JP2019189922A - Adjustment method of film deposition apparatus, film deposition method, film deposition apparatus, manufacturing system, manufacturing system of organic el panel, and manufacturing method of organic el panel - Google Patents

Abstract

To shorten a time required for alignment of a substrate and a mask.SOLUTION: A deflection shape of a substrate 5 supported by receiving nails 26a, 26b is measured by using a distance sensor 55 of a measurement device 200. A mutual relative position in a Z-direction between the receiving nails 26a, 26b is adjusted so that a deviation dx of the center Gc of the substrate 5 to the center Mc of a mask 6 becomes small, corresponding to the measured deflection shape of the substrate 5, by spacers 41a, 41b arranged between the receiving nails 26a, 26b and holding part bases 25a, 25b.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a method for adjusting a film forming apparatus for forming a film on a substrate using a mask, a film forming method, a film forming apparatus, a manufacturing system, an organic EL panel manufacturing system, and an organic EL panel manufacturing method.

  In the manufacture of electronic devices such as organic EL elements, a substrate such as a glass substrate is placed on a mask having an opening corresponding to the pattern of the film to be formed on the deposition surface of the substrate, and film formation is performed. Yes.

  In order to form a film at a predetermined position on the substrate, relative alignment, that is, alignment between the substrate and the mask is performed. In Patent Document 1, the position of the alignment mark on the substrate and the alignment mark on the mask is measured using an imaging device, and then the substrate and the mask are relatively aligned with the substrate and the mask separated from each other. , Placing a substrate on a mask is described. If the amount of deviation between the alignment mark of the substrate and the alignment mark of the mask is within a predetermined range with the substrate placed on the mask, the alignment is completed.

JP 2012-92394 A

  However, when the substrate is placed on the mask, if the amount of deviation between the alignment mark on the substrate and the alignment mark on the mask is not within a predetermined range, relative alignment between the substrate and the mask is performed again. There is a need. When such alignment operation is performed many times, the time required for alignment is increased, and there is a problem that productivity of a film-formed product is lowered.

  Therefore, an object of the present invention is to shorten the time required for alignment.

  The present invention relates to a method for adjusting a film forming apparatus for placing a substrate, the ends of which are supported by a plurality of first members, on a mask and forming a film on the substrate, which is supported by the plurality of first members. A first measuring step for measuring the bent shape of the substrate, and an adjusting step for adjusting relative positions of the plurality of first members in the vertical direction according to the measured bent shape of the substrate. Features.

  According to the present invention, when the substrate is placed on the mask, the displacement of the substrate with respect to the mask is reduced, and the time required for alignment between the substrate and the mask can be shortened.

It is explanatory drawing which shows schematic structure of the film-forming apparatus which concerns on 1st Embodiment. It is a perspective view of an alignment apparatus. It is a perspective view of a rotation translation mechanism. It is a perspective view of a board | substrate holding part. (A) And (b) is a schematic diagram of a board | substrate holding | maintenance part. (A) is the figure which looked at the board | substrate currently hold | maintained at the board | substrate holding part, (b) is the figure which looked at the mask from the top, (c) is the image figure of the visual field of a fine camera. It is a flowchart which shows the alignment sequence of 1st Embodiment. (A)-(d) is explanatory drawing of the alignment operation | movement of 1st Embodiment. (A) And (b) is explanatory drawing of alignment operation of a reference example. (A) And (b) is explanatory drawing of the measuring device of 1st Embodiment. It is a flowchart of the adjustment method of the film-forming apparatus which concerns on 1st Embodiment. (A) is a graph which shows an example of the result of having measured the bending shape of a board | substrate. (B) is explanatory drawing which shows the measured bending shape and reference | standard shape of the board | substrate in the cross section which follows the XIIB-XIIB line | wire shown to (a). It is a schematic diagram of a substrate holding part and a mask holding part. (A) is a general view of an organic EL panel, and (b) is a partial cross-sectional schematic view of the organic EL panel taken along line XIIIB-XIIIB in (a). It is explanatory drawing of the manufacturing system which manufactures an organic electroluminescent panel. It is a schematic diagram of the substrate holding part of the film-forming apparatus which concerns on 2nd Embodiment.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is an explanatory diagram showing a schematic configuration of a film forming apparatus 100 according to the first embodiment. The film forming apparatus 100 is an apparatus for forming a film on the surface (deposition surface) of the substrate 5. In this embodiment, a thin film having a desired pattern is formed on the surface of the substrate 5 by vacuum deposition. The substrate 5 is, for example, a parallel flat glass substrate. As an evaporation material, any material such as an organic material and an inorganic material (metal, metal oxide, etc.) can be selected. The film forming apparatus 100 can be applied to a manufacturing system for manufacturing an electronic device such as a display device (flat panel display or the like) and a thin film solar cell, for example. In particular, a glass substrate is used as the substrate 5 and the substrate 5 is enlarged. The present invention is preferably applied to a manufacturing system for manufacturing an organic EL panel.

  The film forming apparatus 100 includes a film forming chamber 4 having a film forming space 2 for forming a film forming material on the substrate 5, a gate valve 15 for loading / unloading the substrate 5 into / from the film forming chamber 4, and a substrate. 5 and an alignment apparatus 1 that holds the mask 6 and performs relative alignment. In the film forming space 2 of the film forming chamber 4, a mechanism for installing a film forming source (deposition source) 7 containing a film forming material is provided. Although FIG. 1 shows a vapor deposition apparatus, the alignment apparatus can also be applied to a film deposition apparatus that uses a film deposition method other than the vapor deposition method, such as a sputtering method or a CVD method. In FIG. 1, the vertical direction is indicated by the Z-axis direction (Z direction), and the horizontal direction orthogonal to the vertical direction is indicated by the X-axis direction (X direction) and the Y-axis direction (Y direction). A vacuum pump (not shown) is connected to the film forming chamber 4 so that the inside of the film forming chamber 4 can be depressurized to a desired pressure at which a film can be formed.

  The alignment apparatus 1 includes a positioning mechanism 90 having a driving unit mounted on the top plate 3 of the film forming chamber 4, a substrate holding unit 8 that is a holding unit that holds the substrate 5, and a mask holding unit that holds the mask 6. 9.

  The positioning mechanism 90 includes a rotary translation mechanism 11 and a Z lifting / lowering mechanism 80 that is a first drive unit, and is provided outside the film forming chamber 4. By disposing the positioning mechanism 90 including many movable parts outside the film formation space 2, dust generation in the film formation space 2 can be suppressed.

  When the substrate 5 and the mask 6 are aligned as will be described later, the rotary translation mechanism 11 rotates the substrate holding portion 8, that is, the substrate 5 in the XY directions and the rotation directions around the Z axis with respect to the top plate 3. The substrate holding part 8 is moved in the θz direction. The Z raising / lowering mechanism 80 moves the substrate holding unit 8 or the mask holding unit 9, in this embodiment, the substrate holding unit 8 in the Z direction so that the substrate 5 and the mask 6 are brought close to or away from each other.

  The Z lifting mechanism 80 has a Z lifting slider 10. Substrate holding shafts 12 a and 12 b are fixed to the Z lift slider 10. The substrate holding shafts 12 a and 12 b are provided over the outside and inside of the film forming chamber 4 through the through holes 16 provided in the top plate 3 of the film forming chamber 4. And in the film-forming space 2, the substrate holding part 8 is provided under the substrate holding shafts 12a and 12b, and the substrate 5 as the film-forming object can be held.

  The through hole 16 is designed to be sufficiently larger than the outer diameter of the substrate holding shafts 12a and 12b so that the substrate holding shafts 12a and 12b and the top plate 3 do not interfere with each other. In addition, portions of the substrate holding shafts 12 a and 12 b outside the film forming chamber 4 are covered with a bellows 40 fixed to the Z elevating slider 10 and the top plate 3. That is, the substrate holding shafts 12a and 12b are covered with the bellows 40 at the outer part of the film forming chamber 4, so that the entire substrate holding shafts 12a and 12b are in the same state as the film forming space 2 (for example, in a vacuum state). Can be kept in.

  A bellows 40 having flexibility in the Z direction and the XY direction may be used. The resistance force generated when the bellows 40 is displaced by the operation of the alignment apparatus 1 can be sufficiently reduced, and the load at the time of position adjustment can be reduced. The mask holding unit 9 is installed on the surface of the top plate 3 on the film formation space side inside the film formation chamber 4 and can hold the mask 6. A mask 6 widely used in the manufacture of an organic EL panel has a mask foil 6a having an opening corresponding to a film formation pattern and a highly rigid mask frame 6b, and is fixed in a state of being stretched on a mask holding portion 9. Is done. For this reason, the mask holding | maintenance part 9 can be hold | maintained in the state which reduced the bending of the mask 6. FIG.

  A series of operations of the positioning mechanism 90, the substrate holding unit 8, and the film forming source 7 are controlled by a control device 50 that is an example of a processing unit. The control device 50 can be configured by a computer having a processor, a memory, a storage, an I / O, and the like, for example. In this case, the function of the control device 50 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Or you may comprise a part or all of the function of the control apparatus 50 with circuits, such as ASIC and FPGA. In addition, the control apparatus 50 may be provided for every film-forming apparatus, and one control apparatus 50 may control a several film-forming apparatus.

  Next, the positioning mechanism 90 of the alignment apparatus 1 will be described in detail with reference to FIG. FIG. 2 is a perspective view showing the alignment apparatus 1. The Z elevating mechanism 80 includes the Z elevating slider 10, the Z elevating base 13, the plurality of Z guides 18, the motor 19, the ball screw 20, and the like.

  The Z guide 18 is supported on the side surface of the Z lifting base 13 so as to be slidable in the Z direction with respect to the Z lifting base 13, and is fixed to the Z lifting slider 10. A ball screw 20 for transmitting a driving force is disposed at the center of the Z lift slider 10, and the power transmitted from the motor 19 fixed to the Z lift base 13 is transmitted to the Z lift slider 10 via the ball screw 20. Reportedly.

  The motor 19 has a built-in rotary encoder (not shown), and can indirectly measure the position of the Z lift slider 10 in the Z direction based on the number of rotations of the encoder. The driving of the motor 19 is controlled by the control device 50 of FIG. 1, so that the Z elevating slider 10, that is, the substrate holding portion 8 can be accurately positioned in the Z direction. In addition, although the case where the motor 19 is a rotary motor was demonstrated, a linear motor may be sufficient. In this case, a linear encoder may be arranged instead of the rotary encoder, and the ball screw 20 can be omitted.

  FIG. 3 is a perspective view showing the rotary translation mechanism 11. In the alignment apparatus 1 shown in FIGS. 1 and 2, the Z lifting slider 10 and the Z lifting base 13 are disposed on the rotary translation mechanism 11. The entire Z elevating base 13 and the Z elevating slider 10 can be driven in the XYθz direction by the rotary translation mechanism 11.

  As illustrated in FIG. 3, the rotary translation mechanism 11 includes a plurality of drive units 21 a to 21 d. In the configuration of FIG. 3, the drive units 21 a to 21 d are respectively disposed at the four corners of the base, and are disposed in a direction in which the drive units disposed at adjacent corners are rotated 90 degrees around the Z axis.

  Each of the drive units 21a to 21d includes a motor 41 that generates a driving force. Further, the first guide 22 that slides in the first direction by transmitting the force of the motor 41 via the ball screw 42, and the second that slides in the second direction orthogonal to the first direction in the XY plane. The guide 23 is provided. Furthermore, a rotary bearing 24 that can rotate around the Z-axis is provided. For example, the drive unit 21c has a first guide 22 that slides in the X direction, a second guide 23 that slides in the Y direction orthogonal to the X direction, and a rotary bearing 24. Is transmitted to the first guide 22 via the ball screw 42.

  The motor 41 incorporates a rotary encoder (not shown) and can measure the displacement amount of the first guide 22. In each of the drive units 21a to 21d, the drive of the motor 41 is controlled by the control device 50 of FIG. 1 so that the position of the Z lifting base 13, that is, the substrate holder 8, in the XYθz direction can be precisely controlled. It has become.

  For example, when the Z elevating base 13 is moved in the X direction, a force for sliding in the X direction in each of the drive unit 21b and the drive unit 21c is generated by the motor 41, and the force is transmitted to the Z elevating base 13. Further, when moving in the Y direction, it is preferable to generate a force for sliding in the Y direction in each of the drive unit 21 a and the drive unit 21 d by the motor 41 and transmit the force to the Z lift base 13.

  When the Z lifting base 13 is rotated in the θz direction around the Z axis, the force required to rotate θz around the Z axis is generated using the drive unit 21c and the drive unit 21b arranged diagonally. The force may be transmitted to the Z lift base 13. Alternatively, the driving unit 21a and the driving unit 21d may be used to transmit a force necessary for rotation to the Z lift base 13.

  Next, the structure of the board | substrate holding | maintenance part 8 is demonstrated using FIG. FIG. 4 is a perspective view showing the entire substrate holding portion 8 in a state where the substrate 5 is held. The substrate 5 is formed in a rectangular shape. The substrate holding portion 8 holds the end portions on the two sides (here, long sides) facing each other in the substrate 5. In the present embodiment, the substrate holding unit 8 holds the substrate 5 with the deposition surface facing down, that is, the deposition surface of the substrate 5 faces the mask 6.

  As shown in FIG. 4, the substrate holding portion 8 includes a plurality of receiving claws 26 a and a plurality of receiving claws 26 b that are a plurality of first members that support the end portions of the substrate 5. The plurality of receiving claws 26 a are arranged along the end of one of the two long sides of the substrate 5, and the plurality of receiving claws 26 b are the other long side of the two long sides of the substrate 5. It is arranged along the side edge. Furthermore, the board | substrate holding | maintenance part 8 is arrange | positioned facing the some receiving claw 26a, and has the some clamp 27a driven to a Z direction via the drive shaft 34a. The substrate holding portion 8 has a plurality of clamps 27b that are arranged to face the plurality of receiving claws 26b and are driven in the Z direction via the drive shaft 34b. In a state where the plurality of clamps 27a and 27b are brought close to the plurality of receiving claws 26a and 26b and the end portion of the substrate 5 is sandwiched and sandwiched to fix the substrate 5 and reduce the bending of the substrate 5. Can be held. Although the end on the short side instead of the end on the long side of the substrate 5 may be held, it is preferable to hold the end on the long side because the amount of bending of the substrate 5 is small.

  Further, the substrate holding portion 8 includes a holding portion base 25a that is a second member that supports the plurality of receiving claws 26a and is fixed to the lower portion of the substrate holding shaft 12a. The substrate holding unit 8 includes a holding unit base 25b that is a second member that supports the plurality of receiving claws 26b and is fixed to the lower portion of the substrate holding shaft 12b. The holding part bases 25a and 25b are moved and positioned by the substrate holding shafts 12a and 12b, respectively. The holding bases 25 a and 25 b are plate-like members having a length equivalent to the end portion on the long side of the substrate 5.

  The mask frame 6b is provided with a plurality of grooves for avoiding interference with the receiving claws 26a and 26b when the substrate 5 is placed on the mask 6. If the clearance between the groove and the receiving claws 26a and 26b is set to about several millimeters, even if the receiving claws 26a and 26b are further lowered after the substrate 5 is placed on the mask 6, the mask frame 6b and the receiving claws 26a. , 26b can be prevented from colliding with each other.

  The substrate holding shafts 12a and 12b for moving the holding unit bases 25a and 25b may be configured to move together, or may be divided into the substrate holding shaft 12a and the substrate holding shaft 12b separately. You may comprise so that it may move.

  In the present embodiment, a plurality of clamps 27a are included in the clamp unit 28a, and a plurality of clamps 27b are included in the clamp unit 28b. And the case where it drives with a drive mechanism for every clamp unit 28a, 28b is demonstrated using FIG. 4, FIG. 5 (a) and FIG.5 (b). 5A is a schematic diagram of the substrate holding portion 8 in a state where the substrate 5 is unclamped, and FIG. 5B is a schematic diagram of the substrate holding portion 8 in a state where the substrate 5 is clamped. is there. Hereinafter, the clamp unit 28a will be described. Since the clamp unit 28b has the same configuration as the clamp unit 28a, the description thereof will be omitted.

  The plurality of clamps 27a of the clamp unit 28a are fixed to the clamp slider 32a. The clamp slider 32a is guided in the Z direction by a linear bush 39a disposed between the holding portion base 25a of the substrate holding portion 8 and the holding portion upper plate 35a. The clamp slider 32 a is fixed to the Z lift slider 10 via a drive shaft 34 a that penetrates the top plate 3. The clamp slider 32a can be driven in the Z direction by a force generated from the electric cylinder 36a via the drive shaft 34a.

  When the clamp 27a descends from the position shown in FIG. 5A and reaches the position shown in FIG. 5B, the clamp 27a contacts the surface of the substrate 5 placed on the receiving claw 26a. Thereby, the board | substrate 5 will be in the state fixed between the clamping surface of the receiving nail | claw 26a, and the clamping surface of the clamp 27a. A spring 29a that generates a holding force (load) is disposed on the upper side of the clamp 27a in order to hold the substrate 5 by applying a constant load by the clamp 27a. A rod 31a exists between the clamp 27a and the spring 29a, and the clamp 27a is guided in the Z direction. The total length of the spring 29a can be adjusted by changing the gap L with the load adjusting screw 30a. Therefore, the pushing force generated in the clamp 27a via the rod 31a can be freely adjusted by the pushing amount of the spring 29a. If the pushing force is about several N to several tens of N, the substrate 5 can be pressed with a load larger than its own weight, and the substrate 5 can be prevented from shifting during alignment.

  According to the above configuration, the substrate 5 can be moved in the XYθz direction and the Z direction by the alignment apparatus 1 while being held with a constant load. The plurality of clamps 27a may be driven up and down by individually provided drive mechanisms, and the plurality of clamps 27b may also be driven up and down by individually provided drive mechanisms. Good.

  A spacer 41a described later is provided between the holding portion base 25a and the receiving claw 26a, and a spacer 41b described later is provided between the holding portion base 25b and the receiving claw 26b.

  Next, an image pickup apparatus for simultaneously measuring the position of the substrate 5 and the mask 6, that is, the position of each alignment mark will be described. In FIG. 1, on the outer surface of the top plate 3, a plurality of (books) which are position acquisition means for acquiring the positions of the alignment marks (mask marks) on the mask 6 and the alignment marks (substrate marks) on the substrate 5 are shown. In the embodiment, four) imaging devices 14 are arranged.

  The top plate 3 is provided with a through hole and a window glass 17 on the camera optical axis so that the position of the alignment mark arranged inside the film forming chamber 4 can be measured by the imaging device 14. Further, illumination (not shown) is provided inside or in the vicinity of the imaging device 14, and light is irradiated near the alignment marks on the substrate 5 and the mask 6, thereby enabling accurate mark image measurement.

  A method for measuring the positions of the substrate mark 37 and the mask mark 38 using the imaging device 14 will be described with reference to FIGS. FIG. 6A is a top view of the substrate 5 held by the substrate holding unit 8. On the substrate 5, substrate marks 37 that can be measured by the imaging device 14 of FIG. 1 are formed at the four corners of the substrate 5. The four substrate marks 37 are simultaneously imaged by the four imaging devices 14, and the control device 50 in FIG. 1 obtains four points, which are the center positions of the substrate marks, from the captured image, and translates the substrate 5 from the positional relationship of the four points. Calculate the amount and amount of rotation. Thereby, the control apparatus 50 can acquire the position information of the substrate 5.

  FIG. 6B is a view of the mask 6 as viewed from above. Mask marks 38 that can be measured by the imaging device are formed at the four corners of the mask foil 6a. Four mask marks 38 are simultaneously imaged by the four imaging devices 14, and the control device 50 in FIG. 1 obtains four points that are the center positions of the mask marks from the captured image, and translates the mask 6 from the positional relationship of the four points. The amount, rotation amount, etc. are calculated. Thereby, the control apparatus 50 can acquire the positional information on the mask 6.

  Actually, since the substrate 5 and the mask 6 overlap each other in the Z direction, the substrate mark 37 and the mask mark 38 are simultaneously imaged by the imaging device 14. FIG. 6C is an image diagram of the visual field 43 when one set of mask mark 38 and substrate mark 37 is imaged by one imaging device 14. Since the substrate mark 37 and the mask mark 38 can be simultaneously imaged in the field of view 43 of the imaging device 14, the relative positions of the mark centers can be measured. Note that an image processing device different from the control device 50 may be prepared, and the image processing device may perform image processing to measure the position of the mark. The shape of the mask mark 38 and the substrate mark 37 may be any shape as long as the center position can be easily calculated, but is preferably different from each other so that they can be distinguished from each other.

  When high-precision alignment is required, a high-magnification CCD camera (fine camera) having a high resolution on the order of several μm is used as the imaging device 14. Since the field of view of the fine camera is as narrow as several millimeters, the substrate mark 37 will be out of the field of view if the displacement of the state in which the substrate 5 is placed on the claw is large.

  Therefore, it is preferable to provide a low magnification CCD camera (rough camera) having a wide field of view in addition to the fine camera. After performing rough alignment using a rough camera so that the mask mark 38 and the substrate mark 37 are simultaneously within the field of view of the fine camera, position measurement can be performed with high accuracy using the fine camera.

  The control device 50 can obtain the relative position information of the mask 6 and the substrate 5 from the position information of the mask 6 and the position information of the substrate 5 acquired by the imaging device 14. The control device 50 controls the drive amounts of the elevating slider 10, the rotary translation mechanism 11, and the substrate holding unit 8 using the relative position information. By using a fine camera as the imaging device 14, the relative position of the mask 6 and the substrate 5 can be adjusted with an accuracy of several μm.

  After the alignment between the mask 6 and the substrate 5 is completed, the vapor of the film forming material is released from the film forming source 7 disposed in the film forming space 2 to form a film on the surface of the substrate 5 through the mask 6. Start the membrane process.

  Next, an alignment method using the alignment apparatus 1 performed before the film formation step in the film formation method will be described with reference to FIGS. Each step of the alignment method described below is performed by the control device 50. FIG. 7 is a flowchart showing an alignment sequence when a fine camera and a rough camera are installed as the imaging device 14. FIG. 8A to FIG. 8D are schematic views of the substrate holding unit 8 for explaining the alignment operation. First, the control device 50 operates a robot (not shown) to carry the substrate 5 into the film forming chamber 4 through the gate valve 15 of FIG. 1 and place it on the receiving claws 26a and 26b (S101). .

  When the substrate 5 is placed on the receiving claws 26a and 26b, the control device 50 operates the electric cylinders 36a and 36b in FIG. Forces generated from the electric cylinders 36a and 36b are transmitted to the clamp sliders 32a and 32b via the drive shafts 34a and 34b shown in FIG. 8A, and the clamp sliders 32a and 32b are driven in the Z direction. Then, the clamps 27a and 27b attached to the clamp sliders 32a and 32b are lowered to contact the substrate 5, and the substrate 5 is clamped by the receiving claws 26a and 26b (S102).

  When the substrate 5 is large, the substrate 5 is bent in the direction of gravity by its own weight even when the end portion is clamped. The control device 50 drives and controls the positioning mechanism 90 in FIG. 1, and as shown in FIG. 8A, a sufficient first height (rough alignment height) greater than the amount of bending of the substrate 5 with respect to the mask 6. (S103). As a result, the mask 6 and the substrate 5 are prevented from coming into contact with each other and rubbed against each other, and when the film pattern is already formed on the surface of the substrate 5, the film pattern is prevented from being damaged.

  Subsequently, the control device 50 simultaneously captures the substrate mark 37 of the substrate 5 and the mask mark 38 of the mask 6 with a rough camera, and acquires relative position information of the substrate 5 and the mask 6 (S104). Specifically, the relative position information is the distance between the center positions of the substrate mark 37 and the mask mark 38 and the direction of displacement.

  The control device 50 drives and controls the positioning mechanism 90 based on the relative position information between the substrate 5 and the mask 6 to adjust (align) the relative position between the substrate 5 and the mask 6. As described above, the control device 50 drives and controls the positioning mechanism 90 of the alignment device 1 based on the relative position information, and moves the substrate 5 in the XYθz direction to adjust the relative position between the substrate 5 and the mask 6 (S105). ). Steps S104 to S105 are referred to as rough alignment for fine alignment based on relative position information obtained using a fine camera, which is performed later.

  After rough alignment, the control device 50 drives and controls the positioning mechanism 90, and as shown in FIG. 8B, the focus of the fine camera is adjusted to the second height (fine alignment height) that matches the substrate mark 37. Until it becomes, the substrate 5 is brought close to the mask 6 (S106). At that time, the substrate 5 may come into contact with the mask 6 as shown in FIG.

  By performing rough alignment in advance in steps S104 to S105, a captured image can be acquired from the fine camera in which the substrate mark 37 and the mask mark 38 are within the same field of view by the fine camera. The control device 50 obtains the center positions of the substrate mark 37 and the mask mark 38 from the acquired captured image from the fine camera, and acquires the relative position information of the substrate 5 and the mask 6 with an accuracy of several μm (S107). .

  The control device 50 compares the distance between the center positions of the substrate mark 37 and the mask mark 38, that is, the shift amount of the relative position, included in the acquired relative position information, with a preset threshold value (S108). The threshold value is set on the order of several μm, which can achieve the required alignment accuracy between the substrate 5 and the mask 6. When the amount of relative position deviation exceeds the threshold (S108: NO), the controller 50 raises the rough alignment height, which is the first height at which the substrate 5 does not contact the mask 6 (S109).

  The control device 50 adjusts the relative position between the substrate 5 and the mask 6 (fine alignment) based on the relative position information between the substrate 5 and the mask 6 (S110). In step S110, the positioning mechanism of the alignment apparatus 1 is driven based on the relative position information, and the relative position between the substrate 5 and the mask 6 is adjusted by moving the substrate 5 in the XYθz direction. After step S110, steps S106 to S108 are performed again.

  When the deviation amount of the relative position between the substrate 5 and the mask 6 becomes equal to or smaller than the threshold value in step S108 (S108: YES), the control device 50 brings the substrate 5 close to the mask 6 and as shown in FIG. The substrate 5 is placed on the mask 6 (S111).

  Next, the controller 50 unclamps the substrate 5 by raising the clamps 27a and 27b (S112). Then, the holding bases 25a and 25b are lowered to a position where the entire receiving claws 26a and 26b are lower than the upper surface of the mask frame 6b, and the state shown in FIG.

  When the substrate 5 is unclamped, the control device 50 captures the substrate mark 37 and the mask mark 38 with a fine camera, and acquires relative position information between the substrate 5 and the mask 6 (S113). The method for acquiring the relative position information is the same as that in step S107.

  The control device 50 compares the shift amount of the relative position between the substrate 5 and the mask 6 included in the acquired relative position information with a threshold value (S114). The threshold value may be the same value as the threshold value used in step S108. The control device 50 completes the alignment sequence when the displacement amount of the relative position is equal to or less than the threshold value (S114: YES). When the amount of relative position deviation exceeds the threshold (S114: NO), the control device 50 restarts the alignment sequence. Specifically, the receiving claws 26a and 26b are raised to the height of the mask frame 6b, and the clamps 27a and 27b are lowered to clamp the substrate 5 (S115). Then, the process returns to step S109, and the alignment between the substrate 5 and the mask 6 is performed again.

  By the way, when the substrate 5 is placed on the mask 6 and the substrate 5 is laterally displaced in the XY direction with respect to the mask 6, it is determined in step S114 that the displacement amount of the relative position exceeds the threshold, and step S109. It is necessary to return to and restart the alignment sequence. In this way, if the alignment sequence is performed again, it takes time, and the productivity of the film-formed product is reduced. Therefore, it is preferable to minimize the lateral displacement of the substrate 5 when the substrate 5 is mounted on the mask 6.

  Hereinafter, the cause of the lateral displacement of the substrate 5 will be described. FIGS. 9A and 9B are explanatory diagrams of the alignment operation of the reference example. 9A and 9B illustrate a state in which spacers 41a and 41b, which will be described later, are not disposed between the receiving claws 26a and 26b and the holding portion bases 25a and 25b. FIG. 9A and FIG. 9B schematically illustrate the relationship between the substrate deflection and the substrate displacement that occur during the alignment operation.

  The larger the substrate 5 is, the wider the interval in the X direction between the receiving claw 26a and the receiving claw 26b is. As the distance between the receiving claw 26a and the receiving claw 26b increases, the relative positional accuracy in the Z direction between the receiving claw 26a and the receiving claw 26b is required.

  Since the substrate 5 is held in an inclined state when the relative difference (the mutual difference) in the Z direction between the receiving claws 26a and 26b is large, as shown in FIG. The deflection center Gc of the substrate 5 is displaced laterally by dx with respect to the center Mc of the mask 6. Therefore, even if it is determined in step S108 that the shift amount of the relative position between the substrate 5 and the mask 6 is equal to or less than the threshold value, the substrate 5 is placed on the mask 6 as shown in FIG. When the bending is eliminated, the substrate 5 may be laterally displaced. If a lateral shift occurs in the substrate 5, the shift amount of the relative position may exceed a threshold value in step S114. As described above, an alignment error is caused by the deviation dx of the center Gc of the deflection of the substrate 5 due to the difference in height between the receiving claws.

  Even if only the height in the Z direction of each of the receiving claws 26a and 26b with respect to the mask holding portion 9 is measured and the height is adjusted based on the measurement result, the substrate 5 whose ends are supported by the receiving claws 26a and 26b. Is difficult to bend to reduce the deviation dx. Therefore, in the operation of measuring and adjusting the height of the catching claw with respect to the mask holding portion, it is repeated by trial and error, and the adjustment operation takes time.

  In this embodiment, before the alignment method shown in FIG. 7 is performed, for example, when the film forming apparatus 100 is set, the height of each of the receiving claws 26a and 26b is adjusted so as to reduce the deviation dx. Implement the method. This adjustment method only needs to be performed once before performing each step of the film forming method that is repeatedly performed when manufacturing a film-formed product.

  10A and 10B show a state in which the measuring device 200 used for adjusting the heights of the receiving claws 26a and 26b of the film forming apparatus is arranged in the film forming space 2 in the film forming chamber. It is a schematic diagram which shows. FIG. 10A shows the height of the receiving claws 26a and 26b before the height adjustment, and FIG. 10B shows the height after the height of the receiving claws 26a and 26b is adjusted by the adjustment method of this embodiment. Before the height adjustment of the receiving claws 26a and 26b, as shown in FIG. 10A, the center Gc of the substrate 5 is changed due to the relative difference in height between the receiving claws 26a and 26b in the Z direction. Deviation dx occurs.

  The measuring device 200 includes a plurality (six in this embodiment) of distance sensors 55 for measuring the deflection of the substrate 5. The distance sensor 55 is a sensor that detects the distance between itself and the object, and is a laser displacement sensor in the present embodiment. The plurality of distance sensors 55 are arranged on the sensor slider 54 at intervals in the X direction.

  The sensor slider 54 is guided in the Y direction along the sensor guide portion 51 via the horizontal guide 53 and the yaw guide 56. The sensor guide part 51 is fixed to the mask holding part 9. The sensor slider 54, that is, a plurality of distance sensors 55 arranged side by side in the X direction, is sent in the Y direction to detect the distance in the Z direction at each position (detection point) in the XY direction on the surface of the opposing substrate 5. be able to.

  Note that the configuration of the measuring apparatus 200 is not limited to this. Although the case where a plurality of distance sensors 55 are arranged in the X direction has been described above, a plurality of distance sensors 55 may be arranged in the XY direction. Further, the distance may be detected by moving one distance sensor in the XY directions.

  FIG. 11 is a flowchart of the adjustment method of the film forming apparatus according to the first embodiment. Hereinafter, description will be made along the flowchart shown in FIG. 11 with reference to FIG. 10A and FIG. In addition, although the case where shape measurement is performed using the measurement device 200 by the control device 50 in FIG. 1 is described, the shape measurement may be performed by a calculation device different from the control device 50. The substrate 5 used in this adjustment method is preferably the same as the substrate actually formed so that the bending of the substrate actually formed is reproduced.

  The control device 50 measures the three-dimensional bending shape of the substrate 5 supported by the plurality of receiving claws 26a and 26b using the distance sensors 55 of the measuring device 200 shown in FIG. 10A (S201: First measurement step). Specifically, the control device 50 holds the end of the substrate 5 with a plurality of receiving claws 26a and 26b and a plurality of clamps 27a and 27b. Then, the control device 50 moves the plurality of distance sensors 55 in the Y direction in a state where the substrate 5 and the mask 6 are separated from each other and the substrate 5 is bent due to gravity, so that the surface of the substrate 5 (film formation) The distance data in the Z direction of each point in the XY direction on the surface) is acquired. The control device 50 acquires a signal (distance data) indicating the distance from each distance sensor 55 of the measuring device 200 shown in FIG. 10A, and a function (formula) indicating the three-dimensional bending shape of the substrate 5. Ask for.

  Note that when measuring the bending shape of the substrate 5 using the distance sensor 55, the substrate 5 is reset to zero at the position of the bending origin of the substrate 5 (surface where the amount of bending is 0), that is, the reference plane. 5 can be measured accurately.

  For example, there is means for mounting a stretch with high flatness on the sensor guide 51, detecting the distance between the distance sensor 55 and the stretched surface by the distance sensor 55, and resetting to zero. Further, although the deflection amount due to the weight of the substrate 5 is large at the center of the mask 6, the deflection amount can be regarded as almost zero at the end portion of the substrate 5, so the distance between the distance sensor 55 and the surface of the portion is the distance. There is also a means for detecting by the sensor 55 and resetting to zero.

  In FIG. 10A, the mask 6 held by the mask holding unit 9 exists between the distance sensor 55 of the measuring apparatus 200 and the substrate 5. If distance data can be acquired in each distance sensor 55 while the mask 6 is held by the mask holding unit 9, the mask 6 is interposed between the measuring device 200 and the substrate 5 as shown in FIG. May be present. In this embodiment, since the distance sensor 55 is a laser displacement sensor, the substrate 5 may be irradiated with laser light through the opening of the mask 6. If the mask 6 hinders measurement of the shape of the substrate 5 using the measuring device 200, the mask 6 is removed from the mask holding unit 9 so that there are no obstacles between the substrate 5 and the measuring device 200. Good.

  FIG. 12A is a graph showing an example of the result of measuring the bending shape of the substrate 5. As shown in FIG. 12A, the substrate 5 bends due to its own weight so that the central portion is recessed downward, and the measurement result is measured as a bent shape as shown in FIG. In the present embodiment, the control device 50 obtains a three-dimensional curved surface function indicating the bending shape of the substrate 5 using data acquired from the distance sensor 55 at each detection point.

  FIG. 12B is an explanatory diagram showing the measured bending shape of the substrate and the reference shape in the cross section along the line XIIB-XIIB shown in FIG. Hereinafter, in order to simplify the description, it will be described as an XZ two-dimensional curve in which the value in the Y direction is a certain constant value. By approximating the detection result of the distance sensor 55 with a quadratic curve (for example, approximating with the least square method), a function zr = F (x) indicating the shape of the substrate 5 is obtained. In FIG. 12B, the function zr = F (x) is shown by a solid line.

  Information on the function zi serving as a reference shape is stored in advance in a storage device such as a memory or storage of the control device 50. The function zi used as a reference is a curved surface indicating the shape of the target substrate, and is shown by a dashed curve in FIG. The function zi may be obtained using theoretical values, or may be obtained by approximating experimental values with a quadric surface. When performing the experiment, the same measurement as in step S201 may be performed using a film forming apparatus that is a prototype having the same configuration as the film forming apparatus 100.

  After measuring the shape of the substrate 5, the control device 50 calculates an offset dz = zr-zi in the Z direction (S202). In the present embodiment, the control device 50 displays the calculation result on a display device (not shown), for example, as can be understood by the worker.

  Next, the relative positions of the plurality of receiving claws 26a and 26b in the Z direction are adjusted according to the measured bending shape of the substrate 5 (S203: adjustment step). In this embodiment, the position of the receiving claw 26a in the Z direction with respect to the holding part base 25a and the position of the receiving claw 26b in the Z direction with respect to the holding part base 25b are adjusted.

  The adjustment in step S203 is performed by the control device 50 or the worker, in this embodiment, the worker. As shown in FIG. 10B, the operator adjusts the height of the spacer 41a in the Z direction so that the offset dz in the Z direction is eliminated, that is, the bent shape of the substrate 5 approaches the reference shape. 41b is arrange | positioned between receiving nail | claw 26a, 26b and holding | maintenance part base 25a, 25b. The spacer 41a corresponding to each of the plurality of receiving claws 26a and the spacer 41b corresponding to each of the plurality of receiving claws 26b are individually adjusted in height in the Z direction.

  The relative positions of the plurality of receiving claws 26a, 26b in the Z direction are adjusted by the spacers 41a, 41b disposed between the receiving claws 26a, 26b and the holding portion bases 25a, 25b. As a result, the center shift dx of the substrate 5 can be set to zero or within a predetermined range including zero as shown in FIG. In this way, by adjusting the relative positions of the plurality of receiving claws 26a, 26b in the Z direction according to the measured bending shape of the substrate 5, the receiving claws are individually measured for height and adjusted. Compared to the case, the adjustment work time is shortened and the adjustment accuracy is improved.

  In addition, although the work may be finished as it is after the process of step S203 is finished, in this embodiment, the state of adjustment in step S203 is confirmed. That is, the control apparatus 50 measures the bending shape of the board | substrate 5 supported by several receiving nail | claw 26a, 26b after step S203 (S204: 2nd measurement process). In step S204, processing similar to that in step S201 is performed. And the control apparatus 50 calculates offset dz = zr-zi similarly to step S202 (S205).

  Next, the control device 50 determines whether or not the bent shape of the substrate 5 measured in step S204 has converged within a predetermined range including the reference shape (S206). Referring to FIG. 12B, the control device 50 converges the function zr indicating the bending shape of the substrate 5 within a predetermined range za sandwiched between two dashed lines including the function zi indicating the reference shape. Determine if you did. In addition, it is preferable that the control apparatus 50 displays the image which shows whether it converged, and the calculation result of step S205 on a display apparatus not shown so that an operator may understand.

  If the bent shape of the substrate 5 measured in step S204 converges within a predetermined range including the reference shape (S206: YES), the adjustment is finished as it is. If the bent shape of the substrate 5 measured in step S204 does not converge within a predetermined range including the reference shape (S206: NO), the operator performs the adjustment process in step S203 again.

  As described above, the accuracy of adjustment by the spacers 41a and 41b is improved by repeating step S203 and step S204 until the measured bent shape of the substrate 5 converges within a predetermined range including the reference shape.

  FIG. 13 is a schematic diagram of the substrate holding unit 8 and the mask holding unit 9 when the substrate 5 is placed on the mask 6. Since the heights of the receiving claws 26a, 26b in the Z direction are adjusted by the spacers 41a, 41b, the center dx of the substrate 5 and the center Mc of the mask 6 coincide with each other as shown in FIG. The alignment error when seated on 6 can be brought close to zero.

  Therefore, if the film formation is performed using the film formation apparatus 100 adjusted by the adjustment method shown in FIG. 11, the number of re-alignments can be reduced when the alignment method shown in FIG. 7 is executed. That is, in step S114 of FIG. 7, the amount of deviation of the relative position between the substrate 5 and the mask 6 is less likely to exceed the threshold value. In particular, if the height of the spacers 41a and 41b is adjusted with high accuracy, the number of times of re-alignment can be reduced to zero.

  Therefore, according to the first embodiment, the displacement of the substrate 5 at the time of contact between the substrate 5 and the mask 6 is reduced, and the alignment accuracy can be improved. As a result, when a film-formed product is manufactured using the film-forming apparatus 100, the time required for alignment between the substrate 5 and the mask 6, that is, the tact time is shortened, and the productivity can be increased.

  Next, a film forming method using the film forming apparatus 100 adjusted according to the present embodiment, that is, a method for manufacturing an organic EL panel will be described as an example of a method for manufacturing an electronic device that is a film-formed product.

  First, the organic EL panel to be manufactured will be described. FIG. 14A shows an overall view of the organic EL panel 60, and FIG. 14B shows a cross-sectional structure of one pixel.

  As shown in FIG. 14A, in the display area 61 of the organic EL panel 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to a minimum unit capable of displaying a desired color in the display area 61.

  In the case of the organic EL panel according to the present embodiment, the pixel 62 includes a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit different light. In the present embodiment, the pixel 62 includes a red light emitting element, a green light emitting element, and a blue light emitting element, but is not limited thereto, and includes, for example, a yellow light emitting element, a cyan light emitting element, and a white light emitting element. Also good.

  FIG. 14B is a schematic partial cross-sectional view of the organic EL panel taken along line XIIIB-XIIIB in FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of the light emitting layers 66 </ b> R, 66 </ b> G, and 66 </ b> B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. And a light emitting element (organic EL element). Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light emitting elements that emit red, green, and blue, respectively. The first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements, or may be formed for each light emitting element. Although the first electrode 64 is an anode and the second electrode is a cathode here, the first electrode 64 may be a cathode and the second electrode may be an anode. In that case, the stacking order of the hole transport layer 65 and the electron transport layer 67 may be reversed.

  In order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter, an insulating layer 69 is provided between the first electrodes 64. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

  In order to form the organic EL layer in units of light emitting elements, a method of forming a film through a mask is used. In recent years, display devices have been improved in definition, and a mask having an opening width of several tens of μm is used for forming an organic EL layer. For film formation using such a mask, the film formation apparatus 100 of this embodiment is preferably used.

  FIG. 15 is an explanatory diagram of a manufacturing system 300 for manufacturing an organic EL panel. The manufacturing system 300 includes a plurality of film forming apparatuses 100, transfer chambers 101, 102, and 103, a substrate supply chamber 105, a mask stock chamber 106, a delivery chamber 107, a glass supply chamber 108, a bonding chamber 109, a take-out chamber 110, and the like. ing. Each film forming apparatus 100 has almost the same basic configuration (particularly, a configuration related to substrate transport and alignment), although there are portions that differ in fine points such as a difference in film forming source and a mask. As described above, in each film forming apparatus 100, the height of the receiving claw that supports the substrate is adjusted by the spacer by the adjusting method shown in FIG.

  In the transfer chambers 101, 102, and 103, a robot 120 that is a transfer mechanism is arranged. The substrate is transferred by the robot 120. Each film forming apparatus 100 forms a thin film of an inorganic material such as a metal material or an organic material on the substrate conveyed by the robot 120, for example, by vapor deposition.

  A substrate is supplied to the substrate supply chamber 105 from the outside. The mask stock chamber 106 is transported by the robot 120 using a mask deposited with a film, which is used in each film forming apparatus 100. The mask can be cleaned by collecting the mask transferred to the mask stock chamber 106.

  Sealing glass is supplied to the glass supply chamber 108 from the outside. In the bonding chamber 109, an organic EL panel is manufactured by bonding sealing glass to a film-formed substrate. The manufactured organic EL panel is taken out from the take-out chamber 110.

  Hereinafter, the example of the manufacturing method of an organic electroluminescent panel is demonstrated concretely. First, a circuit (not shown) for driving the organic EL element and a substrate 63 on which the first electrode 64 is formed are prepared.

  An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in a portion where the first electrode 64 is formed. 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

  The substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus 100, the substrate is held by the substrate holding unit, and the hole transport layer 65 is used as a common layer on the first electrode 64 in the display region. Form a film. The hole transport layer 65 is formed by vacuum deposition. Actually, since the hole transport layer 65 is formed in a size larger than the display region 61, a high-definition mask is not necessary.

  Next, the substrate 63 on which the hole transport layer 65 is formed is carried into another film forming apparatus 100 and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red is formed on the portion of the substrate 63 where the element that emits red is disposed. According to the present embodiment, the relative positions of the mask and the substrate can be accurately aligned and overlapped, and highly accurate film formation can be performed.

  Similarly to the formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by another film forming apparatus 100, and the light emitting layer 66B emitting blue is formed by another film forming apparatus 100. After film formation of the light emitting layers 66R, 66G, and 66B is completed, an electron transport layer 67 is formed on the entire display region 61 by using another film forming apparatus 100. The electron transport layer 67 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.

  By moving the substrate on which the electron transport layer 67 is formed to the sputtering apparatus, forming the second electrode 68, and then moving to the plasma CVD apparatus to form the protective layer 70, and bonding the sealing glass The organic EL panel 60 is completed.

  From when the substrate 63 with the insulating layer 69 patterned is carried into the film forming apparatus 100 until the film formation of the protective layer 70 is completed, if it is exposed to an atmosphere containing moisture or oxygen, a light emitting layer made of an organic EL material May be deteriorated by moisture or oxygen. Therefore, in this embodiment, the carrying in / out of the substrate between the film forming apparatuses 100 is performed under a vacuum atmosphere or an inert gas atmosphere.

  In the organic EL panel 60 manufactured as described above, a light emitting layer is accurately formed for each light emitting element. Therefore, if the said manufacturing method is used, generation | occurrence | production of the defect of the organic electroluminescent panel resulting from the position shift of a light emitting layer can be suppressed.

[Second Embodiment]
Next, a film forming method according to the second embodiment will be described. FIG. 16 is a schematic diagram of a substrate holding part of the film forming apparatus according to the second embodiment. In the first embodiment, as shown in FIG. 10B, the case where the heights in the Z direction of the receiving claws 26a and 26b with respect to the holding portion bases 25a and 25b are adjusted by the spacers 41a and 41b has been described. As shown in FIG. 16, in the film forming apparatus of the second embodiment, instead of the spacer, actuators 57a, which are second drive units that displace the receiving claws 26a, 26b in the Z direction with respect to the holding unit bases 25a, 25b. 57b. In the film forming apparatus of the second embodiment, the other configuration is the same as that of the film forming apparatus 100 of the first embodiment. Therefore, in the following description, the same reference numerals are used, and FIG. Similar components are denoted by the same reference numerals, and detailed description thereof is omitted.

  Actuators 57a and 57b include guide struts 58a and 58b supported on the holding bases 25a and 25b, and guides 59a and 59b that are fixed to the receiving claws 26a and 26b and move in the Z direction relative to the guide struts 58a and 58b Have. The guide columns 58a, 58b incorporate a drive source such as a linear motor (not shown).

  One actuator 57a is provided for each receiving claw 26a, and the plurality of receiving claws 26a can be independently moved in the Z direction. Similarly, one actuator 57b is provided for each receiving claw 26b, and the plurality of receiving claws 26b can be independently moved in the Z direction.

  Each actuator 57a, 57b operates according to a command from the control device 50, which is a processing unit. In the first embodiment, the case where the adjustment method shown in FIG. 11 is performed separately from the film formation method, such as when the film formation apparatus 100 is set, has been described. And the case where an operator performed the process of step S203 shown in FIG. 11 was demonstrated. In the second embodiment, the adjustment method shown in FIG. 11 is performed as a step in the film forming method. And the control apparatus 50 implements the process of step S203 shown in FIG.

  The processing in step S203 will be specifically described. The control device 50 determines the relative positions of the plurality of receiving claws 26a and 26b in the Z direction according to the bending shape of the substrate 5 measured in step S201 or step S204. Find the adjustment amount to adjust. And the control apparatus 50 operates actuator 57a, 57b based on the calculated | required adjustment amount, and adjusts the position of the receiving claw 26a, 26b with respect to the holding | maintenance part base 25a, 25b in the Z direction. In this way, in the second embodiment, in step S203, the positions of the receiving claws 26a and 26b in the Z direction with respect to the holding portion bases 25a and 25b are adjusted by the actuators 57a and 57b instead of the spacers.

  As described above, in the second embodiment, the adjustment method shown in FIG. 11 may be performed before the film formation step, that is, before the alignment method shown in FIG. As described above, in the second embodiment, the positions of the receiving claws 26a and 26b in the Z direction can be adjusted actively, that is, automatically.

  And in 2nd Embodiment, the shift | offset | difference of the board | substrate 5 at the time of the contact of the board | substrate 5 and the mask 6 is reduced similarly to 1st Embodiment, and alignment accuracy can be improved. As a result, when a film-formed product is manufactured using the film-forming apparatus, the time required for alignment between the substrate 5 and the mask 6, that is, the tact time is shortened, and the productivity can be increased.

  The present invention is not limited to the embodiment described above, and many modifications are possible within the technical idea of the present invention. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments. In the above description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. are intended to limit the scope of the present invention only to those unless otherwise specified. Is not.

5 ... Substrate, 6 ... Mask, 25a ... Holding part base (second member), 25b ... Holding part base (second member), 26a ... Receiving claw (first member), 26b ... Receiving claw (first member), 41a ... spacer, 41b ... spacer, 50 ... control device (processing unit), 55 ... distance sensor, 57a ... actuator (second drive unit), 57b ... actuator (second drive unit), 80 ... Z lift mechanism (first Drive unit), 100 ... film forming apparatus

Claims (14)

A method of adjusting a film forming apparatus for placing a substrate having end portions supported by a plurality of first members on a mask and forming a film on the substrate,
A first measurement step of measuring a bent shape of the substrate supported by the plurality of first members;
An adjustment step of adjusting relative positions of the plurality of first members in the vertical direction according to the measured bending shape of the substrate. The first member is supported by a second member;
The method for adjusting a film forming apparatus according to claim 1, wherein, in the adjusting step, the vertical position of the first member with respect to the second member is adjusted.   The adjustment step includes adjusting a vertical position of the first member with respect to the second member by a spacer disposed between the first member and the second member. The adjustment method of the film-forming apparatus of description.   In the adjusting step, the vertical position of the first member with respect to the second member is adjusted by a drive unit that displaces the first member in the vertical direction with respect to the second member. The method for adjusting a film forming apparatus according to claim 2.   2. The position in the vertical direction of the plurality of first members is adjusted so that the bending shape of the substrate supported by the plurality of first members approaches a reference shape in the adjusting step. 5. A method for adjusting a film forming apparatus according to any one of items 1 to 4. After the adjustment step, the second measurement step of measuring the bending shape of the substrate supported by the plurality of first members,
6. The method for adjusting a film forming apparatus according to claim 5, wherein the adjustment step and the second measurement step are repeated until the measured bent shape of the substrate converges within a predetermined range including the reference shape. .   7. The configuration according to claim 1, wherein a bending shape of the substrate is measured using a distance sensor arranged to face the substrate supported by the plurality of first members. Method for adjusting the membrane device. A film forming method of placing a substrate having end portions supported by a plurality of first members on a mask and forming a film on the substrate,
A first measurement step of measuring a bent shape of the substrate supported by the plurality of first members;
An adjustment step of adjusting the relative positions of the plurality of first members in the vertical direction according to the measured bending shape of the substrate,
A film forming step of placing a substrate on the mask and forming a film on the substrate. After the adjustment step, the second measurement step of measuring the bending shape of the substrate supported by the plurality of first members,
The film forming method according to claim 8, wherein the adjustment step and the second measurement step are repeated until the measured bent shape of the substrate converges within a predetermined range including the reference shape. A plurality of first members that support the end of the substrate;
A mask holding unit for holding a mask on which the substrate is placed;
A first drive unit configured to move the plurality of first members or the mask holding unit in a vertical direction;
A distance sensor disposed to face the substrate supported by the plurality of first members;
The bending shape of the substrate supported by the plurality of first members is measured based on the signal from the distance sensor, and the vertical direction relative to each other in the plurality of first members is measured according to the measured bending shape of the substrate. And a processing unit for obtaining an adjustment amount for adjusting a correct position. A second member that supports the first member;
A second drive unit that displaces the first member in the vertical direction with respect to the second member;
The said processing part operates the said 2nd drive part based on the said adjustment amount, The said vertical position of the said 1st member with respect to the said 2nd member is adjusted, The structure of Claim 10 characterized by the above-mentioned. Membrane device.   12. A manufacturing system comprising a plurality of film forming apparatuses according to claim 10 or 11, wherein a film is formed in each film forming apparatus on a substrate carried into each film forming apparatus.   A plurality of film forming apparatuses according to claim 10 or 11, wherein an inorganic material or an organic material film is formed in each film forming apparatus on a substrate carried into each film forming apparatus. Organic EL panel manufacturing system.   10. A method for manufacturing an organic EL panel, comprising forming a film of an inorganic material or an organic material on a substrate by the film forming method according to claim 8 or 9.

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