JP2019096770A - Circuit structure - Google Patents

Circuit structure Download PDF

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Publication number
JP2019096770A
JP2019096770A JP2017225754A JP2017225754A JP2019096770A JP 2019096770 A JP2019096770 A JP 2019096770A JP 2017225754 A JP2017225754 A JP 2017225754A JP 2017225754 A JP2017225754 A JP 2017225754A JP 2019096770 A JP2019096770 A JP 2019096770A
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Japan
Prior art keywords
circuit
heat
leg
circuit structure
legs
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佑一 服部
Yuichi Hattori
佑一 服部
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Priority to JP2017225754A priority Critical patent/JP2019096770A/en
Priority to PCT/JP2018/041199 priority patent/WO2019102847A1/en
Publication of JP2019096770A publication Critical patent/JP2019096770A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02Details
    • H02G3/08Distribution boxes; Connection or junction boxes
    • H02G3/16Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

To provide a circuit structure capable of performing heat dissipation without increasing a fin volume.SOLUTION: A circuit structure 1 includes a circuit unit 10 supported by a support member 20. The support member 20 includes: a heat radiating unit 22 projecting outward from an opposite surface to a support surface that supports the circuit unit 10; and a leg 23 which is formed to extend more than a height of a protrusion of the heat radiating unit 22. Thus, heat can be dissipated without increasing a fin volume.SELECTED DRAWING: Figure 1

Description

本発明は、回路構成体に関する。   The present invention relates to a circuit assembly.

比較的小さな電流を導通させる回路を構成する導電パターンが形成された基板に対し、比較的大きな電流を導通させるための回路を構成する導電部材(バスバー等とも称される)が固定された回路構成体が一般的に知られている(例えば、特許文献1を参照)。このような回路構成体では、例えば、バスバーで均熱した後にヒートシンクを介して外部への放熱を行っている。   A circuit configuration in which a conductive member (also referred to as a bus bar or the like) constituting a circuit for conducting a relatively large current is fixed to a substrate on which a conductive pattern constituting the circuit for conducting a relatively small current is formed. The body is generally known (see, for example, Patent Document 1). In such a circuit structure, for example, heat is dissipated to the outside through a heat sink after the soaking with a bus bar.

特開2003−164039号公報JP 2003-164039 A

しかしながら、回路構成体のヒートシンク側に取付部位を設ける必要がある場合、空気の逃げ道を確保することが困難となるため、放熱のためにフィン体積を増やす必要があり、その結果、コスト及び重量が増大するという問題点を有している。   However, when it is necessary to provide an attachment site on the heat sink side of the circuit assembly, it is difficult to secure an escape path for air, so it is necessary to increase the fin volume for heat radiation, resulting in cost and weight It has the problem of increasing.

本発明の目的は、フィン体積を増加させることなく、放熱を実施できる回路構成体を提供することにある。   An object of the present invention is to provide a circuit structure capable of performing heat dissipation without increasing the fin volume.

本発明の一態様に係る回路構成体は、支持部材により支持された回路部を有する回路構成体であって、前記支持部材は、前記回路部を支持する支持面の反対面から外向きに突出する放熱部と、該放熱部の突出高さよりも延伸して形成される脚部とを備える。   The circuit structure according to an aspect of the present invention is a circuit structure having a circuit portion supported by a support member, and the support member protrudes outward from the opposite surface of the support surface that supports the circuit portion. And a leg portion which is formed to extend more than the projecting height of the heat radiating portion.

上記によれば、フィン体積を増加させることなく、放熱を実施することができる。   According to the above, heat dissipation can be implemented without increasing the fin volume.

実施の形態1に係る回路構成体の正面図である。FIG. 1 is a front view of a circuit assembly according to Embodiment 1; 回路構成体の平面図である。It is a top view of a circuit structure. 回路構成体の下面図である。It is a bottom view of a circuit composition. 回路構成体の斜視図である。It is a perspective view of a circuit structure. 脚部と放熱フィンとを連結する連結部の部分拡大図である。It is the elements on larger scale of the connection part which connects a leg part and a radiation fin. 回路構成体の取付状態を説明する模式的説明図である。It is a schematic explanatory drawing explaining the attachment state of a circuit structure. 放熱部における空気の流れを説明する模式的説明図である。It is a schematic explanatory drawing explaining the flow of the air in a thermal radiation part. 比較例における空気の流れを説明する説明図である。It is an explanatory view explaining a flow of air in a comparative example. 実施の形態2に係る回路構成体の下面図である。FIG. 7 is a bottom view of a circuit assembly according to Embodiment 2;

本発明の実施態様を列記して説明する。また、以下に記載する実施形態の少なくとも一部を任意に組み合わせても良い。   Embodiments of the present invention will be listed and described. In addition, at least a part of the embodiments described below may be arbitrarily combined.

本発明の一態様に係る回路構成体は、支持部材により支持された回路部を備える回路構成体であって、前記支持部材は、前記回路部を支持する支持面の反対面から外向きに突出する放熱部と、該放熱部の突出高さよりも延伸して形成される脚部とを備える。   The circuit assembly according to one aspect of the present invention is a circuit assembly including a circuit unit supported by a support member, and the support member protrudes outward from the opposite surface of the support surface that supports the circuit unit. And a leg portion which is formed to extend more than the projecting height of the heat radiating portion.

本態様にあっては、脚部は放熱部の突出高さよりも延伸して形成されているので、脚部を介して回路構成体を被取付部位に取り付けた場合、放熱部の下端面と被取付部位との間には隙間が生じる。すなわち、放熱部と被取付部位との間に空間が形成されるので、放熱部によって空気の流れが遮断されることはなく、放熱性能の低下を回避することができる。   In this aspect, since the leg portion is formed to extend more than the protruding height of the heat radiating portion, the lower end surface of the heat radiating portion and the portion to be mounted when the circuit structure is attached to the mounting site via the leg portion. A gap is created between the mounting site. That is, since a space is formed between the heat radiating portion and the mounting portion, the flow of air is not blocked by the heat radiating portion, and a decrease in the heat radiating performance can be avoided.

本発明の一態様に係る回路構成体は、前記放熱部は、前記反対面の面内における第1方向に沿って延び、該第1方向と交差する第2方向に間隔を隔てて並設される複数の放熱フィンを備え、前記脚部は、前記放熱部から前記第1方向に離隔して設けられ、前記脚部と前記放熱フィンの1つとを連結部により連結してある。   In the circuit structure according to one aspect of the present invention, the heat dissipation portions extend in a first direction in the surface of the opposite surface, and are juxtaposed at intervals in a second direction intersecting the first direction. A plurality of heat radiation fins, wherein the leg portion is provided apart from the heat radiation portion in the first direction, and the leg portion and one of the heat radiation fins are connected by a connection portion.

本態様にあっては、脚部と放熱部が備える放熱フィンの1つとを連結部を介して連結しているので、各脚部の強度を高めることができる。この結果、車両等の被取付部位に回路構成体を取り付けた場合であっても、車両振動に伴う脚部の破損等を回避することができる。   In this aspect, since the leg portion and one of the heat dissipating fins provided in the heat dissipating portion are connected via the connecting portion, the strength of each leg portion can be increased. As a result, even when the circuit assembly is attached to a mounting site such as a vehicle, it is possible to avoid damage or the like of the leg portion caused by the vehicle vibration.

本発明の一態様に係る回路構成体は、前記脚部は、被取付部位に取り付けられる取付板と、該取付板に立設されており、前記第2方向に離隔配置される2つの側板とを備え、前記連結部は、前記脚部に連結される放熱フィンに対して斜めに連なり、前記2つの側板に各別に連結される2つの連結板を備える。   In the circuit assembly according to one aspect of the present invention, the leg portion is a mounting plate attached to the mounting site, and two side plates which are provided upright on the mounting plate and are spaced apart in the second direction. And the connection part includes two connection plates which are obliquely connected to the heat dissipating fins connected to the leg parts and separately connected to the two side plates.

本態様にあっては、隣り合う2つの放熱フィン間に形成される空間が概ね鉛直方向に延びるように回路構成体を被取付部位に取り付けた場合、放熱フィンからの放熱によって暖められた空気は、放熱フィンの間の空間を通って鉛直上方へ流れる。また、放熱フィンの間を通って鉛直上方に流れた空気は、連結板の斜面によって回路構成体の外部へ導かれる。よって、本態様にあっては、回路部にて発生した熱を放熱フィン間の空間を通じて効率良く外部へ逃がすことができ、良好な放熱性能を確保することができる。   In this aspect, when the circuit assembly is attached to the mounting site so that the space formed between the two adjacent heat radiation fins extends in the substantially vertical direction, the air warmed by the heat radiation from the heat radiation fins is , Vertically upward through the space between the heat dissipating fins. In addition, the air that has flowed vertically upward between the heat radiation fins is led to the outside of the circuit component by the slopes of the connection plate. Therefore, in this aspect, the heat generated in the circuit portion can be efficiently dissipated to the outside through the space between the heat dissipating fins, and good heat dissipating performance can be secured.

本発明の一態様に係る回路構成体は、前記脚部を2つ備え、前記2つの脚部の一方を、前記第1方向の一端側にて一の放熱フィンに連結してあり、他方を、前記第1方向の他端側にて他の放熱フィンに連結してある。   The circuit structure according to an aspect of the present invention includes two of the legs, one of the two legs being connected to one heat radiation fin at one end side in the first direction, and the other is The other heat radiation fin is connected to the other heat radiation fin at the other end side in the first direction.

本態様にあっては、基部の左右方向及び前後方向に間隔を隔てて設けられる2つの脚部を利用して被取付部位に取り付けられるので、回路構成体を軽量化しつつ、取付強度を確保することができる。   In this aspect, because the mounting portion is attached using the two legs provided at intervals in the left and right direction and the front and rear direction of the base, the weight of the circuit structure can be reduced while securing the mounting strength. be able to.

本発明の一態様に係る回路構成体は、前記第1方向の他端側にて前記一の放熱フィンに連結してある脚部を更に備える。   The circuit assembly according to an aspect of the present invention further includes a leg connected to the one radiation fin at the other end side in the first direction.

本態様にあっては、基部の左右方向及び前後方向に間隔を隔てて設けられる3つの脚部を利用して被取付部位に取り付けられるので、取付強度を確保することができる。   In this aspect, since attachment is performed to the attachment site using three legs provided at intervals in the left-right direction and the front-rear direction of the base, attachment strength can be secured.

以下、本発明をその実施の形態を示す図面に基づいて具体的に説明する。
(実施の形態1)
図1は実施の形態1に係る回路構成体1の正面図、図2はその平面図、図3はその下面図、図4はその斜視図である。回路構成体1は、車両が備えるバッテリなどの電源と、ランプ、ワイパ等の車載電装品又はモータなどからなる負荷との間の電力供給経路に配される電気接続箱を構成する。回路構成体1は、例えばDC−DCコンバータやインバータなどの電気部品として用いられる。
Hereinafter, the present invention will be specifically described based on the drawings showing the embodiments thereof.
Embodiment 1
1 is a front view of a circuit assembly 1 according to the first embodiment, FIG. 2 is a plan view thereof, FIG. 3 is a bottom view thereof, and FIG. 4 is a perspective view thereof. The circuit assembly 1 constitutes an electric connection box disposed in a power supply path between a power source such as a battery provided in a vehicle and a load including an on-vehicle electrical component such as a lamp or a wiper or a motor. The circuit structure 1 is used as an electrical component such as a DC-DC converter or an inverter.

回路構成体1を車両などの被取付部位C(図6を参照)に取り付けた場合の姿勢については後述することとするが、実施の形態1では、便宜的に、図1〜図4に示す前後、左右、上下の各方向により、回路構成体1の「前」、「後」、「左」、「右」、「上」、「下」を定義する。以下では、図1〜図4により定義される前後、左右、上下の各方向を用いて、回路構成体1の構成について説明する。   The posture in the case where the circuit assembly 1 is attached to the attachment site C (see FIG. 6) such as a vehicle will be described later, but in the first embodiment, it is illustrated for convenience in FIGS. The “front”, “rear”, “left”, “right”, “upper”, and “lower” of the circuit assembly 1 are defined according to the front, rear, left, right, upper and lower directions. Below, the structure of the circuit structure 1 is demonstrated using each direction of front and rear, right and left, and the upper and lower sides defined by FIGS. 1-4.

回路構成体1は、回路部10と、回路部10を支持する支持部材20とを備える。回路部10は、回路パターンを有する回路基板、電力回路を構成するバスバー、回路基板及びバスバーに実装される電子部品等(不図示)を備える。電子部品は、回路構成体1の用途に応じて適宜実装され、FET(Field Effect Transistor)などのスイッチング素子、抵抗、コイル、コンデンサ等を含む。   The circuit assembly 1 includes a circuit unit 10 and a support member 20 for supporting the circuit unit 10. The circuit unit 10 includes a circuit board having a circuit pattern, a bus bar configuring the power circuit, an electronic component (not shown) mounted on the circuit board, and the bus bar. The electronic component is appropriately mounted in accordance with the application of the circuit assembly 1 and includes a switching element such as a field effect transistor (FET), a resistor, a coil, a capacitor, and the like.

支持部材20は、上面に回路部10を支持する支持面211を有する基部21と、支持面211とは反対側の面(下面212)に設けられた放熱部22と、放熱部22を挟んで基部21の左右両端に設けられた脚部23A〜23Cとを備える。支持部材20が備える基部21、放熱部22、及び脚部23A〜23Cは、例えば、アルミニウム、アルミニウム合金等の金属材料を用いたダイキャストにより一体的に成形される。   The support member 20 has a base 21 having a support surface 211 for supporting the circuit unit 10 on the upper surface, a heat release unit 22 provided on the surface (lower surface 212) opposite to the support surface 211, and the heat release unit 22. It has legs 23A-23C provided on the left and right ends of the base 21. The base 21, the heat radiating portion 22, and the legs 23 </ b> A to 23 </ b> C included in the support member 20 are integrally formed by die casting using a metal material such as aluminum or aluminum alloy, for example.

基部21は、適宜の厚みを有する矩形状の平板部材である。基部21は、例えば、左右方向に120mm程度、前後方向に80mm程度の寸法を有する。基部21の支持面211には、接着、ネジ止め、ハンダ付け等の公知の方法にて、回路構成体1が固定される。   The base 21 is a rectangular flat plate member having an appropriate thickness. The base 21 has, for example, dimensions of about 120 mm in the left-right direction and about 80 mm in the front-rear direction. The circuit structure 1 is fixed to the support surface 211 of the base 21 by a known method such as bonding, screwing, or soldering.

放熱部22は、基部21の下面212から下方に向けて突出した複数の放熱フィン221a〜221gを備え、回路部10から発せられる熱を外部へ放熱する。放熱フィン221a〜221gは、左右方向に延びると共に、前後方向に間隔を隔てて複数並設されている。各放熱フィン221a〜221gは、左右方向の寸法が90〜100mm程度、上下方向の寸法(突出高さ)が20mm程度、厚みが3mm程度の矩形板状の部材である。放熱フィン221a〜221gの厚み方向(前後方向)の断面形状は、例えば、下端部が先細り形状に形成された上下方向に細長い山形をなす。   The heat radiating portion 22 includes a plurality of heat radiating fins 221 a to 221 g protruding downward from the lower surface 212 of the base 21, and radiates the heat generated from the circuit unit 10 to the outside. The radiation fins 221a to 221g extend in the left-right direction, and are arranged in parallel at intervals in the front-rear direction. Each of the heat radiation fins 221a to 221g is a rectangular plate-like member having a size of about 90 to 100 mm in the left-right direction, a size (projecting height) of about 20 mm in the up-down direction, and a thickness of about 3 mm. The cross-sectional shape in the thickness direction (front-rear direction) of the heat radiation fins 221a to 221g has, for example, an elongated mountain shape which is elongated in the vertical direction in which the lower end portion is formed in a tapered shape.

脚部23A〜23Cは、基部21の左右両端に設けられている。本実施の形態では、基部21の右側に2つの脚部23A,23Bを備え、左側に1つの脚部23Cを備える。脚部23A〜23Cは、基部21の下面212と略平行に配され、車両などの被取付部位Cに取り付けられる取付板231と、取付板231から立ち上がり、基部21の下面212に連なる前後一対の側板232a,232bとを備える。また、脚部23A〜23Cには、側板232a,232bと交差するように配され、取付板231及び側板232a,232bの双方に連なる補強板233を備える。
なお、以下の説明において、左右両端の脚部23A〜23Cを区別して説明する必要がない場合には、単に脚部23とも記載する。
The legs 23A to 23C are provided at the left and right ends of the base 21. In the present embodiment, two legs 23A and 23B are provided on the right side of the base 21 and one leg 23C is provided on the left side. The leg portions 23A to 23C are disposed substantially in parallel with the lower surface 212 of the base 21 and attached to the attachment portion C of the vehicle or the like, and a pair of front and rear ends rising from the attachment plate 231 and continuing to the lower surface 212 of the base 21 Side plates 232a and 232b are provided. Further, the leg portions 23A to 23C are provided with a reinforcing plate 233 which is disposed to intersect the side plates 232a and 232b and which is continuous with both the mounting plate 231 and the side plates 232a and 232b.
In the following description, the legs 23A to 23C at the left and right ends are also simply described as the legs 23 when it is not necessary to distinguish them.

各脚部23は、放熱部22の突出高さよりも延伸して形成されている。すなわち、基部21の下面212から各脚部23の取付板231の下面までの離隔距離は、基部21の下面212から放熱フィン221a〜221gの下端面までの離隔距離(すなわち放熱フィン221a〜221gの突出高さ)よりも少しだけ長くなるように、各脚部23及び放熱フィン221a〜221gの高さ寸法が設計されている。   Each leg portion 23 is formed to extend more than the protruding height of the heat dissipation portion 22. That is, the separation distance from the lower surface 212 of the base 21 to the lower surface of the mounting plate 231 of each leg 23 is the separation distance from the lower surface 212 of the base 21 to the lower end surfaces of the radiation fins 221a to 221g (ie, the radiation fins 221a to 221g). The height dimensions of each leg 23 and the radiation fins 221a to 221g are designed to be slightly longer than the protruding height).

各脚部23の取付板231にはボルト挿通孔234が設けられている。ボルト挿通孔234は、取付板231を厚み方向に貫通する貫通孔であり、挿通させるボルトよりも少しだけ大きな直径を有する。脚部23は、ボルト挿通孔234に挿通させたボルトを利用して車両などの被取付部位Cに取り付けられるように構成されている。   The mounting plate 231 of each leg 23 is provided with a bolt insertion hole 234. The bolt insertion hole 234 is a through hole that penetrates the mounting plate 231 in the thickness direction, and has a diameter slightly larger than a bolt to be inserted. The leg portion 23 is configured to be attached to a mounting site C of a vehicle or the like using a bolt inserted into the bolt insertion hole 234.

各脚部23は、放熱部22が備える放熱フィン221a〜221gの1つに連結される。図3に示す例では、右側の一方の脚部23(23A)は、放熱部22が備える複数の放熱フィン221a〜221gのうち、前側から2枚目の放熱フィン221bの右端に連結されており、右側の他方の脚部23(23B)は、後側から2枚目の放熱フィン221fの右端に連結されている。また、左側の脚部23(23C)は、放熱部22が備える複数の放熱フィン221a〜221gのうち、後側から2枚目の放熱フィン221f(すなわち、右側の他方の脚部23が連結されている放熱フィン221f)の左端に連結されている。   Each leg 23 is connected to one of the heat radiation fins 221 a to 221 g provided in the heat radiation unit 22. In the example shown in FIG. 3, one leg 23 (23A) on the right side is connected to the right end of the second heat radiation fin 221b from the front side among the plurality of heat radiation fins 221a to 221g provided in the heat radiation unit 22. The other right leg 23 (23B) is connected to the right end of the second radiation fin 221f from the rear side. In the left leg 23 (23C), the second heat radiation fin 221f from the rear side (that is, the other leg 23 on the right side) of the plurality of heat radiation fins 221a to 221g included in the heat radiation unit 22 is connected It is connected with the left end of the radiation fin 221f).

このように、各脚部23と放熱フィン221b(又は221f)とを連結部24を介して連結することにより、各脚部23の強度を高めることができるので、車両等の被取付部位Cに回路構成体1を取り付けた場合であっても、車両振動に伴う脚部23の破損等を回避することができる。   As described above, by connecting each leg portion 23 and the heat radiation fin 221 b (or 221 f) through the connection portion 24, the strength of each leg portion 23 can be enhanced. Even when the circuit assembly 1 is attached, breakage or the like of the leg 23 caused by vehicle vibration can be avoided.

図5は脚部23と放熱フィン221bとを連結する連結部24の部分拡大図である。連結部24は、放熱フィン221bが延びる方向(左右方向)の端部から分岐して、それぞれ脚部23が備える2つの側板232a,232bに連結される2つの連結板241a,241bを備える。これらの連結板241a,241bは、放熱フィン221bが延びる方向に対して斜め方向に配されている。放熱フィン221bを延長した延長線Lと一方の連結板241aが配されている方向との間のなす角度θ1は90度未満の角度である。また、放熱フィン221bを延長した延長線Lと他方の連結板241bが配されている方向との間のなす角度θ2もまた90度未満の角度である。ここで、角度θ1,θ2は、同じ大きさの角度であってもよく、異なる大きさの角度であってもよい。   FIG. 5 is a partially enlarged view of the connecting portion 24 connecting the leg portion 23 and the radiation fin 221b. The connection portion 24 includes two connection plates 241 a and 241 b that are branched from the end in the extending direction (left and right direction) of the heat radiation fin 221 b and are connected to two side plates 232 a and 232 b included in the leg portion 23. The connection plates 241a and 241b are disposed in an oblique direction with respect to the direction in which the heat dissipating fins 221b extend. An angle θ1 between the extension line L extending the radiation fin 221b and the direction in which the one connection plate 241a is disposed is an angle less than 90 degrees. In addition, an angle θ2 between the extension line L extending the radiation fin 221b and the direction in which the other connection plate 241b is disposed is also an angle less than 90 degrees. Here, the angles θ1 and θ2 may be angles of the same size, or may be angles of different sizes.

以下、本実施の形態に係る回路構成体1の作用について説明する。
図6は回路構成体1の取付状態を説明する模式的説明図である。回路構成体1は、放熱フィン221a〜221gの延びる方向が概ね鉛直方向となるように被取付部位Cに取り付けられる。すなわち、回路構成体1は、隣り合う2つの放熱フィン間に形成される空間が概ね鉛直方向に延びるように取り付けられる。このように回路構成体1を取り付けた場合、回路部10から発せられた熱は放熱フィン221a〜221gによって放熱され、放熱フィン221a〜221gからの放熱によって暖められた空気は、放熱フィン221a〜221gの間の空間を通って鉛直上方へ流れる。また、放熱フィン221a〜221gの間を通って鉛直上方に流れた空気は、連結板241a,241bの斜面によって回路構成体1の外部へ導かれる。よって、本実施の形態に係る回路構成体1では、回路部10にて発生した熱を放熱フィン221a〜221gの間の空間を通じて効率良く外部へ逃がすことができ、良好な放熱性能を確保することができる。
Hereinafter, the operation of the circuit assembly 1 according to the present embodiment will be described.
FIG. 6 is a schematic explanatory view for explaining the mounting state of the circuit structure 1. The circuit configuration body 1 is attached to the mounting site C such that the extending direction of the radiation fins 221a to 221g is substantially vertical. That is, the circuit assembly 1 is attached such that the space formed between the two adjacent heat radiation fins extends in the substantially vertical direction. Thus, when the circuit assembly 1 is attached, the heat generated from the circuit unit 10 is dissipated by the radiation fins 221a to 221g, and the air warmed by the radiation from the radiation fins 221a to 221g is the radiation fins 221a to 221g. Flow vertically upward through the space between Moreover, the air which flowed vertically upwards between radiation fin 221a-221g is guide | induced to the exterior of the circuit structure 1 by the slope of connection board 241a, 241b. Therefore, in the circuit configuration body 1 according to the present embodiment, the heat generated in the circuit unit 10 can be efficiently dissipated to the outside through the space between the heat radiation fins 221a to 221g, and good heat radiation performance is ensured. Can.

また、本実施の形態では、各脚部23は、放熱部22の突出高さよりも延伸して形成されているので、脚部23を介して回路構成体1を被取付部位Cに取り付けた場合、放熱フィン221a〜221gの下端面と被取付部位Cとの間には隙間が生じる。すなわち、放熱フィン221a〜221gと被取付部位Cとの間に空間が形成されるので、放熱フィン221a〜221gによって空気の流れが遮断されることはなく、放熱性能の低下を回避することができる。   Further, in the present embodiment, each leg 23 is formed to extend more than the protruding height of the heat dissipation portion 22, so when the circuit structure 1 is attached to the mounting site C via the leg 23 A clearance is generated between the lower end surfaces of the heat radiation fins 221 a to 221 g and the attachment site C. That is, since a space is formed between the radiation fins 221a to 221g and the mounting site C, the flow of air is not blocked by the radiation fins 221a to 221g, and a decrease in the radiation performance can be avoided. .

図7は放熱部22における空気の流れを説明する模式的説明図であり、図8は比較例における空気の流れを説明する説明図である。図8に示す比較例は、放熱フィン321と脚部33との連結部34が放熱フィン321の延びる方向に対して直交する直交部341を有する構成としたものである。この場合、放熱フィン321からの放熱によって暖められた空気は、放熱フィン321の間の空間を通って鉛直上方へ流れるものの、その空気の流れは直交部341によって遮断されるので、暖められた空気は直交部付近で滞留することになり、放熱効果は低下する。   FIG. 7 is a schematic explanatory view for explaining the flow of air in the heat radiating portion 22, and FIG. 8 is an explanatory view for explaining the flow of air in the comparative example. In the comparative example shown in FIG. 8, the connecting portion 34 between the heat dissipating fin 321 and the leg portion 33 has an orthogonal portion 341 orthogonal to the extending direction of the heat dissipating fin 321. In this case, although the air warmed by the heat radiation from the radiation fin 321 flows vertically upward through the space between the radiation fins 321, the flow of the air is blocked by the orthogonal portion 341, so the warmed air Will stay near the orthogonal part, and the heat radiation effect will be reduced.

これに対し、本実施の形態に係る回路構成体1では、上述したように、放熱フィン221a〜221gからの放熱によって暖められた空気は、放熱フィン221a〜221gの間の空間を通って鉛直上方へ流れると共に、連結板241a,241bの斜面によって回路構成体1の外部へ導かれる。よって、鉛直上方への空気の流れは連結部24の連結板241a,241bによって遮断されることはなく、暖められた空気が連結部24付近で滞留することはないので、効率良く熱を逃がすことができる。   On the other hand, in the circuit structure 1 according to the present embodiment, as described above, the air warmed by the heat radiation from the radiation fins 221a to 221g passes vertically through the space between the radiation fins 221a to 221g. And flows to the outside of the circuit component 1 by the slopes of the connection plates 241a and 241b. Therefore, the flow of air vertically upward is not blocked by the connecting plates 241 a and 241 b of the connecting portion 24, and the warmed air does not stay near the connecting portion 24, so heat is efficiently dissipated. Can.

以上のように、本実施の形態では、連結部24を介して脚部23を放熱フィン221b(221f)に連結しているので、脚部23の強度を高めることができる。また、本実施の形態では、支持部材20の脚部23を放熱フィン221a〜221gの突出高さよりも延伸して形成してあり、脚部23と放熱フィン221b(221f)とを連結する連結部24の連結板241a,241bを放熱フィン221b(221f)が延びる方向に対して斜め方向に配している。よって、放熱フィン221a〜221gの延びる方向が概ね鉛直方向となるように回路構成体1を被取付部位Cに取り付けた場合、空気の流れは放熱フィン221a〜221g又は連結部24によって遮られることはなく、放熱フィン221a〜221gからの放熱によって暖められた空気を回路構成体1の外部へ効率良く逃がすことが可能となる。   As described above, in the present embodiment, since the leg portion 23 is connected to the radiation fin 221 b (221 f) via the connection portion 24, the strength of the leg portion 23 can be increased. Further, in the present embodiment, the leg portion 23 of the support member 20 is formed to extend beyond the protruding height of the heat radiation fins 221a to 221g, and a connecting portion for connecting the leg portion 23 and the heat radiation fins 221b (221f) The 24 connection plates 241a and 241b are arranged in a direction oblique to the direction in which the heat radiation fins 221b (221f) extend. Therefore, when the circuit assembly 1 is attached to the mounting site C so that the extending direction of the radiation fins 221a to 221g is substantially vertical, the flow of air may not be blocked by the radiation fins 221a to 221g or the connecting portion 24. Instead, the air warmed by the heat radiation from the heat radiation fins 221a to 221g can be efficiently released to the outside of the circuit configuration body 1.

(実施の形態2)
実施の形態1では、基部21の右端に2つの脚部23A,23B、基部21の左端に1つの脚部23Cを備える構成としたが、基部21の左右両端に1つずつ脚部23を備える構成としてもよい。
実施の形態2では、基部21の左右両端に1つずつ脚部23を備える構成について説明する。
Second Embodiment
In the first embodiment, two legs 23A and 23B are provided at the right end of the base 21 and one leg 23C is provided at the left end of the base 21, but one leg 23 is provided at each of the left and right ends of the base 21. It is good also as composition.
In the second embodiment, a configuration in which one leg 23 is provided on each of the left and right ends of the base 21 will be described.

図9は実施の形態2に係る回路構成体1の下面図である。実施の形態2に係る回路構成体1は、回路部10(図1等を参照)と、回路部10を支持する支持部材20とを備える。回路部10の構成は、実施の形態1と同様であり、回路パターンを有する回路基板、電力回路を構成するバスバー、回路基板及びバスバーに実装される電子部品等(不図示)を備える。   FIG. 9 is a bottom view of the circuit structure 1 according to the second embodiment. The circuit assembly 1 according to the second embodiment includes a circuit unit 10 (see FIG. 1 and the like) and a support member 20 for supporting the circuit unit 10. The configuration of the circuit unit 10 is the same as that of the first embodiment, and includes a circuit board having a circuit pattern, a bus bar configuring a power circuit, an electronic component (not shown) mounted on the circuit board and the bus bar.

支持部材20は、上面に回路部10を支持する支持面211を有する基部21と、支持面211とは反対側の面(下面212)に設けられた放熱部22と、放熱部22を挟んで基部21の左右両端に設けられた脚部23A,23Cとを備える。支持部材20が備える基部21、放熱部22、及び脚部23A,23Cは、例えば、アルミニウム、アルミニウム合金等の金属材料を用いたダイキャストにより一体的に成形される。   The support member 20 has a base 21 having a support surface 211 for supporting the circuit unit 10 on the upper surface, a heat release unit 22 provided on the surface (lower surface 212) opposite to the support surface 211, and the heat release unit 22. It has legs 23A and 23C provided on the left and right ends of the base 21. The base 21, the heat radiating portion 22, and the legs 23A and 23C included in the support member 20 are integrally formed by die-casting using a metal material such as aluminum or an aluminum alloy, for example.

支持部材20の基部21及び放熱部22の構成は、実施の形態1と同様であり、その説明を省略することとする。   The configurations of the base portion 21 and the heat radiating portion 22 of the support member 20 are the same as in the first embodiment, and the description thereof will be omitted.

脚部23A,23Cは、基部21の左右両端に設けられている。本実施の形態では、基部21の右側に脚部23Aを備え、基部21の左側に脚部23Cを備える。図9に示す例では、右側の脚部23Aは、放熱部22が備える複数の放熱フィン221a〜221gのうち、前側から2枚目の放熱フィン221bの右端に連結部24を介して連結されており、左側の脚部23Cは、後側から2枚目の放熱フィン221fの左端に連結部24を介して連結されている。
なお、以下の説明において、左右両端の脚部23A,23Bを区別して説明する必要がない場合には、単に脚部23とも記載する。
The legs 23A and 23C are provided at the left and right ends of the base 21. In the present embodiment, the leg portion 23A is provided on the right side of the base portion 21, and the leg portion 23C is provided on the left side of the base portion 21. In the example shown in FIG. 9, the leg 23A on the right side is connected to the right end of the second heat radiation fin 221b from the front side through the coupling part 24 among the plurality of heat radiation fins 221a to 221g of the heat radiation unit 22 The left leg 23C is connected to the left end of the second heat dissipating fin 221f from the rear side via the connecting portion 24.
In the following description, the legs 23A and 23B at the left and right ends are also simply described as the legs 23 when it is not necessary to distinguish them.

各脚部23は、基部21の下面212と略平行に配され、車両などの被取付部位Cに取り付けられる取付板231と、取付板231から立ち上がり、基部21の下面212に連なる前後一対の側板232a,232b(図4等を参照)とを備える。また、各脚部23には、側板232a,232bと交差するように配され、取付板231及び側板232a,232bの双方に連なる補強板233(図4等を参照)を備える。各脚部23の取付板231にはボルト挿通孔234が設けられており、脚部23は、ボルト挿通孔234に挿通させたボルトを利用して車両などの被取付部位Cに取り付けられるように構成されている。なお、被取付部位Cへの回路構成体1の取り付けは、放熱フィン221a〜221gの延びる方向が概ね鉛直方向となるように被取付部位Cに取り付けられる。   Each leg 23 is disposed substantially parallel to the lower surface 212 of the base 21 and attached to the attachment portion C of the vehicle or the like, and a pair of front and rear side plates which stand up from the attachment plate 231 and continue to the lower surface 212 of the base 21 232a and 232b (see FIG. 4 and the like). Each leg 23 is provided with a reinforcing plate 233 (see FIG. 4 and the like) which is disposed to intersect with the side plates 232a and 232b and is continuous with both the mounting plate 231 and the side plates 232a and 232b. The bolt insertion hole 234 is provided in the attachment plate 231 of each leg portion 23 so that the leg portion 23 is attached to a mounting site C such as a vehicle using a bolt inserted into the bolt insertion hole 234. It is configured. In addition, attachment of the circuit structure 1 to the attachment site | part C is attached to the attachment site | part C so that the extension direction of radiation fin 221a-221g may turn into a substantially perpendicular direction.

以上のように、実施の形態2では、基部21の左右方向及び前後方向に間隔を隔てて設けられる脚部23を利用して被取付部位Cに取り付けられるので、取付強度を確保することができる。また、放熱フィン221a〜221gの延びる方向が概ね鉛直方向となるように回路構成体1を被取付部位Cに取り付けた場合、放熱フィン221a〜221gからの放熱によって暖められた空気の一部は、連結板241a,241bの斜面によって回路構成体1の外部へ導かれ、また、暖められた空気の一部は、連結板241a,241bの斜面を経由することなく直接的に回路構成体1の外部へ導かれるので、効率良く熱を逃すことができる。   As described above, in the second embodiment, since the leg portion 23 provided at an interval in the left and right direction and the front and rear direction of the base 21 is attached to the attachment site C, the attachment strength can be secured. . When the circuit assembly 1 is attached to the mounting site C so that the extending direction of the radiation fins 221a to 221g is substantially vertical, part of the air warmed by the radiation from the radiation fins 221a to 221g is A part of the air that is led to the outside of the circuit component 1 by the slopes of the connection plates 241a and 241b and warmed is directly outside the circuit component 1 without passing through the slopes of the connection plates 241a and 241b. Because it is led to, you can efficiently release the heat.

今回開示された実施形態はすべての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は、上記した意味では無く、特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。   The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is indicated not by the meaning described above but by the claims, and is intended to include all the modifications within the meaning and scope equivalent to the claims.

例えば、本実施の形態では、7枚の放熱フィン221a〜221gを備えた放熱部22の構成について説明したが、放熱フィンの枚数は7枚に限定されるものではない。放熱フィンの枚数は、要求される放熱性能に応じて適宜設計され得るものであり、6枚以下であってもよく、8枚以上であってもよい。   For example, in the present embodiment, the configuration of the heat dissipation portion 22 provided with seven heat dissipation fins 221a to 221g has been described, but the number of heat dissipation fins is not limited to seven. The number of heat dissipating fins may be appropriately designed according to the required heat dissipating performance, and may be 6 or less, or 8 or more.

また、支持部材20や放熱フィン221a〜221gの寸法は、回路構成体1の仕様や要求される放熱性能等に応じて適宜設計され得るものであり、上述した実施の形態で説明した寸法に限定されるものではない。   Further, the dimensions of the support member 20 and the heat radiation fins 221a to 221g can be appropriately designed according to the specification of the circuit structure 1, the required heat radiation performance, and the like, and are limited to the dimensions described in the above embodiment. It is not something to be done.

更に、本実施の形態では、基部21の長辺方向に沿って放熱フィン221a〜221gを配し、短辺方向に複数枚を並設した構成としたが、基部21の短辺方向に沿って放熱フィン221a〜221gを配し、長辺方向に複数枚を並設する構成であってもよい。   Furthermore, in the present embodiment, the radiation fins 221a to 221g are disposed along the long side direction of the base 21 and a plurality of the fins are arranged in the short side direction. However, along the short side direction of the base 21 The radiation fins 221a to 221g may be disposed, and a plurality of the fins may be disposed in parallel in the long side direction.

更に、本実際の形態では、回路構成体1が脚部23を2つ以上備える構成について説明したが、取り付け強度を確保できるのであれば、脚部23は1つであってもよい。   Furthermore, although the circuit structure 1 includes two or more legs 23 in the actual mode, the number of the legs 23 may be one as long as the mounting strength can be secured.

1 回路構成体
10 回路部
20 支持部材
21 基部
22 放熱部
23(23A〜23C) 脚部
24 連結部
211 支持面
212 下面
221a〜221g 放熱フィン
231 取付板
232a,232b 側板
233 補強板 233
234 ボルト挿通孔
241a,241b 連結板
L 延長線
C 被取付部位
DESCRIPTION OF SYMBOLS 1 Circuit composition 10 Circuit part 20 Support member 21 Base 22 Heat dissipation part 23 (23A-23C) Leg part 24 Connection part 211 Support surface 212 Lower surface 221a-221g Heat dissipation fin 231 Mounting plate 232a, 232b Side plate 233 Reinforcing plate 233
234 Bolt insertion holes 241a, 241b Connection plate L Extension line C Mounting site

Claims (5)

支持部材により支持された回路部を備える回路構成体であって、
前記支持部材は、
前記回路部を支持する支持面の反対面から外向きに突出する放熱部と、
該放熱部の突出高さよりも延伸して形成される脚部と
を備える回路構成体。
A circuit assembly comprising a circuit portion supported by a support member, the circuit structure comprising:
The support member is
A heat dissipating portion projecting outward from the opposite surface of the support surface supporting the circuit portion;
And a leg portion which is formed to extend more than the projecting height of the heat radiating portion.
前記放熱部は、前記反対面の面内における第1方向に沿って延び、該第1方向と交差する第2方向に間隔を隔てて並設される複数の放熱フィンを備え、
前記脚部は、前記放熱部から前記第1方向に離隔して設けられ、
前記脚部と前記放熱フィンの1つとを連結部により連結してある
請求項1に記載の回路構成体。
The heat dissipating portion includes a plurality of heat dissipating fins extending along a first direction in the surface of the opposite surface and spaced apart in a second direction intersecting the first direction.
The leg portion is provided apart from the heat dissipation portion in the first direction,
The circuit structure according to claim 1, wherein the leg portion and one of the heat dissipating fins are connected by a connecting portion.
前記脚部は、
被取付部位に取り付けられる取付板と、
該取付板に立設されており、前記第2方向に離隔配置される2つの側板と
を備え、
前記連結部は、
前記脚部に連結される放熱フィンに対して斜めに連なり、前記2つの側板に各別に連結される2つの連結板
を備える請求項2に記載の回路構成体。
The legs are
A mounting plate attached to the mounting site,
And two side plates disposed upright on the mounting plate and spaced apart in the second direction;
The connecting portion is
The circuit assembly according to claim 2, further comprising: two connecting plates that are obliquely connected to the heat dissipating fins connected to the legs and are separately connected to the two side plates.
前記脚部を2つ備え、
前記2つの脚部の一方を、前記第1方向の一端側にて一の放熱フィンに連結してあり、他方を、前記第1方向の他端側にて他の放熱フィンに連結してある
請求項2又は請求項3に記載の回路構成体。
Equipped with two of the legs,
One of the two legs is connected to one radiation fin at one end in the first direction, and the other is connected to the other radiation fin at the other end in the first direction. The circuit structure according to claim 2 or claim 3.
前記第1方向の他端側にて前記一の放熱フィンに連結してある脚部
を更に備える請求項4に記載の回路構成体。
The circuit structure according to claim 4, further comprising: a leg connected to the one radiation fin at the other end side of the first direction.
JP2017225754A 2017-11-24 2017-11-24 Circuit structure Pending JP2019096770A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3697920B2 (en) * 1998-12-18 2005-09-21 住友電装株式会社 Electrical junction box
US20020141159A1 (en) * 2001-03-29 2002-10-03 Bloemen James Andrew Sealed and passively cooled telecommunications customer service terminal
JP4623646B2 (en) * 2004-05-27 2011-02-02 ホーチキ株式会社 CATV amplifier
JP2006093404A (en) * 2004-09-24 2006-04-06 Sumitomo Wiring Syst Ltd Electrical connection box
JP4524667B2 (en) * 2005-12-07 2010-08-18 住友電装株式会社 Electrical junction box
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