JPS63157778A - Method and device for cutting solid material by laser projection - Google Patents
Method and device for cutting solid material by laser projectionInfo
- Publication number
- JPS63157778A JPS63157778A JP61306150A JP30615086A JPS63157778A JP S63157778 A JPS63157778 A JP S63157778A JP 61306150 A JP61306150 A JP 61306150A JP 30615086 A JP30615086 A JP 30615086A JP S63157778 A JPS63157778 A JP S63157778A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- laser
- groove
- depth
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 60
- 239000011343 solid material Substances 0.000 title claims description 23
- 238000000034 method Methods 0.000 title claims description 11
- 238000003698 laser cutting Methods 0.000 claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 239000002893 slag Substances 0.000 claims description 16
- 238000005422 blasting Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims 2
- 239000004567 concrete Substances 0.000 abstract description 25
- 239000000463 material Substances 0.000 abstract description 22
- 239000011521 glass Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 5
- 239000004576 sand Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000011150 reinforced concrete Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011210 fiber-reinforced concrete Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
- B23P25/003—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress immediately preceding a cutting tool
- B23P25/006—Heating the workpiece by laser during machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/144—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing particles, e.g. powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Working Measures On Existing Buildindgs (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野]
この発明は、低出力のレーザーによって同一切断位置を
繰返し溶断することにより、大出力レーザーで切断した
場合と同等の結果が得られるようにしたレーザー照射に
よる固形材の切断方法及びその装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] This invention makes it possible to obtain the same result as cutting with a high-power laser by repeatedly cutting the same cutting position with a low-power laser. The present invention relates to a method for cutting solid materials by laser irradiation and an apparatus therefor.
固形材のうち、特に鉄筋コンクリート、鉄骨鉄筋コンク
リート、ファイバー鉄筋コンクリート、ファイバーコン
クリート、コンクリート、モルタルおよびそれらを用い
た構造物等をレーザービームによって切断し解体する実
際例は未だほとんど見られず、現在においては実験室的
階段にある。Among solid materials, there are still few actual examples of cutting and disassembling reinforced concrete, steel-framed reinforced concrete, fiber-reinforced concrete, fiber concrete, concrete, mortar, and structures using these materials using laser beams, and at present, there are few practical examples of cutting and disassembling solid materials using laser beams. It's on the staircase.
また、現在行われている切断方法は、切断性能を向上さ
せる要因であるレーザー出力、切断速度、集光レンズ又
は集光ミラーの焦点距覗、焦点を合わせる位置、レーザ
ービームモード(強度分布)、アシストガスの圧力とそ
の種類等をパラメータとし、これらのパラメータをそれ
ぞれ変化させて組合わせ、切断を行っている。但し、こ
れらの切断方法は、レーザー切断装置を、その焦点位置
を切断深さ方向に一定として一方向へ移動させることに
より対象物を切断している。このような方法で切断する
装置としては、第5図に示す特開昭59−194805
号公報に開示されたものかある。In addition, the currently used cutting methods require factors that improve cutting performance: laser output, cutting speed, focal length of the condensing lens or condensing mirror, focusing position, laser beam mode (intensity distribution), The pressure of the assist gas, its type, etc. are used as parameters, and cutting is performed by changing and combining these parameters. However, in these cutting methods, the object is cut by moving a laser cutting device in one direction with its focal position fixed in the cutting depth direction. As a device for cutting in this way, there is a device disclosed in Japanese Patent Application Laid-Open No. 59-194805 shown in Fig. 5.
Is there something that was disclosed in the publication?
この概要を説明すると、図においてレーザービームlは
図外のレーザー発振器から発射され、トーチ部2を経て
被切断物であるコンクリート材3を照射する。Pはレー
ザービームlのほぼ焦点となる照射点で、コンクリート
材3はここから内部へ向って溶融する。そしてこの溶融
物へは補給材であるMgO等がノズル4を介して補給材
供給装置5から供給され、溶融したコンクリートと混合
して冷却後に脆い溶滓6となる。この溶滓は溶断により
生じた溝7に貯まるので、ワイヤブラシ8を回転させて
除去する。溶滓を除去した溝7にはコンクリート材3を
破断するための破砕剤9が装入される。To briefly explain this, in the figure, a laser beam 1 is emitted from a laser oscillator (not shown), passes through a torch section 2, and irradiates a concrete material 3, which is an object to be cut. P is an irradiation point that is almost the focus of the laser beam l, and the concrete material 3 melts inward from this point. A replenishment material such as MgO is supplied to this melt from a replenishment supply device 5 through a nozzle 4, mixed with the molten concrete, and becomes brittle slag 6 after cooling. This molten slag accumulates in the groove 7 created by the fusing, and is removed by rotating the wire brush 8. A crushing agent 9 for breaking the concrete material 3 is charged into the groove 7 from which the slag has been removed.
以上のような諸部品が機枠10に列設されてレーザー切
断装置を構成し、この装置を矢印A方向へ移動しつつコ
ンクリート材の切断を行゛うようになっている。′
〔本発明が解決しようとする問題点〕
しかしながら、このような従来の切断方法においては、
レーザーの焦点位置をその切断深さ方向に変えることな
くレーザー切断装置を一方向に移動させることによりコ
ンクリート材を切断する方法であるため、この装置とこ
の方法によって切断加工性を大幅に向上するには、装置
の移動速度を遅くするかあるいはレーザー出力を大きく
するしかないことになる。そして装置の移動速度を遅く
すれば切断に時間がかかり、レーザー出力を大きくすれ
ばレーザー発振器および電源装置等が大型化し、工場等
の所定場所以外での作業には装置一式の現場への運搬が
困難となり、さらに装置は高額となる。The above-mentioned parts are arranged in a row on the machine frame 10 to constitute a laser cutting device, and this device is moved in the direction of arrow A to cut concrete material. ′ [Problems to be solved by the present invention] However, in such a conventional cutting method,
This method cuts concrete by moving the laser cutting device in one direction without changing the laser focus position in the direction of the cutting depth, so this device and method can greatly improve cutting processability. In this case, the only option is to either slow down the moving speed of the device or increase the laser output. Slowing down the moving speed of the device will take time to cut, increasing the laser output will require larger laser oscillators, power supplies, etc., and transportation of the entire device to the site will be necessary if work is to be done outside of a designated location such as a factory. This becomes difficult and the equipment becomes expensive.
また、レーザー出力を大きくすると安定した出力が得ら
れず、現在市販されているものはCO2レーザーで出力
はl0KWまで、その他のレーザーでは出力が3KW以
下である。Furthermore, if the laser output is increased, a stable output cannot be obtained, and currently commercially available CO2 lasers have an output of up to 10 KW, and other lasers have an output of 3 KW or less.
この発明は、以上のような従来の問題点にかんがみてな
されたものであって、レーザーの焦点位置を切断深さ方
向に変えながら同一切断位置を繰返し溶断する方法とす
ることにより、上記問題点を解決することを目的として
いる。This invention has been made in view of the above-mentioned conventional problems, and the above-mentioned problems can be solved by repeatedly melting the same cutting position while changing the focal position of the laser in the direction of the cutting depth. It aims to solve the problem.
〔問題点を解決するための手段]
この発明は、レーザーを照射して固形材を切断するに際
し、同一切断位置を繰返し溶断するために、毎回の溶断
深さに応じてレーザービームの焦点位置を溶断深さ方向
に移動するとともに、毎回の溶断後に固形材が溶融して
生じる溶滓を回転カッタ又はショツトブラスト等により
除去しつつ切断する固形材の切断方法、及びこの方法の
実施に際して使用する装置の発明として、レーザービー
ムの焦点位置を固形材の溶断深さ方向に移動可能とした
レーザー照射装置と、溶断した固形材の溶滓を除去清掃
するだめの回転カッタ又はショツトブラスト詰置とを備
えたレーザー切断装置としたものである。[Means for Solving the Problems] When cutting a solid material by irradiating a laser, the present invention adjusts the focus position of the laser beam according to the depth of each cut in order to repeatedly cut the same cutting position. A method for cutting solid materials in which the solid material is cut while moving in the direction of the melting depth and removing slag produced by melting of the solid material after each melting using a rotary cutter, shot blasting, etc., and an apparatus used to carry out this method. The present invention is equipped with a laser irradiation device that can move the focal position of the laser beam in the direction of the melting depth of the solid material, and a rotary cutter or shot blasting device for removing and cleaning slag from the melted solid material. This is a laser cutting device.
先ずレーザービー1、の焦点位置を被切断物である固形
材の表面に設定して照射しつつレーザー切断装置を切断
位置に沿って移動させると、固形材には切断装置の移動
速さに反比例した深さに溶断された溝が形成され、固形
材が例えばコンクリート材である場合は上記溝の中に溶
断後に冷却固化した溶滓が固着する。そこでこの溶滓を
回転カッタ又はショツトブラスト等により除去し、溝を
清掃する。次にレーザービームの焦点位置を清掃された
溝の底部に移動して照射しつつレーザー切断装置を前回
と同じ切断位置に沿って再び移動させると、上記溝はそ
の底部からさらに深く溶断されてより深い溝が形成され
る。そこで再び生じた溶滓を前記手段によって除去する
。次にこのより深くなった溝の底部へレーザーの焦点位
置を設定し、同様な溶断を繰返すことにより、溶断され
た溝の深さが固形材の裏面に達して固形材は切断される
。First, when the focus position of the laser beam 1 is set on the surface of the solid material to be cut and the laser cutting device is moved along the cutting position while irradiating the surface, the solid material will be cut in inverse proportion to the moving speed of the cutting device. If the solid material is concrete, for example, the molten slag that has been cooled and solidified after being fused is fixed in the groove. Therefore, this molten slag is removed using a rotary cutter, shot blasting, etc., and the grooves are cleaned. Next, the laser cutting device is moved again along the same cutting position as the previous time while moving the focal point of the laser beam to the bottom of the cleaned groove and irradiating it, so that the groove is cut deeper and deeper from the bottom. Deep grooves are formed. Then, the slag generated again is removed by the above-mentioned means. Next, by setting the focal point of the laser at the bottom of this deeper groove and repeating the same cutting, the depth of the cut groove reaches the back surface of the solid material, and the solid material is cut.
このように低出力レーザーによる)容断を繰返すことに
より、大出力レーザーで切断した場合と同じ結果が得ら
れる。そしてこの際、使用される装置は、レーザービー
ムの焦点位置を移動可能とした手段を有する低出力のレ
ーザー切断装置である。By repeating cutting with a low-power laser in this way, the same result as cutting with a high-power laser can be obtained. The device used at this time is a low-power laser cutting device that has means that allows the focal position of the laser beam to be moved.
以下、この発明を図面に基づいて説明する。第1〜4図
はこの発明の実施例を示す図である。The present invention will be explained below based on the drawings. 1 to 4 are diagrams showing embodiments of the present invention.
先ず、構成を説明すると、第1図において、1はレーザ
ー切断装置で、2はそのレーザー照射装置としての加工
ヘッドである。この加工ヘッド2には反射ミラー3.集
光ミラー4等が内設されていて、図外のレーザー発振器
から発射されたレーザービーム5を反射集光して固形材
であるコンクリート材6へ照射するようになっている。First, to explain the configuration, in FIG. 1, 1 is a laser cutting device, and 2 is a processing head as the laser irradiation device. This processing head 2 includes a reflecting mirror 3. A condensing mirror 4 and the like are installed inside, so that a laser beam 5 emitted from a laser oscillator (not shown) is reflected and condensed to irradiate it onto a concrete material 6, which is a solid material.
7は加工ヘッド2の防護筒で、コンクリート6溶断時に
生じる粉塵や煙がレーザービームを遮りレーザーの能力
を低下させないために設けたもので、さらに空気吹込口
8からこの防護筒7内へ空気を吹込み、レーザービーム
5の径路へこれらのヒユームが侵入するのを防止してい
る。9はアシストガスノズルで、レーザービーム焦点位
置へ向けて02等のアシストガスを吹付けて、コンクリ
ート中の鉄筋等の溶融を早めるとともに溶融状態にある
溶滓(ドロス)を吹飛ばすために設けたものである。ま
た、このドロスは冷却するとガラス状の固体の溶滓10
となって、溶断によって形成された溝IIを埋めるとと
もにその壁面に固着する。そこで、この溶滓10を、レ
ーザー切断装置1に設けた回転カッタ12によって切削
して粉砕し、清掃装置13で吸収して外部へ排出するよ
うになっている。Reference numeral 7 designates a protective tube for the processing head 2, which is provided to prevent dust and smoke generated when the concrete 6 is melted from blocking the laser beam and reducing the performance of the laser. This prevents these fumes from entering the path of the laser beam 5. 9 is an assist gas nozzle, which is installed to spray assist gas such as 02 toward the laser beam focal point to hasten the melting of reinforcing bars in concrete and blow away molten dross. It is. In addition, when this dross is cooled, it becomes a glass-like solid slag.
As a result, it fills the groove II formed by fusing and is fixed to the wall surface of the groove II. Therefore, this molten slag 10 is cut and crushed by a rotary cutter 12 provided in the laser cutting device 1, and is absorbed by a cleaning device 13 and discharged to the outside.
14はコンピュータ制御装置であって、図外のセンサー
が検知した溝11の深さhによって加工ヘッド2を溶断
深さ方向に移動させ、レーザービームの焦点位置を自動
的に制御する。15は図外の遠隔操作装置と連結する作
動環である。Reference numeral 14 denotes a computer control device that moves the processing head 2 in the fusing depth direction based on the depth h of the groove 11 detected by a sensor (not shown), and automatically controls the focal position of the laser beam. 15 is an operating ring connected to a remote control device (not shown).
なお、本実施例においては、集光ミラー4によって集光
されるレーザービーム5の焦点距離は大きい溶断深さを
得るために約1mに設定されている。In this embodiment, the focal length of the laser beam 5 focused by the focusing mirror 4 is set to about 1 m in order to obtain a large fusing depth.
次に動作を説明する。Next, the operation will be explained.
先ス、レーザービーム5の焦点位置がコンクリート材6
の表面に来るように加工ヘッド2を調整し、次いでレー
ザー切断装置1をコンクリート材の切断位置に沿って所
定の速度で移動させると、コンクリート材6には後述す
る移動速度に関連した深さり、に溶断された溝11が形
成される。そして、このとき生じるドロスは、アシスト
ガスノズル9から吹出すアシストガスで焦点位置近傍か
ら吹とばされながら、溝11内で冷却してガラス状の溶
滓となり溝11の壁に固着する。固着した溶滓lOは装
置1と一体に移動してくる回転カッタ12により切削粉
砕されるとともに清掃装置13に吸込まれて外部へ排出
される。かくして、コンクリート材6の切断位置が、深
さり、の溝11が形成されるごとく溶断されると装置1
は切断位置の切断開始点に戻り、同時に図外のセンサが
溝11の深さり、を検知してその検知信号がコンピュー
タ制御装置14に送られると、加工へノド2はこの装置
14によって制御され、レーザービーム5の焦点位置が
溝11の底部へ来るように深さ方向に移動される。次い
で、レーザー切断装置lは、再び前回と同じコンクリー
ト材6の切断位置を所定の速度で移動し、移動に伴って
コンクリート材6をさらに溶断し深さり、+h2の溝を
形成するとともに、その溝内の溶滓はさらにh2の距離
だけ装置1から突出した回転カッタ12によって切削粉
砕され、清掃装置13によって排出される。First, the focus position of the laser beam 5 is on the concrete material 6.
When the processing head 2 is adjusted so that it comes to the surface of the concrete material 6, and then the laser cutting device 1 is moved at a predetermined speed along the cutting position of the concrete material, the concrete material 6 has a depth related to the moving speed, which will be described later. A groove 11 is formed. The dross generated at this time is blown away from the vicinity of the focal point by the assist gas blown from the assist gas nozzle 9, cools within the groove 11, becomes glass-like slag, and adheres to the wall of the groove 11. The fixed molten slag lO is cut and crushed by a rotary cutter 12 that moves together with the device 1, and is sucked into a cleaning device 13 and discharged to the outside. In this way, when the cutting position of the concrete material 6 is fused so that the groove 11 of depth is formed, the device 1
returns to the cutting starting point of the cutting position, and at the same time a sensor (not shown) detects the depth of the groove 11 and sends the detection signal to the computer control device 14, which controls the processing gutter 2. , the focal position of the laser beam 5 is moved in the depth direction so that it comes to the bottom of the groove 11. Next, the laser cutting device l moves again at the same cutting position of the concrete material 6 as the previous time at a predetermined speed, and as it moves, the concrete material 6 is further melted and deepened to form a groove of +h2, and the groove is The molten slag inside is further cut and crushed by a rotary cutter 12 that protrudes from the device 1 by a distance h2, and is discharged by a cleaning device 13.
レーザー切断装置1がこのような溶断動作を繰返すこと
により溝11の深さは大きくなって、コンクリート材6
は切断位置において切断されるごとになる。As the laser cutting device 1 repeats such a fusing operation, the depth of the groove 11 increases, and the concrete material 6
is cut at the cutting position.
第2図に第2の実施例を示す(前記実施例と同一の部分
については同一の符号を付し、重複する説明を省く)。A second embodiment is shown in FIG. 2 (the same parts as in the previous embodiment are given the same reference numerals and redundant explanations will be omitted).
この実施例は前記実施例における回転カッタ12の代わ
りにプラストノズル17を設け、ここからサンド又はグ
リッドを噴射してドロス10を吹とばし、このサンド又
はグリッドとドロスの混合した粉粒体を吸引管18を介
して清掃装置13内へ回収し、回収した粉粒体を圧縮空
気によって供給管19を介し再びプラス1−ノズル17
から噴射させるようにしたものである。2゜は密閉用プ
レートであって、粉粒体を吸引する際に、溝11を仕切
って密閉空間21を画成する。In this embodiment, a plasto nozzle 17 is provided in place of the rotary cutter 12 in the previous embodiment, from which sand or grid is injected to blow away the dross 10, and the powder mixture of the sand or grid and dross is transferred to a suction tube. 18 into the cleaning device 13, and the collected powder is conveyed by compressed air through the supply pipe 19 to the plus 1 nozzle 17 again.
It is designed to be ejected from. 2° is a sealing plate which partitions the groove 11 to define a sealed space 21 when sucking the powder.
また、加工ヘッド2の動作及び同一切断位置を繰返し溶
断する方法等については前記第1の実施例と同様である
。Further, the operation of the processing head 2 and the method of repeatedly fusing the same cutting position are the same as in the first embodiment.
第3図に第3の実施例を示す。これは第2実施例におい
てサンドやグリッドを回収するための吸引管18を欠除
したものであって、ブラスト材タンク22から供給管1
9を介してプラストノズル17から噴射し、サンド等の
ブラスト材は再使用しない。従って、構成は第2実施例
よりさらに簡単になっているが、この装置は吹飛ばされ
た粉塵が作業環境において問題を生じない場合に使用さ
れるものである。FIG. 3 shows a third embodiment. This is the same as the second embodiment except that the suction pipe 18 for collecting sand and grid is omitted, and the supply pipe 18 is connected to the blasting material tank 22.
9 from the blast nozzle 17, and the blasting material such as sand is not reused. Therefore, although the structure is simpler than that of the second embodiment, this device is used when the blown dust does not cause problems in the working environment.
第4図は以上の実施例において、同一切断位置を繰返し
溶断を行った場合のレーザー出力と溶断された切断深さ
く前述の溝11の深さhl++12+・・・・・・)と
の関係を示す線図であって、出力5KWのレーザーで2
回溶断した場合の切断深さく1回切り値45Mm、2回
切り値85mm)は、出力10KWのレーザーで1回溶
断した場合の切断深さく82mm)よりも大きいことを
示している。(但し、いずれも装置の移動速度はlQc
m/m1n)。すなわち、l0KWを超えるような大出
力のレーザーで切断を行う必要がなく、5KW乃至l0
KW未満の低出力レーザーで繰返し溶断を行えば、大出
力レーザーで切断した場合と同じ結果が得られることに
なる。なお、図は出力5KWのレーザーを用い、切断速
度を10cm/minで2回溶断した場合の切断深さく
85朧■)は、切断速度5cm/minで1回溶断した
場合の切断深さく82mm)よりも大きいことも示して
いる。FIG. 4 shows the relationship between the laser output and the depth of the fused groove 11 (hl++12+...) when the same cutting position is repeatedly fused in the above embodiment. 2 with a laser with an output of 5KW.
This shows that the cutting depth (1-time cutting value of 45 mm) and 2-time cutting value (85 mm) when melt-cutting is performed twice is larger than the cutting depth (82 mm) when melt-cutting is performed once with a laser with an output of 10 KW. (However, in both cases, the moving speed of the device is lQc
m/m1n). In other words, there is no need to cut with a laser with a high power exceeding 10KW,
If fusing is repeatedly performed with a low power laser of less than KW, the same result as cutting with a high power laser will be obtained. The figure shows a cutting depth of 85 mm when a laser with an output of 5 KW is used and cutting is performed twice at a cutting speed of 10 cm/min.The figure shows a cutting depth of 82 mm when cutting is performed once at a cutting speed of 5 cm/min It also shows that it is larger than
以上説明したように、この発明によれば、低出力レーザ
ーの繰返し溶断で、コンクリート材等の固形物の切断が
容易に行われ、大出力レーザーで切断した場合以上の結
果が得られる。従って、大出力のための大型の装置(レ
ーザー発振器、電源装置等)及び付帯設備を必要とせず
、安全対策上及びコスト上、きわめて有利であるという
効果が得られる。As explained above, according to the present invention, solid materials such as concrete materials can be easily cut by repeated fusing with a low-power laser, and results better than those obtained by cutting with a high-power laser can be obtained. Therefore, there is no need for large-scale devices (laser oscillators, power supplies, etc.) and incidental equipment for high output, which is extremely advantageous in terms of safety and cost.
第1図は本発明に係る第1の実施例の概要図、第2図は
第2の実施例の概要図、第3図は第3の実施例の概要図
、第4図はレーザー出力と切断深さとの関係を示す線図
、第5図は従来例の概要図である。
2・・・・・・レーザー照射装置(加工ヘッド)、5・
・・・・・レーザービーム、6・・・・・・固形材(コ
ンクリート材)、10・・・・・・溶滓、12・・・・
・・回転カッタ、13・・・・・・清掃装置、17・・
・・・・プラストノズル、18・・・・・・吸引管、1
9・・・・・・供給管、13.17,18゜19・・・
・・・ショツトブラスト装置。
特許出願人 大成建設株式会社
代理人 弁理士 森 哲 也
代理人 弁理士 内 藤 嘉 昭
代理人 弁理士 清 水 正
第1図
に那←εFig. 1 is a schematic diagram of the first embodiment according to the present invention, Fig. 2 is a schematic diagram of the second embodiment, Fig. 3 is a schematic diagram of the third embodiment, and Fig. 4 is a schematic diagram of the laser output. A diagram showing the relationship with cutting depth, FIG. 5 is a schematic diagram of a conventional example. 2... Laser irradiation device (processing head), 5.
... Laser beam, 6 ... Solid material (concrete material), 10 ... Molten slag, 12 ...
...Rotary cutter, 13...Cleaning device, 17...
... Plast nozzle, 18 ... Suction tube, 1
9... Supply pipe, 13.17, 18°19...
...shot blasting device. Patent applicant Taisei Corporation Agent Patent attorney Tetsuya Mori Attorney Yoshiaki Naito Attorney Patent attorney Tadashi Shimizu Figure 1←ε
Claims (2)
一切断位置を繰返し溶断するために、毎回の溶接深さに
応じてレーザービームの焦点位置を溶断深さ方向に移動
するとともに、毎回の溶断後に固形材が溶融して生じる
溶滓を回転カッタ又はショットブラスト等により除去清
掃しつつ切断することを特徴とするレーザ照射による固
形材の切断方法。(1) When cutting solid materials by laser irradiation, in order to repeatedly fuse the same cutting position, the focal position of the laser beam is moved in the direction of the welding depth depending on the welding depth each time, and the A method for cutting a solid material by laser irradiation, which comprises cutting while removing and cleaning slag produced by melting the solid material using a rotary cutter, shot blasting, or the like.
向に移動可能に構成したレーザー照射装置と、溶断した
固形材の溶滓を除去清掃するための回転カッタ又はショ
ットブラスト装置とを備えたことを特徴とするレーザー
切断装置。(2) Equipped with a laser irradiation device configured to be able to move the focal position of the laser beam in the direction of the melting depth of the solid material, and a rotary cutter or shot blasting device for removing and cleaning slag from the melted solid material. A laser cutting device characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61306150A JPH0798274B2 (en) | 1986-12-22 | 1986-12-22 | Method and apparatus for cutting solid material by laser irradiation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61306150A JPH0798274B2 (en) | 1986-12-22 | 1986-12-22 | Method and apparatus for cutting solid material by laser irradiation |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63157778A true JPS63157778A (en) | 1988-06-30 |
JPH0798274B2 JPH0798274B2 (en) | 1995-10-25 |
Family
ID=17953654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61306150A Expired - Lifetime JPH0798274B2 (en) | 1986-12-22 | 1986-12-22 | Method and apparatus for cutting solid material by laser irradiation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0798274B2 (en) |
Cited By (15)
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US5747771A (en) * | 1995-04-13 | 1998-05-05 | The Boc Group Plc | Method and apparatus for forming blind slots including laser melting and gas vortex |
WO2004028735A1 (en) * | 2002-09-28 | 2004-04-08 | Bnfl (Ip) Limited | Cutting of cementitious materials |
DE19922169B4 (en) * | 1999-05-12 | 2005-06-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for separating / cutting components, workpieces and / or test specimens of any thickness, size and other dimensions from concrete, stone and other mineral building materials with economically acceptable separation speeds |
US7038164B2 (en) | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
US7038166B2 (en) | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Containment plenum for laser irradiation and removal of material from a surface of a structure |
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US7060932B2 (en) | 2003-03-18 | 2006-06-13 | Loma Linda University Medical Center | Method and apparatus for material processing |
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JP2007230230A (en) * | 2006-02-01 | 2007-09-13 | Oyo Kogaku Kenkyusho | Laser using concrete cutting device |
US7286223B2 (en) | 2003-03-18 | 2007-10-23 | Loma Linda University Medical Center | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
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JPS61276792A (en) * | 1985-05-31 | 1986-12-06 | Kawasaki Steel Corp | Butt welding method for metallic strip |
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JPS5627388A (en) * | 1979-08-07 | 1981-03-17 | Postalia Gmbh | Slipless connecting mechanism among driving device* carrying device and feed drum in automatic printed letter erasing machine |
JPS61276792A (en) * | 1985-05-31 | 1986-12-06 | Kawasaki Steel Corp | Butt welding method for metallic strip |
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---|---|---|---|---|
US5747771A (en) * | 1995-04-13 | 1998-05-05 | The Boc Group Plc | Method and apparatus for forming blind slots including laser melting and gas vortex |
DE19922169B4 (en) * | 1999-05-12 | 2005-06-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for separating / cutting components, workpieces and / or test specimens of any thickness, size and other dimensions from concrete, stone and other mineral building materials with economically acceptable separation speeds |
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WO2004028735A1 (en) * | 2002-09-28 | 2004-04-08 | Bnfl (Ip) Limited | Cutting of cementitious materials |
US7289206B2 (en) | 2003-03-18 | 2007-10-30 | Loma Linda University Medical Center | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
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US7057134B2 (en) | 2003-03-18 | 2006-06-06 | Loma Linda University Medical Center | Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure |
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US8258425B2 (en) | 2003-03-18 | 2012-09-04 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
US7286223B2 (en) | 2003-03-18 | 2007-10-23 | Loma Linda University Medical Center | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
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US7620085B2 (en) | 2003-03-18 | 2009-11-17 | Loma Linda University Medical Center | Method and apparatus for material processing |
US7880114B2 (en) | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | Method and apparatus for material processing |
US7880116B2 (en) | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
US7880877B2 (en) | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | System and method for detecting laser irradiated embedded material in a structure |
US8228501B2 (en) | 2003-03-18 | 2012-07-24 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US7038166B2 (en) | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Containment plenum for laser irradiation and removal of material from a surface of a structure |
DE102005023715A1 (en) * | 2005-05-19 | 2006-11-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process and assembly to cut a duct within an existing wall by holographic laser beam or focused ultrasonic emitter |
JP2007230230A (en) * | 2006-02-01 | 2007-09-13 | Oyo Kogaku Kenkyusho | Laser using concrete cutting device |
JP2011521805A (en) * | 2008-05-16 | 2011-07-28 | カーベーアー−ジオリ ソシエテ アノニム | Intaglio printing plate manufacturing method and system for producing securities |
US9796202B2 (en) | 2008-05-16 | 2017-10-24 | Kba-Notasys Sa | Method and system for manufacturing intaglio printing plates for the production of security papers |
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Also Published As
Publication number | Publication date |
---|---|
JPH0798274B2 (en) | 1995-10-25 |
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