JP2019509177A5 - - Google Patents

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Publication number
JP2019509177A5
JP2019509177A5 JP2018544902A JP2018544902A JP2019509177A5 JP 2019509177 A5 JP2019509177 A5 JP 2019509177A5 JP 2018544902 A JP2018544902 A JP 2018544902A JP 2018544902 A JP2018544902 A JP 2018544902A JP 2019509177 A5 JP2019509177 A5 JP 2019509177A5
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JP
Japan
Prior art keywords
pipe
pipe end
sleeve
rod
laser beam
Prior art date
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Application number
JP2018544902A
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English (en)
Japanese (ja)
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JP2019509177A (ja
JP6895449B2 (ja
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Priority claimed from DE102016103230.1A external-priority patent/DE102016103230B3/de
Application filed filed Critical
Publication of JP2019509177A publication Critical patent/JP2019509177A/ja
Publication of JP2019509177A5 publication Critical patent/JP2019509177A5/ja
Application granted granted Critical
Publication of JP6895449B2 publication Critical patent/JP6895449B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018544902A 2016-02-24 2017-02-03 環形状の溶接シームのレーザー透過溶接のための装置 Expired - Fee Related JP6895449B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016103230.1A DE102016103230B3 (de) 2016-02-24 2016-02-24 Vorrichtung zum Lasertransmissionsschweißen einer ringförmigen Schweißnaht
DE102016103230.1 2016-02-24
PCT/DE2017/100075 WO2017144048A1 (de) 2016-02-24 2017-02-03 VORRICHTUNG ZUM LASERTRANSMISSIONSSCHWEIßEN EINER RINGFÖRMIGEN SCHWEIßNAHT

Publications (3)

Publication Number Publication Date
JP2019509177A JP2019509177A (ja) 2019-04-04
JP2019509177A5 true JP2019509177A5 (https=) 2020-03-12
JP6895449B2 JP6895449B2 (ja) 2021-06-30

Family

ID=58108373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018544902A Expired - Fee Related JP6895449B2 (ja) 2016-02-24 2017-02-03 環形状の溶接シームのレーザー透過溶接のための装置

Country Status (7)

Country Link
US (1) US11052485B2 (https=)
EP (1) EP3419784A1 (https=)
JP (1) JP6895449B2 (https=)
KR (1) KR20180117118A (https=)
CN (1) CN108883498B (https=)
DE (1) DE102016103230B3 (https=)
WO (1) WO2017144048A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111070700B (zh) * 2019-12-20 2022-01-18 浙江舜宇智领技术有限公司 激光焊接治具
CN113547217A (zh) * 2021-08-16 2021-10-26 深圳市浩毅丰科技有限公司 用于激光透射焊接环形焊缝的装置
CN114043089B (zh) * 2021-12-10 2022-05-17 哈尔滨工业大学 一种t型接头点环激光双侧同步焊接方法
DE102022117918A1 (de) 2022-07-18 2024-01-18 André LeGuin Verfahren zum stirnseitigen Verrunden von tubusförmigen Bauteilen
CN115782194B (zh) * 2022-10-26 2026-01-02 武汉华工激光工程有限责任公司 一种采用机械腔体匀化激光应用于塑料焊接的装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414699A (en) * 1964-08-24 1968-12-03 Omark Industries Inc Gravity drop stud welding apparatus
SE434480B (sv) 1982-02-18 1984-07-30 Optik Innovation Ab Oiab Anordning for bearbetning av ett utvendigt omkretsomrade av en artikel medelst stralningsenergi, speciellt for utvendig forsegling av en rorformig termoplastfolie medelst en laserstrale
JPS5969979A (ja) * 1982-10-15 1984-04-20 Hitachi Ltd レ−ザ光源装置
JPS6224883A (ja) * 1985-07-25 1987-02-02 Toyota Motor Corp 円周部のレ−ザ−表面処理方法
JPH0698508B2 (ja) * 1985-12-25 1994-12-07 株式会社小松製作所 光ビ−ム加工装置
EP0282593B1 (en) * 1986-07-08 1993-09-15 Kabushiki Kaisha Komatsu Seisakusho Laser beam forming apparatus
JPS6316893A (ja) * 1986-07-08 1988-01-23 Komatsu Ltd リングモ−ド成形装置
JPS63168893A (ja) 1987-01-06 1988-07-12 Fujitsu Ltd 磁気バブルメモリ素子作製法
JP3623274B2 (ja) 1995-04-14 2005-02-23 株式会社アマダ レーザー加工装置の加工ヘッド
JPH11285868A (ja) 1998-04-01 1999-10-19 Toshiba Corp レーザ照射による部材の補修方法および装置およびこの装置に補修方法を実行させるプログラムを記録した媒体
DE10005593C1 (de) 2000-02-09 2001-10-31 Horst Exner Hand- und maschinenführbare autonome Einrichtung zum Punktschweißen
JP3743383B2 (ja) * 2001-04-20 2006-02-08 株式会社 レーザックス レーザ加工装置、レーザ加工方法、およびレーザ加工された被加工物を有する物品の製造方法
ATE328698T1 (de) * 2003-08-21 2006-06-15 Leister Process Tech Verfahren und vorrichtung zum simultanen erwärmen von materialien
EP1518664A1 (de) 2003-09-20 2005-03-30 Leister Process Technologies Verfahren und Vorrichtung zum Verbinden von Bauteilen durch Laserstrahlung
DE102004003696B4 (de) 2004-01-24 2017-02-16 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zum simultanen Laserschweißen
JP2011020175A (ja) 2009-07-17 2011-02-03 Hamamatsu Univ School Of Medicine 筒状体のレーザ加工方法と筒状体のレーザ加工装置
DE102009053261A1 (de) 2009-11-11 2011-05-12 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Punktschweißen mit Laserstrahl

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