JP2019125787A5 - - Google Patents

Description

Chip-shaped metal resistor and its manufacturing method

The present invention relates to a chip-shaped metal resistor having a chip-shaped metal resistor and a method for manufacturing the same.

The chip-shaped metal resistor shown in Patent No. 4460564 (Patent Document 1) includes a chip-shaped metal resistor, a plurality of electrodes formed by plating provided on one side of the resistor, and a plurality of electrodes. It is provided with a solder layer formed by plating formed by laminating on an electrode. An insulating layer for determining the resistance value between the electrodes of the resistor is provided on one side of the resistor. Further, the plurality of electrodes are separated from each other with the insulating layer interposed therebetween, and a part of each of the plurality of electrodes and a part of each of the solder layers laminated on the plurality of electrodes are attached to the edge of the insulating layer. , Overlap so that they are in direct contact with this edge. According to such a configuration, it is not necessary to perform trimming for adjusting the resistance value. In addition, it is not necessary to perform complicated cutting work in the manufacturing process of the chip-shaped metal resistor.

Japanese Patent No. 4460564

However, in the conventional structure, each part of the solder layer formed by the plating laminated on the plurality of electrodes formed by the plating is overlaid with respect to the edge of the insulating layer so as to be in direct contact with the edge. Since it is wrapped, if soldering is performed at the time of mounting, the solder for mounting will be attached to the portion of the solder layer that overlaps the edge of the insulating layer. As a result, if the dimension between the electrodes is reduced in order to reduce the resistance value, there is a problem that a short circuit between solder layers is likely to occur.

An object of the present invention is to provide a chip-shaped metal resistor in which solder interlayer short circuit does not occur even if the resistance value is low, and a method for manufacturing the chip-shaped metal resistor.

The first invention comprises a chip-shaped metal resistor, a plurality of electrode layers formed by plating on one side of the metal resistor, and a plurality of solder layers formed by plating on the plurality of electrode layers. , A chip-shaped metal resistor formed on one surface and provided with an insulating layer for determining the resistance value between electrodes of the metal resistor is targeted for improvement. In the chip-shaped metal resistor of the present invention, the plurality of electrode layers are formed so as to have overlapping portions on the insulating layer, and the plurality of solder layers expose the overlapping portions of the plurality of electrode layers. It is formed to make it.

When the plurality of solder layers are formed so as to expose the overlapping portions of the plurality of electrode layers in this way, the distance between the solder layers located on both sides of the insulating layer becomes long. As a result, the distance between the mounting solders adhering to the solder layer becomes long, and even if the resistance value of the resistor is lowered, it is possible to prevent the solder interlayer short circuit from occurring.

The second invention comprises a chip-shaped metal resistor, a plurality of electrode layers formed by plating on one side of the metal resistor, and a plurality of solder layers formed by plating on the plurality of electrode layers. The method for manufacturing a chip-shaped metal resistor, which is formed on one surface and includes an insulating layer for determining the resistance value between electrodes of the metal resistor, is targeted for improvement. In the method for manufacturing a chip-shaped metal resistor of the present invention, an insulating layer is formed on one side of a metal resistor, and a plurality of electrode layers are formed so as to have an overlapping portion overlapping on the insulating layer. The solder layer is formed so as to cover the overlapping portion of the plurality of electrode layers, and each step of removing the portion covering the overlapping portion of the plurality of solder layers is included.

According to such a method for manufacturing a chip-shaped metal resistor, it is possible to easily manufacture a chip-shaped metal resistor in which a plurality of solder layers are formed so as to expose an overlapping portion of a plurality of electrode layers.

The third invention comprises a chip-shaped metal resistor, a plurality of electrode layers formed by plating on one side of the metal resistor, and a plurality of solder layers formed by plating on the plurality of electrode layers. The method for manufacturing a chip-shaped metal resistor, which is formed on one surface and includes an insulating layer for determining the resistance value between electrodes of the metal resistor, is targeted for improvement. In the method for manufacturing a chip-shaped metal resistor of the present invention, an insulating layer is formed on one side of a metal resistor, and a plurality of electrode layers are formed so as to have an overlapping portion that overlaps the insulating layer. An insulating layer for masking is formed so as to cover the insulating layer located between the wrap portion and the overlapping portion, and a plurality of solder layers are formed on a plurality of electrode layers not covered by the insulating layer for masking, and then masking is performed. Each step of removing the insulating layer is included.

According to such a method for manufacturing a chip-shaped metal resistor, it is possible to easily manufacture a chip-shaped metal resistor in which a plurality of solder layers are formed so as to expose an overlapping portion of a plurality of electrode layers.

The fourth invention comprises a chip-shaped metal resistor, a plurality of electrode layers formed by plating on one side of the metal resistor, and a plurality of solder layers formed by plating on the plurality of electrode layers. , A chip-shaped metal resistor formed on one surface and provided with an insulating layer for determining the resistance value between electrodes of the metal resistor is targeted for improvement. The chip-like metal resistor of the present invention, so as to prevent the respective inner edges of the plurality of solder layers extend inward from the inner edge of the plurality of electrode layers, each inner end of the plurality of solder layers The insulating layer is formed so as to have an extension blocking portion that penetrates between the edge and each inner edge of the plurality of electrode layers.

By forming the insulating layer so as to have an extension blocking portion in this way, it is possible to maintain a long distance between the inner edge of each of the plurality of solder layers, and therefore even if the resistance value of the resistor is lowered. It is possible to prevent the occurrence of short circuit between solder layers.

The insulating layer of the chip-shaped metal resistor consists of an insulating layer for determining the resistance value between electrodes and an insulating layer for determining the resistance value between electrodes, which determines the end position of the inner edge of a plurality of electrode layers and determines the resistance value between electrodes. A main body formed on top of each other and an extension blocking portion extending beyond the end of the insulating layer for determining the resistance value between electrodes are provided, and the end positions of the inner end edges of a plurality of solder layers are determined to determine the distance between electrodes. It may be configured to have an insulating layer for determining the distance between electrodes.

In the chip-shaped metal resistor of the present invention, the plurality of electrode layers sandwich the first electrode forming layer formed so as to sandwich the insulating layer for determining the resistance value between electrodes and the insulating layer for determining the distance between electrodes. A second electrode forming layer formed in the above may be provided.

Further, in the chip-shaped metal resistor of the fourth invention, even if the insulating layer for determining the resistance value between electrodes and the insulating layer for determining the distance between electrodes are formed of different insulating materials, they are formed of the same insulating material. May be good.

In the chip-shaped metal resistor of the fourth invention, an insulating layer for determining the resistance value between electrodes is formed on one surface of a metal resistor, and the insulating layer for determining the resistance value between electrodes is used as a masking layer as a first electrode forming layer. Is formed by plating, and an insulating layer for determining the distance between electrodes is formed on the insulating layer for determining the resistance value between electrodes and beyond the boundary between the insulating layer for determining the resistance value between electrodes and the first electrode forming layer. It can be manufactured by a manufacturing method including each step of forming a second electrode forming layer by plating with an insulating layer for determining the distance between electrodes as a masking layer and forming a solder layer on the second electrode forming layer by plating. can.

The chip-shaped metal resistor of the fifth invention is formed so that a plurality of solder layers do not have an overlapping portion overlapping on the insulating layer, and the plurality of solder layers are formed on the plurality of electrode layers. Only formed. In this chip-shaped metal resistor, an insulating layer for determining the resistance value between electrodes is formed on one side of a metal resistor, a masking insulating layer is formed on the insulating layer, and then a plurality of electrode layers and a plurality of electrode layers are formed. It can be manufactured by forming a solder layer and finally removing the entire masking insulating layer or removing a part of the insulating layer so as to reduce the thickness.

The chip-shaped metal resistor of the sixth invention is also formed so that the plurality of solder layers do not have an overlapping portion overlapping on the insulating layer, and the plurality of solder layers are formed on the plurality of electrode layers. Only formed. In this chip-shaped metal resistor, an insulating layer made of a masking material for determining the resistance value between electrodes is formed on one side of a metal resistor, then a plurality of electrode layers and a plurality of solder layers are formed, and finally an insulating layer is formed. It can be manufactured by removing all of it or removing a part of it so as to reduce the thickness.

It is sectional drawing which shows the laminated structure of 1st Embodiment of the chip-shaped metal resistor which concerns on this invention. In each figure, the thickness of each layer is shown to be thicker or thinner than the actual ratio for the sake of explanation, and the ratio of the thickness of each layer of the specific chip-shaped metal resistor is different from the figure. (A) to (e) are diagrams showing the manufacturing process of the first embodiment according to the manufacturing method of the chip-shaped metal resistor according to the present invention for manufacturing the chip-shaped metal resistor of FIG. (C) and (d) are diagrams showing the manufacturing process of the second embodiment according to the manufacturing method of the chip-shaped metal resistor according to the present invention for manufacturing the chip-shaped metal resistor of FIG. 1, and FIG. Since the steps prior to (c) are the same as those in FIGS. 2 (a) and 2 (b), the illustration is omitted. It is sectional drawing which shows the laminated structure of the 2nd Embodiment of the chip-shaped metal resistor which concerns on this invention. (A) and (b) are enlarged sectional views showing a part of the laminated structure of another embodiment of the chip metal resistor according to the present invention, respectively. (A) to (d) are diagrams showing the manufacturing process of the second embodiment according to the manufacturing method of the chip-shaped metal resistor according to the present invention for manufacturing the chip-shaped metal resistor of FIG. (A) to (d) are diagrams showing a manufacturing process for manufacturing a chip-shaped metal resistor according to a third embodiment. (A) to (c) are diagrams showing a manufacturing process for manufacturing a chip-shaped metal resistor according to a fourth embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Chip-shaped metal resistor of the first embodiment)
FIG. 1 shows a laminated structure of chip-shaped metal resistors according to the first embodiment. This chip-shaped metal resistor includes a metal resistor 10, a pair of electrode layers 20 and 20, two solder layers 30 and 30 on each of the electrode layers 20 and 20, and insulating layers 40 and 50. There is.

The metal resistor 10 has a uniform thickness and is in the shape of a rectangular chip in a plan view. Specific examples of the material of the metal resistor 10 include Cu—Mn-based alloys, Ni—Cu-based alloys, Ni—Cr-based alloys, and the like, which are desired for chip-shaped metal resistors. It can be selected according to the size and resistance value to be applied.

Each of the pair of electrode layers 20 and 20 is a metal layer formed by plating on one side of the metal resistor 10, and is typically made of copper having high electrical conductivity. Although two electrode layers 20 are shown in this embodiment, three or more electrode layers may be provided.

The solder layers 30 and 30 are formed by plating on each of the pair of electrode layers 20 and 20. The solder layers 30 and 30 are soldered to electrodes (not shown) on the substrate of various devices to which chip-shaped metal resistors are attached and used, so that the electrodes on the substrate and the electrode layers 20 are soldered to the electrodes 20 and 30. Electrically connect to 20. In this embodiment, the solder layers 30 and 30 are made of tin.

The insulating layer 40 is formed on one side of the metal resistor 10 between the pair of electrode layers 20 and 20, and the distance between the pair of electrode layers 20 and 20 is determined by determining the distance between the pair of electrode layers 20 and 20. Determine the resistance value between electrodes. The insulating layer 40 is typically an epoxy resin-based resin film, and is formed by thick film printing.

The surface of the metal resistor 10 opposite to one side is covered with an insulating layer 50 over the entire surface. The insulating layer 50 is also an epoxy resin-based resin film like the insulating layer 40, and can be formed by the same thick film printing equipment as the insulating layer 40. The insulating layers 40 and 50 may be formed by a photoresist method instead of thick film printing.

In the chip-shaped metal resistor of the first embodiment, the electrode layers 20 and 20 are formed so as to have overlapping portions 22 and 22 on the insulating layer 40, respectively. The solder layers 30 and 30 are formed so as to expose the overlapped portions 22 and 22 of the electrode layers 20 and 20, respectively.

In a typical chip-shaped metal resistor, the thickness of the metal resistor 10 is about 0.1 to 1.0 mm, and the size of each side of the rectangle is about 0.5 to 7 mm. The thickness of the electrode layer 20 is about 100 μm, the thickness of the solder layer 30 is about 3 to 15 μm, and the thickness of the insulating layers 40 and 50 is about 20 to 50 μm.

(First Embodiment of the method for manufacturing a chip-shaped metal resistor)
The chip-shaped metal resistor of the first embodiment as described above can be manufactured through each manufacturing step shown in FIG.

First, as shown in FIG. 2A, the insulating layer 40 is formed on one side of the metal resistor 10. In FIG. 2A, the insulating layer 50 is already formed, but the insulating layer 50 is first printed on the entire surface of the metal resistor 10 opposite to one side, and then the insulating layer is partially printed on one side. 40 is printed on a thick film.

Next, as shown in FIG. 2B, the pair of electrode layers 20 and 20 are formed by plating. If copper plating is applied on one side of the metal resistor 10 so as to be sufficiently thicker than the thickness of the insulating layer 40, the electrode layers 20 and 20 overlap with each other near the edge of the insulating layer 40. The wrap portion 22 is formed.

Next, as shown in FIG. 2C, the two solder layers 30 and 30 are formed by tin plating. Each of the solder layers 30 and 30 has an overlap portion covering portion 32 and 32 formed so as to cover the overlap portions 22 and 22 of the pair of electrode layers 20 and 20, respectively.

Next, as shown in FIG. 2D, tin-plated protective films 60 and 60 are formed on the portions of the solder layers 30 and 30 other than the overlapped portion covering portions 32 and 32. The tin-plated protective films 60, 60 are made of an appropriate resin and can be formed by pattern printing.

Next, as shown in FIG. 2E, by performing the tinning removal treatment, the portions of the solder layers 30 and 30 that are not protected by the tinning protective films 60 and 60, that is, the solder layers 30 and 30 are overlaid. The wrap portion covering portions 32 and 32 are removed, and the overlap portions 22 and 22 of the pair of electrode layers 20 and 20 are exposed. Then, by removing the tin-plated protective film 60, the chip-shaped metal resistor shown in FIG. 1 can be manufactured.

In the manufacturing method of another embodiment, in order to remove the overlapping portion covering portions 32, 32 that cover the overlapping portions 22, 22 of the pair of electrode layers 20, 20, machining such as grinding or laser light is performed. Processing such as removal can be applied. The reason why the overlapping portions 22 and 22 of the pair of electrode layers 20 and 20 are exposed is that the distance between the solder layers 30 and 30 and the solder mounted on the solder layers 30 and 30 is short. This is to prevent short circuits between solder layers. Therefore, high accuracy is not required for the dimensional accuracy of the portion where the solder layers 30 and 30 are partially removed. Further, it is not required to completely remove tin from the surfaces of the overlap portions 22 and 22, and even if a small amount of tin remains, conversely, even if a part of the overlap portions 22 and 22 is removed, there is a big problem. Does not occur.

Industrially, a plurality of such chip-shaped metal resistors are manufactured at the same time. That is, the metal resistor 10 extends in the horizontal direction at the time of manufacture, and each of the above-mentioned treatments is simultaneously applied to each of a large number of vertically and horizontally arranged parts, and each part is cut after the completion of each treatment, as shown in FIG. It is divided into certain sizes as shown.

The first chip-shaped metal resistor manufactured by such a manufacturing method is formed so that the solder layers 30 and 30 expose the overlap portions 22 and 22 of the pair of electrode layers 20 and 20 to insulate the first chip-shaped metal resistor. Since the distance between the solder layers 30 and 30 located on both sides of the layer 40 becomes long, and as a result, the distance between the mounting solders adhering to the solder layers 30 and 30 also becomes long, the resistance value of the resistor becomes long. Even when the value is low, it is possible to prevent a short circuit from occurring between the solder layers 30 and 30.

(Second embodiment of the method for manufacturing a chip-shaped metal resistor)
FIG. 3 shows a second embodiment of a method for manufacturing a chip-shaped metal resistor. The manufacturing method of the second embodiment is the same as the manufacturing method of the first embodiment up to the step shown in FIG. 2B in the manufacturing method of the first embodiment, and only the subsequent manufacturing steps will be described. ..

As shown in FIG. 3 (c), the insulating layer 40 is formed on one side of the metal resistor 10, and the pair of electrode layers 20 and 20 have the overlapping portions 22 and 22 on the insulating layer 40, respectively. The masking insulating layer 62 is formed so as to cover the insulating layer 40 located between the overlapping portions 22 and 22 and the overlapping portions 22 and 22 with respect to the formed semi-processed product in the state of FIG. 2 (b). The masking insulating layer 62 is made of a suitable resin and can be formed by screen printing.

Next, as shown in FIG. 3D, the solder layers 30 and 30 are formed by plating on the pair of electrode layers 20 and 20 not covered by the masking insulating layer 62, respectively. Then, by removing the masking insulating layer 62, the chip-shaped metal resistor shown in FIG. 1 can be manufactured.

(Chip-shaped metal resistor of the second embodiment)
FIG. 4 is a cross-sectional view showing the laminated structure of the second embodiment of the chip-shaped metal resistor according to the present invention, and the members having the same functions as those of the first embodiment are designated by the same reference numerals. Although it is shown, a detailed description will be omitted.

In each figure, the chip-shaped metal resistor of the second embodiment includes a chip-shaped metal resistor 10 and a pair of electrode layers 70, 70 formed by plating on one side of the metal resistor 10. The solder layers 30 and 30 formed by plating on each of the electrode layers 70 and 70, the insulating layer 80 formed on one side, and the insulating layer covering the surface opposite to one side of the metal resistor 10. It has 50 and.

In the chip-shaped metal resistor of the second embodiment, each inner edge of each solder layer 30 is prevented from extending inward from each inner edge of the pair of electrode layers 70, 70. The insulating layer 80 is formed so as to have extension blocking portions 81, 81 that enter between the inner edge of the solder layers 30 and 30 and the inner edges of the pair of electrode layers 70 and 70.

The insulating layer 80 is formed by being divided into two layers. The insulating layer 82 for determining the resistance value between electrodes is formed on one surface of the metal resistor 10, and the insulating layer 84 for determining the distance between electrodes is formed on the upper layer of the insulating layer 82 for determining the resistance value between electrodes. The insulating layer 84 for determining the distance between electrodes is an extension blocking portion 81 extending beyond the end portions of the main body portion 83 formed by overlapping the insulating layer 82 for determining the resistance value between electrodes and the insulating layer 82 for determining the resistance value between electrodes. , 81 is provided.

The pair of electrode layers 70, 70 sandwiches the first electrode forming layer 72 formed so as to sandwich the insulating layer 82 for determining the resistance value between electrodes and the insulating layer 84 for determining the distance between electrodes. Each includes a second electrode forming layer 74 formed.

The material of each layer is the same as that of the chip-shaped metal resistor of the first embodiment, that is, the insulating layers 50 and 80 are made of resin, the pair of electrode layers 70 and 70 are made of copper, and the solder layers 30 and 30 are made of tin. .. The insulating layer 82 for determining the resistance value between electrodes and the insulating layer 84 for determining the distance between electrodes of the insulating layer 80 are formed of the same insulating material, but in other embodiments, they are formed of different insulating materials.

Although each figure does not show the ratio of the thickness of each layer exactly in agreement with the actual product, in the chip-shaped metal resistor of the second embodiment of FIG. 4, the insulating layer 82 for determining the resistance value between electrodes is used. It is formed to have substantially the same thickness as the first electrode forming layer 72. In another embodiment of FIG. 5A, the first electrode forming layer 72 is slightly thicker than the insulating layer 82 for determining the resistance value between electrodes, and therefore the insulating layer for determining the resistance value between electrodes is at the boundary. There is a slight overlap of the first electrode forming layer 72 on the 82. On the contrary, in still another embodiment shown in FIG. 5B, the first electrode forming layer 72 is formed to be slightly thinner than the insulating layer 82 for determining the resistance value between electrodes.

By forming the insulating layer so as to have the extension blocking portions 81 and 81 in this way, the distance between the inner edges of the solder layers 30 can be kept long, and thus the resistance value of the resistor is lowered. However, it is possible to prevent the occurrence of a short circuit between the solder layers 30.

(Second embodiment of the method for manufacturing a chip-shaped metal resistor)
The chip-shaped metal resistor of the second embodiment as described above can be manufactured through each manufacturing step shown in FIG.

First, as shown in FIG. 6A, an insulating layer 82 for determining the resistance value between electrodes is formed on one side of the metal resistor 10. An insulating layer 50 is formed on the surface of the metal resistor 10 opposite to one side.

Next, as shown in FIG. 6B, the pair of first electrode forming layers 72 and 72 are formed by copper plating with the insulating layer 82 for determining the resistance value between electrodes as a masking layer.

Next, as shown in FIG. 6 (c), above the insulating layer 82 for determining the resistance value between the electrodes and between the electrodes so as to cross the boundary between the insulating layer 82 for determining the resistance value between the electrodes and the first electrode forming layer. The insulation layer 84 for determining the distance is formed.

Next, as shown in FIG. 6D, the second electrode forming layer 74 is formed by plating with the insulating layer 84 for determining the distance between electrodes as a masking layer. Then, by forming the solder layer 30 on the second electrode forming layer 74 by plating, the chip-shaped metal resistor of the second embodiment shown in FIG. 4 can be formed.

As described above, according to the chip-shaped metal resistor of the second embodiment, since the insulating layer 80 is formed so as to have the extension blocking portion 81, the distance between the inner edges of the solder layers 30 and 30 is mutual. Therefore, even when the resistance value of the metal resistor 10 is low, it is possible to prevent the occurrence of a short circuit between the solder layers 30 and 30.

(Third Embodiment of a chip-shaped metal resistor and a method for manufacturing the same)
7 (a) to 7 (d) show the process of the manufacturing method of the 3rd Embodiment of the chip metal resistor of this invention. First, as shown in FIG. 7A, an insulating layer 40 for determining the resistance value between electrodes is formed on one side of the metal resistor 10. An insulating layer 50 is formed on the surface of the metal resistor 10 opposite to one side.

Next, as shown in FIG. 7B, after forming the masking insulating layer 62 on the insulating layer 40 for determining the resistance value between electrodes, the pair of electrode layers 20 and 20 are formed by copper plating, and further. The solder layers 30 and 30 are formed by tin plating with the masking insulating layer 62 as the masking layer. In this embodiment, the thickness of the masking insulating layer 62 is about 100 μm.

Next, as shown in FIG. 7 (c), the masking insulating layer 62 is completely removed, or as shown in FIG. 7 (d), a part of the masking insulating layer 62 is removed so as to reduce the thickness. The remaining masking insulating layer 62'is a protective layer.

In this way, the plurality of electrode layers 20, 20 are formed so as not to have an overlapping portion on the insulating layer 40 for determining the resistance value between electrodes and the insulating layer 62 for masking, and the plurality of solder layers 30, A chip-shaped metal resistor in which 30 is formed only on a plurality of electrode layers 20, 20 can be easily manufactured. In consideration of printing misalignment, the masking insulating layer 62 may be formed smaller than the insulating layer 40 for determining the resistance value between electrodes. In this case, a part of the electrode layers 20 and 20 partially overlaps the insulating layer 40 for determining the resistance value between the electrodes, but the plurality of solder layers 30 and 30 have the plurality of electrode layers 20 and 20. Formed only on top of 20. Further, in this case, the solder layer 30 does not overlap with the ends of the electrode layers 20 and 20, so that there is an advantage that the mounting deviation with respect to the soldering electrode on the mounting circuit is small.

(Fourth Embodiment of Chip Metal Resistor and Method for Manufacturing thereof)
8 (a) and 8 (b) show the process of the manufacturing method of the 4th Embodiment of the chip metal resistor of this invention. First, as shown in FIG. 8A, an insulating layer 40 for determining the resistance value between electrodes is formed on one side of the metal resistor 10 with a masking material. An insulating layer 50 is formed on the surface of the metal resistor 10 opposite to one side.

Next, as shown in FIG. 8B, the pair of electrode layers 20 and 20 are formed by copper plating, and the solder layers 30 and 30 are further formed by tin plating. In this embodiment, the thickness of the insulating layer 40 for determining the resistance value between electrodes is about 100 μm.

Next, as shown in FIG. 8C, the insulating layer 40 for determining the resistance value between electrodes formed of the masking material is partially removed so as to reduce its thickness. The remaining insulating layer 40'for determining the resistance value between electrodes serves as a protective layer. Of course, the insulating layer 40 for determining the resistance value between the electrodes may be completely removed.

In this way, the plurality of electrode layers 20 overlap on the insulating layer 40 for determining the resistance value between electrodes and on the insulating layer 40 beyond the boundary between the insulating layer 40 for determining the resistance value between electrodes and the electrode forming layer. A chip-shaped metal resistor formed so as not to have an overlap portion and having the plurality of solder layers 30 and 30 formed only on the plurality of electrode layers 20 and 20 can be easily manufactured.

According to the chip-shaped metal resistor of the present invention, the distance between the solder layers located on both sides of the insulating layer can be increased. Therefore, even when the resistance value of the metal resistor is low, short circuit between solder layers does not occur.

10 Metal resistor 20 Electrode layer 22 Overlap part 30 Solder layer 40, 50, 80 Insulation layer 60 Tin-plated protective film 62 Masking insulation layer 70 Electrode layer 72 First electrode forming layer 74 Second electrode forming layer 81 Extension Blocking part 82 Insulating layer for determining resistance between electrodes 83 Main body 84 Insulating layer for determining distance between electrodes

Claims (12)

A chip-shaped metal resistor, a plurality of electrode layers formed by plating on one surface of the metal resistor, a plurality of solder layers formed by plating on the plurality of electrode layers, and a plurality of solder layers on the one surface. A chip-shaped metal resistor formed in the metal resistor and provided with an insulating layer for determining the resistance value between electrodes of the metal resistor.
The plurality of electrode layers are formed so as to have an overlapping portion that overlaps the insulating layer.
A chip-shaped metal resistor characterized in that the plurality of solder layers are formed so as to expose the overlapped portion of the plurality of electrode layers. A chip-shaped metal resistor, a plurality of electrode layers formed by plating on one surface of the metal resistor, a plurality of solder layers formed by plating on the plurality of electrode layers, and a plurality of solder layers on the one surface. A method for manufacturing a chip-shaped metal resistor, which is formed in a metal resistor and includes an insulating layer for determining the resistance value between electrodes of the metal resistor.
The insulating layer is formed on one side of the metal resistor to form the insulating layer.
The plurality of electrode layers are formed so as to have an overlapping portion that overlaps the insulating layer.
The plurality of solder layers are formed so as to cover the overlapped portion of the plurality of electrode layers.
A method for manufacturing a chip-shaped metal resistor, which comprises removing a portion of the plurality of solder layers that covers the overlapped portion. A chip-shaped metal resistor, a plurality of electrode layers formed by plating on one surface of the metal resistor, a plurality of solder layers formed by plating on the plurality of electrode layers, and a plurality of solder layers on the one surface. A method for manufacturing a chip-shaped metal resistor, which is formed in a metal resistor and includes an insulating layer for determining the resistance value between electrodes of the metal resistor.
The insulating layer is formed on one side of the metal resistor to form the insulating layer.
The plurality of electrode layers are formed so as to have an overlapping portion that overlaps the insulating layer.
A masking insulating layer is formed so as to cover the overlapping portion and the insulating layer located between the overlapping portions.
A method for manufacturing a chip-shaped metal resistor, which comprises forming the plurality of solder layers on the plurality of electrode layers not covered by the masking insulating layer, and then removing the masking insulating layer. A chip-shaped metal resistor, a plurality of electrode layers formed by plating on one surface of the metal resistor, a plurality of solder layers formed by plating on the plurality of electrode layers, and a plurality of solder layers on the one surface. A chip-shaped metal resistor formed in the metal resistor and provided with an insulating layer for determining the resistance value between electrodes of the metal resistor.
Each inner edge of the plurality of solder layers and the plurality of electrodes so as to prevent each inner edge of the plurality of solder layers from extending inward from each inner edge of the plurality of electrode layers. A chip-shaped metal resistor, characterized in that the insulating layer has an extension blocking portion that enters between the inner edges of the layer. The insulating layer is above the insulating layer for determining the resistance value between electrodes and the insulating layer for determining the resistance value between electrodes, which determines the end position of the inner edge of the plurality of electrode layers and determines the resistance value between electrodes. The main body portion formed so as to overlap the electrodes and the extension blocking portion extending beyond the end portion of the insulating layer for determining the resistance value between the electrodes are provided, and the terminal positions of the inner end edges of the plurality of solder layers are determined and between the electrodes. The chip-shaped metal resistor according to claim 4, which has an insulating layer for determining the distance between electrodes for determining the distance. The plurality of electrode layers are formed so as to sandwich a first electrode forming layer formed so as to sandwich the insulating layer for determining the resistance value between electrodes and an insulating layer for determining the distance between electrodes. The chip-shaped metal resistor according to claim 5, further comprising an electrode forming layer of the above. The chip-shaped metal resistor according to claim 5, wherein the insulating layer for determining the resistance value between electrodes and the insulating layer for determining the distance between electrodes are formed of different insulating materials. The chip-shaped metal resistor according to claim 5, wherein the insulating layer for determining the resistance value between electrodes and the insulating layer for determining the distance between electrodes are formed of the same insulating material. The method for manufacturing a chip-shaped metal resistor according to any one of claims 5 to 8.
An insulating layer for determining the resistance value between electrodes is formed on one surface of the metal resistor.
The first electrode forming layer was formed by plating using the insulating layer for determining the resistance value between electrodes as a masking layer.
The insulating layer for determining the distance between the electrodes is formed on the insulating layer for determining the resistance value between the electrodes and beyond the boundary between the insulating layer for determining the resistance value between the electrodes and the first electrode forming layer.
The second electrode forming layer was formed by plating using the insulating layer for determining the distance between electrodes as a masking layer.
A method for manufacturing a chip-shaped metal resistor, which comprises forming the solder layer on the second electrode forming layer by plating. A chip-shaped metal resistor, a plurality of electrode layers formed by plating on one surface of the metal resistor, a plurality of solder layers formed by plating on the plurality of electrode layers, and a plurality of solder layers on the one surface. A chip-shaped metal resistor formed in the metal resistor and provided with an insulating layer for determining the resistance value between electrodes of the metal resistor.
A chip-shaped metal resistor characterized in that the plurality of solder layers are formed only on the plurality of electrode layers so as not to have an overlapping portion overlapping on the insulating layer. A chip-shaped metal resistor, a plurality of electrode layers formed by plating on one surface of the metal resistor, a plurality of solder layers formed by plating on the plurality of electrode layers, and a plurality of solder layers on the one surface. A method for manufacturing a chip-shaped metal resistor, which is formed in a metal resistor and includes an insulating layer for determining the resistance value between electrodes of the metal resistor.
The insulating layer is formed on one side of the metal resistor to form the insulating layer.
An insulating layer for masking is formed on the insulating layer, and the insulating layer is formed.
After that, the plurality of electrode layers and the plurality of solder layers are formed, and the plurality of electrode layers and the plurality of solder layers are formed.
After that, a method for manufacturing a chip-shaped metal resistor, which comprises removing all the insulating layer for masking or partially removing the insulating layer for masking so as to reduce the thickness. A chip-shaped metal resistor, a plurality of electrode layers formed by plating on one surface of the metal resistor, a plurality of solder layers formed by plating on the plurality of electrode layers, and a plurality of solder layers on the one surface. A method for manufacturing a chip-shaped metal resistor, which is formed in a metal resistor and includes an insulating layer for determining the resistance value between electrodes of the metal resistor.
The insulating layer made of a masking material is formed on one side of the metal resistor, and the insulating layer is formed.
After that, the plurality of electrode layers and the plurality of solder layers are formed, and the plurality of electrode layers and the plurality of solder layers are formed.
A method for manufacturing a chip-shaped metal resistor, which is characterized in that the insulating layer is then completely removed or partially removed so as to reduce the thickness.