JP2019096862A - Multilayer ceramic capacitor and method of manufacturing the same - Google Patents

Abstract

To provide a multilayer ceramic capacitor capable of securing sufficient moisture resistance reliability even if a thickness of an external electrode is thin, and improving an effective volume ratio by forming a thin and dense primary electrode layer on a body of the multilayer ceramic capacitor.SOLUTION: The multilayer ceramic capacitor includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed on one surface of the body. The external electrode includes: a primary electrode layer, disposed on one surface of the body, in contact with the internal electrode, and containing titanium nitride (TiN); and a secondary electrode layer disposed on the primary electrode layer.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same.

  With the trend toward miniaturization and higher capacity of multilayer ceramic capacitors (MLCC; Multilayer Ceramic Capacitor), it is important for increasing the effective volume ratio (the ratio of the volume contributing to the capacity as compared to the total volume) of the multilayer ceramic capacitor Sex is increasing.

  Conventionally, when forming an external electrode, a method of dipping a surface on which the internal electrode of the main body is exposed into the paste using a paste containing a conductive metal has been mainly used.

  By the way, in the external electrode formed by the dipping method, the thickness of the external electrode is not uniform, and the external electrode is formed excessively thin at the corner portion of the main body, while the external electrode is excessively thick at the remaining portion It was formed. Therefore, it is difficult not only to secure a high effective volume ratio, but also to form a plating solution inside the main body when forming a plating layer on the external electrode in order to enhance the connectivity and mounting of the multilayer ceramic capacitor. There is a problem that the reliability of the multilayer ceramic capacitor is reduced.

  One of the objects of the present invention is to secure sufficient moisture resistance reliability even if the thickness of the external electrode is thin by forming a thin and dense primary electrode layer on the main body of the multilayer ceramic capacitor. It is an object of the present invention to provide a laminated ceramic capacitor capable of improving the effective volume ratio.

  One embodiment of the present invention includes a main body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the main body, the external electrode being disposed on one surface of the main body, the internal electrode A multilayer ceramic capacitor comprising: a first electrode layer in contact with titanium nitride (TiN), and a second electrode layer disposed on the first electrode layer.

  Another embodiment of the present invention is a method of preparing a main body including a dielectric layer and an internal electrode, and forming a first electrode layer including titanium nitride (TiN) on the entire surface of the main body by an atomic layer deposition method. Forming a second electrode layer on the top of the portion where the first and second external electrodes are formed in the main body where the first electrode layer is formed, and forming the second electrode layer And removing the exposed portion of the first electrode layer in the main body.

  The multilayer ceramic capacitor according to one embodiment of the present invention secures sufficient moisture resistance reliability even when the thickness of the external electrode is thin by forming a thin and dense primary electrode layer on the main body of the multilayer ceramic capacitor. And the effective volume fraction can be improved.

FIG. 1 schematically shows a perspective view of a multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 2 schematically shows a cross-sectional view taken along the line II ′ of FIG. Fig. 3 schematically shows an enlarged cross-sectional view of a portion A in Fig. 2. Fig. 3 schematically shows an enlarged cross-sectional view of a portion B in Fig. 2. FIG. 10 schematically shows an enlarged cross-sectional view of a portion B of a laminated ceramic capacitor according to another embodiment of the present invention. FIG. 10 schematically shows an enlarged cross-sectional view of a portion B of a laminated ceramic capacitor according to still another embodiment of the present invention. It is the perspective view which showed roughly each step of the manufacturing method of the laminated ceramic capacitor which is other embodiment of this invention. It is the perspective view which showed roughly each step of the manufacturing method of the laminated ceramic capacitor which is other embodiment of this invention. It is the perspective view which showed roughly each step of the manufacturing method of the laminated ceramic capacitor which is other embodiment of this invention. It is the perspective view which showed roughly each step of the manufacturing method of the laminated ceramic capacitor which is other embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, embodiments of the present invention are provided to more fully describe the present invention to one of ordinary skill in the art. Accordingly, the shapes and sizes of elements in the drawings may be scaled (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same. It is an element of

  In order to clearly explain the present invention, parts not related to the explanation are omitted in the drawings, and the thickness is shown enlarged to clearly express various layers and regions, and functions within the same idea range. The same components will be described using the same reference numerals. Further, throughout the specification, "including" a certain component may mean that the component may further include another component without removing the other component unless otherwise stated. Means

  In the drawings, the X direction can be defined as the first direction or the length direction, the Y direction can be defined as the second direction or the thickness direction, and the Z direction can be defined as the third direction, the width direction or the lamination direction, but is limited thereto It is not a thing.

Multilayer Ceramic Capacitor FIG. 1 schematically shows a perspective view of a multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 2 schematically shows a cross-sectional view taken along line I-I 'of FIG. FIG. 3 schematically shows an enlarged cross-sectional view of a portion A in FIG. FIG. 4 schematically shows an enlarged cross-sectional view of a portion B in FIG.

  Hereinafter, a multilayer ceramic capacitor 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4.

  Referring to FIG. 1, the multilayer ceramic capacitor 100 according to an embodiment of the present invention includes a body 110 and first and second outer electrodes 130 and 140 disposed outside the body 110.

  The main body 110 is connected to the first and second surfaces 1 and 2 opposite to each other in the thickness direction (Z direction) and the first and second surfaces 1 and 2 opposite to each other in the width direction (Y direction) The third and fourth surfaces 3, 4 and the first and second surfaces 1, 2 connected to the third and fourth surfaces 3, 4 and facing each other in the length direction (X direction) 5 and 6th surfaces 5, 6 can be provided.

  Referring to FIG. 2, the main body 110 includes a dielectric layer 111 and internal electrodes 121 and 122 disposed so as to be alternately exposed from the third and fourth surfaces 3 and 4 with the dielectric layer 111 interposed therebetween. ,including.

  The main body 110 is formed by laminating a plurality of dielectric layers 111 in the thickness direction (Z direction) and firing the same. However, the shape, size, and number of laminated dielectric layers 111 of the main body 110 are not limited. It is not limited to what was illustrated to embodiment.

  The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between the adjacent dielectric layers 111 are integrated to such an extent that they can not be confirmed unless a scanning electron microscope (SEM: Scanning Electron Microscope) is used. Can be

The raw material for forming the dielectric layer 111 is not particularly limited as long as a sufficient capacitance can be obtained. For example, barium titanate (BaTiO ₃ ) powder may be used. As a material for forming the dielectric layer 111, powder such as barium titanate (BaTiO ₃ ), various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. according to the object of the present invention May be added.

  The internal electrodes 121 and 122 may include a first internal electrode 121 exposed from the third surface 3 and a second internal electrode 122 exposed from the fourth surface 4.

  The first and second inner electrodes 121 and 122 are a pair of electrodes having different polarities, and are electrically isolated from each other by the dielectric layer 111 disposed in the middle.

  The first and second internal electrodes 121 and 122 are disposed outside the main body 110 by alternately exposing the third and fourth surfaces 3 and 4 in the longitudinal direction (X direction) of the main body 110. And the second external electrodes 130 and 140, respectively.

  The thickness of the first and second inner electrodes 121, 122 can be determined according to the application.

  For example, the width of the first and second internal electrodes 121 and 122 may be formed to satisfy the range of 0.2 to 1.0 μm in consideration of the size of the main body 110, but is not limited thereto. It is not something to be done.

  The first and second inner electrodes 121 and 122 may be made of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), lead (Pb) or platinum (Pt) alone or in combination. A conductive metal consisting of an alloy can be included.

  Each of the upper and lower portions of the main body 110 may include a cover layer 112 formed by laminating dielectric layers in which the internal electrodes are not formed. The cover layer 112 can play a role in maintaining the reliability of the multilayer ceramic capacitor against external impact.

  The external electrodes 130 and 140 are disposed on one surface of the main body 110 and in contact with the internal electrodes 121 and 122, and are disposed on the first electrode layers 131 and 141 including TiN and the first electrode layers 131 and 141. And two electrode layers 132 and 142.

  The outer electrodes 130 and 140 may include first and second outer electrodes 130 and 140 connected to the first and second inner electrodes 121 and 122, respectively.

  At this time, the first and second external electrodes 130 and 140 are connected to the third and fourth surfaces 3 and 4 of the main body 110, respectively, and the first, second and second main portions of the main body from the connecting portions. And a band portion formed to extend to a part of the sixth surface 1, 2, 5, 6, and a corner portion where the connection portion and the band portion are in contact with each other.

  The structures of the first and second outer electrodes 130 and 140 in the multilayer ceramic capacitor according to an embodiment of the present invention will be described in more detail with reference to FIGS. 3 and 4. Although FIGS. 3 and 4 are enlarged views of the first outer electrode 130, the description thereof can be applied to the second outer electrode 140 as well.

  The first electrode layer 131 contains TiN (titanium nitride). Also, it may be made of only TiN.

  Since TiN is excellent in acid resistance and durability, it has a low possibility of breakage during the process, and has an advantage of being excellent in adhesion to ceramics, metals and the like. Furthermore, since the moisture permeability is low, it plays a role to improve the moisture resistance reliability.

  The first electrode layer 131 may be formed by atomic layer deposition (ALD).

  The ALD method is a technology that deposits a thin film or a protective film on the surface of a substrate in a semiconductor process, and unlike the conventional deposition technology in which a thin film is chemically attached, it is a technology that stacks atomic layers one by one to grow a thin film. Say The ALD method has the advantages of excellent step-coverage, easy control of the thickness of the thin film, and formation of a uniform thin film.

  When TiN is used to form the first electrode layer by the ALD method, the connectivity between the internal electrode and the external electrode can be sufficiently ensured even with a thickness of about 5 nm. This can reduce the thickness of the external electrode and can increase the effective volume ratio.

  The thickness of the first electrode layer 131 may be 10 to 500 nm.

  If the thickness of the first electrode layer 131 is less than 10 nm, a sufficient moisture permeation preventing effect can not be obtained, and if it exceeds 500 nm, the ESR may be increased.

  In Table 1 below, after forming a first electrode layer of TiN using an atomic layer deposition method and forming two electrode layers with a resin-based electrode, measurement of the change in moisture proof reliability due to the maximum thickness of the first electrode layer is measured The result is

  The humidity resistance reliability was tested by applying a 9.5 V voltage for 20 hours under the conditions of 85 ° C. and 85%, and as a result of testing 100 pieces for each sample, the number of parts where reliability failure did not occur was indicated by%.

  As can be seen from Table 1 above, when the thickness of the first electrode layer was 10 nm or more, the humidity resistance reliability was 100%.

  Referring to FIG. 3, when the thickness of the connection portion of the first electrode layer is t1 and the thickness of the corner portion of the first electrode layer is t2, t2 / t1 may be 0.9 or more. In order to form a 1st electrode layer using ALD method, the thickness of a 1st electrode layer can be adjusted uniformly uniformly so that t2 / t1 may be 0.9 or more. Thereby, the first electrode layer can be formed to a sufficient thickness up to the corner portion, and the permeation path of water and plating solution can be blocked.

  When the thickness of the band portion of the first electrode layer is t3, t3 / t1 may be 0.9 to 1.1. That is, the thickness variation of the connection portion and the band portion can also be 10% or less.

  As described above, since it is possible to secure sufficient moisture resistance reliability and electrode connectivity by the first electrode layer, the second electrode layer need not be particularly limited, and as a more preferable example, the second electrode layer is It can have a form as shown in FIGS.

  FIG. 4 schematically shows an enlarged cross-sectional view of a portion B in FIG.

  Referring to FIG. 4, the second electrode layer may be a fired electrode 132 including a conductive metal 132 a and a glass 132 b. The glass 132 b component functions as a binder that aids in the formation of an alloy between the conductive metal 132 a and the first electrode layer 131 and serves to seal.

  In this case, in order to obtain the fired electrode 132, for example, a paste containing the conductive metal 132a and the glass 132b can be applied onto the first electrode layer and then fired to form the fired electrode 132.

  At this time, the conductive metal 132a may be Cu.

  FIG. 5 schematically shows an enlarged cross-sectional view of a portion B of a multilayer ceramic capacitor according to another embodiment of the present invention.

  Referring to FIG. 5, the second electrode layer may be a resin-based electrode 132 ′ including a plurality of metal particles 132a ′ and a base resin 132b ′.

  The resin-based electrode 132 'has a form in which a plurality of metal particles 132a' are dispersed in a base resin 132b '. In this case, in order to obtain a resin-based electrode, for example, a paste in which metal particles are dispersed in a base resin can be used. Since the applied paste is formed through the drying and curing steps, unlike the conventional method in which the external electrode is formed by firing, the metal particles do not melt and exist in the form of particles in the resin-based electrode. Can.

  At this time, the metal particles 132a ′ may be any one or more of Cu, Ni, and Ag.

  The metal particles 132a ′ may be not only spherical but may be in the form of flakes, if necessary, or a mixture of spheres and flakes.

  The base resin 132b 'can include a thermosetting resin.

  At this time, the thermosetting resin may be, for example, an epoxy resin, but the present invention is not limited thereto.

  The base resin 132 b ′ plays a role of mechanically bonding the first electrode layer 131 and the plating layer (not shown).

  FIG. 6 schematically shows an enlarged cross-sectional view of a portion B of a multilayer ceramic capacitor according to still another embodiment of the present invention.

  Referring to FIG. 6, the second electrode layer 132 ′ ′ includes a plurality of metal particles 132a ′ ′, a conductive connection portion 132c ′ ′ surrounding the plurality of metal particles, a base resin 132b ′ ′, and the first electrode layer 132 ′ ′. It may be a resin-based electrode 132 ′ ′ including an intermetallic compound 132d ′ ′ in contact with the electrode layer 131 and the conductive connection portion 132c ′ ′.

  A resin-based electrode 132 ′ ′ containing an intermetallic compound 132d ′ ′ is in a form in which a plurality of metal particles 132a ′ ′ are dispersed in a base resin 132b ′ ′.

  At this time, the metal particles 132a ′ ′ may be any one or more of Cu, Ni, Ag, Cu coated with Ag, and Cu coated with Sn.

  The metal particles 132a ′ ′ may not only be spherical, but may be in the form of flakes if necessary, or may be a mixture of spheres and flakes.

  The base resin 132b ′ ′ can include a thermosetting resin.

  At this time, the thermosetting resin may be, for example, an epoxy resin, but the present invention is not limited thereto.

  The base resin 132 b ′ ′ serves to mechanically bond the first electrode layer 131 and the plating layer (not shown).

  The conductive connection portion 132c ′ ′ serves to surround and connect the plurality of metal particles 132a ′ ′ in a molten state, thereby minimizing internal stress of the main body 110 and improving high temperature load and moisture resistance load characteristics. It can be done.

  At this time, the metal contained in the conductive connection portion 132c ′ ′ may have a melting point lower than the curing temperature of the base resin 132b ′ ′.

  That is, since the conductive connection portion 132c ′ ′ has a melting point lower than the curing temperature of the base resin 132b ′ ′, the conductive connection portion 132c ′ ′ melts in the process of drying and curing, and as shown in FIG. '' Can cover the metal particles 132a '' in the molten state.

  At this time, the metal of the conductive connection portion is preferably made of a low melting point metal of 300 ° C. or less. For example, Sn having a melting point of 213 to 220 ° C. can be included.

  The intermetallic compound 132 d ′ ′ is disposed on the first electrode layer 131 so as to be in contact therewith, and serves to reduce the contact resistance between the resin-based electrode 132 ′ ′ and the first electrode layer 131. In addition, the intermetallic compound 132d ′ ′ is in contact with the conductive connection portion 132c ′ ′ and plays a role of connecting the first electrode layer 131 and the conductive connection portion 132c ′ ′.

  In this case, in order to obtain a resin-based electrode 132 ′ ′, for example, any one or more metal particles of Cu, Ni coated with Ag, Cu coated with Ag, and Cu coated with Sn, and A paste in which a low melting point metal having a melting point lower than the curing temperature of the base resin 132b ′ ′ can be used, and the applied paste is formed through a drying and curing step, so the external electrode is formed by firing Unlike the conventional method which has been formed, the metal particles do not melt and can be present in the form of particles in the resin-based electrode.

  At this time, the low melting point metal may be any one or more of Sn / Bi, Sn-Pb, Sn-Cu, Sn-Ag, and Sn-Ag-Cu.

  The external electrodes 130 and 140 may further include a plating layer (not shown) formed on the second electrode layers 132 and 142.

  Also, the plating layer may have a multilayer structure. For example, the plating layer may be composed of a multilayer structure such as Ni / Sn, Sn / Ni / Sn, and Cu / Ni / Sn.

Method of Manufacturing Multilayer Ceramic Capacitor FIGS. 7 to 10 are perspective views schematically showing steps of a method of manufacturing a multilayer ceramic capacitor according to another embodiment of the present invention.

  A method of manufacturing a multilayer ceramic capacitor according to another embodiment of the present invention comprises the steps of preparing a body including a dielectric layer and an internal electrode, and including TiN (titanium nitride) on the entire surface of the body by atomic layer deposition. Forming a first electrode layer; forming a second electrode layer on a portion of the main body on which the first electrode layer is formed, the first and second external electrodes being formed, and the second electrode Etching away the exposed portion of the first electrode layer in the layer-formed body.

  First, referring to FIG. 7, the step of providing a body including the dielectric layer 211 and the internal electrodes 221 and 222 may be performed.

A slurry formed from a powder such as barium titanate (BaTiO ₃ ) is applied onto a carrier film and dried to provide a plurality of ceramic sheets.

The ceramic sheet is prepared by mixing a ceramic powder such as barium titanate (BaTiO ₃ ), a binder, a solvent and the like to produce a slurry, which is formed into a sheet having a thickness of several μm by a doctor blade method. It can be made.

  Next, a conductive paste containing a conductive metal can be provided. The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), lead (Pb) or platinum (Pt) alone or as an alloy, and the average particle size is It may be 0.1 to 0.2 μm, and a conductive paste for an internal electrode containing 40 to 50% by weight of a conductive metal may be provided.

  The conductive paste for internal electrode may be applied onto the ceramic sheet by a printing method or the like to form an internal electrode pattern. Although the printing method of the said electroconductive paste can use the screen-printing method, a gravure printing method, etc., this invention is not limited to this.

  The ceramic sheet on which the internal electrode pattern is printed is laminated, and the ceramic sheet on which the internal electrode pattern is not printed is laminated on the upper and lower parts thereof to form a laminate including the internal electrodes 221 and 222 inside it can. At this time, the number of laminated ceramic sheets on which the internal electrode pattern is printed can be adjusted according to the capacity of the laminated ceramic capacitor. The ceramic sheet on which the internal electrode pattern is not printed becomes the cover portions 212 disposed at the upper and lower portions of the main body 210.

  Thereafter, the laminated body may be pressed and fired to form the main body 210.

  Referring to FIG. 8, after forming the main body 210, a step of forming a first electrode layer 250 including TiN on the entire surface of the main body 210 by an ALD method is performed.

  Next, referring to FIG. 9, in the main body where the first electrode layer 250 is formed, the second electrode layers 232 and 242 are formed on the upper portion of the portion where the first and second external electrodes are to be formed. .

  For example, a paste containing a conductive metal and glass can be applied and fired to form a second electrode layer.

  Moreover, after apply | coating the paste in which the metal particle was disperse | distributed to base resin, a 2nd electrode layer can be formed by drying and hardening.

  Furthermore, the second electrode layer can be formed by applying a paste in which a low melting metal having a melting point lower than the curing temperature of the metal particles and the base resin is applied to the base resin, followed by drying and curing.

  Next, referring to FIG. 10, in the main body in which the second electrode layers 232 and 242 are formed, the exposed portion of the first electrode layer 250 is etched away to remove the first electrode layer 231, The multilayer ceramic capacitor can be completed by forming the first and second outer electrodes 230 and 240 including the 232 and the second electrode layers 232 and 242.

  Here, since the second electrode layers 232 and 242 function as protective layers (Passivation), there is no need to separately provide a protective layer, and the exposed portion of the first electrode layer 250 can be etched away. .

  Also, the etching may be dry etching or wet etching.

  In addition, if necessary, a step of forming a plating layer on the first and second external electrodes 230 and 240 may be performed, but is not limited thereto.

  Although the embodiments of the present invention have been described in detail, the scope of the present invention is not limited thereto, and various modifications and changes may be made without departing from the technical concept of the present invention described in the claims. It will be apparent to those skilled in the art that this is possible.

Reference Signs List 100 laminated ceramic capacitor 110 main body 111 dielectric layer 112 cover layer 121, 122 internal electrode 130, 140 external electrode 131 first electrode layer 132 second electrode layer

Claims (15)

A body including a dielectric layer and an inner electrode, and an outer electrode disposed on one side of the body;
The external electrode is
A multilayer ceramic capacitor comprising: a first electrode layer disposed on one surface of the body and in contact with the internal electrode and containing titanium nitride (TiN); and a second electrode layer disposed on the first electrode layer.   The multilayer ceramic capacitor of claim 1, wherein a thickness of the first electrode layer is 10 to 500 nm. The main body is connected to the first and second surfaces facing each other, the third and fourth surfaces facing each other connected to the first and second surfaces, and the first and second surfaces, and Connected to the third and fourth surfaces and including fifth and sixth surfaces facing each other;
The internal electrode includes first and second internal electrodes disposed such that one end is alternately exposed from the third and fourth surfaces with the dielectric layer interposed therebetween,
The multilayer ceramic capacitor of claim 1, wherein the external electrode comprises first and second external electrodes disposed on the third and fourth surfaces of the main body and connected to the first and second internal electrodes, respectively. . The first and second external electrodes are connected to the connection portions respectively formed on the third and fourth surfaces of the main body, and one of the first, second, fifth and sixth surfaces of the main body from the connection portion. A band portion formed to extend to the portion, and a corner portion contacting the connection portion and the band portion,
The laminated ceramic according to claim 3, wherein t2 / t1 is 0.9 or more, where t1 is a thickness of the connection portion of the first electrode layer and t2 is a thickness of a corner portion of the first electrode layer. Capacitor.   The multilayer ceramic capacitor according to claim 1, wherein the second electrode layer is a fired electrode containing a conductive metal and glass.   The multilayer ceramic capacitor according to claim 5, wherein the conductive metal is Cu.   The multilayer ceramic capacitor according to claim 1, wherein the second electrode layer is a resin-based electrode including a plurality of metal particles and a base resin.   The multilayer ceramic capacitor according to claim 7, wherein the metal particles are any one or more of Cu, Ni, and Ag.   The second electrode layer includes a plurality of metal particles, a conductive connection portion surrounding the plurality of metal particles, a base resin, and an metal formed at an interface where the first electrode layer and the conductive connection portion are in contact with each other. A multilayer ceramic capacitor according to claim 1, comprising: a compound.   The multilayer ceramic capacitor according to claim 9, wherein the metal particles are any one or more of Cu, Ni, Ag, Cu coated with Ag, and Cu coated with Sn.   The multilayer ceramic capacitor of claim 1, wherein the outer electrode further comprises a plating layer formed on the second electrode layer. Providing a body comprising a dielectric layer and an inner electrode;
Forming a first electrode layer including titanium nitride (TiN) on the entire surface of the main body by an atomic layer deposition method;
Forming a second electrode layer on a portion of the main body on which the first electrode layer is formed, the first and second external electrodes being formed;
And removing the exposed portion of the first electrode layer from the main body on which the second electrode layer is formed.   The method of manufacturing a multilayer capacitor according to claim 12, wherein the second electrode layer is formed by applying and baking a paste containing a conductive metal and glass.   The method of manufacturing a multilayer capacitor according to claim 12, wherein the second electrode layer is formed by applying a paste in which metal particles are dispersed to a base resin, and then drying and curing the paste.   The second electrode layer may be formed by applying a paste in which a low melting metal having a melting point lower than the curing temperature of the metal particles and the base resin is applied to the base resin, followed by drying and curing. The manufacturing method of the multilayer capacitor as described in-.