JP2019145538A - Resin sealing mold, resin sealing device, and resin sealing method - Google Patents

Abstract

To provide a resin sealing mold core pin, a resin sealing mold, a resin sealing apparatus, and a resin sealing method that can prevent the resin sealing mold from becoming large while suppressing the influence on the accuracy of use and the service life.SOLUTION: A core pin according to the present invention is a core pin for a resin sealing mold, and includes a main body portion, an inner space inside the main body portion along the direction of combination of the resin sealing mold, and a tip of the main body portion, which can contact the corresponding member, and the tip comes into contact with the corresponding member by moving the resin sealing mold in the combination direction, and the internal space can bend the main body portion by the contact pressure at the tip contact.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a resin-encapsulating core pin, a resin-encapsulating mold, a resin-encapsulating apparatus, and a resin-encapsulating method for encapsulating an electronic component with a resin while leaving a through hole.

  Many electronic devices, measuring devices, transportation devices, precision devices, and the like have many electronic components such as semiconductor integrated circuits. Processors, image processing circuits, audio processing circuits, various sensors, and the like have been highly integrated, and many functions are integrated in electronic components. This electronic component is necessary for these devices.

  These electronic components may need to be sealed with a resin depending on their properties or mounted characteristics. When sealed with resin, the electronic component is sandwiched between an upper mold and a lower mold that form an internal space in a state of being mounted on the substrate. When the upper mold and the lower mold are combined, an internal space is formed. In this internal space, the electronic component mounted on the board comes to be located.

  Resin is poured into this internal space. Resin is injected to fill the internal space. After this filling, the resin solidifies. When the upper mold and the lower mold are removed after the resin is solidified, the electronic component is sealed with the resin. An element including a mechanism such as resin injection in the upper mold and the lower mold is a resin-sealed mold.

  In the resin-sealed mold, a single electronic component that is not mounted on the substrate may be resin-sealed. Further, depending on the properties of the electronic component, only one side of the electronic component may be resin-sealed, or both sides may be resin-sealed.

  When sealed with resin, the resin forming layer is externally present.

  As described above, the resin sealing of the electronic component is performed, but depending on the characteristics of the electronic component and the mounting property, a through hole in the thickness direction is required in a part of the resin forming layer generated by the sealing. Sometimes. This is for the purpose of automation in the mounting apparatus or to cope with the component characteristics.

  In order to form such a through hole, a member called a core pin may be provided in the internal space formed by the resin-sealed mold. The resin-sealed mold includes a core pin on each of an upper mold and a lower mold that sandwich an electronic component that is an object to be sealed. The upper mold core pin and the lower mold core pin face each other when the upper mold and the lower mold are combined. By this contact, a rod-shaped inhibitor is formed in the thickness direction in the internal space of the resin-sealed mold.

  Since this inhibitor has a rod-like aspect in the thickness direction, the resin does not enter the internal space. In this state, when the resin is injected into the internal space and solidified, the through hole remains in the molded resin forming layer.

  FIG. 16 is a side view of a resin-sealed mold having a core pin in the prior art. The resin sealing mold 100 includes an upper mold 101 and a lower mold 102. The upper mold 101 includes a recess 103, and the lower mold 102 includes a recess 104. The upper mold 101 includes a core pin 110, and the lower mold 102 includes a core pin 120. In FIG. 16, for ease of viewing, electronic components and substrates sandwiched between them are omitted, but actually, these are sandwiched between an upper mold and a lower mold. Furthermore, the electronic component is included in an internal space formed by the recesses 103 and 104.

  In the state of FIG. 16, when the upper mold 101 and the lower mold 102 come close to each other and are combined, the concave portion 103 and the concave portion 104 are integrated to form an internal space 106 as shown in FIG. Resin is injected into the internal space 106. At this time, the core pin 110 and the core pin 120 communicate with each other with their tips in contact with each other, so that an integrated rod-shaped inhibitor is generated.

  FIG. 17: is a side view of the combination state of a resin sealing type | mold provided with the core pin in a prior art.

  The injected resin is filled in the internal space 106 while avoiding the obstruction by the core pins 110 and 120. As a result, the resin-sealed electronic component to be manufactured (hereinafter referred to as “resin-sealed molded product” as necessary) is in a state in which a through hole is generated. FIG. 18 is a front view of a resin-sealed molded product. A through hole 130 is formed in the resin-sealed molded product 140. As described above, the through hole 130 is generated by the core pins 110 and 120 that are in contact with each other, and an area of an obstacle remains as the through hole 130. The other part is a resin forming layer. Inside, electronic components and a substrate are included.

  Here, the core pin 110 is provided in the upper die 101, and the core pin 120 is provided in the lower die 102. When the upper mold 101 and the lower mold 102 are combined and fitted, the core pins 110 and 120 are preferably in contact with each other and communicate with each other. At this time, it is preferable that the upper mold 101 and the lower mold 102 are fitted with no gap.

  However, the upper mold 101 and the lower mold 102 are combined with an electronic board on which electronic components are mounted interposed therebetween. For this reason, there may be variations in the thickness of electronic components and electronic substrates. Alternatively, the shape and thickness of the upper mold 101 and the lower mold 102 may vary.

  In such a state, when the lengths of the core pins 110 and 120 are short, contact between the tip portions of the core pins 110 and 120 becomes insufficient. FIG. 19 is a side view of the resin-sealed mold when the core pin is short. As shown in FIG. 19, a gap is generated between the tip portions of the core pin 110 and the core pin 120. If there is this gap, the resin enters the gap, and the through hole 130 of the resin-sealed molded product to be manufactured does not surely penetrate, or a burr occurs at the joint portion.

  Conversely, when the length of the core pins 110 and 120 is too long, the upper mold 101 and the lower mold 102 are not sufficiently fitted as shown in FIG. FIG. 20 is a side view of the resin-sealed mold when the core pin is too long.

  In this case, a gap is formed between the upper mold 101 and the lower mold 102, and resin enters the gap, which leads to a problem that a resin burr is generated on the outer periphery of the resin-sealed molded product. However, it is difficult to adjust the length of the core pin to a fine level, and even if it is performed, it may be short due to variations in the shape and thickness of the upper mold 101 and the lower mold 102, and variations in the shape and thickness of electronic components and substrates. The long problem remains.

  Thus, in the resin-sealed mold in which the through hole is formed using the core pin, there is a problem that it is difficult to optimize the length of the core pin.

  In such a situation, a technique for adjusting the length of the core pin has been proposed (see, for example, Patent Document 1, Patent Document 2, and Patent Document 3).

JP-A-6-91704 JP 2003-324116 A JP 2017-136776 A

  Patent Document 1 has a movable mold and a fixed mold, and has a pin shape in which a tip portion projects into a cavity 14 in one mold in order to form a through hole in a resin molding portion of a resin-encapsulated transistor device. In the resin mold for a transistor provided with the member 20, the pin-like member 20 is fitted into one mold 10 so as to be reciprocable within a predetermined range, and is urged toward the other mold 30 by the elastic member 25. When the mold is closed, the tip of the pin-shaped member 20 abuts against the surface of the cavity 14 of the other mold 30 and is moved against the urging force of the elastic member 25, and is pinned by the elastic member 25. Disclosed is a mold die in which the member 20 and the other die 30 are brought into close contact with each other with an urging force of a predetermined level or more.

  In Patent Document 2, the core pin 24 is disposed in the upper mold 13 inside the through hole 19 a of the upper mold cavity insert 19. A backup hole 26 is formed in a portion of the upper chase block 18 facing the through hole 19a. A spring member 27 is disposed in the backup hole 26, and the core pin 24 can slide in the through hole 19 a according to the expansion and contraction of the spring member 27. The core pin 24 discloses a resin-sealed mold that elastically contacts the lower mold cavity insert 16 in a state where the upper mold 13 and the lower mold 12 are closed.

  Patent Documents 1 and 2 disclose that a spring is connected to the core pin and the contact state of the tip of the core pin is adjusted by the elastic force of the spring. When the length of the core pin is too long in the fitting of the mold, the spring absorbs this and suppresses the length. In this way, the length of the core pin is suppressed from being insufficient or too long.

  However, a spring is connected to the rear end of the core pin, and the core pin needs to move up and down by the elastic force of the spring. For this reason, a pin passage hole through which the core pin can move up and down is provided in the mold. The through hole communicates with an internal space into which resin is injected. For this reason, there is a problem that the resin enters the through hole. If the resin enters the pin through hole, the core pin cannot be moved up and down, and the use as a resin-sealed mold cannot be continued.

  In addition, if the elastic force of the spring is insufficient, there is a problem that the length adjustment of the core pin becomes insufficient. Further, depending on the elastic force life of the spring, there may be a problem that the length of the core pin cannot be adjusted. As described above, there is a problem that the service life of the resin-sealed mold is reduced and the manufacturing accuracy is lowered.

  Or the area | region which accommodates a spring is required and there also exists a problem from which size reduction of a resin sealing type | mold and size reduction of a resin sealing apparatus become difficult.

  In Patent Document 3, a resin sealing mold B includes an upper mold chess 1, a lower mold chess 2 having a cavity recess 200, and a core 201 fixed to the cavity recess 200. The core 201 can be liquid-tightly attached to the tip of the core body 202 and the tip surface of the core 201 can be in close contact with the surface of the sensor element 501. Disclosed is a resin-sealing mold constituted by a masking body 203 having required elasticity and heat resistance, which suppresses outward bulging deformation when pressure is applied.

However, in Patent Document 3, the masking body functions as an elastic body and has the same problems as Patent Documents 1 and 2. Further, there is a problem that the masking body is deformed due to wear, peeling, or sealing resin pressure. Alternatively, there may be a problem that the masking body is deformed by the heat of the injected resin.
As described above, the conventional techniques have various problems.

  In view of the problems of the prior art, the present invention is capable of preventing an increase in the size of a resin-sealed mold while suppressing the influence on use accuracy and service life, a resin-sealed mold core pin, a resin-sealed mold, and a resin-sealed mold An object is to provide an apparatus and a resin sealing method.

In view of the above problems, the core pin for the resin-sealed mold of the present invention is
The main body,
An internal space along the combination direction for the resin-sealed mold inside the main body,
A distal end of the main body, which can be brought into contact with a corresponding corresponding member,
By moving the resin-sealed mold in the direction of combination, the tip is in contact with the corresponding member.
The internal space can bend the main body by the contact pressure at the contact of the tip.

  The core pin for resin-sealed molds according to the present invention can cope with variations in thickness when the molds are fitted due to the expansion and contraction ability of the core pins themselves. As a result, even if there are variations in the thickness and shape of the formwork and the substrate, the tip portions of the core pins can reliably contact and communicate with each other. Also, the molds are combined with no gaps.

  As a result, it is possible to suppress the occurrence of burrs on the outer periphery of the resin-sealed molded product after resin sealing, or the formation of walls that block burrs and holes inside the through holes.

  As a result of suppressing these burrs and walls, the finishing work step required after the resin sealing work can be omitted or simplified, and the manufacturing cost and manufacturing time of the resin-sealed molded product can be reduced.

It is a side view of the core pin in a prior art. It is a side view of the core pin in Embodiment 1 of this invention. It is a side view which shows the bending of the core pin in Embodiment 1 of this invention. It is a side view which shows the usage condition of the core pin in the resin sealing type in Embodiment 1 of this invention. It is a side view of the state in which the resin sealing type | mold in Embodiment 1 of this invention is combined. It is a schematic diagram which shows the state which the 1st mold and the 2nd mold in Embodiment 1 of this invention combined. It is a schematic diagram which shows the state with which resin in Embodiment 1 of this invention was filled. It is a side view which shows the state after the 1st formwork and 2nd formwork in Embodiment 1 of this invention were removed. It is a front view of the board | substrate after resin-sealing. It is a side view of the core pin in Embodiment 2 of this invention. It is a bottom view of the core pin in Embodiment 2 of this invention. It is a schematic diagram of the resin sealing apparatus in Embodiment 3 of this invention. It is a schematic diagram of the resin sealing apparatus in the variation 2 in Embodiment 3 of this invention. It is a schematic diagram of the resin sealing apparatus in the variation 3 in Embodiment 3 of this invention. It is a schematic diagram of the resin sealing apparatus in the variation 4 in Embodiment 3 of this invention. It is a side view of a resin sealing type | mold provided with the core pin in a prior art. It is a side view of the combination state of a resin sealing type | mold provided with the core pin in a prior art. It is a front view of a resin sealing molded product. It is a side view of a resin sealing type when a core pin is short. It is a side view of a resin sealing type when a core pin is too long.

The core pin for resin-sealing molds according to the first invention of the present invention is:
The main body,
An internal space along the direction of combination of the resin-sealed molds inside the main body,
A distal end of the main body, which can be brought into contact with a corresponding corresponding member,
By moving the resin-sealed mold in the direction of combination, the tip is in contact with the corresponding member.
The internal space can bend the main body by the contact pressure at the contact of the tip.

  With this configuration, it is compatible that the tip portion of the core pin is reliably in contact with the corresponding member and that the resin-sealed mold is reliably combined. As a result, the resin does not enter the gap at the tip part, and the resin does not protrude from the combined part of the mold, so that the resin burrs of the manufactured resin-sealed product do not occur.

  In the resin-encapsulated core pin according to the second aspect of the present invention, in addition to the first aspect, the internal space is bent so as to contract the main body in the combination direction when contact pressure is applied. When the contact pressure is released, the main body is returned to the original state.

  With this configuration, when the front end portion receives contact pressure, the main body portion contracts to ensure the combination of the molds, and it is also possible to prevent a gap from occurring at the front end portion. In addition, since it can be restored, it can be used repeatedly.

  In the resin-encapsulated core pin according to the third invention of the present invention, in addition to the first or second invention, the corresponding member is another core pin, and the tip portion is a tip portion of the other core pin. Touchable.

  With this configuration, a space not filled with resin can be formed by communication between the core pins. As a result, a through hole can be formed in resin sealing.

  In the resin-encapsulated core pin according to the fourth aspect of the present invention, in addition to any one of the first to third aspects, the tip has a flat shape or a recess.

  With this configuration, it is possible to ensure the contact of the distal end portion, and it is difficult to generate a gap in the outer edge portion in the contact.

  In the resin-encapsulated core pin according to the fifth aspect of the present invention, in addition to any of the first to fourth aspects, the internal space has a through-hole penetrating from the base of the main body to the tip. It is.

  With this configuration, the internal space can be easily formed. Moreover, the recessed part of the front-end | tip part can also be formed according to formation of internal space.

  In the resin-encapsulated core pin according to the sixth aspect of the present invention, in addition to any of the first to fourth aspects, the internal space is a hollow portion inside the main body.

  With this configuration, a balance between deflection and strength can be realized.

  In the resin-encapsulated core pin according to the seventh invention of the present invention, in addition to any one of the first to sixth inventions, the inner diameter of the internal space in the cross section of the main body portion is in the combination direction of the main body portions. Change.

  With this configuration, it is possible to achieve a balance between the deflection of the internal space and the strength of the main body.

  In the resin-encapsulated core pin according to the eighth aspect of the present invention, in addition to any one of the first to seventh aspects, the distal end side of the main body has a tapered outer diameter.

  With this configuration, the through hole formed by the main body has an appropriate shape.

A resin-sealed mold according to a ninth aspect of the present invention includes a first mold having a first mold mating surface and a first recess,
A second mold that is combined with the first mold and has a second mold mating surface and a second recess;
By combining the first mold and the second mold, a resin injection port for injecting resin into the internal space formed by the first recess and the second recess,
The core pin according to any one of claims 1 to 8 (hereinafter referred to as "first core pin") provided in the first mold,
A corresponding member corresponding to the first core pin provided in the second mold,
When the first formwork and the second formwork are combined,
The first mold mating surface and the second mold mating surface sandwich the substrate on which the electronic component is mounted,
The first recess and the second recess form an internal space;
The tip of the first core pin is in close contact with the corresponding member, and
The resin injected from the resin injection port is filled in the remaining portion of the internal space excluding the substrate on which the first core pin, the corresponding member, and the electronic component are mounted.

  With this configuration, the resin-sealed mold can realize resin sealing in which burrs and the like are unlikely to occur in the through hole due to the flexibility of the core pin having the internal space.

In the resin-sealed mold according to the tenth aspect of the present invention, the corresponding member is
The surface of the second recess,
The resin-sealed mold according to claim 9, which is a general-purpose core pin provided in the second mold, or a core pin according to claim 1 provided in the second mold.

  With this configuration, the resin-sealed mold can realize variations with various corresponding members.

A resin-sealed mold according to an eleventh aspect of the present invention includes a first mold having a first mold mating surface and a first recess,
A second mold that is combined with the first mold and has a second mold mating surface and a second recess;
By combining the first mold and the second mold, a resin injection port for injecting resin into the internal space formed by the first recess and the second recess,
The core pin according to any one of claims 1 to 8 (hereinafter referred to as "first core pin") provided in the first mold,
The core pin according to any one of claims 1 to 8 (hereinafter referred to as "second core pin") provided in the second mold,
When the first formwork and the second formwork are combined,
The first mold mating surface and the second mold mating surface sandwich the substrate on which the electronic component is mounted,
The first recess and the second recess form an internal space;
The tip of the first core pin is in close contact with the tip of the second core pin,
The resin injected from the resin injection port is filled in the remaining portion of the internal space excluding the substrate on which the first core pin, the second core pin, and the electronic component are mounted.

  With these configurations, the resin-sealed mold can realize resin sealing in which burrs and the like are unlikely to occur in the through hole due to the flexibility of the core pin having the internal space.

A resin sealing device according to a twelfth aspect of the present invention is the resin sealing mold according to any one of claims 9 to 11,
A mold clamping mechanism that can be clamped by combining the first mold frame and the second mold frame.

  With this configuration, it is possible to realize resin sealing in which burrs and the like are hardly generated in the through hole due to the flexibility of the core pin having the internal space.

A resin sealing method according to a thirteenth aspect of the present invention is a resin sealing method of a resin sealing object using the resin sealing device according to claim 12,
A substrate installation step of installing a substrate on which electronic components are mounted between the first mold frame and the second mold frame;
A combination process of combining the first mold frame and the second mold frame by the mold clamping mechanism;
A sandwiching step of sandwiching the substrate on which the electronic component is mounted by the first mold mating surface and the second mold mating surface;
A filling step of injecting and filling the resin from the resin injection port into the remaining portion of the internal space excluding the substrate on which the first core pin, the corresponding member, and the electronic component are mounted.

  With this configuration, it is possible to realize resin sealing in which burrs and the like are hardly generated in the through hole due to the flexibility of the core pin having the internal space.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  (Embodiment 1)

(Overview)
FIG. 1 is a side view of a core pin in the prior art. FIG. 1 shows the external form of the core pin in the prior art, and also shows the internal aspect. As shown in FIG. 1, the core pin 200 in the prior art includes a main body 201, but does not include an internal space inside the main body, unlike the core pin of the present invention described later.

  FIG. 2 is a side view of the core pin in the first embodiment of the present invention. While showing the external shape of the core pin 1, the internal state is shown as a see-through state. The core pin 1 includes a main body portion 2, an internal space 3, and a tip portion 4. The core pin 1 is used for a resin-sealed mold.

  The main body 2 creates the outer shape of the core pin 1. The main body 2 itself forms the core pin 1 as a whole. The main body 2 is made of metal or alloy and has a certain rigidity and strength. However, the inner space 3 is flexible enough to cause deflection and return due to pressure.

  The internal space 3 is provided inside the main body 2 and in a direction along the resin sealing mold combination direction. An internal space 3 is provided along the direction of the arrow A in FIG. In addition, the core pin 1 is used for a resin sealing type similarly to the structure of the resin sealing type in FIG. 16 of the prior art. At this time, the resin-sealed mold includes a first mold frame and a second mold frame, which are used in combination. The combination direction of the first mold frame and the second mold frame is the direction of the arrow A.

  The distal end portion 4 is the distal end of the main body portion 2 and can come into contact with an opposing corresponding member when the resin sealing mold is combined. By this contact, the space around the core pin 1 is filled with resin, but the resin does not enter the space occupied by the core pin 1. Moreover, it can aim at preventing resin entering into the tip of the front-end | tip part 4 of the core pin 1 because the front-end | tip part 4 is contacting the corresponding member.

  The core pin 1 comes into contact with the corresponding member by the movement of the resin-sealed mold in the combination direction. At the time of this contact, contact pressure is applied to the main body 2. At this time, as described in the related art, the contact pressure applied to the distal end portion 4 of the main body portion 2 may vary depending on the thickness variation of the substrate to be resin-sealed.

  In the case of the core pin 110 according to the prior art in the combination of the resin sealing molds due to the variation in the thickness of the substrate or the like, the resin sealing molds are in contact with the core pin 110 and the corresponding member or between the core pin 110 and the core pin 120. There was something that couldn't be combined.

  On the other hand, the core pin 1 of the present invention can be bent by the contact pressure applied to the tip portion 4 by the internal space 3. The tip part 4 comes into contact with the corresponding member by combining the resin sealing molds. At this time, contact pressures with different sizes are applied. The internal space 3 bends the main body 2 in accordance with this contact pressure.

  This is because the presence of the internal space 3 in the main body 2 gives the main body 2 flexibility and allows it to bend with contact pressure from the tip 4 that is the tip.

  In this manner, the core pin 1 of the present invention can cope with the variation in the thickness of the substrate to be resin-sealed due to the body portion 2 being deflected (contracted) corresponding to the contact pressure at the tip portion 4. The tip portion 4 of the core pin 1 is in a state of being surely in contact with the corresponding member. In addition, the resin-sealed mold is also tightly fitted and combined.

  Since the contact and the combination are firmly performed, the injected resin is prevented from entering the tip of the core pin 1. Moreover, it is possible to prevent the resin from leaking into the combination part of the resin sealing mold.

  As a result, it is possible to prevent difficult formation of through holes and leakage of resin to the outer edge, which have been problems in the prior art.

  FIG. 3 is a side view showing the deflection of the core pin in the first embodiment of the present invention. The core pin 1 is used for a resin-sealed mold, and contact pressure is applied to the tip portion 4. At this time, the main body 2 bends due to the provision of the internal space 3. That is, it shrinks. FIG. 3 shows a state in which the main body 2 is contracted.

  As described above, the core pin 1 of the present invention can be bent by the function of the internal space 3, and can be reliably brought into contact with a corresponding member or a combination of resin-sealed molds corresponding to variations in the thickness of the substrate and the like. .

(Use with resin-sealed mold)
The use state of the above-described core pin 1 in the resin-sealed mold will be described.

  FIG. 4 is a side view showing how the core pin is used in the resin-sealed mold according to Embodiment 1 of the present invention. FIG. 4 shows a state before the resin sealing mold 20 is combined. Moreover, it has shown in the transparent state so that an internal structure can be understood.

  That is, FIG. 4 illustrates the resin-sealed mold 20 using the core pin 1. This is the same from FIG. 4 to FIG. 8, and the resin-sealed mold 20 will be described below using FIG. 4 to FIG. 8 as the structure and function of the core pin 1 are described. For this reason, the description here is also the description of the resin sealing mold 20.

  4 to 8 show a resin-sealed mold 20 including a first mold 21 and a second mold 22. The resin-sealed mold 20 becomes a resin-sealed device by having a mold-clamping mechanism unit that mold-clamps the first mold 21 and the second mold 22 in combination. 4-8 demonstrates the structure and function as a resin sealing apparatus, showing the resin sealing type | mold 20. FIG.

  In addition, the sealing object is resin-sealed using a resin sealing device. That is, a resin sealing method. For this reason, in FIGS. 4-8, it is also description of the resin sealing method which uses a resin sealing apparatus.

  The resin sealing mold 20 includes a first mold 21 and a second mold 22. Each of the first mold 21 and the second mold 22 includes the core pin 1 described above. In addition, the code | symbol regarding the core pin 1 is partially abbreviate | omitted for legibility. The first mold 21 has a first recess 23. The second mold 22 has a second recess 24.

  The core pin 1 provided in each of the first mold 21 and the second mold 22 includes a main body 2, an internal space 3, and a tip 4.

  In the state of FIG. 4, the first mold 21 and the second mold 22 are separated and before being combined.

  From the state of FIG. 4, the first mold 21 and the second mold 22 approach each other and are combined. FIG. 5 is a side view of the state where the resin-sealed molds according to Embodiment 1 of the present invention are combined. Following FIG. 4, the state is as shown in FIG.

  In FIG. 5, the first mold 21 and the second mold 22 are approaching. In this state, the tip portion 4 of the core pin 1 provided in the first mold 21 and the tip portion 4 of the core pin 1 provided in the second mold frame 22 are in contact with each other. The first mold 21 and the second mold 22 sandwich a substrate 30 that is a resin sealing target. Here, if the thickness of the substrate 30 is as designed, the first mold 21 and the second mold 22 are tightly fitted when the tip portions 4 come into contact with each other.

  However, depending on the thickness of the substrate 30, the first mold 21 and the second mold 22 may not be properly fitted in this state. In anticipation of this, if the length of each main body portion 2 of the core pin 1 is shortened, the tip portions 4 of the core pin 1 are in contact with each other even if the first mold frame 21 and the second mold frame 22 are fitted. There are things you can't do.

  For this reason, it is appropriate that the length of the main body 2 of the core pin 1 is slightly longer.

  Thus, even if the front-end | tip parts 4 of the core pin 1 contact, the 1st formwork 21 and the 2nd formwork 22 may be in the state which does not fit. This is the state of FIG.

  In the state of FIG. 5, the tip 4 of the core pin 1 of the first mold 21 and the tip 4 of the core pin 1 of the second mold 22 are in contact with each other. From this state, the first mold 21 and the second mold 22 are brought closer together and combined.

  FIG. 6 is a schematic diagram showing a state in which the first mold frame and the second mold frame are combined in Embodiment 1 of the present invention. The state changes from the state of FIG. 5 to the state of FIG.

  The first mold 21 and the second mold 22 are further brought closer to the state of FIG. 5, and the first mold 21 and the second mold 22 are fitted and combined. Here, at the stage of FIG. 5, the tip portions 4 of the core pins 1 of the first mold 21 and the core pins 1 of the second mold 22 are in contact. From here, in order for the 1st mold 21 and the 2nd mold 22 to approach like FIG. 6, the contact between core pins 1 may become obstruction.

  For example, in addition to the resin-sealed mold 20, a mold clamping mechanism for clamping the mold by combining the first mold 21 and the second mold 22 is further provided. By including this mold clamping mechanism, a resin sealing device including the resin sealing mold 20 is configured. As shown in FIG. 5 to FIG. 6, the first mold frame 21 and the second mold frame 22 are combined and firmly clamped by the mold clamping mechanism.

  At this time, each of the first mold 21 and the second mold 22 sandwiches (pinches) the substrate 30. This is because the mating surfaces other than the first recess 23 of the first mold 21 and the second recess 24 of the second mold 22 sandwich the substrate 30.

  The first mold 21 has a first mold matching surface 27. The second mold 22 has a second mold matching surface 28 that faces the first mold matching surface 27. The first mold 21 is provided with a recessed first recess 23 at a portion other than the first mold mating surface 27. The second mold 22 includes a second recess 24 that is recessed in a portion other than the second mold mating surface 28.

  When the first mold frame 21 and the second mold frame 22 are combined, the first mold matching surface 27 and the second mold matching surface 28 sandwich the substrate 30. The first recess 23 and the second recess 24 form an internal space 40. In the internal space 40, the substrate 30 and the electronic components mounted on the substrate 30 are accommodated (not shown in the figure).

  In this state, each of the core pins 1 comes into close contact with its tip.

  However, as described above, each of the core pins 1 has the internal space 3. By providing this internal space 3, when the front-end | tip parts 4 contact and the contact pressure arises, each main-body part 2 will bend. As a result, the first mold frame 21 and the second mold frame 22 are firmly combined without causing the harmful contact between the core pins 1.

  A sealed space 40 is formed by the first recess 23 and the second recess 24.

  Here, since the first mold 21 and the second mold 22 are firmly combined, even if resin is injected into the sealing space 40, the first mold 21 and the second mold 22 Resin does not leak into the combination part.

  Moreover, the front-end | tip parts 4 of the core pin 1 contact and communicate with strong contact pressure. For this reason, it is possible to prevent the resin injected into the sealing space 40 from entering between the front end portions 4. Through the communication between the main body portions 2, a through hole that is not filled with resin in the sealing space 40 is formed. By not allowing the resin to enter between the front end portions 4 near the center of the through hole, penetration of the through hole is reliably formed. It is also possible to prevent burrs from occurring inside.

  At this time, as shown in FIG. 3, each of the core pin 1 of the first mold 21 and the core pin 2 of the second mold 22 is contracted. This is due to the deflection of the main body 2 due to the internal space 3. Due to this shrinkage, there is no gap for the resin to enter between the tip portions 4, and the first mold frame 21 and the second mold frame 22 are precisely combined.

  FIG. 7 is a schematic diagram showing a state in which the resin according to Embodiment 1 of the present invention is filled. As shown in FIG. 6, when the first mold 21 and the second mold 22 are combined, the first recess 23 and the second recess 24 are combined to form a sealed space 40 into which resin is injected. The

  Following the state of FIG. 6, the resin 50 is injected into the sealed space 40 as shown in FIG. Although not shown in FIG. 7, a resin injection port communicating with the sealing space may be provided. Molten resin is injected from this resin injection port. When the resin is continuously injected into the sealing space 40, the sealing space 40 is filled with the resin. FIG. 7 shows this filled state.

  At this time, the core pin 1 provided in the first mold 21 and the core pin 1 provided in the second mold 22 are connected to each other, and the resin 50 is filled avoiding these. Further, there is no gap between the tip portions 4 of the core pins 1, and the resin 50 does not enter here. Of course, the resin 50 does not protrude from the combined surface of the first mold 21 and the second mold 22.

  As a result, the resin 50 is filled without filling the portion of the core pin 1 that is desired to be a through hole in the resin sealing while filling the sealing space 40. This is the state of FIG.

  FIG. 8 is a side view showing a state after the first mold frame and the second mold frame in Embodiment 1 of the present invention are removed.

  FIG. 8 shows a state where the first mold 21 and the second mold 22 are removed after the resin 50 is cured in the state of FIG. For ease of viewing, the overlapping symbols are not shown. When the first mold 21 and the second mold 22 are removed, the resin layer 51 is formed on the substrate 30 to be sealed.

  Further, the portion where the resin 50 has not been injected by the core pin 1 remains as the through hole 52. As a result, resin sealing requiring a through hole can be realized. At this time, due to sufficient contact between the core pins 1 provided on the first mold 21 and the second mold 22, no burr due to the resin entering the central portion of the through hole 52 occurs.

  It should be noted that an electronic component or the like is mounted on the substrate 30 to be sealed, and the resin layer 51 may be an embodiment in which this electronic component is resin-sealed.

  FIG. 9 is a front view of the substrate after resin sealing. An electronic component or the like is mounted, and a portion of the substrate 30 to be sealed is sealed with a resin layer 51. In this state, a through hole 52 is provided in a part of the resin layer 51. The core pin 1 reliably forms the through hole 52 simultaneously with the resin sealing. It prevents burr from being generated inside the through-hole or burr from being generated on the outer edge of the resin layer 51.

  Further, as shown in FIG. 8, when the first mold 21 and the second mold 22 are separated, the contact pressure between the tip portions 4 of the core pin 1 is released. In the state where the contact pressure is applied, the main body 2 of the core pin 1 bends due to the action of the internal space 3. On the other hand, when the contact pressure is released, the main body 2 returns to the original state. As a result, the core pin 1 can be used again for resin sealing of another sealing object.

  When used next, the thickness of the substrate 30 or the like may vary due to variations. Also in this case, contact for forming the through hole 52 is possible due to the flexibility of the core pin 1, and the combination of the first mold 21 and the second mold 22 can be performed firmly.

  Thus, the core pin 1 can form the through-hole 52 appropriately corresponding to the same kind of sealing object and variations. In addition, repeated use is possible. This is because the main body 2 itself is hardly deformed by being repeatedly bent and returned by the internal space 3 and the durability in repeated use is high.

  Here, FIG. 4 etc. demonstrated the case where the core pin 1 was provided in each of the 1st mold 21 and the 2nd mold 22, and the core pins 1 contact the front-end | tip part 4 mutually. In addition to this, only one of the first mold 21 and the second mold 22 is provided with the core pin 1, and the core pin 1 contacts the inner surface of the first mold 21 or the second mold 22 facing each other. It may be an aspect. The corresponding member with which the tip 4 of the core pin 1 contacts may be the tip 4 of the core pin 1 or the inner surface of the mold. Or the board member which the front-end | tip part 4 of the core pin 1 in the case of combining a formwork may contact may be sufficient. Or the core pin 200 of a prior art may be sufficient.

  As described above, the core pin 1 according to the first embodiment can reliably form the through hole 52 simultaneously with the resin sealing.

  Moreover, what was demonstrated using FIGS. 4-9 has demonstrated the structure and characteristic of the core pin 1. FIG. According to this, it is also description of the resin sealing type | mold 20 provided with the core pin 1, and is also description of the resin sealing apparatus provided with the resin sealing type | mold 20. FIG. Furthermore, it is a description of a resin sealing method using a resin sealing device.

  In addition, what is necessary is just to think as follows when seeing the above-mentioned description as a resin sealing method.

  A resin sealing device is configured by providing the resin sealing mold 20 shown in FIG. The resin sealing device further includes a resin supply unit. The resin sealing method uses this resin sealing device.

  First, an installation process is performed in which the substrate 30 on which electronic components are mounted is installed between the first mold 21 and the second mold 22. FIG. 4 shows this state. As described above, the illustration of the electronic components is omitted from FIG. In addition, the substrate 30 is also partially omitted between the first mold 21 and the second mold 22. These actually exist between the first mold 21 and the second mold 22 and are included in the internal space 40.

  Next, a combination process of combining the first mold 21 and the second mold 22 is performed by the mold clamping mechanism. 5 to 6 show this state.

  Next, a sandwiching process is performed in which the substrate 30 on which the electronic component is mounted is sandwiched between the first mold mating surface 27 of the first mold 21 and the second mold mating surface 28 of the second mold 22. FIG. 6 shows this state.

  Here, although not illustrated, the resin sealing mold 20 includes a resin injection port for injecting resin into the internal space 40. Resin is injected into the internal space 40 from the resin injection port. At this time, the resin is filled in the remaining portion excluding the core pin 1, the electronic component, and the substrate 30, which is a shield in the internal space 40. Such a filling step is performed. FIG. 7 shows the filling process.

  Finally, when the resin is cured, a separation process for separating the first mold 21 and the second mold 22 is performed, and the resin-sealed substrate 30 appears. FIG. 8 illustrates this. As a result, the resin-sealed substrate 30 as shown in FIG. 9 is manufactured.

  Thus, the resin sealing mold 20 provided with the core pin 1 can implement | achieve use of the resin sealing method as a resin sealing apparatus.

  (Embodiment 2)

  Next, a second embodiment will be described. In the second embodiment, various variations will be described.

(Shape of core pin tip)
The form which has the recessed part is also suitable for the front-end | tip part 4 of the core pin 1. FIG. FIG. 10 is a side view of the core pin in the second embodiment of the present invention. The tip portion 4 of the core pin 1 shown in FIG. As described with reference to FIG. 4 and the like, the distal end portion 4 is used in the resin-sealed mold 20 by contacting the corresponding member. The corresponding member is a plate member of the mold or a pair of opposing core pins 1.

  In this contact, it is required that the tip portion 4 firmly contacts the corresponding member to prevent the resin from entering. At this time, the provision of the concave portion 5 in the distal end portion 4 has an advantage of increasing the degree of contact of the distal end portion 4 with the corresponding member. It is because it becomes difficult to be influenced by the flatness etc. of the front-end | tip part 4. FIG.

  In addition, since the concave portion 5 is provided, attention to the entry of air into the contact surface is reduced, and the outer periphery of the tip portion 4 can be reliably blocked from the outside. This blocking can reliably prevent the resin from entering the contact surface of the tip portion 4.

  The recess 5 preferably has at least one shape of a partial shape of a sphere, a conical shape, a cylindrical shape, a polygonal pyramid shape, a polygonal cylinder shape, or a combination thereof. This is because by having one of these shapes, it is possible to prevent a gap from being generated on the outer periphery of the contact surface while increasing the contact pressure.

  These recesses 5 may be provided by cutting or grinding.

  Of course, the tip portion 4 may have a flat shape.

(Internal space shape)
The main body 2 includes the internal space 3 as described above. Due to the presence of the internal space 3, the main body portion 2 bends due to the contact pressure and returns to the original state when the contact pressure is released.

  As shown in FIG. 10, the internal space may be a hollow portion inside the main body 2. For this reason, it does not penetrate in the length direction of the main body 2. By being in the form of the hollow portion, it is possible to realize deflection while having sufficient strength.

  Alternatively, the internal space 3 may have a form of a through hole that penetrates from the base of the main body 2 to the tip 4. By being in the form of the through hole, it is easy to form the internal space 3 in the main body 2. In addition, since the internal space 3 has a form of a through-hole, there is an advantage that the concave portion 5 can be inevitably formed in the tip portion 4.

  When the internal space 4 has such various aspects, it is possible to expand the ease of manufacture and variations in use.

(External shape of main body and inner diameter of internal space)
FIG. 11 is a bottom view of the core pin in the second embodiment of the present invention. The state seen from the bottom face side of the core pin 1 is shown.

  The core pin 1 includes a main body 2 and an internal space 3. On the bottom surface, there is an opening portion of the internal space 3. Here, in the bottom cross section of the main body 2 (that is, in the state of FIG. 11), the ratio between the outer shape of the main body 2 and the inner diameter of the internal space 3 is

    Inner diameter / outer diameter ≧ 50% (Formula 1)

  It is also suitable.

  Of course, this is an example.

  Since the relationship between the outer diameter and the inner diameter has the formula 1, the main body 2 can be sufficiently bent by the contact pressure applied to the tip 4 while the core pin 1 is made of metal or alloy. it can. Similarly, the main body 2 can be restored to its original state by releasing the contact pressure applied to the tip 4.

  Thus, by defining the ratio between the outer diameter and the inner diameter, it is possible to reliably realize the deflection of the main body 2 due to the contact pressure and achieve the purpose of use in the resin-sealed mold 20.

(Inner diameter aspect of internal space)
The internal space 3 may be a hollow part or a through hole. These may be formed by cutting or grinding the inside of the main body 2. Alternatively, the internal space 3 may be formed when the main body portion 2 is manufactured by a mold intended for the internal space 3.

  It is also preferable that the inner space 3 has the same inner diameter from the base of the main body 2 toward the tip. It is because manufacture is easy if it is a form with the same internal diameter.

  Alternatively, the inner diameter of the internal space 3 in the cross section of the main body 2 may be changed in the length direction of the main body 3 (combination direction of resin-sealed molds).

  For example, the inner diameter of the inner space on the distal end side of the main body 2 may be smaller than the inner diameter of the inner space 3 on the base side of the main body 2. In this case, the tip of the main body 2 has a merit that the portion of the meat other than the internal space 3 increases and the response force against the contact pressure applied to the tip 4 is increased.

  Alternatively, the inner diameter of the internal space 3 may be gradually reduced as going to the front end side of the main body 2. If the outer periphery of the inner space 3 is tapered, the inner diameter of the inner space 3 becomes smaller toward the tip side. Also in this case, there is an advantage that the response force against the contact pressure applied to the tip portion 4 is increased.

  Or it is also suitable for the cross-sectional shape in the length direction of the main-body part 2 of the internal space 3 to have a curved shape. In this case, the inner diameter near the center is increased, and the main body 2 is more easily bent by the contact pressure applied to the tip 4. Of course, it will be easier to return.

(Body configuration)
It is also preferable that the distal end side of the main body 2 has a tapered outer diameter. This is because the molded product can be smoothly taken out from the mold by having the taper outer diameter.

  When the front end side of the main body 2 has a tapered outer diameter, it is also preferable that the internal space 3 has a tapered shape along the same direction. In this case, the thickness of the meat portion in the length direction of the main body 2 can be maintained constant, and the strength at the time of bending can be ensured.

  Moreover, it is also suitable for the main-body part 2 to be a straight shape from the root to the middle, and to become a taper shape from the middle. This is because it is possible to maintain both strength and usability. In particular, it is suitable for mounting on the first mold 21 or the second mold 22.

  The main body 2 is inserted and inserted into insertion holes provided in the first mold frame 21 and the second mold frame 22 of the resin-sealed mold 20. At this time, it is also preferable that the portion protruding from the insertion hole has a tapered shape. At this time, a part protruding from the insertion hole may be a straight shape and the tip thereof may be a tapered shape.

  Thus, the main body 2 has various forms and has a merit that balance between strength and flexibility can be obtained by having a correspondence relationship with the resin-sealed mold 20.

  As described above, the core pin 1 according to the second embodiment can balance the ease of contact, strength, and deflection by various variations.

  (Embodiment 3)

  Next, Embodiment 3 will be described. In the third embodiment, a resin sealing mold 20 including the core pin 1 described in the first and second embodiments, a resin sealing device including the resin pin, and a resin sealing method will be described.

(Resin sealing type)
The resin-sealed mold includes the core pin 1 as described with reference to FIG. The resin sealing type is an element constituting the resin sealing device. The resin-sealed mold 20 will be described with reference to FIG. FIG. 12 is a schematic diagram of a resin sealing device according to Embodiment 3 of the present invention.

  The resin sealing mold 20 includes a first mold 21 and a second mold 22. The first mold 21 has a first mold mating surface 27 and a first recess 23. The second mold 22 has a second mold mating surface 28 and a second recess 24.

  Moreover, the first recess 23 and the second recess 24 form an internal space 40 by combining the first mold 21 and the second mold 22. A resin injection port (not shown in FIG. 4 and the like) for injecting resin into the internal space 40 is provided. Furthermore, the first mold 22 is provided with the core pin 1 described in the first and second embodiments (hereinafter referred to as “first core pin 1” as necessary).

  The second mold 23 is provided with a corresponding member 41 corresponding to the first core pin 1.

  When the first mold 21 and the second mold 22 are combined, the internal space 40 is formed by combining the first mold combining surface 27 and the second mold combining surface 28. The first mold matching surface 27 and the second mold matching surface 28 sandwich the substrate 30 on which electronic components are mounted.

  The first recess 23 and the second recess 24 form an internal space 40. The circular end portion 4 of the first core pin 1 comes into close contact with the corresponding member 41. A shield is formed in the internal space 40 by this close contact.

  The resin is injected from the resin injection port, and the injected resin is filled in the remaining portion of the internal space 40 except for the first core pin 1 and the substrate 30 on which the electronic component is mounted.

  The resin sealing mold 20 has such a configuration.

(Resin sealing device and resin sealing method)
FIG. 12 shows the resin sealing device 500. Each of FIG. 12 to FIG. 15 shows a state before the first mold frame 21 and the second mold frame 22 are combined on the left side, and the first mold frame 21 and the second mold frame 22 on the right side. The state after combination is shown.

  A resin sealing device 500 in FIG. 12 includes a mold clamping mechanism 510 in addition to the resin sealing mold 20 described above. The mold clamping mechanism 510 performs mold clamping by combining the first mold 21 and the second mold 22. In other words, the first mold 21 and the second mold 22 that are combined can be separated.

  Thus, the resin sealing device 500 is configured by providing the resin sealing mold 20 with the mold clamping mechanism 510. A resin supply unit may be provided as necessary.

  By the resin sealing method using the resin sealing device 500, the through hole 52 is formed in the substrate 30 and the resin sealing is performed. The resin sealing method includes the following steps.

  First, an installation process is performed in which the substrate 30 on which electronic components are mounted is installed between the first mold 21 and the second mold 22. As described above, for the sake of easy viewing, the electronic components are not shown in FIG. In addition, the substrate 30 is also partially omitted between the first mold 21 and the second mold 22. These actually exist between the first mold 21 and the second mold 22 and are included in the internal space 40.

  Next, a combination process of combining the first mold 21 and the second mold 22 is performed by the mold clamping mechanism.

  Next, a sandwiching process is performed in which the substrate 30 on which the electronic component is mounted is sandwiched between the first mold mating surface 27 of the first mold 21 and the second mold mating surface 28 of the second mold 22.

  Here, although not illustrated, the resin sealing mold 20 includes a resin injection port for injecting resin into the internal space 40. Resin is injected into the internal space 40 from the resin injection port. At this time, the resin is filled in the remaining portion excluding the core pin 1, the electronic component, and the substrate 30, which is a shield in the internal space 40. Such a filling step is performed.

  Finally, when the resin is cured, a separation process for separating the first mold 21 and the second mold 22 is performed, and the resin-sealed substrate 30 appears. This is the state shown in FIG.

  Here, the resin sealing device 500 has various variations depending on the type of the corresponding member 41 provided in the second mold 23. A mode according to this variation is shown in each of FIGS.

(Variation 1: Fig. 12)
FIG. 12 shows a case where the corresponding member 41 is the surface of the second recess 24 of the second mold 22. The first formwork 21 is a formwork provided with the first core pin 1 (which is the core pin provided with the inside 3 described in the first and second embodiments). The corresponding member 41 is the surface of the second recess 24.

  For this reason, when the first mold frame 21 and the second mold frame 22 are combined by the mold clamping mechanism 510, the tip 4 of the first core pin 1 is in close contact with the surface of the second recess 24, which is the corresponding member 41. Then touch.

  With such a configuration, when the first mold 21 and the second mold 22 are combined, the right side of FIG. 12 is obtained. The through hole 52 formed after resin sealing is formed by the first core pin 1 on the right side of FIG.

  In the resin sealing device 500, when it is desired to reduce the cost of the mold or supplement the through hole 52, a variation as shown in FIG. 12 is suitable. Also in the resin sealing method, the resin sealing device 500 of FIG. 12 is used. That is, the resin is filled in a state in which the tip portion 4 of the first core pin 1 and the surface of the second recess 24 are in close contact with each other.

(Variation 2: Fig. 13)
FIG. 13 is a schematic diagram of a resin sealing device according to Variation 2 in Embodiment 3 of the present invention. In the resin sealing device 500 of FIG. 13, a short (short) conventional core pin 200 is used as the corresponding member 41.

  For this reason, when the first mold 21 and the second mold 22 are combined, the tip 4 of the first core pin 1 is in close contact with the tip of the core pin 200. The right side of FIG. 13 shows this state. The first core pin 1 and the core pin 200 that are in close contact with each other serve as a shield, and the through hole 52 can be formed.

  Since a combination of two core pins can form the shape of the through hole 52, when it is desired to form such a through hole 52, a variation as shown in FIG. 13 is used. The resin sealing apparatus 500 of FIG. 13 is used for the resin sealing method, and resin sealing is performed.

(Variation 3: Fig. 14)
FIG. 14 is a schematic diagram of a resin sealing device according to Variation 3 in Embodiment 3 of the present invention.

  In FIG. 14, a conventional core pin 200 is used as the corresponding member 41. The core pin 200 is taller (longer) than in the case of FIG. The core pin 200 has a height identified with the first core pin 1. When the first mold 21 and the second mold 22 are combined, the tip 4 of the first core pin 1 comes into close contact with the tip of the core pin 200.

  The variation of FIG. 14 is realizable because the 2nd formwork 22 is provided with the core pin 200. FIG.

  At this time, like the other variations, the first core pin 1 is contracted by the internal space 3. For this reason, both the degree of adhesion and the degree of fitting of the formwork are increased. By these, resin sealing can be performed appropriately while forming the through hole 52. In other words, it is possible to prevent the burr from being generated in the through hole 52 and the protrusion of the fitting portion of the formwork from occurring.

  By using the tall core pin 200, the through hole 52 can be formed as such. Alternatively, it is possible to realize the resin sealing device 500 that achieves cost reduction with the combination with the second mold 22 of the prior art.

(Variation 4: Fig. 15)
FIG. 15 is a schematic diagram of a resin sealing device according to Variation 4 in Embodiment 3 of the present invention.

  In FIG. 15, the core pin 1 described in the first and second embodiments (hereinafter, “second core pin 1 </ b> A”) is used as the corresponding member 41. That is, the second mold 22 includes the second core pin 1 </ b> A that is the same core pin 1 as the first mold 21.

  As a result, as described in FIGS. 4 to 8, the tip portion 4 of the first core pin 1 and the tip portion of the second core pin 1 </ b> A are in close contact with each other. By this close contact, the first core pin 1 and the second core pin 1 </ b> A can form the through hole 52.

  Both the first core pin 1 and the second core pin 1A can be shrunk by the internal space 3, and both the fitting degree of the mold and the close contact degree between the core pins can be achieved. As a result, resin burrs and protrusions can be prevented.

  As described above, the resin sealing device 500 has various variations. This is the same as the resin-sealed mold 20. By using each of these resin sealing devices 500, a resin sealing method can be realized.

  The resin-encapsulated core pin described in the first to third embodiments is an example for explaining the gist of the present invention, and includes modifications and alterations without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Core pin 2 Main-body part 3 Internal space 4 Front-end | tip part 5 Recessed part 20 Resin sealing type | mold 21 1st formwork 22 2nd formwork 23 1st dent 24 2nd dent 30 Substrate 40 Internal space 50 Resin 51 Resin layer 100 Sealing type 200 Core Pin 500 Resin Sealing Device 510 Mold Clamping Mechanism

In view of the above problems, the resin-sealed mold of the present invention is
A first mold having a first mold mating surface and a first recess;
A second mold that is combined with the first mold and has a second mold mating surface and a second recess;
A resin injection port for injecting resin into an internal space formed by the first recess and the second recess by combining the first mold and the second mold;
A first core pin provided in the first formwork;
A corresponding member corresponding to the first core pin provided in the second formwork,
When the first formwork and the second formwork are combined,
The first mold matching surface and the second mold matching surface sandwich a substrate on which an electronic component is mounted,
The first recess and the second recess form the internal space;
The tip of the first core pin is in close contact with the corresponding member,
The resin injected from the resin injection port is filled in the remaining part of the internal space, excluding the substrate on which the first core pin, the corresponding member, and the electronic component are mounted .
The first core pin is
The main body,
An inner space inside the main body, the inner space being along the combination direction of the first mold and the second mold,
A distal end of the main body, the distal end being capable of contacting the corresponding member;
Due to the movement of the first mold frame and the second mold frame in the combination direction, the tip portion comes into contact with the corresponding member,
The internal space can bend the main body by contact pressure in contact with the tip.

Claims (13)

A core pin for a resin-sealed mold,
The main body,
An internal space inside the main body along the combination direction of the resin-sealed molds; and
A tip portion of the main body portion, the tip portion being capable of contacting a corresponding corresponding member,
By the movement in the combination direction of the resin-sealed mold, the tip portion comes into contact with the corresponding member,
The internal space is a resin-encapsulated core pin capable of bending the main body by contact pressure in contact with the tip.   The internal space bends to shrink the main body in the combination direction when the contact pressure is applied, and returns the main body to an original state when the contact pressure is released. Item 2. A core pin for resin-sealed mold according to Item 1.   3. The resin-encapsulated core pin according to claim 1, wherein the corresponding member is another core pin, and the tip portion can contact a tip portion of the other core pin.   4. The resin-encapsulated core pin according to claim 1, wherein the tip has a flat shape or a recess. 5.   5. The resin-encapsulated core pin according to claim 1, wherein the internal space is a through-hole penetrating from a base of the main body portion to the tip portion.   The core pin for a resin-sealed mold according to any one of claims 1 to 4, wherein the internal space is a hollow portion inside the main body.   The core pin for a resin-sealed mold according to any one of claims 1 to 6, wherein an inner diameter of the internal space in a cross section of the main body portion changes in the combination direction of the main body portions.   The core pin for a resin-sealed mold according to any one of claims 1 to 7, wherein a distal end side of the main body portion has a tapered outer diameter. A first mold having a first mold mating surface and a first recess;
A second mold that is combined with the first mold and has a second mold mating surface and a second recess;
A resin injection port for injecting resin into an internal space formed by the first recess and the second recess by combining the first mold and the second mold;
The core pin according to any one of claims 1 to 8 (hereinafter referred to as "first core pin") provided in the first formwork,
A corresponding member corresponding to the first core pin provided in the second formwork,
When the first formwork and the second formwork are combined,
The first mold matching surface and the second mold matching surface sandwich a substrate on which an electronic component is mounted,
The first recess and the second recess form the internal space;
The tip of the first core pin is in close contact with the corresponding member,
A resin-sealed mold in which the resin injected from the resin injection port is filled in the remaining portion of the internal space excluding the substrate on which the first core pin, the corresponding member, and the electronic component are mounted. The corresponding member is
The surface of the second recess,
The resin-sealed mold according to claim 9, which is a general-purpose core pin provided in the second formwork or a core pin according to any one of claims 1 to 8 provided in the second formwork. A first mold having a first mold mating surface and a first recess;
A second mold that is combined with the first mold and has a second mold mating surface and a second recess;
A resin injection port for injecting resin into an internal space formed by the first recess and the second recess by combining the first mold and the second mold;
The core pin according to any one of claims 1 to 8 (hereinafter referred to as "first core pin") provided in the first formwork,
A core pin according to any one of claims 1 to 8 (hereinafter referred to as "second core pin") provided in the second formwork,
When the first formwork and the second formwork are combined,
The first mold matching surface and the second mold matching surface sandwich a substrate on which an electronic component is mounted,
The first recess and the second recess form the internal space;
The tip of the first core pin is in close contact with the tip of the second core pin, and
A resin-sealed mold in which the resin injected from the resin injection port is filled in the remaining portion of the internal space excluding the substrate on which the first core pin, the second core pin, and the electronic component are mounted. A resin-sealed mold according to any one of claims 9 to 11,
A resin sealing device comprising: a mold clamping mechanism portion that can be clamped by combining the first mold frame and the second mold frame. A resin sealing method for a resin sealing object using the resin sealing device according to claim 12,
A substrate installation step of installing the substrate on which the electronic component is mounted between the first mold frame and the second mold frame;
A combination step of combining the first mold frame and the second mold frame by the mold clamping mechanism;
A sandwiching step of sandwiching the substrate on which the electronic component is mounted by the first mold mating surface and the second mold mating surface;
And a filling step of injecting and filling a resin into the remaining portion of the internal space excluding the substrate on which the first core pin, the corresponding member, and the electronic component are mounted.