JP6496432B1 - Resin-sealed type, resin-sealed device and resin-sealed method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a core pin for resin sealing type, a resin sealing type, a resin sealing device, and a resin sealing method capable of preventing an increase in size of a resin sealing type while suppressing the influence on use accuracy and service life. Do.
A core pin according to the present invention is a core pin for a resin-sealed type, and includes a main body, an internal space inside the main body, and an internal space along a combination direction of the resin-sealed type, and The tip is provided with a tip that can come into contact with the corresponding corresponding member, and the movement of the resin-sealed type in the combination direction brings the tip into contact with the corresponding member, and the internal space is the contact pressure at the contact of the tip. Allows the main body to be flexed.
[Selected figure] Figure 2

Description

  The present invention relates to a resin-sealed core pin, a resin-sealed type, a resin-sealed device, and a resin-sealed method for sealing leaving electronic components when sealing electronic components with resin.

  Many electronic devices, measuring devices, transportation devices, precision devices and the like have many electronic components including semiconductor integrated circuits. Processors, image processing circuits, sound processing circuits, various sensors, etc. are becoming highly integrated and many functions are integrated in electronic components. This electronic component is required for these devices.

  These electronic components may need to be sealed with resin depending on their nature or the characteristics to be mounted. When sealed with a resin, the electronic component is sandwiched between an upper mold and a lower mold that form an internal space in a state of being mounted on a substrate. When the upper and lower molds are combined, an internal space is formed. In this internal space, the electronic component mounted on the substrate comes to be located.

  Resin is injected into this internal space. The resin is injected and filled in the inner space. After this filling, the resin solidifies. When the upper mold and the lower mold are removed after the resin is solidified, the electronic component is sealed with the resin. An element including a mechanism such as injection of resin in the upper and lower molds is a resin-sealed type.

  The resin-sealed type may be resin-sealed even for a single electronic component not mounted on a substrate. Further, depending on the nature of the electronic component, only one side of the electronic component may be resin-sealed, or both sides may be resin-sealed.

  When sealed with a resin, in appearance, the resin forming layer is in the state of being present outside.

  As described above, resin sealing of electronic parts is performed, but depending on the characteristics of the electronic parts and the characteristics for mounting, through holes in the thickness direction are required in a part of the resin forming layer generated by sealing. Sometimes. This is for the purpose of automation in the mounting apparatus, or for dealing with the component characteristics.

  In order to form such a through hole, a member called a core pin may be provided in the internal space formed by the resin-sealed mold. In the resin-sealed type, core pins are provided on the upper and lower molds sandwiching the electronic component to be sealed. The upper core pin and the lower core pin face and contact when the upper and lower molds are combined. By this contact, a rod-shaped inhibitor is formed in the thickness direction in the resin-sealed internal space.

  Since this inhibitor has a rod-like form in the thickness direction, the resin does not enter the internal space. In this state, when the resin is injected into the internal space and solidified, the through holes are left in the resin-formed layer to be molded.

  FIG. 16 is a side view of a resin-sealed mold provided with a core pin in the prior art. The resin-sealed mold 100 includes an upper mold 101 and a lower mold 102. The upper mold 101 includes a recess 103, and the lower mold 102 includes a recess 104. Also, the upper mold 101 includes the core pin 110, and the lower mold 102 includes the core pin 120. In FIG. 16, the electronic components and the substrate sandwiched therebetween are omitted for the sake of easy viewing, but in actuality, these are sandwiched between the upper die and the lower die. Furthermore, the electronic component is included in the internal space formed by the recesses 103 and 104.

  In the state of FIG. 16, when the upper mold 101 and the lower mold 102 approach and are combined, as shown in FIG. 17, the recess 103 and the recess 104 are integrated to form an internal space 106. The resin is injected into the internal space 106. At this time, since the core pin 110 and the core pin 120 bring their tips into contact with each other and communicate with each other, an integrated bar-like inhibiting substance is generated.

  FIG. 17 is a side view of a resin-sealed combination provided with a core pin in the prior art.

  The injected resin is filled in the inner space 106 avoiding the inhibition by the core pins 110, 120. As a result, in the resin-sealed electronic component to be manufactured (hereinafter, referred to as “resin-sealed molded product” if necessary), a through hole is formed. FIG. 18 is a front view of a resin-sealed molded article. Through holes 130 are formed in the resin-sealed molded product 140. The through holes 130 are generated by the core pins 110 and 120 in contact with each other as described above, and the region of the inhibitor remains as the through holes 130. The other part is a resin forming layer. The inside contains electronic components and a substrate.

  Here, the core pin 110 is provided to the upper mold 101, and the core pin 120 is provided to the lower mold 102. When the upper mold 101 and the lower mold 102 are combined and fitted, it is preferable that the core pins 110 and 120 reliably contact and communicate with each other. At this time, it is preferable to fit the upper mold 101 and the lower mold 102 without a gap.

  However, the upper mold 101 and the lower mold 102 are combined with the electronic substrate on which the electronic component is mounted interposed. For this reason, there may be variations in the thickness of electronic components and electronic substrates. Alternatively, the shapes and thicknesses of the upper mold 101 and the lower mold 102 may vary.

  In such a state, when the length of the core pins 110 and 120 is short, the contact of the tip of the core pins 110 and 120 is insufficient. FIG. 19 is a side view of the resin-sealed mold in the case where the core pin is short. As shown in FIG. 19, a gap is generated between the core pin 110 and the tip of the core pin 120. If this gap is present, the resin enters into the gap, and the through hole 130 of the resin-sealed molded product to be produced does not reliably penetrate or burrs occur at the joint portion.

  On the other hand, when the length of the core pins 110 and 120 is too long, the fitting between the upper mold 101 and the lower mold 102 becomes insufficient as shown in FIG. FIG. 20 is a side view of the resin-sealed mold in the case where the core pin is too long.

  In this case, a gap is generated between the upper mold 101 and the lower mold 102, and the resin enters the gap, which leads to the problem that resin burrs occur on the outer periphery of the resin-sealed molded product. However, it is difficult to adjust the length of the core pin to a fine level, and even if it is performed, it may be short due to variations in the shape and thickness of the upper mold 101 and lower mold 102, and variations in the shape and thickness of electronic parts and substrates. Long-standing problems remain.

  As described above, in the resin-sealed type in which the through hole is formed using the core pin, there is a problem that it is difficult to optimize the length of the core pin.

  Under such circumstances, techniques for adjusting the length of the core pin have been proposed (see, for example, Patent Document 1, Patent Document 2, and Patent Document 3).

Japanese Patent Application Laid-Open No. 6-91704 JP 2003-324116 A JP 2017-136776 A

  Patent Document 1 has a movable mold and a fixed mold, and has a pin shape whose tip projects into one of the molds in one mold in order to form a through hole in a resin molded portion of a resin-sealed transistor device. In the resin mold for a transistor provided with the member 20, the pin-like member 20 is reciprocably fitted in one mold 10 within a predetermined range, and is urged toward the other mold 30 by the elastic member 25. And when the mold is closed, the tip end of the pin-like member 20 abuts against the cavity 14 surface of the other mold 30 and is moved against the biasing force of the elastic member 25, and the pin-like member is moved by the elastic member 25. Disclosed is a molding die characterized in that the member 20 and the other mold 30 are in close contact with each other with a predetermined biasing force or more.

  In Patent Document 2, the core pin 24 is disposed in the upper mold 13 inside the through hole 19 a of the upper mold cavity insert 19. A backup hole 26 is formed in a portion of the upper chase block 18 facing the through hole 19 a. A spring member 27 is disposed in the backup hole 26, and the core pin 24 can slide in the through hole 19a according to the expansion and contraction of the spring member 27. The core pin 24 discloses a resin sealing mold that elastically contacts the lower mold cavity insert 16 with the upper mold 13 and the lower mold 12 closed.

  Patent documents 1 and 2 disclose connecting a spring to a core pin and adjusting the contact state of the tip of the core pin by the elastic force of the spring. If the core pin length is too long in the mold fit, the spring will absorb it and reduce the length. In this way, the core pin is prevented from being insufficient or too long.

  However, a spring is connected to the rear end of the core pin, and it is necessary to move the core pin up and down by the elastic force of the spring. For this reason, a pin through hole through which the core pin can move up and down is provided in the mold. The through hole communicates with the internal space into which the resin is injected. Therefore, there is a problem that the resin gets into the through hole. If the resin penetrates into the pin through hole, the core pin can not move up and down, which makes it impossible to continue the use as a resin-sealed type.

  In addition, if the elastic force of the spring is insufficient, there is a problem that the length adjustment of the core pin becomes insufficient. In addition, depending on the elastic life of the spring, there may be a problem that the length adjustment of the core pin can not be performed. As described above, there is a problem that the service life of the resin-sealed mold is reduced or the manufacturing accuracy is reduced.

  Alternatively, there is also a problem that it is difficult to miniaturize the resin-sealed type and miniaturize the resin-sealed device because a region for housing the spring is required.

  In Patent Document 3, a resin sealing mold B has an upper mold chess 1, a lower mold chess 2 having a cavity recess 200, and a core 201 fixed to the cavity recess 200. In the core 201, the tip end face of the core main body 202 can be in close contact with the surface of the sensor element 501 in a fluid-tight manner, a pinching portion is formed on the outer peripheral portion on the tip end face side, and the pinching portion is pressed against the tip end face Disclosed is a resin sealing mold constituted of a masking body 203 having required elasticity and heat resistance, which suppresses outward swelling deformation when pressure is applied.

However, in Patent Document 3, the masking body plays the role of an elastic body, and has the same problems as Patent Documents 1 and 2. In addition, there is also a problem that the masking body is deformed by abrasion, peeling, and sealing resin pressure. Alternatively, there may be a problem that the masking body is deformed by the heat of the injected resin.
As described above, there are various problems in the prior art.

  SUMMARY OF THE INVENTION In view of the problems of the prior art, the present invention is capable of preventing an increase in size of a resin-sealed type while suppressing the influence on use accuracy and service life, core pins for resin-sealed type, resin-sealed, resin-sealed It aims at providing an apparatus and a resin sealing method.

In view of the above problems, the resin-sealed mold of the present invention is
A first mold having a first mold mating surface and a first recess;
A second mold which is combined with the first mold and has a second mold mating surface and a second recess;
A resin injection port for injecting a resin into an internal space formed by the first recess and the second recess by combining the first form and the second form;
A first core pin provided on the first formwork,
And a corresponding member corresponding to the first core pin provided on the second formwork,
When the first form and the second form are combined,
The first mold mating surface and the second mold mating surface sandwich a substrate on which an electronic component is mounted,
The first recess and the second recess form the internal space,
The tip of the first core pin comes in close contact with the corresponding member,
The resin injected from the resin injection port is filled in the remaining portion of the internal space excluding the substrate on which the first core pin, the corresponding member, and the electronic component are mounted .
The first core pin is
Body part,
An internal space inside the main body portion along a combination direction of the first form and the second form;
A distal end of the main body, the distal end being capable of contacting the corresponding member;
The movement of the first form and the second form in the combination direction brings the tip into contact with the corresponding member,
The inner space can deflect the main body by a contact pressure at the contact of the tip.

  The core pin for a resin-sealed mold of the present invention can cope with the variation in thickness at the time of fitting of the mold by the expansion and contraction capacity of the core pin itself. As a result, even if there are variations in the thickness or shape of the mold, the substrate, etc., the tip portions of the core pins can be reliably in contact and communicated. Also, the molds are combined without any gap.

  As a result of these, it is possible to suppress the occurrence of burrs on the outer periphery of the resin-sealed molded product after resin sealing, and the formation of walls that block burrs and holes inside the through holes.

  As a result of being able to suppress these burrs and walls, it is possible to omit or simplify the finishing operation process required after the resin sealing operation, and it is possible to reduce the manufacturing cost and the manufacturing time of the resin sealing molded product.

It is a side view of the core pin in prior art. It is a side view of the core pin in Embodiment 1 of this invention. It is a side view showing deflection of a core pin in Embodiment 1 of the present invention. It is a side view which shows the usage aspect of the core pin in the resin-sealed type | mold in Embodiment 1 of this invention. It is a side view in the state where the resin mold in Embodiment 1 of the present invention is combined. It is a schematic diagram which shows the state which the 1st formwork and the 2nd formwork in Embodiment 1 of this invention combined. It is a schematic diagram which shows the state with which the resin in Embodiment 1 of this invention was filled. It is a side view which shows the state after the 1st formwork and the 2nd formwork in Embodiment 1 of this invention have been removed. It is a front view of a substrate after being resin-sealed. It is a side view of the core pin in Embodiment 2 of this invention. It is a bottom view of the core pin in Embodiment 2 of this invention. It is a schematic diagram of the resin sealing device in Embodiment 3 of this invention. It is a schematic diagram of the resin sealing device in the variation 2 in Embodiment 3 of this invention. It is a schematic diagram of the resin sealing device in the variation 3 in Embodiment 3 of this invention. It is a schematic diagram of the resin sealing device in the variation 4 in Embodiment 3 of this invention. It is a side view of a resin-sealed type provided with a core pin in a prior art. It is a side view of the combination state of the resin mold type provided with the core pin in a prior art. It is a front view of a resin sealing molded article. It is a side view of a resin-sealed type when a core pin is short. It is a side view of a resin-sealed type when a core pin is too long.

The core pin for a resin-sealed mold according to the first invention of the present invention is
Body part,
An internal space inside the main body along the resin-sealed combination direction,
A distal end portion of the main body portion, the distal end portion being capable of being in contact with a corresponding counterpart;
By moving the resin-sealed mold in the combination direction, the tip contacts the corresponding member,
The inner space can deflect the body by the contact pressure at the contact of the tip.

  According to this configuration, it is compatible that the tip of the core pin reliably contacts the corresponding member and the resin-sealed form is reliably combined. As a result, the resin does not intrude into the gap of the tip portion or the resin does not stick out to the combination part of the mold, and the burr of the resin of the manufactured resin sealed product does not occur.

  In the core pin for resin-sealed type according to the second invention of the present invention, in addition to the first invention, the internal space is bent so as to shrink the main body in the combination direction when the contact pressure is applied. When the contact pressure is released, the main body returns to the original state.

  According to this configuration, when the tip end receives contact pressure, the main body portion is shrunk to secure the combination of the molds, and it is possible to prevent the formation of a gap at the tip end. Also, being able to return to the original enables repeated use.

  In the core pin for resin-sealed type according to the third aspect of the present invention, in addition to the first or second aspect, the corresponding member is another core pin, and the tip portion is the tip portion of the other core pin It is possible to touch.

  By this configuration, the communication between the core pins can form a space in which the resin is not filled. As a result, through holes can be formed in resin sealing.

  In the core pin for resin-sealed type according to the fourth invention of the present invention, in addition to any one of the first to third inventions, the tip end portion has a flat shape or a concave portion.

  According to this configuration, it is possible to secure the contact of the tip end and to make it difficult to form a gap in the outer edge in the contact.

  In the core pin for resin-sealed type according to the fifth invention of the present invention, in addition to any of the first to fourth inventions, the internal space is a through hole penetrating from the root to the tip of the main body. It is.

  This configuration facilitates the formation of the internal space. Moreover, the recessed part of a front-end | tip part can also be formed according to formation of interior space.

  In the core pin for resin-sealed type according to the sixth invention of the present invention, in addition to any of the first to fourth inventions, the internal space is a hollow portion inside the main body.

  This configuration makes it possible to achieve a balance between deflection and strength.

  In the resin-sealed core pin according to the seventh invention of the present invention, in addition to any of the first to sixth inventions, the inner diameter of the internal space in the cross section of the main body portion is in the combination direction of the main body portions Change.

  With this configuration, it is possible to balance the deflection due to the internal space and the strength of the main body.

  In the core pin for resin-sealed type according to the eighth invention of the present invention, in addition to any of the first to seventh inventions, the tip end side of the main body portion has a tapered outer diameter.

  By this configuration, the through hole formed by the main body has an appropriate shape.

A resin mold according to a ninth aspect of the present invention is a first mold having a first mold mating surface and a first recess;
A second mold which is combined with the first mold and has a second mold mating surface and a second recess;
A resin injection port for injecting a resin into an internal space formed by the first recess and the second recess by combining the first form and the second form;
The core pin according to any one of claims 1 to 8 (hereinafter, "first core pin") provided in the first formwork,
And a corresponding member corresponding to the first core pin provided in the second formwork,
When the first form and the second form are combined,
The first mold mating surface and the second mold mating surface sandwich the substrate on which the electronic component is mounted,
The first recess and the second recess form an internal space,
The tip of the first core pin comes in close contact with the corresponding member,
The resin injected from the resin injection port is filled in the remaining part of the internal space except for the substrate on which the first core pin, the corresponding member, and the electronic component are mounted.

  With this configuration, the resin-sealed type can realize resin sealing in which burrs and the like do not easily occur in the through holes due to the flexibility of the core pin having the internal space.

In the resin-sealed type according to the tenth aspect of the present invention, the corresponding member is
Surface of the second recess,
The resin-sealed mold according to claim 9, which is a general-purpose core pin provided in the second mold, or the core pin according to any one of claims 1 to 8 provided in the second mold.

  By this configuration, the resin-sealed type can realize variations with various corresponding members.

A resin mold according to an eleventh aspect of the present invention is a first mold having a first mold mating surface and a first recess;
A second mold which is combined with the first mold and has a second mold mating surface and a second recess;
A resin injection port for injecting a resin into an internal space formed by the first recess and the second recess by combining the first form and the second form;
The core pin according to any one of claims 1 to 8 (hereinafter, "first core pin") provided in the first formwork,
The core pin according to any one of claims 1 to 8 (hereinafter referred to as "second core pin") provided in a second formwork,
When the first form and the second form are combined,
The first mold mating surface and the second mold mating surface sandwich the substrate on which the electronic component is mounted,
The first recess and the second recess form an internal space,
The tip of the first core pin comes in close contact with the tip of the second core pin;
The resin injected from the resin injection port is filled in the remaining part of the inner space excluding the substrate on which the first core pin and the second core pin and the electronic component are mounted.

  With these configurations, the resin-sealed type can realize resin sealing in which burrs and the like do not easily occur in the through holes due to the flexibility of the core pin having the internal space.

The resin sealing device according to a twelfth aspect of the present invention is the resin sealing type according to any one of claims 9 to 11,
And a mold clamping mechanism capable of clamping by combining the first mold and the second mold.

  With this configuration, it is possible to realize resin sealing in which burrs and the like do not easily occur in the through holes due to the flexibility of the core pin having the internal space.

A resin sealing method according to a thirteenth aspect of the present invention is a resin sealing method for an object to be sealed with a resin, using the resin sealing device according to claim 12.
A substrate setting step of setting a substrate on which the electronic component is mounted between the first form and the second form;
Combining the first mold and the second mold by the mold clamping mechanism;
A holding step of holding the substrate on which the electronic component is mounted by the first mold mating surface and the second mold mating surface;
And filling the resin from the resin injection port to the remaining portion of the internal space excluding the first core pin, the corresponding member, and the substrate on which the electronic component is mounted.

  With this configuration, it is possible to realize resin sealing in which burrs and the like do not easily occur in the through holes due to the flexibility of the core pin having the internal space.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  Embodiment 1

(Overall overview)
FIG. 1 is a side view of a core pin in the prior art. FIG. 1 also shows the inner aspect while showing the outline of the core pin in the prior art. As shown in FIG. 1, the core pin 200 in the prior art includes the main body portion 201, but does not have an internal space inside the main body portion like the core pin of the present invention described later.

  FIG. 2 is a side view of the core pin in the first embodiment of the present invention. While showing the outline of core pin 1, the state inside is shown as a transparent state. The core pin 1 includes a main body 2, an internal space 3 and a tip 4. Also, the core pin 1 is used in a resin-sealed type.

  The main body 2 makes the outer shape of the core pin 1. The main body 2 itself forms the whole as the core pin 1. The main body portion 2 is made of metal or alloy, and has certain rigidity and strength. However, the internal space 3 is flexible enough to cause deflection and return due to pressure.

  The internal space 3 is provided inside the main body 2 and in the direction along the resin-sealed combination direction. An internal space 3 is provided along the direction of arrow A in FIG. The core pin 1 is used in a resin-sealed type as in the configuration of the resin-sealed type in FIG. 16 of the prior art. At this time, the resin-sealed mold includes a first mold and a second mold, and these are used in combination. The combination direction of the first form and the second form is the direction of the arrow A.

  The tip 4 is a tip of the main body 2 and can be in contact with an opposing corresponding member when the resin-sealed mold is combined. By this contact, the space around the core pin 1 is filled with resin, but the space occupied by the core pin 1 does not enter the resin. In addition, it is possible to prevent the resin from entering the tip of the tip 4 of the core pin 1 by the tip 4 being in contact with the corresponding member.

  When the core pin 1 is moved in the resin-sealed combination direction, the tip 4 contacts the corresponding member. At the time of this contact, contact pressure is applied to the main body 2. At this time, as described in the prior art, the contact pressure applied to the leading end 4 of the main body 2 may differ in size due to the variation in the thickness of the resin-sealed substrate or the like.

  In the case of the core pin 110 of the prior art in the resin-sealed combination due to the variation of the thickness of the substrate etc., the resin-sealed type is used for the contact between the core pin 110 and the corresponding member and the contact between the core pin 110 and the core pin 120. It happened that it could not be combined.

  On the other hand, in the core pin 1 of the present invention, the main body 2 can be bent by the contact pressure applied to the tip 4 by the internal space 3. The resin-sealed mold is combined to bring the tip 4 into contact with the corresponding member. At this time, a contact pressure having a large and small difference is applied. The internal space 3 deflects the main body 2 in accordance with the contact pressure.

  By the presence of the internal space 3 inside the main body portion 2, flexibility is created in the main body portion 2 so that the contact pressure from the distal end portion 4 which is the distal end can be flexed.

  In this manner, the core pin 1 of the present invention can cope with variations in the thickness of the substrate to be resin-sealed, by bending (shrinkage) of the main body 2 corresponding to the contact pressure at the distal end 4. The tip 4 of the core pin 1 is always in a state of firmly in contact with the corresponding member. In addition, the resin-sealed mold is also in a tightly fitted and combined state.

  With such contact and combination being made firm, the injected resin is prevented from entering the tip of the core pin 1. In addition, it is also possible to prevent the resin from leaking out to the resin-sealed combination portion.

  As a result, it is possible to prevent the difficulty in forming the through hole and the resin leakage to the outer edge, which are problems in the prior art.

  FIG. 3 is a side view showing the deflection of the core pin in the first embodiment of the present invention. The core pin 1 is used in a resin-sealed type, and a contact pressure is applied to the tip 4. At this time, the main body portion 2 is bent by the provision of the internal space 3. That is, it shrinks. FIG. 3 shows that the main body 2 is contracted.

  As described above, the core pin 1 of the present invention can be flexed by the function of the internal space 3, and the combination with the corresponding member and the resin-sealed type can be reliably made according to the thickness variation of the substrate etc. .

(Use with resin-sealed type)
The use condition of the core pin 1 in the resin-sealed type will be described.

  FIG. 4 is a side view showing a use mode of the core pin in the resin-sealed type according to the first embodiment of the present invention. FIG. 4 shows a state before the resin mold 20 is combined. Also, it is shown in a transparent state so that the internal structure can be seen.

  That is, FIG. 4 describes a resin-sealed mold 20 using the core pin 1. This is the same from FIG. 4 to FIG. 8. The resin-sealed mold 20 will be described below with reference to FIGS. 4 to 8 in accordance with the description of the structure and function of the core pin 1. Therefore, the description here is also the description of the resin-sealed mold 20.

  4-8 has shown the resin mold 20 provided with the 1st formwork 21 and the 2nd formwork 22. As shown in FIG. The resin-sealed mold 20 becomes a resin-sealed device by having a clamping mechanism portion that clamps the first mold 21 and the second mold 22 in combination. 4 to 8 illustrate the configuration and function as a resin sealing device while showing the resin sealing mold 20.

  In addition, resin sealing is performed on the object to be sealed using a resin sealing device. That is, it is a resin sealing method. Therefore, FIGS. 4 to 8 also describe the resin sealing method using the resin sealing device.

  The resin-sealed mold 20 includes a first mold 21 and a second mold 22. Further, each of the first mold 21 and the second mold 22 includes the above-described core pin 1. In addition, the code | symbol regarding the core pin 1 is partially abbreviate | omitted for legibility. The first form 21 has a first recess 23. The second mold 22 has a second recess 24.

  The core pin 1 provided on each of the first form 21 and the second form 22 includes a main body 2, an internal space 3, and a tip 4.

  In the state of FIG. 4, the first mold 21 and the second mold 22 are separated and before being combined.

  From the state of FIG. 4, the first mold 21 and the second mold 22 come close to each other and are combined. FIG. 5 is a side view of a state in which the resin-sealed mold according to Embodiment 1 of the present invention is combined. It becomes the state of FIG. 5 following FIG.

  In FIG. 5, the first form 21 and the second form 22 are approaching. In this state, the tip 4 of the core pin 1 provided on the first mold 21 and the tip 4 of the core pin 1 provided on the second mold 22 are in contact with each other. The first mold 21 and the second mold 22 sandwich the substrate 30 which is a resin sealing target. Here, if the thickness of the substrate 30 is as designed, the first form 21 and the second form 22 fit tightly with each other when the end portions 4 are in contact with each other.

  However, depending on the thickness of the substrate 30, the first form 21 and the second form 22 may not fit exactly in this state. In anticipation of this, if the lengths of the respective main body portions 2 of the core pin 1 are shortened, even if the first form 21 and the second form 22 are fitted, the tip 4 of the core pin 1 contacts There are also things that can not be done.

  For this reason, it is appropriate to slightly increase the length of the main body 2 of the core pin 1.

  Since the tip portions 4 of the core pins 1 are in contact with each other, the first mold frame 21 and the second mold frame 22 may not be fitted due to the fact that they are slightly longer. This is the state of FIG.

  In the state of FIG. 5, the tip end 4 of the core pin 1 of the first mold 21 is in contact with the tip 4 of the core pin 1 of the second mold 22. From this state, the first mold 21 and the second mold 22 are brought closer and combined.

  FIG. 6 is a schematic view showing a state in which the first mold and the second mold are combined in the first embodiment of the present invention. The state of FIG. 5 changes to the state of FIG.

  The first mold 21 and the second mold 22 come closer to each other from the state shown in FIG. 5, and the first mold 21 and the second mold 22 are fitted and combined. Here, at the stage of FIG. 5, the tip portions 4 of the core pins 1 of the first mold 21 and the core pins 1 of the second mold 22 are in a contact state. From this point of view, in order for the first mold 21 and the second mold 22 to approach as shown in FIG.

  For example, in addition to the resin-sealed mold 20, a mold clamping mechanism for clamping the first mold 21 and the second mold 22 in combination is further provided. By providing the mold clamping mechanism, a resin sealing device including the resin sealing mold 20 is configured. As shown in FIGS. 5 to 6, the first mold frame 21 and the second mold frame 22 are combined and firmly clamped by this mold clamping mechanism.

  Further, at this time, each of the first mold 21 and the second mold 22 sandwiches (holds) the substrate 30. This is because the mating surfaces of the first recess 21 of the first form 21 and the second recess 24 of the second form 22 sandwich the substrate 30.

  The first mold frame 21 has a first mold mating surface 27. The second mold 22 has a second mold mating surface 28 opposite to the first mold mating surface 27. The first mold frame 21 is provided with a recessed first recess 23 in a portion other than the first mold mating surface 27. The second mold 22 is provided with a second recess 24 which is recessed in a portion other than the second mold mating surface 28.

  When the first form 21 and the second form 22 are combined, the first mold mating surface 27 and the second mold mating surface 28 sandwich the substrate 30. The first recess 23 and the second recess 24 form an internal space 40. In the internal space 40, the substrate 30 and the electronic component mounted on the substrate 30 are accommodated (not shown).

  In this state, each of the core pins 1 comes in close contact with its tip.

  However, as described above, each of the core pins 1 has an internal space 3. By providing the internal space 3, when the tip end portions 4 are in contact with each other and a contact pressure is generated, the respective main body portions 2 bend. As a result, the first mold frame 21 and the second mold frame 22 are firmly combined without the contact between the core pins 1 becoming an adverse effect.

  A sealing space 40 is formed by the first recess 23 and the second recess 24.

  Here, even when the resin is injected into the sealing space 40, the first form 21 and the second form 22 are firmly combined because the first form 21 and the second form 22 are firmly combined. There is no leakage of resin in the combination part.

  Further, the tip portions 4 of the core pins 1 are in contact and communicated by a strong contact pressure. For this reason, it is possible to prevent the resin injected into the sealing space 40 from entering between the end portions 4. The communication between the main body portions 2 forms through holes in the sealing space 40 in which the resin is not filled. The resin does not enter between the end portions 4 which are in the vicinity of the center of the through hole, whereby the through hole is reliably formed. It is also prevented that a burr is generated inside.

  At this time, as shown in FIG. 3, each of the core pin 1 of the first mold 21 and the core pin 2 of the second mold 22 is contracted. This is due to the deflection of the main body 2 due to the internal space 3. Due to this contraction, a gap into which the resin enters can not be formed between the end portions 4 and the first mold frame 21 and the second mold frame 22 are tightly combined.

  FIG. 7 is a schematic view showing a state in which the resin is filled in the first embodiment of the present invention. As shown in FIG. 6, when the first form 21 and the second form 22 are combined, the first recess 23 and the second recess 24 are combined to form a sealing space 40 into which the resin is injected. Ru.

  Subsequent to the state of FIG. 6, the resin 50 is injected into the sealing space 40 as shown in FIG. Although not shown in FIG. 7, a resin injection port communicating with the sealing space may be provided. The molten resin is injected from this resin injection port. When the resin continues to be injected into the sealing space 40, the sealing space 40 is filled with the resin. FIG. 7 shows this filled state.

  At this time, the core pin 1 provided in the first form 21 and the core pin 1 provided in the second form 22 are in a connected state, and the resin 50 is filled avoiding these. Further, there is no gap between the tip portions 4 of the core pins 1 and the resin 50 does not enter here. Of course, the resin 50 does not run over the combined surface of the first form 21 and the second form 22.

  As a result of these, while filling the sealing space 40, the resin does not enter the portion of the core pin 1 to be the through hole in the resin sealing, and the resin 50 is filled. This is the state of FIG.

  FIG. 8 is a side view showing a state after removing the first mold and the second mold in the first embodiment of the present invention.

  FIG. 8 shows a state in which the first mold 21 and the second mold 22 are removed after the resin 50 is cured in the state of FIG. 7. In order to make the figure easy to see, the illustration of the same symbols is omitted. When the first mold 21 and the second mold 22 are removed, the resin layer 51 is formed on the substrate 30 to be sealed.

  Further, a portion where the resin 50 is not injected by the core pin 1 remains as the through hole 52. As a result, resin sealing requiring a through hole can be realized. At this time, due to the sufficient contact between the core pins 1 provided in each of the first mold frame 21 and the second mold frame 22, burrs due to penetration of the resin in the central portion of the through hole 52 do not occur.

  In addition, an electronic component etc. may be mounted in the board | substrate 30 of sealing object, and the aspect which resin-seals this electronic component may be sufficient as the resin layer 51. FIG.

  FIG. 9 is a front view of the substrate after being resin-sealed. An electronic component or the like is mounted, and a portion having the substrate 30 to be sealed is sealed by the resin layer 51. A through hole 52 is provided in a part of the resin layer 51. The core pin 1 reliably forms the through hole 52 simultaneously with resin sealing. The formation of burrs inside the through holes or the formation of burrs on the outer edge of the resin layer 51 is prevented.

  Further, as shown in FIG. 8, when the first form 21 and the second form 22 are separated from each other, the contact pressure between the tip portions 4 of the core pins 1 is released. When the contact pressure is applied, the main body 2 of the core pin 1 is flexed by the function of the internal space 3. On the other hand, when the contact pressure is released, the main body 2 returns to the original state. As a result, the core pin 1 can be used again for resin sealing of another object to be sealed.

  When used next, the thickness of the substrate 30 or the like may vary due to variations. Also in this case, due to the flexibility of the core pin 1, the contact for forming the through hole 52 can be made, and the combination of the first mold 21 and the second mold 22 can also be made firmly.

  As described above, the core pin 1 can form the through hole 52 appropriately in response to the same kind of sealing object and variation or the like. In addition, repeated use is possible. By repeating the deflection and return of the main body 2 by the internal space 3, the main body 2 itself is less likely to be deformed, and the durability in repeated use is high.

  Here, FIG. 4 etc. demonstrated the case where the core pin 1 was provided in each of the 1st formwork 21 and the 2nd formwork 22, and core pin 1 comrades contact the front-end | tip part 4. FIG. Besides this, the core pin 1 is provided only on either the first mold frame 21 or the second mold frame 22, and the core pin 1 contacts the inner surface of the opposing first mold frame 21 or second mold frame 22. The aspect may be used. The corresponding member with which the tip 4 of the core pin 1 contacts may be the tip 4 of the core pin 1 or the inner surface of the mold. Alternatively, it may be a plate member in contact with the tip 4 of the core pin 1 when the molds are combined. Alternatively, it may be a core pin 200 of the prior art.

  As described above, the core pin 1 according to the first embodiment can reliably form the through hole 52 simultaneously with resin sealing.

  Moreover, what was demonstrated using FIGS. 4-9 has demonstrated the structure and the characteristic of the core pin 1. FIG. In accordance with this, it is also a description of the resin-sealed type 20 provided with the core pin 1 and a description of a resin-sealed device provided with the resin-sealed type 20. Furthermore, it is also a description of a resin sealing method using a resin sealing device.

  In addition, what is necessary is just to consider as follows, when seeing the above-mentioned description as a resin sealing method.

  The resin-sealed mold 20 shown in FIG. In addition, the resin sealing device further includes a resin supply unit. The resin sealing method uses this resin sealing device.

  First, an installation step of installing the substrate 30 on which the electronic component is mounted between the first mold 21 and the second mold 22 is performed. FIG. 4 shows this state. As described above, the illustration of the electronic components is omitted from FIG. In addition, the substrate 30 is also partially omitted between the first mold 21 and the second mold 22. These are actually present between the first mold 21 and the second mold 22 and included in the internal space 40.

  Next, a combination step of combining the first mold 21 and the second mold 22 is performed by the mold clamping mechanism. 5 to 6 show this state.

  Next, a sandwiching step of sandwiching the substrate 30 on which the electronic component is mounted is performed by the first mold mating surface 27 of the first mold 21 and the second mold mating surface 28 of the second mold 22. FIG. 6 shows this state.

  Here, although not shown, the resin-sealed mold 20 is provided with a resin injection port for injecting a resin into the internal space 40. The resin is injected into the internal space 40 from the resin injection port. At this time, the resin is filled in the remaining portion excluding the core pin 1 and the electronic component and the substrate 30, which is a shield in the internal space 40. Such a filling step is performed. FIG. 7 shows the filling process.

  Finally, when the resin is cured, a separation step of separating the first mold 21 and the second mold 22 is performed, and the resin-sealed substrate 30 appears. FIG. 8 illustrates this. As a result of these, a resin-sealed substrate 30 as shown in FIG. 9 is manufactured.

  The resin-sealed type 20 provided with the core pin 1 can thus realize the use of the resin sealing method as a resin-sealed device.

  Second Embodiment

  A second embodiment will now be described. In the second embodiment, various variations will be described.

(Shape of tip of core pin)
It is also preferable that the tip 4 of the core pin 1 have a recess. FIG. 10 is a side view of the core pin in the second embodiment of the present invention. The tip 4 of the core pin 1 shown in FIG. 10 is provided with a recess 5. The tip 4 is used in the resin-sealed mold 20 by contacting with the corresponding member as described in FIG. 4 and the like. The corresponding member is a plate member of the form and a pair of opposing core pins 1.

  In this contact, it is required that the leading end 4 be firmly in contact with the corresponding member to prevent the resin from entering. At this time, the provision of the concave portion 5 at the tip end 4 has an advantage that the degree of contact of the tip end 4 with the corresponding member is increased. It is because it becomes difficult to be influenced by the flatness etc. of tip part 4.

  In addition, the presence of the concave portion 5 reduces attention to air entering into the contact surface and the like, and the outer periphery of the tip portion 4 can reliably block the outside. This blocking makes it possible to reliably prevent the resin from entering the contact surface of the tip 4.

  The recess 5 preferably has at least one shape of a partial sphere shape, a conical shape, a cylindrical shape, a polygonal pyramid shape, a polygonal cylinder shape, or a combination thereof. By having any of these shapes, it is possible to prevent the formation of a gap in the outer periphery of the contact surface while raising the contact pressure.

  These recesses 5 may be provided by cutting or grinding.

  Of course, the tip 4 may have a flat shape.

(Shape of internal space)
The main body portion 2 includes the internal space 3 as described above. Due to the presence of the internal space 3, the main body 2 is flexed by the contact pressure and returned to the original state by the release of the contact pressure.

  The internal space may be in the form of a hollow in the interior of the main body 2 as shown in FIG. For this reason, it does not penetrate in the length direction of the main body 2. By being an aspect of the hollow portion, deflection can be realized while having sufficient strength.

  Alternatively, the internal space 3 may have an aspect of a through hole penetrating from the root of the main body 2 to the tip 4. With the aspect of the through hole, the internal space 3 can be easily formed in the main body 2. In addition, the internal space 3 has the form of a through hole, so that there is a merit that the concave portion 5 can be inevitably formed in the tip portion 4.

  With the internal space 4 having such various aspects, variations in ease of manufacture and use can be extended.

(Outside of body and inner diameter of internal space)
FIG. 11 is a bottom view of the core pin in the second embodiment of the present invention. The state seen from the bottom side of core pin 1 is shown.

  The core pin 1 includes a main body 2 and an internal space 3. At the bottom, an opening of the internal space 3 is present. Here, in the bottom surface cross section of the main body 2 (that is, in the state of FIG. 11), the ratio of the outer diameter of the main body 2 to the inner diameter of the internal space 3 is

    Inner diameter / outer diameter ≧ 50% (Equation 1)

  Is also suitable.

  Of course, this is an example.

  By having the relationship between the outer diameter and the inner diameter by the equation 1, it is possible that the main body portion 2 is sufficiently bent by the contact pressure applied to the distal end portion 4 while the core pin 1 has strength such as metal or alloy. it can. Similarly, the main body portion 2 can be returned to the original state by releasing the contact pressure applied to the distal end portion 4.

  Thus, by defining the ratio between the outer diameter and the inner diameter, the deflection of the main body 2 due to the contact pressure can be surely realized, and the purpose of use in the resin-sealed mold 20 can be achieved.

(Inside diameter of inner space)
The internal space 3 may be a hollow portion or a through hole. These may be formed by cutting or grinding the inside of the main body 2. Alternatively, the inner space 3 may be formed when the main body portion 2 is manufactured by a mold intended for the inner space 3.

  It is also preferable that the inner diameter of the internal space 3 has the same inner diameter from the root to the tip of the main body 2. It is because manufacture is easy if it is a form with the same inside diameter.

  Alternatively, the inner diameter of the internal space 3 in the cross section of the main body 2 may be changed in the length direction of the main body 3 (the combination direction of the resin-sealed type).

  For example, the inner diameter of the inner space at the tip end side of the main body portion 2 may be smaller than the inner diameter of the inner space 3 at the root side of the main body portion 2. In this case, there are merits in that as the distal end of the main body portion 2, the number of meat portions other than the internal space 3 increases, the response to the contact pressure applied to the distal end portion 4 increases.

  Alternatively, the inner diameter of the internal space 3 may be gradually reduced toward the distal end side of the main body 2. If the outer periphery of the inner space 3 is tapered, the inner diameter of the inner space 3 becomes smaller toward the tip end. Also in this case, there is an advantage that the response to the contact pressure applied to the tip 4 is enhanced.

  Alternatively, it is also preferable that the cross-sectional shape of the internal space 3 in the longitudinal direction of the main body portion 2 has a curved shape. In this case, the inner diameter near the center is increased, and the contact pressure applied to the tip 4 makes the main body 2 more flexible. Of course, it will be easier to return.

(Form of main body)
It is also preferable that the distal end side of the main body 2 have a tapered outer diameter. By having the tapered outer diameter, the molded product can be taken out smoothly from the mold.

  When the front end side of the main body portion 2 has a tapered outer diameter, it is also preferable that the inner space 3 also have a tapered shape along the same direction. In this case, the thickness of the meat portion in the longitudinal direction of the main body 2 can be maintained constant, and the strength at the time of bending can be secured.

  In addition, the main body portion 2 has a straight shape from the root to the middle, and preferably has a tapered shape from the middle. This is because it is possible to achieve both strength maintenance and usability. In particular, it is suitable when mounted on the first mold 21 or the second mold 22.

  Further, the main body portion 2 is inserted and mounted in insertion holes provided in the first mold 21 and the second mold 22 of the resin-sealed mold 20. At this time, it is also preferable that a portion protruding from the insertion hole has a tapered shape. At this time, a part protruding from the insertion hole may be a straight shape and a tip thereof may be a taper shape.

  In this manner, the main body 2 has various forms and the correspondence relationship with the resin-sealed mold 20 has an advantage of being able to balance the strength and the flexibility.

  As described above, the core pin 1 according to the second embodiment can be balanced in ease of contact, strength, and deflection by various variations.

  Third Embodiment

  Next, the third embodiment will be described. In the third embodiment, a resin-sealed type 20 including the core pin 1 described in the first and second embodiments, a resin sealing device including the same, and a resin sealing method will be described.

(Resin seal type)
The resin-sealed type includes the core pin 1 as described in FIG. 4 and the like of the first embodiment. The resin-sealed type is an element that constitutes a resin-sealed device. The resin mold 20 will be described with reference to FIG. FIG. 12 is a schematic view of a resin sealing device according to a third embodiment of the present invention.

  The resin mold 20 includes a first mold 21 and a second mold 22. The first mold frame 21 has a first mold mating surface 27 and a first recess 23. The second mold 22 has a second mold mating surface 28 and a second recess 24.

  Further, the first recess 23 and the second recess 24 form an internal space 40 by combining the first form 21 and the second form 22. A resin injection port (not shown in FIG. 4 and the like) for injecting a resin into the internal space 40 is provided. Furthermore, the first mold frame 22 is provided with the core pin 1 described in the first and second embodiments (hereinafter, "first core pin 1" as necessary).

  The second formwork 23 is provided with a corresponding member 41 corresponding to the first core pin 1.

  When the first mold frame 21 and the second mold frame 22 are combined, the internal space 40 is formed by combining the first mold mating surface 27 and the second mold mating surface 28. Further, the first mold mating surface 27 and the second mold mating surface 28 sandwich the substrate 30 on which the electronic component is mounted.

  The first recess 23 and the second recess 24 form an internal space 40. The circular end 4 of the first core pin 1 closely contacts the corresponding member 41. The close contact forms a shield in the internal space 40.

  The resin is injected from the resin injection port, but the injected resin is filled in the remaining portion of the internal space 40 except the first core pin 1 and the substrate 30 on which the electronic component is mounted.

  The resin-sealed mold 20 has such a configuration.

(Resin sealing device and resin sealing method)
FIG. 12 shows the resin sealing device 500. Each of FIGS. 12 to 15 shows the state before the combination of the first form 21 and the second form 22 on the left side, and on the right side of the first form 21 and the second form 22. The state after combination is shown.

  The resin sealing device 500 of FIG. 12 includes a mold clamping mechanism 510 in addition to the above-described resin sealing mold 20. The clamping mechanism 510 clamps the first mold 21 and the second mold 22 in combination. Conversely, the combined first mold 21 and second mold 22 can be separated.

  Thus, the resin sealing device 500 is configured by providing the mold clamping mechanism unit 510 in the resin sealing mold 20. A resin supply may be provided as needed.

  Through holes 52 are formed in the substrate 30 by the resin sealing method using the resin sealing device 500, and resin sealing is performed. The resin sealing method comprises the following steps.

  First, an installation step of installing the substrate 30 on which the electronic component is mounted between the first mold 21 and the second mold 22 is performed. As described above, in FIG. 12 and the like, the illustration of the electronic components is omitted for easy viewing of the drawing. In addition, the substrate 30 is also partially omitted between the first mold 21 and the second mold 22. These are actually present between the first mold 21 and the second mold 22 and included in the internal space 40.

  Next, a combination step of combining the first mold 21 and the second mold 22 is performed by the mold clamping mechanism.

  Next, a sandwiching step of sandwiching the substrate 30 on which the electronic component is mounted is performed by the first mold mating surface 27 of the first mold 21 and the second mold mating surface 28 of the second mold 22.

  Here, although not shown, the resin-sealed mold 20 is provided with a resin injection port for injecting a resin into the internal space 40. The resin is injected into the internal space 40 from the resin injection port. At this time, the resin is filled in the remaining portion excluding the core pin 1 and the electronic component and the substrate 30, which is a shield in the internal space 40. Such a filling step is performed.

  Finally, when the resin is cured, a separation step of separating the first mold 21 and the second mold 22 is performed, and the resin-sealed substrate 30 appears. The state is as shown in FIG.

  Here, the resin sealing device 500 has various variations depending on the type of the corresponding member 41 provided in the second mold 23. The aspect according to this variation is shown by each of FIGS. 12-15.

(Variation 1: Fig. 12)
FIG. 12 shows the case where the corresponding member 41 is the surface of the second recess 24 of the second form 22. The first mold frame 21 is a mold provided with a first core pin 1 (a core pin having the inside 3 described in the first and second embodiments). The corresponding member 41 is the surface of the second recess 24.

  Therefore, when the first mold frame 21 and the second mold frame 22 are combined by the mold clamping mechanism 510, the tip 4 of the first core pin 1 is in close contact with the surface of the second recess 24, which is the corresponding member 41. To touch.

  With such a configuration, when the first form 21 and the second form 22 are combined, they are as shown on the right side of FIG. The through hole 52 formed after resin sealing is formed by the first core pin 1 on the right side of FIG.

  In the resin sealing device 500, when it is desired to reduce the cost of the mold or supplement the through holes 52, a variation as shown in FIG. 12 is suitable. Also in the resin sealing method, the resin sealing device 500 of FIG. 12 is used. That is, the resin is filled in a state where the tip 4 of the first core pin 1 and the surface of the second recess 24 are in close contact with each other.

(Variation 2: Fig. 13)
FIG. 13 is a schematic view of a resin sealing device in Variation 2 of Embodiment 3 of the present invention. In the resin sealing device 500 of FIG. 13, a short (short) conventional core pin 200 is used as the corresponding member 41.

  For this reason, when the first form 21 and the second form 22 are combined, the end 4 of the first core pin 1 comes in close contact with the end of the core pin 200. The right side of FIG. 13 shows this state. The closely-contacted first core pin 1 and the core pin 200 serve as a shield to form the through hole 52.

  Since a combination of two core pins can form the shape of the through hole 52, when it is desired to form such a through hole 52, a variation as shown in FIG. 13 is used. The resin sealing apparatus 500 of FIG. 13 is used for the resin sealing method, and resin sealing is performed.

(Variation 3: Fig. 14)
FIG. 14 is a schematic view of a resin sealing device according to Variation 3 of Embodiment 3 of the present invention.

  In FIG. 14, the core pin 200 of the prior art is used as the corresponding member 41. The core pin 200 is taller (longer) than in the case of FIG. The core pin 200 has a height identified as the first core pin 1. When the first form 21 and the second form 22 are combined, the tip 4 of the first core pin 1 comes in close contact with the tip of the core pin 200.

  Since the second mold 22 includes the core pin 200, the variation of FIG. 14 can be realized.

  At this time, the first core pin 1 is shrunk by the internal space 3 as in the other variations. For this reason, the degree of adhesion and the degree of fitting of the formwork both increase. By these, resin sealing can be appropriately performed while forming the through holes 52. That is, it is possible to prevent burrs from being generated in the through holes 52 and to prevent the protruding portions from being formed in the mating portions of the molds.

  By using tall core pins 200, the through holes 52 can be formed as such. Alternatively, it is possible to realize the resin sealing device 500 that achieves cost reduction with the combination with the second mold 22 of the prior art.

(Variation 4: Fig. 15)
FIG. 15 is a schematic view of a resin sealing device in a variation 4 of the third embodiment of the present invention.

  In FIG. 15, the core pin 1 (hereinafter, "second core pin 1A") described in the first and second embodiments is used as the corresponding member 41. That is, the second mold 22 includes the second core pin 1A, which is the same core pin 1 as the first mold 21.

  As a result, as described with reference to FIGS. 4 to 8, the end 4 of the first core pin 1 and the end of the second core pin 1A come in close contact with each other. By this close contact, the first core pin 1 and the second core pin 1A can form the through holes 52.

  Both the first core pin 1 and the second core pin 1A can be shrunk by the internal space 3, so that the degree of fitting of the formwork and the degree of adhesion between the core pins can be compatible. As a result, it is possible to prevent resin burrs and protrusion.

  As described above, the resin sealing device 500 has various variations. This is the same as the resin-sealed mold 20. By using each of these resin sealing devices 500, a resin sealing method can be realized.

  In addition, the core pin for resin-sealed type demonstrated in Embodiment 1-3 is an example which illustrates the meaning of this invention, and includes the deformation | transformation and the remodeling in the range which does not deviate from the meaning of this invention.

DESCRIPTION OF SYMBOLS 1 core pin 2 main body 3 inner space 4 tip 5 recess 20 resin-sealed type 21 first form 22 22 second form 23 first recess 24 second recess 30 substrate 40 inner space 50 resin 51 resin layer 100 sealed type 200 core pin 500 resin sealing device 510 type tightening mechanism

Claims (10)

A first mold having a first mold mating surface and a first recess;
A second mold which is combined with the first mold and has a second mold mating surface and a second recess;
A resin injection port for injecting a resin into an internal space formed by the first recess and the second recess by combining the first form and the second form;
A first core pin provided on the first formwork,
And a corresponding member corresponding to the first core pin provided on the second formwork,
When the first form and the second form are combined,
The first mold mating surface and the second mold mating surface sandwich a substrate on which an electronic component is mounted,
The first recess and the second recess form the internal space,
The tip of the first core pin comes in close contact with the corresponding member,
The resin injected from the resin injection port is filled in the remaining portion of the internal space excluding the substrate on which the first core pin, the corresponding member, and the electronic component are mounted .
The first core pin is
Body part,
An internal space inside the main body portion along a combination direction of the first form and the second form;
A distal end of the main body, the distal end being capable of contacting the corresponding member;
The movement of the first form and the second form in the combination direction brings the tip into contact with the corresponding member,
The resin-sealed type , wherein the internal space can bend the main body by a contact pressure at the contact of the tip . The corresponding member is
The surface of the second recess,
The general purpose core pin provided in the second mold frame or said first core pin provided in the second-type frame, which is, according to claim 1, resin sealing die according. A first mold having a first mold mating surface and a first recess;
A second mold which is combined with the first mold and has a second mold mating surface and a second recess;
A resin injection port for injecting a resin into an internal space formed by the first recess and the second recess by combining the first form and the second form;
A first core pin provided on the first formwork,
A second core pin provided on the second formwork,
When the first form and the second form are combined,
The first mold mating surface and the second mold mating surface sandwich a substrate on which an electronic component is mounted,
The first recess and the second recess form the internal space,
The tip of the first core pin comes in close contact with the tip of the second core pin,
The resin injected from the resin injection port is filled in the remaining portion of the internal space excluding the substrate on which the first core pin and the second core pin and the electronic component are mounted.
Each of the first core pin and the second core pin is
Body part,
An internal space inside the main body portion along a combination direction of the first form and the second form;
The distal end portion of the main body portion, the distal end portion being in contact with the distal end of the corresponding first core pin or the second core pin,
The tip end of the first core pin and the tip end of the second core pin are in contact with each other by the movement of the first form and the second form in the combination direction.
The resin-sealed type , wherein the internal space is capable of bending the main body portion by a contact pressure at the contact between the tip end portions . When the contact pressure is applied, the internal space is flexed so as to contract the main body in the combination direction, and when the contact pressure is released, the main body is returned to the original state. The resin-sealed type according to any one of Items 1 to 3. The resin-sealed mold according to any one of claims 1 to 4, wherein the tip portion has a flat shape or a recess. The resin-sealed mold according to any one of claims 1 to 5, wherein the internal space is a through hole penetrating from a root of the main body to the distal end, or a hollow portion inside the main body. The resin-sealed mold according to any one of claims 1 to 6, wherein an inner diameter of the internal space in a cross section of the main body changes in the combination direction of the main body . The resin-sealed type according to any one of claims 1 to 7, wherein a distal end side of the main body portion has a tapered outer diameter. The resin-sealed type according to any one of claims 1 to 8 ,
A resin sealing device, comprising: a mold clamping mechanism capable of clamping a combination of the first mold and the second mold. A resin sealing method for a resin sealing object using the resin sealing device according to claim 9 ,
A substrate setting step of setting a substrate on which the electronic component is mounted between the first form and the second form;
Combining the first mold and the second mold by the mold clamping mechanism;
A holding step of holding a substrate on which the electronic component is mounted by the first mold mating surface and the second mold mating surface;
And filling the resin from the resin injection port to the remaining portion of the internal space excluding the first core pin, the corresponding member, and the substrate on which the electronic component is mounted.