JP2014212193A - Stack type cooling device for semiconductor module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stack type cooling device for a semiconductor module capable of preventing a bus bar of one semiconductor module from being contacted with a bus bar of the other semiconductor module or a power terminal, at adjacent semiconductor modules.SOLUTION: A stack type cooling device 10 for a semiconductor module comprises: a semiconductor module 63 stacked on a semiconductor module 61 via a cooling unit 66; a bus bar 82 extending along a terminal side face where a power terminal 75 is protruded; and a bus bar 84 extending along a terminal side face where a power terminal 76 is protruded. A first junction between the bus bar 82 and the power terminal 75, and a second junction between the bus bar 84 and the power terminal 76, are arranged so as to be shifted in an extending direction or a protruding direction.

Description

  The present invention relates to a stacked cooling device for a semiconductor module.

  In hybrid vehicles and electric vehicles, a plurality of semiconductor modules and a plurality of coolers are used in load drive circuits such as inverters and converters. From the viewpoint of efficient cooling, a plurality of semiconductor modules and a plurality of coolers are used. The coolers are alternately arranged and stacked.

  As a technique related to the present invention, Patent Document 1 discloses a power conversion device including a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked. Here, a configuration is disclosed in which a semiconductor module includes a main body portion in which a semiconductor element is incorporated, and a signal terminal and a power terminal conducted to the semiconductor element protrude from an end surface of the main body portion.

  Further, in Patent Document 2, a plurality of semiconductor modules and a plurality of coolers are alternately stacked, and the semiconductor modules adjacent in the stacking direction are configured so that the heat generation centers of the power semiconductor elements included in the semiconductor module do not face each other. A configuration in which they are alternately shifted is disclosed.

JP 2012-100457 A JP 2006-210605 A

  As described above, when a plurality of semiconductor modules and a plurality of coolers are alternately arranged and stacked, when attention is paid to two adjacent semiconductor modules, connection to a power terminal protruding from the terminal side surface of one semiconductor module In some cases, the bus bar on one side and the bus bar on the other side connected to the power terminal protruding from the terminal side surface of the other semiconductor module are arranged in parallel.

  In such a case, if a semiconductor element included in one semiconductor module fails, an overcurrent flows through the power terminal and the bus bar, so that repulsive force is generated between the power terminal and the bus bar. Thereby, when a bus bar bends to the other semiconductor module side, it may contact with the power terminal or bus bar of the other semiconductor module, and may short-circuit.

  An object of the present invention is to provide a stacked cooling device for a semiconductor module that prevents a bus bar of one semiconductor module from coming into contact with a bus bar or a power terminal of the other semiconductor module in adjacent semiconductor modules.

  A stacked cooling apparatus for a semiconductor module according to the present invention includes a first semiconductor module, a second semiconductor module stacked on the first semiconductor module via a cooler along the stacking direction, and a stacking direction in the first semiconductor module. A first power terminal projecting from a terminal side surface that is a side surface parallel to a direction perpendicular to the first semiconductor device, a first bus bar extending in a direction perpendicular to the first power terminal along the terminal side surface of the first semiconductor module, and a second semiconductor module A second power terminal projecting from a terminal side surface perpendicular to the stacking direction and parallel to the terminal side surface of the first semiconductor module, and extending in a direction perpendicular to the second power terminal along the terminal side surface of the second semiconductor module A second bus bar, a first joint where the first bus bar and the first power terminal are joined, and a second bus bar and the second power terminal joined. And the second joint portion, characterized in that it is arranged to be shifted in the extending direction or protrude direction.

  According to the present invention, the first joint where the first bus bar and the first power terminal are joined and the second joint where the second bus bar and the second power terminal are joined are displaced in the extending direction or the protruding direction. Are arranged. Thereby, even when the first bus bar or the second bus bar is bent, the first bus bar is in contact with the second bus bar or the second power terminal, or the second bus bar is the first bus bar or the first power terminal. Can be prevented from contacting.

1 is a block diagram of a power conversion circuit system including a stacked cooling device for a semiconductor module according to an embodiment of the present invention. FIG. 2 is a plan view of the stacked cooling device for the semiconductor module shown in FIG. 1. It is the side view which shows a mode that the part enclosed with the dashed-dotted line of FIG. 2 was seen along the X direction.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. Also, in the following, corresponding elements in all drawings are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is a block diagram of a power conversion circuit system 12 including a stacked cooling device 10 for semiconductor modules. The power conversion circuit system 12 is mounted on a vehicle such as a hybrid vehicle or an electric vehicle whose driving wheels are driven by the motor generator 14.

  The motor generator 14 is a three-phase AC motor generator that rotates with a three-phase AC voltage supplied from the inverter 30 and generates a driving torque of the vehicle. Motor generator 14 also generates a three-phase AC voltage during regenerative braking of the vehicle and supplies it to inverter 30.

  The battery 16 is a chargeable / dischargeable battery, and is constituted by, for example, a secondary battery such as a nickel metal hydride battery or a lithium ion battery. The battery 16 supplies a DC voltage to the step-up / down converter 18. Further, the battery 16 is charged by a DC voltage supplied from the step-up / down converter 18 during regenerative braking of the vehicle.

  The step-up / down converter 18 boosts the DC voltage supplied from the battery 16 via the positive bus P1 based on a control signal from the control device 62, and supplies the boosted voltage to the inverter 30 via the positive bus P2. Further, the step-up / step-down converter 18 charges the battery 16 by reducing the DC voltage supplied from the inverter 30 to the voltage level of the battery 16 based on a control signal from the control device 62.

  The step-up / down converter 18 includes a reactor 20, power transistors 22 and 24, and diodes 26 and 28. Reactor 20 has one end connected to positive electrode bus P <b> 1 and the other end connected to the connection point of power transistors 22 and 24.

  The power transistors 22 and 24 are composed of, for example, an IGBT (Insulated Gate Bipolar Transistor). The power transistors 22 and 24 are connected in series between the positive bus P2 and the negative bus N1 and have a base terminal to which a control signal from the control device 62 is input. Diodes 26 and 28 are respectively connected between the collector terminals and the emitter terminals of the power transistors 22 and 24 so that a current flows from the emitter side to the collector side.

  Inverter 30 converts the DC voltage supplied from buck-boost converter 18 via positive bus P2 into a three-phase AC voltage based on a control signal from control device 62, and drives motor generator 14. Thereby, motor generator 14 is driven to generate torque commanded by the torque command value. The inverter 30 also converts the three-phase AC voltage generated by the motor generator 14 during regenerative braking of the vehicle on which the power conversion circuit system 12 is mounted into a DC voltage based on a control signal from the control device 62, and the positive bus P2 To the step-up / down converter 18.

  Inverter 30 includes a U-phase arm 32, a V-phase arm 34, and a W-phase arm 36. U-phase arm 32, V-phase arm 34, and W-phase arm 36 are connected in parallel between positive electrode bus P2 and negative electrode bus N1. The U-phase arm 32, the V-phase arm 34, and the W-phase arm 36 are configured by connecting power transistors 38 and 40, power transistors 42 and 44, and power transistors 46 and 48 in series, respectively.

  The power transistors 38 to 48 are composed of IGBTs, for example. The power transistors 38 to 48 have base terminals to which a control signal from the control device 62 is input. Between the collector terminals and the emitter terminals of the power transistors 38 to 48, diodes 50 to 60 for passing a current from the emitter side to the collector side are respectively connected. In inverter 30, the connection points of power transistors 38 to 48 in U-phase arm 32, V-phase arm 34, and W-phase arm 36 are neutral point terminals of U-phase coil, V-phase coil, and W-phase coil of motor generator 14. Each is connected to the opposite coil terminal.

  Capacitor 57 is connected between positive electrode bus P1 and negative electrode bus N1, and smoothes fluctuations in voltage or current between positive electrode bus P1 and negative electrode bus N1. Capacitor 59 is connected between positive electrode bus P2 and negative electrode bus N1, and smoothes fluctuations in voltage or current between positive electrode bus P2 and negative electrode bus N1.

  The control device 62 is based on the torque command value of the motor generator 14 output from an ECU (Electronic Control Unit) (not shown), the actual rotational speed of the motor generator 14, the motor current of the motor generator 14, the battery voltage of the battery 16, and the like. Then, a control signal for driving the step-up / down converter 18 and the inverter 30 is generated, and the generated control signal is output to the step-up / down converter 18 and the inverter 30.

  Here, the step-up / step-down arm 19 of the step-up / step-down converter 18 and the U-phase arm 32, V-phase arm 34, and W-phase arm 36 of the inverter 30 are modularized, and these are alternately arranged with the coolers 64-69 (see FIG. 2). A stacked cooling device 10 for semiconductor modules is formed. Hereinafter, the stacked cooling device 10 for the semiconductor module will be described in detail.

  FIG. 2 is a plan view of the stacked cooling device 10 for a semiconductor module including the step-up / down converter 18 and the inverter 30 shown in FIG. FIG. 3 is a side view showing a state in which a portion surrounded by a one-dot chain line in FIG. 2 is viewed along the X direction. As shown in FIG. 2, the stacked cooling device 10 for a semiconductor module includes a semiconductor module 61 including a step-up / step-down arm 19 of the step-up / down converter 18, a U-phase arm 32, a V-phase arm 34, and a W-phase arm of an inverter 30. 36, semiconductor modules 63, 65, and 67, coolers 64, 66, 68, 70, and 72, a refrigerant inlet 71, a refrigerant outlet 73, and a plurality of connecting members 74, respectively.

  The semiconductor modules 61 to 67 are cooled from both sides by the coolers 64 to 72. The semiconductor modules 61, 63, 65, 67 are arranged between the cooler 64 and the cooler 66, between the cooler 66 and the cooler 68, between the cooler 68 and the cooler 70, and between the cooler 70 and the cooler 72. Respectively. That is, in the stacked cooling device 10 for semiconductor modules, the semiconductor modules 61, 63, 65, 67 and the coolers 64, 66, 68, 70, 72 are alternately stacked. Note that the stacking direction of the semiconductor modules 61 to 67 and the coolers 64 to 72 is parallel to the X direction.

  The coolers 64, 66, 68, 70, 72 are cooling tubes through which a refrigerant flows, and cool the semiconductor modules 61, 63, 65, 67 from both sides. The plurality of connecting members 74 have a cylindrical shape through which the refrigerant flows, and are arranged to communicate with the coolers 64, 66, 68, 70, and 72. As a result, the refrigerant flowing in from the inlet 71 flows through the coolers 64, 66, 68, 70, 72 and the connection member 74 and flows out from the outlet 73.

  Here, attention is focused on the semiconductor module (first semiconductor module) 61 and the semiconductor module (second semiconductor module) 63 stacked via the semiconductor module 61 and the cooler 66. In FIG. 2, the direction perpendicular to the X direction and the direction in which the bus bars 82 and 84 extend is the Y direction. In FIG. 3, the direction perpendicular to the Y direction and the power terminal 75 protrudes from the terminal side surface of the semiconductor module 61 is defined as the Z direction.

  The semiconductor module 61 has a power terminal (first power terminal) 75 protruding from the terminal side surface in the Z direction. The power terminal 75 is taken out using the connection point of the power transistors 22 and 24 as a terminal. The power terminal 75 is made of a conductive member such as copper, for example.

  The bus bar (first bus bar) 82 is made of a conductive member such as copper and extends along the Y direction. Bus bar 82 has one end joined to power terminal 75 at the end in the Z direction, and the other end connected to reactor 20. As for the arrangement relationship between the bus bar 82 and the power terminal 75, as shown in FIG. 2, the bus bar 82 is arranged on the X direction side, and the power terminal 75 is arranged on the opposite direction side in the X direction.

  The semiconductor module 63 has a power terminal (second power terminal) 76 protruding from the terminal side surface in the Z direction. The power terminal 76 is taken out using the connection point of the power transistors 38 and 40 as a terminal. The power terminal 76 is made of a conductive member such as copper.

  The bus bar (second bus bar) 84 is made of a conductive member such as copper and extends along the Y direction. Bus bar 84 has one end joined to power terminal 76 at the end in the Z direction, and the other end connected to the U-phase coil of motor generator 14. As for the arrangement relationship between the bus bar 84 and the power terminal 76, as shown in FIG. 2, the bus bar 84 is arranged on the X direction side, and the power terminal 76 is arranged on the opposite side of the X direction.

  As shown in FIG. 3, when the power terminal 75 and the power terminal 76 are viewed along the X direction, the power terminal 75 and the power terminal 76 are displaced from each other with respect to the Y direction (left and right direction in the drawing). They are spaced apart so that they do not overlap. In addition, the bus bar 82 and the bus bar 84 are arranged so as to be shifted from each other with respect to the Z direction (the vertical direction in the drawing) so that they do not overlap. Thereby, the joint part 92 of the bus bar 82 and the power terminal 75 and the joint part 94 of the bus bar 84 and the power terminal 76 are arranged so as to be shifted from each other in the Y direction and the Z direction.

  It should be noted that the joint portion 96 between the power terminal 78 of the semiconductor module 65 and the bus bar 86 and the joint portion 98 between the power terminal 80 and the bus bar 88 of the semiconductor module 67 are the same as the joint portion 92 and the joint portion 94 described above. The arrangement relationship is shifted from each other with respect to the direction and the Z direction. The joint portions 92, 94, 96, and 98 have a zigzag arrangement relationship as shown in FIG. Since the power terminals 75, 76, 78, and 80 may have different potentials, a short circuit occurs between the bus terminals having different potentials.

  The operation of the stacked cooling apparatus 10 for a semiconductor module having the above configuration will be described. As described above, the joint portion 92 between the bus bar 82 and the power terminal 75 and the joint portion 94 between the bus bar 84 and the power terminal 76 are arranged so as to be shifted from each other in the Y direction and the Z direction. Here, if the power transistor 24 is short-circuited, an overcurrent flows through the bus bar 82 and the power terminal 75 at the timing when the power transistor 22 is turned on.

  Since the direction of the current flowing through the bus bar 82 and the power terminal 75 is opposite in the end portion in the Z direction, the bus bar 82 and the power terminal 75 generate repulsive force therebetween. This may cause the bus bar 82 to bend in the X direction beyond the cooler 66, but even in that case, the power terminal 75 is displaced in the Y direction with respect to the power terminal 76. 82 and the power terminal 75 do not contact each other. Further, since the bus bar 84 is displaced in the Z direction with respect to the bus bar 82, the bus bar 82 and the bus bar 84 do not come into contact with each other.

  Further, if the power transistor 40 has a short circuit failure, an overcurrent flows through the bus bar 84 and the power terminal 76 at the timing when the power transistor 38 is turned on, and a repulsive force is generated between them. Even when the power terminal 78 is bent in the X direction, the bus bar 84 and the power terminal 76 do not come into contact with each other because the power terminal 78 is displaced in the direction opposite to the Y direction with respect to the power terminal 76. Further, since the bus bar 86 is displaced in the direction opposite to the Z direction with respect to the bus bar 84, the bus bar 84 and the bus bar 86 do not come into contact with each other.

  As described above, in the stacked cooling device 10 for semiconductor modules, the joint portions between the power terminals and the bus bars are arranged so as to be shifted from each other in the Y direction and the Z direction in the adjacent semiconductor modules. Therefore, even if a repulsive force is generated between the power terminals joined in the stacked cooling device 10 of the semiconductor module and the bus bar and the bus bar is bent toward the adjacent semiconductor module, the power terminal of the adjacent semiconductor module Alternatively, it is possible to prevent a short circuit from coming into contact with the bus bar.

  In FIG. 2, the bus bars connected to the positive terminal 91 and the negative terminal 93 of the semiconductor modules 61 to 67 are not shown, but the positive terminals 91 and the negative terminals 93 have the same potential. Even when the bus bar is bent and comes into contact with an adjacent terminal, a short circuit is not formed. Therefore, in FIG. 2, the positive electrode terminal 91 and the negative electrode terminal 93 are arranged in a line, respectively.

  DESCRIPTION OF SYMBOLS 10 Semiconductor module laminated cooling device, 12 Power conversion circuit system, 14 Motor generator, 16 Battery, 18 Buck-boost converter, 19 Buck-boost arm, 20 Reactor, 22, 24 Power transistor, 26, 28 Diode, 30 Inverter, 32 U-phase arm, 34 V-phase arm, 36 W-phase arm, 38, 40, 42, 44, 46, 48 Power transistor, 50, 52, 54, 56, 58, 60 Diode, 57, 59 Capacitor, 61, 63, 65, 67 Semiconductor module, 62 Control device, 64, 66, 68, 69, 70, 72 Cooler, 71 Inlet, 73 Outlet, 74 Connection member, 75, 76, 78, 80 Power terminal, 82, 84, 86,88 bus bar, 91 positive terminal, 92, 94, 96, 98 contact Joint part, 93 negative terminal.

Claims (1)

A first semiconductor module;
A second semiconductor module stacked on the first semiconductor module via a cooler along the stacking direction;
A first power terminal protruding from a terminal side surface which is a side surface parallel to a direction perpendicular to the stacking direction in the first semiconductor module;
A first bus bar extending in a direction perpendicular to the first power terminal along the terminal side surface of the first semiconductor module;
A second power terminal protruding from a terminal side surface in a direction perpendicular to the stacking direction in the second semiconductor module and parallel to the terminal side surface of the first semiconductor module;
A second bus bar extending in a direction perpendicular to the second power terminal along the terminal side surface of the second semiconductor module;
With
The first joint where the first bus bar and the first power terminal are joined and the second joint where the second bus bar and the second power terminal are joined are arranged so as to be shifted in the extending direction or the protruding direction. A stacked cooling device for a semiconductor module.

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