JP2019507716A - 結晶基板上に半極性窒化物層を得るための方法 - Google Patents
結晶基板上に半極性窒化物層を得るための方法 Download PDFInfo
- Publication number
- JP2019507716A JP2019507716A JP2018544216A JP2018544216A JP2019507716A JP 2019507716 A JP2019507716 A JP 2019507716A JP 2018544216 A JP2018544216 A JP 2018544216A JP 2018544216 A JP2018544216 A JP 2018544216A JP 2019507716 A JP2019507716 A JP 2019507716A
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- facets
- seed
- facet
- epitaxial growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 title claims abstract description 53
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 16
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 87
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 83
- 239000010703 silicon Substances 0.000 claims abstract description 81
- 230000012010 growth Effects 0.000 claims abstract description 73
- 239000013078 crystal Substances 0.000 claims abstract description 58
- 238000005530 etching Methods 0.000 claims abstract description 8
- 230000003698 anagen phase Effects 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 72
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 41
- 230000004048 modification Effects 0.000 claims description 20
- 238000012986 modification Methods 0.000 claims description 20
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 15
- 239000007789 gas Substances 0.000 claims description 15
- 229910052733 gallium Inorganic materials 0.000 claims description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 9
- 238000002407 reforming Methods 0.000 claims description 8
- 238000004377 microelectronic Methods 0.000 claims description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 229910002601 GaN Inorganic materials 0.000 description 55
- 230000007547 defect Effects 0.000 description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 238000011065 in-situ storage Methods 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 5
- 230000010287 polarization Effects 0.000 description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006911 nucleation Effects 0.000 description 3
- 238000010899 nucleation Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000005701 quantum confined stark effect Effects 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000001350 scanning transmission electron microscopy Methods 0.000 description 1
- 230000035040 seed growth Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/186—Epitaxial-layer growth characterised by the substrate being specially pre-treated by, e.g. chemical or physical means
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02293—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process formation of epitaxial layers by a deposition process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Led Devices (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
‐ 結晶基板の上面に複数の好ましくは平行な溝をエッチングするステップ(各溝は少なくとも二つの対向する傾斜ファセットを備え、二つの対向するファセットのうち少なくとも一つが{111}の結晶方位を有する);
‐ {111}の結晶方位を有するファセットに対向するファセットがマスキングされ、{111}の結晶方位を有するファセットがマスキングされないように結晶基板の上面の上にマスクを形成するステップ;
‐ マスキングされていない{111}の結晶方位を有するファセットからのエピタキシャル成長によって、半極性窒化物層を得るステップ。
‐ 少なくとも複数の平行な溝の中にシードを形成するようにマスキングされていない{111}の結晶方位を有するファセットから少なくとも第一エピタキシャル成長段階を行うステップ;
‐ シードが(0001)の結晶方位を有する傾斜ファセット及び
‐ シリコン(Si)を備える少なくとも一種のガスの存在下にシードを置くことによって、シードの表面上にシリコン(Si)を備える改質部を形成するように、シードの上部の改質を行うことを備える表面処理ステップ;
‐ (0001)の結晶方位を有する傾斜ファセットから物質の少なくとも第二エピタキシャル成長段階を行うステップ。
‐ マスキングされていない{111}の結晶方位を有するファセットからの窒化アルミニウム(AlN)系物質の第一エピタキシャル成長:
‐ 次いで、その窒化アルミニウム(AlN)系物質からの窒化ガリウム(GaN)系物質の少なくとも第二エピタキシャル成長。
‐ SiH4流: 5sccmから3000sccmの間
‐ NH3流: 0.2slmから15slmの間
‐ 温度: 600℃から1200℃の間
‐ 圧力: 20mbarから800mbarの間
320 溝
331 マスク
410 バッファ層
440 シード
450 改質部
480 半極性層
500 転位
Claims (21)
- 立方対称性の結晶基板(300)の上面にガリウム(Ga)及び窒素(N)系の物質から得られた少なくとも一つの窒化物の半極性層(480)を得るための方法であって、
前記結晶基板(300)の上面に複数の平行な溝(320)をエッチングするステップであって、各溝(320)が少なくとも二つの対向する傾斜ファセット(310、311)を備え、前記二つの対向する傾斜ファセット(310、311)のうち少なくとも一つ(310)が<111>の結晶方位を有する、ステップと、
<111>の結晶方位を有するファセット(310)に対向するファセット(311)がマスキングされ、<111>の結晶方位を有するファセット(310)がマスキングされないように前記結晶基板(300)の上面の上にマスク(331)を形成するステップと、
前記マスク(331)を形成するステップの後に、マスキングされていない<111>の結晶方位を有するファセット(310)からのエピタキシャル成長によって、窒化物の半極性層(350)を形成するステップとのうち少なくとも一つを備え、
前記半極性層(350)を形成するステップが、少なくとも、
マスキングされていない<111>の結晶方位を有するファセット(310)から、すくなくとも前記複数の平行な溝(320)の中にシード(440)を形成するように少なくとも第一エピタキシャル成長段階を行うステップと、
前記シード(440)が、(0001)の結晶方位を有する傾斜ファセット(442)と、
シリコン(Si)を備える少なくとも一種のガスの存在下に前記シード(440)を置いて、前記シード(440)の表面にシリコン(Si)を備える改質部(450)を形成することによって、前記シード(440)の上部を改質することを備える表面処理ステップと、
(0001)の結晶方位を有する傾斜ファセット(442)から、前記物質の少なくとも第二エピタキシャル成長段階を行うステップとを備え、前記第二エピタキシャル成長段階が、隣接する平行な溝(320)のシード(440)同士が合体するまで続けられることを特徴とする方法。 - 前記第二エピタキシャル成長段階において、窒化物(N)の半極性層(480)が、前記シリコンを備える改質部(450)の少なくとも一部を覆う、請求項1に記載の方法。
- 前記シリコンを備える改質部(450)が、前記シード(440)の上部ファセット(441)上で連続的である、請求項1又は2に記載の方法。
- 前記シリコンを備える改質部(450)が、(0001)の結晶方位を有する傾斜ファセット(442)上において存在しない又は不連続である、請求項1から3のいずれか一項に記載の方法。
-
- 前記シード(440)の上部の改質が、SiH4とNH3とを備える混合ガス流に前記シード(440)を暴露することを備える、請求項1から5のいずれか一項に記載の方法。
- 前記シリコンを備える改質部(450)の厚さが、少なくとも、SiH4とNH3との流量比を調整すること及び/又は暴露時間を調整することによって制御される、請求項1から6のいずれか一項に記載の方法。
- 前記シリコンを備える改質部(450)の厚さが、シリコンを備える少なくとも一種のガスの流量と温度と注入圧力とのうち少なくとも一つのパラメータを調整することによって制御される、請求項1から7のいずれか一項に記載の方法。
- 前記上部ファセット(441)の上に存在する前記シリコンを備える改質部(450)が、単原子層1層分よりも厚く、好ましくは単原子層16層分以上の厚さを有する、請求項1から8のいずれか一項に記載の方法。
- 前記上部ファセット(441)の上に存在する前記シリコンを備える改質部(450)が、0.3nmよりも厚く、好ましくは5nmよりも厚い厚さを有する、請求項1から9のいずれか一項に記載の方法。
- 前記傾斜ファセット(442)の上に存在する前記シリコンを備える改質部(450)が、単原子層1層分以下の厚さを有する、請求項1から10のいずれか一項に記載の方法。
- 前記傾斜ファセット(442)の上に存在する前記シリコンを備える改質部(450)が、0.3nm以下の厚さを有する、請求項1から11のいずれか一項に記載の方法。
- 少なくとも前記第一エピタキシャル成長段階及び前記シード(440)の上部の改質が同じ反応器で行われる、請求項1から12のいずれか一項に記載の方法。
- 前記シード(440)の上部の改質が有機金属化学気相堆積(MOCVD)によって行われる、請求項1から13のいずれか一項に記載の方法。
- 前記中断ステップが所定の期間後に開始される、請求項1から14のいずれか一項に記載の方法。
- <111>の結晶方位を有するファセット(310)からの前記物質の第一エピタキシャル成長段階が、前記シード(440)が前記溝を充填する前に中断される、請求項1から15のいずれか一項に記載の方法。
- <111>の結晶方位を有するファセット(310)からの前記物質のエピタキシャル成長段階の前に、AlNのバッファ層(410)が、<111>の結晶方位を有するファセット(310)の上に形成される、請求項1から16のいずれか一項に記載の方法。
- 前記結晶基板(300)が、Si、Ge、GaAsのうち一種から形成され、又はSi、Ge、GaAsのうち一種に基づいていて、又はSi、Ge、GaAsの合金から形成される、請求項1から17のいずれか一項に記載の方法。
- 窒化ガリウム(GaN)の少なくとも一つの半極性層(480)を備えるマイクロエレクトロニクスデバイスであって、前記半極性層(480)が、平坦部(445)と、前記平坦部(445)から延在する複数のピラミッド状部(446)とを備え、各ピラミッド状部の中にシリコンを備える改質部(450)を備えることを特徴とするマイクロエレクトロニクスデバイス。
- 前記シリコンを備える改質部(450)が、前記平坦部(445)と平行な少なくとも一つの平坦な部分を有し、前記改質部(450)の平坦な部分の厚さが0.3nmより厚い、請求項19に記載のマイクロエレクトロニクスデバイス。
- 請求項19又は20に記載のマイクロエレクトロニクスデバイスを備える発光ダイオード(LED)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1651433A FR3048002B1 (fr) | 2016-02-22 | 2016-02-22 | Procede permettant d'obtenir sur un substrat cristallin une couche semi-polaire de nitrure |
FR1651433 | 2016-02-22 | ||
PCT/EP2017/053830 WO2017144429A1 (fr) | 2016-02-22 | 2017-02-21 | Procédé permettant d'obtenir sur un substrat cristallin une couche semi-polaire de nitrure |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019507716A true JP2019507716A (ja) | 2019-03-22 |
JP7055102B2 JP7055102B2 (ja) | 2022-04-15 |
Family
ID=56263823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018544216A Active JP7055102B2 (ja) | 2016-02-22 | 2017-02-21 | 結晶基板上に半極性窒化物層を得るための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10892378B2 (ja) |
EP (1) | EP3420125A1 (ja) |
JP (1) | JP7055102B2 (ja) |
KR (1) | KR20180120193A (ja) |
FR (1) | FR3048002B1 (ja) |
WO (1) | WO2017144429A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020191434A (ja) * | 2019-05-21 | 2020-11-26 | 國立交通大學 | シリコン基板に窒化ガリウムをヘテロ統合した半導体構造、及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003243702A (ja) * | 2002-02-15 | 2003-08-29 | Nobuhiko Sawaki | 半導体発光素子およびその製造方法 |
US20120119218A1 (en) * | 2010-11-15 | 2012-05-17 | Applied Materials, Inc. | Method for forming a semiconductor device using selective epitaxy of group iii-nitride |
US20120276722A1 (en) * | 2011-04-27 | 2012-11-01 | Jen-Inn Chyi | Method for growing semipolar nitride |
WO2016202899A1 (fr) * | 2015-06-18 | 2016-12-22 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procédé permettant d'obtenir sur un substrat cristallin une couche semi-polaire de nitrure obtenu avec l'un au moins parmi les matériaux suivants :gallium (ga), indium (in) et aluminium (al) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10134727B2 (en) * | 2012-09-28 | 2018-11-20 | Intel Corporation | High breakdown voltage III-N depletion mode MOS capacitors |
US9978589B2 (en) | 2014-04-16 | 2018-05-22 | Yale University | Nitrogen-polar semipolar and gallium-polar semipolar GaN layers and devices on sapphire substrates |
FR3044464B1 (fr) * | 2015-11-30 | 2018-02-09 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede permettant d'obtenir sur un substrat cristallin une couche semi-polaire de nitrure |
-
2016
- 2016-02-22 FR FR1651433A patent/FR3048002B1/fr active Active
-
2017
- 2017-02-21 KR KR1020187027185A patent/KR20180120193A/ko not_active Application Discontinuation
- 2017-02-21 WO PCT/EP2017/053830 patent/WO2017144429A1/fr active Application Filing
- 2017-02-21 US US16/078,203 patent/US10892378B2/en active Active
- 2017-02-21 EP EP17706453.2A patent/EP3420125A1/fr active Pending
- 2017-02-21 JP JP2018544216A patent/JP7055102B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003243702A (ja) * | 2002-02-15 | 2003-08-29 | Nobuhiko Sawaki | 半導体発光素子およびその製造方法 |
US20120119218A1 (en) * | 2010-11-15 | 2012-05-17 | Applied Materials, Inc. | Method for forming a semiconductor device using selective epitaxy of group iii-nitride |
US20120276722A1 (en) * | 2011-04-27 | 2012-11-01 | Jen-Inn Chyi | Method for growing semipolar nitride |
WO2016202899A1 (fr) * | 2015-06-18 | 2016-12-22 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procédé permettant d'obtenir sur un substrat cristallin une couche semi-polaire de nitrure obtenu avec l'un au moins parmi les matériaux suivants :gallium (ga), indium (in) et aluminium (al) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020191434A (ja) * | 2019-05-21 | 2020-11-26 | 國立交通大學 | シリコン基板に窒化ガリウムをヘテロ統合した半導体構造、及びその製造方法 |
US11342179B2 (en) | 2019-05-21 | 2022-05-24 | National Chiao Tung University | Semiconductor structure having a Si substrate heterointegrated with GaN and method for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
KR20180120193A (ko) | 2018-11-05 |
US10892378B2 (en) | 2021-01-12 |
JP7055102B2 (ja) | 2022-04-15 |
EP3420125A1 (fr) | 2019-01-02 |
US20190081204A1 (en) | 2019-03-14 |
WO2017144429A1 (fr) | 2017-08-31 |
FR3048002A1 (fr) | 2017-08-25 |
FR3048002B1 (fr) | 2021-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7732306B2 (en) | Methods for producing improved epitaxial materials | |
JP5903714B2 (ja) | エピタキシャル方法およびこの方法によって成長させられたテンプレート | |
US7095062B2 (en) | Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts, and gallium nitride semiconductor structures fabricated thereby | |
JP4486506B2 (ja) | ハイドライド気相成長方法による転位密度の低い無極性窒化ガリウムの成長 | |
US6720196B2 (en) | Nitride-based semiconductor element and method of forming nitride-based semiconductor | |
EP2518191B1 (en) | Template for epitaxial growth and process for producing same | |
CN105702562B (zh) | 使用化学剥离方法的ⅲ族氮化物基板的制备方法 | |
US10896818B2 (en) | Stacking fault-free semipolar and nonpolar GaN grown on foreign substrates by eliminating the nitrogen polar facets during the growth | |
JP2002033288A (ja) | 結晶成長方法 | |
JP2010521810A (ja) | 半導体ヘテロ構造及びその製造 | |
JP4356208B2 (ja) | 窒化物半導体の気相成長方法 | |
JP2018056551A (ja) | 発光素子及びその製造方法 | |
US10892159B2 (en) | Semipolar or nonpolar group III-nitride substrates | |
JP7055102B2 (ja) | 結晶基板上に半極性窒化物層を得るための方法 | |
US20210175077A1 (en) | Semipolar or nonpolar group iii-nitride substrates | |
KR101094409B1 (ko) | 질화갈륨 단결정 후막의 제조 방법 | |
JP7284983B2 (ja) | 半導体基板の製造方法及びそれに用いる下地基板 | |
Zhang | MOCVD growth of GaN on 200mm Si and addressing foundry compatibility issues | |
JP2009208989A (ja) | 化合物半導体基板およびその製造方法 | |
LI | MOCVD GROWTH OF GAN ON 200MM SI AND ADDRESSING FOUNDRY COMPATIBILITY ISSUES | |
Han | Growth of gallium nitride layers with very low threading dislocation densities | |
KR20130036483A (ko) | Ⅲ-ⅴ족 질화물계 화합물 반도체 소자, 기판 및 그 제조 방법 | |
KR20130030400A (ko) | Ⅲ-ⅴ족 질화물계 화합물 반도체 소자, 기판 및 그 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191209 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20201211 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210402 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210913 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211105 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220307 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220405 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7055102 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |