JP2019107193A - Game machine - Google Patents

Abstract

To provide a proper board configuration.SOLUTION: A signal wiring formed of a second pattern 43AK11 of a wiring corresponds to a first shape part 43AK11L which is formed into a first shape being a linear shape or almost linear shape, and a signal wiring formed of a first pattern 43AK10 of a wiring includes a second shape part 43AK10M such as a meander shape different from the first shape part 43AK11L. On the second shape part 43AK10M on a signal wiring formed of a first pattern 43AK10 of the wiring, as a specific conductor part for connection confirmation, a test point 43AK10TP is provided. On the second shape part 43AK11M on a signal wiring formed of a second pattern 43AK11 of a wiring, as a specific conductor part for connection confirmation, a test point 43AK11TP is provided.SELECTED DRAWING: Figure 30

Description

  The present invention relates to a gaming machine capable of playing a game such as a pachinko gaming machine.

  In gaming machines such as pachinko gaming machines, there has been proposed a technology relating to signal lines for connecting electric components such as a CPU and a ROM (for example, Patent Document 1).

JP 2014-223336 A

  According to the technique described in Patent Document 1, there is a possibility that an appropriate substrate configuration can not be obtained, for example, the synchronization of signals is likely to be disturbed.

  This invention is made in view of the said situation, and aims at provision of the game machine in which an appropriate board | substrate structure is possible.

(1) In order to achieve the above object, the gaming machine according to the claims of the present application is a gaming machine capable of playing a game (for example, pachinko gaming machine 1 etc.), and a first pattern (for example, a plurality of signal wires) A first pattern 43AK10 of wiring and a second pattern (eg, second pattern 43AK11 of wiring) are formed (see, eg, FIG. 30), and a plurality of electrical components (eg, RAM 102 and CPU 103, etc.) are formed by the plurality of signal wirings. A signal wiring formed of one of the first pattern and the second pattern has a first shape of a straight line or a substantially straight line. The other putter of the first pattern and the second pattern corresponding to the shape portion (for example, the first shape portion 43AK10L, 43AK11L, etc.) And the second shape portion (for example, second shape portions 43AK10M, 43AK11M, etc.) having a second shape different from the first shape, and the second shape portion includes a specific conductor for connection confirmation. A unit (for example, test points 43AK10P, 43AK11P, etc.) is provided.
Such a configuration enables an appropriate substrate configuration.

(2) In the gaming machine of the above (1), the first pattern and the second pattern may be formed such that the wiring lengths of the respective signal wirings are the same or substantially the same.
Such a configuration enables an appropriate substrate configuration.

(3) In the gaming machine of the above (1) or (2), the specific conductor portion is formed using a metal material, and is wider than the wiring width of the signal wiring formed by the first pattern or the second pattern. It may be formed (for example, formed such that the wiring width W5 <diameter W6) (see, for example, FIG. 30).
Such a configuration enables an appropriate substrate configuration.

(4) In the game machine according to any one of the above (1) to (3), the substrate includes a plurality of layers (for example, surface layer 44AK1S, ground layer 44AK1L, power supply layer 44AK2L, wiring layer 44AK3L, power supply layer 44AK4L, back surface layer And the specific conductor portion may be connected to a conductor layer different from the layer in which the specific conductor portion is provided among the plurality of layers by through holes (for example, through holes 44AK1H, 44AK2H, etc.) (See, for example, FIG. 31).
Such a configuration enables an appropriate substrate configuration.

(5) In the gaming machine according to any one of the above (1) to (4), the second shape portion is different in the signal wiring formed by the first pattern and the signal wiring formed by the second pattern. It may be formed in a direction (see, for example, FIG. 26).
Such a configuration enables an appropriate substrate configuration.

(6) In the gaming machine according to any one of (1) to (5), the second shape portion is different in the signal wiring formed by the first pattern and the signal wiring formed by the second pattern. It may be formed in the wiring width (see, for example, FIG. 27).
Such a configuration enables an appropriate substrate configuration.

(7) In the gaming machine according to any one of (1) to (6), in the second shape portion, the signal wiring formed by the first pattern and the signal wiring formed by the second pattern are parallel to each other. Alternatively, parallel wiring portions formed substantially in parallel may be included (see, for example, FIG. 28A).
Such a configuration enables an appropriate substrate configuration.

(8) In the gaming machine according to any one of (1) to (7), the second shape portion in the signal wiring formed by the first pattern or the second pattern is formed by another pattern. A circuit component (for example, the circuit component 42AK1R or the like) mounted so as to be connected to the signal wiring may be provided (see, for example, FIGS. 29A and 29B).
Such a configuration enables an appropriate substrate configuration.

(9) In the gaming machine according to any one of (1) to (8), the signal wiring formed by the first pattern or the second pattern is connected to a wiring portion different from the second shape portion. Circuit components (for example, the circuit component 42AK2R etc.) mounted in (see, for example, FIG. 29A).
Such a configuration enables an appropriate substrate configuration.

It is a front view of a pachinko game machine in this embodiment. It is a block diagram which shows the various control boards etc. which were mounted in the pachinko game machine. It is a rear view of a gaming machine frame. It is a disassembled perspective view of the state which looked at a substrate case. It is a disassembled perspective view of the state which looked at a substrate case. It is six views which show a base member. It is six views which show a cover member. It is a perspective view of the state which looked at the receptacle. It is a rear view of the state which looked at the receptacle. It is sectional drawing of the state which looked at the receptacle. It is a figure which shows the transmission path corresponding to wiring. It is a figure which shows the transmission path of a power supply voltage. It is a figure which shows the relationship of wiring length, etc. It is a figure which shows the structural example of a filter circuit. It is a figure which shows the structural example of a noise prevention circuit. It is a figure which shows a power supply monitoring circuit. It is a figure which shows the structural example of the part in which the pattern of wiring was formed. It is a figure which shows the area | region and area for demonstrating the pattern of wiring. FIG. 19 is an enlarged view of the area shown in FIG. 18; It is a figure which shows the example of a setting corresponding to the pattern of wiring. FIG. 19 is an enlarged view of the area shown in FIG. 18; FIG. 19 is an enlarged view of the area shown in FIG. 18; It is sectional drawing which shows the structural example of a main board | substrate. It is a figure which shows the other structural example about the pattern of wiring. It is a figure which shows the structural example which concerns on the characteristic part 42AK. It is a figure which shows the structural example by which the 2nd shape part is formed in the different direction. It is a figure which shows the structural example in which several signal wiring is formed in wiring width which is different. It is a figure which shows the structural example by which the 2nd shape part respond | corresponds and is formed. It is a figure which shows the structural example mounted so that circuit components may be connected. It is a figure which shows the structural example which concerns on the characteristic part 43AK. It is a figure which shows the structural example which concerns on the characteristic part 44AK. FIG. 44 is an exploded perspective view of the substrate case, the substrate, and the heat sink of the gaming machine according to the characteristic part 45AK, as viewed from the rear. FIG. 45 is an exploded perspective view of the substrate case, the substrate, and the heat sink of the gaming machine according to the characteristic part 45AK, as viewed from the front. It is sectional drawing which showed a mode that a heat sink and a board | substrate were attached to a substrate case by attachment order ((a)-(b)). It is sectional drawing which showed a mode that a heat sink and a board | substrate were attached to a substrate case in order of attachment ((a)-(b)) following FIG. It is a top view for demonstrating the relationship between a heat sink and an electronic component. It is an explanatory view for explaining the flow of air in a substrate case. FIG. 14 is a cross-sectional view showing the heat sink and the substrate attached to the substrate case of the gaming machine according to the other embodiment 1; FIG. 21 is a cross-sectional view showing the heat sink and the substrate attached to the substrate case of the gaming machine according to another embodiment 2;

  FIG. 1 is a front view of a pachinko gaming machine 1 according to this embodiment. The pachinko gaming machine 1 includes a gaming board 2 and a gaming machine frame 3. In addition, the pachinko gaming machine 1 is provided with an outer frame and the like rotatably supporting the gaming machine frame 3. The game board 2 is a gauge board that constitutes a game board surface. The gaming machine frame 3 is a frame on which the gaming board 2 is fixed. In the game board 2, a game area surrounded by guide rails and the like is formed. The game ball (game medium) fired from the launch device passes through the launch path and is shot into the game area. In the gaming machine frame 3, a glass door frame having a glass window is rotatably provided.

  At a predetermined position of the game board 2, a first special symbol display device 4A, a second special symbol display device 4B, an image display device 5, an ordinary winning ball device 6A, an ordinary variable winning ball device 6B, a special variable winning ball device 7, A normal symbol display 20, a first hold indicator 25A, a second hold indicator 25B, a general drawing reserve indicator 25C, a passing gate 41 and the like are provided. In addition, on the game board surface in the game area, a windmill, a large number of obstacle nails, a general winning opening, an out opening, and the like may be provided. A game effect lamp 9 is provided at the periphery of the game area. At the upper left and right positions of the gaming machine frame 3, speakers 8L and 8R are provided.

  A hitting operation handle (operation knob) is provided at the lower right position of the gaming machine frame 3. The hitting ball operating handle is operated by the player or the like to shoot the game ball toward the game area, and the resilience of the game ball is adjusted in accordance with the amount of operation (the amount of rotation). An upper tray (ball hitting supply tray) for holding (storing) gaming balls and a lower tray for holding (storing) surplus balls from the upper tray are provided at predetermined positions of the gaming machine frame 3 below the gaming area. It is done. The stick controller 31A is attached to the member forming the lower tray, and the push button 31B is provided to the member forming the upper tray.

  On the screen of the first special symbol display device 4A, the second special symbol display device 4B, the image display device 5, etc., variable display of a special symbol or a decorative symbol is performed. These variable displays are based on the occurrence of the first start winning due to the game ball passing (entering) the first starting winning opening formed in the regular winning ball device 6A, or in the normally variable winning ball device 6B. Execution becomes possible based on the occurrence of the second start winning due to the game ball passing (entering) the formed second start winning opening. The first special symbol display device 4A and the second special symbol display device 4B are respectively configured using, for example, LEDs (light emitting diodes) of 7 segments or dot matrix, and are identified in the special view game as an example of the variable display game. A special symbol (special figure) which is information (special identification information) is variably displayed (variable display). The image display device 5 is configured using, for example, an LCD (liquid crystal display device) or the like, and forms a display area for displaying various effect images. On the screen of the image display 5, the variable display of the special symbol (first special view) by the first special symbol display device 4A in the special figure game and the special symbol (second special figure) by the second special symbol display 4B In correspondence with each of the variable display, a decorative symbol which is identification information (decorative identification information) is variably displayed in decorative symbol display areas which are a plurality of variable display portions such as three. The variable display of this decorative pattern is also included in the variable display game. As an example, on the screen of the image display device 5, decorative symbol display areas 5L, 5C, 5R of "left", "middle" and "right" are arranged.

  On the screen of the image display device 5, a pending storage display area 5H is disposed. In the holding storage display area 5H, a holding display is performed to display the number of holdings of variable display (the number of special drawing holding memories) corresponding to the special drawing game in a distinguishable manner. The pending display may be any one that can be displayed in response to pending storage of information related to variable display. The suspension display using the first suspension indicator 25A and the second suspension indicator 25B may be performed together with or in place of the suspension storage display area 5H.

  FIG. 2 is a block diagram showing a configuration example of various substrates and peripheral devices. In the pachinko gaming machine 1, various control boards such as a main board 11, a presentation control board 12, a voice control board 13 and a lamp control board 14 as shown in FIG. 2 are mounted. The pachinko gaming machine 1 also has a relay board 15, a driver board 19, a power supply board 92, and the like. In addition, various substrates such as, for example, a payout control substrate, an information terminal substrate, a emission control substrate, an interface substrate, a touch sensor substrate, and the like may be mounted. In various control boards, not only electronic circuit boards such as printed wiring boards on which conductor patterns are formed and electric parts are mounted, but also electric parts are mounted (mounted) on the electronic circuit board to realize specific electric functions. It is a concept including an electronic circuit mounting board configured as described above.

  The power supply substrate 92 is configured to be able to supply power from an AC power supply, which is an external power supply (commercial power supply), to electrical components including various control substrates such as the main substrate 11 and the effect control substrate 12. The power supply substrate 92 includes, for example, a rectifier circuit for converting alternating current (AC) to direct current (DC), a power supply circuit for converting a predetermined DC voltage to a specific DC voltage (for example, 12 V DC or 5 V DC), etc. , Equipped. The voltage generated by the power supply substrate 92 may be supplied to the main substrate 11 or the effect control substrate 12 via the drawer relay substrate.

  On the main board 11, a game control microcomputer 100, a switch circuit 110, a solenoid circuit 111 and the like are mounted. In the main board 11, signals taken from various detection switches such as the gate switch 21, the start port switch (the first start port switch 22A and the second start port switch 22B) and the count switch 23 are transmitted through the switch circuit 110. It is transmitted to the game control microcomputer 100. The gate switch 21 detects the gaming ball (gate passing ball) which has passed through the passing gate 41. Based on the detection of the gate passing ball by the gate switch 21, the variable display of the normal symbol by the normal symbol display 20 can be performed. The first starting opening switch 22A detects the gaming ball having passed (entered) the first starting winning opening. The second starting opening switch 22B detects the gaming ball having passed (entered) the second starting winning opening. The count switch 23 detects the game ball which has passed (entered) the special winning opening. When game balls having passed through various winning openings such as the first start winning opening, the second starting winning opening, and the large winning opening are detected, the winning balls are determined in advance in number corresponding to the respective winning openings. The game ball is paid out.

  In the main board 11, a solenoid drive signal from the game control microcomputer 100 is transmitted to the solenoid 81 for the ordinary electric role and the solenoid 82 for the special winning opening door through the solenoid circuit 111. The solenoid 81 for the ordinary electric role product is in a state (or a state in which it is easy to pass through) the gaming ball hardly passes (or does not pass) the second starting winning opening formed in the normally variable winning ball device 6B. And changeable. A solenoid 82 for the special winning opening door can change the special winning opening formed on the special variable winning ball device 7 into a state where the gaming ball can not pass and a state where the gaming ball can not pass. From the main substrate 11, a command signal for performing display control of the first special symbol display device 4A, the second special symbol display device 4B, the normal symbol display device 20 and the like is transmitted.

  The game control microcomputer 100 mounted on the main substrate 11 is, for example, a one-chip microcomputer, and a ROM 101 for storing a program for game control, fixed data, etc., and a RAM 102 for providing a work area for game control , A CPU 103 for executing a control operation by executing a program for game control, a random number circuit 104 for updating numerical data indicating a random number independently of the CPU 103, and an I / O (Input / Output port) 105 It comprises and is constituted. As an example, in the game control microcomputer 100, the CPU 103 executes a program read from the ROM 101 to execute a process for controlling the progress of the game in the pachinko gaming machine 1. In the game control microcomputer 100 mounted on the main substrate 11, various random number values used to control the progress of the game, for example, by the random number circuit 104 and a game random counter provided in a predetermined area of the RAM 102 are used. The numerical data to be displayed is counted (generated) updatable. The random numbers used to control the progress of the game are also called game random numbers.

  Based on the reception of the control signal (rendering control command) transmitted from the main substrate 11 via the relay substrate 15, the effect control substrate 12 controls the image display device 5, the speakers 8L and 8R, the game effect lamp 9, and the motor for effecting It is possible to control the rendering operation by the electronic components for presentation such as 60 and the LED 61 for presentation. On the effect control board 12, a CPU 120 for effect control, a ROM 121, a RAM 122, a display control unit 123, a random number circuit 124, an I / O 125 and the like are mounted.

  The effect control CPU 120 mounted on the effect control board 12 uses the effect control program read from the ROM 121, fixed data, and the like to execute processing for controlling the effect operation by the effect electric component. The display control unit 123 mounted on the effect control board 12 determines the control content of the display operation in the image display device 5 based on the display control instruction from the effect control CPU 120 and the like. For example, the display control unit 123 performs control to execute variable display of decorative symbols and various effect displays by determining the switching timing of the effect image to be displayed in the display screen of the image display device 5 or the like.

  A controller sensor unit 35A and a push sensor 35B are connected to the effect control board 12. The controller sensor unit 35A includes a tilt direction sensor and a trigger sensor. The tilting direction sensor makes it possible to detect the tilting direction of the operating rod using a plurality of sensors when the tilting operation on the operating rod of the stick controller 31A is performed. The trigger sensor makes it possible to detect the presence or absence of a push operation on a trigger button provided on the operating rod of the stick controller 31A. That is, the controller sensor unit 35A can detect the operation of the player using the stick controller 31A, such as the tilting operation on the operation stick of the stick controller 31A and the pushing and pulling operation on the trigger button. The push sensor 35B can detect the operation of the player using the push button 31B, such as the pressing operation on the push button 31B. In the effect control board 12, for example, numerical data indicating various random number values used to control the execution of effects are countably updated (for example, by a random counter for effect provided in a predetermined area of the random number circuit 124 or the RAM 122). Generated). The random numbers used to control the execution of the effect are also referred to as effect random numbers.

  The effect control board 12 has a first board 12A and a second board 12B connected to the first board 12A on a board-to-board basis. The first substrate 12A is mounted with a CPU 120 for effect control and a graphics processor of the display control unit 123, and the second substrate 12B is an electrical component in which data unique to the model such as the ROM 121 and image data memory are stored. Is mounted. The graphics processor of the display control unit 123 may be a microprocessor integrated with the function of the CPU 120 for effect control, or may be a microprocessor configured as a chip separate from the CPU 120 for effect control.

  The voice control board 13 is a control board for voice output control provided separately from the effect control board 12, and outputs voice from the speakers 8L and 8R based on a command from the effect control board 12, control data, etc. The processing circuit etc. which perform the audio signal processing for making it be carried are carried. If a graphics controller or the like constituting the display control unit 123 mounted on the effect control board 12 can execute audio signal processing, a band pass filter, an amplifier circuit, etc. may be mounted on the audio control board 13. Alternatively, the sound control board 13 may be omitted, and a band pass filter, an amplifier circuit, etc. may be mounted on the effect control board 12. The lamp control board 14 is a control board for lamp output control provided separately from the effect control board 12, and based on commands and control data from the effect control board 12, lighting of the game effect lamp 9, etc. A lamp driver circuit or the like for turning off the light is mounted. The driver board 19 is a control board for driving an electric component provided separately from the effect control board 12, and various motors included in the effect motor 60 based on commands and control data from the effect control board 12. The driver circuit etc. for performing lighting control of various LED contained in rotation control of these, LED61 for presentation, etc. are mounted. An output signal from the driver board 19 is transmitted to each motor included in the effect motor 60 and each LED included in the effect LED 61.

  In the pachinko gaming machine 1, a predetermined game using a game ball as a game medium is performed, and a predetermined game value can be provided based on the game result. As an example of the game using the game ball, the predetermined operation based on the predetermined operation (for example, the rotation operation) by the player, the hitting operation handle provided at the lower right position of the gaming machine frame 3 in the pachinko gaming machine 1 A game ball as a game medium is shot toward the game area by a launch motor or the like provided in the hit ball launch device of the invention. When the game ball having flowed down the game area passes (enters) various winning openings, the game ball as a winning ball is paid out. When the variable display result of the special symbol or the decorative symbol is "big hit", the large winning opening is opened and the gaming ball is easily passed (entered), which is an advantageous state advantageous to the player. It becomes big hit game state of.

  The advantageous state is not limited to the jackpot gaming state, but may include special gaming states such as a time saving state or a probability changing state. In addition, the upper limit number of round games that can be executed in the jackpot gaming state becomes the first round number (for example, "15") that is larger than the second round number (for example, "7"). The upper limit number of variable display becomes the first number (for example, "100") that is larger than the second number (for example, "50"), and the big hit probability in the positive change state is higher than the second probability (for example, 1/50) 1 probability (for example, 1/20), the number of consecutive chans which is the number of times repeatedly controlled to the big hit gaming state without being controlled to the normal state is more than the second consecutive chan number (for example "5") It may be included that the game situation is more advantageous to the player, such as a part or all of becoming one consecutive channel number (for example, “10”).

  In the main board 11, when power supply from the power supply board 92 is started, the CPU 103 of the game control microcomputer 100 is activated, and execution of the game control main process is started by the CPU 103. In the game control main processing, the CPU 103 performs the necessary initialization after setting the interrupt prohibition. When initialization is completed, the interrupt processing is enabled, and loop processing is started. Thereafter, an interrupt request signal is sent from the CTC to the CPU 103 every predetermined time (for example, 2 milliseconds), and the CPU 103 periodically executes a game control timer interrupt process.

  The game control timer interrupt process includes a switch process, a main side error process, an information output process, a game random number update process, a special symbol process process, a normal symbol process process, a command control process and the like. In the switch process, the state of detection signals input from various switches is determined. In the main side error processing, abnormality diagnosis of the pachinko gaming machine 1 is performed, and if necessary, a warning can be generated. In the information output process, predetermined data supplied to the hole management computer is output. In the gaming random number update process, at least a part of the gaming random number is updated by software. In the special symbol process process, various processes are selected and executed in order to perform display control of the special symbol, opening / closing operation setting of the special winning opening, and the like in a predetermined procedure. In the normal symbol process processing, various processes are selected and executed in order to perform display control of the normal symbol, tilt operation setting of the movable wing piece in the normally variable winning ball device 6B, and the like in a predetermined procedure.

  In the special symbol process process, first, the start winning determination process is executed. After the start winning determination process is executed, the process selected according to the value of the special drawing process flag is executed. At this time, selectable processing includes special symbol normal processing, variation pattern setting processing, special symbol variation processing, special symbol stop processing, big hit open pretreatment, big hit open processing, big hit open post processing, big hit finish processing, etc. It should just be.

  In the start winning determination process, it is determined whether or not the first start win or the second start win has occurred, and if it has occurred, settings for updating the number of stored special maps are made. In the special symbol normal processing, it is determined whether to start the execution of the special figure game. Further, in the special symbol normal processing, it is determined whether or not the variable display result of the special symbol or the decorative symbol is to be a "big hit". Furthermore, in the special symbol normal processing, the setting of the finalized special symbol in the special figure game, etc. are performed corresponding to the variable display result. In the fluctuation pattern setting process, the fluctuation pattern is determined based on the variable display result or the like. In the special symbol variation process, settings for changing the special symbol, settings for measuring an elapsed time from the start of variation, and the like are performed. In the special symbol stop process, the variation of the special symbol is stopped, and the setting for displaying (deriving) the determined special symbol as the variable display result is performed.

  In the big hit opening pre-processing, the variable display result corresponds to "big hit", and settings for opening the big winning opening in the big hit gaming state are performed. In the big hit open processing, it is determined whether or not to return the big winning opening from the open state to the closed state. In the big hit open post-processing, after returning the big winning opening to the closed state, it is determined whether the number of round executions has reached the upper limit, and if it has not reached, the next round can be executed, if it has reached Settings for ending the jackpot gaming state are performed. In the big hit end process, after waiting until a waiting time corresponding to an execution period of ending effect notifying the end of the big hit gaming state has elapsed, setting for starting probability change control or time saving control is performed.

  In the effect control board 12, when power supply from the power supply board 92 is started, the effect control CPU 120 starts execution of the effect control main process. In the effect control main processing, after predetermined initialization is performed, each time a timer interrupt occurs, command analysis processing, effect control process processing, and effect random number updating processing are executed. In the command analysis process, the effect control command transmitted from the main substrate 11 is analyzed, and a flag corresponding to the analysis result is set. In the effect control process, various processes are selected and executed in order to control the electric component for effect in accordance with a predetermined procedure. In the effect random number updating process, the count value or the like for generating the effect random number is updated by software.

  In the effect control process, a hold display update process is first executed. After executing the hold display update process, the process selected according to the value of the effect process flag is performed. At this time, selectable processing may include variable display start waiting processing, variable display start setting processing, variable display effect processing, variable display stop processing, jackpot display processing, jackpot effect processing, ending effect processing, etc. .

  In the on-hold display update process, settings for updating the display of the on-hold storage display area 5H in accordance with the number of special-mode on-hold storages are performed. In the variable display start waiting process, it is determined whether or not to start variable display of a special symbol or a decorative symbol. In the variable display start setting process, settings for starting variable display of a decorative pattern are performed. In the variable display effect process, settings for controlling the electric component for effect according to the effect control pattern are performed corresponding to the variable display of the decorative symbol. In the variable display stop process, control is performed to stop the variable display of the decorative symbol and derive a finalized decorative symbol as a variable display result.

  In the big hit display process, the variable display result corresponds to “big hit”, and control for executing an effect (fanfare effect) for notifying the occurrence of a big hit is performed. In the big hit internal effect processing, settings for controlling the electric components for effect according to the effect control pattern are performed corresponding to the big hit gaming state. In the ending effect process, settings for controlling the execution of ending effect are performed corresponding to the end of the big hit gaming state.

  FIG. 3 is a rear view of the gaming machine frame 3 provided in the pachinko gaming machine 1. A ball tank 150 and a terminal substrate 154 are provided on the upper back of the gaming machine frame 3. In addition, a supply passage 151, a payout device 152, and a winning ball passage 153 are also provided. On the back of the game board 2, a board case 400 for a game control board, a board case 800 for an effect control board, and a cover body 301 are provided. The substrate case 400 accommodates the main substrate 11. The substrate case 800 accommodates the effect control substrate 12. The cover body 301 is made of a transparent synthetic resin or the like, and covers the substrate case 800 and the upper portion of the substrate case 400. At the lower position of the gaming control board substrate case 400, a payout control board 91 and a power supply board 92 are provided so as to overlap in the front and back.

  The structure of the substrate case 800 for effect control substrate will be described with reference to FIGS. 4 to 7. FIG. 4 is an exploded perspective view showing the substrate case 800 as viewed from obliquely above the left rear. FIG. 5 is an exploded perspective view showing the substrate case 800 as viewed obliquely from above the right front. FIG. 6 is a six-sided view showing the base member 801. As shown in FIG. FIG. 7 is a six-sided view showing the cover member 802. As shown in FIG. The substrate case 800 includes a base member 801 and a cover member 802, and is assembled so as to sandwich the effect control substrate 12 from the front and back. The base member 801 covers the front side of the effect control board 12, and the cover member 802 covers the back side of the effect control board 12.

  The base member 801 is made of a transparent thermoplastic synthetic resin, and includes a base plate 801a formed in a vertically elongated substantially rectangular shape, and side walls 801b to 801e erected on the upper and lower and left and right sides toward the back side. , It is formed in the box shape opened toward the back side. The base plate 801 a includes bosses 803 and 804, locking bars 805, locking hooks 806, locking holes 807, locked portions 808, screw holes 810 of one-way screws 809, mounting holes 811, and substrate supporting ribs 812, 813, stepped portions 814a and 814b, and ribs 815 are provided.

  The cover member 802 is made of a transparent thermoplastic synthetic resin, and includes a base plate 821a formed in a vertically elongated substantially rectangular shape, and side walls 821b to 811e erected on the upper and lower and left and right sides toward the back side. , It is formed in the box shape opened toward the back side. The base plate 821a has a screw hole 823 into which the screw 822 is screwed, a positioning convex portion 824, a screw hole 826 into which the screw 825 is screwed, a positioning convex portion 827, a locking hook 831, a locking piece 832, a locking A portion 833, a mounting piece 834 in which a mounting hole 834a of the one-way screw 809 is formed, a switch opening 835 for exposing the volume control switch 835a to the outside, and connector openings 836 and 837 are provided.

  The connector opening 836 is formed in a vertically elongated shape so that the various substrate connectors KCN 10 mounted on the first substrate 12A can be exposed to the outside on the upper right side of the base plate 821a. The various substrate connectors KCN10 may include the receptacles KRE1 to KRE4. The receptacle KRE1 is a connector port for main board wiring. The receptacle KRE2 is a connector port for power supply substrate wiring. The receptacle KRE3 is a connector port for driver board wiring. The receptacle KRE 4 is a connector port for voice control board wiring. The arrangement of the receptacles and the wiring to be connected may be arbitrarily changed according to the specification of the pachinko gaming machine 1.

  The receptacle KRE 1 for main board wiring has a configuration of a wiring connection device capable of detachably connecting signal wiring (main board wiring) electrically connected with the main board 11. The receptacle KRE 2 for power supply substrate wiring has a configuration of a wiring connection device capable of detachably connecting signal wiring (power supply substrate wiring) electrically connected with the power supply substrate 92. The receptacle KRE 3 for driver substrate wiring has a configuration of a wiring connection device capable of detachably connecting signal wiring (driver substrate wiring) electrically connected with the driver substrate 19. The receptacle KRE 4 for voice control board wiring has a configuration of a wire connection device capable of detachably connecting signal wiring (voice control board wiring) electrically connected with the voice control board 13.

  8 to 10 show a configuration example of the receptacle KRE1. FIG. 8A is a perspective view showing the left rear as viewed obliquely from below. FIG. 8 (B) is a perspective view showing a state of the left rear as viewed from obliquely above. FIG. 9 is a rear view showing a state in which the vicinity of the receptacle KRE 1 outside the cover member 802 is viewed from the rear side (rear side). FIG. 10 is a cross-sectional view showing the vicinity of the receptacle KRE1 as viewed from the lower side. The receptacle KRE1 includes a housing in which the insertion port OP1 is formed, and terminals TA01 to TA03.

  The insertion opening OP1 is an opening portion into which a connector plug provided on the main substrate wiring can be inserted and attached. The terminals TA01 to TA03 are made of metal such as copper, for example, and correspond to the plurality of terminals provided on the connector plug when the connector plug of the main board wiring is inserted into the insertion port OP1. It is a metal member which is in electrical contact with the terminal placed at the position. In the receptacle KRE 1, terminals TA 01 and TA 03 serving as a pair of ground terminals are surface-mounted on the substrate of the effect control board 12 at positions sandwiching both sides of the terminal TA 02 serving as a signal terminal. In the main substrate wiring, ground lines serving as a pair of ground voltage lines may be provided at positions sandwiching both sides of the signal line serving as the signal transmission line. Alternatively, even if the coaxial cable is used as the main board wiring, the inner conductor of the coaxial cable is electrically connected to the terminal TA02, and the outer conductor of the coaxial cable is electrically connected to the terminals TA01 and TA03. Good.

  The receptacles KRE1 can be joined to connection pads provided on the effect control substrate 12 (first substrate 12A) with the terminals TA01 to TA03 drawn out on the side surface PL1 to be the terminal arrangement surface. The method of bonding the terminal to the connection pad may be a metal bonding method using solder or the like, or may be an adhesive bonding method such as conductive resin bonding or anisotropic conductive member bonding. Fixing brackets SS01 and SS02 are provided on the side of the side surface PL2 which is the back side of the side surface PL1.

  In the cover member 802 of the substrate case 800, of the connector openings 836, the opening area 836a formed corresponding to the receptacle KRE1 has a narrower opening width than the opening area formed corresponding to the other receptacles. It may be formed to be Each of the terminals TA01 to TA03 of the receptacle KRE1 is formed to have an exposed portion exposed from the substrate case 800 in the opening region 836a and a covered portion which is covered by the substrate case 800 and not exposed. For example, in the terminals TA01 to TA03, the tip end portion joined to the corresponding connection pad may be included in the covering portion which is covered by the cover member 802 of the substrate case 800 and is not exposed.

  If the component housing portion 802a and the opening peripheral portion 840 forming the inner peripheral wall surface 836b to be the inner end surface in the opening region 836a are integrally formed on the cover member 802 of the substrate case 800 via the sloped portion 821e1. Good. The component storage portion 802 a is formed so as to be able to store at least a part of the electrical components mounted on the effect control substrate 12. In the opening region 836a, the distance between the inner peripheral wall surface 836b and the receptacle KRE1 is such that the distance between the inner peripheral wall surface 836b far from the component storage portion 802a and the side surface PL2 of the receptacle KRE1 is the opening width W1. An opening width W2 is a distance between the near inner peripheral wall surface 836b and the side surface PL1 which is a terminal disposition surface of the receptacle KRE1. The arrangement of the opening area 836a and the receptacle KRE1 may be adjusted so that the opening width W2 is wider than the opening width W1. In the terminals TA01 to TA03 of the receptacle KRE1, the tip end portion which is a mounting position joined to the corresponding connection pad and mounted on the surface is covered by the opening peripheral portion 840 forming the inner peripheral wall surface 836b in the opening region 836a. A space SP1 as a space is formed near the mounting position of the receptacle KRE1 by the opening peripheral portion 840 of the cover member 802 and the substrate surface of the effect control board 12.

  The terminal TA01 is bonded to the dummy pad DP1 provided on the effect control substrate 12. The terminal TA03 is bonded to the dummy pad DP2 provided on the effect control substrate 12. The terminals TA01 and TA03 are joined to the connection pad GPA1. The connection pad GPA1 may be connected to the wiring layer LY4 in which the wiring pattern for grounding is formed through the through holes provided in the effect control substrate 12. In the section of the effect control board 12 shown in FIG. 10, the wiring layer LY2 is formed between the insulating layer LY1 and the insulating layer LY3, and the surface on which the receptacle KRE1 is surface mounted is protected using, for example, polyimide. It is sufficient if the layer LY0 is formed. As described above, the wiring pattern in the effect control substrate 12 may be formed in the wiring layer LY2 provided between the insulating layer LY1 and the insulating layer LY3 serving as the inner layer in the substrate of the effect control substrate 12. Alternatively, the wiring pattern in the effect control board 12 may be formed on the surface of the effect control board 12. The terminal TA02 is joined to a connection pad electrically connected to the wiring pattern for signal transmission.

  The fixing bracket SS01 provided in the receptacle KRE1 is joined to a dummy pad DP3 provided on the effect control board 12. The fixing bracket SS02 provided in the receptacle KRE1 is joined to the dummy pad DP4 provided on the effect control substrate 12. Thus, on the side of the side surface PL2 on the back side of the side surface PL1 where the terminals TA01 to TA03 are arranged, the fixing brackets SS01 and SS02 are provided on the substrate of the effect control substrate 12, and dummy pads DP3 and DP4. It is sufficient to be bonded to the

  While the presentation control command is transmitted from the main substrate 11 to the presentation control substrate 12, there may be only one signal line serving as a signal transmission line in the main substrate wiring for transmitting the command. . Corresponding to this, in receptacle KRE1 surface-mounted on the board of effect control board 12, a case where only terminal TA02 used as a signal terminal is provided is also considered. In this case, the area of the bonding surface of the effect control board 12 on the substrate according to the lateral width and depth of the receptacle KRE1 corresponds to the protrusion amount of the effect control board 12 from the substrate surface according to the height of the receptacle KRE1. Since it becomes easy to reduce, there exists a possibility that it may become impossible to fully ensure the joint intensity by surface mounting of receptacle KRE1. Therefore, in the receptacle KRE 1, the terminals TA 01 and TA 03 serving as a pair of ground terminals are surface-mounted on the substrate of the effect control board 12 at positions sandwiching both sides of the terminal TA 02 serving as a signal terminal. As a result, an appropriate substrate configuration that can sufficiently ensure the bonding strength by surface mounting of the receptacle KRE 1 is possible. Further, since both sides of the terminal TA02 serving as a signal terminal are sandwiched between the terminals TA01 and TA03 serving as a pair of ground terminals, an appropriate substrate configuration that is less susceptible to noise can be realized.

  In the receptacle KRE1, the terminal TA01 is joined to the dummy pad DP1 provided on the substrate of the effect control board 12, and the terminal TA03 is joined to the dummy pad DP2 provided on the substrate of the effect control board 12. Further, tip portions of the terminals TA01 to TA03 are disposed so as to be covered by the cover member 802 of the substrate case 800. As described above, since the terminals TA01 and TA03 are bonded to the dummy pads DP1 and DP2, it is possible to achieve an appropriate substrate configuration capable of sufficiently securing the bonding strength by surface mounting of the receptacle KRE1. Since the tips of the terminals TA01 to TA03 are covered with the cover member 802 of the substrate case 800, an appropriate substrate configuration that can protect important portions in surface mounting, such as the junctions between the terminals and the substrate surface, is possible. Note that the terminal TA 02 that is to be a signal terminal may be bonded to the dummy pad or may not be bonded to the dummy pad. The signal deterioration due to the influence of the conductor shape may be prevented by preventing the terminal TA 02 serving as the signal terminal from being bonded to the dummy pad.

  In receptacle KRE1, fixing bracket SS01 is joined to dummy pad DP3 provided on the board of effect control board 12 on the side of side PL2 on the back side of side face PL1 on which terminals TA01 to TA03 are arranged, and fixed. The metal fitting SS02 is bonded to the dummy pad DP4 provided on the effect control substrate 12. As described above, since the fixing brackets SS01 and SS02 are joined to the dummy pads DP3 and DP4, it is possible to provide an appropriate substrate configuration capable of sufficiently securing the joint strength by surface mounting of the receptacle KRE1. In addition, any fixing method such as bonding a fixing member using a synthetic resin similar to that of the housing of the receptacle KRE 1 onto a substrate is possible regardless of the method of bonding metal members such as fixing brackets SS01 and SS02 onto the substrate. Any member may be used as long as the member can be bonded onto the substrate.

  The component housing portion 802a of the cover member 802 of the substrate case 800 is formed so as to be able to receive at least a part of the electric components mounted on the substrate of the effect control substrate 12, and the inner peripheral wall surface 836b in the opening region 836a and the receptacle KRE1. The opening width W2 of the side close to the component storage portion 802a is formed wider than the opening width W1 of the far side. The side close to the component storage portion 802a is the side of the side surface PL1 which is a terminal disposition surface on which the terminals TA01 to TA03 are drawn out in the receptacle KRE1. On the other hand, the side far from the component storage portion 802a is the side of the side face PL2 which is the back side of the terminal arrangement face in the receptacle KRE1. Therefore, the distance between inner peripheral wall surface 836b and receptacle KRE1 in opening region 836a is the opening width on the side corresponding to side PL2 where the opening width W2 on the side corresponding to side PL1 serving as the terminal arranging face corresponds to the back surface It is formed wider than W1. The adjusted opening width enables, for example, an appropriate substrate configuration that allows the cover member 802 to be easily attached, removed, or aligned. In addition, an appropriate board configuration that can suppress damage due to a collision between the terminal arrangement surface of the receptacle KRE1 and the cover member 802 at the time of attachment or removal of the cover member 802 is possible.

  Each of the terminals TA01 to TA03 of the receptacle KRE1 is not covered by the cover member 802 of the substrate case 800 in the opening area 836a, and an exposed part exposed and a cover part not covered by the cover member 802 of the substrate case 800 are formed. Ru. As described above, unlike the exposed portion, each of the terminals TA01 to TA03 is provided with a covered portion which is covered and not exposed, so that important portions in surface mounting can be protected, such as a joint portion between the terminal and the substrate surface. Appropriate substrate configuration is possible.

  In the terminals TA01 to TA03 of the receptacle KRE1, the mounting position surface-mounted to be bonded to the corresponding connection pad on the effect control substrate 12 is the opening of the cover member 802 forming the inner peripheral wall surface 836b in the opening region 836a. It is covered by the rim 840. Then, a space SP1 close to the mounting position of the receptacle KRE1 is formed by the opening peripheral edge portion 840 of the cover member 802 and the substrate surface of the effect control substrate 12. As described above, since the opening peripheral portion 840 of the cover member 802 and the substrate surface of the effect control substrate 12 are arranged so as to be position adjustable, an appropriate substrate configuration capable of protecting the mounting position of the receptacle KRE1 is possible.

  FIG. 11A shows a transmission path corresponding to the main substrate wiring. As shown in FIG. 11A, the signal SCD supplied to the terminal TA 02 in the main substrate wiring receptacle KRE 1 is input to the effect control CPU 120 via the input driver circuit 130. The terminals TA01 and TA03 of the receptacle KRE1 are grounded (connected to the ground line).

  FIG. 11B shows a transmission path corresponding to the power supply substrate wiring. The receptacle KRE2 for power supply substrate wiring includes terminals TA11 to TA30. Among these, in the receptacle KRE2, the terminals TA11 and TA12 corresponding to the outside and the terminals TA29 and TA30 are all grounded (connected to the ground line). In addition to the terminals TA11, TA12, TA29, and TA30, the terminals TA25 and TA26 are grounded (connected to the ground line). A power supply voltage VSL2 of 34 V DC is supplied to the terminals TA13 and TA14 of the receptacle KRE2. A power supply voltage VDD2 of 12 V DC is supplied to the terminals TA15 to TA20 of the receptacle KRE2. A power supply voltage VCC2 of 5 V DC is supplied to the terminals TA21 to TA24 of the receptacle KRE2. A power supply voltage VDD3 of DC 12 V is supplied to the terminals TA27 and TA28 of the receptacle KRE2.

  Power supply voltage VSL2 of direct current 34 V supplied from power supply substrate 92 to effect control substrate 12 via power supply substrate wiring connected to receptacle KRE2 for power supply substrate wiring is output from effect control substrate 12 as power supply voltage VSL as it is The driver substrate 19 is supplied via the driver substrate wiring connected to the receptacle KRE 3 for driver substrate wiring. For example, in receptacle KRE2 for power supply substrate wiring, terminals TA13 and TA14 receiving supply of power supply voltage VSL2 are connected to power supply line LSL, and power supply line LSL is connected to a predetermined terminal in receptacle KRE3 for driver substrate wiring . As shown in FIG. 4, receptacle KRE 2 for power supply substrate wiring is provided adjacent to receptacle KRE 3 for driver substrate wiring, and power supply line LSL does not approach main electric circuits or electrical parts in effect control substrate 12. It may be arranged to pass through the end of the substrate 12.

  FIG. 12 shows the transmission path of the power supply voltage VSL. In the power supply substrate 92, a power supply voltage VSL2 of DC 34 V is generated from a commercial power supply which is an external power supply, using the transformer circuit 501, the DC voltage generation circuit 502 and the like. For example, in the transformer circuit 501, a power supply voltage of 24 V AC is generated. The DC voltage generation circuit 502 includes a rectification circuit and a smoothing circuit, and rectifies and smoothes a power supply voltage of 24 V AC to generate a power supply voltage VSL2 of 34 V DC. The power supply voltage VSL2 of 34 V DC is not controlled by feedback control or the like, so the power supply voltage VSL2 of 34 V DC also fluctuates due to the fluctuation of the power supply voltage of 24 V AC. As described above, the power supply voltage VSL2 of 34 V DC supplied to the terminals TA13 and TA14 of the receptacle KRE2 is a DC voltage with a large fluctuation range (ripple component) in which voltage control is not performed. On the other hand, the power supply voltage VDD2 of DC 12 V supplied to the terminals TA15 to TA20 of the receptacle KRE2, the power supply voltage VCC2 of DC 5 V supplied to the terminals TA21 to TA24 of the receptacle KRE2, and the terminals TA27 and TA28 of the receptacle KRE2 The power supply voltage VDD3 of 12 V DC is voltage controlled by feedback control in the power supply substrate 92, and may be a DC voltage having a smaller fluctuation range (ripple component) compared to the power voltage VSL of 34 V DC. .

  In the effect control board 12, the power supply line LSL corresponding to the power supply voltage VSL of DC 34 V does not interpose the stabilization circuit for stabilizing the voltage such as the filter circuit. On the other hand, in the driver substrate 19, the power supply voltage VSL of DC 34 V is input to the filter circuit 511 to stabilize the voltage. Further, in the effect control board 12, a stabilization circuit for stabilizing the voltage by a filter circuit or the like intervenes on the power supply line corresponding to the power supply voltage different from the power supply voltage VSL of 34 V DC.

  For example, in receptacle KRE2 for power supply substrate wiring, terminals TA15 to TA20 to which power supply voltage VDD2 of 12 V DC is supplied are connected to filter circuit 131a, and terminals TA21 to TA24 to which power supply voltage VCC2 of 5 V DC is supplied are filter The terminals TA 27 and TA 28 connected to the circuit 131 b and supplied with the power supply voltage VDD 3 of 12 V DC are connected to the filter circuit 131 c. The output portion of the filter circuit 131a is connected to a power supply line LDS supplying a 12 V DC power supply voltage VDS, and the output portion of the filter circuit 131b is connected to a power supply line LCC supplying a 5 V DC power supply voltage VCC. The output unit is connected to a power supply line LDC that supplies a power supply voltage VDC of 12 V DC. Thus, filter circuit 131a is interposed between terminals TA15-TA20 of receptacle KRE2 and power supply line LDS corresponding to power supply voltage VDS of 12 V DC, and filter circuit 131b is the power supply voltage of terminals TA21-TA24 of receptacle KRE2 and DC 5 V The filter circuit 131c intervenes between the terminals TA27 and TA28 of the receptacle KRE2 and the power supply line LDC corresponding to the power supply voltage VDC of 12 V DC.

  The power supply line LSL is provided to supply a 34 V DC power supply voltage VSL. The power supply line LDS is provided to supply a 12 V DC power supply voltage VDS. The power supply line LCC is provided to supply a power supply voltage VCC of 5 V DC. The power supply line LDC is provided to supply a power supply voltage VDC of 12 V DC. Therefore, the power supply line LSL not including the filter circuit is provided to supply a high power supply voltage as compared with any of the power supply lines LDS, LCC, and LDC in which the filter circuit is interposed.

  In the receptacle KRE2, six terminals TA15 to TA20 to which the power supply voltage VDD2 of 12 V DC is supplied, four terminals TA21 to TA24 to which the power supply voltage VCC2 of 5 V DC is supplied, and two power supplies VDD3 of 12 V DC are supplied While the terminals TA27 and TA28 are provided, two terminals TA13 and TA14 to which a 34 V DC power supply voltage VSL2 is supplied are provided. Therefore, in the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the terminals TA15 to TA20, TA21 to TA24, TA27, and TA28 connected to the filter circuit are not connected to the filter circuit. It becomes more than the number of terminals of TA14. The number of terminals corresponding to each power supply voltage may be set according to the power supply capacity and the load current.

  In receptacle KRE2, power supply voltage VDD2 of DC 12 V is supplied to terminals TA15 to TA20, power supply voltage VCC2 of DC 5 V is supplied to terminals TA21 to TA24, and power supply voltage VDD3 of DC 12 V is supplied to terminals TA27 and TA28. Thus, a power supply voltage VSL2 of 34 V DC is supplied to the terminals TA13 and TA14. A filter circuit 131a intervenes between the terminals TA15 to TA20 of the receptacle KRE2 and the power supply line LDS supplying the power supply voltage VDS of 12 V DC to supply the terminals TA21 to TA24 of the receptacle KRE2 and the power supply voltage VCC of 5 V DC. A filter circuit 131b intervenes between the power supply line LCC and the power supply line LCC, and a filter circuit 131c intervenes between the terminals TA27 and TA28 of the receptacle KRE2 and the power supply line LDC supplying the power supply voltage VDC of 12 V DC. On the other hand, no filter circuit intervenes between the terminals TA13 and TA14 of the receptacle KRE2 and the power supply line LSL supplying the power supply voltage VSL of 34 V DC. Thus, the power supply lines LDS, LCC, and LDC in which the filter circuit intervenes can supply a plurality of types of power supply voltages such as DC 12 V and DC 5 V, and the power supply line LSL in which the filter circuit is not interposed is one type of DC 34 V Power supply voltage can be supplied. In the receptacle KRE2, the terminals TA13 and TA14 are disposed outside the terminals TA15 to TA24 and the like. Alternatively, the receptacle KRE2 includes, among the terminals TA15 to TA24, TA27, and TA28, a terminal disposed inside the terminals TA13 and TA14, such as the terminals TA15 to TA24.

  In the receptacle KRE2, the terminals TA13 to TA24, TA27, and TA28 are disposed between the terminals TA11 and TA12 and the terminals TA29 and TA30. The terminals TA13 to TA24, TA27, and TA28 are all terminals to which a power supply voltage is supplied, and serve as power supply voltage terminals connected to various power supply voltages. On the other hand, the terminals TA11 and TA12 and the terminals TA29 and TA30 are terminals to which no power supply voltage is supplied, and serve as ground terminals connected to the ground voltage. Therefore, in the receptacle KRE2, the terminals TA13 to TA24, TA27 and TA28 to be power supply voltage terminals are arranged between the terminals TA11 and TA12 to be ground terminals and the terminals TA29 and TA30.

  In receptacle KRE2, terminals TA13 and TA14 and terminals TA15 to TA24 are disposed between terminals TA11 and TA12 and terminals TA25 and TA26, and between terminals TA25 and TA26 and terminals TA29 and TA30 TA27 and TA28 are arranged. The terminals TA13 and TA14 are terminals to which a power supply voltage VSL2 of 34 V DC is supplied, and are power supply voltage terminals connected to the power supply voltage VSL2. The terminals TA15 to TA20 are terminals to which a power supply voltage VDD2 of 12 V DC is supplied, and are power supply voltage terminals connected to the power supply voltage VDD2. The terminals TA21 to TA24 are terminals to which a power supply voltage VCC2 of 5 V DC is supplied, and are power supply voltage terminals connected to the power supply voltage VCC2. The terminals TA27 and TA28 are terminals to which a power supply voltage VDD3 of 12 V DC is supplied, and are power supply voltage terminals connected to the power supply voltage VDD3. Therefore, terminals TA13 and TA14 as power supply voltage terminals connected to power supply voltage VSL2 of DC 34 V and terminals TA15 to TA24, TA27, TA28 as power supply voltage terminals connected to power supply voltage other than power supply voltage VSL2 of DC 34 V The terminals TA15 to TA24, which are a part of the above, are disposed between the terminals TA11 and TA12 serving as the ground terminals and the terminals TA25 and TA26. Further, among the terminals TA15 to TA24, TA27, and TA28 as power supply voltage terminals connected to a power supply voltage other than the power supply voltage VSL2 of DC 34V, terminals TA27 and TA28, which are other parts, become ground terminals. It is disposed between TA 25 and TA 26 and terminals TA 29 and TA 30.

  The 12 VDC power supply voltage VDD3 supplied to the terminals TA27 and TA28 is used by the step-down converter circuit 132 to generate a 1.05 VDC DC power supply voltage. The power supply voltage of DC 1.05 V is supplied to a specific microprocessor, such as a graphics processor of the display control unit 123, for example. Therefore, in the receptacle KRE2, of the terminals TA13 to TA24, TA27, and TA28 connected to the power supply voltage, the terminals TA13 and TA14 connected to the power supply voltage VSL2 having a relatively large fluctuation width (ripple component) 34V are The display control unit 123 is disposed farthest from TA 27 and TA 28 connected to a power supply voltage VDD 3 of DC 12 V used to generate a power supply voltage to be supplied to a specific microprocessor such as a graphics processor.

  In the effect control board 12, it is also conceivable that the power supply voltage VSL2 of 34 V DC is stabilized and then output as the power supply voltage VSL. However, in the effect control board 12, the installation of the circuit element for stabilizing the power supply voltage VSL2 of direct current 34 V which has no direct application causes an increase in the number of parts and the substrate volume, and the power loss and the manufacturing cost also increase. In addition, the installation of special circuit elements may make it difficult to reuse and commonize the effect control board 12. Therefore, the power supply voltage VSL2 of direct current 34 V for which voltage control is not performed is output from the effect control board 12 as the power supply voltage VSL as it is, and is input to the filter circuit 511 by the driver board 19 to stabilize the voltage. This enables an appropriate substrate configuration that prevents the increase in the number of parts and the substrate volume, and the power loss and the manufacturing cost. In addition, an appropriate substrate configuration can be realized in which reuse and sharing of the effect control substrate 12 are easily performed. In addition, the power supply line LSL is disposed away from the main electric circuits and electric parts in the effect control board 12, so that an appropriate board configuration is provided to prevent the adverse effect of noise due to the DC voltage having a large fluctuation width (ripple component). It will be possible.

  In the effect control board 12, the power supply line LSL supplying the power supply voltage VSL of DC 34 V is the power supply line LDS supplying the power supply voltage VDS of DC 12 V, the power supply line LCC supplying the power supply voltage VCC of DC 5 V, the power supply of DC 12 V It supplies DC 34 V, which is a high power supply voltage, as compared with any of the power supply lines LDS that supply the voltage VDS. In general, a stabilization circuit that stabilizes a high power supply voltage tends to have larger circuit element volume and power loss than a stabilization circuit that stabilizes a low power supply voltage, and the cost of the circuit element is expensive. It is easy to be a thing. Therefore, since no filter circuit intervenes in the power supply line LSL for supplying the power supply voltage VSL of DC 34 V, which is a high power supply voltage, an appropriate substrate configuration capable of preventing an increase in substrate volume, an increase in power loss and manufacturing cost is possible. become.

  In the receptacle KRE2, a power supply voltage VSL of 34 V DC is supplied to the two terminals TA13 and TA14. On the other hand, in receptacle KRE2, power supply voltage VDD2 of DC 12 V is supplied to six terminals TA15 to TA20, power supply voltage VCC2 of DC 5 V is supplied to four terminals TA21 to TA24, and two terminals TA27 and TA28 Is supplied with a power supply voltage VDD3 of DC 12V. Therefore, in the effect control board 12, among the terminals to which the power supply voltage is supplied in the receptacle KRE2, the number of terminals TA15 to TA24, TA27, TA28 connected to any of the filter circuits 131a to 131c is the filter circuit The number of terminals TA13 and TA14 not connected to is larger than the number of terminals. Since the number of terminals is set in this manner, an appropriate board for improving the degree of freedom in wiring design according to the application of the power supply voltage and the power supply capacity to be stabilized in the effect control board 12, for example. Configuration is possible.

  In the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the terminals TA15 to TA24, TA27 and TA28 connected to any of the filter circuits 131a to 131c in the effect control board 12 have a power supply voltage VDD2 of 12 V DC. It includes terminals TA15 to TA20 which can be supplied, terminals TA21 to TA24 which can supply a power supply voltage VCC2 of 5 V DC, and terminals TA27 and TA28 which can supply a power supply voltage VDD3 of 12 V DC. On the other hand, in the receptacle KRE2, among the terminals to which the power supply voltage is supplied, the terminals TA13 and TA14 not connected to the filter circuit in the effect control board 12 can supply the power supply voltage VSL2 of DC 34 V, and other types Supply voltage is not supplied. Therefore, the number of types of power supply voltages that can be supplied differs depending on whether the power supply line includes the filter circuit or the power supply line does not include the filter circuit. More specifically, the power supply line through which the filter circuit intervenes can supply a plurality of types of power supply voltages such as a power supply voltage VDD2 of DC 12 V, a power supply voltage VCC2 of DC 5 V, and a power supply voltage VDD2 of DC 12 V. The power supply line where there is no intervening can supply one kind of power supply voltage of 34 V DC as the power supply voltage VSL. As described above, since the number of types of power supply voltages that can be supplied is different corresponding to the power supply line, for example, according to the application of the power supply voltage for which the voltage is stabilized in the effect control board 12, freedom of wiring design An appropriate substrate configuration can be made to improve the degree.

  The terminals TA13 and TA14 connected to the power supply line not including the filter circuit are disposed outside the terminals TA15 to TA24 and the like connected to the power supply line including the filter circuit. Such an arrangement of the terminals enables an appropriate substrate configuration that improves the degree of freedom in wiring design according to, for example, the application of the power supply voltage for which the voltage is to be stabilized in the effect control substrate 12 or the like. In addition, an appropriate substrate configuration can be achieved in which the wiring length for outputting the power supply voltage VSL2 of direct current 34 V supplied to the terminals TA13 and TA14 to the driver substrate 19 as the power supply voltage VSL as it is can be shortened.

  In the receptacle KRE2, the terminals TA13 to TA24, TA27, and TA28 are power supply voltage terminals connected to various power supply voltages. On the other hand, in the receptacle KRE2, the terminals TA11 and TA12 and the terminals TA29 and TA30 are all ground terminals connected to the ground voltage. The terminals TA13 to TA24, TA27, and TA28 are disposed between the terminals TA11 and TA12 and the terminals TA29 and TA30. Such an arrangement of terminals enables an appropriate substrate configuration that is less susceptible to noise. In addition, it is possible to shield the power supply voltage and to make an appropriate substrate configuration that prevents the occurrence of noise.

  In the receptacle KRE2, the terminals TA15 to TA24, TA27, and TA28 become first power supply voltage terminals connected to a power supply voltage different from the power supply voltage VSL2 of 34 V DC. On the other hand, in the receptacle KRE2, the terminals TA13 and TA14 become second power supply voltage terminals connected to the power supply voltage VSL2 of 34 V DC. In the receptacle KRE2, the terminals TA11 and TA12 are the first ground terminals connected to the ground voltage, the terminals TA25 and TA26 are the second ground terminals connected to the ground voltage, and the terminals TA29 and TA30 are connected to the ground voltage Third ground terminal. In receptacle KRE2, terminals TA13 and TA14 included in the second power supply voltage terminal and terminals TA15 to TA24 included in the first power supply voltage terminal are included in the first ground terminal, and terminals TA11 and TA12, and the second The terminals TA27 and TA28 disposed between the terminals TA25 and TA26 included in the ground terminal and included in the first power supply voltage terminal are included in the terminals TA25 and TA26 included in the second ground terminal and the third ground terminal It is disposed between the terminals TA29 and TA30. Such an arrangement of terminals enables an appropriate substrate configuration that is less susceptible to noise. In particular, the terminals TA25 and TA26 included in the second ground terminal are included in the terminals TA13 and TA14 included in the second power supply voltage terminal and the terminals TA15 to TA24 included in the first power supply voltage terminal and the first power supply voltage terminal. The arrangement between the TA 27 and the TA 28 enables an appropriate substrate configuration that is less susceptible to noise. In addition, it becomes possible to shield the power supply voltage efficiently, and to prevent the generation of noise. In addition, terminals TA13 and TA14 connected to the DC 34V power supply voltage VSL2 are connected to the DC 12V power supply voltage VDD3 used to generate the power supply voltage supplied to a specific microprocessor such as the graphics processor of the display control unit 123 Because they are located away from the TA 27 and TA 28 that are to be placed, it is possible to have an appropriate substrate configuration that makes certain microprocessors less susceptible to noise.

  In the effect control board 12, the power supply voltage VDL is branched at the branch point DB1 from the power supply voltage VDD2 supplied at the terminals TA15 to TA20 of the receptacle KRE2. After the power supply voltage VDL is branched at such a branch point DB1, the power supply voltage VDS is stabilized by the filter circuit 131a. The power supply voltage VDL is a DC 12 V power supply voltage used to drive a specific electrical component, such as a specific LED included in the effect LED 61, for example. The power supply voltage VDS is a DC 12 V power supply voltage which is supplied to the amplifier circuit 521 and used to output an audio signal. Thus, the filter circuit 131a stabilizes the power supply voltage VDS after branching the power supply voltage VDD2 of 1 into the power supply voltage VDL and the power supply voltage VDS. The effect control board 12 may be provided with an amplification circuit 521, and may output audio signals supplied to the speakers 8L and 8R.

  FIG. 13A shows the relationship between the wire lengths of the wires for supplying the power supply voltage VDS. In the effect control board 12, the power supply line LDS for supplying the power supply voltage VDS to the amplifier circuit 521 has a wiring length LL1 from the branch point DB1 to the input part of the filter circuit 131a and the output part of the filter circuit 131a. A wire having a wire length LL2 to the input portion of the amplifier circuit 521 may be included. The wiring length LL2 may be adjusted so that the arrangement of the wirings and circuits in the effect control board 12 is shorter than the wiring length LL1. Thus, the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 becomes shorter than the wiring length LL1 to the filter circuit 131a after the power supply voltage VDS is branched at the branch point DB1. The amplification circuit 521 and the filter circuit 131 a are not limited to those installed on the effect control board 12, and may be installed on the voice control board 13.

  FIG. 13B shows the transmission path of the power supply voltage VDS when the amplifier circuit 521 and the filter circuit 131 a are installed on the voice control board 13. In the power supply substrate 92, a power supply voltage VDD2 of DC 12 V is generated from a commercial power supply which is an external power supply, using the transformer circuit 501, the DC voltage generation circuit 502 and the like. The power supply voltage VDD2 of DC 12 V is supplied to the terminals TA15 to TA20 in the receptacle KRE2 for power supply substrate wiring. In the effect control board 12, after the power supply voltage VDL is branched at the branch point DB1 from the power supply voltage VDD2 supplied from the terminals TA15 to TA20 of the receptacle KRE2, it is outputted from the effect control board 12 as the power supply voltage VDS as it is. The voice control board 13 may be supplied via the voice control board wire connected to the receptacle KRE 4 for voice board wiring. For example, in receptacle KRE2 for power supply substrate wiring, terminals TA15 to TA20 receiving supply of power supply voltage VDD2 are connected to power supply line LDS, and power supply line LDS is connected to a predetermined terminal in receptacle KRE4 for voice control substrate wiring. Just do it. In the effect control board 12, the power supply line LDS corresponding to the power supply voltage VDS of direct current 12 V may not have a stabilization circuit for stabilizing the voltage such as the filter circuit. On the other hand, in the voice control board 13, the power supply voltage VDS of DC 12 V is input to the filter circuit 131a to stabilize the voltage. The power supply voltage VDS thus stabilized may be supplied to the amplifier circuit 521.

  The voice control board 13 may be provided with a voice control IC 522, a voice data ROM 523 and the like. The voice control IC 522 executes signal processing for generating voice and sound effects in accordance with a command (such as sound number data) output from the effect control CPU 120 of the effect control board 12 or the like. The voice data ROM 523 stores control data corresponding to the sound number data. The control data corresponding to the sound number data is a collection of data indicating in time series the output mode of the sound and the sound effect in a predetermined period (for example, a variable display period of a decorative symbol). The various configurations provided on the voice control board 13 may be configured to be provided on the effect control board 12 without the voice control board 13.

  The amplifier circuit 521 that can amplify an audio signal generated by the audio control IC 522 or the like and output it to the speakers 8L, 8R, etc. causes distortion in the output audio signal when the power supply voltage fluctuates. May be adversely affected. Therefore, the power supply voltage VDS of DC 12 V is supplied to the amplifier circuit 521 after being stabilized by the filter circuit 131a. In the effect control board 12, after the power supply voltage VDD2 of 1 is branched into the power supply voltage VDL for driving a specific electric component and the power supply voltage VDS for supplying to the amplifier circuit 521, the filter circuit 131a is used. The stabilized power supply voltage VDS is supplied to the amplifier circuit 521. As described above, by supplying the stabilized power supply voltage VDS to the amplifier circuit 521 using the filter circuit 131a, an appropriate substrate configuration for stably operating the amplifier circuit 521 can be realized.

  In the power supply line LDS corresponding to the power supply voltage VDS to be supplied to the amplifier circuit 521, the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 is branched to the filter circuit 131a after the power supply voltage VDL is branched at the branch point DB1. It is shorter than the wiring length LL1 before input. As described above, by shortening the wiring length until the stabilized power supply voltage VDS is supplied to the amplifier circuit 521 using the filter circuit 131a, the amplifier circuit 521 is less likely to be affected by noise, and is appropriately operated. Board configuration is possible.

  In the effect control board 12, the power supply voltage VCL is branched from the power supply voltage VCC2 supplied at the terminals TA21 to TA24 of the receptacle KRE2. After the power supply voltage VCL is branched, the power supply voltage VCC is stabilized by the filter circuit 131 b. The power supply voltage VCL is, for example, a DC 5 V power supply voltage used to drive a specific electric component such as a specific motor included in the effect motor 60 or a specific LED included in the effect LED 61. The power supply voltage VCC is a DC 5 V DC power supply used to drive a predetermined electric circuit, such as the CPU 120 for effect control. As described above, the filter circuit 131 b stabilizes the power supply voltage VDD after branching the power supply voltage VCC2 of 1 into the power supply voltage VCL and the power supply voltage VDD.

  In the effect control board 12, after the power supply voltage VDD3 supplied at the terminals TA27 and TA28 of the receptacle KRE2 is stabilized by the filter circuit 131c, the power supply voltage VDC is branched so as to be able to be supplied. The power supply voltage VDC is a DC 12 V power supply voltage used to monitor the occurrence of the power supply interruption. The power supply voltage VDD3 is input to the step-down converter circuit 132 after being stabilized by the filter circuit 131c. The step-down converter circuit 132 is a circuit that converts a 1-input 2-output DC voltage. Step-down converter circuit 132 shown in FIG. 11 receives a voltage obtained by stabilizing power supply voltage VDD3 of DC 12 V by filter circuit 131 c, and converts it into a power supply voltage of 1.05 V DC and a power voltage of 3.3 V DC. Output. An output portion of the step-down converter circuit 132 is connected to a power supply line L10 supplying a power supply voltage of 1.05 V DC and a power supply line L33 supplying a power supply voltage of 3.3 V DC. The power supply voltage of 1.05 V DC is used to drive a predetermined electric circuit such as a graphics processor included in the display control unit 123, for example. The power supply voltage of 3.3 V DC is used to drive a predetermined electric circuit such as an image data memory included in the ROM 121 or the display control unit 123, for example. The power supply voltage of DC 3.3 V is also input to the regulator circuit 133. The regulator circuit 133 may be a linear type stabilized power supply circuit such as a series regulator such as an LDO (Low Drop-Out) regulator, for example. A power supply voltage of 3.3 V DC is input, and a power supply voltage of 1.5 V DC Convert to and output. The output portion of the regulator circuit 133 is connected to a power supply line L15 that supplies a power supply voltage of 1.5 V DC. A power supply voltage of 1.5 V DC is used to drive a predetermined electric circuit such as, for example, the RAM 122.

  FIG. 14 shows an example of the configuration of the filter circuits 131a to 131c. FIG. 14A shows a configuration example of the filter circuit 131a corresponding to the power supply voltage VDS. FIG. 14B shows a configuration example of the filter circuit 131 b corresponding to the power supply voltage VCC. FIG. 14C shows a configuration example of the filter circuit 131c corresponding to the power supply voltage VDC.

  The filter circuit 131a illustrated in FIG. 14A may be configured using a three-terminal capacitor 85a, bypass capacitors C10 and C11, and an electrolytic capacitor C1. The bypass capacitors C10 and C11 are electrical components for noise suppression that prevent high frequency noise compared to the electrolytic capacitor C1, and are also referred to as decoupling capacitors. The electrolytic capacitor C1 is an electrical component for noise reduction that prevents low frequency noise as compared to the bypass capacitors C10 and C11. The input terminal (IN) of the three-terminal capacitor 85a serves as the input portion of the filter circuit 131a, and is supplied with the power supply voltage VDD2 of 12 V DC. The output terminal (OUT) of the three-terminal capacitor 85a serves as the output part of the filter circuit 131a, and supplies a power supply voltage VDS of DC 12 V whose voltage is stabilized. The ground terminal (GND) of the three-terminal capacitor 85a is grounded (connected to the ground line). A 0.1 μF bypass capacitor C10, a 47 μF bypass capacitor C11, and a 1000 μF electrolytic capacitor C1 are connected between the output terminal of the three-terminal capacitor 85a and the ground terminal.

  The filter circuit 131b illustrated in FIG. 14B may be configured using a three-terminal capacitor 85b, bypass capacitors C12 and C13, and an electrolytic capacitor C2. The bypass capacitors C12 and C13 are electrical components for noise reduction that prevent high frequency noise as compared to the electrolytic capacitor C2. The electrolytic capacitor C2 is an electrical component for noise reduction that prevents low frequency noise as compared to the bypass capacitors C12 and C13. The input terminal (IN) of the three-terminal capacitor 85b serves as the input portion of the filter circuit 131b, and is supplied with the power supply voltage VCC2 of 5 V DC. The output terminal (OUT) of the three-terminal capacitor 85b serves as the output portion of the filter circuit 131b, and supplies a power supply voltage VCC of DC 5 V whose voltage is stabilized. The ground terminal (GND) of the three-terminal capacitor 85b is grounded (connected to the ground line). A 0.1 μF bypass capacitor C12, a 47 μF bypass capacitor C13, and a 1000 μF electrolytic capacitor C2 are connected between the output terminal of the three-terminal capacitor 85b and the ground terminal.

  The filter circuit 131c shown in FIG. 14C may be configured using a three-terminal capacitor 85c, a bypass capacitor C14, and an electrolytic capacitor C3. The bypass capacitor C14 is an electrical component for noise reduction that prevents high frequency noise compared to the electrolytic capacitor C3. The electrolytic capacitor C3 is an electrical component for noise reduction that prevents low frequency noise as compared to the bypass capacitor C14. The input terminal (IN) of the three-terminal capacitor 85c serves as the input portion of the filter circuit 131c, and is supplied with the power supply voltage VDD3 of 12 V DC. The output terminal (OUT) of the three-terminal capacitor 85c serves as the output portion of the filter circuit 131c, and supplies a power supply voltage VDC of DC 12 V whose voltage is stabilized. The ground terminal (GND) of the three-terminal capacitor 85c is grounded (connected to the ground line). A 0.1 μF bypass capacitor C14 and a 1000 μF electrolytic capacitor C3 are connected between the output terminal of the three-terminal capacitor 85c and the ground terminal.

  The filter circuits 131a to 131c function as a stabilization circuit that stabilizes the voltage of each power supply path. For example, the filter circuit 131a stabilizes the power supply voltage VDS of DC 12 V supplied by the power supply line LDS. The filter circuit 131 b stabilizes the power supply voltage VCC of DC 5 V supplied by the power supply line LCC. The filter circuit 131 c stabilizes the DC 12 V power supply voltage supplied by the power supply line LDC. In addition to the filter circuits 131a to 131c, the effect control board 12 may be provided with a noise prevention circuit for preventing generation of noise in various power supply voltages.

  FIG. 15 shows a configuration example of the noise prevention circuit provided on the effect control board 12. FIG. 15A shows a configuration example of the noise prevention circuit 135a corresponding to the LED DC 12V (12 VDC) called the power supply voltage VDL. FIG. 15B shows a configuration example of the noise prevention circuit 135b corresponding to the power supply voltage VCL of 5 V DC (5 V DC) for motor / motor. FIG. 15C shows a configuration example of the noise prevention circuit 135c corresponding to a power supply voltage VCC of 5 VDC (5 VDC) for IC and a power supply voltage of 3.3 VDC DC for 3.3 VDC (3.3 VDC). ing.

  The noise prevention circuit 135a shown in FIG. 15A is configured using a capacitor C20 and a resistor R20 connected in series, a capacitor C21 and a resistor R21 connected in series, and a capacitor C22 and a resistor R22 connected in series. It should just be. These configurations may be connected to the power supply line LDL supplying the power supply voltage VDL and the ground terminal (ground line) providing the ground voltage. The capacitors C20, C21 and C22 may all be bypass capacitors of 0.1 μF. The resistors R20, R21 and R22 may be any ones having a resistance value of 22Ω.

  The noise prevention circuit 135b illustrated in FIG. 15B may be configured using the capacitor C23 and the resistor R23 connected in series, and the capacitor C24 and the resistor R24 connected in series. These configurations may be connected to the power supply line LCL supplying the power supply voltage VCL and the ground terminal (ground line) providing the ground voltage. Both capacitors C23 and C24 may be bypass capacitors of 0.1 μF. Each of the resistors R23 and R24 may have a resistance value of 22Ω.

  The noise prevention circuit 135c shown in FIG. 15C may be configured using capacitors C25 to C28. The capacitor C25 may be connected to the power supply line LCC supplying the power supply voltage VCC and the ground terminal (ground line) providing the ground voltage. Capacitors C26, C27 and C28 may be connected to power supply line L33 supplying a power supply voltage of 3.3 V DC and to a ground terminal (ground line) providing a ground voltage. Each of the capacitors C25 to C28 may be a bypass capacitor of 0.1 μF.

  In the noise prevention circuit 135a shown in FIG. 15A, resistors R20, R21 and R22 are used in addition to the capacitors C20, C21 and C22. In the noise prevention circuit 135b shown in FIG. 15B, resistors R23 and R24 are used in addition to the capacitors C23 and C24. On the other hand, in the noise prevention circuit 135c shown in FIG. 15C, the capacitors C25 to C28 are used, and no resistor is used. As described above, in the noise prevention circuits 135a and 135b, the resistors R20, R21 and R22, and the resistors R23 and R24 are used as circuit elements different from the noise prevention circuit 135c.

  The power supply voltage VDL stabilized by the noise prevention circuit 135a shown in FIG. 15A is used to drive a specific electrical component such as a specific LED included in the effect LED 61, for example. The power supply line LDL supplies a power supply voltage VDL for driving a specific electrical component, such as a specific LED included in the effect LED 61, for example. The power supply voltage VCL stabilized by the noise prevention circuit 135b shown in FIG. 15B drives, for example, a specific electric component such as a specific motor included in the effect motor 60 or a specific LED included in the effect LED 61. Used to The power supply line LCL supplies a power supply voltage VCL for driving a specific electric component such as a specific motor included in the effect motor 60 or a specific LED included in the effect LED 61, for example. The power supply voltage VCC stabilized by the noise prevention circuit 135c shown in FIG. 15C and the power supply voltage of DC 3.3 V are specified, for example, an image data memory included in the effect control CPU 120, the ROM 121, or the display control unit 123. Is used to drive an electric circuit including the control circuit of The power supply line LCC supplies a power supply voltage VCC for driving an electric circuit including a specific control circuit, such as the CPU 120 for effect control. The power supply line L33 supplies a power supply voltage of 3.3 V DC for driving an electric circuit including a specific control circuit such as the ROM 121 or an image data memory of the display control unit 123, for example. Thus, in the noise prevention circuits 135a and 135b corresponding to the power supply voltage for driving a specific electric component such as a motor or an LED, the noise prevention corresponding to the power supply voltage for driving a specific electric circuit such as a CPU or a ROM As circuit elements different from the circuit 135c, resistors R20, R21, R22 and resistors R23, R24 are used.

  In a load circuit using a specific motor included in the effect motor 60 or a current drive circuit element such as a specific LED included in the effect LED 61, an excessive rush current is generated due to a transient phenomenon of the load circuit. , There is a risk of damage to electrical components. Therefore, in the noise prevention circuit 135a, the resistor R20 is connected in series to the capacitor C20, the resistor R21 is connected in series to the capacitor C21, and the resistor R22 is connected in series to the capacitor C22. Further, in the noise prevention circuit 135b, the resistor R23 is connected in series to the capacitor C23, and the resistor R24 is connected in series to the capacitor C24. When the power supply voltage VDL is stable, the capacitors C20, C21, and C22 are in a charging state, and the resistors R20, R21, and R22 are in a non-conducting state, so that the occurrence of power loss can be prevented. When the power supply voltage VCL is stable, the capacitors C23 and C24 are in the charging state, and the resistors R23 and R24 are in the non-conducting state, so that the occurrence of power loss can be prevented. On the other hand, in semiconductor integrated circuits such as the effect control CPU 120 and the ROM 121 or the image data memory of the display control unit 123, voltage driven circuit elements such as CMOS circuits are used, and the input impedance becomes relatively large. Therefore, inrush current due to the transient phenomenon of the circuit is hard to occur. Therefore, in the noise prevention circuit 135c, while using the capacitors C25 to C28, it is not necessary to use a resistor. In this way, by configuring the noise prevention circuit using different circuit elements according to the characteristics of the circuit and the electric component to which the power supply voltage is to be supplied, the increase of the substrate volume and the increase of the manufacturing cost can be prevented. An appropriate substrate configuration to prevent the occurrence is made possible.

  FIG. 16 shows a power supply monitoring circuit 140 using the power supply voltage VDC. In the effect control board 12, the power supply voltage VDC is used to monitor the occurrence of the power-off. The power supply monitoring circuit 140 is a circuit that is configured using, for example, a power failure monitoring and resetting module IC, and implements a power supply monitoring unit capable of outputting a power supply disconnection signal. For example, when the power supply voltage VDC exceeds a predetermined value (for example, 10 V), the power supply monitoring circuit 140 outputs a power off signal in the off state (high level). On the other hand, when the period when the power supply voltage VDC has become lower than or equal to the predetermined value continues for a predetermined standby time or more, a power off signal of the on state (low level) is output. The power-off signal output from the power supply monitoring circuit 140 is transmitted to the CPU 120 for effect control.

  The power supply voltage VDC to be monitored for outputting the power supply disconnection signal is used to generate a power supply voltage of 1.05 V DC, a power voltage of 3.3 V DC, and a power voltage of 1.5 V DC. The power supply voltage of 1.05 V DC is used to drive a predetermined electric circuit such as a graphics processor included in the display control unit 123, for example. The power supply voltage of 3.3 V DC is used to drive a predetermined electric circuit such as an image data memory included in the ROM 121 or the display control unit 123, for example. A power supply voltage of 1.5 V DC is used to drive a predetermined electric circuit such as, for example, the RAM 122. By monitoring the power supply voltage VDC used to generate the power supply voltage supplied to such an electric circuit, a power-off signal is output (turned on) before the operation state of the electric circuit becomes unstable. As a result, malfunction in various electric circuits can be prevented.

  In the effect control board 12, the power supply voltage VDD3 supplied from the terminals TA27 and TA28 of the receptacle KRE2 is stabilized by the filter circuit 131c and then input to the step-down converter circuit 132. The step-down converter circuit 132 uses the input voltage to generate a power supply voltage of 1.05 V DC and a power supply voltage of 3.3 V DC higher than 1.05 V DC. The power supply voltage of DC 3.3 V is input to the regulator circuit 133. The regulator circuit 133 uses an input voltage to generate a power supply voltage of 1.5 V DC. The power supply voltage of 1.5 V DC is a power supply voltage higher than 1.05 V DC but lower than 3.3 V DC. Thus, using the step-down converter circuit 132 and the regulator circuit 133, the power supply voltage of 1.05 V DC, the power supply voltage of 1.5 V DC higher than 1.05 V DC, and the DC 3 higher than 1.5 V DC While the step-down converter circuit 132 outputs a power supply voltage of 1.05 V DC and a power supply voltage of 3.3 V DC, the regulator circuit 133 can generate a power supply voltage of 3 V. Output 5V power supply voltage.

  After the power supply voltage VDD3 is stabilized by the filter circuit 131c, the branched power supply voltage VDC of 12 V DC is supplied to the power supply monitoring circuit 140 that monitors the occurrence of the power-off. Therefore, the input voltage of step-down converter circuit 132 is common to power supply voltage VDC of 12 V DC, and the input voltage of step-down converter circuit 132 is to be monitored by power supply monitoring circuit 140. Note that after the power supply voltage VDC is branched, a bypass capacitor of a predetermined capacity (for example, 47 μF) may be connected to the input side of the step-down converter circuit 132.

  Among the power supply voltages generated using the step-down converter circuit 132 and the regulator circuit 133, the power supply voltage of 1.05 V DC, which is a low voltage with the smallest voltage value, is a specific one such as a graphics processor of the display control unit 123. Supplied to a microprocessor. The power supply voltage of 1.05 V DC is not limited to that supplied to the graphics processor of the display control unit 123, and may be supplied to, for example, any microprocessor for effect control CPU 120 and the like.

  Of the power supply voltages generated using the step-down converter circuit 132 and the regulator circuit 133, the power supply voltage of 3.3 V DC, which is the largest voltage with the largest voltage value, is used, for example, in the image data memory of the ROM 121 and the display control unit 123. Supplied. The ROM 121 only needs to be able to start up earlier than the electric component driven by the power supply voltage of 1.5 V DC.

  Among the power supply voltages generated using the step-down converter circuit 132 and the regulator circuit 133, a power supply voltage of 1.5 V DC higher than 1.05 V DC and lower than 3.3 V DC is supplied to, for example, the RAM 122. The RAM 122 is, for example, a temporary storage memory that can store and read data in a double data rate (DDR) mode, and functions as a memory module such as a single in-line memory module (SIMM) or a dual in-line memory module (DIMM). Configure the substrate. Such a substrate constituting the RAM 122 may be configured as a separate substrate that can be detachably connected to the effect control substrate 12. In this case, the power supply voltage of 1.5 V DC is supplied to a substrate different from the effect control substrate 12.

  When a one-input three-output step-down converter circuit is used instead of the step-down converter circuit 132 and the regulator circuit 133, a special dedicated circuit is required, which may increase the manufacturing cost. In addition, the amount of heat generation in a single circuit may be increased to damage the electric circuit. Therefore, in the step-down converter circuit 132, the power supply voltage VDD3 stabilized by the filter circuit 131c (the same applies to the power supply voltage VDC) is input to output a power supply voltage of 1.05 V DC and a power voltage of 3.3 V DC. . The regulator circuit 133 receives a power supply voltage of 3.3 V DC and outputs a power supply voltage of 1.5 V DC. This makes it possible to prevent the increase of the manufacturing cost and to make the appropriate substrate configuration to disperse the heat generation in the electric circuit.

  The power supply voltage VDC that is the same as or substantially the same as the voltage supplied to the step-down converter circuit 132 is supplied to the power supply monitoring circuit 140, and the occurrence of a power-off is monitored. Thus, since the power supply voltage VDC used for generation of various power supply voltages by the step-down converter circuit 132 and the regulator circuit 133 is to be monitored by the power supply monitoring circuit 140, a pachinko gaming machine 1 such as a graphics processor of the display control unit 123, for example. Before the operation state of the electrical circuit, which is important for performing the rendering, becomes unstable, an appropriate substrate configuration for detecting the occurrence of the power-off becomes possible.

  The power supply voltage of DC 1.05 V output from the step-down converter circuit 132 is supplied to a specific microprocessor, such as a graphics processor of the display control unit 123, for example. By outputting the power supply voltage of 1.05 V DC from the step-down converter circuit 132, the power supply voltage of 1.05 V DC is output until a longer time elapses than in the configuration output from the regulator circuit 133 when a power failure occurs. Can be maintained. As a result, when a power failure occurs, an appropriate board configuration, such as the graphics processor of the display control unit 123, continues the operation of the electrical circuits that are important for executing effects in the pachinko gaming machine 1 as much as possible. It will be possible.

  The power supply voltage of 3.3 V DC output from the step-down converter circuit 132 is supplied to, for example, the ROM 121, and starts earlier than an electric component such as the RAM 122 driven by the 1.5 V DC power supply voltage output from the regulator circuit 133. It becomes possible. As a result, when the power is turned on, for example, an appropriate substrate configuration that can immediately read the stored data of the ROM 121 by the CPU 120 for effect control can be realized.

  The power supply voltage of 1.5 V DC output from the regulator circuit 133 may be supplied to, for example, a RAM 122 configured as a substrate different from the effect control substrate 12. As described above, by causing the regulator circuit 133 different from the step-down converter circuit 132 to output the power supply voltage of 1.5 V DC supplied to a substrate different from the effect control substrate 12, an increase in manufacturing cost is prevented. An appropriate substrate configuration that disperses heat generation in the electrical circuit is possible.

(Description about the feature 30AK)
FIG. 17 shows a configuration example of a portion in which a wiring pattern connecting the CPU 103 and the RAM 102 is formed on one of the substrate surfaces (surface) of the main substrate 11 in relation to the characterizing portion 30AK of the present embodiment. In the main substrate 11, in order to connect a plurality of electrical components such as, for example, the RAM 102 and the CPU 103 by a plurality of signal wirings, a wiring pattern which configures a plurality of signal wirings is formed. The CPU 103 is an electric component configured to be able to execute predetermined processing with respect to control of a game in the pachinko gaming machine 1, and the RAM 102 is an electric component configured to be able to store information related to the execution of processing by the CPU 103.

  One or a plurality of ground conductors are arranged in a region around or between the signal wirings with respect to the wiring patterns constituting the plurality of signal wirings. The ground conductor functions as a reference ground and a ground for characteristic impedance adjustment, and is maintained at the ground voltage. In the configuration example shown in FIG. 17, as a plurality of ground conductors, ground conductors 30AK10G and 30AK11G are arranged in the area around a plurality of signal lines, and ground conductors 30AK20G are arranged in an area between a plurality of signal lines. . As described above, one or a plurality of ground conductors may be provided in the airspace portion which is a blank region where the pattern of the wiring forming the plurality of signal wirings is not provided. Thereby, electromagnetic interference caused by electromagnetic wave noise radiated from a plurality of signal wires and electromagnetic wave noise between the signal wires can be prevented or suppressed.

  The present invention is not limited to the arrangement in which the plurality of ground conductors are arranged in both the regions around and between the plurality of signal wires, and the ground conductor is only in one region around or between the plurality of signal wires. It may be arranged. Alternatively, such a ground conductor may not be disposed.

  FIG. 18 shows regions and sections for describing in more detail the wiring patterns that constitute the plurality of signal wirings shown in FIG. An area 30AK01R illustrated in FIG. 18 is an area at an end of the side where the plurality of signal lines are connected to the CPU 103. A region 30AK10R shown in FIG. 18 is a region in which a plurality of signal wirings are all in a linear shape or a substantially linear shape and in a first shape parallel or substantially parallel to each other, and regions 30AK11R and 30AK12R shown in FIG. This is a region in which the signal wiring of the part has a second shape which is different from the linear shape and the substantially linear shape and which is not parallel to or substantially parallel to other signal wires. In a section 30AK0SC shown in FIG. 18, a short distance pattern in which some of the plurality of signal wirings are connected at the shortest or substantially shortest distance and a signal wiring which is not included in the short distance pattern are longer than the short distance patterns. And long distance patterns connected by.

  FIG. 19 is an enlarged view of area 30AK01R shown in FIG. In the area 30AK01R shown in FIG. 19, the wiring patterns constituting the plurality of signal lines include patterns 30AK10D to 30AK13D, patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 30AK14A.

  FIG. 20 shows setting examples of the signal type, the presence or absence of signal synchronization, and the presence or absence of the meandering shape, corresponding to the wiring pattern shown in FIG. The signal types shown in FIG. 20 indicate the contents (applications) of the electrical signals transmitted by the signal lines formed by the patterns of the respective lines. Signal synchronization shown in FIG. 20 indicates the presence or absence of synchronization with an electrical signal transmitted through another signal wiring. The meandering shape shown in FIG. 20 indicates whether or not a portion having a meandering shape different from the linear shape and the substantially linear shape is provided for each wiring pattern connecting the RAM 102 and the CPU 103. The serpentine shape is also referred to as a meander shape, a zigzag shape, or a folded shape, and the signal wiring is repeatedly bent with respect to the extending direction of the signal wiring in a predetermined section, for example, in a direction orthogonal or substantially orthogonal to the extending direction. It may be any shape that can be turned back and forth.

  In the setting example shown in FIG. 20, each of the wiring patterns 30AK10D to 30AK13D constitutes a signal wiring for transmitting a data signal. A data signal transmitted by each signal wiring is transmitted in synchronization with a signal transmitted by another signal wiring, such as a clock signal and a data signal transmitted by another signal wiring. The wiring pattern 30AK10CK constitutes a signal wiring for transmitting a clock signal. The clock signal is transmitted in synchronization with a signal transmitted through another signal wiring, such as a data signal, an address signal, or a chip select signal. The wiring pattern 30AK10CS constitutes a signal wiring for transmitting a chip select signal. The chip select signal is transmitted in synchronization with a signal transmitted by another signal wiring, such as a clock signal. The wiring pattern 30AK10RS constitutes a signal wiring for transmitting a reset signal. The reset signal is asynchronously transmitted asynchronously with the signal transmitted through the other signal lines. Each of the wiring patterns 30AK10A to 30AK14A constitutes a signal wiring for transmitting an address signal. An address signal transmitted by each signal wiring is transmitted in synchronization with a signal transmitted by another signal wiring, such as a clock signal and an address signal transmitted by another signal wiring.

  Among the data signals, clock signals, chip select signals, and address signals transmitted in synchronization with signals transmitted through other signal wirings, wiring patterns 30AK10D to 30AK13D that constitute signal wirings for transmitting data signals , And a wiring pattern 30AK10D having no meandering shape. At least a part of the wiring pattern constituting the signal wiring for transmitting the data signal, the clock signal, the chip select signal, and the address signal different from the data signal transmitted by the signal wiring formed by the wiring pattern 30AK10D is at least partially linear And it becomes meandering shape as a shape different from a substantially linear shape.

  The signal wiring for transmitting the data signal formed by the wiring pattern 30AK10D is between the connection terminals of the RAM 102 and the CPU 103, compared with the signal wiring for transmitting the other data signal, clock signal, chip select signal, and address signal. The distance is longer. Therefore, at least a part of the wiring patterns that constitute the signal wiring for transmitting the data signal, the clock signal, the chip select signal, and the address signal different from the data signal transmitted by the signal wiring formed by the wiring pattern 30AK10D Due to the serpentine shape, the wire lengths of the respective signal wires become the same or substantially the same. On the other hand, it is not necessary to provide a serpentine shape in the wiring pattern 30AK10D.

  Thus, among signal wires for transmitting synchronization signals, signal wires whose distance between connection terminals in a plurality of electric parts is longer than the distance between other connection terminals are, for example, wire portions having a serpentine shape. The wiring pattern may be formed so as not to include the wiring portion having a shape different from the linear shape and the substantially linear shape. Conversely, the signal wiring formed by the wiring pattern which does not include the shape different from the straight line and the substantially straight line shape such as the meander shape while forming the straight line shape or the substantially straight line shape has a meandering shape. The distance between the connection terminals of the plurality of electrical components is longer as compared with the signal wiring formed by the wiring pattern including the shape different from the straight line shape and the substantially straight line shape. Alternatively, among signal wires for transmitting synchronization signals, signal wires whose distance between connection terminals in a plurality of electrical components is longer than the distance between other connection terminals may be another wire portion such as a wire portion having a meander shape. The wiring pattern may be formed so as not to include a wiring portion having a shape different from the shape parallel to and substantially parallel to the signal wiring of FIG. Conversely, the signal wiring formed by the wiring pattern which does not include a shape different from the parallel and substantially parallel shapes such as the meandering shape while being parallel or substantially parallel to the other signal wires has the meandering shape. The distance between the connection terminals in the plurality of electrical components is longer as compared with the signal wiring formed by the wiring pattern including the shape different from the parallel and substantially parallel shapes with other signal wiring such as. As a result, it is possible to make the wiring lengths of the respective signal wirings identical or substantially identical, and to prevent or suppress the occurrence of the delay time difference (skew) of the signals transmitted by the plurality of signal wirings. By reducing the delay time difference of the signals transmitted by the plurality of signal wirings, it is possible to improve the reliability of the signals transmitted by the plurality of signal wirings.

  The wiring pattern 30AK10RS is not provided with a meandering shape. The wiring pattern 30AK10RS constitutes a signal wiring for transmitting a reset signal which is an asynchronous signal. When transmitting an asynchronous signal such as a reset signal, it is not necessary to take into consideration the delay time difference from the signal transmitted through the other signal wiring. Therefore, as in the wiring pattern 30AK10RS constituting the signal wiring for transmitting the reset signal, the meandering shape is not provided in the wiring pattern constituting the signal wiring through which the asynchronous signal is transmitted. If the meandering shape is not provided in the wiring pattern, the increase in the area of the substrate on which the wiring pattern is arranged can be suppressed, and the substrate can be miniaturized.

  As a wiring pattern not provided with a serpentine shape, a wiring pattern constituting a dummy wiring maintained at the ground voltage may be arranged. For example, in the signal wiring formed by the wiring pattern 30AK10RS, the ground voltage may be maintained instead of transmitting the reset signal. The wiring pattern 30AK10RS is a wiring pattern 30AK10D to 30AK13D that constitutes a signal wiring for transmitting a data signal, a wiring pattern 30AK10CK that constitutes a signal wiring for transmitting a clock signal, and a chip select signal to be transmitted. It is disposed between a group of patterns formed of wiring patterns 30AK10CS forming the signal wiring and a group of patterns formed of wiring patterns 30AK10A to 30AK14A forming the signal wiring for transmitting the address signal There is. By setting the signal wiring disposed between other signal wirings such as the wiring pattern 30AK10RS as a dummy wiring maintained at the ground voltage, it is possible to prevent or suppress electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings. . As a wiring pattern not provided with a serpentine shape, a wiring pattern maintained at the power supply voltage may be arranged instead of the dummy wiring maintained at the ground voltage or together with the dummy wiring maintained at the ground voltage. For example, in the signal wiring formed by the wiring pattern 30AK10RS, instead of transmitting the reset signal, the power supply voltage may be maintained. If the wiring pattern maintained at the power supply voltage is disposed close to the wiring pattern forming another signal wiring, electromagnetic noise may occur due to electromagnetic coupling between the respective signal wirings. Therefore, in the case of arranging the wiring pattern to be maintained at the power supply voltage, the distance from the signal wiring is longer than in the case of arranging the wiring pattern to be maintained at the ground voltage. A pattern may be formed. Thereby, the electromagnetic interference due to the electromagnetic wave noise in the signal wiring can be prevented or suppressed.

  FIG. 21 is an enlarged view of a region 30AK10R shown in FIG. Wiring patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 14A are formed in the region 30AK10R. These wiring patterns are formed in the region 30AK10R such that the plurality of signal wirings are all in a linear shape or a substantially linear shape and in parallel or substantially parallel to each other. As described above, in the region 30AK10R, the wiring patterns constituting the plurality of signal wirings are all formed in a linear shape or a substantially linear shape, and the plurality of signal wirings are in a parallel or substantially parallel shape. Wiring patterns are formed.

  FIG. 22 is an enlarged view of a region 30AK11R shown in FIG. Wiring patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 14A are formed in the region 30AK11R, similarly to the region 30AK10R. These wiring patterns are formed such that at least one signal wiring has a linear shape or a substantially linear shape in the region 30AK11R, while the other signal wiring has a shape different from the linear shape or the substantially linear shape. It is formed to be In the area 30AK11R shown in FIG. 22, for example, a wiring pattern 30AK10CK that constitutes a signal wiring for transmitting a clock signal and a wiring pattern 30AK10CS that constitutes a signal wiring for transmitting a chip select signal have a plurality of bent portions. Although it contains, all are formed so that it may become linear shape or substantially linear shape. Further, in the region 30AK11R shown in FIG. 22, the wiring pattern 30AK10RS constituting the signal wiring for transmitting the reset signal is formed to have a linear shape or a substantially linear shape not including the bent portion. On the other hand, in the area 30AK11R shown in FIG. 22, the wiring patterns 30AK10A to 30AK14A constituting the signal wiring for transmitting the address signal have a meandering shape formed by a plurality of bent portions, and have a linear shape and a substantially linear shape. Are formed to have different shapes.

  In the portion where the meandering shape is formed, the signal wiring may be bent in a direction orthogonal to the original extending direction by, for example, interposing a plurality of bent portions. In each of the bent portions, the wiring pattern in which the extending direction of the signal wiring is changed may be formed by bending the signal wiring so as to form an angle (obtuse angle) larger than a right angle. In this case, the signal wiring is bent so that the amount of bending at each of the bent portions is smaller than a right angle. In the portion where the serpentine shape is formed, the signal wiring can be extended in the first extension direction and the second extension direction orthogonal or substantially orthogonal to the first extension direction, and the first extension A plurality of bent portions may be provided between the wiring pattern forming the signal wiring in the direction and the wiring pattern forming the signal wiring in the second extending direction. As described above, the extending direction of the signal wiring is changed through the plurality of bending portions where the bending amount of the signal wiring is smaller than the predetermined angle. By reducing the amount of bending, it is possible to suppress a large change in the pattern width of the wiring in the bent portion, and to prevent a sudden change in the characteristic impedance of the transmission path, and electromagnetic radiation due to electromagnetic wave noise in a plurality of signal wirings Interference can be prevented or suppressed.

  In each signal wiring, the plurality of bent portions may be arranged such that the position of the bent portion is longer than a predetermined length from the position of the bent portion in the other signal wiring. The predetermined length may be a predetermined length from the viewpoint of substrate design, for example, a fixed length included in the range of 2 mm to 5 mm. At the bent portion of the signal wiring, electromagnetic noise is likely to occur due to a change in characteristic impedance or the like. A bent portion formed by a pattern of a wire forming one signal wire included in a plurality of signal wires is close to a bent portion formed by a pattern of a wire forming another signal wire included in a plurality of signal wires If arranged, the signals transmitted through the respective signal lines may be susceptible to electromagnetic noise. Therefore, a bent portion formed by a pattern of a wire constituting one signal wire included in a plurality of signal wires and a bent portion formed by a pattern of a wire configured other signal wires included in a plurality of signal wires are By arranging at intervals so as to be a distance longer than a predetermined length, it is possible to prevent or suppress electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings.

  In the region 30AK11R, at least one signal wiring is formed to have a shape different from parallel and substantially parallel. In the area 30AK11R shown in FIG. 22, for example, the wiring pattern 30AK10CK that constitutes a signal wiring for transmitting a clock signal and the wiring pattern 30AK10CS that constitutes a signal wiring for transmitting a chip select signal are all plural. The respective signal lines are formed in parallel or substantially in parallel as a whole through the bent portions. On the other hand, in the area 30AK11R shown in FIG. 22, the patterns 30AK10A to 30AK14A of the wiring forming the signal wiring for transmitting the address signal have a meandering shape formed by the plurality of bent portions, The signal lines are formed to have a shape different from parallel or substantially parallel.

  In the area 30AK11R shown in FIG. 22, at least one of the plurality of signal lines has a meandering shape or the like different from the parallel and substantially parallel shapes. In the area 30AK11R, in the space area 30AK0SP close to the wiring pattern forming the signal wiring, at least the conductor on the same substrate as the signal wiring is not provided with a conductor. The space region 30AK0SP is close to, for example, a wiring pattern 30AK10A to 30AK13A in which a serpentine shape is provided in the region 30AK11R among the wiring patterns 30AK10A to 30AK14A that constitute a signal wiring for transmitting an address signal. Since the space region 30AK0SP is not provided with a conductor, it is possible to prevent or suppress electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings. When a conductor is provided in the area close to the pattern of the wiring having a meandering shape, electromagnetic waves may be emitted from the signal wiring, and electromagnetic noise may occur due to electromagnetic coupling between the signal wiring and the conductor. There is a risk of Therefore, for example, as in the space area 30AK0SP, the conductor is not provided in the area close to the pattern of the wiring provided with the meandering shape, so that the prevention or suppression of the electromagnetic interference by the electromagnetic wave noise in the plurality of signal wiring is shown. Be

  FIG. 23 is a cross-sectional view showing a configuration example of the main substrate 11 formed as a multilayer wiring substrate. The main substrate 11 shown in FIG. 23 has a multilayer structure formed by overlaying synthetic resins, and various wiring patterns can be formed on the surface or inner layer of each layer. A plurality of electronic components such as, for example, the RAM 102 and the CPU 103 are electrically connected via the wiring pattern formed on the main substrate 11 having such a multilayer structure. The multilayer structure of the main substrate 11 shown in FIG. 23 includes a surface layer 30AK1S, a ground layer 30AK1L, a power supply layer 30AK2L, a wiring layer 30AK3L, a power supply layer 30AK4L, and a back surface layer 30AK2S.

  A surface layer 30AK1S is provided on the surface of the main substrate 11 which is to be one of the substrate surfaces, and a pattern 30AK10P and a pattern 30AK11P of a wiring forming the signal wiring are formed. A back surface layer 30AK2S is provided on the back surface of the main substrate 11, which is the other substrate surface, and a wiring pattern 30AK20P that constitutes the signal wiring is formed. The wiring pattern 30AK10P formed on the surface layer 30AK1S of the main substrate 11 and the wiring pattern 30AK20P formed on the back surface layer 30AK2S through the through holes 30AK1H penetrating the surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 It is electrically connected. The wiring pattern 30AK11P formed on the surface layer 30AK1S of the main substrate 11 and the wiring pattern 30AK20P formed on the back surface layer 30AK2S through the through holes 30AK2H penetrating the surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 It is electrically connected. Thus, the main substrate 11 is provided on the surface 30AK1S provided on the front surface of one of the substrates, on the back surface of the other substrate, with the patterns 30AK10P and 30AK11P of the wiring forming the signal wiring. A through hole 30AK1H and a through hole 30AK2H capable of electrically connecting the pattern 30AK20P of the wiring forming the signal wiring in the back surface layer 30AK2S are provided.

  The wiring lengths of the respective signal wirings included in the plurality of signal wirings connecting the RAM 102 and the CPU 103 shown in FIG. 23 are pattern 30AK10P and pattern 30AK11P of the wiring formed in the surface layer 30AK1S and wiring of the wiring formed in the back surface layer 30AK2S. The lengths of the through holes 30AK1H and the through holes 30AK2H are the same or substantially the same, as well as the wiring length of the signal wiring formed by the patterns 30AK20P. In main substrate 11 having a multilayer structure shown in FIG. 23, the lengths of the signal lines are equal or substantially the same including the lengths of through holes 30AK1H and through holes 30AK2H, and the signals transmitted by a plurality of signal lines The occurrence of the delay time difference can be prevented or suppressed. By reducing the delay time difference of the signals transmitted by the plurality of signal wirings in the multilayer wiring board such as the main substrate 11, it is possible to improve the reliability of the signals transmitted by the plurality of signal wirings.

  In the main substrate 11 having a multilayer structure shown in FIG. 23, a ground layer 30AK1L is provided as a conductor layer adjacent to the surface layer 30AK1S. In the ground layer 30AK1L, one or more ground conductors are disposed, and the ground conductors are maintained at the ground voltage. In the surface layer 30AK1S, the wiring patterns 30AK10P and 30AK11P that constitute the signal wiring have at least one of a plurality of signal wirings parallel and substantially parallel in a shape different from a linear shape and a substantially linear shape, such as a meander shape in at least one pattern. It may be formed to include a region having a shape different from the above shape. In the ground layer 30AK1L as a conductor layer adjacent to such a surface layer 30AK1S, signal transmission is not performed. Since the signal transmission is not performed in the conductor layer adjacent to the surface layer 30AK1S on which the wiring pattern 30AK10P and the pattern 30AK11P are formed, the signals transmitted by the plurality of signal wirings formed by the wiring pattern 30AK10P and the pattern 30AK11P are electromagnetic waves It becomes less susceptible to noise, and the influence of electromagnetic wave noise on other signal wiring can be prevented or suppressed.

  In the back surface layer 30AK2S of the main substrate 11 having a multilayer structure shown in FIG. 23, the wiring pattern 30AK 20P constituting the signal wiring has a plurality of signal wirings parallel and substantially different in shape different from linear shape and substantially linear shape such as meander shape. It may be formed to include a region having a shape different from the parallel shape. In the power supply layer 30AK4L as a conductor layer adjacent to such a back surface layer 30AK2S, signal transmission is not performed. One or more power supply conductors are arranged in the power supply layer 30AK4L, and the power supply conductors are maintained at the power supply voltage. Since the signal transmission is not performed in the conductor layer adjacent to the back surface layer 30AK2S on which the wiring pattern 30AK20P is formed, the signals transmitted through the plurality of signal wirings formed by the wiring pattern 30AK20P are less susceptible to the electromagnetic wave noise. Thus, the influence of electromagnetic wave noise on other signal lines can be prevented or suppressed. In the multi-layer wiring board such as the main board 11, the signal transmission is not performed in the conductor layer adjacent to the layer provided with the plurality of signal lines, thereby preventing or suppressing the electromagnetic interference by the electromagnetic wave noise in the plurality of signal lines. Is taken.

  In the wiring layer 30AK3L of the main substrate 11 having a multilayer structure shown in FIG. 23, the wiring pattern constituting the signal wiring has a shape different from a straight line and a substantially straight line, such as a meander shape. It may be formed so as to include a region having a shape different from the shape described above. In the power supply layer 30AK2L and the power supply layer 30AK4L as conductor layers adjacent to such a wiring layer 30AK3L, signal transmission is not performed. In the conductor layer adjacent to the wiring layer 30AK3L in which a plurality of signal wirings are provided in a multilayer wiring board such as the main substrate 11, signal transmission is not performed, thereby preventing electromagnetic interference due to electromagnetic wave noise in the plurality of signal wirings or Suppression is achieved. However, in the case where the wiring layer 30AK3L, which is a conductor layer of the inner layer provided on the multilayer wiring board, is formed so as to include a region in which the wiring pattern constituting the signal wiring has a meandering shape or the like, When a failure due to disconnection or the like occurs, it may be difficult to check the state of the signal wiring in the wiring layer 30AK3L from the outside of the substrate. On the other hand, a region such as the surface layer 30AK1S or the back surface layer 30AK2S of the main substrate 11 in which one of the substrate surfaces provided on the main substrate 11 and the other substrate surface has a meandering pattern When it is formed to include, an appropriate board configuration that makes it easy to check the state of the signal wiring in the surface layer 30AK1S and the back surface layer 30AK2S from the outside of the substrate when a failure due to a break in the signal wiring or the like occurs Become.

  The through holes penetrating the surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 are not limited to the through holes 30AK1H and the through holes 30AK2H shown in FIG. 23, and more through holes are provided, and It may be used to make the wire lengths of the wires the same or substantially the same. Among the wiring patterns constituting the plurality of signal wirings, for example, the signal wirings are arranged only on the surface layer 30AK1S of the main substrate 11 without through holes such as the through holes 30AK1H and the through holes 30AK2H. The formed pattern may be included. A signal wiring such as a signal wiring for transmitting a data signal formed by the wiring pattern 30AK10D has a longer distance between connection terminals in a plurality of electrical components than a distance between other connection terminals. The signal wiring may be disposed only on the surface layer 30AK1S of the main substrate 11 without through holes such as the holes 30AK2H. Conversely, the signal wiring formed by the wiring pattern formed without a through hole in the conductor layer 1 such as the surface layer 30AK1S is a through hole in a plurality of conductor layers such as the surface layer 30AK1S and the back surface layer 30AK2S. The distance between the connection terminals in the plurality of electrical components is longer than the signal wiring formed by the wiring pattern formed to be electrically connectable via the two.

  When a plurality of signal lines are provided adjacent to each other, a small blank area is formed as in space area 30AK0SP shown in FIG. It is also conceivable to provide a through hole in this blank area and to have a through hole electrode in which a conductive material such as copper is embedded so as to be electrically connected to another conductor layer such as ground layer 30AK1L. In a configuration in which a conductor such as a through hole electrode is provided in the blank area, a large number of through hole electrodes may be disposed, for example, in order to stabilize the electric field distribution in the blank area. In this case, not only the surface layer 30AK1S of the main substrate 11 but also the back surface layer 30AK2S, for example, a structure corresponding to a through hole electrode such as a bump is disposed, and the design of the wiring pattern on the substrate is restricted. Problems may occur. Also, in the ground layer 30AK1L and the power supply layers 30AK2L, 30AK4L, etc., which are the conductor layers of the inner layer provided on the multilayer wiring board, when the through hole electrode is provided, the pattern of the conductor layer is removed around the through hole electrode. As a result, the patterns in the conductor layers of the inner layers, such as the ground layer 30AK1L and the power supply layers 30AK2L and 30AK4L, may be divided, which may make it difficult to design the patterns in the conductor layer. Furthermore, in a configuration in which a conductor such as a dummy pad is provided in a blank region instead of the through-hole electrode and not connected to another conductor layer, the conductor is affected by electromagnetic noise from the outside, There is a possibility that this conductor may affect the plurality of signal wires by electromagnetic wave noise to cause adverse effects such as electromagnetic interference. On the other hand, since the space is not provided in the space area 30AK0SP close to the pattern of the wiring forming the signal wiring, the occurrence of these problems can be prevented or suppressed.

  Besides, as in the space area 30AK0SP shown in FIG. 22, the blank area formed when a plurality of signal lines are provided adjacent to each other is different from the constituent material of the substrate, for example, a screw hole for fixing the substrate. There may be no structure provided that the material is used. When a screw hole for fixing the substrate is provided, when the substrate is fixed by screwing, the component material of the screw is affected by electromagnetic noise from the outside, and other signal wiring is adversely affected by electromagnetic interference and the like. May cause inconveniences. Also, a structure using a synthetic resin or dielectric material having a dielectric constant different from that of the insulating layer contained in the substrate, or a structure using a synthetic resin or metal material having an electric conductivity different from that of a conductor layer contained in the substrate When provided in a blank area close to a plurality of signal wires, these structures are affected by electromagnetic noise from the outside, or these structures affect the plurality of signal wires by electromagnetic noise. In some cases, problems such as electromagnetic interference may occur. On the other hand, these problems occur because a structure using a material different from the material of the substrate is not provided in the blank area such as the space area 30AK0SP close to the pattern of the wiring forming the signal wiring. Can be prevented or suppressed.

  In a section 30AK0SC shown in FIG. 18, one of the patterns 30AK10D to 30AK13D of the wirings forming a plurality of signal wirings for transmitting data signals has one pattern 30AK13D different from a linear shape and a substantially linear shape such as a serpentine shape. And the other signal wiring is formed to include a portion of the signal wiring which has a shape different from the parallel and substantially parallel shape. On the other hand, at least the pattern 30AK10D and the pattern 30AK11D are formed in the section 30AK0SC so that the signal wirings are parallel or substantially parallel in a linear shape or a substantially linear shape without including the meandering shape. . Therefore, the pattern 30AK10D and the pattern 30AK11D are patterns in which the signal wiring connects the section 30AK0SC with the shortest or substantially shortest. On the other hand, the patterns 30AK12D and 30AK13D are patterns in which the signal wiring connects the section 30AK0SC at a distance longer than the patterns 30AK10D and 30AK11D.

  In the section 30AK0SC, in the portion where the signal wiring formed by the pattern 30AK13D has a shape different from a straight line and a substantially straight line such as a meander shape, the signal lines formed by the other patterns 30AK10D to 30AK12D have a linear shape or It is formed to have a substantially linear shape. As described above, in a portion where the signal wiring composed of the wiring pattern of one of the wiring patterns constituting the plurality of signal wirings has a shape different from the linear shape such as meandering shape and the substantially linear shape, The signal wiring formed by the wiring pattern of may be formed in a linear shape or a substantially linear shape. In a portion where the signal wiring composed of the wiring pattern of 1 has a shape different from a straight line shape such as a meandering shape and a substantially straight line shape, the signal wiring composed of another wiring pattern has a linear shape or a substantially straight line shape It may be formed so as not to overlap with The wiring pattern is formed such that portions having linear shapes such as meandering shapes and shapes different from substantially linear shapes do not overlap for a plurality of signal wirings, thereby suppressing an increase in substrate area for arranging the wiring patterns Thus, the substrate can be miniaturized.

  FIG. 24 shows another example of formation of wiring patterns in which portions where a plurality of signal wirings are serpentine do not overlap. In the area 30AK20R shown in FIG. 24 as well, in the portion where the signal wiring formed of one of the wiring patterns constituting the plurality of signal wirings has a serpentine shape, the signal is formed of the other wiring patterns. The wiring is formed to have a linear shape or a substantially linear shape. Then, when the first meandering portion, which is a portion where the first signal wiring formed by the pattern of the first wiring has a meandering shape, is finished, the second signal wiring is formed by the pattern of the second wiring different from the pattern of the first wiring. A pattern of wires constituting the plurality of signal wires is formed such that a second meandering portion in which the signal wires have a meandering shape is started. In the first meandering portion, the wiring pattern including the second wiring pattern constituting the second signal wiring as the wiring pattern constituting the signal wiring other than the first signal wiring is a signal wiring constituted by each pattern May be formed to be parallel or substantially parallel. In the second meandering portion, the wiring pattern including the pattern of the first wiring constituting the first signal wiring as the wiring pattern constituting the signal wiring other than the second signal wiring is a signal wiring constituted by each pattern May be formed to be parallel or substantially parallel. Since the second meandering portion is started after the end of the first meandering portion, the first meandering portion is disposed so as not to overlap with the second meandering portion. As a result, even when a number of signal wirings are provided with portions having linear shapes such as meandering shapes and shapes different from substantially linear shapes, an increase in the area of the substrate on which the wiring patterns are arranged is suppressed as much as possible. The size of the substrate can be reduced.

(Description about feature part 42AK)
FIG. 25 shows a configuration example of a portion in which a plurality of signal wirings formed of wiring patterns are formed in the characteristic portion 42AK of the present embodiment. The wiring pattern shown in FIG. 25 may be, for example, the main substrate 11 as long as it configures a plurality of signal wirings such as the RAM 102 and the CPU 103 that connect a plurality of electrical components. In the configuration example shown in FIG. 25, patterns of wires forming two signal wires are shown as patterns of wires forming a plurality of signal wires. 25A shows the case where the wiring interval W1 is smaller than the wiring interval W2, and FIG. 25B shows the case where W1> W2 where the wiring interval W1 is wider than the wiring interval W2. The wiring interval W1 is the wiring interval according to the wiring pattern in the portion where the same signal wiring is serpentine. The wiring interval W2 is a wiring interval between patterns of wirings which are adjacent to each other in parallel or substantially in parallel to constitute different signal wirings.

  The wiring patterns constituting the two signal wirings shown in FIG. 25A include a first wiring pattern 42AK10 and a second wiring pattern 42AK11. The first wiring pattern 42AK10 and the second wiring pattern 42AK11 are each signal wiring such that the wiring portion 42AK1Z and the wiring portion 42AK2Z are included according to the shape of the signal wiring formed by the wiring pattern Form.

  In the wiring portion 42AK1Z, the signal wiring formed by the first pattern 42AK10 of the wiring forms a second shape portion 42AK10M, and the signal wiring formed by the second pattern 42AK11 of the wiring forms a first shape portion 42AK11L. . In the wiring portion 42AK2Z, the signal wiring formed by the first pattern 42AK10 of the wiring forms a first shape portion 42AK10L, and the signal wiring formed by the second pattern 42AK11 of the wiring forms a second shape portion 42AK11M. . The first shape portions 42AK10L and 42AK11L are formed such that the signal wirings have a first shape of a linear shape or a substantially linear shape. The second shape portions 42AK10M and 42AK11M are formed such that the signal wiring has a second shape such as a serpentine shape, which is different from a linear shape and a substantially linear shape. The second shape portions 42AK10M and 42AK11M are not limited to the meandering shape, and may be formed to have an arbitrary shape different from the linear shape and the substantially linear shape.

  As described above, in the plurality of signal wirings configured by the first pattern 42AK10 of the wiring and the second pattern 42AK11 of the wiring, the signal wiring configured by the second pattern 42AK11 of the wiring in the wiring portion 42AK1Z has a linear shape or The signal wiring formed by the first pattern 42AK10 of the wiring corresponds to the second shape such as a meandering shape different from the first shape 42AK11L corresponding to the first shape 42AK11L which is the substantially linear first shape. The second shape portion 42AK10M is included. That is, in the wiring portion 42AK1Z, the signal wiring constituted by the first pattern 42AK10 of the wiring includes the second shape portion 42AK11M corresponding to the first shape portion 42AK11L of the signal wiring constituted by the second pattern 42AK11 of the wiring. It is.

  The plurality of signal wirings formed by the first pattern 42AK10 of the wiring and the second pattern 42AK11 of the wiring have a linear shape or a substantially straight line in the signal line formed by the first pattern 42AK10 of the wiring in the wiring portion 42AK2Z. The signal wiring formed by the second pattern 42AK11 of the wiring corresponds to the first shape 42AK10L, which is the first shape of the shape, has a second shape such as a meandering shape different from the first shape 42AK10L. It includes the shape part 42AK11M. That is, in the wiring portion 42AK2Z, the signal wiring constituted by the second pattern 42AK11 of the wiring includes the second shape portion 42AK11M corresponding to the first shape portion 42AK10L in the signal wiring constituted by the first pattern 42AK10 of the wiring. It is.

  In the second shape portion 42AK10M and the second shape portion 42AK11M in which the signal wiring shown in FIG. 25A has a second shape such as a meander shape, the second shape portion 42AK10M is included in the wiring portion 42AK1Z, and the second shape portion 42AK11M Are included in the wiring portion 42AK2Z. Thus, the second shape portion 42AK10M and the second shape portion 42AK11M do not overlap in their respective positions. In addition, the wiring length of each signal wiring is formed to be the same or substantially the same. Since the signal wiring composed of the first pattern of wiring 42AK10 and the second pattern of wiring 42AK11 is formed to include the second shape portion 42AK10M and the second shape portion 42AK11M, the wiring pattern is formed. It is possible to suppress the increase in the area of the substrate on which the substrate is disposed, and to miniaturize the substrate.

  The wiring patterns constituting the two signal wirings shown in FIG. 25B include a third wiring pattern 42AK12 and a fourth wiring pattern 42AK13. The third pattern 42AK12 of the wiring and the fourth pattern 42AK13 of the wiring include the respective signal lines such that the wiring portion 42AK3Z and the wiring portion 42AK4Z are included in accordance with the shape of the signal wiring formed by the patterns of the wirings. Form.

  The signal wiring formed by the third pattern 42AK12 of the wiring and the fourth pattern 42AK13 of the wiring is the first signal wiring formed by the fourth pattern 42AK13 of the wiring in the wiring portion 42AK3Z that has a linear shape or a substantially linear shape. A second shape portion 42AK12M having a second shape such as a meander shape different from the first shape portion 42AK13L in the signal wiring formed by the third pattern 42AK12 of the wiring corresponding to the first shape portion 42AK13L to be the shape It contains. That is, in the wiring portion 42AK3Z, the signal wiring constituted by the third pattern 42AK12 of the wiring includes the second shape portion 42AK12M corresponding to the first shape portion 42AK13L in the signal wiring constituted by the fourth pattern 42AK13 of the wiring. It is.

  Further, in the signal wiring formed by the third pattern 42AK12 of the wiring and the fourth pattern 42AK13 of the wiring, the signal wiring formed by the third pattern 42AK12 of the wiring in the wiring portion 42AK4Z has a linear shape or a substantially linear shape. A second shape portion having a second shape such as a meander shape different from the first shape portion 42AK12L, in which the signal wiring formed by the fourth pattern 42AK13 of the wiring corresponds to the first shape portion 42AK12L to be the first shape 42AK13M is included. That is, in the wiring portion 42AK4Z, the signal wiring constituted by the fourth pattern 42AK13 of the wiring includes the second shape portion 42AK13M corresponding to the first shape portion 42AK12L of the signal wiring constituted by the third pattern 42AK12 of the wiring. It is.

  In the second shape portion 42AK12M and the second shape portion 42AK13M in which the signal wiring shown in FIG. 25B has a second shape such as a meander shape, the second shape portion 42AK12M is included in the wiring portion 42AK3Z, and the second shape portion 42AK13M Are included in the wiring portion 42AK4Z. Thus, the second shape portion 42AK12M and the second shape portion 42AK13M do not overlap in their respective arrangements. In addition, the wiring length of each signal wiring is formed to be the same or substantially the same. Since the signal wiring composed of the third pattern of wiring 42AK12 and the fourth pattern of wiring 42AK13 is formed so as to include the second shape portion 42AK12M and the second shape portion 42AK13L, the wiring pattern is formed. It is possible to suppress the increase in the area of the substrate on which the substrate is disposed, and to miniaturize the substrate.

  In the configuration example shown in FIG. 25A, each signal wiring is formed such that the wiring interval W2 is wider than the wiring interval W1. For example, in the second shape portion 42AK10M and the second shape portion 42AK11M, the same signal wiring folded back by the bending portion forms a serpentine shape that reciprocates at the wiring interval W1, but is configured by the first pattern 42AK10 of the wiring. When the signal wiring to be formed and the signal wiring formed by the second pattern 42AK11 of the wiring are parallel or substantially parallel to each other, the wiring interval W2 between the adjacent signal wirings is wider than the wiring interval W1. Signal wiring is formed. As described above, since the wiring interval W2 between adjacent signal wirings is wider than the wiring interval W1 in the same signal wiring, an adverse effect due to a short circuit or the like generated in one signal wiring is caused by the other signal wirings. It can be prevented or suppressed from reaching the signal to be transmitted.

  In the configuration example shown in FIG. 25B, each signal wiring is formed so that the wiring interval W2 is narrower than the wiring interval W1. For example, in the second shape portion 42AK12M and the second shape portion 42AK13M, the same signal wiring folded back by the bent portion forms a serpentine shape that reciprocates at the wiring interval W1, but is configured by the third pattern 42AK12 of the wiring Between the adjacent signal lines when the signal lines to be formed and the signal lines formed by the fourth pattern 42AK13 of the lines are parallel or substantially parallel to each other, such that the line interval W2 between adjacent signal lines is narrower than the line interval W1. Signal wiring is formed. Thus, since the wiring interval W2 between adjacent signal wirings is narrower than the wiring interval W1 in the same signal wiring, one signal wiring and another signal wiring are shorter than a short circuit inside one signal wiring. It is more likely that a short circuit between them will occur. A short circuit generated between one signal wiring and another signal wiring can be easily detected using a test point provided on each signal wiring. For example, a short generated between one signal wiring and another signal wiring can be detected by testing the electrical characteristics of the signal wiring by bringing a test probe into contact with a test point provided on each signal wiring. .

  As shown in FIG. 25A, on the other hand, the first pattern 42AK10 of the wiring corresponds to the wiring portion 42AK1Z in which the signal wiring formed by the second pattern 42AK11 of the wiring forms the first shape portion 42AK11L. The signal wiring comprised by these forms 2nd shape part 42AK10M. On the other hand, the signal wiring formed by the second pattern 42AK11 of the wiring corresponds to the wiring portion 42AK1Z in which the signal wiring formed by the first pattern 42AK10 of the wiring forms the first formation portion 42AK10L. The portion 42AK11M is formed. As shown in FIG. 25B, on the other hand, the signal wiring formed by the fourth pattern 42AK13 of the wiring corresponds to the wiring portion 42AK3Z forming the first shape portion 42AK13L, the third pattern 42AK12 of the wiring The signal wiring comprised by these forms 2nd shape part 42AK12M. On the other hand, the signal wiring formed by the fourth pattern 42AK13 of the wiring corresponds to the wiring portion 42AK4Z in which the signal wiring formed by the third pattern 42AK12 of the wiring forms the first shape portion 42AK12L. The portion 42AK13M is formed. The correspondence relationship of each signal wiring formed by the pattern of each wiring is, for example, an arbitrary predetermined relationship such as upper and lower relation, left and right relation, or a range less than a predetermined distance when viewed from a direction perpendicular to the substrate surface of the main substrate 11 or the like. It is sufficient that the signal wiring is in the position range of (1), and the signal wiring is not in the case of the signal wiring not in such a position range.

  In the example shown in FIGS. 25A and 25B, the signal wiring composed of the other wiring pattern corresponding to the first shape portion in the signal wiring composed of the wiring pattern 1 is the second one. A signal wiring composed of a wiring pattern of 1 corresponding to a first shape part of a signal wiring composed of a wiring part forming a shape and a pattern of another wiring forms a second shape In the wiring portion, the respective signal wirings are formed such that the wiring interval W1 is common and the wiring interval W2 is also common. More specifically, the signal wiring formed of the first pattern 42AK10 of the wiring corresponds to the first shape portion 42AK11L of the signal wiring formed of the second pattern 42AK11 of the wiring shown in FIG. The signal wiring composed of the second pattern 42AK11 of the wiring corresponds to the wiring part 42AK1Z forming the two-shaped part 42AK10M and the first shape part 42AK10L in the signal wiring composed of the first pattern 42AK10 of the wiring In the wiring portion 42AK2Z forming the second shape portion 42AK11M, the respective signal wirings are formed such that the wiring interval W1 is common (constant) and the wiring interval W2 is also common (constant). This facilitates the pattern design of the wiring on the substrate surface. Further, since differences in shape among the plurality of signal wirings are suppressed, variations in characteristic impedance among the respective signal wirings are suppressed, and signal quality uniformity among the plurality of signal wirings can be achieved.

  A wiring portion in which a signal wiring formed by a pattern of another wiring corresponds to a first shape portion in the signal wiring formed by a wiring pattern of 1 forms a second shape, and One of the wiring interval W1 and the wiring interval W2 in the wiring section in which the signal wiring constituted by the pattern of one wiring corresponds to the first shape section in the signal wiring constituted by the pattern forms the second shape Or each signal wiring may be formed so that both may be different. For example, in the wiring section 42AK1Z and the wiring section 42AK2Z shown in FIG. 25A, the wiring interval W2 is common, while the wiring interval W1 is each signal such that the wiring section 42AK2Z is wider than the wiring section 42AK1Z. Wiring may be formed. In such a case, it is possible to flexibly design the wiring pattern on the substrate surface.

  FIG. 26 shows an example of a configuration in which the second shape portions of a plurality of signal wirings formed by the wiring pattern are formed in different directions. In the configuration example shown in FIG. 26A, patterns of wires forming three signal wires are shown as patterns of wires forming a plurality of signal wires. In the configuration example shown in FIG. 26B, patterns of wires forming four signal wires are shown as patterns of wires forming a plurality of signal wires.

  The wiring patterns constituting the three signal wirings shown in FIG. 26A include a first wiring pattern 42AK20, a second wiring pattern 42AK21, and a third wiring pattern 42AK22. The signal wiring formed of the first pattern 42AK20 of the wiring includes a portion forming the second shape portion 42AK20M. The signal wiring formed of the second pattern 42AK21 of the wiring includes a portion forming the second shape portion 42AK21M. The signal wiring formed of the third pattern 42AK22 of wiring includes a portion forming the second shape portion 42AK22M. The second shape portion 42AK20M and the second shape portion 42AK21M have, for example, a meandering shape that is folded back and forth in a first direction, such as the left and right direction. On the other hand, the second shape portion 42AK22M has, for example, a meandering shape which is turned back and forth in a second direction different from the first direction, such as the vertical direction. Each second shape portion is not limited to the meandering shape, and may be formed to have an arbitrary shape different from the linear shape and the substantially linear shape.

  As described above, the second shape portion 42AK20M in the signal wiring formed by the first pattern 42AK20 of the wiring is common (parallel) to the second shape portion 42AK21M in the signal wiring formed by the second pattern 42AK21 of the wiring. It is formed in the direction. On the other hand, the second shape portion 42AK22M in the signal wiring formed of the third pattern 42AK22 of the wiring is formed of the second shape portion 42AK20M formed of the first pattern of the wiring and the second shape of the wiring It is formed in the 2nd direction different from the 1st direction in which shape part 42AK21M is formed. By forming the second shape portions in different directions in the plurality of signal wirings, the pattern design of the wirings on the substrate surface can be easily and flexibly performed. Further, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be miniaturized.

  The wiring patterns constituting the four signal wirings shown in FIG. 26B include a fourth pattern 42AK23 of wiring, a fifth pattern 42AK24 of wiring, a sixth pattern 42AK25 of wiring, and a seventh pattern 42AK26 of wiring. . The signal wiring formed by the fourth pattern 42AK23 of wiring includes a portion forming the two second shape portions 42AK23M1 and 42AK23M2. The signal wiring formed of the fifth pattern 42AK24 of wiring includes a portion forming one second shape portion 42AK24M. The signal wiring formed by the sixth pattern 42AK25 of the wiring includes a portion forming one second shape portion 42AK25M. The signal wiring formed by the seventh pattern 42AK26 of wiring includes a portion forming the two second shape portions 42AK26M1 and 42AK26M2. Among the plurality of second shape portions shown in FIG. 26B, the second shape portions 42AK23M1, 42AK25M, and 42AK26M2 have a meandering shape that reciprocates in the first direction, for example, in the vertical direction. On the other hand, the second shape portions 42AK23M2, 42AK24M, 42AK26M1 have a serpentine shape that is folded back and forth in a second direction different from the first direction, for example, in the left-right direction.

  As shown in FIG. 26 (B), in a plurality of signal wirings formed by the wiring pattern, a signal wiring including a portion forming one second shape portion and a portion forming a plurality of second shape portions And signal wiring including the Alternatively, the plurality of signal wirings formed by the wiring pattern may include only a portion where each signal wiring forms one second shape portion. Alternatively, the plurality of signal wirings configured by the wiring pattern may include a portion in which each signal wiring forms a plurality of second shape portions. The second shape portion 42AK23M1 of the signal wiring formed of the fourth pattern 42AK23 of the wiring shown in FIG. 26B is the second shape portion 42AK25M of the signal wiring formed of the sixth pattern 42AK25 of the wiring and the seventh of the wiring. The second shape portion 42AK26M2 in the signal wiring formed by the pattern 42AK26 is formed in a first direction common (parallel). The second shape portion 42AK23M2 in the signal wiring formed by the fourth pattern 42AK23 of the wiring is formed by the second shape portion 42AK24M in the signal wiring formed by the fifth pattern 42AK24 of the wiring and the seventh pattern 42AK26 of the wiring. The second shape portion 42AK26M1 of the signal wiring is formed in a second direction common (parallel to). On the other hand, the second shape portions 42AK23M2, 42AK24M, 42AK26M1 are formed in a second direction different from the first direction in which the second shape portions 42AK23M1, 42AK25M, 42AK26M2 are formed.

  The signal wiring formed by the fourth pattern 42AK23 of the wiring includes a second shape portion 42AK23M1 formed in the first direction and a second shape portion 42AK23M2 formed in the second direction. The signal wiring formed by the seventh pattern 42AK26 of the wiring includes a second shape portion 42AK26M1 formed in the second direction and a second shape portion 42AK26M2 formed in the first direction. Thus, even if one signal wiring is configured by the same wiring pattern, it may include a plurality of second shape portions formed in different directions. Further, the signal wiring formed of the pattern of one wiring is different from the second shape formed in the same (parallel) direction as the second shape portion of the signal wiring formed of the other wiring pattern and different It may include a second shape formed in the direction. By forming the second shape portion in different directions in one or a plurality of signal wirings, pattern design of the wirings on the substrate surface can be easily and flexibly performed. Further, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be miniaturized.

  FIG. 27 shows an example of a configuration in which a plurality of signal wirings formed by wiring patterns are formed to have different wiring widths. In the configuration example shown in FIG. 27, patterns of wires forming four signal wires are shown as patterns of wires forming a plurality of signal wires. FIG. 27A shows the case where the wiring width is different in the entire signal wiring, and FIG. 27B shows the case where the wiring width is different in a part of the signal wiring.

  The wiring patterns constituting the four signal wirings shown in FIG. 27A include a first wiring pattern 42AK30, a second wiring pattern 42AK31, a third wiring pattern 42AK32, and a fourth wiring pattern 42AK43. . The signal wiring formed by the first pattern 42AK30 of the wiring includes a portion forming the second shape portion 42AK30M. The signal wiring formed of the second pattern 42AK31 of the wiring includes a portion forming the second shape portion 42AK31M. The signal wiring formed by the third pattern 42AK32 of wiring includes a portion forming the second shape portion 42AK32M. The signal wiring formed by the fourth pattern 42AK33 of wiring includes a portion forming the second shape portion 42AK33M.

  The signal wiring formed of the first wiring pattern 42AK30 is formed to have the same or substantially the same wiring width as the signal wiring formed of the second wiring pattern 42AK31. The signal wiring formed of the third wiring pattern 42AK32 is formed to have the same or substantially the same wiring width as the signal wiring formed of the fourth wiring pattern 42AK33. On the other hand, the signal wiring composed of the first wiring pattern 42AK30 and the signal wiring composed of the wiring second pattern 42AK31 are the same as the signal wiring composed of the third wiring pattern 42AK32 and the fourth pattern 42AK33 of the wiring. The wiring width of the entire signal wiring is formed to be wider than that of the signal wiring formed by the above. As described above, the first wiring pattern 42AK30 and the second wiring pattern 42AK31 constitute a signal wiring having a wide wiring width, and the third wiring pattern 42AK32 and the fourth wiring pattern 42AK33 constitute a signal wiring having a narrow wiring width. doing.

  For example, even if a common type of electrical signal such as a first type differential signal is transmitted between the signal wiring formed of the first pattern 42AK30 of the wiring and the signal wiring formed of the second pattern 42AK31 of the wiring Good. In addition, a common type such as a second type of differential signal different from the first type, for example, between the signal wiring configured by the third pattern 42AK32 of the wiring and the signal wiring configured by the fourth pattern 42AK33 of the wiring Electrical signals may be transmitted. On the other hand, the signal wiring composed of the first pattern 42AK30 of the wiring and the signal wiring composed of the second pattern 42AK31 of the wiring, and the fourth pattern 42AK33 of the signal wire and the wiring composed of the third pattern 42AK32 of the wiring Different types of electrical signals may be transmitted with the signal wiring configured by As described above, the plurality of signal wirings configured by the wiring pattern may be formed to have different wiring widths according to the type of the electric signal to be transmitted. Alternatively, the plurality of signal wirings configured by the wiring pattern may be formed to have the same or substantially the same wiring width when the types of electric signals to be transmitted are common. The plurality of signal wirings formed by the wiring patterns may include signal wirings formed to have different wiring widths even when the types of electric signals to be transmitted are common. Alternatively, the plurality of signal wires configured by the pattern of the wires include the signal wires formed to have the same or substantially the same wire width even when the types of electrical signals to be transmitted are different. It is also good. Since the plurality of signal lines are formed to have different line widths, the characteristic impedance in each signal line can be easily adjusted, and appropriate transmission can be performed according to the type of electric signal or the like.

  The wiring patterns constituting the four signal wirings shown in FIG. 27B include a fifth pattern 42AK34 of the wiring, a sixth pattern 42AK35 of the wiring, a seventh pattern 42AK36 of the wiring, and an eighth pattern 42AK37 of the wiring. . The signal wiring formed by the fifth pattern 42AK34 of the wiring includes a portion forming the second shape portion 42AK34M. The signal wiring formed of the sixth pattern 42AK35 of wiring includes a portion forming the second shape portion 42AK35M. The signal wiring formed of the seventh pattern 42AK36 of wiring includes a portion forming the second shape portion 42AK36M. The signal wiring formed of the eighth pattern 42AK37 of wiring includes a portion forming the second shape portion 42AK37M.

  The signal wiring composed of the fifth pattern 42AK34 of the wiring and the signal wiring composed of the sixth pattern 42AK35 of the wiring are configured such that a part of the wiring width is different from the wiring width in the other part. For example, the second shape portion 42AK34M in the signal wiring formed of the fifth pattern 42AK34 of the wiring is formed such that the wiring width is wider as compared to other portions in the same signal wiring. The second shape portion 42AK35M in the signal wiring formed by the sixth pattern 42AK35 of the wiring is formed such that the wiring width is wider compared to other portions in the same signal wiring. As described above, the fifth pattern 42AK34 of the wiring constitutes a signal wiring having a wide wiring width by the second shape portion 42AK34M, and constitutes a signal wiring having a narrow wiring width other than the second shape portion 42AK34M. The sixth pattern 42AK35 of wiring forms a signal wiring having a wide wiring width by the second shape portion 42AK35M, and configures a signal wiring having a narrow wiring width other than the second shape portion 42AK35M. The second shape portion is not limited to the one forming the signal wiring having a large wiring width, and the first shape portion having a linear shape or a substantially linear shape may form the signal wiring having a large wiring width. It is also good.

  The signal wiring formed of the fifth pattern 42AK34 of the wiring is formed such that the wiring width of the same signal wiring is different because the wiring width of the second shape portion 42AK34M is wider than the other portions. The signal wiring composed of the sixth pattern 42AK35 of the wiring is formed such that the wiring width of the same signal wiring is different because the wiring width of the second shape portion 42AK35M is wider than the other portions. On the other hand, the signal wiring formed by the seventh pattern 42AK36 of the wiring and the signal wiring formed by the eighth pattern 42AK37 of the wiring are formed such that the wiring widths of the same signal wiring are the same or substantially the same. There is. By forming part of the signal wiring with a different wiring width in one or a plurality of signal wiring, characteristic impedance in each signal wiring can be easily adjusted, and appropriate transmission according to the type of electric signal etc. is possible. Become.

  FIG. 28 shows an example of a configuration in which second shape portions of a plurality of signal wires formed by the pattern of the wires correspond to each other. In the configuration example shown in FIG. 28, patterns of wires forming two signal wires are shown as patterns of wires forming a plurality of signal wires. FIG. 28A shows a case where two signal wires meander in a substantially parallel manner, and FIG. 28B shows a case where two signal wires meanders in a direction away from each other.

  The wiring patterns constituting the two signal wirings shown in FIG. 28A include a first wiring pattern 42AK40 and a second wiring pattern 42AK41. The first wiring pattern 42AK40 and the second wiring pattern 42AK41 have a serpentine shape that is folded back and forth in a common (parallel) direction such as, for example, the vertical direction. In the meandering shape, when the signal wiring formed by the first pattern 42AK40 of the wiring is bent in a direction approaching the signal wiring formed by the second pattern 42AK41 of the wiring with respect to the extending direction DR1, it protrudes and The signal wiring formed of the second pattern 42AK41 of the wiring is bent and protruded in a direction away from the signal wiring formed of the first pattern 42AK40 of the wiring in the extending direction DR1. Thereafter, when the signal wiring formed by the first pattern 42AK40 of the wiring is bent in the direction away from the signal wiring formed by the second pattern 42AK41 of the wiring in the extension direction DR1 and returns, The signal wiring formed by the second pattern 42AK41 is bent in a direction approaching the signal wiring formed by the first pattern 42AK40 of the wiring in the extension direction DR1 and returns. In the meandering shape, the signal wiring formed by the first pattern 42AK40 of the wiring is bent and protruded in the direction away from the signal wiring formed by the second pattern 42AK41 of the wiring with respect to the extending direction DR1. The signal wiring formed by the second pattern 42AK41 of the wiring is bent and projected in a direction approaching the signal wiring formed by the first pattern 42AK40 of the wiring in the extending direction DR1. Thereafter, in the case where the signal wiring formed by the first pattern 42AK40 of the wiring is bent in a direction approaching the signal wiring formed by the second pattern 42AK41 of the wiring with respect to the extending direction DR1, the wiring is restored. The signal wiring formed by the second pattern 42AK41 is bent in the direction away from the signal wiring formed by the first pattern 42AK40 of the wiring in the extension direction DR1 and returns. Thus, the first pattern 42AK40 of the wiring and the second pattern 42AK41 of the wiring form a serpentine signal wiring which is folded back and forth substantially in parallel while maintaining substantially the same wiring interval. In addition, it is not limited to the meandering shape, and it may be formed to have an arbitrary shape different from the linear shape and the substantially linear shape.

  Thus, the signal wiring formed by the first wiring pattern 42AK40 is formed in parallel or substantially parallel to the signal wiring formed by the second wiring pattern 42AK41, and has a shape different from the linear shape and the substantially linear shape. It is formed to be By forming a second shape portion that is different from a straight line shape and a substantially straight line shape while being parallel or substantially parallel in a plurality of signal lines, pattern design of the wiring on the substrate surface is easy and flexible. Can be done. Further, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be miniaturized.

  The wiring patterns constituting the two signal wirings shown in FIG. 28B include a third wiring pattern 42AK42 and a fourth wiring pattern 42AK43. The third wiring pattern 42AK42 and the fourth wiring pattern 42AK43 have a serpentine shape that is folded back and forth in a common (parallel) direction such as, for example, the vertical direction. In this meandering shape, when the signal wiring formed by the third pattern 42 of the wiring is bent in a direction away from the signal wiring formed by the fourth pattern 42AK43 of the wiring with respect to the extending direction DR1, and protrudes. The signal wiring formed of the fourth pattern 42AK43 of the wiring is bent and protruded in a direction away from the signal wiring formed of the third pattern 42AK42 of the wiring in the extending direction DR1. In the case where the signal wiring formed by the third pattern 42AK42 of the wiring is bent in the direction approaching the signal wiring formed by the fourth pattern 42AK43 of the wiring with respect to the extending direction DR1 from the projections due to these projections The signal wiring formed by the fourth pattern 42AK43 of the wiring is bent in a direction approaching the signal wiring formed by the third pattern 42AK42 of the wiring in the extension direction DR1 and returns. In this way, the third pattern 42AK42 of the wiring and the fourth pattern 42AK43 of the wiring form a meandering signal wiring which is folded back and forth so as to protrude in the direction away from each other while changing the wiring interval and then return in the approaching direction. There is.

  Thus, the signal wiring formed by the third pattern 42AK42 of the wiring is formed in the same (parallel) direction as the signal wiring formed by the fourth pattern 42AK43 of the wiring, and is different from the linear shape and the substantially linear shape It is formed to be a shape. The substrate surface is formed by forming a second shape portion having a shape different from a linear shape and a substantially linear shape, such as a plurality of signal wires being bent in a separated direction and bent and returned in a direction approaching a protrusion The wiring pattern design in the above can be performed easily and flexibly. Further, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be miniaturized.

  FIG. 29 shows a configuration example in which circuit components are mounted so as to be connected to a plurality of signal wires configured by wiring patterns. In the configuration example shown in FIG. 29A, patterns of wires forming four signal wires are shown as patterns of wires forming a plurality of signal wires. The wiring patterns constituting these four signal wirings include a first wiring pattern 42AK50, a wiring second pattern 42AK51, a wiring third pattern 42AK52, and a wiring fourth pattern 42AK53. The signal wiring formed of the second pattern 42AK51 of the wiring includes a portion forming the first shape portion 42AK51L and a portion forming the second shape portion 42AK51M. The signal wiring formed by the third pattern 42AK52 of the wiring includes a portion forming the first shape portion 42AK52L and a portion forming the second shape portion 42AK52M.

  In the second shape portion 42AK51M of the signal wiring formed by the second pattern 42AK51 of the wiring shown in FIG. 29A, the circuit component 42AK1R connected to the signal wiring formed by the first pattern 42AK50 of the wiring is a wiring The second pattern 42AK51 is mounted so as to be connected to the signal wiring formed by the second pattern 42AK51. The circuit component 42AK1R may be, for example, a circuit element such as a resistance element. The circuit component 42AK1R may include a passive element such as a capacitor or a coil in part or all, in addition to or instead of the resistive element. The circuit component 42AK1R may include an active element such as a diode, a transistor such as a bipolar transistor or a MOS transistor, or a thyristor instead of or in addition to a passive element such as a resistive element, a capacitor or a coil. . The circuit component 42AK1R may constitute a functional circuit such as, for example, a filter circuit, a noise prevention circuit, or another IC chip. The circuit component 42AK1R supplies a specific power supply voltage to the signal wiring formed by the second pattern 42AK51 of the wiring, when the signal wiring formed by the first pattern 42AK50 of the wiring is maintained at a specific power supply voltage It may function as a pull up resistor to enable. Alternatively, the circuit component 42AK1R can supply the ground voltage to the signal wiring formed by the second pattern 42AK51 of the wiring when the signal wiring formed by the first pattern 42AK50 of the wiring is maintained at the ground voltage. Function as a pull-down resistor. Alternatively, the circuit component 42AK1R may be a functional circuit capable of switching the resistance element to a pull-up resistor and a pull-down resistor by the polarity switching unit.

  FIG. 29B is an enlarged view showing a connection portion of the circuit component 42AK1R. In the second shape portion 42AK51M shown in FIG. 29B, three folded portions in which the signal wiring formed by the second pattern 42AK51 of the wiring is folded back via the bent portion are shown. These three folded portions include a first folded portion 42AK51M1, a second folded portion 42AK51M2, and a third folded portion 42AK51M3. The circuit component 42AK1R is mounted so as to be connected to the signal wiring formed by the second pattern 42AK51 of the wiring and the signal wiring formed by the first pattern 42AK50 of the wiring in the second folded portion 42AK51M2. There is. In the second folded portion 42AK51M2 shown in FIG. 29B, the same signal wiring folded back through the bent portion has a shape in which the same signal wiring reciprocates at the wiring interval W3. On the other hand, in the first folded portion 42AK51M1 and the third folded portion 42AK51M3, the same signal wiring folded back through the bent portion is formed to reciprocate at the wiring interval W4. Further, the interval between the first folded portion 42AK51M1 and the second folded portion 42AK51M2 and the interval between the second folded portion 42AK51M2 and the third folded portion 42AK51M3 are also formed to be the wiring interval W4. The signal wiring is formed such that the wiring interval W3 is wider than the wiring interval W4. As described above, since the wiring interval W3 in the second folded portion 42AK51M2 on which the circuit component 42AK1R is mounted is wider than the wiring interval W4 in the portion on which the circuit component 42AK1R is not mounted in the second shape portion 42AK51M, the circuit component 42AK1R It can be easily mounted to appropriately adjust the transmission characteristics and the like in the signal wiring.

  The wiring interval W3 in the second folded portion 42AK51M2 on which the circuit component 42AK1R is mounted is not limited to a wiring width W4 in the portion where the circuit component 42AK1R is not mounted in the second shape portion 42AK51M. W3 may be the same as or substantially the same as the wiring interval W4, or the wiring interval W3 may be formed to be narrower than the wiring interval W4. Further, the circuit component 42AK1R is not limited to one mounted so as to be connected to the signal wiring formed by the second pattern 42AK52 of the wiring in the second folded portion 42AK51M2, and the first folded portion 42AK51M1 or the third folded portion The part 42AK51M3 may be mounted so as to be connected to the signal wiring formed by the second pattern 42AK52 of the wiring.

  As described above, the second shape portion 42AK51M of the signal wiring formed by the second pattern 42AK51 of the wiring shown in FIG. 29A or the like is connected to the signal wiring formed by the first pattern 42AK50 of the wiring. And the circuit component 42AK1R mounted on the By mounting the circuit component on the second shape portion, it is possible to appropriately adjust the transmission characteristic and the like in the signal wiring. Further, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be miniaturized.

  In the first shape portion 42AK52L of the signal wiring formed by the third pattern 42AK52 of the wiring shown in FIG. 29A, the circuit component 42AK2R connected to the signal wiring formed by the fourth pattern 42AK53 of the wiring is a wiring The third pattern 42AK52 is mounted to be connected to the signal wiring formed by the third pattern 42AK52. The circuit component 42AK2R may be, for example, a circuit element such as a resistance element. The circuit component 42AK2R may include a passive element such as a capacitor or a coil in part or all, in addition to or instead of the resistive element. The circuit component 42AK2R may include an active element such as a diode, a transistor such as a bipolar transistor or a MOS transistor, or a thyristor instead of or in addition to a passive element such as a resistive element, a capacitor or a coil. . The circuit component 42AK2R may constitute a functional circuit such as, for example, a filter circuit, a noise prevention circuit, or another IC chip. The circuit component 42AK2R supplies a specific power supply voltage to the signal wiring formed by the third pattern 42AK52 of the wiring when the signal wiring formed by the fourth pattern 42AK53 of the wiring is maintained at the specific power supply voltage It may function as a pull up resistor to enable. Alternatively, the circuit component 42AK2R can supply the ground voltage to the signal wiring formed by the third pattern 42AK52 of the wiring when the signal wiring formed by the fourth pattern 42AK53 of the wiring is maintained at the ground voltage. Function as a pull-down resistor. Alternatively, the circuit component 42AK2R may be a functional circuit in which the resistive element can be switched between pull-up resistance and pull-down resistance by the polarity switching unit.

  Thus, the first shape portion 42AK52L different from the second shape portion 42AK52M of the signal wiring formed by the third pattern 42AK52 of the wiring shown in FIG. 29A is configured by the fourth pattern 42AK53 of the wiring. The circuit component 42AK2R is mounted to be connected to the signal wiring. By mounting the circuit component in a portion different from the second shape portion, it is possible to appropriately adjust the transmission characteristic and the like in the signal wiring. Further, the increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the substrate can be miniaturized.

  Each signal wiring may be formed such that the wiring width in the portion where the circuit component 42AK1R or the circuit component 42AK2R is mounted is different from the wiring width in the portion where the circuit component 42AK1R or the circuit component 42AK2R is not mounted. For example, each signal wiring may be formed such that the wiring width in the portion where the circuit component 42AK1R or the circuit component 42AK2R is mounted is wider than the wiring width in the portion where the circuit component 42AK1R or the circuit component 42AK2R is not mounted. As described above, the plurality of signal wirings configured by the wiring pattern may be formed to have a wiring width different from that of the unmounted portion, corresponding to the portion where the circuit component is mounted. By forming the wiring parts with different wiring widths corresponding to the parts where the circuit parts are mounted, the characteristic impedance of each signal wiring can be easily adjusted, and appropriate transmission by the signal wiring becomes possible.

  25A and 25B when the signal wiring having the first shape portions 42AK10L, 42AK11L, 42AK12L, 42AK13L and the second shape portions 42AK10M, 42AK11M, 42AK12M, 42AK13M is formed, For example, as shown in FIG. 26, the second shape portions may be formed in different directions, for example, as shown in FIG. 27, for example, all or part of the signal wiring as shown in FIG. For example, as shown in FIG. 28, the second shape portion may be formed corresponding to a direction substantially parallel or apart, as shown in FIG. 28, for example, as shown in FIG. A circuit component connected to a portion different from the two-shaped portion may be mounted, or may be formed by combining some or all of them. .

(Description of the feature portion 43AK)
FIG. 30 shows a configuration example in which a test point serving as a specific conductor portion for connection confirmation is provided in the second shape portion of a plurality of signal lines configured by a pattern of wiring, with respect to the feature portion 43AK of the present embodiment. ing. In the configuration example shown in FIG. 30, as a pattern of wiring that configures a plurality of signal wirings, a pattern of wiring that configures two signal wirings is shown. The wiring patterns constituting these two signal wirings include a first wiring pattern 43AK10 and a second wiring pattern 43AK11. The signal wiring formed of the first pattern 43AK10 of wiring includes a portion forming the first shape portion 43AK10L and a portion forming the second shape portion 43AK10M. The signal wiring formed of the second pattern 43AK11 of wiring includes a portion forming the first shape portion 43AK11L and a portion forming the second shape portion 43AK11M. The first shape portions 43AK10L and 43AK11L are formed such that the signal wiring has a first shape of a linear shape or a substantially linear shape. The second shape portions 43AK10M and 43AK11M are formed such that the signal wiring has a second shape, such as a meandering shape, different from a linear shape and a substantially linear shape. The second shape portions 43AK10M and 43AK11M are not limited to the serpentine shape, and may be formed to have an arbitrary shape different from the linear shape and the substantially linear shape.

  A plurality of signal wirings constituted by the first pattern 43AK10 of the wiring and the second pattern 43AK11 of the wiring have at least a part thereof, for example, the first pattern 42AK10 of the wiring and the second pattern 42AK11 of the wiring shown in FIG. Similarly, or as in the case of the third pattern 42AK12 of the wiring and the fourth pattern 42AK13 of the wiring shown in FIG. For example, the signal wiring formed by the first pattern 43AK10 of the wiring corresponds to the first shape portion 43AK11L in which the signal wiring formed by the second pattern 43AK11 of the wiring is the first shape of the linear shape or the substantially linear shape. However, what is necessary is just to include 2nd shape part 43AK10M, such as meander shape different from 1st shape part 43AK11L. In addition, the signal wiring formed by the second pattern 43AK11 of the wiring corresponds to the first shape portion 43AK10L in which the signal wiring formed by the first pattern 43AK10 of the wiring is linear or substantially linear. It is only necessary to include a second shape portion 43AK10M such as a meander shape different from the shape portion 43AK10L.

  A test point 43AK10TP is provided in the second shape portion 43AK10M of the signal wiring formed by the first wiring pattern 43AK10 as a specific conductor portion for connection confirmation. A test point 43AK11TP is provided in the second shape portion 43AK11M of the signal wiring formed by the second pattern 43AK11 of the wiring as a specific conductor portion for connection confirmation. The test points 43AK10TP and 43AK11TP may be formed using a metal material such as solder or copper foil, for example. The test points 43AK10TP and 43AK11TP have, for example, a circular diameter W6 that is greater than the wiring width W5 of the signal wiring formed of the first wiring pattern 43AK10 and the signal wiring of the second wiring pattern 43AK11 of the wiring. , Is made to be large (wide). The test points 43AK10TP and 43AK11TP are not limited to those formed in a circle, but may be formed in any shape such as a square or a strip. Whatever shape the test points 43AK10TP and 43AK11TP have, it may be formed so that the average shape is larger (wider) than the wiring width in the signal wiring. By providing the test points 43AK10TP and 43AK11TP, it may be possible to suppress variations in the characteristic impedance in a plurality of signal wirings. As a result, the signal quality in the plurality of signal lines can be homogenized.

  For example, by bringing the test probe into contact with the test point 43AK10TP and the test point 43AK11TP, a short circuit occurs between the signal wiring formed by the first pattern 43AK10 of the wiring and the signal wiring formed by the second pattern 43AK11 of the wiring. It can be checked for the occurrence. In addition to the test points 43AK10TP and 43AK11TP, test points to be specific conductor portions for connection confirmation may be provided. As an example, a test point may be provided in addition to the test point 43AK10TP in the signal wiring formed by the first pattern 43AK10 of the wiring. By bringing a test probe into contact with this test point and the test point 43AK10TP provided in the second shape portion 43AK10M, whether or not a break occurs in the signal wiring formed of the first pattern 43AK10 of the wiring is inspected. be able to. The short circuit and the disconnection may be inspected for the occurrence or not, or in place of the inspection, for example, an oscilloscope may be used to confirm or inspect the signal waveform.

  As described above, the test point 43AK10TP is provided in the second shape portion 43AK10M in which the signal wiring shown in FIG. 30 has a second shape such as a serpentine shape, and the test point 43AK11TP is provided in the second shape portion 43AK11M. By providing a test point in the second shape portion of the signal wiring, the wiring pattern can be properly disposed, and various structures can be appropriately disposed to suppress the increase in the substrate area, thereby achieving the miniaturization of the substrate. be able to. Further, the test points 43AK10TP and 43AK11TP are formed using a metal material and formed so as to be wider than the signal line width. By forming the test points so as to be larger (wider) than the wiring width of such signal wiring, it is possible to easily make the test probe contact and test the electrical characteristics of the signal wiring. In addition, the wiring pattern can be appropriately disposed, and various structures can be appropriately disposed to suppress an increase in the substrate area, thereby achieving downsizing of the substrate.

  When test points 43AK10TP and 43AK11TP as shown in FIG. 30 are provided, a plurality of signal wires formed of wiring patterns are formed in different directions of the second shape portion, as shown for example in FIG. For example, as shown in FIG. 27, the whole or a part of the signal wiring may be formed to have a different wiring width, for example, as shown in FIG. For example, as shown in FIG. 29, circuit parts connected to portions different from the second shape portion or the second shape portion may be mounted, or may be formed by combining some or all of them. It is also good.

(Description of the feature portion 44AK)
FIG. 31 relates to the feature portion 44AK of this embodiment. In the main board 11 configured as a multilayer wiring board, signal wiring including the second shape is provided on one surface, and a specific conductor for connection confirmation is provided on the other surface. The example of a structure in case a test point is provided is shown. At least a part of the feature portion 44AK shown in FIG. 31 may be formed in the same manner as the configuration example shown in FIG. For example, the feature portion 44AK may have a multilayer structure formed by overlapping synthetic resins. The multilayer structure of the main substrate 11 shown in FIG. 31 includes a surface layer 44AK1S, a ground layer 44AK1L, a power supply layer 44AK2L, a wiring layer 44AK3L, a power supply layer 44AK4L, and a back surface layer 44AK2S.

  A surface layer 44AK1S is provided on the surface of the main substrate 11 which is to be one of the substrate surfaces, and a pattern 44AK10P and a pattern 44AK11P of a wiring forming the signal wiring are formed. A back surface layer 44AK2S is provided on the back surface of the main substrate 11, which is the other substrate surface, and a wiring pattern 44AK20P that constitutes the signal wiring is formed. Wiring pattern 44AK10P formed on surface layer 44AK1S of main substrate 11 is formed of wiring pattern 44AK2P formed on back surface layer 44AK2S through through hole 44AK1H penetrating surface layer 44AK1S and back surface layer 44AK2S of main substrate 11. It is electrically connected. The wiring pattern 44AK11P formed on the surface layer 44AK1S of the main substrate 11 and the wiring pattern 44AK20P formed on the back surface layer 44AK2S through the through holes 44AK2H penetrating the surface layer 44AK1S and the back surface layer 44AK2S of the main substrate 11 It is electrically connected. As described above, the main substrate 11 is provided on the surface layer 44AK1S provided on the front surface of one of the substrates, on the back surface of the other substrate surface, the patterns 44AK10P and 44AK11P of the wiring forming the signal wiring. A through hole 44AK1H and a through hole 44AK2H capable of electrically connecting with the wiring pattern 44AK20P constituting the signal wiring in the back surface layer 44AK2S are provided.

  The wiring pattern 44AK10P formed in the surface layer 44AK1S is, for example, a portion for forming the first shape portion and the second shape portion, similarly to the first pattern 43AK10 of the wiring and the second pattern 43AK11 of the wiring shown in FIG. A plurality of signal lines may be formed so as to be included. The signal wiring formed by the first pattern 43AK10 of the wiring and the second pattern 43AK11 of the wiring shown in FIG. Corresponding to the first shape portion 43AK11L, the signal wiring formed by the first pattern 43AK10 of the wiring may include a second shape portion 43AK10M such as a meander shape different from the first shape portion 43AK11L. In addition, the signal wiring formed by the second pattern 43AK11 of the wiring corresponds to the first shape portion 43AK10L in which the signal wiring formed by the first pattern 43AK10 of the wiring is linear or substantially linear. It is only necessary to include a second shape portion 43AK10M such as a meander shape different from the shape portion 43AK10L.

  The test point 44AK10TP shown in FIG. 31 corresponds to the wiring pattern 44AK10P corresponding to the test point 43AK10TP provided in the second shape part 43AK10M and the test point 43AK11TP provided in the second shape part 43AK11M shown in FIG. It should just be provided in the signal wiring comprised by these. The test point 44AK10TP may be connected to a different conductor layer, such as a wiring pattern 44AK20P formed in the back surface layer 44AK2S, through the through hole 44AK1H. The test points 44AK10TP are not limited to the wiring pattern 44AK20P formed on the back surface layer 44AK2S, but may be any pattern different from the surface layer 44AK1S on which the test points 44AK10TP are provided, such as a wiring pattern formed on the wiring layer 44AK3L. What is necessary is just to be connected with the conductor layer. By connecting a conductor layer different from the layer on which the test point is provided and the test point through the through hole, it is possible to easily perform the electrical property inspection of the signal wiring and the conductor layer. In addition, the wiring pattern can be appropriately disposed, and various structures can be appropriately disposed to suppress an increase in the substrate area, thereby achieving downsizing of the substrate.

  Also in the pattern 44AK11P of the wiring formed in the surface layer 44AK1S, a plurality of signal wirings may be formed so as to include the portion forming the first shape portion and the second shape portion. As described above, the plurality of signal wirings formed by the wiring pattern 44AK11P include the second shape portions different from the linear shape and the substantially linear shape on one surface of the substrate, such as the surface layer 44AK1S of the main substrate 11. It is formed. On the other hand, test points 44AK11TP are provided on the back surface layer 44AK2S. The test points 44AK11TP may be provided, for example, on the signal wiring formed of the wiring pattern 44AK20P, and may be connected to different conductor layers such as the wiring pattern 44AK11P formed on the surface layer 44AK1S through the through holes 44AK2H. . By providing the test points 44AK10TP and 44AK11P, it may be possible to suppress variations in the characteristic impedance in a plurality of signal lines. As a result, the signal quality in the plurality of signal lines can be homogenized. The signal wiring including the second shape portion is provided on one surface of the substrate, and the test point is provided on the other surface of the substrate, so that the electrical characteristic inspection of the signal wiring and the conductor layer can be easily performed. In addition, the wiring pattern can be appropriately disposed, and various structures can be appropriately disposed to suppress an increase in the substrate area, thereby achieving downsizing of the substrate.

  For example, by bringing the test probe into contact with the test point 44AK10TP, it may be possible to inspect the presence or absence of the occurrence of a short circuit in a plurality of signal wirings formed by the wiring pattern 44AK10P. Further, for example, by bringing the test probe into contact with the test point 44AK10TP and the test point 44AK11TP, the presence or absence of the occurrence of disconnection in the signal wiring constituted by the wiring pattern 44AK20P formed in the back surface layer 44AK2S or the through hole 44AK1H It should just be able to inspect. In addition, the presence or absence of disconnection in a plurality of signal lines constituted by the wiring pattern 44AK10P, the presence or absence of occurrence of short circuit or disconnection in a plurality of signal lines constituted by the wiring pattern 44AK11P, constituted by a wiring pattern 44AK20P A test point may be provided which enables inspection of the presence or absence of a short circuit in a plurality of signal wirings, the presence or absence of a short circuit in through hole 44AK1H, and the presence or absence of a short circuit or disconnection in through hole 44AK2H.

  The test point to be the specific conductor portion for connection confirmation is not limited to the one provided with a dedicated electrode pad for contacting the test probe, and for example, circuit components can be connected for adjustment of characteristic impedance in signal wiring. What is necessary is just to be comprised using arbitrary electrode pads, such as an electrode pad, provided in. A specific conductor such as a test point is a conductor layer different from a layer on which a plurality of signal wiring lines and test points are provided among a plurality of layers included in the multilayer wiring board by through holes provided in the multilayer wiring board By being electrically connected to each other, the electrical property inspection on the multilayer wiring board can be appropriately performed. For example, by providing a specific conductor portion such as a test point on the other substrate surface different from the one substrate surface on which the wiring pattern is formed, such as the substrate surface on the back surface side, the electrical characteristics inspection in the multilayer wiring substrate is appropriate Can be done. In addition, the wiring pattern can be appropriately disposed, and various structures can be appropriately disposed to suppress an increase in the substrate area, thereby achieving downsizing of the substrate.

  When test points 44AK10TP and 44AK11TP as shown in FIG. 31 are provided, a plurality of signal wires formed of wiring patterns are formed in different directions of the second shape portion, for example, as shown in FIG. For example, as shown in FIG. 27, the whole or a part of the signal wiring may be formed to have a different wiring width, for example, as shown in FIG. For example, as shown in FIG. 29, circuit parts connected to portions different from the second shape portion or the second shape portion may be mounted, or may be formed by combining some or all of them. It is also good.

(Description of feature 45AK)
Hereinafter, with reference to the drawings, the substrate case 45AK10 of the gaming machine according to the characteristic part 45AK, and the substrate 45AK50 and the heat sink 45AK40 accommodated in the substrate case 45AK10 will be described in detail. FIG. 32 is an exploded perspective view of the substrate case 45AK10, the substrate 45AK50, and the heat sink 45AK40 of the gaming machine according to the embodiment of the present invention as viewed from the rear. FIG. 33 is an exploded perspective view of the substrate case 45AK10, the substrate 45AK50, and the heat sink 45AK40 of the gaming machine according to the embodiment of the present invention as viewed from the front. In the following description, in order to facilitate understanding, the longitudinal direction shown in FIG. 32 and the like is defined, and the vertical and horizontal directions when the substrate case 45AK10 etc. are viewed from the front are the vertical and horizontal directions of the substrate case 45AK10 etc. explain.

  The substrate case 45AK10 is configured by combining a front case 45AK20 forming the front and a rear case 45AK30 forming the rear. Inside the substrate case 45AK10, a housing 45AK50 on which electronic components such as a CPU, a ROM, and a connector are mounted, and a housing space for housing the heat sink 45AK40 are formed.

  The front case 45AK20 is made of, for example, a synthetic resin having thermoplasticity, and is formed in a substantially rectangular shape in plan view. The front case 45AK20 has a box shape with an open rear. The upper edge of the front case 45AK20 is formed with two protrusions 45AK21 projecting upward. Further, at the lower edge of the front case 45AK20, two projecting portions 45AK22 that project downward are formed.

  Similarly to the front case 45AK20, the rear case 45AK30 is also made of, for example, a synthetic resin having thermoplasticity, and is formed in a substantially rectangular shape in plan view. The rear case 45AK30 has a base plate 45AK30a forming a rear surface, an upper wall 45AK30b, a right wall 45AK30c, a lower wall 45AK30d, and a left wall 45AK30e erected forward from the base plate 45AK30a. As a result, the rear case 45AK30 has a box shape with an open front, and its housing portion is deeper than that of the front case 45AK20. On the upper wall 45AK30b of the rear case 45AK30, two locking portions 45AK31 having insertion holes 45AK31a through which the projecting portions 45AK21 formed on the front case 45AK20 are inserted are formed. Further, on the lower wall 45AK30d of the rear case 45AK30, two locking portions 45AK38 (FIG. 33) to which the projecting portions 45AK22 formed on the front case 45AK20 are hooked are formed.

  When combining the front case 45AK20 and the rear case 45AK30, first, the protruding portion 45AK21 of the front case 45AK20 is inserted into the insertion hole 45AK31a of the rear case 45AK30. Then, the lower portion of the front case 45AK20 is pressed against the rear case 45AK30, and the projection 45AK22 of the front case 45AK20 is hooked on the locking portion 45AK38 of the rear case 45AK30. As a result, the front case 45AK20 and the rear case 45AK30 are combined to form an accommodation space for the substrate 45AK50 and the like inside.

  Further, in the rear case 45AK30, a plurality of air holes 45AK32 are formed in the upper wall 45AK30b, and a plurality of air holes 45AK33 (FIG. 33) are formed in the lower wall 45AK30d. Thus, the passage of air along the vertical direction is secured in the substrate case 45AK10. Further, the four insertion convex portions 45AK36 for positioning the substrate 45AK50, screw holes 45AK37a to 45AK37e for screwing the substrate 45AK50, and the four corners of the heat sink 45AK40 are suppressed in the base plate 45AK30a of the rear case 45AK30. Four positioning portions 45AK34 for positioning, and six supporting portions 45AK35 supported in contact with the heat sink 45AK40 positioned at the four positioning portions 45AK34 are formed.

  The insertion convex portions 45AK36 are formed at the four corners of the base plate 45AK30a. Each of the insertion convex portions 45AK36 is a cylindrical convex portion to be inserted into an insertion hole 45AK50a formed in the substrate 45AK50.

  Each of the four positioning portions 45AK34 has an angled shape, and is disposed so as to be able to abut on the corner of the heat sink 45AK40 in an orthogonal plane.

  The support portion 45AK35, as shown in the enlarged view of FIG. 33, is disposed in the notch 45AK30f of the base plate 45AK30a, and has a projecting portion 45AK35a that protrudes further forward than the base plate 45AK30a. The supporting portion 45AK35 is in a cantilever state in which only one end is supported by the base plate 45AK30a. Therefore, the support portion 45AK35 elastically deforms and is displaced rearward when a stress in the rear direction acts on the projecting portion 45AK35a. On the other hand, when the backward stress does not act on the protrusion 45AK 35 a, the support 45 AK 35 returns to the front and returns to the original state.

  The heat sink 45AK40 is formed, for example, by processing aluminum excellent in heat conductivity. The heat sink 45AK40 includes a rectangular base plate 45AK41 and five rectangular fins 45AK42 erected on the base plate 45AK41. Each of the fins 45AK42 extends in the vertical direction, and is arranged in parallel in the horizontal direction.

  The substrate 45AK50 is, for example, a printed circuit board on which various electronic components such as a CPU, a ROM, and a connector are mounted. In the substrate 45AK50, four insertion holes 45AK50a provided at positions corresponding to the insertion convex portions 45AK36 formed in the rear case 45AK30, and screw insertion holes 45AK55a into which screws 45AK81a to 45AK81e for fixing the substrate 45AK50 are inserted. To 45 AK 55 e are formed.

  Furthermore, on the substrate 45AK50, a heat-generating electronic component 45AK60, and a non-heat-generating electronic component 45AK51 and an electronic component 45AK52 are provided. The electronic component 45AK60, the electronic component 45AK51, and the electronic component 45AK52 have a rectangular shape. In particular, the electronic component 45AK60 has a substantially square shape. Further, among the non-heat generating electronic components, the electronic component 45AK52 is taller (thicker) than the electronic component 45AK51. That is, in FIG. 32, the electronic component 45AK52 protrudes further to the rear than the electronic component 45AK51. Here, the heat generating electronic component refers to an electronic component that generates heat to the extent that a heat radiation countermeasure is necessary to prevent a malfunction of the electronic component. On the other hand, the non-heat generating electronic component refers to an electronic component that generates heat only to an extent that does not need to take measures against heat release, or does not generate heat at all.

  Among the non-heat generating electronic components, the low-height electronic component 45AK51 is disposed above the heat generating electronic component 45AK60. Among the non-heat generating electronic components, the high-height electronic component 45AK52 is disposed to the right of the heat generating electronic component 45AK60. Further, the non-heat generating electronic component 45AK51 and the electronic component 45AK52 are arranged such that each side is parallel to the side of the rectangular substrate 45AK50 in plan view. On the other hand, the heat-generating electronic component 45AK60 is arranged such that each side is not parallel to the side of the rectangular substrate 45AK50 in plan view. A heat conductive sheet 45AK70 is attached to the heat generating electronic component 45AK60 so as to be interposed between the electronic component 45AK60 and the heat sink 45AK40 and to transmit the emitted heat to the heat sink 45AK40. The heat conductive sheet 45AK70 covers approximately the whole of the electronic component 45AK60.

  The heat conductive sheet 45AK70 can be adopted from a known heat conductive sheet of a type in which both sides adhere, a flexible heat conductive sheet mainly made of silicone, non-silicone or ceramic. The heat conductive sheet 45AK70 is interposed between the electronic component 45AK60 and the heat sink 45AK40 to bond the two together.

(About attachment of the heat sink 45AK40 and the substrate 45AK50)
Next, a procedure for attaching the heat sink 45AK 40 and the substrate 45AK 50 to the substrate case 45AK 10 will be described. FIG. 34 is a cross-sectional view showing how the heat sink 45AK 40 and the substrate 45AK 50 are attached to the substrate case 45AK 10 in the order of attachment ((a) to (b)). FIG. 35 is a cross-sectional view showing how the heat sink 45AK 40 and the substrate 45AK 50 are attached to the substrate case 45AK 10 in the order of attachment ((a) to (b)), following FIG. 34 and 35 are cross-sectional views taken along the line A-A in FIG.

  As shown in FIG. 34A, first, the rear case 45AK30 is placed on a table or the like, and the heat sink 45AK40 is placed on the rear case 45AK30. The heat sink 45AK40 is placed with its four corners aligned with the positioning portion 45AK34 formed on the base plate 45AK30a, as shown in FIG. 34B, so that the fins 45AK42 extend in the vertical direction. Thereby, the heat sink 45AK40 can be positioned with respect to the rear case 45AK30. At this time, the fins 45AK42b and the fins 45AK42d of the heat sink 45AK40 are in contact with the projecting portion 45AK35a of the support portion 45AK35.

  Subsequently, as shown in FIG. 34B, the substrate 45AK50 in which the heat conduction sheet 45AK70 is attached to the electronic component 45AK60 is installed in the rear case 45AK30. At that time, the insertion convex portion 45AK36 formed in the rear case 45AK30 is inserted into the insertion hole 45AK50a formed in the substrate 45AK50 shown in FIG. 33, and the substrate 45AK50 is formed as the rear case 45AK30 as shown in FIG. Place on As described above, the insertion convex portion 45AK36 is inserted into the insertion hole 45AK50a, whereby the substrate 45AK50 is positioned with respect to the rear case 45AK30.

  Subsequently, as shown in FIG. 35A, the screws 45AK81a to 45AK81e (only the screw 45AK81e is shown in FIG. 35A) are inserted into the substrate 45AK50 and tightened in the corresponding screw holes 45AK37a to 45AK37e. As a result, the heat sink 45AK40 and the substrate 45AK50 supported by the support portion 45AK35 are pressed toward the rear case 45AK30. As a result, as shown in FIG. 35 (b), the support 45 AK 35 elastically deforms, and its tip is displaced rearward by the distance L. The elastically deformed supporting portion 45AK 35 pushes the heat sink 45AK 40 in contact forward. On the other hand, the screws 45AK81a to 45AK81e hold down the substrate 45AK50 which is pressed forward via the heat sink 45AK40. As a result, the heat sink 45AK40 and the heat conduction sheet 45AK70 are in close contact with each other, and the electronic component 45AK60 and the heat conduction sheet 45AK70 are in close contact with each other. With such a configuration, the heat generated from the electronic component 45AK60 is transmitted to the heat sink 45AK40 via the heat conductive sheet 45AK70 and dissipated from the heat sink 45AK40.

(About the effect etc. of the characteristic part 45AK)
The effects of the gaming machine according to the characteristic part 45AK will be described with reference to the drawings. FIG. 36 is a plan view for illustrating the relationship between the heat sink 45AK40 and the electronic component 45AK60. FIG. 37 is an explanatory view for explaining the flow of air in the substrate case 45AK10. Since FIG. 36 is a view of the heat sink 45AK40 from the side of the fin 45AK42, the electronic component 45AK60 is illustrated by a broken line which is a hidden line. In addition, although a heat conduction sheet 45AK70 is interposed between the heat sink 45AK40 and the electronic component 45AK60 to conduct heat, for convenience, the heat conduction sheet 45AK70 is omitted from the heat sink from the entire surface of the electronic component 45AK60. It is assumed that heat is conducted to 45AK40. The electronic component 45AK61 indicated by a two-dot chain line is a comparative example shown for comparison with the electronic component 45AK60.

  As shown in FIG. 36, the rectangular electronic component 45AK60 is arranged such that the sides 45AK60a to 45AK60d are not parallel to the sides 45AK40a to 45AK40d of the rectangular heat sink, as viewed from above. That is, the electronic component 45AK61 can be disposed by rotating the electronic component 45AK61 having the sides parallel to the sides 45AK40a to 45AK40d of the heat sink by a predetermined angle θ with respect to the center point O. The predetermined angle θ is, for example, approximately 45 °. In addition, since the electronic component 45AK60 has a substantially square shape, the diagonal of the electronic component 45AK60 faces in the vertical and horizontal directions. By arranging the electronic component 45AK60 in this way, the apex 45AK60f of the electronic component 45AK60 is on the right side (left side in the figure) than the fin 45AK42b, and the apex 45AK60e of the electronic part 45AK60 is on the left side (right side in the drawing) than the fin 45AK42d It can be arranged. On the other hand, in the electronic component 45AK61 of the comparative example disposed so that the direction matches the heat sink 45AK40, any portion is on the right side (left side in the drawing) than the fin 45AK 42b or left side (right side in the drawing) Not located in). Thus, the electronic component 45AK60 can transfer much heat to the fins 45AK42b and the fins 45AK42d, and can effectively use the fins 45AK42b and the fins 45AK42d when radiating heat. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced. In the above, the arrangement aspect of the electronic component 45AK60 with respect to the heat sink 45AK40 has been described, but naturally this is technically equivalent even if it is described as the arrangement aspect of the heat sink 45AK40 with respect to the electronic component 45AK60.

  Further, the heat generated from the electronic component 45AK60 is transmitted not only to the heat sink 45AK40 but dissipated, but a part of the heat is dissipated directly upward from the electronic component 45AK60. Thus, the amount of heat radiated directly upward from the electronic component 45AK60 becomes larger as the length in the left-right direction of the electronic component 45AK60 becomes longer. Here, as shown in FIG. 36, the width W1 in the left-right direction of the electronic component 45AK60 is larger than the width W2 in the left-right direction of the electronic component 45AK61 that is the comparative example. Therefore, with the arrangement of the electronic component 45AK60, more heat generated from the electronic component 45AK60 can be radiated directly upward to be dissipated. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  Further, as shown in FIG. 37, an air hole 45AK33 for air to flow in is formed in the lower portion of the rear case 45AK30, and an air hole 45AK32 for discharging air is formed in the upper portion of the rear case 45AK30. . Thus, in the substrate case 45AK10, a passage of air along the vertical direction is secured. The air (arrow Y1) flowing in from the air hole 45AK33 moves upward. The air moved upward passes through between the fins 45AK42 formed on the heat sink 45AK40 (arrow Y2). At this time, the heat of the heat sink 45AK40 is taken away and the air is warmed. The warmed air passes between the low-profile electronic components 45AK51 disposed above the heat sink 45AK40 (arrow Y3) or passes behind the low-profile electronic components 45AK51 (arrow Y4) to the upper side. And move. The air, which has been moved upward in the end, is discharged from the air hole 45AK32 formed at the top of the rear case 45AK30 (arrow Y5). As described above, by arranging the electronic components 45AK51 with a low height above the heat sink 45AK40, air can be passed not only between the electronic components 45AK51 but also behind the electronic components 45AK51. On the other hand, the electronic component 45AK52 having a high height is disposed on the right side (left side in the drawing) without being disposed above and below the heat sink 45AK40. Accordingly, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced without blocking the flow of air moving from the lower side to the upper side.

  Further, by making the longitudinal direction of the electronic component 45AK51 coincide with the vertical direction, the space between the electronic components 45AK51 can be made large. Thus, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced without obstructing the flow of air moving upward.

  Further, the heat sinks 45AK40 are arranged such that the fins 45AK42 arranged in parallel in the left-right direction face in the vertical direction. Thereby, air moving from the lower side to the upper side can be passed between the fins 45AK42 along the vertical direction. Thus, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced without blocking the flow of air moving upward.

  In addition, the heat conduction sheet 45AK70 interposed between the electronic component 45AK60 and the heat sink 45AK40 is a flexible heat conduction sheet in which both surfaces are adhered. Therefore, the heat conduction sheet 45AK70 can be closely attached to the electronic component 45AK60 and the heat sink 45AK40 without any gap. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transmitted to the heat sink 45AK40 through the heat conduction sheet 45AK70.

  Further, the rear case 45AK30 is provided with a support 45AK35 for pressing the heat sink 45AK40 to the heat-generating electronic component 45AK60. As a result, the heat sink 45AK40 and the electronic component 45AK60 press the heat conduction sheet 45AK70 and adhere closely to the heat conduction sheet 45AK70 without any gap. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transmitted to the heat sink 45AK40 through the heat conduction sheet 45AK70.

  Further, as shown in FIGS. 32 and 33, the substrate 45AK50 is attached to the rear case 45AK30 by a plurality of screws 45AK81a to 45AK81e. Among the plurality of screws 45AK81a to 45AK81e, the screw 45AK81d and the screw 45AK81e are inserted into the screw insertion hole 45AK55d and the screw insertion hole 45AK55e in the vicinity of the electronic component 45AK60, and are tightened to the rear case 45AK30. As described above, by fastening the screw 45AK 81 d and the screw 45 AK 81 e to the rear case 45 AK 30 in the vicinity of the electronic component 45 AK 60, the heat sink 45 AK 40 bonded to the electronic component 45 AK 60 can be reliably pressed toward the rear case 45 AK 30. Thereby, adhesion between the heat sink 45AK40 and the electronic component 45AK60 can be made reliable.

  Further, the support portion 45AK35 is disposed in the notch 45AK30f of the base plate 45AK30a, and a slight clearance t (FIG. 34A) is provided between the support portion 45AK35 and the notch 45AK30f. . The heat transferred to the heat sink 45AK40 can be dissipated to the outside of the substrate case 45AK10 from the gap t. Thereby, the heat generated from the electronic component 45AK60 can be dissipated efficiently.

  When the substrate 45AK50 is not installed in the rear case 45AK30, the support 45AK35 is flush with the base plate 45AK30a of the rear case 45AK30 except for the protrusion 45AK35a. On the other hand, when the substrate 45AK50 is installed in the rear case 45AK30, the support portion 45AK35 bends rearward and a shift occurs with the base plate 45AK30a. Thus, heat can be easily dissipated from the gap t due to the displacement generated between the support portion 45AK 35 and the base plate 45AK 30a. Thereby, the heat generated from the electronic component 45AK60 can be dissipated efficiently.

(Description of other features)
For example, instead of being provided on a control board such as the main board 11 or the effect control board 12 or being provided on a control board, a wiring pattern for connecting a plurality of electrical components shown in FIG. A connecting member between boards for connecting a plurality of control boards, a connecting member between board circuits for connecting a control board and another electrical component, a connecting member between circuits for connecting a plurality of electrical parts, and the like It may be provided to a plurality of connecting members in which some or all of these connecting members are combined. The connecting member may be configured partially or entirely as a rigid printed wiring board, or partially or entirely configured as a flexible printed wiring board. In such a connecting member, a parallel wiring portion in which a plurality of signal wirings are in a parallel or substantially parallel first shape and at least one signal wiring of a plurality of signal wirings is in a second shape not parallel to other signal wirings A wiring pattern may be formed to include the specific wiring portion. Also, the wiring pattern may be formed such that the wiring lengths of the respective signal wirings included in the plurality of signal wirings are the same or substantially the same. Thereby, the increase in the area in the connection member which arrange | positions the pattern of wiring is suppressed, and size reduction of a structure can be achieved.

  The connecting member may have a shape including a bent portion, such as an L-shape, or may have a linear shape not including the bent portion. When the connecting member has a shape including a bending portion, the bending portion may have an angular shape having a predetermined angle, or may have an arc shape having a predetermined curvature. The wiring pattern may be formed on both sides of the connection member, or may be formed on one side of the connection member. When the connection member is configured as a multilayer printed wiring board, the wiring pattern may be formed on the surface layer of the connection member or may be formed on the inner layer of the connection member. When such a connecting member is used, by forming the plurality of signal wires to include the parallel wiring portion and the specific wiring portion, an increase in the area of the connecting member for arranging the wiring pattern is suppressed. The size of the configuration can be reduced.

  The connection member is configured to include a flexible flex portion such as a flex rigid wiring board and a non-flexible rigid portion, for example. Circuit components configured to be performed. This can prevent the circuit components from falling off. Moreover, the increase in the area in the connection member which arrange | positions the pattern of wiring is suppressed, and size reduction of a structure can be achieved.

  When the connecting member is configured to include a flexible flex portion such as a flexible printed wiring board or a flex rigid wiring board, for example, between the front surface as one surface and the rear surface as the other surface, A penetrating portion such as a through hole or a via which can electrically connect the signal wiring may be provided. In this case, the through portion may not be provided in the flex portion. Alternatively, the through portion may not be provided in the bent portion of the flex portion which is bent at the time of connection. This can reduce the possibility of disconnection of the signal wiring. Moreover, the increase in the area in the connection member which arrange | positions the pattern of wiring is suppressed, and size reduction of a structure can be achieved.

  When the wiring pattern for electrically connecting the first component and the second component by the plurality of signal wirings is connected to the first component, the plurality of signal wirings are connected at the first wiring interval, and the second component And the plurality of signal lines may be formed to be connected at a second wiring interval different from the first wiring interval. Such a wiring pattern may be formed such that the plurality of signal wirings include a space adjustment unit that adjusts the first wiring space and the second wiring space. Also, the wiring pattern may be formed such that the wiring lengths of the respective signal wirings included in the plurality of signal wirings are the same or substantially the same. As a result, the wiring interval can be adjusted, and a plurality of components can be appropriately connected. Moreover, the increase in the area in the connection member which arrange | positions the pattern of wiring is suppressed, and size reduction of a structure can be achieved.

  Both the first part and the second part may be wiring connection parts such as a receptacle or a connector, or both may be electrical parts such as a processor or a memory, and one is a wiring connection part and the other is an electric. It may be a part. Thereby, when various components are connected, the wiring interval can be adjusted, and a plurality of components can be appropriately connected. Moreover, the increase in the area in the connection member which arrange | positions the pattern of wiring is suppressed, and size reduction of a structure can be achieved.

(Description on deformation and application)
The present invention is not limited to the above embodiment, and various modifications and applications are possible. For example, the pachinko gaming machine 1 does not have to have all the technical features shown in the above embodiment, and the part described in the above embodiment can be solved so that at least one problem in the prior art can be solved. It may have a configuration of For example, among the features described in the above embodiment, it is sufficient to have at least one feature that enables appropriate substrate configuration. In addition, even if the configuration is not described in the above embodiment, at least one problem included in the same or similar problems as in the case of including the configuration described in the above embodiment is solved, or the above embodiment If at least one purpose or function included in the same or similar purpose or function as the case described in the above can be achieved, the structure described in the above embodiment or in the above embodiment can be used. It may be provided instead of the described configuration.

  In the above embodiment, at least one of the plurality of signal wires electrically connecting the plurality of electrical components has a shape different from the linear shape and the substantially linear shape, and is parallel to the other signal wires. The description has been made assuming that the shape different from the substantially parallel shape includes a portion to be a shape called a meander shape, a meander shape, a zigzag shape, or a folded shape. On the other hand, unlike the meandering shape such as a curved shape or a spiral shape, the wiring length of the signal wiring is different from the linear shape and the shape different from the substantially linear shape and the shape different from the parallel and substantially parallel shapes with other signal wires. Can be any shape that can be extended or adjusted. At least one of the plurality of signal wires electrically connecting the plurality of electrical components includes a portion having a shape capable of extending the wire length, whereby each signal wire included in the plurality of signal wires is The wiring lengths may be the same or substantially the same, and the delay time difference of the signals transmitted through the plurality of signal wirings may be prevented or suppressed.

  The plurality of electrical components electrically connected by the plurality of signal wirings are not limited to the RAM 102 and the CPU 103 mounted on the main substrate 11, and may be any electrical components provided in a gaming machine such as the pachinko gaming machine 1 . For example, the effect control CPU 120 and the RAM 122 mounted on the effect control board 12 are electrically connected by a plurality of signal lines as a plurality of electric parts, and at least one of the plurality of signal lines has a linear shape and The wiring pattern may be formed so as to have a shape different from the substantially straight shape and to have a shape different from the shapes parallel and substantially parallel to other signal wires. In this case, the effect control CPU 120 is an electric component configured to be able to execute predetermined processing with regard to control of effects in the pachinko gaming machine 1, and the RAM 122 can store information regarding the execution of the process by the effect control CPU 120 It is an electrical component configured in Alternatively, instead of the RAM 102 in the above-described embodiment, it may be an electrical component such as the ROM 101 capable of storing information related to the execution of processing by the CPU 103. Alternatively, instead of the CPU 120 for effect control, an electrical component such as a graphics processor included in the display control unit 123 may be an electric component capable of executing processing relating to effects different from the CPU 120 for effect control. Furthermore, instead of the RAM 122, it may be an electric component such as the ROM 121 capable of storing information related to the execution of the process by the effect control CPU 120. In addition, the RAM 122 may be replaced by an electrical component such as an image data memory capable of storing information related to the execution of processing by the graphics processor of the CPU 120 for effect control or the display control unit 123.

  The effect control board 12 may be configured as a multilayer wiring board, similarly to the main board 11 in the above embodiment. The plurality of signal wires in the above embodiment are electrically connected to a plurality of processing devices, such as a graphics processor provided in the effect control CPU 120 and the display control unit 123 mounted on the effect control board 12, for example. A wiring pattern may be formed. Alternatively, the plurality of signal lines are formed with a wiring pattern such that a plurality of electrical components such as a graphics processor included in the display control unit 123 and an input / output port for video signals are electrically connected. It may be In a plurality of signal lines to which a plurality of such electric components are connected, a wiring pattern is formed such that an arbitrary electric circuit different from the plurality of electric components, such as a filter circuit or a buffer circuit, intervenes It may be one. In a plurality of signal wirings, for example, digital video signals indicating respective levels (RGB values) of display colors R (red), G (green), and B (blue) in the image display device 5 are transmitted by parallel signal method It may be done. Alternatively, in the plurality of signal wires, signals relating to control of game control and effects may be transmitted by parallel signal method such as LVDS (Low Voltage Differential Signal) method, for example. In these parallel signal systems, synchronized signal transmission may be required in a plurality of signal lines. Therefore, by forming a wiring pattern so that a portion having a meandering shape or the like is provided as in the above embodiment, the wiring length of each signal wiring included in a plurality of signal wirings is the same or substantially the same. It becomes the same and can reduce the delay time difference of the signal transmitted by several signal wiring.

  In addition, it is not limited to the signal transmitted by a parallel signal system, For example, for presentation for the video signal supplied to the image display apparatus 5, speakers 8L and 8R, the game effect lamp 9, the motor 60 for presentation, LED61 for presentation, etc. When a control signal supplied to an electric component is transmitted by serial signal method, a signal wiring for transmitting a clock signal and a signal wiring for transmitting a data signal are a plurality of in the above embodiment. It may be included in the signal wiring. Furthermore, when the video signal and the control signal are transmitted by the serial signal method, signal wirings for transmitting the signal by the differential signal transmission method may be included in the plurality of signal wirings in the above embodiment.

  For example, as in the signal wiring formed by the wiring pattern 30AK10D, even for signal wirings in which the distance between connection terminals in a plurality of electrical components is longer than that of other signal wirings, the shape is different from the linear shape The wiring pattern may be formed to include a portion having a shape different from the parallel and substantially parallel shapes with other signal wires. Even if the distance between connection terminals in a plurality of electrical components is a signal wiring shorter than other signal wirings, the wiring length may be longer than the other signal wirings depending on the design of the wiring pattern on the substrate. In such a case, selection of a signal wiring including a portion having a shape such as a meandering shape among a plurality of signal wirings and a signal wiring not including such a portion is performed in designing a wiring pattern on the substrate. It may be arbitrarily changed accordingly.

  The plurality of signal wirings formed by the wiring patterns are not limited to those formed with the same or substantially the same wiring length, and are formed in combination with an arbitrary configuration capable of adjusting the delay time difference (skew) It may be For example, the dielectric constant of a dielectric disposed corresponding to one signal wiring among a plurality of signal wirings is made different from the dielectric constant of an insulator or the like disposed corresponding to another signal wiring. Thus, by changing the propagation speed of the signal, the delay time difference (skew) in each signal wiring is combined with that which can be adjusted, and at least one signal wiring has a linear shape and a substantially linear first shape and May include a second shape portion having a different second shape.

  In the above embodiment, as shown in FIG. 37, the electronic components arranged with the sides inclined in the vertical and horizontal directions are the heat generating electronic component 45AK60 and the electronic component 45AK62 provided around the electronic component 45AK60. . However, only the heat-generating electronic component 45AK60 may be arranged to be inclined, and the other electronic components may be arranged not to be inclined. In addition, all of the electronic components 45AK60 may be inclined.

  Further, the inclination angle of the heat sink with respect to the heat-generating square electronic component is not limited to 45 °. That is, the degree of the inclination angle is not particularly limited as long as the heat sink can sufficiently ensure the range in contact with the electronic component in the arrangement direction of the fins.

  The shape of the heat-generating electronic component does not have to be substantially square, and may be rectangular. Even when employing a rectangular electronic component, the heat generated from the electronic component can be obtained by arranging the heat sink so that the direction in which the fins are arranged matches the direction in which the diagonal of the electronic component extends. The heat dissipation effect of the

  In addition, the heat conduction sheet attached to the heat generating electronic component may be provided in a range sufficient to conduct the heat generated from the electronic component. For example, it may be provided in the range which covers the whole electronic component, and you may make it provide only in the range which generates heat (only the one part range of the electronic component). In addition, it is preferable to set it as the magnitude | size which does not contact with the wiring of a board | substrate, even when it is a case where it provides when covering the whole electronic component, a heat conductive sheet.

(Other Embodiment 1)
FIG. 38 is a cross-sectional view showing how the heat sink and the substrate are attached to the substrate case of the gaming machine according to the other embodiment 1. In the following description of the other embodiments, differences from the above embodiments will be mainly described. In addition, about the member same as the said form, the same code | symbol shall be attached | subjected and the description is abbreviate | omitted. As shown in FIG. 38, the rear case 45AK130 is provided with a spring 45AK135 which abuts on and supports the fins 45AK42 of the heat sink 45AK40 instead of the support portion 45AK35 shown in FIG. The spring 45AK135 is a compression coil spring, but in addition, a leaf spring such as a spring washer may be employed. Further, the rear case 45AK130 is formed with a plurality of air holes 45AK138 for discharging the heat of the heat sink 45AK40 to the outside. The attachment of the heat sink 45AK 40 and the rear case 45AK 130 of the substrate 45AK 50 is the same as that described above. That is, the heat sink 45AK40 is placed in alignment with the positioning portion 45AK134. At this time, the fin 45AK42 is placed on the spring 45AK135. Subsequently, the substrate 45AK50 having the heat conduction sheet 45AK70 attached to the electronic component 45AK60 is inserted into the insertion convex portion 45AK136 to be aligned and mounted on the heat sink 45AK40. Subsequently, the screw 45AK81e is inserted into the substrate 45AK50 and fastened to the screw hole 45AK37e. Thereby, the spring 45AK135 is pressed and contracted by the fin 45AK42 and presses the fin 45AK42 toward the substrate 45AK50. Thereby, the heat conduction sheet 45AK70 can be closely attached to the heat sink 45AK40 and the electronic component 45AK60.

(Other Embodiment 2)
FIG. 39 is a cross-sectional view showing how the heat sink and the substrate are attached to the substrate case of the gaming machine according to the second embodiment. As shown in FIG. 39, unlike the above embodiment, the rear case 45AK 230 is not provided with a member for supporting the fin 45AK 242, such as the support 45AK 35 (FIG. 33) and the spring 45AK 135 (FIG. 38). The rear case 45AK230 is formed with a plurality of air holes 45AK238 for releasing the heat of the heat sink 45AK240 to the outside.

  In the substrate 45AK250, a screw insertion hole 45AK252 for passing the screw 45AK251 is formed. Further, in the heat sink 45AK240, a screw hole 45AK243 for fastening the screw 45AK251 is formed. The heat sink 45AK240 and the substrate 45AK250 can be integrated by inserting the screw 45AK251 into the screw insertion hole 45AK252 formed in the substrate 45AK250 and tightening the screw hole 45AK243 formed in the heat sink 45AK240. At this time, the heat sink 45AK240 is drawn to the substrate 45AK250 side by sufficiently tightening the screw 45AK251. Thereby, the heat conduction sheet 45AK270 can be closely attached to the heat sink 45AK240 and the electronic component 45AK260.

  The receptacle KRE 1 is not limited to one mounted on the surface of the effect control board 12 as long as the receptacle KRE 1 is mounted on an arbitrary board such as the board of the main board 11. The various power supply voltages are not limited to those supplied to the effect control board 12, but may be supplied to any control board such as the main board 11 or the payout control board. The various electric circuits and electric components are not limited to those disposed on the effect control board 12, but may be disposed on any control board such as the main board 11 or the payout control board.

  This invention is applicable not only to the pachinko gaming machine 1 but also to slot machines and the like. The slot machine is, for example, an arbitrary gaming machine capable of playing a predetermined game such as variable display of symbols serving as plural types of identification information and giving a predetermined game value based on the game result, more specifically, A variable display device that can start a game by setting a predetermined number of bets (the number of medals or the number of credits) for one game, and variably displays plural types of identification information (patterns) that can be identified. For example, one game is ended when the display results of a plurality of reels are derived and displayed, and the winnings are made according to the displaying results (for example, cherry winning, watermelon winning, bell winning, replay winning, BB winning, RB winning etc) Is a game machine in which it is possible to generate In such a slot machine, the pachinko game shown in the above embodiment is performed by the cooperation of hardware resources including a game control microcomputer for performing game control and software for performing predetermined processing. It may be configured to include all or some of the features of the machine 1.

  In addition, the device configuration and various operations of the gaming machine can be arbitrarily changed and modified without departing from the spirit of the present invention. In addition, the gaming machine according to the present invention is not limited to a payout type gaming machine that pays out a predetermined number of gaming media as a prize based on the occurrence of a prize, and the gaming medium is enclosed and scored based on the occurrence of a prize It can apply also to the enclosed type game machine which grants. The slot machines are not limited to those in which the number of bets is set using medals and credits as gaming values, but only slot machines that set the number of bets using gaming balls as gaming values and only credits as gaming values It may be a fully credited slot machine that sets the number of bets using.

  It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is indicated not by the above description but by the claims, and is intended to include all the modifications within the meaning and scope equivalent to the claims.

(Description of means for solving problems and effects)
As described above, in the gaming machine such as the pachinko gaming machine 1 according to the present invention, in the wiring connection device such as the receptacle KRE1, the terminals TA01 serving as a pair of ground terminals at positions sandwiching the terminals TA02 serving as signal terminals. , And by mounting the TA 03 on the surface of the effect control substrate 12, an appropriate substrate configuration becomes possible.

  By bonding the terminals TA01 and TA03 to the dummy pads DP1 and DP2 and covering the tips of the terminals TA01 to TA03 with the cover member 802 of the substrate case 800, an appropriate substrate configuration is possible.

  In the receptacle KRE1, by providing the fixing brackets SS01 and SS02 joined to the dummy pads DP3 and DP4 on the side of the side surface PL2, an appropriate substrate configuration can be realized.

  The gap between the inner peripheral wall surface 836b and the receptacle KRE1 in the opening region 836a is formed such that the opening width W2 closer to the component storage portion 802a is wider than the opening width W1 farther, allowing an appropriate board configuration Become.

  Each of the terminals TA01 to TA03 of the receptacle KRE1 is not covered by the cover member 802 of the substrate case 800 in the opening area 836a, and an exposed part exposed and a cover part not covered by the cover member 802 of the substrate case 800 are formed. This enables appropriate substrate configuration.

  The mounting position where the terminals TA01 to TA03 of the receptacle KRE1 are surface mounted is covered by the opening peripheral portion 840, and a space SP1 in which the opening peripheral portion 840 and the substrate surface of the effect control board 12 are close to the mounting position is formed. Appropriate substrate configuration is possible.

  Alternatively, in the effect control board 12, the power supply voltage VSL2 of DC 34 V is output as it is as the power supply voltage VSL, and is input to the filter circuit 511 by the driver board 19 to stabilize the voltage, thereby enabling an appropriate board configuration. .

  Since the filter circuit is not interposed in the power supply line LSL for supplying the power supply voltage VSL of 34 V DC, an appropriate substrate configuration can be realized.

  In the receptacle KRE2, the number of the terminals TA15 to TA24, TA27, and TA28 connected to any of the filter circuits 131a to 131c is larger than the number of the terminals TA13 and TA14 not connected to the filter circuit. Substrate configuration is possible.

  The terminals TA15 to TA24, TA27, and TA28 connected to any of the filter circuits 131a to 131c can supply a plurality of types of power supply voltages, and in the effect control substrate 12, the terminals TA13 and TA14 not connected to the filter circuit are one type. A power supply voltage can be supplied, and the terminals TA13 and TA14 are disposed outside the terminals TA15 to TA24 and the like, whereby an appropriate substrate configuration is possible.

  By arranging the terminals TA13 to TA24, TA27, and TA28, which are power supply voltage terminals, between the terminals TA11 and TA12, which are ground terminals, and the terminals TA29 and TA30, which are ground terminals, appropriate substrate configuration is possible. become.

  In the receptacle KRE2, the terminals TA13 and TA14 included in the second power supply voltage terminal and the terminals TA15 to TA24 included in the first power supply voltage terminal are included in the first ground terminal, and the terminals TA11 and TA12, and the second ground terminal Are disposed between the terminals TA25 and TA26 included in the first power supply voltage terminal, the terminals TA25 and TA26 included in the second ground terminal, and the terminal TA29 included in the third ground terminal. , And between the TAs 30, enables appropriate substrate configuration.

  Alternatively, in the effect control board 12, after the power supply voltage VDD2 of 1 is branched into the power supply voltage VDL for driving a specific electric component and the power supply voltage VDS for supplying to the amplifier circuit 521, the filter circuit 131a is By supplying the stabilized power supply voltage VDS to the amplification circuit 521, an appropriate substrate configuration is possible.

  By making the wiring length LL2 from the filter circuit 131a to the amplifier circuit 521 shorter than the wiring length LL1 from when the power supply voltage VDL is branched at the branch point DB1 to when it is input to the filter circuit 131a, an appropriate substrate configuration is obtained. It will be possible.

  Alternatively, in the noise prevention circuits 135a and 135b, an appropriate substrate configuration can be realized by using a resistor which is a circuit element different from the noise prevention circuit 135c.

  The noise prevention circuits 135a and 135b are provided corresponding to the power supply voltage for driving a specific electric component such as a motor or LED, and the noise prevention circuit 135c is a power supply voltage for driving a specific electric circuit such as a CPU or a ROM. The corresponding provision enables appropriate substrate configuration.

  Alternatively, in the step-down converter circuit 132, the power supply voltage VDD3 stabilized by the filter circuit 131c is input, and the power supply voltage of 1.05 V DC and the power voltage of 3.3 V DC are output. By supplying a power supply voltage of 3.3 V and outputting a power supply voltage of 1.5 V DC, an appropriate substrate configuration is possible.

  By supplying the power supply monitoring circuit 140 with the same or substantially the same power supply voltage VDC as the voltage supplied to the step-down converter circuit 132, an appropriate substrate configuration is possible.

  The power supply voltage of 1.05 V DC output from the step-down converter circuit 132 is supplied to a specific microprocessor, such as a graphics processor of the display control unit 123, to enable an appropriate substrate configuration.

  The power supply voltage of 3.3 V DC output from the step-down converter circuit 132 is supplied to, for example, the ROM 121, and starts earlier than an electric component such as the RAM 122 driven by the 1.5 V DC power supply voltage output from the regulator circuit 133. By being possible, an appropriate substrate configuration is possible.

  The power supply voltage of 1.5 V DC output from the regulator circuit 133 is supplied to one configured as a substrate different from the effect control substrate 12, such as the RAM 122, for example, so that an appropriate substrate configuration is possible.

(Description of means for solving problems and effects of feature portion 30AK)
For example, a pachinko gaming machine 1, such as pachinko gaming machine 1, is a gaming machine capable of playing a game, and as shown in FIG. 17, for example, a pattern forming a plurality of signal lines is formed, and a plurality of electric lines such as RAM 102 and CPU 103 by a plurality of signal lines. A pattern is provided with a substrate such as the main substrate 11 to which components are connected, and the pattern includes a plurality of signals such as the region 30AK11R and a parallel wiring portion in which the plurality of signal wires are parallel or substantially parallel. At least one of the wires includes a specific wire portion having a second shape that is not parallel to the other signal wires, and the wire lengths of the respective signal wires included in the plurality of signal wires are the same or substantially the same. Become. This enables an appropriate substrate configuration to reduce the delay time difference of the signals transmitted by the plurality of signal wirings.

  For example, signal wires not including the second shape, such as signal wires formed by the wiring pattern 30AK10D, have a second distance, such as signal wires formed by the wiring patterns 30AK11D to 30AK13D, of the plurality of electrical components. It may be longer than the signal wiring including the shape. As a result, an increase in the area of the substrate on which the wiring patterns are arranged is suppressed, and an appropriate substrate configuration can be realized in order to miniaturize the substrate.

  For example, the conductor may not be provided in a predetermined area close to the second shape signal wiring, such as the space area 30AK0SP. This enables an appropriate substrate configuration in which electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings is prevented or suppressed.

  The substrate is provided with through holes capable of electrically connecting signal wires provided on one surface of the substrate, such as through holes 30AK1H and 30AK2H, with signal wires provided on the other surface of the substrate. The wiring lengths of the signal wirings included in the above may be the same or substantially the same, including the lengths of the through holes, for the signal wirings connected by the through holes. This enables an appropriate substrate configuration to reduce the delay time difference of the signals transmitted by the plurality of signal wirings.

  The substrate includes a plurality of layers such as, for example, surface layer 30AK1S, ground layer 30AK1L, power supply layer 30AK2L, wiring layer 30AK3L, power supply layer 30AK4L, back surface layer 30AK2S, and the signal wiring to be the second shape among the plurality of layers is provided. Signal transmission may not be performed on a conductor layer such as the ground layer 30AK1L adjacent to the layer. This enables an appropriate substrate configuration in which electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings is prevented or suppressed.

  As a plurality of electrical components, for example, processing means capable of executing predetermined processing such as the CPU 103, and storage means capable of storing information on execution of processing such as the RAM 102 may be connected. As a result, it is possible to make an appropriate substrate configuration that reduces the delay time difference of the signals transmitted by the plurality of signal wires connected to the processing means and the storage means as the plurality of electrical components.

  Alternatively, for example, a pachinko gaming machine 1 or the like is a gaming machine capable of playing a game, and as shown in FIG. 17, for example, patterns forming a plurality of signal wiring are formed, and a plurality of RAM 102, CPU 103, etc. And a plurality of parallel wiring portions such as a region 30AK10R in which a plurality of signal wirings are parallel or substantially parallel and a plurality of parallel wiring portions, for example, a plurality of regions 30AK11R The signal wiring may include a specific wiring portion having a second shape different from the first shape, and the wiring lengths of the signal wirings included in the plurality of signal wirings may be the same or substantially the same. This enables an appropriate substrate configuration to reduce the delay time difference of the signals transmitted by the plurality of signal wirings.

  Alternatively, for example, a pachinko gaming machine 1 or the like is a gaming machine capable of playing a game, and as shown in FIG. 17, for example, patterns forming a plurality of signal wiring are formed, and a plurality of RAM 102, CPU 103, etc. A pattern such as, for example, the wiring pattern 30AK10D, at least one of a plurality of signal wirings has a linear shape or a substantially linear shape; And a second pattern having a second shape different from the first shape, such as, for example, wiring patterns 30AK11D to 30AK13D, which are not included in the first pattern among the plurality of signal wirings. In the first pattern and the second pattern, the wire lengths of the respective signal wires included in the plurality of signal wires are the same or substantially the same. It may be made. This enables an appropriate substrate configuration to reduce the delay time difference of the signals transmitted by the plurality of signal wirings.

  Alternatively, for example, a pachinko gaming machine 1 or the like is a gaming machine capable of playing a game, and as shown in, for example, FIG. Of the plurality of signal lines, at least one of the plurality of signal lines connects the predetermined sections such as the section 30AK0SC by the shortest or substantially shortest distance. Wiring patterns 30AK12D, 30AK13D, etc. in which a first pattern such as the patterns 30AK10D and 30AK11D and another signal wiring not included in the first pattern among the plurality of signal wirings connect a predetermined section at a distance longer than the first pattern And the first pattern and the second pattern are included in the plurality of signal lines. The wiring length of the signal lines may be made the same or substantially the same. This enables an appropriate substrate configuration to reduce the delay time difference of the signals transmitted by the plurality of signal wirings.

  In the first pattern, the distance between connection terminals in the plurality of electrical components may be longer than the second pattern. As a result, an increase in the area of the substrate on which the wiring patterns are arranged is suppressed, and an appropriate substrate configuration can be realized in order to miniaturize the substrate.

  For example, the conductor may not be provided in a predetermined area close to the second pattern, such as the space area 30AK0SP. This enables an appropriate substrate configuration in which electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings is prevented or suppressed.

  The substrate includes a plurality of layers such as, for example, surface layer 30AK1S, ground layer 30AK1L, power supply layer 30AK2L, wiring layer 30AK3L, power supply layer 30AK4L, back surface layer 30AK2S, and the signal wiring included in the second pattern among the plurality of layers is provided. In the conductor layer such as the ground layer 30AK1L adjacent to the target layer, signal transmission may not be performed. This enables an appropriate substrate configuration in which electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings is prevented or suppressed.

(Description of means for solving problems and effects of the characteristic part 42AK)
For example, as shown in FIG. 25A, a pachinko gaming machine 1 such as pachinko gaming machine 1 is a gaming machine capable of forming a plurality of signal wiring, for example, a first pattern 42 AK10 of wiring and a second wiring of wiring A substrate such as a main substrate 11 on which a first pattern such as a pattern 42AK11 and a second pattern are formed and a plurality of electrical components such as the RAM 102 and the CPU 103 are connected by a plurality of signal wirings The signal wiring formed by one of the patterns corresponds to the first shape which is a straight or substantially straight first shape, such as the first shape 42AK10L, for example, and the other of the first pattern and the second pattern A second shape different from the first shape, such as the second shape portion 42AK11M, for example. Corresponding to the first shape portion in the signal wiring including the other portion including the L-shaped portion, such as the first shape portion 42AK11L, the signal wiring including one pattern such as the second shape portion 42AK10M The second shape portion is included. As a result, an increase in the area of the substrate on which the wiring patterns are arranged is suppressed, and an appropriate substrate configuration can be realized in order to miniaturize the substrate.

  The first pattern and the second pattern may be formed such that the wiring lengths of the respective signal wirings are the same or substantially the same. This enables an appropriate substrate configuration to reduce the delay time difference of the signals transmitted by the plurality of signal wirings.

  For example, as shown in FIG. 26, the second shape portion may be formed in different directions by the signal wiring formed by the first pattern and the signal wiring formed by the second pattern. Thereby, the pattern design of the wiring on the substrate surface can be easily and flexibly performed, and the increase in the substrate area for arranging the wiring pattern can be suppressed, and the substrate can be miniaturized.

  For example, as shown in FIG. 27, the second shape portion may be formed to have different wiring widths by the signal wiring formed by the first pattern and the signal wiring formed by the second pattern. As a result, the characteristic impedance in each signal wiring can be easily adjusted, and appropriate transmission can be performed according to the type of the electric signal.

  For example, as shown in FIG. 28A, the second shape portion is a parallel wiring portion in which the signal wiring formed by the first pattern and the signal wiring formed by the second pattern are formed in parallel or substantially in parallel. May be included. Thereby, the pattern design of the wiring on the substrate surface can be easily and flexibly performed, and the increase in the substrate area for arranging the wiring pattern can be suppressed, and the substrate can be miniaturized.

  For example, as shown in FIGS. 29A and 29B, the second shape portion of the signal wiring formed of the first pattern or the second pattern is connected to the signal wiring formed of another pattern. May be provided with circuit components such as circuit components 42AK1R mounted in a manner such that Thereby, the transmission characteristics and the like in the signal wiring can be appropriately adjusted, and the increase in the area of the substrate on which the wiring pattern is arranged can be suppressed, and the substrate can be miniaturized.

  For example, as shown in FIG. 29A, the signal wiring formed by the first pattern or the second pattern is mounted so as to be connected to a wiring portion such as the first shape portion 42AK52L different from the second shape portion. The circuit component such as the circuit component 42AK2R may be provided. Thereby, the transmission characteristics and the like in the signal wiring can be appropriately adjusted, and the increase in the area of the substrate on which the wiring pattern is arranged can be suppressed, and the substrate can be miniaturized.

(Description of means for solving problems and effects of the characteristic part 43AK)
For example, as shown in FIG. 30, the pachinko gaming machine 1 or the like is a gaming machine capable of playing a game, for example, a first pattern 43AK10 of wiring and a second pattern 43AK11 of wiring as patterns constituting a plurality of signal wirings. And a substrate such as the main substrate 11 to which a plurality of electrical components such as the RAM 102 and the CPU 103 are connected by a plurality of signal wirings, and one of the first pattern and the second pattern The signal wiring composed of the first pattern and the second pattern corresponding to the first shape such as the first shape 43AK10L and 43AK11L, for example, is a straight or substantially straight first shape. For example, the second shape portion 43AK10M, 43AK11M, and the like have a first shape and a signal wiring formed of a pattern. It includes a second profiles made different from the second shape, for example, test points 43AK10P, etc. 43AK11P, certain conductor portions for connection confirmation to the second shaped portion is provided. As a result, the wiring pattern can be properly disposed, various structures can be appropriately disposed, and the increase in the substrate area can be suppressed, and the substrate can be miniaturized.

  The specific conductor portion is formed of, for example, a metal material such as solder or copper foil, and for example, of the signal wiring formed of the first pattern or the second pattern as in the wiring width W5 <diameter W6 shown in FIG. It may be formed to be wider than the wiring width. This makes it possible to easily inspect the electrical characteristics of the signal wiring, properly arrange the wiring pattern, and properly arrange various structures, thereby suppressing an increase in the substrate area and downsizing of the substrate. Can be

  The substrate includes a plurality of layers such as a surface layer 44AK1S, a ground layer 44AK1L, a power supply layer 44AK2L, a wiring layer 44AK3L, a power supply layer 44AK4L, a back surface layer 44AK2S shown in FIG. 31. The specific conductor portion is specified among the plurality of layers It may be connected to a conductor layer different from the layer in which the conductor portion is provided, for example, through holes such as through holes 44AK1H and 44AK2H. This makes it possible to easily inspect the electrical characteristics of the signal wiring and the conductor layer, appropriately arrange the wiring pattern, and properly arrange various structures, thereby suppressing an increase in the substrate area. Can be miniaturized.

(Description of means for solving problems and effects of the characteristic part 44AK)
For example, as shown in FIG. 30, the pachinko gaming machine 1 or the like is a gaming machine capable of playing a game, for example, a first pattern 43AK10 of wiring and a second pattern 43AK11 of wiring as patterns constituting a plurality of signal wirings. And a substrate such as the main substrate 11 to which a plurality of electrical components such as the RAM 102 and the CPU 103 are connected by a plurality of signal wirings, and one of the first pattern and the second pattern The signal wiring composed of the first pattern and the second pattern corresponding to the first shape such as the first shape 43AK10L and 43AK11L, for example, is a straight or substantially straight first shape. For example, the second shape portion 43AK10M, 43AK11M, and the like have a first shape and a signal wiring formed of a pattern. A signal including a second shape having a different second shape, such as a surface layer 44AK1S shown in FIG. 31, for example, including a second shape such as a signal wiring formed of wiring patterns 44AK10P and 44AK11P on one surface of a substrate Wiring is provided, and a specific conductor portion for connection confirmation, such as a test point 44AK11TP, is provided on the other surface of the substrate, such as the back surface layer 44AK2S. This makes it possible to easily inspect the electrical characteristics of the signal wiring and the conductor layer, appropriately arrange the wiring pattern, and properly arrange various structures, thereby suppressing an increase in the substrate area. Can be miniaturized.

(Description of means for solving problems and effects of the characteristic part 45AK)
As shown in FIG. 36, the rectangular electronic component 45AK60 is arranged such that the sides 45AK60a to 45AK60d are not parallel to the sides 45AK40a to 45AK40d of the rectangular heat sink, as viewed from above. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  The electronic component 45AK61 can be disposed by rotating the electronic component 45AK61 having the sides parallel to the sides 45AK40a to 45AK40d of the heat sink by a predetermined angle θ around the center point O. The predetermined angle θ is, for example, approximately 45 °. Thereby, the heat dissipation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  The heat sinks 45AK40 are arranged such that the fins 45AK42 arranged in parallel in the left-right direction face the top-bottom direction. Thereby, the air moving from the lower side to the upper side can be passed between the fins 45AK42 along the vertical direction, and the heat generated from the electronic component 45AK60 is not obstructed the flow of the air moving upward. The heat dissipation effect of the

  The heat conduction sheet 45AK70 interposed between the electronic component 45AK60 and the heat sink 45AK40 is a flexible heat conduction sheet in which both surfaces adhere. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transmitted to the heat sink 45AK40 via the heat conduction sheet 45AK70, and the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  The rear case 45AK30 is provided with a support 45AK35 for pressing the heat sink 45AK40 to the heat-generating electronic component 45AK60. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transmitted to the heat sink 45AK40 via the heat conduction sheet 45AK70, and the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

1 ... pachinko gaming machine 11 ... main board 12 ... effect control board 13 ... voice control board 19 ... driver board 120 ... CPU for effect control
121 ... ROM
122 ... RAM
123 ... Display control units 131a to 131c, 511 ... Filter circuits 132 ... Step-down converter circuits 133 ... Regulator circuits 140 ... Power supply monitoring circuits 521 ... Amplifier circuits 800 ... Substrate cases 802 ... Cover members KRE1 to KRE4 ... Receptacles 30AK10G, 30AK11G, 30AK20G ... Ground conductor 30AK01R, 30AK10R, 30AK11R, 30AK12R,
30AK20R ... area 30AK0SC ... section 30AK10D to 30AK13D, 30AK10CK, 30AK10CS,
30AK10RS, 30AK10A-30AK14A, 30AK10P,
30AK11P, 30AK20P ... Wiring pattern 30AK1S ... Surface layer 30AK2S ... Back surface layer 30AK1L ... Ground layer 30AK2L, 30AK4L ... Power supply layer 30AK3L ... Wiring layer 30AK1H, 30AK2H ... Through holes 42AK10 to 42AK13, 42AK20 to 42AK26
42AK30-42AK37, 42AK40-42AK43
42AK50-42AK53, 43AK10, 43AK11,
44AK10P, 44AK11P, 44AK20P ... wiring patterns 42AK10L to 42AK13L, 42AK51L, 42AK52L ... first shape portions 42AK10M to 42AK13M, 42AK20M to 42AK22M,
42AK23M1, 42AK23M2, 42AK24M, 42AK25M,
42AK26M1, 42AK26M2, 42AK30M to 42AK37M,
42AK51M, 42AK52M ... second shape part 42AK51M1 to 42AK51M3 ... folded part 42AK1Z to 42AK4Z ... wiring part 42AK1R, 42AK2R ... circuit parts 43AK10, 43AK11 ... wiring pattern 43AK10L, 43AK11L ... first shape part 43AK10M, 43AK11MTP ... , 43AK11TP ... test point 44AK10P, 44AK11P, 44AK20P ... wiring pattern 44AK1S ... surface layer 44AK2S ... back surface layer 44AK1L ... ground layer 44AK2L, 44AK4L ... power supply layer 44AK3L ... wiring layer 44AK1H, 44AK2H ... through hole 44AK10TP, 44AK10TP ... Board case 45AK20 ... Previous Source 45AK30 ... Rear case 45AK32, 45AK33 ... Air hole 45AK34 ... Positioning part 45AK35 ... Support part 45AK36 ... Insertion convex part 45AK37 ... Screw hole 45AK40 ... Heat sink 45AK42 ... Fin 45AK50 ... Substrate 45AK60 ... Electronic component 45AK70 ... Thermal conductive sheet 45AK81a ~ 45AK81b … screw

Claims (1)

A gaming machine capable of playing games,
A first pattern and a second pattern that constitute a plurality of signal lines are formed;
A substrate to which a plurality of electrical components are connected by the plurality of signal wires;
A signal wiring composed of one of the first pattern and the second pattern corresponds to a first shape portion which is a straight or substantially straight first shape, the first pattern and the second pattern And a second shape portion having a second shape different from the first shape, wherein the signal wiring formed by the other pattern of
A specific conductor portion for connection confirmation is provided in the second shape portion,
A game machine characterized by