JP2019527412A5 - - Google Patents

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Publication number
JP2019527412A5
JP2019527412A5 JP2019500296A JP2019500296A JP2019527412A5 JP 2019527412 A5 JP2019527412 A5 JP 2019527412A5 JP 2019500296 A JP2019500296 A JP 2019500296A JP 2019500296 A JP2019500296 A JP 2019500296A JP 2019527412 A5 JP2019527412 A5 JP 2019527412A5
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JP
Japan
Prior art keywords
temperature
computing device
value
reduction step
temperature information
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JP2019500296A
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English (en)
Japanese (ja)
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JP6926185B2 (ja
JP2019527412A (ja
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Priority claimed from US15/205,678 external-priority patent/US10007310B2/en
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Publication of JP2019527412A publication Critical patent/JP2019527412A/ja
Publication of JP2019527412A5 publication Critical patent/JP2019527412A5/ja
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Publication of JP6926185B2 publication Critical patent/JP6926185B2/ja
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JP2019500296A 2016-07-08 2017-06-14 コンピューティングデバイスにおける温度緩和のための較正を提供する回路および方法 Active JP6926185B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/205,678 2016-07-08
US15/205,678 US10007310B2 (en) 2016-07-08 2016-07-08 Circuits and methods providing calibration for temperature mitigation in a computing device
PCT/US2017/037502 WO2018009317A1 (en) 2016-07-08 2017-06-14 Circuits and methods providing calibration for temperature mitigation in a computing device

Publications (3)

Publication Number Publication Date
JP2019527412A JP2019527412A (ja) 2019-09-26
JP2019527412A5 true JP2019527412A5 (enExample) 2020-06-25
JP6926185B2 JP6926185B2 (ja) 2021-08-25

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ID=59216051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019500296A Active JP6926185B2 (ja) 2016-07-08 2017-06-14 コンピューティングデバイスにおける温度緩和のための較正を提供する回路および方法

Country Status (8)

Country Link
US (1) US10007310B2 (enExample)
EP (1) EP3482274B1 (enExample)
JP (1) JP6926185B2 (enExample)
KR (1) KR102513430B1 (enExample)
CN (2) CN109416568B (enExample)
ES (1) ES2770108T3 (enExample)
HU (1) HUE047310T2 (enExample)
WO (1) WO2018009317A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11399720B2 (en) 2016-04-05 2022-08-02 Qulacomm Incorporated Circuits and methods providing temperature mitigation for computing devices
US10402205B2 (en) * 2017-03-02 2019-09-03 Quanta Computer Inc. System and method for dynamically optimizing hardware frequency for booting
KR102400977B1 (ko) * 2020-05-29 2022-05-25 성균관대학교산학협력단 프로세서를 통한 페이지 폴트 처리 방법
CN111966409B (zh) * 2020-07-30 2021-04-02 深圳比特微电子科技有限公司 矿机快速搜频方法和装置以及矿机
CN112462820B (zh) * 2020-10-29 2022-03-22 广东禅信通科技有限公司 一种石墨烯发热材料的控温系统，方法以及存储介质
KR102679433B1 (ko) * 2020-11-25 2024-06-28 (주)하이페리온테크 적응적 폴링 기반의 센서 데이터 처리 장치 및 방법
US12379768B2 (en) 2021-12-22 2025-08-05 Samsung Electronics Co., Ltd. Electronic device and method of controlling temperature associated with a semiconductor device using dynamic voltage frequency scaling (DVFS)
US12443254B2 (en) 2023-01-30 2025-10-14 Thomson Licensing Apparatus and method for controlling temperature in an electronic device

Family Cites Families (21)

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US5940785A (en) * 1996-04-29 1999-08-17 International Business Machines Corporation Performance-temperature optimization by cooperatively varying the voltage and frequency of a circuit
US20020087904A1 (en) * 2000-12-28 2002-07-04 Zhong-Ning (George) Cai Method and apparatus for thermal sensitivity based dynamic power control
US6977646B1 (en) * 2001-11-30 2005-12-20 3M Innovative Properties Co. Touch screen calibration system and method
CN1330090C (zh) * 2002-12-17 2007-08-01 皇家飞利浦电子股份有限公司 温度补偿rc振荡器
US20040233930A1 (en) 2003-05-19 2004-11-25 Modular Computing & Communications Corporation Apparatus and method for mobile personal computing and communications
US7461272B2 (en) 2004-12-21 2008-12-02 Intel Corporation Device, system and method of thermal control
US7535020B2 (en) * 2005-06-28 2009-05-19 Kabushiki Kaisha Toshiba Systems and methods for thermal sensing
US7900069B2 (en) * 2007-03-29 2011-03-01 Intel Corporation Dynamic power reduction
US8315746B2 (en) * 2008-05-30 2012-11-20 Apple Inc. Thermal management techniques in an electronic device
US8402290B2 (en) * 2008-10-31 2013-03-19 Intel Corporation Power management for multiple processor cores
US8996330B2 (en) * 2011-01-06 2015-03-31 Qualcomm Incorporated Method and system for managing thermal policies of a portable computing device
US8760217B2 (en) * 2011-02-25 2014-06-24 Qualcomm Incorporated Semiconductor device having on-chip voltage regulator
KR101840852B1 (ko) 2011-10-10 2018-03-22 삼성전자주식회사 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법
US9703336B2 (en) 2013-02-21 2017-07-11 Qualcomm Incorporated System and method for thermal management in a multi-functional portable computing device
US9529397B2 (en) 2013-03-01 2016-12-27 Qualcomm Incorporated Thermal management of an electronic device based on sensation model
US20150148981A1 (en) * 2013-11-24 2015-05-28 Qualcomm Incorporated System and method for multi-correlative learning thermal management of a system on a chip in a portable computing device
US9632841B2 (en) 2014-05-29 2017-04-25 Mediatek Inc. Electronic device capable of configuring application-dependent task based on operating behavior of application detected during execution of application and related method thereof
US20150346745A1 (en) 2014-05-30 2015-12-03 Qualcomm Incorporated Thermally-adaptive voltage scaling for supply voltage supervisor power optimization
US9652019B2 (en) * 2014-06-02 2017-05-16 Advanced Micro Devices, Inc. System and method for adjusting processor performance based on platform and ambient thermal conditions
JP6275173B2 (ja) * 2016-03-03 2018-02-07 ルネサスエレクトロニクス株式会社 半導体装置
US10310572B2 (en) * 2016-06-10 2019-06-04 Microsoft Technology Licensing, Llc Voltage based thermal control of processing device

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