JP2019161197A - Stack tray for transporting ring frames - Google Patents

Abstract

To solve the problem in which, when transporting semiconductor wafers and various substrates mounted on a ring frame, although they are generally shipped in a two-piece box container with 25 pieces, they are often transported with 13 sheets or less without storing 25 pieces due to weight and strength problems, which is a great waste of that volume, also, in the same box type container, the ring frame cannot be completely suppressed and shaving powder is generated and contamination may become a problem in the next process.SOLUTION: Provided is a tray 1 capable of transporting with a minimum volume by storing ring frames 2 detachably in the tray 1 one by one and stacking the required number of pieces for transportation while maintaining a certain interval and completely fixing and transporting each tray and ring frame by attaching lids 3, 4 shared on a top and bottom to the bottom and top of stacked trays and simply sealing and bundling with commercially available films.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a tray for transporting a ring frame that holds a semiconductor wafer or the like.

  As a container for transporting the ring frame, there is a two-piece box-type container shown in FIG. 7 capable of storing 25 sheets vertically with a certain interval in order to avoid touching the surface of the mounted wafer.

  The box-type container has a structure that suppresses the ring frame by combining and locking two pieces.

  With a box-type container for an 8-inch ring frame, when storing a stainless steel ring frame, because of the weight of the ring frame and the fear of strength during transportation, even a container that can hold 25 sheets can store only 13 sheets at maximum. In many cases, a container of 25 sheets is used even when storing less than 13 sheets, and the volume of the container is greatly wasted during transportation and storage.

  Box type containers have a structure that holds the ring frame at one location at the upper part of the division, but due to the clearance between the groove of the container and the ring frame, there is a problem that deviation occurs due to impact or vibration during conveyance, and the powder of the container is generated. ing.

  A wafer with a glass substrate or a wafer with a 3D structure does not touch the wafer itself, so a box-type container with a certain interval is required. In addition to preventing cracking, it does not generate dust such as shavings. Transport is required.

  Due to its size and weight, the 12-inch ring frame box-type container is mainly a large container with 13 sheets from the beginning. If you want to transport more than that, you will need to prepare multiple containers. Even when storing less than that, the container is used, resulting in great waste.

  As shown in FIG. 1, the tray 1 has a substantially circular shape, and as shown in FIG. 3, is a flat tray that can detachably store one ring frame 2.

  As shown in FIG. 2, a semiconductor wafer or the like is affixed to a dicing film 6 and a single sheet mounted on the ring frame 2 is accommodated, and an arbitrary number of sheets can be stacked to convey a minimum necessary volume. It is characterized by things.

  The ring frames housed in the upper tray and the lower tray have an appropriate clearance 5, which not only absorbs warping and distortion of the tray and ring frame, but also can absorb shock when stacked.

  The outermost stepped stack structure shown in FIG. 4 extends around the entire circumference, and by stacking the steps, the strength of the upper and lower steps can be complemented and the strength against impact from all directions can be obtained.

  When transporting, as shown in FIG. 2, cover 3 and 4 with a commercially available binding tape and each ring frame must be completely fixed after lids 3 and 4 are provided at the bottom of the uppermost stage for easy sealing. Therefore, the generation of shavings is suppressed. The lowermost lid 4 has a structure that fits inside the hollow portion in the center of the tray, and the wall of the tray and the lid wall 8 interfere with each other, so that the strength that can withstand the weight when stacked in multiple stages can be supplemented. I can do it.

  Here, the tray in the claims may be not only a resin resistant to shaving by injection molding but also an elastomer having elasticity or buffer absorption. Similarly, the upper and lower lids may be made of a buffering material, a different molding method, or a material for increasing the overall strength.

  According to the present invention, the price, volume, weight, and transportation cost can be minimized as compared with the box-type container.

  From the overall strength when the trays are stacked and bundled with a commercially available tape, the original 25 ring frames can be transported.

  In accordance with “JIS Z0202: Packaged cargo, free drop test, Level II”, a drop test when 25 or 13 stainless steel 8-inch ring frames were stored in the main tray according to our packaging method. It has been confirmed that there is no occurrence of step collapse and shavings.

  In the process, it is possible to store and stack any number of layers, and space can be reduced.

  Even in the next generation 18-inch wafer, space saving can be achieved by this embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

  A preferred embodiment of the tray according to the present invention will be described. The material used is a material kneaded with a permanent antistatic agent that does not use carbon from the viewpoint of dust and contamination.

  Space is provided at four locations and can be pointed at the time of flat placement. The operator can easily take out the ring frame and at the same time, by providing a flat part, it is possible to suck the ring frame and the main tray. The shape can be automatically conveyed.

  Tab spaces are provided at two locations on the outer periphery to enable display of product numbers, lots, and the like.

  Hereinafter, a preferred embodiment of a tray according to the present invention will be described with reference to the drawings.

  As shown in FIG. 2, the tray 1 in this embodiment has a substantially circular shape, has a structure that can be stacked in a flat manner, and is formed with a minimum shape having strength to hold the ring frame 2. The The semiconductor wafer 7 is affixed to the dicing film 6 and mounted on the ring frame 2, and can be detachably stored in the tray 1.

  Further, the tray 1 has a stacked structure as shown in FIGS. 3 to 4, exhibits a stacking function and a shift prevention function, and can be stacked in an arbitrary number.

  The ring frame and the upper tray shown in FIG. 2 have an appropriate clearance 5, which absorbs each distortion and warp when stacked, and also absorbs impact during transportation.

  FIGS. 3 to 5 are image diagrams in which a ring frame on which a semiconductor wafer is mounted is stored in a tray and stacked in a stacked manner, and upper and lower lids 3 and 4 are attached. At the bottom, the lid is inverted and specified.

  2 is an image diagram in which the lowermost lid 4 is fitted in the central cavity of the tray 5. The lid 4 is fitted inside the central cavity of the tray 1, and the tray wall and the lid wall 8 interfere with each other, so that the strength that can withstand the weight when stacked in multiple stages can be complemented.

FIG. 6 shows a state in which the stacked trays are bound in a cross shape with a film.
The film uses a low dusting material, and may be a magic band, a polyester belt, a PP band, or the like.

  FIG. 3 is a perspective explanatory view schematically showing an embodiment of a tray according to the present invention.   It is a perspective explanatory view which accommodated the ring frame in embodiment of the tray which concerns on this invention.   FIG. 6 is a partial cross-sectional explanatory diagram schematically illustrating a stacked state in the embodiment of the tray according to the present invention.   It is a partial cross-section solid explanatory drawing which shows the state where the tray in the embodiment concerning the present invention was piled up in a simulated manner.   FIG. 4 is a three-dimensional view schematically illustrating a stacked state in which lids are vertically attached in an embodiment of a tray according to the present invention.   It is a three-dimensional view schematically showing a state where trays according to the present invention are stacked and bound by a film.   It is a typical figure of 25 pieces and a 2 piece type box type container.

DESCRIPTION OF SYMBOLS 1 Tray 2 Ring frame 3 Upper lid 4 Lower lid 5 Clearance 6 Dicing film 7 Semiconductor wafer 8 The figure which fits the lid 4 in the tray

Claims (5)

  A tray that stores a single ring frame carrying semiconductor wafers, etc., and can be stacked in the required number.   The outermost tiered structure is wound around the entire circumference, can keep the ring frame at a constant interval, and can withstand impact loads from all directions. 2. The tray according to claim 1, wherein the trays are further stacked to complement the strength of the upper and lower stages, and the overall strength can be maintained.   2. The tray according to claim 1, wherein a common lid can be attached to the uppermost lowermost stage of the stacked trays.   2. The tray according to claim 1, wherein at the lowermost stage, the strength can be complemented by fitting a lid in the hollow portion at the center of the tray.   The tray according to claim 1, wherein the ring frame and the tray can be completely fixed by binding the stacked trays with a commercially available binding tape.