JP2019188451A - Iron tip state determination method - Google Patents

Abstract

To provide an iron tip state determination method by which a state of an iron tip can be always accurately determined.SOLUTION: There is provided an iron tip state determination method for determining a state of an iron tip in a soldering device which has: an iron tip which has a solder hole to which a solder piece is supplied, and heats and melts the solder piece at the solder hole; a gas supply source which supplies a gas; and a gas supply passage which communicates the gas supply source and the solder hole with each other, and supplies the gas of a constant flow from the gas supply source to the solder hole. According to this method, a pressure of the gas, which flows in the gas supply passage or in the solder hole, is measured, and a state of the iron tip is determined depending on whether the pressure of the gas, which flows in the gas supply passage or in the solder hole, is changed or not within a prescribed time with an operation signal output time of the soldering device as a reference.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a tip state determination method for determining a tip state provided in a soldering apparatus for soldering components.

  In recent years, many electronic devices are equipped with electronic circuits on which electronic components are mounted. In the electronic circuit, a terminal or wire of the electronic component is inserted into a through hole (through hole) formed in the wiring board, and a tip portion thereof is soldered to a wiring pattern (land) formed around the through hole. Thus, mounting and fixing of electronic components and wires to the wiring board are performed (see Patent Document 1).

  For example, in the invention of Patent Document 1, air is blown onto a solder joint portion, the pressure of the air is measured, and the joining state of the solder joint portion is confirmed based on the measured value. Further, in the invention of Patent Document 2, it is determined whether or not the soldering is completed based on whether or not air passes through the through hole after soldering.

Japanese Patent Laid-Open No. 10-62408 JP 2004-95989 A

  However, in the inventions of Patent Documents 1 and 2, a soldering failure can be detected, but the state of solder during the soldering process cannot be detected.

  Accordingly, an object of the present invention is to provide a tip state determination method and a soldering apparatus that can always accurately determine the state of the tip.

  To achieve the above object, the present invention has a solder hole to which a solder piece is supplied and a tip for heating and melting the solder piece in the solder hole, a gas supply source for supplying gas, and the gas supply source, A tip state determining method for determining a tip state of a soldering apparatus that communicates with the solder hole and includes a gas supply path that supplies a gas at a constant flow rate from the gas supply source to the solder hole. Then, the pressure of the gas flowing in the gas supply path or the solder hole is measured, and the gas flows in the gas supply path or the solder hole within a predetermined time with reference to the time when the operation signal of the soldering device is output. The tip state is determined based on whether or not the gas pressure has changed.

  By measuring the gas pressure with such a configuration, the state of each step of soldering is determined.

  In the above configuration, gas pressure measurement may be started when a soldering start signal is output from the soldering apparatus.

  In the above configuration, the gas flowing in the gas supply path or the solder hole within a predetermined time with reference to the time of signal output starting to move in a direction in which at least one of the soldering device and the object to be soldered contacts. It may be determined that the tip contacts the object based on an increase in pressure.

  In the above configuration, the soldering apparatus further includes a cutting unit that cuts the thread solder into a solder piece having a predetermined length, and the gas supply path is within a predetermined time with reference to a signal output of a cutting start by the cutting unit. It is determined that at least one of charging of the solder piece into the solder hole and melting of the solder piece in the solder hole is performed based on an increase in the pressure of the gas flowing in the solder hole or in the solder hole May be.

  In the above-described configuration, the gas flowing in the gas supply path or the solder hole within a predetermined time with reference to the time of signal output in which movement of at least one of the soldering apparatus and the object to be soldered starts in a direction away from each other It may be determined that the molten solder piece has flowed out of the solder hole based on the decrease in pressure.

  In the above configuration, the amount of movement in the separating direction is in the range of 0.2 mm or more and 2 mm or less, and the melted solder piece is based on the decrease in the pressure of the gas flowing in the gas supply path or the solder hole. May flow out of the solder holes and determine that normal soldering is performed.

  To achieve the above object, the present invention has a solder hole to which a solder piece is supplied and a tip for heating and melting the solder piece in the solder hole, a gas supply source for supplying gas, and the gas supply source, A gas supply path that communicates with the solder hole and supplies a constant flow rate of gas from the gas supply source to the solder hole; and a measurement unit that measures the pressure of the gas flowing in the gas supply path or in the solder hole; A soldering apparatus comprising: a state determining unit that determines the state of the tip based on the pressure of the gas measured by the measuring unit; and an operation control unit that controls the operation of the device, The determination unit determines the state of the tip using any one of the methods described above.

  According to the tip state determination method and the soldering apparatus according to the present invention, the state of the tip is determined based on the gas pressure in the gas supply path or the solder hole when performing soldering, and during the soldering process It is possible to immediately determine the state of the tip. Further, it is possible to always accurately determine the state inside the solder hole which cannot be observed from the outside.

It is a perspective view of an example of the soldering apparatus of a 1st embodiment. It is sectional drawing cut | disconnected by the II-II line | wire of the soldering apparatus shown in FIG. FIG. 2 is an exploded perspective view of a part of a drive mechanism provided in the soldering apparatus shown in FIG. 1. It is a figure which shows the tip in a reference | standard state. It is a figure which shows the tip in a tip contact state. It is a figure which shows the tip in a solder piece insertion state. It is a figure which shows the tip in a solder piece molten state. It is a figure which shows the tip in the solder piece outflow state. It is a figure which shows the heel in a heel tip separation state (1st step). It is a figure which shows the heel in a heel tip separation state (2nd step). It is a state diagram which determines the soldering state of the land Ld of the wiring board Bd, and the terminal Nd of the electronic component Ep. It is a figure which shows the change of the pressure in a solder hole when a soldering apparatus performs soldering once. It is a figure which shows the other example of the soldering apparatus which concerns on this invention. It is sectional drawing which shows an example of the tip used for the modification of the soldering apparatus which concerns on this embodiment. It is a figure which shows the soldering apparatus of 2nd Embodiment. It is a figure which shows the flow of the tip and nitrogen gas in a tip contact state. It is a figure which shows the flow of the tip and nitrogen gas in a solder piece insertion state. It is a figure which shows the tip and the flow of nitrogen gas in a solder piece molten state. It is a figure which shows the flow of the tip and nitrogen gas in the solder piece outflow state. It is a figure which shows the change of the pressure in a solder hole when a soldering apparatus performs soldering once. It is a figure which shows the soldering apparatus of 3rd Embodiment. It is a figure which shows the soldering apparatus of 4th Embodiment.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view of an example of a soldering apparatus according to the present invention. 2 is a cross-sectional view taken along the line II-II of the soldering apparatus shown in FIG. FIG. 3 is an exploded perspective view of a part of the drive mechanism provided in the soldering apparatus shown in FIG. In FIG. 1, a part of the housing and the support unit 1 is cut to display the inside of the soldering apparatus.

  As shown in FIG. 1, the soldering apparatus A supplies the wire solder W from above, and uses the rivet 5a provided at the lower part to provide a wiring board Bd disposed below the rivet 5a, and an electronic component. This is a device for soldering Ep. As shown in FIGS. 1 and 2, the soldering apparatus A includes a support unit 1, a cutter unit 2, a drive mechanism 3, a heater unit 4, a flange 5a, a solder feed mechanism 6, and a gas flow rate adjustment unit 7a. .

  The support portion 1 includes a flat plate-like wall body 11 that is erected. In the following description, for convenience, as shown in FIG. 1, the horizontal direction along the wall body 11 is the X direction, the horizontal direction perpendicular to the wall body 11 is the Y direction, and the vertical direction along the wall body 11 is the Z direction. To do. For example, as shown in FIG. 1, the wall 11 has a ZX plane.

  The soldering apparatus A supplies and fixes the molten solder to the wiring board Bd attached to the jig Gj and the terminal Nd of the electronic component Ep arranged on the wiring board Bd. When soldering, the jig Gj is moved in the X direction and the Y direction to position the wiring board Bd with the land Ld. Further, the soldering apparatus A is movable in the Z direction, and the tip of the hook 5a can be brought into contact with the land Ld by moving in the Z direction after positioning.

  The support part 1 includes a wall body 11, a holding part 12, a sliding guide 13, and a heater unit fixing part 14. The wall body 11 is a flat wall body erected in the vertical direction. The wall body 11 serves as a support member for the soldering apparatus A. The holding portion 12 is fixed at a position shifted upward from the lower end portion in the Z direction of the wall body 11. The holding unit 12 holds an air cylinder 31 described later of the drive mechanism 3. The heater unit fixing portion 14 is a member that fixes the heater unit 4, and is provided at an end portion (lower end portion) of the wall body 11 in the Z direction.

  The sliding guide 13 is fixed near the lower end of the wall 11 in the Z direction. The sliding guide 13 is fixed to the wall 11 together with a cutter lower blade 22 described later of the cutter unit 2, and guides a cutter upper blade 21 described later of the cutter unit 2 so as to be slidable in the X direction.

  The sliding guide 13 is a member that makes a pair in the Y direction. The sliding guide 13 has a pair of wall portions 131 and a retaining portion 132. The wall 131 is a flat plate member extending in the X direction. One wall portion 131 is arranged in contact with the wall body 11, and the surface on the side opposite to the wall body 11 is in contact with the cutter lower end 22. Further, the other wall 131 is in contact with the side surface of the cutter lower blade 22. That is, the pair of wall portions 131 sandwich the cutter lower blade 22 from both sides in the Y direction. And a pair of wall part 131 and the cutter lower blade 22 are fastened together with the wall body 11 with fasteners, such as a screw, and are fixed.

  The retaining portion 132 is provided on each of the pair of wall portions 131. The pair of wall portions 131 extends in the Z direction from the upper surface of the cutter lower blade 22 in the Z direction, and extends from the upper end portions in the Z direction of the pair of wall portions 131 toward the other. That is, the sliding guide 13 includes a pair of retaining portions 132. And the front-end | tip of the Y direction of each of a pair of retaining part 132 does not contact, in other words, the sliding guide 13 has an opening in the upper part. The cutter upper blade 21 is at least partially disposed between the upper surface of the cutter lower blade 22 and the retaining portion 132. Thereby, the cutter upper blade 21 is guided in the X direction and is prevented from coming off in the Z direction.

  The cutter unit 2 is a cutting tool that cuts the thread solder W fed by the solder feeding mechanism 6 into solder pieces Wh having a predetermined length. The cutter unit 2 includes a cutter upper blade 21, a cutter lower blade 22, and a pusher pin 23.

  As described above, the cutter lower blade 22 is fixed to the wall body 11 together with the sliding guide 13. As shown in FIG. 2, the cutter lower blade 22 includes a lower blade hole 221 and a gas inflow hole 222. The lower blade hole 221 is a through-hole penetrating the cutter lower blade 22 in the Z direction, and thread solder W penetrating an upper blade hole 211 described later of the cutter upper blade 21 is inserted therein. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. Using the upper blade hole 211 and the lower blade hole 221, the thread solder W is cut into solder pieces Wh having a predetermined length. The cut solder piece Wh is pushed down by its own weight or by the pusher pin 23 and falls down in the lower blade hole 221. The lower blade hole 221 communicates with a later-described solder hole 51 of the flange 5a through a later-described solder supply hole 422 of the heater unit 4. The solder piece Wh dropped inside the lower blade hole 221 reaches the solder supply hole 422 and then falls into the solder hole 51.

  The gas inflow hole 222 is a hole that communicates the outer surface of the cutter lower blade 22 and the lower blade hole 221. A pipe 70 a for supplying gas is connected to the outside of the gas inflow hole 222. That is, the gas supplied from the pipe 70 a flows into the gas inflow hole 222. Then, the gas passes through the lower blade hole 221 and the solder supply hole 422 and reaches the solder hole 51. The gas is used to suppress solder oxidation when the solder is heated and melted. That is, it is a gas for suppressing contact between molten solder and oxygen. Examples of the gas include nitrogen gas, argon gas, helium gas, carbon dioxide, and the like. In the soldering apparatus A of this embodiment, it demonstrates as what supplies nitrogen gas. In the present embodiment, the pipe 70a, the gas inflow hole 222, and the solder supply hole 422 constitute a gas supply path for supplying gas from the gas supply source GS1 to the solder hole 51. Since the upper blade hole 211 and the lower blade hole 221 communicate with each other when the thread solder W is supplied, a part of the nitrogen gas from the gas inflow hole 222 is removed from the upper blade hole 211. Released to the outside.

  As described above, the cutter upper blade 21 is disposed on the upper surface of the cutter lower blade 22 in the Z direction. The cutter upper blade 21 is guided by the sliding guide 13 so that the sliding direction becomes the X direction when sliding, and is prevented from coming off in the Z direction. That is, the cutter upper blade 21 slides in the X direction on the upper surface of the cutter lower blade 22 in the Z direction. The cutter upper blade 21 is slid by the drive mechanism 3. At this time, since the communication from the lower blade hole 221 to the upper blade hole 211 is lost, the flow from the gas inflow hole 222 to the upper blade hole 211 becomes small.

  The cutter upper blade 21 includes an upper blade hole 211 and a pin hole 212. The upper blade hole 211 is a through-hole penetrating the cutter upper blade 21 in the Z direction, and the thread solder W sent from the solder feeding mechanism 6 is inserted into the upper blade hole 211. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The pin hole 212 is a through hole that penetrates the cutter upper blade 21 in the Z direction. A rod portion 231 described later of the pusher pin 23 is slidably inserted into the pin hole 212.

  The pusher pin 23 includes a rod portion 231, a head portion 232, and a spring 233. The rod portion 231 is a columnar member and is slidably inserted into the pin hole 212. Further, the pusher pin 23 moves downward in the Z direction, so that the tip of the rod portion 23 protrudes from the pin hole 212. The head part 232 is connected to the upper end of the rod part 231 in the axial direction. The head portion 232 has a disk shape having an outer diameter larger than the inner diameter of the pin hole 212. The head portion 232 is not inserted into the pin hole 212. That is, the head portion 232 serves as a so-called stopper that restricts the movement of the rod portion 231 into the pin hole 212.

  The spring 233 is a compression coil spring that surrounds the radially outer side of the rod portion 231. The spring 233 has a lower end in the Z direction in contact with the upper surface of the cutter upper blade 21 and an upper end in the Z direction in contact with the lower surface of the head portion 232. That is, the spring 233 receives a reaction force from the upper surface of the cutter upper blade 21 and pushes the head portion 232 in the Z direction. Accordingly, the rod portion 231 connected to the head portion 232 is lifted upward in the Z direction, and the lower end of the rod portion 231 is maintained so as not to protrude from the lower end of the pin hole 212. Note that a stopper (not shown) that prevents the pin hole 212 from coming off is provided at the lower end of the rod portion 231 in the Z direction.

  The pusher pin 23 pushes the solder piece Wh cut by the cutter upper blade 21 and the cutter lower blade 22 and remaining in the lower blade hole 221 downward. The pusher pin 23 is always pushed upward by the elastic force of the spring 233, that is, on the side opposite to the cutter lower blade 22. That is, the rod portion 231 protrudes downward from the lower end portion in the Z direction of the pin hole 212 when the head portion 232 is pushed. Then, the head portion 232 is pushed by a cam member 33 described later of the drive mechanism 3.

  In the cutter upper blade 21, the upper blade hole 211 and the pin hole 212 are provided side by side in the X direction. The cutter upper blade 21 slides in the X direction to move to a position where the upper blade hole 211 and the lower blade hole 221 overlap vertically or a position where the pin hole 212 and the lower blade hole 221 overlap vertically. . When the cutter upper blade 21 slides to one sliding end, the upper blade hole 211 and the lower blade hole 221 overlap, and when the cutter upper blade 21 slides to the other sliding end, You may slide so that the blade hole 221 may overlap.

  When the thread solder W is sent from the solder feeding mechanism 6 in a state where the upper blade hole 211 and the lower blade hole 221 overlap with each other in the Z direction, the thread solder W that has passed through the upper blade hole 211 is transferred to the lower blade hole. 221 is inserted. As described above, the lower edge portion of the upper blade hole 211 is formed in a cutting edge shape, and the upper edge portion of the lower blade hole 221 is also formed in a cutting blade shape. The lower surface of the cutter upper blade 21 is in contact with the upper surface of the cutter lower blade 22. Therefore, when the thread solder W is inserted into the lower blade hole 221, the cutter upper blade 21 slides in the X direction, so that the thread solder W is cut by the upper blade hole 211 and the lower blade hole 221. Disconnected.

  The cutter upper blade 21 is slid in the X direction by the cam member 33. Therefore, the cutter upper blade 21 and the pusher pin 23 are synchronized with the cam member 33. The cam member 33 pushes the head portion 232 when the pin hole 212 overlaps the lower blade hole 221 in the Z direction. Therefore, when the cutter upper blade 21 slides in the X direction, the tip of the rod portion 231 of the pusher pin 23 is accommodated in the pin hole 212. Therefore, when the cutter upper blade 21 slides in the X direction, contact between the tip of the rod portion 231 and the upper surface of the cutter lower blade 22 is suppressed, and the tip of the rod portion 231 and / or the cutter lower blade 22 is suppressed. Deformation, breakage, etc. are suppressed.

  As the cutter upper blade 21 slides in the X direction, the lower blade hole 211 and the pin hole 212 overlap in the Z direction. The head portion 232 is pushed by the cam member 33 in a state where the pin hole 212 overlaps the lower blade hole 211. As a result, the pusher pin 23 moves downward in the Z direction. When the pusher pin 23 protrudes downward in the Z direction from the pin hole 212, a part of the pusher pin 23 is inserted into the lower blade hole 211. When a solder piece (described later) obtained by cutting the thread solder remains at the entrance of the lower blade hole 211, the tip of the pusher pin 23 pushes the solder piece, and the solder piece falls.

  As shown in FIGS. 1 and 2, the drive mechanism 3 includes an air cylinder 31, a piston rod 32, a cam member 33, a slider portion 34, and a guide shaft 35. The air cylinder 31 is held by the holding unit 12. The air cylinder 31 has a bottomed cylindrical shape. A piston rod 32 is housed inside the air cylinder 31 and is slidably driven (expanded / contracted) by the pressure of air supplied from the outside. The air cylinder 31 and the piston rod 32 constitute an actuator of the drive mechanism 3. The piston rod 32 is disposed inside the air cylinder 31, and a part of the piston rod 32 always protrudes from one end of the air cylinder 31 in the axial direction (here, the lower end in the Z direction). The air cylinder 31 is held by the holding unit 12 so that the surface from which the piston rod 32 protrudes faces the cutter unit 2, that is, faces downward in the Z direction.

  The piston rod 32 passes through a through hole (not shown) provided in the holding unit 12. The piston rod 32 is provided in parallel with the guide shaft 35 and reciprocates linearly along the guide shaft 35. The distal end portion of the piston rod 32 is fixed to the cam member 33, and the cam member 33 slides in the Z direction by the expansion and contraction of the piston rod 32. The sliding of the cam member 33 is guided by the guide shaft 35.

  As shown in FIG. 2, the guide shaft 35 has a lower end fitted in a recessed hole provided in the cutter lower blade 22, and is fixed to the cutter lower blade 22 with a screw 351. Further, the upper portion of the guide shaft 35 passes through a hole provided in the holding portion 12, and movement is restricted by the pin 352. In other words, the guide shaft 35 is fixed to the cutter lower blade 22 by the screw 351 and the holding portion 12 by the pin 352.

  In this embodiment, the guide shaft 35 is fixed by the screw 351 and the pin 352. However, the guide shaft 35 is not limited to this, and is fixed by a fixing method such as press fitting or welding. Also good. In the present embodiment, the guide shaft 35 is a cylindrical member, but is not limited thereto, and a polygonal cross section, an ellipse, or the like may be used.

  As shown in FIGS. 2 and 3, the cam member 33 is a rectangular member, and is connected to the recess 330 having a part of the long side cut out in a rectangular shape and the cam member 33, and the guide shaft 35 passes therethrough. And a cylindrical support portion 331 having a through-hole. The slider part 34 is slidably disposed in the recess 330 (in the X direction and the Z direction). Further, the support portion 331 has a shape extending in parallel with the guide shaft 35 and is provided in order to suppress rattling of the cam member 33. That is, when the cam member 33 has a certain thickness and is unlikely to generate rattling, the cylindrical portion may be omitted, and the support portion 331 may be configured only by the through hole.

  The cam member 33 is provided at an intermediate portion of the recess 330 and has a cylindrical pin 332 whose central axis is orthogonal to the guide shaft 35, a pin pressing portion 333 that presses the pusher pin 23 adjacent to the recess 330, and a support And a bearing 334 disposed inside the portion 331. The pin 332 is inserted into a cam groove 340 described later provided in the slider portion 34. Further, the bearing 334 is a member that is fitted on the guide shaft 35 and is slid smoothly so that the cam member 33 does not rattle.

  As shown in FIGS. 2 and 3, the slider portion 34 is a rectangular plate-like member, and is formed integrally with the cutter upper blade 21. The slider portion 34 includes a cam groove 340 that penetrates in the plate thickness direction and extends in the longitudinal direction. The cam groove 340 has a first groove part 341 extending in parallel with the guide shaft 35 on the upper side and a second groove part 342 extending in parallel with the guide shaft 35 on the lower side. The first groove portion 341 and the second groove portion 342 are provided so as to be shifted in the X direction, and the cam groove 340 includes a connection groove portion 343 that connects the first groove portion 341 and the second groove portion 342.

  A pin 332 of the cam member 33 is inserted into the cam groove 340, and the pin 332 slides on the inner surface of the cam groove 340 as the cam member 33 moves along the guide shaft 35. When the pin 332 is positioned in the connection groove 343 of the cam groove 340, the inner surface of the connection groove 343 is pushed. Thus, the slider part 34 and the cutter upper blade 21 formed integrally with the slider part 34 move in the direction (X direction) intersecting the sliding direction (Z direction) of the cam member 33 (with respect to the cutter lower blade 22). Slide).

  In the present embodiment, the cam member 33 is described with a pin 332 and the slide portion 34 is provided with a cam groove 340. In practice, however, the cam member is provided with a cam groove and the slide portion is provided with a pin. It may be a configuration.

  In the present embodiment, air pressure is used as the actuator of the drive mechanism 3, but the present invention is not limited to this and may be one (hydraulic pressure) using a fluid (for example, hydraulic oil) other than air. Moreover, it is not limited to what uses a fluid, You may use electric power, such as a motor and a solenoid. In the present embodiment, the cutter upper blade 21 is slid and the pusher pin 23 is pressed using one actuator, a cam, and a cam groove. However, the present invention is not limited to this. For example, a plurality (two) of actuators may be provided so that the cutter upper blade 21 slides and the pusher pin 23 is pressed.

  As shown in FIGS. 1 and 2, the solder feeding mechanism 6 supplies the thread solder W. The solder feed mechanism 6 includes a pair of feed rollers 61 and a guide tube 62. The pair of feed rollers 61 are rotatably attached to the support wall 11. The pair of feed rollers 61 feeds the thread solder downward by rotating across the side surface of the thread solder W. The pair of feed rollers 61 are biased toward each other, and the thread solder W is sandwiched by the biasing force. The length of the thread solder W fed out is measured (determined) by the rotation angle (number of rotations) of the feed roller 61.

  The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out. The lower end of the guide tube 62 is provided so as to communicate with the upper blade hole 211 of the cutter upper blade 21. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21, and the guide tube 62 has a length that is not excessively pulled or stretched within the range in which the cutter upper blade 21 slides. And has a shape.

  The heater unit 4 is a heating device for heating and melting the solder piece Wh, and is fixed to the heater unit fixing portion 14 provided at the lower end portion of the wall 22 as shown in FIG. The heater unit 4 includes a heater 41 and a heater block 42. The heater 41 generates heat when energized. Here, the heater 41 has a heating wire wound around the outer peripheral surface of a cylindrical heater block 42.

  The heater block 42 has a cylindrical shape, and has a concave section 421 having a circular cross section for attaching the hook 5a to an end in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the concave section 421 to the opposite side. And. The heater block 42 is provided in contact with the cutter lower blade 22 so that the solder supply hole 422 and the lower blade hole 221 communicate with each other. By providing the heater block 42 in this manner, the solder piece Wh moves from the lower blade hole 221 to the solder supply hole 422.

  The tip 5a is a cylindrical member, and includes a solder hole 51 extending in the axial direction at the center. The hook 5a is inserted into the recess 421 of the heater block 42, and is prevented from coming off by a member not shown. Also, the solder hole 51 of the tip 5a communicates with the solder supply hole 422 of the heater block 42, and the solder piece Wh is sent from the solder supply hole 422.

  The tip 5a receives heat from the heater 41 and melts the solder piece Wh with the heat. Therefore, the tip 5a is formed of a material having a high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten. In the soldering apparatus A, the tip 5a has a cylindrical shape, but is not limited thereto, and a cylindrical shape having a polygonal cross section or an elliptical shape may be used. Different shapes may be prepared according to the shape of the wiring board Bd to be soldered and / or the terminal Nd of the electronic component Ep.

  The tip 5a has a release hole 53 that connects the solder hole 51 and the outer peripheral surface above the melting region 510 where the solder piece Wh into which the solder hole 51 has been introduced melts, that is, upstream in the direction in which the nitrogen gas flows. I have. When the soldering apparatus A is operated as will be described later, the release hole 53 may be clogged with the lower end opening of the solder hole 51 by molten solder. In such a case, the release hole 53 is supplied from the gas supply source GS1. It plays the role of releasing nitrogen gas, vaporized flux, etc. out of the tip 5a. Note that the inner diameter of the release hole 53 is smaller than the inner diameter of the solder hole 51. That is, the release hole 53 has a larger flow path resistance than the solder hole 51.

  In addition, the tip 5 a includes a pressure measurement hole 54 that connects the solder hole 51 and the outer peripheral surface upstream of the melting region 510 in the nitrogen gas flow direction. The pressure measurement hole 54 is a hole for measuring the pressure in the solder hole 51, and the inner diameter of the pressure measurement hole 54 is smaller than the inner diameter of the solder hole 51, similar to the release hole 53. That is, the pressure measurement hole 54 has a larger flow path resistance than the solder hole 51. The position in the axial direction of the pressure measurement hole 54 in the tip 5a may be the same position as the release hole 53 or may be a different position. As described above, contamination of the pressure measurement hole 54 due to vaporized flux can be reduced.

  The gas flow rate adjusting unit 7a adjusts the gas supplied from the gas supply source GS1 provided outside the soldering apparatus A to a constant flow rate. By using the inert gas described above as the gas, it is possible to prevent the solder from being oxidized. As shown in FIG. 2, the gas flow rate adjustment unit 7 a includes a first adjustment unit 71 and a first measurement unit 72. The pipe 70 a allows the nitrogen gas that has been made a constant flow rate by the gas flow rate adjusting unit 7 a to flow into the gas inflow hole 222. In FIG. 2, for convenience, the piping 70 a is shown as a diagram, but in actuality, it is a tube body (for example, a resin tube) that does not leak nitrogen gas.

  The 1st adjustment part 71 is the structure containing a flow control valve, and is adjusting the flow volume of nitrogen gas. The first measuring unit 72 measures the flow rate of nitrogen gas. That is, the first measuring unit 72 measures the flow rate of nitrogen gas discharged from the first adjusting unit 71. And the 1st measurement part 72 is transmitting the control signal which controls the 1st adjustment part 71 with respect to the 1st adjustment part 71 so that the flow volume of the measured nitrogen gas may turn into a predetermined flow volume. . That is, the gas flow rate adjustment unit 7a performs feedback control using the first adjustment unit 71 and the first measurement unit 72, and makes the flow rate of nitrogen gas supplied from the gas supply source GS1 to the solder hole 51 constant. I have control. Note that the operator may manually operate the first adjustment unit 71 based on the measurement result of the first measurement unit 72 to adjust the flow rate of the nitrogen gas. Further, when the flow rate measured due to some abnormality is different from a predetermined reference value or deviates from a preset range, the control unit CN gives an alarm that an abnormality has occurred and / or operates the soldering apparatus. May be stopped.

  One end of the pressure measurement pipe 8 is connected to the outer opening of the pressure measurement hole 54 formed in the tip 5a. A pressure measurement unit 75 is connected to the other end of the pressure measurement pipe 8. The pressure measurement unit 75 measures the pressure inside the solder hole 51, and the measurement result is transmitted to the state determination unit CN1 of the control unit CN. On the other hand, the operation control unit CN2 of the control unit CN controls the operation of the soldering apparatus A. As the operation control of the soldering apparatus A, for example, approach and separation of the soldering apparatus A to the substrate Bd, cutting of the thread solder W, heating of the tip 5a, and the like can be mentioned. The operation control signal from the operation control unit CN2 is also sent to the state determination unit CN1. Then, the state determination unit CN1 determines the tip state based on whether or not the pressure inside the solder hole 51 has changed within a predetermined time with reference to the time when the operation signal of the soldering apparatus A is output.

  Next, a determination method for determining the state of the tip based on the pressure change in the solder hole 51 of the tip 5a will be described. In the pipe 70a, it is assumed that all the nitrogen gas flowing into the gas inflow hole 222 flows into the solder hole 51 of the tip 5a. For example, the gas inflow hole 222 communicates with the lower blade hole 221, and the lower blade hole 221 penetrates the cutter lower blade 22 vertically in the Z direction. In the state where nitrogen gas is supplied, the nitrogen gas is sealed so as not to escape from the upper end of the lower blade hole 221 in the Z direction.

  Further, the flow rate of the nitrogen gas flowing through the solder hole 51 of the tip 5a is adjusted by adjusting the gas from the gas supply source GS1 by the first adjusting unit 71. The flow rate control valve provided in the first adjustment unit 71 keeps flowing nitrogen gas at a set flow rate regardless of the pressure inside the solder hole 51. That is, the gas flow rate adjusting unit 7a performs flow rate control with a constant flow rate. In addition, when the pressure change in the solder hole 51 is extremely large, there is no problem as long as the reproducibility is reproducible even if the flow rate value slightly varies depending on the control performance of the gas flow rate adjusting unit 7a.

  In the soldering apparatus A, for example, when the solder piece Wh is supplied to the solder hole 51, the solder piece Wh occupies a part of the cross section orthogonal to the axis of the solder hole 51. For this reason, the flow path area of the portion of the solder hole 51 where the nitrogen gas flows becomes small, and the nitrogen gas hardly flows, that is, the flow path resistance increases. When the flow path resistance of the solder hole 51 increases, the pressure P1 in the solder hole 51 increases. That is, the pressure P <b> 1 in the solder hole 51 varies as the tip state changes. The state determination unit CN1 determines the state of the tip based on the presence or absence of the change in the pressure P1. For example, the state determination unit CN1 determines whether or not the pressure P1 in the solder hole 51 has increased within a predetermined time with reference to the time when the approach start signal is output from the operation control unit CN2 to the substrate Bd of the soldering apparatus A. Based on this, the state of the tip is determined.

  Below, the change of the pressure P1 in the solder hole 51 in each state of the tip will be described with reference to the drawings. 4-11 is a figure which shows the operation | movement of a soldering apparatus, or the state of a tip. FIG. 12 is a diagram showing a change with time of the pressure P1 in the solder hole 51 when the soldering operation is performed once by the soldering apparatus. In the present embodiment, it is assumed that the substrate Bd is a through-hole substrate and the terminal Nd inserted into the through-hole Th is soldered.

  In the present embodiment, as the tip state, (a) a reference state, (b) a tip contact state, (c) a solder piece inserted state, (d) a solder piece melted state, (e) a solder piece outflow state, ( f) A description will be given of six states in which the tip is separated. In the soldering apparatus A, each state changes in order from (a) to (f) at the time of one soldering.

(A) Reference State FIG. 4 is a view showing the tip of the soldering apparatus in the reference state. As shown in FIG. 4, in the soldering apparatus A, in the previous stage of soldering (for example, preheating the tip 5a, changing the substrate Bd to be soldered, etc.), the tip 5a is separated from the substrate Bd. In the initial position. In this embodiment, the state in which the tip 5a is in the initial position away from the substrate Bd is set as the reference state. In the reference state, the solder hole 51 is open to the atmosphere at the lower end in the Z direction. In the present embodiment, when the soldering apparatus A is in the reference state, the heater unit 4 is driven to heat the tip 5a. When the supply of nitrogen gas from the gas supply source GS1 is started in the reference state, the nitrogen gas is adjusted to the flow rate Q1 in the gas flow rate adjusting unit 7a.

  As shown in FIG. 4, in the standard state of the soldering apparatus A, the lower end of the solder hole 51 of the tip 5a is open to the atmosphere at the lower end in the Z direction. Therefore, even if nitrogen gas is supplied from the gas supply source GS1 to the solder hole 51, the pressure P1 in the solder hole 51 is constant. The pressure P1 in the solder hole 51 in the reference state is defined as a pressure P1a. In the reference state, the tip 5a has a small amount of nitrogen gas flowing from the release hole 53 to the outside because the lower end of the solder hole 51 is released to the atmosphere.

(B) Tip Contact State FIG. 5 is a diagram showing the tip of the soldering apparatus in the tip contact state. When an approach start signal is output from the operation control unit CN2 to the board Bd of the soldering apparatus A, the soldering apparatus A moves downward in the Z direction, and the tip 5a contacts the land Ld of the board Bd. In the soldering apparatus A, the tip 5a is brought into contact with the land Ld to raise the temperature of the land Ld to a temperature suitable for soldering (preheating).

  Then, when the tip 5a contacts the land Ld, a part of the lower end opening of the solder hole 51 of the tip 5a is blocked by the land Ld. The substrate Bd is for soldering the terminal Nd penetrating the through hole Th, and the upper end portion in the Z direction of the terminal Nd of the electronic component is inserted into the solder hole 51 as shown in FIG. Further, the nitrogen gas that has passed through the solder hole 51 flows out from the through hole Th in which the terminal Nd is inserted.

  The portion of the through hole Th into which the terminal Nd is inserted through which the nitrogen gas escapes is the flow path of the nitrogen gas, and the flow path area is smaller than the cross-sectional area cut along the plane perpendicular to the axis of the solder hole 51. In the state of contact with the tip, a flow path resistance is formed on the tip end side of the solder hole 51, that is, the flow path resistance in the solder hole 51 becomes larger than the reference state. Thereby, the pressure P1b of the nitrogen gas in the solder hole 51 in the tip contact state becomes higher than the pressure P1a in the reference state. The pressure P1 in the solder hole 51 changes depending on the contact state of the tip 5a with the substrate Bd, but the contact state can be made uniform by a displacement sensor or a weight sensor, and the contact state of the tip 5a is detected. By doing so, the determination criterion may be changed.

(C) Solder piece insertion state FIG. 6 is a diagram showing the tip of the soldering apparatus in the solder piece insertion state. In the soldering apparatus A, the tip 5a contacts the land Ld, preheating is performed, and after the land Ld is heated to an appropriate temperature, a cutting signal of the thread solder W is output from the operation control unit CN2. Then, the solder feeding mechanism 6 and the cutter unit 2 are operated, and the thread solder W is cut into a predetermined length by the cutter upper blade 21 and the cutter lower blade 22 to become a solder piece Wh, and is pushed by its own weight or the pusher pin 23. It is put into the solder hole 51. The preheating of the land Ld may be controlled by directly detecting the temperature of the land Ld with a temperature sensor and controlling the temperature by the temperature, or by the contact time of the heel 5a and the land Ld.

  The solder piece Wh put into the solder hole 51 comes into contact with the terminal Nd inserted in the solder hole 51 and stops inside the solder hole 51. Thus, when the solder piece Wh stops in the middle of the solder hole 51, the flow passage area through which the nitrogen gas in the solder hole 51 passes becomes smaller. Thereby, the flow resistance in the solder hole 51 becomes larger when the solder piece is in the charged state than when the tip is in contact. And the pressure P1c in the solder hole 51 at the time of a solder piece insertion state becomes higher than the pressure P1b at the tip contact state.

(D) Solder piece melted state FIG. 7 is a diagram showing the tip of the soldering apparatus in the solder piece melted state. In the soldering apparatus A, the tip 5a is heated by the heater unit 4, and the solder piece Wh put in the solder hole 51 is heated and melted by the tip 5a. The molten solder piece Wh becomes a highly viscous liquid. Then, the solder hole 51 is closed by the molten solder piece. As a result, the nitrogen gas does not leak to the outside from the lower end opening of the solder hole 51 or becomes difficult to leak, and most of the nitrogen gas is released to the outside from the release hole 53 having a smaller inner diameter than the solder hole 51 and a large flow resistance. become.

  As a result, when the solder piece Wh is melted, the pressure P1d of the nitrogen gas in the solder hole 51 becomes higher than the pressure P1c in the solder piece insertion state.

(E) Solder Piece Outflow State FIG. 8 is a diagram showing the tip of the soldering apparatus in the solder piece outflow state. When the molten solder piece Wh flows out, the lower end portion in the Z direction of the solder hole 51 is blocked by the molten solder blocking the land Ld and the through hole Th. Thereby, nitrogen gas does not leak to the outside from the lower end opening of the solder hole 51 or is difficult to leak. Then, most of the nitrogen gas is released to the outside through the release hole 53 having a smaller inner diameter than the solder hole 51 and a larger flow path resistance.

  As a result, the pressure P1 of the nitrogen gas in the solder hole 51 is equal to or substantially equal to the pressure in the solder piece molten state. Since the tip 5a is always heated by the heater unit 4, all the melted solder pieces Wh flow out of the tip 5a, that is, to the land Ld and the terminal Nd of the electronic component Ep.

(F) Tip Tip Separation State FIGS. 9 and 10 are diagrams showing the tip of the soldering apparatus in the tip tip separation state. In the soldering apparatus A, when the soldering between the land Ld and the terminal Nd of the electronic component Ep is finished, a separation start signal S3 from the substrate Bd of the tip 5a is output from the operation control unit CN2. Note that the determination of the end of soldering is set, for example, after a predetermined time from when the yarn solder W cutting signal S2 is output.

  Here, depending on the separation distance of the tip 5a from the land Ld, it is possible to determine the soldered state of the molten solder piece Wh along with the outflow of the molten solder piece Wh from the solder hole 51. In this case, the tip 5a is separated from the land Ld in at least two stages. First, as a first stage, after the separation signal S3 from the land Ld of the tip 5a is output from the operation control unit CN2, a separation stop signal S4 is output from the operation control unit CN2 after a predetermined time. As a result, the tip 5a stops when the lower end of the tip 5a and the land Ld are separated by a distance G as shown in FIG.

  At this time, the distance G between the tip 5a and the land Ld is such that the solder does not contact the inner peripheral surface of the solder hole 51 when soldering is normal, and the solder This is the distance with which the inner peripheral surface of the solder hole 51 comes into contact. FIG. 11 shows an explanatory diagram. FIG. 11A shows the case where the land Ld and the terminal Nd are normally soldered, and the melted and solidified solder has a symmetrical conical shape with the center in the vertical direction as an axis. On the other hand, FIG. 11B shows a case where a so-called potato solder is formed, and the molten solder does not flow to the back surface side of the substrate Bd, but has a shape that rises like a dome on the front surface side. The separation distance G between the tip 5a and the land Ld is set such that the lower end of the tip 5a does not contact normal solder and does not contact the solder.

  Thereby, when soldering is normally performed when the tip 5a is separated from the land Ld by the distance G, nitrogen gas flows out from the gap between the lower end opening of the solder hole 51 and the solder. The pressure P1 in the solder hole 51 is lower than the pressure P1d in the solder piece outflow state. At this time, it may be determined that the soldering is completed, and the tip 5a may be continuously separated. On the other hand, when potato solder is formed, a gap is not formed between the lower end opening of the solder hole 51 and the solder, and the nitrogen gas in the solder hole 51 does not leak to the outside or is difficult to leak. The pressure P1 is equal to or slightly lower than the pressure P1d in the solder piece outflow state. At this time, it may be determined that the heating is insufficient, and the movement of the tip 5a may be stopped until the solder is melted normally.

  The separation distance G is appropriately determined based on the volume of the supplied solder piece Wh, the shape of the solder hole 51, and the like, and based on a preliminary experiment, and is usually in the range of 0.2 mm to 2 mm. Further, there is no particular limitation on the separation speed of the tip 5a when the tip 5a and the land Ld are separated to the distance G. However, from the viewpoint of the measurement accuracy of the pressure P1, etc., it is 0.1 mm / sec to 10 mm / sec. A range is preferred. More preferably, it is the range of 0.2 mm / sec-2 mm / sec. The time for holding the heel 5a at the separation distance G is preferably in the range of 0.1 sec to 2 sec.

  Next, a separation start signal S5 of the tip 5a from the substrate Bd is output from the operation controller CN2, and the tip 5a is greatly separated from the land Ld as shown in FIG. In the solder piece outflow state, all or almost all of the molten solder piece Wh has flowed out of the solder hole 51. Therefore, when the tip 5a is further separated from the land Ld, the solder hole 51 is in a state before soldering. That is, the state returns to the same state as the reference state. Thereby, the pressure P1f of the nitrogen gas in the solder hole 51 is substantially the same as the pressure P1a that is the same as that in the reference state.

  As described above, the pressure P in the solder hole 51 varies depending on each state of the tip 5a. Therefore, the state determination unit CN1 determines whether the pressure P1 in the solder hole 51 obtained from the pressure measurement unit 75 has changed within a predetermined time with reference to the time when the operation signal of the soldering apparatus A transmitted from the operation control unit CN2 is output. The tip state is determined based on whether or not.

  In the soldering apparatus A, the tip state is (a) the reference state, (b) the tip contact state, (c) the solder piece inserted state, (d) the solder piece melted state, (e) the solder piece outflow state, ( f) It changes in the order of the tip separation state. The pressure P1 in the solder hole 51 in each state is as shown in the graph shown in FIG. FIG. 12 shows a change in the pressure P1 in the solder hole 51 when the soldering apparatus A performs soldering once. In FIG. 12, the vertical axis represents pressure P1, and the horizontal axis represents time. Note that the pressure values P1a, P1b, P1c, P1d, P1e, and P1f shown in FIG. 12 are all reference values.

  As shown in FIG. 12, the first area Ar1 is when the tip is in the reference state, and the pressure in the solder hole 51 is the pressure P1a in the first area Ar1. In the second region Ar2, the tip is in the tip contact state, and when the tip changes from the reference state to the tip contact state, the tip 5a abruptly changes from the pressure P1a to the pressure P1b due to the contact with the land Ld. That is, the change from the first region Ar1 to the second region Ar2 is steep.

Therefore, the contact from the operation control unit CN2 to the soldering apparatus soldering tip 5a is a land Ld when pressure increases in the solder hole 51 to the output time t ₁ hour S ₀ as a reference of the approach start signal to the substrate Bd of A It is determined that On the other hand, if the pressure in the solder hole 51 does not increase within the time t ₁ from the output of the approach start signal S _0, the controller CN is abnormal because the tip 5a is not in contact with the land Ld. A warning to the effect and / or stop the operation of the soldering device. The time t ₁ can be set as appropriate by the user, and the time from the initial position until the tip 5a contacts the land Ld is measured in advance, and the measurement time may be set and input. Incidentally, it is also possible to start measuring the pressure of the solder hole 51 from the detection of the approach start signal S _0. Further, since the rapid movement of the tip 5a causes a pressure fluctuation, the measurement may be stopped or the measured value may be excluded during that time.

Further, when the stricter condition determination is previously set reference pressure P1b of the increased pressure in the solder hole 51, approaching start signal S ₀ soldering hole during t ₁ hour, based on the output of the 51 A more detailed state of the tip 5a may be determined depending on whether or not the internal pressure has reached the reference pressure P1b. For example, when only a part of the tip 5a is in contact with the land Ld due to deformation such as bending of the land Ld, the pressure in the solder hole 51 increases due to the contact of the tip 5a with the land Ld, but the reference pressure is increased. Since P1b is not reached, the malfunction can be detected.

  Next, in the third region Ar3 in FIG. 12, the tip shows the solder piece insertion state, and by inserting the solder piece Wh into the solder hole 51, a part of the flow path of the solder hole 51 is blocked. Since the road resistance suddenly increases, the pressure P1b changes rapidly to the pressure P1c. That is, in FIG. 12, the change from the second region Ar2 to the third region Ar3 is steep.

Therefore, it is determined from the operation control unit CN2 and wire solder W solder pieces Wh into the soldering tip in 5a when pressure increases in the output when S ₂ soldering holes 51 t in ₂ hours as a reference cutting signal is turned . On the other hand, if the pressure in the solder hole 51 does not increase within t ₂ hours from the output of the cutting signal S _2, the control unit CN is abnormal because the solder piece Wh is not put into the tip 5. An alarm to the effect and / or stop the operation of the soldering device. t ₂ hours can be set as appropriate by the user, the solder pieces from the cutting signal output wire solder may be set inputs the measured time measured in advance the time to be put into the soldering tip 5a. Note that the determination criterion can be changed depending on the outer diameter and length of the solder piece Wh or the inner diameter of the solder hole 51.

Further, more in the case of performing the exact state determination is previously set reference pressure P1c the increased pressure in the solder hole 51, disconnection signal S the solder hole 51 t in ₂ hours, based on the time of output of ₂ A more detailed state of the tip 5a may be determined depending on whether or not the pressure reaches the reference pressure P1c. For example, when the length (size) of the solder piece Wh cut from the thread solder W is different from a predetermined length, the pressure in the solder hole 51 is increased by inserting the solder piece Wh into the tip 5a. When the solder piece Wh is longer than the predetermined length, the pressure in the solder hole 51 becomes larger than the reference pressure P1c. On the contrary, when the length of the solder piece Wh is shorter than the predetermined length, the pressure in the solder hole 51 becomes smaller than the reference pressure P1c. Therefore, it is possible to detect whether or not the solder piece Wh thrown into the solder hole 51 has a predetermined length by comparing the measured pressure in the solder hole 51 with the reference pressure P1c.

  In the fourth region Ar4 in FIG. 12, the tip shows a solder piece molten state, and the solder hole 51 is blocked by the melting of the solder piece Wh, so the flow path resistance increases. In the melting of the solder piece Wh, first, the flux is melted relatively slowly, and then the solder is melted rapidly. The pressure P1c increases to the pressure P1d slowly at first, and then increases rapidly after a certain change. That is, in FIG. 12, the change from the third region Ar3 to the fourth region Ar4 is initially slow and then rapidly increases.

Therefore, the solder in the soldering tip in 5a be increased than the pressure the pressure P1c within the operation control unit CN2 output when S ₂ t ₂ hours after t ₃ hours based on the cleavage signal wire solder W solder hole 51 It is determined that the piece Wh has melted. On the other hand, when the pressure in the disconnect signal S solder holes 51 t in ₂ hours after t ₃ hours from the time of output of ₂ is not increased, the solder pieces Wh is insufficient molten or not melted The control unit CN performs an alarm indicating that an abnormality has occurred and / or stops the operation of the soldering apparatus. Incidentally, t ₃ hours can be set as appropriate by the user, the solder pieces from the cutting signal output wire solder may be set enter the time previously measured by advance the measurement of the time until the melt.

Further, when the stricter condition determination is previously set reference pressure P1d the increased pressure in the solder hole 51, disconnection signal S ₂ of the time of output to t within ₂ hours after t ₃ hours based A more detailed state of the flange 5a may be determined based on whether or not the pressure in the solder hole 51 has reached the reference pressure P1d. For example, when the pressure in the solder hole 51 increases but does not reach the reference pressure P1d, it can be determined that the solder piece Wh is not sufficiently melted. Note that the determination criteria may be changed when the molten state of the solder piece Wh changes depending on the weight of the solder piece Wh, the physical property value when the solder piece Wh is melted, or the property of the flux contained in the solder piece Wh. .

  5th area | region Ar5 has shown the solder piece outflow state. As described above, the pressure in the solder piece molten state and the pressure in the solder piece outflow state are the same or substantially the same, and the change from the pressure P1d is small for a certain period of time.

The sixth region Ar6 is a state in which the tip 5a is separated from the land Ld by the distance G, and when normal soldering is performed, the outer region is exposed from the gap between the melted and solidified solder and the inner peripheral surface of the solder hole 51. The pressure in the solder hole 51 decreases from the pressure P1d to the pressure P1e. The operation control unit CN2 After outputting the first spacing start signal _{S 3} from the land Ld of soldering tip 5a, and outputs the separation stop signal _{S 4.} The output timing of spaced stop signal S ₄ is when the distance between the soldering tip 5a and the land Ld reaches the distance G, is calculated from the distance G of the separating speed of the soldering tip 5a.

Therefore, if decrease the pressure P1 of the output when _{S 3} the solder hole 51 in the _{t 4} hours based on the spaced start signal from the land Ld of soldering tip 5a from the operation control unit CN2 from the pressure P1d, solder piece Wh is It is determined that normal soldering has been performed by melting and flowing out. On the other hand, when the pressure P1 in the solder hole 51 from the time the output of the first spacing start signal S ₃ in t ₄ hours did not decrease, the potato solder (FIG. 11 (b)) soldered not normal such as The control unit CN performs an alarm indicating that an abnormality has occurred and / or stops the operation of the soldering apparatus. Incidentally, t ₄ hours can be set as appropriate by the user, may be set appropriately input in consideration of the travel time from the soldering tip 5a is a land Ld until a predetermined distance G.

  Note that the separation distance G between the tip 5a and the land Ld is such that when soldering is normal, the melted and solidified solder does not contact the inner peripheral surface of the solder hole 51, and potato solder is formed. The distance between the melted and solidified solder and the inner peripheral surface of the solder hole 51 is determined as appropriate based on the volume of the supplied solder piece Wh, the shape of the solder hole 51, and the like, and based on preliminary experiments. That's fine. The separation distance G is usually in the range of 0.2 mm to 2 mm. Moreover, the preferable range regarding the separation speed of the tip 5a when the tip 5a and the land Ld are separated to the distance G and the time for holding the tip 5a at the separation distance G are as described above. In addition, when the outflow of the solder is insufficient even though the solder is melted, the supply of nitrogen gas is increased or the pressure is increased in a pulsed manner to cause the molten solder to flow out. Can do.

Further, more in the case of performing the exact state determination is previously set reference pressure P1e the decreased pressure within the solder hole 51, solder in t ₄ hours at the output of the first spacing start signal S ₃ as reference Depending on whether the pressure in the hole 51 has reached the reference pressure P1e, a more detailed state of the tip of the tip 5a may be determined. For example, when the pressure in the solder hole 51 decreases but does not reach the reference pressure P1e, it is possible to determine that the soldering state is insufficient (incomplete). Although it may be determined whether the pressure of the solder hole 51 in a predetermined relative to the time of output of spaced stop signal S ₄ time reaches a reference pressure P1e, spaced stops depending spaced speed of the soldering tip 5a since the pressure of the soldering tip in 5a before the signal S ₄ is output may occur even when reaching the reference pressure P1e, it is preferable to a reference at the output of spaced start signal S _3.

  The seventh region Ar7 is in a state where the tip has returned to the reference state and is in the same state as the first region Ar1. When it is determined that soldering is normal in the sixth region Ar6, the tip 5a moves further away from the land Ld, the lower end opening of the solder hole 51 is completely opened, and the pressure in the solder hole 51 is the pressure P1e. To pressure P1f. The pressure P1f is atmospheric pressure and is the same as the pressure P1a in the reference state.

Therefore, if decrease the pressure in the solder hole 51 at the time of t ₅ hours, based on the output of the second spacing start signal S ₅ from the operation control unit CN2 from the land Ld of soldering tip 5a from pressure P1e, soldering tip 5a Is determined to have returned to the reference position. On the other hand, if the pressure in the second separating start signal S solder hole 51 to t ₅ hours from the time the output of the ₅ did not decrease, the control section as not able to move away from the land Ld of soldering tip 5a The CN alerts that an abnormality has occurred and / or stops the operation of the soldering apparatus. Incidentally, t ₅ hours is possible appropriately set by the user, may be set appropriately input in consideration of the necessary time until the soldering tip 5a moves to a position in the reference state from the land Ld.

Further, when the stricter condition determination is previously set reference pressure P1f the decreased pressure within the solder hole 51, solder second separating start signal S in t ₅ hours based on the time of output of ₅ A more detailed state of the tip 5a may be determined depending on whether or not the pressure P1 in the hole 51 has reached the reference pressure P1f. For example, when the pressure P1 in the solder hole 51 does not reach the reference pressure P1f, it can be determined that dirt is attached in the solder hole 51. The detection of dirt in the solder hole 51 is performed in other states, that is, the reference state of the tip 5a, the contact between the tip 5a and the substrate Bd, the introduction of the solder piece Wh to the tip 5a, heating and melting, the tip. It can also be determined from the difference between the pressure P1 in the solder hole 51 and the reference pressure in a series of soldering processes such as the outflow of molten solder from 5a and the separation of the tip 5a from the substrate Bd.

  The case where the contamination state of the solder hole 51 is determined in the third region Ar3, that is, the step of putting the solder piece Wh into the solder hole 51 will be described as an example. FIG. 13 shows a state diagram in which the solder piece Wh is put into the solder hole 51. In the initial state where the solder hole 51 is not dirty as shown in FIG. 6, the pressure in the solder hole 51 is P1c. On the other hand, in the state where dirt such as dross adheres to the inner peripheral walls of the solder holes 51 and the release holes 53 as shown in FIG. 13, the flow passage area through which the nitrogen gas in the solder holes 51 passes is small. Since the flow passage area is further reduced by introducing the solder piece Wh, the pressure in the solder hole 51 becomes a pressure P1c ′ higher than the pressure P1c in the initial state (the chain line in FIG. 12). The control unit CN can determine the contamination state of the solder hole by comparing the measured pressure in the solder hole 51 with the reference pressure P1c. It should be noted that the contamination state of the solder hole can also be determined based on the level of the pressure P1a in the reference state as shown in FIG. In this case, the flow rate of nitrogen gas may be increased in order to improve sensitivity. If the pressure value fluctuates, it can also be determined by performing an averaging process.

  In addition, when performing a detailed state determination by comparing with a reference value in each soldering state, the state determination may be performed as follows. First, an upper limit value Px1 and a lower limit value Py1 of the reference pressure are set. The upper limit value Px1 and the lower limit value Py1 are values represented by Px1 = P1c + x1 and Py1 = P1c−y1 (x1, y1 are positive numbers), respectively. When the pressure P1 in the solder hole 51 measured in the soldering process deviates from the range between the upper limit value Px1 and the lower limit value Py1, the control unit CN determines that there is an abnormality in the soldering process and performs an alarm or operation. May be stopped. One of x1 and y1 may be 0.

  Further, the second upper limit value Px2 = P1c + x2 and the second lower limit value Py2 = P1c−y2 are set by using x2 and y2 which are smaller than the aforementioned x1 and y1, and the measured pressure in the solder hole 51 is measured. When P1 deviates from the second upper limit value Px2 outside the range of the second lower limit value Py2, the control unit CN can also notify the operator of attention. One of x2 and y2 may be 0. In the above description, the first upper limit value and the first lower limit value are used to warn or stop the operation, or the second upper limit value and the second lower limit value are further used for warning and the reference value is used for warning. Or although the thing of the 2 steps | paragraphs which stop driving | operation is mentioned, these are an example, You may perform a warning or an alarm in 2 steps | paragraphs or more using many reference values.

  The pressure data described above is stored for each soldering and can be stored in correspondence with the soldered device, and may be referenced from the outside via a network. It is also possible to determine the quality of soldering jointly with the pressure data by referring to the image after soldering, and the image data is acquired only when it is determined by the pressure data that the soldering is not good. May be.

  Further, the determination may be made by using the information on the temperature change of the tip 5a. Further, the determination may be made by referring to the electric resistance between the land Ld after soldering and the terminal Nd.

(First modification)
A modification of the soldering apparatus according to this embodiment will be described with reference to the drawings. FIG. 14 is a cross-sectional view showing an example of a rivet used in a modification of the soldering apparatus according to the present embodiment. As shown in FIG. 14, the tip 5b used in the soldering apparatus of the second modified example has a solder piece for stopping the solder piece Wh in the solder hole 51b before the solder piece Wh contacts the terminal Nd. A stop 511 is provided.

  As shown in FIG. 14, the solder piece stopping portion 511 has a tapered shape with an inner diameter decreasing downward in the Z direction. When the solder piece Wh reaches the solder piece stop portion 511, the gap between the solder holes 51b is reduced by the solder piece Wh. As a result, the flow path resistance in the solder hole 51b when the solder piece is put in increases. Thereby, in the 2nd modification, pressure P1 at the time of a solder piece injection state becomes large. And since the difference of the pressure P1 in each of a tip contact state and a solder piece insertion state becomes large, it becomes easy for the control part CN to distinguish a tip contact state and a solder piece insertion state.

  In this embodiment, possible states when the soldering apparatus A performs soldering include (a) a reference state, (b) a tip contact state, (c) a solder piece insertion state, (d) a solder piece molten state, Although six states (e) solder piece outflow state and (f) heel tip separation state are listed, other states may be determined.

(Second modification)
In the above-described embodiment, the case where the tip 5a is in a high temperature state where the solder can be melted is described. However, the tip 5a may be out of the normal temperature range set for melting the solder due to a failure of the heater 41 or the like. Since the nitrogen gas passing through the tip 5a expands and has a different viscosity depending on the temperature of the tip 5a, the flow resistance also increases and decreases, and as a result, the pressure of the nitrogen gas also changes. For example, when the temperature of the tip 5a decreases, the volume of nitrogen gas decreases and the viscosity decreases, so the pressure of nitrogen gas in the solder hole 51 decreases. Using this, the control unit CN stores the reference pressure P1a when the solder hole 51 is open to the atmosphere, that is, the tip 5a is in the reference state, and stores the stored reference pressure. Based on P1a and the measured pressure P1, it is possible to determine the temperature of the tip 5a.

  Further, when the type of gas to be supplied changes as in a mixed gas of nitrogen and air or oxygen, the flow path resistance changes, so that a difference occurs in the pressure P1 in the solder hole 51. Using this, the control unit CN stores the reference pressure P1a when the solder hole 51 is open to the atmosphere, that is, the tip 5a is in the reference state, and stores the stored reference pressure. Based on P1a and the measured pressure P1, it can be determined whether the supplied gas is nitrogen gas (gas to be supplied). Thereby, the control part CN can detect the error of gas piping connection, for example.

  The operation of the second modified example can be performed at regular intervals, for example. With a fixed period, you may manage by time, for example, and may manage by the frequency | count of soldering. Alternatively, it may be performed immediately after power-on of the soldering apparatus A and at the end of the process. Further, it may be performed at random timing.

(Second Embodiment)
Another example of the soldering apparatus according to this embodiment will be described with reference to the drawings. FIG. 15 is a view showing another example of the soldering apparatus according to the present invention. Note that the soldering apparatus C shown in FIG. 15 includes a gas release portion 52 that penetrates the solder hole 51 and the outer peripheral surface downstream of the melting region 510 of the tip 5c. Other than that, it has the same configuration as the soldering apparatus A of the first embodiment. Therefore, in the tip 5c, substantially the same part as the tip 5a of the soldering apparatus A is denoted by the same reference numeral, and detailed description of the same portion is omitted.

  The gas release portion 52 is a portion that communicates the solder hole 51 and the outside downstream of the melting region 510 of the solder hole 51. In this embodiment, the gas release portion 52 is connected to the outer peripheral surface of the tip 5c and the solder. Although it has a through-hole shape communicating with the hole 51, it is not limited to this. For example, a slit shape or a notch shape formed so as to communicate the solder hole 51 and the outer peripheral surface of the tip 5c between the downstream side of the melting region 510 of the solder hole 51 and the lower end in the Z direction of the tip 5c. It may be. In addition to the above-described through holes, slits, and notches, the gas release portion 52 has a shape that allows the nitrogen gas in the solder holes 51 to flow out of the tip 5c when in the tip contact state and the solder piece outflow state. Can be widely adopted.

  The determination of the state of the tip by the state determination unit CN1 when using such a soldering apparatus C will be described with reference to the drawings. FIG. 16 is a diagram showing the tip and the flow of nitrogen gas in the tip contact state. FIG. 17 is a diagram showing the tip and the flow of nitrogen gas in the solder piece insertion state. FIG. 18 is a diagram showing the tip and the flow of nitrogen gas in a solder piece molten state. FIG. 19 is a diagram showing the tip and the flow of nitrogen gas in the solder piece outflow state.

  In the soldering apparatus C, the state where the tip can be taken in one soldering is the same as in the first embodiment, that is, the reference state, the tip contact state, the solder piece insertion state, the solder piece molten state, and the solder piece outflow. This is the state, the tip separation state. The reference state and the tip separation state are substantially the same as those of the soldering apparatus A of the first embodiment. Further, the tip 5c is provided with a gas release portion 52, and when the gas can flow out from the gas release portion 52, that is, in each state of the tip contact state, the solder piece insertion state, and the solder piece outflow state. The pressure of the nitrogen gas flowing through the solder hole 51 is smaller than that in the first embodiment. Therefore, the pressure in the solder hole 51 will be described as the pressure P11. For example, in the reference state, the pressure in the solder hole 51 is set to the pressure P11b. Similarly, in other states, the pressures are set to P11c and P11e.

  In the tip contact state shown in FIG. 16, the nitrogen gas in the solder hole 51 flows out from the through hole Th and also flows out from the release hole 53 and the gas release portion 52. Therefore, the pressure P11 in the solder hole 51 is lower than when there is no gas release portion 52 (first embodiment). That is, the pressure P11b (<P1b) in the solder hole 51 is obtained. Similarly, when the solder piece is loaded as shown in FIG. 17, the flow path resistance is increased by the solder piece Wh. On the other hand, since nitrogen gas flows out from the gas release part 52, the pressure P11 in the solder hole 51 becomes lower than when there is no gas release part 52 (1st Embodiment). That is, the pressure P11c (<P1c) in the solder hole 51 is obtained. The pressure P11c in the solder hole 51 when the solder piece is inserted is higher than the pressure P11b in the solder hole 51 in the tip contact state.

  When the solder piece is melted as shown in FIG. 18, the melted region 510 of the solder hole 51 is closed with the melted solder piece Wh. Therefore, the nitrogen gas does not flow out from the gas release portion 52 that is downstream of the melting region 510 in the flow direction of the nitrogen gas. For this reason, the pressure P11d in the solder hole 51 when the solder piece is melted is substantially equal to that in the first embodiment (P1d).

  In the solder piece outflow state shown in FIG. 19, the lower end in the Z direction of the solder hole 51 is blocked by the land Ld. Further, since the molten solder piece Wh blocks the through hole Th of the land Ld, the nitrogen gas does not flow out from the through hole Th. On the other hand, since the solder piece Wh is melted and flows out from the melted region 510 toward the circuit board Bd, the nitrogen gas in the solder hole 51 can flow out from the gas release portion 52 to the outside. That is, since the nitrogen gas flows out from the gas release part 52, the pressure P11 in the solder hole 51 is lower than when there is no gas release part 52 (first embodiment). That is, the pressure in the solder hole 51 in the solder piece outflow state is the pressure P11e (<P1d). In addition, since the nitrogen gas in the solder hole 51 is flowing out from the gas release portion 52 when the solder piece is out, the pressure P11e is lower than the pressure P11d when the solder piece is melted.

  As described above, by providing the gas release portion 52 on the tip 5c, the pressure P11b in the solder hole 51 when the tip is in contact, the pressure P11c inside the solder hole 51 when the solder piece is put in, and the solder The pressure P11e in the solder hole 51 in the single outflow state is a reference pressure value different from that in the soldering apparatus A of the first embodiment.

  The pressure P11 in each state is as shown in the graph shown in FIG. FIG. 20 shows a change in the pressure P11 in the solder hole 51 when the soldering apparatus C performs soldering once. In FIG. 20, the vertical axis represents the pressure P11 in the solder hole 51, and the horizontal axis represents time. Since the determination of the reference state, the tip contact state, the solder piece insertion state, and the solder piece molten state is the same as in the first embodiment, the state determination of the solder piece outflow state and the tip separation state will be described below.

  As shown in FIG. 20, the pressure in the solder hole 51 is provided after the fourth region Ar4 (pressure P11d in the solder hole 51) indicating the molten state of the solder piece by using the tip 5c provided with the gas release portion 52. A fifth region Ar5 indicating the solder piece outflow state of P11e appears.

Therefore, if smaller than the pressure a pressure P11d of the operation control unit CN2 from wire solder W cutting signal output when S ₂ t ₄ hours in the solder hole 51 from t ₃ hours later as a reference, the solder pieces Wh is It is determined that the molten metal has flowed out of the tip 5c. On the other hand, when the pressure in the disconnect signal S ₂ output time of solder holes 51 in the t ₄ hours t ₃ hours after the reference did not decrease than the pressure P11d, the solder pieces Wh is either not melted As the melting is insufficient and does not flow out of the solder hole 51, the control unit CN performs an alarm indicating that an abnormality has occurred and / or stops the operation of the soldering apparatus. Incidentally, t ₄ hours is possible appropriately set by the user, the thread cutting signal solder piece Wh from the time the output of the S ₂ of solder to set and input the to keep the measurement time measured in advance the time to melt runoff Also good.

Further, more in the case of performing the exact state determination is previously set reference pressure P11e the decreased pressure within the solder hole 51, disconnection signal S ₂ in t ₄ hours at from t ₃ hours after, based on the output Further, a more detailed state of the tip 5c may be determined depending on whether the pressure in the solder hole 51 has reached the reference pressure P11e. For example, when the pressure P11 in the solder hole 51 decreases but does not reach the reference pressure P11e, it can be determined that the solder piece Wh has melted and flowed out but the soldering state (soldering shape) is not normal. It becomes.

The sixth region Ar6 is a state in which the tip 5c is separated from the land Ld by a distance G, and when normal soldering is performed, from the gap between the melted and solidified solder and the inner peripheral surface of the solder hole 51, Nitrogen gas flows out and the pressure P11 in the solder hole 51 decreases. The operation control unit CN2 After outputting the first spacing start signal _{S 3} from the land Ld of soldering tip 5c, and outputs the separation stop signal _{S 4.} The output timing of spaced stop signal S ₄ is when the distance between the soldering tip 5c and the land Ld reaches the distance G, is calculated from the separation speed of the soldering tip 5c.

Therefore, if the pressure P11 decreases in the solder hole 51 to t ₅ hours based on the time of output of spaced start signal S ₃ from the land Ld of soldering tip 5c from the operation control unit CN2, the solder pieces Wh is melted runoff Determine that normal soldering has been performed. On the other hand, when the pressure P11 in the solder hole 51 from the time the output of the first spacing start signal S ₃ in the t ₅ hours did not decrease, the potato solder (FIG. 11 (b)) soldered not normal such as The control unit CN performs an alarm indicating that an abnormality has occurred and / or stops the operation of the soldering apparatus. Incidentally, t ₅ hours is possible appropriately set by the user, may be set appropriately input in consideration of the travel time from the soldering tip 5c has a land Ld until a predetermined distance G.

  The seventh region Ar7 is a state where the tip 5c has returned to the reference state, and is the same state as the first region Ar1. When it is determined that soldering is normal in the sixth region Ar6, the tip 5c moves further away from the land Ld, the lower end opening of the solder hole 51 is completely opened, and the pressure P11 in the solder hole 51 decreases. It becomes the same as the pressure P11a in the reference state.

Therefore, if the pressure in the solder hole 51 at the time of t ₆ hours on the basis of the output of the second spacing start signal S ₅ from the operation control unit CN2 from the land Ld of soldering tip 5c decreases, soldering tip 5c is reference state It is determined that the position has been returned to. On the other hand, when the pressure P11 in the second separating start signal S solder hole 51 to t ₆ hours from the time the output of the ₅ did not decrease, the control as not able to move away from the land Ld of soldering tip 5c The part CN performs an alarm indicating that an abnormality has occurred and / or stops the operation of the soldering apparatus. Incidentally, t ₆ hours can be set as appropriate by the user, may be set appropriately input in consideration of the necessary time until the soldering tip 5c is moved to the position of the reference state from the land Ld.

Further, when the stricter condition determination is previously set reference pressure P11a after reduction the pressure in the solder hole 51, solder second separating start signal S in t ₆ hours based on the time of output of ₅ A more detailed state of the tip 5 may be determined depending on whether or not the pressure in the hole 51 has reached the reference pressure P11a. For example, when the pressure in the solder hole 51 does not reach the reference pressure P11a, it can be determined that dirt is attached in the solder hole 51 as in the first embodiment. The detection of dirt in the solder hole 51 is performed in other states, that is, the reference state of the tip 5c, the contact between the tip 5c and the substrate Bd, the introduction of the solder piece Wh to the tip 5c, heating and melting, the tip. It is also possible to determine from the difference between the pressure in the solder hole 51 and the reference pressure in a series of soldering processes such as the outflow of molten solder from 5c and the separation of the tip 5c from the substrate Bd.

  As described above, by providing the gas release portion 52 on the tip 5c, the pressure in the solder hole 51 in the solder piece molten state and the pressure in the solder hole 51 in the solder piece outflow state can be set to different values. . Thereby, the state determination unit CN1 can more accurately detect the solder piece outflow state, that is, the completion of the soldering of the terminal Nd and the land Ld of the electronic component Ep.

(Third embodiment)
FIG. 21 shows another embodiment of the soldering apparatus according to the present invention. In the soldering apparatuses A and C shown in the first embodiment and the second embodiment, the solder hole 51 is closed by the molten solder in the melting region 510 at least in the molten state of the solder piece. At this time, nitrogen gas or vaporized flux in the solder hole 51 is discharged out of the release hole 53, but part of the gas may enter the pressure measurement hole 54. When gas containing vaporized flux or the like enters the pressure measurement hole 54, dirt such as dross adheres to the inner peripheral surfaces of the pressure measurement hole 54 and the pressure measurement pipe 8, and the measurement accuracy of the pressure measurement unit 75 is improved. May decrease.

  Therefore, in the soldering apparatus D shown in FIG. 21, an inert gas is supplied to the pressure measurement pipe 8 so that gas containing flux or the like vaporized into the pressure measurement hole 54 and the pressure measurement pipe 8 does not enter. did.

  Specifically, an inert gas is supplied from a gas supply source GS2 to a gas supply hole 81 formed in the pressure measurement pipe 8 via a pipe (gas supply path) 70b. Here, the formation position of the gas supply hole 81 is the end where the pressure measurement part 75 of the pressure measurement pipe 8 is attached from the viewpoint of preventing the retention part of the inert gas from being formed in the pressure measurement pipe 8. It is desirable to be on the part side. The gas flow rate adjustment unit 7 b includes a second adjustment unit 73 and a second measurement unit 74. The pipe 70b is a gas supply path through which an inert gas from the gas supply source GS2 flows into the gas supply hole 81. In FIG. 21, for the sake of convenience, the piping 70b is shown by a diagram, but in actuality, it is a tube body (for example, a resin tube) that does not leak gas. The inert gas from the gas supply source GS2 is here the same nitrogen gas as the gas supplied from the gas supply source GS1.

  The flow rate of the nitrogen gas supplied from the gas supply source GS2 is adjusted by the second adjusting unit 73. Then, the second measuring unit 74 measures the flow rate of nitrogen gas discharged from the second adjusting unit 73, and the second measuring unit 74 sets the second flow rate to the second adjusting unit 73 so that the measured nitrogen gas flow rate becomes a predetermined flow rate. 2 When a control signal for controlling the adjustment unit 73 is output. Note that the flow rate Q2 of the nitrogen gas supplied from the gas supply source GS2 to the pressure measurement pipe 8 only needs to prevent vaporized flux or the like from entering the pressure measurement pipe 8, and thus flows in the solder hole 51. The flow rate is set to be much smaller than the flow rate Q1 of nitrogen gas. Further, the pressure of the nitrogen gas in the pressure measuring pipe 8 is set higher than the pressure of the nitrogen gas in the solder hole 51.

  According to such a configuration, the gas containing vaporized flux or the like is effectively suppressed from entering the pressure measurement hole 54, and the pressure measurement hole 54 and the pressure measurement pipe 8 are connected to the inner peripheral surfaces. Dirt adhesion such as dross can be suppressed. Thereby, the measurement accuracy of the pressure measurement unit 75 can be maintained in a high state over a long period of time.

(Modification)
In the soldering apparatus D of FIG. 21, the nitrogen gas that flows in the pressure measurement pipe 8 is supplied from the gas supply source GS2. However, the nitrogen gas is supplied from the gas supply source GS1 to the pressure measurement pipe 8. May be. That is, nitrogen gas may be supplied from the gas supply source GS1 into the solder hole 51 and the pressure measurement pipe 8. With such a configuration, one gas supply source can be provided. Also in this case, a gas flow rate adjusting unit 7b is provided between the gas supply source GS1 and the pressure measuring pipe 8, and the flow rate of the nitrogen gas is measured by the second measuring unit 74 while adjusting the flow rate by the second adjusting unit 73. Then, the flow rate of the nitrogen gas supplied into the pressure measurement pipe 8 is controlled to be a predetermined flow rate. Further, the pressure of the nitrogen gas in the pressure measurement pipe 8 is controlled to be higher than the pressure of the nitrogen gas in the solder hole 51.

(Fourth embodiment)
FIG. 22 shows another embodiment of the soldering apparatus according to the present invention. In the soldering apparatuses A, C, and D shown in the first to third embodiments, the pressure in the solder hole 51 is measured. In the state determination method according to the present invention, the gas supply source GS and the solder hole are measured. The pressure in the gas supply path that communicates with 51 and supplies gas from the gas supply source GS to the solder hole 51 may be measured. In the soldering apparatus E shown in FIG. 22, a pressure measuring unit 75 is provided in the pipe 70a. Even when the pressure measuring unit 75 is provided in the pipe 70a, it is possible to measure the same pressure change as in the first embodiment, and the inside of the pipe 70a is within a predetermined time with reference to the time when the operation signal is output from the operation control unit CN2. The state determination unit CN1 can determine the state of the tip depending on whether or not the pressure of the flowing gas has changed. In the present embodiment, the gas supply path is configured by the pipe 70 a, the gas inflow hole 222, and the solder supply hole 422, and the pressure measuring unit 75 may be provided in the gas inflow hole 222 or the solder supply hole 422.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to this content. The embodiments of the present invention can be variously modified without departing from the spirit of the invention. For example, it is also possible to automatically adjust the optimum soldering conditions by automatically changing the tip temperature, preheating time or soldering time based on the degree of change in pressure.

A, C, D, E Soldering device 1 Support member 11 Wall body 12 Holding portion 13 Sliding guide 14 Heater unit fixing portion 15 Actuator holding portion 16 Spring holding portion 2 Cutter unit 21 Cutter upper blade 211 Upper blade hole 212 Pin hole 22 Cutter lower blade 221 Lower blade hole 222 Gas inflow hole (gas supply path)
23 Pusher pin 231 Rod portion 232 Head portion 233 Spring 3 Drive mechanism 31 Air cylinder 32 Piston rod 33 Cam member 330 Recess 331 Support portion 332 Pin 333 Pin pushing portion 334 Bearing 34 Slider portion 340 Cam groove 341 First groove portion 342 Second groove portion 343 Connection groove 35 Guide shaft 4 Heater unit 41 Heater 42 Heater block 421 Recess 422 Solder supply hole (gas supply path)
5a, 5b, 5c, 5d Tip 51 Solder hole 510 Melting region 52 Gas release part 53 Release hole 54 Pressure measurement hole 6 Solder feed mechanism 61 Feed roller 62 Guide pipes 7a and 7b Gas flow rate adjustment parts 70a and 70b Piping (gas Supply channel)
71 First Adjustment Unit 72 First Measurement Unit 73 Second Adjustment Unit 74 Second Measurement Unit 75 Pressure Measurement Unit 8 Pressure Measurement Tube 81 Gas Supply Hole W Solder Wh Solder Piece Bd Wiring Board Ep Electronic Component Ld Land Th Through Hole Nd Terminal CN Control unit CN1 State determination unit CN2 Operation control unit

Claims (7)

A tip having a solder hole to which the solder piece is supplied and heating and melting the solder piece in the solder hole;
A gas supply source for supplying the gas;
A gas supply path for communicating the gas supply source and the solder hole, and supplying a constant flow of gas from the gas supply source to the solder hole;
A tip state determination method for determining a tip state of a soldering apparatus having
Measure the pressure of the gas flowing in the gas supply path or the solder hole,
The tip state is determined by whether or not the pressure of the gas flowing in the gas supply path or the solder hole has changed within a predetermined time with reference to the time when the operation signal of the soldering apparatus is output. How to judge the state of the tip.   The tip state determination method according to claim 1, wherein gas pressure measurement is started when a soldering start signal is output from the soldering apparatus.   The pressure of the gas flowing in the gas supply path or in the solder hole increases within a predetermined time with reference to the time of signal output starting to move in a direction in which at least one of the soldering device and the object to be soldered contacts. The tip state determination method according to claim 1 or 2, wherein it is determined that the tip contacts the object based on what has been done. The soldering apparatus further includes a cutting means for cutting the thread solder into a predetermined length of solder pieces,
Based on the increase in the pressure of the gas flowing in the gas supply path or in the solder hole within a predetermined time with respect to the time when the cutting means outputs a signal to start cutting, the solder piece to the solder hole The tip state determination method according to any one of claims 1 to 3, wherein at least one of charging and melting of the solder pieces in the solder holes is determined.   The pressure of the gas flowing in the gas supply path or the solder hole is reduced within a predetermined time with reference to the time of signal output in which at least one of the soldering apparatus and the object to be soldered starts moving in the direction of separation. The tip state determination method according to any one of claims 1 to 4, wherein it is determined that the molten solder piece has flowed out of the solder hole based on the fact.   The amount of movement in the separating direction is in the range of 0.2 mm or more and 2 mm or less, and based on the fact that the pressure of the gas flowing in the gas supply path or the solder hole is reduced, the molten solder piece is the solder hole. The tip state determination method according to claim 5, wherein it is determined that the solder has flown out and normal soldering is being performed. A tip having a solder hole to which the solder piece is supplied and heating and melting the solder piece in the solder hole;
A gas supply source for supplying the gas;
A gas supply path for communicating the gas supply source and the solder hole, and supplying a constant flow of gas from the gas supply source to the solder hole;
A measuring unit for measuring the pressure of the gas flowing in the gas supply path or the solder hole;
A state determining unit that determines the state of the tip based on the pressure of the gas measured by the measuring unit;
An operation control unit for controlling the operation of the device;
A soldering apparatus having
The said state determination part determines the state of the said tip by the method in any one of Claims 1-6, The soldering apparatus characterized by the above-mentioned.