JP5479712B2 - Ceiling radiant panel with ceiling lighting function - Google Patents

Description

The present invention, office, a radiation panel that is installed in the ceiling in order to perform the cooling and heating in a room, such as lobby or holes, in particular, to a ceiling radiant panel having a function of ceiling lights .

Recently, as described in Patent Documents 1, 2, and 3 as the prior art for indoor air conditioning, the indoor ceiling is made of a flat plate made of a good heat conductive material such as aluminum. A radiating panel is provided, and the radiating panel is cooled or heated by a heat medium flowing in a pipe provided on the upper surface of the radiating panel.
Japanese Patent Laid-Open No. 07-019533 Japanese Patent Laid-Open No. 09-184642 JP 2006-170551 A JP 2003-092009 A

However, the lower surface of the radiating panel in the prior art, only a mere flat plane, the contact area with air in the room, that is because the radiation area can not exceed the area under surface thereof, it is achieved in heating and cooling effect It was insufficient.

  Moreover, since the radiating panel is flat, there is a problem that not only the design effect on the ceiling is low, but also the warp deformation of the radiating panel is large.

Also, when the lighting apparatus is installed in the ceiling of the chamber, the radiation area of the lower surface of the radiating panel will be reduced by the amount of the lighting device.

On the other hand, Patent Document 4 as another prior art, a light emitting diode and a plurality of using the (LED) and a surface illuminating device is disclosed, by placing the surface lighting device on the ceiling, at the light emitting diode Can be ceiling lighting.

Further, the surface lighting device in the Patent Document 4, while mounted side by side on the surface of the flat plate a plurality of light-emitting diodes in the matrix, by which a configuration of providing a passage for cooling water to the back surface of the flat plate , Each of the light emitting diodes can be constantly cooled.

However, when a large number of light emitting diodes are provided on the lower surface of the flat plate for ceiling lighting, when a person looks up at the ceiling, all the light emitting diodes are emitted with strong directivity. The light will enter the field of view at the same time with this strong directivity. As a whole, it will be in the state of extremely dazzling point light emission, and ceiling lighting with soft surface light emission will be required. I couldn't.

The present invention, while eliminating the problem of ceiling radiant panel of the prior art has, it is an technical problem of imparting functions of ceiling lighting thereto.

In order to achieve this technical problem, claim 1 is provided with a pipe through which a heat medium flows on the upper surface of the panel body, and a plurality of heat radiation fins extending parallel or substantially parallel to each other on the lower surface of the panel body. Is a metal radiating panel that protrudes downward, and is a portion between any adjacent heat radiating fins of the panel main body, or a side surface of any heat radiating fin , or an upper surface of a lip provided on the heat radiating fin. In addition, a plurality of light emitting diodes are arranged along the longitudinal direction of the heat dissipating fins, and the light emitting diodes are turned on by grounding a direct current supplied from a power line to the radiating panel. ing.

According to a second aspect of the present invention , in the first aspect of the present invention, at least a heat dissipating fin adjacent to the light emitting diode is provided with a laterally protruding lip extending in the longitudinal direction of the heat dissipating fin. .

Claim 3 is, before Symbol of claims 1 or 2, it is attached in front Symbol emitting diode before Symbol radiation panel.

Claim 4 is, before Symbol of claims 1 or 2, in any portion between the radiating fins of the lower surface of the panel body portion, provided so as recessed groove extending in the longitudinal direction of the heat radiating fins is, the light emitting diode is mounted in front Symbol recessed groove.

Claim 5 is the prior SL according to claim 2, wherein the light emitting diode that is attached to the upper surface of the front Symbol lip.

Claim 6 is the front Symbol of claims 1, wherein the radiation fins are inclined with respect to the lower surface of the plate-shaped section a and the panel body, the panel and the angled heat dissipating fin It is arranged before Symbol emitting diode surrounded portion by the main body portion.

Claim 7 is the prior SL according to claim 6, wherein the inclined radiating fins, lip projecting sideways are provided.

Claim 8 is the front Symbol of claims 6 or 7, wherein the light emitting diode, that are attached to the upper surface of the panel body before or Kiho heat fins or lips.

According to claim 1, by providing a plurality of heat dissipating fins integrally on the lower surface of the panel body , the contact area with the air in the room, that is, the radiation area can be greatly increased. Moreover, by providing a plurality of heat dissipating fins integrally, warpage deformation of the radiation panel can be reduced, and the heat dissipating fins have a horizontal stripe pattern or a vertical stripe pattern. The design effect in can be improved.

  The plurality of light emitting diodes disposed between the heat dissipating fins perform ceiling illumination.

  In this case, since the light emitting diode is disposed in the portion between the heat radiating fins, when the ceiling formed by the radiation panel is looked up from a direction perpendicular to the heat radiating fins, In the area of the ceiling excluding the point just above the viewpoint, the light emitting diode is covered with the heat-dissipating fins with respect to the viewpoint, and strong directivity from the covered light emitting diode is obtained. The light that it has does not enter the field of view directly, but is reflected downward on the surfaces of the radiation panel and the heat radiation fins to illuminate the interior of the room.

  As a result, in the area of the ceiling excluding the point just above the viewpoint, the light emitted from the light emitting diodes with a strong directivity can be used for the heat radiation without reducing the cooling / heating effect of the radiation panel and the heat radiation fin. Since fins can be used to achieve a soft surface emission state, the radiant panel can be given a function of ceiling illumination by a surface.

  And, as described in claim 2, at least the heat dissipating fin adjacent to the light emitting diode among the heat dissipating fins is provided with a lip projecting sideways so that the contact area with the air in the room, that is, the radiation area. Can be increased without increasing the height of the heat dissipating fins or increasing the number of heat dissipating fins per unit area, and more lip diodes can be added to the lip. Since it can be covered, when the ceiling is looked up, the area where the light-emitting diode is covered, that is, the area where the surface is illuminated by the ceiling can be further expanded.

Further, the light-emitting diodes, as described in claim 3, by attaching taken on the radiation panel, can hand absorbed panel radiate heat generated in the light-emitting diode, the light emitting diode, the temperature Therefore, the light emitting diode can be kept at a high output and its durability can be improved.

  In particular, with the configuration described in claim 4, the area of contact with the air in the room, that is, the radiation area, can be expanded by the recessed groove, and the region, that is, the surface in which the light emitting diode is covered. The area where the ceiling illumination is caused can be further expanded by the recessed groove, and the inner surface of the recessed groove can be a reflecting surface that disperses point-emitting light over a wide range.

  According to the configuration described in claim 5, the light emitting diode can be cooled, but the light emitting diode is covered with a lip when the ceiling is viewed from a direction perpendicular to the heat dissipating fin. It can be concealed and can be concealed by a lip even when viewed from a direction parallel to the heat dissipating fin, so that ceiling illumination by a surface can be reliably achieved over a wide range.

  Next, by adopting the configuration described in claim 6, as in the case of claim 5, the light-emitting diode can be mounted from the direction perpendicular to the heat-dissipation fin by simply inclining the heat-dissipation fin. Since it can be covered when viewed up, it can also be covered up when viewed from a direction parallel to the heat-dissipating fin, so that ceiling illumination by a surface can be reliably achieved over a wide range.

  Even in this case, by adopting the configuration described in claim 7, it is possible to further increase the area of the ceiling where the light emitting diode is covered with the heat-radiating fin.

Further, by the configuration in which the electronic apparatus according to claim 8, the heat generated in the light-emitting diode, the panel can be absorbed by the body part or the radiation fins or lips, the light emitting diode, the temperature of the panel body or Since it can be cooled to a temperature close to that of the heat dissipating fin or lip, the light emitting diode can be maintained at a high output and its durability can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 is a perspective view of the interior of the room as viewed from the back, FIG. 2 shows the interior of the room as viewed from below, and FIG. 3 is a view taken along line III-III in FIG. The enlarged cross-sectional view shows the first embodiment.

In these figures, reference numeral 1 denotes a building such as a bi Rudingu, the ceiling in a room 2 of office and the like in the building 1, the ceiling unit 3 is provided.

  As shown in FIG. 3, the ceiling unit 3 is configured by horizontally arranging a plurality of radiation panels 4.

  This radiant panel 4 has a long shape in which the length L is significantly longer than the width W, and is manufactured by extruding a metal having excellent heat transfer properties, for example, aluminum. An opening groove 5 is provided at one end edge in the longitudinal direction, and a fitting piece 6 is provided at the other end edge so as to extend in the longitudinal direction.

By arranging a plurality of the radiating panels 4 side by side so that the fitting pieces 6 at the other end edge of the other radiating panel 4 are fitted in the opening groove 5 at one end edge of the adjacent one radiating panel 4. The ceiling unit 3 is configured.

  The radiating panels 4 in the ceiling unit 3 are connected to each other by cross beam members 7 arranged so as to extend laterally on the upper surfaces at both ends, and supported by the building 1 via the cross beam members 7. Yes.

  That is, as shown in FIGS. 3, 4 and 5, each radiating panel 4 has a bottom surface of each cross beam member 7 between a pair of hook-shaped claw pieces 8a, 8b integrally provided on each top surface. By inserting and engaging the hook-shaped projecting piece 9 projecting downward from the horizontal beam member 7, the horizontal beam member 7 is detachably attached to the horizontal beam member 7 so as to be suspended from the lower surface thereof. Is attached to the building 1.

Further, a pair of pipe receiving portions 10 are provided on the upper surface of each radiating panel 4 so as to extend in the longitudinal direction, and pipes 11 are fitted and attached to the pipe receiving portions 10. As shown in FIG. 2, the pipes 11 attached to each pipe receiving part 10 in FIG. 4 are connected in a zigzag manner , and a predetermined temperature (eg, 23 by flowing a heat medium such as water which is held in ° C.), by maintaining the temperature of the said surface of the radiating panel 4 constitute the chamber 2 to the cold tufts or heating.

  As shown in FIGS. 3, 4 and 5, the pipe 11 on the upper surface of each radiation panel 4 is a presser interposed between the pie receiving portion 10 into which the pipe 11 is fitted and the cross beam member 7. The member 12 is fixed in a state of being fitted into the pie receiving portion 10.

Each of the radiating panels 4 is provided with a flat plate-like panel main body , and a plurality of heat radiation fins 13 configured to protrude downward are provided on the lower surface of the panel main body . They are integrally provided at appropriate intervals P along the width direction.

The heat dissipating fins 13 are parallel or substantially parallel to each other and extend in the longitudinal direction of the radiating panel 4. In the first embodiment, as shown in FIGS. 3, 4, and 5, It is configured to have a plate-like cross-sectional shape that is perpendicular to or substantially perpendicular to the lower surface of the panel body (substantially perpendicular).

  On the other hand, in the second embodiment, as shown in FIG. 7, each of the heat dissipating fins is configured as a heat dissipating fin 13 'having a semicircular cross-sectional shape.

  Needless to say, the second embodiment has the same configuration as that of the first embodiment except that the heat dissipating fin 13 'has a semicircular cross-sectional shape.

As described above, the plurality of heat dissipating fins 13 and 13 'protruding downward are integrally provided on the lower surface of the panel main body portion of each radiation panel 4 constituting the ceiling unit 3 so as to extend in the longitudinal direction. As a result, the contact area with the air in the room 2, that is, the radiation area can be greatly increased, so that the effect of cooling and heating can be achieved with certainty, and a plurality of heat radiation fins 13 and 13 'are provided integrally. Thus, warpage deformation in the radiating panel 4 can be reduced, and the fins 13 and 13 'for heat radiation have a horizontal stripe pattern or a vertical stripe pattern, so that the design effect of the ceiling can be improved.

  A portion between any of the heat dissipation fins 13, 13 ′, for example, a portion between a pair of heat dissipation fins 13, 13 ′ of one radiating panel 4 is shown in FIGS. As shown, a plurality of light emitting diodes 14 are disposed at an appropriate pitch S along the longitudinal direction of the heat dissipating fins 13, 13 ′.

  As shown in FIG. 6, each of the light emitting diodes 14 is packaged (sealed) with a light emitting diode chip 14c on a substrate (heat sink) 14a made of a metal material having excellent thermal conductivity such as copper. The light emitting portion 14b made of the light transmissive synthetic resin 14d is provided. Specifically, as shown in FIG. 6, the substrate (heat sink) 14a is in close contact with the lower surface of the radiation panel 4. Alternatively, as in the third embodiment shown in FIG. 8, the substrate (heat sink) 14a is attached in close contact with the side surface of the heat radiation fin 13.

Further, as shown in FIG. 9, each of the light emitting diodes 14 is connected in parallel between one electrical wiring 16 a and the radiating panel 4 serving as a ground wire with respect to a DC power source 16 . That is, the light emitting diode 14 is turned on (emits light) when a direct current flows through the radiation panel 4.

  The light emitting diodes 14 have a staggered arrangement as shown in FIG.

  The plurality of light emitting diodes 14 disposed in the portion between the heat dissipating fins 13 and 13 'constitute ceiling lighting.

  In this case, when the ceiling by the ceiling unit 3 is looked up from the direction perpendicular to the radiation fins 13 and 13 'in each of the radiation panels 4, as indicated by an arrow A in FIG. In the region except just above, the light emitting diode 14 is covered with the heat radiation fins 13 and 13 ′ with respect to the viewpoint, and has strong directivity from the covered light emitting diode 14. The light is reflected directly downward on the surfaces of the radiation panel 4 and the heat dissipating fins 13 and 13 'without directly entering the field of view, and illuminates the room.

Thus, in the region excluding the substantially directly above the viewpoint of the ceiling, the light emitted by the strong directivity from the light emitting diode 14, Ru reduces the heating and cooling effect by the panel body and the radiation fins 13, 13 ' Without any problem, the heat radiation fins 13 and 13 'can be used to achieve a soft surface emission state.

In addition, the light emitting diode 14 is attached to the lower surface of the panel main body portion of the radiation panel 4 so that the substrate (heat sink) 14a of the light emitting diode 14 is in close contact, or the side surface of the heat dissipating fin 13 is Since the light-emitting diode 14 is mounted so that the substrate (heat sink) 14a is in close contact with it, the heat generated by the light-emitting diode 14 is absorbed by the panel body of the radiation panel 4 or the heat radiation fins 13 and 13 '. Therefore, the light emitting diode 14 can be cooled so that the temperature thereof is close to the panel main body or the heat radiation fins 13 and 13 '.

  In this case, it is preferable that the light emitting diode 14 is attached to a portion of the upper surface of the radiating panel 4 as close as possible to the pipe receiving portion 10 in terms of promoting the cooling.

When the light emitting diode 14 is attached to the panel body of the radiating panel 4 , a through hole 17 is formed in the panel body of the radiating panel 4, as in the fourth embodiment shown in FIG. The light-emitting diode 14 can be mounted such that its substrate (heat sink) 14a is in close contact with the upper surface of the panel body portion of the radiation panel 4 and its light-emitting portion 14b is fitted in the through-hole 17. .

  According to this configuration, it is possible to further approximate surface emission while cooling the light emitting diode 14.

  Next, FIGS. 11 and 12 show a fifth embodiment.

In the fifth embodiment, a concave groove 18 is provided in a portion of the panel body portion of the radiating panel 4 between any heat radiation fins so as to extend in the longitudinal direction of the heat radiation fin 13. The light-emitting diode 14 is mounted in the housing 18 so that the substrate (heat sink) 14a is in close contact with the bottom surface of the recessed groove 18 (see FIG. 11).

  According to this configuration, the area of contact with the air in the room, that is, the radiation area can be expanded by the recessed groove 18 and the light emitting diode 14 is covered with the area, that is, the surface is in a ceiling illumination state. The area can be further expanded, and the inner surface of the recessed groove 18 can be a reflecting surface that disperses point-emitting light over a wide range.

In the fifth embodiment, similarly to the fourth embodiment shown in FIG. 10, as shown in FIG. 12, a through-hole 19 is formed in the bottom of the recessed groove 18, and the the light emitting diodes 14, closely the substrate (heat sink) 14a is the upper surface of the panel body, Ru can be the light emitting unit 14b is a structure of attaching so as to fit within the through hole 19.

  When the heat dissipating fin 13 has a plate-like cross-sectional shape as shown in FIGS. 3 to 6, 8, 10, 11, and 12, the lower end of the fin 13 is horizontally oriented. The projecting lip 15 is provided by being attached so as to extend in the longitudinal direction of the heat dissipating fins 13 or integrally provided.

  With this configuration, the contact area with the air in the room 2, that is, the radiation area can be increased by the lip 15, and more light-emitting diodes 14 can be covered by the lip 15. Therefore, when the ceiling is looked up, the area where the light-emitting diode 14 is covered, that is, the area where the surface is illuminated by the ceiling can be expanded more extensively by the lip 15. .

Moreover, by providing the lip 15, it is possible to prevent the deformation of the heat radiation fin 13.

  Note that the heat dissipating fin 13 having the plate-like cross-sectional shape is not limited to the reverse T-shape provided integrally with the lip 15 projecting left and right laterally at the lower end, but is shown in FIG. 13 described below. Thus, it can be configured in an L shape.

  Further, the lip 15 is not limited to be provided on all the heat radiation fins 13, but is provided on at least one of the heat radiation fins 13 adjacent to the left and right sides or one side of the light emitting diode 14. By doing so, the above-described effects can be obtained.

  Next, FIG. 13 shows a sixth embodiment.

  In the sixth embodiment, when the fin 13 for heat dissipation has a plate-like cross-sectional shape and a lip 15 is provided at the lower end, the light-emitting diode 14 is placed on the upper surface of the lip 15 and the light-emitting diode 14 The substrate (heat sink) 14a is attached so as to be in close contact with each other, and other configurations are the same as those in the first and third embodiments.

  According to this configuration, while the light emitting diode 14 can be cooled, the light emitting diode 14 is viewed from a direction perpendicular to the heat dissipating fins 13 as indicated by an arrow A in FIG. 2 can be covered with the lip 15 and can also be covered with the lip 15 when the ceiling is viewed from a direction parallel to the heat dissipating fins 13 as indicated by an arrow B in FIG. Therefore, the ceiling lighting by the surface can be reliably achieved over a wider range.

  14 and 15 show a seventh embodiment.

In the seventh embodiment, when the heat dissipating fins 13 ″ having a plate-like cross-sectional shape are integrally provided on the lower surface of the radiation panel 4 having the above-described configuration, the heat dissipating fins 13 ″ are provided on the lower surface of the panel body. appropriate angle by inclining the theta, to the portion surrounded by between the panel body portion the tilted radiation fins 13 ", which has a configuration that provided the light emitting diodes 14, other configurations for Is the same as in the first embodiment.

  According to the seventh embodiment, the light emitting diode 14 can be covered when the ceiling is viewed from a direction perpendicular to the heat dissipating fin 13 ″ as indicated by an arrow A in FIG. 2 can be concealed even when viewed from a direction parallel to the heat dissipating fin 13 ″ as indicated by an arrow B in FIG.

In the seventh embodiment, specifically, as shown in FIG. 11, the substrate (heat sink) 14a of the light emitting diode 14 is in close contact with the lower surface of the panel main body. Alternatively, as shown in FIG. 12, the substrate (heat sink) 14a of the light emitting diode 14a is attached in close contact with the upper surface of the inclined heat radiation fin 13 ″. The light emitting diode 14 can be reliably cooled so that the temperature thereof becomes the temperature of the radiation panel 4 or the heat radiation fin 13 ″.

  Also in the seventh embodiment, as in each of the embodiments described above, among the inclined heat radiation fins 13 ″, the heat radiation fins 13 connected to at least the left and right sides or one side of the light emitting diodes 14 ”. In addition, the lip 15 'is integrally provided, and this can promote the above-described effects.

It is a perspective view which shows a room | chamber interior. It is a figure when looking up at a ceiling from the bottom. FIG. 3 is an enlarged sectional view taken along line III-III in FIG. 2 in the first embodiment. It is an exploded view of a radiation panel. It is a disassembled perspective view of a radiation panel. It is a principal part enlarged view of FIG. It is principal part sectional drawing which shows 2nd Embodiment. It is principal part sectional drawing which shows 3rd Embodiment. It is a wiring diagram with respect to a light emitting diode. It is principal part sectional drawing which shows 4th Embodiment. It is principal part sectional drawing which shows 5th Embodiment. It is a figure which shows the modification of 5th Embodiment. It is principal part sectional drawing shown in 6th Embodiment. It is principal part sectional drawing which shows 7th Embodiment. It is a figure which shows the modification of 7th Embodiment.

DESCRIPTION OF SYMBOLS 1 Building 2 Room 3 Ceiling unit 4 Radiation panel 5 Opening groove 6 Insertion piece 7 Cross beam member 10 Pipe receiving part 11 Pipe 12 Pipe holding member 13,13 ', 13 "Radiation fin 14 Light emitting diode 14a Light emitting diode substrate (heat sink)
14b Light-emitting part of light-emitting diode 15, 15 'lip 16 Power supply 18 Recessed groove 17, 19 Through hole

Claims (8)

A metal radiant panel comprising a pipe through which a heat medium flows on the upper surface of the panel main body, and a plurality of heat dissipating fins extending downward or parallel to each other on the lower surface of the panel main body. ,
A plurality of light-emitting diodes are disposed on the side of any adjacent heat-dissipating fins in the panel body, on the side surface of any heat-dissipating fin , or on the upper surface of the lip provided on the heat-dissipating fin. Arranged along the direction, the light emitting diode is lit by grounding a direct current supplied from a power line to the radiating panel,
Radiant panel for ceiling with ceiling lighting function. In the description of claim 1,
The radiating fin adjacent to at least the light emitting diode among the radiating fins is provided with a lip projecting sideways so as to extend in the longitudinal direction of the radiating fin .
Radiant panel for ceiling with ceiling lighting function. In the claim 1 or 2,
The light emitting diodes are only Mounting prior Symbol radiating panel a,
Radiant panel for ceiling with ceiling lighting function. In the claim 1 or 2,
The optional portion between the radiating fins of the lower surface of the panel body is provided as recessed groove extending in the longitudinal direction of the heat radiating fins, the light emitting diode is mounted in front Symbol recessed groove ,
Radiant panel for ceiling with ceiling lighting function. In the description of claim 2,
The light emitting diode is mounted on the upper surface of the front Symbol lip,
Radiant panel for ceiling with ceiling lighting function. In the description of claim 1,
The radiation fins are inclined with respect to the lower surface of the plate-shaped section a and the panel body, the front Symbol emitting diode surrounded portion in this inclined radiating fin and the panel body Arranged ,
Radiant panel for ceiling with ceiling lighting function. In the description of claim 6,
Wherein the inclined radiating fins, lip projecting sideways are provided,
Radiant panel for ceiling with ceiling lighting function. In claim 6 or 7,
The light emitting diode, that are attached to the upper surface of the panel body before or Kiho heat fins or lips,
Radiant panel for ceiling with ceiling lighting function.