JP2019157562A - Floor material - Google Patents

Abstract

To provide a light-weight floor material capable of reducing in particular heavy floor impact noises with high vibration suppression while being lightweight.SOLUTION: The floor material comprises: a layer of high thermal insulation material of 20-300 mm in thickness; and a layer of 0.1-30 mm in thickness formed over at least one side of the support member, in which the flexural rigidity is 1.5×10-1.5×10GPa*mm, and weight per unit area is 2-110 kg/m.SELECTED DRAWING: None

Description

  The present invention relates to a lightweight building material, and more particularly to a lightweight flooring material used by being installed on the upper surface of a floor structure of a building.

  Woody materials have both material characteristics that are lightweight and have good processability, and design characteristics such as healing effects and relaxation effects, and have been widely used in residential buildings. In recent years, the use of timber, especially domestic timber, has been further promoted, and technical development of increasing the size and height of wooden buildings including residential buildings has been actively conducted.

  When a residential wooden building has a plurality of floors, heat insulation and high sound insulation performance are required in order to obtain comfortable living. As a method for improving the sound insulation performance of a wooden floor, for example, a method using a laminate of a polymer sheet containing a cushioning material and a filler on a wooden board has been proposed (Patent Document 1). However, what can be reduced by this method is a so-called lightweight floor impact sound and has not yet reduced a heavy floor impact sound (for example, a sound generated by jumping a child, etc.) which is a problem in an apartment house.

  As a method for reducing heavy floor impact sound, a method has been proposed in which a mass layer is provided in the floor structure and the weight of the floor structure itself is positively increased (Patent Document 2). However, in order to increase the floor weight, it is necessary to increase the strength of the columns and beams, and the cross-sectional area of the beams and columns tends to increase. Due to the increase in weight and construction process, the workability is lowered and finally the cost of the building is increased.

JP-A-6-93706 JP 2003-293571 A

  It is an object of the present invention to provide a lightweight floor material that can obtain high vibration suppression while being lightweight, and that can particularly reduce heavy floor impact sound.

That is, the present invention includes a layer of a high heat insulating material having a thickness of 20 to 300 mm and a support having a thickness of 0.1 to 30 mm provided on at least one surface thereof, and has a bending rigidity of 1.5 × 10 ⁷ to 1. The flooring material is characterized in that it has a weight of 0.5 × 10 ¹¹ GPa · mm ⁴ and a weight per unit area of ² to 110 kg / m ² .

  According to the present invention, it is possible to provide a lightweight floor material capable of obtaining high vibration suppression while being lightweight, and particularly capable of reducing heavy floor impact sound.

It is the schematic of the flooring of this invention. It is the schematic of the composite molded object of this invention. It is the structure schematic of the fiber reinforced resin wood composite material of this invention.

  Hereinafter, embodiments of the present invention will be described.

[Laminated structure]
The flooring of the present invention comprises a layer of highly heat insulating material having a thickness of 20 to 300 mm and a support having a thickness of 0.1 to 30 mm provided on at least one surface thereof.

  In the present invention, it is important to design the building material with high bending rigidity from the viewpoint of reducing heavy floor impact sound. From this, the structure which provided the support body in the both surfaces of the layer of high heat insulation material is more preferable than the structure which provided the support body only in one side of the layer of high heat insulation material. That is, a preferred embodiment of the present invention is an embodiment comprising a layer of a highly heat insulating material having a thickness of 20 to 300 mm and a support having a thickness of 0.1 to 30 mm provided on both surfaces thereof.

  Furthermore, a preferable aspect is the structure which provided the support body also on the both surfaces and the at least 2 side surface of the layer of highly heat-insulating material. That is, a further preferred embodiment of the present invention is an embodiment comprising a layer of a highly heat-insulating material having a thickness of 20 to 300 mm and a support having a thickness of 0.1 to 30 mm provided on both sides and at least two sides. It is. With this structure, the bending rigidity can be designed high.

[Bending stiffness, weight per unit area]
The flooring material of the present invention has a flexural rigidity of 1.5 × 10 ⁷ to 1.5 × 10 ¹¹ GPa · mm ⁴ , preferably 1.5 × 10 ^{8 to} 1.5 × 10 ¹⁰ GPa · mm ⁴ . If the bending rigidity is less than 1.5 × 10 ⁷ , the heavy floor impact sound, which is the subject of the present invention, cannot be sufficiently reduced. On the other hand, if it exceeds 1.5 × 10 ¹¹ GPa · mm ⁴ , it is necessary to take measures to make the thickness of the support more than 30 mm, the thickness of the highly insulating material more than 300 mm, or both. In such a case, there is a possibility of causing various problems such as an increase in weight, cost increase, and pressure on living space.

The flooring of the present invention has a weight per unit area of ² to 110 kg / m ² , preferably ² to 70 kg / m ² , more preferably ² to 45 kg / m ² . If the weight per unit area is less than 2 kg / m ² , the heavy floor impact sound, which is the subject of the present invention, cannot be sufficiently reduced. Moreover, since it will be heavy if it exceeds 110 kg / m < ² >, the influence which the floor material of this invention has on a building structure frame | body will be large, and possibility that the examination which enlarges the cross section of a beam or a column in structural design will become high. .

[High thermal insulation materials]
It is preferable to use an organic foam for the highly heat insulating material. Examples of organic foams include phenol foam, phenol-urethane foam, and urethane foam. Among these, phenol foam is preferable because high heat resistance can be obtained.

  The thickness of the layer of high thermal insulation material is 20 to 300 mm. If the thickness of the layer of the high heat insulating material is less than 20 mm, it becomes difficult to ensure bending rigidity, and fire resistance is impaired. On the other hand, if the thickness exceeds 300 mm, when the flooring of the present invention is attached to a structural member of a building and used, the living space of the building is narrowed due to the thickening of the flooring.

  In order to obtain high thermal insulation as a flooring material, the thermal conductivity of the high thermal insulation material is preferably 0.01 to 0.40 W / m · K. A material having a thermal conductivity of less than 0.01 W / m · K is a material that exhibits higher heat insulation than air, and is not preferable because it is special, extremely expensive, and industrially difficult to handle. On the other hand, if it exceeds 0.40 W / m · K, the heat insulation is insufficient, which is not preferable.

[Support]
In the present invention, a fiber reinforced resin is used as the support. The support is used to maintain the shape of the highly heat insulating material. The thickness of this support is 0.1 to 30 mm, preferably 0.3 to 30 mm, and more preferably 1 to 30 mm. If the thickness of the support is less than 0.1 mm, the flexural rigidity of the composite cannot be ensured, and when the flooring is used, the support may be cracked. On the other hand, if it exceeds 30 mm, the heat generation during molding of the support is increased, so that the moldability is significantly impaired.

  The flexural modulus of the support is 50 to 500 GPa. If the flexural modulus is less than 50 GPa, the flexural rigidity of the flooring material becomes low, or in order to prevent it, it is necessary to increase the thickness of the support. On the other hand, in order to obtain support exceeding 500 GPa, it is necessary to increase the volume fraction of the fiber in the support, which tends to increase the difficulty of molding, and it is necessary to use expensive fibers with high physical properties.

  The weight floor impact sound was reduced by setting the flexural modulus of the support in the range of 50 to 500 GPa, the thickness of the high heat insulating material to 20 to 300 mm, and the thickness of the support to 0.1 to 30 mm. Flooring can be obtained.

  The fiber reinforced resin of the support is preferably a thermosetting resin containing inorganic fibers or organic fibers having a melting point or glass transition temperature of 200 ° C. or higher. Examples of the inorganic fiber of the fiber reinforced resin include carbon fiber and glass fiber. Examples of the organic fiber include aramid fiber, polyarylate fiber, polyparaphenylene benzobisoxazal fiber, polyphenylene sulfide fiber, polyimide fiber, and tetrafluoroethylene fiber. As the fiber of the fiber reinforced resin, these inorganic fibers or organic fibers are used alone or in combination of two or more. As the form of the fiber, for example, a UD base material aligned in one direction, a combination of two or more directions, a woven fabric, and a nonwoven fabric can be used. A thermosetting resin is used as the resin of the fiber reinforced resin. Examples of the thermosetting resin include a phenol resin, an epoxy resin, and a vinyl ester resin.

[Composite molded body]
A preferred embodiment of the flooring material of the present invention is a composite molded body in which an organic foam is filled and fixed in a hollow portion of a molded body having a hollow section obtained by pultrusion molding of a fiber reinforced resin. This cross section is preferably rectangular hollow. FIG. 2 shows a schematic view of a composite molded body obtained by filling and fixing an organic foam in a hollow portion of a molded body having a rectangular cross section obtained by pultrusion molding of fiber reinforced resin. In this composite molded body, it is a molded body having a rectangular cross section obtained by the pultrusion molding of the fiber reinforced resin that plays the role of the support body that maintains the shape. The organic foam forms a layer of highly heat insulating material.

  In the present invention, the support body is a pultrusion body having a rectangular hollow section obtained by pultrusion molding of a fiber reinforced resin, and an organic foam in which a highly heat insulating material is filled and fixed in the rectangular hollow portion of the pultrusion body. The configuration is a preferred embodiment.

  The organic foam becomes a layer of a high heat insulating material by foaming a foamable organic material in the hollow portion of the hollow molded body. This organic foam is preferably fixed to a pultruded product of fiber reinforced resin and integrated with each other. In order to obtain high adhesiveness, an adhesive may be applied to the wall surface of the hollow portion of the molded body before the foamable organic material or the organic foam is injected.

  The pultrusion molding is a molding method in which fibers are aligned in one direction and are drawn out while impregnating and solidifying a resin from a metal base. In the present invention, a rectangular hollow pultruded body can be obtained by using a base having a rectangular cross section. The volume ratio of the fiber to the resin in the fiber reinforced resin is, for example, 50/50 to 60/40. By molding the composite molded body by pultrusion molding, since the fiber direction is one direction, it is possible to maximize the bending properties in that direction, and to design the thickness of the fiber reinforced resin in the composite molded body thin.

  In a composite molded body, in order to obtain high adhesion between a highly heat-insulating material layer and a pultruded body having a rectangular cross section as a support, a thermosetting property is provided at the interface between the high heat-insulating material layer and the support. It is preferable to provide a porous substrate impregnated with a resin. In this case, the uncured thermosetting resin enters the pores of the porous base material, so that a physical anchor effect can be obtained and strong adhesion can be obtained. For example, paper can be used as the porous substrate.

[Fiber-reinforced resin wood composite]
Another preferred embodiment of the flooring material of the present invention is a fiber reinforced resin wood composite material in which a wood material board is used as a layer of a high thermal insulation material, and a fiber reinforced resin board is provided as a support on both sides of the wood material board. is there. A schematic diagram of the structure of this fiber-reinforced resin wood composite is shown in FIG.

  The woody material is wood generally used in existing wooden buildings, and for example, lumber, plywood, laminated lumber, CLT, and LVL can be used. The fiber reinforced resin plate is a plate-like pultruded molded body of fiber reinforced resin.

  This fiber-reinforced resin wood composite material can be manufactured by applying an adhesive to both sides of a wooden material plate and press-bonding the fiber-reinforced resin plate. It is preferable that the fiber-reinforced resin plate used here has a textured surface. Moreover, it is preferable to arrange | position the porous base material which impregnated the adhesive agent in the interface of the board | plate of a wood material, and a fiber reinforced resin board.

  By applying a texture to the surface of the fiber reinforced resin plate, it is possible to obtain a strong bond with the wood material plate. As an adhesive impregnating the porous substrate, an adhesive used when producing a laminated material or CLT can be used, and a resorcinol adhesive or a water-soluble polymer-isocyanate adhesive is particularly preferable. As the press bonding, a high temperature press such as a room temperature press or a high frequency can be applied.

[Installation of flooring]
The flooring of the present invention is a material that is much lighter and more rigid than conventional flooring made of iron or cement. The flooring of the present invention can be chemically fixed to the floor structure with an adhesive, or can be physically fixed using screws, bolts or the like. In addition, a floor structure here is a member which comprises the structure which has a function which supports a flooring among the structures of a building.

  By fixing the flooring of the present invention to the floor structure, the effect of increasing the rigidity of the floor structure and reducing the weight impact sound can be obtained. Moreover, since the weight is light, it is not necessary to reinforce the beams and pillars that support the flooring and constitute the floor structure, and good workability can be obtained.

The present invention will be specifically described with reference to examples.
(1) Wooden floor structure As a wooden floor structure for fixing the building material of the present invention, a wooden floor structure of width 300 mm x length 600 mm (1/3 scale of the actual size of a wooden house) is made of wood lumber and plywood (9 mm thick) It was created using. The beams and columns, and the beams were fixed with screws using L-shaped metal fittings.
(2) Vibration suppression effect (reduction effect of heavy floor impact sound)
The impact point was applied to the center of the specimen, and the impact data was struck with an impulse hammer, and vibration data was acquired with an accelerometer placed at the center of the distance between the impact point and the short side of the specimen. A mechanical impedance value at a frequency of 63 Hz (a frequency corresponding to a heavy floor impact sound) was calculated by Fourier transform analysis of this data, and converted into an impact sound (dB). In addition, it shows that the vibration suppression effect at the time of the impact application to a sound-insulation test body (the reduction effect of a heavy floor impact sound) is so large that this value is low.
(3) Bending elastic modulus of the support A test piece having a width of 15 mm and a length of 100 mm was cut out from the support so that the fiber direction was the length direction, and a three-point bending test with a center point force of 80 mm between fulcrums was performed. The load-deflection curve was obtained. The test speed was 5 mm / min. The bending elastic modulus was calculated from the obtained breaking point load and load-deflection curve using the following formula.
Flexural modulus = L ³ × ΔF / 4 × b × h ³ × ΔS
[Delta] F: S 'and S "difference ^{(here, S' = 0.0005 × L 2} /6 × h, S" = 0.0025 × L 2/6 × h)
ΔS: Difference in deflection between S 'and S "(4) Flexural rigidity of floor material In the case of solid materials such as cement slab and wood, the rigidity is calculated by the product of the standard bending elastic modulus of each material and the secondary moment of section. In the case of a composite material of a support and a highly heat-insulating material, the rigidity of each material is calculated from the product of the bending elastic modulus and the moment of inertia of the cross-section for each of the support and the highly heat-insulating material, and the respective rigidity is added. The bending rigidity was obtained by combining them.
(5) Thermal conductivity of highly heat-insulating material The highly heat-insulating material was cut into a size of 300 mm x 300 mm (thickness is the thickness used), and the thermal conductivity in the thickness direction was measured. The measurement temperature was 20 ° C. The measuring instrument used was HC-074 manufactured by Eihiro Seiki Co., Ltd.

[Example 1]
A carbon fiber reinforced vinyl ester resin was used as the fiber reinforced resin. In this fiber reinforced resin, the volume ratio of carbon fiber to vinyl ester resin (thermosetting resin) was 55% by volume / 60% by volume. The fiber reinforced resin was drawn out with a rectangular hollow cross section (outer dimensions: width 300 mm, length 600 mm, height 102 mm) by a pultrusion method to obtain a pultruded body having a thickness of 1 mm. A planar plate material (15 mm × 100 mm) was sampled from this pultruded product and the bending elastic modulus was measured and found to be 80 GPa.

  In the rectangular hollow portion of the pultruded molded body, phenol foam was foam-molded and filled and fixed in the rectangular hollow portion to obtain a composite molded body having the shape shown in FIG. The thickness of the phenol foam filled and fixed in the rectangular hollow portion was 100 mm. The thermal conductivity of this phenol foam was 0.02 W / m · K. The obtained composite molded body was screwed to a wooden floor structure at intervals of 50 mm, and the vibration suppression effect was measured. Table 1 shows the results of the weight, bending rigidity, and measured vibration suppression effect of the specimen.

[Example 2]
The same fiber reinforced resin as in Example 1 was used. The fiber reinforced resin was drawn by a pultrusion molding with a plate-like cross section (outer dimensions: width 300 mm, length 600 mm) to obtain a pultruded product having a thickness of 2 mm. The bending elastic modulus of the plate material collected from this pultruded product was 80 GPa. A porous base material impregnated with an epoxy resin was placed on the surface of the pultruded body and subjected to graining. A water-soluble polymer-isocyanate adhesive was applied to both surfaces of a 60 mm thick laminated material in which two sheets of 30 mm thick cedarmina were preliminarily assembled, and the pultruded product was adhered to both surfaces by a room temperature press. At this time, the carbon fibers were bonded so that the arrangement direction of the carbon fibers and the direction of the wood fibers of the wood were the same. The fiber reinforced resin wood composite shown in FIG. 3 was obtained. The obtained fiber reinforced resin wood composite material was screwed to the wooden floor structure at intervals of 50 mm, and the vibration suppression effect was measured. Table 1 shows the results of the weight, bending rigidity, and measured vibration suppression effect of the specimen. The thermal conductivity of the cedar laminate was 0.10 W / m · K.

[Comparative Example 1]
A floor was prepared by placing a cement slab having a thickness of 70 mm, a width of 300 mm, and a length of 600 mm on the upper surface of the wooden floor structure. The vibration suppression effect of this floor was measured. Table 1 shows the measurement results of weight, bending rigidity, and vibration suppression effect.

[Comparative Example 2]
The vibration suppression effect was measured only with the wooden floor structure. Table 1 shows the measurement results of weight, bending rigidity, and vibration suppression effect.

  The flooring of the present invention can be suitably used as a lightweight flooring used by being attached to a building floor structure.

1 Fiber Reinforced Resin 2 High Thermal Insulation Material 3 Organic Foam 4 Woody Material

Claims (6)

It consists of a layer of high heat insulating material having a thickness of 20 to 300 mm and a support having a thickness of 0.1 to 30 mm provided on at least one surface thereof, and has a flexural rigidity of 1.5 × 10 ⁷ to 1.5 × 10 ^11. GPa · mm ⁴ , and the weight per unit area is ² to 110 kg / m ² .   The support is a rectangular hollow pultruded body obtained by pultrusion molding of fiber reinforced resin, and the highly heat insulating material is an organic foam filled and fixed in the rectangular hollow portion of the pultruded body. The flooring according to 1.   The flooring according to claim 2, wherein the flexural modulus of the support is from 50 to 500 GPa.   The flooring according to claim 2, wherein the fiber reinforced resin is a thermosetting resin containing inorganic fibers or organic fibers having a melting point or glass transition temperature of 200 ° C or higher.   The flooring according to claim 1 or 2, wherein the highly heat-insulating material is an organic foam having a thermal conductivity of 0.01 to 0.40 W / m · K.   The flooring of Claim 1 or 2 provided with the porous base material which impregnated the thermosetting resin in the interface of the layer of a highly heat-insulating material, and a support body.

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