JP2019180113A - Power conversion device - Google Patents

Abstract

To improve wiring efficiency and to improve space efficiency and layout property when a device is attached to other devices.SOLUTION: A power conversion device 1 comprises: a plurality of semiconductor modules 61; a capacitor unit 23; and a conductor set 67 formed of positive electrode bus bars and negative electrode bus bars. When viewed from a direction parallel to an arrangement face SA, the plurality of semiconductor modules 61 and the capacitor unit 23 are arranged so that positions in an orthogonal direction to the arrangement face SA are overlapped. The conductor set 67 extends along the direction parallel to the arrangement face SA within a range where the positions in the orthogonal direction of the plurality of semiconductor modules 61 and the capacitor unit 23 are overlapped in a state where the positive electrode bus bars and the negative electrode bus bars are mutually confronted, and connects the semiconductor modules 61 and the capacitor unit 23.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device.

  2. Description of the Related Art Conventionally, a vehicle drive unit including a drive device case in which a generator and a motor are housed and a power control unit mounted on the drive device case is known (see, for example, Patent Document 1). In this vehicle drive unit, the power control unit includes two inverters connected to each of the generator and the motor, a control unit that controls the two inverters, a current sensor, and the like in the unit case. The outer shape of the drive device case is formed in a cylindrical shape, and the drive device case is arranged such that the axial direction is the vehicle width direction. The outer shape of the unit case is formed in a box shape, and the unit case is disposed so as to be placed on the upper surface of the drive device case in the vertical direction of the vehicle.

Japanese Patent Laid-Open No. 2006-140198

By the way, according to the vehicle drive unit according to the above-described prior art, a plurality of components (for example, a switching element module, a reactor, a capacitor, and the like) constituting the power control unit are stacked and each component is arranged for each layer. It is divided and arranged. Thereby, the problem that the connection line which electrically connects a some component mutually becomes long arises.
Further, the stacking direction of the plurality of components in the power control unit is set to be parallel to the direction in which the drive device case and the unit case are stacked, that is, the vertical direction of the vehicle. Thereby, the dimension of the whole drive unit in the up-down direction of a vehicle may increase, and there exists a possibility that the space efficiency and layout property in a vehicle cannot be improved.

  An object of this invention is to provide the power converter device which can improve the space efficiency and layout property at the time of attaching to other apparatuses while improving wiring efficiency.

In order to solve the above problems and achieve the object, the present invention employs the following aspects.
(1) A power converter according to an aspect of the present invention includes a plurality of switching elements (for example, the high-side arm transistors UH, VH, and WH and the low-side arm transistors UL, VL, and WL in the embodiment). A semiconductor module (for example, semiconductor modules 61U, 61V, 61W in the embodiment), a capacitor (for example, capacitor unit 23 in the embodiment) electrically connected to the semiconductor module, the semiconductor module, and the semiconductor module A conductor set (for example, conductive in the embodiment) composed of a positive conductor (for example, positive bus bar 50p, PI in the embodiment) and a negative conductor (for example, negative bus bar 50n, NI in the embodiment) to which the capacitor is connected. An assembly surface (for example, in the embodiment) When viewed from a direction parallel to the placement surface SA) (for example, the Y-axis direction in the embodiment), at least a part of the semiconductor module and the capacitor is orthogonal to the placement surface (for example, in the embodiment) (Z-axis direction) are arranged so that the positions thereof overlap each other, and the conductor set has a position in the orthogonal direction of the semiconductor module and the capacitor in a state where the positive electrode conductor and the negative electrode conductor face each other. In the overlapping range (for example, the range ZA in which the positions in the embodiment overlap), the semiconductor module and the capacitor are connected by extending along a direction parallel to the arrangement surface.

(2) In the power conversion device according to (1), the positive electrode conductor (for example, positive electrode bus bar 50p in the embodiment) and the negative electrode conductor (for example, the embodiment) extending from the capacitor toward the semiconductor module. In the negative electrode bus bar 50n), the bent portions (for example, the first bent portions 72p and 72n and the second bent portion in the embodiment) are bent in a state of facing each other within a range where the positions in the orthogonal direction overlap. 73p, 73n).

(3) In the power conversion device according to (1) or (2) above, a plurality of capacitor elements (for example, the capacitor element 23a in the embodiment) constituting the capacitor are in a direction parallel to the arrangement surface (for example, , In the X-axis direction and Y-axis direction in the embodiment).

(4) In the power conversion device according to any one of (1) to (3), a stacked body in which a plurality of the semiconductor modules are stacked (for example, the stacked body 64 in the embodiment); A plurality of mutually facing positive electrode conductors (for example, positive electrode bus bar PI in the embodiment) and the negative electrode extending from each of the plurality of semiconductor modules toward the capacitor at different positions in the stacking direction of the stacked body And a conductor (for example, the negative electrode bus bar NI in the embodiment).

  According to the above (1), the positions of the semiconductor module and the capacitor in the direction orthogonal to the arrangement surface overlap, and the conductor set extends in a direction parallel to the arrangement surface within a range where the position in the orthogonal direction overlaps. As a result, it is possible to reduce the overall thickness of the power conversion device and improve the wiring efficiency.

In the case of (2) above, the positive electrode conductor and the negative electrode conductor have the bent portions facing each other, so that the conductor set can be arranged in a space-efficient manner along the outer periphery of the capacitor.
In the case of (3) above, the capacitor can be formed with a reduced thickness.
In the case of the above (4), even when a laminated body composed of a plurality of semiconductor modules is provided, the power converter can be formed while suppressing the overall thickness, and the wiring efficiency can be improved.

It is a figure which shows typically the structure of the power converter device which concerns on embodiment of this invention, and is a figure which fractures | ruptures a part of motor and abbreviate | omits a part of power converter device seeing from the axial direction of a motor. is there. It is a figure which shows the example of mounting in the vehicle of the power converter device which concerns on embodiment of this invention. It is a figure which shows the structure of a part of vehicle which mounts the power converter device which concerns on embodiment of this invention. It is a perspective view of a power converter concerning an embodiment of the present invention. It is a perspective view which expands and shows a part of power converter device concerning the embodiment of the present invention. It is sectional drawing cut | disconnected by the XZ plane in the position of the AA line shown in FIG. It is the figure which abbreviate | omitted the circuit board of the gate drive unit and was seen from the Z-axis direction in the power converter device which concerns on embodiment of this invention. It is the figure which abbreviate | omitted the circuit board of the gate drive unit and was seen from the X-axis direction in the power converter device which concerns on embodiment of this invention.

  Hereinafter, an embodiment of a power conversion device of the present invention will be described with reference to the accompanying drawings.

  The power converter according to the present embodiment controls power transfer between the motor and the battery. For example, the power conversion device is mounted on an electric vehicle or the like. The electric vehicle is an electric vehicle, a hybrid vehicle, a fuel cell vehicle, or the like. An electric vehicle is driven using a battery as a power source. The hybrid vehicle is driven using a battery and an internal combustion engine as power sources. The fuel cell vehicle is driven using the fuel cell as a power source.

  FIG. 1 is a diagram schematically showing a configuration of a power conversion device 1 according to an embodiment of the present invention. When viewed from the axial direction of the motor 12, a part of the motor 12 is broken, and one of the power conversion devices 1 is shown. It is a figure which abbreviate | omits a part and shows. FIG. 2 is a diagram illustrating a mounting example of the power conversion device 1 according to the embodiment of the present invention in the vehicle 10. FIG. 3 is a diagram illustrating a partial configuration of the vehicle 10 on which the power conversion device 1 according to the embodiment of the present invention is mounted. In the following description, the X-axis, Y-axis, and Z-axis directions orthogonal to each other in the three-dimensional space are directions parallel to the respective axes.

<Vehicle>
As shown in FIGS. 2 and 3, the vehicle 10 includes a battery 11 (BATT) and a travel drive motor 12 (MOT) in addition to the power conversion device 1.
The battery 11 is, for example, a high voltage battery that is a power source of the vehicle 10. The battery 11 includes a battery case and a plurality of battery modules accommodated in the battery case. The battery module includes a plurality of battery cells connected in series. The battery 11 includes a positive terminal PB and a negative terminal NB that are connected to the DC connector 1a of the power converter 1. The positive terminal PB and the negative terminal NB are connected to positive and negative ends of a plurality of battery modules connected in series in the battery case.
The motor 12 generates a rotational driving force (power running operation) with the electric power supplied from the battery 11. The motor 12 may generate generated power by a rotational driving force input to the rotating shaft. The motor 12 may be configured to be able to transmit the rotational power of the internal combustion engine. For example, the motor 12 is a three-phase AC brushless DC motor. The three phases are the U phase, the V phase, and the W phase.

As shown in FIG. 1, the motor 12 includes a housing 14, a shaft 15, a rotor 16, a stator 17, a first refrigerant circulation part 18, and a second refrigerant circulation part 19. The motor 12 is, for example, an inner rotor type. The housing 14 rotatably supports the shaft 15 around the axis O and accommodates the rotor 16 and the stator 17 therein. The shaft 15 is attached to the rotor 16 inside the housing 14 and is connected to other devices outside the housing 14.
The rotor 16 includes a rotor core fixed to the shaft 15 and a plurality of field permanent magnets attached to the rotor core. The stator 17 includes a stator core fixed to the housing 14 and a three-phase stator winding for generating a rotating magnetic field that rotates the rotor 16. The three-phase stator windings of the motor 12 are connected to the three-phase connector 1 b of the power conversion device 1.

  The first refrigerant circulation part 18 and the second refrigerant circulation part 19 are provided in the housing 14. The first refrigerant circulation part 18 and the second refrigerant circulation part 19 are, for example, a pipe fixed to the housing 14 or a tubular part formed in the housing 14. Each internal space of the first refrigerant circulation part 18 and the second refrigerant circulation part 19 forms each flow path through which a cooling refrigerant for the power conversion device 1 flows. The flow path of the first refrigerant circulation part 18 communicates with a refrigerant inlet 18 a formed in the housing 14. The flow path of the second refrigerant circulation part 19 leads to a refrigerant outlet 19 a formed in the housing 14. Each of the 1st refrigerant | coolant distribution part 18 and the 2nd refrigerant | coolant distribution part 19 is connected to each of the 1st connection part 65 and the 2nd connection part 66 of the power converter device 1 mentioned later.

  As shown in FIGS. 1 and 2, the X-axis direction is parallel to the direction of the axis O of the motor 12. For example, the motor 12 is disposed at the rear of the vehicle body at the rear in the front-rear direction of the vehicle 10 such that the direction of the axis O is parallel to the left-right direction of the vehicle 10. For example, the left-right direction of the vehicle 10 is parallel to the X-axis direction, the front-rear direction of the vehicle 10 is parallel to the Y-axis direction, and the vertical direction of the vehicle 10 is parallel to the Z-axis direction. Further, the left side in the left-right direction of the vehicle 10 is the positive direction in the X-axis direction, the front in the front-rear direction of the vehicle 10 is the positive direction in the Y-axis direction, and the upper direction in the vertical direction of the vehicle 10 is the positive direction in the Z-axis direction. . For example, the motor 12 is disposed in a power mounting chamber 10e at the rear of the vehicle body provided behind the rear panel 10d. The battery 11 is disposed, for example, below the floor panel in the passenger compartment 10c provided behind the dashboard lower panel 10a.

<Power conversion device>
The power converter 1 is attached to the housing 14 of the motor 12, for example. The power conversion device 1 is disposed, for example, on the upper side of the motor 12 in the vertical direction of the vehicle 10.
As shown in FIG. 3, the power conversion device 1 includes a power module 21, a capacitor unit 23, a resistor 24, a first current sensor 25, a second current sensor 27, and an electronic control unit 28 (MOT ECU). And a gate drive unit 29 (G / D).

  The power module 21 includes, for example, one power conversion circuit unit 31. The power conversion circuit unit 31 is connected to the three-phase stator windings of the motor 12 by a three-phase connector 1b. The power conversion circuit unit 31 converts DC power input from the battery 11 into three-phase AC power. The power conversion circuit unit 31 may convert the three-phase AC power input from the motor 12 into DC power. The DC power converted by the power conversion circuit unit 31 can be supplied to the battery 11.

  The power conversion circuit unit 31 includes a bridge circuit formed by a plurality of switching elements that are bridge-connected. For example, the switching element is a transistor such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal Oxide Semi-conductor Field Effect Transistor). For example, in the bridge circuit, a pair of high side arm and low side arm U-phase transistors UH, UL, a pair of high side arm and low side arm V phase transistors VH, VL, and a pair of high side arm and low side arm The W-phase transistors WH and WL are bridge-connected.

Each of the transistors UH, VH, and WH of the high side arm has a collector connected to the positive bus bar PI to constitute a high side arm. In each phase, each positive electrode bus bar PI of the high side arm is connected to the positive electrode bus bar 50p of the capacitor unit 23.
Each of the transistors UL, VL, WL of the low side arm constitutes a low side arm with the emitter connected to the negative bus bar NI. In each phase, each negative bus bar NI of the low side arm is connected to the negative bus bar 50 n of the capacitor unit 23.
In addition, the connection between the positive electrode bus bars PI, 50p and the connection between the negative electrode bus bars NI, 50n are, for example, laser welding or clip so as to be smaller than the bolt fastening and suppress thermal damage of the insulating portion. Connection by is adopted.

In each phase, the emitters of the transistors UH, VH, WH of the high side arm are connected to the collectors of the transistors UL, VL, WL of the low side arm at the connection point TI.
The input / output bus bar 51 that forms the connection point TI in each phase of the power conversion circuit unit 31 is connected to the input / output terminal Q1. The input / output terminal Q1 is connected to the three-phase connector 1b. The connection point TI of each phase of the power conversion circuit unit 31 is connected to the stator winding of each phase of the motor 12 via the input / output bus bar 51, the input / output terminal Q1, and the three-phase connector 1b.
The bridge circuit includes a diode connected in a forward direction from the emitter to the collector between the collectors and emitters of the transistors UH, UL, VH, VL, WH, and WL.

  The power conversion circuit unit 31 turns on / off the transistor pair of each phase based on a gate signal that is a switching command input from the gate drive unit 29 to the gates of the transistors UH, VH, WH, UL, VL, and WL. Switch off (shut off). The power conversion circuit unit 31 converts the DC power input from the battery 11 into three-phase AC power, and sequentially commutates the current to the three-phase stator winding of the motor 12 to thereby change the three-phase stator winding. AC U-phase current, V-phase current, and W-phase current are applied to The power conversion circuit unit 31 outputs three-phase output from the three-phase stator windings of the motor 12 by on (conduction) / off (cut-off) driving of the transistor pairs of each phase synchronized with the rotation of the motor 12. You may convert alternating current power into direct-current power.

The capacitor unit 23 includes a smoothing capacitor 41 and a noise filter 43.
The smoothing capacitor 41 is connected between the plurality of positive electrode bus bars PI and the negative electrode bus bar NI of the power conversion circuit unit 31 via the positive electrode bus bar 50p and the negative electrode bus bar 50n. The smoothing capacitor 41 smoothes voltage fluctuations that occur with the on / off switching operation of the transistors UH, UL, VH, VL, WH, and WL of the power conversion circuit unit 31.

The noise filter 43 is connected between the plurality of positive electrode bus bars PI and negative electrode bus bars NI of the power conversion circuit unit 31 via the positive electrode bus bar 50p and the negative electrode bus bar 50n. The noise filter 43 includes two capacitors connected in series. The connection point of the two capacitors is connected to the body ground of the vehicle 10 or the like.
The resistor 24 is connected between the plurality of positive electrode bus bars PI and the negative electrode bus bar NI of the power conversion circuit unit 31 via the positive electrode bus bar 50p and the negative electrode bus bar 50n.

The first current sensor 25 forms a connection point TI of each phase of the power conversion circuit unit 31 and is disposed on the input / output bus bar 51 connected to the input / output terminal Q1, and each of the U phase, the V phase, and the W phase. Detect current. The second current sensor 27 is disposed between the resistor 24 and the DC connector 1 a and detects the output current of the battery 11.
Each of the first current sensor 25 and the second current sensor 27 is connected to the electronic control unit 28 by a signal line.

  The electronic control unit 28 controls each operation of the motor 12. For example, the electronic control unit 28 is a software function unit that functions when a predetermined program is executed by a processor such as a CPU (Central Processing Unit). The software function unit is an ECU (Electronic Control Unit) including a processor such as a CPU, a ROM (Read Only Memory) that stores a program, a RAM (Random Access Memory) that temporarily stores data, and an electronic circuit such as a timer. is there. Note that at least a part of the electronic control unit 28 may be an integrated circuit such as an LSI (Large Scale Integration). For example, the electronic control unit 28 performs a current feedback control using the current detection value of the first current sensor 25 and a current target value corresponding to the torque command value for the motor 12 and the like, and a control signal input to the gate drive unit 29 Is generated. For example, the electronic control unit 28 performs a current feedback control using the current detection value of the first current sensor 25 and the current target value corresponding to the regeneration command value for the motor 12, and the like, and the control signal input to the gate drive unit 29 May be generated. The control signal is a signal indicating timing for driving each of the transistors UH, VH, WH, UL, VL, WL of the power conversion circuit unit 31 to be turned on (conductive) / off (cut off). For example, the control signal is a pulse width modulated signal or the like.

  The gate drive unit 29 actually drives each transistor UH, VH, WH, UL, VL, WL of the power conversion circuit unit 31 on (conductive) / off (cut off) based on a control signal received from the electronic control unit 28. A gate signal for generating the signal is generated. For example, the gate drive unit 29 performs control signal amplification, level shift, and the like to generate a gate signal.

FIG. 4 is a perspective view of the power conversion device 1 according to the embodiment of the present invention. FIG. 5 is an enlarged perspective view showing a part of the power conversion device 1 according to the embodiment of the present invention. FIG. 6 is a cross-sectional view taken along the XZ plane at the position of the AA line shown in FIG. FIG. 7 is a view of the power conversion device 1 according to the embodiment of the present invention as viewed from the Z-axis direction with the circuit board 29a of the gate drive unit 29 omitted. FIG. 8 is a view of the power conversion device 1 according to the embodiment of the present invention when the circuit board 29a of the gate drive unit 29 is omitted and viewed from the X-axis direction.
As shown in FIGS. 1 and 4, the power conversion device 1 includes a plurality of semiconductor modules 61, a plurality of cooling bodies 62, and a plurality of tubular members 63. The plurality of semiconductor modules 61 and the plurality of cooling bodies 62 are alternately stacked to form a stacked body 64. In the stacked body 64, the plurality of cooling bodies 62 are connected in the stacking direction by a plurality of tubular members 63. For example, the stacking direction is the Z-axis direction.

  Each of the plurality of semiconductor modules 61 includes, for example, an element row formed by switching elements of a high side arm and a low side arm in the power conversion circuit unit 31. For example, the plurality of semiconductor modules 61 are the U-phase, V-phase, and W-phase semiconductor modules 61U, 61V, 61W. The U-phase semiconductor module 61U includes a high-side arm and low-side arm U-phase transistors UH and UL in the power conversion circuit unit 31. The V-phase semiconductor module 61V includes a high-side arm and low-side arm V-phase transistors VH and VL in the power conversion circuit unit 31. The W-phase semiconductor module 61 </ b> W includes a high-side arm and low-side arm W-phase transistors WH and WL in the power conversion circuit unit 31.

For example, in each of the semiconductor modules 61U, 61V, and 61W, the element rows of the respective phases are integrally fixed inside a resin mold body (not shown) formed by molding using an electrically insulating resin material. ing. In each phase element row, the transistors of the high side arm and the low side arm are arranged side by side in the X-axis direction in a plane parallel to the XY plane by the X-axis and the Y-axis, for example.
In each of the semiconductor modules 61U, 61V, and 61W, a cooling surface (not shown) that contacts the cooling body 62 is exposed to the outside from the surface of the resin mold body. The cooling surface of each semiconductor module 61U, 61V, 61W is, for example, the surface of a conductor provided on an insulating substrate connected to each element row inside the resin mold body. The insulating substrate is, for example, a DCB (Direct Copper Bonding) substrate. The DCB substrate includes a ceramic substrate and two copper plates provided on both surfaces of the ceramic substrate in the thickness direction. The two copper plates sandwich the ceramic substrate from both sides in the thickness direction and are electrically insulated by the ceramic substrate.

  In each of the semiconductor modules 61U, 61V, 61W, the positive electrode bus bar PI, the negative electrode bus bar NI, the input / output bus bar 51, and the control electrode 61a connected to each element row protrude outside the resin mold body. For example, in each of the three-phase semiconductor modules 61U, 61V, 61W stacked in the Z-axis direction, the positive electrode bus bar PI and the negative electrode bus bar NI are negative in the Y-axis direction from different positions in the Z-axis direction (that is, the stacking direction). The input / output bus bar 51 and the control electrode 61a protrude to the positive direction side in the Y-axis direction. The control electrode 61 a is connected to the circuit board 29 a of the gate drive unit 29 outside each resin mold body on the positive direction side in the Y-axis direction. The input / output bus bar 51 penetrates the circuit board 29a of the gate drive unit 29 and is connected to the input / output terminal Q1 and the three-phase connector 1b.

The external shape of each of the plurality of cooling bodies 62 is formed in, for example, a rectangular box shape. Inside each cooling body 62, a flow path through which the refrigerant flows is formed. The flow path of each cooling body 62 and the internal flow paths of a plurality of tubular members 63 (for example, the refrigerant supply pipe 63a and the refrigerant discharge pipe 63b) that connect the plurality of cooling bodies 62 in the stacking direction (that is, the Z-axis direction). , Communicate with each other.
Each cooling body 62 includes a mounting surface on which each semiconductor module 61 is mounted. Each of the cooling bodies 62 includes a plurality of fins (not shown) that function as heat sinks on the inner surface opposite to the mounting surface in the thickness direction (that is, a part of the wall surface forming the refrigerant flow path).

  The refrigerant supply pipe 63a and the refrigerant discharge pipe 63b that connect the plurality of cooling bodies 62 in the stacking direction are opposite to each other (that is, in the X-axis direction orthogonal to the stacking direction, with the plurality of semiconductor modules 61 interposed therebetween) They are arranged on both sides of the laminate 64 in the X-axis direction. For example, the refrigerant supply pipe 63a and the refrigerant discharge pipe 63b protrude outward from the end surface of the cooling body 62 forming the end of the stacked body 64 on the negative side in the Z-axis direction.

The power conversion device 1 includes a first connection portion 65 and a second connection portion 66 that are connected to the refrigerant supply pipe 63a and the refrigerant discharge pipe 63b.
The first connecting part 65 connects the refrigerant supply pipe 63 a and the first refrigerant circulation part 18 of the motor 12. The second connecting part 66 connects the refrigerant discharge pipe 63b and the second refrigerant circulation part 19 of the motor 12. For example, the outer shape of each of the first connecting portion 65 and the second connecting portion 66 is formed in a tubular shape. Each of the first connecting portion 65 and the second connecting portion 66 is formed to extend in the Z-axis direction between the stacked body 64 and the motor 12.
Each connection flow path formed inside each of the first connection part 65 and the second connection part 66, each internal flow path of the refrigerant supply pipe 63a and the refrigerant discharge pipe 63b, the first refrigerant flow part 18 and the second Each flow path of the refrigerant circulation unit 19 communicates with each other.

  The refrigerant that cools the power conversion device 1 first flows into the flow path of the first refrigerant circulation portion 18 from the refrigerant inlet 18 a formed in the housing 14 of the motor 12. Next, the refrigerant sequentially flows from the flow path of the first refrigerant flow section 18 to the connection flow path of the first connection section 65, the internal flow path of the refrigerant supply pipe 63a, and the flow path of each cooling body 62. Flowing. Next, the refrigerant sequentially flows from the flow path of each cooling body 62 to the internal flow path of the refrigerant discharge pipe 63b, the connection flow path of the second connection portion 66, and the flow path of the second refrigerant flow portion 19. Flowing. Next, the refrigerant flows out from the refrigerant outlet 19 a formed in the housing 14 of the motor 12.

The capacitor unit 23 includes a plurality of capacitor elements 23a. The external shape of each capacitor element 23a is, for example, formed in a cylindrical shape. The plurality of capacitor elements 23a are arranged on a predetermined arrangement surface SA in a direction parallel to the arrangement surface SA (for example, the X-axis direction and the Y-axis direction). For example, each of the plurality of capacitor elements 23a is arranged in a direction parallel to the arrangement surface SA, with the direction of the central axis being parallel to the direction orthogonal to the arrangement surface SA. For example, the arrangement surface SA is a plane parallel to the XY plane.
As shown in FIG. 6, each of the plurality of capacitor elements 23a is connected to the positive electrode bus bar 50p and the negative electrode bus bar 50n. For example, the positive electrode side connection end of each capacitor element 23a is provided at an end portion on the positive side in the Z-axis direction, and the negative electrode side connection end is provided at an end portion on the negative direction side in the Z-axis direction. Thereby, the positive electrode bus bar 50p is disposed across the Z-axis positive direction side ends of the plurality of capacitor elements 23a so as to cover the plurality of capacitor elements 23a from the positive direction side in the Z-axis direction. The negative electrode bus bar 50n is disposed across the Z-axis negative direction side ends of the plurality of capacitor elements 23a so as to cover the plurality of capacitor elements 23a from the negative direction side in the Z-axis direction. The positive electrode bus bar 50p and the negative electrode bus bar 50n are, for example, drawn from the X-axis negative direction side end portion 23A of the capacitor unit 23 to the negative direction side in the X-axis direction and the surface of the X-axis negative direction side end portion 23A of the capacitor unit 23. Are formed so as to be opposed to each other in the X-axis direction.

As shown in FIGS. 1, 4, and 5, the plurality of semiconductor modules 61 </ b> U, 61 </ b> V, 61 </ b> W constituting the stacked body 64 are stacked on a predetermined layout surface SB. The predetermined arrangement surface SB is, for example, a plane parallel to the arrangement surface SA, that is, the XY plane.
The capacitor unit 23 and the stacked body 64 composed of a plurality of semiconductor modules 61 (61U, 61V, 61W) are arranged side by side in a direction parallel to the mutual arrangement surfaces SA, SB. The stacking direction of the stacked body 64 is parallel to the orthogonal direction to the arrangement surface SB and parallel to the Z-axis direction as described above. When viewed from the direction parallel to the arrangement surface SB, for example, the Y-axis direction, at least a part of the capacitor unit 23 and the multilayer body 64 has a position in a direction orthogonal to the arrangement surfaces SA and SB (that is, the Z-axis direction). It is arranged so that it overlaps. For example, the thickness of each of the capacitor unit 23 and the multilayer body 64 in the Z-axis direction is formed to be substantially the same. Thereby, as viewed from the Y-axis direction, at least a part (for example, almost the whole) of the capacitor unit 23 and the multilayer body 64 in the Z-axis direction overlap each other.

Further, the DC connector 1a or the three-phase connector 1b is arranged so as to be adjacent to the capacitor unit 23 and the multilayer body 64 in a direction parallel to the mutual arrangement surfaces SA and SB. For example, the DC connector 1 a is disposed on the positive side in the X axis direction with respect to the multilayer body 64, and is disposed on the positive direction side in the Y axis direction with the multilayer body 64 with respect to the capacitor unit 23.
The circuit board 29a of the gate drive unit 29 includes, for example, a first part 29a1 and a second part 29a2 bent in the normal direction of the first part 29a1. The first portion 29a1 is arranged in parallel to the arrangement surfaces SA and SB (that is, the XY plane) so as to be laminated on the positive side in the Z-axis direction with respect to the capacitor unit 23 and the laminated body 64. The second portion 29a2 is arranged in parallel to the XZ plane so as to be arranged on the positive side in the Y-axis direction with respect to the stacked body 64.

The positive electrode bus bar PI and negative electrode bus bar NI of each semiconductor module 61U, 61V, 61W and the positive electrode bus bar 50p and negative electrode bus bar 50n of the capacitor unit 23 are connected to each other with the same polarity to form a conductor set 67.
As shown in FIGS. 7 and 8, the positive bus bar PI and the negative bus bar NI of each semiconductor module 61U, 61V, 61W are within the range ZA where the positions of the capacitor unit 23 and the stacked body 64 overlap in the Z-axis direction. It extends toward the capacitor unit 23 along a direction parallel to the arrangement surfaces SA and SB. For example, each positive electrode bus bar PI and negative electrode bus bar NI extend in the negative direction in the Y-axis direction from each semiconductor module 61U, 61V, 61W in a state where they face each other with the electrical insulating member 68 therebetween in the Z-axis direction. ing. For example, outside the semiconductor modules 61U, 61V, and 61W, the length of the negative electrode bus bar NI in the Y-axis direction is longer than the length of the electrically insulating member 68 in the Y-axis direction, and the positive bus bar PI is in the Y-axis direction. Is formed shorter than the length of the electrically insulating member 68 in the Y-axis direction. Thereby, on the negative side in the Y-axis direction, the electrically insulating member 68 has a portion protruding from the tip of the positive electrode bus bar PI, and the negative electrode bus bar NI has a portion protruding from the tip of the electric insulating member 68. is doing.

The positive electrode bus bar 50p and the negative electrode bus bar 50n of the capacitor unit 23 are stacked in a direction parallel to the arrangement surfaces SA and SB in a range ZA where the positions of the capacitor unit 23 and the stacked body 64 overlap in the Z-axis direction. It extends toward. For example, the positive electrode bus bar 50p and the negative electrode bus bar 50n extend in the Y-axis direction while facing each other with the electrical insulating member 69 interposed therebetween.
The positive electrode bus bar 50p and the negative electrode bus bar 50n protrude toward the semiconductor modules 61U, 61V, 61W, and are connected to the positive electrode bus bar PI and the negative electrode bus bar NI of the semiconductor modules 61U, 61V, 61W. And a negative electrode connecting portion 71n.
The positive electrode connecting portion 71p includes a first bent portion 72p and a second bent portion 73p, and the negative electrode connecting portion 71n includes a first bent portion 72n and a second bent portion 73n.

For example, the positive electrode connecting portion 71p and the negative electrode connecting portion 71n extend in the positive direction in the Y-axis direction while facing each other with the electrical insulating member 69 interposed therebetween in the X-axis direction. The first bent portions 72p and 72n face each other across the electrical insulating member 69 so as to extend along the outer periphery of the capacitor element 23a from each of the positive electrode connecting portion 71p and the negative electrode connecting portion 71n. It is bent in the positive direction of the X axis direction. The second bent portions 73p and 73n are bent in the positive direction in the Y-axis direction from the first bent portions 72p and 72n in a state of facing each other with the electrical insulating member 69 interposed therebetween.
For example, the length in the Y-axis direction of the second bent portion 73p on the positive electrode side is formed longer than the length in the Y-axis direction of the electrically insulating member 69, and the length in the Y-axis direction of the second bent portion 73n on the negative electrode side. The length is shorter than the length of the electrically insulating member 69 in the Y-axis direction. Thereby, on the positive side in the Y-axis direction, the electrical insulating member 69 has a portion protruding from the tip of the second bent portion 73n on the negative electrode side, and the second bent portion 73p on the positive electrode side is the electrically insulating member. It has a portion protruding from the tip of 69.

  As shown in FIG. 8, each of positive electrode bus bar PI and negative electrode bus bar NI extending from each semiconductor module 61U, 61V, 61W in the negative direction in the Y-axis direction, and positive electrode bus bar 50p extending from capacitor unit 23 in the positive direction in the Y-axis direction. In addition, the second bent portions 73p and 73n of the negative electrode bus bar 50n are overlapped and connected in the orthogonal direction (that is, the Z-axis direction) to the arrangement surfaces SA and SB.

As described above, according to the power conversion device 1 of the present embodiment, the capacitor unit 23 and the multilayer body 64 in the Z-axis direction are overlapped with each other in the Z-axis direction when viewed from the Y-axis direction. The entire thickness of the device 1 can be suppressed. Further, the plurality of capacitor elements 23a constituting the capacitor unit 23 are arranged in a direction (for example, the X-axis direction and the Y-axis direction) parallel to the arrangement surface SA on the predetermined arrangement surface SA. It is possible to suppress an increase in the thickness of 23 in the Z-axis direction.
Further, in the range ZA where the positions of the capacitor unit 23 and the laminate 64 in the Z-axis direction overlap, the positive electrode bus bars PI, 50p and the negative electrode bus bars NI, 50n extend in a direction parallel to the arrangement surfaces SA, SB. Thereby, the capacitor unit 23 and each semiconductor module 61U, 61V, 61W can be efficiently connected.

Moreover, the positive electrode bus bar 50p and the negative electrode bus bar 50n include the first bent portions 72p and 72n bent along the outer periphery of the capacitor element 23a, so that the positive electrode bus bar 50p and the negative electrode bus bar 50n can be arranged efficiently. it can.
Further, the positive electrode bus bar 50p and the negative electrode bus bar 50n have the first bent portions 72p and 72n and the second bent portions 73p and 73n which are bent in a state of facing each other, so that the lengths of the portions not facing each other are increased. While suppressing the increase, the semiconductor modules 61U, 61V, 61W are drawn out in an arrangement state facing each other. Accordingly, an increase in stray inductance between each of the semiconductor modules 61U, 61V, 61W and the capacitor unit 23 can be suppressed by canceling the mutual magnetic fluxes and suppressing an increase in the length of the portions not facing each other.
Even in the case of including the stacked body 64 composed of a plurality of semiconductor modules 61, the positive electrode bus bar PI and the negative electrode bus bar NI extending from each semiconductor module 61 have overlapping positions of the capacitor unit 23 and the stacked body 64 in the Z-axis direction. In the range ZA that extends from the different positions in the stacking direction toward the capacitor unit 23, the entire thickness of the power conversion device 1 can be suppressed and the wiring efficiency can be improved. .

  Further, the flow path of the refrigerant in the laminated body 64 and the flow paths of the first refrigerant flow portion 18 and the second refrigerant flow portion 19 of the motor 12 are connected by the first connection portion 65 and the second connection portion 66. For example, compared with the case where each of the power conversion device 1 and the motor 12 includes an independent cooling system, the cooling system can be suppressed from becoming complicated, and the cooling system can be formed compactly.

Hereinafter, modifications of the embodiment will be described.
In the above-described embodiment, the motor 12 and the power conversion device 1 are arranged at the rear of the vehicle body in the front-rear direction of the vehicle 10, but are not limited thereto.
The motor 12 and the power conversion device 1 may be arranged at appropriate positions in the vehicle 10, for example, in the power mounting chamber 10b at the front of the vehicle body provided in front of the dashboard lower panel 10a shown in FIG.

In the above-described embodiment, the power conversion device 1 is disposed on the upper side of the motor 12 in the vertical direction of the vehicle 10, but is not limited thereto.
The power conversion device 1 may be disposed at an appropriate position with respect to the motor 12, for example, below the motor 12 in the vertical direction of the vehicle 10.

In the above-described embodiment, when the refrigerant that cools the power conversion device 1 and the refrigerant that cools the motor 12 are the same, instead of the first refrigerant circulation unit 18 and the second refrigerant circulation unit 19, You may use the refrigerant | coolant distribution | circulation part of the motor cooling system provided in the motor 12. FIG.
In this case, the power conversion device 1 and the motor 12 can be integrally cooled, and the number of parts required for the configuration of the cooling system can be reduced, so that a compact cooling system can be configured.

  In addition, in embodiment mentioned above, although the power converter device 1 was mounted in the vehicle 10, it is not limited to this, You may mount in another apparatus.

  The embodiments of the present invention are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 ... Power converter device, 10 ... Vehicle, 11 ... Battery, 12 ... Motor, 14 ... Housing, 18a ... Refrigerant inlet, 19a ... Refrigerant outlet, 21 ... Power module, 22 ... Reactor, 23 ... Capacitor unit (capacitor) , 23a ... capacitor element, 29 ... gate drive unit, 29a ... circuit board, 31 ... power conversion circuit unit, 50p ... positive electrode bus bar (positive electrode conductor), 50n ... negative electrode bus bar (positive electrode conductor), 51 ... input / output bus bar, 61U 61V, 61W ... Semiconductor module, 62 ... Cooling body, 64 ... Laminated body, 65 ... First connecting portion, 66 ... Second connecting portion, 67 ... Conductor set, 72p, 72n ... First bending portion, 73p, 73n ... 2nd bending part, NI ... Negative electrode bus bar (negative electrode conductor), PI ... Positive electrode bus bar (positive electrode conductor), UH, VH, WH ... High side arm Range each transistor (switching element), UL, VL, WL ... each transistor of the low side arm (switching element), SA ... placement surface, SB ... placement surface, a position in ZA ... Z-axis direction overlap

Claims (4)

A semiconductor module comprising a plurality of switching elements;
A capacitor electrically connected to the semiconductor module;
A conductor set comprising a positive electrode conductor and a negative electrode conductor connecting the semiconductor module and the capacitor;
With
When viewed from a direction parallel to the arrangement surface on which the capacitor is arranged, at least a part of the semiconductor module and the capacitor is arranged such that positions in the direction orthogonal to the arrangement surface overlap,
The conductor set is along a direction parallel to the arrangement surface within a range in which the positions of the semiconductor module and the capacitor in the orthogonal direction overlap in a state where the positive electrode conductor and the negative electrode conductor face each other. Extending between the semiconductor module and the capacitor,
The power converter characterized by the above-mentioned. The positive electrode conductor and the negative electrode conductor extending from the capacitor toward the semiconductor module are:
In a range where the positions in the orthogonal direction overlap, the bent portions are bent in a state of facing each other.
The power conversion apparatus according to claim 1. The plurality of capacitor elements constituting the capacitor are arranged in a direction parallel to the arrangement surface.
The power converter according to claim 1 or 2, wherein A laminate formed by laminating a plurality of the semiconductor modules;
A plurality of mutually facing positive and negative electrode conductors extending from each of the plurality of semiconductor modules toward the capacitor at different positions in the stacking direction of the stacked body;
Comprising
The power conversion device according to any one of claims 1 to 3, wherein:

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