JP2024037869A - Processing system and processing method - Google Patents

Abstract

[Problem] It is an object of the present invention to provide a processing system capable of performing additional processing at an appropriate position. [Solution] The processing system includes a support device capable of supporting a processing object, a processing device that irradiates an energy beam onto a processing area on the processing object and supplies material to the area irradiated with the energy beam to perform additional processing, and a position changing device that changes the positional relationship between the support device and the irradiation area of the energy beam from the processing device, and performs additional processing on at least one of a first area that is part of the support device and a second area that is part of the processing object to form a reference object, and controls at least one of the processing device and the position changing device using information about the reference object. [Selected Figure] Figure 1

Description

The present invention relates, for example, to the technical field of a processing system and processing method that performs additional processing on a workpiece.

Patent Document 1 describes a processing system that performs additional processing by melting a powdered material with an energy beam and then solidifying the melted material again. In such processing systems, performing additional processing at appropriate locations becomes a technical challenge.

US Patent Application Publication No. 2017/014909

According to a first aspect, there is provided a support device capable of supporting a workpiece, a support device that irradiates a workpiece area on the workpiece with an energy beam, and supplies and adds material to the area irradiated with the energy beam. A processing device that performs processing, and a position changing device that changes the positional relationship between the support device and the irradiation area of the energy beam from the processing device, and a first region that is a part of the support device; Performing additional processing on at least one of a second region that is a part of the workpiece to form a reference object, and controlling at least one of the processing device and the position changing device using information regarding the reference object. A processing system is provided.

According to a second aspect, there is provided a processing method for performing additional processing on a workpiece by irradiating an energy beam from a processing device, the workpiece being supported by a support device; forming a reference object by performing additional processing on at least one of a first region that is a part and a second region that is a part of the workpiece; measuring the reference object; and measuring the reference object. A processing method is provided that includes changing a positional relationship between the support device and an irradiation area of the energy beam from the processing device based on the information about the reference object.

The operation and other advantages of the present invention will become apparent from the detailed description below.

FIG. 1 is a sectional view showing the structure of the modeling system of this embodiment. FIG. 2 is a top view and a side view showing the top surface 131 of the stage 13 and the side surface of the stage 13, respectively. FIGS. 3(a) to 3(c) are cross-sectional views showing the state in which a certain area on a workpiece is irradiated with light and a modeling material is supplied, respectively. Each of FIGS. 4(a) to 4(c) is a cross-sectional view showing the process of forming a three-dimensional structure. FIG. 5 is a flowchart showing the flow of the initial setting operation of the alignment operation. FIG. 6 is a flowchart showing the flow of the head moving operation of the positioning operation. FIG. 7 is a plan view showing the relationship between the position of the test mark and the printing start position in the stage coordinate system, and the relationship between the position of the printing head and the printing start position in the head coordinate system. FIG. 8 is a flowchart showing a part of the head moving operation of the first modification. FIG. 9 is a flowchart showing another part of the head moving operation of the first modification. FIG. 10 is a flowchart showing another part of the head moving operation of the first modification. FIG. 11 is a plan view showing an example of a test mark used in the first modification. FIG. 12 is a plan view showing the relationship between the position of the test mark and the printing start position in the stage coordinate system, and the relationship between the position of the printing head and the printing start position in the head coordinate system. FIG. 13(a) is a plan view showing a model formed on a workpiece when the workpiece is not thermally expanded, and FIG. 13(b) is a plan view showing a modeled object formed on the workpiece when the workpiece is thermally expanding. FIG. FIG. 14 is a sectional view showing the structure of a modeling system according to a third modification. FIG. 15 is a sectional view showing the structure of a modeling system according to a fourth modification.

Hereinafter, embodiments of a processing system and a processing method will be described with reference to the drawings. In the following, an embodiment of a processing system and a processing method will be described using a modeling system 1 that can form a modeled object by performing additional processing using a modeling material M by laser metal deposition (LMD). Explain. Laser metal deposition (LMD) is used for direct metal deposition, direct energy deposition, laser cladding, laser engineered net shaping, direct write fabrication, and laser consolidation. , shape deposition manufacturing, wire-fed laser deposition, gas-through-wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct It may also be referred to as casting, laser powder deposition, laser additive manufacturing, or laser rapid forming.

Further, in the following description, the positional relationships of various components constituting the modeling system 1 will be explained using an XYZ orthogonal coordinate system defined by mutually orthogonal X, Y, and Z axes. In the following explanation, for convenience of explanation, each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction within a horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction perpendicular to the horizontal plane). It is assumed that the vertical direction is substantially the vertical direction or the direction of gravity). Further, the rotation directions (in other words, the tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Further, the XY plane may be set in the horizontal direction.

(1) Overall structure of the modeling system 1 First, the overall structure of the printing system 1 of this embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view showing an example of the structure of the modeling system 1 of this embodiment.

The modeling system 1 is a three-dimensional structure (that is, a three-dimensional object that has a size in any three-dimensional direction; a three-dimensional object, in other words, an object that has a size in the X, Y, and Z directions). ) ST can be formed. The modeling system 1 is capable of forming a three-dimensional structure ST on a workpiece W that serves as a foundation (that is, a base material) for forming the three-dimensional structure ST. The modeling system 1 can form a three-dimensional structure ST by performing additional processing on the workpiece W. When the workpiece W is a stage 13 described later, the modeling system 1 can form a three-dimensional structure ST on the stage 13. When the workpiece W is an existing structure held by the stage 13, the modeling system 1 can form the three-dimensional structure ST on the existing structure. In this case, the modeling system 1 may form a three-dimensional structure ST that is integrated with an existing structure. The operation of forming the three-dimensional structure ST integrated with an existing structure is equivalent to the operation of adding a new structure to the existing structure. Alternatively, the modeling system 1 may form a three-dimensional structure ST that is separable from an existing structure. Note that FIG. 1 shows an example in which the workpiece W is an existing structure held by the stage 13. Further, the explanation will be continued below using an example in which the workpiece W is an existing structure held by the stage 13.

As described above, the modeling system 1 is capable of forming a shaped object using the laser overlay welding method. In other words, the modeling system 1 can be said to be a 3D printer that forms objects using additive manufacturing technology. Note that the additive manufacturing technology is also referred to as rapid prototyping, rapid manufacturing, or additive manufacturing.

The modeling system 1 processes a modeling material M using light EL to form a modeled object. As such light LE, for example, at least one of infrared light, visible light, and ultraviolet light can be used, but other types of light may also be used. The light EL is laser light. Furthermore, the modeling material M is a material that can be melted by irradiation with light EL having a predetermined intensity or higher. As such a modeling material M, for example, at least one of a metallic material and a resinous material can be used. However, as the modeling material M, other materials different from metal materials and resin materials may be used. The modeling material M is a powdered or granular material. That is, the modeling material M is a granular material. However, the modeling material M does not have to be a powder or granule, and for example, a wire-shaped modeling material or a gaseous modeling material may be used. Note that the modeling system 1 may form a modeled object by processing the modeling material M with an energy beam such as a charged particle beam.

In order to process the modeling material M, the modeling device 4 includes a modeling head 11, a head drive system 12, a stage 13, a measuring device 14, and a control device 15. Further, the modeling head 11 includes an irradiation system 111 and a material nozzle (that is, a supply system that supplies the modeling material M) 112.

The irradiation system 111 is an optical system (for example, a condensing optical system) for emitting light EL from the emitting section 113. Specifically, the irradiation system 111 is optically connected to a light source (not shown) that emits light EL via a light transmission member (not shown) such as an optical fiber. The irradiation system 111 emits light EL propagating from a light source via a light transmission member. The irradiation system 111 irradiates light EL downward (that is, to the -Z side). A stage 13 is arranged below the irradiation system 111. When the workpiece W is mounted on the stage 13, the irradiation system 111 can irradiate the workpiece W with light EL. Specifically, the irradiation system 111 irradiates the light EL onto an irradiation area EA of a predetermined shape that is set on the workpiece W as an area where the light EL is irradiated (typically, condensed). Furthermore, the state of the irradiation system 111 is switchable under the control of the control device 15 between a state in which the irradiation area EA is irradiated with the light EL and a state in which the irradiation area EA is not irradiated with the light EL. Note that the direction of the light EL emitted from the irradiation system 111 is not limited to directly below (that is, the direction that coincides with the Z-axis), but may be, for example, a direction tilted by a predetermined angle with respect to the Z-axis. .

The material nozzle 112 has a supply outlet (i.e., a supply port) 114 for supplying the building material M. The material nozzle 112 supplies (specifically, jets, jets, or injects) the modeling material M from the supply outlet 114 . The material nozzle 112 is physically connected to a material supply device (not shown), which is a supply source of the modeling material M, via a powder transmission member such as a pipe (not shown). The material nozzle 112 supplies the modeling material M supplied from the material supply device via the powder transmission member. In addition, although the material nozzle 112 is drawn in a tube shape in FIG. 1, the shape of the material nozzle 112 is not limited to this shape. The material nozzle 112 supplies the modeling material M downward (that is, to the -Z side). A stage 13 is arranged below the material nozzle 112. When the workpiece W is mounted on the stage 13, the material nozzle 112 supplies the modeling material M toward the workpiece W. Note that the direction in which the modeling material M supplied from the material nozzle 112 is inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis, but is not directly below (that is, in a direction that coincides with the Z-axis). It's okay. Note that a plurality of material nozzles 112 may be provided.

In this embodiment, the material nozzle 112 is aligned with the irradiation system 111 so that the irradiation system 111 supplies the modeling material M toward the irradiation area EA where the light EL is irradiated. In other words, the material nozzle 112 and the irradiation area are arranged so that the supply area MA set on the work W as the area where the material nozzle 112 supplies the modeling material M and the irradiation area EA match (or at least partially overlap). system 111 are aligned. Note that the material nozzle 112 may be positioned so as to supply the modeling material M to the molten pool MP formed on the workpiece W by the light EL emitted from the irradiation system 111. Further, the supply area MA where the material nozzle 112 supplies the modeling material M and the area of the molten pool MP may be aligned so as to partially overlap.

The head drive system 12 moves the modeling head 11. The head drive system 12 moves the modeling head 11 along each of the X-axis, Y-axis, and Z-axis. The head drive system 12 may move the modeling head 11 along at least one of the θX direction, the θY direction, and the θZ direction in addition to each of the X, Y, and Z axes. The head drive system 12 includes, for example, a motor. When the head drive system 12 moves the modeling head 11, the irradiation area EA also moves relative to the work W on the work W. Therefore, the head drive system 12 can change the positional relationship between the workpiece W and the irradiation area EA (in other words, the positional relationship between the stage 13 that holds the workpiece W and the irradiation area EA) by moving the printing head 11. It is. In addition, the head drive system 12 can change the positional relationship between the workpiece W and the supply area MA (in other words, the positional relationship between the stage 13 that holds the workpiece W and the supply area MA) by moving the printing head 11. It is.

Note that the head drive system 12 may move the irradiation system 111 and the material nozzle 112 separately. Specifically, for example, the head drive system 12 may be able to adjust at least one of the position of the injection section 113, the direction of the injection section 113, the position of the supply outlet 114, and the direction of the supply outlet 114. In this case, the irradiation area EA where the irradiation optical system 111 irradiates the light EL and the supply area MA where the material nozzle 112 supplies the modeling material M can be controlled separately.

The stage 13 can hold the workpiece W. The stage 13 is further capable of releasing the held workpiece W. The above-mentioned irradiation system 111 irradiates the light EL during at least part of the period during which the stage 13 holds the workpiece W. Furthermore, the material nozzle 112 described above supplies the modeling material M during at least part of the period when the stage 13 holds the workpiece W. Note that a part of the modeling material M supplied by the material nozzle 112 may be scattered or spilled from the surface of the workpiece W to the outside of the workpiece W (for example, around the stage 13). For this reason, the modeling system 1 may include a collection device around the stage 13 that collects the scattered or spilled modeling material M.

The stage 13 includes an upper surface (+Z side surface in the example shown in FIG. 1) 131 that can face the modeling head 11 in order to hold the workpiece W. The upper surface 131 includes a holding area 132 and a non-holding area 133, as shown in FIG. 2, which includes a plan view showing the upper surface 131 of the stage 13 and a side view showing the side surface of the stage 13. Holding area 132 is part of top surface 131 . Note that the holding area 132 may be the entire upper surface 131. The holding area 132 is an area (for example, a surface) that can hold the workpiece W. Note that the holding area 132 may also be referred to as a holding surface or a supporting surface. The holding area 132 is an area set on the upper surface 131 to hold the work W. The holding area 132 may hold the work W using, for example, at least one of a mechanical chuck, a vacuum chuck, an electromagnetic chuck, an electrostatic chuck, or the like. The holding area 132 is a rectangular area in plan view, but may be an area of other shapes. Non-retention area 133 is a part of upper surface 131. The non-holding area 133 is an area (for example, a surface) that does not hold the workpiece W. The non-holding area 133 is a different area from the holding area 132. The non-retention area 133 is a rectangular frame-shaped area in plan view, but may be an area of other shapes. The non-holding area 133 may be located at the same height as the holding area 132 (that is, the position along the Z-axis), or may be located at a different height.

A plurality of mark areas 134 are set in the non-retention area 133. In the example shown in FIG. 2, three mark areas 134 (specifically, mark area 134 #1, mark area 134 #2, and mark area 134 #3) are set in the non-holding area 133. The plurality of mark areas 134 are set at predetermined positions within the non-retention area 133. The plurality of mark areas 134 are distributed discretely on the upper surface 131. The plurality of mark areas 134 are evenly distributed on the upper surface 131. The plurality of mark areas 134 are distributed so as to surround the holding area 132. The plurality of mark areas 134 are distributed on the top surface 131 such that the holding area 132 is located between at least two mark areas 134 . Note that at least a portion of the holding area 132 may be located in an area surrounded by a plurality of line segments connecting two of the at least three mark areas 134. In the example shown in FIG. 2, mark area 134#1 is arranged on the -Y side and +X side of holding area 132, mark area 134#2 is arranged on -X side of holding area 132, and 134#3 is arranged on the +Y side and +X side of the holding area 132. However, the distribution mode of the plurality of mark areas 134 is not limited to the above-mentioned distribution mode.

At least one of the plurality of mark areas 134 may be located on the same plane as the non-retention area 133. That is, the height of at least one of the plurality of mark areas 134 may be the same as the height of the non-retention area 133. Further, at least one of the plurality of mark areas 134 may be located on the same plane as the holding area 132. At least one of the plurality of mark areas 134 may be located on a different plane from the non-retention area 133. That is, the height of at least one of the plurality of mark areas 134 may be different from the height of the non-retention area 133. Further, the height of at least one of the plurality of mark areas 134 may be different from the height of the holding area 132. At least one of the plurality of mark areas 134 may be located on a different plane from at least one other of the plurality of mark areas 134. That is, the height of at least one of the plurality of mark areas 134 may be different from the height of at least one other of the plurality of mark areas 134. In the example shown in FIG. 2, each of marked areas 134#1 and 134#2 is located on the same plane as non-retention area 133, and marked area 134#3 is located on a different plane from marked areas 134#1 and 134#2. An example of location is shown. In other words, in the example shown in FIG. It shows.

Each of the plurality of mark areas 134 is used for an alignment operation for aligning the workpiece W and the modeling head 11. Although the details of the positioning operation will be explained later, an outline thereof will be briefly explained here. When an alignment operation is performed, a mark member FM is placed in each of the plurality of mark areas 134. Each of the plurality of mark areas 134 holds a mark member FM. Thereafter, the modeling system 1 performs additional processing on the mark member FM to form a test mark TM corresponding to a three-dimensional object on the mark member FM. Thereafter, the modeling system 1 uses the measuring device 14 to measure the state of the formed test mark TM. Thereafter, the modeling system 1 aligns the workpiece W and the printing head 11 using the measurement result of the state of the test mark TM.

Referring again to FIG. 1, the measuring device 14 measures the state of the object to be measured. In this embodiment, it is assumed that the measurement target is an object on the stage 13. Therefore, the object to be measured may include at least a portion of the workpiece W, the mark member FM, the test mark TM, and any other arbitrary object. The measuring device 14 measures the position of the measurement target on the stage 13, as an example of the state of the measurement target. For example, the measuring device 14 may measure the absolute position of a measurement target (for example, a test mark TM) on the stage 13. For example, the measuring device 14 may measure the relative position of a part of the measurement target (for example, the work W) on the stage 13 and another part of the measurement target (for example, the test mark TM). good.

In order to measure the position of the measurement target (particularly the position of the surface of the measurement target), the measuring device 14 may measure at least one of the shape and dimensions of the measurement target using any measurement method. good. Examples of measurement methods include pattern projection method, light cutting method, time-of-flight method, moiré topography method (specifically, grating irradiation method or grating projection method), holographic interferometry, autocollimation method, and stereo method. , an astigmatism method, a critical angle method, and a knife edge method. When at least one of the position, shape, and dimension of the object to be measured on the stage 13 is determined by measurement by the measuring device 14, each part of the object to be measured (for example, at least one of the workpiece W and the test mark TM) is measured on the stage 13. It becomes clear where is located. As a result, the position of the measurement target on the stage 13 can be calculated from at least one of the position, shape, and dimension of the measurement target.

The control device 15 controls the operation of the modeling system 1. The control device 15 may include, for example, an arithmetic device such as a CPU (Central Processing Unit), and a storage device such as a memory. In particular, in this embodiment, the control device 15 controls the emission mode of the light EL by the irradiation system 111. The emission mode includes, for example, at least one of the intensity of the light EL and the emission timing of the light EL. When the light EL is pulsed light, the emission mode includes, for example, at least one of the length of the light emission time of the pulsed light and the ratio of the light emission time and extinction time of the pulsed light (so-called duty ratio). Good too. Furthermore, the control device 15 controls the movement mode of the modeling head 11 by the head drive system 12. The movement mode includes, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing. Further, the control device 15 controls the manner in which the modeling material M is supplied by the material nozzle 112. The supply mode includes, for example, the supply amount (particularly the supply amount per unit time).

(2) Operation of the modeling system 1 Next, the operation of the modeling system 1 will be explained. In this embodiment, the modeling system 1 performs the modeling operation for forming the three-dimensional structure ST, as described above. Furthermore, the modeling system 1 performs an alignment operation for aligning the workpiece W and the printing head 11 before performing the modeling operation. Therefore, below, the modeling operation and the positioning operation for aligning the workpiece W and the modeling head 11 will be explained in order.

(2-1) Printing operation First, the printing operation will be explained. As described above, the modeling system 1 forms the three-dimensional structure ST using the laser overlay welding method. Therefore, the modeling system 1 may form the three-dimensional structure ST by performing an existing modeling operation based on the laser overlay welding method. An example of the operation of forming the three-dimensional structure ST using the laser overlay welding method will be briefly described below.

The modeling system 1 forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (for example, CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. The three-dimensional model data includes data representing the shape (in particular, the three-dimensional shape) of the three-dimensional structure ST. As the three-dimensional model data, measurement data of the three-dimensional object measured by the measuring device 14 provided in the modeling system 1 may be used. As the three-dimensional model data, measurement data from a three-dimensional shape measuring machine provided separately from the modeling system 1 may be used. Examples of such three-dimensional shape measuring machines include at least a contact-type three-dimensional measuring machine and a non-contact three-dimensional measuring machine, each having a probe that is movable relative to the workpiece W and that can come into contact with the workpiece W. One can be given. Examples of non-contact 3D measuring machines include pattern projection type 3D measuring machines, light cutting type 3D measuring machines, time-of-flight type 3D measuring machines, and moiré topography type 3D measuring machines. , a holographic interference type three-dimensional measuring machine, a CT (Computed Tomography) type three-dimensional measuring machine, and an MRI (Magnetic Resonance Imaging) type three-dimensional measuring machine. Design data of the three-dimensional structure ST may be used as the three-dimensional model data.

In order to form the three-dimensional structure ST, the modeling system 1 sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the modeling system 1 sequentially forms a plurality of structural layers SL, one layer at a time, obtained by cutting the three-dimensional structure ST into rings along the Z-axis direction. As a result, a three-dimensional structure ST, which is a layered structure in which a plurality of structural layers SL are stacked, is formed. Hereinafter, a flow of operations for forming a three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.

First, the operation of forming each structural layer SL will be explained. Under the control of the control device 15, the modeling system 1 sets an irradiation area EA in a desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL, and The light EL is irradiated from the irradiation system 111. Note that the area that the light EL irradiated from the irradiation system 111 occupies on the modeling surface MS may be referred to as the irradiation area EA. In this embodiment, the focus position of the light EL (that is, the light convergence position, in other words, the position where the light EL is most converged in the Z-axis direction or the traveling direction of the light EL) coincides with the modeling surface MS. There is. Note that the focus position of the light EL may be set at a position shifted from the modeling surface MS in the Z-axis direction. As a result, as shown in FIG. 3(a), the light EL emitted from the irradiation system 111 forms a molten pool (that is, a pool of liquid metal, resin, etc. melted by the light EL) on the desired area on the modeling surface MS. ) MP is formed. Furthermore, under the control of the control device 15, the modeling system 1 sets a supply area MA in a desired area on the modeling surface MS, and supplies the modeling material M from the material nozzle 112 to the supply area MA. Here, since the irradiation area EA and the supply area MA match as described above, the supply area MA is set in the area where the molten pool MP is formed. For this reason, the modeling system 1 supplies the modeling material M from the material nozzle 112 to the molten pool MP, as shown in FIG. 3(b). As a result, the modeling material M supplied to the molten pool MP is melted. When the molten pool MP is no longer irradiated with the light EL as the modeling head 11 moves, the modeling material M melted in the molten pool MP is cooled and solidified again (that is, solidified). As a result, as shown in FIG. 3(c), the re-solidified modeling material M is deposited on the modeling surface MS. In other words, a modeled object is formed by a deposit of the resolidified modeling material M. That is, a modeled object is formed by performing an additional process of adding a deposit of the modeling material M to the model surface MS.

A series of modeling processes including forming a molten pool MP by such light irradiation EL, supplying the modeling material M to the molten pool MP, melting the supplied modeling material M, and resolidifying the melted modeling material M, This process is repeated while moving the printing head 11 along the XY plane with respect to the printing surface MS. When the printing head 11 moves with respect to the printing surface MS, the irradiation area EA also moves relative to the printing surface MS. Therefore, a series of modeling processes are repeated while moving the irradiation area EA along the XY plane with respect to the modeling surface MS. At this time, the light EL is selectively irradiated to the irradiation area EA set in the area where the object is to be formed, while the irradiation area EA is set to the area where the object is not to be formed. Not selectively irradiated. Note that it can also be said that the irradiation area EA is not set in an area where it is not desired to form a modeled object. In other words, the modeling system 1 moves the irradiation area EA along a predetermined movement locus on the modeling surface MS, and emits light at a timing corresponding to the distribution of the area where the object is to be formed (that is, the pattern of the structural layer SL). EL is irradiated onto the modeling surface MS. As a result, a structural layer SL corresponding to an aggregate of objects made of the solidified modeling material M is formed on the modeling surface MS. In the above description, the irradiation area EA is moved relative to the modeling surface MS, but the modeling surface MS may be moved relative to the irradiation area EA.

The modeling system 1 repeatedly performs operations for forming such a structural layer SL under the control of the control device 15 based on the three-dimensional model data. Specifically, first, the control device 15 creates slice data by slicing the three-dimensional model data at a stacking pitch. Note that the control device 15 may at least partially modify the slice data depending on the characteristics of the modeling system 1. Under the control of the control device 15, the modeling system 1 performs an operation for forming the first structural layer SL#1 on the modeling surface MS corresponding to the surface of the work W in a manner corresponding to the structural layer SL#1. This is performed based on three-dimensional model data (that is, slice data corresponding to structural layer SL#1). As a result, a structural layer SL#1 is formed on the modeling surface MS, as shown in FIG. 4(a). After that, the printing system 1 sets the surface (that is, the upper surface) of the structural layer SL#1 as a new printing surface MS, and forms the second structural layer SL#2 on the new printing surface MS. do. In order to form the structural layer SL#2, the control device 15 first controls the head drive system 12 so that the modeling head 11 moves along the Z-axis. Specifically, the control device 15 controls the head drive system 12 so that the irradiation area EA and the supply area MA are set on the surface of the structural layer SL#1 (that is, the new modeling surface MS). The printing head 11 is moved toward the +Z side. Thereby, the focus position of the light EL matches the new modeling surface MS. Thereafter, under the control of the control device 15, the modeling system 1 performs an operation similar to that for forming the structural layer SL#1 to form the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2. A structural layer SL#2 is formed. As a result, a structural layer SL#2 is formed as shown in FIG. 4(b). Thereafter, similar operations are repeated until all structural layers SL constituting the three-dimensional structure to be formed on the workpiece W are formed. As a result, as shown in FIG. 4(c), a laminated structure in which a plurality of structural layers SL are laminated along the Z axis (that is, along the direction from the bottom to the top of the molten pool MP), A three-dimensional structure ST is formed.

Note that at a stage after at least one structural layer SL is formed and before all structural layers SL are formed, the measuring device 14 measures the shape of the structure including the formed structural layer SL (for example, , the shape of its surface) may be measured. In this case, the control device 15 may modify at least part of the slice data used to form the structural layer SL that will be performed subsequently, based on the measurement results of the measurement device 14.

(2-2) Positioning operation Next, the positioning operation will be explained. The alignment operation is an operation for aligning the workpiece W and the modeling head 11, as described above. More specifically, the alignment operation forms the desired three-dimensional structure ST with relatively high accuracy (that is, the shape error between the ideal three-dimensional structure ST indicated by the three-dimensional model data and This is an operation for aligning the workpiece W and the modeling head 11 so that a relatively small three-dimensional structure ST can be formed. The alignment of the workpiece W and the printing head 11 may mean, for example, controlling (in other words, adjusting or setting) the relative positional relationship between the workpiece W and the printing head 11. Moreover, the alignment of the workpiece W and the printing head 11 may mean, for example, controlling (in other words, adjusting or setting) the relative positional relationship between the workpiece W and the printing position. Note that the alignment of the workpiece W and the modeling head 11 may mean, for example, controlling (in other words, adjusting or setting) the relative positional relationship between the workpiece W and the position of the molten pool; It may also mean control of the relative positional relationship between the work W and the irradiation area EA (in other words, adjustment or setting), and control of the relative positional relationship between the work W and the supply area MA (in other words, adjustment or setting). settings).

In this embodiment, the positioning operation includes a head moving operation of moving the printing head 11 to the printing start position Ch_start on the head coordinate system Ch. The head coordinate system Ch is a three-dimensional coordinate system that indicates the position of the printing head 11. The position in the head coordinate system Ch is determined using the coordinate Xh along the X axis of the head coordinate system Ch, the coordinate Yh along the Y axis of the head coordinate system Ch, and the coordinate Zh along the Z axis of the head coordinate system Ch. be identified. That is, the position within the head coordinate system Ch is specified by the coordinates (Xh, Yh, Zh). Such a head coordinate system Ch mainly specifies the position of the printing head 11 by the control device 15 that controls the head drive system 12 when the head drive system 12 moves the print head 11 (in other words, it represents ) used for

The modeling start position Ch_start is the position of the modeling head 11 that can irradiate the light EL to the modeling start position Cs_start at which modeling (that is, additional processing) on the modeling surface MS corresponding to the surface of the workpiece W should be started. It is. In the following description, the modeling surface MS corresponding to the surface of the workpiece W will be referred to as "workpiece modeling surface MSW" to distinguish it from the modeling surface MS corresponding to the surface of the structural layer SL. In other words, the modeling start position Ch_start is the position of the modeling head 11 where the irradiation area EA can be set at the modeling start position Cs_start on the workpiece modeling surface MSW (in other words, the molten pool MP can be formed or additional processing can be performed). It is. Note that the modeling start position Ch_start may be a position of the modeling head 11 that can set the supply area MA at the modeling start position Cs_start on the workpiece modeling surface MSW.

The modeling start position Cs_start is a position in the stage coordinate system Cs with the stage 23 holding the workpiece W as a reference. The stage coordinate system Cs is a three-dimensional coordinate system with the stage 13 as a reference. Therefore, a position in the stage coordinate system Cs is a coordinate Xs along the X axis of the stage coordinate system Cs, a coordinate Ys along the Y axis of the stage coordinate system Cs, and a coordinate Zs along the Z axis of the stage coordinate system Cs. It is specified using That is, the position within the stage coordinate system Cs is specified by the coordinates (Xs, Ys, Zs). The stage coordinate system Cs is mainly determined by the stage coordinate system Cs when the measuring device 14 measures the characteristics of the measurement target on the stage 13. It is used to specify (in other words, represent) the position of the measurement target on 13.

Here, the technical reason for performing such positioning operation will be explained. First, assume a situation where additional processing is performed on a certain workpiece W. In this case, the control device 15 can specify the position of the workpiece W within the stage coordinate system Cs from the measurement results of the measuring device 14. As a result, the control device 15 can specify the modeling start position Cs_start on the workpiece modeling surface MSW within the stage coordinate system Cs. On the other hand, the control device 15 may not be able to specify the modeling start position Ch_start with relatively high accuracy based on the modeling start position Cs_start. This is because the relationship between the head coordinate system Ch and the stage coordinate system Cs is not always ideal. Note that the ideal relationship referred to here means, for example, that the positional relationship between the origin of the head coordinate system Ch and the origin of the stage coordinate system Cs does not change at all, and the scale of the head coordinate system Ch and the scale of the stage coordinate system Cs do not change at all. are always the same, and the X, Y, and Z axes of the head coordinate system Ch are always parallel to the X, Y, and Z axes of the stage coordinate system Cs, respectively. good. In other words, the ideal relationship here is, for example, that the stage coordinate system Cs does not move in parallel relative to the head coordinate system Ch, and that the stage coordinate system Cs does not move relative to the head coordinate system Ch. It may also mean a relationship in which the stage coordinate system Cs does not expand or contract, and the stage coordinate system Cs does not rotate relative to the head coordinate system Ch. If an ideal modeling system exists in which the relationship between the head coordinate system Ch and the stage coordinate system Cs is always ideal, the control device 15 would Based on the ideal relationship with the system Cs, the modeling start position Ch_start can be specified with relatively high accuracy from the modeling start position Cs_start. However, in reality, the relationship between the head coordinate system Ch and the stage coordinate system Cs may change. For example, if at least one of an installation error of the printing head 11, a fluctuation in the installation position of the printing head 11 (such as rattling), and a deterioration of the performance of the printing head 11 occurs, the head coordinate system Ch and the stage The relationship with the coordinate system Cs may change. In particular, installation errors of the irradiation system 111, fluctuations in the installation position of the irradiation system 111 (for example, rattling, etc.), deterioration of the performance of the irradiation system 111, installation errors of the material nozzle 112, and fluctuations in the installation position of the material nozzle 111 ( For example, if at least one of the following occurs: rattling, etc.), damage to the material nozzle 112, and deterioration of the performance of the material nozzle 112, the relationship between the head coordinate system Ch and the stage coordinate system Cs changes. there is a possibility. Furthermore, for example, if at least one of an installation error of the stage 13, a variation in the installation position of the stage 13 (e.g., rattling), and a change in the shape of the stage 13 occurs, the head coordinate system Ch and the stage coordinate system The relationship between Cs and Cs may change. Furthermore, for example, when the head drive system 12 is reset (that is, restarted), the relationship between the head coordinate system Ch and the stage coordinate system Cs may change. If the relationship between the head coordinate system Ch and the stage coordinate system Cs changes so that it is no longer an ideal relationship, then the relationship between the head coordinate system Ch and the stage coordinate system Cs becomes an ideal relationship. Compared to a certain case, the light EL from the modeling head 11 located at a certain position on the head coordinate system Ch is not necessarily irradiated to the same position on the stage coordinate system Cs. Therefore, even if the control device 15 specifies the printing start position Cs_start within the stage coordinate system Cs, the printing head 11 that can irradiate the printing start position Cs_start with the light EL based on the specified printing start position Cs_start It is not always possible to specify the modeling start position Ch_start, which is the position of Ch_start, with relatively high accuracy. In other words, even if the control device 15 specifies the printing start position Cs_start in the stage coordinate system Cs, the control device 15 appropriately moves the printing head 11 to the printing start position Ch_start corresponding to the specified printing start position Cs_start in the head coordinate system Ch. It is not always possible to move the Specifically, for example, even if the control device 15 specifies the printing start position Cs_start in the stage coordinate system Cs, the control device 15 may specify a printing start position Ch_start corresponding to the specified printing start position Cs_start in the head coordinate system Ch. There is a possibility that the printing head 11 may be moved to a different position. As a result, the shape accuracy of the three-dimensional structure ST to be formed may deteriorate.

Therefore, in this embodiment, the printing system 1 performs a positioning operation under the control of the control device 15 in order to appropriately move the printing head 11 to the printing start position Ch_start corresponding to the printing start position Cs_start. . Thereafter, the modeling system 1 starts additional processing on the workpiece W after the modeling head 11 is positioned at the modeling start position Ch_start. For this reason, the modeling system 1 performs a positioning operation before starting a modeling operation for performing additional processing on the workpiece W.

In this embodiment, in addition to the above-described head movement operation, the alignment operation also includes an initial setting operation that corresponds to a preparation operation for performing the above-described head movement operation. Therefore, the initial setting operation and head moving operation will be explained in order below.

(2-2-1) Initial Setting Operation First, the initial setting operation of the alignment operation will be explained. The initial setting operation includes an operation of associating (in other words, associating) the head coordinate system Ch and the stage coordinate system Cs. Specifically, the initial setting operation includes an operation of associating a position in the head coordinate system Ch with a position in the stage coordinate system Cs. As an example, the initial setting operation may include an operation of associating the position of the printing head 11 in the head coordinate system Ch with the position of the object formed on the stage 13 by the printing head 11 in the stage coordinate system Cs. good.

In the present embodiment, the operation of associating the head coordinate system Ch with the stage coordinate system Cs is such that the position in the head coordinate system Ch specified by the coordinates (Xh, Yh, Zh) is expressed as (Xs, Ys, Zs). Even if it includes an operation of calculating a transformation matrix T that can convert a position in the stage coordinate system Cs specified by coordinates and/or a position in the stage coordinate system Cs to a position in the head coordinate system Ch. good. In other words, the operation of associating the head coordinate system Ch with the stage coordinate system Cs is as follows: (Xh, Yh, Zh) = T x (Xs, Ys, Zs) and (Xs, Ys, Zs) = T ^-1 x (Xh, It may also include an operation of calculating a transformation matrix T that satisfies the relationship (Yh, Zh). The transformation matrix T expands or reduces either the position in the head coordinate system Ch or the position in the stage coordinate system Cs to the other of the position in the head coordinate system Ch or the position in the stage coordinate system Cs. Contains matrices for scaling to transform. However, in addition to or instead of the matrix related to scaling, the transformation matrix T translates either the position in the head coordinate system Ch or the position in the stage coordinate system Cs in parallel to transform the position in the head coordinate system Ch and the stage. It may also include a matrix related to translation for converting a position in the coordinate system Cs to either one of the other positions. In addition to or in place of the scaling matrix, the transformation matrix T rotates either the position in the head coordinate system Ch or the position in the stage coordinate system Cs to transform the position in the head coordinate system Ch or the stage coordinate system Cs. It may also include a matrix for rotations that converts the positions within. Note that the transformation matrix T may include a matrix regarding orthogonality in addition to or instead of a matrix regarding at least one of scaling, translation, and rotation. The operation of calculating the transformation matrix T will be described below with reference to FIG.

As shown in FIG. 5, first, mark members FM are placed in each of the plural mark areas 134 of the stage 13 (step S111). The mark member FM is a member that can be at least partially melted by irradiation with the light EL. The mark member FM is a member that can form a molten pool MP at least in part by irradiation with the light EL. The mark member FM is a member that can form a shaped object at least in part by irradiation with light EL. The mark member FM is, for example, a plate-shaped member, but may be a member of any other shape. Further, the size of the mark member FM may be the same as the size of the mark area 134, may be smaller, or may be larger. Note that while the initial setting operation is being performed, the workpiece W may or may not be placed on the stage 13.

After that, the control device 15 designates one of the plurality of mark regions 134 as the designated mark region 134d where the mark member FM for forming the test mark TM is arranged (step S121). The control device 15 may designate all the mark regions 134 of the plurality of mark regions 134 as the designated mark region 134d, or designate some of the mark regions 134 among the plurality of mark regions 134 as the designated mark region 134d. may be specified. Thereafter, the control device 15 specifies a position Chfm of the modeling head 11 that can perform additional processing on the mark member FM placed in the designated mark area 134d within the head coordinate system Ch (step S122). Specifically, the plurality of mark areas 134 are set at predetermined positions (that is, known positions) on the upper surface 131 of the stage 13. That is, the designated mark area 134d is also set at a predetermined position (that is, a known position) on the upper surface 131 of the stage 13. Therefore, the position Csfm of the designated mark area 134d within the stage coordinate system Cs (for example, the position Csfm of the center, end, or other arbitrary part of the designated mark area 134d) is information known to the control device 15. On the other hand, as described above, in the modeling system 1, since the relationship between the head coordinate system Ch and the stage coordinate system Cs changes, the control device 15 adjusts the designated mark area based on the position Csfm of the designated mark area 134d. It is not easy to specify with relatively high precision the position Chfm of the modeling head 11 that can perform additional processing on the mark member FM placed at 134d. However, in the initial setting operation, it is sufficient for the modeling system 1 to form the test mark TM somewhere on the mark member FM (for example, at any position on the upper surface of the mark member FM). In other words, the modeling system 1 does not need to control the formation position of the test mark TM on the mark member FM with relatively high precision. Therefore, by assuming that the relationship between the head coordinate system Ch and the stage coordinate system Cs is ideal, the control device 15 determines the designated mark area based on the position Csfm of the designated mark area 134d. It is possible to specify (here, essentially, estimate) the position Chfm of the modeling head 11 that can perform additional processing on the mark member FM placed at 134d.

However, if the relationship between the head coordinate system Ch and the stage coordinate system Cs is not an ideal relationship (in particular, it is relatively significantly different from the ideal relationship), the printing system 1 There is a possibility that the test mark TM cannot be formed on the FM. That is, there is a possibility that the modeling system 1 forms the test mark TM at a position away from the mark member FM. Therefore, the size of the mark area 134 (especially the size along the Even if the system 1 deviates to a degree that may occur (the same applies hereinafter), the printing head 11 located at the position Chfm may form the test mark TM on the mark member FM located in the designated mark area 134d. The size may be set as large as possible. Similarly, the size of the mark member FM (especially the size along the XY plane) can be adjusted even if the relationship between the head coordinate system Ch and the stage coordinate system Cs deviates from the ideal relationship. The size may be set so large that the printing head 11 located at the position Chfm can form the test mark TM on the mark member FM arranged in the designated mark area 134d.

Note that when the position Csfm of the designated mark area 134d is known information, the position Chfm of the printing head 11 that can perform additional processing on the mark member FM placed in the designated mark area 134d is also This can be known information. For this reason, the control device 15 may store information regarding the position Csfm of the mark area 134 and the position Chfm of the printing head 11 corresponding to the position Csfm of the mark area 134. In this case, the control device 15 may specify the position Chfm of the printing head 11 from stored information instead of specifying the position Chfm of the printing head 11 in step S122.

After that, the control device 15 controls the head drive system 12 to move the modeling head 11 to the position Chfm specified in step S122 (step S123). After that, after the printing head 11 reaches the position Chfm, the printing system 1 forms a test mark TM on the mark member FM arranged in the designated mark area 134d under the control of the control device 15 (step S124). The modeling system 1 uses a method similar to the method for forming at least one of the above-described modeled object, the above-mentioned structural layer SL, and the above-mentioned three-dimensional structure ST (for example, FIGS. 3A to 4 A test mark TM is formed using the method shown in (c). That is, the test mark TM may be a structure similar to the above-mentioned object, a structure similar to the aggregate of the above-mentioned objects, or a structure similar to the above-mentioned structural layer SL. It may be a structure, or it may be a structure similar to the above-mentioned three-dimensional structure ST in which a plurality of structural layers SL are stacked. However, when specifying the position of the test mark TM from step S131 to step S132, which will be described later, in order to uniquely specify the test mark TM from the measurement object indicated by the measurement result of the measuring device 14, The mark may have at least one of the following dimensions.

After that, the control device 15 determines whether the test mark TM has been formed on all of the plurality of mark members FM arranged in the plurality of mark regions ME set on the stage 13 (step S125). As a result of the determination in step S125, if it is determined that the test mark TM is not formed on any of the mark members FM (step S125: No), the control device 15 repeats the processing from step S121 onwards. That is, the control device 15 designates one mark region 134, which has not yet been designated as the designated mark region 134d, among the plurality of mark regions 134, as the new designated mark region 134d (step S121). Thereafter, the control device 15 performs processing for forming a test mark TM in the newly specified designated mark area 134d (steps S122 to S124).

On the other hand, as a result of the determination in step S125, if it is determined that the test mark TM has been formed on all the mark members FM (step S125: Yes), the measuring device 14 measures the object (specifically Specifically, the state of the measurement object (including the test mark TM) is measured (step S131). The measurement results of the measuring device 14 (that is, information regarding the state of the measurement object including the test mark TM) are output to the control device 15. Note that instead of determining that test marks TM have been formed on all mark members FM, it is determined that test marks TM have been formed on some mark members FM among a plurality of mark members FM. In this case, the process may proceed to the next step (step S131).

Thereafter, the control device 15 specifies the position Cstm of the formed test mark TM in the stage coordinate system Cs based on the measurement result of the measurement device 14 (step S132). Specifically, since the test mark TM is formed under the control of the control device 15, at least one of the position, shape, and size of the test mark TM is information known to the control device 15. Therefore, the control device 15 can identify the test mark TM from the measurement object based on information regarding the state of the measurement object (in particular, at least one of the position, shape, and dimension) measured by the measurement device 14. can. For example, the control device 15 can identify the test mark TM from the measurement target using a pattern matching method or the like. Thereafter, the control device 15 specifies the position Cstm of the specified test mark TM within the stage coordinate system Cs.

Thereafter, the control device 15 sets the position Cstm of the test mark TM specified in step S132 and the position Chfm of the printing head 11 when forming the test mark TM (that is, the position Chfm of the printing head 11 specified in step S122). Based on this, a transformation matrix T indicating the relationship between the head coordinate system Ch and the stage coordinate system Cs is calculated (step S141). Specifically, since a plurality of test marks TM are formed, a plurality of positions Cstm are specified in step S132. Similarly, in step S122, a plurality of positions Chfm are specified. The position Cstm1=(Xstm1, Ystm1, Zstm1) of the first test mark TM among the plurality of positions Cstm is the position Chfm1= of the printing head 11 when forming the first test mark TM among the plurality of positions Chfm. (Xhfm1, Yhfm1, Zhfm1). In other words, the following relationship holds true: (Xhfm1, Yhfm1, Zhfm1)=T×(Xstm1, Ystm1, Zstm1). Similarly, the position Cstm2=(Xstm2, Ystm2, Zstm2) of the second test mark TM among the plurality of positions Cstm is the position of the printing head 11 when forming the second test mark TM among the plurality of positions Chfm. It corresponds to the position Chfm2=(Xhfm2, Yhfm2, Zhfm2). In other words, the following relationship holds true: (Xhfm2, Yhfm2, Zhfm2)=T×(Xstm2, Ystm2, Zstm2). Similarly, the position Cstm3=(Xstm3, Ystm3, Zstm3) of the third test mark TM among the plurality of positions Cstm is the position of the printing head 11 when forming the third test mark TM among the plurality of positions Chfm. Corresponds to position Chfm3=(Xhfm3, Yhfm3, Zhfm3). In other words, the following relationship holds: (Xhfm3, Yhfm3, Zhfm3)=T×(Xstm3, Ystm3, Zstm3). Therefore, the control device 15 can calculate the transformation matrix T by solving simultaneous equations that hold true between the plurality of positions Cstm and the plurality of positions Chfm.

Since each of the head coordinate system Ch and the stage coordinate system Cs is a three-dimensional coordinate system, in order to calculate the transformation matrix T, the modeling system 1 may form at least three test marks TM. That is, at least three mark areas 134 may be set on the stage 13. In this case, the at least three mark areas 134 may include two mark areas 134 at different positions along the X-axis of the stage coordinate system Cs. That is, the modeling system 1 may form at least two test marks TM at different positions along the X-axis of the stage coordinate system Cs. The at least three mark areas 134 may include two mark areas 134 at different positions along the Y-axis. That is, the modeling system 1 may form at least two test marks TM at different positions along the Y axis of the stage coordinate system Cs. The at least three mark areas 134 may include two mark areas 134 at different positions along the Z-axis. That is, the modeling system 1 may form at least two test marks TM at different positions along the Z axis of the stage coordinate system Cs. In the example shown in FIG. 2 described above, three mark areas 134#1 to 134#3 are set on the stage 13. Furthermore, in the example shown in FIG. 2, two mark areas 134#1 and 134#2 (or two mark areas 134#2 and 134#3) having different positions along the X axis are set on the stage 13. three mark areas 134#1 to 134#3 are set at different positions along the Y axis, and two mark areas 134#1 and 134#3 are set at different positions along the Z axis (or two mark areas 134#1 and 134#3 are set at different positions along the Z axis). areas 134#2 and 134#3) are set.

Once the transformation matrix T is calculated, the control device 15 transforms the position (Xh, Yh, Zh) in the head coordinate system Ch into the position (Xh, Yh, Zh) in the stage coordinate system Cs corresponding to the position (Xh, Yh, Zh). Xs, Ys, Zs). Similarly, the control device 15 converts the position (Xs, Ys, Zs) in the stage coordinate system Cs into the position (Xh, Yh, Zh) in the head coordinate system Ch corresponding to the position (Xs, Ys, Zs). can be converted to . Furthermore, the transformation matrix T is calculated based on the test mark TM formed by the modeling system 1 actually performing additional processing on the stage 13. That is, the transformation matrix T is calculated based on the actual position Chfm of the printing head 11 in the head coordinate system Ch and the actual position Cstm of the test mark TM in the stage coordinate system Cs. Therefore, the transformation matrix T reflects the actual relationship between the head coordinate system Ch and the stage coordinate system Cs. In other words, even if the actual relationship between the head coordinate system Ch and the stage coordinate system Cs is different from the ideal relationship, the transformation matrix T includes the position of the printing head 11 in the head coordinate system Ch and the stage The actual relationship between the position of the object on the stage 13 in the coordinate system Cs is reflected. Therefore, using the transformation matrix T, the control device 15 can mutually transform the position in the head coordinate system Ch and the position in the stage coordinate system Cs with relatively high precision.

After the transformation matrix T is calculated (or after the state of the test mark TM is measured), the mark member FM is removed from the mark area 134 (step S151). In other words, the mark member FM corresponds to a member that can be replaced each time an initial setting operation is performed. Note that the mark member FM may be located in the mark area 134 until the next initial setting operation is performed. Further, the same mark member FM may be used in multiple initial setting operations.

The control device 15 performs such an initial setting operation at a desired timing. For example, the control device 15 may perform an initialization operation each time the printing system 1 starts operating (for example, the printing system 1 is powered on). For example, the control device 15 may perform the initial setting operation every time the workpiece W is placed on the stage 13. For example, the control device 15 may perform the initial setting operation before or after the workpiece W is placed on the stage 13. For example, the control device 15 may perform the initial setting operation every time additional processing on one or more workpieces W is completed. For example, the control device 15 may perform the initial setting operation every time a certain period of time has elapsed since the modeling system 1 was activated. For example, the control device 15 may perform the initial setting operation every time an instruction to perform the initial setting operation is input from the operator of the modeling system 1.

(2-2-2) Head Moving Operation Next, the head moving operation of the positioning operation will be explained. As described above, the head moving operation is an operation of moving the printing head 11 to the printing start position Ch_start. The head moving operation will be described below with reference to FIG.

As shown in FIG. 6, first, a workpiece W to be subjected to additional processing is placed on the stage 13 (step S211). The stage 13 holds the work W via the holding area 132.

After that, the control device 15 designates one of the plurality of mark regions 134 as the designated mark region 134d where the mark member FM for forming the test mark TM is to be placed (step S221). Note that the control device 15 may designate all the mark regions 134 of the plurality of mark regions 134 as the designated mark region 134d, or designate some mark regions 134 among the plurality of mark regions 134 as the designated mark region 134d. May be specified. Thereafter, the mark member FM is placed in the designated mark area 134d.

After that, the control device 15 specifies, within the head coordinate system Ch, a position Chfm of the modeling head 11 that can perform additional processing on the mark member FM placed in the designated mark area 134d (step S222). Specifically, in the head movement operation, the control device 15 specifies the position Chfm of the printing head 11 using the method used in the initial setting operation described above to specify the position Chfm of the printing head 11. . In other words, by assuming that the relationship between the head coordinate system Ch and the stage coordinate system Cs is ideal, the control device 15 determines the designated mark region 134d based on the position Csfm of the designated mark region 134d. The position Chfm of the modeling head 11 at which additional processing can be performed on the mark member FM placed at is specified (here, essentially estimated). However, the control device 15 converts the position Csfm of the specified mark area 134d, which is known information, using the conversion matrix T calculated in the initial setting operation, so that the mark member FM placed in the specified mark area 134d The position Chfm of the modeling head 11 where additional processing can be performed may also be specified.

After that, the control device 15 controls the head drive system 12 to move the modeling head 11 to the position Chfm specified in step S222 (step S223). Thereafter, after the printing head 11 reaches the position Chfm, the printing system 1 forms a test mark TM on the mark member FM arranged in the designated mark area 134d under the control of the control device 15 (step S224). The test mark TM formed in the head moving operation may be the same as or different from the test mark TM formed in the initial setting operation described above.

After that, the measuring device 14 measures the state of the object (specifically, the measurement object including the test mark TM and the work W) on the stage 13 (step S231). The measurement results of the measuring device 14 (that is, information regarding the state of the measurement object including the test mark TM and the workpiece W) are output to the control device 15.

Thereafter, the control device 15 specifies the position Cstm of the formed test mark TM in the stage coordinate system Cs based on the measurement result of the measurement device 14 (step S232). Specifically, the control device 15 specifies the position Cstm of the test mark TM using the method used in the initial setting operation described above to specify the position Cstm of the test mark TM.

Further, the control device 15 specifies, in the stage coordinate system Cs, a modeling start position Cs_start at which modeling should be started on the workpiece modeling surface MSW, based on the measurement results of the measuring device 14 (step S232). Specifically, the control device 15 can specify the position of the workpiece W within the stage coordinate system Cs from the measurement results of the measurement device 14. Further, the control device 15 can specify how to form the three-dimensional structure ST on the workpiece W based on the three-dimensional model data of the three-dimensional structure ST to be formed. When it is specified how to form the three-dimensional structure ST on the workpiece W, the position where the object should be formed first in order to form the three-dimensional structure ST (for example, the first structural layer) is determined. In order to form SL#1, the position at which the object should be formed first can be specified. The position at which a modeled object is first formed to form the three-dimensional structure ST corresponds to the modeling start position Cs_start.

After that, the control device 15 controls the position Cstm of the test mark TM specified in step S232, the position Chfm of the printing head 11 when forming the test mark TM (that is, the position Chfm of the printing head 11 specified in step S222), Then, the printing head 11 is moved to the printing start position Ch_start based on the printing start position Cs_start specified in step S232 (step S241). Hereinafter, with reference to FIG. 7, the operation of moving the printing head 11 to the printing start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the printing head 11, and the printing start position Cs_start will be described in more detail. .

The upper part of FIG. 7 is a plan view showing the relationship between the position Cstm=(Xstm, Ystm, Zstm) of the test mark TM in the stage coordinate system Cs and the modeling start position Cs_start=(Xs_start, Ys_start, Zs_start). On the other hand, the lower part of FIG. 7 is a plan view showing the relationship between the position Chfm=(Xhfm, Yhfm, Zhfm) of the printing head 11 in the head coordinate system Ch and the printing start position Ch_start=(Xh_start, Yh_start, Zh_start). .

As shown in FIG. 7, a test mark TM is formed at a position Cstm in the stage coordinate system Cs by the light EL from the modeling head 11 located at a position Chfm in the head coordinate system Ch. Therefore, the irradiation area EA of the light EL from the modeling head 11 located at the position Chfm in the head coordinate system Ch is set to the position Cstm in the stage coordinate system Cs. In this case, if the printing head 11 moves within the head coordinate system Ch such that the irradiation area EA moves from the position Cstm to the printing start position Cs_start within the stage coordinate system Cs, the printing head 11 will be located at the printing start position Cs_start. It turns out.

Specifically, in the stage coordinate system Cs, the modeling start position Cs_start is separated from the position Cstm of the test mark TM by a distance of (Xs_start−Xstm) along the X axis. In the stage coordinate system Cs, the modeling start position Cs_start is separated from the position Cstm of the test mark TM by a distance of (Ys_start−Ystm) along the Y axis. In the stage coordinate system Cs, the modeling start position Cs_start is separated from the position Cstm of the test mark TM by a distance of (Zs_start−Zstm) along the Z axis. Therefore, within the stage coordinate system Cs, the irradiation area EA moves along the X-axis by a distance of (Xs_start-Xstm), along the Y-axis by a distance of (Ys_start-Ystm), and If the printing head 11 located at the position Chfm in the head coordinate system Ch moves so as to move along the axis by a distance of (Zs_start-Zstm), the printing head 11 will be located at the printing start position Cs_start. Become.

Here, in the head coordinate system Ch, the printing head 11 moves along the X-axis by a distance of (Xs_start-Xstm), along the Y-axis by a distance of (Ys_start-Ystm), and If it moves along the axis by a distance of (Zs_start−Zstm), there is a possibility that the irradiation area EA will move from the position Cstm to the modeling start position Cs_start within the stage coordinate system Cs. However, as described above, the relationship between the head coordinate system Ch and the stage coordinate system Cs is not always ideal. Therefore, even if the printing head 11 moves along the X-axis by a distance of (Xs_start-Xstm) within the head coordinate system Ch, the irradiation area EA moves along the X-axis within the stage coordinate system Cs by a distance of (Xs_start-Xstm). ) is not necessarily the distance traveled. Similarly, even if the printing head 11 moves along the Y-axis by a distance of (Ys_start-Ystm) within the head coordinate system Ch, the irradiation area EA moves along the Y-axis within the stage coordinate system Cs by a distance of (Ys_start-Ystm). ) is not necessarily the distance traveled. Similarly, even if the printing head 11 moves by a distance (Zs_start-Zstm) along the Z-axis within the head coordinate system Ch, the irradiation area EA moves along the Z-axis by a distance (Zs_start-Zstm) within the stage coordinate system Cs. ) is not necessarily the distance traveled. Therefore, the control device 15 uses the transformation matrix T to change the amount and direction of movement of the irradiation area EA from the position Cstm of the test mark TM to the modeling start position Cs_start in the stage coordinate system Cs in the head coordinate system Ch. The amount of movement and the direction of movement of the printing head 11 are converted. Thereafter, the control device 15 moves the modeling head 11 located at the position Chfm in the head coordinate system Ch by the amount of movement obtained by the conversion in the movement direction obtained by the conversion. As a result, the printing head 11 is located at the printing start position Ch_start where the irradiation area EA can be set at the printing start position Cs_start.

In this manner, in this embodiment, the control device 15 can appropriately move the printing head 11 to the printing start position Ch_start. That is, the control device 15 can move the printing head 11 so that the position of the printing head 11 after the movement in the head coordinate system Ch matches (or approaches) the printing start position Ch_start. In other words, the control device 15 can move the printing head 11 so that the irradiation area EA to which the light EL from the moved printing head 11 is irradiated is set to the printing start position Cs_start. Note that the control device 15 may move the printing head 11 so that the molten pool MP formed by the light EL from the printing head 11 after the movement is set to the printing start position Cs_start, and the printing head 11 after the movement The printing head 11 may be moved so that the supply position MA by the head 11 is set to the printing start position Cs_start.

The control device 15 performs such a head movement operation at a desired timing. For example, the control device 15 may perform the head movement operation every time the workpiece W is placed on the stage 13. For example, the control device 15 may perform the head movement operation every time additional processing on one or more workpieces W is completed. For example, the control device 15 may perform the head movement operation every time a certain period of time has elapsed since the modeling system 1 was activated. For example, the control device 15 may perform the head movement operation every time an instruction to perform the head movement operation is input from the operator of the modeling system 1. For example, the control device 15 may perform a head movement operation every time an initial setting operation is performed. In other words, the control device 15 may perform the head movement operation at the same frequency as the initial setting operation. For example, the control device 15 may perform the head movement operation less frequently than the initial setting operation. For example, the control device 15 may perform the head movement operation more frequently than the initial setting operation.

The control device 15 uses the transformation matrix T to convert the printing start position Cs_start in the stage coordinate system Cs to the printing start position Ch_start in the head coordinate system Ch, and starts printing at the printing start position Ch_start obtained by the conversion. The head 11 may be moved. In particular, when the transformation matrix T includes all of the above-mentioned parallel translation matrix, the above-mentioned scaling matrix, and the above-mentioned rotation matrix, the control device 15 uses the transformation matrix T to specify the modeling start position Ch_start. , the printing head 11 may be moved to the specified printing start position Ch_start. Even in this case, the control device 15 can appropriately move the printing head 11 to the printing start position Ch_start.

(3) Modification Next, a modification of the modeling system 1 will be described.

(3-1) First Modification First, the first modification will be explained. In the first modification, the content of the head movement operation is different from the head movement operation described above. Specifically, the head movement operation in the first modification is an operation of moving the modeling head 11 to the modeling start position Ch_start, similar to the head movement operation described above. However, the head moving operation in the first modification forms a plurality of types of test marks TM, and moves the printing head 11 to the printing start position Ch_start based on the position Cstm of any one of the plurality of types of test marks TM. This operation differs from the above-mentioned head movement operation in that it moves the head. Hereinafter, the head moving operation in the first modification will be described with reference to FIGS. 8 to 10. It should be noted that the same steps as those in the head movement operation described above will be given the same step numbers and detailed explanation thereof will be omitted.

As shown in FIG. 8, first, a workpiece W to be subjected to additional processing is placed on the stage 13 (step S211). Further, the control device 15 designates one of the plurality of mark regions 134 as a designated mark region 134d where the mark member FM for forming the test mark TM is to be placed (step S221). Note that the control device 15 may designate all the mark regions 134 of the plurality of mark regions 134 as the designated mark region 134d, or designate some mark regions 134 among the plurality of mark regions 134 as the designated mark region 134d. May be specified. At this time, the mark member FM is placed in the designated mark area 134d.

As described above, in the first modification, a plurality of types of test marks TM are formed on the mark member FM arranged in the designated mark area 134d. Specifically, a plurality of test marks TM are formed in which the direction of movement of the printing head 11 (in particular, the direction of movement along the XY plane of the head coordinate system Ch) during the period of forming the test marks TM is different. For example, the test mark TM formed by the printing head 11 moving toward the first direction is different from the first direction (for example, the test mark TM is formed by the printing head 11 moving toward the first direction) and ) A test mark TM is formed by the printing head 11 moving in the second direction. For example, a test mark TM formed by the printing head 11 moving in a first direction, a test mark TM formed by the printing head 11 moving in a second direction, and a first and second a printing head that moves toward a third direction that is different from the direction (for example, intersects with at least one of the first and second directions, or opposite to at least one of the first and second directions); A test mark TM formed by 11 is formed. For example, there are test marks TM formed by the printing head 11 moving in the first direction, test marks TM formed by the printing head 11 moving in the second direction, and test marks TM formed by the printing head 11 moving in the third direction. The test marks TM formed by the printing head 11 that moves are different from the first to third directions (for example, the test marks TM are different from the first to third directions, or are different from the first to third directions). A test mark TM is formed by the printing head 11 moving in the fourth direction (opposite to at least one of the directions).

The test mark TM formed by the printing head 11 moving in the first direction is moved along the workpiece printing surface MSW in the first direction (or the stage corresponding to the first direction in the head coordinate system Ch). This becomes a linear test mark TM extending along the fifth direction in the coordinate system Cs. The test mark TM formed by the printing head 11 moving in the second direction is moved along the workpiece printing surface MSW in the second direction (or the stage corresponding to the second direction in the head coordinate system Ch). This becomes a linear test mark TM extending along the sixth direction in the coordinate system Cs. The test mark TM formed by the printing head 11 moving in the third direction is moved along the workpiece printing surface MSW in the third direction (or the stage corresponding to the third direction in the head coordinate system Ch). This becomes a linear test mark TM extending along the seventh direction in the coordinate system Cs. The test mark TM formed by the printing head 11 moving in the fourth direction is moved along the workpiece printing surface MSW in the fourth direction (or the stage corresponding to the fourth direction in the head coordinate system Ch). This becomes a linear test mark TM extending along the eighth direction in the coordinate system Cs. Therefore, it can be said that in the first modification, a plurality of test marks TM are formed with different extending directions along the workpiece modeling surface MSW. Note that the extending direction of the plurality of test marks TM does not have to be along the workpiece modeling surface MSW.

As an example, FIG. 11 shows an example in which a test mark TM(+X), a test mark TM(-X), a test mark TM(+Y), and a test mark TM(-Y) are formed. The test mark TM (+X) is a test mark TM formed by the modeling head 11 that moves along the X axis of the head coordinate system Ch and toward the +X side of the head coordinate system Ch. The test mark TM(-X) is a test mark TM formed by the modeling head 11 that moves along the X axis of the head coordinate system Ch and toward the -X side of the head coordinate system Ch. The test mark TM (+Y) is a test mark TM formed by the modeling head 11 that moves along the Y axis of the head coordinate system Ch and toward the +Y side of the head coordinate system Ch. The test mark TM (-Y) is a test mark TM formed by the modeling head 11 that moves along the Y axis of the head coordinate system Ch and toward the -Y side of the head coordinate system Ch. In the following explanation, for convenience of explanation, the four types of test marks TM shown in FIG. )) will now be described. However, in the head movement operation, test marks TM may be formed in a number different from the four types of test marks TM shown in FIG. 11, having different shapes, and/or extending in different directions.

Referring again to FIG. 8, after specifying the specified mark area 134d, the control device 15 performs a process when starting to form a test mark TM (+X) on the mark member FM placed in the specified mark area 134d in the head coordinate system Ch. The position Chfm (+X) of the printing head 11 is specified (step S3221). Note that the method for specifying the position Chfm(+X) in step S3221 may be the same as the method for specifying the position Chfm in step S222 of FIG. 6 described above. That is, the control device 15 forms the test mark TM(+X) within the specified mark area 134d by assuming that the relationship between the head coordinate system Ch and the stage coordinate system Cs is an ideal relationship. Based on the starting position Csfm(+X), the position Chfm(+X) of the printing head 11 when starting to form the test mark TM(+X) may be specified. The same applies to the method of specifying the position Chfm(-X) in step S3222, the method of specifying the position Chfm(+Y) in step S3223, and the method of specifying the position Chfm(-Y) in step S3224, which will be described later.

After that, the control device 15 controls the head drive system 12 to move the modeling head 11 to the position Chfm (+X) specified in step S3221 (step S3231). Thereafter, after the printing head 11 reaches the position Chfm (+X), the printing system 1 moves along the X axis of the head coordinate system Ch and toward the +X side of the head coordinate system Ch under the control of the control device 15. While moving the transfer modeling head 11, a test mark TM (+X) is formed on the mark member FM arranged in the designated mark area 134d (step S3241).

Furthermore, as shown in FIG. 8, before and after the process for forming the test mark TM(+X), the control device 15 controls the mark member FM disposed in the designated mark area 134d in the head coordinate system Ch. The position Chfm(-X) of the printing head 11 when starting to form the test mark TM(-X) is specified (step S3222). After that, the control device 15 controls the head drive system 12 to move the printing head 11 to the position Chfm(-X) specified in step S3222 (step S3232). Thereafter, after the printing head 11 reaches the position Chfm(-X), the printing system 1 moves along the X axis of the head coordinate system Ch and on the -X side of the head coordinate system Ch under the control of the control device 15. While moving the printing head 11 toward the target, a test mark TM(-X) is formed on the mark member FM placed in the designated mark area 134d (step S3242).

Furthermore, as shown in FIG. 9, before and after the process for forming at least one of the test mark TM(+X) and the test mark TM(-X), the control device 15 performs the following in the head coordinate system Ch: The position Chfm (+Y) of the modeling head 11 when starting to form the test mark TM (+Y) on the mark member FM placed in the designated mark area 134d is specified (step S3223). After that, the control device 15 controls the head drive system 12 to move the modeling head 11 to the position Chfm (+Y) specified in step S3223 (step S3233). After that, after the printing head 11 reaches the position Chfm (+Y), the printing system 1 moves along the Y axis of the head coordinate system Ch and toward the +Y side of the head coordinate system Ch under the control of the control device 15. While moving the modeling head 11, a test mark TM (+Y) is formed on the mark member FM arranged in the designated mark area 134d (step S3243).

Furthermore, as shown in FIG. 9, before and after the process for forming at least one of the test mark TM(+X), the test mark TM(-X), and the test mark TM(+Y), the control device 15 performs the following operations. In the head coordinate system Ch, the position Chfm(-Y) of the printing head 11 when starting to form the test mark TM(-Y) on the mark member FM placed in the designated mark area 134d is specified (step S3224). After that, the control device 15 controls the head drive system 12 to move the printing head 11 to the position Chfm(-Y) specified in step S3224 (step S3234). After that, after the printing head 11 reaches the position Chfm (-Y), the printing system 1 moves along the Y axis of the head coordinate system Ch and on the -Y side of the head coordinate system Ch under the control of the control device 15. While moving the printing head 11 toward the designated mark area 134d, a test mark TM(-Y) is formed on the mark member FM placed in the designated mark area 134d (step S3244).

Thereafter, as shown in FIG. 10, the measuring device 14 measures the state of the object on the stage 13 (specifically, the measurement object including the four types of test marks TM and the workpiece W) (step S331). The measurement results of the measuring device 14 (that is, information regarding the state of the measurement object including the four types of test marks TM and the workpiece W) are output to the control device 15.

Thereafter, the control device 15 specifies the positions Cstm of the four types of test marks TM formed within the stage coordinate system Cs based on the measurement results of the measurement device 14 (step S332). In particular, the control device 15 specifies the position of the end of each test mark TM (in particular, the end corresponding to the first formed portion of each test mark TM) as the position Cstm. Note that the control device 15 may specify the center position or center position of each test mark TM as the position Cstm.

Specifically, as shown in FIG. 11, the test mark TM(+X) is an addition in which a shaped object is added from the -X side end of the test mark TM(+X) toward the +X side end. It is formed by processing. Therefore, the control device 15 specifies the position of the -X side end of the test mark TM(+X) as the position Cstm(+X). Similarly, the test mark TM (-X) is formed by performing additional processing to add a shaped object from the +X side end of the test mark TM (-X) to the -X side end. be done. Therefore, the control device 15 specifies the position of the +X side end of the test mark TM(-X) as the position Cstm(-X). Similarly, the test mark TM (+Y) is formed by performing additional processing to add a shaped object from the -Y side end of the test mark TM (+Y) to the +Y side end. . Therefore, the control device 15 specifies the position of the end of the test mark TM(+Y) on the −Y side as the position Cstm(+Y). Similarly, the test mark TM (-Y) is formed by performing additional processing to add a shaped object from the +Y side end of the test mark TM (-Y) to the -Y side end. be done. Therefore, the control device 15 specifies the position of the +Y side end of the test mark TM(-Y) as the position Cstm(-Y).

Further, the control device 15 specifies a modeling start position Cs_start at which modeling on the workpiece modeling surface MSW should start in the stage coordinate system Cs based on the measurement results of the measuring device 14 (step S332). Note that the method for identifying the modeling start position Cs_start in step S332 may be the same as the method for identifying the modeling start position Cs_start in step S232 of FIG. 6 described above.

After that, the control device 15 moves the printing head 11 to the printing start position Ch_start (step S3411 to step S3414). In particular, in the first modification, the control device 15 causes the printing head 11 to move in the same direction as the movement direction of the printing head 11 when the printing head 11 starts moving with the start of additional processing on the workpiece W. Based on the position Cstm of the test mark TM, the printing head 11 is moved to the printing start position Ch_start. For example, when the printing head 11 starts moving along the X axis and toward the +X side with the start of additional processing, the control device 15 moves the position Cstm(+X) of the test mark TM(+X). Then, the printing head 11 is moved to the printing start position Ch_start. For example, when the printing head 11 starts moving along the ), the printing head 11 is moved to the printing start position Ch_start. For example, when the printing head 11 starts moving along the X-axis and toward the +Y side with the start of additional processing, the control device 15 controls the Then, the printing head 11 is moved to the printing start position Ch_start. For example, when the printing head 11 starts moving along the ), the printing head 11 is moved to the printing start position Ch_start.

In order to move the printing head 11 in this manner, the control device 15 first determines in which direction the printing head 11 will start moving with the start of additional processing (step S35). The control device 15 determines which direction the printing head 11 is moving when the printing head 11 starts moving with the start of additional processing (step S35). The control device 15 determines in which direction the printing head 11 located at the printing start position Ch_start starts moving with the start of additional processing (step S35). Specifically, the control device 15 can specify the position of the workpiece W within the stage coordinate system Cs from the measurement results of the measurement device 14. Further, the control device 15 can specify how to form the three-dimensional structure ST on the workpiece W based on the three-dimensional model data of the three-dimensional structure ST to be formed. Once it is specified how to form the three-dimensional structure ST on the workpiece W, the movement trajectory of the printing head 11 for forming the three-dimensional structure ST (for example, the first structural layer SL #1 The movement locus of the printing head 11 for forming the image can be specified. If the movement locus of the modeling head 11 can be specified, the direction of movement of the printing head 11 when starting additional processing on the workpiece W can also be specified.

If it is determined in step S35 that the printing head 11 starts moving along the X axis and toward the +X side, the control device 15 controls the position Cstm(+X ), the position Chfm(+X) of the printing head 11 when forming the test mark TM(+X) (that is, the position Chfm(+X) of the printing head 11 specified in step S3221), and the printing specified in step S332 The printing head 11 is moved to the printing start position Ch_start based on the start position Cs_start (step S3411). Note that the operation of moving the printing head 11 to the printing start position Ch_start based on the position Cstm(+X) of the test mark TM(+X), the position Chfm(+X) of the printing head 11, and the printing start position Cs_start in step S3411 is as follows. , is the same as the operation of moving the printing head 11 to the printing start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the printing head 11, and the printing start position Cs_start in step S241 of FIG. 6 described above. good. Therefore, a detailed explanation thereof will be omitted, but an outline will be briefly explained below. For example, as shown in FIG. 12, the control device 15 moves from the position Cstm(+X)=(Xstm(+X), Ystm(+X), Zstm(+X)) of the test mark TM(+X) to the modeling start position Cs_start. The amount and direction of movement of the moving irradiation area EA is specified. Thereafter, the control device 15 uses the transformation matrix T to convert the movement amount and movement direction of the irradiation area EA specified in the stage coordinate system Cs into the movement amount and movement direction of the modeling head 11 in the head coordinate system Ch. After that, the control device 15 moves the modeling head 11 located at the position Chfm(+X) in the head coordinate system Ch by the amount of movement obtained by the conversion in the moving direction obtained by the conversion. As a result, the printing head 11 is located at the printing start position Ch_start.

In step S35, if it is determined that the printing head 11 starts moving along the (-X), the position Chfm(-X) of the printing head 11 when forming the test mark TM(-X) (that is, the position Chfm(-X) of the printing head 11 identified in step S3222), and The printing head 11 is moved to the printing start position Ch_start based on the printing start position Cs_start specified in step S332 (step S3412). Operation of moving the printing head 11 to the printing start position Ch_start based on the position Cstm(-X) of the test mark TM(-X), the position Chfm(-X) of the printing head 11, and the printing start position Cs_start in step S3412 is the same as the operation of moving the printing head 11 to the printing start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the printing head 11, and the printing start position Cs_start in step S241 of FIG. 6 described above. Good too. The same applies to step S3413 and step S3414, which will be described later.

In step S35, if it is determined that the printing head 11 starts moving along the Y axis and toward the +Y side, the control device 15 controls the position Cstm(+Y) of the test mark TM (+Y) specified in step S332. ), the position Chfm(+Y) of the printing head 11 when forming the test mark TM(+Y) (that is, the position Chfm(+Y) of the printing head 11 specified in step S3223), and the printing specified in step S332 The printing head 11 is moved to the printing start position Ch_start based on the start position Cs_start (step S3413).

If it is determined in step S35 that the printing head 11 starts moving along the Y axis and toward the -Y side, the control device 15 moves the position Cstm of the test mark TM (-Y) specified in step S332. (-Y), the position Chfm(-Y) of the printing head 11 when forming the test mark TM(-Y) (that is, the position Chfm(-Y) of the printing head 11 identified in step S3224), and The printing head 11 is moved to the printing start position Ch_start based on the printing start position Cs_start specified in step S332 (step S3414).

In this way, also in the first modification, as described above, the control device 15 can appropriately move the printing head 11 to the printing start position Ch_start. That is, the control device 15 can move the printing head 11 so that the position of the printing head 11 after the movement in the head coordinate system Ch matches (or approaches) the printing start position Ch_start. In other words, the control device 15 can move the printing head 11 so that the irradiation area EA to which the light EL from the moved printing head 11 is irradiated is set to the printing start position Cs_start.

In the first modified example, even if there is a possibility that the formation position of the modeled object on the workpiece W may change due to a difference in the moving direction of the printing head 11, the formation position of the modeled object on the workpiece W may be changed. The modeling head 11 can be appropriately moved to the modeling start position Ch_start so that a modeled object can be formed in the following manner. Specifically, depending on the characteristics of the head drive system 12, the relative position between the position of the printing head 11 in the head coordinate system Ch and the position of the object formed by the printing head 11 in the stage coordinate system Cs may vary. The positional relationship may change depending on the direction of movement of the printing head 11. For example, when the printing head 11 is headed in the first direction, the position of the printing head 11 in the head coordinate system Ch and the position of the object formed by the printing head 11 in the stage coordinate system Cs may be different. The relative positional relationship is the position of the printing head 11 in the head coordinate system Ch when the printing head 11 is headed in the second direction and the stage coordinate system Cs of the model formed by the printing head 11. The relative positional relationship between the two locations may differ. In this case, the position in the stage coordinate system Cs of the object formed by the printing head 11 that has started moving in the first direction from a certain position in the head coordinate system Ch (particularly at the starting point of the object). The position in the stage coordinate system Cs of the object formed by the printing head 11 that has started moving in the second direction from the same position in the head coordinate system Ch (the position of the corresponding end in the stage coordinate system Cs) may not match. As a result, the shape accuracy of the three-dimensional structure ST, which is an aggregate of shaped objects, may deteriorate. However, in the first modification, the control device 15 moves the printing head 11 to the printing start position Ch_start based on the positions of the plurality of test marks TM respectively formed by the printing head 11 moving in a plurality of different directions. move it. Therefore, the relative positional relationship between the position of the printing head 11 in the head coordinate system Ch and the position of the object formed by the printing head 11 in the stage coordinate system Cs depends on the moving direction of the printing head 11. Even if the position changes, the printing head 11 can form an appropriate object from the printing start position Cs_start of the stage coordinate system Cs. Therefore, deterioration in shape accuracy of the three-dimensional structure ST is appropriately suppressed.

In addition, in the first modification, the test mark formed by the printing head 11 that has moved in a direction different from the moving direction of the printing head 11 when the printing head 11 starts moving with the start of additional processing on the workpiece W. The TM position Cstm may also be used. For example, when the printing head 11 starts moving along the direction of 45 degrees with respect to the X-axis and Y-axis and toward the +X side and +Y side with the start of additional processing, the control device The printing head 11 may be moved to the printing start position Ch_start based on the position Cstm(+X) of the mark TM(+X) and the position Cstm(+Y) of the test mark TM(+Y). When the printing head 11 starts moving along the direction of 45 degrees with respect to the X-axis and Y-axis and toward the +X side and +Y side with the start of additional processing, the position of the test mark TM (+X) The average value of Cstm(+X) and the position Cstm(+Y) of the test mark TM(+Y) may be used, and if it is not 45 degrees, the position Cstm(+X) of the test mark TM(+X) and the test mark TM(+Y) may be used. +Y) may be used as a weighted average of the positions Cstm(+Y). In this way, statistics of the positions Cstm of a plurality of test marks TM may be used.

In the above description, a plurality of types of test marks TM are formed on the same mark member 134 arranged in the designated mark area 134d. However, some of the plurality of types of test marks TM are formed on the first mark member FM-1 disposed in the first designated mark area 134d-1, and other parts of the plurality of types of test marks TM are , may be formed on a second mark member FM-2 disposed in a second designated mark area 134d-2 different from the first designated mark area 134d-1.

In addition, in the above explanation, the shapes of the test marks TM(+X), TM(-X), TM(+Y), and TM(-Y) were linear, but the shapes of the test marks are not linear. For example, it may be curved or hooked.

(3-2) During the modeling period during which the second modification modeling operation is being performed, the modeling surface MS corresponding to the surface of the workpiece W (or the surface of the structural layer SL formed on the workpiece W) Light EL is irradiated. Therefore, heat may be transferred from the light EL to the workpiece W via the modeling surface CS (furthermore, via the structural layer SL). When heat is transferred to the workpiece W, the workpiece W may thermally expand. On the other hand, when the modeling operation is finished, the modeling surface MS is no longer irradiated with the light EL, so that heat is no longer transferred to the workpiece W from the light EL. For this reason, there is a possibility that the workpiece W, which has been thermally expanded, may contract.

Considering that the workpiece W may thermally expand and contract in this way, it is possible that the shaped object (or structural layer SL or three-dimensional structure) formed on the workpiece W while the workpiece W is thermally expanding. The object ST) may shrink as the workpiece W shrinks. As a result, the shape accuracy of the three-dimensional structure ST may deteriorate.

Therefore, in the second modification, the modeling system 1 controls the size of the object to be formed by additional processing based on the shape of the workpiece W during the modeling period. Specifically, the measuring device 14 measures the shape of the workpiece W before the modeling operation is started. As a result, the control device 15 can acquire first shape information regarding the original shape (that is, the designed shape) of the workpiece W from the measurement device 14 . Alternatively, the control device 15 may acquire the first shape information regarding the original shape of the workpiece W by acquiring the design data of the workpiece W. Furthermore, the measuring device 14 measures the shape of the workpiece W at a desired timing during the modeling period. As a result, the control device 15 can acquire second shape information regarding the current shape of the workpiece W from the measurement device 14. Thereafter, the control device 15 determines whether the actual shape of the work W is different from the original shape of the work W, based on the acquired first and second shape information. As a result, if it is determined that the actual shape of the workpiece W is different from the original shape of the workpiece W, the workpiece W is deformed by the heat transferred from the light EL (typically , thermal expansion).

When the workpiece W is thermally expanding, the control device 15 controls the size of the object to be formed on the workpiece W based on the amount of deviation of the actual shape of the workpiece W from the original shape of the workpiece W. Forming objects. Here, the deviation of the actual shape of the workpiece W from the original shape of the workpiece W due to thermal expansion of the workpiece W means that the actual shape of the workpiece W is expanded or contracted with respect to the original shape of the workpiece W. This includes deviations related to scaling. Specifically, for example, FIG. 13(a) is a plan view showing a shaped object formed on the workpiece W when the workpiece W is not thermally expanded. On the other hand, FIG. 13(b) is a plan view showing a shaped object formed on the workpiece W when the workpiece W is thermally expanded. As shown in FIGS. 13(a) and 13(b), the thermally expanding work W has an expanded shape compared to the work W having the original shape (that is, not thermally expanding). are doing. In this case, the control device 15 controls the modeling so that when the workpiece W is thermally expanded, the size of the object formed on the workpiece W is also larger than when the workpiece W is not thermally expanded. A shaped object may be formed while controlling the size of the object. For example, the control device 15 may specify correlation information that defines the relationship between the original shape of the workpiece W and the actual shape of the workpiece W, and control the size of the shaped object based on the correlation information. As an example of such correlation information, the coordinates indicating the position of the original workpiece W (for example, a workpiece W that has not thermally expanded) in the stage coordinate system Cs and the actual workpiece W (for example, a workpiece W that has thermally expanded ) and the coordinates indicated by the stage coordinate system Cs (for example, a matrix related to scaling).

The control device 15 determines the ratio of the size of the modeled object to the size of the workpiece W when the workpiece W is thermally expanding, and the ratio of the size of the modeled object to the size of the workpiece W when the workpiece W is not thermally expanded. The size of the modeled object may be controlled so that the difference in . In particular, the control device 15 determines the ratio of the size of the modeled object to the size of the workpiece W when the workpiece W is thermally expanding, and the ratio of the size of the modeled object to the size of the workpiece W when the workpiece W is not thermally expanded. The size of the modeled object may be controlled so that the proportions match.

According to such a second modification, the shaped object (or the structural layer SL or the three-dimensional structure ST) formed on the workpiece W while the workpiece W is thermally expanding expands as the workpiece W contracts. Even if the size of the shrunk object is smaller than the size of the object formed on the work W that has not undergone thermal expansion (and therefore has not shrunk) (that is, the size of the object that was originally supposed to be formed) It will not deviate significantly from the size of the modeled object. In some cases, the size of the shrunken model may match the size of the model formed on the workpiece W that has not been thermally expanded in the first place (that is, the size of the model that should have been originally formed). Therefore, deterioration in shape accuracy of the three-dimensional structure ST is appropriately suppressed.

In the above description, the operation of measuring the current shape of the workpiece W and acquiring the second shape information regarding the current shape of the workpiece W is performed during the modeling period in which the modeling operation is performed. However, the operation of measuring the current shape of the workpiece W and acquiring the second shape information regarding the current shape of the workpiece W may be performed before the modeling operation is started. This is because even if the modeling operation has not started (that is, the light EL is not irradiated onto the modeling surface MS), there is a possibility that the workpiece W is thermally expanding due to some factor. .

In the above description, an example has been described in which the deviation of the actual shape of the workpiece W from the original shape of the workpiece W is caused by heat transmitted from the light EL. However, the deviation of the actual shape of the workpiece W from the original shape of the workpiece W may be caused by factors other than the heat transferred from the light EL. Even in this case, the control device 15 forms the object while controlling the size of the object to be formed on the workpiece W based on the amount of deviation of the actual shape of the workpiece W from the original shape of the workpiece W. It's okay. As a result, deterioration in shape accuracy of the three-dimensional structure ST is suppressed.

In the above explanation, the deviation of the actual shape of the workpiece W from the original shape of the workpiece W due to thermal expansion of the workpiece W is caused by the expansion or contraction of the actual shape of the workpiece W with respect to the original shape of the workpiece W. This includes a scaling-related misalignment. However, the deviation of the actual shape of the workpiece W from the original shape of the workpiece W due to thermal expansion of the workpiece W is caused by the actual workpiece W moving parallel to the original workpiece W (for example, in the XY plane). It may also include a shift related to parallel movement. The deviation of the actual shape of the workpiece W from the original shape of the workpiece W due to thermal expansion of the workpiece W is due to rotation of the actual workpiece W with respect to the original workpiece W (for example, rotation around the Z axis). It may also include rotation-related deviations such as In this case as well, the control device 15 prevents deterioration of the shape accuracy of the three-dimensional structure ST based on the amount of deviation of the actual shape of the workpiece W from the original shape of the workpiece W (for example, if the deviation occurs the work W so as to reduce or match the difference between the shape of the three-dimensional structure ST formed in a situation where the deviation is not occurring and the shape of the three-dimensional structure ST formed in a situation where no deviation occurs. The object may be formed while controlling the size (or other arbitrary characteristics such as the formation position) of the object to be formed.

(3-3) Third Modification Next, the third modification will be explained. In the third modification, a part of the structure of the modeling system 1c in the third modification differs from the structure of the modeling system 1 described above. Hereinafter, the structure of the modeling system 1c in the third modification will be described with reference to FIG. 14. Note that structures that are the same as those of the modeling system 1 described above are given the same reference numerals, and detailed explanation thereof will be omitted.

As shown in FIG. 14, the printing system 1c differs from the above-described printing system 1 in that it includes a printing head 11c instead of the printing head 11. The modeling head 11c differs from the above-described modeling head 11 in that it further includes a material nozzle 112c in addition to the irradiation system 111 and the material nozzle 112. The other structure of the modeling system 1c may be the same as the other structure of the modeling system 1.

The material nozzle 112c has a supply outlet (that is, a supply port) 114c that supplies the modeling material M. The material nozzle 112c supplies (specifically, injects) the modeling material M from the supply outlet 114c. The material nozzle 112c is physically connected to a material supply device (not shown), which is a supply source of the modeling material M, via a powder transmission member such as a pipe (not shown). The material nozzle 112c supplies the modeling material M supplied from the material supply device via the powder transmission member. In addition, although the material nozzle 112c is drawn in a tube shape in FIG. 14, the shape of the material nozzle 112c is not limited to this shape.

The material nozzle 112c supplies the modeling material M downward (that is, to the −Z side) from the material nozzle 112c. A stage 13 is arranged below the material nozzle 112c. When the workpiece W is mounted on the stage 13, the material nozzle 112c supplies the modeling material M toward the workpiece W.

The material nozzle 112c is aligned with the irradiation system 111 so that the irradiation system 111 supplies the modeling material M toward the irradiation area EA where the light EL is irradiated. In other words, the material nozzle 112c and the irradiation area are arranged so that the supply area MAc set on the work W as the area where the material nozzle 112c supplies the modeling material M and the irradiation area EA match (or at least partially overlap). system 111 are aligned. In other words, the supply area MAc is set on the workpiece W as an area where the material nozzle 112c supplies the modeling material M, and the supply area MA is set on the workpiece W as an area where the material nozzle 112 supplies the modeling material M. match (or at least partially overlap). However, the supply area MAc set on the workpiece W as the area where the material nozzle 112c supplies the modeling material M overlaps with the supply area MA set on the workpiece W as the area where the material nozzle 112 supplies the modeling material M. You don't have to.

Particularly in the third modification, the traveling direction of the modeling material M supplied from the material nozzle 112c is different from the traveling direction of the modeling material M supplied from the material nozzle 112. The direction in which the modeling material M is supplied from the material nozzle 112c is different from the direction in which the modeling material M is supplied from the material nozzle 112. That is, in the third modification, the modeling system 1c can supply the modeling material M from a plurality of different directions to the workpiece W or the upper surface 131 of the stage 13 (in particular, the mark area 134 or the mark member FM). . In this case, for example, the modeling system 1c performs additional processing on the mark member FM while supplying the modeling material M from the material nozzle 112, forms the first test mark TM on the mark member FM, and prints the material from the material nozzle 112c. Additional processing may be performed on the mark member FM while supplying the material M to form a second test mark TM different from the first test mark TM on the mark member FM. Note that the direction in which the modeling material M supplied from the material nozzle 112c is inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis is not directly below (that is, in a direction that coincides with the Z-axis). It's okay.

In the above description, the modeling system 1c includes a single modeling head 11c that includes the material nozzle 112c in addition to the irradiation system 111 and the material nozzle 112. However, the printing system 1c may include a printing head 11c-1 including a material nozzle 112c, separately from the printing head 11 including the irradiation system 111 and the material nozzle 112. In this case, the head drive system 12 may move the printing head 11c-1 separately and independently from the printing head 11.

(3-4) Fourth Modification Next, the fourth modification will be explained. In the fourth modification, a part of the structure of the modeling system 1d in the fourth modification differs from the structure of the modeling system 1 described above. Hereinafter, the structure of the modeling system 1d in the fourth modification will be described with reference to FIG. 15. Note that structures that are the same as those of the modeling system 1 described above are given the same reference numerals, and detailed explanation thereof will be omitted.

As shown in FIG. 15, the printing system 1d differs from the above-described printing system 1 in that it includes a printing head 11d instead of the printing head 11. The modeling head 11d differs from the above-described modeling head 11 in that it further includes an irradiation system 111d in addition to the irradiation system 111 and the material nozzle 112. The other structure of the modeling system 1d may be the same as the other structure of the modeling system 1.

The irradiation system 111d is an optical system (for example, a condensing optical system) for emitting the light EL from the emission section 113d. Specifically, the irradiation system 111d is optically connected to a light source (not shown) that emits light EL via a light transmission member (not shown) such as an optical fiber. The irradiation system 111d emits light EL propagating from the light source via the light transmission member. The irradiation system 111d irradiates the light EL downward (that is, to the -Z side) from the irradiation system 111d. A stage 13 is arranged below the irradiation system 111d. When the work W is mounted on the stage 13, the irradiation system 111d can irradiate the work W with the light EL. Specifically, the irradiation system 111d irradiates the light EL onto an irradiation area EAd of a predetermined shape that is set on the workpiece W as an area where the light EL is irradiated (typically, condensed). Further, the state of the irradiation system 111d can be switched under the control of the control device 15 between a state in which the irradiation area EAd is irradiated with the light EL and a state in which the irradiation area EAd is not irradiated with the light EL. Note that the irradiation area EAd to which the irradiation system 111d irradiates the light EL may coincide with the irradiation area EA to which the irradiation system 111 irradiates the light EL. The irradiation area EAd to which the irradiation system 111d irradiates the light EL may at least partially overlap the irradiation area EA to which the irradiation system 111 irradiates the light EL. The irradiation area EAd to which the irradiation system 111d irradiates the light EL does not need to overlap the irradiation area EA to which the irradiation system 111 irradiates the light EL.

Particularly in the fourth modification, the traveling direction of the light EL irradiated from the irradiation system 111d is different from the traveling direction of the light EL irradiated from the irradiation system 111. The irradiation direction of the light EL from the irradiation system 111d is different from the irradiation direction of the light EL from the irradiation system 111. That is, in the fourth modification, the modeling system 1d can irradiate the workpiece W or the upper surface 131 of the stage 13 (particularly the mark region 134 or the mark member FM) with the light EL from a plurality of different directions. In this case, for example, the modeling system 1d performs additional processing on the mark member FM with the light EL irradiated by the irradiation system 111, forms the first test mark TM on the mark member FM, and forms the first test mark TM with the light EL irradiated by the irradiation system 111d. A second test mark TM different from the first test mark TM may be formed on the mark member FM by performing additional processing on the mark member FM using EL. Note that the direction of movement of the modeling material M supplied from the material nozzle 112c is directly below (that is, the direction that coincides with the Z-axis), but it is not inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis. It's okay.

In the above description, the modeling system 1d includes a single modeling head 11d that includes the irradiation system 111d in addition to the irradiation system 111 and the material nozzle 112. However, the printing system 1d may include a printing head 11d-1 including an irradiation system 111d, separately from the printing head 11 including an irradiation system 111 and a material nozzle 112. In this case, the head drive system 12 may move the printing head 11d-1 separately and independently from the printing head 11.

Also in the fourth modification, the modeling head 11d may include a material nozzle 112c, similar to the third modification. In this case, the material nozzle 112 supplies the building material M to the irradiation area EA where the irradiation system 111 irradiates the light EL, and the material nozzle 112c supplies the building material M to the irradiation area EAd where the irradiation system 111d irradiates the light EL. May be supplied. Alternatively, the modeling system 1d may include a printing head 11d-2 including an irradiation system 111d and a material nozzle 112c, separately from the printing head 11 including an irradiation system 111 and a material nozzle 112.

(3-5) Other Modifications In the above description, the mark member FM is arranged in the mark area 134. However, the mark member FM does not have to be arranged in the mark area 134. In this case, the modeling system 1 may form the test mark TM in the mark region 134 instead of the mark member FM.

In the above description, the modeling system 1 forms the test mark TM on the mark member FM arranged in the mark area 134. However, the modeling system 1 may form the test mark TM on the mark member FM arranged in a region different from the mark region 134. For example, the modeling system 1 may form the test mark TM on the mark member FM placed at an arbitrary position in the non-holding area 133 of the stage 13. The modeling system 1 may form the test mark TM on the mark member FM placed at any position in the holding area 132 of the stage 13. The modeling system 1 may form the test mark TM on the mark member FM placed at any position on the workpiece W held by the stage 13.

In the above description, the modeling system 1 forms the test mark TM on the mark member FM. However, the modeling system 1 may form the test mark TM on a member different from the mark member FM. For example, the modeling system 1 may form the test mark TM at any position in the non-holding area 133 of the stage 13. For example, the modeling system 1 may form the test mark TM at any position in the holding area 132 of the stage 13. The modeling system 1 may form the test mark TM at any position on the workpiece W held by the stage 13. When forming the test mark TM on the work W held by the stage 13, the position where the test mark TM is formed may be different from the area where the object is formed.

In the above description, a plurality of mark members FM are respectively arranged in a plurality of mark regions 134 in the initial setting operation. However, while the mark member FM is arranged in some of the plurality of mark regions 134, the mark member FM does not have to be arranged in the remaining part of the plurality of mark regions 134. For example, mark members FM are arranged in the number of mark regions 134 necessary for calculating the transformation matrix T among the plurality of mark regions 134, while mark members FM are arranged in the remaining mark regions 134 among the plurality of mark regions 134. It doesn't have to be done. In the example described above, in order to calculate the transformation matrix T, the test mark TM is formed on each of at least three mark members FM arranged in at least three mark areas 134, respectively. In this case, if four or more mark areas 134 are set on the stage 13, for example, at least three mark members FM are arranged in the three mark areas 134, while the remaining one or more marks The mark member FM may not be arranged in the region 134.

In the above description, the modeling system 1 performs the alignment operation before starting the modeling operation for performing additional processing on the workpiece W. However, the modeling system 1 may perform the alignment operation at other timings. For example, after completing the modeling operation (that is, after forming the three-dimensional structure ST), the modeling system 1 may perform a positioning operation (in particular, an initial setting operation) in preparation for the next modeling operation. . For example, the modeling system 1 may temporarily interrupt the modeling operation in the middle of the modeling operation, and then perform the alignment operation. In this case, the printing system 1 resumes the interrupted printing operation after the positioning operation is completed. As an example, each time a certain structural layer SL is formed, the modeling system 1 may temporarily suspend the modeling operation and perform the alignment operation before forming the next structural layer SL. .

In the above description, the head moving operation is an operation for moving the printing head 11 to the printing start position Ch_start. However, the head moving operation may include an operation for moving the modeling head 11 to any position Ch_any within the head coordinate system Ch. The control device 15 may move the printing head 11 to any position Ch_any in the head coordinate system Ch by performing the same operation as when moving the printing head 11 to the printing start position Ch_start. That is, the control device 15 specifies an arbitrary position Cs_any in the stage coordinate system Cs instead of the above-mentioned printing start position Cs_start, and based on the position Cstm of the test mark, the position Chfm of the printing head 11, and the position Cs_any. , in the head coordinate system Ch, the modeling head 11 may be moved to a position Ch_any corresponding to the position Cs_any.

In the above description, the printing system 1 includes the head drive system 12 that moves the printing head 11. However, the modeling system 1 may include a stage drive system for moving the stage 13 in addition to or in place of the head drive system 12. The stage drive system may move the stage 13 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. The movement of the stage 13 by the stage drive system changes the relative positional relationship between the stage 13 and the print head 11 (that is, the relationship between the workpiece W and the irradiation area EA), as well as the movement of the print head 11 by the head drive system 12. (relative positional relationship between the two) is changed.

In the above description, the printing system 1 moves the irradiation area EA with respect to the printing surface MS by moving the printing head 11. However, in addition to or instead of moving the printing head 11, the printing system 1 may move the irradiation area EA with respect to the printing surface MS by deflecting the light EL. In this case, the irradiation system 111 may include, for example, an optical system (eg, a galvano mirror) that can deflect the light EL.

In the above description, the positioning operation is an operation of moving the printing head 11 relative to the workpiece W (that is, relative to the stage 13) so as to align the workpiece W and the printing head 11. Here, the purpose of aligning the workpiece W and the printing head 11 is to change the position of the irradiation area EA by moving the printing head 11 so that the desired position of the workpiece W (for example, the printing start position Cs_start) is irradiated. This is to set the area EA. Then, the alignment operation is substantially equivalent to the operation of moving the irradiation area EA with respect to the workpiece W (that is, with respect to the stage 13) in order to align the workpiece W and the irradiation area EA. It is. In this case, in addition to or instead of moving the printing head 11 using the head drive system 12, the printing system 1 moves the stage 13 using the above-mentioned stage drive system in order to perform the alignment operation. Thus, the irradiation area EA may be moved relative to the workpiece W (that is, relative to the stage 13). For example, the printing system 1 sets the stage coordinate system Cs so that the irradiation area EA is set at a desired position within the stage coordinate system Cs while the position of the printing head 11 is fixed or as the printing head 11 moves. The stage 13 may be moved within the space. Alternatively, in order to perform the alignment operation, in addition to or in place of moving at least one of the printing head 11 and the stage 13, the printing system 1 uses an optical system (for example, a galvano mirror) capable of deflecting the light EL described above. etc.), the irradiation area EA may be moved relative to the workpiece W (that is, relative to the stage 13). For example, the printing system 1 sets the irradiation area EA to a desired position within the stage coordinate system Cs while keeping the position of the printing head 11 fixed or in accordance with the movement of the printing head 11 (see FIG. 7). , the irradiation area EA may be moved within the head coordinate system Ch. In either case, the irradiation area EA can still be set at a desired position of the workpiece W (for example, the modeling start position Cs_start) by performing the positioning operation described above.

In the above description, the modeling system 1 melts the modeling material M by irradiating the modeling material M with light EL. However, the modeling system 1 may melt the modeling material M by irradiating the modeling material M with an arbitrary energy beam. In this case, the modeling system 1 may include, in addition to or instead of the irradiation system 111, a beam irradiation device capable of irradiating an arbitrary energy beam. Any energy beams include, but are not limited to, charged particle beams such as electron beams, ion beams, or electromagnetic waves.

In the above description, the modeling system 1 is capable of forming the three-dimensional structure ST using the laser overlay welding method. However, the modeling system 1 may form the three-dimensional structure ST from the modeling material M using other methods capable of forming the three-dimensional structure ST. Other methods include, for example, powder bed fusion such as selective laser sintering (SLS), binder jetting, or laser metal fusion (LMF). Laser Metal Fusion).

(5) Additional Notes Regarding the embodiments described above, the following additional notes are further disclosed.
[Additional note 1]
a support device capable of supporting a workpiece;
a processing device that performs additional processing by irradiating an energy beam onto a processing region on the workpiece and supplying material to the region irradiated with the energy beam;
a position changing device that changes the positional relationship between the support device and the irradiation area of the energy beam from the processing device;
performing additional processing on at least one of a first region that is a part of the support device and a second region that is a part of the workpiece to form a reference shaped object;
A processing system that controls at least one of the processing device and the position changing device using information regarding the reference object.
[Additional note 2]
The processing system according to supplementary note 1, wherein the position change device is controlled so that additional processing is performed on a desired portion of the workpiece using the information regarding the reference object.
[Additional note 3]
The processing system according to supplementary note 1 or 2, wherein the position change device is controlled using the information regarding the reference object so that additional processing is started from a desired portion of the workpiece.
[Additional note 4]
Before the processing device starts additional processing on the workpiece, the processing device performs additional processing on at least one of the first region and the second region to form the reference object; controlling the position changing device;
After forming the reference model, controlling the position changing device using the information regarding the reference model,
According to any one of Supplementary Notes 1 to 3, the processing device is controlled to start additional processing on the workpiece after controlling the position changing device using the information regarding the reference model object. processing system.
[Additional note 5]
Before the processing device starts additional processing on the workpiece, the processing device performs additional processing on at least one of the first region and the second region to form the reference object; controlling the position changing device;
After forming the reference object, the position changing device is configured to use the information regarding the reference object so that the irradiation area is set at a processing start portion of the workpiece where additional processing is to be started. control,
The processing system according to any one of Supplementary Notes 1 to 4, wherein the processing device is controlled to start additional processing on the workpiece after the irradiation area is set in the processing start portion.
[Additional note 6]
a movement direction calculated based on the information regarding the reference object, with the position of the irradiation area relative to the support device as a base point when the reference object is formed in at least one of the first region and the second region; The processing system according to any one of Supplementary Notes 1 to 5, wherein the position changing device is controlled so that the irradiation area moves with respect to the support device.
[Additional note 7]
A movement distance calculated based on the information regarding the reference object based on the position of the irradiation area with respect to the support device when the reference object is formed in at least one of the first region and the second region. The processing system according to any one of Supplementary Notes 1 to 6, wherein the position changing device is controlled so that the position of the irradiation area with respect to the support device is changed by the amount of the irradiation area.
[Additional note 8]
The processing system according to any one of Supplementary Notes 1 to 7, wherein the position changing device moves the processing device with respect to the support device to change the positional relationship between the support device and the irradiation area.
[Additional note 9]
Before the processing device starts additional processing on the workpiece, the processing device performs additional processing on at least one of the first region and the second region to form the reference object; controlling the position changing device;
After forming the reference model, the processing device is arranged to be located at a processing start position where additional processing can be performed on a processing start portion of the workpiece where additional processing is to be started. controlling the position change device using the information;
The processing system according to appendix 8, wherein the processing device is controlled to start additional processing on the workpiece after the processing device is positioned at the processing start position.
[Additional note 10]
A movement direction calculated based on the information regarding the reference object, with the position of the processing device relative to the support device when the reference object is formed in at least one of the first region and the second region as a base point. The processing system according to appendix 8 or 9, wherein the position changing device is controlled so that the processing device moves with respect to the support device.
[Additional note 11]
A movement distance calculated based on the information regarding the reference object, with a position of the processing device relative to the support device when the reference object is formed in at least one of the first region and the second region as a base point. The processing system according to any one of Supplementary Notes 8 to 10, wherein the position changing device is controlled so that the position of the processing device with respect to the support device is changed by the amount of the processing device.
[Additional note 12]
The processing system according to any one of Supplementary Notes 1 to 11, wherein the information regarding the reference molded object includes information regarding the state of the reference molded object.
[Additional note 13]
The processing system according to any one of Supplementary Notes 1 to 12, wherein the information regarding the reference molded object includes first position information regarding a relative positional relationship between the workpiece and the reference molded object.
[Additional note 14]
The first position information includes information regarding a relative positional relationship between a processing start portion of the workpiece where additional processing is to be started and the reference molded object.
The processing system described in Appendix 13.
[Additional note 15]
The first position information includes the relative position of the workpiece and the reference model along a first direction, and the relative position of the workpiece and the reference model along a second direction intersecting the first direction. Includes information regarding at least one of a relative position to an object, and a relative position between the workpiece and the reference object along a third direction intersecting the first and second directions. 15. The processing system according to 13 or 14.
[Additional note 16]
In addition to the information regarding the reference object, second information regarding the relative positional relationship between the support device and the processing device when the reference object is formed in at least one of the first region and the second region. The processing system according to any one of Supplementary Notes 1 to 15, wherein the position change device is controlled using position information.
[Additional note 17]
The processing is performed such that additional processing is performed on the first region while changing the positional relationship between the support device and the processing device along a fourth direction to form a first modeled object as the reference modeled object. The processing system according to any one of Supplementary Notes 1 to 16, which controls a device and the position changing device.
[Additional note 18]
The processing system according to appendix 17, wherein the information regarding the reference object includes first information regarding the first object.
[Additional note 19]
When starting additional processing such that the processing device performs additional processing on the workpiece while moving along the fourth direction with respect to the support device, the first information is used to determine the position. The processing system according to appendix 18, which controls a changing device.
[Additional note 20]
Controlling the position changing device using the first information so that the processing device is located at a processing start position where additional processing can be performed on a processing start portion of the workpiece where additional processing is to be started. and then controlling the processing device so as to start additional processing on the workpiece while the processing device moves along the fourth direction with respect to the support device. Processing system described.
[Additional note 21]
The processing device performs additional processing on at least one of the first region and the second region while moving with respect to the support device along a fifth direction different from the fourth direction, so as to form the reference model object. The processing system according to any one of Supplementary Notes 17 to 20, wherein the processing device and the position changing device are controlled so as to form a second shaped object.
[Additional note 22]
The processing system according to attachment 21, wherein the information regarding the reference molded object includes second information regarding the second molded object.
[Additional note 23]
When starting additional processing such that the processing device performs additional processing on the workpiece while moving along the fifth direction with respect to the support device, the second information is used to determine the position. The processing system according to appendix 22, which controls a changing device.
[Additional note 24]
Controlling the position changing device using the second information so that the processing device is positioned at a processing start position where additional processing can be performed on a processing start portion of the workpiece where additional processing is to be started. and then controlling the processing device so as to start additional processing on the workpiece while the processing device moves along the fifth direction relative to the support device. Processing system described.
[Additional note 25]
The processing system according to any one of appendices 21 to 24, wherein the fifth direction is a direction opposite to the fourth direction.
[Additional note 26]
The processing device performs additional processing on at least one of the first region and the second region while moving with respect to the support device along a sixth direction different from the fourth direction, so as to form the reference model object. The processing system according to any one of Supplementary Notes 17 to 25, wherein the processing device and the position changing device are controlled so as to form a third modeled object.
[Additional note 27]
The processing system according to attachment 26, wherein the information regarding the reference object includes third information regarding the third object.
[Additional note 28]
When starting additional processing such that the processing device performs additional processing on the workpiece while moving along the sixth direction with respect to the support device, the third information is used to determine the position. The processing system according to appendix 27, which controls a changing device.
[Additional note 29]
Controlling the position changing device using the third information so that the processing device is positioned at a processing start position where additional processing can be performed on a processing start portion of the workpiece where additional processing is to be started. and then controlling the processing device so as to start additional processing on the workpiece while the processing device moves along the sixth direction with respect to the support device. Processing system described.
[Additional note 30]
The processing system according to any one of appendices 27 to 29, wherein the sixth direction is a direction intersecting the fourth direction.
[Additional note 31]
The processing device performs additional processing on at least one of the first region and the second region while moving with respect to the support device along a seventh direction different from the fourth direction and the sixth direction, and The processing system according to any one of appendices 27 to 30, wherein the processing device and the position changing device are controlled so as to form a fourth modeled object as a reference modeled object.
[Additional note 32]
The processing system according to appendix 31, wherein the information regarding the reference object includes fourth information regarding the fourth object.
[Additional note 33]
When starting additional processing such that the processing device performs additional processing on the workpiece while moving along the seventh direction relative to the support device, the fourth information is used to determine the position. The processing system according to appendix 32, which controls a changing device.
[Additional note 34]
Controlling the position changing device using the fourth information so that the processing device is positioned at a processing start position where additional processing can be performed on a processing start portion of the workpiece where additional processing is to be started. and then controlling the processing device so as to start additional processing on the workpiece while the processing device moves along the seventh direction relative to the support device. Processing system described.
[Additional note 35]
The processing system according to any one of Supplementary Notes 32 to 34, wherein the seventh direction is a direction that intersects the fourth direction and is a direction opposite to the sixth direction.
[Appendix 36]
36. The processing system according to any one of Supplementary Notes 1 to 35, wherein the information regarding the reference object is measured by a measuring device.
[Additional note 37]
The processing system according to appendix 36, further comprising the measuring device.
[Appendix 38]
The processing system according to appendix 36 or 37, wherein the measuring device is capable of measuring a relative positional relationship between the workpiece and the reference molded object.
[Additional note 39]
performing additional processing on a first portion of at least one of the first region and the second region to form a fifth modeled object as the reference model; performing additional processing on a second portion different from the first portion to form a sixth modeled object as the reference model, and at least one of the first region and the second region. controlling the processing device and the position changing device to perform additional processing on a third portion different from the first and second portions to form a seventh object as the reference object;
The information regarding the reference built object includes fifth information regarding the fifth to seventh built objects,
Using the fifth information, a first coordinate system in which the position of the processing device is expressed, and a relative positional relationship between the workpiece measured by the measurement device and the reference model object is expressed. The processing system according to appendix 38, wherein the processing system is associated with a second coordinate system.
[Additional note 40]
The processing system according to attachment 39, wherein at least one height of the first to third portions is different from at least one other height of the first to third portions.
[Additional note 41]
The processing system according to attachment 39 or 40, wherein a support region capable of supporting the workpiece of the support device is arranged between at least two of the first to third parts.
[Additional note 42]
Any one of Supplementary Notes 1 to 41, wherein at least one of the processing device and the position changing device is controlled based on deviation information regarding a deviation between the actual shape of the workpiece and the designed shape of the workpiece. The processing system described in item (1).
[Additional note 43]
Based on the shift information, at least one of the processing device and the position changing device is controlled so that an additional shaped object having a desired shape is added to a desired portion of the workpiece by additional processing. processing system.
[Additional note 44]
Based on the shift information, the processing device and the position are changed so that the larger the actual shape of the workpiece is with respect to the designed shape of the workpiece, the larger the shape of the additional shaped object is. The processing system according to attachment 43, which controls at least one of the devices.
[Additional note 45]
45. The processing system according to any one of Supplementary Notes 1 to 44, wherein the information regarding the reference molded object includes dimensional information regarding dimensions of the reference molded object.
[Additional note 46]
46. The processing system according to any one of Supplementary Notes 1 to 45, wherein the information regarding the reference molded object includes shape information regarding the shape of the reference molded object.
[Additional note 47]
Additional processing is performed on at least one of the first region and the second region while supplying the material from an eighth direction to a region to be irradiated with the energy beam, thereby forming an eighth modeled object as the reference modeled object. death,
Additional processing is performed on at least one of the first region and the second region while supplying the material from a ninth direction different from the eighth direction to the region to be irradiated with the energy beam, thereby forming the reference object. The processing system according to any one of Supplementary Notes 1 to 46, which forms a ninth modeled object.
[Additional note 48]
The processing device includes a first supply port that supplies the material, and a second supply port that supplies the material,
Additional processing is performed on at least one of the first region and the second region while supplying the material from the first supply port to the region to be irradiated with the energy beam, thereby producing an eighth modeled object as the reference modeled object. form,
Additional processing is performed on at least one of the first region and the second region while supplying material from the second supply port to the region to be irradiated with the energy beam, thereby forming a ninth modeled object as the reference modeled object. forming the processing system according to any one of Supplementary Notes 1 to 47.
[Additional note 49]
Performing additional processing on at least one of the first region and the second region while irradiating the workpiece with the energy beam from a tenth direction to form a tenth modeled object as the reference modeled object. ,
Additional processing is performed on at least one of the first region and the second region while irradiating the workpiece with the energy beam from an eleventh direction different from the tenth direction, so that the workpiece is processed as the reference object. The processing system according to any one of Supplementary Notes 1 to 48, which forms an eleventh modeled object.
[Additional note 50]
A processing method that performs additional processing on a workpiece by irradiating an energy beam from a processing device,
supporting the workpiece with a support device;
performing additional processing on at least one of a first region that is a part of the support device and a second region that is a part of the workpiece to form a reference shaped object;
Measuring the reference object;
A processing method comprising: changing a positional relationship between the support device and an irradiation area of the energy beam from the processing device based on the measured information regarding the reference object.
[Additional note 51]
A processing method that performs additional processing on the workpiece using the processing system according to any one of Supplementary Notes 1 to 49.

At least some of the constituent features of each of the above-described embodiments can be combined as appropriate with at least some of the other constituent features of each of the above-described embodiments. Some of the constituent elements of each embodiment described above may not be used. In addition, to the extent permitted by law, the disclosures of all publications and US patents cited in each of the above-mentioned embodiments are incorporated into the description of the main text.

The present invention is not limited to the embodiments described above, and can be modified as appropriate within the scope of the invention as understood from the claims and the entire specification. Processing methods are also included within the technical scope of the present invention.

1 Printing system 11 Printing head 111 Irradiation system 112 Material nozzle 13 Stage 131 Top surface 132 Holding area 133 Non-holding area 134 Mark area 14 Measuring device W Work M Building material LS Structural layer ST Three-dimensional structure FM Mark member TM Test mark

Claims (1)

a support device capable of supporting a workpiece;
an LMD type processing device that irradiates an energy beam to a processing area on the workpiece and supplies material to the area irradiated with the energy beam to perform additional processing;
a position changing device that changes the positional relationship between the support device and the irradiation area of the energy beam from the processing device;
performing additional processing on at least one of a first region that is a part of the support device and a second region that is a part of the workpiece using the processing device to form a reference shaped object;
A processing system that controls at least one of the processing device and the position changing device using information regarding the reference object.