JP2019220636A - Processing method for protective member - Google Patents

Abstract

To provide a processing method for a protective member, by which the protective member made of resin can appropriately be processed.SOLUTION: A processing method for a protective member, by which the protective member stuck to a wafer is processed using a grinding device including a chuck table with a holding surface for holding a wafer and also including a grinding unit for rotating a grinding wheel with a plurality of grinding stones arranged in an annular form, comprises: a protective member sticking step in which an adhesive layer side of the protective member having a base material formed of a material containing resin and an adhesive layer provided on one surface of the base material is stuck to a surface of the wafer; a groove formation step in which a plurality of grooves with a depth not reaching the adhesive layer are formed on the other surface of the base material; a resin filling step in which resin with abrasive grains dispersed therein is filled into the grooves; and a protective member processing step in which a rear surface side of the wafer is held by the holding surface, the chuck table and the grinding wheel are individually rotated to bring the grinding stone into contact with the other surface of the base material of the protective member, thereby decreasing a thickness of the base material.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a protection member processing method for processing a protection member attached to a wafer.

  In electronic devices represented by mobile phones and personal computers, device chips including devices such as integrated circuits are indispensable components. The device chip, for example, divides the front side of a wafer made of a semiconductor material such as silicon into a plurality of dividing lines (streets), forms a device in each region, and divides the wafer along the dividing lines. It can be obtained by:

  In recent years, there has been an increasing number of opportunities to process thin wafers before division for the purpose of reducing the size and weight of device chips. For example, by rotating a disk-shaped tool in which a plurality of grinding wheels formed by dispersing abrasive grains in a binder are fixed, and bringing the grinding wheels into contact with the back surface of the wafer, the wafer is ground from the back surface side. Can be thin.

  When grinding the back surface of the wafer by the method described above, a resin protective member called a protective tape or the like is attached to the surface of the wafer, and the exposed surface side of the protective tape is held by a chuck table or the like. Often do. Thus, it is possible to prevent devices formed on the surface of the wafer from being damaged by a load or the like applied during grinding.

  Incidentally, the protective member made of resin is not necessarily formed to have a uniform thickness, and the thickness of the wafer after being thinned by grinding is likely to vary by simply attaching the protective member to the surface of the wafer. Therefore, a technique has been proposed in which the exposed surface of the protective member is ground before the wafer is ground, and the exposed surface of the protective member is processed to be substantially parallel and flat with respect to the back surface of the wafer (for example, Patent Document 1). 1, 2).

JP-A-61-141142 JP 2005-19666 A

  However, when the protective member made of resin is ground with the above-described grinding wheel, the grinding wheel is likely to be clogged by debris (grinding debris) generated during the grinding. If the grinding wheel is clogged, the load at the time of processing increases, and the protection member cannot be processed properly.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a new protection member processing method capable of appropriately processing a resin protection member.

  According to one aspect of the present invention, the chuck table has a conical holding surface for holding a wafer, and the chuck table rotates so that a vertex of the conical shape becomes a center of rotation, and a plurality of annularly arranged chuck tables. A grinding unit for rotating a grinding wheel having a grinding wheel, and a method for processing a protective member attached to the wafer using a grinding device having the same, wherein a base material formed of a resin-containing material And a pressure-sensitive adhesive layer provided on one surface of the base material, and a protective member bonding step of bonding the pressure-sensitive adhesive layer side of the protective member to the surface of the wafer, and a depth not reaching the pressure-sensitive adhesive layer. Forming a plurality of grooves on the other surface side of the substrate, filling the grooves with a resin in which abrasive grains are dispersed, and filling the grooves with the back surface of the wafer with the holding surface. Holding the chuck table and the grinding wheel Rotating each, by contacting the grinding wheel with the other surface side of the substrate of the protective member, a protective member processing step of processing the protective member so that the thickness of the substrate is reduced, In the protection member processing step, the protection member processing the protection member by aligning the position of the chuck table and the grinding wheel such that the grinding wheel passes through a position corresponding to the vertex of the conical shape. A method is provided.

  In the groove forming step according to one embodiment of the present invention described above, a plurality of grooves having a depth that does not reach the adhesive layer are formed by cutting a rotated annular cutting blade into the base material of the protective member. It may be formed on the other surface side of the substrate.

  In the above-described groove forming step according to one embodiment of the present invention, a plurality of grooves having a depth that does not reach the adhesive layer are formed by irradiating the base material with a laser beam on the other surface side of the base material. May be formed.

  In the method for processing a protective member according to one embodiment of the present invention, a plurality of grooves are formed on the other surface side of the base member of the protective member, and after filling the resin in which the abrasive grains are dispersed in the plurality of grooves, The protective member is processed by bringing a grinding wheel into contact with the other surface of the substrate. Therefore, the grinding wheel is dressed by the resin and the abrasive particles filled in the plurality of grooves, and the protection member can be processed while suppressing the clogging of the grinding wheel.

  In addition, since a plurality of grooves filled with resin are formed in the base material, it becomes easy to cut the grinding wheel into the base material at the boundary with the resin filled in these grooves, thereby improving the efficiency of the protective member. Can be processed well. As described above, according to the method for processing a protection member according to one embodiment of the present invention, a resin protection member can be appropriately processed.

FIG. 1A is a perspective view showing a configuration example of a wafer, and FIG. 1B is a perspective view for explaining a protective member attaching step. FIG. 2A is a partial cross-sectional side view for explaining a groove forming step, and FIG. 2B is a cross-sectional view showing a protective member and the like after the groove forming step. FIG. 3A is a partial cross-sectional side view for explaining a resin filling step, and FIG. 3B is a partially enlarged cross-sectional view showing a protection member and the like after the resin filling step. is there. It is a perspective view showing the example of composition of a grinding device used in a protection member processing process. It is sectional drawing which shows the structure of a chuck table. It is a perspective view showing the structure of a grinding wheel. It is a top view for explaining a protection member processing step. It is a partial section side view for explaining a protection member processing step.

  An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. The processing method of the protective member according to the present embodiment includes a protective member attaching step (see FIG. 1B), a groove forming step (see FIGS. 2A and 2B), and a resin filling step (FIG. A), FIG. 3 (B)), and a protective member processing step (see FIGS. 7 and 8).

  In the protective member attaching step, a protective member made of a material such as resin is attached to the front surface side of the wafer. In the groove forming step, a plurality of grooves are formed in the base material of the protection member. In the resin filling step, a plurality of grooves are filled with a resin in which abrasive grains are dispersed. In the protection member processing step, the protection member attached to the wafer is processed to be thin. Hereinafter, the processing method of the protection member according to the present embodiment will be described in detail.

  FIG. 1A is a perspective view illustrating a configuration example of a wafer 11 used in the present embodiment. As shown in FIG. 1A, the wafer 11 is formed in a disk shape using a semiconductor material such as silicon (Si). The surface 11a side of the wafer 11 is divided into a plurality of regions by a plurality of intersecting dividing lines (streets) 13, and a device 15 such as an IC (Integrated Circuit) is formed in each region.

  In this embodiment, a disc-shaped wafer 11 made of a semiconductor material such as silicon is used, but the material, shape, structure, size, and the like of the wafer 11 are not limited. For example, a substrate made of a material such as ceramics, resin, and metal can be used as the wafer 11. Similarly, the type, quantity, size, arrangement, and the like of the device 15 are not limited. Further, a substrate or the like on which the device 15 is not formed may be used as the wafer 11.

  In the processing method of the protective member according to the present embodiment, first, the above-described protective member attaching step of attaching the protective member to the front surface 11a side of the wafer 11 is performed. FIG. 1B is a perspective view for describing a protective member attaching step. The protective member 21 is formed, for example, in a circular shape having a diameter substantially equal to that of the wafer 11, and has a film-shaped (plate-shaped) base material 23 made of a material containing a resin and a base material having a predetermined adhesive strength. And an adhesive layer 25 provided on one surface of the material 23.

  Therefore, as shown in FIG. 1B, the protective member 21 can be attached to the surface 11 a of the wafer 11 by bringing the adhesive layer 25 side of the protective member 21 into close contact with the surface 11 a of the wafer 11. By attaching the protective member 21 to the front surface 11a side of the wafer 11, the load, impact, and the like when grinding the back surface 11b side of the wafer 11 later are reduced, and the device 15 formed on the front surface 11a side of the wafer 11 is reduced. Etc. can be protected.

  After the protective member attaching step, a groove forming step of forming a plurality of grooves on the other surface side (the opposite side of the adhesive layer 25) of the base material 23 of the protective member 21 is performed. FIG. 2A is a partial cross-sectional side view for describing a groove forming step. The groove forming step is performed using, for example, the cutting device 1 shown in FIG.

  The cutting device 1 includes a chuck table 3 for sucking and holding the wafer 11 to which the protection member 21 is attached. The chuck table 3 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the vertical direction. A processing feed mechanism (not shown) is provided below the chuck table 3, and the chuck table 3 is moved in the processing feed direction (first horizontal direction) by the processing feed mechanism.

  A part of the upper surface of the chuck table 3 is a holding surface 3a for holding the back surface 11b side of the wafer 11. The holding surface 3a is connected to a suction source (not shown) via a suction path (not shown) formed inside the chuck table 3. By applying the negative pressure of the suction source to the holding surface 3a, the wafer 11 is sucked and held on the chuck table 3.

  Above the chuck table 3, a cutting unit 5 for cutting the protection member 21 is arranged. The cutting unit 5 includes a spindle 7 that is a rotation axis that is substantially perpendicular to the processing feed direction and the vertical direction. An annular cutting blade 9 is mounted on one end of the spindle 7.

  A rotary drive source (not shown) such as a motor is connected to the other end of the spindle 7, and the cutting blade 9 mounted on the spindle 7 is rotated by a force transmitted from the rotary drive source. The cutting unit 5 is supported by an elevating mechanism (not shown) and an indexing and feeding mechanism (not shown), is moved vertically (elevated and lowered) by the elevating mechanism, and is indexed and fed in a direction perpendicular to the machining feeding direction by the indexing and feeding mechanism. (Horizontal second direction).

  When a plurality of grooves are formed in the protection member 21 using the cutting device 1, first, the back surface 11b side of the wafer 11 is brought into contact with the holding surface 3a of the chuck table 3, and the holding surface 3a is provided with a suction source. Apply negative pressure. Thereby, the back surface 11b side of the wafer 11 is sucked and held by the chuck table 3, and the other surface side of the base material 23 is exposed upward.

  Next, the chuck table 3 is rotated so that an arbitrary processing line set on the protection member 21 is made parallel to the processing feed direction of the cutting device 1. Further, the chuck table 3 and the cutting unit 5 are relatively moved to align the cutting blade 9 on an extension of an arbitrary line to be processed.

  Thereafter, the lower end of the rotated cutting blade 9 is lowered to a position lower than the other surface of the substrate 23 and higher than the one surface, and the chuck table 3 is moved in the processing feed direction. Thereby, the cutting blade 9 can be cut into the other surface side of the substrate 23 to form the groove 23a along the target processing line. The above operation is repeated until the grooves 23a are formed along all the lines to be processed set in the protection member 21. FIG. 2B is a cross-sectional view illustrating the protection member 21 and the like after the groove forming step.

  There are no particular restrictions on the conditions such as the depth, width, shape, and interval (quantity) of the groove 23a. For example, when the thickness of the base material 23 having a thickness of about 30 μm is reduced to about 10 μm, the depth is 5 μm to 15 μm. , Typically a linear groove 23a having a width of 0.1 mm to 0.3 mm, typically 0.2 mm, and a gap of 0.5 mm to 2.0 mm, typically 1.0 mm. It is good to form with.

  After the groove forming step, a resin filling step of filling the groove 23a with a resin in which abrasive grains are dispersed is performed. FIG. 3A is a partial cross-sectional side view for explaining a resin filling step, and FIG. 3B is a cross-sectional view showing a protection member 21 and the like partially enlarged after the resin filling step. It is. The resin filling step is performed using, for example, a spin coater (spin coater) 31 shown in FIG. The spin coater 31 includes a spinner table (chuck table) 33 for holding the wafer 11.

  The spinner table 33 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the vertical direction. A part of the upper surface of the spinner table 33 is a holding surface 33a for holding the back surface 11b side of the wafer 11. The holding surface 33a is connected to a suction source (not shown) via a suction path (not shown) formed inside the spinner table 33. Above the spinner table 33, a nozzle 35 for dropping a liquid resin 27 in which abrasive grains are dispersed is disposed.

  In the resin filling step, first, the back surface 11b side of the wafer 11 is brought into contact with the holding surface 33a of the spinner table 33, and a negative pressure of a suction source is applied to the holding surface 33a. Thereby, the back surface 11b side of the wafer 11 is sucked and held by the spinner table 33, and the other surface side of the base material 23 is exposed upward.

  Subsequently, as shown in FIG. 3A, the liquid resin 27 is dropped from the nozzle 35 and the spinner table 33 is rotated to apply the liquid resin 27 to the other surface of the base material 23. As described above, the plurality of grooves 23a are formed on the other surface side of the base material 23. Therefore, the liquid resin 27 is filled in the plurality of grooves 23a.

  As the liquid resin 27, for example, a curable resin having a property of being cured by irradiation of light, application of heat, or the like is used. In the present embodiment, abrasive grains are dispersed in the liquid resin 27. The abrasive grains dispersed in the liquid resin 27 are suitable for at least dressing of a grinding wheel 40 (see FIG. 6 and the like) used in a subsequent protective member processing step.

  As such abrasive grains, for example, white alundum (WA) made of alumina, green carborundum (GC) made of silicon carbide, and the like can be used. It is desirable that the particle size of the abrasive grains is smaller than the particle size of the abrasive grains contained in the grinding wheel 40. By dispersing abrasive grains smaller than the abrasive grains of the grinding wheel 40 in the liquid resin 27, the surface (grinding surface) of the grinding wheel 40 can be prevented from being roughened, and the grinding wheel 40 can be dressed more appropriately.

  After filling the plurality of grooves 23a with the liquid resin 27 in which the abrasive grains are dispersed, the liquid resin 27 in the grooves 23a is cured by applying light, applying heat, or the like. As a result, as shown in FIG. 3B, the resin layer 29 containing abrasive grains is formed inside the groove 23a. When the resin layer 29 is formed in the groove 23a, the resin filling step ends.

  In the present embodiment, the plurality of grooves 23a are filled with the liquid resin 27 by the spin coating method using the spin coater 31, so that not only the grooves 23a but also the other surface of the base material 23 is filled with the liquid resin 27. 27 may be applied. As a result, the other surface side of the base material 23 may not be flat. However, since the unevenness formed on the other surface side of the base material 23 by the liquid resin 27 or the like is removed in the subsequent protective member processing step, the unevenness does not cause a problem.

  After the resin filling step, a protection member processing step of processing the protection member 21 attached to the wafer 11 is performed. FIG. 4 is a perspective view showing a configuration example of the grinding device 2 used in the protection member processing step. As shown in FIG. 4, the grinding device 2 includes a base 4 on which each component is mounted. At the rear end of the base 4, a columnar support structure 6 is provided.

  An opening 4 a that is long in the X-axis direction (front-back direction) is formed on the upper surface of the base 4. A ball screw type X-axis moving mechanism 8 and a dust-proof and drip-proof cover 10 that covers a part of the X-axis moving mechanism 8 are arranged in the opening 4a. The X-axis moving mechanism 8 includes an X-axis moving table 8a, and moves the X-axis moving table 8a in the X-axis direction. An operation panel 12 for inputting processing conditions and the like is provided in front of the opening 4a.

  On the X-axis movement table 8a, a chuck table 14 for holding the wafer 11 to which the protection member 21 is attached is provided. FIG. 5 is a sectional view showing the structure of the chuck table 14. In FIG. 5, the shape of the chuck table 14 and the like are exaggerated for convenience of explanation. As shown in FIGS. 4 and 5, a part of the upper surface of the chuck table 14 is a holding surface 14 a for holding the wafer 11.

  The holding surface 14a is formed in a substantially conical shape (a shape corresponding to the side surface of the cone), and is connected to a suction source (not shown) via a suction path 14b formed inside the chuck table 14. . The wafer 11 can be sucked and held by the chuck table 14 by placing the wafer 11 on the holding surface 14a and applying the negative pressure of the suction source. In FIG. 5, the conical shape of the holding surface 14a is exaggerated, but in reality, the difference between the highest point and the lowest point of the holding surface 14a (height difference) is about 15 μm to 20 μm.

  The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and is generally arranged in the Z-axis direction (vertical direction) such that the conical apex 14c of the holding surface 14a is the center of rotation. Rotate around parallel axes of rotation. The chuck table 14 is moved in the X-axis direction together with the X-axis movement table 8a by the X-axis movement mechanism 8 described above.

  On the front surface of the support structure 6, a Z-axis moving mechanism 16 is provided. The Z-axis moving mechanism 16 includes a pair of Z-axis guide rails 18 that are substantially parallel to the Z-axis direction. A Z-axis moving plate 20 is slidably mounted on the Z-axis guide rails 18. A nut (not shown) is provided on the rear side (rear side) of the Z-axis moving plate 20, and a Z-axis ball screw 22 substantially parallel to the Z-axis guide rail 18 is screwed into the nut. ing.

  A Z-axis pulse motor 24 is connected to one end of the Z-axis ball screw 22. By rotating the Z-axis ball screw 22 by the Z-axis pulse motor 24, the Z-axis moving plate 20 moves in the Z-axis direction along the Z-axis guide rail 18. On the front surface (front surface) of the Z-axis moving plate 20, a support 26 protruding forward is provided.

  A grinding unit (processing unit) 28 for processing the protection member 21 attached to the wafer 11 is supported by the support 26. The grinding unit 28 includes a spindle housing 30 fixed to the support 26. A spindle 32 serving as a rotation shaft is rotatably accommodated in the spindle housing 30.

  The lower end (tip) of the spindle 32 is exposed outside the spindle housing 30. At the lower end of the spindle 32, a disk-shaped wheel mount 34 is provided. A disc-shaped grinding wheel 36 having substantially the same diameter as the wheel mount 34 is fixed to the lower surface of the wheel mount 34 with bolts or the like.

  FIG. 6 is a perspective view showing the structure of the grinding wheel 36. As shown in FIG. 6, the grinding wheel 36 according to the present embodiment includes a disk-shaped (annular) wheel base 38 made of stainless steel, aluminum, or the like. The wheel base 38 has an upper surface 38a and a lower surface 38b that are substantially parallel to each other, and a substantially circular opening 38c that penetrates the wheel base 38 from the upper surface 38a to the lower surface 38b is formed at the center. The lower surface 38b of the wheel base 38 is provided with a plurality of supply ports 38d for supplying a liquid (working liquid) such as pure water downward.

  When mounting the grinding wheel 36 on the above-described grinding device 2, the upper surface 38a of the wheel base 38 is brought into close contact with the lower surface of the wheel mount 34, and the wheel base 38 is fixed to the wheel mount 34 with bolts or the like. That is, the upper surface 38a of the wheel base 38 is a fixed end surface that contacts the wheel mount 34 of the grinding device 2. On the other hand, the lower surface 38 b of the wheel base 38 is a free end surface that is not fixed to the grinding device 2.

  On the lower surface 38b of the wheel base 38, a plurality of grinding wheels 40 in which abrasive grains such as diamond or CBN (Cubic Boron Nitride) are dispersed in a binder such as resin or metal are annularly arranged and fixed. Although there is no particular limitation on the type (material) of the binder constituting the grinding wheel 40 and the material, size, shape, etc. of the abrasive grains, in the present embodiment, the abrasive grains of the diamond are formed of a nickel (plating) binder. The grinding wheel 40 fixed by the above is used.

  FIG. 7 is a plan view for explaining the protection member processing step, and FIG. 8 is a partial cross-sectional side view for explaining the protection member processing step. In the protection member processing step, first, the back surface 11b side of the wafer 11 is brought into contact with the holding surface 14a of the chuck table 14, and a negative pressure of a suction source is applied to the holding surface 14a. Thereby, the back surface 11b side of the wafer 11 is sucked and held by the chuck table 14, and the other surface side of the base material 23 is exposed upward.

  After the wafer 11 is sucked and held by the chuck table 14, the chuck table 14 is moved by the X-axis moving mechanism 8 to grind the position corresponding to the conical vertex 14c of the holding surface 14a as shown in FIG. The positional relationship between the chuck table 14 and the grinding wheel 36 is adjusted so that the grindstone 40 passes.

  Next, the chuck table 14 and the grinding wheel 36 are rotated at predetermined rotation speeds in predetermined directions. The rotation speed of the chuck table 14 is, for example, about 10 rpm, and the rotation speed of the grinding wheel 36 is, for example, about 4000 rpm. However, the rotation speed of the chuck table 14 and the rotation speed of the grinding wheel 36 are not limited to these.

  Then, the grinding wheel 36 is lowered at a predetermined speed, and the grinding wheel 40 is brought into contact with the other surface side of the base material 23 of the protective member 21 while supplying a liquid (working liquid) from the plurality of supply ports 38d and the like. The speed at which the grinding wheel 36 is lowered is, for example, about 0.1 μm / s, and the supply amount of the liquid is, for example, about 3.0 L / min to 7.0 L / min. However, the speed at which the grinding wheel 36 is lowered and the liquid supply amount are not limited to these.

  Thereby, as shown in FIG. 8, the base member 23 of the protection member 21 is processed by the grinding wheel 40 so as to be thinned. For example, when the exposed surface of the base member 23 of the protection member 21 is substantially parallel and flat with respect to the back surface 11b of the wafer 11, the protection member processing step is completed.

  As described above, in the present embodiment, before processing the protective member 21, a plurality of grooves 23a are formed on the other surface side of the base material 23, and the resin 27 in which abrasive grains are dispersed in the plurality of grooves 23a. Is filled to form the resin layer 29. Therefore, the grinding wheel 40 is dressed by the resin layer 29 (resin and abrasive grains) provided in the plurality of grooves 23a, and the protection member 21 can be processed while suppressing the clogging of the grinding wheel 40.

  Further, since the grinding wheel 40 is easily cut into the base material 23 at the boundary between the resin layer 29 provided in the groove 23a and the base material 23 (groove 23a), the protection member 21 (base material 23) can be efficiently formed. (Effectively) can be processed.

  After the protection member processing step, for example, a grinding step of grinding the back surface 11b side of the wafer 11 may be performed. In this case, the wafer 11 can be ground using the above-described grinding device 2 and grinding wheel 36, or the wafer 11 may be ground using another grinding device or grinding wheel.

  In the processing method of the protection member according to the present embodiment, since the protection member 21 can be appropriately processed, the variation in thickness can be achieved by holding the protection member 21 side by a chuck table or the like and grinding the back surface 11b side of the wafer 11. The thickness of the wafer 11 can be reduced while suppressing the thickness. That is, by incorporating the processing method of the protection member according to the present embodiment into the processing method (grinding method) of the wafer, the processing accuracy of the wafer 11 can be improved.

  As described above, in the method for processing the protection member according to the present embodiment, the plurality of grooves 23a are formed on the other surface side of the base member 23 of the protection member 21, and the abrasive grains are dispersed in the plurality of grooves 23a. After the resin 27 is filled, the protective member 21 is processed by bringing the grinding wheel 40 into contact with the other surface of the substrate 23. Therefore, the grinding wheel 40 is dressed by the resin and the abrasive particles filled in the plurality of grooves 23a, and the protection member 21 can be processed while suppressing the clogging of the grinding wheel 40.

  Further, since the plurality of grooves 23a filled with the resin layer 29 (resin 27) are formed in the base material 23, the grinding grindstone 40 is formed at the boundary between the plurality of grooves 23a and the resin layer 29 filled in the grooves 23a. 23, the protection member 21 can be efficiently processed. As described above, according to the method for processing the protection member according to the present embodiment, the protection member 21 made of resin can be appropriately processed.

  Note that the present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, in the above embodiment, the chuck table 14 and the grinding wheel 36 are both rotated in the counterclockwise direction in the plan view of FIG. 7, but there is no particular limitation on the direction in which the chuck table 14 and the grinding wheel 36 are rotated. Absent.

  In the above embodiment, the resin 27 is filled in the groove 23a by the spin coating method. However, the method of filling the resin 27 is not particularly limited. For example, the resin 23 can be filled in the groove 23a by using an arbitrary method such as a spray coating method, a screen printing method, a dip coating method, and an inkjet method.

  Further, in the above-described embodiment, the plurality of grooves 23 a having a depth that does not reach the adhesive layer 25 are formed on the other side of the base material 23 by a method in which the rotated annular cutting blade 9 is cut into the base material 23 of the protection member 21. However, for example, a plurality of grooves 23a can be formed by irradiating the base material 23 with a laser beam. In this case, a laser beam having a wavelength easily absorbed by the base material 23 is preferably used.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

11 Wafer 11a Front 11b Back 13 Planned dividing line (street)
DESCRIPTION OF SYMBOLS 15 Device 21 Protective member 23 Base material 23a Groove 25 Adhesive material layer 27 Liquid resin 29 Resin layer 1 Cutting device 3 Chuck table 3a Holding surface 5 Cutting unit 7 Spindle 9 Cutting blade 2 Grinding device 4 Base 6 Support structure 8 X axis Moving mechanism 8a X-axis moving table 10 Dust-proof and drip-proof cover 12 Operation panel 14 Chuck table 14a Holding surface 14b Suction path 14c Vertex 16 Z-axis moving mechanism 18 Z-axis guide rail 20 Z-axis moving plate 22 Z-axis ball screw 24 Z-axis pulse motor 26 Supporting tool 28 Grinding unit (processing unit)
Reference Signs List 30 spindle housing 32 spindle 34 wheel mount 36 grinding wheel 38 wheel base 38a upper surface 38b lower surface 38c opening 38d supply port 40 grinding wheel 31 spin coater (spin coater)
33 Spinner table (chuck table)
33a holding surface 35 nozzle

Claims (3)

A chuck table that has a conical holding surface for holding a wafer and rotates so that the apex of the conical shape becomes the center of rotation, and rotates a grinding wheel having a plurality of grinding wheels arranged in an annular shape Grinding unit, and a method of processing a protective member for processing the protective member attached to the wafer using a grinding device having a,
A protective member attaching step of attaching the adhesive layer side of a protective member having a substrate formed of a resin-containing material and an adhesive layer provided on one surface of the substrate to the surface of the wafer When,
A groove forming step of forming a plurality of grooves having a depth not reaching the adhesive material layer on the other surface side of the base material;
A resin filling step of filling the grooves with a resin in which abrasive grains are dispersed,
By holding the back side of the wafer with the holding surface, rotating the chuck table and the grinding wheel respectively, and bringing the grinding wheel into contact with the other surface side of the base material of the protective member, A protection member processing step of processing the protection member so that the thickness of the base material is reduced,
In the protection member processing step, the protection member is processed by aligning a position of the chuck table and the grinding wheel such that the grinding wheel passes through a position corresponding to a vertex of the conical shape. Processing method of the member.   In the groove forming step, a plurality of grooves having a depth not reaching the adhesive layer are formed on the other surface side of the base material by cutting the rotated annular cutting blade into the base material of the protection member. The method for processing a protective member according to claim 1, wherein the protective member is formed.   In the groove forming step, a plurality of grooves having a depth not reaching the adhesive layer are formed on the other surface side of the base material by irradiating the base material with a laser beam. The method for processing a protective member according to item 1.