JP2019526163A5 - - Google Patents

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Publication number
JP2019526163A5
JP2019526163A5 JP2018558325A JP2018558325A JP2019526163A5 JP 2019526163 A5 JP2019526163 A5 JP 2019526163A5 JP 2018558325 A JP2018558325 A JP 2018558325A JP 2018558325 A JP2018558325 A JP 2018558325A JP 2019526163 A5 JP2019526163 A5 JP 2019526163A5
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JP
Japan
Prior art keywords
titanium dioxide
polyimide
test socket
socket housing
acicular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018558325A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019526163A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2017/032093 external-priority patent/WO2017197077A1/en
Publication of JP2019526163A publication Critical patent/JP2019526163A/ja
Publication of JP2019526163A5 publication Critical patent/JP2019526163A5/ja
Pending legal-status Critical Current

Links

JP2018558325A 2016-05-12 2017-05-11 ポリイミド組成物およびポリイミド試験ソケットハウジング Pending JP2019526163A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201662335222P 2016-05-12 2016-05-12
US201662335229P 2016-05-12 2016-05-12
US201662335225P 2016-05-12 2016-05-12
US62/335,229 2016-05-12
US62/335,222 2016-05-12
US62/335,225 2016-05-12
PCT/US2017/032093 WO2017197077A1 (en) 2016-05-12 2017-05-11 Polyimide compositions and a polyimide test socket housing

Publications (2)

Publication Number Publication Date
JP2019526163A JP2019526163A (ja) 2019-09-12
JP2019526163A5 true JP2019526163A5 (https=) 2020-06-25

Family

ID=58772643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018558325A Pending JP2019526163A (ja) 2016-05-12 2017-05-11 ポリイミド組成物およびポリイミド試験ソケットハウジング

Country Status (6)

Country Link
US (1) US20190136054A1 (https=)
EP (1) EP3455292B1 (https=)
JP (1) JP2019526163A (https=)
KR (1) KR20190008538A (https=)
CN (2) CN112920601A (https=)
WO (1) WO2017197077A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201911133D0 (en) * 2019-08-05 2019-09-18 Qinetiq Ltd Materials and methods
KR102548091B1 (ko) * 2021-04-16 2023-06-27 주식회사 대림 폴리이미드를 포함하는 반도체 소자 테스트 소켓용 성형체 및 이의 제조방법
USD1112120S1 (en) * 2024-06-04 2026-02-10 Tfe Co., Ltd. Detachable pocket for semiconductor test socket housing

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331970A (en) * 1978-09-18 1982-05-25 General Electric Company Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation
US4360626A (en) 1981-04-24 1982-11-23 E. I. Du Pont De Nemours And Company Oxidatively stable polyimide compositions
DE68927376D1 (de) * 1988-12-27 1996-11-28 Mitsui Toatsu Chemicals Verfahren zur Herstellung einer Buchse für eine integrierte Schaltung
US5886129A (en) 1997-07-01 1999-03-23 E. I. Du Pont De Nemours And Company Oxidatively stable rigid aromatic polyimide compositions and process for their preparation
JP2000143984A (ja) * 1998-11-05 2000-05-26 Showa Denko Kk フッ素化ポリイミド樹脂組成物及びその製造方法
CN1311594C (zh) * 2001-04-03 2007-04-18 株式会社吴羽 Ic插座
JP2004035825A (ja) * 2002-07-05 2004-02-05 Kanegafuchi Chem Ind Co Ltd 半導電性ポリイミドフィルムおよびその製造方法
DE20316645U1 (de) * 2003-10-29 2005-03-10 Fan, Wei-Fang, Jwu Beei Modulare elastische Kontaktstiftgruppevorrichtung
WO2008033428A2 (en) * 2006-09-12 2008-03-20 Innoconnex, Inc. Compliance partitioning in testing of integrated circuits
DE602007013585D1 (de) * 2006-10-11 2011-05-12 Sumitomo Electric Industries Polyimidrohr, herstellungsverfahren dafür, verfahren zur herstellung eines polyimidlacks und fixierband
US8433029B2 (en) * 2007-12-14 2013-04-30 Global Nuclear Fuel—Americas, LLC Determination of safety limit minimum critical power ratio
JP5346078B2 (ja) * 2008-05-20 2013-11-20 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 熱および寸法安定性ポリイミドフィルム、ならびに、これに関する方法
KR20120096003A (ko) * 2009-11-20 2012-08-29 이 아이 듀폰 디 네모아 앤드 캄파니 반도체 패키징 응용에 유용한 인터포저 필름, 및 그 관련 방법
CN101805517B (zh) * 2010-03-02 2012-05-09 天津恒通时代电工材料科技有限公司 一种无机颗粒填充的聚酰亚胺薄膜的制造方法
CN101831175A (zh) * 2010-04-01 2010-09-15 辽宁科技大学 一种无色透明的聚酰亚胺纳米复合材料膜及其制备方法
KR20130097781A (ko) * 2010-09-29 2013-09-03 이 아이 듀폰 디 네모아 앤드 캄파니 고온 용도를 위한 폴리이미드 수지
CN107000427A (zh) * 2014-10-01 2017-08-01 纳幕尔杜邦公司 作为饮料罐印刷单元的一部分的包含非热塑性聚酰亚胺的主轴套

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