JP2019526163A5 - - Google Patents
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- Publication number
- JP2019526163A5 JP2019526163A5 JP2018558325A JP2018558325A JP2019526163A5 JP 2019526163 A5 JP2019526163 A5 JP 2019526163A5 JP 2018558325 A JP2018558325 A JP 2018558325A JP 2018558325 A JP2018558325 A JP 2018558325A JP 2019526163 A5 JP2019526163 A5 JP 2019526163A5
- Authority
- JP
- Japan
- Prior art keywords
- titanium dioxide
- polyimide
- test socket
- socket housing
- acicular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 30
- 239000004642 Polyimide Substances 0.000 claims description 17
- 229920001721 polyimide Polymers 0.000 claims description 17
- 239000004408 titanium dioxide Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 4
- 229940018564 m-phenylenediamine Drugs 0.000 description 4
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662335229P | 2016-05-12 | 2016-05-12 | |
| US201662335222P | 2016-05-12 | 2016-05-12 | |
| US201662335225P | 2016-05-12 | 2016-05-12 | |
| US62/335,222 | 2016-05-12 | ||
| US62/335,225 | 2016-05-12 | ||
| US62/335,229 | 2016-05-12 | ||
| PCT/US2017/032093 WO2017197077A1 (en) | 2016-05-12 | 2017-05-11 | Polyimide compositions and a polyimide test socket housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019526163A JP2019526163A (ja) | 2019-09-12 |
| JP2019526163A5 true JP2019526163A5 (https=) | 2020-06-25 |
Family
ID=58772643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018558325A Pending JP2019526163A (ja) | 2016-05-12 | 2017-05-11 | ポリイミド組成物およびポリイミド試験ソケットハウジング |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190136054A1 (https=) |
| EP (1) | EP3455292B1 (https=) |
| JP (1) | JP2019526163A (https=) |
| KR (1) | KR20190008538A (https=) |
| CN (2) | CN112920601A (https=) |
| WO (1) | WO2017197077A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201911133D0 (en) * | 2019-08-05 | 2019-09-18 | Qinetiq Ltd | Materials and methods |
| KR102548091B1 (ko) * | 2021-04-16 | 2023-06-27 | 주식회사 대림 | 폴리이미드를 포함하는 반도체 소자 테스트 소켓용 성형체 및 이의 제조방법 |
| USD1112120S1 (en) * | 2024-06-04 | 2026-02-10 | Tfe Co., Ltd. | Detachable pocket for semiconductor test socket housing |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4331970A (en) * | 1978-09-18 | 1982-05-25 | General Electric Company | Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation |
| US4360626A (en) | 1981-04-24 | 1982-11-23 | E. I. Du Pont De Nemours And Company | Oxidatively stable polyimide compositions |
| EP0387450B1 (en) * | 1988-12-27 | 1996-10-23 | MITSUI TOATSU CHEMICALS, Inc. | Process for making an IC Socket |
| US5886129A (en) | 1997-07-01 | 1999-03-23 | E. I. Du Pont De Nemours And Company | Oxidatively stable rigid aromatic polyimide compositions and process for their preparation |
| JP2000143984A (ja) * | 1998-11-05 | 2000-05-26 | Showa Denko Kk | フッ素化ポリイミド樹脂組成物及びその製造方法 |
| DE60233559D1 (de) * | 2001-04-03 | 2009-10-15 | Kureha Corp | Ic-fassung |
| JP2004035825A (ja) * | 2002-07-05 | 2004-02-05 | Kanegafuchi Chem Ind Co Ltd | 半導電性ポリイミドフィルムおよびその製造方法 |
| DE20316645U1 (de) * | 2003-10-29 | 2005-03-10 | Fan, Wei-Fang, Jwu Beei | Modulare elastische Kontaktstiftgruppevorrichtung |
| US7876087B2 (en) * | 2006-09-12 | 2011-01-25 | Innoconnex, Inc. | Probe card repair using coupons with spring contacts and separate atachment points |
| JP5491031B2 (ja) * | 2006-10-11 | 2014-05-14 | 住友電気工業株式会社 | ポリイミドチューブ、その製造方法、ポリイミドワニスの製造方法、及び定着ベルト |
| US8433029B2 (en) * | 2007-12-14 | 2013-04-30 | Global Nuclear Fuel—Americas, LLC | Determination of safety limit minimum critical power ratio |
| US20120009406A1 (en) * | 2008-05-20 | 2012-01-12 | E.I. Du Pont De Nemours And Company | Thermally and dimensionally stable polyimide films and methods relating thereto |
| WO2011063204A1 (en) * | 2009-11-20 | 2011-05-26 | E. I. Du Pont De Nemours And Company | Thermally and dimensionally stable polyimide films and methods relating thereto |
| CN101805517B (zh) * | 2010-03-02 | 2012-05-09 | 天津恒通时代电工材料科技有限公司 | 一种无机颗粒填充的聚酰亚胺薄膜的制造方法 |
| CN101831175A (zh) * | 2010-04-01 | 2010-09-15 | 辽宁科技大学 | 一种无色透明的聚酰亚胺纳米复合材料膜及其制备方法 |
| EP2622020B1 (en) * | 2010-09-29 | 2017-03-15 | E. I. du Pont de Nemours and Company | Polyimide resins for high temperature applications |
| US20170232776A1 (en) * | 2014-10-01 | 2017-08-17 | E.I. Du Pont De Nemours And Company | Non-thermoplastic polyimide spindle cover |
-
2017
- 2017-05-11 CN CN202110048235.8A patent/CN112920601A/zh active Pending
- 2017-05-11 WO PCT/US2017/032093 patent/WO2017197077A1/en not_active Ceased
- 2017-05-11 KR KR1020187034141A patent/KR20190008538A/ko not_active Ceased
- 2017-05-11 CN CN201780027829.2A patent/CN109071874B/zh not_active Expired - Fee Related
- 2017-05-11 EP EP17725815.9A patent/EP3455292B1/en active Active
- 2017-05-11 US US16/095,434 patent/US20190136054A1/en not_active Abandoned
- 2017-05-11 JP JP2018558325A patent/JP2019526163A/ja active Pending
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