JP2019198938A - 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 - Google Patents

研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 Download PDF

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Publication number
JP2019198938A
JP2019198938A JP2018096000A JP2018096000A JP2019198938A JP 2019198938 A JP2019198938 A JP 2019198938A JP 2018096000 A JP2018096000 A JP 2018096000A JP 2018096000 A JP2018096000 A JP 2018096000A JP 2019198938 A JP2019198938 A JP 2019198938A
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JP
Japan
Prior art keywords
polishing
head
polishing head
strain sensor
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018096000A
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English (en)
Japanese (ja)
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JP2019198938A5 (https=
Inventor
正雄 梅本
Masao Umemoto
正雄 梅本
隆一 小菅
Ryuichi Kosuge
隆一 小菅
修一 鎌田
Shuichi Kamata
修一 鎌田
健人 吉田
Taketo Yoshida
健人 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2018096000A priority Critical patent/JP2019198938A/ja
Priority to US16/408,960 priority patent/US20190351526A1/en
Priority to TW108116736A priority patent/TW202003157A/zh
Priority to KR1020190056958A priority patent/KR20190132245A/ko
Priority to CN201910404342.2A priority patent/CN110497307A/zh
Publication of JP2019198938A publication Critical patent/JP2019198938A/ja
Publication of JP2019198938A5 publication Critical patent/JP2019198938A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/22—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in capacitance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2018096000A 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置 Pending JP2019198938A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018096000A JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置
US16/408,960 US20190351526A1 (en) 2018-05-18 2019-05-10 Method of detecting a polishing surface of a polishing pad using a polishing head, and polishing apparatus
TW108116736A TW202003157A (zh) 2018-05-18 2019-05-15 使用研磨頭檢測研磨墊的研磨面的方法，以及研磨裝置
KR1020190056958A KR20190132245A (ko) 2018-05-18 2019-05-15 연마 헤드를 이용하여 연마 패드의 연마면을 검출하는 방법, 및 연마 장치
CN201910404342.2A CN110497307A (zh) 2018-05-18 2019-05-15 使用研磨头对研磨垫的研磨面进行检测的方法以及研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018096000A JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置

Publications (2)

Publication Number Publication Date
JP2019198938A true JP2019198938A (ja) 2019-11-21
JP2019198938A5 JP2019198938A5 (https=) 2021-02-18

Family

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Family Applications (1)

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JP2018096000A Pending JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置

Country Status (5)

Country Link
US (1) US20190351526A1 (https=)
JP (1) JP2019198938A (https=)
KR (1) KR20190132245A (https=)
CN (1) CN110497307A (https=)
TW (1) TW202003157A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022108789A (ja) * 2021-01-14 2022-07-27 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法

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CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
BR112021019766A2 (pt) 2019-04-03 2021-12-07 Saint Gobain Abrasifs Sa Artigo abrasivo, sistema abrasivo e método para uso e formação dos mesmos
CN111085931A (zh) * 2019-12-31 2020-05-01 浙江芯晖装备技术有限公司 一种抛光头驱动装置及抛光设备
EP3919192B1 (en) * 2020-06-04 2023-11-29 Sugino Machine Limited Cleaning apparatus
KR102762332B1 (ko) * 2020-09-02 2025-02-03 에스케이하이닉스 주식회사 기판의 평탄화 장치 및 방법
CN113458972A (zh) * 2021-07-28 2021-10-01 北京烁科精微电子装备有限公司 一种抛光垫修整装置及抛光设备
CN114633206A (zh) * 2022-04-25 2022-06-17 北京烁科精微电子装备有限公司 一种修整装置及晶圆抛光系统
CN114918832B (zh) * 2022-05-20 2023-07-28 湖州师范学院 一种高精密的砂轮修整设备
US20240066658A1 (en) * 2022-08-31 2024-02-29 Ebara Corporation Polishing head system and polishing method
CN117718876B (zh) 2024-02-07 2024-06-18 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备
WO2026043500A1 (en) * 2024-08-23 2026-02-26 Applied Materials, Inc. Wafer simulation plate

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JP2013111701A (ja) * 2011-11-29 2013-06-10 Hitachi Koki Co Ltd 携帯用切断機
JP2014117784A (ja) * 2012-12-18 2014-06-30 Hitachi Ltd バニシング装置及びそれを用いたバニシング方法

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JP2006128582A (ja) * 2004-11-01 2006-05-18 Ebara Corp 研磨装置
JP2013111701A (ja) * 2011-11-29 2013-06-10 Hitachi Koki Co Ltd 携帯用切断機
JP2014117784A (ja) * 2012-12-18 2014-06-30 Hitachi Ltd バニシング装置及びそれを用いたバニシング方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022108789A (ja) * 2021-01-14 2022-07-27 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
US12083646B2 (en) 2021-01-14 2024-09-10 Ebara Corporation Polishing apparatus, polishing method and method for outputting visualization information of film thickness distribution on substrate
JP7709281B2 (ja) 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
KR102931407B1 (ko) * 2021-01-14 2026-02-26 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 연마 방법 및 기판의 막 두께 분포의 가시화 정보를 출력하는 방법

Also Published As

Publication number Publication date
KR20190132245A (ko) 2019-11-27
CN110497307A (zh) 2019-11-26
US20190351526A1 (en) 2019-11-21
TW202003157A (zh) 2020-01-16

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