JP2019104055A - Laser processing method and method for manufacturing mask assembly - Google Patents

Abstract

To provide a laser processing method which compensates change in a shape when pulling an object to be processed, and a method for manufacturing a mask assembly.SOLUTION: A laser processing method including: a process in which plural guide lines, which include a curve along a first axial direction of a tabular to be processed, are set onto the object to be processed; a process in which plural unit processing regions, which are so located along the plural guide lines as to be separated from one another, are set onto the object to be processed; and a process in which the plural processing regions are irradiated with laser beam while moving an irradiation position of laser beam. According to the present invention, a method for manufacturing a mask assembly is also provided.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laser processing method and a method of manufacturing a mask assembly, and more particularly, to a method of manufacturing a laser processing method and a mask assembly that compensates for a change in shape of a workpiece when pulled.

  When manufacturing an active organic light emitting diode (Active Matrix Organic Light-Emitting Diode; AMOLED), vacuum deposition is performed to deposit a plurality of organic layers, and different organic layers are deposited according to RGB (Red, Green, Blue) pixels. It must be done. At this time, it is a fine metal mask (FMM) assembly that acts as a screen mask so that the desired organic material is deposited only on the desired pixels and the organic material is not deposited on other regions.

  In general, a fine metal mask (FMM) assembly is manufactured by pulling a plurality of mask sticks made of divided masks and fixing them to a frame using welding or the like. When pulling the mask stick to secure the mask stick to the frame, the shape and size of the holes (the holes formed in the mask stick) because the mask expands in the pulling direction and contracts in the direction perpendicular to the pulling direction. and changes in the position of the hole. Thereby, when processing the holes of the mask stick, when making the shape, size and spacing of all the holes equal, the shape and size of the holes and the position of the holes change when the mask stick is pulled, It will not be possible to meet the specifications or specifications such as positional accuracy, shape, size, etc. of each hole.

  In particular, conventionally, in the case of laser processing the hole of the mask stick, the shape of the hole only in a straight line direction (or only on a straight line) by controlling the laser beam only in two dimensions of x axis and y axis. However, there has been a problem in processing the hole by compensating for the change in the shape and size of the hole and the position of the hole which occur when the mask stick is pulled.

Korean Patent Publication No. 10-2015-0111349

  The present invention processes a plurality of unit processing areas whose positions are guided using a plurality of guidelines including a curve, and can compensate for a change in shape of a workpiece when it is pulled. And a method of manufacturing the mask assembly.

  A laser processing method according to an embodiment of the present invention comprises: setting a plurality of guidelines including a curve along a first axial direction of the object to be processed on a plate-like object to be processed; A process of setting a plurality of unit processing areas spaced apart from each other along the plurality of guidelines on the object to be processed, and moving the irradiation position of the laser beam, the plurality of unit processing areas And b) irradiating the laser beam.

  Two adjacent ones of the plurality of guidelines may have different bending rates.

  The guideline which is a curve among the plurality of guidelines forms an arc on the side away from the first axial center line of the object to be processed, and the first object of the object to be processed is formed. The bending ratio may increase with distance from the axial center line.

  In the process of irradiating the plurality of unit processing areas with the laser beam, the plurality of unit processing areas may be irradiated with the laser beam while moving the laser head from which the laser beam is emitted separately for each of the guidelines. .

  In the process of irradiating the plurality of unit processing regions with the laser beam, the laser head may be moved at a constant speed in each of the guidelines.

  In the process of irradiating the plurality of unit processing areas with the laser beam, while changing the size of the laser beam corresponding to the size of each unit processing area, the laser beam The irradiation position may be moved.

  In the process of irradiating the plurality of unit processing areas with the laser beam, the size of the laser beam may be changed by adjusting the height of the laser head.

  In the process of irradiating the plurality of unit processing areas with the laser beam, the size of the laser beam is changed while sequentially changing the three-dimensional coordinate value of the laser head to move the irradiation position of the laser beam. May be

  In the process of setting the plurality of unit processing areas, the unit processing area at the central portion may be set larger than the unit processing areas at both ends in each of the guidelines.

  In the process of setting the plurality of unit machining areas, the unit machining area located at the central portion of each of the guidelines is set to be larger as it goes away from the first axial center line of the workpiece. It is also good.

  In the process of setting the plurality of unit machining areas, the unit machining area located at the central portion of each of the guidelines is increased at a constant ratio as it goes away from the first axial center line of the workpiece The constant ratio may be set according to the deformation rate of the object to be processed.

  In the process of setting the plurality of unit processing areas, the unit processing areas located at both ends of the plurality of guidelines may be set to a predetermined size.

  In a method of manufacturing a mask assembly according to another embodiment of the present invention, the object to be processed is processed by the laser processing method according to an embodiment of the present invention, and a plurality of unit processing regions are processed. The method may include the steps of preparing a mask stick having a processed hole formed therein, and pulling and fixing the mask stick in a first axial direction on a frame having an opening.

  In the process of pulling and fixing the mask stick in the first axial direction, parallel tensile forces may act on both ends of each of the guidelines in the first axial direction of the mask stick.

  In the process of pulling and fixing the mask stick in the first axial direction, the plurality of machined holes may be linearly arranged in a two-dimensional manner, and the diameter of the plurality of machined holes may be constant.

  The laser processing method according to the embodiment of the present invention sets a plurality of guidelines including a curve along a first axial direction of the object to be processed on a plate-like object to be processed, and a plurality of guidelines By processing a plurality of unit processing areas whose positions are guided accordingly, it is possible to compensate for the change in the processing shape and the change in the position when the object to be processed is pulled. That is, a plurality of guidelines having a bending rate determined by reflecting the deformation rate of the object to be processed is provided on the object to be processed, and a unit processing area is set at a compensation position of a change in position due to tension. be able to. In addition, since the size of each unit processing area can be determined reflecting the change of the processing shape according to the position of the unit processing area, the change of the position at the time of pulling of the workpiece and the change of the processing shape It can be compensated.

  Therefore, when forming the processing holes in the mask stick by the laser processing method of the present invention, when the mask stick is pulled and fixed to the frame, the positional difference, the size difference and the shape difference of the processing holes are corrected. It can meet the specifications or specifications such as the positional accuracy, size, and shape of the processing hole.

  Moreover, a plurality of unit processing areas can be processed while moving the irradiation position of the laser beam along each guide line, and the plurality of unit processing areas can be processed at a constant speed for each guide line. Along with this, it is possible to obtain processed products (for example, processed holes) of constant quality for each unit processing area.

  Furthermore, by adjusting the size of the laser beam by adjusting the height of the laser head according to the change in the size of the unit processing area, constant energy can be applied to a plurality of unit processing areas having different sizes depending on the position. The laser beam can be emitted. Accordingly, the object to be processed can be processed with a certain number of repetitions, and uniform processing can be performed over the entire region of the object to be processed.

FIG. 2 is a procedure diagram showing a laser processing method according to an embodiment of the present invention. The conceptual diagram for demonstrating the setting of the guideline and unit processing area which concern on one Embodiment of this invention. The conceptual diagram for demonstrating the movement of the laser head which concerns on one Embodiment of this invention. FIG. 6 is a view showing a mask assembly manufactured by the method for manufacturing a mask assembly according to another embodiment of the present invention. The conceptual diagram for demonstrating correction | amendment of the shape of the processing hole by tension | pulling of the mask stick which concerns on other embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in more detail based on the attached drawings. However, the present invention is in no way limited to the embodiments disclosed below, but is embodied in different forms, which merely complete the disclosure of the present invention and have ordinary knowledge. It is provided to fully inform the person having the scope of the invention. In describing the present invention, the same reference numerals are given to the same components, and the drawings may be partially exaggerated in size to accurately describe the embodiments of the present invention. , The same reference numerals indicate the same components.

  FIG. 1 is a procedure diagram showing a laser processing method according to an embodiment of the present invention, and FIG. 2 is a conceptual diagram for explaining setting of a guideline and a unit processing area according to an embodiment of the present invention. .

  Referring to FIGS. 1 and 2, in the laser processing method according to the embodiment of the present invention, a curve is formed on a plate-like workpiece 100 along a first axial direction 21 of the workpiece 100. And setting a plurality of unit processing areas 110 spaced apart from each other along the plurality of guidelines 11 on the object to be processed 100 (S110). The process (S120) and the process (S130) of irradiating the laser beam 10 to the plurality of unit processing areas 110 while moving the irradiation position of the laser beam 10 may be included.

  Generally, the object to be processed 100 in the present invention may be a mask stick of a fine metal mask (FMM) used in a vacuum deposition process when manufacturing an organic EL (Electro Luminescence), an organic semiconductor device or the like. . However, the present invention is not limited to this, and may be any object as long as it can be processed by a laser. In particular, in the case of forming a processing pattern in a specific region on a semiconductor substrate or a via hole formed in a printed circuit board (Printed Circuit Board; PCB) in packaging of a semiconductor element, etc. It can be used in various ways.

  First, a plurality of guidelines 11 including curves are set on the plate-like workpiece 100 along the first axial direction 21 of the workpiece 100 (S110). The plurality of guidelines 11 can be set as virtual lines on the workpiece 100, may be set along the first axial direction 21 of the workpiece 100, and include at least one curve. It may be. At this time, the plurality of guide lines 11 may guide the positions where the plurality of unit processing areas 110 should be set, and the first axial direction 21 of the object 100 to be processed is the length of the object 100 to be processed It may be axial (or longitudinal), or it may be the direction in which it should be pulled if there is no distinction between major and minor axes. Here, the phrase “along the first axial direction of the object to be processed” covers not only linear and curvilinear shapes, but also follows parallel to the first axis of the object 100 to be processed. It is also used to cover non-parallel tracking. That is, the plurality of guide lines 11 is a line extending from one end in the first axial direction 21 of the workpiece 100 to the other end while having a component in the first axial direction 21 of the workpiece 100 I hope there is.

  Next, a plurality of unit processing areas 110 which are disposed apart from each other along the plurality of guidelines 11 on the workpiece 100 are set (S120). The plurality of unit processing areas 110 may be spaced apart from each other along the respective guidelines 11, and may be set as virtual areas on the workpiece 100. At this time, the plurality of unit processing areas 110 may be set such that the centers of the unit processing areas 110 are positioned on the guide line 11, respectively. Here, when the shape of the unit processing area 110 is a shape having a direction, the guide line 11 may guide the formation direction of the unit processing area 110.

  When the object to be processed 100 is pulled, it expands in the pulling direction and shrinks in the direction perpendicular to the pulling direction, so the shape change and the position change of the processed product 110a formed by processing the unit processing area 110 It occurs. Accordingly, in the present invention, a unit machining area 110 is set by compensating for such a change in shape and position of the processed product 110a, and a unit in which the change in shape and the change in position are reflected. By processing the processing area 110, it is possible to compensate for the change in the shape and the position of the processed product 110a when the workpiece 100 is pulled.

  In general, the mask assembly is manufactured by pulling a plurality of mask sticks made of divided masks and fixing them to a frame using welding or the like. At this time, when the mask stick is pulled to fix the mask stick to the frame, the shape and size of the processing holes formed in the mask stick are expanded in the pulling direction and expand in the direction perpendicular to the pulling direction. (Size) and changes in the position of the processing hole occur. Along with this, when machining holes in the mask stick, when making the shape, size and spacing of all the machining holes equal, change in shape, size and position of the holes when pulling the mask stick As a result, it becomes impossible to meet the standards or specifications such as positional accuracy, shape, size, etc. of each processing hole.

  However, by using the laser processing method of the present invention to compensate for the change in the shape and the position of the processed product 110 a (that is, the change in the shape and the position of the processed hole) to process the unit processed region 110. When forming holes in the mask stick, when the mask stick is pulled and fixed to the frame, the positional difference, size difference and shape difference of the processed holes are compensated (or corrected), and the positional accuracy of each processed hole is obtained. Meet the standards or specifications such as size, shape, etc.

  Two adjacent ones of the plurality of guidelines 11 may have different bending rates or directions of curves. Here, the bending rate includes a sign, and ones having different signs of the bending rate may also have different bending rates. At this time, the sign of the bending rate is determined according to the direction of the curve, but the direction of the curve means the direction in which the curve is bent, and the direction of the upward convex curve is the + direction (or the + sign And the direction of the concave curve may be-direction (or-sign). In FIG. 2, the upper side may be in the + direction with the center line in the first axial direction 21 of the workpiece 100 (or a straight line in the middle of a plurality of guidelines), and the lower side may be the − direction. It may be Here, the center line in the first axial direction 21 of the object 100 to be processed means a line at the center among the lines extending in parallel to the first axial direction 21, and the center line among the plurality of guidelines 11 If there is no straight line, it may be a virtual line. On the other hand, the center straight line of the plurality of guidelines 11 coinciding with the center line in the first axial direction 21 of the object to be processed 100 may have a bending ratio of “0”, and is not a curve. The direction of the curve (or the sign of the bending factor) may not be present. At this time, the presence or absence of the direction of the curve can also be regarded as the direction of the curve being different.

  Since the tensile force received when the workpiece 100 is pulled (that is, the expansion force in the tension direction and the contraction force in the direction perpendicular to the tension direction) differs depending on the position of the workpiece 100, the tension acting on each position The set position of the unit processing area 110 may be determined according to the force. Here, the bending rates or the directions of the curves of the plurality of guide lines 11 may be different so as to guide the set position of such unit processing area 110.

  Since the plurality of guidelines 11 are set at different positions, the tensile force acting on each of the guidelines 11 in which the plurality of unit processing areas 110 are set may be different. Along with this, the bending rate of the guide line 11 may be determined according to the tensile force at the position of each guide line 11, and the curved direction may be determined according to the direction of the tensile force at the position of each guide line 11. Accordingly, two adjacent ones of the plurality of guidelines 11 may have different bending rates or directions of curves.

  For example, since the linear guide line 11 coinciding with the center line in the first axial direction 21 of the object to be processed 100 has a bending rate of "0", The other curved guide lines 11 with different bending rates may also have different bending rates, as the other guide lines 11 with bending rates also have different bending rates depending on the difference in tensile force acting depending on the position. .

  The guide line 11 which is a curved line (or curved line) of a plurality of the guide lines 11 has an arc on the side away from the center line of the first axial direction 21 of the object 100 to be processed. It may be formed, and the bending ratio may become higher as it goes away from the center line of the first axial direction 21 of the object 100 to be processed.

  The guide line 11 which is a curve among the plurality of guide lines 11 is a chord parallel to the first axis of the object 100 to be processed (or the center line in the first axial direction of the object to be processed) May form an arc. At this time, arcs may be formed on the side (or both sides in the second axial direction of the object to be processed) of the object to be processed 100 away from the center line of the first axial direction 21 of the object 100 to be processed. Here, the second axial direction 22 of the object to be processed 100 may be the minor axis direction (or the width direction) of the object to be processed 100, and the first axial direction 21 of the object to be processed 100 may be It may be in the direction intersecting (or perpendicular). When the workpiece 100 is pulled in the first axial direction 21, it expands in the first axial direction 21 of the workpiece 100 and contracts in the second axial direction 22 of the workpiece 100. An arc is formed on the side away from the center line of the workpiece 100 in the first axial direction 21 to position the workpiece 110a when the workpiece 100 is pulled in the first axial direction 21. Can compensate for changes in If the same tensile force does not act at both ends of the curve, the curve does not extend in a straight line, so that the curve forms an arc having a chord parallel to the axis of the first axial direction 21 of the object 100 to be processed. A plurality of process formations 110 a arranged in a curved line on the guide line 11 may be arranged in a line (or in a straight line) when the workpiece 100 is pulled in the first axial direction 21.

  The bending ratio of the guide line 11 which is the curved line may increase as it goes away from the center line of the first axial direction 21 of the workpiece 100. At this time, the bending ratio may be maximized in the outer shell on both sides of the second axial direction 22 of the workpiece 100 in which the contraction force is strongest in the second axial direction 22. The bending ratio may decrease as it approaches the center of the second axial direction 22 of the workpiece 100 in which the contraction force is reduced. The contraction force in the second axial direction 22 of the object to be processed 100 in response to the tension in the first axial direction 21 of the object 100 to be processed is the outer shell on both sides in the second axial direction 22 of the object 100 to be processed. The second axial direction of the object 100 to be processed is the largest because it works at the center of the second axial direction 22 of the object 100 to be processed in the second axial direction 22 of the object 100 to be processed. It is the smallest at the center of 22. Along with this, the bending ratio may increase as the distance from the center line in the first axial direction 21 of the object to be processed 100 increases. At this time, the bending rate of each of the guide lines 11 may be determined according to the deformation rate of the workpiece 100 and the tensile force acting on both ends of the workpiece 100 in the first axial direction 21. The bending rate of each of the guidelines 11 is the thickness of the workpiece 100, the material of the workpiece 100, the shape, size, position, and pattern of the unit machining region 110 and the plurality of unit machining regions 110. It may be determined in consideration of at least one or more factors of the size.

  On the other hand, the plurality of unit processing areas 110 may be disposed symmetrically with respect to the center line of the first axial direction 21 and the second axis direction 22 of the workpiece 100. For example, the guide lines 11 may be arranged symmetrically about a central straight line among the plurality of guide lines 11. In this case, the tensile force for pulling the workpiece 100 in the first axial direction 21 is uniformly transmitted to the entire region of the workpiece 100 in a predetermined pattern, and the first axial direction 21 of the workpiece 100 is obtained. The positional accuracy of each processed product 110a is increased when pulling to the center, and it becomes possible to form an accurate two-dimensional pattern in the central portion of the workpiece 100.

  Next, while moving the irradiation position of the laser beam 10, the plurality of unit processing areas 110 are irradiated with the laser beam 10 (S130). Here, the irradiation position of the laser beam 10 may be moved by moving the position of the workpiece 100 or the laser head 50. At this time, the laser beam 10 may be irradiated onto the workpiece 100 only in the plurality of unit processing regions 110. That is, the laser beam 10 may be turned on only in the plurality of unit processing areas 110, and the laser beam 10 may be turned off in other areas where the processing by the laser beam 10 is not required. . In a state where the laser beam 10 is activated (or turned on), the laser beam 10 is blocked by a blocking member (not shown) or the like in a region where the processing by the laser beam 10 is not required. The laser beam 10 may be irradiated only to the plurality of unit processing areas 110.

  For example, in the process (S130) of irradiating the plurality of unit processing areas 110 with the laser beam 10, the irradiation position of the laser beam 10 may be moved while changing the coordinate value of the laser beam 10. That is, even if the laser beam 10 is irradiated to the plurality of unit processing areas 110 by changing the coordinate value of the laser beam 10 and moving the irradiation position of the laser beam 10 to the coordinates corresponding to the plurality of unit processing areas 110 Good. In this case, the laser beam 10 may be activated (or turned on) at coordinates (or coordinate sections) corresponding to a plurality of unit processing areas 110. Thus, the irradiation position of the laser beam 10 can be easily moved to the plurality of unit processing areas 110 simply by changing the coordinate value of the laser beam 10. In addition, the irradiation position of the laser beam 10 is moved to the coordinates corresponding to the plurality of unit processing areas 110, and the laser beams 10 are irradiated to the plurality of unit processing areas 110. 10 can be irradiated and processed.

  FIG. 3 is a conceptual diagram for explaining the movement of the laser head according to the embodiment of the present invention, and FIG. 3 (a) is a conceptual diagram for explaining the movement of the laser head in the horizontal direction. FIG. 3 (b) is a conceptual view for explaining the vertical movement of the laser head.

  Referring to FIG. 3, in the process (S130) of irradiating the plurality of unit processing regions 110 with the laser beam 10, the plurality of unit processing is performed while moving the laser head 50 from which the laser beam 10 is emitted separately for each guideline. The region 110 may be irradiated with the laser beam 10. The laser head 50 may be moved continuously for each guideline 11. For example, it may be moved along each guideline 11, and the plurality of unit processed areas 110 may be (only) activated (or turned on) in the plurality of unit processed areas 110 while the plurality of unit processed areas 110 are moved. You may process it. Here, in the case of moving along the curved guide line 11, the laser head 50 may be moved substantially in the same manner as the curved line by a combination of minute straight line vectors. Not only moving similarly but also moving substantially similar to the guide line 11 is used to cover. At this time, scanning (or reciprocation) may be performed multiple times along one guide line 11. When a plurality of scans are performed along one guideline 11 while irradiating each unit processing area 110 with the laser beam 10 having a size smaller than the size of each unit processing area 110, the laser in each unit processing area 110 While maintaining the bending ratio of the guide line 11 so that the irradiation position of the beam 10 can be changed, the second and the other end of the guide line 11 meet the width of the second axial direction 22 of the laser beam 10 The laser beam 10 may be scanned multiple times along the length of the guide line 11 until the laser beam 10 is uniformly irradiated in each unit processing area 110 while moving in the axial direction 22 (or in the step direction). At this time, the irradiation position of the laser beam 10 may be moved separately for each of the guidelines 11 by time division or space division of the laser beam 10. The irradiation position of the laser beam 10 may be moved separately for each guideline 11. For example, the irradiation position of the laser beam 10 may be moved by one guide line 11 by time division, or space division may be performed to move the irradiation position of the laser beam 10 in the plurality of guide lines 11 by a plurality of laser beams 10. May be

  The step (S130) of irradiating the plurality of unit processing areas 110 with the laser beam 10 is a step of sequentially irradiating the unit processing areas 110 of the first guideline 11a among the plurality of guidelines 11 (S131) And irradiating the laser beam 10 sequentially to the unit processing area 110 of the second guide line 11b adjacent to the first guide line 11a (S132).

  The unit processing area 110 of the first guideline 11a is sequentially irradiated with the laser beam 10 to process (or complete) the unit processing area 110 arranged in the first guideline 11a, and the second guideline 11b The laser beam 10 is sequentially irradiated to the unit processing areas 110 of 1 to process the unit processing areas 110 arranged in the second guideline 11 b to process the unit processing areas 110 separately for each guideline 11. Good. Since the pulling force according to the position acts on the both ends of each guideline 11, the same pulling force works for each guideline 11. As a result, if processing of the unit processing area 110 is not performed under the same conditions for each guideline 11, it is impossible to obtain a pattern of constant quality in the plurality of unit processing areas 110 of each guideline 11.

  For this reason, in order to obtain a pattern of constant quality in a plurality of unit processing areas 110 of each guideline 11, it is necessary to process the unit processing area 110 under the same conditions for each guideline 11. Here, when the processing of the unit processing area 110 is not performed separately for each guideline 11, it becomes difficult to match the same conditions for each guideline 11 and it is necessary to keep changing the conditions. You may process it. Through this, it is possible to obtain a pattern of constant quality in the plurality of unit processing areas 110 of each guideline 11.

  In the process of irradiating the plurality of unit processing areas 110 with the laser beam 10 (S130), the size of the laser beam 10 is changed corresponding to the size of each unit processing area 110, and the respective guidelines 11 are followed. The irradiation position of the laser beam 10 may be moved. Here, the size of the laser beam 10 may be changed to be equal to each unit processing area 110, and although smaller than each unit processing area 110, it may be proportional to the size of each unit processing area 110. It may be changed. When the size of the laser beam 10 is smaller than each unit processing area 110, scanning may be performed multiple times along the guideline 11 for each guideline 11. In order to shorten (or minimize) the distance traveled by the irradiation position of the laser beam 10 and to make the moving speed (or moving speed) of the laser beam 10 in each unit processing area 110 constant, along the guide line 11 The irradiation position of the laser beam 10 may be moved. When moving the irradiation position of the laser beam 10 along the guide line 11, the irradiation position of the laser beam 10 moves linearly and the bending ratio of the moving section is constant. It becomes easy to maintain (or speed) and it becomes easy to turn on / off the laser beam 10.

  At this time, the size of the laser beam 10 may be changed according to the size of the unit processing area 110, and the irradiation position of the laser beam 10 for processing the unit processing area 110 of various sizes in each guideline 11. Simultaneously with changing the size of the laser beam 10. That is, the size (or area) to be processed may be adjusted by changing the size of the laser beam 10, or even if the size of the laser beam 10 is changed according to the size of the unit processing area 110. Good.

  For example, in the process (S131) of sequentially irradiating the laser beam 10 to the unit processing area 110 of the first guide line 11a, the laser beam along the first guide line 11a from one end to the other end of the first guide line 11a. The laser beam 10 may be irradiated to the unit processing area 110 of the first guide line 11 a while moving the irradiation position 10. Then, in the process (S132) of sequentially irradiating the laser beam 10 to the unit processing area 110 of the second guideline 11b, the laser beam along the second guideline 11b from the other end to the one end of the second guideline 11b. The laser beam 10 may be irradiated to the unit processing area 110 of the second guideline 11 b while moving the irradiation position 10. In this case, to irradiate the laser beam 10 to all the plurality of unit processing areas 110 (or scan the entire surface of the object to be processed), the distance by which the irradiation position of the laser beam 10 moves is The number of irradiations (or the number of repetitions) to which the laser beam 10 is irradiated can be made the same for each unit processing area 110.

  At this time, the other end of the first guide line 11 a is moved in the second axial direction 22 (or in the step direction) of the workpiece 100, and the other end of the second guide line 11 b is irradiated with the laser beam 10. The position may move, and the distance between the plurality of guidelines 11 and the guidelines 11 in the second axial direction 22 of the workpiece 100 may be constant. That is, in the unit processing areas 110 located at both ends of each of the guidelines 11, the distance between the guidelines 11 may be constant. In this case, when the workpiece 100 is pulled in the first axial direction 21, the intervals are constant. A pattern of intervals can be obtained.

  When a plurality of unit processing areas 110 are irradiated with the laser beam 10 while moving the irradiation position of the laser beam 10 along the respective guidelines 11, side effects such as thermal effects and burrs (sides) on each unit processing area 110 (side effects can be reduced, the time for processing the plurality of unit processing areas 110 can be shortened, and control of the laser head 50 such as the moving direction and moving speed is facilitated.

  For example, when the laser beam 10 is irradiated while being stopped without moving in each unit processing area 110, heat may be accumulated in the unit processing area 110, and the shape of the processed product 110a may be deformed by the accumulated heat. And burrs may be formed on the periphery of the processed product 110a. And when there are many hundreds of unit processing area 110, it takes a long time to process several hundred unit processing area 110 altogether.

  However, as in the present invention, if the laser beam 10 is irradiated to the plurality of unit processing areas 110 while moving the irradiation position of the laser beam 10 along each guideline 11, the laser beam on the object 100 to be processed Since the position to which 10 is irradiated continues to change, accumulation of heat in the unit processing area 110 can be prevented, and accordingly, thermal deformation and formation of burrs can be prevented. In addition, since it is only necessary to adjust the number of scans (or the number of repetitions) moving along each guideline 11 without waiting for completion of processing in each unit processing area 110, processing of a plurality of unit processing areas 110 is performed. The time required for scanning can be shortened, and the scanning distance for scanning a plurality of unit processing areas 110 can also be shortened.

  On the other hand, if the laser beam 10 is irradiated to a plurality of unit processing areas 110 while moving the laser head 50 in an arbitrary direction, the moving direction of the laser head 50 may be rapidly changed. Because the rate of change in the second axial direction 22 and the rate of change in the second axial direction 22 are not constant, the control of the movement of the laser head 50 is not only easy, but the processing error for the unit processing area 110 is It may happen. However, in the case where the laser beams 10 are irradiated to the plurality of unit processing areas 110 while moving the laser head 50 along the respective guidelines 11, the moving direction of the laser head 50 is a constant pattern (or sequentially ) Since the change rate in the first axial direction 21 and the change rate in the second axial direction 22 become constant, control of the movement of the laser head 50 becomes easy.

  In the process of irradiating the plurality of unit processing areas 110 with the laser beam 10 (S130), the size of the laser beam 10 may be changed by adjusting the height of the laser head 50. The laser head 50 may emit the laser beam 10, and the height (or the position in the z-axis direction) may be adjusted to change the size of the laser beam 10. For example, if the laser beam 10 is a focused beam, the size of the laser beam 10 may be reduced if the height of the laser head 50 decreases (or if the laser head approaches the object to be processed). When the height of the laser head 50 becomes high (or when the laser head moves away from the object to be processed), the size of the laser beam 10 decreases. Alternatively, if the beam is a beam such as LED light which is not focused, as shown in FIG. 3B, the height of the laser head 50 is lowered (or the laser head is the object to be processed) When the size of the laser beam 10 decreases and the height of the laser head 50 increases (or when the laser head moves away from the object to be The size increases.

  In order to process the plurality of unit processing areas 110 uniformly over the entire area of the workpiece 100, each unit processing area 110 must be processed with the laser beam 10 of the same energy. At this time, if the size of the laser beam 10 is changed by adjusting the height of the laser head 50, it is possible to obtain the laser beam 10 whose energy is the same but only the size is changed. Accordingly, the plurality of unit processing areas 110 can be processed with the laser beam 10 of the same energy, and the unit processing areas 110 can be processed to the same depth, and the number of irradiation times of the plurality of unit processing areas 110 is You can do the same. Through this, it is possible to process a plurality of unit processed areas 110 with the same energy and the number of irradiations, and to form a uniform processed product 110 a over the entire area of the workpiece 100.

  In the process (S130) of irradiating the plurality of unit processing areas 110 with the laser beam 10, the three-dimensional coordinate values of the laser head 50 are sequentially changed to move the irradiation position of the laser beam 10, The size may be changed. At this time, the value of the first axial direction 21 (for example, the x-axis value), the value of the second axial direction 22 (for example, the y-axis value), and the value of the height direction 23 (for example, the z-axis value) It can be set to dimension coordinate values.

  Conventionally, in laser processing, the shape is processed on a straight line by controlling the x-axis and y-axis (that is, two-dimensional) linearly, and processing in the direction of the straight line is performed. It was not possible to compensate for changes in the shape and position of the work piece during pulling in the axial direction 21. That is, in the conventional case, in the state of the mask stick subjected to the laser processing, it is possible to satisfy the standards or specifications such as positional accuracy, size and shape, but when pulling the mask stick in the first axial direction 21 It expands in the pulling direction and contracts in the direction perpendicular to the pulling direction, making it impossible to meet the specifications or specifications of the machined hole.

  However, in the present invention, it is not only possible to sequentially change the three-dimensional coordinate values of the laser head 50 and process in the curved direction along the guide line 11, but also to position the laser head 50 in the height direction (or z The size of the laser beam 10 can be changed while maintaining a constant energy according to the size of each unit processing area 110. Along with this, when the workpiece 100 is pulled in the first axial direction 21 such as pulling the mask stick and fixing it to the frame, it is possible to secure the desired shape and positional accuracy of the workpiece 110a.

  In the process (S130) of irradiating the plurality of unit processing areas 110 with the laser beam 10, the laser head 50 may be moved at a constant speed in each of the guidelines 11. In order to obtain a pattern of constant quality in a plurality of unit machining areas 110 of each guideline 11, it is necessary to machine the unit machining area 110 at a constant speed for each guideline 11. At this time, while setting three-dimensional coordinate values, the velocity values in each direction (that is, the first axial direction, the second axial direction, and the height direction) are also set, and along the respective guidelines 11. The laser head 50 may be moved at a constant speed, and the size of the laser beam 10 may be simultaneously adjusted while moving the respective guidelines 11 at a constant speed through the three-dimensional movement of the laser head 50. Along with this, it is possible to obtain a pattern of constant quality in a plurality of unit processing areas 110 of each guideline 11.

  For example, the laser head 50 may be moved using a numerical control (NC) method. Here, nano scale may be applied to the numerical control (NC) method. In the numerical control (NC) method, linear movement in each direction may be substantially equivalent to curvilinear movement as a minute unit. More specifically, unit processing with the laser beam 10 is carried out while determining the loci of the x, y and z axes at the time of curvilinear movement, and at the same time making the laser head 50 move three axes (or in three axes). The area may be processed. Since data of three-dimensional coordinates can be calculated in advance using the guide line 11, if these position coordinates are converted to G-Code and a numerical control (NC) device is used, the shape of the processed product 110a can be more easily Precise control for compensation of changes in Here, G-Code is a programming language or standard format used for numerical control (NC), and may input three-dimensional coordinates of x, y, z and velocity of each axis, Accordingly, the laser head 50 may be moved at a constant speed in the respective guidelines 11 through the input of the speed of each axis.

  On the other hand, the velocity in the first axial direction 21 (for example, the velocity in the x-axis direction) may be the same in all the guidelines 11, and the velocity in the second axial direction 22 according to the bending ratio of each guideline 11 (For example, the velocity in the y-axis direction) may increase as the bending ratio increases. For example, the moving speed of the laser head 50 may be adjusted so that the sum vector (or combined speed) of the speed in the x-axis direction and the speed in the y-axis direction is constant in each guideline 11. At this time, the movement in the z-axis direction is relatively small compared to the movement in the x-axis direction and the movement in the y-axis direction. However, since it is necessary to change the size of the laser beam 10 in accordance with the plurality of unit processing areas 110 which increase and decrease at a constant ratio according to the bending rate of each guideline 11, the speed in the x-axis direction in each guideline 11; It is preferable to adjust the moving speed of the laser head 50 so that the sum vector of the velocity in the y-axis direction and the velocity in the z-axis direction becomes constant.

  Then, with the time when the laser head 50 passes (or scans) each of the guidelines 11, a pattern of constant quality may be obtained in all of the plurality of unit processing areas 110.

  In the step of setting the plurality of unit processing areas 110 (S120), the unit processing area 110 at the central portion may be set to be larger than the unit processing areas 110 at both ends in each guideline 11. Since the tensile force received when the workpiece 100 is pulled differs depending on the position of the unit processing area 110, the size of the unit processing area 110 may be determined according to the tensile force acting on each position. The expansion force in the first axial direction 21 of the to-be-processed object 100 in response to the tension of the to-be-processed object 100 in the first axial direction 21 is the to-be-processed object 100 from both ends in the first axial direction 21. It works to the central part of the first axial direction 21 of the processing object 100. As a result, the both ends of the workpiece 100 in the first axial direction 21 become maximum, and the center of the workpiece 100 in the first axial direction 21 becomes minimum. Accordingly, it is possible to set the unit processing area 110 at the central portion of the relatively expanding guide line 11 to be larger than the unit processing areas 110 at both ends of the relatively expanding guide line 11. Further, at the central portion in the first axial direction 21 of the object 100 to be processed, the contraction force in the second axial direction 22 of the object 100 to be processed is in the first axial direction 21 of the object 100 to be processed. It will work more than at both ends. This is one reason (or factor) to set the unit processing area 110 at the central portion to be larger than the unit processing areas 110 at both ends in each guideline 11.

  In the process of setting the plurality of unit machining areas 110 (S120), the unit machining area 110 located at the center of each guideline 11 is moved away from the center line of the first axial direction 21 of the workpiece 100 It may be set to be large. The contraction force in the second axial direction 22 of the object to be processed 100 in response to the tension in the first axial direction 21 of the object 100 to be processed is the above-mentioned from both sides in the second axial direction 22 of the object 100 to be processed. It works to the center line of the first axial direction 21 of the workpiece 100. As a result, it becomes maximum at both sides in the second axial direction 22 of the object 100 to be processed about the center line of the object 100 to be processed 100 in the first axial direction 21, and the first object of the object 100 to be processed is It is minimum at the center line of the axial direction 21. Accordingly, the first processing target object 100 shrinks relatively less in the unit processing area 110 of the guide line 11 located on both sides in the second axial direction 22 of the processing target object 100 which shrinks relatively more. It can be set larger than the unit processing area 110 of the guide line 11 located near (or next to) the center line of the axial direction 21 of. Therefore, the unit processing area 110 located at the central portion of each of the guidelines 11 can also be set to be larger as it goes away from the center line in the first axial direction 21 of the object 100 to be processed.

  In the process of setting the plurality of unit machining areas 110 (S120), the unit machining area 110 located at the center of each guideline 11 is moved away from the center line of the first axial direction 21 of the workpiece 100 It may be set to increase at a fixed ratio, and the fixed ratio may be determined according to the deformation rate of the workpiece 100.

  Since the tensile force received when the workpiece 100 is pulled differs depending on the position of the unit processing area 110, the size of the unit processing area 110 may be determined according to the tensile force acting on each position. At this time, a tensile force acting on both ends in the first axial direction 21 of the workpiece 100 generates a compressive stress on both sides in the second axial direction 22 in the central portion of the workpiece 100. , And the unit processing area 110 shrinks. For this reason, the unit processing area 110 located in the central part of each of the guidelines 11 can be set so as to increase at a constant ratio as it goes away from the center line of the first axial direction 21 of the object 100 to be processed. Through this, the plurality of processed products 110a can be corrected (or compensated) to a predetermined size when the workpiece 100 is pulled in the first axial direction 21.

  The constant ratio may be determined in accordance with the deformation rate of the workpiece 100 and the tensile force acting on both ends of the first axial direction 21 of the workpiece 100. At this time, the size of the unit processing area 110 at each position may be calculated according to the deformation rate of the workpiece 100 and the tensile force acting on both ends of the workpiece 100 in the first axial direction 21.

  In the workpiece 100, compressive stress is generated on both sides in the second axial direction 22 of the central portion of the workpiece 100 by the tensile force acting on both ends in the first axial direction 21 of the workpiece 100. It will contract with this. At this time, the degree of contraction differs depending on the magnitude of the tensile force acting on both ends in the first axial direction 21 of the workpiece 100. The pattern shapes of the plurality of processed products 110 a actually desired when the workpiece 100 is pulled in the first axial direction 21 are the guide lines 11 located on both sides of the second axial direction 22 of the workpiece 100. And, the processing formations 110a arranged along this are contracted to be horizontal in accordance with the tensile force acting on both ends in the first axial direction 21 of the object 100 to be processed. Accordingly, the object to be processed is from both sides in the second axial direction 22 of the central portion of the object to be processed 100 according to the magnitude of the tensile force acting on both ends of the object to be processed 100 in the first axial direction 21. The amount (or contraction force) of contraction (or contraction force) of the object 100 to the center line in the first axial direction 21 is calculated (or measured), and the shape of the unit processing area 110 (the size) Alternatively, the size can be corrected (or compensated) (i.e. the shape of the work piece).

  In this case, the guide lines 11 located on both sides in the second axial direction 22 of the object 100 to be processed are curved, and in each of the guide lines 11, the unit processing area 110 at the central portion is more than the unit processing areas 110 at both ends. The size of the unit processing area 110 located at the center of each of the guidelines 11 increases as the distance from the center line of the first axial direction 21 of the workpiece 100 increases. At this time, calculate the bending ratio (or bending radius) of the guideline 11 by the distance between the straight line connecting the both ends of the guideline 11 (that is, the chord) and the center of the guideline 11 and the length of the straight line connecting both ends of the guideline 11 Alternatively, the shape (or size) of the unit processing area 110 for each position may be determined by applying a shrinkage amount for each position on each of the guide lines 11 in accordance with the stiffness.

  Then, the amount of contraction (or the acting tension) at each position is different according to the deformation rate of the workpiece 100 determined by the stiffness or the like, so the above constant value reflecting the deformation rate of the workpiece 100 The ratio of may be determined. The thickness of the object to be processed 100, the material of the object to be processed 100, the size of the pattern formed by the plurality of unit processing areas 110, and the size that the processing formed object 110a should have when the object to be processed 100 is pulled. At least one or more elements of them may be reflected.

  In the step of setting the plurality of unit processing areas 110 (S120), the unit processing areas 110 located at both ends of the plurality of guide lines 11 may be set to a predetermined size. At this time, the length of a straight line connecting both ends of the guide line 11 may be the same for the plurality of guide lines 11, and the distance between the straight lines connecting the both ends of the guide line 11 may be constant. That is, the unit processing regions 110 located at both ends of the plurality of guide lines 11 may be arranged on the same line at predetermined intervals in the second axial direction 22 of the workpiece 100.

  Since parallel tensile forces act on both ends in the first axial direction 21 of the object 100 to be processed, positions on both ends of the plurality of guide lines 11 when the object 100 to be processed is pulled in the first axial direction 21 The processed product 110a may have the same change in position. In addition, since the distance between both ends in the first axial direction 21 of the object to be processed 100 is the same, the expansion force in the first axial direction 21 of the object to be processed 100 may be the same. Since it is not the central portion of the processing target 100, the contraction force on both sides in the second axial direction 22 of the processing target 100 may be almost zero. Thereby, the unit process area | region 110 located in the both ends of the several guideline 11 can be set as a fixed magnitude | size. Along with this, when the workpiece 100 is pulled in the first axial direction 21, the size of the processed product 110 a is the same, and it is possible to obtain a pattern of fixed size and spacing.

  Thus, in the present invention, a plurality of guidelines 11 having a bending rate calculated according to the deformation rate of the workpiece 100 and the tensile force acting on the workpiece 100 on the workpiece 100. The plurality of unit processing areas 110 may be set to the compensation position of the change in position due to pulling. Further, the size of each unit processing area 110 is determined by calculating the change in processing shape according to the position of the unit processing area 110 through the deformation rate of the processing object 100 and the tensile force acting on the processing object 100 May be Along with this, it is possible to compensate for the change in the position of the processed product 110a and the change in the processed shape when the workpiece 100 is pulled.

  FIG. 4 is a view showing a mask assembly manufactured by the method of manufacturing a mask assembly according to another embodiment of the present invention.

  A method of manufacturing a mask assembly according to another embodiment of the present invention will be described in more detail with reference to FIG. 4, but overlapping with the portion described above in connection with the laser processing method according to an embodiment of the present invention. Matters will be omitted.

  In the method of manufacturing a mask assembly according to another embodiment of the present invention, the object to be processed 100 is processed by the laser processing method according to an embodiment of the present invention, and the plurality of unit processing areas 110 are processed. Preparing a mask stick 210 in which a plurality of processing holes 211 are formed (S210), and pulling and fixing the mask stick 210 in the first axial direction 21 to a frame 220 having an opening (S220) , May be included.

  First, the workpiece 100 is processed by the laser processing method according to one embodiment of the present invention, and the mask stick 210 in which a plurality of processing holes 211 are formed according to the plurality of unit processing areas 110 is prepared (S210 ). The mask stick 210 may be prepared by processing the object to be processed 100 by the laser processing method according to an embodiment of the present invention. At this time, a plurality of processing holes 211 may be formed according to a plurality of unit processing areas 110, and even if a plurality of processing formations 110a obtained by processing a plurality of unit processing areas 110 are a plurality of processing holes 211. Good. Before the mask stick 210 is pulled to be fixed to the frame 220, a plurality of processing holes 211 are spaced apart along a plurality of guidelines 11 including a curve to form a pattern. You may Note that the width of the pattern in the direction (that is, the second axial direction) perpendicular to the first axial direction 21 of the pattern corresponds to the first shape of the pattern according to the form (or shape) of the plurality of guidelines 11. It may be wider as it proceeds from the both ends in the axial direction 21 toward the center.

  The mask assembly 200 may be configured by assembling a plurality of mask sticks 210, may be configured by at least two or more mask sticks 210, and four mask sticks 210 are shown in FIG. However, this is only one embodiment, and the present invention is not limited to this.

  The mask stick 210 may be a thin rectangular plate, and a plurality of processed holes 211 may be formed at predetermined intervals along the first axial direction 21. A blocking area may be formed around the pattern formed by. Further, as shown in FIG. 4, the shape of the pattern formed by the plurality of processing holes 211 and the shape of the plurality of processing holes 211 are different before and after the mask stick 210 is fixed to the frame 220. A detailed description of will be given later.

  For example, the mask stick 210 may be a thin magnetic sheet, but may be made of nickel or a nickel alloy, which can easily form a fine pattern and has a very good surface roughness. It may be formed of an alloy of

  Next, the mask stick 210 is pulled and fixed to the frame 220 having the opening in the first axial direction 21 (or in the longitudinal direction extending in the first axial direction) (S220). The frame 220 may have an opening, and may be formed of an elastic material, but is not limited thereto. Further, since the frame 220 supports the mask stick 210 in a tensioned state, the frame 30 may have sufficient rigidity so that the mask stick 210 can be stably supported. In addition, as long as the flame | frame 220 is a structure which does not produce interference in the case of adhesion with a vapor deposition thing and the mask assembly 200, what kind of thing is employable.

  The mask stick 210 fixes both ends of the mask stick 210 in the first axial direction 21 to the frame 220 in a state where a predetermined tensile force is applied in the first axial direction 21 (or in the longitudinal direction). It is also good. At this time, the plurality of processing holes 211 of the mask stick 210 may be located inside the opening of the frame 220. Here, as a fixing method, various methods such as laser welding and resistance heating welding may be applied, but a laser welding method may be used in consideration of a change in accuracy and the like. The mask sticks 210 may be aligned and welded such that they form a predetermined gap.

  According to the embodiment of the present invention, the shape of the pattern formed by the plurality of processing holes 211 and the shape of the plurality of processing holes 211 are different before and after each mask stick 210 is fixed to the frame 220.

  FIG. 5 is a conceptual view for explaining the correction of the shape of the processed hole by pulling of the mask stick according to another embodiment of the present invention, and FIG. 5 (a) shows the mask stick before pulling. 5 (b) shows the mask stick after pulling.

  Referring to FIG. 5, in the process of pulling and fixing the mask stick 210 in the first axial direction 21 (S 220), both ends of each of the guidelines 11 are parallel to both sides of the mask stick 210 in the first axial direction 21. Pulling force may work.

  Generally, an integral mask, when secured to the frame, pulls the mask in all directions to secure it to the frame. However, as in the embodiment of the present invention, the mask assembly 200 configured with a plurality of mask sticks 210 pulls each divided mask stick 210 only in the first axial direction 21 of the mask stick 210 to the frame 220. It may be fixed to In this case, the mask stick 210 is contracted in the direction (that is, the second axial direction) perpendicular to the tensile direction by the tensile force generated in the tensile direction (that is, the first axial direction) of the mask stick 210. .

  Here, if the same tensile force does not act on both ends of each guideline 11, the curve does not extend linearly, so the same tensile force acts on both ends of each guideline 11 from both sides in the first axial direction 21 of the mask stick 210. May be Through this, a plurality of processing holes 211 arranged in a curved line on the curved guide line 11 can be arranged in a line (or in a straight line) when the mask stick 210 is pulled in the first axial direction 21. It should be noted that if a tensile force parallel to the first axial direction 21 of the mask stick 210 does not act on both ends of the plurality of guide lines 11, the plurality of machined holes 211 is drawn when the mask stick 210 is pulled in the first axial direction 21 It will not be arranged in parallel (or side by side).

  At this time, the ratio of the deformation ratio of the mask stick 210 in the longitudinal direction (or the vertical direction) to the deformation ratio of the mask stick 210 in the pulling direction, that is, Poisson's ratio (Poisson ratio) The shape, size, position, etc. of the material or the plurality of processing holes 211 may be determined.

  The mask stick 210 shown in FIG. 5A shows an example of compensation designed in consideration of all the factors that affect the Poisson's ratio described above.

  In the process of pulling and fixing the mask stick 210 in the first axial direction 21 (S220), the plurality of processing holes 211 may be linearly arranged (or arranged in a grid) in a two-dimensional manner, The size of the processing hole 211 may be constant. Here, the term " constant " is used not only to cover the same thing, but also to cover substantially the same things within a predetermined tolerance. Referring to FIG. 5B, the pattern formed by the plurality of processing holes 211 has a first axis after both ends are pulled in the first axial direction 21 of the mask stick 210 and fixed to the frame 220. The width in the direction perpendicular to the direction 21 (or the second axial direction) may be substantially equal. That is, the plurality of machining holes 211 may be linearly arranged two-dimensionally, the sizes of the plurality of machining holes 211 may be fixed, and all the intervals and arrangement may be uniform. Along with this, the organic matter deposited through the aligned plurality of processing holes 211 can also be deposited without error at a desired position.

  As described above, in the present invention, a plurality of guidelines including a curve are set on the plate-like object along the first axial direction of the object to be processed, according to the plurality of guidelines. By processing the plurality of unit processing areas whose positions are guided, it is possible to compensate for the change in the processing shape and the change in the position when the workpiece is pulled. That is, a plurality of guidelines having a bending rate calculated according to the deformation rate of the object to be processed is provided on the object to be processed, and a unit processing area is set at a compensation position of a change in position due to tension. Can. In addition, since the size of each unit processing area can be determined by calculating the change in processing shape according to the position of the unit processing area through the deformation rate of the processing object, the position at the time of pulling the processing object And changes in the machined shape can be compensated. For this reason, when forming the mask stick in which the processing hole is formed by processing the object to be processed, when the mask stick is pulled and fixed to the frame, the positional difference, size difference and shape difference of the processing hole It can be corrected to meet standards or specifications such as positional accuracy, size and shape of each processing hole. Furthermore, while moving the irradiation position of the laser beam along each guideline, it is possible to process a plurality of unit machining areas and process a plurality of unit machining areas at a constant speed for each guideline. Along with this, it is possible to obtain a processed product of constant quality for each unit processing area. In addition, by adjusting the height of the laser head and adjusting the size of the laser beam according to the change in the size of the unit processing area, a plurality of unit processing areas having different sizes depending on the position have a constant energy It can be irradiated with a laser beam. Accordingly, the object to be processed can be processed with a certain number of repetitions, and uniform processing can be performed over the entire region of the object to be processed.

  The term "on" as used in the above description covers the case of direct contact and the case where it is not directly contact but is positioned opposite the upper or lower part, either in the upper surface or It can be positioned opposite to the entire lower surface, or can be partially opposed, in the sense of facing away in position, or directly contacting the upper surface or the lower surface. It was used. Therefore, “on the object to be processed” may be the surface (upper surface or lower surface) of the object to be processed, or may be the surface of a film deposited on the surface of the object to be processed .

  The preferred embodiments of the present invention have been illustrated and described above, but the present invention is not limited to the above-described embodiments in any way, and does not deviate from the scope of the present invention claimed in the claims. It should be understood by those skilled in the art to which the present invention belongs that various modifications can be made therefrom and equivalent other embodiments can be adopted. Accordingly, the technical protection scope of the present invention should be defined by the following claims.

10: Laser beam 11: Guideline 21: first axial direction 22: second axial direction 23: height direction (z-axis direction)
50: laser head 100: workpiece 110: unit machining area 110a: machined product 200: mask assembly 210: mask stick 211: machined hole 220: frame

Claims (15)

Setting a plurality of guidelines including a curve along a first axial direction of the object to be processed on a plate-like object to be processed;
Setting a plurality of unit processing areas spaced apart from each other along the plurality of guidelines on the object to be processed;
Irradiating the plurality of unit processing areas with the laser beam while moving the irradiation position of the laser beam;
Laser processing method including:   The laser processing method according to claim 1, wherein two adjacent ones of the plurality of guidelines have different bending rates.   The guideline which is a curve among the plurality of guidelines forms an arc on the side away from the first axial center line of the object to be processed, and the first object of the object to be processed is formed. The laser processing method according to claim 1, wherein the bending ratio becomes higher as moving away from the axial center line.   In the process of irradiating the plurality of unit processing areas with the laser beam, the plurality of unit processing areas are irradiated with the laser beam while moving the laser head from which the laser beam is emitted separately for each of the guidelines. The laser processing method as described in.   The laser processing method according to claim 4, wherein the laser head is moved at a constant speed in each of the guidelines in the process of irradiating the plurality of unit processing areas with the laser beam.   In the process of irradiating the plurality of unit processing areas with the laser beam, while changing the size of the laser beam corresponding to the size of each unit processing area, the laser beam The laser processing method according to claim 1, wherein the irradiation position is moved.   7. The laser processing method according to claim 6, wherein the size of the laser beam is changed by adjusting the height of the laser head in the process of irradiating the plurality of unit processing regions with the laser beam.   In the process of irradiating the plurality of unit processing areas with the laser beam, the size of the laser beam is changed while sequentially changing the three-dimensional coordinate value of the laser head to move the irradiation position of the laser beam. The laser processing method according to claim 7.   2. The laser processing method according to claim 1, wherein in the process of setting the plurality of unit processing areas, the unit processing area at the central portion of each of the guidelines is set larger than the unit processing areas at both ends.   In the process of setting the plurality of unit machining areas, the unit machining area located at the central portion of each of the guidelines is set to be larger as it goes away from the first axial center line of the object to be machined. The laser processing method according to Item 1. In the process of setting the plurality of unit machining areas, the unit machining area located at the central portion of each of the guidelines is increased at a constant ratio as it goes away from the first axial center line of the workpiece Set to
The laser processing method according to claim 10, wherein the constant ratio is determined according to a deformation rate of the object to be processed.   The laser processing method according to claim 1, wherein in the process of setting the plurality of unit processing areas, the unit processing areas located at both ends of the plurality of guidelines are set to a predetermined size. A mask stick provided with a plurality of processing holes formed according to the plurality of unit processing areas by processing the object to be processed by the laser processing method according to any one of claims 1 to 12. And the process of
Pulling and fixing the mask stick in the first axial direction to a frame having an opening;
A method of manufacturing a mask assembly comprising:   The process according to claim 13, wherein in the process of pulling and fixing the mask stick in the first axial direction, parallel tensile forces act on both sides of the mask stick in the first axial direction at both ends of each of the guidelines. Method of manufacturing a mask assembly   14. The process according to claim 13, wherein in the process of pulling and fixing the mask stick in the first axial direction, the plurality of machined holes are two-dimensionally linearly arranged, and the size of the plurality of machined holes becomes constant. Method of manufacturing a mask assembly.