JP2019522932A - 無線周波数相互接続デバイス - Google Patents
無線周波数相互接続デバイス Download PDFInfo
- Publication number
- JP2019522932A JP2019522932A JP2018567257A JP2018567257A JP2019522932A JP 2019522932 A JP2019522932 A JP 2019522932A JP 2018567257 A JP2018567257 A JP 2018567257A JP 2018567257 A JP2018567257 A JP 2018567257A JP 2019522932 A JP2019522932 A JP 2019522932A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- line
- transmission line
- interconnection system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/2039—Galvanic coupling between Input/Output
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
- Filters And Equalizers (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Transceivers (AREA)
Abstract
Description
Claims (16)
- 第1のプリント回路基板(1105)であって、フィルタの第1の部分を含み(図7〜12)、前記フィルタは前記第1のプリント回路基板の間で信号を通信するために使用される、第1のプリント回路基板(1105)と、
第2のプリント回路基板(1205)と、
前記第1のプリント回路基板と前記第2のプリント回路基板との間で前記信号を結合する機械的構造(図16)であって、前記第2のプリント回路基板は前記第1のプリント回路基板に対してある角度を成して向けられている、機械的構造(図16)と
を備える相互接続システム。 - 前記フィルタがバンドパスフィルタである、請求項1に記載の相互接続システム。
- 前記バンドパスフィルタが対称無線周波数広帯域バンドパスフィルタである、請求項2に記載の相互接続システム。
- 前記機械的構造が湾曲ストリップから形成された金属クリップである、請求項1〜3のいずれか一項に記載の相互接続システム。
- 前記機械的構造が、2つの電気的インターフェース接続(1220(TL3)および1225)を用いて結合を提供する、請求項1〜4のいずれか一項に記載の相互接続システム。
- 前記2つの電気的インターフェース接続の1つが前記信号用(1220(TL3))である、請求項5に記載の相互接続システム。
- 前記角度が鋭角である、請求項1〜6のいずれか一項に記載の相互接続システム。
- 前記角度が直角である、請求項1〜7のいずれか一項に記載の相互接続システム。
- 前記第1のプリント回路基板が第1のI/Oポート(1115)でアースに接続された第1の伝送線路(1130)を含み、前記第1のプリント回路基板が中間終端パッド(1120)に接続された第2の伝送線路(935)をさらに含み、前記中間終端パッドが第1の接地パッド(1125)から離されている、請求項1に記載の相互接続システム。
- 前記第2のプリント回路基板が、第2の接地パッド(1225)に接続された第3の伝送線路(1220)を含み、前記第2の接地パッド(1225)は前記第1の接地パッド(1125)の真上に配置され、前記第3の伝送線路(1220)は交点(C)で出力線路(1215)に同じく接続され、前記第3の伝送線路(1220)はマイクロストリップ線路である、請求項9に記載の相互接続システム。
- 前記第1の伝送線路(1130)が約2分の1波長の長さである、請求項9または10に記載の相互接続システム。
- 前記第1の伝送線路(1130)が直線である、請求項9または10に記載の相互接続システム。
- 前記第1の伝送線路(1130)が蛇行している、請求項1〜5のいずれか一項に記載の相互接続システム。
- 前記中間終端パッド(1120)と前記第1の接地パッド(1125)との間の距離が100〜200μmの間である、請求項9〜13のいずれか一項に記載の相互接続システム。
- 前記第1の伝送線路(1130)がマイクロストリップ線路、コプレーナ線路、ストリップ線路、または多層線路の1つであり、前記第2の伝送線路(935)がマイクロストリップ線路、コプレーナ線路、ストリップ線路、または多層線路の1つであり、前記第1の接地パッド(1125)および前記中間終端パッド(1120)が前記第1の回路基板(1105)の外面に印刷される、請求項9〜14のいずれか一項に記載の相互接続システム。
- 少なくとも2つのプリント回路基板(1105、1205)を備え、前記少なくとも2つのプリント回路基板の2つが請求項1〜15のいずれか一項に記載の無線周波数相互接続システムを使用する、電子デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16305824.1 | 2016-06-30 | ||
EP16305824.1A EP3264872A1 (en) | 2016-06-30 | 2016-06-30 | Radio frequency interconnection device |
PCT/EP2017/065917 WO2018002092A1 (en) | 2016-06-30 | 2017-06-27 | Radio frequency interconnection device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019522932A true JP2019522932A (ja) | 2019-08-15 |
JP2019522932A5 JP2019522932A5 (ja) | 2020-07-30 |
JP7058611B2 JP7058611B2 (ja) | 2022-04-22 |
Family
ID=56567543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018567257A Active JP7058611B2 (ja) | 2016-06-30 | 2017-06-27 | 無線周波数相互接続デバイス |
Country Status (6)
Country | Link |
---|---|
US (1) | US11043726B2 (ja) |
EP (2) | EP3264872A1 (ja) |
JP (1) | JP7058611B2 (ja) |
KR (1) | KR102427125B1 (ja) |
CN (1) | CN109417848B (ja) |
WO (1) | WO2018002092A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49124561A (ja) * | 1973-04-02 | 1974-11-28 | ||
US4257668A (en) * | 1979-01-02 | 1981-03-24 | Gte Automatic Electric Laboratories, Inc. | Edge clip terminal for mounting thick film hybrid circuits in printed circuit boards |
US4429289A (en) * | 1982-06-01 | 1984-01-31 | Motorola, Inc. | Hybrid filter |
JPS6313503A (ja) * | 1986-07-04 | 1988-01-20 | Yuniden Kk | マイクロ波フイルタ装置 |
JPH0983132A (ja) * | 1995-09-20 | 1997-03-28 | Taiyo Yuden Co Ltd | 回路基板用リード端子 |
JP2009207142A (ja) * | 2008-02-27 | 2009-09-10 | Thomson Licensing | それぞれが少なくとも1つの伝送ラインを含む2つの基板を相互接続するシステム |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3764955A (en) * | 1972-05-17 | 1973-10-09 | Amp Inc | Connecting and mounting means for substrates |
US5523768A (en) * | 1991-05-30 | 1996-06-04 | Conifer Corporation | Integrated feed and down converter apparatus |
US5441430A (en) | 1994-04-06 | 1995-08-15 | North American Specialties Corporation | Electrical lead for surface mounting of substrates |
US6917525B2 (en) | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
US6704592B1 (en) | 2000-06-02 | 2004-03-09 | Medrad, Inc. | Communication systems for use with magnetic resonance imaging systems |
DE10057460C1 (de) | 2000-11-20 | 2002-08-08 | Tyco Electronics Amp Gmbh | Halteelement mit einer Halteklammer, Anordnung mit einer Trägerplatte und einem Halteelement und Anordnung mit Halteelement und Trägerstreifen |
US6984156B2 (en) | 2003-09-05 | 2006-01-10 | Power-One Limited | Connector for surface mounting subassemblies vertically on a mother board and assemblies comprising the same |
US7221240B2 (en) * | 2005-02-01 | 2007-05-22 | Alpha Networks Inc. | Narrow bandpass filter installed on a circuit board for suppressing a high-frequency harmonic wave |
US8615279B2 (en) | 2010-07-23 | 2013-12-24 | Blackberry Limited | Mobile wireless communications device with shunt component and related methods |
CN202333088U (zh) * | 2011-06-14 | 2012-07-11 | 南京理工大学 | 小型化超宽带带通滤波器 |
US10292263B2 (en) | 2013-04-12 | 2019-05-14 | The Board Of Trustees Of The University Of Illinois | Biodegradable materials for multilayer transient printed circuit boards |
FR3018660A1 (fr) | 2014-03-12 | 2015-09-18 | Thomson Licensing | Systeme d'interconnexion de cartes de circuit electronique |
US9325086B2 (en) | 2014-08-05 | 2016-04-26 | International Business Machines Corporation | Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications |
AU2015215891A1 (en) | 2014-09-05 | 2016-03-24 | Thomson Licensing | Antenna assembly and electronic device comprising said antenna assembly |
-
2016
- 2016-06-30 EP EP16305824.1A patent/EP3264872A1/en not_active Withdrawn
-
2017
- 2017-06-27 US US16/314,435 patent/US11043726B2/en active Active
- 2017-06-27 JP JP2018567257A patent/JP7058611B2/ja active Active
- 2017-06-27 WO PCT/EP2017/065917 patent/WO2018002092A1/en unknown
- 2017-06-27 CN CN201780040625.2A patent/CN109417848B/zh active Active
- 2017-06-27 KR KR1020187037651A patent/KR102427125B1/ko active IP Right Grant
- 2017-06-27 EP EP17736593.9A patent/EP3479661A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49124561A (ja) * | 1973-04-02 | 1974-11-28 | ||
US4257668A (en) * | 1979-01-02 | 1981-03-24 | Gte Automatic Electric Laboratories, Inc. | Edge clip terminal for mounting thick film hybrid circuits in printed circuit boards |
US4429289A (en) * | 1982-06-01 | 1984-01-31 | Motorola, Inc. | Hybrid filter |
JPS6313503A (ja) * | 1986-07-04 | 1988-01-20 | Yuniden Kk | マイクロ波フイルタ装置 |
JPH0983132A (ja) * | 1995-09-20 | 1997-03-28 | Taiyo Yuden Co Ltd | 回路基板用リード端子 |
JP2009207142A (ja) * | 2008-02-27 | 2009-09-10 | Thomson Licensing | それぞれが少なくとも1つの伝送ラインを含む2つの基板を相互接続するシステム |
Also Published As
Publication number | Publication date |
---|---|
US20190319329A1 (en) | 2019-10-17 |
KR102427125B1 (ko) | 2022-07-28 |
KR20190024904A (ko) | 2019-03-08 |
JP7058611B2 (ja) | 2022-04-22 |
EP3264872A1 (en) | 2018-01-03 |
US11043726B2 (en) | 2021-06-22 |
CN109417848A (zh) | 2019-03-01 |
WO2018002092A1 (en) | 2018-01-04 |
EP3479661A1 (en) | 2019-05-08 |
CN109417848B (zh) | 2021-11-09 |
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