JP2010101603A - Ceiling radiation panel having function of ceiling area lighting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To promote heating or cooling effect of a radiation panel 4 and to add a function of ceiling area lighting to the radiation panel 4, in the radiation panel 4 including a pipe 11 provided on the upper face and with a heating medium made to flow and arranged on the indoor ceiling. <P>SOLUTION: A plurality of heat radiation fins 13 extended in parallel with or substantially in parallel with each other at appropriate intervals P are integrally provided on the lower face of the radiation panel 4. In portions between any heat radiation fins 13 out of the heat radiation fins 13, several light emitting diodes 14 are arranged along the longitudinal direction of the radiation fins 13 at appropriate pitches S. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a radiant panel installed on a ceiling for air conditioning in a room such as an office room, a lobby or a hall, and more particularly to a ceiling radiant panel having a ceiling lighting function. .

Recently, for indoor air conditioning, as described in Patent Documents 1, 2 and 3 as prior art, the ceiling in the room is made of a flat plate with a good heat conductive material such as aluminum. A radiating panel is provided, and the radiating panel is cooled or heated by a heat medium flowing in a pipe provided on the upper surface of the radiating panel.
Japanese Patent Laid-Open No. 07-019533 Japanese Patent Laid-Open No. 09-184642 JP 2006-170551 A JP 2003-092009 A

  However, the lower surface of the radiating panel in the prior art is merely a flat plane, and the contact area with air in the room, that is, the radiating area does not exceed the area of the lower surface of the radiating panel. The achievement of was insufficient.

  Moreover, since the radiating panel is flat, there is a problem that not only the design effect on the ceiling is low, but also the warp deformation of the radiating panel is large.

  Further, when the lighting device is installed on the ceiling in the room, the radiation area on the lower surface of the radiation panel is reduced by this ceiling lighting device.

  On the other hand, Patent Document 4 as another prior art discloses a surface illumination device using a plurality of light emitting diodes (LEDs). By installing this surface illumination device on a ceiling, a light emitting diode is used. Can be ceiling lighting.

  Further, the surface illumination device in Patent Document 4 is configured such that a plurality of light emitting diodes are mounted in a matrix on the front surface of the flat plate, and a cooling water passage is provided on the back surface of the flat plate. , Each of the light emitting diodes can be constantly cooled.

  However, when a large number of light emitting diodes are provided on the lower surface of the flat plate for ceiling lighting, when looking up at the ceiling, light emitted from all of the many light emitting diodes with strong directivity is emitted. Because this strong directivity will enter the field of view at the same time (all at once), as a whole it will be in a state of extremely dazzling point light emission, and it will not be possible to make ceiling lighting with soft surface light emission. there were.

  It is a technical object of the present invention to provide a ceiling lighting function in a state close to surface lighting while solving the problems of the prior art ceiling radiating panel.

In order to achieve this technical problem, claim 1
“In the radiant panel installed on the ceiling of the room with a pipe through which the heat medium flows,
On the lower surface of the radiation panel, a plurality of heat radiation fins configured to extend parallel or substantially parallel to each other at appropriate intervals are integrally provided so as to protrude downward. A plurality of light emitting diodes are disposed at intervals of appropriate pitches along the longitudinal direction of the heat dissipating fins in the portion between the heat dissipating fins. "
It is characterized by that.

Claim 2
“In the first aspect of the present invention, at least the heat dissipating fins adjacent to the light emitting diodes of the heat dissipating fins are provided with a lip projecting sideways so as to extend in the longitudinal direction of the heat dissipating fins. "
It is characterized by that.

Claim 3
“In the first or second aspect, the light emitting diode is attached to the radiation panel or the heat radiation fin.”
It is characterized by that.

Claim 4
“In the first or second aspect of the present invention, a concave groove is provided in the lower surface of the radiating panel between any heat-dissipating fins so as to extend in the longitudinal direction of the heat-dissipating fins. , Mounted in the recessed groove. "
It is characterized by that.

Claim 5
“In the claim 2, the light emitting diode is attached to the upper surface of the lip.”
It is characterized by that.

Claim 6
“In the first aspect, the heat dissipating fin has a plate-like cross-sectional shape protruding downward from the lower surface of the radiating panel, and is inclined with respect to the lower surface of the radiating panel. The light emitting diode is disposed in a portion surrounded by the fin and the radiation panel. "
It is characterized by that.

Claim 7
“In claim 6, the inclined heat dissipating fin is provided with a lip projecting sideways.”
It is characterized by that.

Claim 8
“In the sixth or seventh aspect, the light emitting diode is attached to an upper surface of the radiating panel or the inclined heat dissipating fin or lip.”
It is characterized by that.

  According to claim 1, by providing a plurality of heat radiation fins integrally on the lower surface of the radiating panel, the contact area with the air in the room, that is, the radiating area can be greatly increased. In addition, by providing a plurality of heat dissipating fins integrally, warpage deformation of the radiation panel can be reduced, and the heat dissipating fins have a pattern of horizontal stripes or vertical stripes. The design effect can be improved.

  The plurality of light emitting diodes disposed between the heat dissipating fins perform ceiling illumination.

  In this case, since the light emitting diode is disposed in the portion between the heat radiating fins, when the ceiling formed by the radiation panel is looked up from a direction perpendicular to the heat radiating fins, In the area of the ceiling excluding the point just above the viewpoint, the light emitting diode is covered with the heat-dissipating fins with respect to the viewpoint, and strong directivity from the covered light emitting diode is obtained. The light that it has does not enter the field of view directly, but is reflected downward on the surfaces of the radiation panel and the heat radiation fins to illuminate the interior of the room.

  As a result, in the area of the ceiling excluding the point just above the viewpoint, the light emitted from the light emitting diodes with a strong directivity can be used for the heat radiation without reducing the cooling / heating effect of the radiation panel and the heat radiation fin. Since fins can be used to achieve a soft surface emission state, the radiant panel can be given a function of ceiling illumination by a surface.

  And, as described in claim 2, at least the heat dissipating fin adjacent to the light emitting diode among the heat dissipating fins is provided with a lip projecting sideways so that the contact area with the air in the room, that is, the radiation area. Can be increased without increasing the height of the heat dissipating fins or increasing the number of heat dissipating fins per unit area, and more lip diodes can be added to the lip. Since it can be covered, when the ceiling is looked up, the area where the light-emitting diode is covered, that is, the area where the surface is illuminated by the ceiling can be further expanded.

  Further, as described in claim 3, the light emitting diode is attached to the radiating panel or attached to the heat radiating fin, so that the heat generated by the light emitting diode is transferred to the radiating panel or the heat radiating fin. The light emitting diode can be cooled so that the temperature thereof is close to that of the radiation panel or the heat dissipating fin. Therefore, the light emitting diode can be kept at a high output and its durability can be improved.

  In particular, with the configuration described in claim 4, the area of contact with the air in the room, that is, the radiation area, can be expanded by the recessed groove, and the region, that is, the surface in which the light emitting diode is covered. The area where the ceiling illumination is caused can be further expanded by the recessed groove, and the inner surface of the recessed groove can be a reflecting surface that disperses point-emitting light over a wide range.

  According to the configuration described in claim 5, the light emitting diode can be cooled, but the light emitting diode is covered with a lip when the ceiling is viewed from a direction perpendicular to the heat dissipating fin. It can be concealed and can be concealed by a lip even when viewed from a direction parallel to the heat dissipating fin, so that ceiling illumination by a surface can be reliably achieved over a wide range.

  Next, by adopting the configuration described in claim 6, as in the case of claim 5, the light-emitting diode can be mounted from the direction perpendicular to the heat-dissipation fin by simply inclining the heat-dissipation fin. Since it can be covered when viewed up, it can also be covered up when viewed from a direction parallel to the heat-dissipating fin, so that ceiling illumination by a surface can be reliably achieved over a wide range.

  Even in this case, by adopting the configuration described in claim 7, it is possible to further increase the area of the ceiling where the light emitting diode is covered with the heat-radiating fin.

  According to the configuration described in claim 8, the heat generated by the light emitting diode can be absorbed by the radiating panel or the heat radiating fin or lip, and the temperature of the light emitting diode can be absorbed by the radiating panel or the heat radiating. Since it can cool so that it may become the temperature close | similar to a use fin or a lip, while being able to maintain the said light emitting diode at high output, its durability can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 is a perspective view of the interior of the room as viewed from the back, FIG. 2 shows the interior of the room as viewed from below, and FIG. 3 is a view taken along line III-III in FIG. The enlarged cross-sectional view shows the first embodiment.

  In these drawings, reference numeral 1 indicates a building such as a building, and a ceiling unit 3 is provided on the ceiling in a room 2 such as an office in the building 1.

  As shown in FIG. 3, the ceiling unit 3 is configured by horizontally arranging a plurality of radiation panels 4.

  This radiant panel 4 has a long shape in which the length L is significantly longer than the width W, and is manufactured by extruding a metal having excellent heat transfer properties, for example, aluminum. An opening groove 5 is provided at one end edge in the longitudinal direction, and a fitting piece 6 is provided at the other end edge so as to extend in the longitudinal direction.

  The ceiling unit 3 is configured by arranging a plurality of the radiating panels 4 side by side so as to fit the fitting pieces 6 at the other end edge into the opening groove 5 at the one end edge.

  The radiating panels 4 in the ceiling unit 3 are connected to each other by cross beam members 7 arranged so as to extend laterally on the upper surfaces at both ends, and supported by the building 1 via the cross beam members 7. Yes.

  That is, as shown in FIGS. 3, 4 and 5, each radiating panel 4 has a bottom surface of each cross beam member 7 between a pair of hook-shaped claw pieces 8a, 8b integrally provided on each top surface. By inserting and engaging the hook-shaped projecting piece 9 projecting downward from the horizontal beam member 7, the horizontal beam member 7 is detachably attached to the horizontal beam member 7 so as to be suspended from the lower surface thereof. Is attached to the building 1.

  Further, a pair of pipe receiving portions 10 are provided on the upper surface of each radiating panel 4 so as to extend in the longitudinal direction, and pipes 11 are fitted and attached to the pipe receiving portions 10. 2 are connected in a zigzag manner as shown in FIG. 2, and a predetermined temperature (for example, 23 by a device not shown) is connected to the pipe 11. The room 2 is cooled by heat exchange with the air in the room 2 by flowing a heat medium such as water maintained at a temperature of ° C. and maintaining the surface of each radiant panel 4 at the temperature described above. Or it is comprised so that it may heat.

  As shown in FIGS. 3, 4 and 5, the pipe 11 on the upper surface of each radiation panel 4 is a presser interposed between the pie receiving portion 10 into which the pipe 11 is fitted and the cross beam member 7. The member 12 is fixed in a state of being fitted into the pie receiving portion 10.

  On the lower surface of each radiating panel 4, a plurality of heat dissipating fins 13 configured to protrude downward are integrally provided at appropriate intervals P along the width direction of the radiating panel 4.

  The heat dissipating fins 13 are parallel or substantially parallel to each other and extend in the longitudinal direction of the radiating panel 4. In the first embodiment, as shown in FIGS. 3, 4, and 5, The radiating panel 4 is configured to have a plate-like cross-sectional shape that is perpendicular to the lower surface of the radiating panel 4 or substantially perpendicular (substantially perpendicular).

  On the other hand, in the second embodiment, as shown in FIG. 7, each of the heat dissipating fins is configured as a heat dissipating fin 13 'having a semicircular cross-sectional shape.

  Needless to say, the second embodiment has the same configuration as that of the first embodiment except that the heat dissipating fin 13 'has a semicircular cross-sectional shape.

  As described above, a plurality of heat-dissipating fins 13, 13 ′ projecting downward are integrally provided on the lower surface of each radiation panel 4 constituting the ceiling unit 3 so as to extend in the longitudinal direction. Since the contact area with the air, that is, the radiation area, can be greatly increased, the effect of cooling and heating can be achieved with certainty, and by providing a plurality of heat radiation fins 13 and 13 'integrally, the radiation can be achieved. The warp deformation in the panel 4 can be reduced, and the heat radiation fins 13 and 13 ′ have horizontal stripes or vertical stripes, so that the design effect on the ceiling can be improved.

  A portion between any of the heat dissipation fins 13, 13 ′, for example, a portion between a pair of heat dissipation fins 13, 13 ′ of one radiating panel 4 is shown in FIGS. As shown, a plurality of light emitting diodes 14 are disposed at an appropriate pitch S along the longitudinal direction of the heat dissipating fins 13, 13 ′.

  As shown in FIG. 6, each of the light emitting diodes 14 is packaged (sealed) with a light emitting diode chip 14c on a substrate (heat sink) 14a made of a metal material having excellent thermal conductivity such as copper. The light emitting portion 14b made of the light transmissive synthetic resin 14d is provided. Specifically, as shown in FIG. 6, the substrate (heat sink) 14a is in close contact with the lower surface of the radiation panel 4. Alternatively, as in the third embodiment shown in FIG. 8, the substrate (heat sink) 14a is attached in close contact with the side surface of the heat radiation fin 13.

  Further, as shown in FIG. 9, each of the light emitting diodes 14 is connected in parallel between one electrical wiring 16 a and the radiating panel 4 serving as a ground wire with respect to a DC power source 16. Of course, it is possible to connect to an AC power source.

  The light emitting diodes 14 have a staggered arrangement as shown in FIG.

  The plurality of light emitting diodes 14 disposed in the portion between the heat dissipating fins 13 and 13 'constitute ceiling lighting.

  In this case, when the ceiling by the ceiling unit 3 is looked up from the direction perpendicular to the radiation fins 13 and 13 'in each of the radiation panels 4, as indicated by an arrow A in FIG. In the region except just above, the light emitting diode 14 is covered with the heat radiation fins 13 and 13 ′ with respect to the viewpoint, and has strong directivity from the covered light emitting diode 14. The light is reflected directly downward on the surfaces of the radiation panel 4 and the heat dissipating fins 13 and 13 'without directly entering the field of view, and illuminates the room.

  As a result, in the area of the ceiling excluding the point just above the viewpoint, the light emitted from the light emitting diode 14 with strong directivity reduces the cooling / heating effect of the radiation panel 4 and the heat dissipating fins 13 and 13 '. Without any problem, the heat radiation fins 13 and 13 'can be used to achieve a soft surface emission state.

  Moreover, the light emitting diode 14 is attached to the lower surface of the radiating panel 4 so that the substrate (heat sink) 14a of the light emitting diode 14 is in close contact, or the side surface of the heat dissipating fin 13 is Since the substrate (heat sink) 14a is attached so as to be in close contact, the heat generated by the light emitting diode 14 is absorbed by the radiation panel 4 or the heat radiation fins 13 and 13 '. Can be cooled so that the temperature thereof is close to that of the radiation panel 4 or the fins 13 and 13 'for heat radiation.

  In this case, it is preferable that the light emitting diode 14 is attached to a portion of the upper surface of the radiating panel 4 as close as possible to the pipe receiving portion 10 in terms of facilitating cooling.

  When the light emitting diode 14 is attached to the radiation panel 4, a through hole 17 is formed in the radiation panel 4 as in the fourth embodiment shown in FIG. The substrate (heat sink) 14 a can be in close contact with the upper surface of the radiation panel 4, and the light emitting portion 14 b can be attached so as to fit into the through hole 17.

  According to this configuration, it is possible to further approximate surface emission while cooling the light emitting diode 14.

  Next, FIGS. 11 and 12 show a fifth embodiment.

  In the fifth embodiment, a recessed groove 18 is provided in a portion between any heat radiation fins of the heat radiation fins 13 on the lower surface of the radiation panel 4 so as to extend in the longitudinal direction of the heat radiation fins 13. The light emitting diode 14 is mounted in the recessed groove 18 so that the substrate (heat sink) 14a is in close contact with the bottom surface of the recessed groove 18 (see FIG. 11).

  According to this configuration, the area of contact with the air in the room, that is, the radiation area can be expanded by the recessed groove 18 and the light emitting diode 14 is covered with the area, that is, the surface is in a ceiling illumination state. The area can be further expanded, and the inner surface of the recessed groove 18 can be a reflecting surface that disperses point-emitting light over a wide range.

  In the fifth embodiment, similarly to the fourth embodiment shown in FIG. 10, as shown in FIG. 12, a through-hole 19 is formed in the bottom of the recessed groove 18, and the The light emitting diode 14 can be mounted such that its substrate (heat sink) 14a is in close contact with the upper surface of the radiation panel 4 and its light emitting portion 14b is fitted in the through hole 19 (see FIG. 12). .

  When the heat dissipating fin 13 has a plate-like cross-sectional shape as shown in FIGS. 3 to 6, 8, 10, 11, and 12, the lower end of the fin 13 is horizontally oriented. The projecting lip 15 is provided by being attached so as to extend in the longitudinal direction of the heat dissipating fins 13 or integrally provided.

  With this configuration, the contact area with the air in the room 2, that is, the radiation area can be increased by the lip 15, and more light-emitting diodes 14 can be covered by the lip 15. Therefore, when the ceiling is looked up, the area where the light-emitting diode 14 is covered, that is, the area where the surface is illuminated by the ceiling can be expanded more extensively by the lip 15. .

  In addition, by providing the lip 15, deformation of the heat dissipating fin 13 can be prevented.

  Note that the heat dissipating fin 13 having the plate-like cross-sectional shape is not limited to the reverse T-shape provided integrally with the lip 15 projecting left and right laterally at the lower end, but is shown in FIG. 13 described below. Thus, it can be configured in an L shape.

  Further, the lip 15 is not limited to be provided on all the heat radiation fins 13, but is provided on at least one of the heat radiation fins 13 adjacent to the left and right sides or one side of the light emitting diode 14. By doing so, the above-described effects can be obtained.

  Next, FIG. 13 shows a sixth embodiment.

  In the sixth embodiment, when the fin 13 for heat dissipation has a plate-like cross-sectional shape and a lip 15 is provided at the lower end, the light-emitting diode 14 is placed on the upper surface of the lip 15 and the light-emitting diode 14 The substrate (heat sink) 14a is attached so as to be in close contact with each other, and other configurations are the same as those in the first and third embodiments.

  According to this configuration, while the light emitting diode 14 can be cooled, the light emitting diode 14 is viewed from a direction perpendicular to the heat dissipating fins 13 as indicated by an arrow A in FIG. 2 can be covered with the lip 15 and can also be covered with the lip 15 when the ceiling is viewed from a direction parallel to the heat dissipating fins 13 as indicated by an arrow B in FIG. Therefore, the ceiling lighting by the surface can be reliably achieved over a wider range.

  14 and 15 show a seventh embodiment.

  In the seventh embodiment, when the radiation fins 13 ″ having a plate-like cross-sectional shape are integrally provided on the lower surface of the radiation panel 4 having the above-described configuration, The light emitting diode 14 is disposed in a portion surrounded by the inclined heat radiation fin 13 ″ and the radiation panel 4 by being inclined at an appropriate angle θ with respect to the lower surface. The configuration of is the same as that of the first embodiment.

  According to the seventh embodiment, the light emitting diode 14 can be covered when the ceiling is viewed from a direction perpendicular to the heat dissipating fin 13 ″ as indicated by an arrow A in FIG. 2 can be concealed even when viewed from a direction parallel to the heat dissipating fin 13 ″ as indicated by an arrow B in FIG.

  In the seventh embodiment, specifically, as shown in FIG. 11, the substrate (heat sink) 14a of the light emitting diode 14 is in close contact with the lower surface of the radiating panel 4 as shown in FIG. Alternatively, as shown in FIG. 12, the substrate (heat sink) 14a of the light emitting diode 14a is attached in close contact with the upper surface of the inclined heat radiation fin 13 ″. The light emitting diode 14 can be reliably cooled so that the temperature thereof becomes the temperature of the radiation panel 4 or the heat radiation fin 13 ″.

  Also in the seventh embodiment, as in each of the embodiments described above, among the inclined heat radiation fins 13 ″, the heat radiation fins 13 connected to at least the left and right sides or one side of the light emitting diodes 14 ”. In addition, the lip 15 'is integrally provided, and this can promote the above-described effects.

It is a perspective view which shows a room | chamber interior. It is a figure when looking up at a ceiling from the bottom. FIG. 3 is an enlarged sectional view taken along line III-III in FIG. 2 in the first embodiment. It is an exploded view of a radiation panel. It is a disassembled perspective view of a radiation panel. It is a principal part enlarged view of FIG. It is principal part sectional drawing which shows 2nd Embodiment. It is principal part sectional drawing which shows 3rd Embodiment. It is a wiring diagram with respect to a light emitting diode. It is principal part sectional drawing which shows 4th Embodiment. It is principal part sectional drawing which shows 5th Embodiment. It is a figure which shows the modification of 5th Embodiment. It is principal part sectional drawing shown in 6th Embodiment. It is principal part sectional drawing which shows 7th Embodiment. It is a figure which shows the modification of 7th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Building 2 Room 3 Ceiling unit 4 Radiation panel 5 Opening groove 6 Insertion piece 7 Cross beam member 10 Pipe receiving part 11 Pipe 12 Pipe holding member 13,13 ', 13 "Radiation fin 14 Light emitting diode 14a Light emitting diode substrate (heat sink)
14b Light-emitting portion of light-emitting diode 15, 15 'Lip 16 Power supply 18 Recessed groove 17, 19 Through hole

Claims (8)

In a radiant panel provided on the ceiling of the room with a pipe through which the heat medium flows on the top surface,
On the lower surface of the radiating panel, a plurality of radiating fins configured to extend parallel to each other or substantially in parallel with each other at an appropriate interval are provided so as to protrude downward. A ceiling radiating panel having a ceiling lighting function, wherein a plurality of light emitting diodes are arranged at appropriate pitch intervals along a longitudinal direction of the heat dissipating fins in a portion between the fins. .   In the first aspect of the present invention, at least the heat dissipating fin adjacent to the light emitting diode among the heat dissipating fins is provided with a laterally protruding lip extending in the longitudinal direction of the heat dissipating fin. A ceiling radiant panel with a ceiling lighting function.   3. The ceiling radiating panel having a ceiling lighting function according to claim 1, wherein the light emitting diode is attached to the radiating panel or the heat radiation fin.   In the description of claim 1 or 2, a concave groove is provided in a portion between any heat radiation fins on the lower surface of the radiation panel so as to extend in a longitudinal direction of the heat radiation fins. A ceiling radiating panel having a ceiling illumination function, wherein the ceiling radiating panel is mounted in the recessed groove.   3. The ceiling radiating panel according to claim 2, wherein the light emitting diode is attached to an upper surface of the lip.   2. The heat dissipation fin according to claim 1, wherein the heat dissipating fin has a plate-like cross-sectional shape protruding downward from the lower surface of the radiating panel and is inclined with respect to the lower surface of the radiating panel. A ceiling radiating panel having a ceiling lighting function, wherein the light emitting diode is disposed in a portion surrounded by the radiating panel.   7. The ceiling radiating panel having a ceiling lighting function according to claim 6, wherein the inclined heat dissipating fin is provided with a lip projecting sideways.   8. The ceiling radiating panel having a ceiling lighting function according to claim 6, wherein the light emitting diode is attached to an upper surface of the radiating panel or the inclined heat radiation fin or lip. .