JP2019106324A - Light emitter - Google Patents

Light emitter Download PDF

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JP2019106324A
JP2019106324A JP2017239070A JP2017239070A JP2019106324A JP 2019106324 A JP2019106324 A JP 2019106324A JP 2017239070 A JP2017239070 A JP 2017239070A JP 2017239070 A JP2017239070 A JP 2017239070A JP 2019106324 A JP2019106324 A JP 2019106324A
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light emitting
base
air
emitting device
light
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JP7057115B2 (en
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一乃大 八木
Motonao Yagi
一乃大 八木
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CCS Inc
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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

To prevent adhesion of garbage and dust to a substrate while improving heat radiation efficiency of light emitting elements.SOLUTION: A light emitter 100 includes: a heat radiation member 40 having a base 42 where light emitting elements 20 are located in a row and a plurality of heat radiation bodies 41 provided oppositely to the light emitting elements 20 of the base 42; and a fan 50 for circulating air between the plurality of heat radiation bodies 41, and the light emitter 100 is configured such that the base 42 has a through hole H formed at one or both of positions sandwiching the light emitting elements 20 arranged in the row and that a circulation path L for circulating the air between the through hole H and an outside of the light emitter 100 in a manner such as not to pass the air through a light emitting element loaded region 31 is provided on a side closer to a light emission side than the base 42.SELECTED DRAWING: Figure 3

Description

本発明は、例えばライン状の光を射出する光射出装置に関するものである。   The present invention relates to a light emitting device that emits, for example, linear light.

この種の光射出装置は、特許文献1に示すように、複数のLEDが列状に搭載された基板を、複数の放熱板がベースに支持されてなるヒートシンクに設けて、このヒートシンクに送風ファンから空気を送り込むことで、LEDを冷却するように構成されたものがある。   As shown in Patent Document 1, in this type of light emitting device, a substrate on which a plurality of LEDs are mounted in a row is provided on a heat sink having a plurality of heat dissipation plates supported by a base, Some have been configured to cool the LEDs by pumping air from the

この光射出装置は、基板がベースの幅方向中央に設けられ、放熱板がLEDの配列方向に垂直且つ互いに平行に設けられ、送風ファンが放熱板の先端部から内部に空気を送り込むように構成されており、放熱板の間に送り込まれた空気は、ベース側に向けて流動した後、ベースに沿って流動して放熱板の間から排出されるため、ヒートシンクの外周部に比べ、熱源の直下であるヒートシンクの中央部では風量が少なかったり、空気が滞留し易く、放熱効率が悪い。   This light emitting device is configured such that the substrate is provided at the center in the width direction of the base, the heat sinks are provided vertically and parallel to the arrangement direction of the LEDs, and the blower fan feeds air from the tip of the heat sink to the inside. The air sent between the heat sinks flows toward the base side and then flows along the base and is discharged from between the heat sinks, so that the heat sink is directly under the heat source compared to the outer periphery of the heat sink In the central part of the air volume is small, air tends to stay, and the heat radiation efficiency is poor.

そこで、放熱効率を向上させる方法として、例えば、LED近傍のベース部分に貫通孔を設け、送風ファンからの空気がこの貫通孔へ流れ込むようにすることで、ヒートシンクの中央部の風量を増やす方法が考えられる。   Therefore, as a method of improving the heat radiation efficiency, for example, a method of increasing the air volume at the central portion of the heat sink by providing a through hole in the base portion in the vicinity of the LED and allowing air from the blower fan to flow into the through hole Conceivable.

しかしながら、単に貫通孔を設けるだけでは、貫通孔へ流れ込んだ空気がLEDの搭載されている領域を通過するので、例えばLEDや配線などにゴミや埃などが付着してしまい、それらが焼けてショート等を引き起こす恐れがある。   However, simply by providing the through hole, the air that has flowed into the through hole passes through the area where the LED is mounted, so that, for example, dust or dirt adheres to the LED, the wiring, etc. There is a risk of causing

特開2014−122798号公報JP, 2014-122798, A

そこで、本発明は、上記問題点を一挙に解決すべくなされたものであり、放熱効率を向上させつつ、LEDなどの発光素子や配線などにゴミや埃などが付着することを防ぐことをその主たる課題とするものである。   Therefore, the present invention has been made to solve the above problems at once, and to prevent the adhesion of dust and dirt to light emitting elements such as LEDs and wiring while improving the heat radiation efficiency. It is the main issue.

すなわち本発明にかかる光射出装置は、複数の発光素子と、表面に前記複数の発光素子が列状に搭載されたベース及び前記ベースの裏面に設けられた複数の放熱体を有する放熱部材と、前記複数の放熱体の間に空気を流通させるファンとを具備するものであって、前記ベースには、列状に配置された前記発光素子を挟む位置の一方又は両方に、表裏に貫通する貫通孔が形成されており、前記ベースよりも光射出側には、前記空気を、前記発光素子が搭載された領域を通過させないように、前記貫通孔と当該光射出装置の外部との間で流通させる流通路が形成されていることを特徴とするものである。   That is, a light emitting device according to the present invention comprises: a plurality of light emitting elements; a base on the surface of which the plurality of light emitting elements are mounted in a row; and a heat radiating member having a plurality of heat radiating bodies provided on the back of the base. And a fan for circulating air between the plurality of radiators, wherein the base penetrates through the front and back at one or both of positions sandwiching the light emitting elements arranged in a row. A hole is formed, and the air is circulated between the through hole and the outside of the light emitting device so as not to allow the air to pass through the region where the light emitting element is mounted on the light emitting side than the base. It is characterized in that a flow passage is formed.

このように構成された光射出装置であれば、ベースに形成された貫通孔に空気が流通するので、熱源である発光素子の直下部近傍において、放熱体を流通する風量を増やしたり、空気が滞留するのを防止することができ、放熱効率を向上させることができる。
そのうえ、ベースよりも光射出側における流通路が、空気を、発光素子が搭載された領域を通過させないように、貫通孔と光射出装置の外部との間で流通させるため、発光素子や配線などにゴミや埃などが付着することを防ぐことができる。
In the light emitting device configured as described above, the air flows through the through holes formed in the base, so that the amount of air flowing through the heat sink can be increased in the vicinity of the portion directly below the light emitting element that is the heat source. Accumulation can be prevented, and the heat radiation efficiency can be improved.
Moreover, the flow passage on the light emission side relative to the base allows the air to flow between the through hole and the outside of the light emission device so that the air does not pass through the region where the light emission element is mounted. Can be prevented from adhering to dust and dirt.

空気が発光素子搭載領域を通過することを防ぐための具体的な構成としては、前記複数の発光素子と前記貫通孔との間に介在して、前記空気が前記発光素子搭載領域を通過することを防ぐ保護部材をさらに具備している構成が挙げられる。   As a specific configuration for preventing air from passing through the light emitting element mounting area, the air passes through the light emitting element mounting area, being interposed between the plurality of light emitting elements and the through hole. The structure which is further equipped with the protection member which prevents

前記保護部材が、前記発光素子から射出された光を反射するものであることが好ましい。
このような構成であれば、発光素子から射出された光の取り出し効率を向上させるという効果も更に得ることができる。
It is preferable that the protective member reflects light emitted from the light emitting element.
With such a configuration, the effect of improving the extraction efficiency of light emitted from the light emitting element can be further obtained.

前記発光素子を挟む位置の一方又は両方に設けられた前記貫通孔のさらに外側の前記ベースの表面に、第2の放熱部材が設けられていることが好ましい。
このような構成であれば、第2の放熱部材によって放熱効率をさらに向上させることができる。
It is preferable that a second heat dissipation member is provided on the surface of the base outside the through hole provided at one or both of the positions sandwiching the light emitting element.
With such a configuration, the heat dissipation efficiency can be further improved by the second heat dissipation member.

前記複数の発光素子及び前記放熱部材により光射出ユニットが構成されるとともに、当該ユニットの複数が前記発光素子の配列方向に沿って配置されており、前記第2の放熱部材が、前記光射出ユニットを連結することが好ましい。
このような構成であれば、発光素子及び放熱部材をユニット化することができ、不具合を生じた部分の交換等が容易である。そのうえ、第2の放熱部材によって複数の光射出ユニットが連結されるので、これらのユニットを連結する連結具等の専用部材を不要にすることができる。
A light emitting unit is constituted by the plurality of light emitting elements and the heat radiating member, and a plurality of the units are arranged along the arrangement direction of the light emitting elements, and the second heat radiating member is the light emitting unit Are preferably linked.
With such a configuration, it is possible to unitize the light emitting element and the heat dissipation member, and replacement of a portion having a defect is easy. Moreover, since the plurality of light emitting units are connected by the second heat radiating member, a dedicated member such as a connector for connecting these units can be eliminated.

空気が発光素子搭載領域を通過することをより確実に防ぐためには、前記ベースを収容するとともに、側壁に前記空気が流通する通風窓が形成された筐体をさらに具備し、前記流通路が、前記通風窓により当該光射出装置の外部に連通していることが好ましい。
このような構成であれば、通風窓を介して、流通路内に空気が流入したり、流通路外に空気が流出することとなる。
In order to more reliably prevent the air from passing through the light emitting element mounting area, the apparatus further comprises a housing which accommodates the base and in which a ventilation window through which the air flows is formed on the side wall, the flow passage It is preferable to communicate with the exterior of the said light emission apparatus by the said ventilation window.
With such a configuration, air flows into the flow passage or flows out of the flow passage through the ventilating window.

より具体的な実施態様としては、前記発光素子の両側に、複数の前記貫通孔が前記発光素子の配列方向に沿って設けられ、前記通風窓が前記筐体の両側壁に形成されている構成が挙げられる。
このような構成であれば、複数の貫通孔が発光素子の両側にその配列方向に沿って設けられているので、発光素子の配列方向の様々な箇所における発光素子の直下部近傍において、放熱体を流通する風量を増やしたり、空気の滞留を防止することができ、放熱効率をさらに向上させることが可能である。
As a more specific embodiment, a plurality of the through holes are provided on both sides of the light emitting element along the arrangement direction of the light emitting element, and the ventilation windows are formed on both side walls of the housing. Can be mentioned.
With such a configuration, since the plurality of through holes are provided on both sides of the light emitting element along the arrangement direction, the heat dissipating member in the vicinity of the portion directly below the light emitting element at various places in the arrangement direction of the light emitting element It is possible to increase the amount of air flowing through and to prevent the stagnation of air and to further improve the heat radiation efficiency.

このように構成した本発明によれば、放熱効率を向上させつつ、発光素子や配線などにゴミや埃が付着することを防ぐことができる。   According to the present invention configured as described above, it is possible to prevent dust and dirt from adhering to the light emitting element, the wiring, and the like while improving the heat dissipation efficiency.

本実施形態の光射出装置の全体構成を模式的に示す斜視図。BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which shows typically the whole structure of the light emission apparatus of this embodiment. 本実施形態の光射出装置の筐体内の構成を模式的に示す斜視図。FIG. 2 is a perspective view schematically showing a configuration inside a housing of the light emitting device of the present embodiment. 本実施形態の光射出装置の筐体内の構成を模式的に示す断面図。Sectional drawing which shows typically the structure inside the housing | casing of the light emission apparatus of this embodiment. その他の実施形態の光射出装置の筐体内の構成を模式的に示す断面図。Sectional drawing which shows typically the structure inside the housing | casing of the light emission apparatus of other embodiment.

以下に本発明に係る光射出装置の一実施形態について図面を参照して説明する。   An embodiment of a light emitting device according to the present invention will be described below with reference to the drawings.

本実施形態に係る光射出装置100は、例えば検査物(ワーク)にライン状の光を照射するものであり、その外観検査などに用いられるライン光射出装置100である。具体的にこのライン光射出装置100は、図1及び図2に示すように、略直方体形状をした筐体10と、複数の発光素子たるLED20と、表面にこれらのLED20が搭載された基板30と、基板30の裏面が取り付けられた放熱部材40(以下、メイン放熱部材40という)と、メイン放熱部材40に空気を流通させるファン50とを具備している。なお、図2では、説明の便宜上、筐体10及び後述する保護部材70の記載は省略してある。   The light emission device 100 according to the present embodiment is, for example, a line light emission device 100 that irradiates light in the form of a line to an inspection object (work), and is used for an appearance inspection or the like. Specifically, as shown in FIG. 1 and FIG. 2, the line light emitting device 100 has a substantially rectangular parallelepiped housing 10, LEDs 20 which are a plurality of light emitting elements, and a substrate 30 on which these LEDs 20 are mounted. A heat dissipating member 40 (hereinafter referred to as a main heat dissipating member 40) to which the back surface of the substrate 30 is attached and a fan 50 for allowing air to flow through the main heat dissipating member 40 are provided. In FIG. 2, for convenience of explanation, the description of the housing 10 and the protective member 70 described later is omitted.

筐体10は、例えば金属製で、LED20、基板30、放熱部材40、保護部材70を内部に収容している。また、筐体10は、図1及び図3に示すように、LED20に対向する上壁10aに、LED20から射出された光を取り出す光取出し窓W1が形成されている。ここでは、光取出し窓W1に保護ガラス11が設けられているが、拡散板や透光板、レンズが設けられていても良い。   The housing 10 is made of metal, for example, and accommodates the LED 20, the substrate 30, the heat dissipation member 40, and the protection member 70 therein. Further, as shown in FIGS. 1 and 3, the housing 10 has a light extraction window W1 for extracting light emitted from the LED 20 in the upper wall 10 a facing the LED 20. Here, the protective glass 11 is provided in the light extraction window W1, but a diffusion plate, a light transmission plate, or a lens may be provided.

LED20は、基板30上に列状に等間隔に配置されており、ここでは筐体10の長手方向に沿って配置されている。本実施形態では、LED20としてチップ型のものを用いているが、砲弾型のものを用いても良く、その構造は何ら限定されるものではない。また、LED20から射出される光は、可視光(例えば白色)の他、紫外光や赤外光など何ら限定されるものではない。また、LED20に代えて、レーザ光を射出する発光素子などを適宜選択することもできる。   The LEDs 20 are arranged at equal intervals in a row on the substrate 30, and are arranged along the longitudinal direction of the housing 10 here. In this embodiment, although a chip type LED is used as the LED 20, a shell type LED may be used, and the structure is not limited at all. Further, the light emitted from the LED 20 is not limited to visible light (for example, white), ultraviolet light, infrared light, or the like. Moreover, it can replace with LED20 and can also select the light emitting element etc. which inject | emit a laser beam suitably.

基板30は、図2に示すように、矩形状且つ長尺状に形成されており、その表面の幅方向中央部には、LED20が搭載されるLED搭載領域31が、長手方向に沿って設定されている。なお、LED搭載領域31及びこれに搭載されたLED20は筐体10内の空気に晒されている。   As shown in FIG. 2, the substrate 30 is formed in a rectangular shape and a long shape, and the LED mounting area 31 on which the LED 20 is mounted is set along the longitudinal direction at the center in the width direction of the surface thereof. It is done. The LED mounting area 31 and the LEDs 20 mounted thereon are exposed to the air in the housing 10.

メイン放熱部材40は、LED20や基板30を冷却するためのものである。図1及び図2に示すように、メイン放熱部材40は、複数の放熱板41(以下、メイン放熱板41という)と、これらのメイン放熱板41を支持するベース42(以下、メインベース42という)とを有するヒートシンクである。   The main heat radiating member 40 is for cooling the LED 20 and the substrate 30. As shown in FIGS. 1 and 2, the main heat dissipation member 40 includes a plurality of heat dissipation plates 41 (hereinafter, referred to as main heat dissipation plates 41) and a base 42 for supporting the main heat dissipation plates 41 (hereinafter, referred to as a main base 42). And the like).

メイン放熱板41は、図2に示すように、LED20の配列方向に垂直(メインベース42の長手方向に平行)に設けられており、互いに隣り合うメイン放熱板41同士が間隔をあけて対面するようにLED20の配列方向(メインベース42の幅方向)に複数列で配置されている。   As shown in FIG. 2, the main heat sinks 41 are provided perpendicular to the arrangement direction of the LEDs 20 (parallel to the longitudinal direction of the main base 42), and the main heat sinks 41 adjacent to each other face each other at an interval. As described above, the LEDs 20 are arranged in a plurality of rows in the arrangement direction (the width direction of the main base 42).

メインベース42は、矩形平板状に形成され、長手方向がLED20の配列方向と垂直、幅方向がLED20の配列方向と平行に設けられており、図3に示すように、メイン放熱板41を支持する支持面421と、支持面421の反対側の基板載置面422とを有し、基板載置面422の長手方向中央に基板30が載置されている。   The main base 42 is formed in a rectangular flat plate shape, the longitudinal direction is perpendicular to the arrangement direction of the LEDs 20, the width direction is provided parallel to the arrangement direction of the LEDs 20, and as shown in FIG. The substrate 30 is mounted on the center of the substrate mounting surface 422 in the longitudinal direction.

そして、複数のメイン放熱部材40がメインベース42の幅方向(筐体10の長手方向)に沿って配置され、これらLED20、基板30、放熱部材40により光射出ユニットが構成される。これにより、当該ユニットを適宜連結することで、ライン光の長さを調整することができる。   A plurality of main heat dissipating members 40 are disposed along the width direction of the main base 42 (longitudinal direction of the housing 10), and the light emitting unit is configured by the LEDs 20, the substrate 30, and the heat dissipating members 40. Thereby, the length of line light can be adjusted by connecting the said units suitably.

ファン50は、各メイン放熱部材40のメイン放熱板41にそれぞれ対応してメインベース42とは反対側に設けられており、筐体10の下壁10bに取り付けられる。なお、筐体10の下壁10bには開口が形成されており、この開口を介してファン50からの空気がメイン放熱板41の間に送り込まれる。   The fans 50 are provided on the opposite side of the main base 42 to correspond to the main heat dissipation plates 41 of the respective main heat dissipation members 40, and are attached to the lower wall 10 b of the housing 10. An opening is formed in the lower wall 10 b of the housing 10, and air from the fan 50 is fed into the space between the main heat dissipation plates 41 through the opening.

然して、本実施形態のライン光射出装置100には、図2及び図3に示すように、メインベース42に表裏に貫通する複数の貫通孔Hが形成されるとともに、メインベース42よりも光射出側に、空気を、LED搭載領域31を通過させないように、貫通孔Hとライン光射出装置100の外部との間で流通させる流通路Lが形成されている。   Therefore, as shown in FIGS. 2 and 3, in the line light emitting device 100 of the present embodiment, a plurality of through holes H penetrating to the front and back are formed in the main base 42, and light is emitted from the main base 42. On the side, a flow passage L is formed which allows air to flow between the through hole H and the outside of the line light emitting device 100 so as not to pass the LED mounting area 31.

より具体的に説明すると、複数の貫通孔Hは、メインベース42の長手方向においてLED20の近傍且つ両外側に、LED20の配列方向に沿って例えば等間隔で形成されている。なお、貫通孔Hは、メインベース42の支持面421及び基板載置面422に対して垂直に形成されており、基板30の縁に近接配置された例えば断面円形状のものである。   More specifically, the plurality of through holes H are formed, for example, at equal intervals along the arrangement direction of the LEDs 20 in the vicinity of and on both sides of the LEDs 20 in the longitudinal direction of the main base 42. The through holes H are formed perpendicularly to the support surface 421 and the substrate mounting surface 422 of the main base 42, and are, for example, circular in cross section disposed close to the edge of the substrate 30.

このようにメインベース42に貫通孔Hを形成することで、ファン50からメイン放熱板41に送り込まれた空気の一部が貫通孔Hを通過して、基板30の表面側にも流れ込む。そして、この空気を筐体10の外部に流出させるべく、図1及び図3に示すように、本実施形態の筐体10の側壁10cには通風窓W2が形成される。これにより、上述した流通路Lは、一端側が貫通孔Hに連通し、他端側が通風窓W2に連通することとなる。   By forming the through holes H in the main base 42 as described above, part of the air sent from the fan 50 to the main heat sink 41 passes through the through holes H and also flows to the surface side of the substrate 30. And in order to make this air flow out of case 10, as shown in Drawing 1 and Drawing 3, ventilation window W2 is formed in side wall 10c of case 10 of this embodiment. As a result, one end of the flow passage L described above communicates with the through hole H, and the other end communicates with the ventilation window W2.

なお、具体的に通風窓W2は、筐体10の側壁のうち長手方向に延びる一対の側壁10cそれぞれに形成される。すなわち、列状に配置されたLED20の両側に貫通孔Hが形成されており、それらの貫通孔Hのさらに外側それぞれに通風窓W2が形成される。
各通風窓W2は、側壁10cの長手方向のほぼ全域に亘って形成されており、上述したメインベース42やメイン放熱板41の一部が通風窓W2に臨むように配置されている。
Specifically, the ventilation window W2 is formed in each of a pair of side walls 10c extending in the longitudinal direction among the side walls of the housing 10. That is, the through holes H are formed on both sides of the LEDs 20 arranged in a row, and the ventilation windows W2 are formed on the outer sides of the through holes H respectively.
Each ventilation window W2 is formed over substantially the entire region in the longitudinal direction of the side wall 10c, and a part of the above-described main base 42 and the main heat dissipation plate 41 is disposed to face the ventilation window W2.

本実施形態では、通風窓W2それぞれに臨むように複数の第2の放熱部材60(以下、サブ放熱部材60という)が設けられている。各サブ放熱部材60は、筐体10に収容されており、複数のサブ放熱板61と、これらのサブ放熱板61を支持するサブベース62とを有するヒートシンクである。   In the present embodiment, a plurality of second heat radiation members 60 (hereinafter, referred to as sub heat radiation members 60) are provided to face each of the ventilation windows W2. Each sub heat dissipation member 60 is a heat sink which is accommodated in the housing 10 and has a plurality of sub heat dissipation plates 61 and a sub base 62 for supporting the sub heat dissipation plates 61.

サブ放熱板61は、LED20の配列方向と垂直(サブベース62の幅方向に平行)に設けられており、互いに隣り合うサブ放熱板61同士が間隔をあけて対面するようにLED20の配列方向(サブベース62の長手方向)に配置されている。なお、互いに隣り合うサブ放熱板61の離間間隔は、互いに隣り合うメイン放熱板41の離間間隔よりも広い。   The sub heat dissipation plate 61 is provided perpendicularly to the arrangement direction of the LEDs 20 (parallel to the width direction of the sub base 62), and the arrangement direction of the LEDs 20 faces each other such that the sub heat dissipation plates 61 adjacent to each other are spaced apart It is arranged in the longitudinal direction of the sub base 62). In addition, the separation distance of the sub heat sinks 61 adjacent to each other is wider than the separation distance of the main heat sinks 41 adjacent to each other.

サブベース62は、矩形平板状に形成され、長手方向がLED20の配列方向と平行に設けられており、メインベース42の長手方向両端部に載置されて、サブ放熱板61を支持する支持面621とは反対側の面がメインベース42の基板載置面422と接触している。本実施形態のサブベース62は、その長手方向の寸法がメインベース42の幅方向の寸法よりも長く、隣り合うメインベース42を一体的に支持して、隣り合うメイン放熱部材40を連結する。なお、サブベース62の長手方向寸法は、メインベース42の幅方向寸法の2倍である。   The sub base 62 is formed in a rectangular flat plate shape, the longitudinal direction of which is provided in parallel with the arrangement direction of the LEDs 20, and is mounted on both longitudinal end portions of the main base 42 to support the sub heat sink 61 The surface opposite to the surface 621 is in contact with the substrate mounting surface 422 of the main base 42. The sub base 62 of this embodiment has a dimension in the longitudinal direction longer than a dimension in the width direction of the main base 42, supports the adjacent main bases 42 integrally, and connects the adjacent main heat radiating members 40. The longitudinal dimension of the sub base 62 is twice the width dimension of the main base 42.

本実施形態のライン光射出装置100は、LED20と貫通孔Hとの間に介在して、空気がLED搭載領域31を通過することを防ぐ保護部材70をさらに具備している。
保護部材70は、例えばLED20から射出された光を反射するものであり、ここではLED20の配列方向に沿って設けられている。この保護部材70は、基板30の幅方向外側に位置しており、メインベース42の基板載置面422から起立して筐体10の上壁10aまで延びている。
本実施形態では、上述した保護部材70が基板30の両側それぞれに設けられる。これにより、筐体10内におけるメインベース42と上壁10aとの間の空間は、一対の保護部材70によって基板30を収容する基板収容空間S1と、上述した流通路Lたる空気流通空間S2とに仕切られる。
The line light emitting device 100 of the present embodiment further includes a protection member 70 interposed between the LED 20 and the through hole H to prevent air from passing through the LED mounting area 31.
The protective member 70 reflects light emitted from, for example, the LEDs 20, and is provided along the arrangement direction of the LEDs 20 here. The protective member 70 is located on the outer side in the width direction of the substrate 30, extends from the substrate mounting surface 422 of the main base 42 to the upper wall 10 a of the housing 10.
In the present embodiment, the protective members 70 described above are provided on both sides of the substrate 30. Thus, the space between the main base 42 and the upper wall 10a in the housing 10 includes the substrate accommodation space S1 for accommodating the substrate 30 by the pair of protection members 70, and the air circulation space S2 which is the flow passage L described above. Divided into

このように構成された本実施形態のライン光射出装置100によれば、メインベース42のLED20の近傍に形成された貫通孔Hに空気が流通するので、メイン放熱板41のLED20の直下部近傍に位置する部分において、風量を増やしたり、空気が滞留するのを防止することができ、放熱効率を向上させることができる。
そのうえ、基板30の両側に保護部材70を設けてあるので、貫通孔Hを通り抜けた空気が、LED搭載領域31を通過することなく、通風窓W2に抜けていくので、基板30上のLED20や配線などにゴミや埃などが付着することを防ぐことができる。
According to the line light emitting device 100 of the present embodiment configured as described above, air flows in the through holes H formed in the vicinity of the LED 20 of the main base 42, so the vicinity of the main heat sink 41 near the portion directly below the LED 20. The air flow rate can be increased and the air can be prevented from staying in the portion located at the point of (4), and the heat radiation efficiency can be improved.
Moreover, since the protection members 70 are provided on both sides of the substrate 30, the air which has passed through the through holes H escapes to the ventilation window W2 without passing through the LED mounting area 31, and the LEDs 20 on the substrate 30 or It is possible to prevent dust and dirt from adhering to wiring and the like.

また、保護部材70がLED20から射出された光を反射するので、LED20から射出された光の取り出し効率を向上させることもできる。   Further, since the protective member 70 reflects the light emitted from the LED 20, the light extraction efficiency of the light emitted from the LED 20 can also be improved.

さらに、複数の貫通孔HがLED20の配列方向に沿ってその両側に列状に設けられているので、LED20の配列方向の様々な箇所において、メイン放熱板41のLED20の直下部近傍における風量をLED20の配列方向の全体に亘って増やしたり、昇温した空気が滞留するのを防止することができる。   Furthermore, since the plurality of through holes H are provided in a row on both sides along the arrangement direction of the LEDs 20, the air flow rate in the vicinity of the portion directly below the LEDs 20 of the main heat sink 41 at various locations in the arrangement direction It is possible to prevent increase in temperature in the arrangement direction of the LEDs 20 and retention of heated air.

さらに、メインベース42に設けたサブ放熱部材60により放熱効率のさらなる向上を図ることができるうえ、サブ放熱板61がLED20の配列方向と垂直に設けられているため、通風窓W2に向かう空気流を阻害することもない。   Furthermore, the radiation efficiency can be further improved by the sub radiation member 60 provided on the main base 42, and the sub radiation plate 61 is provided perpendicular to the arrangement direction of the LEDs 20, so the air flow toward the ventilation window W2 It does not inhibit

加えて、LED20、基板30、放熱部材40をユニット化しているので、不具合の生じた部分の交換等が容易である。そのうえ、サブ放熱部材60によってこれらのユニットを連結しているので、専用の連結具を不要にすることができる。   In addition, since the LED 20, the substrate 30, and the heat dissipation member 40 are unitized, it is easy to replace the defective portion. Moreover, since these units are connected by the sub heat dissipating member 60, a dedicated connector can be eliminated.

なお、本発明は前記実施形態に限られるものではない。   The present invention is not limited to the above embodiment.

例えば、通風窓W2は筐体10の長手方向に沿って延びる側壁10cの一方にのみ形成されていても良い。さらに、長手方向に沿って延びる側壁10cには通風窓W2を形成することなく、長手方向と直交する側壁に通風窓W2を形成しても良い。   For example, the ventilation window W2 may be formed only on one side wall 10c extending along the longitudinal direction of the housing 10. Furthermore, the ventilation window W2 may be formed on the side wall perpendicular to the longitudinal direction without forming the ventilation window W2 on the side wall 10c extending along the longitudinal direction.

また、貫通孔Hを流通する空気が、LED搭載領域31を通過し難く、そのほとんどが通風窓W2に向かうような位置に通風窓W2が形成されている場合は、保護部材70は必ずしも設ける必要はない。具体的には、前記実施形態のようにLED20を挟む位置の両方に貫通孔Hを設けて、そのさらに外側それぞれに通風窓W2を形成する場合や、LED20を挟む位置の一方に貫通孔Hを設けて、そのさらに外側に通風窓W2を形成する場合などが挙げられる。   In the case where the air flowing through the through hole H does not easily pass through the LED mounting area 31 and the ventilation window W2 is formed at a position where most of the air is directed to the ventilation window W2, the protective member 70 needs to be necessarily provided. There is no. Specifically, the through holes H are provided at both of the positions sandwiching the LED 20 as in the above embodiment, and the ventilation windows W2 are formed further on the outer side respectively, or the through holes H are formed at one of the positions sandwiching the LED 20 It is provided, and the case where ventilation window W2 is formed in the further outside etc. is mentioned.

さらに、前記実施形態では通風窓W2が筐体10の側壁10cに形成されていたが、例えば筐体10の上壁10aにおけるLED搭載領域31の上方を除く箇所に通風窓W2が形成されていても良い。   Furthermore, although the ventilation window W2 is formed in the side wall 10c of the housing 10 in the above embodiment, for example, the ventilation window W2 is formed in the upper wall 10a of the housing 10 except the upper part of the LED mounting area 31 Also good.

貫通孔Hは、メインベース42における列状に配置されたLED20を挟む位置の一方にのみ形成されていても良いし、LED20を挟む位置の一方又は両方において複数列形成されていても良いし、LED20を挟む位置の一方又は両方において1つだけ形成されていても良い。
また、貫通孔Hの形状は、断面円形状に限らず、断面が多角形状や長穴形状のものであっても良い。
The through holes H may be formed in only one of the positions sandwiching the LEDs 20 arranged in a row in the main base 42, or a plurality of lines may be formed in one or both of the positions sandwiching the LEDs 20, Only one may be formed at one or both of the positions sandwiching the LED 20.
Further, the shape of the through hole H is not limited to the circular cross section, and the cross section may be polygonal or long hole.

さらに、前記実施形態の貫通孔Hは、メインベース42の支持面421や基板載置面422に対して垂直に貫通して形成されていたが、メインベース42の支持面421や基板載置面422に対して斜めに貫通させても良い。具体的には、図4に示すように、メインベース42の支持面421における長手方向中央部と、基板載置面422における基板30よりも長手方向外側とを貫通させた構成が挙げられる。このような構成であれば、LED20の直下に貫通孔Hの一端開口を形成することができるので、LED20の直下の風量を増やすことができる。そのうえ、貫通孔Hを斜め方向に形成することで、貫通孔Hの内周面の表面積を増やすことができ、放熱性のさらなる向上を図れる。   Furthermore, although the through holes H of the embodiment are formed to penetrate perpendicularly to the support surface 421 of the main base 42 and the substrate mounting surface 422, the support surface 421 of the main base 42 and the substrate mounting surface are also formed. You may make it penetrate with respect to 422 diagonally. Specifically, as shown in FIG. 4, there is a configuration in which the longitudinal central portion of the support surface 421 of the main base 42 and the longitudinal outer side of the substrate 30 on the substrate mounting surface 422 are penetrated. With such a configuration, since one end opening of the through hole H can be formed immediately below the LED 20, the air volume immediately below the LED 20 can be increased. Moreover, by forming the through holes H in the oblique direction, the surface area of the inner peripheral surface of the through holes H can be increased, and the heat dissipation can be further improved.

保護部材70は、前記実施形態ではメインベース42に設けられていたが、基板30の例えば幅方向端部に設けられていても良い。また、保護部材70は、必ずしもミラーである必要はなく、材質や形状等は適宜変更して構わない。   The protective member 70 is provided on the main base 42 in the above embodiment, but may be provided on, for example, the end in the width direction of the substrate 30. Further, the protective member 70 does not necessarily have to be a mirror, and the material, shape, etc. may be changed as appropriate.

貫通孔HをLED20に近づけるべく、基板30に貫通孔を空けても構わない。この場合、基板30の貫通孔とメインベース42の貫通孔Hとの少なくとも一部が重なり合っていれば良い。   In order to make the through holes H close to the LEDs 20, the through holes may be formed in the substrate 30. In this case, at least a part of the through hole of the substrate 30 and the through hole H of the main base 42 may be overlapped with each other.

ファン50は、前記実施形態では放熱部材に空気を送り込むものであったが、放熱部材側から空気を吸引して外部に吐き出すものであっても良い。つまり、空気の流れは、前記実施形態のように貫通孔Hから通風窓W2に流れ込んでも良いし、逆に通風窓W2から貫通孔Hに流れ込んでも良い。   Although the fan 50 sends air to the heat radiating member in the above embodiment, it may suck the air from the heat radiating member side and discharge it to the outside. That is, the flow of air may flow into the ventilation window W2 from the through hole H as in the above embodiment, or may flow into the through hole H from the ventilation window W2.

前記実施形態では複数のLED20が直線状に配置されていたが、複数のLED20を円周状や矩形状に配置しても良い。
また、LED20は、必ずしも基板30に搭載されている必要はなく、メイン放熱部材40のメインベース42に直接搭載されていても良い。この場合、LED搭載領域31は、メインベース42上に形成されることになる。
Although the plurality of LEDs 20 are linearly arranged in the embodiment, the plurality of LEDs 20 may be arranged circumferentially or rectangularly.
Further, the LEDs 20 do not necessarily have to be mounted on the substrate 30, and may be mounted directly on the main base 42 of the main heat dissipating member 40. In this case, the LED mounting area 31 is formed on the main base 42.

さらに、ライン光射出装置100としては筐体10を備えていないものであっても良い。こうしたライン光射出装置100においては、別の機器に取り付けられることにより、メインベース42よりも光射出側に、空気を、LED搭載領域31を通過させないように、貫通孔Hと外部との間で流通させる流通路Lが形成されれば良い。   Furthermore, the line light emitting device 100 may not have the housing 10. In such a line light emitting device 100, by being attached to another device, between the through hole H and the outside so that air does not pass through the LED mounting area 31 to the light emitting side than the main base 42. It is only necessary to form a flow passage L to be circulated.

また、メイン放熱部材40やサブ放熱部材60の構造として、メイン放熱板41やサブ放熱板61の態様は、ピン状の放熱フィンや網状の放熱体に変更しても良い。   Further, as the structures of the main heat dissipation member 40 and the sub heat dissipation member 60, the aspect of the main heat dissipation plate 41 and the sub heat dissipation plate 61 may be changed to pin-shaped heat dissipation fins or a mesh shaped heat dissipation body.

その他、本願発明は前記実施形態に限られず、その趣旨を逸脱しない範囲で種々の変形が可能である。   In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

100・・・ライン光射出装置
10 ・・・筐体
20 ・・・LED(発光素子)
30 ・・・基板
31 ・・・LED搭載領域
40 ・・・メイン放熱部材
50 ・・・ファン
H ・・・貫通孔
60 ・・・サブ放熱部材
W2 ・・・通風窓
100 ... line light emitting device 10 ... housing 20 ... LED (light emitting element)
30 ... substrate 31 ... LED mounting area 40 ... main heat dissipation member 50 ... fan H ... through hole 60 ... sub heat dissipation member W 2 ... ventilation window

Claims (7)

複数の発光素子と、
表面に前記複数の発光素子が列状に搭載されたベース及び前記ベースの裏面に設けられた複数の放熱体を有する放熱部材と、
前記複数の放熱体の間に空気を流通させるファンとを具備する光射出装置であって、
前記ベースには、列状に配置された前記発光素子を挟む位置の一方又は両方に、表裏に貫通する貫通孔が形成されており、
前記ベースよりも光射出側には、前記空気を、前記発光素子が搭載された領域を通過させないように、前記貫通孔と当該光射出装置の外部との間で流通させる流通路が形成されている光射出装置。
Multiple light emitting elements,
A heat dissipating member having a base on the surface of which the plurality of light emitting elements are mounted in a row and a plurality of heat dissipating members provided on the back surface of the base;
A light emitting device comprising: a fan for circulating air between the plurality of heat dissipating members;
In the base, through holes penetrating from the front to the back are formed at one or both of positions sandwiching the light emitting elements arranged in a row,
A flow passage is formed on the light emission side with respect to the base so as to flow the air between the through hole and the outside of the light emission device so as not to pass the region where the light emitting element is mounted. Light emitting device.
前記複数の発光素子と前記貫通孔との間に介在して、前記空気が前記発光素子搭載領域を通過することを防ぐ保護部材をさらに具備している請求項1記載の光射出装置。   The light emitting device according to claim 1, further comprising a protection member interposed between the plurality of light emitting elements and the through hole to prevent the air from passing through the light emitting element mounting region. 前記保護部材が、前記発光素子から射出された光を反射するものである請求項2記載の光射出装置。   The light emitting device according to claim 2, wherein the protective member reflects light emitted from the light emitting element. 前記発光素子を挟む位置の一方又は両方に設けられた前記貫通孔のさらに外側の前記ベースの表面に、第2の放熱部材が設けられている請求項1乃至3のうち何れか一項に記載の光射出装置。   The 2nd heat radiating member is provided in the surface of the said base of the further outer side of the said through-hole provided in one or both of the position which pinches | interposes the said light emitting element in any one of the Claims 1 thru | or 3 Light emitting device. 前記複数の発光素子及び前記放熱部材により光射出ユニットが構成されるとともに、当該ユニットの複数が前記発光素子の配列方向に沿って配置されており、
前記第2の放熱部材が、前記光射出ユニットを連結する請求項4記載の光射出装置。
A light emitting unit is configured by the plurality of light emitting elements and the heat dissipation member, and a plurality of the units are arranged along the arrangement direction of the light emitting elements,
The light emitting device according to claim 4, wherein the second heat radiation member connects the light emitting unit.
前記ベースを収容するとともに、側壁に前記空気が流通する通風窓が形成された筐体をさらに具備し、
前記流通路が、前記通風窓により当該光射出装置の外部に連通している請求項1乃至5のうち何れか一項に記載の光射出装置。
The housing further includes a housing that accommodates the base and in the side wall is formed a ventilation window through which the air flows.
The light emitting device according to any one of claims 1 to 5, wherein the flow passage is in communication with the outside of the light emitting device by the ventilation window.
前記発光素子の両側に、複数の前記貫通孔が前記発光素子の配列方向に沿って設けられ、
前記通風窓が前記筐体の両側壁に形成されている請求項6記載の光射出装置。
A plurality of the through holes are provided on both sides of the light emitting element along the arrangement direction of the light emitting element,
The light emitting device according to claim 6, wherein the ventilation windows are formed on both side walls of the housing.
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JP2021154535A (en) * 2020-03-25 2021-10-07 富士フイルムビジネスイノベーション株式会社 Light-emitting device and drawing device
JP7435127B2 (en) 2020-03-25 2024-02-21 富士フイルムビジネスイノベーション株式会社 Light emitting device and drawing device
US11947276B2 (en) 2020-03-25 2024-04-02 Fujifilm Business Innovation Corp. Light emitting device and image forming apparatus

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