JP2022088386A - Processing system and processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing system that is able to perform an additional processing in an appropriate position.

SOLUTION: A processing system includes: a support device capable of supporting an object to be processed; a processing device that performs additional processing by emitting an energy beam to a region to be processed on the object to be processed and by supplying a material to the region to which the energy beam is emitted; and a position changing device that changes a positional relation between the support device and an emission region of the energy beam from the processing device. A reference shaped object is formed by performing the additional processing on at least one of a first region, which is part of the support device, and a second region, which is part of the object to be processed; and at least one of the processing device and the position changing device is controlled using information about the reference shaped object.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to, for example, a technical field of a processing system and a processing method for performing additional processing on an object to be processed.

Patent Document 1 describes a processing system in which a powdery material is melted by an energy beam and then additional processing is performed by resolidifying the melted material. In such a processing system, it is a technical problem to perform additional processing at an appropriate position.

U.S. Patent Application Publication No. 2017/014909

According to the first aspect, a support device capable of supporting an object to be machined and a region to be machined on the object to be machined are irradiated with an energy beam, and a material is supplied to and added to the region to which the energy beam is irradiated. A first region that is a part of the support device and a position change device that changes the positional relationship between the support device and the irradiation region of the energy beam from the support device. A reference model is formed by performing additional processing on at least one of the second regions that are a part of the object to be machined, and at least one of the processing device and the position changing device is controlled by using the information about the reference model. Processing system is provided.

According to the second aspect, it is a processing method of irradiating an energy beam from a processing device to perform additional processing on a processing object, in which the processing object is supported by a support device and among the support devices. Forming a reference model by performing additional processing on at least one of a first region that is a part and a second region that is a part of the object to be processed, measuring the reference model, and measuring the measurement. A processing method including changing the positional relationship between the support device and the irradiation region of the energy beam from the processing device is provided based on the information regarding the reference modeled object.

The actions and other gains of the present invention will be apparent from the embodiments described below.

FIG. 1 is a cross-sectional view showing the structure of the modeling system of the present embodiment. FIG. 2 is a top view and a side view showing the upper surface 131 of the stage 13 and the side surfaces of the stage 13, respectively. 3 (a) to 3 (c) are cross-sectional views showing a state in which light is irradiated and a modeling material is supplied in a certain region on the work, respectively. Each of FIGS. 4 (a) to 4 (c) is a cross-sectional view showing a process of forming a three-dimensional structure. FIG. 5 is a flowchart showing the flow of the initial setting operation in the alignment operation. FIG. 6 is a flowchart showing the flow of the head moving operation in the alignment operation. FIG. 7 is a plan view showing the relationship between the position of the test mark in the stage coordinate system and the modeling start position, and the relationship between the modeling head position and the modeling start position in the head coordinate system. FIG. 8 is a flowchart showing a flow of a part of the head movement operation of the first modification. FIG. 9 is a flowchart showing the flow of another part of the head movement operation of the first modification. FIG. 10 is a flowchart showing the flow of another part of the head movement operation of the first modification. FIG. 11 is a plan view showing an example of the test mark used in the first modification. FIG. 12 is a plan view showing the relationship between the position of the test mark in the stage coordinate system and the modeling start position, and the relationship between the modeling head position and the modeling start position in the head coordinate system. FIG. 13A is a plan view showing a modeled object formed on the work when the work is not thermally expanded, and FIG. 13B is a plan view formed on the work when the work is thermally expanded. It is a top view which shows the modeled object. FIG. 14 is a cross-sectional view showing the structure of the modeling system of the third modification. FIG. 15 is a cross-sectional view showing the structure of the modeling system of the fourth modification.

Hereinafter, embodiments of a machining system and a machining method will be described with reference to the drawings. In the following, an embodiment of a processing system and a processing method will be used by using a modeling system 1 capable of forming a modeled object by performing additional processing using a modeling material M by a laser overlay welding method (LMD: Laser Metal Deposition). To explain. The laser overlay welding method (LMD) includes direct metal deposition, direct energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, and laser consolidation. , Shape Deposition Manufacturing, Wire-Feed Laser Deposition, Gas Through Wire, Laser Powder Fusion, Laser Metal Forming, Selective Laser Powder Remelting, Laser Direct It may also be referred to as casting, laser powder deposition, laser additive manufacturing, or laser rapid forming.

Further, in the following description, the positional relationship of various components constituting the modeling system 1 will be described using the XYZ Cartesian coordinate system defined from the X-axis, the Y-axis, and the Z-axis which are orthogonal to each other. In the following description, for convenience of explanation, each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction in the horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane). Yes, it is assumed that it is substantially in the vertical direction or the gravity direction). Further, the rotation directions (in other words, the inclination direction) around the X-axis, the Y-axis, and the Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Further, the XY plane may be horizontal.

(1) Overall Structure of the Modeling System 1 First, the overall structure of the modeling system 1 of the present embodiment will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view showing an example of the structure of the modeling system 1 of the present embodiment.

The modeling system 1 is a three-dimensional structure (that is, a three-dimensional object having a size in any of the three-dimensional directions, and a three-dimensional object, in other words, an object having a size in the X, Y, and Z directions. ) ST can be formed. The modeling system 1 can form the three-dimensional structure ST on the work W which is the basis (that is, the base material) for forming the three-dimensional structure ST. The modeling system 1 can form a three-dimensional structure ST by performing additional processing on the work W. When the work W is the stage 13 described later, the modeling system 1 can form the three-dimensional structure ST on the stage 13. When the work W is an existing structure held by the stage 13, the modeling system 1 can form the three-dimensional structure ST on the existing structure. In this case, the modeling system 1 may form a three-dimensional structure ST integrated with the existing structure. The operation of forming the three-dimensional structure ST integrated with the existing structure is equivalent to the operation of adding a new structure to the existing structure. Alternatively, the modeling system 1 may form a three-dimensional structure ST that can be separated from the existing structure. Note that FIG. 1 shows an example in which the work W is an existing structure held by the stage 13. Further, in the following, the description will be advanced by using an example in which the work W is an existing structure held by the stage 13.

As described above, the modeling system 1 can form a modeled object by a laser overlay welding method. That is, it can be said that the modeling system 1 is a 3D printer that forms an object by using the laminated modeling technique. The laminated modeling technique is also referred to as rapid prototyping, rapid manufacturing, or additive manufacturing.

The modeling system 1 processes the modeling material M with optical EL to form a modeled object. As such an optical LE, for example, at least one of infrared light, visible light, and ultraviolet light can be used, but other types of light may be used. The optical EL is a laser beam. Further, the modeling material M is a material that can be melted by irradiation with light EL having a predetermined intensity or higher. As such a modeling material M, for example, at least one of a metallic material and a resinous material can be used. However, as the modeling material M, other materials different from the metallic material and the resin material may be used. The modeling material M is a powdery or granular material. That is, the modeling material M is a powder or granular material. However, the modeling material M does not have to be a powder or granular material, and for example, a wire-shaped modeling material or a gas-like modeling material may be used. The modeling system 1 may process the modeling material M with an energy beam such as a charged particle beam to form a modeled object.

In order to process the modeling material M, the modeling device 4 includes a modeling head 11, a head drive system 12, a stage 13, a measuring device 14, and a control device 15. Further, the modeling head 11 includes an irradiation system 111 and a material nozzle (that is, a supply system for supplying the modeling material M) 112.

The irradiation system 111 is an optical system (for example, a condensing optical system) for emitting light EL from the injection unit 113. Specifically, the irradiation system 111 is optically connected to a light source (not shown) that emits an optical EL via an optical transmission member (not shown) such as an optical fiber. The irradiation system 111 emits optical EL propagating from the light source via the optical transmission member. The irradiation system 111 irradiates the optical EL downward (that is, the −Z side) from the irradiation system 111. A stage 13 is arranged below the irradiation system 111. When the work W is mounted on the stage 13, the irradiation system 111 can irradiate the work W with light EL. Specifically, the irradiation system 111 irradiates the irradiation area EA having a predetermined shape set on the work W as the area where the light EL is irradiated (typically, the light is focused). Further, the state of the irradiation system 111 can be switched between a state in which the irradiation region EA is irradiated with the light EL and a state in which the irradiation region EA is not irradiated with the light EL under the control of the control device 15. The direction of the light EL emitted from the irradiation system 111 is not limited to the direction directly below (that is, the direction corresponding to the Z axis), and may be, for example, a direction tilted by a predetermined angle with respect to the Z axis. ..

The material nozzle 112 has a supply outlet (that is, a supply port) 114 for supplying the modeling material M. The material nozzle 112 supplies the modeling material M from the supply outlet 114 (specifically, injection, ejection or injection). The material nozzle 112 is physically connected to a material supply device (not shown), which is a supply source of the modeling material M, via a powder transmission member such as a pipe (not shown). The material nozzle 112 supplies the modeling material M supplied from the material supply device via the powder transmission member. Although the material nozzle 112 is drawn in the shape of a tube in FIG. 1, the shape of the material nozzle 112 is not limited to this shape. The material nozzle 112 supplies the modeling material M downward (that is, the −Z side) from the material nozzle 112. A stage 13 is arranged below the material nozzle 112. When the work W is mounted on the stage 13, the material nozzle 112 supplies the modeling material M toward the work W. The traveling direction of the modeling material M supplied from the material nozzle 112 is a direction tilted by a predetermined angle (an acute angle as an example) with respect to the Z axis, but is directly below (that is, a direction corresponding to the Z axis). You may. In addition, a plurality of material nozzles 112 may be provided.

In the present embodiment, the material nozzle 112 is aligned with the irradiation system 111 so that the irradiation system 111 supplies the modeling material M toward the irradiation region EA on which the light EL is irradiated. That is, the material nozzle 112 and the irradiation region 112 are irradiated so that the supply region MA set on the work W as the region for supplying the modeling material M and the irradiation region EA coincide with each other (or at least partially overlap). It is aligned with the system 111. The material nozzle 112 may be aligned so as to supply the modeling material M to the molten pool MP formed in the work W by the optical EL emitted from the irradiation system 111. Further, the supply region MA to which the material nozzle 112 supplies the modeling material M and the region of the molten pool MP may be aligned so as to partially overlap each other.

The head drive system 12 moves the modeling head 11. The head drive system 12 moves the modeling head 11 along the X-axis, the Y-axis, and the Z-axis, respectively. The head drive system 12 may move the modeling head 11 along at least one of the θX direction, the θY direction, and the θZ direction in addition to each of the X axis, the Y axis, and the Z axis. The head drive system 12 includes, for example, a motor and the like. When the head drive system 12 moves the modeling head 11, the irradiation region EA also moves with respect to the work W on the work W. Therefore, the head drive system 12 can change the positional relationship between the work W and the irradiation region EA (in other words, the positional relationship between the stage 13 holding the work W and the irradiation region EA) by moving the modeling head 11. Is. Further, the head drive system 12 can change the positional relationship between the work W and the supply area MA (in other words, the positional relationship between the stage 13 holding the work W and the supply area MA) by moving the modeling head 11. Is.

The head drive system 12 may move the irradiation system 111 and the material nozzle 112 separately. Specifically, for example, the head drive system 12 may be able to adjust at least one of the position of the injection unit 113, the orientation of the injection unit 113, the position of the supply outlet 114, and the orientation of the supply outlet 114. In this case, the irradiation region EA where the irradiation optical system 111 irradiates the light EL and the supply region MA where the material nozzle 112 supplies the modeling material M can be controlled separately.

The stage 13 can hold the work W. The stage 13 can further release the held work W. The irradiation system 111 described above irradiates the optical EL at least a part of the period in which the stage 13 holds the work W. Further, the material nozzle 112 described above supplies the modeling material M for at least a part of the period in which the stage 13 holds the work W. A part of the modeling material M supplied by the material nozzle 112 may be scattered or spilled from the surface of the work W to the outside of the work W (for example, around the stage 13). Therefore, the modeling system 1 may be provided with a recovery device for recovering the scattered or spilled modeling material M around the stage 13.

The stage 13 is provided with an upper surface (+ Z side surface in the example shown in FIG. 1) 131 that can face the modeling head 11 in order to hold the work W. The upper surface 131 includes a holding region 132 and a non-holding region 133, as shown in FIG. 2, which includes a plan view showing the upper surface 131 of the stage 13 and a side view showing the side surface of the stage 13. The holding region 132 is a part of the upper surface 131. The holding region 132 may be the entire upper surface 131. The holding region 132 is a region (for example, a surface) capable of holding the work W. The holding region 132 may be referred to as a holding surface or a supporting surface. The holding area 132 is an area set on the upper surface 131 for holding the work W. The holding region 132 may hold the work W by using at least one of a mechanical chuck, a vacuum suction chuck, an electromagnetic suction chuck, an electrostatic suction chuck, and the like. The holding region 132 is a rectangular region in a plan view, but may be a region having another shape. The non-holding region 133 is a part of the upper surface 131. The non-holding region 133 is a region (for example, a surface) that does not hold the work W. The non-holding region 133 is a region different from the holding region 132. The non-holding region 133 is a rectangular frame-shaped region in a plan view, but may be a region having another shape. The non-holding region 133 may be located at the same height as the holding region 132 (that is, a position along the Z axis), or may be arranged at a different height.

A plurality of mark areas 134 are set in the non-holding area 133. In the example shown in FIG. 2, three mark areas 134 (specifically, mark area 134 # 1, mark area 134 # 2, and mark area 134 # 3) are set in the non-holding area 133. The plurality of mark areas 134 are set at predetermined positions in the non-holding area 133. The plurality of mark regions 134 are discretely distributed on the upper surface 131. The plurality of mark regions 134 are evenly distributed on the upper surface 131. The plurality of mark areas 134 are distributed so as to surround the holding area 132. The plurality of mark areas 134 are distributed on the upper surface 131 so that the holding area 132 is located between at least two mark areas 134. It should be noted that at least a part of the holding region 132 may be located in a region surrounded by a plurality of line segments connecting two mark regions out of at least three mark regions 134. In the example shown in FIG. 2, the mark area 134 # 1 is arranged on the −Y side and + X side of the holding area 132, the mark area 134 # 2 is arranged on the −X side of the holding area 132, and the mark area is located. 134 # 3 is arranged on the + Y side and the + X side of the holding area 132. However, the distribution mode of the plurality of mark regions 134 is not limited to the above-mentioned distribution mode.

At least one of the plurality of mark areas 134 may be located on the same plane as the non-holding area 133. That is, the height of at least one of the plurality of mark areas 134 may be the same as the height of the non-holding area 133. Further, at least one of the plurality of mark areas 134 may be located on the same plane as the holding area 132. At least one of the plurality of mark areas 134 may be located on a plane different from the non-holding area 133. That is, the height of at least one of the plurality of marked areas 134 may be different from the height of the non-holding area 133. Further, the height of at least one of the plurality of mark areas 134 may be different from the height of the holding area 132. At least one of the plurality of mark areas 134 may be located on a plane different from at least one of the plurality of mark areas 134. That is, the height of at least one of the plurality of mark areas 134 may be different from the height of at least the other one of the plurality of mark areas 134. In the example shown in FIG. 2, each of the mark areas 134 # 1 and 134 # 2 is located on the same plane as the non-holding area 133, and the mark area 134 # 3 is on a different plane from the mark areas 134 # 1 and 134 # 2. An example of location is shown. In other words, in the example shown in FIG. 2, the mark regions 134 # 1 and 134 # 2 are located on the same plane as the holding region 132, and the mark regions 134 # 3 are located on a different plane from the holding region 132. Shows.

Each of the plurality of mark areas 134 is used for the alignment operation for aligning the work W and the modeling head 11. The details of the alignment operation will be described in detail later, but here, the outline thereof will be briefly described. When the alignment operation is performed, the mark member FM is arranged in each of the plurality of mark areas 134. Each of the plurality of mark areas 134 holds the mark member FM. After that, the modeling system 1 forms a test mark TM corresponding to a three-dimensional object on the mark member FM by performing additional processing on the mark member FM. After that, the modeling system 1 measures the state of the formed test mark TM by using the measuring device 14. After that, the modeling system 1 aligns the work W with the modeling head 11 by using the measurement result of the state of the test mark TM.

Again, in FIG. 1, the measuring device 14 measures the state of the object to be measured. In the present embodiment, the measurement target is assumed to be an object on the stage 13. Therefore, the measurement object may include at least a part of the work W, the mark member FM, the test mark TM, and any other object. The measuring device 14 measures the position of the measuring object on the stage 13 as an example of the state of the measuring object. For example, the measuring device 14 may measure the absolute position of the object to be measured (for example, the test mark TM) on the stage 13. For example, the measuring device 14 may measure the relative position of the other part of the measurement object (for example, the test mark TM) with respect to the part of the measurement object (for example, the work W) on the stage 13. good.

In order to measure the position of the object to be measured (particularly, the position of the surface of the object to be measured), the measuring device 14 may measure at least one of the shape and the size of the object to be measured by using an arbitrary measuring method. good. As an example of the measurement method, the pattern projection method, the light cutting method, the time of flight method, the moiretopography method (specifically, the grid irradiation method or the grid projection method), the holographic interferometry, the autocollimation method, and the stereo method. , At least one of the non-point interferometry, the critical angle method and the knife edge method. When the measurement of the measuring device 14 reveals at least one of the positions, shapes, and dimensions of the object to be measured on the stage 13, each part of the object to be measured (for example, at least one of the work W and the test mark TM) is found on the stage 13. Find out where is located. As a result, the position of the measurement object on the stage 13 can be calculated from at least one of the position, shape, and size of the measurement object.

The control device 15 controls the operation of the modeling system 1. The control device 15 may include, for example, an arithmetic unit such as a CPU (Central Processing Unit) and a storage device such as a memory. In particular, in the present embodiment, the control device 15 controls the emission mode of the optical EL by the irradiation system 111. The ejection mode includes, for example, at least one of the intensity of the optical EL and the ejection timing of the optical EL. When the optical EL is pulsed light, the emission mode includes, for example, at least one of the length of the emission time of the pulsed light and the ratio of the emission time of the pulsed light to the quenching time (so-called duty ratio). It is also good. Further, the control device 15 controls the movement mode of the modeling head 11 by the head drive system 12. The movement mode includes, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing. Further, the control device 15 controls the supply mode of the modeling material M by the material nozzle 112. The supply mode includes, for example, a supply amount (particularly, a supply amount per unit time).

(2) Operation of the modeling system 1 Next, the operation of the modeling system 1 will be described. In the present embodiment, as described above, the modeling system 1 performs a modeling operation for forming the three-dimensional structure ST. Further, the modeling system 1 performs an alignment operation for aligning the work W and the modeling head 11 before performing the modeling operation. Therefore, in the following, the modeling operation and the alignment operation for aligning the work W and the modeling head 11 will be described in order.

(2-1) Modeling operation First, the modeling operation will be described. As described above, the modeling system 1 forms the three-dimensional structure ST by the laser overlay welding method. Therefore, the modeling system 1 may form the three-dimensional structure ST by performing an existing modeling operation based on the laser overlay welding method. Hereinafter, an example of the modeling operation of the three-dimensional structure ST by the laser overlay welding method will be briefly described.

The modeling system 1 forms the three-dimensional structure ST on the work W based on the three-dimensional model data (for example, CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. The three-dimensional model data includes data representing the shape (particularly, the three-dimensional shape) of the three-dimensional structure ST. As the three-dimensional model data, the measurement data of the three-dimensional object measured by the measuring device 14 provided in the modeling system 1 may be used. As the three-dimensional model data, the measurement data of the three-dimensional shape measuring machine provided separately from the modeling system 1 may be used. As an example of such a three-dimensional shape measuring machine, at least a contact type three-dimensional measuring machine and a non-contact type three-dimensional measuring machine having a probe that can move with respect to the work W and can contact the work W. One can be given. As an example of a non-contact type 3D measuring machine, a pattern projection type 3D measuring machine, an optical cutting type 3D measuring machine, a time of flight type 3D measuring machine, and a moiretopography type 3D measuring machine. , At least one of a holographic interference type three-dimensional measuring machine, a CT (Computed Tomography) type three-dimensional measuring machine, and an MRI (Magnetic Response Imaging) type three-dimensional measuring machine. As the 3D model data, the design data of the 3D structure ST may be used.

In order to form the three-dimensional structure ST, the modeling system 1 sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SLs arranged along the Z-axis direction. For example, the modeling system 1 sequentially forms a plurality of structural layers SL obtained by slicing a three-dimensional structure ST along the Z-axis direction one by one. As a result, a three-dimensional structure ST, which is a laminated structure in which a plurality of structural layers SL are laminated, is formed. Hereinafter, the flow of the operation of forming the three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.

First, the operation of forming each structural layer SL will be described. Under the control of the control device 15, the modeling system 1 sets an irradiation region EA in a desired region on the modeling surface MS corresponding to the surface of the work W or the surface of the formed structural layer SL, and sets the irradiation region EA for the irradiation region EA. The light EL is irradiated from the irradiation system 111. The region occupied by the light EL irradiated from the irradiation system 111 on the modeling surface MS may be referred to as an irradiation region EA. In the present embodiment, the focus position of the optical EL (that is, the condensing position, in other words, the position where the optical EL is most convergent in the Z-axis direction or the traveling direction of the optical EL) coincides with the modeling surface MS. There is. The focus position of the optical EL may be set to a position deviated from the modeling surface MS in the Z-axis direction. As a result, as shown in FIG. 3A, a pool of liquid metal or resin melted by the optical EL in a desired region on the modeling surface MS by the optical EL emitted from the irradiation system 111. ) MP is formed. Further, the modeling system 1 sets a supply region MA in a desired region on the modeling surface MS under the control of the control device 15, and supplies the modeling material M to the supply region MA from the material nozzle 112. Here, since the irradiation region EA and the supply region MA coincide with each other as described above, the supply region MA is set to the region where the molten pool MP is formed. Therefore, as shown in FIG. 3B, the modeling system 1 supplies the modeling material M to the molten pool MP from the material nozzle 112. As a result, the modeling material M supplied to the molten pool MP is melted. When the molten pool MP is no longer irradiated with light EL due to the movement of the modeling head 11, the modeling material M melted in the molten pool MP is cooled and solidified (that is, solidified) again. As a result, as shown in FIG. 3C, the resolidified modeling material M is deposited on the modeling surface MS. That is, a model formed by the deposit of the resolidified modeling material M is formed. That is, a modeled object is formed by performing additional processing for adding a deposit of the modeling material M to the modeling surface MS.

A series of modeling processes including the formation of the molten pool MP by such light irradiation EL, the supply of the modeling material M to the molten pool MP, the melting of the supplied modeling material M, and the resolidification of the molten modeling material M can be performed. The modeling head 11 is repeatedly moved along the XY plane with respect to the modeling surface MS. When the modeling head 11 moves with respect to the modeling surface MS, the irradiation region EA also moves relative to the modeling surface MS. Therefore, a series of modeling processes are repeated while moving the irradiation region EA along the XY plane with respect to the modeling surface MS. At this time, the optical EL selectively irradiates the irradiation region EA set in the region where the modeled object is desired to be formed, while the optical EL is applied to the irradiation region EA set in the region where the modeled object is not desired to be formed. Not selectively irradiated. It can also be said that the irradiation region EA is not set in the region where the modeled object is not desired to be formed. That is, the modeling system 1 moves the irradiation region EA along a predetermined movement locus on the modeling surface MS, and at the timing corresponding to the distribution of the region where the modeled object is to be formed (that is, the pattern of the structural layer SL). The EL is applied to the modeling surface MS. As a result, a structural layer SL corresponding to an aggregate of the modeled objects made of the solidified modeling material M is formed on the modeling surface MS. In the above description, the irradiation area EA is moved with respect to the modeling surface MS, but the modeling surface MS may be moved with respect to the irradiation area EA.

The modeling system 1 repeatedly performs an operation for forming such a structural layer SL under the control of the control device 15 based on the three-dimensional model data. Specifically, first, the control device 15 slices the three-dimensional model data at a stacking pitch to create slice data. The control device 15 may modify the slice data at least partially according to the characteristics of the modeling system 1. The modeling system 1 corresponds to the operation for forming the first structural layer SL # 1 on the modeling surface MS corresponding to the surface of the work W under the control of the control device 15. This is performed based on the three-dimensional model data (that is, the slice data corresponding to the structural layer SL # 1). As a result, the structural layer SL # 1 is formed on the modeling surface MS as shown in FIG. 4A. After that, the modeling system 1 sets the surface (that is, the upper surface) of the structural layer SL # 1 on the new modeling surface MS, and then forms the second structural layer SL # 2 on the new modeling surface MS. do. In order to form the structural layer SL # 2, the control device 15 first controls the head drive system 12 so that the modeling head 11 moves along the Z axis. Specifically, the control device 15 controls the head drive system 12 so that the irradiation region EA and the supply region MA are set on the surface of the structural layer SL # 1 (that is, the new modeling surface MS). The modeling head 11 is moved toward the + Z side. As a result, the focus position of the optical EL coincides with the new modeling surface MS. After that, the modeling system 1 operates on the structural layer SL # 1 based on the slice data corresponding to the structural layer SL # 2 in the same operation as the operation of forming the structural layer SL # 1 under the control of the control device 15. The structural layer SL # 2 is formed on the surface. As a result, the structural layer SL # 2 is formed as shown in FIG. 4 (b). After that, the same operation is repeated until all the structural layers SL constituting the three-dimensional structure to be formed on the work W are formed. As a result, as shown in FIG. 4C, a laminated structure in which a plurality of structural layers SL are laminated along the Z axis (that is, along the direction from the bottom surface to the top surface of the molten pool MP) A three-dimensional structure ST is formed.

In addition, after the formation of at least one structural layer SL and before all the structural layers SL are formed, the measuring device 14 measures the shape of the structure including the formed structural layer SL (for example,). , The shape of its surface) may be measured. In this case, the control device 15 may modify at least a part of the slice data used for forming the subsequent structural layer SL based on the measurement result of the measuring device 14.

(2-2) Alignment operation Next, the alignment operation will be described. As described above, the alignment operation is an operation for aligning the work W and the modeling head 11. More specifically, the alignment operation forms the desired 3D structure ST with relatively high accuracy (that is, the shape error with the ideal 3D structure ST shown by the 3D model data). Is an operation for aligning the work W and the modeling head 11 so that a relatively small three-dimensional structure ST can be formed). The alignment of the work W and the modeling head 11 may mean, for example, control (in other words, adjustment or setting) of the relative positional relationship between the work W and the modeling head 11. Further, the alignment between the work W and the modeling head 11 may mean, for example, control (in other words, adjustment or setting) of the relative positional relationship between the work W and the modeling position. The alignment of the work W and the modeling head 11 may mean, for example, control (in other words, adjustment or setting) of the relative positional relationship between the work W and the position of the molten pool, and the work W may be aligned. It may mean control of the relative positional relationship between the work W and the irradiation area EA (in other words, adjustment or setting), and control of the relative positional relationship between the work W and the supply area MA (in other words, adjustment or setting). It may mean setting).

In the present embodiment, the alignment operation includes a head movement operation of moving the modeling head 11 to the modeling start position Ch_start on the head coordinate system Ch. The head coordinate system Ch is a three-dimensional coordinate system indicating the position of the modeling head 11. The position in the head coordinate system Ch uses the coordinate Xh along the X axis of the head coordinate system Ch, the coordinate Yh along the Y axis of the head coordinate system Ch, and the coordinate Zh along the Z axis of the head coordinate system Ch. Be identified. That is, the position in the head coordinate system Ch is specified by the coordinates (Xh, Yh, Zh). Such a head coordinate system Ch mainly specifies the position of the modeling head 11 by the control device 15 that controls the head driving system 12 when the head driving system 12 moves the modeling head 11 (in other words, it is represented). ) Is used for.

The modeling start position Ch_start is the position of the modeling head 11 capable of irradiating the modeling start position Cs_start on the modeling surface MS corresponding to the surface of the work W to start modeling (that is, additional processing). Is. In the following description, the modeling surface MS corresponding to the surface of the work W is referred to as "work modeling surface MSW" to distinguish it from the modeling surface MS corresponding to the surface of the structural layer SL. That is, the modeling start position Ch_start is the position of the modeling head 11 capable of setting the irradiation region EA at the modeling start position Cs_start on the work modeling surface MSW (in other words, forming the molten pool MP or performing additional processing). Is. The modeling start position Ch_start may be the position of the modeling head 11 capable of setting the supply area MA at the modeling start position Cs_start on the work modeling surface MSW.

The modeling start position Cs_start is a position in the stage coordinate system Cs with respect to the stage 23 that holds the work W. The stage coordinate system Cs is a three-dimensional coordinate system based on the stage 13. Therefore, the position in the stage coordinate system Cs is the coordinate Xs along the X axis of the stage coordinate system Cs, the coordinate Ys along the Y axis of the stage coordinate system Cs, and the coordinate Zs along the Z axis of the stage coordinate system Cs. Specified using. That is, the position in the stage coordinate system Cs is specified by the coordinates (Xs, Ys, Zs). The stage coordinate system Cs is mainly staged by the measuring device 14 (furthermore, the control device 15 that processes the measurement result of the measuring device 14) when the measuring device 14 measures the characteristics of the measurement object on the stage 13. 13 It is used to specify (in other words, represent) the position of the object to be measured.

Here, the technical reason for performing such an alignment operation will be described. First, it is assumed that additional processing is performed on a certain work W. In this case, the control device 15 can specify the position of the work W in the stage coordinate system Cs from the measurement result of the measurement device 14. As a result, the control device 15 can specify the modeling start position Cs_start on the work modeling surface MSW in the stage coordinate system Cs. On the other hand, the control device 15 may not be able to specify the modeling start position Ch_start with relatively high accuracy based on the modeling start position Cs_start. This is because the relationship between the head coordinate system Ch and the stage coordinate system Cs is not always the ideal relationship. The ideal relationship referred to here is, for example, that the positional relationship between the origin of the head coordinate system Ch and the origin of the stage coordinate system Cs does not change at all, and the scale of the head coordinate system Ch and the scale of the stage coordinate system Cs. Is always the same, even if it means that the X-axis, Y-axis and Z-axis of the head coordinate system Ch are always parallel to the X-axis, Y-axis and Z-axis of the stage coordinate system Cs, respectively. good. That is, the ideal relationship referred to here is, for example, that the stage coordinate system Cs does not move relatively in parallel with the head coordinate system Ch, and the stage coordinate system Cs is relatively relative to the head coordinate system Ch. It does not expand or contract, and may mean a relationship in which the stage coordinate system Cs does not rotate relative to the head coordinate system Ch. If there is an ideal modeling system in which the relationship between the head coordinate system Ch and the stage coordinate system Cs is always ideal, the control device 15 may use the head coordinate system Ch and the stage coordinates. Based on the ideal relationship with the system Cs, the modeling start position Ch_start can be specified with relatively high accuracy from the modeling start position Cs_start. However, in reality, the relationship between the head coordinate system Ch and the stage coordinate system Cs may fluctuate. For example, if at least one of the mounting error of the modeling head 11, the fluctuation of the mounting position of the modeling head 11 (for example, rattling, etc.) and the deterioration of the performance of the modeling head 11 occur, the head coordinate system Ch and the stage The relationship with the coordinate system Cs may fluctuate. In particular, the mounting error of the irradiation system 111, the fluctuation of the mounting position of the irradiation system 111 (for example, rattling, etc.), the deterioration of the performance of the irradiation system 111, the mounting error of the material nozzle 112, the fluctuation of the mounting position of the material nozzle 111 (for example). For example, if at least one of rattling), damage to the material nozzle 112, and deterioration of the performance of the material nozzle 112 occurs, the relationship between the head coordinate system Ch and the stage coordinate system Cs changes. there is a possibility. Further, for example, when at least one of the mounting error of the stage 13, the fluctuation of the mounting position of the stage 13 (for example, rattling, etc.) and the shape change of the stage 13 occur, the head coordinate system Ch and the stage coordinate system The relationship with Cs may fluctuate. Further, for example, when the head drive system 12 is reset (that is, when it is restarted), the relationship between the head coordinate system Ch and the stage coordinate system Cs may change. When the relationship between the head coordinate system Ch and the stage coordinate system Cs fluctuates so as not to be an ideal relationship in this way, the relationship between the head coordinate system Ch and the stage coordinate system Cs becomes an ideal relationship. Compared with a certain case, the optical EL from the modeling head 11 located at a certain position on the head coordinate system Ch is not always irradiated to the same position on the stage coordinate system Cs. Therefore, even if the control device 15 specifies the modeling start position Cs_start in the stage coordinate system Cs, the modeling head 11 capable of irradiating the modeling start position Cs_start with light EL based on the specified modeling start position Cs_start. It is not always possible to specify the modeling start position Ch_start, which is the position of, with relatively high accuracy. That is, even if the control device 15 specifies the modeling start position Cs_start in the stage coordinate system Cs, the modeling head 11 is appropriately set to the modeling start position Ch_start corresponding to the specified modeling start position Cs_start in the head coordinate system Ch. It is not always possible to move to. Specifically, for example, even if the control device 15 specifies the modeling start position Cs_start in the stage coordinate system Cs, the control device 15 has the modeling start position Ch_start corresponding to the specified modeling start position Cs_start in the head coordinate system Ch. May move the modeling head 11 to a different position. As a result, the shape accuracy of the formed three-dimensional structure ST may deteriorate.

Therefore, in the present embodiment, the modeling system 1 performs an alignment operation under the control of the control device 15 for the purpose of appropriately moving the modeling head 11 to the modeling start position Ch_start corresponding to the modeling start position Cs_start. .. After that, the modeling system 1 starts additional processing on the work W after the modeling head 11 is positioned at the modeling start position Ch_start. Therefore, the modeling system 1 performs the alignment operation before starting the modeling operation for performing additional processing on the work W.

In the present embodiment, in addition to the above-mentioned head movement operation, the alignment operation also performs an initial setting operation corresponding to the preparation operation for performing the above-mentioned head movement operation. Therefore, the initial setting operation and the head movement operation will be described in order below.

(2-2-1) Initial setting operation First , the initial setting operation among the alignment operations will be described. The initial setting operation includes an operation of associating (in other words, associating) the head coordinate system Ch with the stage coordinate system Cs. Specifically, the initial setting operation includes an operation of associating a position in the head coordinate system Ch with a position in the stage coordinate system Cs. As an example, the initial setting operation may include an operation of associating the position of the modeling head 11 in the head coordinate system Ch with the position of the model formed on the stage 13 by the modeling head 11 in the stage coordinate system Cs. good.

In the present embodiment, the operation of associating the head coordinate system Ch with the stage coordinate system Cs means that the position in the head coordinate system Ch specified by the coordinates (Xh, Yh, Zh) is referred to as (Xs, Ys, Zs). Even if it includes an operation of calculating a conversion matrix T that can be converted into a position in the stage coordinate system Cs specified by coordinates and / or a position in the stage coordinate system Cs can be converted into a position in the head coordinate system Ch. good. That is, the operation of associating the head coordinate system Ch with the stage coordinate system Cs is (Xh, Yh, Zh) = T × (Xs, Ys, Zs) and (Xs, Ys, Zs) = T ^-1 × (Xh, It may include an operation of calculating a transformation matrix T that satisfies the relationship (Yh, Zh). The transformation matrix T expands or contracts either the position in the head coordinate system Ch or the position in the stage coordinate system Cs to the position in the head coordinate system Ch or the position in the stage coordinate system Cs. Contains a matrix for scaling to transform. However, in addition to or instead of the matrix related to scaling, the conversion matrix T translates either the position in the head coordinate system Ch or the position in the stage coordinate system Cs to move the position in the head coordinate system Ch and the stage. It may include a matrix for translation that transforms to either one of the positions in the coordinate system Cs. The transformation matrix T rotates either the position in the head coordinate system Ch or the position in the stage coordinate system Cs in addition to or instead of the matrix related to scaling, and the position in the head coordinate system Ch and the stage coordinate system Cs. It may contain a matrix of rotations that transforms into one or the other of the positions within. It should be noted that the transformation matrix T may include, in addition to or in place of, a matrix relating to at least one of scaling, translation and rotation a matrix relating to the degree of orthogonality. Hereinafter, the operation of calculating the transformation matrix T will be described with reference to FIG.

As shown in FIG. 5, first, the mark member FM is arranged in each of the plurality of mark areas 134 of the stage 13 (step S111). The mark member FM is a member whose at least a part can be melted by irradiation with light EL. The mark member FM is a member capable of forming a molten pool MP at least in a part by irradiation with light EL. The mark member FM is a member capable of forming a modeled object at least in part by irradiation with light EL. The mark member FM is, for example, a plate-shaped member, but may be a member having any other shape. Further, the size of the mark member FM may be the same as the size of the mark region 134, may be small, or may be large. The work W may or may not be arranged on the stage 13 during the period during which the initial setting operation is being performed.

After that, the control device 15 designates the mark area 134 of the plurality of mark areas 134 as the designated mark area 134d in which the mark member FM for forming the test mark TM is arranged (step S121). The control device 15 may designate all the mark areas 134 of the plurality of mark areas 134 as the designated mark area 134d, or may designate some mark areas 134 of the plurality of mark areas 134 as the designated mark area 134d. It may be specified in. After that, the control device 15 specifies the position Chfm of the modeling head 11 capable of performing additional processing on the mark member FM arranged in the designated mark region 134d in the head coordinate system Ch (step S122). Specifically, the plurality of mark areas 134 are set at predetermined positions (that is, known positions) on the upper surface 131 of the stage 13. That is, the designated mark area 134d is also set to a predetermined position (that is, a known position) on the upper surface 131 of the stage 13. Therefore, the position Csfm of the designated mark area 134d in the stage coordinate system Cs (for example, the position Csfm of the center, the end, or any other arbitrary portion of the designated mark area 134d) is known information to the control device 15. On the other hand, as described above, since the relationship between the head coordinate system Ch and the stage coordinate system Cs changes in the modeling system 1, the control device 15 determines the designated mark area based on the position Csfm of the designated mark area 134d. It is not easy to specify the position Chfm of the modeling head 11 capable of performing additional processing on the mark member FM arranged at 134d with relatively high accuracy. However, in the initial setting operation, it is sufficient that the modeling system 1 can form the test mark TM somewhere on the mark member FM (for example, an arbitrary position on the upper surface of the mark member FM). In other words, the modeling system 1 does not have to control the formation position of the test mark TM in the mark member FM with relatively high accuracy. Therefore, the control device 15 assumes that the relationship between the head coordinate system Ch and the stage coordinate system Cs is an ideal relationship, and the designated mark area is based on the position Csfm of the designated mark area 134d. It is possible to specify (substantially estimate here) the position Chfm of the modeling head 11 capable of performing additional processing on the mark member FM arranged at 134d.

However, if the relationship between the head coordinate system Ch and the stage coordinate system Cs is not an ideal relationship (particularly, it is relatively significantly different from the ideal relationship), the modeling system 1 is used as a mark member. It may not be possible to form the test mark TM on the FM. That is, there is a possibility that the modeling system 1 will form the test mark TM at a position away from the mark member FM. Therefore, the size of the mark region 134 (particularly, the size along the XY plane) is when the relationship between the head coordinate system Ch and the stage coordinate system Cs deviates from the ideal relationship (particularly, the actual modeling). If the system 1 is displaced to the extent that it can occur, the modeling head 11 located at the position Chfm may form a test mark TM on the mark member FM arranged in the designated mark area 134d, even if the same applies hereinafter). It may be set to a size as large as possible. Similarly, the size of the mark member FM (particularly the size along the XY plane) is such that the relationship between the head coordinate system Ch and the stage coordinate system Cs deviates from the ideal relationship. The modeling head 11 located at the position Chfm may be set to a size large enough to form a test mark TM on the mark member FM arranged in the designated mark area 134d.

If the position Csfm of the designated mark area 134d is known information, the position Chfm of the modeling head 11 capable of performing additional processing on the mark member FM arranged in the designated mark area 134d is also used. It can be known information. Therefore, the control device 15 may store information regarding the position Csfm of the mark area 134 and the position Chfm of the modeling head 11 corresponding to the position Csfm of the mark area 134. In this case, the control device 15 may specify the position Chfm of the modeling head 11 from the stored information instead of specifying the position Chfm of the modeling head 11 in step S122.

After that, the control device 15 controls the head drive system 12 so as to move the modeling head 11 to the position Chfm specified in step S122 (step S123). Then, after the modeling head 11 reaches the position Chfm, the modeling system 1 forms a test mark TM on the mark member FM arranged in the designated mark area 134d under the control of the control device 15 (step S124). The modeling system 1 is the same method as the method for forming at least one of the above-mentioned model, the above-mentioned structural layer SL, and the above-mentioned three-dimensional structure ST (for example, FIGS. 3A to 4). The test mark TM is formed by using the method shown in (c). That is, the test mark TM may be a structure similar to the above-mentioned modeled object, a structure similar to the aggregate of the above-mentioned shaped objects, or the same structure as the above-mentioned structural layer SL. It may be a structure, or it may be a structure similar to the above-mentioned three-dimensional structure ST in which a plurality of structural layers SL are laminated. However, when specifying the position of the test mark TM in steps S131 to S132, which will be described later, a specific shape can be uniquely specified from the measurement object indicated by the measurement result of the measuring device 14. And may be a mark having at least one of the dimensions.

After that, the control device 15 determines whether or not the test mark TM is formed for all of the plurality of mark member FMs arranged in the plurality of mark areas ME set in the stage 13 (step S125). If it is determined as a result of the determination in step S125 that the test mark TM is not formed for all the mark member FMs (step S125: No), the control device 15 repeats the processes after step S121. That is, the control device 15 designates one mark area 134 that has not yet been designated as the designated mark area 134d among the plurality of mark areas 134 as the new designated mark area 134d (step S121). After that, the control device 15 performs a process for forming the test mark TM in the newly designated designated mark area 134d (steps S122 to S124).

On the other hand, when it is determined that the test mark TM is formed for all the mark member FMs as a result of the determination in step S125 (step S125: Yes), the measuring device 14 is an object (specifically) on the stage 13. Specifically, the state of the measurement object including the test mark TM) is measured (step S131). The measurement result of the measuring device 14 (that is, information regarding the state of the measurement object including the test mark TM) is output to the control device 15. In addition, instead of the case where it is determined that the test mark TM is formed for all the mark member FMs, it is determined that the test mark TM is formed for some of the mark member FMs among the plurality of mark member FMs. If so, the process may proceed to the next step (step S131).

After that, the control device 15 identifies the position Cstm of the formed test mark TM in the stage coordinate system Cs based on the measurement result of the measuring device 14 (step S132). Specifically, since the test mark TM is formed under the control of the control device 15, at least one of the positions, shapes, and dimensions of the test mark TM is information known to the control device 15. Therefore, the control device 15 can identify the test mark TM from the measurement object based on the information regarding the state (particularly, at least one of the position, shape, and dimension) of the measurement object measured by the measurement device 14. can. For example, the control device 15 can specify the test mark TM from the measurement target by using a pattern matching method or the like. After that, the control device 15 specifies the position Cstm of the specified test mark TM in the stage coordinate system Cs.

After that, the control device 15 sets the position Cstm of the test mark TM specified in step S132 and the position Chfm of the modeling head 11 when the test mark TM is formed (that is, the position Chfm of the modeling head 11 specified in step S122). Based on this, a transformation matrix T showing the relationship between the head coordinate system Ch and the stage coordinate system Cs is calculated (step S141). Specifically, since a plurality of test mark TMs are formed, a plurality of position Cstms are specified in step S132. Similarly, in step S122, a plurality of positions Chfm are specified. The position Cstm1 = (Xstm1, Ystm1, Zstm1) of the first test mark TM among the plurality of positions Cstm is the position Chfm1 = of the modeling head 11 when the first test mark TM is formed among the plurality of positions Chfm. Corresponds to (Xhfm1, Yhfm1, Zhfm1). That is, the relationship (Xhfm1, Yhfm1, Zhfm1) = T × (Xstm1, Ystm1, Zstm1) is established. Similarly, the position Cstm2 = (Xstm2, Ystm2, Zstm2) of the second test mark TM in the plurality of positions Cstm is the position of the modeling head 11 when the second test mark TM in the plurality of positions Chfm is formed. It corresponds to the position Chfm2 = (Xhfm2, Yhfm2, Zhfm2). That is, the relationship (Xhfm2, Yhfm2, Zhfm2) = T × (Xstm2, Ystm2, Zstm2) is established. Similarly, the position Cstm3 = (Xstm3, Ystm3, Zstm3) of the third test mark TM in the plurality of positions Cstm is the position of the modeling head 11 when the third test mark TM in the plurality of positions Chfm is formed. It corresponds to the position Chfm3 = (Xhfm3, Yhfm3, Zhfm3). That is, the relationship (Xhfm3, Yhfm3, Zhfm3) = T × (Xstm3, Ystm3, Zstm3) is established. Therefore, the control device 15 can calculate the transformation matrix T by solving the simultaneous equations that hold between the plurality of positions Cstm and the plurality of positions Chfm.

Since each of the head coordinate system Ch and the stage coordinate system Cs is a three-dimensional coordinate system, the modeling system 1 may form at least three test mark TMs in order to calculate the transformation matrix T. That is, at least three mark areas 134 may be set on the stage 13. In this case, at least three mark regions 134 may include two mark regions 134 having different positions along the X axis of the stage coordinate system Cs. That is, the modeling system 1 may form at least two test mark TMs having different positions along the X axis of the stage coordinate system Cs. At least three mark regions 134 may include two mark regions 134 that are located at different positions along the Y axis. That is, the modeling system 1 may form at least two test mark TMs having different positions along the Y axis of the stage coordinate system Cs. At least three mark regions 134 may include two mark regions 134 that are located at different positions along the Z axis. That is, the modeling system 1 may form at least two test mark TMs having different positions along the Z axis of the stage coordinate system Cs. In the example shown in FIG. 2 described above, three mark areas 134 # 1 to 134 # 3 are set on the stage 13. Further, in the example shown in FIG. 2, two mark areas 134 # 1 and 134 # 2 (or two mark areas 134 # 2 and 134 # 3) having different positions along the X axis are set on the stage 13. Three mark areas 134 # 1 to 134 # 3 having different positions along the Y axis are set, and two mark areas 134 # 1 and 134 # 3 (or two marks) having different positions along the Z axis are set. Areas 134 # 2 and 134 # 3) are set.

When the transformation matrix T is calculated, the control device 15 sets the position (Xh, Yh, Zh) in the head coordinate system Ch to the position (Xh, Yh, Zh) in the stage coordinate system Cs corresponding to the position (Xh, Yh, Zh). It can be converted to Xs, Ys, Zs). Similarly, the control device 15 sets the position (Xs, Ys, Zs) in the stage coordinate system Cs to the position (Xh, Yh, Zh) in the head coordinate system Ch corresponding to the position (Xs, Ys, Zs). Can be converted to. Further, the transformation matrix T is calculated based on the test mark TM formed by the modeling system 1 actually performing additional processing on the stage 13. That is, the transformation matrix T is calculated based on the actual position Chfm of the modeling head 11 in the head coordinate system Ch and the actual position Cstm of the test mark TM in the stage coordinate system Cs. Therefore, the transformation matrix T reflects the actual relationship between the head coordinate system Ch and the stage coordinate system Cs. That is, even if the actual relationship between the head coordinate system Ch and the stage coordinate system Cs is different from the ideal relationship, the transformation matrix T includes the position of the modeling head 11 in the head coordinate system Ch and the stage. It reflects the actual relationship with the position of the object on stage 13 in the coordinate system Cs. Therefore, the control device 15 can perform mutual conversion between the position in the head coordinate system Ch and the position in the stage coordinate system Cs with relatively high accuracy by using the transformation matrix T.

After the transformation matrix T is calculated (or after the state of the test mark TM is measured), the mark member FM is removed from the mark region 134 (step S151). That is, the mark member FM corresponds to a member that can be replaced each time the initial setting operation is performed. The mark member FM may be located in the mark area 134 until the next initial setting operation is performed. Further, the same mark member FM may be used in a plurality of initial setting operations.

The control device 15 performs such an initial setting operation at a desired timing. For example, the control device 15 may perform an initial setting operation each time the modeling system 1 starts to operate (for example, the modeling system 1 is turned on). For example, the control device 15 may perform the initial setting operation every time the work W is arranged on the stage 13. For example, the control device 15 may perform the initial setting operation before or after the work W is arranged on the stage 13. For example, the control device 15 may perform the initial setting operation each time the additional processing for one or a plurality of work W is completed. For example, the control device 15 may perform the initial setting operation every time a certain time elapses from the operation of the modeling system 1. For example, the control device 15 may perform the initial setting operation each time an instruction to perform the initial setting operation is input from the operator of the modeling system 1.

(2-2-2) Head movement operation Next, the head movement operation among the alignment operations will be described. As described above, the head moving operation is an operation of moving the modeling head 11 to the modeling start position Ch_start. Hereinafter, the head moving operation will be described with reference to FIG.

As shown in FIG. 6, first, the work W to be subjected to additional machining is arranged on the stage 13 (step S211). The stage 13 holds the work W via the holding area 132.

After that, the control device 15 designates the mark area 134 of the plurality of mark areas 134 as the designated mark area 134d to be arranged by the mark member FM for forming the test mark TM (step S221). The control device 15 may designate all the mark areas 134 of the plurality of mark areas 134 as the designated mark area 134d, or may designate a part of the mark areas 134 of the plurality of mark areas 134 as the designated mark area 134d. You may specify it. After that, the mark member FM is arranged in the designated mark area 134d.

After that, the control device 15 specifies the position Chfm of the modeling head 11 capable of performing additional processing on the mark member FM arranged in the designated mark region 134d in the head coordinate system Ch (step S222). Specifically, the control device 15 also specifies the position Chfm of the modeling head 11 by using the method used in the above-mentioned initial setting operation for specifying the position Chfm of the modeling head 11 in the head moving operation. .. That is, the control device 15 assumes that the relationship between the head coordinate system Ch and the stage coordinate system Cs is an ideal relationship, and the designated mark area 134d is based on the position Csfm of the designated mark area 134d. The position Chfm of the modeling head 11 capable of performing additional processing on the mark member FM arranged in the above is specified (here, substantially estimated). However, the control device 15 uses the transformation matrix T calculated in the initial setting operation to convert the position Csfm of the designated mark area 134d, which is known information, with respect to the mark member FM arranged in the designated mark area 134d. The position Chfm of the modeling head 11 capable of performing additional processing may be specified.

After that, the control device 15 controls the head drive system 12 so as to move the modeling head 11 to the position Chfm specified in step S222 (step S223). Then, after the modeling head 11 reaches the position Chfm, the modeling system 1 forms a test mark TM on the mark member FM arranged in the designated mark area 134d under the control of the control device 15 (step S224). The test mark TM formed in the head movement operation may be the same as or different from the test mark TM formed in the above-mentioned initial setting operation.

After that, the measuring device 14 measures the state of the object (specifically, the measurement object including the test mark TM and the work W) on the stage 13 (step S231). The measurement result of the measuring device 14 (that is, information on the state of the measurement object including the test mark TM and the work W) is output to the control device 15.

After that, the control device 15 identifies the position Cstm of the formed test mark TM in the stage coordinate system Cs based on the measurement result of the measuring device 14 (step S232). Specifically, the control device 15 specifies the position Cstm of the test mark TM by using the method used in the above-mentioned initial setting operation for specifying the position Cstm of the test mark TM.

Further, the control device 15 specifies a modeling start position Cs_start to start modeling on the work modeling surface MSW in the stage coordinate system Cs based on the measurement result of the measuring device 14 (step S232). Specifically, the control device 15 can specify the position of the work W in the stage coordinate system Cs from the measurement result of the measurement device 14. Further, the control device 15 can specify how to form the three-dimensional structure ST on the work W based on the three-dimensional model data of the three-dimensional structure ST to be formed. When how to form the three-dimensional structure ST on the work W is specified, the position where the model should be formed first in order to form the three-dimensional structure ST (for example, the first structural layer). The position where the model should be formed first in order to form SL # 1) can be specified. The position where the modeled object should be formed first in order to form the three-dimensional structure ST corresponds to the modeling start position Cs_start.

After that, the control device 15 determines the position Cstm of the test mark TM specified in step S232, the position Chfm of the modeling head 11 when the test mark TM is formed (that is, the position Chfm of the modeling head 11 specified in step S222). Then, the modeling head 11 is moved to the modeling start position Ch_start based on the modeling start position Cs_start specified in step S232 (step S241). Hereinafter, the operation of moving the modeling head 11 to the modeling start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the modeling head 11, and the modeling start position Cs_start will be described in more detail with reference to FIG. 7. ..

The upper part of FIG. 7 is a plan view showing the relationship between the position Cstm = (Xstm, Ystm, Zstm) of the test mark TM in the stage coordinate system Cs and the modeling start position Cs_start = (Xs_start, Ys_start, Zs_start). On the other hand, the lower part of FIG. 7 is a plan view showing the relationship between the position Chfm = (Xhfm, Yhfm, Zhfm) of the modeling head 11 in the head coordinate system Ch and the modeling start position Ch_start = (Xh_start, Yh_start, Zh_start). ..

As shown in FIG. 7, the test mark TM is formed at the position Cstm in the stage coordinate system Cs by the optical EL from the modeling head 11 located at the position Chfm in the head coordinate system Ch. Therefore, the irradiation region EA of the optical EL from the modeling head 11 located at the position Chfm in the head coordinate system Ch is set to the position Cstm in the stage coordinate system Cs. In this case, if the modeling head 11 moves in the head coordinate system Ch so that the irradiation region EA moves from the position Cstm to the modeling start position Cs_start in the stage coordinate system Cs, the modeling head 11 is located at the modeling start position Cs_start. It will be.

Specifically, in the stage coordinate system Cs, the modeling start position Cs_start is separated from the position Cstm of the test mark TM by a distance (Xs_start-Xstm) along the X axis. In the stage coordinate system Cs, the modeling start position Cs_start is separated from the position Cstm of the test mark TM by a distance (Ys_start-Ystm) along the Y axis. In the stage coordinate system Cs, the modeling start position Cs_start is separated from the position Cstm of the test mark TM by a distance (Zs_start-Zstm) along the Z axis. Therefore, in the stage coordinate system Cs, the irradiation region EA moves by a distance of (Xs_start-Xstm) along the X axis, moves by a distance of (Ys_start-Ystm) along the Y axis, and Z. If the modeling head 11 located at the position Chfm in the head coordinate system Ch moves so as to move by a distance (Zs_start-Zstm) along the axis, the modeling head 11 will be positioned at the modeling start position Cs_start. Become.

Here, in the head coordinate system Ch, the modeling head 11 moves by a distance of (Xs_start-Xstm) along the X axis, moves by a distance of (Ys_start-Ystm) along the Y axis, and Z. If it moves by a distance (Zs_start-Zstm) along the axis, the irradiation region EA may move from the position Cstm to the modeling start position Cs_start in the stage coordinate system Cs. However, as described above, the relationship between the head coordinate system Ch and the stage coordinate system Cs is not always the ideal relationship. Therefore, even if the modeling head 11 moves by a distance along the X axis (Xs_start-Xstm) in the head coordinate system Ch, the irradiation region EA moves along the X axis (Xs_start-Xstm) in the stage coordinate system Cs. ) Does not always move. Similarly, even if the modeling head 11 moves by a distance along the Y axis (Ys_start-Ystm) in the head coordinate system Ch, the irradiation region EA moves along the Y axis (Ys_start-Ystm) in the stage coordinate system Cs. ) Does not always move. Similarly, even if the modeling head 11 moves by a distance along the Z axis (Zs_start-Zstm) in the head coordinate system Ch, the irradiation region EA moves along the Z axis (Zs_start-Zstm) in the stage coordinate system Cs. ) Does not always move. Therefore, the control device 15 uses the transformation matrix T to set the moving amount and moving direction of the irradiation region EA moving from the position Cstm of the test mark TM to the modeling start position Cs_start in the stage coordinate system Cs in the head coordinate system Ch. It is converted into the movement amount and the movement direction of the modeling head 11. After that, the control device 15 moves the modeling head 11 located at the position Chfm in the head coordinate system Ch toward the moving direction obtained by the conversion by the amount of movement obtained by the conversion. As a result, the modeling head 11 is located at the modeling start position Ch_start where the irradiation region EA can be set at the modeling start position Cs_start.

As described above, in the present embodiment, the control device 15 can appropriately move the modeling head 11 to the modeling start position Ch_start. That is, the control device 15 can move the modeling head 11 so that the position of the modeling head 11 in the head coordinate system Ch after movement matches (or approaches) the modeling start position Ch_start. In other words, the control device 15 can move the modeling head 11 so that the irradiation region EA to which the light EL from the modeling head 11 after movement is irradiated is set to the modeling start position Cs_start. The control device 15 may move the modeling head 11 so that the molten pool MP formed by the optical EL from the modeling head 11 after the movement is set at the modeling start position Cs_start, and the modeling after the movement may be performed. The modeling head 11 may be moved so that the supply position MA by the head 11 is set to the modeling start position Cs_start.

The control device 15 performs such a head movement operation at a desired timing. For example, the control device 15 may perform a head moving operation each time the work W is arranged on the stage 13. For example, the control device 15 may perform a head moving operation each time the additional processing for one or a plurality of work W is completed. For example, the control device 15 may perform a head movement operation every time a certain time elapses after the modeling system 1 is operated. For example, the control device 15 may perform the head moving operation every time an instruction to perform the head moving operation is input from the operator of the modeling system 1. For example, the control device 15 may perform a head movement operation each time an initial setting operation is performed. That is, the control device 15 may perform the head movement operation at the same frequency as the initial setting operation is performed. For example, the control device 15 may perform the head movement operation less frequently than the initial setting operation is performed. For example, the control device 15 may perform the head movement operation more frequently than the initial setting operation is performed.

The control device 15 uses the transformation matrix T to convert the modeling start position Cs_start in the stage coordinate system Cs to the modeling start position Ch_start in the head coordinate system Ch, and models at the modeling start position Ch_start obtained by the conversion. The head 11 may be moved. In particular, when the transformation matrix T includes all of the above-mentioned translation matrix, the above-mentioned scaling matrix, and the above-mentioned rotation matrix, the control device 15 specifies the modeling start position Ch_start using the transformation matrix T. , The modeling head 11 may be moved to the specified modeling start position Ch_start. Even in this case, the control device 15 can appropriately move the modeling head 11 to the modeling start position Ch_start.

(3) Modification Example Next, a modification of the modeling system 1 will be described.

(3-1) First Modified Example First , the first modified example will be described. In the first modification, the content of the head moving operation is different from the above-mentioned head moving operation. Specifically, the head moving operation in the first modification is an operation of moving the modeling head 11 to the modeling start position Ch_start, similar to the head moving operation described above. However, in the head movement operation in the first modification, a plurality of types of test mark TMs are formed, and the modeling head 11 is set to the modeling start position Ch_start based on the position Cstm of any one of the plurality of types of test mark TMs. It differs from the above-mentioned head movement operation in that it is moved. Hereinafter, the head moving operation in the first modification will be described with reference to FIGS. 8 to 10. For the same processing as the head movement operation described above, the same step numbers are assigned and detailed description thereof will be omitted.

As shown in FIG. 8, first, the work W to be subjected to additional machining is arranged on the stage 13 (step S211). Further, the control device 15 designates the mark area 134 of the plurality of mark areas 134 as the designated mark area 134d in which the mark member FM for forming the test mark TM should be arranged (step S221). The control device 15 may designate all the mark areas 134 of the plurality of mark areas 134 as the designated mark area 134d, or may designate a part of the mark areas 134 of the plurality of mark areas 134 as the designated mark area 134d. You may specify it. At this time, the mark member FM is arranged in the designated mark area 134d.

As described above, in the first modification, a plurality of types of test mark TMs are formed on the mark member FM arranged in the designated mark area 134d. Specifically, a plurality of test mark TMs having different moving directions (particularly, moving directions along the XY plane of the head coordinate system Ch) during the period of forming the test mark TM are formed. For example, the test mark TM formed by the modeling head 11 moving toward the first direction is different from the first direction (for example, intersecting the first direction or opposite to the first direction). ) A test mark TM formed by the modeling head 11 moving in the second direction is formed. For example, the test mark TM formed by the modeling head 11 moving in the first direction, the test mark TM formed by the modeling head 11 moving in the second direction, and the first and second models. A modeling head that moves in a third direction that is different from the direction (for example, intersecting at least one of the first and second directions, or opposite to at least one of the first and second directions). The test mark TM formed by 11 is formed. For example, a test mark TM formed by a modeling head 11 moving in a first direction, a test mark TM formed by a modeling head 11 moving in a second direction, and a third direction. The test mark TM formed by the moving modeling head 11 is different from the first to third directions (for example, intersecting at least one of the first to third directions, or the first to third directions. A test mark TM formed by the modeling head 11 moving in a fourth direction (opposite to at least one of the directions) is formed.

The test mark TM formed by the modeling head 11 moving toward the first direction is a stage corresponding to the first direction (or the first direction in the head coordinate system Ch) along the work modeling surface MSW. It is a linear test mark TM extending along the fifth direction in the coordinate system Cs). The test mark TM formed by the modeling head 11 moving toward the second direction is a stage corresponding to the second direction (or the second direction in the head coordinate system Ch) along the work modeling surface MSW. It is a linear test mark TM extending along the sixth direction in the coordinate system Cs). The test mark TM formed by the modeling head 11 moving toward the third direction is a stage corresponding to the third direction (or the third direction in the head coordinate system Ch) along the work modeling surface MSW. It is a linear test mark TM extending along the seventh direction in the coordinate system Cs). The test mark TM formed by the modeling head 11 moving toward the fourth direction is a stage corresponding to the fourth direction (or the fourth direction in the head coordinate system Ch) along the work modeling surface MSW. It is a linear test mark TM extending along the eighth direction in the coordinate system Cs). Therefore, in the first modification, it can be said that a plurality of test mark TMs having different stretching directions along the work forming surface MSW are formed. The stretching direction of the plurality of test marks TM does not have to be along the work forming surface MSW.

As an example, FIG. 11 shows an example in which a test mark TM (+ X), a test mark TM (−X), a test mark TM (+ Y), and a test mark TM (−Y) are formed. The test mark TM (+ X) is a test mark TM formed by the modeling head 11 that moves along the X axis of the head coordinate system Ch and toward the + X side of the head coordinate system Ch. The test mark TM (−X) is a test mark TM formed by the modeling head 11 that moves along the X axis of the head coordinate system Ch and toward the −X side of the head coordinate system Ch. The test mark TM (+ Y) is a test mark TM formed by the modeling head 11 that moves along the Y axis of the head coordinate system Ch and toward the + Y side of the head coordinate system Ch. The test mark TM (−Y) is a test mark TM formed by the modeling head 11 that moves along the Y axis of the head coordinate system Ch and toward the −Y side of the head coordinate system Ch. In the following description, for convenience of explanation, the four types of test mark TM shown in FIG. 11 (that is, test mark TM (+ X), test mark TM (−X), test mark TM (+ Y), and test mark TM (−Y). )) The head moving operation forming the) will be described. However, in the head moving operation, a different number of test mark TMs different from the four types of test mark TMs shown in FIG. 11 and / or extending in different directions may be formed.

After designating the designated mark area 134d again in FIG. 8, when the control device 15 begins to form the test mark TM (+ X) on the mark member FM arranged in the designated mark area 134d in the head coordinate system Ch. The position Chfm (+ X) of the modeling head 11 is specified (step S3221). The method of specifying the position Chfm (+ X) in step S3221 may be the same as the method of specifying the position Chfm in step S222 of FIG. 6 described above. That is, the control device 15 forms the test mark TM (+ X) in the designated mark area 134d by assuming that the relationship between the head coordinate system Ch and the stage coordinate system Cs is an ideal relationship. Based on the starting position Csfm (+ X), the position Chfm (+ X) of the modeling head 11 when starting to form the test mark TM (+ X) may be specified. The same applies to the method of specifying the position Chfm (−X) in step S3222, the method of specifying the position Chfm (+ Y) in step S3223, and the method of specifying the position Chfm (−Y) in step S3224, which will be described later.

After that, the control device 15 controls the head drive system 12 so as to move the modeling head 11 to the position Chfm (+ X) specified in step S3221 (step S3231). After that, after the modeling head 11 reaches the position Chfm (+ X), the modeling system 1 controls the control device 15 along the X axis of the head coordinate system Ch and toward the + X side of the head coordinate system Ch. While moving the transfer head 11, a test mark TM (+ X) is formed on the mark member FM arranged in the designated mark area 134d (step S3241).

Further, as shown in FIG. 8, before and after the process for forming the test mark TM (+ X), the control device 15 arranges the mark member FM in the designated mark area 134d in the head coordinate system Ch. The position Chfm (-X) of the modeling head 11 at the time when the test mark TM (-X) is started to be formed is specified (step S3222). After that, the control device 15 controls the head drive system 12 so as to move the modeling head 11 to the position Chfm (−X) specified in step S3222 (step S3232). Then, after the modeling head 11 reaches the position Chfm (-X), the modeling system 1 is controlled by the control device 15 along the X axis of the head coordinate system Ch and on the -X side of the head coordinate system Ch. The test mark TM (−X) is formed on the mark member FM arranged in the designated mark area 134d while moving the modeling head 11 toward the direction (step S3242).

Further, as shown in FIG. 9, before and after the process for forming at least one of the test mark TM (+ X) and the test mark TM (−X), the control device 15 controls the control device 15 in the head coordinate system Ch. The position Chfm (+ Y) of the modeling head 11 when starting to form the test mark TM (+ Y) on the mark member FM arranged in the designated mark area 134d is specified (step S3223). After that, the control device 15 controls the head drive system 12 so as to move the modeling head 11 to the position Chfm (+ Y) specified in step S3223 (step S3233). After that, after the modeling head 11 reaches the position Chfm (+ Y), the modeling system 1 controls the control device 15 along the Y axis of the head coordinate system Ch and toward the + Y side of the head coordinate system Ch. While moving the modeling head 11, a test mark TM (+ Y) is formed on the mark member FM arranged in the designated mark area 134d (step S3243).

Further, as shown in FIG. 9, the control device 15 is subjected to processing for forming at least one of the test mark TM (+ X), the test mark TM (−X), and the test mark TM (+ Y). In the head coordinate system Ch, the position Chfm (−Y) of the modeling head 11 when starting to form the test mark TM (−Y) on the mark member FM arranged in the designated mark region 134d is specified (step S3224). After that, the control device 15 controls the head drive system 12 so as to move the modeling head 11 to the position Chfm (−Y) specified in step S3224 (step S3234). After that, after the modeling head 11 reaches the position Chfm (-Y), the modeling system 1 is controlled by the control device 15 along the Y axis of the head coordinate system Ch and on the −Y side of the head coordinate system Ch. The test mark TM (−Y) is formed on the mark member FM arranged in the designated mark area 134d while moving the modeling head 11 toward the direction (step S3244).

After that, as shown in FIG. 10, the measuring device 14 measures the state of the object (specifically, the measurement object including the four types of test mark TM and the work W) on the stage 13 (step S331). The measurement result of the measuring device 14 (that is, information on the state of the measurement object including the four types of test mark TM and the work W) is output to the control device 15.

After that, the control device 15 identifies the position Cstm of the four types of test mark TM formed in the stage coordinate system Cs based on the measurement result of the measuring device 14 (step S332). In particular, the control device 15 specifies the position of the end portion of each test mark TM (particularly, the end portion corresponding to the first formed portion of each test mark TM) as the position Cstm. The control device 15 may specify the position of the center of gravity or the center of each test mark TM as the position Cstm.

Specifically, as shown in FIG. 11, the test mark TM (+ X) adds a modeled object from the end on the −X side to the end on the + X side of the test mark TM (+ X). It is formed by processing. Therefore, the control device 15 specifies the position of the end portion of the test mark TM (+ X) on the −X side as the position Cstm (+ X). Similarly, the test mark TM (-X) is formed by performing additional processing in which a modeled object is added from the + X side end portion of the test mark TM (-X) toward the -X side end portion. Will be done. Therefore, the control device 15 specifies the position of the end portion on the + X side of the test mark TM (−X) as the position Cstm (−X). Similarly, the test mark TM (+ Y) is formed by performing additional processing in which a modeled object is added from the −Y side end portion of the test mark TM (+ Y) toward the + Y side end portion. .. Therefore, the control device 15 specifies the position of the end portion of the test mark TM (+ Y) on the −Y side as the position Cstm (+ Y). Similarly, the test mark TM (-Y) is formed by performing additional processing in which a modeled object is added from the + Y side end portion of the test mark TM (-Y) toward the -Y side end portion. Will be done. Therefore, the control device 15 specifies the position of the end portion on the + Y side of the test mark TM (−Y) as the position Cstm (−Y).

Further, the control device 15 specifies a modeling start position Cs_start to start modeling on the work modeling surface MSW in the stage coordinate system Cs based on the measurement result of the measuring device 14 (step S332). The method of specifying the modeling start position Cs_start in step S332 may be the same as the method of specifying the modeling start position Cs_start in step S232 of FIG. 6 described above.

After that, the control device 15 moves the modeling head 11 to the modeling start position Ch_start (step S3411 to step S3414). In particular, in the first modification, the control device 15 is formed by the modeling head 11 that moves in the same direction as the moving direction of the modeling head 11 when the modeling head 11 starts moving with the start of additional processing on the work W. The modeling head 11 is moved to the modeling start position Ch_start based on the position Cstm of the test mark TM. For example, when the modeling head 11 starts moving along the X axis and toward the + X side with the start of additional processing, the control device 15 is based on the position Cstm (+ X) of the test mark TM (+ X). Then, the modeling head 11 is moved to the modeling start position Ch_start. For example, when the modeling head 11 starts moving along the X axis and toward the −X side with the start of the additional processing, the control device 15 determines the position Cstm (−X) of the test mark TM (−X). ), The modeling head 11 is moved to the modeling start position Ch_start. For example, when the modeling head 11 starts moving along the X axis and toward the + Y side with the start of additional processing, the control device 15 is based on the position Cstm (+ Y) of the test mark TM (+ Y). Then, the modeling head 11 is moved to the modeling start position Ch_start. For example, when the modeling head 11 starts moving along the X axis and toward the −Y side with the start of the additional processing, the control device 15 determines the position Cstm (−Y) of the test mark TM (−Y). ), The modeling head 11 is moved to the modeling start position Ch_start.

In order to move the modeling head 11 in this way, the control device 15 first determines in which direction the modeling head 11 starts moving with the start of additional processing (step S35). The control device 15 determines in which direction the modeling head 11 moves when the modeling head 11 starts moving with the start of additional processing (step S35). The control device 15 determines in which direction the modeling head 11 located at the modeling start position Ch_start starts moving with the start of additional processing (step S35). Specifically, the control device 15 can specify the position of the work W in the stage coordinate system Cs from the measurement result of the measurement device 14. Further, the control device 15 can specify how to form the three-dimensional structure ST on the work W based on the three-dimensional model data of the three-dimensional structure ST to be formed. When how to form the three-dimensional structure ST on the work W is specified, the movement locus of the modeling head 11 for forming the three-dimensional structure ST (for example, the first structural layer SL # 1). The movement locus of the modeling head 11 for forming the above) can be specified. If the movement locus of the modeling head 11 can be specified, the moving direction of the modeling head 11 when starting additional processing with respect to the work W can also be specified.

When it is determined in step S35 that the modeling head 11 starts moving along the X axis and toward the + X side, the control device 15 determines the position Cstm (+ X) of the test mark TM (+ X) specified in step S332. ), The position Chfm (+ X) of the modeling head 11 when the test mark TM (+ X) is formed (that is, the position Chfm (+ X) of the modeling head 11 specified in step S3221), and the modeling specified in step S332. Based on the start position Cs_start, the modeling head 11 is moved to the modeling start position Ch_start (step S3411). The operation of moving the modeling head 11 to the modeling start position Ch_start based on the position Cstm (+ X) of the test mark TM (+ X) in step S3411, the position Chfm (+ X) of the modeling head 11, and the modeling start position Cs_start is Even if it is the same as the operation of moving the modeling head 11 to the modeling start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the modeling head 11 and the modeling start position Cs_start in step S241 of FIG. good. Therefore, although a detailed description thereof will be omitted, the outline thereof will be briefly described below. For example, as shown in FIG. 12, the control device 15 moves from the position Cstm (+ X) = (Xstm (+ X), Ystm (+ X), Zstm (+ X)) of the test mark TM (+ X) to the modeling start position Cs_start. The moving amount and moving direction of the moving irradiation area EA are specified. After that, the control device 15 uses the transformation matrix T to convert the movement amount and movement direction of the irradiation region EA specified in the stage coordinate system Cs into the movement amount and movement direction of the modeling head 11 in the head coordinate system Ch. After that, the control device 15 moves the modeling head 11 located at the position Chfm (+ X) in the head coordinate system Ch toward the moving direction obtained by the conversion by the amount of movement obtained by the conversion. As a result, the modeling head 11 is located at the modeling start position Ch_start.

When it is determined in step S35 that the modeling head 11 starts moving along the X axis and toward the −X side, the control device 15 determines the position Cstm of the test mark TM (−X) specified in step S332. (-X), the position Chfm (-X) of the modeling head 11 when the test mark TM (-X) is formed (that is, the position Chfm (-X) of the modeling head 11 specified in step S3222), and Based on the modeling start position Cs_start specified in step S332, the modeling head 11 is moved to the modeling start position Ch_start (step S3412). Operation to move the modeling head 11 to the modeling start position Ch_start based on the position Cstm (-X) of the test mark TM (-X) in step S3412, the position Chfm (-X) of the modeling head 11, and the modeling start position Cs_start. Is the same as the operation of moving the modeling head 11 to the modeling start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the modeling head 11 and the modeling start position Cs_start in step S241 of FIG. May be good. The same applies to steps S3413 and S3414 described later.

When it is determined in step S35 that the modeling head 11 starts moving along the Y axis and toward the + Y side, the control device 15 determines the position Cstm (+ Y) of the test mark TM (+ Y) specified in step S332. ), The position Chfm (+ Y) of the modeling head 11 when the test mark TM (+ Y) is formed (that is, the position Chfm (+ Y) of the modeling head 11 specified in step S3223), and the modeling specified in step S332. Based on the start position Cs_start, the modeling head 11 is moved to the modeling start position Ch_start (step S3413).

When it is determined in step S35 that the modeling head 11 starts moving along the Y axis and toward the −Y side, the control device 15 determines the position Cstm of the test mark TM (−Y) specified in step S332. (-Y), the position Chfm (-Y) of the modeling head 11 when the test mark TM (-Y) is formed (that is, the position Chfm (-Y) of the modeling head 11 specified in step S3224), and Based on the modeling start position Cs_start specified in step S332, the modeling head 11 is moved to the modeling start position Ch_start (step S3414).

As described above, also in the first modification, as described above, the control device 15 can appropriately move the modeling head 11 to the modeling start position Ch_start. That is, the control device 15 can move the modeling head 11 so that the position of the modeling head 11 in the head coordinate system Ch after movement matches (or approaches) the modeling start position Ch_start. In other words, the control device 15 can move the modeling head 11 so that the irradiation region EA to which the light EL from the modeling head 11 after movement is irradiated is set to the modeling start position Cs_start.

Further, in the first modification, even if there is a possibility that the formation position of the modeled object on the work W may change due to the difference in the moving direction of the modeling head 11, the appropriate position on the work W The modeling head 11 can be appropriately moved to the modeling start position Ch_start so that the modeled object can be formed. Specifically, depending on the characteristics of the head drive system 12, the relative position between the position of the modeling head 11 in the head coordinate system Ch and the position of the model formed by the modeling head 11 in the stage coordinate system Cs. The positional relationship may vary depending on the moving direction of the modeling head 11. For example, between the position of the modeling head 11 in the head coordinate system Ch when the modeling head 11 is directed in the first direction and the position of the modeling object formed by the modeling head 11 in the stage coordinate system Cs. The relative positional relationship is the position of the modeling head 11 in the head coordinate system Ch when the modeling head 11 is oriented in the second direction and the stage coordinate system Cs of the modeled object formed by the modeling head 11. It may be different from the relative positional relationship with the position. In this case, the position in the stage coordinate system Cs of the modeled object formed by the modeling head 11 that has started to move from a certain position in the head coordinate system Ch toward the first direction (particularly, at the modeling start portion of the modeled object). The position of the corresponding end in the stage coordinate system Cs) is the position in the stage coordinate system Cs of the model formed by the modeling head 11 that has started to move from the same position in the head coordinate system Ch toward the second direction. May not match. As a result, the shape accuracy of the three-dimensional structure ST, which is an aggregate of shaped objects, may deteriorate. However, in the first modification, the control device 15 sets the modeling head 11 at the modeling start position Ch_start based on the positions of the plurality of test marks TM formed by the modeling heads 11 moving in different directions. Move it. Therefore, the relative positional relationship between the position of the modeling head 11 in the head coordinate system Ch and the position in the stage coordinate system Cs of the modeled object formed by the modeling head 11 depends on the moving direction of the modeling head 11. Even if it fluctuates, the modeling head 11 can form an appropriate modeled object from the modeling start position Cs_start of the stage coordinate system Cs. Therefore, deterioration of the shape accuracy of the three-dimensional structure ST is appropriately suppressed.

In the first modification, the test mark formed by the modeling head 11 that has moved in a direction different from the moving direction of the modeling head 11 when the modeling head 11 starts moving with the start of additional processing on the work W. The position Cstm of TM may be used. For example, when the modeling head 11 starts moving along the direction of 45 degrees with respect to the X axis and the Y axis and toward the + X side and the + Y side with the start of the additional processing, the control device 15 is tested. The modeling head 11 may be moved to the modeling start position Ch_start based on the position Cstm (+ X) of the mark TM (+ X) and the position Cstm (+ Y) of the test mark TM (+ Y). When the modeling head 11 starts moving along the direction of 45 degrees with respect to the X-axis and the Y-axis and toward the + X side and the + Y side with the start of the additional processing, the position of the test mark TM (+ X). The average value of the position Cstm (+ Y) of the Cstm (+ X) and the test mark TM (+ Y) may be used. If the temperature is not 45 degrees, the position Cstm (+ X) of the test mark TM (+ X) and the test mark TM ( A weighted average of the position Cstm (+ Y) at + Y) may be used. In this way, the statistic of the position Cstm of a plurality of test mark TMs may be used.

In the above description, a plurality of types of test mark TMs are formed on the same mark member 134 arranged in the designated mark area 134d. However, a part of the plurality of types of test mark TM is formed on the first mark member FM-1 arranged in the first designated mark area 134d-1, and the other part of the plurality of types of test mark TM is formed. , May be formed on the second mark member FM-2 arranged in the second designated mark area 134d-2 different from the first designated mark area 134d-1.

Further, in the above description, the shapes of the test marks TM (+ X), TM (-X), TM (+ Y), and TM (-Y) are linear, but the shape of the test marks is not linear. It may be curved or hook-shaped, for example.

(3-2) Second Modification Example With respect to the modeling surface MS corresponding to the surface of the work W (or the surface of the structural layer SL formed on the work W) during the modeling period in which the modeling operation is performed. Light EL is irradiated. Therefore, heat may be transferred from the optical EL to the work W via the modeling surface CS (further, via the structural layer SL). When heat is transferred to the work W, the work W may thermally expand. On the other hand, when the modeling operation is completed, the optical EL is not irradiated to the modeling surface MS, so that heat is not transferred from the optical EL to the work W. Therefore, the work W that has been thermally expanded may shrink.

Considering that the work W may be thermally expanded and contracted in this way, a modeled object (or a structural layer SL or a three-dimensional structure) formed on the work W in a state where the work W is thermally expanded in this way. The object ST) may shrink as the work W shrinks. As a result, the shape accuracy of the three-dimensional structure ST may deteriorate.

Therefore, in the second modification, the modeling system 1 controls the size of the modeled object to be formed by the additional processing based on the shape of the work W during the modeling period. Specifically, the measuring device 14 measures the shape of the work W before the modeling operation is started. As a result, the control device 15 can acquire the first shape information regarding the original shape (that is, the design shape) of the work W from the measuring device 14. Alternatively, the control device 15 may acquire the first shape information regarding the original shape of the work W by acquiring the design data of the work W. Further, the measuring device 14 measures the shape of the work W at a desired timing during the modeling period. As a result, the control device 15 can acquire the second shape information regarding the current shape of the work W from the measuring device 14. After that, the control device 15 determines whether or not the actual shape of the work W is different from the original shape of the work W based on the acquired first and second shape information. As a result, when it is determined that the actual shape of the work W is different from the original shape of the work W, the work W is deformed by the heat transmitted from the optical EL (typically). , Thermal expansion).

When the work W is thermally expanded, the control device 15 controls the size of the modeled object formed on the work W based on the amount of deviation of the actual shape of the work W with respect to the original shape of the work W. Form a model. Here, the deviation of the actual shape of the work W from the original shape of the work W due to the thermal expansion of the work W is such that the actual shape of the work W is enlarged or reduced with respect to the original shape of the work W. Including the deviation related to scaling. Specifically, for example, FIG. 13A is a plan view showing a modeled object formed on the work W when the work W is not thermally expanded. On the other hand, FIG. 13B is a plan view showing a modeled object formed on the work W when the work W is thermally expanded. As shown in FIGS. 13 (a) and 13 (b), the thermally expanded work W has an enlarged shape with respect to the work W having the original shape (that is, not thermally expanded). is doing. In this case, the control device 15 is shaped so that when the work W is thermally expanded, the size of the modeled object formed on the work W is also larger than that when the work W is not thermally expanded. The modeled object may be formed while controlling the size of the object. For example, the control device 15 may specify the correlation information that defines the relationship between the original shape of the work W and the actual shape of the work W, and control the size of the modeled object based on the correlation information. As an example of such correlation information, the coordinates indicating the position of the original work W (for example, the work W that is not thermally expanded) in the stage coordinate system Cs and the actual work W (for example, the work W that is thermally expanded) are shown. ) Is a matrix (for example, a matrix related to scaling) that defines the relationship with the coordinates indicating the same position in the stage coordinate system Cs.

The control device 15 has a ratio of the size of the modeled object to the size of the work W when the work W is thermally expanded, and a ratio of the size of the modeled object to the size of the work W when the work W is not thermally expanded. The size of the modeled object may be controlled so that the difference between the two is small. In particular, in the control device 15, the ratio of the size of the modeled object to the size of the work W when the work W is thermally expanded and the size of the modeled object to the size of the work W when the work W is not thermally expanded. The size of the model may be controlled so that it matches the ratio.

According to such a second modification, a modeled object (or a structural layer SL or a three-dimensional structure ST) formed on the work W in a state where the work W is thermally expanded accompanies the contraction of the work W. Even if it shrinks, the size of the shrunk model is the size of the model formed on the work W that is not thermally expanded (and therefore is not shrunk) in the first place (that is, it should have been formed originally). It does not deviate significantly from the size of the modeled object). In some cases, the size of the shrunk model may match the size of the model formed on the work W that has not been thermally expanded in the first place (that is, the size of the model that should have been formed). Therefore, deterioration of the shape accuracy of the three-dimensional structure ST is appropriately suppressed.

In the above description, the operation of measuring the current shape of the work W and acquiring the second shape information regarding the current shape of the work W is performed during the modeling period in which the modeling operation is performed. However, the operation of measuring the current shape of the work W and acquiring the second shape information regarding the current shape of the work W may be performed before the modeling operation is started. This is because the work W may be thermally expanded due to some factor even when the modeling operation is not started (that is, the optical EL is not irradiated on the modeling surface MS). ..

In the above description, an example is described in which the deviation of the actual shape of the work W with respect to the original shape of the work W is caused by the heat transferred from the optical EL. However, the deviation of the actual shape of the work W with respect to the original shape of the work W may occur due to other factors different from the heat transferred from the optical EL. Even in this case, the control device 15 forms the shaped object while controlling the size of the shaped object formed on the work W based on the amount of deviation of the actual shape of the work W with respect to the original shape of the work W. You may. As a result, deterioration of the shape accuracy of the three-dimensional structure ST is suppressed.

In the above description, the deviation of the actual shape of the work W from the original shape of the work W due to the thermal expansion of the work W expands or contracts the actual shape of the work W with respect to the original shape of the work W. It contains a scaling deviation of being. However, the deviation of the actual shape of the work W from the original shape of the work W due to the thermal expansion of the work W is that the actual work W is translated with respect to the original work W (for example, in the XY plane). It may include a deviation related to the parallel movement (moving in parallel along the line). The deviation of the actual shape of the work W from the original shape of the work W due to the thermal expansion of the work W is that the actual work W is rotated with respect to the original work W (for example, it is rotated around the Z axis). It may include a deviation related to rotation. Also in this case, the control device 15 is designed to prevent deterioration of the shape accuracy of the three-dimensional structure ST based on the amount of deviation of the actual shape of the work W with respect to the original shape of the work W (for example, deviation occurs). The difference between the shape of the three-dimensional structure ST formed in the situation where the work is being performed and the shape of the three-dimensional structure ST formed in the situation where no deviation has occurred is reduced or matched) with the work W. The modeled object may be formed while controlling the size (or any other characteristic such as the forming position) of the modeled object to be formed.

(3-3) Third Modified Example Next, a third modified example will be described. In the third modification, a part of the structure of the modeling system 1c in the third modification is different from the structure of the modeling system 1 described above. Hereinafter, the structure of the modeling system 1c in the third modification will be described with reference to FIG. 14. The same structure as the structure of the modeling system 1 described above is designated by the same reference numeral, and detailed description thereof will be omitted.

As shown in FIG. 14, the modeling system 1c is different from the above-mentioned modeling system 1 in that the modeling head 11c is provided in place of the modeling head 11. The modeling head 11c is different from the modeling head 11 described above in that the material nozzle 112c is further provided in addition to the irradiation system 111 and the material nozzle 112. The other structure of the modeling system 1c may be the same as the other structure of the modeling system 1.

The material nozzle 112c has a supply outlet (that is, a supply port) 114c for supplying the modeling material M. The material nozzle 112c supplies (specifically, spraying) the modeling material M from the supply outlet 114c. The material nozzle 112c is physically connected to a material supply device (not shown), which is a supply source of the modeling material M, via a powder transmission member such as a pipe (not shown). The material nozzle 112c supplies the modeling material M supplied from the material supply device via the powder transmission member. Although the material nozzle 112c is drawn in a tubular shape in FIG. 14, the shape of the material nozzle 112c is not limited to this shape.

The material nozzle 112c supplies the modeling material M downward (that is, the −Z side) from the material nozzle 112c. A stage 13 is arranged below the material nozzle 112c. When the work W is mounted on the stage 13, the material nozzle 112c supplies the modeling material M toward the work W.

The material nozzle 112c is aligned with respect to the irradiation system 111 so that the irradiation system 111 supplies the modeling material M toward the irradiation region EA on which the light EL is irradiated. That is, the material nozzle 112c and the irradiation region 112c are irradiated so that the supply region MAc set on the work W as the region for supplying the modeling material M and the irradiation region EA coincide with each other (or at least partially overlap). It is aligned with the system 111. That is, the supply area MAc set on the work W as the area where the material nozzle 112c supplies the modeling material M and the supply area MA set on the work W as the area where the material nozzle 112 supplies the modeling material M are Match (or at least partially overlap). However, the supply area MAc set on the work W as the area where the material nozzle 112c supplies the modeling material M overlaps with the supply area MA set on the work W as the area where the material nozzle 112 supplies the modeling material M. You don't have to.

In particular, in the third modification, the traveling direction of the modeling material M supplied from the material nozzle 112c is different from the traveling direction of the modeling material M supplied from the material nozzle 112. The supply direction of the modeling material M from the material nozzle 112c is different from the supply direction of the modeling material M from the material nozzle 112. That is, in the third modification, the modeling system 1c can supply the modeling material M to the work W or the upper surface 131 of the stage 13 (particularly, the mark region 134 or the mark member FM) from a plurality of different directions. .. In this case, for example, the modeling system 1c performs additional processing on the mark member FM while supplying the modeling material M from the material nozzle 112 to form a first test mark TM on the mark member FM, and modeling from the material nozzle 112c. The mark member FM may be subjected to additional processing while supplying the material M to form a second test mark TM different from the first test mark TM on the mark member FM. The traveling direction of the modeling material M supplied from the material nozzle 112c is a direction tilted by a predetermined angle (an acute angle as an example) with respect to the Z axis, but is directly below (that is, a direction corresponding to the Z axis). You may.

In the above description, the modeling system 1c includes a single modeling head 11c including the material nozzle 112c in addition to the irradiation system 111 and the material nozzle 112. However, the modeling system 1c may include the modeling head 11c-1 including the material nozzle 112c, separately from the modeling head 11 including the irradiation system 111 and the material nozzle 112. In this case, the head drive system 12 may move the modeling head 11c-1 separately from the modeling head 11.

(3-4) Fourth Modified Example Next, the fourth modified example will be described. In the fourth modification, a part of the structure of the modeling system 1d in the fourth modification is different from the structure of the modeling system 1 described above. Hereinafter, the structure of the modeling system 1d in the fourth modification will be described with reference to FIG. The same structure as the structure of the modeling system 1 described above is designated by the same reference numeral, and detailed description thereof will be omitted.

As shown in FIG. 15, the modeling system 1d differs from the above-mentioned modeling system 1 in that the modeling head 11d is provided in place of the modeling head 11. The modeling head 11d is different from the above-mentioned modeling head 11 in that the irradiation system 111d is further provided in addition to the irradiation system 111 and the material nozzle 112. The other structure of the modeling system 1d may be the same as the other structure of the modeling system 1.

The irradiation system 111d is an optical system (for example, a condensing optical system) for emitting optical EL from the injection unit 113d. Specifically, the irradiation system 111d is optically connected to a light source (not shown) that emits an optical EL via an optical transmission member (not shown) such as an optical fiber. The irradiation system 111d emits optical EL propagating from the light source via the optical transmission member. The irradiation system 111d irradiates the optical EL downward (that is, the −Z side) from the irradiation system 111d. A stage 13 is arranged below the irradiation system 111d. When the work W is mounted on the stage 13, the irradiation system 111d can irradiate the work W with light EL. Specifically, the irradiation system 111d irradiates the irradiation area EAd having a predetermined shape set on the work W as the area to be irradiated with the light EL (typically, focused) with the light EL. Further, the state of the irradiation system 111d can be switched between a state in which the irradiation region EAd is irradiated with the light EL and a state in which the irradiation region EAd is not irradiated with the light EL under the control of the control device 15. The irradiation region EAd on which the irradiation system 111d irradiates the light EL may coincide with the irradiation region EA on which the irradiation system 111 irradiates the light EL. The irradiation region EAd on which the irradiation system 111d irradiates the light EL may at least partially overlap with the irradiation region EA on which the irradiation system 111 irradiates the light EL. The irradiation region EAd on which the irradiation system 111d irradiates the light EL does not have to overlap with the irradiation region EA on which the irradiation system 111 irradiates the light EL.

In particular, in the fourth modification, the traveling direction of the light EL irradiated from the irradiation system 111d is different from the traveling direction of the light EL irradiated from the irradiation system 111. The irradiation direction of the light EL from the irradiation system 111d is different from the irradiation direction of the light EL from the irradiation system 111. That is, in the fourth modification, the modeling system 1d can irradiate the work W or the upper surface 131 of the stage 13 (particularly, the mark region 134 or the mark member FM) with light EL from a plurality of different directions. In this case, for example, the modeling system 1d performs additional processing on the mark member FM with the light EL irradiated by the irradiation system 111 to form the first test mark TM on the mark member FM, and the light irradiated by the irradiation system 111d. The mark member FM may be subjected to additional processing by EL to form a second test mark TM different from the first test mark TM on the mark member FM. The traveling direction of the modeling material M supplied from the material nozzle 112c is directly below (that is, a direction corresponding to the Z axis), but is a direction inclined by a predetermined angle (an acute angle as an example) with respect to the Z axis. You may.

In the above description, the modeling system 1d includes a single modeling head 11d including the irradiation system 111d in addition to the irradiation system 111 and the material nozzle 112. However, the modeling system 1d may include the modeling head 11d-1 including the irradiation system 111d separately from the modeling head 11 including the irradiation system 111 and the material nozzle 112. In this case, the head drive system 12 may move the modeling head 11d-1 separately from the modeling head 11.

Further, in the fourth modification as well, the modeling head 11d may be provided with the material nozzle 112c, as in the third modification. In this case, the material nozzle 112 supplies the modeling material M to the irradiation region EA where the irradiation system 111 irradiates the light EL, and the material nozzle 112c supplies the modeling material M to the irradiation region EAd where the irradiation system 111d irradiates the light EL. May be supplied. Alternatively, the modeling system 1d may include a modeling head 11d-2 including an irradiation system 111d and a material nozzle 112c, separately from the modeling head 11 including the irradiation system 111 and the material nozzle 112.

(3-5) Other Modifications In the above description, the mark member FM is arranged in the mark area 134. However, the mark member FM may not be arranged in the mark region 134. In this case, the modeling system 1 may form the test mark TM in the mark region 134 instead of the mark member FM.

In the above description, the modeling system 1 forms a test mark TM on the mark member FM arranged in the mark region 134. However, the modeling system 1 may form the test mark TM on the mark member FM arranged in a region different from the mark region 134. For example, the modeling system 1 may form a test mark TM on a mark member FM arranged at an arbitrary position in the non-holding region 133 of the stage 13. The modeling system 1 may form a test mark TM on the mark member FM arranged at an arbitrary position in the holding region 132 of the stage 13. The modeling system 1 may form a test mark TM on a mark member FM arranged at an arbitrary position of the work W held by the stage 13.

In the above description, the modeling system 1 forms a test mark TM on the mark member FM. However, the modeling system 1 may form the test mark TM on a member different from the mark member FM. For example, the modeling system 1 may form a test mark TM at an arbitrary position in the non-holding region 133 of the stage 13. For example, the modeling system 1 may form a test mark TM at an arbitrary position in the holding region 132 of the stage 13. The modeling system 1 may form a test mark TM at an arbitrary position on the work W held by the stage 13. When the test mark TM is formed on the work W held by the stage 13, the position where the test mark TM is formed may be different from the region where the modeled object is modeled.

In the above description, in the initial setting operation, the plurality of mark member FMs are arranged in the plurality of mark areas 134, respectively. However, while the mark member FM is arranged in a part of the plurality of mark areas 134, the mark member FM may not be arranged in the remaining part of the plurality of mark areas 134. For example, the mark member FM is arranged in the number of mark areas 134 required for calculating the transformation matrix T in the plurality of mark areas 134, while the mark member FM is arranged in the rest of the plurality of mark areas 134. It does not have to be done. In the above example, in order to calculate the transformation matrix T, test mark TM is formed in each of at least three mark member FMs arranged in at least three mark regions 134. In this case, when four or more mark areas 134 are set in the stage 13, for example, at least three mark member FMs are arranged in the three mark areas 134, while the remaining one or more marks. The mark member FM may not be arranged in the region 134.

In the above description, the modeling system 1 performs the alignment operation before starting the modeling operation for performing additional processing on the work W. However, the modeling system 1 may perform the positioning operation at other timings. For example, the modeling system 1 may perform an alignment operation (particularly, an initial setting operation) in preparation for the next modeling operation after completing the modeling operation (that is, after forming the three-dimensional structure ST). .. For example, the modeling system 1 may temporarily suspend the modeling operation in the middle of the modeling operation and then perform the positioning operation. In this case, the modeling system 1 resumes the interrupted modeling operation after the alignment operation is completed. As an example, for example, the modeling system 1 may perform the positioning operation after temporarily suspending the modeling operation before forming the next structural layer SL each time a certain structural layer SL is formed. ..

In the above description, the head moving operation is an operation for moving the modeling head 11 to the modeling start position Ch_start. However, the head moving operation may include an operation for moving the modeling head 11 to an arbitrary position Ch_any in the head coordinate system Ch. The control device 15 may move the modeling head 11 to an arbitrary position Ch_any in the head coordinate system Ch by performing the same operation as in the case of moving the modeling head 11 to the modeling start position Ch_start. That is, the control device 15 identifies an arbitrary position Cs_any in the stage coordinate system Cs instead of the above-mentioned modeling start position Cs_start, and is based on the position Cstm of the test mark, the position Chfm of the modeling head 11, and the position Cs_any. In the head coordinate system Ch, the modeling head 11 may be moved to the position Ch_any corresponding to the position Cs_any.

In the above description, the modeling system 1 includes a head drive system 12 for moving the modeling head 11. However, the modeling system 1 may include a stage drive system for moving the stage 13 in addition to or in place of the head drive system 12. The stage drive system may move the stage 13 in at least one direction of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. Due to the movement of the stage 13 by the stage drive system, the relative positional relationship between the stage 13 and the modeling head 11 (that is, the work W and the irradiation region EA) is similar to the movement of the modeling head 11 by the head drive system 12. (Relative positional relationship between) is changed.

In the above description, the modeling system 1 moves the irradiation region EA with respect to the modeling surface MS by moving the modeling head 11. However, the modeling system 1 may move the irradiation region EA with respect to the modeling surface MS by deflecting the optical EL in addition to or instead of moving the modeling head 11. In this case, the irradiation system 111 may include, for example, an optical system capable of deflecting the optical EL (for example, a galvano mirror or the like).

In the above description, the alignment operation is an operation of moving the modeling head 11 with respect to the work W (that is, with respect to the stage 13) so as to align the work W with the modeling head 11. Here, the purpose of aligning the work W and the modeling head 11 is to change the position of the irradiation region EA by moving the modeling head 11 to irradiate the desired position of the work W (for example, the modeling start position Cs_start). It is to set the area EA. Then, the alignment operation is substantially equivalent to the operation of moving the irradiation region EA with respect to the work W (that is, with respect to the stage 13) in order to align the work W with the irradiation region EA. Is. In this case, the modeling system 1 moves the stage 13 using the above-mentioned stage drive system in addition to or instead of moving the modeling head 11 using the head drive system 12 in order to perform the alignment operation. Therefore, the irradiation region EA may be moved with respect to the work W (that is, with respect to the stage 13). For example, in the modeling system 1, the stage coordinate system Cs is set so that the irradiation region EA is set to a desired position in the stage coordinate system Cs while the position of the modeling head 11 is fixed or in accordance with the movement of the modeling head 11. The stage 13 may be moved within. Alternatively, in addition to or in place of moving at least one of the modeling head 11 and the stage 13, the modeling system 1 may deflect the above-mentioned optical EL into an optical system (eg, a galvano mirror) capable of deflecting the above-mentioned optical EL. Etc.) may be used to move the irradiation area EA to move the irradiation area EA with respect to the work W (that is, with respect to the stage 13). For example, in the modeling system 1, the irradiation region EA is set to a desired position in the stage coordinate system Cs while the position of the modeling head 11 is fixed or in accordance with the movement of the modeling head 11 (see FIG. 7). , The irradiation area EA may be moved within the head coordinate system Ch. In any case, by performing the above-mentioned alignment operation, the irradiation region EA can be set at the desired position of the work W (for example, the modeling start position Cs_start).

In the above description, the modeling system 1 melts the modeling material M by irradiating the modeling material M with light EL. However, the modeling system 1 may melt the modeling material M by irradiating the modeling material M with an arbitrary energy beam. In this case, the modeling system 1 may include a beam irradiation device capable of irradiating an arbitrary energy beam in addition to or in place of the irradiation system 111. Any energy beam includes, but is not limited to, a charged particle beam such as an electron beam, an ion beam, or an electromagnetic wave.

In the above description, the modeling system 1 can form the three-dimensional structure ST by the laser overlay welding method. However, the modeling system 1 may form the three-dimensional structure ST from the modeling material M by another method capable of forming the three-dimensional structure ST. Other methods include, for example, a powder bed fusion bonding method (Power Bed Fusion) such as a powder sintering layered manufacturing method (SLS: Selective Laser Sintering), a binder jetting method (Binder Jetting), or a laser metal fusion method (LMF:). Laser Metall Fusion).

At least a part of the constituent elements of each of the above-described embodiments can be appropriately combined with at least another part of the constituent requirements of each of the above-described embodiments. Some of the constituent requirements of each of the above embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all published gazettes and US patents cited in each of the above embodiments shall be incorporated as part of the text.

The present invention is not limited to the above-described embodiment, and can be appropriately modified within the scope of claims and within the scope not contrary to the gist or idea of the invention that can be read from the entire specification. The processing method is also included in the technical scope of the present invention.

1 Modeling system 11 Modeling head 111 Irradiation system 112 Material nozzle 13 Stage 131 Top surface 132 Holding area 133 Non-holding area 134 Mark area 14 Measuring device W work M Modeling material LS Structural layer ST 3D structure FM Mark member TM test mark

Claims (51)

A support device that can support the object to be machined and
A processing device that irradiates an energy beam on a region to be processed on the object to be processed and supplies a material to the region irradiated with the energy beam to perform additional processing.
A position changing device for changing the positional relationship between the support device and the irradiation region of the energy beam from the processing device is provided.
At least one of the first region, which is a part of the support device, and the second region, which is a part of the work object, is subjected to additional processing to form a reference model.
A processing system that controls at least one of the processing device and the position changing device using information about the reference model. The processing system according to claim 1, wherein the position changing device is controlled so that additional processing is performed on a desired portion of the processing object by using the information regarding the reference modeled object. The processing system according to claim 1 or 2, wherein the position changing device is controlled so that additional processing is started from a desired portion of the processing object by using the information regarding the reference model. The processing apparatus and the processing apparatus so as to perform additional processing on at least one of the first region and the second region to form the reference modeled object before the processing apparatus starts additional processing on the object to be processed. Control the position change device
After forming the reference model, the position changing device is controlled by using the information about the reference model.
The item according to any one of claims 1 to 3, wherein the processing device is controlled so as to start additional processing on the processing target after controlling the position changing device using the information regarding the reference modeled object. Described processing system. The processing apparatus and the processing apparatus so as to perform additional processing on at least one of the first region and the second region to form the reference modeled object before the processing apparatus starts additional processing on the object to be processed. Control the position change device
After forming the reference model, the position change device is used with the information about the reference model so that the irradiation region is set in the processing start portion of the object to be processed where additional processing should be started. Control and
The machining system according to any one of claims 1 to 4, wherein the machining apparatus is controlled so as to start additional machining with respect to the machining object after the irradiation region is set in the machining start portion. The movement direction calculated based on the information about the reference model, with the position of the irradiation region with respect to the support device when the reference model is formed in at least one of the first region and the second region as a base point. The processing system according to any one of claims 1 to 5, which controls the position changing device so that the irradiation region moves toward the support device. The moving distance calculated based on the information about the reference model based on the position of the irradiation region with respect to the support device when the reference model is formed in at least one of the first region and the second region. The processing system according to any one of claims 1 to 6, which controls the position changing device so that the position of the irradiation area is changed only with respect to the support device. The processing system according to any one of claims 1 to 7, wherein the position changing device moves the processing device with respect to the support device to change the positional relationship between the support device and the irradiation region. The processing apparatus and the processing apparatus so as to perform additional processing on at least one of the first region and the second region to form the reference modeled object before the processing apparatus starts additional processing on the object to be processed. Control the position change device
Regarding the reference modeled object, the processing apparatus is located at a processing start position where additional processing can be performed on a processing start portion of the processing object to which additional processing should be started after the reference modeled object is formed. The information is used to control the position changing device.
The machining system according to claim 8, wherein the machining apparatus is controlled so as to start additional machining with respect to the machining object after the machining apparatus is positioned at the machining start position. The movement direction calculated based on the information about the reference modeled object based on the position of the processing device with respect to the support device when the reference modeled object is formed in at least one of the first region and the second region. The processing system according to claim 8 or 9, which controls the position changing device so that the processing device moves toward the support device. The moving distance calculated based on the information about the reference model based on the position of the processing device with respect to the support device when the reference model is formed in at least one of the first region and the second region. The processing system according to any one of claims 8 to 10, which controls the position change device so that the position of the processing device is changed only with respect to the support device. The processing system according to any one of claims 1 to 11, wherein the information regarding the reference model includes information regarding the state of the reference model. The processing system according to any one of claims 1 to 12, wherein the information regarding the reference model includes first position information regarding a relative positional relationship between the object to be processed and the reference model. The first position information includes information on the relative positional relationship between the processing start portion of the processing object to which additional processing should be started and the reference modeled object.
The processing system according to claim 13. The first position information is the relative position between the processed object and the reference modeled object along the first direction, and the processed object and the reference modeled object along the second direction intersecting the first direction. A claim that includes information about a relative position to an object and at least one of the relative positions of the object to be machined and the reference model along a third direction that intersects the first and second directions. Item 13. The processing system according to Item 13. In addition to the information regarding the reference model, a second regarding the relative positional relationship between the support device and the processing device when the reference model is formed in at least one of the first region and the second region. The processing system according to any one of claims 1 to 15, wherein the position changing device is controlled by using the position information. The processing is performed so as to perform additional processing on the first region while changing the positional relationship between the support device and the processing device along the fourth direction to form the first modeled object as the reference modeled object. The processing system according to any one of claims 1 to 16, which controls the apparatus and the position changing apparatus. The processing system according to claim 17, wherein the information regarding the reference model includes the first information regarding the first model. When the processing device starts additional processing so as to perform additional processing on the processing object while moving along the fourth direction with respect to the support device, the position is used using the first information. The processing system according to claim 18, which controls the changing device. Using the first information, the position changing device is controlled so that the machining device is located at the machining start position where the additional machining can be performed on the machining start portion of the machining object to which the additional machining should be started. Then, claim 18 or 19 for controlling the processing device so that the processing device starts the additional processing performed on the support device while the processing device moves along the fourth direction with respect to the processing object. The processing system described in. While the processing device moves along a fifth direction different from the fourth direction with respect to the support device, additional processing is performed on at least one of the first region and the second region to obtain the reference model. The processing system according to any one of claims 17 to 20, which controls the processing apparatus and the position changing apparatus so as to form the second modeled object of the above. The processing system according to claim 21, wherein the information regarding the reference model includes the second information regarding the second model. When the processing device starts the additional processing so as to perform the additional processing on the processing object while moving along the fifth direction with respect to the support device, the position is used by using the second information. 22. The machining system according to claim 22, which controls the changing device. Using the second information, the position changing device is controlled so that the machining device is located at the machining start position where the additional machining can be performed on the machining start portion of the machining object to which the additional machining should be started. Then, claim 22 or 23, which controls the processing device so as to start additional processing on the processing object while the processing device moves along the fifth direction with respect to the support device. The processing system described in. The processing system according to any one of claims 21 to 24, wherein the fifth direction is a direction opposite to the fourth direction. While the processing device moves along a sixth direction different from the fourth direction with respect to the support device, additional processing is performed on at least one of the first region and the second region to obtain the reference model. The processing system according to any one of claims 17 to 25, which controls the processing apparatus and the position changing apparatus so as to form the third modeled object of the above. The processing system according to claim 26, wherein the information regarding the reference model includes the third information regarding the third model. When the processing device starts the additional processing so as to perform the additional processing on the processing object while moving along the sixth direction with respect to the support device, the position is used by using the third information. 28. The machining system according to claim 27, which controls the changing device. Using the third information, the position changing device is controlled so that the machining device is located at the machining start position where the additional machining can be performed on the machining start portion of the machining object to which the additional machining should be started. Then, claim 27 or 28, which controls the processing device so as to start additional processing on the processing object while the processing device moves along the sixth direction with respect to the support device. The processing system described in. The processing system according to any one of claims 27 to 29, wherein the sixth direction intersects the fourth direction. While the processing device moves along a seventh direction different from the fourth direction and the sixth direction with respect to the support device, additional processing is performed on at least one of the first region and the second region, and the processing is performed. The processing system according to any one of claims 27 to 30, which controls the processing apparatus and the position changing apparatus so as to form a fourth modeled object as a reference modeled object. The processing system according to claim 31, wherein the information regarding the reference model includes the fourth information regarding the fourth model. When the processing device starts additional processing so as to perform additional processing on the processing object while moving along the seventh direction with respect to the support device, the position is used using the fourth information. The machining system according to claim 32, which controls the changing device. Using the fourth information, the position changing device is controlled so that the machining device is located at the machining start position where the additional machining can be performed on the machining start portion of the machining object to which the additional machining should be started. Then, claim 32 or 33, which controls the processing device so as to start additional processing on the processing object while the processing device moves along the seventh direction with respect to the support device. The processing system described in. The processing system according to any one of claims 32 to 34, wherein the seventh direction is a direction that intersects the fourth direction and is a direction opposite to the sixth direction. The processing system according to any one of claims 1 to 35, wherein the information regarding the reference model is measured by a measuring device. The processing system according to claim 36, further comprising the measuring device. The processing system according to claim 36 or 37, wherein the measuring device can measure a relative positional relationship between the processing object and the reference modeled object. The first portion of at least one of the first region and the second region is subjected to additional processing to form a fifth model as the reference model, and at least one of the first region and the second region. A second portion different from the first portion is subjected to additional processing to form a sixth model as the reference model, and at least one of the first region and the second region. The processing device and the position changing device are controlled so as to perform additional processing on the third part different from the first and second parts to form the seventh modeled object as the reference modeled object.
The information regarding the reference model includes the fifth information regarding the fifth model to the seventh model.
Using the fifth information, the relative positional relationship between the first coordinate system in which the position of the processing apparatus is represented, the machining object measured by the measuring device, and the reference modeled object is represented. The machining system according to claim 38, which associates with a second coordinate system. 39. The processing system of claim 39, wherein at least one height from the first portion to the third portion is different from at least one other height from the first portion to the third portion. The processing system according to claim 39 or 40, wherein a support region capable of supporting the processing object in the support device is arranged between at least two of the first portion and the third portion. Claims 1 to 41 that control at least one of the machining apparatus and the position changing apparatus based on the deviation information regarding the deviation between the actual shape of the machining object and the design shape of the machining object. The processing system described in any one of the items. 42. Claim 42, which controls at least one of the processing device and the position changing device so that an additional model having a desired shape is added to a desired portion of the processing target by additional processing based on the deviation information. Processing system. Based on the deviation information, the processing device and the position change so that the larger the actual shape of the processing object with respect to the design shape of the processing object, the larger the shape of the additional modeled object. The machining system according to claim 43, which controls at least one of the devices. The processing system according to any one of claims 1 to 44, wherein the information regarding the reference model includes dimensional information regarding the dimensions of the standard model. The processing system according to any one of claims 1 to 45, wherein the information regarding the reference model includes shape information regarding the shape of the reference model. While supplying the material from the eighth direction to the region irradiated with the energy beam, additional processing is performed on at least one of the first region and the second region to form the eighth model as the reference model. death,
While supplying the material from a ninth direction different from the eighth direction to the region irradiated with the energy beam, additional processing is performed on at least one of the first region and the second region to obtain the reference model. 9. The processing system according to any one of claims 1 to 46, which forms a modeled object. The processing apparatus includes a first supply port for supplying the material and a second supply port for supplying the material.
While supplying the material to the region irradiated with the energy beam from the first supply port, additional processing is performed on at least one of the first region and the second region, and the eighth modeled object as the reference modeled object is used. Form and
While supplying materials from the second supply port to the region irradiated with the energy beam, additional processing is performed on at least one of the first region and the second region to obtain a ninth model as the reference model. The processing system according to any one of claims 1 to 47 to be formed. While irradiating the object to be processed with the energy beam from the tenth direction, additional processing is performed on at least one of the first region and the second region to form the tenth model as the reference model. ,
While irradiating the object to be processed with the energy beam from an eleventh direction different from the tenth direction, additional processing is performed on at least one of the first region and the second region to obtain the reference model. 11. The processing system according to any one of claims 1 to 48 for forming a modeled object. It is a processing method that irradiates an energy beam from a processing device to perform additional processing on an object to be processed.
Supporting the object to be processed by a support device and
To form a reference model by performing additional processing on at least one of the first region that is a part of the support device and the second region that is a part of the work object.
Measuring the reference model and
A processing method including changing the positional relationship between the support device and the irradiation region of the energy beam from the processing device based on the measured information about the reference model. A processing method for performing additional processing on the object to be processed by using the processing system according to any one of claims 1 to 49.

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