JP2019508789A5 - - Google Patents

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JP2019508789A5
JP2019508789A5 JP2018534670A JP2018534670A JP2019508789A5 JP 2019508789 A5 JP2019508789 A5 JP 2019508789A5 JP 2018534670 A JP2018534670 A JP 2018534670A JP 2018534670 A JP2018534670 A JP 2018534670A JP 2019508789 A5 JP2019508789 A5 JP 2019508789A5
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JP
Japan
Prior art keywords
embodiments described
acceleration
inspection
enable
image generation
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JP2018534670A
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Japanese (ja)
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JP2019508789A (ja
JP6941103B2 (ja
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Priority claimed from US15/394,792 external-priority patent/US9916965B2/en
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Priority claimed from PCT/US2016/069580 external-priority patent/WO2017117568A1/en
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Publication of JP2019508789A5 publication Critical patent/JP2019508789A5/ja
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JP2018534670A 2015-12-31 2016-12-30 半導体用途のための機械学習ベースのモデルの加速トレーニング Active JP6941103B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562273985P 2015-12-31 2015-12-31
US62/273,985 2015-12-31
US15/394,792 US9916965B2 (en) 2015-12-31 2016-12-29 Hybrid inspectors
US15/394,792 2016-12-29
PCT/US2016/069580 WO2017117568A1 (en) 2015-12-31 2016-12-30 Accelerated training of a machine learning based model for semiconductor applications

Publications (3)

Publication Number Publication Date
JP2019508789A JP2019508789A (ja) 2019-03-28
JP2019508789A5 true JP2019508789A5 (enExample) 2020-02-13
JP6941103B2 JP6941103B2 (ja) 2021-09-29

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JP2018534670A Active JP6941103B2 (ja) 2015-12-31 2016-12-30 半導体用途のための機械学習ベースのモデルの加速トレーニング

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EP (1) EP3398123B1 (enExample)
JP (1) JP6941103B2 (enExample)
KR (1) KR102812577B1 (enExample)
CN (1) CN108475351B (enExample)
IL (1) IL259705B (enExample)
WO (1) WO2017117568A1 (enExample)

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