JP2019145811A - Method of bonding thin filmed substrate - Google Patents

Abstract

To enable a bonding manufacturing that there is no defective item in the low cost as possible.SOLUTION: A first substrate 4 and/or a second substrate are/is fixed to support body surfaces 3o and 3o'of support bodies 3 and 3' each having an annular frame 2 in order to be thin filmed or bond. They are aligned on the basis of an alignment mark corresponding to those substrates 4, and are continuously and magnetically performed in a preparatory fixing. A base plate fixing member includes: one substrate fixing surface 9 for fixing one substrate 4 thereof; and one support fixing surface 8 or a support fixing region surrounding the substrate fixing surface 9 for mutually fixing the substrate fixing member. Here, the support fixing surface 8 or the support fixing region is magnetized or can be magnetized specifically, or, apart from the above, substrate fixing members 1 and 1' can be fixed mutually by an adhesive agent, a clamp, a connector system, or a static electricity.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a bonding method according to claim 1.

  In the semiconductor industry, substrates are bonded to each other either continuously or temporarily by a so-called bonding process.

  By the bonding process, for example, a substrate having different functional units, for example, a substrate having a memory chip and a substrate having a microcontroller can be stacked on each other. Laminating and persistent fixing of multiple substrates with different properties results in a substrate stack with complex properties. The resulting substrate stack has a thickness of a few hundred micrometers.

  However, the bonding technique can also be used for temporary fixing of the substrate and / or substrate stack. In this case, the product substrate is fixed to the support substrate with an adhesive while applying pressure and / or heating. After processing the product substrate, the product substrate is again detached from the support substrate.

  The biggest problem in the prior art lies in the alignment and continuous fixation of multiple extremely thin substrates. This kind of thin substrate stacking produces a substrate stack, the so-called “multi-stack”. In order to avoid difficult and troublesome handling of a thin substrate, an alignment process and a bonding process are performed on a substrate having a predetermined standard thickness. After the second substrate is bonded to the first substrate, the back surface of the second substrate is thinned. By thinning the back surface, a thin substrate is manufactured from a thick substrate. If necessary, a further third thick substrate is bonded to the second substrate having the back surface thinned, and the thickness of the substrate is reduced by a further back surface thinning process. This theoretically repeated process any number of times can produce a substrate stack of any function.

  The technical problem is that continuous bonding cannot be performed backwards, so that in the case of incorrect alignment and / or damage, the entire substrate stack constructed so far cannot be used. A substrate stack consisting of multiple substrates can cost tens of thousands of euros.

  The problem underlying the present invention is therefore to provide a method which at least partly solves, preferably to a large extent, the abovementioned problems. Furthermore, it is an object of the present invention to enable bonded manufacturing that is low cost and that produces as few defective products as possible.

  This problem is solved by the features of claim 1. Preferred embodiments of the invention are described in the dependent claims. All combinations of at least two of the features described in the description, the claims and / or the drawings are also included in the scope of the present invention. Where a range of values is stated, the value inside the stated boundary shall also be disclosed as a limit value and any combination shall be claimed.

  The basic idea of the present invention is to thin the back surface of at least one, preferably all of the substrates to be bonded, contrary to the actual practice so far, particularly before continuous bonding.

  Therefore, the present invention particularly relates to a method of bonding substrates that have already been thinned. In this case, the present invention preferably fixes a thinned substrate, preferably a wafer, to a support, particularly a sheet (substrate fixing member) stretched on a frame, and transports, aligns, and bonds together in this state. Based on this idea. Thus, the substrate is preferably thinned to a predetermined thickness during the transport and / or alignment and / or bonding steps. In the case of a particular embodiment according to the invention, the thick substrate is fixed to the support and (preferably) the thinning of the backside is made for the first time just before alignment or just before bonding so Is possible. In the following, for the sake of simplicity, it is assumed that the substrate has already been thinned at all times, and if so, this clearly describes other states.

  In a preferred embodiment, the thinned substrate can be bonded to an unthinned substrate, or more preferably to a substrate stack. In order to more appropriately avoid defective substrate stacks, in the case of the present invention, only thinned substrates can be bonded together.

  According to a preferred embodiment of the present invention, the first substrate and / or the second substrate is thinned to a thickness of less than 1000 μm, in particular less than 500 μm, preferably less than 100 μm, more preferably less than 50 μm, most preferably less than 30 μm. Turn into.

  In the case of embodiments of the present invention, the first substrate and / or the second substrate is on a support surface of a support, in particular a support with an annular frame, for thinning and / or bonding. Fixed / scheduled to be fixed. In particular, when this support is used, the thin substrate is always supported because the support can be omitted for thinning and laminating, so that the thin substrate is always supported, and thus damage, especially after thinning. Can avoid damage.

  Preferably, in the case of one embodiment of the present invention, the first substrate and / or the second substrate is at least the first substrate and / or the second substrate, which is at least parallel to the bonding surface. For each one of the cross-sections, it is preferably intended to be exactly the same shape and / or have similar geometric dimensions. In particular, the present invention is utilized as a wafer-to-wafer method (W2W), which provides advantages in processing speed and throughput.

  Prior to bonding, the first substrate and the second substrate are preferably better than 100 μm, preferably better than 50 μm, more preferably better than 1 μm, most preferably by means of corresponding alignment marks on the substrates. In the case of alignment with each other with an alignment accuracy better than 500 nm, and most preferably better than 200 nm, and subsequently preliminarily magnetically fixed, the influence of the alignment between the supports can actually be eliminated.

  However, in order to arrange a plurality of small second substrates on a single support, in particular regularly, and to attach them to one first substrate at the same time, it is conceivable to reduce the thickness of the back surface in particular. . Thereby, a Die-to-Wafer method (D2W) according to the present invention is achieved, in which case a small substrate is referred to hereinafter as a chip in the semiconductor industry terminology. However, this small substrate does not necessarily have to be a chip, that is, it does not necessarily have electrical functionality. These small substrates are thinned on the back surface in the case of the present invention, particularly before bonding.

  In the case of the special third embodiment according to the invention, it is even possible to attach a plurality of small substrates to a plurality of small substrates at the same time, which is chip-to-chip. ) (C2C) method. These small substrates are thinned on the back surface in the case of the present invention, particularly before bonding.

  In the following, for the sake of simplicity, only two large, in particular identically shaped substrates that are handled in the case of the present invention will be described.

Preferably, in the case of the present invention, the thinned substrate can be directly bonded. More preferably, one or more of the following processing steps are performed prior to transport and / or alignment and / or lamination:
-Grinding and / or-Polishing and / or-Etching and / or-Dicing
-Cleaning-coating, in particular-by physical methods, in particular-PVD
・ By chemical method, especially ・ CVD, PE-CVD
-Functionalization, in particular the production and / or in particular of electronic structures-Resist coating-Lithography-Embossing-Development-Testing

  Preferably, only the thinned substrate that is defect-free (ie, tested after the above steps) becomes part of the new substrate stack to be bonded. A thinned substrate having defects, in particular a functionalized thinned substrate in which most or even all functional units do not function, can be removed from this process line. Thereby, the probability that the entire substrate stack is damaged is significantly reduced. Due to the process according to the invention, damage to the substrate stack occurs rather much in the case of alignment and / or bonding steps. Of course, both of these steps are also used in the prior art to produce a substrate stack, so there are no additional process steps after this bonding.

  In particular, in the case of the present invention, a substrate fixing member configured to fix the thin film substrate to the support of the substrate fixing member is particularly planned.

Substrate types In the case of the present invention, all conventional substrate types are suitable, in particular wafers. The substrate can have any arbitrary shape, but is preferably circular. The diameter of the substrate is particularly industrially standardized. For wafers, the industry standard diameters are 1 inch, 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, 12 inches and 18 inches. In particular, the method according to the invention is also promising for the processing of rectangular substrates, in particular glass substrates or sapphire substrates.

  The substrate can be a semiconductor substrate, a metal substrate, a ceramic substrate, a mineral substrate, in particular a sapphire substrate, a glass substrate or a polymer substrate. In the case of a ceramic or mineral substrate, a sapphire substrate is preferably used.

  In the case of the present invention, it is possible to fix a thin film substrate or a substrate stack composed of a plurality of thin film substrates that are already aligned and bonded to each other. Therefore, hereinafter, the substrate is also interpreted as being synonymous with the substrate stack.

Substrate fixing member In the case of one embodiment of the present invention, the substrate fixing member includes a frame (in English: frame) and an elastic sheet (in English: tape) stretched on the frame as a support.

  This sheet forms a particularly adhesive substrate fixing surface, and the substrate can be fixed to the substrate fixing surface. This sheet is a fixed element. The frame forms a support fixing surface, particularly a support fixing surface (support fixing region) that acts magnetically, in order to fix the substrate fixing member to a second, in particular corresponding substrate fixing member.

Therefore, in the case of the first preferred embodiment, these substrate fixing members can be magnetically fixed to each other. Thus, preferably this frame is magnetic or magnetizable. The magnetic flux density of the frame is in particular ^greater than 10 ^-5 T, preferably ^greater than 10 ^-4 T, more preferably 10 ^-3 T, most preferably 10 ^-1 T, and most preferably greater than ¹ T.

Preferably, due to two magnetic frames attached to each other, the pressure generated at the contact surface of the substrate is more than 10 ⁻⁵ N / m ² , preferably more than 10 ⁻³ N / m ^2, more preferably more than 1 N / m ^2. , Most preferably 10 ¹ N / m ² , and most preferably 10 ³ N / m ² .

  In the case of the second embodiment according to the present invention, the substrate fixing members can be fixed to each other by clamping, particularly from the outside.

  In the case of the third embodiment according to the present invention, the board fixing members can be fixed to each other by a connector system. The connector system is preferably configured such that the connector elements and the recesses used for receiving the connector elements of the board fixing members facing each other are alternately arranged along the entire circumference. .

  In the case of the fourth embodiment according to the present invention, the substrate fixing members can be fixed to each other electrostatically. In this case, there are a plurality of corresponding plates, these corresponding plates can be applied with a potential, and these corresponding plates are evenly distributed along the substrate fixing member. These plates are preferably insulated from the remaining substrate fixing members.

  In one embodiment of the present invention, the substrate fixing member has a strong base, which is a fixing element, in particular a controllable fixing element, for fixing the substrate to the flat substrate fixing surface of the base. Have Furthermore, the substrate fixing members can be fixed to each other according to the above-described embodiment of the present invention.

In one embodiment, the substrate fixing members can be magnetically fixed to each other. The substrate is therefore particularly magnetic or magnetizable at the substrate fixing surface. The magnetic flux density of the substrate is particularly ^greater than 10 ⁻⁵ T, preferably ^greater than 10 ⁻⁴ T, more preferably ^greater than 10 ⁻³ T, most preferably ^greater than 10 ⁻¹ T, and most preferably within the support fixing region. Is greater than 1T.

Preferably, the pressure generated at the contact surface of the substrate by the two substrate fixing members magnetically attached to each other is more than 10 ⁻⁵ N / m ² , preferably more than 10 ⁻³ N / m ^2, more preferably 1 N / M ² , most preferably greater than 10 ³ N / m ² , and most preferably greater than 10 ³ N / m ² .

  Properties for fixing the substrate, frame and / or substrate fixing member, particularly magnetic properties, for adhesion at the support fixing surface or support fixing region between two belonging substrates, frames and / or substrate fixing members Is preferably independent of the fixing characteristics of the fixing elements for fixing the substrate, which are listed below.

  According to a first embodiment according to the invention, the fixing element is at least one sticky surface. This adhesive surface is preferably switchable electrically and / or magnetically, so that it can be switched between a state of high adhesiveness and a state of low adhesiveness, in particular by a control device.

  In the case of the second embodiment according to the present invention, the fixing element is at least one vacuum fixing part on the substrate fixing surface. This vacuum fixing part is preferably composed of a plurality of vacuum conduits penetrating the support surface. This vacuum conduit is preferably connected to a vacuum chamber present in the substrate fixing member or support. This vacuum chamber can be closed by a conduit which is hydrodynamically separable from the surrounding environment by means of a valve, preferably by a control device. Thereby, in the case of the present invention, it is possible to fix the substrate, particularly the substrate having a thinned back surface, to the support surface by applying a vacuum and to close the valve during the evacuation step. This creates an arbitrary negative pressure in the vacuum conduit and the vacuum chamber. Therefore, the normal pressure acting from the outside is a positive pressure in relation to the negative pressure region in the support, thus fixing the substrate to the support.

  In the case of the third embodiment according to the invention, the fixing element is at least one static fixing part. This electrostatic fixing part consists in particular of a plurality of specially shaped electrodes aligned and positioned with respect to each other, through which a predetermined potential can be set through the wires. The generated charge separation can cause charge separation, particularly electrostatic induction, within the conductive region of the substrate to be fixed. This electrostatic induction causes static electricity between the support and the substrate in contact with the substrate fixing surface. Create an inquiries. This electrostatic attraction can be controlled in particular by a control device.

  In the case of the fourth embodiment according to the invention, the fixing element is at least one magnetic fixing part. This magnetic fixing part is preferably switchable, and is particularly distinguished from the permanent magnetism of the substrate. The switchable magnetic fixing part is preferably a magnetic coil that forms a magnetic field for fixing the substrate to the substrate fixing surface by an electric current. Thus, the substrate to be fixed has at least partly magnetic properties.

  In the case of the fifth embodiment according to the invention, the fastening element is at least one mechanical fastening. This mechanical fixing part consists in particular of a clamping element. The clamp element fixes the substrate along the substrate surface to be bonded. This clamping element can remain in a fixed position during the alignment process according to the invention and even while both substrates are in close proximity to each other. This clamping element can be removed immediately before the contact of the substrate, during the contact or even immediately after the contact.

  In other words, the substrate fixing member preferably has a substrate fixing surface and a support fixing surface (or a support fixing region) surrounding the substrate fixing surface.

  This substrate can be thinned on the back surface before and / or after being fixed to the substrate fixing member. When the substrate before being fixed to the substrate fixing member is thinned on the back surface, the substrate fixing member is not contaminated. However, the substrate having the backside thin film must then be transferred to the substrate fixing member. In the case of thinning the back surface after fixing the substrate to the substrate fixing member, the substrate fixing member is preferably washed after the thinning of the back surface. However, immediate stability of the substrate to be thinned on the back surface has the advantage of stability. Furthermore, it is not necessary to transfer the substrate having the thinned back surface to the substrate fixing member according to the present invention.

Process According to a first embodiment of the process according to the present invention, the two thinned substrates to be bonded are first brought into contact with each other or temporarily bonded (prebonded) by the first fixing part according to the present invention. ) Place them at a distance from each other. Then, this board | substrate is each fixed to the corresponding board | substrate fixed surface which the board | substrate fixing member opposes.

  In the first process step, two substrates are aligned with each other based on the alignment marks on the substrates. Although the substrate fixed to the substrate fixing member according to the present invention is aligned by the alignment mark of the substrate, the substrate fixing member according to the present invention is not used as long as the substrate fixing member is not aligned with the same substrate type. Cannot be completely aligned with each other. This alignment can be performed, for example, using one of the devices described in US 6,214,692 B1, PCT / EP 2013/075831 or PCT / EP 2013/062473. When aligning multiple small substrates with respect to a large substrate or aligning multiple small substrates with multiple small substrates, this alignment process can be used for optimal alignment of the substrate fixing member, and thus the small substrate on it. Can be placed under the influence of an error minimization process which performs an optimal alignment by error minimization. This type of process is described in document WO 2013/182236 A1.

  In particular, in the subsequent processing, the orientation angle is centered on the normal of the two corresponding substrate fixing members, respectively, in particular less than 5 °, most preferably less than 1 °, more preferably less than 0.1 °, most preferably Less than 0.01 °, more preferably less than 0.0001 ° and / or the corresponding translational displacement of the two substrate fixing members is in particular less than 5 mm, preferably less than 1 mm, more preferably less than 100 μm. Most preferably less than 1 μm, most preferably less than 100 nm. The above values can be measured by a test device.

  In the case of the second process step according to the present invention, the substrate fixing members according to the present invention are brought close to each other. During this proximity, the alignment marks and / or characteristic marks can optionally be continuously inspected with respect to each other or with respect to other marks, so that a continuous check of the position of the substrates during the proximity period. It can be performed. This ensures that there is no misalignment of both substrates during the proximity period. At the end of this process step, the substrate fixing member, particularly the surface of the magnetic substrate fixing member, here the frame, is in contact with the support fixing surface. This frame is fixed to each other. This fixing is preferably performed at least on the support fixing surface by the magnetization of at least one of both frames, in particular the intrinsic magnetization. However, fixing with an adhesive applied to at least one of the support fixing surfaces is also conceivable. Another conceivable fixing method is a clamp using a clamp element attached to the outside.

  In the case of the third process step according to the present invention, the prebonding or bonding step is performed by bringing both substrates fixed to the substrate fixing surface on the support close to each other. The bonding process by the proximity of both substrates can be carried out from the back side of the substrate fixing member according to the invention, in particular by means of proximity, in particular by means of a pressure device arranged in the center, in particular by means of a rod. Such a means for proximity and a sample holder which is particularly suitable for supporting a substrate fixing member is described in detail in the document PCT / EP 2011/064353.

  In the case of this embodiment, this proximity is effected by deformation of the support, in particular by deformation of the sheet stretched on the frame. The sheet can be deformed from the side of the sheet opposite the substrate by a centrally arranged pressure device or roller. Document WO 2014037044 A1 describes a device using a roller, and embossing can be performed by this roller. A person skilled in the art can produce from the device of document WO 2014037044 A1 a device for producing a corresponding linear load of a substrate fixing member, in particular a sheet, according to the invention and thereby performing a corresponding contact and / or bonding step. . In particular, in the case of the embodiment according to the invention, it is only useful to achieve the object that one of both substrates is brought close to the second, in particular flat, substrate by deformation of the support. . In particular, a central load, in particular a central load using a pin, can be taken into account in order to produce an automatically propagating coupled wave (Bondwelle). This embodiment according to the invention is particularly suitable for prebonding or bonding substrates that are bonded together by a fusion bonding process.

  In the case of the second embodiment of the process according to the invention, both substrates are fixed to each other using the second substrate fixing member described above.

  In the first process step, the two substrates are aligned with each other based on the alignment marks on the substrates. What has been described above for the first embodiment of this process applies in particular also to this second embodiment. In the first embodiment, when the sheet is distorted by a mechanical load and / or a thermal load, the substrate may be displaced with respect to the frame after the substrate is fixed. In the case of the second embodiment, This deviation is actually eliminated.

  The second process step is carried out in the same way as in the first embodiment, where the fixing of the substrate fixing member is preferably (instead of contacting the support fixing surface directly), preferably in the support fixing area, in particular It is preferably magnetically spaced from each other.

  In the case where it is preferable to pre-fix both substrates together by prebonding, the present invention provides for both substrates prior to heat treatment and / or in order to apply an additional, in particular full and even pressure load, to both substrates. It is possible to schedule an additional full-face bonding during the heat treatment. This applied force is in this case in particular more than 100 N, preferably more than 1 kN, more preferably more than 10 kN, most preferably more than 100 kN, and most preferably more than 1000 kN. This pressure is calculated by dividing the applied force by the area of the substrates to be bonded. The pressure acting on the 200 mm circular substrate is therefore about 3.2 Pa bar at a pressure load of 1 N and about 320,000 Pa at a pressure load of 10 kN.

  This substrate fixture can be handled by the sample holder and / or robot and can be transported between different processes and stations.

Heat treatment All embodiments according to the invention of the substrate fixing member are preferably suitable for overcoming the heat treatment process, especially for bonding. The first embodiment may certainly be limited by the maximum use temperature of the support or the substrate fixing member, particularly when the support is a sheet.

The substrate can be heat treated to produce a permanent bond. Bonding force of the permanent bonds are particularly, 1.0 J / m ^2, preferably greater than the 1.5 J / m ^2, still more preferably greater 2.0 J / m ² greater, most preferably 2.5 J / m ² That's it. Here, in the case of the present invention, it is preferable that a plurality of substrates exist on the substrate fixing member according to the present invention. In other words, the substrate fixing member can be heated by one mass production process (English: batch process). This heating is preferably performed in a continuous furnace. In another embodiment, the heat treatment is performed in the form of a cluster of clusters consisting of a single row of modules. In the case of the present invention, bonding on a hot plate can also be considered. The temperature used in the case of this kind of heat treatment process is in particular less than 700 ° C., preferably less than 500 ° C., more preferably less than 300 ° C., most preferably less than 100 ° C., and most preferably less than 50 ° C. In the special case where the fixed substrates have specially prepared surfaces, these substrates can already be bonded together so tightly that no additional heat treatment is required anymore at the time of contact at room temperature.

  When the substrate fixing member according to the present invention comprises a ferromagnetic material, it preferably does not exceed the Curie temperature in order not to lose the magnetic properties of the substrate fixing member according to the present invention.

  However, in other embodiments according to the present invention, the disappearance of the ferromagnetism of the substrate fixing member according to the present invention when the Curie temperature is exceeded may represent just another aspect of the present invention. If the bond strength of the sustained bond between the two substrates is achieved only above its maximum predetermined temperature and if this temperature is at least near the Curie temperature, further heating above the Curie temperature will increase the strength. The substrate fixing member can be automatically separated due to the disappearance of magnetism. Preferably, the substrate holders according to the invention are separated below the Curie temperature again, so that the ferromagnetism returns, or at least by other separation elements so that they are no longer coupled to each other at least below the Curie temperature. Or at least easily separated from each other. This type of automatic separation process is particularly advantageous in the case of fully automated batch processes.

  Other advantages, features and details of the present invention will become apparent from the following description of the preferred embodiments and the drawings, each of which is shown schematically:

FIG. 1a shows a schematic cross-sectional view of a first embodiment of the device according to the invention, not to scale, and FIG. 1b a schematic cross-section of the second embodiment of the device according to the invention, not to scale. The figure is shown. FIG. 2a shows a schematic cross-sectional view of the first process step of the first embodiment of the process according to the invention which is not to scale, and FIG. 2b shows the dimensions of the second process step of the first embodiment. FIG. 2c shows a schematic cross-sectional view of the third process step of the first embodiment which is not true to size. FIG. 3a shows a schematic cross-sectional view of the first process step of the second embodiment of the process according to the invention, which is not to scale, and FIG. 3b shows the dimensions of the second process step of the second embodiment. Figure 2 shows a schematic cross-sectional view that is not street.

  In the drawings, the same members or members having the same function are denoted by the same reference numerals.

  A first embodiment according to FIG. 1 a is a substrate fixing member 1 formed from a frame 2 and a support 3 (here, an elastic sheet) stretched on the frame 2. Although this stretched support 3 is very thin, it does not bend when not supported, and therefore can be considered as a plate without being interpreted as a sheet. This support 3 can then be elastically deformed by a load, in particular from its support surface 3o. The substrate fixing member 1 has a substrate fixing surface 9 (or a substrate fixing region) on the support surface 3o and an annular support fixing surface 8 (or a support fixing region) that surrounds the substrate fixing surface 9 in particular.

  The frame 2 and the support 3 together form an accommodation area for accommodating the first thinned substrate 4 in particular, where the first substrate 4 is relative to the support 3. The opposite side is preferably retracted from the support fixing surface 8.

  The thinned first substrate 4 is fixed to a substrate fixing surface 9 (here, a sheet surface) of a support 3 (here, an elastic sheet) stretched on the frame 2. The support surface 3o is adhesive for fixing the first substrate 4 and for fixing the support 3 to the frame 2.

  In the case of the embodiment according to FIG. 1b, in particular an integrated substrate fixing member 1 ′ is shown. The substrate fixing member 1 ′ has a rigid support body 3 ′ having a support surface 3 o ′, and the substrate fixing member 1 ′ has a vacuum fixing portion as the fixing element 5.

  This fixing element 5 may have a vacuum passage (as shown), but instead may have an electrostatic fixing part, a magnetic fixing part, an adhesive surface or a mechanical clamp. In particular, the fixing element 5 functions over a long distance / long time even when the support 3 'is transported. When a vacuum is used for fixing the first substrate 4, the vacuum in the vacuum chamber and / or the vacuum passage can be maintained by closing the valve 6. In the case of other fixing members according to the invention, this valve 6 can generally be interpreted as a control unit, which is controlled by a control device. Instead of this, in the case of the static electricity fixing part and / or the magnetic fixing part, it may be considered as a conducting wire for current.

  The layer thickness of the thinned first substrate 4 is so thin that it is preferable to stabilize the first substrate 4 by the supports 3, 3 'according to the present invention in order to avoid damage to the first substrate 4.

  What has been said about the first substrate also applies to the second substrate 4 'or further substrates as long as they are identically configured. For the second substrate or a further substrate, a combination of the above-mentioned substrate fixing members 1, 1 'can also be used.

  In the following figures, the process according to the invention is illustrated using two embodiments, where the substrates to be bonded (first substrate, second substrate and optionally further substrate) and the substrate fixing member are: Are configured identically. In the case of the present invention, it is also conceivable to use various substrate fixing members and / or various substrates for the first substrate 4 and the second substrate 4 'or further substrates.

  FIG. 2a shows an alignment process, in which the two substrates 4, 4 'are respectively fixed to the support 3 arranged opposite to each other of the substrate fixing member 1 and aligned with each other. This alignment is preferably performed by an alignment device (English: aligner) not shown. This alignment is performed in a manner known per se, preferably between the corresponding alignment marks on the substrate surfaces 4o, 4o 'of the substrates 4, 4'.

  When the alignment marks on the substrates 4 and 4 'are aligned, the substrate fixing member 1 can be shifted from each other. This shifting operation is certainly very small and can be omitted. In particular, this shifting action is less than 5 mm, preferably less than 1 mm, more preferably less than 100 μm, most preferably less than 10 μm, and most preferably less than 1 μm in the present invention. In this case, it is important that the corresponding support fixing regions or support fixing surfaces 8 face each other so that a sufficient force can be transmitted to fix the substrate fixing members 1 to each other.

  FIG. 2b shows a contact process, in which the surfaces 2o (support fixing surfaces 8) of both frames 2 are in contact with each other. Both of these frames 2 are fixed directly in contact with each other, in particular by an intrinsic magnetic force (indicated by magnetic field lines 7). It is also conceivable that the substrate surface 4o exceeds the surface 2o. In this case, the substrate surface 4o contacts the front surface 2o. Independently of this, the surfaces 2o are closed to each other, in particular by magnetic forces.

  In the method step according to FIG. 2c, both substrates 4, 4 'are brought into contact. This contact can be made by any element that exerts a force in the opposite direction on the substrates 4, 4 ', in particular by a central radial symmetrical pressure element or roller. By the action of this force, the elastic support body 3 extends in the direction of the support body 3 that faces it. In particular, it is also conceivable for both supports 3 to be deformed relative to each other as shown. When the substrate surface 4o protrudes from the surface 2o, the outer frame 2 is contacted in this process step. This contact is made by the magnetic force of course, especially in the case of a magnetic frame.

  FIG. 3a shows an alignment process similar to FIG. 2a, using the substrate fixing part 1 ′ according to FIG. 1b.

  FIG. 3b shows a contact process, in which the substrate surfaces 4o, 4o ′ of both substrates 4, 4 ′ contact each other before the substrate fixing member 1 ′ contacts. Therefore, in this embodiment, the substrate fixing member 1 'is operated without contact. The substrate laminate formed in this way is particularly fixed by the inherent magnetic force of the support 3 '.

  In the case of the present invention, at least one of the both substrates 4, 4 'is the thinned substrate 4, 4'. Therefore, this bonding process is no longer limited to the use of thick shape-stable substrates.

1, 1 'Substrate fixing member 2 Frame 2o Surface 3, 3' Support body 3o, 3o 'Support surface 4, 4' Substrate 4o, 4o 'Substrate surface 5 Fixing element, especially vacuum fixing part 6 Control unit, especially valve 7 Magnetic field line 8 Support fixing area / Support fixing plane 9 Substrate fixing plane

Claims (7)

  The first substrate (4) and / or the second substrate (4 ') is thinned / thinned before bonding, the first substrate (4) being A method of bonding to the second substrate (4 ').   The first substrate (4) and / or the second substrate (4 ′) is thinned to a thickness of less than 1000 μm, in particular less than 500 μm, preferably less than 100 μm, more particularly less than 50 μm, most preferably less than 30 μm. 2. The method of claim 1 wherein the method is thinned / thinned.   The first substrate (4) and / or the second substrate (4 ') is provided with a support (3, 3'), in particular an annular frame (2), for thinning and / or laminating. Method according to claim 1 or 2, wherein the method is fixed / fixed to the support surface (3o, 3o ') of the support (3, 3').   The first substrate (4) and the second substrate (4 ′) are preferably identical in shape and / or have similar geometric dimensions, in particular at least with respect to their respective cross-sections parallel to the bonding surface. The method according to claim 1, comprising:   The first substrate (4) and the second substrate (4 ′) are, in particular, better than 100 μm, preferably better than 50 μm, based on the corresponding alignment marks on the substrate before bonding, 5. Any one of claims 1 to 4, in particular aligned with one another with an alignment accuracy of better than 1 μm, most preferably better than 500 nm, most preferably better than 50 nm, and in particular magnetically prefixed. The method according to claim 1.   The substrate fixing member includes one substrate fixing surface (9) for fixing each one substrate (4, 4 ') and the substrate fixing surface (9) for fixing the substrate fixing member to each other. 6. The method according to claim 1, further comprising a support fixing surface (8) or a support fixing area, each surrounding one).   The method according to claim 6, wherein the support fixing surface (8) or support fixing region is magnetized or magnetizable.

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