JP2019155449A - Laser cutting system and wall surface cutting method - Google Patents

Abstract

To provide a laser cutting system which can perform a work with good efficiency and high safety, and a wall surface cutting method.SOLUTION: A laser cutting system comprises: a laser beam output device which outputs laser beam; a laser head which emits laser beam in the state that laser beam, which is output from the laser beam output device, faces a cutting object; a damper gear which faces the laser head via the cutting object, and shields laser beam having passed through the cutting object; a mobile device which moves the laser head and the damper gear; a dustproof unit which covers a processing area in which the laser head and the damper gear are located; and a dust recovery unit which sucks air in the dustproof unit, and removes dusts.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laser cutting system and a wall surface cutting method.

  Concrete saws are used in the removal work of general buildings, roads, bridges of railways, and concrete walls of viaducts. When a concrete wall is cut with a concrete saw, there is a possibility that an operator's intervention work may occur. For example, there is a possibility that the saw of a concrete saw machine may bite into an obstacle such as piping existing on the concrete wall, and an operator's intervention work is required to release the biting between the obstacle and the saw. Moreover, in a concrete saw machine, there is a possibility that saw breakage may occur. The operator's intervention work or saw breakage results in a decrease in workability of the concrete wall cutting work. In addition, there is a demand to reduce the operator's intervening work in cutting concrete walls in a high radiation environment such as a nuclear reactor building or in an environment where it is difficult for the worker to work close to the sea such as the deep sea.

  As a concrete wall cutting method, a cutting method using a laser cutting device is expected. The laser cutting device has a nozzle for injecting laser and shielding gas, and irradiates concrete with laser emitted from the nozzle in a state where the nozzle and the concrete wall face each other. A part of the concrete wall is melted by the laser emitted from the nozzle, and the concrete is cut by removing the melt (dross) of the concrete wall by the assist gas ejected from the assist gas nozzle. The concrete wall cutting method using the laser cutting device does not cause breakage like a concrete saw, is suitable for remote operation, and can suppress the operator's intervention work. Patent Document 1 discloses a technique related to a processing apparatus that cuts a thick plate with a laser.

Japanese Patent Application Laid-Open No. 07-116885

  Patent Document 1 is a cutting method for cutting a thick plate with high quality. However, there is a problem in performing work efficiently and with high safety. The present invention solves the above-described problems, and an object thereof is to provide a laser cutting system and a wall surface cutting method capable of performing work efficiently and with high safety.

  In order to achieve the above object, the present invention provides a laser cutting system comprising: a laser output device that outputs laser; and the laser output from the laser output device facing the object to be cut. A laser cutting unit that emits, a damper unit that faces the laser head through the cutting object and shields a laser that has passed through the cutting object, and a moving device that moves the laser cutting unit and the damper unit; And a dust-proof unit that covers a processing region in which the laser cutting unit and the damper unit are disposed, and a dust recovery unit that sucks air in the dust-proof unit and removes dust.

  It is preferable to further have a container unit including a container in which the laser output device is stored and a container in which the dust collection unit is stored.

  The container unit is preferably placed on a gantry installed on the cutting object.

  It is preferable to further have a temporary container placed on the gantry and storing the cut object to be cut.

  It is preferable that the dustproof unit has a cover that covers the cutting object and the damper device.

  The object to be cut can be a wall surface of a structure contaminated with radioactive material.

  In order to achieve the above object, the present invention provides a wall surface cutting method for cutting a wall surface of a structure, the step of installing a gantry on the outer surface of the wall surface, and each device housed in a container on the gantry A step of installing a laser cutting unit and a damper unit on the wall surface, a step of connecting the laser cutting unit and the damper unit to each device housed in the container, the laser cutting unit, The method includes a step of installing a dust-proof unit that covers a processing region in which the damper unit is disposed, and a step of cutting the wall surface with the laser cutting unit.

  It is preferable that the method further includes a step of storing the wall surfaces cut and separated by the temporary placement unit disposed on the gantry.

  According to the present invention, work can be performed efficiently and with high safety.

FIG. 1 is a block diagram showing a schematic configuration of the laser cutting system of the present embodiment. FIG. 2 is a perspective view showing a schematic configuration of the laser cutting system of the present embodiment. FIG. 3 is a schematic diagram showing a schematic configuration of the moving unit of the present embodiment. FIG. 4 is a schematic diagram showing a schematic configuration of the peripheral portion of the wall surface to be cut by the laser cutting system of the present embodiment. FIG. 5 is a schematic diagram showing a schematic configuration of the damper unit of the present embodiment. FIG. 6 is a schematic diagram showing a schematic configuration of the dust collection unit of the present embodiment. FIG. 7 is a flowchart showing a method of cutting a concrete wall using the laser cutting device of this embodiment. FIG. 8 is a perspective view showing a schematic configuration of a laser cutting system according to another embodiment.

  Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

  The present embodiment will be described with reference to FIGS. FIG. 1 is a block diagram showing a schematic configuration of the laser cutting system of the present embodiment. FIG. 2 is a perspective view showing a schematic configuration of the laser cutting system of the present embodiment. FIG. 3 is a schematic diagram showing a schematic configuration of the moving unit of the present embodiment. FIG. 4 is a schematic diagram showing a schematic configuration of the peripheral portion of the wall surface to be cut by the laser cutting system of the present embodiment. The laser cutting system 10 cuts the wall surface 1 by irradiating the wall surface 1 as a cutting target with a laser. In the present embodiment, the wall surface 1 is a concrete wall. The wall surface 1 is a reinforced concrete wall used for a nuclear reactor building, for example. The wall surface 1 includes a wall portion 1a on a thin plate and a column portion 1b having a rectangular cross section. The laser cutting system 10 cuts both the wall 1a and the pillar 1b.

  As shown in FIG. 1, the laser cutting system 10 includes a laser cutting unit 12, a laser output device 14, a laser cutting unit accessory device 16, a damper unit 18, a damper accessory device 20, a dustproof unit 22, and dust. The recovery unit 24, the moving unit 26, the temporary storage container 27, the control device 28, the gantry 32, and the container unit 34 are included.

  The arrangement of each part will be described with reference to FIGS. The gantry 32 is installed on the outer surface side of the wall surface 1, that is, on the outer wall side of the building. The gantry 32 is a base on which each part of the laser cutting system 10 is installed. The gantry 32 of the present embodiment is installed around the wall surface 1. In the laser cutting system 10, a container unit 34 and a temporary container 27 are installed on a gantry 32. The container unit 34 has a plurality of containers 36. In the container 36, the laser output device 14, the laser cutting unit accessory device 16, the damper accessory device 20, and the dust collection unit 24 are stored. The laser cutting unit 12 and the damper unit 18 are supported by a moving unit 26. The moving unit 26 of this embodiment is suspended by a wire 204. The wire 204 is supported by a crane, for example, and adjusts the position of the moving unit 26 as necessary. The laser cutting unit 12 and the damper unit 18 supported by the moving unit 26 face each other with the wall surface 1 sandwiched when the wall surface 1 is cut. The dustproof unit 22 is supported by the moving unit 26. The dustproof unit 22 includes a part of the moving unit 26. The control device 28 is arranged at a position away from the wall surface 1. The control device 28 operates each unit remotely.

  Next, the configuration and function of each unit will be described. The laser cutting unit 12 irradiates the wall surface 1 with a laser and cuts the wall surface 1. The laser cutting unit 12 includes a cutting head 40, a camera 42, and a sensor 44. The cutting head 40 is a tip portion that irradiates a laser toward the wall surface 1. The cutting head 40 is formed with an opening through which a laser passes, an assist gas supply unit for injecting an assist gas, a cooling path for circulating a cooling medium, and the like. The camera 42 is disposed in the vicinity of the cutting head 40, and monitors the area where the cutting head 40 irradiates the laser and the surrounding area. The camera 42 sends the monitored image to the control device 28. The sensor 44 is an element that detects the situation of the cutting head 40 and the wall surface 1. Examples of information detected by the sensor 44 include temperature, flow rate, laser output, distance between the cutting head 40 and the processing position, and the like. The sensor 44 sends the detection result to the control device 28.

  The laser output device 14 oscillates a laser. The laser output device 14 is, for example, a fiber laser source. The fiber laser source outputs a laser using an optical fiber as a medium. As the fiber laser output device, for example, a Fabry-Perot type fiber laser output device or a ring type fiber laser output device may be used. Silica glass to which rare earth elements such as erbium (Er), neodymium (Nd), and ytterbium (Yb) are added may be used as the fiber of the fiber laser output device. The laser output device 14 may be a pulse laser source. For example, a high-power YAG laser pulse light source can be used as the pulse laser source. The laser output device 14 outputs a laser of 1 kW or more and 200 kW. In consideration of the target concrete plate thickness and the amount of reinforcing bars, select the laser output that provides the necessary cutting speed.

  The laser output device 14 is connected to the laser cutting unit 12 through a laser transmission path 50. The laser transmission path 50 is a mechanism for guiding a laser, such as an optical fiber, and connects the laser output device 14 and the laser cutting unit 12. The laser output device 14 enters the oscillated laser into the laser transmission path 50 and transmits it to the laser cutting unit 12. The laser transmission path 50 is detachably connected to the laser cutting unit 12.

  The laser cutting unit accessory device 16 supplies various media necessary for the operation of the laser cutting unit 12. The laser cutting unit accessory device 16 includes a head cooling chiller 46 and an assist gas supply unit 46. The head cooling chiller 46 cools the cooling medium that cools the cutting head 40. The assist gas supply unit 46 supplies assist gas to be ejected from the cutting head 40. In the present embodiment, the assist gas is injected from an opening provided at the tip of the cutting head 40. As the assist gas, for example, air, nitrogen gas, argon gas, xenon gas, helium gas, or a mixed gas thereof can be used.

  The cooling medium pipe 52 connects the laser cutting unit 12 and the head cooling chiller 46. The cooling medium pipe 52 forms a circulation path through which the cooling medium flows between the laser cutting unit 12 and the head cooling chiller 46. The gas supply pipe 54 connects the laser cutting unit 12 and the assist gas supply unit 46. The gas supply pipe 54 supplies assist gas from the assist gas supply unit 46 to the laser cutting unit 12. The cooling medium pipe 52 and the gas supply pipe 54 are flexible pipes, and are connected to the laser cutting unit 12 in a detachable state.

  FIG. 5 is a schematic diagram showing a schematic configuration of the damper unit of the present embodiment. FIG. 5 also shows a damper accessory device 20 connected to the damper unit 18. The damper unit 18 is disposed to face the laser cutting unit 12 with the wall surface 1 interposed therebetween. The damper unit 18 is disposed on the optical path of the laser irradiated from the laser cutting unit 12. The damper unit 18 is a device that shields the high-power laser for processing output from the laser cutting unit 12. Here, since the high-power laser shielded by the damper unit 18 has an output of kW order and the irradiation energy of the laser is large, the damper unit 18 can efficiently absorb the irradiation energy of the high-power laser. It has become a thing.

  As shown in FIG. 5, the damper unit 18 includes a casing 115, a water curtain (liquid curtain) 116, a water curtain 117, a laser receiving plate 118, and a water circulation mechanism 119. In addition, the damper accessory device 20 supplies various media necessary for the operation of the damper unit 18. The damper accessory device 20 includes a pump 142, an air supply source 144, a damper water supply tank 152, and a damper chiller 154. The pump 142 and the damper chiller 154 are part of the water circulation mechanism 119.

  The casing 115 is formed in a rectangular box shape, and houses a water curtain 116, a water curtain 117, and a laser receiving plate 118 therein. The casing 115 has an opening 125 through which a laser and assist gas are introduced, and the opening 125 is formed through the side surface of the casing 115. For this reason, the irradiation direction of the laser introduced into the housing 115 through the opening 125 is the horizontal direction. Further, the casing 115 is a water tank 126 for storing water (liquid) used in the water curtain 116 and the water curtain 117 on the lower side inside. A water circulation mechanism 119 described later is connected to the water tank 126. Further, the housing 115 is formed with a gas discharge port (gas discharge channel) 127 for discharging the assist gas introduced into the interior and the gas used in the water curtain 116. The gas discharge port 127 is a portion of the side surface of the housing 115 to which the gas ejected from the water curtain 116 blows, or a portion of the side surface of the housing 115 near the downstream side in the flow direction of the gas ejected from the water curtain 116. Is formed through.

  The water curtain 116 forms a water film (liquid film) 135 inside the housing 115. The water curtain 116 has a slit opening (outlet) 132 formed in the chamber 131. The chamber 131 is attached to the ceiling inside the housing 115 and is provided to extend in the longitudinal direction with the direction perpendicular to the laser irradiation direction as the longitudinal direction. The water supplied into the chamber 131 spreads over the longitudinal direction of the chamber 131. The slit opening 132 serves as an outlet through which water supplied into the chamber 131 flows out, and is provided on the lower surface side of the chamber 131. The slit opening 132 is formed extending in the longitudinal direction of the chamber 131. In the water curtain 116, water is used, but any water can be used as long as it can absorb the irradiation energy of the laser. When water is supplied to the water curtain 116, the water spreads over the longitudinal direction of the chamber 131 and flows out from the slit opening 132. The water flowing out from the slit opening 132 becomes a curtain-like water film 135 having a surface orthogonal to the laser irradiation direction. Here, an air supply source 144 is connected to a path for supplying water to the water curtain 116. The water curtain 116 is supplied with air in addition to water. The water curtain 116 is supplied with water and air, thereby forming a water film 135 that increases in width as the distance from the slit opening 132 increases.

  The water curtain 117 forms a water film 136 inside the housing 115. The water curtain 117 has a slit opening (outlet) 137 formed in the chamber 131. The chamber 131 is attached to the ceiling inside the housing 115 and is provided to extend in the longitudinal direction with the direction perpendicular to the laser irradiation direction as the longitudinal direction. The water supplied into the chamber 131 spreads over the longitudinal direction of the chamber 131. The slit opening 137 serves as an outlet through which water supplied into the chamber 131 flows out, and is provided on the lower surface side of the chamber 131. The slit opening 132 is formed extending in the longitudinal direction of the chamber 131. In the water curtain 117, water is used. However, any liquid may be used as long as it can absorb laser irradiation energy. When water is supplied to the water curtain 116, the water spreads over the longitudinal direction of the chamber 131 and flows out from the slit opening 137. The water flowing out from the slit opening 137 becomes a curtain-like water film 136 having a surface orthogonal to the laser irradiation direction. Here, the water curtain 117 is not supplied with air. When only water is supplied to the water curtain 117, a water film 136 having a width that is wider than the water film 135 as the distance from the slit opening 137 increases.

  The water films 135 and 136 formed by the water curtains 116 and 117 are irradiated with laser. The water films 135 and 136 absorb the irradiation energy of the laser and flow from the upper side to the lower side in the vertical direction. That is, the water films 135 and 136 flow from the upper ceiling side inside the housing 115 toward the lower water tank 126 inside the housing 115. The water films 135 and 136 have a thickness in the laser irradiation direction of about 10 mm. The water films 135 and 136 have a flow velocity in the range of 2 m / s to 28 m / s. Here, the lower limit of the flow rate of the water film 135 is such a rate that the water film 135 does not evaporate when the water film 135 is irradiated with laser. Further, the upper flow rate of the water films 135 and 136 is not a flow rate at which bubbles are likely to be generated, such as a jet flow, and is a flow rate at which bubbles are not easily generated.

  Further, the water curtain 116 and the water curtain 117 are arranged side by side in the laser irradiation direction, and the water curtain 116 is arranged on the downstream side of the water curtain 117 in the irradiation direction, in other words, the water curtain. 117 is disposed upstream of the water curtain 116 in the irradiation direction.

  The assist gas present around the laser sprays onto the water film 136 formed by the water curtain 117. The water film 136 suppresses inflow of the sprayed assist gas into the water film 135. The water film 136 flows from the upper side to the lower side in the vertical direction. That is, the water film 136 flows from the upper ceiling side inside the housing 115 toward the lower water tank 126 inside the housing 115, and from one side surface inside the housing 115 to the other side surface inside the housing 115. It flows toward. Since the water film 136 is a film having a smaller spread than the water film 135, the assist gas can be further blocked, and the influence of the assist gas on the downstream water film 135 can be reduced.

  The water film 135 formed by the water curtain 116 is jetted in a state where gas is mixed therein, so that water absorbs the laser and further scatters the passing laser at the boundary between the gas and the liquid. Thereby, the energy per unit area is absorbed and scattered, thereby reducing the output per unit area.

  The laser receiving plate 118 is a member that receives the laser attenuated by the water curtain 116 and the water curtain 117, and is, for example, a metal plate using metal. The laser receiving plate 118 shields the laser inside the housing 115 by receiving the laser.

  The water circulation mechanism 119 is a mechanism for circulating the water accumulated in the water tank 126 of the casing 115 to the water curtain 116. The water circulation mechanism 119 includes a circulation channel 141 and a pump 142 provided in the circulation channel 141. One of the circulation channels 141 is connected to the water tank 126 of the housing 115 and the other is connected to the chamber 131 of the water curtain 116. The pump 142 pumps the water accumulated in the water tank 126 toward the water curtain 116.

  The water pressure gauge 146 is disposed in the circulation channel 141 and detects the pressure of water supplied to the water curtain 116. The water pressure gauge 148 is disposed in the circulation channel 141 and detects the pressure of water supplied to the water curtain 117. The pressure gauge 150 detects the pressure of the air supplied from the air supply source 144 to the water curtain 116. The water pressure gauges 146 and 148 and the pressure gauge 150 send the measurement results to the control device 28. The damper water supply tank 152 is a tank for storing water, and replenishes water circulated by the water circulation mechanism 119. The damper chiller 154 is disposed in the circulation channel 141 and cools water flowing through the circulation channel 141.

  When the damper unit 18 is irradiated with a laser such as a high-power laser used in a processing machine, the irradiated laser together with the assist gas around the laser passes through the opening 125 of the casing 115. Introduced inside. The laser and the assist gas introduced into the housing 115 first intersect with the water film 136 formed by the water curtain 117. The assist gas crosses the water film 136, thereby preventing the assist gas from flowing to the water film 135. The laser crosses the water film 136 and is attenuated as the irradiation energy is absorbed. The laser that has passed through the water film 136 intersects the water film 135 formed by the water curtain 116. The laser crosses the water film 135 and attenuates as the irradiation energy is absorbed. The attenuated laser is scattered by the water film 135 and the irradiation range is expanded, and then enters the laser receiving plate 118 and is shielded by the laser receiving plate 118.

  The dustproof unit 22 includes a cover 170 and a cover 172. The cover 170 covers the surface of the wall surface 1 on the laser cutting unit 12 side. That is, the cover 170 covers the laser cutting unit 12 side at the cutting position. The cover 172 covers the surface of the wall surface 1 on the damper unit 18 side. That is, the cover 170 covers the damper unit 18 side at the cutting position. The dustproof unit 22 covers the area of the wall surface 1 that is processed by the laser cutting system 10 with the cover 170 and the cover 172. Thereby, it is suppressed that the dust which arises at the time of a process leaks out of the covers 170 and 172. Here, the dust includes fumes and dust generated by cutting. The covers 170 and 172 are provided with openings 174. A pipe 176 is connected to the opening 174. The pipe 176 is connected to the openings 174 of the covers 170 and 172, and the other is connected to the dust collection unit 24.

  FIG. 6 is a schematic diagram showing a schematic configuration of the dust collection unit of the present embodiment. The dust collection unit 24 is connected to the pipe 176 and collects the dust inside the dustproof unit 22. The dust collection unit 24 includes, for example, a cyclone 180, an electric dust collector 182, a filter unit 184, and a dust collection fan 186. The dust collection unit 24 is connected to the cyclone 180, the electrostatic precipitator 182, the filter unit 184, and the dust collection fan 186 in this order from the upstream side of the pipe 176. The cyclone 180 centrifuges the gas containing the dust supplied from the pipe 176, and collects the dust from the gas. The electric dust collector 182 collects dust contained in the gas that has passed through the cyclone 180. The filter unit 184 is, for example, a HEPA filter, and collects dust that cannot be collected by the cyclone 180 and the electric dust collector 182. The dust recovery fan 186 forms an air flow from the dustproof unit 22 toward the dust recovery unit 24 in the pipe 176. That is, the air in the dustproof unit 22 is sucked. The dust collection unit 24 collects dust in the order of the cyclone 180, the electrostatic precipitator 182, and the filter unit 184, thereby efficiently collecting the dust and collecting the dust in the dustproof unit 22.

  The moving unit 26 moves the cutting head 40 of the laser cutting unit 12 and the region of the damper unit 18 that shields the laser in conjunction with each other. The moving unit 26 includes a moving housing 202, a wire 204, a head moving mechanism 206, and a damper moving mechanism 208. The moving housing 202 supports the head moving mechanism 206 and the damper moving mechanism 208. The movable housing 202 includes a long and narrow plate-like ceiling surface 210 and plate-like side surfaces 212 and 214 that are connected to two opposite long sides of the ceiling surface 210 and extend downward in the vertical direction. The ceiling surface 210 faces the surface on the upper side in the vertical direction of the wall surface 1 at the time of cutting. The ceiling surface 210 is provided with, for example, two handles 220 to which the wire 204 is connected to the upper surface in the vertical direction. In the side surface 212, the upper surface in the vertical direction is connected to the ceiling surface 210, and faces the outer surface of the wall surface 1 (surface serving as the outer wall of the building) during processing. In the side surface 212, the upper surface in the vertical direction is connected to the ceiling surface 210, and faces the outer surface of the wall surface 1 (surface serving as the outer wall of the building) during processing. In the side surface 214, the upper surface in the vertical direction is connected to the ceiling surface 210, and faces the inner surface of the wall surface 1 (surface serving as the inner wall of the building) during processing. The ceiling surface 210 and the side surfaces 212 and 214 are part of the dustproof unit 22.

  As shown in FIGS. 2 and 3, the head moving mechanism 206 is disposed on the surface of the side surface 212 on the side surface 214 side. The head moving mechanism 206 is a mechanism that moves the laser cutting unit 12 along the side surface 212, that is, along the wall surface 1, and includes a horizontal direction moving mechanism 220 and a vertical direction moving mechanism 222. The horizontal movement mechanism 220 has, for example, a rail extending in the horizontal direction and a moving unit that moves along the rail. The vertical direction moving mechanism 222 is fixed to the moving unit of the horizontal direction moving mechanism 220, and includes a rail extending in the vertical direction and a moving unit that moves the rail. The laser cutting unit 12 is fixed to the moving part of the vertical direction moving mechanism 222. The head moving mechanism 206 moves the laser cutting unit 12 in the horizontal direction by moving the laser cutting unit 12 in the vertical direction by the vertical direction moving mechanism 222 and moving the vertical direction moving mechanism 222 in the horizontal direction by the horizontal direction moving mechanism 220. Move to.

  The damper moving mechanism 208 is disposed on the surface of the side surface 214 on the side surface 212 side. The damper moving mechanism 208 is a mechanism that moves the damper unit 18 along the side surface 214, that is, along the wall surface 1, and includes a horizontal direction moving mechanism 230 and a vertical direction moving mechanism 232. The horizontal direction moving mechanism 230 includes a rail extending in the horizontal direction and a moving unit that moves along the rail. The vertical direction moving mechanism 232 is fixed to the moving unit of the horizontal direction moving mechanism 230, and includes a rail extending in the vertical direction and a moving unit that moves the rail. The damper unit 18 is fixed to the moving part of the vertical direction moving mechanism 232. The damper moving mechanism 208 moves the damper unit 18 in the horizontal direction by moving the damper unit 18 in the vertical direction by the vertical direction moving mechanism 232 and moving the vertical direction moving mechanism 232 in the horizontal direction by the horizontal direction moving mechanism 230. Let

  The moving unit 26 is a moving casing 202 that moves the head cutting unit 12 and the damper unit 18 to a position sandwiching the vicinity of the cutting position of the wall surface 1 and moves the head cutting unit 12 by the head moving mechanism 206 during processing. The damper unit 18 is moved by the damper moving mechanism 208. Moreover, it is preferable that the movement unit 26 is further provided with the conveyance mechanism which conveys the cut | disconnected wall surface.

  The temporary storage container 27 is a box having an open upper surface, and is installed in a movable state on the gantry 32. The temporarily placed container 27 accommodates the cut wall surface 1. The temporary container 27 can be moved from the gantry 32 by a crane or the like. The laser cutting unit 10 may replace and use a plurality of temporary storage containers 27, or may use one temporary storage container 27 repeatedly.

  The control device 28 is arranged at a position away from the wall surface 1. The control device 28 includes an arithmetic processing unit, a display unit, an operation unit, and the like, and the laser cutting unit 10, the damper unit 18, and the like based on operator input, sensor detection results, and a preset program. The operation of each part of the laser output device 14, the laser cutting unit accessory device 16, the damper accessory device 20 and the dust collection unit 24 is controlled.

  Next, a method for cutting the wall surface 1 (wall surface cutting method) using the laser cutting system 10 according to the present embodiment will be described with reference to the flowchart of FIG. Hereinafter, although described as processing executed by the laser cutting system 10, preparatory work up to cutting is performed by the operator remotely, regardless of whether the worker performs the work or the work device automatically. Also good.

  The laser cutting system 10 installs the gantry 32 outside the wall surface 1 (step S12). The gantry 32 is installed in the vicinity of the height at which the wall surface 1 is cut. The laser cutting system 10 installs the container 34 on the gantry 32 (step S14). By installing the container 34 in which each part is stored on the gantry 32, each part of the laser cutting system 10 is arranged near the region to be cut. The laser cutting system 10 installs the laser cutting unit 12 and the damper unit 18 on the wall surface (step S16). The laser cutting unit 12 and the damper unit 18 are moved together by the moving unit 26 and installed at a position where the wall surface 1 is cut. Next, the laser cutting system 10 connects the system of each part (step S18). Each part accommodated in the container 34 is connected to the laser cutting unit 12 and the damper unit 18. Specifically, in addition to the laser transmission path 50, the cooling medium pipe 52, the gas supply pipe 54, and the circulation flow path 134, control wiring and electric wires are connected to each part. Next, the laser cutting system 10 installs the dustproof unit 22 (step S20). The dustproof unit 22 may be installed in the moving unit 26 in advance.

  The laser cutting system 10 cuts the wall surface 1 (step S22). The laser cutting system 10 cuts the wall surface 1 by moving the laser cutting unit 12 and the damper unit 18 while irradiating the laser from the laser cutting unit 12 with the moving unit 26. The moving unit 26 moves the laser cutting unit 12 on a straight line in the horizontal direction and the vertical direction, respectively, and cuts the wall surface 1 into a rectangle. The laser cutting system 10 stores the cut wall surface 1 in the temporary container 27 (step S24). The cut wall surface 1 may be transported by a transport device arranged in the moving housing 202 of the moving unit 26 or may be transported by another transport mechanism.

  The laser cutting system 10 determines whether the temporarily cut wall surface can be accommodated in the temporary container 27 (step S26). When the laser cutting system 10 determines that the temporarily placed container 27 cannot accommodate the cut wall surface, that is, the temporarily placed container 27 is full (No in step S26), the laser cutting system 10 removes the wall surface in the temporarily placed container 27 (step S26). S28). The laser cutting system 10 moves the temporary container 27 from the gantry 32 to the ground even if the temporary container 27 is replaced and the cut wall surface in the temporary container 27 installed on the gantry 32 is removed. Then, the inner cut wall surface may be removed, and the temporary container 27 may be moved to the gantry 32 again.

  If the laser cutting system 10 determines that the further cut wall surface can be accommodated in the temporary container 27 (Yes in step S26), the process proceeds to step S30. When the wall surface of the temporary container 27 is removed, the laser cutting system 10 determines whether the cutting is finished when the new wall surface of the temporary container 27 can be accommodated (step S30). When the laser cutting system 10 determines that the cutting is not finished (No in step S30), the laser cutting system 10 returns to step S22 and cuts the wall surface. In the laser cutting system 10, the moving unit 26 moves the positions of the laser cutting unit 12 and the damper unit 18 to cut the remaining wall surface 1. If the laser cutting system 10 determines that the cutting is finished (Yes in step S30), the process is finished.

  As described above, the laser cutting system 10 enables the laser cutting unit 12 to be moved by the moving unit 26 and provides a dustproof unit 22 and a dust collection unit 24 to safely cut a wall surface of a building such as a building. Can do. Specifically, even when cutting in a radiation environment, such as a building of a nuclear facility, by cutting non-contact and remotely using a laser, it can be prevented that the processing equipment bites into the wall surface 1 and cannot be removed. In addition, the exposure of workers can be reduced. Further, by collecting fumes and dust generated at the time of processing by the dust-proof unit 22 and the dust collection unit 24, it is possible to suppress the radiation material from being scattered outside.

  Further, the laser cutting system 10 can easily arrange each part in the vicinity of the wall surface 1 by housing each part in a container unit and unitizing it. Further, by providing the gantry 32 on the wall surface 1, various devices can be arranged in the vicinity of the wall surface 1 to be cut, and assist gas, a cooling medium, and the like can be supplied efficiently. In addition, the temporary container 27 can be placed on the gantry 32. Further, by providing the temporary container 27, the cut wall surface can be immediately accommodated, and the dismantling work can be performed efficiently. Further, the apparatus can be miniaturized by performing processing while relatively moving the laser irradiation unit 12 and the damper unit 18.

  FIG. 8 is a perspective view showing a schematic configuration of a laser cutting system according to another embodiment. Since the basic configuration of the laser cutting system 10a shown in FIG. 8 is the same as that of the laser cutting system 10, points unique to the laser cutting system 10a will be described. The laser cutting system 10a has a damper unit 18a. The damper unit 18a is arranged over the entire range in which the head moving unit 26a moves the laser cutting unit 12.

  A head moving mechanism 250 that moves the laser cutting unit 12 is fixed to the gantry 32. The head moving mechanism 250 is a mechanism that moves the laser cutting unit 12 along the side surface 212, that is, along the wall surface 1, and includes a horizontal direction moving mechanism 250 and a vertical direction moving mechanism 252. The horizontal movement mechanism 250 includes a rail 250a extending in the horizontal direction and a moving unit 252 that moves along the rail 250a. The rail 250 a is fixed to the gantry 32. The vertical direction moving mechanism 252 is fixed to the moving unit of the horizontal direction moving mechanism 250, and includes a rail 252a extending in the vertical direction and a moving unit 252b moving the rail 252a. The laser cutting unit 12 is fixed to the moving unit 252b of the vertical direction moving mechanism 252. The head moving mechanism 250 moves the laser cutting unit 12 in the horizontal direction by moving the laser cutting unit 12 in the vertical direction by the vertical direction moving mechanism 252 and moving the vertical direction moving mechanism 252 in the horizontal direction by the horizontal direction moving mechanism 250. Move to.

  In addition, the laser cutting system 10a includes a cover 252 that is deformable in a sheet shape. One end of the cover 252 is fixed to the structure on the laser cutting unit 12 side of the wall surface 1 and extends to the damper unit 18 side. The cover 252 extends from the laser cutting unit 12 side of the wall surface 1 to the damper unit 18 side, thereby covering the surface of the wall surface 1 on the upper side in the vertical direction and the surface on the damper unit 18 side. The dust-proof unit 22 has a dross collecting section 254 that collects dross generated by processing and discharged to the surface on the damper unit 18a side. The dross collection part 254 is disposed between the damper unit 18 and the wall surface 1 on the lower side in the vertical direction than the damper unit 18. The dross collection part 254 collects dross and prevents it from being scattered around.

  The laser cutting system 10a can perform cutting without providing a mechanism for moving the damper unit by disposing the damper unit 18a on the entire surface. Moreover, by providing the cover 252 formed of a deformable material, it is possible to follow the wall surface 1 whose shape changes by cutting and cover the surroundings, and dust discharge can be further suppressed.

  Further, the laser cutting system 10a may fix the damper unit 18a to the adjacent column portion 1b when the damper unit 18a is not moved along with the laser cutting unit 12. By fixing the damper unit 18a to the pillar portion 1b, the pillar 1b and the damper unit 18a can shield the space on the damper unit 18a side, and the pillar 1b and the damper unit 18a can be used as a cover for the dustproof unit 22. it can. Moreover, it can suppress more suitably that dust leaks. Moreover, the weight which the movement unit 26 supports at the time of a process can be reduced by fixing the damper unit 18a to the pillar 1b. Further, it is not necessary to provide a support mechanism inside the wall surface 1.

  Moreover, since the dustproof unit 22 can remove dust efficiently, the dustproof unit 22 covers the vicinity of the processing region of the wall surface 1, but may cover the entire structure having the wall surface 1.

DESCRIPTION OF SYMBOLS 1 Wall surface 1a Wall part 1b Column part 10, 10a Laser cutting system 12 Laser cutting unit 14 Laser output device 16 Laser cutting unit incidental equipment 18, 18a Damper unit 20 Damper auxiliary equipment 22 Dust-proof unit 24 Dust collection unit 26 Moving unit 27 Temporary placement Container 28 Control device 32 Gantry unit 34 Container unit 36 Container 40 Cutting head 42 Camera 44 Sensor 46 Head cooling chiller 48 Assist gas supply unit 50 Laser transmission path 52 Cooling medium piping 54 Gas supply piping 115 Housing 116 Water curtain 117 Water curtain 118 Laser receiving plate 119 Water circulation mechanism 120 Control unit 125 Opening 126 Water tank 127 Gas discharge port 132 Slit opening 135, 136 Water film 137 Injection nozzle 141 Circulating flow path 142 Pump 44 Air supply source 146, 148 Water pressure gauge 150 Pressure gauge 152 Damper water supply tank 154 Damper chiller 170, 172 Cover 174 Opening 176 Piping 180 Cyclone 182 Electric dust collector 184 Filter unit 186 Dust collection blower 202 Moving housing 204 Wire 206 Head movement Mechanism 208 Damper moving mechanism

Claims (8)

A laser output device for outputting a laser;
A laser cutting unit that emits the laser in a state where the laser output from the laser output device faces a cutting object;
A damper unit that faces the laser cutting unit through the cutting object and shields the laser that has passed through the cutting object;
A moving device for moving the laser cutting unit and the damper unit;
A dust-proof unit that covers a processing region in which the laser cutting unit and the damper unit are disposed;
A laser cutting system comprising: a dust recovery unit that sucks air in the dustproof unit and removes dust.   2. The laser cutting system according to claim 1, further comprising a container unit including a container in which the laser output device is stored and a container in which the dust collection unit is stored.   The laser cutting system according to claim 2, wherein the container unit is placed on a gantry installed on the cutting object.   The laser cutting system according to claim 3, further comprising a temporary container placed on the gantry and storing a cut object to be cut.   5. The laser cutting system according to claim 1, wherein the dust-proof unit has a cover that covers the cutting object and the damper device. 6.   The laser cutting system according to any one of claims 1 to 5, wherein the object to be cut is a wall surface of a structure contaminated with a radioactive substance. A wall surface cutting method for cutting a wall surface of a structure,
Installing a gantry on the outer surface of the wall;
Installing each device housed in a container on the gantry;
Installing a laser cutting unit and a damper unit on the wall;
Connecting the laser cutting unit and the damper unit to each device housed in the container;
Installing a dustproof unit that covers a processing region in which the laser cutting unit and the damper unit are disposed;
Cutting the wall surface with the laser cutting unit.   The wall surface cutting method according to claim 7, further comprising a step of storing a wall surface separated by cutting into a temporary placement unit disposed on the gantry.

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