JP2019143078A - Pressure sensitive adhesive composition, pressure sensitive adhesive obtained by crosslinking the same, pressure sensitive adhesive for masking film, masking film, self-adhesive film for step of forming transparent electrode layer, tape for step of producing semiconductor, method for using masking film - Google Patents

Abstract

To provide a pressure sensitive adhesive composition which has excellent rapid curability while having a sufficient pot life, has a less rise in adhesion after use under a high-temperature condition, can be peeled by small force and at a high speed, is further inhibited from causing a stain when being peeled from an adherend, and can be used in a masking film or the like.SOLUTION: The pressure sensitive adhesive composition includes an acrylic resin (A), an isocyanate-based crosslinking agent (B), a metallic crosslinking catalyst (C), and a crosslinking retarder (D). In the pressure sensitive adhesive composition, the glass transformation temperature of the acrylic resin (A) is higher than -50°C.SELECTED DRAWING: None

Description

  The present invention relates to a pressure-sensitive adhesive composition, a pressure-sensitive adhesive obtained by crosslinking this, a pressure-sensitive adhesive for masking film, a masking film, a pressure-sensitive adhesive film for forming a transparent electrode layer, a tape for semiconductor manufacturing process, and a method for using a masking film. is there. Specifically, the pressure-sensitive adhesive composition that can be used for a masking film or the like that has a sufficient pot life, has excellent immediate curing properties, and has excellent heat resistance and high-speed peelability, and the pressure-sensitive adhesive composition , A pressure sensitive adhesive for masking film made of the pressure sensitive adhesive, a masking film having a pressure sensitive adhesive layer made of the pressure sensitive adhesive on the film, a pressure sensitive adhesive film for forming a transparent electrode layer, and a tape for semiconductor manufacturing process And a method of using the masking film.

Conventionally, a re-peelable adhesive film has been used to temporarily fix and protect members when processing various members. In recent years, for example, circuit boards such as flexible printed wiring (FPC) boards and ITO For example, it is used as a masking film for temporarily protecting the surface of a transparent electrode layer such as a surface protecting adhesive film such as a flat panel display or a touch panel.
However, the annealing process and the wiring formation process include a process in which a protective film is applied to a transparent electrode layer such as an FPC board or ITO, and the adhesive layer of the adhesive film adheres to the laminate. In other words, when the adhesive film is peeled off, contamination due to adhesive residue may occur, or the FPC board or the laminated plate of the transparent electrode layer may be damaged. For this reason, even after a high temperature process, it is required that the adhesive can be peeled off with a light force without any adhesive residue.

  In addition, the pressure-sensitive adhesive in the re-peelable pressure-sensitive adhesive film has good releasability such as no adherend adherence, and particularly when used as an industrial pressure-sensitive adhesive film, it peels at a high speed. It is necessary to reduce the load on the adherend and to improve the workability and the balance between the properties of the high-speed peelability and the above physical properties. Various studies have been made to achieve such a requirement.

On the other hand, during the production of the pressure-sensitive adhesive film, in order to sufficiently cure (crosslink) the pressure-sensitive adhesive layer, the pressure-sensitive adhesive composition is applied on the base film to form the pressure-sensitive adhesive layer, and then allowed to stand for a certain period of time. It is necessary to perform aging processing. Here, if it takes time for the aging treatment, the adhesive layer follows the fine irregularities on the surface of the base film or the release film, and the adhesive film has irregularities on the surface of the adhesive layer. End up.
When such an adhesive film is used for surface protection of, for example, a flat panel display or a touch panel, the unevenness on the surface of the adhesive layer is transferred to an optical film on the surface of the adherend, such as a flat panel display. Depending on the field of application, such as reduced visibility, defects may occur even with slight irregularities.
Therefore, the following pressure-sensitive adhesive composition is known as a pressure-sensitive adhesive composition that shortens the aging time (in other words, has excellent quick-curing properties) by proceeding with crosslinking immediately after coating, and has little change in adhesive force. It has been.

  In Patent Document 1, 100 parts by mass of an acrylic polymer (A) containing a hydroxyl group and a carboxyl group, 0.1 to 15 parts by weight of an isocyanate-based crosslinking agent (B), and a catalyst (C) 0 having iron as an active center 0.002 parts by mass to 0.5 parts by mass, a pressure-sensitive adhesive composition containing a compound (D) that causes keto-enol tautomerism, and has keto-enol tautomerism with respect to a catalyst (C) having iron as an active center A pressure-sensitive adhesive composition in which the weight ratio (D / C) of the compound (D) to be raised is 3 to 70 is disclosed, and according to the pressure-sensitive adhesive composition, crosslinking proceeds rapidly without using a tin compound. It is described that there is little change in force.

  Patent Document 2 discloses that a (meth) acrylic polymer (A) obtained by polymerizing a monomer component having a glass transition temperature of −50 ° C. or lower and containing an alkyl (meth) acrylate and a hydroxyl group-containing monomer, isocyanate A pressure-sensitive adhesive composition containing a system cross-linking agent (B) and a catalyst (C) having iron as an active center is disclosed. According to the pressure-sensitive adhesive composition, the occurrence of glue surface irregularities and the occurrence of zipping It is described that it can be suppressed.

JP-A-2015-000945 Japanese Patent Laying-Open No. 2015-048394

  However, in the techniques of Patent Document 1 and Patent Document 2, although the crosslinking reaction is promoted to suppress deformation of the pressure-sensitive adhesive layer, a pressure-sensitive adhesive layer having a high level and excellent high-speed peelability is currently required. Therefore, it is considered that such high-level requirements cannot be fully met. In addition, there was no one that satisfactorily satisfied the balance between suppression of increase in adhesive strength with time, peelability (contamination resistance to adherend) and high-speed peelability.

  Therefore, the present invention, under such a background, while having a sufficient pot life, is excellent in immediate curing, has little increase in adhesive strength after use under high temperature conditions, and can be peeled off with a small force, The object of the present invention is to provide a pressure-sensitive adhesive composition that can be suitably used for a masking film and the like that hardly cause contamination when peeled off from an adherend and is excellent in high-speed peelability.

  However, as a result of intensive studies in view of such circumstances, the present inventor contains a metal-based crosslinking catalyst (C) together with the isocyanate-based crosslinking agent (B) in the pressure-sensitive adhesive composition using the acrylic resin (A). Furthermore, the present inventors have found that a pressure-sensitive adhesive composition that solves the above-mentioned problems can be obtained by adjusting the glass transition temperature of the acrylic resin (A) to be in a specific range, thereby completing the present invention.

  That is, the gist of the present invention is a pressure-sensitive adhesive composition containing an acrylic resin (A), an isocyanate-based crosslinking agent (B), a metal-based crosslinking catalyst (C), and a crosslinking retarder (D). It is a pressure-sensitive adhesive composition characterized in that the glass transition temperature of the system resin (A) is higher than -50 ° C.

The gist of the present invention is that the pressure-sensitive adhesive is crosslinked with the isocyanate-based crosslinking agent (B) of the pressure-sensitive adhesive composition of the present invention, and the masking film comprising the pressure-sensitive adhesive of the present invention. A masking film having a pressure-sensitive adhesive layer made of the pressure-sensitive adhesive of the present invention on a film, a pressure-sensitive adhesive film for forming a transparent electrode layer, a tape for semiconductor manufacturing process, and a method for using the masking film It is also related.
Hereinafter, the masking film, the transparent electrode layer forming step adhesive film, and the transparent electrode layer forming step adhesive film are also collectively referred to as “masking film or the like”.

  In general, an acrylic resin having a high glass transition temperature is preferably used as an adhesive for a masking film in order to smoothly peel off a masking film or the like attached to the adherend from the adherend even at high speed. On the other hand, when including a step of using a masking film or the like under high temperature conditions, the acrylic resin tends to adhere to the adherend and increase the adhesive force, so the increase in adhesive force after heating is small and the masking film For example, a soft acrylic resin, that is, an acrylic resin having a low glass transition temperature is preferably used. Accordingly, it is considered that it is difficult to achieve both high-speed peelability of a masking film and the like and to reduce the increase in adhesive strength after use under high temperature conditions. The inventors have found that even if the glass transition temperature is higher than a predetermined temperature, the high-speed peelability is good, but the increase in adhesive strength after use under high-temperature conditions can be suppressed.

  According to the pressure-sensitive adhesive composition of the present invention and the pressure-sensitive adhesive obtained by crosslinking the same, when it is cured (cross-linked) while having a sufficient pot life, it has a very excellent immediate curing property. The surface of the pressure-sensitive adhesive layer can be formed without transferring the uneven shape of the substrate film or the release film having fine unevenness, and further peeled from the adherend after being used under high temperature conditions. The pressure-sensitive adhesive of the present invention is particularly useful as a pressure-sensitive adhesive for a masking film.

The present invention will be described in detail below, but these show examples of desirable embodiments. In the present specification, (meth) acryl means acryl or methacryl, (meth) acryloyl means acryloyl or methacryloyl, and (meth) acrylate means acrylate or methacrylate.
In the present invention, the “film” conceptually includes a sheet, a film, and a tape.

<Adhesive composition>
The pressure-sensitive adhesive composition of the present invention contains an acrylic resin (A), an isocyanate-based crosslinking agent (B), a metal-based crosslinking catalyst (C), and a crosslinking retarder (D).

[Acrylic resin (A)]
The hydroxyl group-containing acrylic resin (A) used in the present invention is characterized by having a glass transition temperature higher than −50 ° C., preferably −45 ° C. or higher, particularly preferably −40 ° C. or higher, and Preferably it is -35 degreeC or more. In addition, the glass transition temperature of acrylic resin (A) is 10 degrees C or less normally, Preferably it is 5 degrees C or less, Most preferably, it is 0 degrees C or less.
If the glass transition temperature is too low, the high-speed peelability is lowered. If the glass transition temperature is too high, the adhesive strength after the heating step tends to increase, or the adhesive performance tends not to be obtained.

Ｔｇ：共重合体のガラス転移温度（Ｋ）
Ｔga：モノマーＡのホモポリマーのガラス転移温度（Ｋ） Ｗａ：モノマーＡの重量分率
Ｔgb：モノマーＢのホモポリマーのガラス転移温度（Ｋ） Ｗｂ：モノマーＢの重量分率
Ｔgn：モノマーＮのホモポリマーのガラス転移温度（Ｋ） Ｗｎ：モノマーＮの重量分率
（Ｗａ＋Ｗｂ＋・・・＋Ｗｎ＝１） The glass transition temperature is calculated from the following Fox equation.

Tg: Glass transition temperature of copolymer (K)
Tga: Glass transition temperature (K) of monomer A homopolymer Wa: Weight fraction of monomer A Tgb: Glass transition temperature of homopolymer of monomer B (K) Wb: Weight fraction of monomer B Tgn: Homogeneity of monomer N Glass transition temperature (K) of polymer Wn: weight fraction of monomer N (Wa + Wb +... + Wn = 1)

That is, it is a value calculated by applying the glass transition temperature and the weight fraction to the Fox equation when the homopolymer of each monomer constituting the acrylic resin is used.
In addition, the glass transition temperature at the time of setting it as the homopolymer of the monomer which comprises acrylic resin is normally measured with a differential scanning calorimeter (DSC).

  The acrylic resin (A) used in the present invention is obtained by polymerizing a polymerization component containing the (meth) acrylic acid alkyl ester monomer (a1) as an essential component, preferably further a hydroxyl group-containing monomer ( a2) is contained as a polymerization component, and if necessary, a polymerization component containing a functional group-containing monomer (a3) other than the hydroxyl group-containing monomer (a2) and other polymerizable monomer (a4) as a polymerization component is polymerized as necessary. Is obtained.

  In the (meth) acrylic acid alkyl ester monomer (a1) used in the present invention, the carbon number of the alkyl group is usually 1 to 20, preferably 1 to 12, particularly preferably 1 to 8. If the carbon number is too large, adherend contamination after the heating step tends to increase.

Specifically, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, iso-butyl (meth) acrylate, tert-butyl (meth) acrylate , N-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, iso-octyl acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, cetyl (meth) acrylate, n- Examples include stearyl (meth) acrylate and iso-stearyl (meth) acrylate.
These can be used alone or in combination of two or more.
Among these, as the (meth) acrylic acid ester monomer (a1), methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, iso-butyl (meth) acrylate, tert-butyl (meth) C1-C8 aliphatic (meth) acrylic acid esters of alkyl groups such as) acrylate, n-propyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and the like are preferable.

The content of the (meth) acrylic acid alkyl ester monomer (a1) in the polymerization component is usually 40 to 99.9% by weight, preferably 45 to 99% by weight, particularly preferably 50 to 98% by weight. is there. When the content is too small, the adhesive strength after the heating step tends to be too high, and when it is too large, adherend contamination after the heating step tends to increase.
Further, in the (meth) acrylic acid alkyl ester monomer (a1), the content of the alkyl group having 1 to 8 carbon atoms (meth) acrylic acid alkyl ester monomer is 80% by weight or more after the heating step. It is preferable in terms of excellent adherence stain resistance, particularly preferably 85% by weight or more, more preferably 90% by weight or more, and particularly preferably 95% by weight or more.

Examples of the hydroxyl group-containing monomer (a2) include a primary hydroxyl group-containing monomer, a secondary hydroxyl group-containing monomer, and a tertiary hydroxyl group-containing monomer. Examples of the primary hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 5-hydroxypentyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, and 8-hydroxyoctyl. Hydroxyalkyl esters of acrylic acid such as (meth) acrylate; caprolactone-modified monomers such as caprolactone-modified 2-hydroxyethyl (meth) acrylate; oxyalkylene-modified monomers such as diethylene glycol (meth) acrylate and polyethylene glycol (meth) acrylate; -Acryloyloxyethyl-2-hydroxyethylphthalic acid and the like. Examples of the secondary hydroxyl group-containing monomer include 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-chloro 2-hydroxypropyl (meth) acrylate, and the like. Examples of the tertiary hydroxyl group-containing monomer include 2,2-dimethyl 2-hydroxyethyl (meth) acrylate and the like.
These hydroxyl group-containing monomers (a2) can be used alone or in combination of two or more.
Among the above hydroxyl group-containing monomers, it is preferable to use a primary hydroxyl group-containing monomer in terms of excellent reactivity with the isocyanate-based crosslinking agent (B), particularly 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl. It is preferable to use (meth) acrylate.

  The content of the hydroxyl group-containing monomer (a2) in the polymerization component is preferably 0.1 to 30% by weight, particularly preferably 1 to 25% by weight, and further preferably 2 to 20% by weight. If the content is too large, crosslinking proceeds before the drying step, causing problems in coatability, or the resin tends to be too hard to float between the adherends, and too little. There is a tendency that the degree of cross-linking decreases and adherend contamination increases.

  In addition, as the hydroxyl group-containing monomer (a2) used in the present invention, it is also preferable to use an impurity having a content ratio of di (meth) acrylate of 0.5% or less, particularly 0.2% or less. Further, it is preferable to use a material of 0.1% or less.

  Examples of the functional group-containing monomer (a3) other than the hydroxyl group-containing monomer (a2) include a carboxyl group-containing monomer, an acetoacetyl group-containing monomer, an isocyanate group-containing monomer, a glycidyl group-containing monomer, an amino group-containing monomer, and an amide group-containing And monomers.

  Examples of the carboxyl group-containing monomer include (meth) acrylic acid, acrylic acid dimer, crotonic acid, maleic acid, maleic anhydride, fumaric acid, citraconic acid, glutaconic acid, itaconic acid, acrylamide N-glycolic acid, and cinnamon. (Meth) acrylic acid is preferably used because it has excellent copolymerizability, but when used for a metal substrate, it is preferable not to contain a carboxyl group from the viewpoint of preventing corrosion. .

  Examples of the acetoacetyl group-containing monomer include 2- (acetoacetoxy) ethyl (meth) acrylate and allyl acetoacetate.

  Examples of the isocyanate group-containing monomer include 2-acryloyloxyethyl isocyanate, 2-methacryloyloxyethyl isocyanate, and alkylene oxide adducts thereof.

  Examples of the glycidyl group-containing monomer include glycidyl (meth) acrylate, allyl glycidyl (meth) acrylate, and the like.

Examples of the amino group-containing monomer include monomers having an ethylenically unsaturated double bond and an amino group (unsubstituted or substituted amino group), such as aminomethyl (meth) acrylate, aminoethyl (meth) acrylate, N-alkylaminoalkyl (meth) acrylates such as aminopropyl (meth) acrylate, aminoalkyl (meth) acrylate such as aminoisopropyl (meth) acrylate, and N- (t-butyl) aminoethyl (meth) acrylate Mono-substituted amino group-containing (meth) acrylic acid ester such as acrylic acid ester; (meth) acrylic acid N, N-dimethylaminoethyl, (meth) acrylic acid N, N-diethylaminoethyl, (meth) acrylic acid N, N -(Meth) acrylic acid esters of N, N-dialkylaminoalkyl such as dimethylaminopropyl Disubstituted amino group-containing (meth) acrylic acid esters; quaternized salts of these amino group-containing monomers; amino group-containing styrenes such as p-aminostyrene; 3- (dimethylamino) styrene, dimethylaminomethylstyrene Styrenes having a dialkylamino group such as: dialkylaminoalkyl vinyl ethers such as N, N-dimethylaminoethyl vinyl ether and N, N-diethylaminoethyl vinyl ether; allylamine, 4-diisopropylamino-1-butene, trans-2-butene -1,4-diamine, 2-vinyl-4,6-diamino-1,3,5-triazine and the like.
In the present specification, a monomer having an ethylenically unsaturated double bond and an amino group (unsubstituted or substituted amino group) and having an amide group (group having an amide bond) is described below. Included in the amide group-containing monomer.

  Examples of the amide group-containing monomer include monomers having an ethylenically unsaturated double bond and an amide group (group having an amide bond), such as (meth) acrylamide; N-methyl (meth) acrylamide, N-ethyl. (Meth) acrylamide, N-propyl (meth) acrylamide, N-isopropyl (meth) acrylamide, Nn-butyl (meth) acrylamide, N-isobutyl (meth) acrylamide, Ns-butyl (meth) acrylamide, N -T-butyl (meth) acrylamide, N-hexyl (meth) acrylamide, diacetone (meth) acrylamide, N, N'-methylenebis (meth) acrylamide, N- (1,1-dimethyl-3-oxobutyl) (meta ) N-alkyl (meth) acrylics such as acrylamide N, N-dimethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, N, N-dipropyl (meth) acrylamide, N, N-diisopropyl (meth) acrylamide, N, N-di (n- Butyl) (meth) acrylamide, N, N-diisobutyl (meth) acrylamide, N, N-di (s-butyl) (meth) acrylamide, N, N-di (t-butyl) (meth) acrylamide, N, N -Dipentyl (meth) acrylamide, N, N-dihexyl (meth) acrylamide, N, N-diheptyl (meth) acrylamide, N, N-dioctyl (meth) acrylamide, N, N-diallyl (meth) acrylamide, N, N -N, N-dialkyl (meth) acrylamide such as ethylmethylacrylamide; N, N-dimethyla Dialkylaminoalkyl (meth) acrylamides such as minopropyl (meth) acrylamide; substituted amide group-containing monomers such as N-vinylacetamide, N-vinylformamide, (meth) acrylamide ethylethylene urea, (meth) acrylamide t-butylsulfonic acid; Hydroxyl group-containing (meth) acrylamides such as N-methylol (meth) acrylamide, N-hydroxyethyl (meth) acrylamide, N-methylolpropane (meth) acrylamide; N-methoxymethyl (meth) acrylamide, N- (n-butoxy Examples thereof include alkoxy group-containing (meth) acrylamides such as methyl) (meth) acrylamide; quaternized salts of these amide group-containing monomers.

These functional group-containing monomers (a3) other than the hydroxyl group-containing monomer (a2) may be used alone or in combination of two or more.
Among these, in the present invention, it is preferable to contain a functional group-containing monomer containing a nitrogen atom from the viewpoint of crosslinking promotion effect, particularly preferably an amino group-containing monomer, an amide group-containing monomer, and more preferably dimethylamino. Ethyl (meth) acrylate, diethylaminoethyl methacrylate, dimethylaminopropyl (meth) acrylamide, dimethyl (meth) acrylamide, particularly preferably dimethylaminopropyl acrylamide.

  The content of the functional group-containing monomer (a3) other than the hydroxyl group-containing monomer (a2) in the polymerization component is usually 30% by weight or less, preferably 20% by weight or less, particularly preferably 15% by weight or less. If the content is too large, crosslinking proceeds before the drying step, causing problems in coating properties, and the resin is too hard and tends to float between the adherend.

  When the functional group-containing monomer (a3) other than the hydroxyl group-containing monomer (a2) contains an amino group-containing monomer and / or an amide group-containing monomer, the content ratio of the monomer in the polymerization component is preferably 0.001. -30% by weight, particularly preferably 0.005-5% by weight, more preferably 0.01-2% by weight. If the content is too large, the molecular weight tends to decrease or increase during polymerization or the pressure-sensitive adhesive tends to be colored, and if it is too small, the crosslinking accelerating effect tends not to be sufficiently obtained.

As other copolymerizable monomer (a4), for example,
(Meth) acrylic acid containing aromatic rings such as phenyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, phenyldiethylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate Ester monomers;
It has an alicyclic structure such as cyclohexyl (meth) acrylate, cyclohexyloxyalkyl (meth) acrylate, t-butylcyclohexyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate (meta) ) Acrylic acid ester monomers;
Biphenyloxy structure-containing (meth) acrylic acid ester monomers such as biphenyloxyethyl (meth) acrylate;
Alkoxy such as 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, and polypropylene glycol mono (meth) acrylate (Meth) acrylic acid ester monomers containing a group or an oxyalkylene group;
Styrene, α-methylstyrene, acrylonitrile, methacrylonitrile, vinyl acetate, vinyl propionate, vinyl stearate, vinyl chloride, vinylidene chloride, alkyl vinyl ether, vinyl toluene, vinyl pyridine, vinyl pyrrolidone, dialkyl itaconic acid, dialkyl fumarate Examples include esters, allyl alcohol, acrylic chloride, methyl vinyl ketone, allyl trimethyl ammonium chloride, dimethyl allyl vinyl ketone, and the like.
These can be used alone or in combination of two or more.

  The content of the other copolymerizable monomer (a4) in the polymerization component is usually 40% by weight or less, preferably 30% by weight or less, particularly preferably 25% by weight or less. When there is too much content, there exists a tendency for an adhesive characteristic to fall easily.

  In the polymerization of the acrylic resin (A), for example, conventionally known methods such as solution radical polymerization, suspension polymerization, bulk polymerization, and emulsion polymerization can be employed. Among these, solvent-based acrylic resins obtained by solution radical polymerization are preferable in that an acrylic resin composition can be produced safely and stably with an arbitrary monomer composition. For example, in the organic solvent, the above (meth) acrylic acid alkyl ester monomer (a1), preferably further a hydroxyl group-containing monomer (a2), and if necessary, a functional group-containing monomer (a3) other than the hydroxyl group-containing monomer (a2) ), A solvent-based acrylic resin obtained by mixing or dropping a polymerization component containing a polymerizable monomer (a4) and a polymerization initiator and performing polymerization at reflux or 50 to 99 ° C. for 2 to 20 hours is preferable. .

  About the weight average molecular weight of acrylic resin (A) of this invention, it is 100,000-2 million normally, Preferably it is 200,000-2,200,000, Especially preferably, it is 400,000-2 million. If the weight average molecular weight is too large, a large amount of diluent solvent is required, which tends to be disadvantageous in terms of coating properties and cost. If it is too small, the heat resistance of the pressure-sensitive adhesive layer decreases and adherend contamination increases. Tend.

  The degree of dispersion (weight average molecular weight / number average molecular weight) of the acrylic resin (A) is, for example, usually 20 or less, preferably 15 or less, particularly preferably 10 or less, and the lower limit is usually 1.1. is there. If the degree of dispersion is too high, the heat resistance of the pressure-sensitive adhesive layer tends to decrease, and foaming and the like tend to occur.

In addition, said weight average molecular weight is a weight average molecular weight by standard polystyrene molecular weight conversion, and it is a column in a high performance liquid chromatography (The Japan Waters company, "Waters 2695 (main body)" and "Waters 2414 (detector)"). : Shodex GPC KF-806L (exclusion limit molecular weight: 2 × 10 ⁷ , separation range: 100 to 2 × 10 ⁷ , theoretical plate number: 10,000 plates / piece, filler material: styrene-divinylbenzene copolymer, filler The particle diameter is measured by using three series of 10 μm), and the same method can be used for the number average molecular weight. The degree of dispersion is determined from the weight average molecular weight and the number average molecular weight.
In the measurement, the polymer may be derivatized, or the type of the eluent may be appropriately changed.

Moreover, it is preferable that the acrylic resin (A) used in the present invention does not substantially contain an acid, whereby corrosion of an adherend such as a metal can be reduced. Here, “substantially free of acid” specifically means that the acid value is preferably 1 mgKOH / g or less, particularly preferably 0.5 mgKOH / g or less, more preferably 0.1 mgKOH / g. Means the following:
In addition, the acid value in this invention shows the acid value with respect to solid content of an acrylic resin component (A), and can be calculated | required by calculation.

The acrylic resin (A) used in the present invention preferably has a hydroxyl value of 1 to 70 mgKOH / g, particularly preferably 5 to 60 mgKOH / g, and more preferably 10 to 50 mgKOH / g. If the hydroxyl value is too high, the three-dimensional structure becomes too dense at the synthesis stage, a sudden increase in viscosity occurs, and the gel tends to gel during the production of the acrylic resin (A). If the hydroxyl value is too low, The hardness of the coating surface after curing tends to be lowered.
The hydroxyl value in the present invention can be determined by calculation.

  The content of the acrylic resin (A) is preferably 30 to 99% by weight, particularly preferably 40 to 98.5% by weight, more preferably 50 to 98% by weight, based on the total amount of the pressure-sensitive adhesive composition. It is.

[Isocyanate-based crosslinking agent (B)]
In the pressure-sensitive adhesive composition of the present invention, it is important that the isocyanate-based crosslinking agent (B) is contained as a crosslinking agent in order to increase reactivity and improve heat resistance.

As said isocyanate type crosslinking agent (B), for example,
Aromatic diisocyanates such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, diphenylmethane diisocyanate, 1,5-naphthylene diisocyanate, tolidine diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate;
Cycloaliphatic diisocyanates such as isophorone diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated diphenylmethane diisocyanate, dimer acid diisocyanate, norbornene diisocyanate, trans-cyclohexane diisocyanate, hydrogenated tolylene diisocyanate;
Aliphatic isocyanates such as hexamethylene diisocyanate;
Etc.
Furthermore, adduct bodies of these polyisocyanate compounds and polyol compounds such as trimethylolpropane, burette bodies and isocyanurate bodies of these polyisocyanate compounds can be mentioned.

  Among them, isocyanurate of hexamethylene diisocyanate and 2,4-tolylene diisocyanate in that the increase in adhesive strength after heating is small and the adhesive residue is difficult to remove after heating (heat-resistant stain resistance). And / or an adduct of 2,6-tolylene diisocyanate and trimethylolpropane, an isocyanurate of 2,4-tolylene diisocyanate and / or 2,6-tolylene diisocyanate, tetramethylxylylene diisocyanate and trimethylolpropane The adduct body is preferable.

  The content of the isocyanate crosslinking agent (B) is preferably 0.5 to 40 parts by weight, particularly preferably 3 to 30 parts by weight, more preferably 5 to 5 parts by weight with respect to 100 parts by weight of the acrylic resin (A). 20 parts by weight. If the content of the isocyanate-based crosslinking agent is too large, the crosslinking of the pressure-sensitive adhesive proceeds excessively, and the adhesive strength is reduced. Therefore, there is a tendency to cause floating between the adherend surface. There is a tendency that the cohesive strength of the agent is reduced and the adhesive remains.

Moreover, in this invention, the other crosslinking agent normally used for an adhesive composition can also be used together in the range which does not impair the objective of this invention.
Examples of such a crosslinking agent include an epoxy-based crosslinking agent, an aziridine-based crosslinking agent, an oxazoline-based crosslinking agent, a melamine-based crosslinking agent, an aldehyde-based crosslinking agent, and an amine-based crosslinking agent.

[Metal-based crosslinking catalyst (C)]
The pressure-sensitive adhesive composition of the present invention contains a metal-based crosslinking catalyst (C) as a crosslinking catalyst. The metal-based crosslinking catalyst (C) is a catalyst having a metal as an active center, and promotes the reaction of the isocyanate-based crosslinking agent (B). It is important that the pressure-sensitive adhesive composition of the present invention contains a metal-based crosslinking catalyst (C) in that both a pot life and an immediate curing property can be achieved and a smooth pressure-sensitive adhesive layer can be obtained. A metal type crosslinking catalyst (C) can be used individually by 1 type or in combination of 2 or more types.

  As the metal-based crosslinking catalyst (C), iron compound (C1), tin compound, zinc compound, cobalt compound, copper compound, bismuth compound, titanium compound, zirconium compound, aluminum compound, nickel compound, chromium compound, manganese compound, antimony Examples thereof include iron compounds (C1).

As said iron compound (C1), an iron chelate compound can be used suitably, for example, it can represent as general formula Fe (L) (M) (N). The iron chelate compound is represented by any of Fe (L) ₃ , Fe (L) ₂ (M), and Fe (L) (M) (N) by a combination of (L) (M) (N).
In the iron chelate compound Fe (L) (M) (N), (L) (M) (N) is a ligand for Fe. For example, when L, M or N is a β-diketone, examples of the β-diketone include acetylacetone, hexane-2,4-dione, heptane-2,4-dione, heptane-3,5-dione, 5- Methyl-hexane-2,4-dione, octane-2,4-dione, 6-methylheptane-2,4-dione, 2,6-dimethylheptane-3,5-dione, nonane-2,4-dione, Nonane-4,6-dione, 2,2,6,6-tetramethylheptane-3,5-dione, tridecane-6,8-dione, 1-phenyl-butane-1,3-dione, hexafluoroacetylacetone, Examples include ascorbic acid.
When L, M or N is a β-ketoester, examples of the β-ketoester include methyl acetoacetate, ethyl acetoacetate, acetoacetate-n-propyl, isopropyl acetoacetate, acetoacetate-n-butyl, acetoacetate -Sec-butyl, acetoacetic acid-tert-butyl, propionyl acetate methyl, propionyl acetate ethyl, propionyl acetate-n-propyl, propionyl acetate isopropyl, propionyl acetate-n-butyl, propionyl acetate-sec-butyl, propionyl acetate-tert- Examples include butyl, benzyl acetoacetate, dimethyl malonate, and diethyl malonate. These iron compounds (C1) can be used alone or in combination of two or more.

  In the present invention, among these iron compounds (C1), an iron chelate compound having a β-diketone as a ligand is preferable in terms of reactivity and curability, and tris (acetylacetonato) iron is particularly preferable. .

  Specific iron compounds (C1) include, for example, “Narsem Ferric” manufactured by Nippon Chemical Industry Co., Ltd., “Nikka Octix Iron” manufactured by Nippon Chemical Industry Co., Ltd., “Tris (2, 4-Pentandionato) Iron (III), Wako Pure Chemical Industries, Ltd. “2,4-Pentandionate Iron (III)”, Sigma-Aldrich Japan GK “Iron (III) Acetylacetonate” It is done.

The content of the metal-based crosslinking catalyst (C) is preferably 0.0001 to 20 parts by weight, particularly preferably 0.0005 to 10 parts by weight, more preferably 100 parts by weight of the acrylic resin (A). 0.001 to 5 parts by weight, particularly preferably 0.005 to 1 part by weight.
If the content of the metal-based crosslinking catalyst (C) is too large, the stability of the blended solution tends to decrease, and if the content is too small, the immediate curing property decreases, and the unevenness tends to be transferred to the coating surface. There is.

[Crosslinking retarder (D)]
It is necessary for the pressure-sensitive adhesive composition of the present invention to contain a crosslinking retarder (D) from the viewpoint of maintaining a sufficient pot life and improving coatability.
The crosslinking retarder (D) is contained to adjust the activity of the metal-based crosslinking catalyst (C) and balance the pot life and curability of the pressure-sensitive adhesive composition. In the pressure-sensitive adhesive composition, the crosslinking retarder (D) acts as a chelating agent for the metal-based crosslinking catalyst (C) and blocks the metal-based crosslinking catalyst (C). Excessive viscosity increase and gelation can be suppressed, and the pot life of the pressure-sensitive adhesive composition can be extended. Then, when the crosslinking retarder (D) is volatilized by applying the pressure-sensitive adhesive composition to a substrate and drying it, the metal-based crosslinking catalyst (C) blocked by the crosslinking retarder (D) is active. And the cross-linking promoting effect is exhibited, and the cross-linking of the pressure-sensitive adhesive composition proceeds.

Examples of the crosslinking retarder (D) include β-ketoesters such as methyl acetoacetate, ethyl acetoacetate, octyl acetoacetate, oleyl acetoacetate, lauryl acetoacetate, stearyl acetoacetate, acetylacetone, and 2,4-hexanedione. And β-diketones such as benzoylacetone. These are ketoenol tautomeric compounds, and by protecting the metal-based crosslinking catalyst (C), the catalytic activity in the solution state of the metal-based crosslinking catalyst (C) is reduced. An excessive increase in viscosity and gelation can be suppressed, and the pot life of the pressure-sensitive adhesive composition can be extended.
Among these, it is preferable to use acetylacetone as the crosslinking retarder (D) from the viewpoint of the balance between pot life and immediate curing.
In addition, these crosslinking retarders (D) can be used individually by 1 type or in combination of 2 or more types.

  Specific examples of the crosslinking retarder (D) include “acetylacetone” manufactured by Daicel Corporation, “acetylacetone” manufactured by Tokyo Chemical Industry, “acetylacetone” manufactured by Wako Pure Chemical Industries, “acetylacetone” manufactured by Kishida Chemical, and the like.

Since the crosslinking retarder (D) has an effect of suppressing crosslinking, contrary to the crosslinking promotion effect of the metal-based crosslinking catalyst (C), the ratio of the crosslinking retarder (D) to the metal-based crosslinking catalyst (C). Is preferably set appropriately.
In order to prolong the pot life of the pressure-sensitive adhesive composition and not impair the immediate curing, the content ratio (weight ratio) of the crosslinking retarder (D) (solid content equivalent amount) to the metal-based crosslinking catalyst (C) ( D) / (C) is preferably 0.1 to 70, particularly preferably 0.5 to 50, more preferably 1 to 20.
If the content of the crosslinking retarder (D) is too small relative to the content of the metal-based crosslinking catalyst (C), the pot life tends to be short and the coating property tends to be lowered. Tend to.

The content of the crosslinking retarder (D) is preferably 0.001 to 30 parts by weight, particularly preferably 0.005 to 20 parts by weight, and more preferably 0 to 100 parts by weight of the acrylic resin (A). 0.01 to 10 parts by weight.
When the content of the crosslinking retarder (D) is too large, the immediate curing property tends to be lowered, and when the content is too small, the pot life tends to be shortened.

[Other ingredients]
The pressure-sensitive adhesive composition of the present invention further includes an antistatic agent, an antioxidant, a plasticizer, a filler, a pigment, a diluent, an anti-aging agent, an ultraviolet absorber, and an ultraviolet stabilizer as long as the effects of the present invention are not impaired. Further, an additive such as a tackifying resin may be further contained, and these additives may be used alone or in combination of two or more. In particular, the antioxidant is effective for maintaining the stability of the pressure-sensitive adhesive layer. The content when the antioxidant is blended is not particularly limited, but is preferably 0.01 to 5% by weight. In addition to the additives, a small amount of impurities contained in the raw materials for producing the constituent components of the pressure-sensitive adhesive composition may be contained.

  The pressure-sensitive adhesive composition of the present invention is prepared by adding an acrylic resin (A), an isocyanate-based crosslinking agent (B), a metal-based crosslinking catalyst (C), a crosslinking retarder (D), and other components as necessary. It can be prepared by blending by the method, but if the metal-based crosslinking catalyst (C) is blended before blending the crosslinking retarder (D), the crosslinking starts and gelation occurs. It is preferable to blend the crosslinking retarder (D) before blending C) or blend a mixture of the metal-based crosslinking catalyst (C) and the crosslinking retarder (D).

The gel fraction of the pressure-sensitive adhesive obtained by crosslinking the pressure-sensitive adhesive composition of the present invention with an isocyanate-based crosslinking agent (B) is usually 40 to 100%, preferably 60 to 100%, particularly preferably 80 to 100%. More preferably, it is 85 to 100%, and particularly preferably 90 to 100%.
If the gel fraction is too low, the cohesive force of the pressure-sensitive adhesive is lowered, and adhesive residue is generated, which tends to cause adherend contamination.

  The gel fraction is a measure of the degree of crosslinking and is calculated by the following method. That is, a pressure-sensitive adhesive sheet (without a release film) in which a pressure-sensitive adhesive layer is formed on a polymer sheet (such as a polyethylene terephthalate film) as a base material is wrapped in a 200-mesh SUS wire mesh, and in toluene. In the solution at 23 ° C. for 24 hours, and the weight percentage of the insoluble adhesive component remaining in the wire mesh is defined as the gel fraction. However, the weight of the substrate is calculated by subtracting.

<Adhesive, adhesive film>
The pressure-sensitive adhesive composition of the present invention can be made into a pressure-sensitive adhesive having an adhesive strength (about 2 N / 25 mm or less) of slight adhesion to low adhesion by crosslinking with an isocyanate-based crosslinking agent (B). Such an adhesive is suitably used as an adhesive for an adhesive film such as an adhesive for a masking film that is bonded to an adherend for a short period (several hours to several days) in order to temporarily protect the surface of the adherend. It is done.
Examples of the adhesive film include a masking film, a transparent electrode layer forming process adhesive film used in a transparent electrode layer forming process made of ITO, and a semiconductor manufacturing process tape used in a semiconductor manufacturing process.

  In the present invention, a pressure-sensitive adhesive film such as a masking film is obtained by preparing a pressure-sensitive adhesive such as a pressure-sensitive adhesive for masking film from the above pressure-sensitive adhesive composition, and forming a pressure-sensitive adhesive layer on the base film. Can do. In addition, the adhesive which comprises an adhesive layer is what the said adhesive composition was bridge | crosslinked with the isocyanate type crosslinking agent (B).

  Examples of the base material on which the pressure-sensitive adhesive layer is laminated include a single layer or laminated film made of metal, polyester resin, polyfluorinated ethylene resin, polyimide and derivatives thereof, epoxy resin, and the like. In the adhesive film such as a masking film, it is preferable to further provide a release film on the surface of the adhesive layer opposite to the base material. When an adhesive film such as a masking film is put to practical use, the release film is peeled off and used. Examples of the release film include a silicon release film, an olefin release film, a fluorine release film, a long-chain alkyl release film, and an alkyd release film. .

  The method for producing the above adhesive film is as follows: [1] A method in which a pressure-sensitive adhesive composition is applied on a substrate and dried, and then a release film is bonded and an aging treatment is performed. [2] A release film Examples include a method of applying an adhesive composition on the top, drying the substrate, pasting a base material, and performing an aging treatment. Among these, the method [1] is preferable in terms of improving the adhesion to the substrate, workability and stable production.

  The aging treatment is carried out to balance the physical properties of the adhesive. As the aging conditions, the temperature is usually 0 to 150 ° C., preferably 10 to 100 ° C., particularly preferably 20 to 80 ° C., and the time is Usually, it is 30 days or less, preferably 14 days or less, particularly preferably 7 days or less. Specifically, it can be carried out under conditions such as 3 to 10 days at 23 ° C., 1 to 7 days at 40 ° C. .

  In the production of the pressure-sensitive adhesive film, an aging treatment is usually required in order to sufficiently advance the crosslinking reaction of the layer composed of the pressure-sensitive adhesive composition (hereinafter referred to as the pressure-sensitive adhesive composition layer). By containing a metal-based crosslinking catalyst (C), it becomes excellent in immediate curing, so that fine irregularities on the surface of the base film and the release film are not transferred to the pressure-sensitive adhesive composition layer during aging. A smooth pressure-sensitive adhesive layer surface can be formed.

  In applying the pressure-sensitive adhesive composition, it is preferable to dilute and apply the pressure-sensitive adhesive composition to a solvent, and the dilution concentration is preferably 5 to 60% by weight, particularly preferably 10 to 50% by weight. The solvent is not particularly limited as long as it dissolves the pressure-sensitive adhesive composition. For example, ester solvents such as methyl acetate, ethyl acetate, methyl acetoacetate, and ethyl acetoacetate; acetone, methyl ethyl ketone, A ketone solvent such as methyl isobutyl ketone; an aromatic solvent such as toluene and xylene; and an alcohol solvent such as methanol, ethanol and propyl alcohol can be used. Among these, ethyl acetate, methyl ethyl ketone, and toluene are preferably used from the viewpoints of solubility, drying property, price, and the like.

  The pressure-sensitive adhesive composition can be applied by a conventional method such as roll coating, die coating, gravure coating, comma coating, or screen printing.

  The thickness of the pressure-sensitive adhesive layer in the pressure-sensitive adhesive film is usually 1 to 300 μm, preferably 5 to 50 μm, particularly preferably 10 to 30 μm. If this pressure-sensitive adhesive layer is too thin, the physical properties of the adhesive tend to be difficult to stabilize, and if it is too thick, the entire pressure-sensitive adhesive film tends to be too thick and the usability tends to deteriorate.

  As the adherend of the adhesive film, it is preferable to use a base material of a material having heat resistance, such as a metal plate or metal foil of aluminum, copper, iron, stainless steel, magnesium, nickel, titanium, etc .; polyethylene terephthalate, Polyester resins such as polyethylene naphthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, ester acrylate; polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, etc. Polyfluorinated ethylene resin; polyimide and its derivatives; bisphenol type epoxy resin, epoxy resin composite material, alicyclic epoxy resin, epoxy novolac, biphenyl type epoxy resin, epoxy acrylate, etc. And the like.

  The adhesive strength of the pressure-sensitive adhesive layer (or pressure-sensitive adhesive composition layer) of the pressure-sensitive adhesive film is appropriately adjusted according to the material of the adherend, but for example, a SUS-BA plate, a hard-coated PET film, glass, When pasting to a polyimide film or the like, the adhesive strength of the adhesive composition layer immediately after coating (before aging) is preferably 0.01 to 1.0 N / 25 mm, particularly preferably 0.05 to 0.5 N / 25 mm, more preferably 0.1 to 0.3 N / 25 mm.

  Moreover, it is preferable that the adhesive force of the adhesive composition layer of the adhesive film after an aging is 0.01-1.0N / 25mm, Especially preferably, it is 0.05-0.5N / 25mm, More preferably, it is 0 0.1 to 0.3 N / 25 mm.

  Furthermore, the adhesive strength of the adhesive layer of the adhesive film after heating is preferably 0.01 to 1.0 N / 25 mm, particularly preferably 0.05 to 0.5 N / 25 mm, and more preferably 0.1 to 0.1 N / 25 mm. 0.3 N / 25 mm.

An adhesive film such as a masking film obtained by using the adhesive composition of the present invention is hardly contaminated when peeled from an adherend even after being used under high temperature conditions, and peels off with a small force. For example, for masking applications that require heat resistance such as a masking film for temporarily protecting the surface of a circuit board such as an FPC board or a transparent electrode layer, or for temporarily holding and reinforcing products during the manufacturing process. It can be used for general fixing applications such as an adhesive film for forming a transparent electrode layer for fixing and a tape for semiconductor manufacturing process.
In addition, the pressure-sensitive adhesive composition of the present invention has an immediate curing property, and fine unevenness of the release film is difficult to be transferred to the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer, so that it is used for protective films for displays such as flat panel displays and touch panels. Even when used as, it is possible to prevent a decrease in visibility due to unevenness.

  Furthermore, since the pressure-sensitive adhesive composition of the present invention is excellent in high-speed peelability, the masking film obtained using the pressure-sensitive adhesive composition of the present invention has good workability and a load on the adherend. Reduced and very useful for industrial production.

  As a method for using the masking film obtained by using the pressure-sensitive adhesive composition of the present invention, for example, the masking film is attached to the surface of the adherend, and usually 100 ° C. or higher (preferably 110 ° C. or higher, particularly preferably 120 ° C. As described above, it is preferable that the masking film is peeled off from the adherend surface after being subjected to a heating step of 130 ° C. or more.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated further more concretely, this invention is not limited to a following example, unless the summary is exceeded. In the examples, “%” and “parts” mean weight basis.

<Manufacture of acrylic resin (A) solution>
[Production Example 1: Acrylic resin (A-1)]
In a reactor equipped with a thermometer, a stirrer, a dropping funnel and a reflux condenser, 40 parts of ethyl acetate was charged, the temperature was increased while stirring, and when the temperature reached about 80 ° C., 65 parts of butyl acrylate (BA) (a1), A mixed solution in which 30 parts of methyl methacrylate (MMA) (a1), 5 parts of hydroxyethyl methacrylate (HEMA) (a2), 0.05 part of azobisisobutyronitrile (AIBN), and 5.0 parts of ethyl acetate are mixed and dissolved. Was added dropwise over 2 hours. Further, during the polymerization, a mixed solution in which 0.025 part of AIBN was mixed with 5 parts of ethyl acetate, and finally a mixed solution in which 0.05 part of AIBN was mixed with 5 parts of ethyl acetate were successively added at reflux at the above temperature. After refluxing for hours, the mixture was diluted with ethyl acetate and toluene to obtain an acrylic resin (A-1) having a solid content of 40% and a glass transition temperature (Tg) of −19.3 ° C.

  Raw material composition, weight average molecular weight (Mw), dispersity of acrylic resin (A-2) and (A′-1) produced in the same manner as in Production Example 1 together with acrylic resin (A-1) Weight average molecular weight / number average molecular weight) and glass transition temperature (Tg) are also shown in Table 1.

<Isocyanate-based crosslinking agent (B)>
(B-1) "Coronate HX" manufactured by Tosoh Corporation
<Metal-based crosslinking catalyst (C)>
(C-1) “Narsem Ferric Acid” manufactured by Nippon Chemical Industry Co., Ltd. (molecular weight 353.17)
<Crosslinking retarder (D)>
(D-1) "Acetylacetone" manufactured by Daicel Corporation

<Example 1>
7 parts of coronate HX (B-1), 0.5 parts of ferric nurser (C-1), and acetylacetone (D-1) with respect to 100 parts of the solid content of the acrylic resin (A-1) One part was blended to prepare an adhesive composition. The obtained pressure-sensitive adhesive composition was applied to a PET film (Toray Industries, T60 Lumirror, thickness 38 μm) as a substrate so that the thickness after drying was about 20 μm, and then at 130 ° C. for 2 minutes. Dried. Thereafter, a release-treated PET film (Mitsui Chemicals Tosero Co., Ltd., PET-01-BU, thickness 38 μm) was adhered and protected on the coated surface to prepare an adhesive film.
The calculated value of the hydroxyl value of the acrylic resin (A-1) is 21.8 mgKOH / g, and the calculated value of the acid value is 0 mgKOH / g (however, the acid as an impurity contained in the raw material is taken into account). Not)

<Examples 2-5 and Comparative Examples 1-2>
A pressure-sensitive adhesive composition was prepared in the same manner as in Example 1 except that the components of the pressure-sensitive adhesive composition were blended in the proportions shown in Table 2, and a pressure-sensitive adhesive film was further produced.

  The following evaluation was performed using the obtained pressure-sensitive adhesive composition and pressure-sensitive adhesive film, and the results are summarized in Table 3.

<Adhesive strength (peeling speed 0.3 m / min)>
・ Before heating (evaluation method)
After the adhesive film obtained above was aged at 40 ° C. for 7 days, a test piece of 25 mm × 100 mm was prepared, the release film was peeled off, and then a stainless steel plate (SUS304BA plate) and HC (hard coat) -PET A 2 kg rubber roller is applied to the HC surface of the adherend to which the PET surface of the film (“Tough Top THS” manufactured by Toray Industries Inc.) is attached in an atmosphere of 23 ° C. and 50% relative humidity by two reciprocations. It was left for 30 minutes under the same atmosphere.
Thereafter, the 180 ° peel strength (N / 25 mm) was measured at a peel rate of 0.3 m / min, and evaluated according to the following criteria.
(Evaluation criteria)
○ ... 0.5N / 25mm or less △ ... 0.5N / 25mm or more, 1.0N / 25mm or less × ... 1.0N / 25mm or less

・ After heating (evaluation method)
After the adhesive film obtained above was aged at 40 ° C. for 7 days, a test piece of 25 mm × 100 mm was prepared, the release film was peeled off, and then a stainless steel plate (SUS304BA plate) and HC (hard coat) -PET A 2 kg rubber roller is applied to the HC surface of the adherend to which the PET surface of the film (“Tough Top THS” manufactured by Toray Industries Inc.) is attached in an atmosphere of 23 ° C. and 50% relative humidity by two reciprocations. It was left for 30 minutes under the same atmosphere.
Then, it exposed to 150 degreeC atmosphere for 1 hour, and returned to 23 degreeC after that. Further, after being left for 2 hours in an atmosphere of 23 ° C. and 50% relative humidity, the 180 ° peel strength (N / 25 mm) was measured at a peel rate of 0.3 m / min, and evaluated according to the following criteria.
(Evaluation criteria)
○ ... 1.0N / 25mm or less △ ... 1.0N / 25mm or more, 1.5N / 25mm or less × ... 1.5N / 25mm or less

<Adhesive strength (peeling speed 10 m / min)>
The adhesive strength before and after heating was evaluated in the same manner as above except that the peeling speed was changed to 10 m / min.

<Immediate curing (surface irregularities)>
(Evaluation method)
After the adhesive film obtained above was aged at 40 ° C. for 7 days, the release film of the adhesive film was peeled off, and platinum was deposited on the surface of the adhesive layer at 30 mA, 40 s using a JFC-1600 auto fine coater. (Deposition layer thickness of about 10 nm). Then, the pressure-sensitive adhesive layer surface on which platinum was vapor-deposited was observed with a digital microscope (manufactured by Keyence Corporation, VHX-900 (model number)), and the ratio of the concavo-convex portion to the whole pressure-sensitive adhesive layer surface was evaluated according to the following criteria. .
(Evaluation criteria)
○ ... 0.5 or less △ ... over 0.5, 1.0 or less × ... over 1.0

<Pot life>
(Evaluation method)
The pre-coating pressure-sensitive adhesive composition prepared above is placed in a sample bottle and stirred for 30 minutes, then placed in a constant temperature water bath at 25 ° C., and after 1 hour has elapsed since the start of the test (when the pressure-sensitive adhesive composition was prepared). The viscosity of the pressure-sensitive adhesive composition was measured at 25 ° C. for 1 minute using a B-type viscometer. Then, it was further continued in a constant temperature water bath at 25 ° C., and the viscosity after 6 hours from the start of the test was measured at 25 ° C. × 1 minute using a B-type viscometer, and evaluated according to the following criteria.
(Evaluation criteria)
○: The viscosity after 6 hours was not more than 10 times the viscosity after 1 hour.
Δ: The viscosity after 6 hours is more than 10 times the viscosity after 1 hour, and no gelation occurs within 6 hours.
X: Gelled within 6 hours.

From the results shown in Table 2 and Table 3, in Examples 1 to 5 according to the present invention, while having a sufficient pot life, it has excellent quick curing properties and little increase in adhesive strength after use under high temperature conditions. It can be seen that the film can be peeled off with a small force, and it is difficult to cause contamination when peeled off from the adherend and is excellent in high-speed peelability.
On the other hand, although Comparative Example 1 is good in the evaluation of adhesive strength at low-speed peeling, it does not contain a metal-based crosslinking catalyst (C) and a crosslinking retarder (D), so there are many irregularities on the surface of the pressure-sensitive adhesive layer. confirmed.
Moreover, in Comparative Example 2, although the adhesive strength evaluation at low speed peeling was good, the glass transition temperature of the acrylic resin (A) was −50 ° C. or lower, so the high speed peeling property and pot life were inferior. .

  The pressure-sensitive adhesive composition of the present invention is a masking film for performing masking and fixing in a heating process included in a manufacturing process of a touch panel-related member such as a circuit board such as an FPC board or a transparent electrode layer, and an adhesive for forming a transparent electrode layer. It can use suitably for adhesive films, such as a film and a tape for semiconductor manufacturing processes.

Claims (10)

A pressure-sensitive adhesive composition containing an acrylic resin (A), an isocyanate-based crosslinking agent (B), a metal-based crosslinking catalyst (C), and a crosslinking retarder (D),
A pressure-sensitive adhesive composition, wherein the glass transition temperature of the acrylic resin (A) is higher than -50 ° C.   The pressure-sensitive adhesive composition according to claim 1, wherein the acid value of the acrylic resin (A) is 1 mgKOH / g or less.   The pressure-sensitive adhesive composition according to claim 1 or 2, wherein the hydroxyl value of the acrylic resin (A) is 1 to 70 mgKOH / g.   The pressure-sensitive adhesive composition according to any one of claims 1 to 3, wherein the metal-based crosslinking catalyst (C) is an iron compound (C1).   A pressure-sensitive adhesive, wherein the pressure-sensitive adhesive composition according to any one of claims 1 to 4 is crosslinked with an isocyanate-based crosslinking agent (B).   A pressure-sensitive adhesive for masking film, comprising the pressure-sensitive adhesive according to claim 5.   A masking film comprising an adhesive layer comprising the adhesive according to claim 5 on the film.   A pressure-sensitive adhesive film for forming a transparent electrode layer, comprising a pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive according to claim 5 on the film.   A tape for a semiconductor manufacturing process, comprising a pressure-sensitive adhesive layer made of the pressure-sensitive adhesive according to claim 5 on a film.   A method for using a masking film, comprising: attaching the masking film according to claim 7 to the surface of the adherend, subjecting the masking film to a heating step of 100 ° C. or higher, and then peeling the masking film from the surface of the adherend.