JP2019145584A - Optical device inspection method and optical device inspection apparatus - Google Patents

Abstract

To provide an optical device inspection method and an optical device inspection apparatus capable of suppressing the difficulty of grasping the light emission state of an optical device.SOLUTION: An optical device inspection method is a method in which an electrode of an optical device wafer on which an optical device having a light emitting portion and the electrode is formed is energized through a probe terminal to inspect the light emitting state of the light emitting portion. The optical device inspection method includes a probe card preparation step ST1 of preparing a transparent plate-like probe card including a probe terminal that abuts the electrode of the optical device and a transparent electrode that is a circuit that feeds power to the probe terminal, a holding step ST2 of holding the optical device wafer on a holding table, a power supply step ST3 of supplying power by bringing the probe terminal into contact with the electrode of the optical device wafer held on the holding table, and a determination step ST4 of determining the state of the optical device through the probe card.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an optical device inspection method and an optical device inspection apparatus.

  In an LED (Light Emitting Diode) chip, after an LED element, which is an optical device, is formed on an optical device wafer, the optical device wafer is divided for each LED element along a planned division line, and the light emission state is inspected for each LED element. The The LED chip is confirmed as the luminance, light quantity, and color of the light emitting state of the LED element, and is then formed into a chip, packaged, and shipped as a product. In the above-described inspection of the light emitting state of the LED element, the probe terminal is brought into contact with the electrode of the LED element to emit light from the light emitting portion. Note that Patent Literature 1 and Patent Literature 2 show inspection apparatuses that bring a probe terminal into contact with an electrode.

JP-A-10-163281 JP 2003-273175 A

  At the time of inspecting the light emitting state of the LED element described above, a very high alignment accuracy is required in which the probe terminal is brought into contact with the fine electrode accurately at the minimum required atmospheric pressure. In particular, it is difficult to control the contact state of the probe terminal with the electrode, and since the vertical movement of the probe terminal is controlled in units of microns, the inspection apparatus is very expensive and difficult to set and maintain. Moreover, since the electrode of the LED element is fine, when the probe is brought into contact with the electrode, the inspection device blocks the light emitted from the light emitting unit, and emits light while the probe terminal is in contact with the electrode. It was difficult to grasp the light emission state of the part.

  The present invention has been made in view of such problems, and an object thereof is to provide an optical device inspection method and an optical device inspection apparatus capable of suppressing difficulty in grasping the light emission state of the optical device. It is to be.

  In order to solve the above-described problems and achieve the object, an optical device inspection method of the present invention includes a probe terminal connected to an electrode of an optical device wafer on which an optical device including a light emitting portion and an electrode is formed. An optical device inspection method for energizing and inspecting the light emission state of the light emitting unit, comprising: a probe terminal that contacts the electrode of the optical device; and a transparent electrode that is a circuit that supplies power to the probe terminal. A probe card preparation step of preparing a plate-like probe card; a holding step of holding the optical device wafer by a holding table; and feeding power by bringing the probe terminals into contact with the electrodes of the optical device wafer held by the holding table And a determination step of determining the state of the optical device through the probe card.

  An optical device inspection apparatus according to the present invention is an optical device inspection apparatus used in the optical device inspection method, wherein the optical device wafer is held by a holding surface, and a probe terminal is in contact with the electrode of the optical device. A transparent plate-like probe card comprising: a transparent electrode that is a circuit that feeds power to the probe terminal; a probe card support portion that supports the probe card with the probe terminal facing the holding surface; An approach / separation mechanism for bringing the probe terminal of the probe card into and out of contact with the electrode of the optical device wafer held by the holding table, and a camera for photographing the optical device held by the holding table through the probe card And a determination unit that determines the state of the optical device from image information obtained by photographing the optical device with the camera. .

  In the optical device inspection apparatus, the probe card support part is provided with a bottom opening that is sealed by the probe card facing the holding surface of the holding table, and a sealed space is formed inside. A supply / exhaust control for controlling the amount of bending of the probe card by supplying or exhausting gas to / from the sealed space having a transparent part on the top surface of the bottom surface of the housing facing the opening. It may have a part.

  In the optical device inspection apparatus, the housing may include a check valve communicating with the sealed space.

  The optical device inspection apparatus may include a measuring instrument that measures the pressure in the sealed space of the housing.

  The present invention has an effect that it is possible to suppress difficulty in grasping the light emission state of the optical device.

FIG. 1 is a perspective view of an optical device wafer including an optical device to be inspected by the optical device inspection method according to the first embodiment. FIG. 2 is a perspective view of the optical device of the optical device wafer shown in FIG. FIG. 3 is a side view illustrating a configuration example of the optical device inspection apparatus according to the first embodiment in a partial cross section. FIG. 4 is a flowchart illustrating the flow of the optical device inspection method according to the first embodiment. FIG. 5 is a cross-sectional view of the main part of the optical device inspection apparatus after the holding step of the optical device inspection method according to the first embodiment. FIG. 6 is a cross-sectional view of a main part of the optical device inspection apparatus during the power feeding step of the optical device inspection method according to the first embodiment. FIG. 7 is a side view showing a configuration example of the optical device inspection apparatus according to the second embodiment in a partial cross section. FIG. 8 is a cross-sectional view of the housing of the optical device inspection apparatus according to the second embodiment. FIG. 9 is a cross-sectional view of a main part of the optical device inspection apparatus after the holding step of the optical device inspection method according to the second embodiment. FIG. 10 is a cross-sectional view of the main part of the optical device inspection apparatus during the power feeding step of the optical device inspection method according to the second embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
An optical device inspection method and an optical device inspection apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an optical device wafer including an optical device to be inspected by the optical device inspection method according to the first embodiment. FIG. 2 is a perspective view of the optical device of the optical device wafer shown in FIG. FIG. 3 is a side view illustrating a configuration example of the optical device inspection apparatus according to the first embodiment in a partial cross section. FIG. 4 is a flowchart illustrating the flow of the optical device inspection method according to the first embodiment.

  The optical device inspection method according to the first embodiment is a method of inspecting the optical device 2 of the optical device wafer 1 shown in FIG. An optical device wafer 1 shown in FIG. 1 is a disk-shaped wafer having a substrate 3 made of silicon, sapphire, gallium arsenide, SiC (silicon carbide), or the like. As shown in FIG. 1, the optical device wafer 1 has a surface 5 on which optical devices 2 are formed in a plurality of regions defined by a plurality of linear division planned lines 4 that intersect each other. Moreover, in Embodiment 1, as shown in FIG. 1, the optical device wafer 1 has a protective tape 10 as a protective member attached to the back surface 6 on the back side of the front surface 5, and an annular frame 11 on the outer periphery of the protective tape 10. The inspection method for the optical device according to the first embodiment is performed in the state of being attached.

  In Embodiment 1, the optical device 2 of the optical device wafer 1 includes a pair of electrodes 7 and a light emitting unit 8 that emits light when power is applied to the pair of electrodes 7 as shown in FIG. (Light Emitting Diode) element.

  The optical device inspection apparatus 20 according to Embodiment 1 applies power to the pair of electrodes 7 of each optical device 2 of the optical device wafer 1 to cause the light emitting unit 8 to emit light, and the light emitting state (luminance, light quantity) of the light emitting unit 8. , Color, and the like), and the quality of each optical device 2 is inspected. The optical device inspection apparatus 20 according to the first embodiment is also an apparatus used for the optical device inspection method according to the first embodiment. As shown in FIG. 3, the optical device inspection apparatus 20 includes a holding table 30, a probe card 40, a probe card support unit 50, an approach / separation mechanism 60, a camera 70, and a control unit 100.

  The holding table 30 holds the optical device wafer 1 with the holding surface 31. The holding table 30 has a disk shape in which a portion constituting the holding surface 31 is formed of porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown) and placed on the holding surface 31. The optical device wafer 1 is held by being sucked. The holding table 30 is provided so as to be movable in both the X-axis direction and the Y-axis direction parallel to the horizontal direction, and is provided so as to be rotatable about an axis parallel to the Z-axis direction. Note that the X-axis direction and the Y-axis direction are orthogonal to each other, and the Z-axis direction is parallel to the vertical direction. In the first embodiment, a clamp portion 32 that clamps the annular frame 11 is provided around the holding table 30.

  The probe card 40 is formed in a transparent plate shape. The probe card 40 is made of a transparent material and has a transparent plate 41 facing the holding surface 31 of the holding table 30, a probe terminal 43 provided on the lower surface 42 facing the holding surface 31 of the transparent plate 41, and a probe terminal 43 and a transparent electrode 44 electrically connected.

  The transparent plate 41 is made of a transparent resin or glass as a transparent material. The transparent plate 41 is formed in a plate shape with a constant thickness, and is disposed at a position where the lower surface 42 is parallel to the holding surface 31.

  The probe terminal 43 is a terminal that can contact the electrode 7 of the optical device 2. The probe terminal 43 is made of a conductive metal and is provided at the center of the lower surface 42 of the transparent plate 41. In the first embodiment, the probe terminal 43 is a spherical bump provided so as to protrude from the lower surface 42. However, in the present invention, a needle-like probe needle protruding from the lower surface 42 may be used. The probe terminals 43 are arranged so as to form a pair, and the pair of two probe terminals 43 can contact the pair of electrodes 7 of the optical device 2. A plurality of pairs of probe terminals 43 are provided so as to be capable of simultaneously contacting a pair of electrodes 7 of a predetermined number of optical devices 2 and are relatively capable of simultaneously contacting a pair of electrodes 7 of a predetermined number of optical devices 2. Are arranged. In the first embodiment, eight probe terminals 43 are provided on the lower surface 42 of the transparent plate 41, that is, four sets, and can simultaneously contact the pair of electrodes 7 of the four optical devices 2.

  The transparent electrode 44 is a circuit that supplies power to the probe terminal 43 from a power source 46 that is a DC power source. The transparent electrode 44 electrically connects the probe terminal 43 and the power supply 46, and supplies power to one electrode 7 through one probe terminal 43 of each pair of probe terminals 43. In the first embodiment, the transparent electrode 44 is provided on at least one of the upper surface 45 and the lower surface 42 of the transparent plate 41, embedded in the transparent plate 41, or formed on the surface, and the surface thereof is made of resin or the like. Covered and covered. The transparent electrode 44 is composed of at least one of indium tin oxide, zinc oxide, tin oxide, titanium oxide, and graphene used for FPD (Flat Panel Display).

  The probe card support unit 50 supports the probe card 40 with the probe terminal 43 facing the holding surface 31. In the first embodiment, the probe card support unit 50 supports the end of the probe card 40 via the elastic member 51. The elastic member 51 is made of an elastically deformable synthetic resin such as rubber. The elastic member 51 is disposed between the end of the probe card 40 and the probe card support 50, and can change the relative position between the end of the probe card 40 and the probe card support 50 by elastic deformation. It is.

  The contact / separation mechanism 60 makes the probe terminal 43 of the probe card 40 contact and separate from the electrode 7 of the optical device 2 of the optical device wafer 1 held by the holding table 30. In the first embodiment, the contact / separation mechanism 60 includes a drive unit 61 that moves the probe card support 50 in the Z-axis direction. The drive unit 61 moves the probe card support 50 in the Z-axis direction, thereby moving the probe card 40 in the Z-axis direction to bring the probe terminal 43 into contact with the electrode 7 and away from the electrode 7. In the first embodiment, the drive unit 61 includes a motor (not shown), a ball screw, and a guide rail. However, in the present invention, the drive unit 61 may include an air cylinder or the like.

  The camera 70 photographs the optical device 2 held on the holding table 30 through the probe card 40. The camera 70 is disposed above the probe card 40. In the first embodiment, the camera 70 is disposed above the center portion where the probe terminal 43 of the probe card 40 is provided. The camera 70 takes an image of the optical device wafer 1 held on the holding table 30, obtains an image for performing alignment for positioning the optical device wafer 1 and the probe card 40, and controls the obtained image. Output to unit 100.

  Further, when inspecting the optical device 2, the camera 70 takes an image of the optical device 2 that is fed with the probe terminal 43 in contact with the electrode 7 of the optical device wafer 1 held on the holding table 30. An image obtained by imaging is output to the control unit 100. The camera 70 includes an image sensor that photographs the optical device 2 of the optical device wafer 1. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor.

  The control unit 100 is a computer that controls the above-described components of the optical device inspection apparatus 20 to cause the optical device inspection apparatus 20 to perform an inspection operation on the optical device 2. The control unit 100 is connected to a display unit (not shown) configured by a liquid crystal display device that displays an image and the like, and an input unit (not shown) used when an operator registers inspection content information and the like. The input unit includes at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

  The control unit 100 also includes a determination unit 101 that determines the state of the optical device 2 from image information obtained by capturing the optical device 2 with the camera 70. The determination unit 101 brings the probe terminal 43 into contact with the electrode 7 and the light emitting unit 8 of the optical device 2 fed to the electrode 7 of the image obtained by photographing the optical device 2 fed by the camera 70 to the electrode 7. The quality of the plurality of optical devices 2 fed to the electrode 7 is determined based on the luminance, light quantity, and color of the light emitted from the. Specifically, in the first embodiment, the determination unit 101 of the control unit 100 captures a reference image in which a plurality of optical devices 2 fed to the electrode 7 are non-defective products and a plurality of optical devices 2 to be inspected by the camera 70. The luminance, light quantity, and color at the same position of the reference image and the image obtained by the camera 70 imaging the plurality of optical devices 2 to be inspected are compared by comparing the luminance, light quantity, and color at the same position of the obtained image. Each difference is calculated. The determination unit 101 of the control unit 100 determines that the optical device 2 disposed at a position where at least one of the luminance difference, the light amount, and the color difference exceeds a predetermined value is a defective product, and determines the luminance difference, the light amount, and the color. It is determined that the optical device 2 arranged at a position where all the differences are less than or equal to a predetermined value is a non-defective product. In the present invention, the determination method of the optical device 2 in the determination unit 101 is not limited to the method described in the first embodiment.

  The optical device inspection method is a method in which the electrode 7 of the optical device wafer 1 is energized through the probe terminal 43 to inspect the light emission state of the light emitting unit 8. As shown in FIG. 4, the optical device inspection method includes a probe card preparation step ST1, a holding step ST2, a power feeding step ST3, and a determination step ST4.

(Probe card preparation step)
The probe card preparation step ST1 is a step of preparing the probe card 40 having the above-described configuration. In the first embodiment, the probe card preparation step ST1 is performed by the operator registering the inspection content information in the control unit 100 to prepare for the inspection operation of the optical device inspection apparatus 20. Information indicating the position of the electrode 7 of each optical device 2 is registered as the inspection content information. In the first embodiment, the control unit 100 determines the position of the electrode 7 of each optical device 2 by the distance from the predetermined reference position of the optical device wafer 1 or the like. The optical device inspection method proceeds to holding step ST2.

(Holding step)
FIG. 5 is a cross-sectional view of the main part of the optical device inspection apparatus after the holding step of the optical device inspection method according to the first embodiment. The holding step ST2 is a step of holding the optical device wafer 1 by the holding table 30.

  In the first embodiment, in the holding step ST2, the operator places the optical device wafer 1 on the holding surface 31 of the holding table 30 via the protective tape 10. Thereafter, in the holding step ST2, when the control unit 100 receives an inspection operation start instruction from the operator, the optical device wafer 1 is sucked and held on the holding surface 31, and the annular frame 11 is clamped by the clamp portion 32. In the holding step ST2, the control unit 100 moves the holding table 30 of the optical device inspection apparatus 20 toward the lower side of the camera 70, causes the camera 70 to take an image of the optical device wafer 1, and the camera 70 takes an image. Based on the image, alignment is performed so that the probe terminal 43 of the probe card 40 faces the electrode 7 of the optical device 2 along the Z-axis direction. In the holding step ST2, the control unit 100 lowers the probe card 40 to the drive unit 61 of the contact / separation mechanism 60 until just before the probe terminal 43 contacts the electrode 7, as shown in FIG. The optical device inspection method proceeds to the power supply step ST3.

(Power supply step)
FIG. 6 is a cross-sectional view of a main part of the optical device inspection apparatus during the power feeding step of the optical device inspection method according to the first embodiment. The power supply step ST3 is a step of supplying power by bringing the probe terminal 43 into contact with the electrode 7 of the optical device 2 of the optical device wafer 1 held on the holding table 30.

  In the first embodiment, in the power supply step ST3, the probe card 40 is lowered to the drive unit 61 of the contact / separation mechanism 60 in a state where power is supplied from the power source 46 to each probe terminal 43, and as shown in FIG. The terminal 43 is brought into contact with the electrode 7 of the optical device 2. Then, the light emitting unit 8 of the non-defective optical device 2 emits light with a luminance, a light amount, and a predetermined color that exceed predetermined values. The optical device inspection method proceeds to determination step ST4.

(Judgment step)
Determination step ST4 is a step of determining the state of the optical device 2 through the probe card 40. In the first embodiment, in the determination step ST4, the control unit 100 causes the camera 70 to take an image while supplying power to the electrode 7 with which the probe terminal 43 abuts, and an image obtained by the camera 70 is input. In the determination step ST4, the determination unit 101 of the control unit 100 determines the luminance, light amount, and color of the light 200 and 201 emitted from the light emitting unit 8 of the optical device 2 that is fed to the electrode 7 of the image obtained by the camera 70. Based on the above, the quality of each of the plurality of optical devices 2 fed to the electrode 7 is determined.

  In the case shown in FIG. 6, the light 200 indicated by the solid line emitted from the light emitting unit 8 of the optical device 2 has all of the difference in luminance, light amount, and color from the reference image being less than or equal to a predetermined value. In the light 201 indicated by the dotted line emitted from the light emitting unit 8, at least one of the difference in luminance, the amount of light, and the color from the reference image exceeds a predetermined value. For this reason, in the case shown in FIG. 6, the determination unit 101 of the control unit 100 determines that the optical device 2 that emits the light 200 indicated by the solid line among the plurality of optical devices 2 fed to the electrode 7 is a non-defective product. The optical device 2 that emits the light 201 shown is determined as a defective product. The control unit 100 stores the position of the optical device 2 determined as a defective product.

  Then, the control unit 100 stops the power supply to the probe terminal 43 and raises the probe card 40, and then moves the holding table 30 in the horizontal direction to connect the probe terminal to the electrode 7 of the next optical device 2 to be inspected. 43 faces each other. The control unit 100 lowers the probe card 40 while supplying power to the probe terminal 43 and brings it into contact with the electrode 7 to sequentially perform the power supply step ST3 and the determination step ST4. In this way, the control unit 100 repeats the power feeding step ST3 and the determination step ST4 until the quality determination of all the optical devices 2 on the optical device wafer 1 is performed. The optical device inspection method ends when all the optical devices 2 are judged to be good or bad.

  In the optical device inspection method and the optical device inspection apparatus 20 according to the first embodiment, since the probe card 40 is transparent, the contact state of the probe terminal 43 to the electrode 7 and the light emission state of the light emitting unit 8 through the probe card 40. Can be grasped. As a result, the optical device inspection method and the optical device inspection apparatus 20 can suppress difficulty in grasping the light emission state of the optical device 2.

  Moreover, since the optical device inspection method and the optical device inspection apparatus 20 according to the first embodiment are provided with the elastic member 51 between the probe card 40 and the probe card support 50, the elastic member 51 is elastically deformed. Thereby, it can suppress that the force by which the probe terminal 43 is pressed by the electrode 7 becomes excessive.

[Embodiment 2]
An optical device inspection method and an optical device inspection apparatus according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 7 is a side view showing a configuration example of the optical device inspection apparatus according to the second embodiment in a partial cross section. FIG. 8 is a cross-sectional view of the housing of the optical device inspection apparatus according to the second embodiment. FIG. 9 is a cross-sectional view of a main part of the optical device inspection apparatus after the holding step of the optical device inspection method according to the second embodiment. FIG. 10 is a cross-sectional view of the main part of the optical device inspection apparatus during the power feeding step of the optical device inspection method according to the second embodiment. 7 and 8. In FIG. 9 and FIG. 10, the same parts as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  The optical device inspection apparatus 20-2 according to the second embodiment is the same as the first embodiment except that the configurations of the probe card support unit 50 and the contact / separation mechanism 60 are different from those of the first embodiment.

  The probe card support unit 50 of the optical device inspection apparatus 20-2 according to the second embodiment is a housing 52 as shown in FIGS. As shown in FIG. 8, the casing 52 is formed in a box shape, and a sealed space 53 is formed therein. The housing 52 includes an opening 54 on the bottom surface 55 that is sealed by the probe card 40 that faces the holding surface 31 of the holding table 30. The opening 54 is provided in the center of the bottom surface 55. Further, the housing 52 has a transparent portion 57 on the upper surface 56 facing the opening 54 of the bottom surface 55. The transparent portion 57 is provided at the center of the upper surface 56. The transparent part 57 is made of a transparent material, like the probe card 40. A camera 70 is attached to the upper surface of the transparent portion 57. The casing 52 is made of metal such as stainless steel except for the transparent portion 57, and the rigidity of the casing 52 is higher than the rigidity of the probe card 40. The casing 52 includes a check valve 58.

  The check valve 58 communicates with the sealed space 53 and the outside of the housing 52. When the atmospheric pressure in the sealed space 53 exceeds a predetermined atmospheric pressure, the check valve 58 opens and exhausts the gas in the housing 52 to the outside of the housing 52. The check valve 58 prevents the probe card 40 from being damaged because the air pressure in the sealed space 53 exceeds a predetermined pressure even if gas is supplied into the sealed space 53.

  The contact / separation mechanism 60 includes a supply / exhaust control unit 62 in addition to the drive unit 61. The air supply / exhaust control unit 62 supplies gas to the sealed space 53 in the casing 52 or exhausts gas in the sealed space 53 to control the amount of bending of the probe card 40 so that the probe terminal 43 contacts the electrode 7. Let go. The air supply / exhaust control unit 62 includes a gas supply unit 63 and a gas exhaust unit 64.

  The gas supply unit 63 supplies gas into the sealed space 53 of the housing 52, and includes a gas supply source 631, a pipe 632, and an on-off valve 633. The gas supply source 631 is connected to the sealed space 53 via a pipe 632. The on-off valve 633 is provided in the pipe 632.

  The gas exhaust unit 64 exhausts the gas in the sealed space 53 of the housing 52 to the outside of the housing 52, and includes a pipe 641 and an opening / closing valve 642. The pipe 641 connects the sealed space 53 and the outside of the housing 52. The on-off valve 642 is provided in the pipe 641.

  The optical device inspection apparatus 20-2 according to the second embodiment includes a measuring device 80. The measuring device 80 measures the atmospheric pressure in the sealed space 53 of the housing 52 and outputs the measurement result to the control unit 100.

  In the optical device inspection method according to the second embodiment, the probe card preparation step ST1 is the same as that in the first embodiment. In the holding step ST2 of the optical device inspection method according to the second embodiment, as in the first embodiment, the control unit 100 sucks and holds the optical device wafer 1 on the holding surface 31 and causes the clamp portion 32 to clamp the annular frame 11. , Alignment is performed so that the probe terminal 43 of the probe card 40 faces the electrode 7 of the optical device 2 along the Z-axis direction. In the holding step ST2, as shown in FIG. 9, the control unit 100 closes the on-off valve 633, opens the on-off valve 642, makes the air pressure in the sealed space 53 equal to the air pressure outside the housing 52, and contacts the control unit 100. The probe card 40 is lowered to the drive unit 61 of the separation mechanism 60 until just before the probe terminal 43 contacts the electrode 7. The optical device inspection method proceeds to the power supply step ST3.

  In the power supply step ST3 of the optical device inspection method according to the second embodiment, the control unit 100 closes the open / close valve 642 and opens the open / close valve 633 in a state where electric power is supplied from the power source 46 to each probe terminal 43. Based on the measurement result of the vessel 80, the air pressure in the sealed space 53 is controlled to be a predetermined pressure. In the power supply step ST3 of the optical device inspection method according to the second embodiment, when the air pressure in the sealed space 53 becomes a predetermined air pressure, the rigidity of the housing 52 is higher than the rigidity of the probe card 40. The probe card 40 bends in the direction approaching the wafer 1, and as shown in FIG. 10, the probe terminal 43 comes into contact with the electrode 7, and the light emitting unit 8 of the non-defective optical device 2 has a luminance, light amount, Emits light in a predetermined color. The optical device inspection method and the optical device inspection apparatus 20 according to the second embodiment control the atmospheric pressure in the sealed space 53 in the housing 52 to bring the probe terminal 43 into and out of contact with the electrode 7. The optical device inspection method proceeds to determination step ST4. In the optical device inspection method according to the second embodiment, the determination step ST4 is the same as that of the first embodiment.

  In the optical device inspection method and the optical device inspection apparatus 20-2 according to the second embodiment, since the probe card 40 is transparent, the contact state of the probe terminal 43 with the electrode 7 through the probe card 40 and the light emitting unit 8 Since the light emission state can be grasped, the difficulty of grasping the light emission state of the optical device 2 can be suppressed.

  In addition, the optical device inspection method and the optical device inspection apparatus 20-2 according to the second embodiment control the atmospheric pressure in the sealed space 53 in the housing 52 so that the probe terminal 43 contacts and separates from the electrode 7. Thus, there is an effect that an optical device inspection apparatus 20-2 having a simple apparatus configuration can be realized without requiring a precise mechanical structure.

  The control unit 100 of the optical device inspection apparatuses 20 and 20-2 according to the first and second embodiments described above includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit) and a ROM (read only memory). Alternatively, a storage device having a memory such as a random access memory (RAM) and an input / output interface device are included. The arithmetic processing unit of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and sends control signals for controlling the optical device inspection devices 20 and 20-2 via the input / output interface unit. Output to the above-described components of the optical device inspection apparatuses 20 and 20-2. Moreover, the function of the determination part 101 is implement | achieved when an arithmetic processing unit runs the computer program memorize | stored in the memory | storage device.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Optical device wafer 2 Optical device 7 Electrode 8 Light emission part 20, 20-2 Optical device inspection apparatus 30 Holding table 31 Holding surface 40 Probe card 43 Probe terminal 44 Transparent electrode 50 Probe card support part 52 Case 53 Sealed space 54 Opening 55 Bottom face 56 Top face 57 Transparent part 58 Check valve 60 Contact / separation mechanism 62 Supply / exhaust control part 70 Camera 80 Measuring instrument 101 Judgment part ST1 Probe card preparation step ST2 Holding step ST3 Power feeding step ST4 Judgment step

Claims (5)

There is an inspection method of an optical device for energizing the electrode of an optical device wafer on which an optical device including a light emitting unit and an electrode is formed through a probe terminal, and inspecting a light emission state of the light emitting unit,
A probe card preparation step of preparing a transparent plate-like probe card comprising: a probe terminal that contacts the electrode of the optical device; and a transparent electrode that is a circuit that supplies power to the probe terminal;
Holding step for holding the optical device wafer on a holding table;
A power feeding step of feeding power by bringing the probe terminal into contact with the electrode of the optical device wafer held by the holding table;
And a determination step of determining the state of the optical device through the probe card. An optical device inspection apparatus for use in the optical device inspection method according to claim 1,
A holding table for holding the optical device wafer on a holding surface;
A transparent plate-like probe card comprising: a probe terminal that contacts the electrode of the optical device; and a transparent electrode that is a circuit that supplies power to the probe terminal;
A probe card support part for supporting the probe card with the probe terminal facing the holding surface;
An approach / separation mechanism for bringing the probe terminal of the probe card into contact with or separated from the electrode of the optical device wafer held by the holding table;
A camera for photographing the optical device held on the holding table through the probe card;
An optical device inspection apparatus comprising: a determination unit that determines a state of the optical device from image information obtained by photographing the optical device with the camera. The probe card support part is a casing that includes an opening that is sealed by the probe card facing the holding surface of the holding table on the bottom surface, and in which a sealed space is formed. The upper surface facing the opening has a transparent portion,
The optical device inspection apparatus according to claim 2, wherein the contact / separation mechanism includes an air supply / exhaust control unit that controls the amount of bending of the probe card by supplying or exhausting gas to or from the sealed space.   The optical device inspection apparatus according to claim 3, wherein the housing includes a check valve communicating with the sealed space.   The optical device inspection apparatus according to claim 3, further comprising a measuring device that measures the atmospheric pressure of the sealed space of the housing.

Images