JP2019114619A - Component mounting apparatus and production method - Google Patents

Abstract

To provide a clinching device capable of suitably bending a lead according to various situations.SOLUTION: A component mounting apparatus comprises a clinching device includes a fixed claw, a movable claw that bends a lead inserted in a hole of a substrate according to an operation on the fixed claw, and a backup portion that backs up the substrate from the back side, a substrate holding device that holds the substrate, a component holding device that holds a lead component attached to the substrate, and a control device that includes a storage device that stores the type of substrate to be produced and a production program, and controls the clinching device, the substrate holding device, and the component holding device to mount the lead component on the substrate, wherein the backup portion can be replaced according to the type of substrate to be produced or the production program.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a component mounting apparatus and the like for mounting lead components on a substrate.

  The following patent document describes a clinching device that has a fixed claw and a movable claw, and the movable claw bends a lead inserted into a hole of a substrate by operating relative to the fixed claw. And bending of the lead prevents the lead component from falling off the substrate.

JP-A-63-23399 JP-A-6-61696

  In the present specification, it is an object to suitably bend the lead according to various situations.

  In order to solve the above problems, the present specification provides a fixed claw, a movable claw that bends a lead inserted into a hole of a substrate along with an operation on the fixed claw, and a backup that backs up the substrate from the back surface side A clinching device having a part, a substrate holding device for holding a substrate, a component holding device for holding a lead component attached to the substrate, and a storage device for storing the type of substrate to be produced and a production program, A control device for controlling the clinching device, the substrate holding device, and the component gripping device to mount lead components on a substrate is provided, and the backup unit can be replaced according to the type of a substrate to be produced or a production program. Discloses a component mounting device.

  In order to solve the above problems, the present specification provides a fixed claw, a movable claw that bends a lead inserted into a hole of a substrate along with an operation on the fixed claw, and a backup that backs up the substrate from the back surface side A clinching device having a part, a substrate holding device for holding a substrate, a component holding device for holding a lead component attached to the substrate, and a storage device for storing the type of substrate to be produced and a production program, A component mounting apparatus comprising a control device for controlling the clinching device, the substrate holding device, and the component gripping device to mount lead components on a substrate, the backup according to the type or production program of the substrate to be produced Disclosed is a production method of exchanging parts to produce a substrate.

  According to the present disclosure, it is possible to preferably bend the lead according to various situations by making the backup portion supporting the substrate from the back side exchangeable.

It is a perspective view showing a component mounting machine. It is a perspective view which shows a components mounting apparatus. It is a side view showing a parts holder. It is a front view which shows a components holder. It is a side view which shows the components holder in the state holding the lead components. It is a perspective view showing a cut and clinch device. It is a perspective view showing a cut and clinch unit. It is sectional drawing which shows a slide body. It is an enlarged view which shows a slide body. It is a block diagram showing a control device. It is sectional drawing which shows the cut and clinch unit just before the lead wire of lead components is cut | disconnected. It is sectional drawing which shows the cut-and-clinch unit after the lead wire of lead components is bent. It is the schematic which shows two types of support members. It is sectional drawing which shows the cut-and-clinch unit after the lead wire of lead components is bent. It is an enlarged view which shows the slide body of a modification.

  Hereinafter, as a mode for carrying out the present invention, an embodiment of the present invention will be described in detail with reference to the drawings.

<Configuration of component mounting machine>
A component mounter 10 is shown in FIG. The component mounter 10 is a device for performing the mounting operation of components on the circuit substrate 12. The component mounter 10 includes an apparatus body 20, a base material conveyance / holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a bulk component supply device 32, and a cut and clinch device (see FIG. 6). 34, a control unit (see FIG. 10) 36 is provided. In addition, a circuit board, a base material of a three-dimensional structure, etc. are mentioned as circuit base material 12, A printed wiring board, a printed circuit board, etc. are mentioned as a circuit board.

  The apparatus body 20 is constituted by a frame portion 40 and a beam portion 42 mounted on the frame portion 40. The base material transport and holding device 22 is disposed at the center of the frame portion 40 in the front-rear direction, and includes a transport device 50 and a clamp device 52. The transfer device 50 is a device for transferring the circuit substrate 12, and the clamp device 52 is a device for holding the circuit substrate 12. Thus, the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position. In the following description, the transport direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to the direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. That is, the width direction of the component mounter 10 is the X direction, and the front-rear direction is the Y direction.

  The component mounting device 24 is disposed in the beam unit 42 and has two working heads 60 and 62 and a working head moving device 64. The working head moving device 64 has an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. The two working heads 60 and 62 are integrally moved to an arbitrary position on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70. The working heads 60 and 62 are detachably mounted on the sliders 74 and 76, and the Z-direction moving device 72 moves the sliders 74 and 76 in the vertical direction separately. In other words, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

  Moreover, as shown in FIG. 2, the component holder 78 is attached to the lower end surface of each working head 60,62. The component holder 78 holds the lead of the lead component, and as shown in FIGS. 3 to 5, the main body 80, the pair of claws 82, the auxiliary plate 84, and the opening / closing device 86 (see FIG. 10) And a pusher 88 and an air cylinder 90 (see FIG. 10). Incidentally, FIG. 3 is a side view of the component holder 78, FIG. 4 is a front view of the component holder 78, and FIG. 5 is a side view of the component holder 78 in a state of holding the lead component 92. is there.

  The pair of claws 82 is held rotatably by the main body 80, and the operation of the opening and closing device 86 causes the tips of the two members to approach and separate while the pair of claws 82 are rocked. Inside the pair of claws 82, a recess (not shown) having a size corresponding to the wire diameter of the lead 94 of the lead component 92 to be held is formed. Further, the auxiliary plate 84 is located between the pair of claws 82 and swings with the pair of claws 82. At this time, the auxiliary plate 84 intrudes between the pair of leads 94 of the lead component 92. Then, when the pair of claws 82 approach the auxiliary plate 84, each of the pair of leads 94 of the lead component 92 is nipped from both sides by the concave portion of the claw 82 and the auxiliary plate 84. As a result, as shown in FIG. 5, the lead component 92 is held by the pair of claws 82 at the proximal end of the lead 94, that is, the end of the lead component 92 close to the component body 96.

  Further, the pusher 88 is movably held in the vertical direction by the main body 80, and is moved up and down by the operation of the air cylinder 90. When the pusher 88 is lowered, the pusher 88 contacts the component body 96 of the lead component 92 held by the pair of claws 82 and presses the lead component 92 downward.

  Further, as shown in FIG. 2, the mark camera 26 is attached to the slider 74 in a state of facing downward, and is moved together with the working head 60 in the X direction, the Y direction and the Z direction. Thereby, the mark camera 26 picks up an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance and holding device 22 on the frame portion 40 and the component supply device 30 so as to face upward. Thus, the parts camera 28 picks up an image of the parts held by the parts holder 78 of the working heads 60 and 62.

  The component supply device 30 is disposed at one end of the frame portion 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 97 and a feeder-type component supply device 98 (see FIG. 10). The tray-type component supply device 97 is a device that supplies components in a state of being placed on the tray. The feeder type component supply device 98 is a device that supplies components by a tape feeder and a stick feeder (not shown).

  The bulk parts supply device 32 is disposed at the other end of the frame portion 40 in the front-rear direction. The loose parts feeder 32 is a device for aligning a plurality of parts scattered in a scattered state and supplying the parts in an aligned state. That is, it is an apparatus which aligns a plurality of parts of an arbitrary posture to a predetermined posture and supplies the components of the predetermined posture.

  The cut and clinch device 34 is disposed below the transfer device 50, and includes a cut and clinch unit 100 and a unit moving device 102, as shown in FIG. The cut and clinch unit 100 includes a unit body 110, a pair of slide bodies 112, and a pitch change mechanism 114, as shown in FIG. A slide rail 116 is disposed on the upper end of the unit body 110 so as to extend in the X direction. A pair of slide bodies 112 are slidably supported by the slide rails 116. Thus, the pair of slide bodies 112 approach and separate in the X direction. Also, the pitch changing mechanism 114 has an electromagnetic motor 118, and the operation of the electromagnetic motor 118 controllably changes the distance between the pair of slide bodies 112.

  Further, as shown in FIG. 8, each of the pair of slide bodies 112 includes a fixed portion 120, a movable portion 122, and a slide device 124, and is slidably held on the slide rail 116 in the fixed portion 120. . Two slide rails 126 are fixed to the back side of the fixed portion 120 so as to extend in the X direction, and the movable portion 122 is slidably held by the two slide rails 126. Thereby, the movable portion 122 slides in the X direction with respect to the fixed portion 120. In addition, the slide device 124 has an electromagnetic motor (see FIG. 10) 128, and the operation of the electromagnetic motor 128 causes the movable portion 122 to controllably slide.

  Further, the upper end portion of the fixing portion 120 is tapered, and the first insertion hole 130 is formed so as to penetrate the upper end portion in the vertical direction. The first insertion hole 130 is opened at the upper end of the upper end surface of the fixing portion 120, and the opening edge to the upper end surface is a fixed blade (see FIG. 11) 131. Further, the first insertion hole 130 is opened at the lower end of the fixing portion 120 at the side surface, and the waste box 132 is disposed below the opening at the side surface.

  Further, as shown in FIG. 9, the upper end portion of the movable portion 122 is also tapered, and a bent portion 133 bent in an L shape is formed at the upper end portion. The bent portion 133 extends above the upper end surface of the fixed portion 120, and the bent portion 133 and the upper end of the fixed portion 120 are opposed via a slight clearance. Further, the first insertion hole 130 opened at the upper end surface of the fixing portion 120 is covered by the bending portion 133, but the second insertion hole 136 is opposed to the first insertion hole 130 in the bending portion 133. Is formed.

  The second insertion hole 136 is a through hole penetrating the bending portion 133 in the vertical direction, and the inner peripheral surface of the second insertion hole 136 is a tapered surface whose inner diameter decreases toward the lower side. Further, the opening edge of the second insertion hole 136 to the lower end surface of the bent portion 133 is a movable blade (see FIG. 16) 138. Further, a guide groove 140 is formed on the upper end surface of the bending portion 133 so as to extend in the sliding direction of the movable portion 122. The guide groove 140 is formed to bridge the opening of the second insertion hole 136, and the guide groove 140 and the second insertion hole 136 are connected. The guide groove 140 is open at both side surfaces of the bending portion 133.

  Further, a substantially plate-like support member 144 is detachably attached by a bolt 146 to a side surface opposite to the side surface facing the movable portion 122 of the fixed portion 120. The upper end portion of the support member 144 extends upward from the upper surface of the fixed portion 120, and faces the bent portion 133 of the movable portion 122 in a state where there is a clearance. The upper end portion of the support member 144 is formed with a protrusion 148 projecting upward, and the upper end of the protrusion 148 is positioned above the bending portion 133 of the fixed portion 120 facing the support member 144. doing.

  The fixed portion 120 is bolted to the upper surface of the fixed main body portion 150, and the movable portion 122 is bolted to the upper surface of the movable main body portion 151. A plurality of types of fixed portions 120 having different inner diameters of the first insertion holes 130 are prepared, and a plurality of types of movable portions 122 having different inner diameters of the second insertion holes 136 are prepared. Therefore, the fixed portion 120 and the movable portion 122 can be removed from the fixed side main body portion 150 and the movable side main body portion 151, and can be replaced with another fixed portion 120 and the movable portion 122.

  Moreover, the unit moving apparatus 102 has the X direction moving apparatus 152, the Y direction moving apparatus 153, the Z direction moving apparatus 154, and the autorotation apparatus 156, as shown in FIG. The X-direction moving device 152 includes a slide rail 160 and an X-slider 162. The slide rail 160 is disposed to extend in the X direction, and the X slider 162 is slidably held by the slide rail 160. Then, the X slider 162 is moved in the X direction by the drive of the electromagnetic motor (see FIG. 10) 164. The Y-direction moving device 153 includes a slide rail 166 and a Y-slider 168. The slide rail 166 is disposed on the X slider 162 so as to extend in the Y direction, and the Y slider 168 is slidably held by the slide rail 166. Then, the Y slider 168 moves in the Y direction by the drive of the electromagnetic motor (see FIG. 10) 170. The Z-direction moving device 154 includes a slide rail 172 and a Z-slider 174. The slide rail 172 is disposed on the Y slider 168 so as to extend in the Z direction, and the Z slider 174 is slidably held by the slide rail 172. Then, the Z-slider 174 moves in the Z direction by the drive of the electromagnetic motor (see FIG. 10) 176.

  The rotation device 156 also has a generally disk-shaped rotary table 178. The rotary table 178 is supported by the Z-slider 174 so as to be rotatable about its axis, and is rotated by driving of an electromagnetic motor (see FIG. 10). The cut and clinch unit 100 is disposed on the rotary table 178. With such a structure, the cut and clinch unit 100 is moved to an arbitrary position by the X-direction moving device 152, the Y-direction moving device 153, and the Z-direction moving device 154, and rotates by an autorotation device 156 at an arbitrary angle. Do. This enables the cut and clinch unit 100 to be positioned at an arbitrary position below the circuit substrate 12 held by the clamp device 52.

  As shown in FIG. 10, the control device 36 includes a controller 190, a plurality of driving circuits 192, an image processing device 196, and a data storage area 197. The plurality of drive circuits 192 include the transfer device 50, the clamp device 52, the work head moving device 64, the opening / closing device 86, the air cylinder 90, the tray type component supply device 97, the feeder type component supply device 98, the bulk component supply device 32, The electromagnetic motors 118, 128, 164, 170, 176, and 180 are connected to each other. The controller 190 includes a CPU, a ROM, a RAM, and the like, is mainly composed of a computer, and is connected to a plurality of drive circuits 192. Thus, the controller 190 controls the operation of the base material conveyance and holding device 22, the component mounting device 24 and the like. The controller 190 is also connected to the image processing apparatus 196. The image processing device 196 processes image data obtained by the mark camera 26 and the part camera 28, and the controller 190 obtains various information from the image data.

  The controller 190 is also connected to the data storage area 197. The data storage area 197 stores various information necessary for executing the mounting operation, for example, the type of substrate to be produced, a production program, etc. The controller 190 stores data necessary for the mounting operation. It is acquired from the storage area 197. The controller 190 is also connected to the input device 198. The input device 198 is used to rewrite the production program stored in the data storage area 197 and to input information on production, and will be described in detail later. Furthermore, the controller 190 is also connected to the display device 199, and a screen for rewriting is displayed on the display device 199 when the production program is rewritten.

<Operation of component mounting machine>
In the component mounting machine 10, the component mounting operation is performed on the circuit substrate 12 held by the substrate conveyance and holding device 22 by the configuration described above. In the component mounting machine 10, various components can be attached to the circuit base 12. However, the case where the lead component 92 is attached to the circuit base 12 will be described below.

  Specifically, the circuit substrate 12 is conveyed to the working position, and is held fixed by the clamp device 52 at that position. Then, the cut and clinch unit 100 is moved below the circuit substrate 12. At this time, in the cut-and-clinch unit 100, the coordinate of the second insertion hole 136 of the movable portion 122 in the XY direction coincides with the coordinate of the through hole 200 (see FIG. 11) of the circuit substrate 12 in the XY direction. At the same time, the upper surface of the protrusion 148 of the fixing portion 120 is not in contact with the lower surface of the circuit substrate 12, and the upper surface of the protrusion 148 is moved slightly lower than the lower surface of the circuit substrate 12.

  Specifically, in the cut and clinch unit 100, the distance between the second insertion holes 136 of the movable portions 122 of the pair of slide bodies 112 is between the two through holes 200 formed in the circuit substrate 12. The distance between the pair of slide bodies 112 is adjusted by the pitch change mechanism 114 so as to be the same as the distance. Then, by the operation of the X direction moving device 152 and the Y direction moving device 153, the coordinates of the second insertion hole 136 of the slide body 112 in the XY direction and the coordinates of the through hole 200 of the circuit substrate 12 in the XY direction The cut and clinch unit 100 is moved to match. As a result, the cut and clinch unit 100 is moved along the X and Y directions so that the second insertion hole 136 of the slide body 112 and the through hole 200 of the circuit substrate 12 are vertically overlapped. .

  Furthermore, in the cut and clinch unit 100, the upper surface of the protrusion 148 of the fixed portion 120 is in contact with the lower surface of the circuit substrate 12 or slightly below the lower surface of the circuit substrate 12 by the operation of the Z direction moving device 154. To be raised. Thus, the operations of the X-direction moving device 152, the Y-direction moving device 153, and the Z-direction moving device 154 are controlled, whereby the second insertion hole 136 of the slide body 112 and the through hole 200 of the circuit substrate 12 are obtained. The cut-and-clinch unit 100 is disposed below the circuit substrate 12 in the overlapping state.

  Further, when the circuit substrate 12 is fixedly held by the clamp device 52, the mark camera 26 moves above the circuit substrate 12 and images the circuit substrate 12. And the controller 190 calculates the information regarding the holding position of the circuit base material 12, etc. based on the imaging data. Further, the component supply device 30 or the bulk component supply device 32 supplies the lead component 92 at a predetermined supply position. Then, either of the working heads 60 and 62 moves above the supply position of the component and holds the lead component 92 by the component holder 78.

  When the lead component 92 is held by the component holder 78, the lead component 92 held by the component holder 78 is imaged, and the coordinates of the tip of the lead 94 in the XY direction are calculated based on the imaging data. Next, the operations of the X-direction moving device 68 and the Y-direction moving device 70 are controlled such that the tip end position of the lead 94 and the position of the through hole 200 of the circuit substrate 12 overlap in the XY coordinate. . Then, the component holder 78 is lowered by the operation of the Z direction moving device 72, whereby the lead 94 of the lead component 92 held by the component holder 78 is inserted into the through hole 200 of the circuit substrate 12. At this time, the pusher 88 of the component holder 78 is lowered, and the lead component 92 is pressed against the circuit substrate 12. Thereby, the lead 94 of the lead component 92 is inserted into the through hole 200 to the root, and the bottom surface of the component body 96 contacts the top surface of the circuit substrate 12. Note that although the circuit base 12 is pressed downward by pressing the lead component 92 against the circuit base 12, the lower surface of the circuit base 12 is supported by the projection 148 of the support member 144. Curvature and breakage of the material 12, and eventually the production of defective substrates and the production stop of the component mounting machine are prevented.

  Thus, when the lead 94 of the lead part 92 is inserted into the through hole 200 of the circuit base 12, the tip end of the lead 94 is, as shown in FIG. 11, of the movable part 122 of the cut and clinch unit 100. The second insertion hole 136 is inserted into the first insertion hole 130 of the fixing portion 120. Next, when the leading end of the lead 94 is inserted into the first insertion hole 130 of the fixed unit 120, the movable unit 122 slides by the operation of the slide device 124. As a result, as shown in FIG. 12, the lead 94 is cut by the fixed blade 131 of the first insertion hole 130 and the movable blade 138 of the second insertion hole 136. Then, the tip portion separated by the cutting of the lead 94 falls within the first insertion hole 130 and is discarded to the discard box 132. Further, the new leading end of the lead 94 due to the cutting is bent along the tapered surface of the inner periphery of the second insertion hole 136 with the slide of the movable portion 122, and the movable portion 122 slides further, The tip of the lead 94 bends along the guide groove 140. As a result, the lead component 92 is mounted on the circuit base 12 in a state in which the lead 94 is prevented from coming off the through hole 200.

  As described above, in the component mounting machine 10, the lead 94 is cut and bent by the cut and clinch device 34, whereby the lead component 92 is attached to the circuit substrate 12. However, when the lead 94 is bent, a load is applied to the through hole 200 with which the lead 94 contacts. Specifically, when the lead 94 is bent, the upper end portion of the second insertion hole 136 of the movable portion 122 in contact with the tip of the lead 94 along with the slide of the movable portion 122 of the cut and clinch unit 100 Become. Further, the lower end portion of the through hole 200 with which the lead 94 comes in contact as the lead 94 bends serves as a fulcrum. Then, when the lead 94 is bent around the fulcrum, a load is applied to the fulcrum, that is, the lower end portion of the through hole 200 of the circuit base 12, and further to the circuit base 12 itself. Such a load is desired to be small from the viewpoint of preventing damage to the circuit substrate 12 and quality control.

  In view of this, in the cut and clinch unit 100, as shown in FIG. 13, two types of support members 144a and 144b are prepared. The two types of support members 144a, b have different lengths of the protrusions 148, and the protrusions 148b of the support member 144b are longer than the protrusions 148a of the support member 144a. In the above description, the support member 144a is used.

  Therefore, in the cut and clinch unit 100 used in the above description, the support member 144a is removed from the fixing portion 120, and the support member 144b is attached to the fixing portion 120 instead of the support member 144a. Then, the lead 94 of the lead part 92 is inserted into the through hole 200 of the circuit base 12 according to the above-mentioned procedure, and the cut and clinch unit 100 cuts and bends the lead 94. At this time, in the cut and clinch unit 100, as shown in FIG. 14, the leads 94 are bent in a state where the amount of bending is suppressed. That is, the lead 94 is bent in a state in which the bending angle is reduced. This is because the supporting member 144b is attached to the fixing portion 120 instead of the supporting member 144a, so that the length of the protrusion 148 becomes longer, and a fulcrum when the lead 94 bends, that is, the lower end portion of the through hole 200; This is because the distance between the operating point, that is, the upper end of the second insertion hole 136 of the movable portion 122 is increased. As described above, by using the support member 144b instead of the support member 144a, it is possible to reduce the bending angle of the lead 94 and to suppress the load applied to the circuit substrate 12 when the lead is bent.

  However, when the support member 144 b is used, the bending angle of the lead 94 becomes smaller along with the suppression of the load on the circuit substrate 12, and the lead component 92 is fixed to the circuit substrate 12 in a state effectively prevented from coming off. There is a possibility that it can not be attached. That is, when the support member 144a is used, the lead component 92 can be attached to the circuit base 12 in a state of being effectively prevented from coming off, but the load applied to the circuit base 12 becomes large. On the other hand, when the support member 144 b is used, the load applied to the circuit base 12 can be reduced, but the lead component 92 can not be attached to the circuit base 12 in a state in which the load is effectively prevented.

  In view of such a thing, in cut and clinch unit 100, exchange of support member 144 is performed at the time of setup change. Specifically, for example, in the case where the circuit substrate 12 made of a fragile material is used, the circuit of a material resistant to breakage, such as a material having high hardness and a material rich in elasticity, with the support member 144b attached to the fixing portion 120. When the base 12 is used, the support member 144 a is attached to the fixing portion 120. Also, for example, when the thin circuit substrate 12 is used, the support member 144b is attached to the fixing portion 120, and when the hot circuit substrate 12 is used, the support member 144a is fixed to the fixing portion 120. Attached to In addition, in the case where a reliable retention of the lead component 92 from the circuit base 12 is not required, that is, in the case where the lead component 92 may be temporarily fixed to the circuit base 12, the support member 144b is a fixing portion. The support member 144 a is attached to the fixing portion 120 when it is attached to 120 and a reliable securing of the lead component 92 from the circuit base 12 is required. Thus, by replacing the support member 144 at the time of stage replacement, the support member 144 can be replaced according to the type of the circuit substrate 12 to be produced, the production program, etc. As a result, the lead component 92 can be attached to the circuit substrate 12. In addition, the combination data of the type of circuit substrate to be produced, the lead parts fixed to the circuit substrate or the production program to be executed, and the support member 144 suitable for the conditions are input to the data storage area 197 and storage It is possible. In addition, the combination data can be browsed from the display device 199 and data input and rewrite from the input device 198.

  As described above, when the support member 144 is replaced, the production program stored in the data storage area 197 is rewritten. In detail, in the production program stored in the data storage area 197, information on the support member 144 before replacement is programmed. Therefore, when the support member 144 is replaced, it is necessary to program information on the replaced support member 144 into the production program stored in the data storage area 197. Therefore, when the support member 144 is replaced, a screen for rewriting a production program is displayed on the display device 199 by an operation on the input device 198. Then, by the operation on the input device 198, information on the support member 144 after replacement is input. Thus, with respect to the production program stored in the data storage area 197, the information on the support member 144 before replacement is rewritten to the information on the support member 144 after replacement. Therefore, during the mounting operation, the operation of the component mounter 10 is controlled in accordance with the support member 144 after replacement. That is, when the cut and clinch unit 100 is raised below the circuit base 12, the cut and clinch unit 100 is raised by an amount according to the length dimension of the support member 144 after replacement. As a result, the upper surface of the protrusion 148 of the support member 144 after replacement does not contact the lower surface of the circuit substrate 12, and the upper surface of the protrusion 148 is slightly lower than the lower surface of the circuit substrate 12. The clinch unit 100 is raised, and the proper mounting operation is secured also in the replacement support member 144. In addition, the type or name of the attached support member 144 is displayed on a predetermined position on the display device so that the operator can confirm it, and the type of the support member 144 input from the input device 198 or If the control unit 36 determines that the name is not suitable for the circuit equipment to be produced and the production program, an indication is given to prompt an inappropriate warning and re-setup.

  By the way, at the time of stage replacement, for example, when the lead component to be attached is changed although the circuit substrate 12 is the same, particularly, the lead component to be attached is a lead component of a lead having a different wire diameter. When changing, the fixed part 120 and the movable part 122 are replaced. That is, the fixed portion 120 and the movable portion 122 are removed from the fixed side body portion 150 and the movable side body portion 151, and the fixed portion 120 and the movable portion 122 of the type according to the wire diameter of the lead 94 are fixed. It is attached to the side main body 151. Thereby, the mounting operation of lead parts 92 having different wire diameters can be appropriately performed. On the other hand, even if the type of the circuit substrate 12 is changed, the fixed portion 120 and the movable portion 122 are not replaced unless the lead component to be mounted is changed. However, even if the lead component to be attached is not changed, the support member 144 is replaced if the type of the circuit substrate 12 is changed. As described above, by replacing the fixed portion 120 and the movable portion 122 and replacing the support member 144 in accordance with the type of step replacement, it is possible to perform a suitable mounting operation of the lead component 92.

  The component mounter 10 is an example of a component mounting apparatus. The circuit base 12 is an example of a substrate. The substrate transport and holding device 22 is an example of a substrate holding device. The component mounting device 24 is an example of a component gripping device. Control device 36 is an example of a control device. The lead component 92 is an example of a lead component. The lead 94 is an example of a lead. The cut and clinch unit 100 is an example of a clinching device. The fixing portion 120 is an example of a fixing claw. The movable portion 122 is an example of a movable claw. The support member 144 is an example of a backup unit. The data storage area 197 is an example of a storage device. The input device 198 is an example of an input device.

  The present invention is not limited to the above-described embodiments, and can be implemented in various modes in which various changes and improvements are made based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the support member 144 is detachably attached to the fixed part 120, but the present invention is not limited to the fixed part 120, and the movable part 122, the fixed side main body 150, the movable side main body 151 For example, it may be made removable to various members. Also, the support member 144 may not be removable from any member, and may be integrally formed with any member. For example, as shown in FIG. 15, a movable portion 212 integrally formed with the support member may be employed. In such a case, the movable portion 212 is removed from the fixed side main body portion 150, and different types of movable portions 212 are attached to the fixed side main body portion 150, whereby replacement of the support member is performed. Further, for the purpose of preventing the bending and breakage of the circuit substrate 12, as the supporting members of different types, although the length of the protrusion 148 is the same, the area of the protrusion 148 supporting the circuit substrate is different. It may be one. Further, a touch panel device provided with the functions of both the input device 198 and the display device 199 may be employed.

  In the above embodiment, the present invention is applied to the cut-and-clinch unit 100 which cuts the lead 94 and bends the lead 94. However, the clinch unit bends the lead 94 without cutting the lead 94. The present invention may be applied to

10: component mounting machine (component mounting device) 12: circuit substrate (substrate) 22: substrate conveyance and holding device (substrate holding device) 24: component mounting device (component holding device) 36: control device 92: lead component 94: Lead 100: cut and clinch unit (clinch device) 120: fixed part (fixed claw) 122: movable part (movable claw) 144: support member (backup part) 197: data storage area (storage device) 198: input device

Claims (5)

A clinch device having a fixed claw, a movable claw that bends a lead inserted into a hole of a substrate according to an operation on the fixed claw, and a backup unit that backs up the substrate from the back surface side;
A substrate holding device for holding a substrate;
A component holding device for holding a lead component attached to a substrate;
A storage device for storing the type of substrate to be produced and a production program, and a control device for controlling the clinching device, the substrate holding device, and the component gripping device to mount lead components on the substrate; The component mounting apparatus which can replace | exchange the said backup part according to the kind of board | substrate to produce or a production program.   The component mounting apparatus according to claim 1, wherein the backup unit of the clinching device comprises a clinching device which is detachably attached to the fixing claw.   2. The clinching device according to claim 1, wherein the backup portion of the clinching device and the fixing claw are integrally formed, and the integrally formed backup portion and the fixing claw are provided with replaceable clinching devices. Component mounting device as described. The component mounting device further comprises an input device,
The information according to any one of claims 1 to 3, wherein the information on the backup unit programmed in the production program can be rewritten by the input to the input device to the information on a backup unit of a type different from the backup unit. The component mounting device described in. A clinch device having a fixed claw, a movable claw that bends a lead inserted into a hole of a substrate according to an operation on the fixed claw, and a backup unit that backs up the substrate from the back surface side;
A substrate holding device for holding a substrate;
A component holding device for holding a lead component attached to a substrate;
A storage device for storing the type of substrate to be produced and a production program, and a control device for controlling the clinching device, the substrate holding device, and the component gripping device to mount lead parts on the substrate A production method of producing a substrate by replacing the backup unit according to a type of a substrate to be produced or a production program in a component mounting apparatus.

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