JP2019188529A - Method for production of polishing carrier plate and polishing carrier plate - Google Patents

Abstract

To provide a production method for a polishing carrier plate capable of strongly fixing a cushion member comprising a resin laminate to the inner periphery of a holding hole and further capable of producing without generating warping or undulation at molding, and to provide the polishing carrier plate.SOLUTION: An objective polishing carrier plate having a holding hole provided for holding a material to be polished comprises a metal plate and the substrates with resin pressure-bonded on both surfaces of the metal plate, and has a circular form, on the circumference of which a gear is formed. At least one holding hole is formed on the metal plate, and an annular cushion member comprising a resin laminate is fitted on the inner periphery of the holding hole. A through-hole having the same diameter as the inner diameter of the annular cushion member is provided on the substrate with resin. The annular cushion member is pressure-bonded and fixed to two substrates with resin, and thus is fixed in the holding hole.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a method for producing a polishing carrier plate for holding an object to be polished when polishing the surface of a semiconductor wafer, glass, aluminum disk, glass substrate for liquid crystal display, disk-shaped ceramic substrate, etc. The present invention relates to a polishing carrier plate.

  When polishing these surfaces in the manufacturing process of semiconductor wafers, glass, aluminum disks, liquid crystal display glass substrates, disk-shaped ceramic substrates, etc., hold the object to be polished using a polishing carrier plate Polishing is performed in the condition. The carrier plate for polishing is provided with a holding hole for holding an object to be polished, and a plurality of carrier plates for polishing are provided with a sun gear arranged at the center of the polishing apparatus and an internal gear arranged on the outer periphery. The polishing carrier plate is rotated by the rotation of the sun gear and the internal gear, so that the polishing object placed in the holding hole of the polishing carrier plate is polished. Is done.

  In recent years, semiconductor wafers, glass, aluminum disks, liquid crystal display glass substrates, disk-shaped ceramic substrates and the like have been made thinner, and accordingly, it is required to reduce the thickness of a polishing carrier plate used for polishing work. Furthermore, not only the thickness is reduced, but also rigidity and durability are required.

  As a conventional carrier plate for polishing, a carrier plate made of a metal such as SK steel or stainless steel (see Patent Document 1) or a carrier plate made of a resin plate such as an epoxy glass laminate (see Patent Document 2) is used. ing. A metal polishing carrier plate is obtained by forming a holding hole for holding an object to be polished in a metal plate, and performing polishing, lapping, and polishing. Such a metal polishing carrier plate However, since the object to be polished held in the holding hole is in direct contact with the metal portion, there is a problem that metal contamination, scratching, chipping, cracking, etc. occur.

  The polishing carrier plate made of a resin plate has a problem that the durability is low and the strength of the gear provided on the outer periphery and the holding hole is low compared to a metal polishing carrier plate.

  In order to prevent cracking and chipping of the object to be polished and to improve durability, a metal plate is used as a carrier plate for polishing, and the resin part is bonded to the inner periphery of the holding hole as a buffer member for the object to be polished. A method of fixing with an agent, a method of coating a resin on the inner periphery of a holding hole, and sandwiching a metal plate with an epoxy glass cloth are used.

  Providing such a buffer member is effective in preventing cracking and chipping of the object to be polished, and the durability of the polishing carrier plate is improved. There is a problem in that the fixing strength to the periphery is not sufficient, and the buffer member easily falls off from the inner periphery of the holding hole. In order to improve the fixing strength of such a buffer member, Patent Document 3 uses a method in which a plurality of protruding portions each having a chamfered portion are formed on the inner surface of the holding hole and the resin serving as the buffer member is fixed. However, there is a problem that the manufacturing process increases because the inner peripheral surface of the holding hole is processed, is complicated, the productivity is low, and the manufacturing cost increases.

  Further, the method of adhering a buffer member such as injection-molded polypropylene to the inner periphery of the holding hole has a problem that it is difficult to handle when the thickness of the polishing carrier plate is 0.3 mm or less. Then, in the conventional method for providing the buffer member made of resin in the holding hole of the metal plate, warpage or undulation occurs due to the difference in expansion coefficient between the metal part and the resin part, and the subsequent polishing carrier plate There is also a problem that it becomes difficult to process the teeth on the outer periphery of the metal.

JP 2001-358095 A JP 2004-114208 A Japanese Patent Laid-Open No. 2002-18708

  In the polishing carrier plate made of a metal plate, the present invention can firmly fix an annular buffer member made of a resin laminate in a holding hole, and can be manufactured without causing warpage or undulation. An object of the present invention is to provide a method for producing a polishing carrier plate and a polishing carrier plate.

  The method for producing a polishing carrier plate according to the present invention is a method for producing a polishing carrier plate comprising a metal plate coated on both sides with a resin-coated substrate and having holding holes for holding an object to be polished. Forming at least one holding hole for holding an object to be polished in the metal plate, and fitting an annular member made of a resin laminate having the same thickness as the metal plate into the holding hole. Step: preparing two base materials with resin, and forming a through hole having the same inner diameter as the inner diameter of the annular member at a position corresponding to the holding hole of the metal plate in each of the base materials with resin And a step of pressure-bonding the base material with resin to both surfaces of the metal plate, respectively, and arranging the two base materials with resin on both surfaces of the metal plate so that the through hole and the holding hole overlap each other. And two annular members In a state of being sandwiched between the resin-attached base materials, a step of heating and pressurizing the metal plate and the two resin-attached base materials, and press-bonding the resin-attached base material to both surfaces of the metal plate, A step of cutting the annular member fitted in the holding hole, wherein the annular member is cut together with the two substrates with resin, and the inner diameter of the annular member is widened to form an annular shape. Forming the shock-absorbing member, and processing the outer periphery of the metal plate in a state where the two substrates with resin are pressed into a circular shape, and applying gear processing to the outer periphery. The carrier plate is fixed in a state where the annular buffer member fitted in the holding hole is sandwiched between the two substrates with resin.

  The resin varnish is applied to the substrate and dried to form two substrates with resin.

  A resin varnish is applied to the substrate and dried to form two substrates with resin, and then the two substrates with resin are stacked and heated and pressed to form a resin laminate. The resin laminate is processed to form the annular member.

  The polishing carrier plate of the present invention is a polishing carrier plate provided with a holding hole for holding an object to be polished. The polishing carrier plate includes a metal plate and a resin-attached substrate that is pressure-bonded to both surfaces of the metal plate. An annular buffer having a circular shape with a gear formed on the outer periphery, at least one holding hole formed in the metal plate, and an annular member formed of a resin laminate on the inner periphery of the holding hole. A member is attached, and the resin-coated base material is provided with a through hole having the same diameter as the inner diameter of the annular buffer member, and the annular buffer member is crimped to the two resin-coated base materials. By being fixed, it is fixed in the holding hole.

    The annular buffer member is formed of a resin laminate made of a resin-attached base material.

    The method for producing a polishing carrier plate according to the present invention is a method for producing a polishing carrier plate comprising a metal plate coated on both sides with a resin-coated substrate and having holding holes for holding an object to be polished. Forming at least one holding hole for holding an object to be polished in the metal plate, and fitting an annular member made of a resin laminate having the same thickness as the metal plate into the holding hole. Step: preparing two base materials with resin, and forming a through hole having the same inner diameter as the inner diameter of the annular member at a position corresponding to the holding hole of the metal plate in each of the base materials with resin And a step of pressure-bonding the base material with resin to both surfaces of the metal plate, respectively, and arranging the two base materials with resin on both surfaces of the metal plate so that the through hole and the holding hole overlap each other. And two annular members In a state of being sandwiched between the resin-attached base materials, a step of heating and pressurizing the metal plate and the two resin-attached base materials, and press-bonding the resin-attached base material to both surfaces of the metal plate, A step of cutting the annular member fitted in the holding hole, wherein the annular member is cut together with the two substrates with resin, and the inner diameter of the annular member is widened to form an annular shape. Forming the shock-absorbing member, and processing the outer periphery of the metal plate in a state where the two substrates with resin are pressed into a circular shape, and applying gear processing to the outer periphery. The carrier plate is fixed in a state where the annular buffer member fitted in the holding hole is sandwiched between the two substrates with resin, so that the annular buffer member is attached to the inner periphery of the holding hole. It becomes possible to fix firmly, warp Ri becomes possible to manufacture the following polishing carrier plate with a thickness of 0.3mm while suppressing.

  By applying a resin varnish to the substrate and drying it, the two substrates with resin are formed, and further, applying the resin varnish to the substrate and drying to form two substrates with resin Thereafter, the two resin-coated substrates are stacked and heated and pressed to form a resin laminate, and the resin laminate is processed to form the annular member, thereby forming a metal plate. Since the process of forming the said base material with a resin crimped | bonded to both surfaces and the cyclic | annular buffer member can be made common, manufacturing cost can be reduced.

  The polishing carrier plate of the present invention is a polishing carrier plate provided with a holding hole for holding an object to be polished. The polishing carrier plate includes a metal plate and a resin-attached substrate that is pressure-bonded to both surfaces of the metal plate. An annular buffer having a circular shape with a gear formed on the outer periphery, at least one holding hole formed in the metal plate, and an annular member formed of a resin laminate on the inner periphery of the holding hole. A member is attached, and the resin-coated base material is provided with a through hole having the same diameter as the inner diameter of the annular buffer member, and the annular buffer member is crimped to the two resin-coated base materials. By being fixed, by being fixed in the holding hole, the annular buffer member is firmly fixed in the holding hole, and is excellent in strength and durability, and does not cause warping or undulation from the past. Also reduce the thickness It can become.

It is (a) top view and (b) sectional drawing of the metal plate of the carrier plate for grinding | polishing of this invention. It is the (a) top view of the cyclic | annular resin laminated body fitted to the holding hole of a metal plate, and (b) sectional drawing. It is the (a) top view of the state which made the cyclic | annular resin laminated body fitted to the holding hole of the metal plate, and (b) sectional drawing. It is (a) top view and (b) sectional drawing of the base material with resin made to press-fit to a metal plate. It is the (a) top view of the state where the substrate with resin was pressed on both sides of the metal plate, and (b) sectional view. It is the (a) top view of the metal plate of the state which processed the cyclic | annular resin laminated body, and formed the cyclic | annular buffer member, and (b) sectional drawing. It is (a) top view of the carrier plate for grinding | polishing of this invention, and (b) sectional drawing. It is a top view of the state which has arrange | positioned the grinding | polishing carrier plate between the sun gear and the internal gear. It is (a) top view and (b) sectional drawing of the metal plate of the grinding | polishing carrier plate of a comparative example. It is the (a) top view of the disk-shaped resin laminated body fitted to the holding hole of the metal plate of a comparative example, and (b) sectional drawing. It is (a) top view of the state which made the disk-shaped resin laminated body fit to the holding hole of the metal plate of a comparative example, and (b) sectional drawing. It is the (a) top view of the base material with a resin made to press-fit to the metal plate of a comparative example, and (b) sectional drawing. It is (a) top view and (b) sectional view in the state where a substrate with resin was pressed on both sides of a metal plate of a comparative example. It is the (a) top view and (b) sectional view of the metal plate of the state which processed the disk-shaped resin laminated body and formed the cyclic | annular buffer member. It is (a) top view of the carrier plate for grinding | polishing of a comparative example, and (b) sectional drawing.

  The manufacturing method of the polishing carrier plate 1 and the polishing carrier plate 1 of the present invention will be described below in detail with reference to the drawings. 1 to 6 are a plan view and a cross-sectional view showing the procedure of the method for producing a polishing carrier plate of the present invention, and FIG. 7 shows a plan view and a cross-section of the polishing carrier plate 1 of the present invention. FIG. In order to make the sectional view easier to see, the aspect ratio of the sectional view is changed. As shown in FIG. 8, the polishing carrier plate 1 of the present invention is rotated by a sun gear 11 and an internal gear 12 to polish an object to be polished disposed in the holding hole 3 as shown in FIG. It is used. First, a method for producing the polishing carrier plate 1 of the present invention will be described.

  First, a metal plate 2 having a predetermined thickness and size is prepared, and as shown in FIG. 1, a holding hole 3 for holding an object to be polished is formed by laser processing or the like. As the metal plate 2, a stainless steel plate or the like is used, and the size of the holding hole 3 is set according to the size of the object to be polished, and an annular buffer member 4 is attached in the holding hole 3. The assumed size. Further, the number of the holding holes 3 is not limited to four as shown in FIG. 1A, and can be appropriately changed according to conditions of a polishing apparatus, an object to be polished, and the like.

  Next, a method for forming an annular resin laminate 4 ′ that is an annular member made of a resin laminate fitted into the holding hole 3 will be described. First, two base materials such as glass cloth are prepared, and a resin varnish such as an epoxy resin or a bismaleide resin is applied to the base material and dried to form two base materials with resin of the same size. The two resin-coated base materials are stacked on each other and heated and pressed to form a resin laminate. At this time, the resin laminate is formed to have the same thickness as the metal plate 2. As the substrate, aramid fibers or other highly elastic organic fibers, carbon fibers, or the like can be used. These substrates and a resin varnish can be appropriately selected and combined.

  An annular resin laminate 4 ′ as shown in FIG. 2 is formed on the resin laminate by laser processing, router processing, punching processing, or the like. The outer diameter of the annular resin laminate 4 ′ is set to a size that can be fitted into the holding hole 3, and the inner diameter is cut from the annular buffer member 4 in the final form in consideration of cutting in a later step. The inner diameter is also small. The annular resin laminate 4 ′ is not limited to the one formed using two substrates with resin as in the present embodiment, and may be formed using one substrate with resin. It is also possible to use only resin. The material of the resin is not particularly limited. In this way, four annular resin laminates 4 ′ are formed and inserted into the four holding holes 3 as shown in FIG. 3.

  Next, the resin-attached base material 5 that is pressure-bonded to both surfaces of the metal plate 2 will be described. As with the base material with resin used for forming the annular resin laminate 4 ′, two base materials such as glass cloth are prepared, and a resin varnish such as epoxy is applied to the base material and dried. Two base materials 5 with resin are formed. The two base materials with resin 5 are preferably the same material and the same thickness as the base material with resin used to form the annular resin laminate 4 ′, but may have different materials and different thicknesses. Is possible.

  As shown in FIG. 4, the two substrates 5 with resin thus formed are cut into the same size as the metal plate 2 to form four through holes 6. The same number of the through holes 6 are formed at positions corresponding to the holding holes 3 of the metal plate 2. At this time, the diameter of the through hole 6 is the same as the inner diameter of the annular resin laminate 4 ′.

  As shown in FIG. 6B, the two substrates with resin 5 in which the through holes 6 are formed are arranged on both surfaces of the metal plate 2. At this time, as shown in FIG. 6 (a), the through hole 6 of the substrate 5 with resin is aligned with the holding hole 3 of the metal plate 2, and the inner periphery of the through hole 6 is further aligned. Alignment is performed so as to coincide with the inner periphery of the annular resin laminate 4 ′. Thereby, as shown in FIG. 6B, the annular resin laminate 4 ′ is sandwiched between the two resin-attached base materials 5 in the holding hole 3.

  In this way, with the metal plate 2 being sandwiched between the two substrates 5 with resin, the heat and pressure press is performed to perform pressure forming. Thereby, the base material 5 with resin is pressure-bonded and fixed to both surfaces of the metal plate 2, and the both surfaces of the annular resin laminate 4 ′ are also pressure-fixed to the base material 5 with resin.

  The inner periphery of the annular resin laminate 4 ′ is removed by laser processing to narrow its width, and processed into the shape of the final annular buffer member 4. At this time, the substrate 5 with resin fixed to both surfaces of the annular resin laminate 4 ′ is also removed annularly at the same time. As a result, the annular buffer member 4 is fixed in the holding hole 3, and the object to be polished is disposed in the annular buffer member 4 during the polishing operation.

  After that, when the metal plate 2 with the resin-attached base material 5 fixed on both sides is formed into a disk shape with a predetermined outer diameter by laser processing and gear processing is performed on the outer periphery, the metal plate 2 of the present invention as shown in FIG. The polishing carrier plate 1 is completed.

  The polishing carrier plate 1 of the present invention obtained by the above manufacturing method will be described. The polishing carrier plate 1 of the present invention comprises a metal plate 2 and a resin-coated base material 5 bonded to both surfaces of the metal plate 2 and has a circular shape with a gear 7 formed on the outer periphery. Is provided with a holding hole 3. An annular buffer member 4 made of a resin laminate for protecting the object to be polished is fixed to the inner periphery of the holding hole 3.

  The upper and lower surfaces of the annular buffer member 4 are fixed in a state of being sandwiched by the resin-attached base material 5 fixed to both surfaces of the metal plate 2, and two surfaces of the annular buffer member 4 are provided. The resin-attached base material 5 is firmly fixed. A fixing means such as an adhesive is not used between the outer peripheral surface of the annular buffer member 4 and the inner peripheral surface of the holding hole 3, but as shown in FIG. The member 4 is firmly fixed in the holding hole 3 by being clamped and fixed between the two resin-attached base materials 5 up and down, and the fixing strength is increased as compared with the related art.

  In this manner, the annular buffer member 4 is formed using an annular member made of a resin laminate, and the annular buffer member 4 is fixed in the holding hole 3 by crimping and fixing the substrate 5 with resin. Thus, the polishing carrier plate 1 of the present invention can firmly fix the annular buffer member 4 in the holding hole 3 and can improve the strength and durability of the polishing carrier plate 1 itself. In addition, a thin polishing carrier plate having a thickness of 0.3 mm or less can be realized while suppressing warpage and undulation.

  And the manufacturing method of the carrier plate for grinding | polishing of this invention can manufacture the carrier plate for grinding | polishing which has the above outstanding effects, without increasing manufacturing cost significantly compared with the past.

  As shown in FIG. 8, the polishing carrier plate 1 of the present invention is disposed between a sun gear 11 and an internal gear 12, and the sun gear 11 and the internal gear 12 rotate in the direction of the arrow. The polishing carrier plate 1 rotates in the direction of the arrow, and the object to be polished disposed in the holding hole 3 is polished. During such a polishing operation, the object to be polished held in the holding hole 3 is protected by the annular buffer member 4, and problems such as breakage can be solved.

  Next, the polishing carrier plate 1 of the present invention will be described in detail using Examples and Comparative Examples. First, the polishing carrier plate 1 of the embodiment will be described.

  In this embodiment, a stainless steel plate having a thickness of 0.1 mm and a size of 350 mm × 350 mm is used as the metal plate 2. Four holding holes 3 having a diameter of 110 mm are formed in such a metal plate 2 by laser processing, and the metal plate 2 as shown in FIG. 1 is created.

  Next, an epoxy resin varnish is applied to the glass cloth and dried to form two substrates with resin having a thickness of 0.05 mm. The two substrates with resin are overlapped and heated and pressed to form a resin laminate having the same thickness (0.1 mm) as the metal plate 2.

  Four annular resin laminates 4 ′ having an outer diameter of 99.5 to 99.0 mm and an inner diameter of 89.5 to 89.0 mm are formed on the resin laminate using laser processing, router processing, punching processing, or the like. The annular resin laminate 4 ′ is fitted into the holding hole 3 of the metal plate 2 as shown in FIG. 3.

  Two resin-coated substrates 5 (thickness 0.05 mm) having the same material and thickness are fabricated in the same procedure as the resin-coated substrate used when the annular resin laminate 4 'is fabricated. Then, the two resin-attached base materials 5 are cut into the same size (350 mm × 350 mm) as the metal plate 2, and at the same position as the holding hole 3 of the metal plate 2, as shown in FIG. Four through holes 6 having the same diameter (89.5 to 89.0 mm) as the inner diameter of the resin laminate 4 ′ are formed.

  The base material 5 with resin is disposed on both surfaces of the metal plate 2 in which the annular resin laminate 4 ′ is fitted in the holding hole 3, and then heat-pressed to perform pressure forming. Thereafter, the resin-attached base material 5 that is pressure-bonded to the inner periphery and both surfaces of the annular resin laminate 4 ′ by laser processing so that the width of the annular resin laminate 4 ′ is 1.5 mm. delete. Thereby, the annular buffer member 4 is formed from the annular resin laminate 4 ′, and the annular buffer member 4 is fixed in the holding hole 3.

  Then, the metal plate 2 to which the substrate 5 with resin is pressure-bonded by laser processing is processed into a circle having an outer diameter of 315 mm, holes 8 and the like are processed, and finally, gear processing is performed on the outer periphery to form the gear 7. Then, the polishing carrier plate 1 of the embodiment having a thickness of 0.2 mm as shown in FIG. 7 is completed.

  Next, the polishing carrier plate 21 of the comparative example will be described. The metal plate 22 used in the comparative example is a stainless steel plate having a thickness of 0.1 mm and a size of 350 mm × 350 mm, as in the example. As shown in FIG. 9, four holding holes 23 having a diameter of 110 mm are formed in the metal plate 22 by laser processing.

  In the comparative example, a disc-shaped resin laminate 24 ′ as shown in FIG. 10 is fitted in the holding hole 23 instead of the annular resin laminate. For this purpose, the disk-shaped resin laminate 24 ′ is formed with the same outer diameter and the same thickness using the same substrate with resin as the annular resin laminate 4 ′. The disk-shaped resin laminate 24 ′ thus formed is fitted into the holding hole 23 of the metal plate 22 as shown in FIG. 11.

  And the two base material 25 with a resin crimped | bonded to both surfaces of the said metal plate 22 is prepared. As in the example, the base material with resin 25 used in the comparative example was formed by applying epoxy resin varnish to glass cloth and drying to form two base materials with resin 25 having a thickness of 0.05 mm. Are cut into the same size (350 mm × 350 mm), but at this time, as shown in FIG. 12, a through hole as in the example is not formed.

  The two resin-coated base materials 25 having no through holes formed in this way are arranged on both surfaces of the metal plate 22, and then a heat-pressing press is performed to perform pressure forming. As a result, both surfaces of the metal plate 22 are covered with the substrate 25 with resin. Then, the disk-shaped resin laminate 24 ′ and the two substrates with resin 25 are subjected to laser processing, and the disk-shaped resin laminate 24 is formed at the center of the disk-shaped resin laminate 24 ′. A through-hole 26 that penetrates through the two substrates with resin 25 is formed. Thereby, an annular buffer member 24 is formed from the disk-shaped resin laminate 24 ′.

  Then, the metal plate 22 to which the resin-coated base material 25 is pressure-bonded by laser processing is processed into a circular shape having an outer diameter of 315 mm, the holes 28 and the like are processed, and finally, gear processing is performed on the outer periphery to form the gear 27. Then, the polishing carrier plate 21 of the comparative example having a thickness of 0.2 mm is completed.

  The polishing carrier plate 1 of the example prepared in this way and the polishing carrier plate 21 of the comparative example are evaluated by performing the following tests 1 to 4. The test results are listed in Table 1 below. The contents of each test are as follows.

Test 1: Heat and pressure press formability (the presence or absence of an annular buffer member made of a resin laminate fixed in the holding hole on the surface of the metal plate, the smoothness of the surface of the plate (irregularities, wrinkles, twists are within specifications) Confirm visually)
Test 2: Thickness deviation of the carrier plate for polishing (the thickness of the portion made of the annular buffer member made of the resin laminate in the holding hole and the base with resin, and the portion made of the metal plate around the holding hole and the base with resin (Measure the thickness with a micrometer)
Test 3: Aluminum disc polishing was repeated 5000 batches, and the bonding state of the annular cushioning member in the holding hole and the surface state of the object to be polished were observed with a microscope. Test 4: Warping and waviness of the polishing carrier plate (on the surface plate) Measure the height of the floating part by placing the sample flat on

  From the above test results, the polishing carrier plate 1 of the example shows results superior to the comparative example in all items, and the annular buffer member 4 is formed using the annular resin laminate 4 ′. By doing so, the resin of the annular buffer member 4 does not run on the metal plate 2, and as a result, the smoothness is excellent, the thickness deviation can be kept within the standard, and the bonding strength is also improved. ing. And even if the carrier plate 1 for polishing of the embodiment has a thickness of 0.2 mm, warping and undulation can be accommodated in a practically acceptable range. It is clear that a carrier plate can be realized.

  As described above, the manufacturing method of the polishing carrier plate according to the present invention firmly attaches the annular buffer member 4 made of the resin laminate to the holding hole 3 of the metal plate 2 without performing special processing or the like on the metal plate 2. As a result, it is possible to realize a polishing carrier plate that has a small thickness deviation and can cope with a thin object having a thickness of 0.3 mm or less without causing warpage or waviness.

DESCRIPTION OF SYMBOLS 1 Polishing carrier plate 2 Metal plate 3 Holding hole 4 Annular buffer member 4 'Annular resin laminated body 5 Substrate with resin 6 Through hole 7 Gear 8 Hole 11 Sun gear 12 Internal gear 21 Polishing carrier plate of comparative example 22 metal plate 23 holding hole 24 annular buffer member 24 'disk-shaped resin laminate 25 resin base material 26 through hole 27 gear 28 hole

Claims (5)

A method of manufacturing a carrier plate for polishing, comprising a metal plate coated on both sides with a resin-coated base material, and holding holes for holding an object to be polished,
Forming at least one holding hole for holding an object to be polished in a metal plate;
A step of fitting an annular member made of a resin laminate having the same thickness as the metal plate into the holding hole;
Preparing two bases with resin and forming through holes having the same inner diameter as the inner diameter of the annular member at positions corresponding to the holding holes of the metal plate in each of the bases with resin;
The step of pressure-bonding the resin-attached base material to both surfaces of the metal plate, wherein the two resin-attached base materials are arranged on both surfaces of the metal plate so that the through hole and the holding hole overlap. In the state where the annular member is sandwiched between the two substrates with resin, the metal plate and the two substrates with resin are heated and pressed, and the substrate with resin is converted into the metal. The step of crimping each side of the plate,
A step of cutting the annular member fitted in the holding hole, wherein the annular member is cut together with the two substrates with resin, and the inner diameter of the annular member is widened to form an annular shape. Forming a cushioning member, and
Processing the outer periphery of the metal plate in a state in which the two substrates with resin are pressure-bonded into a circular shape, and performing gear processing on the outer periphery,
The polishing carrier plate is characterized in that the annular cushioning member fitted in the holding hole is fixed in a state of being sandwiched between two substrates with resin. Production method.   2. The method for producing a polishing carrier plate according to claim 1, wherein two substrates with resin are formed by applying a resin varnish to a substrate and drying the substrate.   A resin varnish is applied to the substrate and dried to form two substrates with resin, and then the two substrates with resin are stacked and heated and pressed to form a resin laminate. The method for producing a polishing carrier plate according to claim 1, wherein the annular member is formed by processing the resin laminate. A polishing carrier plate provided with a holding hole for holding an object to be polished,
A metal plate, and a base with a resin that is pressure-bonded to both surfaces of the metal plate, and having a circular shape with gears formed on the outer periphery;
At least one holding hole is formed in the metal plate,
An annular buffer member formed from an annular member made of a resin laminate is attached to the inner periphery of the holding hole,
The resin-coated base material is provided with a through hole having the same diameter as the inner diameter of the annular buffer member, and the annular buffer member is fixed by pressure bonding to the two resin-coated base materials. A polishing carrier plate fixed in the holding hole.   The polishing carrier plate according to claim 4, wherein the annular buffer member is formed of a resin laminate made of a base material with resin.