JP2019130612A5 - - Google Patents

Download PDF

Info

Publication number
JP2019130612A5
JP2019130612A5 JP2018014849A JP2018014849A JP2019130612A5 JP 2019130612 A5 JP2019130612 A5 JP 2019130612A5 JP 2018014849 A JP2018014849 A JP 2018014849A JP 2018014849 A JP2018014849 A JP 2018014849A JP 2019130612 A5 JP2019130612 A5 JP 2019130612A5
Authority
JP
Japan
Prior art keywords
grinding
cutting
shows
grinding wheel
relationship
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018014849A
Other languages
Japanese (ja)
Other versions
JP2019130612A (en
JP6909739B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2018014849A priority Critical patent/JP6909739B2/en
Priority claimed from JP2018014849A external-priority patent/JP6909739B2/en
Publication of JP2019130612A publication Critical patent/JP2019130612A/en
Publication of JP2019130612A5 publication Critical patent/JP2019130612A5/ja
Application granted granted Critical
Publication of JP6909739B2 publication Critical patent/JP6909739B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

このよう複合材料3であるワークを平面研削盤を用いて、そのメタルボンドダイヤモンド砥石等の研削砥石により平面研削するに際しては、一般にインフィード・オシレート方式が採用される。この場合の平面研削法には、所定速度で研削砥石を連続的に切り込む連続的研削法(図14参照)と、研削砥石の前進、後退を交互に繰り返しながら研削砥石を断続的に切り込む断続的研削法(特許文献1)とがある。 When surface-grinding a work which is such a composite material 3 using a surface grinder and a grinding wheel such as a metal bond diamond grindstone, an infeed oscillate method is generally adopted. The surface grinding method in this case includes a continuous grinding method in which the grinding wheel is continuously cut at a predetermined speed (see FIG. 14) and an intermittent cutting method in which the grinding wheel is intermittently cut while alternately repeating forward and backward movements of the grinding wheel. There is a grinding method (Patent Document 1).

本発明の第1の実施形態を示す縦型両頭平面研削盤の概略図である。1 is a schematic view of a vertical double-sided surface grinder showing a first embodiment of the present invention. 同研削状態の説明図である。It is explanatory drawing of the grinding state. 同研削砥石の動きと負荷電流の関係を示す図である。It is a figure which shows the movement of the grinding wheel and the relationship of load current. 同ステップ切込の説明図である。It is explanatory drawing of the same step cut. 研削と負荷電流の関係を示す図である。It is a figure which shows the relationship between the same grinding and load current . 砥石番手と平均砥粒径との関係を示す図である。It is a figure which shows the relationship between the whetstone count and an average grain size . 同砥石番手の違いによる実研削結果を示す図である。It is a figure which shows the actual grinding result by the difference of the whetstone count. 同砥石番手と粒径比との関係を示す図である。It is a figure which shows the relationship between the whetstone count and a particle size ratio. 同研削結果を示す図である。It is a figure which shows the grinding result. 同砥石番手と切込上限量等の関係を示す図である。It is a figure which shows the relationship between the same grindstone count, a cutting upper limit, etc. 本発明の第2の実施形態を示す制御系のブロック図である。It is a block diagram of a control system showing a 2nd embodiment of the present invention. 同フローチャートである。It is the same flowchart. 複合材料及び研削状態の説明図である。It is an explanatory view of a composite material and a grinding state. 従来の研削法の研削砥石の動きと負荷電流の関係を示す図である。It is a figure which shows the movement of the grinding wheel of the conventional grinding method, and the relationship of load current.

一定切込量Dは、1秒の一定時間間隔Tで上側の研削砥石7を切り込んだ場合に、停止ステップE1の停止時間の1秒間に上下の研削砥石7,8がワーク6を研削可能な最大研削量未満であって、その研削と次の切込ステップE2との間に軽負荷のスパークアウト研削又はそれに近い状態で研削(以下、スパークアウト研削という)できるように設定されている。 When the upper grinding wheel 7 is cut at a constant time interval T of 1 second, the constant cutting amount D allows the upper and lower grinding wheels 7 and 8 to grind the work 6 within 1 second of the stop time of the stop step E1. be less than the maximum grinding amount, the grinding and subsequent grinding with light load spark-out grinding or a state close to that of between the cutting step E2 (hereinafter, referred to as spark-out grinding) is by Uni set Ru can.

しかし、切込ステップE2−1後の停止ステップE1中は、上側の研削砥石7の切り込みが行われず、各研削砥石7,8は研削の進行に伴って弾性変形が戻りつつワーク6の研削を実行するため、砥石軸用駆動モータ13,14の研削負荷が徐々に小さくなり、その研削負荷の低下に伴って負荷電流I1も傾斜状に立ち下がる(I1−2)。 However, during the stop step E1 after the cutting step E2-1, the cutting of the upper grinding wheel 7 is not performed, and the grinding wheels 7 and 8 are not deformed elastically as the grinding progresses and the work 6 is ground. to execute, gradually small no longer grinding load wheel spindle drive motor 13 and 14, the load current I1 also falls to the inclined shape with decreasing the grinding load (I1-2).

上下の研削砥石7,8が0.5μm近く研削して装置全体の弾性変形が戻ば、研削砥石7,8は次の切込ステップE2−2までの間に軽負荷状態でスパークアウト研削をするため、その後の負荷電流I1は次の切込ステップE2−2まで略一定値を辿る(I1−3)。 If the upper and lower grinding wheels 7, 8 Re return the elastic deformation of the entire 0.5μm near ground to the apparatus, the spark-out grinding the grinding wheel 7 and 8 in a light load state until the next cutting step E2-2 Therefore, the load current I1 thereafter follows a substantially constant value until the next cutting step E2-2 (I1-3).

全ての演算等が終了すると研削開始指令を待って(S9)、ステップ切込制御手段17が送り用駆動モータ15を介して砥石を一定時間間隔Tで一定切込量Dずつワーク6に対して間欠的に切り込むステップ切込制御を行う(S10)。そして、ワーク6が所定の仕上がり寸法になるまでステップ切込制御を継続し(S10、S11)、所定の仕上がり寸法になれば(S11)、ステップ切込制御によるワーク6の研削を終了する。 When all calculations are completed, the grinding start command is awaited ( S9 ), and the step cutting control means 17 causes the grinding wheel through the feed drive motor 15 at a constant time interval T to the workpiece 6 by a constant cutting amount D. Step cutting control for intermittent cutting is performed (S10). Then, the step cutting control is continued until the work 6 has a predetermined finished size (S10, S11), and when the work has a predetermined finished size (S11), the grinding of the work 6 by the step cut control is finished.

JP2018014849A 2018-01-31 2018-01-31 Work surface grinding method and double-headed surface grinding machine Active JP6909739B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018014849A JP6909739B2 (en) 2018-01-31 2018-01-31 Work surface grinding method and double-headed surface grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018014849A JP6909739B2 (en) 2018-01-31 2018-01-31 Work surface grinding method and double-headed surface grinding machine

Publications (3)

Publication Number Publication Date
JP2019130612A JP2019130612A (en) 2019-08-08
JP2019130612A5 true JP2019130612A5 (en) 2020-04-16
JP6909739B2 JP6909739B2 (en) 2021-07-28

Family

ID=67546662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018014849A Active JP6909739B2 (en) 2018-01-31 2018-01-31 Work surface grinding method and double-headed surface grinding machine

Country Status (1)

Country Link
JP (1) JP6909739B2 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58192743A (en) * 1982-04-29 1983-11-10 Toyoda Mach Works Ltd Cam grinding method
JP3217869B2 (en) * 1992-09-22 2001-10-15 新東ブレーター株式会社 Electrolytic in-process dressing grinding method
JPH10180630A (en) * 1996-12-20 1998-07-07 Toshiba Mach Co Ltd Dressing method for grinding wheel
JP2001225249A (en) * 2000-02-17 2001-08-21 Waida Seisakusho:Kk Grinding method
JP2004175626A (en) * 2002-11-28 2004-06-24 Sumitomo Electric Ind Ltd High thermal conductivity diamond sintered compact, heat sink for mounting semiconductor using the same, and its manufacturing method
JP2006123133A (en) * 2004-10-29 2006-05-18 Waida Seisakusho:Kk Truing method
JP2007160436A (en) * 2005-12-12 2007-06-28 Fujisanki Inc Grinder and grinding method
JP5273922B2 (en) * 2006-12-28 2013-08-28 株式会社アライドマテリアル Heat dissipation member and semiconductor device

Similar Documents

Publication Publication Date Title
TWI681842B (en) Polishing apparatus, method for controlling the same, and method for outputting a dressing condition
JP6360750B2 (en) Wafer processing method
US20070234564A1 (en) Method and apparatus for producing blades
JP5179158B2 (en) Dresser board
KR20120023741A (en) Method for grinding plate-like body
TWI679085B (en) Dehorning method of glass plate, and manufacturing method of glass plate
JP2019130612A5 (en)
US3424566A (en) Method of dressing grinding wheels
JP2000263437A (en) Cylindrical grinding wheel
CN207548485U (en) Grinding device
CN105575856A (en) Device for carrying out circle-cutting and chamfering on InSb
JP2009050996A (en) Deburring device
CN108801829B (en) Method for selecting optimal grinding tool granularity in grinding process
JP6909739B2 (en) Work surface grinding method and double-headed surface grinding machine
JP2901875B2 (en) Truing method of super abrasive grinding wheel
JP2007245288A (en) Method for dressing superabrasive grinding wheel and device to be used in the same method
JP6367614B2 (en) Grinding wheel manufacturing method
JP2940073B2 (en) Grinding machine control method
JP7285507B1 (en) Grinding method for semiconductor crystal wafer
JP4511699B2 (en) Composite grinding method
JP6023101B2 (en) Gear honing method
JP2001252870A (en) Method for grinding and dressing grinding wheel
JP5464337B2 (en) Centerless grinding method and apparatus
CN107877301A (en) A kind of method for grinding using eyeglass grinding attachment
JPS61117065A (en) Grindstone corrective apparatus