JP2019160933A - Adjustment device, adjustment method, and adjustment program - Google Patents

Abstract

To provide an adjustment device or the like that can alleviate a deviation in inclination of an electronic component relative to a substrate, including a biaxial rotational component in a substrate plane, which occurs when the component is fixed to the substrate.SOLUTION: An adjustment device includes a derivation unit that derives measurement information related to the inclination in the first rotation direction using, as an axis, a first straight line in the upper surface of a substrate with respect to the substrate of an electronic component installed at the bonding position supplied with an unsolidified adhesive on the substrate and the inclination in the second rotation direction using the second straight line in the upper surface as an axis, and an inclination adjusting unit that performs adjustment to cause the measurement information to approach setting information related to the inclination in the first rotation direction and the inclination in the second rotation direction for a predetermined period after the installation.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for adjusting the installation state of components.

  When fixing an electronic component to a board | substrate, the method of installing an electronic component on the board | substrate which supplied the unsolidified adhesive agent on the upper surface, and solidifying an adhesive agent is generally used.

  When the electronic component is fixed on the substrate with an adhesive, the angle formed by the upper surface of the electronic component with the substrate may need to be a predetermined angle. In that case, before mounting the electronic component on the substrate or the like, the inclination of the upper surface of the electronic component is measured, and after setting the inclination to be within a predetermined range, the electronic component is installed on the substrate. Then, the electronic component is fixed to the substrate by subsequent solidification of the adhesive.

  Here, in Patent Document 1, a thermosetting adhesive is applied to a component mounting position of a substrate, a component adsorbed by a suction head is placed on the component mounting position of the substrate, and the thermosetting adhesive is heated and cured. An implementation method is disclosed.

JP 2011-009654 A

  However, in the method of fixing the electronic component to the substrate by setting the tilt and then setting the electronic component on the substrate after the adhesive is solidified, the tilt of the upper surface of the electronic component deviates from the set value due to shrinkage during curing of the adhesive. There is a case. The shift may include a tilt shift including a rotation component about two axes in the substrate plane.

  An object of the present invention is to provide an adjustment device or the like that can alleviate a deviation in inclination of an electronic component relative to a substrate, including a biaxial rotational component in the substrate plane, which occurs when the electronic component is fixed to the substrate. .

  The adjustment device according to the present invention is a first rotation direction of an electronic component installed at an adhesion position supplied with an unsolidified adhesive on a substrate, with respect to the substrate, with a first straight line in the upper surface of the substrate as an axis. And a derivation unit for deriving measurement information relating to the inclination in the second rotation direction about the second straight line in the upper surface, and the measurement information as the inclination in the first rotation direction and the second rotation direction And an inclination adjusting unit that performs adjustment for bringing the setting information close to the inclination information for a predetermined period after the installation.

  The adjusting device of the present invention can alleviate the deviation of the inclination of the electronic component relative to the substrate, including the biaxial rotational component in the substrate plane, which occurs when the electronic component is fixed to the substrate.

It is a block diagram showing the example of a structure of the adjustment apparatus of this embodiment. It is a conceptual diagram showing the example of a structure of an operation | movement part. It is a conceptual diagram showing the example of a processing flow of the process which a process part performs. It is a block diagram showing the minimum composition of the adjustment device of an embodiment.

[Configuration and operation]
FIG. 1 is a block diagram illustrating a configuration of an adjustment apparatus 101 that is an example of the adjustment apparatus according to the present embodiment.

  The adjustment apparatus 101 includes an operation unit 201 and a processing unit 401. A specific example of the operation unit 201 will be described later with reference to FIG.

  The operating unit 201 includes a measuring unit 202, a moving unit 203, an adjusting unit 204, and a gripping unit 205.

  The gripper 205 grips an electronic component (not shown).

  The moving unit 203 moves the grip unit 205 to a predetermined relative position with respect to a substrate (not shown) according to an instruction from the processing unit 401. Due to the movement of the gripper 205, the electronic component gripped by the gripper 205 moves relative to the substrate. The movement may be to move the gripper 205 or to move the substrate.

  The measuring unit 202 measures tilt information representing the tilt of the electronic component in accordance with an instruction from the processing unit 401. The inclination information may be the inclination itself. Then, the measurement unit 202 sends the measured tilt information to the processing unit 401.

  The adjustment unit 204 adjusts the inclination of the electronic component according to an instruction from the processing unit 401.

  For example, the processing unit 401 includes a central processing unit (not shown) and a recording unit such as a memory or a hard disk.

  The processing unit 401 holds in advance in the recording unit allowable range information indicating the allowable range of the tilt information.

  When the unsolidified adhesive is supplied onto the substrate, the processing unit 401 installs the electronic component held by the holding unit 205 at a predetermined position where the adhesive is supplied. Let

  Then, the processing unit 401 causes the measurement unit 202 to acquire the tilt information.

  When the tilt information is sent from the measurement unit 202, the processing unit 401 determines whether the tilt information is included in the allowable range.

  When the processing unit 401 determines that the inclination information is not included in the allowable range, the processing unit 401 causes the adjustment unit 204 to set the inclination information to a predetermined value (for example, a center value) included in the allowable range. The inclination of the electronic component in the approaching direction is adjusted.

  The processing unit 401 repeats the acquisition instruction to the measurement unit 202 and the adjustment instruction to the determination and adjustment unit 204 for a predetermined period until the adhesive hardens to some extent.

  As a method for the adjustment device 101 to acquire the inclination of the substrate, for example, an indirect angle measurement method or a direct angle measurement method described below can be used.

  When using the indirect angle measurement method, the adjustment device 101 first sets the distance between the upper surface of the electronic component and the reference surface of the displacement sensor using a displacement sensor such as a laser displacement meter (not shown) provided in the measurement unit 202. Measure at more than one measurement point. As the displacement sensor, for example, LK-G5000 series manufactured by Keyence Corporation can be used.

  Then, the processing unit 401 calculates a plane expression representing the plane of the upper surface of the electronic component from the position of the measurement point and the measurement value. Here, it is assumed that the measurement point is on a plane. When the number of measurement points is four or more, the processing unit 401 approximates by the planar least square method or the like. Then, the processing unit 401 calculates an inclination in a predetermined direction (X direction) of the plane and a direction perpendicular to the direction (Y direction) from the plane formula.

  The operation unit 201 may include a displacement sensor driving XY stage for moving the displacement sensor in the XY direction with respect to the electronic component.

  On the other hand, when the adjustment device 101 uses the direct angle measurement method, the measurement unit 202 includes a commercially available autocollimator. The operation unit 201 directly measures the angle of the upper surface of the electronic component using the autocollimator. In that case, the autocollimator irradiates the upper surface of the electronic component with laser light. The laser light is, for example, a semiconductor laser. The reflected light from the upper surface of the laser light is incident on the CCD of the autocollimator. Here, CCD is an abbreviation for Charge Coupled Device. The autocollimator derives the inclination of the upper surface of the electronic component based on the position where the reflected light is received.

  The direct angle measurement method is effective for detecting the inclination of an electronic component having a mirror-like upper surface that reflects laser light well.

  Further, for gripping the electronic component by the gripper 205, for example, a peripheral part suction method or a side surface gripping method can be used. The peripheral portion suction method is a method in which a peripheral portion that is a portion other than the position where the inclination information is acquired in the electronic component is vacuum-sucked. Further, the side surface gripping method is a method in which a side surface of an electronic component is sandwiched and gripped by an air type or an electric chuck.

  The moving unit 203 includes, for example, a moving stage for moving the grip unit 205 relative to the substrate in the X direction, the Y direction, and the Z direction. Here, the X direction is a certain direction in the upper surface of the substrate. The Y direction is a direction in the upper surface that is perpendicular to the X direction. The Z direction is a direction perpendicular to the X direction and the Y direction.

  As described later with reference to FIG. 2, the moving stage can be configured by combining, for example, an X stage, a Y stage, and a Z stage.

  The moving stage may be a combination of a first moving stage that moves the gripper 205 and a second moving stage that moves the substrate. Further, the moving stage may include a plurality of each of the X stage, the Y stage, and the Z stage.

In addition, the adjustment unit 204 can rotate the gripping unit 205, for example, a combination of a θ _X stage, a θ _Y stage, and a θ _Z stage that can rotate around the axes in the X direction, the Y direction, and the Z direction. Provide a stage. As each of the θ _X stage and the θ _Y stage, for example, an automatic swivel stage SA series manufactured by Kozu Seiki Co., Ltd. can be used. As examples of the theta _Z stage 211, for example, it can be used automatic rotation stage RA series manufactured by Kozu Seiki Corporation.

  FIG. 2 is a conceptual diagram illustrating a configuration of an operation unit 201a that is an example of the operation unit 201 illustrated in FIG.

  FIG. 2 shows a substrate 706 and an electronic component 701 in addition to the operation unit 201a.

  FIG. 2 shows a state in which the substrate 706 is installed on the substrate fixing unit 216 and the electronic component 701 is installed at an adhesive supply location (adhesion location) on the substrate 706. The operation unit 201a is in a different position (not shown) different from the position shown in FIG. 2 before the adhesive is supplied onto the substrate 706.

Operation unit 201a includes a tilt sensor 301, a camera 306, a Y stage 207, an X stage 206, and theta _Z stage, and a substrate fixing portion 216. The operation unit 201a further includes a member 251, a Z stage 256, a θ _Y stage 261, a θ _X stage 266, a member 271, and gripping portions 276a and 276b.

  A surface 901a which is a lower surface of the Y stage 207 is fixed on a surface 903 which is an upper surface of the base 711a. The Y stage 207 moves the surface 901b, which is the upper surface of the Y stage 207, in the Y direction shown in FIG. 2 according to a control signal sent from the processing unit 401 shown in FIG. By this movement, the X stage 206 fixed to the surface 901b moves in the Y direction.

The X stage 206 moves the surface 901d, which is the upper surface of the X stage 206, in the X direction shown in FIG. 2 by a control signal sent from the processing unit 401 shown in FIG. By the movement, theta _Z stage 211 that is fixed to a surface 901d is moved in the X direction.

The θ _Z stage 211 rotates the surface 901f, which is the upper surface of the θ _Z stage 211, in the θ _Z direction shown in FIG. 2 by a control signal sent from the processing unit 401 shown in FIG. By the rotation, the substrate fixing portion 216 and the substrate 706 fixed to the board fixing portion 216 that is fixed to a surface 901f rotates the theta _Z direction.

The above, Y stage 207, X stage 206, the combination of theta _Z stage 211 and the substrate fixing portion 216, a control signal from the processing unit 401, the substrate 706 moves in the X and Y directions, in the theta _Z direction Can be rotated.

  The member 251 is fixed to the base 711a by a member (not shown). The surface 902a of the member 251 is parallel to the XZ plane.

  The surface 902b of the Z stage 256 is fixed to the surface 902a of the member 251.

The Z stage 256 moves the θ _Y stage 261 having the surface 902d fixed to the surface 902c in the Z direction illustrated in FIG. 2 according to a control signal sent from the processing unit 401 illustrated in FIG.

The θ _Y stage 261 tilts the θ _X stage 266 having the surface 902f fixed to the surface 902e in the θ _Y direction illustrated in FIG. 2 by a control signal sent from the processing unit 401 illustrated in FIG.

The θ _X stage 266 includes a member 271 in which a surface 902h is fixed to a surface 902g and a gripping portion 276a in which one of end portions is fixed to the member 271 in accordance with a control signal sent from the processing unit 401 shown in FIG. the 276b, tilted theta _X direction depicted in Figure 2. In FIG. 2, illustration of an air supply device and the like for causing the gripping portions 276a and 276b to grip the electronic component 701 is omitted.

As described above, the combination of the member 251, the Z stage 256, the θ _Y stage 261, the θ _X stage 266, and the member 271 moves the gripping units 276 a and 276 b in the Z direction by the control signal from the processing unit 401, and θ _X Can be tilted in the direction and θ _Y direction.

The tilt sensor 301 is a tilt sensor that measures tilt by the direct angle measurement method described above. The tilt sensor 301 irradiates the measurement point a of the surface 901 l that is the upper surface of the electronic component 701 with a light emitting unit (not shown) below the tilt sensor 301 based on control information from the processing unit 401. Reflected light (not shown) of the laser light 801 is incident on a CCD sensor (not shown) provided in the lower part of the tilt sensor 301. The tilt sensor 301 derives each angle in the θ _X and θ _Y directions representing the tilt of the surface 901l at the measurement point a based on the incident position, and sends it to the processing unit 401 shown in FIG.

  The camera 306 images the electronic component 701 in accordance with an instruction from the processing unit 401 illustrated in FIG. The shooting targets related to the shooting include the position specifying marks A and B provided on the surface 901 l of the electronic component 701 and the position specifying marks C and D provided on the surface 901 j of the substrate 706. . The camera 306 sends image information related to the shooting to the processing unit 401 shown in FIG.

The processing unit 401 receives image information from the mark A to D included in the image in which the image information is represented, to derive the slope of the position and theta _Z direction of the electronic component 701.
[Processing flow]
FIG. 3 is a conceptual diagram illustrating an example of a processing flow of processing performed by the processing unit 401 illustrated in FIG. In the following description, it is assumed that the operation unit 201 illustrated in FIG. 1 is the operation unit 201a illustrated in FIG.

  For example, the processing unit 401 starts the process illustrated in FIG. 3 by inputting start information from the outside.

  Then, the processing unit 401 determines whether the electronic component 701 is installed at a position between the gripping units 276a and 276b on the substrate 706 as the processing of S101. The processing unit 401 performs the determination by, for example, determining whether or not installation completion information is input from the outside.

  The processing unit 401 performs the process of S102 when the determination result of the process of S101 is yes.

  On the other hand, when the determination result of the process of S101 is no, the processing unit 401 performs the process of S101 again.

  When performing the process of S102, the processing unit 401 causes the gripping units 276a and 276b to grip the electronic component 701 as the same processing.

  Then, the processing unit 401 specifies the positions of the marks A and B that are the positioning marks on the upper surface of the electronic component 701 and the marks C and D that are the positioning marks on the upper surface of the substrate 706 shown in FIG. The processing unit 401 performs the identification based on the image information that the camera 306 has captured and sent.

  Then, the processing unit 401 derives the direction and distance in which the substrate 706 should be moved in the XY plane so that the electronic component 701 is positioned above the bonding position of the substrate 706 as the processing of S104. Here, the adhesion position is a position where the electronic component 701 should be adhered to the substrate 706 with an adhesive. It is assumed that the processing unit 401 holds in advance information representing the positional relationship between the marks A and B and the marks C and D when the electronic component 701 is above the bonding position. Then, the processing unit 401 derives the direction and distance for moving the substrate 706 so that the positional relationship is satisfied.

  Then, the processing unit 401 determines whether an unsolidified adhesive is supplied to the bonding position. The processing unit 401 performs the determination by, for example, determining whether or not notification information indicating a supply completion sent from an adhesive supply device (not shown) is input.

  The processing unit 401 performs the process of S106 when the determination result of the process of S105 is yes.

  On the other hand, the process part 401 performs the process of S105 again, when the determination result by the process of S105 is no.

When performing the process of S106, the processing unit 401 instructs the operation unit 201a to move the substrate 706 so that the electronic component 701 is positioned above the bonding position. Processing unit 401, the instruction is carried out by sending a respective control signal specifying a movement direction and distance of the Y stage 207, X stage 206 and theta _Z stage 211 depicted in FIG.

  And the process part 401 pinpoints the position of the Z direction of the electronic component 701 as a process of S107. The processing unit 401 performs the specification by causing the tilt sensor 301 to specify the position. Here, it is assumed that the tilt sensor 301 has a function of a laser displacement meter.

  And the process part 401 determines whether the Z direction position specified by the process of S107 is an allowable range as a process of S108. Here, it is assumed that the processing unit 401 holds information on the allowable range of the Z-direction position in advance.

  Then, the processing unit 401 causes the operation unit 201a to adjust the position of the electronic component 701 in the Z direction by the process of S109. When performing the instruction, the processing unit 401 first derives a distance to which the electronic component 701 should be lowered in the Z direction. The processing unit 401 holds in advance the position in the Z direction of the electronic component 701 when the electronic component 701 is bonded to the substrate 706. The Z direction position is included in the allowable range of the Z direction position described above. Then, the processing unit 401 derives the distance from the Z direction position and the Z direction position derived by the process of S107. Then, the processing unit 401 sends control information including the distance and the direction of movement to the Z stage 256.

And the process part 401 specifies the inclination of the upper surface of the electronic component 701 as a process of S110. The processing unit 401 performs the identification by causing the tilt sensor 301 to measure the tilt. Processing unit 401, the inclination information the inclination sensor 301 is sent, the top surface, to derive a tilt angle of the tilt angle and theta _Y direction theta _Z direction.

Then, the processing unit 401, as processing of S111, each of the inclination angle of the inclination angle and theta _Y direction the derived theta _Z direction by step S110 it is determined whether the allowable range. The processing unit 401 is assumed to previously hold the information of the allowable range for each of the inclination angle of the inclination angle and theta _Y direction theta _Z direction.

  The processing unit 401 performs the process of S112 when the determination result of the process of S111 is yes.

  On the other hand, the process part 401 performs the process of S113, when the determination result by the process of S111 is no.

When performing the processing of S112, the processing unit 401 causes the operation unit 201a to adjust the inclination of the gripping units 207a and 276b as the same processing. Processing unit 401, when to perform the adjustment, to derive the inclination adjustment angle for each of the inclination angle of the inclination angle and theta _Y direction theta _x-direction. Processing unit 401 holds in advance the setting value for each of the inclination angle of the inclination angle and theta _Y direction theta _X direction. Then, by deriving a difference between each of each said set values of the inclination angle of the inclination angle and theta _Y direction specified _X direction by the processing in S110, deriving the adjustment angle. Then, the processing unit 401 sends the control information including the adjustment angle theta _Y direction theta _Y stage 261. Processor 401 also sends control information including the adjustment angle theta _X direction theta _X stage 266.

  Then, the processing unit 401 determines whether the time T has elapsed since the time when the processing of S106 was completed as the processing of S212. Here, the time T is a time set in advance so that it can be assumed that the adhesive has solidified. It is assumed that the processing unit 401 is in an environment where a timer can be used.

  If the determination result obtained in step S113 is yes, the processing unit 401 ends the process illustrated in FIG.

On the other hand, the process part 401 performs the process of S107 again, when the determination result by the process of S113 is no.
[effect]
When the electronic device is fixed on the substrate with an adhesive, the adjustment device of the present embodiment corrects the inclination angle if the inclination angle of the electronic component with respect to the substrate changes during the solidification process. The inclination angle adjusted by the adjusting device is a first rotation direction related to rotation about a straight line in the X direction in the plane of the upper surface of the electronic component, and rotation about a straight line in the Y direction in the plane. And the second rotation direction. The adjustment device may adjust the inclination when the adjustment causes an inclination in a rotation direction including at least one of the first rotation direction and the second rotation direction in the process.

  In addition, the axis | shaft of the rotation direction which concerns on the shift | offset | difference of the inclination of the electronic component which the adjustment apparatus of embodiment specifies may be two axes in the upper surface of a board | substrate. Moreover, the axis | shaft of the rotation direction which concerns on the shift | offset | difference of the inclination of the electronic component which the said adjustment apparatus adjusts should just be two axes in the said upper surface.

  FIG. 4 is a block diagram illustrating the configuration of the adjustment device 101x, which is the minimum configuration of the adjustment device according to the embodiment.

  The adjustment device 101x includes a derivation unit 401x and an inclination adjustment unit 201x.

  The deriving unit 401x derives measurement information related to the inclination in the first rotation direction and the inclination in the second rotation direction. Here, the first rotation direction is the rotation of the electronic component installed at the bonding position supplied with the unsolidified adhesive on the substrate with respect to the substrate about the first straight line in the upper surface of the substrate. Direction. The second rotation direction is a rotation direction with the second straight line in the upper surface as an axis.

  The inclination adjusting unit 201x performs an adjustment for bringing the measurement information closer to setting information related to the inclination in the first rotation direction and the inclination in the second rotation direction for a predetermined period after the installation.

  As described above, the adjustment device 101x can relieve the deviation of the inclination of the electronic component relative to the substrate, including the biaxial rotational component in the substrate surface, which occurs when the electronic component is fixed to the substrate with the adhesive.

  Therefore, the adjusting device 101x has the effects described in the section [Effects of the Invention] by the above configuration.

The derivation unit 401x illustrated in FIG. 4 is, for example, a combination of the measurement unit 202 illustrated in FIG. 2 and a part that performs processing related to the derivation of the measurement information in the processing unit 401. Further, the tilt adjustment unit 201x is, for example, a combination of the adjustment unit 204 illustrated in FIG. 1 and the θ _Y stage 261 and the θ _X stage 266 illustrated in FIG.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and further modifications, substitutions, and adjustments may be made without departing from the basic technical idea of the present invention. Can be added. For example, the configuration of the elements shown in each drawing is an example for helping understanding of the present invention, and is not limited to the configuration shown in these drawings.

Further, a part or all of the above-described embodiment can be described as in the following supplementary notes, but is not limited thereto.
(Appendix 1)
An inclination of a first rotation direction about the first straight line in the upper surface of the substrate with respect to the substrate and an electronic component installed at an adhesion position supplied with unsolidified adhesive on the substrate and in the upper surface A deriving unit for deriving measurement information related to the inclination in the second rotation direction about the second straight line;
An inclination adjustment unit that performs adjustment for bringing the measurement information closer to setting information relating to the inclination in the first rotation direction and the inclination in the second rotation direction for a predetermined period after the installation;
An adjustment device comprising:
(Appendix 2)
The adjusting device according to appendix 1, wherein the period is between a predetermined point in time before completion of solidification of the adhesive.
(Appendix 3)
The setting information includes a first setting value related to the first rotation direction and a second setting value related to the second rotation direction, and the measurement information is a first measurement related to the first rotation direction. And the second measurement value according to the second rotation direction, the inclination adjustment unit sets the first measurement value to the first set value and the second measurement value to the second measurement value. The adjustment device described in Supplementary Note 1 or Supplementary Note 2 that approaches the set value.
(Appendix 4)
The adjusting device according to any one of Supplementary Note 1 to Supplementary Note 3, wherein the first straight line and the second straight line are orthogonal to each other.
(Appendix 5)
Additional remarks 1 to 4 further comprising a gripping part for gripping the electronic component, wherein the tilt adjustment part tilts the gripping part in at least one of the first rotation direction and the second rotation direction. The adjustment apparatus described in any one of these.
(Appendix 6)
The adjusting device according to appendix 5, further comprising a second moving unit that moves the gripping unit.
(Appendix 7)
The movement direction of the gripping part is a first direction represented by the first straight line, a second direction represented by the second straight line, and a third direction perpendicular to the first straight line and the second straight line. The adjustment device described in appendix 6.
(Appendix 8)
The adjustment device according to any one of Supplementary Notes 1 to 6, further comprising a first moving unit that moves a holding unit that holds the substrate in order to perform the installation.
(Appendix 9)
The moving direction of the holding portion is a first direction represented by the first straight line, a second direction represented by the second straight line, and a third direction perpendicular to the first straight line and the second straight line. The adjustment device described in appendix 8.
(Appendix 10)
Appendix 1 further comprising: a first moving unit that moves a holding unit that holds the substrate to perform the installation; and a second moving unit that moves a gripping unit that grips the electronic component to perform the installation. Thru | or the adjustment apparatus as described in any one of appendix 4.
(Appendix 11)
The moving direction of the holding part is a first direction represented by the first straight line, a second direction represented by the second straight line, and a third direction perpendicular to the first straight line and the second straight line, The moving direction of the holding part includes a first direction represented by the first straight line, a second direction represented by the second straight line, and the first straight line and the second The adjustment device according to appendix 10, including the other of the third directions perpendicular to the straight line.
(Appendix 12)
One of Supplementary Note 1 to Supplementary Note 11, further comprising an imaging unit that images the substrate and the electronic component, and performing at least one of movement of the electronic component and movement of the substrate from image information related to the imaging. The adjustment device described in 1.
(Appendix 13)
Install the electronic components at the bonding position where the unsolidified adhesive is supplied on the board,
Measurement of the electronic component relative to the substrate with respect to the inclination in the first rotation direction about the first straight line in the upper surface of the substrate and the inclination in the second rotation direction about the second straight line in the upper surface. Deriving information,
The measurement information is adjusted to be close to setting information relating to the inclination in the first rotation direction and the inclination in the second rotation direction, and is adjusted for a predetermined period after the installation.
Adjustment method.
(Appendix 14)
A process of installing an electronic component at a bonding position supplied with unsolidified adhesive on the substrate;
Measurement of the electronic component relative to the substrate with respect to the inclination in the first rotation direction about the first straight line in the upper surface of the substrate and the inclination in the second rotation direction about the second straight line in the upper surface. Processing to derive information;
A process of performing adjustment for bringing the measurement information closer to setting information related to the inclination in the first rotation direction and the inclination in the second rotation direction for a predetermined period after the installation;
Is an adjustment program that causes a computer to execute.

101, 101x Adjustment device 201, 201a Operation unit 201x Inclination adjustment unit 202 Measurement unit 203 Movement unit 204 Adjustment unit 205, 276a, 276b Holding unit 206 X stage 207 Y stage 211 θ _Z stage 216 Substrate fixing unit 251 Member 256 Z stage 261 θ _Y stage 266 θ _X stage 271 Member 301 Tilt sensor 306 Camera 401 Processing unit 401x Deriving unit 701 Electronic component 706 Substrate 711a Base body 801 Laser light 901a, 901b, 901c, 901d, 901e, 901f, 901g, 901h, 901i, 901h 901k, 901l, 902a, 902b, 902c, 902d, 902e, 902f, 902g, 902h, 902i Surface A, B, C, D mark

Claims (10)

An inclination of a first rotation direction about the first straight line in the upper surface of the substrate with respect to the substrate and an electronic component installed at an adhesion position supplied with unsolidified adhesive on the substrate and in the upper surface A deriving unit for deriving measurement information related to the inclination in the second rotation direction about the second straight line;
An inclination adjustment unit that performs adjustment for bringing the measurement information closer to setting information relating to the inclination in the first rotation direction and the inclination in the second rotation direction for a predetermined period after the installation;
An adjustment device comprising:   The adjusting device according to claim 1, wherein the period is a period until a predetermined time before the adhesive is completely solidified.   The setting information includes a first setting value related to the first rotation direction and a second setting value related to the second rotation direction, and the measurement information is a first measurement related to the first rotation direction. And the second measurement value according to the second rotation direction, the inclination adjustment unit sets the first measurement value to the first set value and the second measurement value to the second measurement value. The adjusting device according to claim 1, wherein the adjusting device approaches the set value.   The adjusting device according to any one of claims 1 to 3, wherein the first straight line and the second straight line are orthogonal to each other.   The gripping unit for gripping the electronic component is further provided, and the tilt adjustment unit tilts the gripping part in at least one of the first rotation direction and the second rotation direction. Item 5. The adjusting device according to any one of Items 4 to 5.   The adjusting device according to claim 5, further comprising a second moving unit that moves the gripping unit.   A first moving unit that moves a holding unit that holds the substrate to perform the installation; and a second moving unit that moves the gripping unit to perform the installation, and the moving direction of the holding unit is , At least one of a first direction represented by the first straight line, a second direction represented by the second straight line, and a third direction perpendicular to the first straight line and the second straight line. Including a first direction represented by the first straight line, a second direction represented by the second straight line, and a third direction perpendicular to the first straight line and the second straight line. 6. The adjustment device according to claim 5, comprising the other of the directions.   The imaging device according to claim 1, further comprising an imaging unit that images the substrate and the electronic component, wherein at least one of the movement of the electronic component and the movement of the substrate is performed from image information related to the imaging. The adjustment apparatus described in any one. Install the electronic components at the bonding position where the unsolidified adhesive is supplied on the board,
Measurement of the electronic component relative to the substrate with respect to the inclination in the first rotation direction about the first straight line in the upper surface of the substrate and the inclination in the second rotation direction about the second straight line in the upper surface. Deriving information,
The measurement information is adjusted to be close to setting information relating to the inclination in the first rotation direction and the inclination in the second rotation direction, and is adjusted for a predetermined period after the installation.
Adjustment method. A process of installing an electronic component at a bonding position supplied with unsolidified adhesive on the substrate;
Measurement of the electronic component relative to the substrate with respect to the inclination in the first rotation direction about the first straight line in the upper surface of the substrate and the inclination in the second rotation direction about the second straight line in the upper surface. Processing to derive information;
A process of performing adjustment for bringing the measurement information closer to setting information related to the inclination in the first rotation direction and the inclination in the second rotation direction for a predetermined period after the installation;
Is an adjustment program that causes a computer to execute.

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