JP2019117833A - Semiconductor module and power conversion system - Google Patents

Abstract

To provide a semiconductor module that makes it easy to shorten a connection wire connected to a power terminal and to provide a power conversion system.SOLUTION: A semiconductor module 2 comprises: a module body part 21 incorporating a switching element 24; and a power element group 220 formed of three or more power terminals 22 projecting in parallel from one another in a direction parallel to a main surface of the module body part 21. If a direction parallel to a direction in which the power terminals 22 project is a Z direction, a direction of a normal of the main surface of the module main body part 21 is an X direction, a direction orthogonal to the X direction and the Z direction is a Y direction, both ends of the module body part 21 in the Y direction are first end part 211 and a second end part 212, respectively, and the center between the first end part 211 and the second end part 212 in the Y direction is a module center C21, a half of power terminals 22 of the power terminal group 220 are arranged within a first area 201 between the module center C21 and the first end part 211.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor module and a power conversion device provided with the same.

  Some power converters such as inverters include a semiconductor module having a switching element built-in. The semiconductor module is provided with a plurality of power terminals for transferring and receiving the power controlled to be turned on and off by the switching element. Patent Document 1 discloses a semiconductor module provided with three power terminals.

  These three power terminals are arranged side by side in a direction parallel to the main surface of the semiconductor module. The power terminal is connected to an external power wiring of the semiconductor module. That is, for example, the bus bar connected to the capacitor and the bus bar connected to the external output terminal are connected to the power terminal.

JP, 2013-149684, A

  However, in a semiconductor module provided with three or more power terminals, the connection wiring connected to each power terminal may be long depending on the arrangement of the power terminals. That is, depending on the positional relationship between the module body incorporating the switching element and the power terminal projecting from the module body, there is a possibility that the connection wiring connected to the power terminal can not but be lengthened. As a result, it may be difficult to reduce the wiring resistance and the loss.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor module and a power conversion device in which the connection wiring connected to the power terminal can be easily shortened.

One aspect of the present invention is a module body (21) incorporating a switching element (24);
A power terminal group (220) composed of three or more power terminals (22) projecting in parallel with each other in a direction parallel to the main surface of the module main body from the module main body;
The direction parallel to the projecting direction of the power terminal is the Z direction, the normal direction of the main surface of the module main body is the X direction, and the direction orthogonal to both the X direction and the Z direction is the Y direction. The two ends of the module main body in the first and second ends are respectively the first end (211) and the second end (212), and the center of the first end and the second end in the Y direction is the module center (C21) When you
A majority of the power terminals of the power terminal group are in the semiconductor module (2), which is arranged to be contained in a first region (201) between the module center and the first end.

Another aspect of the present invention is a power converter (1) provided with the above semiconductor module, which
The semiconductor module has a control terminal (23) projecting from the module body to the opposite side of the power terminal,
An electronic component (3) electrically connected to the semiconductor module;
A wiring holding body (5) holding a part of the output wiring (41) connected to one of the power terminals;
A control board (6) connected to the control terminal;
The control substrate is disposed to face the semiconductor module in the Z direction,
The electronic component and the wiring holder are included in the power conversion device, which are disposed on opposite sides in the Y direction with the semiconductor module interposed therebetween.

  In the semiconductor module, a majority of the power terminals of the power terminal group are arranged to be contained in the first region. As a result, a majority of the power terminals can be disposed at a position near the first end of the module body in the Y direction. As a result, by drawing out the connection wires respectively connected to the majority of the power terminals to the first end side, the connection wires can be easily shortened.

  That is, when arranging the electronic component which is the connection destination by the connection wiring and the holding component which holds the connection wiring in the vicinity of the semiconductor module, these components are arranged so as not to interfere with the module body. Therefore, by arranging a majority of the power terminals in the first region, it becomes easy to shorten the distance between these power terminals and the above-mentioned components arranged on the first end side. As a result, the connection wiring can be easily shortened.

  In the power converter, the electronic component and the wiring holder are disposed on opposite sides of the semiconductor module in the Y direction. Therefore, by arranging the majority of the power terminals 22 to be contained in the first region, shortening of the connection wiring can be effectively achieved.

As described above, according to the above aspect, it is possible to provide a semiconductor module and a power conversion device that can easily shorten the connection wiring connected to the power terminal.
The reference numerals in parentheses described in the claims and the means for solving the problems indicate the correspondence with the specific means described in the embodiments described later, and the technical scope of the present invention is limited. It is not a thing.

FIG. 2 is a front view of the semiconductor module in the first embodiment. The II arrow line view of FIG. BRIEF DESCRIPTION OF THE DRAWINGS Front explanatory drawing of a part of power converter device in Embodiment 1. FIG. Explanatory drawing of the power converter device seen from Z direction in Embodiment 1. FIG. V-V arrow directional cross-sectional view of FIG. FIG. 1 is a circuit diagram of a power conversion device according to a first embodiment. FIG. 7 is an explanatory view of a part of the control board in the first embodiment. VIII sectional view taken on the line in FIG. Sectional drawing equivalent to the VIII line arrow cross section of FIG. 1 concerning the modification of a semiconductor module. FIG. 9 is a front view showing a part of the power conversion device in a second embodiment. FIG. 8 is an explanatory view of a part of the control substrate in the second embodiment. FIG. 14 is a perspective view of a semiconductor module in a third embodiment. The XIII arrow line view of FIG. Front explanatory drawing of the semiconductor module in a modification.

(Embodiment 1)
Embodiments according to a semiconductor module and a power conversion device will be described with reference to FIGS. 1 to 9.
As shown in FIG. 1, the semiconductor module 2 of the present embodiment has a module main body 21 incorporating the switching element 24 and a power terminal group 220 composed of three or more power terminals 22.

  The power terminals 22 project from the module body 21 in a direction parallel to the main surface of the module body 21. The three power terminals 22 project in parallel with one another. In the present embodiment, the power terminal group 220 has three power terminals 22.

  As shown in FIGS. 1 and 2, the direction parallel to the projecting direction of the power terminal 22 is taken as the Z direction, and the normal direction of the main surface of the module body 21 is taken as the X direction. A direction orthogonal to both the X direction and the Z direction is taken as a Y direction. Both ends of the module body 21 in the Y direction are referred to as a first end 211 and a second end 212, respectively. The center of the first end 211 and the second end 212 in the Y direction is a module center C21.

  The majority of the power terminals 22 of the power terminal group 220 are arranged to be contained in the first region 201 between the module center C 21 and the first end portion 211. In the present embodiment, since the power terminal group 220 includes three power terminals 22, two or more power terminals 22 are disposed so as to be contained in the first region 201. In particular, in the present embodiment, two power terminals 22 are arranged to be accommodated in the first region 201.

  In other words, when the full width in the Y direction of the module body 21 is divided into two regions bordering the module center C21, a majority of the power terminals 22 are disposed in one of the regions. A region on the side where the majority of the power terminals 22 are disposed is referred to as a first region 201. The end of the module body 21 on the side where the first region 201 is present is the first end 211, and the end on the opposite side is the second end 212.

The three power terminals 22 project in the same direction as the Z direction. That is, the power terminal group 220 includes three or more power terminals 22 protruding from the module body 21 in the same direction.
The module body portion 21 has a dimension Ly in the Y direction larger than a dimension Lz in the Z direction.

  The control terminal 23 protrudes from the surface of the module body 21 different from the surface from which the power terminal 22 protrudes. In the present embodiment, the control terminal 23 protrudes from the surface of the module body 21 opposite to the surface from which the power terminal 22 protrudes. That is, the control terminal 23 protrudes in the opposite direction to the power terminal 22 in the Z direction.

  The module body 21 incorporates a plurality of switching elements 24 connected in series with one another and arranged in the Y direction. Also, the module body 21 incorporates a plurality of switching elements 24 connected in parallel to each other and arranged in the Y direction. That is, the module body 21 incorporates a plurality of upper arm switching elements 24 u and lower arm switching elements 24 d described later. The upper arm switching element 24 u and the lower arm switching element 24 d are connected in series with each other. The upper arm switching elements 24 u are connected in parallel, and the lower arm switching elements 24 d are also connected in parallel.

  In the present embodiment, the module body 21 incorporates two upper arm switching elements 24 u and two lower arm switching elements 24 d. These four switching elements 24 are arranged side by side in the Y direction. As shown in FIGS. 1 and 8, the module body 21 seals the switching element 24 with an insulating resin 216.

  As shown in FIG. 1, the control terminal 23 includes a control terminal 23u connected to the upper arm switching element 24u and a control terminal 23d connected to the lower arm switching element 24d. The control terminal 23 u on the upper arm side is disposed in the second region 202. The control terminal 23 d on the lower arm side is disposed in the first region 201.

  A plurality of control terminals 23 are provided corresponding to one switching element 24. The control terminals 23 of each group are disposed at positions in the Y direction corresponding to the corresponding switching elements 24. In particular, in the present embodiment, the control terminal 23 of each group is disposed within the width of the corresponding switching element 24 in the Y direction.

  The switching element 24 can be configured by an IGBT. Here, IGBT is an abbreviation for Insulated Gate Bipolar Transistor, that is, an insulated gate bipolar transistor. The switching element can also be a MOSFET. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor, or metal oxide field effect transistor.

  The power terminals 22 belonging to the power terminal group 220 include a positive electrode terminal 22P, a negative electrode terminal 22N, and an output terminal 22A. In the present embodiment, the positive electrode terminal 22P is disposed at a position closest to the first end 211 in the Y direction. The output terminal 22A is disposed at a position closest to the second end 212 in the Y direction. The negative electrode terminal 22N is disposed between the negative electrode terminal 22N and the output terminal 22A in the Y direction. Thus, in the present embodiment, the three power terminals 22 are arranged side by side in the Y direction.

  The positive electrode terminal 22P and the negative electrode terminal 22N are disposed so as to be accommodated in the first region 201. The output terminal 22A is disposed so as to be accommodated in the second area 202 between the module center C21 and the second end 212.

  In the module main body portion 21, the positive electrode terminal 22P is connected to the collector of the upper arm switching element 24u (see FIG. 6). The negative electrode terminal 22N is connected to the emitter of the lower arm switching element 24d. The output terminal 22A is connected to a connection point between the emitter of the upper arm switching element 24u and the collector of the lower arm switching element 24d.

  As shown in FIG. 8, in the module main body 21, the plurality of switching elements 24 connected in parallel have their collector surfaces 24c joined to the same conductive member 213c. That is, the collector surfaces 24c of the two upper arm switching elements 24u are joined to one conductive member 213c. Further, the two lower arm switching elements 24d both connect the collector surface 24c to the other one conductive member 213c. By doing so, the impedance in the current path to the plurality of switching elements 24 connected in parallel can be reduced.

  The plurality of switching elements 24 connected in parallel have their emitter surfaces 24 e joined to the same conductive member 213 e via the individual conductive blocks 214. That is, the two upper arm switching elements 24u join the emitter surface 24e to the individual conductive blocks 214 joined to the common conductive member 213e. Further, the two lower arm switching elements 24d join the emitter surface 24e to the individual conductive blocks 214 joined to the common conductive member 213e.

  The conductive members 213 c and 213 e are also the heat dissipation plate 213 exposed to the main surface of the module body 21. The conductive member 213e on the emitter side of the upper arm and the conductive member 213c on the collector side of the lower arm are connected to each other in the module body 21 and become the same potential. And these are the same electric potential also with the output terminal 21A. The conductive member 213c on the collector side of the upper arm has the same potential as the positive electrode terminal 22P. The conductive member 213e on the emitter side of the lower arm has the same potential as the negative electrode terminal 22N.

  Further, as shown in FIG. 9, in the module main body portion 21, the plurality of switching elements 24 connected in parallel may have a configuration in which the emitter surface 24 e is directly joined to the same conductive member 213 c. That is, the plurality of convex portions 215 are provided on the conductive member 213 e on the emitter side, and the emitter surface 24 e of the switching element 24 is brought into contact with each of the convex portions 215. In other words, the configuration of FIG. 9 can be said to be a configuration in which the conductive block 214 shown in FIG. 8 described above is integrated with the conductive member 213e on the emitter side.

  In this configuration, the two switching elements 24 connected in parallel directly join the emitter surface 24 e to one common conductive member 213 e. Therefore, the impedance can be further reduced.

  At least one of the power terminals 22 connected to the plurality of switching elements 24 connected in parallel to each other is connected to the power terminal 22 in the Y direction at a terminal center C22 which is the center of the power terminal 22 in the Y direction. It is disposed between the switching elements 24. In this embodiment, as shown in FIG. 1, the terminal center C22 of the negative electrode terminal 22N is disposed between two lower arm switching elements 24d connected thereto. The lengths of current paths from the negative electrode terminal 22N to the two lower arm switching elements 24d are substantially equal.

  Specifically, the terminal center C22 is located in the Y direction between the centers in the Y direction of each of the two switching elements 24 connected in parallel with each other. More preferably, the terminal center C22 is at a position between the respective Y-direction inner edges of the two switching elements 24 connected in parallel.

The power converter 1 of the present embodiment includes a plurality of semiconductor modules 2.
As shown in FIGS. 3 and 4, the power conversion device 1 includes a capacitor 3, a wiring support 5, and a control board 6 in addition to the semiconductor module 2. The capacitor 3 is an electronic component electrically connected to the semiconductor module 2. The wiring holder 5 is a component that holds a part of the output wiring 41 connected to one of the power terminals 22. A control terminal 23 is connected to the control board 6. The control substrate 6 is disposed to face the semiconductor module 2 in the Z direction. The capacitor 3 and the wiring holder 5 are disposed on opposite sides of the semiconductor module 2 in the Y direction.

  The capacitor 3 projects the capacitor bus bars 32P and 32N from a capacitor body 31 in which a capacitor element is built. The capacitor bus bar 32P is connected to the positive electrode terminal 22P of the semiconductor module 2, and the capacitor bus bar 32N is connected to the negative electrode terminal 22N of the semiconductor module 2. In FIG. 4, three capacitor bus bars 32P and three capacitor bus bars 32N protrude from the capacitor 3. However, the plurality of capacitor bus bars 32P are at the same potential, and the plurality of capacitor bus bars 32N are also at the same potential. Then, the plurality of capacitor bus bars 32P may be integrated, and the plurality of capacitor bus bars 32N may be integrated.

  Capacitor bus bars 32P and 32N connect capacitor 3 and semiconductor module 2 in the Y direction. That is, the capacitor bus bars 32P and 32N extend from the first end 211 side in the Y direction toward the positive electrode terminal 22P and the negative electrode terminal 22N. That is, capacitor bus bars 32P and 32N extending from the first end portion 211 side are connected to the positive electrode terminal 22P and the negative electrode terminal 22N arranged to be contained in the first region 201 close to the first end portion 211.

  In the present embodiment, the wiring holder 5 is a terminal block for connecting the output bus bar 41 and an external wiring (not shown). That is, the terminal of the output bus bar 41 is mounted on the wiring holder 5 as the terminal block together with the terminal of the external wiring, and can be connected by fastening the both with a bolt or the like. Here, the external wiring is, for example, a wiring connected to a rotating electrical machine. The wiring holder 5 is made of a resin molded body. The wire holder 5 is fixed to the housing of the power conversion device 1.

  As described above, the lower arm switching element 24 d is disposed in the first region 201. The control substrate 6 is opposed to both the semiconductor module 2 and the wiring holder 5 in the Z direction. The wiring holder 5 includes a current sensor 7 that detects a current flowing through the output bus bar 41 which is an output wiring.

  The main surface of the control board 6 faces in the Z direction, and is opposed to the module body 21 and the wiring holder 5 in the Z direction. A signal line 71 of the current sensor 7 protrudes from the wiring holder 5 to the control substrate 6 side. The signal line 71 is connected to the control board 6.

  In the power converter 1, as shown in FIG. 4 and FIG. 5, a plurality of semiconductor modules 2 are stacked and arranged in the X direction. The plurality of semiconductor modules 2 project the power terminals 22 in the same direction as the Z direction. Along with this, the plurality of semiconductor modules 2 project the control terminals 23 in the same direction as the Z direction.

  The plurality of semiconductor modules 2 are stacked in the X direction together with the plurality of cooling pipes 81, and the cooling pipes 81 are configured to distribute the refrigerant w in the Y direction. The first end 211 side of the second end 212 is the upstream side of the refrigerant w. In FIG. 3, the cooling pipe 81 is omitted.

  The semiconductor module 2 has a module body 21 having a substantially rectangular parallelepiped shape. The module main body 21 includes a pair of main surfaces having a larger area than the other surfaces. The normal direction of this main surface is the X direction. Also, the power terminals 22 of the semiconductor module 2 are formed in a substantially plate shape. The main surface of the power terminal 22 is substantially parallel to the main surface of the module body 21.

  As shown in FIGS. 1, 3 and 8, the heat sink 213 is exposed on both main surfaces of the module body 21. The cooling pipe 81 is disposed so as to be in thermal contact with the heat dissipation plate 213 of the semiconductor module 2.

  As shown in FIG. 4, the cooling pipe 81 is provided with a refrigerant flow path through which the refrigerant w flows. The cooling pipes 81 adjacent to each other in the X direction are connected by a connecting pipe 82 in the vicinity of both ends in the Y direction. Further, the cooling pipe 81 disposed at one end in the X direction is provided with a refrigerant introducing pipe 83 for introducing the refrigerant w and a refrigerant discharge pipe 84 for discharging the refrigerant w. The cooling pipe 81 is made of a metal having excellent thermal conductivity, such as an aluminum alloy.

  The refrigerant w introduced from the refrigerant introduction pipe 83 appropriately flows into the respective cooling pipes 81 via the connecting pipe 82. The refrigerant w introduced into the cooling pipe 81 flows in the Y direction. The flow direction of the refrigerant w at this time is the direction from the first end 211 side of the module body 21 toward the second end 212 side. During this time, the refrigerant w exchanges heat with the module body 21 to cool the module body 21. The refrigerant w that has received heat is discharged from the refrigerant discharge pipe 84 via the connection pipe 82 on the second end 212 side as appropriate.

  As a circuit diagram is shown in FIG. 6, the power conversion device 1 of the present embodiment is, for example, an inverter mounted on a vehicle. Then, power conversion between DC power and AC power is performed between the DC power supply BAT and the three-phase AC rotary electric machine MG. The switching circuit unit of the power converter 1 includes three-phase legs. That is, the three-phase legs are connected in parallel with each other between the positive electrode wire 12P connected to the positive electrode of the DC power supply BAT and the negative electrode wire 12N connected to the negative electrode of the DC power supply BAT.

  Each leg is formed of an upper arm switching element 24 u and a lower arm switching element 24 d connected in series with each other. Each arm is formed by connecting two switching elements 24 in parallel. That is, two upper arm switching elements 24 u connected in parallel with each other and two lower arm switching elements 24 d connected in parallel with each other are connected in series to constitute one leg. The two upper arm switching elements 24 u and the two lower arm switching elements 24 d are incorporated in one semiconductor module 2.

  The connection point between the upper arm switching element 24u and the lower arm switching element 24d in each leg is connected to the three electrodes of the rotary electric machine MG via the output wiring (ie, the output bus bar 41). Further, a capacitor 3 is connected between the DC power supply BAT and the switching circuit unit so as to suspend the positive electrode wire 12P and the negative electrode wire 12N. In addition, flywheel diodes are connected in reverse parallel to the switching elements 24.

Next, the operation and effect of the present embodiment will be described.
In the semiconductor module 2, a majority of the power terminals 22 of the power terminal group 220 are arranged to be contained in the first region 201. As a result, the majority of the power terminals 22 can be disposed at a position near the first end 211 of the module body 21 in the Y direction. As a result, by drawing the connection wires (that is, the capacitor bus bars 32P and 32N) connected to the majority of the power terminals 22 to the first end 211 side, the connection wires can be easily shortened.

  That is, when arranging the capacitor 3 in the vicinity of the semiconductor module 2, the capacitor 3 is arranged so as not to interfere with the module body 21. Therefore, by arranging the positive electrode terminal 22P and the negative electrode terminal 22N in the first region 201, the distance between the power terminal 22 and the capacitor 3 can be shortened. As a result, the connection wiring (i.e., the capacitor bus bars 32P and 32N) can be shortened.

  The connection between the power terminal 22 and the connection wiring is made near the protruding tip of the power terminal 22. Therefore, by drawing the connection wiring from the power terminal 22 in the Y direction, connection workability also becomes easy. Then, in the configuration in which the connection wiring is drawn out from the power terminal 22 in the Y direction, the connection wiring is shortened by unevenly distributing the positive electrode terminal 22P and the negative electrode terminal 22N in the first region 201 which is one region in the Y direction. Can.

  The power terminal group 220 includes three or more power terminals 22 protruding from the module body 21 in the same direction. Therefore, the connection wiring connected to the power terminal 22 can be disposed on the same side in the Z direction. Therefore, the wiring can be simplified and the workability of the wiring connection can be improved.

  The module body portion 21 has a dimension Ly in the Y direction larger than a dimension Lz in the Z direction. That is, the module body 21 has a shape elongated in the Y direction. Therefore, if it is arranged that the majority of the power terminals 22 do not fit in the first region 201, the distance from the first end 211 to the majority of the power terminals 22 tends to be long. Then, the connection wiring (i.e., capacitor bus bars 32P and 32N) tends to be long. Therefore, in the semiconductor module 2 of the module main body 21 having such a shape, a majority of the power terminals 22 are disposed so as to be contained in the first region 201. Thereby, the shortening effect of connection wiring (namely, capacitor bus bars 32P and 32N) can be enlarged.

  The control terminal 23 protrudes from the surface of the module body 21 different from the surface from which the power terminal 22 protrudes. Thereby, the wiring of the connection wiring (i.e., the capacitor bus bars 32P and 32N, the output bus bar 41) connected to the power terminal 22 can be facilitated.

  The module body 21 incorporates a plurality of switching elements 24 connected in series with one another and arranged in the Y direction. Therefore, the module body 21 tends to be large in the Y direction. Therefore, the above-described effect obtained by arranging a majority of the power terminals 22 so as to be contained in the first region 201 can be largely obtained.

  The module body 21 incorporates a plurality of switching elements 24 connected in parallel to each other and arranged in the Y direction. Also by this, the module body 21 tends to be large in the Y direction. Therefore, the above-described effect obtained by arranging a majority of the power terminals 22 so as to be contained in the first region 201 can be largely obtained.

  In the negative electrode terminal 22N, the terminal center C22 is disposed between the lower arm switching element 24d in the Y direction. This makes it possible to reduce the difference in the length of the current path between the two lower arm switching elements 24d connected in parallel to each other and the negative electrode terminal 22N. This makes it possible to reduce the difference in impedance between the current paths of the two lower arm switching elements 24d.

  In the power conversion device 1, the control substrate 6 is disposed to face the semiconductor module 2 in the Z direction, and the electronic component (in the present embodiment, the capacitor 3) and the wiring holder 5 sandwich the semiconductor module 2 in the Y direction. They are arranged opposite to each other. As a result, the semiconductor module 2, the capacitor 3, the wiring holder 5, and the control board 6 can be easily disposed in a compact manner. And, by arranging the majority of the power terminals 22 so as to be contained in the first region 201, the wiring shortening effect can be effectively obtained. That is, in the case of the above configuration, it is easy to set the extending direction of the connection wiring (i.e., the capacitor bus bars 32P and 32N) between the capacitor 3 and the power terminal 22 to the Y direction. In that case, by arranging the positive electrode terminal 22P and the negative electrode terminal 22N so as to be contained in the first region 201, the connection wiring can be effectively shortened.

  The lower arm switching element 24d is disposed in the first region 201, the control substrate 6 is opposed to both the semiconductor module 2 and the wiring holder 5 in the Z direction, and the wiring holder 5 is a current sensor It has seven. By this configuration, as shown in FIG. 7, the wiring design (i.e., artwork) in the control substrate 6 can be facilitated.

  The control board 6 is disposed to face the semiconductor module 2 and the wiring holder 5 in the Z direction. Therefore, the control board 6 tends to have a large area on the side of the wiring holder 5 (that is, on the right side in FIG. 7). On the other hand, the control terminal 23 of the upper arm switching element 24u is required to increase the creeping distance between the U phase, the V phase and the W phase. Therefore, in the control substrate 6, it is required to widen the formation area of the printed wiring to which the control terminal 23u on the upper arm side is connected. That is, in the area 6u on the upper arm side, as shown in FIG. 7, the printed wiring formation area 6U to which the U-phase control terminal 23 is connected and the printed wiring formation area to which the V-phase control terminal 23 is connected. 6 V and the printed wiring formation region 6 W to which the W-phase control terminal 23 is connected are formed apart from each other via a sufficient creepage distance. Then, the region 6u on the upper arm side of the control substrate 6 tends to be large.

On the other hand, it is not necessary to provide a creeping distance between the U phase, the V phase and the W phase in the printed wiring formation region 6 d to which the control terminal 23 d on the lower arm side is connected. Therefore, this area 6d is relatively easy to make small.
Therefore, by setting the region 6 u on the upper arm side closer to the wiring holder 5, wiring design in the control substrate 6 can be facilitated.

  The output terminal 22A is disposed so as to be accommodated in the second region 202. Thereby, the distance between the output terminal 22A and the wiring holder 5 can be shortened. As a result, the routing of the output wiring (that is, the output bus bar 41) can be simplified, and the output wiring can be shortened.

  The plurality of semiconductor modules 2 are stacked in the X direction, and the plurality of semiconductor modules 2 project the power terminals 22 in the same direction as the Z direction. This makes it easier to compactly arrange the plurality of semiconductor modules 2 and the components therearound. Then, in this case, the power terminal 22 can be easily designed to access the connection wiring (that is, the capacitor bus bars 32P and 32N, the output bus bar 41) from the Y direction. Therefore, the effect of arranging the majority of the power terminals 22 (the positive electrode terminal 22P and the negative electrode terminal 22N) so as to be contained in the first region 201 can be obtained more remarkably.

  In the cooling pipe 81, the first end 211 side of the second end 212 is the upstream side of the refrigerant w. Thereby, the part by the side of the 1st end 211 which tends to become high temperature in module main part 21 can be cooled by refrigerant w which tends to become low temperature. That is, in the semiconductor module 2, the power terminal group 220 is biased to the side of the first end 211 in the module body 21. In this case, in the module body 21, the current path between the power terminal 22 and the switching element 24 tends to be short on the first end 211 side. Along with this, in the first region 201 in the module main body portion 21, a large amount of current easily flows, and the amount of heat generation tends to be large. On the other hand, the refrigerant w in the cooling pipe 81 has a lower temperature on the upstream side. Therefore, the side of the first end 211 where the amount of heat generation tends to be large is taken as the upstream side of the refrigerant w in the cooling pipe 81. As a result, the module body 21 can be efficiently cooled as a whole.

  As described above, according to the above aspect, it is possible to provide a power conversion device in which the connection wiring connected to the power terminal can be easily shortened.

Second Embodiment
In this embodiment, as shown in FIG. 10, in the module main body 21, the upper arm switching element 24u is disposed in the first region 201. The current sensor 7 is mounted on the control board 6.

  In the present embodiment, in the power terminal group 220, the negative electrode terminal 22N is disposed at a position closest to the first end 211 in the Y direction. The positive electrode terminal 22P is disposed between the negative electrode terminal 22N and the output terminal 22A in the Y direction. The control terminal 23 u on the upper arm side is disposed in the first region 201. The control terminal 23 d on the lower arm side is disposed in the second region 202.

  In the present embodiment, a terminal center C22 of the positive electrode terminal 22P is disposed between two upper arm switching elements 24u connected thereto. The lengths of current paths from the positive electrode terminal 22P to the two upper arm switching elements 24u are substantially equal.

  The output bus bar 41 is held by the wiring holder 5 and penetrates the control board 6. Then, the current sensor 7 is disposed at a portion of the control board 6 through which the output bus bar 41 passes. Thus, the current sensor 7 is configured to be able to detect the current flowing through the output bus bar 41. As shown in FIG. 11, three current sensors 7 are provided, and are configured to detect the current flowing through the U-phase, V-phase, and W-phase output bus bars 41, respectively.

In the present embodiment, the wiring holder 5 is formed of a resin molded body into which a part of the output bus bar 41 is inserted.
The other configuration is the same as that of the first embodiment. In addition, the code | symbol same as the code | symbol used in already-appeared embodiment among the code | symbol used in Embodiment 2 or subsequent ones represents the component similar to the thing in already-appeared embodiment, etc., unless shown.

In the present embodiment, the wiring design in the control substrate 6 can be facilitated from the following viewpoints.
As described above, the printed wiring formation region 6d to which the lower arm side control terminal 23d is connected can be easily made smaller than the printed wiring formation region 6u to which the upper arm side control terminal 23u is connected.

Therefore, by setting the region 6 d on the lower arm side closer to the wire holder 5, it is easy to secure the region facing the wire holder 5 in the control board 6 in the Z direction as a mounting space for the current sensor 7. Become. Thus, also in the present embodiment, the wiring design in the control substrate 6 can be facilitated.
In addition, it has the same operation effect as Embodiment 1.

(Embodiment 3)
In this embodiment, as shown in FIGS. 12 and 13, the positive electrode terminal 22P and the negative electrode terminal 22N are arranged side by side in the X direction. That is, when viewed from the X direction, the positive electrode terminal 22P and the negative electrode terminal 22N are arranged so as to overlap each other.

The positive electrode terminal 22P and the negative electrode terminal 22N are arranged to be contained in the first region 201. The output terminal 22A is disposed so as to be accommodated in the second region 202.
The other configuration is the same as that of the first embodiment.

  In the present embodiment, the positive electrode terminal 22P and the negative electrode terminal 22N are arranged such that their main surfaces face in the X direction. Thereby, the arrangement space of positive electrode terminal 22P and negative electrode terminal 22N can be shortened in the Y direction. Therefore, the positive electrode terminal 22P and the negative electrode terminal 22N can be easily accommodated in the first region 201. Furthermore, both of the positive electrode terminal 22P and the negative electrode terminal 22N can be disposed at a position near the first end portion 211.

Moreover, the inductance in positive electrode terminal 22P and negative electrode terminal 22N can be reduced. That is, by making the positive electrode terminal 22P and the negative electrode terminal 22N, in which currents flow in opposite directions to each other, face each other, it is possible to cancel out the magnetic fields caused by the two. As a result, the inductance can be reduced.
In addition, it has the same operation effect as Embodiment 1.

Moreover, in the said embodiment, although it demonstrated about what the semiconductor module built in 4 switching elements, it is not restricted to this.
For example, as shown in FIG. 14, the semiconductor module 2 may be provided with one upper arm switching element 24u and one lower arm switching element 24d incorporated therein. Also in this case, as shown in the figure, a majority of the power terminals 22 are disposed in the first region 201, which is closer to the first end 211 than the module center C21. In the mode shown in FIG. 14, in the power terminal group 220, the positive electrode terminal 22P and the negative electrode terminal 22N are accommodated in the first region 201, and the output terminal 22A is accommodated in the second region 202.

  In the said embodiment, although the form which used the capacitor | condenser as the electronic component connected to a semiconductor module was shown, an electronic component is not restricted to this. As this electronic component, other components, such as a reactor, can also be arranged, for example.

  The present invention is not limited to the above embodiments, and can be applied to various embodiments without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 1 power converter 2 semiconductor module 201 1st area | region 21 module main-body part 211 1st end part 212 2nd end part 22 power terminal 220 power terminal group 24 switching element C21 module center

Claims (15)

A module body (21) incorporating a switching element (24);
A power terminal group (220) composed of three or more power terminals (22) projecting in parallel with each other in a direction parallel to the main surface of the module main body from the module main body;
The direction parallel to the projecting direction of the power terminal is the Z direction, the normal direction of the main surface of the module main body is the X direction, and the direction orthogonal to both the X direction and the Z direction is the Y direction. The two ends of the module main body in the first and second ends are respectively the first end (211) and the second end (212), and the center of the first end and the second end in the Y direction is the module center (C21) When you
The semiconductor module (2), wherein a majority of the power terminals of the power terminal group are disposed in a first region (201) between the module center and the first end.   The semiconductor module according to claim 1, wherein the power terminal group comprises three or more of the power terminals projecting in the same direction from the module body.   The semiconductor module according to claim 1, wherein a dimension (Ly) in the Y direction of the module body is larger than a dimension (Lz) in the Z direction.   The semiconductor module according to any one of claims 1 to 3, wherein the control terminal (23) protrudes from a surface of the module main body different from the surface from which the power terminal protrudes.   The semiconductor module according to any one of claims 1 to 4, wherein the module body incorporates a plurality of the switching elements connected in series with each other and arranged in the Y direction.   The semiconductor module according to any one of claims 1 to 5, wherein the module body incorporates a plurality of the switching elements connected in parallel to each other and arranged in the Y direction.   The module main body has a plurality of the switching elements connected in series and aligned in the Y direction, and further includes a plurality of switching elements connected in parallel and aligned in the Y direction. In at least one of the power terminals connected to the plurality of connected switching elements, the terminal center (C22) at the center of the power terminal in the Y direction is connected to the power terminal in the Y direction. The semiconductor module according to any one of claims 1 to 4, which is disposed between switching elements.   The power terminal group has a positive electrode terminal (22P), a negative electrode terminal (22N), and an output terminal (22A) as the power terminal, and the positive electrode terminal and the negative electrode terminal are arranged in the X direction with each other. The device according to claim 1, wherein the output terminal is arranged to be accommodated in a second region (202) between the center of the module and the second end. The semiconductor module according to any one of 7. A power converter (1) comprising the semiconductor module according to claim 2, wherein
The semiconductor module has a control terminal (23) projecting from the module body to the opposite side of the power terminal,
An electronic component (3) electrically connected to the semiconductor module;
A wiring holding body (5) holding a part of the output wiring (41) connected to one of the power terminals;
A control board (6) connected to the control terminal;
The control substrate is disposed to face the semiconductor module in the Z direction,
The power conversion device, wherein the electronic component and the wiring holder are disposed on opposite sides in the Y direction across the semiconductor module.   The module main body has an upper arm switching element and a lower arm switching element as the switching element, the lower arm switching element is disposed in the first region, and the control substrate is the semiconductor module 10. The device according to claim 9, further comprising a current sensor (7) facing in the Z direction with respect to both the wire holder and the wire holder, wherein the wire holder detects a current flowing through the output wire. Power converter.   The module main body includes an upper arm switching element (24u) and a lower arm switching element (24d) as the switching elements, and the upper arm switching element is disposed in the first region, and the control is performed. The substrate faces both the semiconductor module and the wiring support in the Z direction, and the control substrate is mounted with a current sensor (7) for detecting the current flowing through the output wiring. The power converter according to claim 9.   The output terminal (22A) connected to the output wiring of the power terminals is disposed so as to be accommodated in a second region (202) between the module center and the second end. The power converter device as described in any one of -11.   The power terminal group has a positive electrode terminal (22P) and a negative electrode terminal (22N) as the power terminals other than the output terminal, and the positive electrode terminal and the negative electrode terminal are arranged in the X direction with one another. The power conversion device according to claim 12, wherein the power conversion device is arranged to fit in the first region.   The semiconductor device according to any one of claims 9 to 13, wherein the plurality of semiconductor modules are stacked in the X direction, and the plurality of semiconductor modules project the power terminals in the same direction as the Z direction. Power converter as described.   The plurality of semiconductor modules are stacked in the X direction together with the plurality of cooling pipes (81), and the cooling pipes are configured to circulate the refrigerant (w) in the Y direction, and the second end The power conversion device according to claim 14, wherein the first end side is more upstream than the refrigerant than the first end side.

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