JP2019216173A - Capacitor - Google Patents

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JP2019216173A
JP2019216173A JP2018112212A JP2018112212A JP2019216173A JP 2019216173 A JP2019216173 A JP 2019216173A JP 2018112212 A JP2018112212 A JP 2018112212A JP 2018112212 A JP2018112212 A JP 2018112212A JP 2019216173 A JP2019216173 A JP 2019216173A
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electrode plate
electrode
capacitor element
capacitor
heat transfer
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JP7163542B2 (en
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友佳 石原
Yuka Ishihara
友佳 石原
勇太 岡部
Yuta Okabe
勇太 岡部
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Shizuki Electric Co Inc
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Shizuki Electric Co Inc
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Abstract

To provide a capacitor that is able to achieve efficient cooling while minimizing the number of components.SOLUTION: A capacitor comprises: a first module M1 comprising a first capacitor element 2, a first electrode plate 4 connected to one electrode part 2a of the first capacitor element 2, and a second electrode plate 5 connected to the other electrode part 2b of the first capacitor element 2; a second module M2 comprising a second capacitor element 3, a third electrode plate 6 connected to one electrode part 3a of a second capacitor element 3, and a fourth electrode plate 7 connected to the other electrode part 3b of the second capacitor element 3; and a heat transfer member 8. A third electrode plate 6 has an extended part 61c along the first module M1; the fourth electrode plate 7 has an overlap part 71b overlapping the extended part 61c of the third electrode plate 6 on an opposite side of the first module M1. The heat transfer member 8 has: a body part 81 along the extended part 61c of the third electrode plate 6 and/or the overlap part 71b of the fourth electrode plate 7; and an extended part 83 along the first electrode plate 4.SELECTED DRAWING: Figure 3

Description

この発明は、伝熱部材を備えたコンデンサに関する。   The present invention relates to a capacitor having a heat transfer member.

特許文献1〜3には、電極板に伝熱部材を当接又は近接させ、電極板やコンデンサ素子の熱を取り除くことが記載されている。特に特許文献2には、正負電極板を互いに重ね合わせる(平行平板構造とする)ことで低インダクタンス化を図りつつ、正負電極板の間に伝熱部材(熱伝導シート)を介在させることが記載されている。   Patent Documents 1 to 3 disclose that a heat transfer member is brought into contact with or close to an electrode plate to remove heat from the electrode plate and the capacitor element. In particular, Patent Literature 2 describes that a heat transfer member (a heat conductive sheet) is interposed between the positive and negative electrode plates while reducing the inductance by stacking the positive and negative electrode plates on each other (a parallel plate structure). I have.

特開2013−084787号公報JP 2013-084787 A 特開2016−119440号公報JP-A-2006-119440 特開2017−017861号公報JP 2017-017861 A

ところで、1つ又は複数のコンデンサ素子と、コンデンサ素子の電極部にそれぞれ接続される正負一対の電極板とからなるモジュールを複数組み合わせてコンデンサを構成することがある。このようなコンデンサにおいて、例えば特許文献2と同様に、正負電極板の間に伝熱部材を介在させようとすると、各モジュールにそれぞれ伝熱部材を設けることとなり、部品点数の増加による組み立ての煩雑化やコスト増を招くことになる。   By the way, a capacitor may be constituted by combining a plurality of modules each including one or more capacitor elements and a pair of positive and negative electrode plates respectively connected to the electrode portions of the capacitor elements. In such a capacitor, if a heat transfer member is to be interposed between the positive and negative electrode plates, as in Patent Document 2, for example, a heat transfer member is provided for each module, and assembly becomes complicated due to an increase in the number of parts. This will increase costs.

そこで本発明は、部品点数を抑えつつも効率良く冷却することができるコンデンサの提供を目的とする。   Therefore, an object of the present invention is to provide a capacitor that can efficiently cool while suppressing the number of components.

本発明のコンデンサ1は、第1コンデンサ素子2と、第1コンデンサ素子2の一方の電極部2aに接続された第1電極板4と、第1コンデンサ素子2の他方の電極部2bに接続された第2電極板5とからなる第1モジュールM1と、第2コンデンサ素子3と、第2コンデンサ素子3の一方の電極部3aに接続された第3電極板6と、第2コンデンサ素子3の他方の電極部3bに接続された第4電極板7とからなる第2モジュールM2と、伝熱部材8とを備え、第3電極板6が、第1モジュールM1に沿う伸長部61cを有し、第4電極板7が、第1モジュールM1の反対側で第3電極板6の伸長部61cに重なる重ね合わせ部71bを有し、伝熱部材8が、第3電極板6の伸長部61c及び/又は第4電極板7の重ね合わせ部71bに沿う本体部81と、第1電極板4に沿う延設部83とを有している。   The capacitor 1 of the present invention is connected to the first capacitor element 2, the first electrode plate 4 connected to one electrode section 2 a of the first capacitor element 2, and the other electrode section 2 b of the first capacitor element 2. A first module M1 including a second electrode plate 5, a second capacitor element 3, a third electrode plate 6 connected to one electrode portion 3a of the second capacitor element 3, and a second capacitor element 3. A second module M2 comprising a fourth electrode plate 7 connected to the other electrode portion 3b and a heat transfer member 8 are provided, and the third electrode plate 6 has an extension 61c along the first module M1. , The fourth electrode plate 7 has an overlapping portion 71b overlapping the extension 61c of the third electrode plate 6 on the side opposite to the first module M1, and the heat transfer member 8 is provided with an extension 61c of the third electrode plate 6. And / or book along the overlapping portion 71b of the fourth electrode plate 7 And parts 81, and a extending portion 83 along the first electrode plate 4.

伝熱部材8の本体部81が、第1モジュールM1と第3電極板6の伸長部61cとの間に位置していることが好ましい。   It is preferable that the main body portion 81 of the heat transfer member 8 be located between the first module M1 and the extending portion 61c of the third electrode plate 6.

特に、伝熱部材8の本体部81が、第2電極板5と第3電極板6の伸長部61cとの間に位置していることが好ましい。   In particular, it is preferable that the main body portion 81 of the heat transfer member 8 be located between the second electrode plate 5 and the extending portion 61c of the third electrode plate 6.

本発明のコンデンサは、伝熱部材が、第3電極板の伸長部及び/又は第4電極板の重ね合わせ部に沿う本体部と、第1電極板に沿う延設部とを有しているため、1つの伝熱部材で2つのモジュールの冷却を図ることができ、部品点数を抑えつつも効率良く冷却することができる。   In the capacitor of the present invention, the heat transfer member has a main body along the extension of the third electrode plate and / or the overlapped portion of the fourth electrode plate, and an extension along the first electrode plate. Therefore, two modules can be cooled by one heat transfer member, and cooling can be efficiently performed while suppressing the number of components.

伝熱部材の本体部が、第1モジュールと第3電極板の伸長部との間に位置していれば、熱のこもり易いモジュールと電極板との間の冷却を図ることができる。   If the main body of the heat transfer member is located between the first module and the extension of the third electrode plate, cooling between the module that easily stores heat and the electrode plate can be achieved.

伝熱部材の本体部が、第2電極板と第3電極板の伸長部との間に位置していれば、1つの伝熱部材によって、第1、第2、第3電極板の冷却を図ることができる。   When the main body of the heat transfer member is located between the second electrode plate and the extension of the third electrode plate, the cooling of the first, second, and third electrode plates is performed by one heat transfer member. Can be planned.

この発明の一実施形態に係るコンデンサを示す分解斜視図である。1 is an exploded perspective view showing a capacitor according to an embodiment of the present invention. 各モジュールと伝熱部材とをケースに収容した状態を示す斜視図である。It is a perspective view showing the state where each module and the heat transfer member were stored in the case. コンデンサの要部断面図である。It is principal part sectional drawing of a capacitor. コンデンサを外部機器の筐体に取り付けた状態を示す要部断面図である。FIG. 4 is a cross-sectional view of a main part showing a state where the capacitor is attached to a housing of an external device. 異なる実施形態のコンデンサを示す要部断面図である。It is a principal part sectional view showing a capacitor of a different embodiment. 冷却効果の比較対象となるコンデンサを示す要部断面図である。It is principal part sectional drawing which shows the capacitor used as a comparison object of a cooling effect.

次に、この発明のコンデンサ1の一実施形態を図面に基づいて詳細に説明する。この発明のコンデンサ1は、図1に示すように、第1コンデンサ素子2と、第1コンデンサ素子2の一方の電極部2aに接続された第1電極板4と、第1コンデンサ素子2の他方の電極部2bに接続された第2電極板5とからなる第1モジュールM1と、第2コンデンサ素子3と、第2コンデンサ素子3の一方の電極部3aに接続された第3電極板6と、第2コンデンサ素子3の他方の電極部3bに接続された第4電極板7とからなる第2モジュールM2と、伝熱部材8とを備えている。また、第1、第2モジュールM1、M2を収容するケース9と、ケース9内に充填され、少なくとも第1、第2コンデンサ素子2、3を覆う樹脂R(図3参照)とを備えている。以下、上記の各部品について説明していくが、説明における「上下」の概念は、製造時、より具体的には樹脂充填時におけるものであって、必ずしも使用時の上下を規定するものではない。   Next, an embodiment of the capacitor 1 of the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, a capacitor 1 of the present invention includes a first capacitor element 2, a first electrode plate 4 connected to one electrode 2 a of the first capacitor element 2, and the other of the first capacitor element 2. A first module M1 including a second electrode plate 5 connected to the electrode portion 2b of the second capacitor element 3, a second capacitor element 3, and a third electrode plate 6 connected to one electrode section 3a of the second capacitor element 3. , A second module M2 including a fourth electrode plate 7 connected to the other electrode portion 3b of the second capacitor element 3, and a heat transfer member 8. In addition, a case 9 that accommodates the first and second modules M1 and M2 and a resin R (see FIG. 3) filled in the case 9 and covering at least the first and second capacitor elements 2 and 3 are provided. . Hereinafter, each of the above components will be described, but the concept of “up and down” in the description is at the time of manufacturing, more specifically, at the time of filling the resin, and does not necessarily define the up and down at the time of use. .

第1コンデンサ素子2は、絶縁性のフィルムの表面に金属を蒸着した金属化フィルムを巻回することでなるフィルムコンデンサであって、図1に示すように、軸方向両端面に金属を溶射してなる電極部2a、2bがそれぞれ形成されている。このコンデンサ素子2は、軸方向から見ると扁平状、具体的には略トラック状(2本の平行線とその両端を半円でつないだ形状)であり、軸方向外周に平坦部2cと曲面部2dとを有している。   The first capacitor element 2 is a film capacitor formed by winding a metallized film obtained by vapor-depositing a metal on the surface of an insulating film. As shown in FIG. Are formed, respectively. The capacitor element 2 has a flat shape when viewed from the axial direction, specifically, a substantially track shape (a shape in which two parallel lines and both ends thereof are connected by a semicircle), and a flat portion 2c and a curved surface on the outer periphery in the axial direction. 2d.

上記構成の第1コンデンサ素子2は、電極部2a、2bを上下に向けた状態で、互いに平坦部2c、2c同士を対向させるようにして4つ並べることで、第1コンデンサ素子群を構成している。なお、第1コンデンサ素子群における第1コンデンサ素子2の数は、必要な静電容量に合わせて適宜変更可能である。   The first capacitor element 2 having the above configuration constitutes a first capacitor element group by arranging four such that the flat portions 2c and 2c face each other with the electrode portions 2a and 2b facing up and down. ing. Note that the number of the first capacitor elements 2 in the first capacitor element group can be appropriately changed according to the required capacitance.

第2コンデンサ素子3は、第1コンデンサ素子2と同様の構成である。また、第2コンデンサ素子群も第1コンデンサ素子群と同様の構成である。従って、同添え字を付し、詳細な説明は省略する。なお、第1コンデンサ素子群と第2コンデンサ素子群とでコンデンサ素子2、3の数を合わせる必要は無い。   The second capacitor element 3 has the same configuration as the first capacitor element 2. The second capacitor element group has the same configuration as the first capacitor element group. Therefore, the same suffix is attached and detailed description is omitted. It is not necessary to match the number of capacitor elements 2 and 3 between the first capacitor element group and the second capacitor element group.

第1電極板4は、図1に示すように、第1コンデンサ素子2の下側の電極部2aに接続されている。この第1電極板4は、第1コンデンサ素子2の外面に沿う本体部41と、本体部41の上端から上方に延出された外部接続部42と、本体部41の電極部2a側の端部から延出された素子接続片43とからなる。本体部41は、第1コンデンサ素子2の下側の電極部2aに沿う水平部41aと、水平部41aの一端から立ち上がり、曲面部2dに沿う垂直部41bとに大別されており、全体として側面視略L字状となっている。   The first electrode plate 4 is connected to the lower electrode portion 2a of the first capacitor element 2, as shown in FIG. The first electrode plate 4 includes a main body portion 41 extending along the outer surface of the first capacitor element 2, an external connection portion 42 extending upward from an upper end of the main body portion 41, and an end of the main body portion 41 on the electrode portion 2 a side. And an element connection piece 43 extending from the portion. The main body 41 is roughly divided into a horizontal portion 41a along the lower electrode portion 2a of the first capacitor element 2 and a vertical portion 41b rising from one end of the horizontal portion 41a and extending along the curved surface portion 2d. It is substantially L-shaped when viewed from the side.

第2電極板5は、第1コンデンサ素子2の上側の電極部2bに接続されている。この第2電極板5は、第1コンデンサ素子2の上側の電極部2bに沿う本体部51と、本体部51の端部から上方に延出された外部接続部52と、本体部51の外部接続部52が延出された側とは反対側の端部から延出された素子接続片53とからなる。なお、第2電極板5の外部接続部52は、第1電極板4の外部接続部42と重ならないよう、ずらして設けられている。   The second electrode plate 5 is connected to the upper electrode portion 2b of the first capacitor element 2. The second electrode plate 5 includes a main body 51 extending along the upper electrode 2 b of the first capacitor element 2, an external connection part 52 extending upward from an end of the main body 51, and an external part of the main body 51. An element connecting piece 53 extends from an end opposite to the side where the connecting portion 52 extends. The external connection portion 52 of the second electrode plate 5 is provided so as to be shifted so as not to overlap with the external connection portion 42 of the first electrode plate 4.

第3電極板6は、第2コンデンサ素子3の下側の電極部3aに接続されている。この第3電極板6は、その一部が第2コンデンサ素子3の外面に沿う本体部61と、本体部61の端部から上方に延出された外部接続部62と、本体部61の電極部3a側の端部から延出された素子接続片63とからなる。本体部61は、第2コンデンサ素子3の下側の電極部3aに沿う水平部61aと、水平部61aの一端から立ち上がり、曲面部3dに沿う垂直部61bと、垂直部61bの上端から水平方向に延びる伸長部61cとに大別されており、全体として側面視略Z字状となっている。   The third electrode plate 6 is connected to the lower electrode portion 3a of the second capacitor element 3. The third electrode plate 6 includes a main body 61 partially extending along the outer surface of the second capacitor element 3, an external connection portion 62 extending upward from an end of the main body 61, and an electrode of the main body 61. And an element connecting piece 63 extending from the end on the part 3a side. The main body 61 includes a horizontal portion 61a along the lower electrode portion 3a of the second capacitor element 3, a vertical portion 61b rising from one end of the horizontal portion 61a, and a vertical portion 61b along the curved surface portion 3d, and a horizontal direction from an upper end of the vertical portion 61b. And is generally Z-shaped when viewed from the side as a whole.

第4電極板7は、第2コンデンサ素子3の上側の電極部3bに接続されている。この第4電極板7は、一部が第2コンデンサ素子3の上側の電極部3bに沿う本体部71と、本体部71の端部から上方に延出された外部接続部72と、本体部71の外部接続部72が延出された側とは反対側の端部から延出された素子接続片73とからなる。本体部71は、第2コンデンサ素子3の上側の電極部3bに沿う水平部71aと、第3電極板6の伸長部61cと重なる重ね合わせ部71bとに大別されている。また、水平部71aと重ね合わせ部71bとの間には、水平部71aよりも重ね合わせ部71bを僅かに持ち上げる段差71cが設けられている。第4電極板7の外部接続部72は、第3電極板6の外部接続部62と重ならないよう、ずらして設けられている。   The fourth electrode plate 7 is connected to the upper electrode portion 3b of the second capacitor element 3. The fourth electrode plate 7 includes a main body 71 partially extending along the upper electrode portion 3 b of the second capacitor element 3, an external connection portion 72 extending upward from an end of the main body 71, An element connection piece 73 extends from an end opposite to the side from which the external connection portion 72 of the extension 71 extends. The main body 71 is roughly divided into a horizontal portion 71a along the upper electrode portion 3b of the second capacitor element 3 and an overlapping portion 71b overlapping with the extension portion 61c of the third electrode plate 6. In addition, a step 71c is provided between the horizontal portion 71a and the overlapping portion 71b to slightly lift the overlapping portion 71b more than the horizontal portion 71a. The external connection part 72 of the fourth electrode plate 7 is provided so as not to overlap with the external connection part 62 of the third electrode plate 6.

各電極板4、5、6、7は、例えばアルミニウムや銅などの金属板を適宜打ち抜き加工や折り曲げ加工することで形成されている。   Each of the electrode plates 4, 5, 6, and 7 is formed by appropriately punching or bending a metal plate such as aluminum or copper.

伝熱部材8は、平面視略矩形状の本体部81と、本体部81の端部から延出された接続部82と、接続部82が延出された端部から下方に向かって延出された延設部83とからなる。接続部82は、本体部81のコーナー近傍から延出されており、先端近傍には取付孔82aが穿設されている。延設部83は、2つの接続部82、82の間から延出されている。この延設部83は、第1、第2電極板4、5の外部接続部42、52との接触を避けるため、外部接続部42、52が位置する箇所に切欠き83aが設けられている。なお、この状態は、延設部83が2つに分割されているともいえる。伝熱部材8は、例えばアルミニウムや銅などの金属板を適宜打ち抜き加工や折り曲げ加工することで形成される。ただ、導電性を備える必要なく、熱伝導率の高い材質のもので製造可能である。   The heat transfer member 8 includes a main body 81 having a substantially rectangular shape in a plan view, a connecting portion 82 extending from an end of the main body 81, and extending downward from the end where the connecting portion 82 extends. And the extended portion 83 provided. The connecting portion 82 extends from the vicinity of the corner of the main body portion 81, and a mounting hole 82a is formed near the front end. The extending portion 83 extends from between the two connecting portions 82 and 82. In order to avoid contact with the external connection portions 42 and 52 of the first and second electrode plates 4 and 5, the extension portion 83 is provided with a notch 83a at a position where the external connection portions 42 and 52 are located. . In this state, it can be said that the extending portion 83 is divided into two. The heat transfer member 8 is formed by appropriately punching or bending a metal plate such as aluminum or copper. However, it is not necessary to provide conductivity, and it is possible to manufacture with a material having high thermal conductivity.

ケース9は平面視略矩形状の底部91と、底部91の四辺からそれぞれ立ち上がる側壁部92とからなる。上面に開口93が設けられており、内部には第1、第2コンデンサ素子2、3を収容可能な収容空間を備えている。4つの側壁部92のうちの1つの側壁部92には、伝熱部材8の接続部82と接続するための取付部94が設けられている。この取付部94は、コンデンサ1を外部機器であるインバータなどの筐体Cに取り付ける際にも使用するものであって、取付孔94aを備えている。   The case 9 includes a bottom portion 91 having a substantially rectangular shape in a plan view, and side wall portions 92 rising from four sides of the bottom portion 91. An opening 93 is provided on the upper surface, and an accommodation space capable of accommodating the first and second capacitor elements 2 and 3 is provided inside. One of the four side wall portions 92 is provided with a mounting portion 94 for connecting to the connection portion 82 of the heat transfer member 8. The mounting portion 94 is also used when mounting the capacitor 1 to a housing C such as an inverter, which is an external device, and has a mounting hole 94a.

ケース9内に充填される樹脂Rは例えばエポキシ樹脂である。ただこれに限らず、ウレタン樹脂等の公知の種々の樹脂を使用可能である。   The resin R filled in the case 9 is, for example, an epoxy resin. However, the invention is not limited thereto, and various known resins such as urethane resins can be used.

次に、コンデンサ1の製造方法について説明する。まず、第1コンデンサ素子2に対して第1、第2電極板4、5を接続して第1モジュールM1を構成するとともに、第2コンデンサ素子3に対して第3、第4電極板6、7を接続して第2モジュールM2を構成する。具体的には、第1コンデンサ素子2の下側の電極部2aと、第1電極板4の素子接続片43とを接続し、第1コンデンサ素子2の上側の電極部2bと、第2電極板5の素子接続片53とを接続する。また、第2コンデンサ素子3の下側の電極部3aと、第3電極板6の素子接続片63とを接続し、第2コンデンサ素子3の上側の電極部3bと、第4電極板7の素子接続片73とを接続する。この際、各電極板4、5、6、7の外部接続部42、52、62、72は同じ側に揃えておく。この状態で、第3電極板6の伸長部61cと、第4電極板7の重ね合わせ部71bとが絶縁を確保した上で互いに重なり合う。   Next, a method for manufacturing the capacitor 1 will be described. First, the first and second electrode plates 4 and 5 are connected to the first capacitor element 2 to form a first module M1, and the third and fourth electrode plates 6 and 7 to form a second module M2. Specifically, the lower electrode part 2a of the first capacitor element 2 is connected to the element connection piece 43 of the first electrode plate 4, and the upper electrode part 2b of the first capacitor element 2 and the second electrode The element connection piece 53 of the plate 5 is connected. The lower electrode portion 3a of the second capacitor element 3 is connected to the element connection piece 63 of the third electrode plate 6, and the upper electrode portion 3b of the second capacitor element 3 and the fourth electrode plate 7 are connected. The element connection piece 73 is connected. At this time, the external connection portions 42, 52, 62, 72 of the respective electrode plates 4, 5, 6, 7 are aligned on the same side. In this state, the extending portion 61c of the third electrode plate 6 and the overlapping portion 71b of the fourth electrode plate 7 overlap each other while ensuring insulation.

次に、第1モジュールM1と第2モジュールM2の間に伝熱部材8を介在させる。具体的には、まず第1コンデンサ素子2の上側の電極部2b及び第2電極板5の本体部51の上に、伝熱部材8の本体部81を絶縁を確保した上で重ね合わせる。この際、伝熱部材8の延設部83に設けられた切欠き83aに第1、第2電極板4、5の外部接続部42、52を位置させるとともに、延設部83を第1電極板4の垂直部41bに沿わせる(絶縁を確保した上で重ね合わせる)。続いて、伝熱部材8の本体部81の上に、第3電極板6の伸長部61cを沿わせる(絶縁を確保した上で重ね合わせる)。これにより、第1コンデンサ素子2と第2コンデンサ素子3とは互いに曲面部2d、3dを互いに対向させた状態で水平方向に並ぶこととなり、第3電極板6の伸長部61cが第1モジュールM1の上面に沿うこととなる。また、伝熱部材8の本体部81が、第1モジュールM1(より具体的には第2電極板5の本体部51)と第3電極板6の伸長部61cとの間に位置することになる。   Next, the heat transfer member 8 is interposed between the first module M1 and the second module M2. Specifically, first, the main body 81 of the heat transfer member 8 is superimposed on the upper electrode 2 b of the first capacitor element 2 and the main body 51 of the second electrode plate 5 while ensuring insulation. At this time, the external connection portions 42, 52 of the first and second electrode plates 4, 5 are positioned in the notches 83a provided in the extension portion 83 of the heat transfer member 8, and the extension portion 83 is connected to the first electrode. Along the vertical portion 41b of the plate 4 (overlap with securing insulation). Subsequently, the extending portion 61c of the third electrode plate 6 is arranged on the main body portion 81 of the heat transfer member 8 (overlapping after securing the insulation). As a result, the first capacitor element 2 and the second capacitor element 3 are arranged in the horizontal direction with the curved surfaces 2d, 3d facing each other, and the extension 61c of the third electrode plate 6 is connected to the first module M1. Along the upper surface of. Further, the main body 81 of the heat transfer member 8 is located between the first module M1 (more specifically, the main body 51 of the second electrode plate 5) and the extension 61c of the third electrode plate 6. Become.

このように一体とされた第1、第2モジュールM1、M2と伝熱部材8とを、図2に示すようにケース9に収容する。この際、伝熱部材8の接続部82と、ケース9の取付部94との位置を合わせておく。また、各電極板4、5、6、7の外部接続部42、52、62、72がケース開口93から外部に突出するように収容する。そして、ケース9内に樹脂Rを充填し、外部接続部42、52、62、72や接続部82を除いて樹脂モールドする。これによりコンデンサ1の製造を完了する。   The first and second modules M1 and M2 thus integrated and the heat transfer member 8 are housed in a case 9 as shown in FIG. At this time, the position of the connection part 82 of the heat transfer member 8 and the position of the attachment part 94 of the case 9 are aligned. The external connection portions 42, 52, 62, 72 of the respective electrode plates 4, 5, 6, 7 are accommodated so as to protrude from the case opening 93 to the outside. Then, the case 9 is filled with the resin R, and resin molding is performed except for the external connection portions 42, 52, 62, 72 and the connection portion 82. Thus, the manufacture of the capacitor 1 is completed.

上記構成のコンデンサ1は、例えば図4に示すように、外部機器の筐体Cに取り付けて使用される。取り付けは、例えば伝熱部材8の接続部82とケース9の取付部94との取付孔82a、94aにボルトを挿入し、筐体Cにボルトを螺合することで行う。これにより、伝熱部材8の接続部82が筐体Cに直接当接し、各モジュールM1、M2からの熱が伝熱部材8を介して筐体Cに伝わる。外部機器の筐体Cは通常、熱容量が大きく、外部機器がインバータのように発熱するものであれば冷却されていることから、コンデンサ1を効率良く冷却することができる。特に、伝熱部材8が、第2電極板5の本体部51と第3電極板6の伸長部61cとの間に位置しているとともに、第1電極板4の垂直部41bと近接対向しているため、効率の良い冷却が可能となる。なお、第4電極板7については、伝熱部材8に直接面していないが、最もケース開口93側に位置しているため、筐体Cとの距離が近く、筐体Cからの冷却効果を得ることができる。   The capacitor 1 having the above-described configuration is used, for example, as shown in FIG. The attachment is performed, for example, by inserting bolts into attachment holes 82a, 94a between the connection portion 82 of the heat transfer member 8 and the attachment portion 94 of the case 9, and screwing the bolts to the housing C. As a result, the connection portion 82 of the heat transfer member 8 directly contacts the case C, and heat from each of the modules M1 and M2 is transmitted to the case C via the heat transfer member 8. Since the casing C of the external device usually has a large heat capacity and is cooled if the external device generates heat like an inverter, the capacitor 1 can be efficiently cooled. In particular, the heat transfer member 8 is located between the main body portion 51 of the second electrode plate 5 and the extending portion 61c of the third electrode plate 6, and is closely opposed to the vertical portion 41b of the first electrode plate 4. Therefore, efficient cooling is possible. Although the fourth electrode plate 7 does not directly face the heat transfer member 8, it is located closest to the case opening 93, so the distance from the case C is short, and the cooling effect from the case C is small. Can be obtained.

冷却効果を具体的に示すと、伝熱部材8を最もケース開口93側に配置するとともに、延設部83を設けないコンデンサ11(図6参照)の場合、電力投入時における発熱温度が最大で99.3℃であったが、本実施形態のコンデンサ1では最大で97.7℃と、さらに1.6℃下げることができた。なお、この下げ幅(差)については、コンデンサ1の周囲の温度と筐体Cの温度との差が大きい場合や、伝熱部材8の接続部82の数を増やすことによってより顕著なものとなる。   More specifically, in the case of the condenser 11 (see FIG. 6) in which the heat transfer member 8 is arranged closest to the case opening 93 and the extension portion 83 is not provided, the heat generation temperature when power is turned on is maximum. Although the temperature was 99.3 ° C., the capacitor 1 of the present embodiment could further reduce the temperature by a maximum of 97.7 ° C., or 1.6 ° C. It should be noted that this reduction width (difference) may be more remarkable when the difference between the temperature around the capacitor 1 and the temperature of the housing C is large, or by increasing the number of connection portions 82 of the heat transfer member 8. Become.

また、本発明のコンデンサ1は、第3電極板6と第4電極板7とが互いに重なり合っているため、低インダクタンス化にも寄与する。   Further, in the capacitor 1 of the present invention, since the third electrode plate 6 and the fourth electrode plate 7 overlap each other, it also contributes to lower inductance.

図5は、本発明のコンデンサの異なる実施形態を示す断面図である。図に示すように、伝熱部材8の本体部81を、第4電極板7の重ね合わせ部71bに沿わせても良い。この場合であっても、第1、第2、第4電極板4、5、7を効率良く冷却することができる。また、第3電極板6の伸長部61c、第4電極板7の重ね合わせ部71b、伝熱部材8の本体部81をケース9の底部91側や側壁部92側に配置しても良い。   FIG. 5 is a sectional view showing another embodiment of the capacitor of the present invention. As shown in the figure, the main body 81 of the heat transfer member 8 may be along the overlapping portion 71b of the fourth electrode plate 7. Even in this case, the first, second, and fourth electrode plates 4, 5, and 7 can be efficiently cooled. Further, the extending portion 61c of the third electrode plate 6, the overlapping portion 71b of the fourth electrode plate 7, and the main body 81 of the heat transfer member 8 may be arranged on the bottom 91 side or the side wall 92 side of the case 9.

以上に、この発明の実施形態について説明したが、この発明は上記実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、第1、第2コンデンサ素子2、3としてはフィルムコンデンサに限らず、セラミックコンデンサなど種々のコンデンサ素子を用いても良い。コンデンサ素子の形状についても、円柱状や角柱状など種々の形状を採用し得る。また、第1、第2コンデンサ素子2、3の軸方向が上下に向いていたが、横に向けても良い。   As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above embodiments, and can be variously modified and implemented within the scope of the present invention. For example, the first and second capacitor elements 2 and 3 are not limited to film capacitors, and various capacitor elements such as ceramic capacitors may be used. Regarding the shape of the capacitor element, various shapes such as a columnar shape and a prismatic shape can be adopted. Further, although the axial directions of the first and second capacitor elements 2 and 3 are vertically oriented, they may be horizontally oriented.

伝熱部材8の接続部82の数は適宜変更可能である。ただ、筐体Cとの当接面積が広いほど冷却効果が得られるため、数を増やすか、1つ当たりの面積を増やすことが好ましい。上記実施形態では、電極板4、5、6、7同士、電極板4、5、6、7と伝熱部材8との絶縁を、絶縁を確保可能な間隔を空けることで確保しているが、絶縁紙などの絶縁体を介在させても良い。   The number of the connection portions 82 of the heat transfer member 8 can be changed as appropriate. However, since the cooling effect can be obtained as the contact area with the casing C is larger, it is preferable to increase the number or the area per one. In the above embodiment, the insulation between the electrode plates 4, 5, 6, 7 and between the electrode plates 4, 5, 6, 7 and the heat transfer member 8 are ensured by providing an interval capable of ensuring the insulation. Alternatively, an insulator such as insulating paper may be interposed.

1 コンデンサ
2 第1コンデンサ素子
2a 一方の電極部
2b 他方の電極部
2c 平坦部
2d 曲面部
3 第2コンデンサ素子
3a 一方の電極部
3b 他方の電極部
3c 平坦部
3d 曲面部
4 第1電極板
41 本体部
41a 水平部
41b 垂直部
42 外部接続部
43 素子接続片
5 第2電極板
51 本体部
52 外部接続部
53 素子接続片
6 第3電極板
61 本体部
61a 水平部
61b 垂直部
61c 伸長部
62 外部接続部
63 素子接続片
7 第4電極板
71 本体部
71a 水平部
71b 重ね合わせ部
71c 段差
72 外部接続部
73 素子接続片
8 伝熱部材
81 本体部
82 接続部
82a 取付孔
83 延設部
83a 切欠き
9 ケース
91 底部
92 側壁部
93 開口
94 取付部
94a 取付孔
R 樹脂
M1 第1モジュール
M2 第2モジュール
C 外部機器の筐体
DESCRIPTION OF SYMBOLS 1 Capacitor 2 1st capacitor element 2a One electrode part 2b The other electrode part 2c Flat part 2d Curved surface part 3 Second capacitor element 3a One electrode part 3b The other electrode part 3c Flat part 3d Curved surface part 4 1st electrode plate 41 Main part 41a Horizontal part 41b Vertical part 42 External connection part 43 Element connection piece 5 Second electrode plate 51 Main part 52 External connection part 53 Element connection piece 6 Third electrode plate 61 Main part 61a Horizontal part 61b Vertical part 61c Extension part 62 External connection part 63 Element connection piece 7 Fourth electrode plate 71 Main part 71a Horizontal part 71b Overlapping part 71c Step 72 External connection part 73 Element connection piece 8 Heat transfer member 81 Main part 82 Connection part 82a Mounting hole 83 Extension part 83a Notch 9 Case 91 Bottom part 92 Side wall part 93 Opening 94 Mounting part 94a Mounting hole R Resin M1 First module M2 Second module C External device housing

Claims (3)

第1コンデンサ素子と、第1コンデンサ素子の一方の電極部に接続された第1電極板と、第1コンデンサ素子の他方の電極部に接続された第2電極板とからなる第1モジュールと、
第2コンデンサ素子と、第2コンデンサ素子の一方の電極部に接続された第3電極板と、第2コンデンサ素子の他方の電極部に接続された第4電極板とからなる第2モジュールと、
伝熱部材とを備え、
第3電極板が、第1モジュールに沿う伸長部を有し、
第4電極板が、第1モジュールの反対側で第3電極板の伸長部に重なる重ね合わせ部を有し、
伝熱部材が、第3電極板の伸長部及び/又は第4電極板の重ね合わせ部に沿う本体部と、第1電極板に沿う延設部とを有している、
コンデンサ。
A first module including a first capacitor element, a first electrode plate connected to one electrode of the first capacitor element, and a second electrode plate connected to the other electrode of the first capacitor element;
A second module including a second capacitor element, a third electrode plate connected to one electrode of the second capacitor element, and a fourth electrode plate connected to the other electrode of the second capacitor element;
And a heat transfer member,
A third electrode plate having an extension along the first module;
A fourth electrode plate having an overlapping portion overlapping the extension of the third electrode plate on the opposite side of the first module;
The heat transfer member has a main body along the extending portion of the third electrode plate and / or the overlapping portion of the fourth electrode plate, and an extending portion along the first electrode plate.
Capacitors.
伝熱部材の本体部が、第1モジュールと第3電極板の伸長部との間に位置している、
請求項1記載のコンデンサ。
A main body of the heat transfer member is located between the first module and the extension of the third electrode plate;
The capacitor according to claim 1.
伝熱部材の本体部が、第2電極板と第3電極板の伸長部との間に位置している、
請求項2記載のコンデンサ。
The main body of the heat transfer member is located between the second electrode plate and the extension of the third electrode plate.
The capacitor according to claim 2.
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Publication number Priority date Publication date Assignee Title
JP7508382B2 (en) 2021-02-03 2024-07-01 株式会社指月電機製作所 Capacitor

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JP2007273774A (en) * 2006-03-31 2007-10-18 Fuji Electric Systems Co Ltd Capacitor cooling structure and power converter
JP2008061282A (en) * 2006-08-29 2008-03-13 Hitachi Ltd Power conversion device
KR20110101417A (en) * 2010-03-08 2011-09-16 주식회사 뉴인텍 Capacitor module
WO2015182081A1 (en) * 2014-05-28 2015-12-03 パナソニックIpマネジメント株式会社 Film capacitor

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2007273774A (en) * 2006-03-31 2007-10-18 Fuji Electric Systems Co Ltd Capacitor cooling structure and power converter
JP2008061282A (en) * 2006-08-29 2008-03-13 Hitachi Ltd Power conversion device
KR20110101417A (en) * 2010-03-08 2011-09-16 주식회사 뉴인텍 Capacitor module
WO2015182081A1 (en) * 2014-05-28 2015-12-03 パナソニックIpマネジメント株式会社 Film capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7508382B2 (en) 2021-02-03 2024-07-01 株式会社指月電機製作所 Capacitor

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