JPWO2017098621A1 - Electronic component unit and heat conduction mounting member - Google Patents

Abstract

The electronic component unit is erected with respect to the heat sink (300), the first electronic component (100) extending in the first direction, and heat generated from the first electronic component (100). And a heat conduction mounting member (10) for conducting to (300). The heat conduction mounting member (10) includes a contact portion (20) that contacts the heat sink (300), a first extension portion (31) extending from the contact portion (20) in the first direction, and a first A second extending portion (32) disposed opposite the extending portion (31) and extending in the first direction from the contact portion (20). The first electronic component (100) is sandwiched between the first extension part (31) and the front two extension parts.

Description

  The present invention relates to an electronic component unit and a heat conduction mounting member.

  Metal body fins are used to cool discrete packages and modules mounted on DC-DC converters and power supply circuits. Even if the metal fins are attached to the package and the module, as a heat dissipation effect, a high heat dissipation performance was not obtained by the heat capacity of the metal fins. The power unit (power semiconductor element), which is an example of an electronic component, generally generates a large amount of heat, and is particularly suitable for a driving motor for driving (a driving motor for electric or hybrid vehicles) that requires a large output torque. In the power section used for the inverter and voltage converter for supplying current, the amount of heat generated is large. For this reason, in order to efficiently release the heat generated from the power unit, it has been attempted to place the power unit in the heat sink. In Japanese Patent Application Laid-Open No. 2011-166773, a pair of heat sinks are mounted on both surfaces of a semiconductor unit. Japanese Unexamined Patent Application Publication No. 2013-069739 discloses a laminate in which element semiconductor units having a metal plate and a heat radiating plate facing the metal plate are disposed between a plurality of heat sinks arranged in parallel.

  However, in the structure provided conventionally, since electronic components, such as a power part, are mounted in a heat sink, there existed a problem which cannot mount many electronic components, such as a power part, in a small space.

  The present invention provides an electronic component unit that can place many electronic components in a small space while maintaining high heat dissipation.

An electronic component unit according to the present invention comprises:
A heat sink,
A first electronic component erected with respect to the heat sink and extending in a first direction;
A heat conduction mounting member for conducting heat generated from the first electronic component to the heat sink;
With
The heat conduction placement member is disposed to face the heat sink, a first extension portion extending in the first direction from the contact portion, and the first extension portion, A second extending portion extending in the first direction from the contact portion,
The first electronic component is sandwiched between the first extending portion and the second extending portion.

In the electronic component unit according to the present invention,
Each of the first extension part and the second extension part is plate-shaped,
The first electronic component has a plate-shaped main body,
The main body portion may be sandwiched between the first extension portion and the second extension portion.

In the electronic component unit according to the present invention,
The heat sink side surface of the first electronic component may be placed on the contact portion.

In the electronic component unit according to the present invention,
A plurality of first electronic components are provided;
The heat conduction mounting member is provided corresponding to each first electronic component,
At least a part of the at least two heat conductive mounting members may be arranged in parallel to each other.

In the electronic component unit according to the present invention,
A plurality of first electronic components are provided;
The heat conduction mounting member is provided corresponding to each first electronic component,
At least a part of the at least two heat conducting placement members may be arranged orthogonal to each other.

In the electronic component unit according to the present invention,
The first extending portion is made of a first conductive material, and the second extending portion is made of a material different from the first conductive material and lighter than the first conductive material, or
The first extending portion may be made of a first conductive material, and the second extending portion may be made of a material different from the first conductive material and heavier than the first conductive material.

In the electronic component unit according to the present invention,
The first electronic component has a first heat radiating portion on a surface facing the first extending portion, and a second heat radiating portion on a surface facing the second extending portion,
The conductivity of the first extension part is higher than the conductivity of the second extension part, and the heat dissipation by the second heat dissipation part is higher than the heat dissipation by the first heat dissipation part, or The conductivity of the second extension portion may be higher than the conductivity of the first extension portion, and the heat dissipation property of the first heat dissipation portion may be higher than the heat dissipation property of the second heat dissipation portion.

An electronic component unit according to the present invention comprises:
A second electronic component,
The first electronic component has a terminal connected to the second electronic component,
The terminal may extend in the first direction.

An electronic component unit according to the present invention comprises:
A second electronic component,
The amount of heat generated from the first electronic component may be greater than the amount of heat generated from the second electronic component.

In the electronic component unit according to the present invention,
The heat conduction placement member has a first heat conduction placement member including the first extension part, and a second heat conduction placement member including the second extension part,
The first heat conduction placement member and the second heat conduction placement member are separable,
The first heat conduction mounting member has a first protrusion that protrudes toward the second heat conduction mounting member on one side of the first electronic component,
The second heat conduction placement member has a second protrusion that protrudes toward the first heat conduction placement member on the other side of the first electronic component,
The first heat conduction mounting member has a first overlapping portion that overlaps the second projecting portion in the first direction,
The second heat conduction mounting member may have a second overlapping portion that overlaps the first protrusion in the first direction.

In the electronic component unit according to the present invention,
Each of the first protruding portion and the second overlapping portion has a fixing hole into which the first fastening member is inserted,
Each of the second protrusion and the first overlapping portion may have a fixing hole into which the second fastening member is inserted.

In the electronic component unit according to the present invention,
The heat conduction placement member has a first heat conduction placement member including the first extension part, and a second heat conduction placement member including the second extension part,
The first heat conduction placement member and the second heat conduction placement member are separable,
One of the first heat conductive mounting member and the second heat conductive mounting member protrudes to the other side in a plane facing the other of the first heat conductive mounting member and the second heat conductive mounting member. Having a mating protrusion
The other of the first heat conduction placement member and the second heat conduction placement member may have a fitting recess or a fitting hole into which the fitting protrusion is inserted.

The heat conduction mounting member according to the present invention is:
A heat conduction mounting member for conducting heat generated from the first electronic component to the heat sink,
A contact portion that contacts the heat sink;
A first extending portion that is erected with respect to the heat sink and extends in a first direction from the contact portion;
A second extending portion disposed opposite to the first extending portion and extending in the first direction from the contact portion,
The first electronic component is erected with respect to the heat sink and extends in the first direction, and is sandwiched between the first extension portion and the second extension portion.

  According to the present invention, since the heat conduction mounting member for conducting the heat generated from the first electronic component to the heat sink is provided, high heat dissipation can be maintained. The heat conduction mounting member is disposed so as to face the contact portion that contacts the heat sink, the first extension portion that extends in the first direction from the contact portion, and the first extension portion. And a second extending portion extending in the first direction. And the 1st electronic component erected with respect to the heat sink is clamped between the 1st extension part and the 2nd extension part. For this reason, many electronic components can be mounted in a small space.

FIG. 1 is a perspective view showing an electronic component unit according to the first embodiment of the present invention. FIG. 2 is a perspective view showing the heat conducting mounting member according to the first embodiment of the present invention. FIG. 3A is an upper plan view showing a thermally conductive mounting member according to the first embodiment of the present invention, and is an upper plan view showing an aspect in which a contact portion is provided. 3 (b) is an upper plan view showing the heat conducting placement member according to the first embodiment of the present invention, and there is a contact portion between the first extension portion and the second extension portion. It is the upper top view which showed the aspect which is not provided. FIG. 4 is an upper plan view showing the first electronic component used in the first embodiment of the present invention. FIG. 5 is a side view showing the relationship between the first electronic component, the terminal, and the second electronic component used in the first embodiment of the present invention. FIG. 6 is a perspective view showing a mode in which a plurality of first electronic components are provided and a heat conduction mounting member is provided corresponding to each first electronic component in the embodiment of the present invention. FIG. 7 is an upper plan view showing a mode in which a plurality of first electronic components are provided and a heat conduction mounting member is provided corresponding to each first electronic component in the embodiment of the present invention. FIG. 8 is a perspective view showing an electronic component unit according to a modification of the first embodiment of the present invention. FIG. 9 is a perspective view showing a heat conduction mounting member according to a modification of the first embodiment of the present invention. FIG. 10 is an upper plan view showing a heat conduction mounting member according to a modification of the first embodiment of the present invention. FIG. 11 is a perspective view showing an electronic component unit according to the second embodiment of the present invention. FIG. 12 is a perspective view showing a heat conduction mounting member according to the second embodiment of the present invention. FIG. 13 is an upper plan view showing a heat conduction mounting member according to the second embodiment of the present invention. FIG. 14 is a perspective view showing a heat conduction mounting member according to the third embodiment of the present invention. FIG. 15A is an upper plan view showing a state where the first heat conduction mounting member and the second heat conduction mounting member of the heat conduction mounting member according to the third embodiment of the present invention are separated. FIG. 15 (b) is a view showing a state in which the first heat conductive mounting member and the second heat conductive mounting member of the heat conductive mounting member according to the third embodiment of the present invention are fitted. .

First Embodiment << Configuration >>
As shown in FIG. 1, the electronic component unit in the present embodiment is generated from a heat sink 300, a first electronic component 100 that stands upright with respect to the heat sink 300 and extends in the first direction, and the first electronic component 100. And a heat conduction mounting member 10 for conducting heat to be transmitted to the heat sink 300. In the present embodiment, the direction orthogonal to the surface of the heat sink 300 is the “first direction”, but the present invention is not limited to this. The “first direction” may include a direction from the contact portion 20 toward the second electronic component 200 described later, and may be a direction inclined with respect to the normal line of the surface of the heat sink 300. Although the heat sink 300 shown in FIG. 1 and subsequent figures is shown in a schematic plate shape, any heat sink 300 known at the time of filing of the present application can be used.

  As shown in FIG. 2, the heat conduction mounting member 10 includes a contact portion 20 that contacts the heat sink 300, a first extension portion 31 that extends from the contact portion 20 in the first direction, and a first extension portion. And a second extending portion 32 that is disposed opposite to the contact portion 20 and extends in the first direction from the contact portion 20.

  As shown in FIG. 1, the first electronic component 100 is sandwiched between the first extending portion 31 and the second extending portion 32 and extends in the first direction.

  Each of the first extension part 31 and the second extension part 32 of the present embodiment may be plate-shaped. The first electronic component 100 has a plate-shaped main body 110. The main body part 110 may be sandwiched between the first extension part 31 and the second extension part 32. The main body 110 includes one or more electronic elements (not shown), a sealing resin (not shown) that encloses the electronic elements, and one that is electrically connected to the electronic elements and protrudes from the sealing resin. The above terminal 120 (a plurality of terminals 120 in this embodiment) may be included. In addition, the 1st extending part 31 used as the plate shape is provided with the 1st notch part 36 on the opposite side to the side in which the 1st electronic component 100 is provided. The second extending portion 32 having a plate shape is provided with a second notch 37 on the side opposite to the side where the first electronic component 100 is provided. The first notch 36 is provided along the width direction of the first extension 31 that is a direction orthogonal to the first direction, and the second notch 37 is along the width of the second extension 32. Is provided. In the present embodiment, the width direction of the first extending portion 31 and the width direction of the second extending portion 32 are parallel to each other and are the second direction in FIG.

  As shown in FIGS. 3A and 3B, the contact portion 20 is provided with a pair of fixing holes 25 into which the fastening members 91 and 92 are inserted. The fixing holes 25 are formed on both sides of the first extending portion 31 and the second extending portion 32 in the width direction when viewed along the direction opposite to the first direction (when viewed from above in FIG. 3). It is provided, and is provided at the center of the contact portion 20 in the third direction orthogonal to the first direction and the second direction. In the present embodiment, since the first electronic component 100 is provided at the center of the contact portion 20, when viewing FIG. 3 from the upper side of the drawing, both sides of the first electronic component 100 (one of the contact portions 20). Part) is provided with a pair of fixing holes 25. The fastening members 91 and 92 are inserted into one of the pair of fixing holes 25, and the first fastening member 91 that fixes the heat conduction mounting member 10 to the heat sink 300 and the pair of fixing holes 25. And a second fastening member 92 that is inserted into the other side and fixes the heat conduction mounting member 10 to the heat sink 300. 3A and 3B, the first fastening member 91 and the second fastening member 92 are shown by dotted lines.

  When FIG. 3 is viewed from above, the contact portion 20 is also provided between the first extension portion 31 and the second extension portion 32 (see FIG. 3A). The surface on the heat sink 300 side of the first electronic component 100 may be placed on the top 20. Further, unlike this aspect, when FIG. 3 is viewed from above, the contact portion 20 is not provided between the first extension portion 31 and the second extension portion 32 (FIG. 3). (See (b)), the surface of the first electronic component 100 on the heat sink 300 side may be in contact with the surface of the heat sink 300.

  The first extending portion 31 may be made of a first conductive material, and the second extending portion 32 may be made of a material (second conductive material) different from the first conductive material.

  In this case, the second extending portion 32 may be made of a material that is lighter than the first conductive material (a material that is light in weight per unit volume). Conversely, the second extending portion 32 may be made of a material heavier than the first conductive material (a material having a heavy weight per unit volume). Examples of light materials include aluminum and aluminum alloys. Examples of heavy materials include copper and copper alloys.

  As shown in FIG. 4, the first electronic component 100 has a first heat radiating portion 131 made of a heat radiating plate or the like on a surface facing the first extending portion 31, and a surface facing the second extending portion 32. You may have the 2nd thermal radiation part 132 which consists of a heat sink etc.

  When the conductivity of the first extension part 31 is higher than the conductivity of the second extension part 32, the heat dissipation by the second heat dissipation part 132 is higher than the heat dissipation by the first heat dissipation part 131. It may be. On the contrary, when the conductivity of the second extending portion 32 is higher than the conductivity of the first extending portion 31, the heat dissipation performance by the first heat dissipation portion 131 is greater than the heat dissipation capability by the second heat dissipation portion 132. May be higher. As an example, as in the case where the first extension portion 31 is made of copper, a copper alloy or the like and the second extension portion 32 is made of aluminum, an aluminum alloy or the like, the conductivity of the first extension portion 31 is the second. When the conductivity of the extending portion 32 is higher, the surface area of the second heat radiating portion 132 made of a heat radiating plate or the like may be larger than the surface area of the first heat radiating portion 131 made of a heat radiating plate or the like. On the contrary, the conductivity of the second extension portion 32 is the first extension as in the case where the second extension portion 32 is made of copper, copper alloy or the like and the first extension portion 31 is made of aluminum, aluminum alloy or the like. When the conductivity of the existing portion 31 is higher, the surface area of the first heat radiating portion 131 made of a heat radiating plate or the like may be larger than the surface area of the second heat radiating portion 132 made of a heat radiating plate or the like.

  As shown in FIG. 5, the electronic component unit may include a second electronic component 200. The terminal 120 of the first electronic component 100 may be connected to the second electronic component 200. The terminal 120 may extend in the first direction. That is, all or part of the terminals 120 of the first electronic component 100 may extend linearly in the first direction, and the terminals 120 may be inserted and connected to the second electronic component 200.

  The first electronic component 100 may be a power device. When the first electronic component 100 includes a plurality of terminals 120, each terminal 120 may extend along the first direction. The second electronic component 200 may comprise a control device or a control board. And as shown in FIG. 5, each terminal 120 of the 1st electronic component 100 which is a power device may be electrically connected to the 2nd electronic component 200 which is a control device or a control board. In this case, the first electronic component 100 is controlled by the second electronic component 200.

  The amount of heat generated from the first electronic component 100 (or the amount of heat generated per unit volume) may be greater than the amount of heat generated from the second electronic component 200 (or the amount of heat generated per unit volume). The first electronic component 100 may be a power device, for example. An example of a power device is a switching device. More specifically, as an example of the first electronic component 100, an FET such as a MOSFET, a bipolar transistor, an IGBT, and the like can be cited. A typical example is a MOSFET.

  As shown in FIGS. 6 and 7, a plurality of first electronic components 100 may be provided. In this case, the heat conduction mounting member 10 may be provided corresponding to each first electronic component 100. At least a part of the at least two heat conductive mounting members 10 may be arranged in parallel to each other. For example, the “extending portions” of the two heat conductive mounting members 10 may be arranged in parallel to each other (the relationship between the two heat conductive mounting members 10 in which the vertical direction in FIG. 7 is the width direction, and (Refer the relationship between the three heat conduction mounting members 10 whose left-right direction of FIG. 7 becomes a width direction). The “extending portion” in the present embodiment is a name that generically refers to the first extending portion 31 and the second extending portion 32. In addition, at least a part of the at least two heat conduction placement members 10 may be arranged orthogonal to each other. For example, the “extending portions” of the two heat conductive mounting members 10 may be arranged orthogonal to each other (at least one of the two heat conductive mounting members 10 in which the vertical direction in FIG. (Refer to the relationship with at least one of the three heat conduction mounting members 10 in which the horizontal direction of 7 is the width direction).

  In addition, by providing the first notch part 36 and / or the second notch part 37, it is possible to earn an insulation distance between the terminal 120 and the heat conduction mounting member 10. When providing the several heat conductive mounting member 10, the distance between the terminal 120 of the adjacent 1st electronic component 100 and the heat conductive mounting member 10 may become short. In this respect, by providing the first notch 36 and / or the second notch 37 as appropriate, the distance between the insulation between the terminal 120 and the heat conduction mounting member 10 can be increased. An insulation distance can be obtained.

Modification The heat conduction mounting member 10 of the present embodiment does not have to be integrated. The heat conductive mounting member 10 may have a separable first heat conductive mounting member 11 and a second heat conductive mounting member 12, as shown in FIGS. As shown in FIG. 10, the first heat conduction mounting member 11 includes a first contact portion 21 that contacts the heat sink 300, and a first extension portion 31 that extends from the first contact portion 21 in the first direction. You may have. The second heat conduction mounting member 12 may also include a second contact portion 22 that contacts the heat sink 300 and a second extending portion 32 that extends from the second contact portion 22 in the first direction. Good. The first contact portion 21 may be provided with a pair of fixing holes 26 into which the fastening members 91 and 92 are inserted. Similarly, the second contact portion 22 may be provided with a pair of fixing holes 27 into which the fastening members 91 and 92 are inserted. In the drawings other than FIG. 3, the fastening members 91 and 92 are omitted. When the separable first heat conduction mounting member 11 and second heat conduction mounting member 12 are used, the first heat conduction mounting member 11 and the second heat conduction mounting member 12 are fastened to each other. A fastening member may be used. When such a fastening member is used, a fastening member (not shown) is inserted into the fastening hole 39 provided in the first extending portion 31 and the second extending portion 32.

《Action ・ Effect》
Next, the operation and effect of the present embodiment having the above-described configuration will be described.

  According to the present embodiment, as shown in FIG. 1, since the heat conductive mounting member 10 for conducting heat generated from the first electronic component 100 to the heat sink 300 is provided, high heat dissipation is maintained. can do. In particular, the heat-conducting mounting member 10 is arranged to face the first extending portion 31 from the contact portion 20 in the first direction and from the contact portion 20 in the first direction. The first extended electronic part 100 is sandwiched between the first extended part 31 and the second extended part 32. For this reason, the heat generated from the first electronic component 100 can be efficiently conducted to the heat sink 300. In addition, by adopting such a configuration, many electronic components can be placed in a small space in the in-plane direction of the surface of the heat sink 300.

  Each of the first extending portion 31 and the second extending portion 32 has a plate shape, the first electronic component 100 has a plate-shaped main body portion 110, and the main body portion 110 has the first extending portion 31 and the second extending portion. When the aspect clamped between the extension parts 32 is adopted, the wide surface of the first electronic component 100 can be clamped between the plate-like first extension part 31 and the second extension part 32. . For this reason, the heat generated from the first electronic component 100 can be efficiently transmitted to the heat sink 300 by each of the first extending portion 31 and the second extending portion 32.

  As shown in FIG. 3A, when the aspect in which the heat sink 300 side surface of the first electronic component 100 is placed on the contact portion 20 is adopted, the heat generated from the first electronic component 100 is The heat can be transmitted to the heat sink 300 via the contact portion 20. Further, when an aspect in which the shape of the contact portion 20 matches the shape of the portion of the first electronic component 100 on the heat sink 300 side, that is, the surface of the first electronic component 100 on the heat sink 300 side and the contact portion 20 is formed. In the case of adopting an aspect in which the surface is in close contact with the surface, the heat generated from the first electronic component 100 can be transmitted to the heat sink 300 more efficiently.

  On the other hand, when the first electronic component 100 is in direct contact with the heat sink 300 as shown in FIG. 3B, the heat generated from the first electronic component 100 is transferred from the first electronic component 100 to the heat sink 300. Can be communicated directly to. When the surface of the first electronic component 100 that contacts the heat sink 300 matches the shape of the surface of the heat sink 300, the first electronic component 100 can be efficiently transmitted to the heat sink 300 also in this manner.

  When a plurality of first electronic components 100 are provided as shown in FIGS. 6 and 7 and the heat conduction placement member 10 is provided corresponding to each first electronic component 100, various arrangements should be adopted. Can do.

  For example, when adopting an embodiment in which at least a part of at least two heat conduction placement members 10 are arranged in parallel to each other, two or more sets of first electronic components 100 and heat conduction placement members 10 can be saved in a space-saving manner. Can be arranged. In particular, when the “extending portions” of two or more heat conductive mounting members 10 are arranged in parallel to each other, two or more sets of the first electronic component 100 and the heat conductive mounting member 10 can be saved in a smaller space. Can be arranged.

  As another example, when adopting an aspect in which at least a part of at least two heat conducting placement members 10 are arranged orthogonal to each other, two or more sets of the first electronic component 100 and the heat are arranged along different directions. The conductive mounting member 10 can be disposed. In particular, when the “extending portions” of the two or more heat conductive mounting members 10 are arranged orthogonal to each other, the two or more sets of the first electronic component 100 and the heat conductive mounting member 10 are more substantially included. Two or more sets of the first electronic component 100 and the heat conduction mounting member 10 can be arranged along different directions.

  As yet another example, an aspect in which at least a part of at least two heat conduction placement members 10 are arranged to be inclined with respect to each other may be employed. Also in this case, two or more sets of the first electronic component 100 and the heat conduction mounting member 10 can be arranged along different directions. In particular, when the “extending portions” of the two or more heat conductive mounting members 10 are arranged to be inclined with respect to each other, the two or more sets of the first electronic component 100 and the heat conductive mounting member 10 are more substantially included. Two or more sets of the first electronic component 100 and the heat conduction mounting member 10 can be arranged along different directions.

  You may combine these aspects suitably. In the embodiment shown in FIGS. 6 and 7, the extending portions of the three heat conductive mounting members 10 are arranged in parallel to each other. And the extension part of the two heat conductive mounting members 10 is arrange | positioned orthogonally with respect to the extension part of these three heat conductive mounting members 10. FIG. If such an aspect is employ | adopted, the assembly of the 1st electronic component 100 and the heat conductive mounting member 10 can be arrange | positioned efficiently in the area | region on a substantially rectangular shape, and a space can be utilized effectively. However, the heat conduction mounting member 10 used in FIGS. 6 and 7 is used in a third embodiment described later. In the case where a plurality of heat conduction placement members 10 are provided, the heat conduction placement members 10 of any embodiment can be used, and the heat conduction placement members 10 used in each embodiment are mixed. You can also.

  (1) When the first extension portion 31 is made of the first conductive material and the second extension portion 32 is made of a material different from the first conductive material and lighter than the first conductive material, (2) reverse When the first extension portion 31 is made of the first conductive material and the second extension portion 32 is made of a material different from the first conductive material and heavier than the first conductive material, the first extension portion 31 Different functions can be performed with respect to the existing portion 31 and the second extending portion 32. For example, the weight by the 1st extension part 31 and the weight by the 2nd extension part 32 can be changed, and the balance of the weight of the heat conduction mounting member 10 can be changed. By changing the weight balance in this way, the weight balance of the entire apparatus can be adjusted.

  As shown in FIG. 4, the first electronic component 100 has a first heat radiating portion 131 on the surface facing the first extending portion 31, and the second heat radiating portion 132 on the surface facing the second extending portion 32. When the aspect which has this is employ | adopted, the heat which generate | occur | produces in the 1st electronic component 100 can be thermally radiated efficiently.

  (1) The conductivity of the first extension portion 31 is higher than the conductivity of the second extension portion 32, and the heat dissipation performance of the second heat dissipation portion 132 is higher than the heat dissipation capability of the first heat dissipation portion 131. (2) On the contrary, the conductivity of the second extension part 32 is higher than the conductivity of the first extension part 31, and the heat dissipation by the first heat dissipation part 131 is more than the heat dissipation by the second heat dissipation part 132. In the case of adopting a mode in which the height of the first electronic component 100 is increased, the heat radiation from both surfaces of the first electronic component 100 can be made closer to an even one. For this reason, the heat generated in the first electronic component 100 can be efficiently released.

  The second electronic component 200 is provided, and the first electronic component 100 has a terminal 120 connected to the second electronic component 200, and the second electronic component 200 is the first electronic component 100 first. When arranged on the direction side, the second electronic component 200 is not arranged in a plane orthogonal to the first direction, so that the overall size of the apparatus on the plane orthogonal to the first direction can be reduced. In particular, when a mode in which the terminal 120 of the first electronic component 100 extends in the first direction is adopted, the design is easy and the second electronic component 200 can be easily attached to the first electronic component 100. Useful in terms. In this regard, as shown in FIG. 5, when the embodiment in which the entire terminal 120 of the first electronic component 100 extends in the first direction is adopted, the design is easy and the surface is orthogonal to the first direction. It is more beneficial in that the strength in the inward direction can be increased. When the first electronic component 100 has a plurality of terminals 120, each terminal 120 may extend in the first direction, and the entirety of each terminal 120 may extend in the first direction.

  When a plurality of first electronic components 100 are provided and each terminal 120 of each first electronic component 100 extends in the first direction, the second electronic component 200 is firmly fixed by each of these terminals 120. be able to. In this regard, the second electronic component 200 can be more securely fixed if the plurality of terminals 120 are provided.

  Further, as shown in FIGS. 6 and 7, the extended portions of two or more heat conductive mounting members 10 are arranged in parallel to each other, and the extended portions of two or more heat conductive mounting members 10 are orthogonal to each other. In the case where the second electronic component 200 is arranged in two orthogonal directions, the second electronic component 200 can be more reliably fixed in that the second electronic component 200 can be fixed in two orthogonal directions. Also, the strength in the in-plane direction orthogonal to the first direction can be increased.

  In the present embodiment, heat dissipation related to the first electronic component 100 is taken into consideration, and therefore, when the heat generation amount from the first electronic component 100 is larger than the heat generation amount from the second electronic component 200, a particularly beneficial effect is obtained. Can fulfill.

  When the heat conductive mounting member 10 has a separable first heat conductive mounting member 11 and a second heat conductive mounting member 12 as in the modification examples shown in FIGS. Can simplify the structure of the first heat conductive mounting member 11 and the second heat conductive mounting member 12. For this reason, manufacture can be made easy and cost can also be reduced.

  According to this modification, in particular, the first heat conductive mounting member 11 and the second heat conductive mounting member 12 can be easily made of different materials. For this reason, the 2nd heat conductive mounting member 12 is easily formed from the material lighter than the 1st heat conductive mounting member 11, or the 2nd heat conductive mounting member 12 is from the 1st heat conductive mounting member 11. Can also be made from heavy materials. Moreover, the 2nd heat conduction mounting member 12 can be easily formed from the material whose heat dissipation is higher than the 1st heat conduction mounting member 11, or the 2nd heat conduction mounting member 12 is the 1st heat conduction mounting member. 11 can be formed from a material having lower heat dissipation than 11. Thus, by manufacturing the 1st heat conduction mounting member 11 and the 2nd heat conduction mounting member 12 with a different material, when the 1st extension part 31 and the 2nd extension part 32 are manufactured with a different material, Effects similar to those described as effects can be obtained.

Second Embodiment Next, a second embodiment of the present invention will be described.

  In the second embodiment, the structure of the heat conduction mounting member 10 is different from that of the first embodiment (including modifications. The same applies hereinafter). In the second embodiment, other configurations are substantially the same as those in the first embodiment.

  As shown in FIG. 13, the first heat conduction mounting member 11 of the present embodiment includes a first base end portion 41 provided on one side of the first electronic component 100 and a first base end portion 41. It has the 1st protrusion part 42 which protrudes in the 2nd heat conductive mounting member 12 side. The second heat conduction mounting member 12 protrudes toward the first heat conduction mounting member 11 from the second base end portion 46 provided on the other side of the first electronic component 100 and the second base end portion 46. A second protrusion 47 is provided.

  As shown in FIGS. 11 and 12, the first heat conduction mounting member 11 includes a second base end portion 46 and a surface on the second heat conduction mounting member 12 side (on the first direction side in FIGS. 11 and 12). Surface) and a first overlapping portion 43 that overlaps with the second protruding portion 47 in the first direction. The second heat conduction placement member 12 abuts on the first base end portion 41 and the first heat conduction placement member 11 side surface (a surface on the first direction side in FIGS. 11 and 12) and has a first protrusion. It has the 2nd overlap part 48 which overlaps with the part 42 in a 1st direction. The first contact portion 21 has a first base end portion 41 and a first overlap portion 43, and the second contact portion 22 has a second base end portion 46 and a second overlap portion 48. Yes.

  By employ | adopting an aspect like this Embodiment, the 1st heat conduction mounting member 11 and the 2nd heat conduction mounting member 12 can be easily positioned mutually.

  As shown in FIG. 13, a fixing hole 25a into which the first fastening member 91 is inserted is provided in each of the first protruding portion 42 and the second overlapping portion 48, and / or the second protruding portion 47 and the first overlapping portion. By adopting a mode in which the fixing hole 25b into which the second fastening member 92 is inserted is provided in each of the portions 43, the number of necessary fastening members 91 and 92 can be reduced. For this reason, manufacturing can be facilitated and costs can be reduced.

  Moreover, even if there is variation in the product by setting the diameters of the fixing holes 25a and 25b to about 1.5 to 2 times the diameter of the first fastening member 91 and the second fastening member 92 (for example, Even if there is a variation of about 100 to 500 μm), the relative positions of the first heat conductive mounting member 11 and the second heat conductive mounting member 12 can be changed and adjusted. For this reason, since the relative position of the 1st heat conduction mounting member 11 and the 2nd heat conduction mounting member 12 can be adjusted in this way, the 1st heat conduction mounting member 11 and the 2nd heat conduction mounting member are more reliably. The first electronic component 100 can be held by the mounting member 12. As a result, good heat dissipation can be obtained. Also, the fixing holes 25a and 25b may have a long hole shape extending in the third direction. Also in this case, it is excellent in that the relative positions of the first heat conductive mounting member 11 and the second heat conductive mounting member 12 can be adjusted.

  In addition, the present embodiment can provide the same effects as those of the first embodiment. Since this point has been described in the first embodiment, a description thereof will be omitted.

Third Embodiment Next, a third embodiment of the present invention will be described.

  In the third embodiment, the structure of the heat conduction mounting member 10 is different from the first embodiment and the second embodiment. In the fourth embodiment, other configurations are substantially the same as those in the third embodiment.

  As shown in FIGS. 15A and 15B, one of the first heat conductive mounting member 11 and the second heat conductive mounting member 12 of the present embodiment is the first heat conductive mounting member 11 and the second heat conductive mounting member 11. It has a fitting protrusion 52 that protrudes to the other side in the surface opposite to the other of the heat conductive mounting member 12. The other of the first heat conductive mounting member 11 and the second heat conductive mounting member 12 has a fitting recess or fitting hole 51 into which the fitting protrusion 52 is inserted. 13 to 15, the second heat conduction mounting member 12 has a pair of fitting protrusions 52, and the first heat conduction mounting member 11 has a pair of fitting holes 51. Although it is an aspect, it is not restricted to this, The 1st heat conduction mounting member 11 has one or more fitting protrusion parts, and the 2nd heat conduction mounting member 12 has one or more fitting recessed parts. Or you may have a fitting hole.

  According to the present embodiment, the first heat conductive mounting member 11 and the second heat conductive mounting member 12 are fixed only by inserting the fitting protrusion 52 into the fitting recess or fitting hole 51. The first heat conductive mounting member 11 and the second heat conductive mounting member 12 can be fixed to each other without using a fastening member (not shown) such as a screw. For this reason, the number of necessary fastening members can be reduced, manufacturing can be facilitated and costs can be reduced.

  In addition, the present embodiment can provide the same effects as those of the first embodiment and the second embodiment. About this point, since it demonstrated in 1st Embodiment and 2nd Embodiment, description is abbreviate | omitted.

  Lastly, the description of each embodiment described above, the description of modifications, and the disclosure of the drawings are only examples for explaining the invention described in the claims, and the description of the above-described embodiment. The invention described in the scope of claims is not limited by the disclosure of the drawings.

DESCRIPTION OF SYMBOLS 10 Heat conduction mounting member 11 1st heat conduction mounting member 12 2nd heat conduction mounting member 20 Contact part 25, 25a, 25b Fixing hole 31 1st extension part 32 2nd extension part 41 1st base end Part 42 first protrusion 43 first overlap part 46 second base end part 47 second protrusion part 48 second overlap part 51 fitting hole 52 fitting protrusion part 91 first fastening member 92 second fastening member 100 first electron Component 110 Main body portion 120 Terminal 131 First heat radiating portion 132 Second heat radiating portion 200 Second electronic component 300 Heat sink

Claims (13)

A heat sink,
A first electronic component erected with respect to the heat sink and extending in a first direction;
A heat conduction mounting member for conducting heat generated from the first electronic component to the heat sink;
With
The heat conduction placement member is disposed to face the heat sink, a first extension portion extending in the first direction from the contact portion, and the first extension portion, A second extending portion extending in the first direction from the contact portion,
Said 1st electronic component is clamped between said 1st extension part and said 2nd extension part, The electronic component unit characterized by the above-mentioned. Each of the first extension part and the second extension part is plate-shaped,
The first electronic component has a plate-shaped main body,
The electronic component unit according to claim 1, wherein the main body portion is sandwiched between the first extending portion and the second extending portion.   The electronic component unit according to claim 1, wherein a surface of the first electronic component on the heat sink side is placed on the contact portion. A plurality of first electronic components are provided;
The heat conduction mounting member is provided corresponding to each first electronic component,
The electronic component unit according to any one of claims 1 to 3, wherein at least a part of the at least two heat conducting placement members are arranged in parallel to each other. A plurality of first electronic components are provided;
The heat conduction mounting member is provided corresponding to each first electronic component,
5. The electronic component unit according to claim 1, wherein at least a part of the at least two heat conduction placement members are arranged orthogonal to each other. The first extending portion is made of a first conductive material, and the second extending portion is made of a material different from the first conductive material and lighter than the first conductive material, or
The first extension part is made of a first conductive material, and the second extension part is made of a material different from the first conductive material and heavier than the first conductive material. The electronic component unit according to any one of 1 to 5. The first electronic component has a first heat radiating portion on a surface facing the first extending portion, and a second heat radiating portion on a surface facing the second extending portion,
The conductivity of the first extension part is higher than the conductivity of the second extension part, and the heat dissipation by the second heat dissipation part is higher than the heat dissipation by the first heat dissipation part, or The conductivity of the second extension portion is higher than the conductivity of the first extension portion, and the heat dissipation property of the first heat dissipation portion is higher than the heat dissipation property of the second heat dissipation portion. The electronic component unit according to any one of claims 1 to 6. A second electronic component,
The first electronic component has a terminal connected to the second electronic component,
The electronic component unit according to claim 1, wherein the terminal extends in the first direction. A second electronic component,
9. The electronic component unit according to claim 1, wherein a heat generation amount from the first electronic component is larger than a heat generation amount from the second electronic component. The heat conduction placement member has a first heat conduction placement member including the first extension part, and a second heat conduction placement member including the second extension part,
The first heat conduction placement member and the second heat conduction placement member are separable,
The first heat conduction mounting member has a first protrusion that protrudes toward the second heat conduction mounting member on one side of the first electronic component,
The second heat conduction placement member has a second protrusion that protrudes toward the first heat conduction placement member on the other side of the first electronic component,
The first heat conduction mounting member has a first overlapping portion that overlaps the second projecting portion in the first direction,
10. The electronic component unit according to claim 1, wherein the second heat conduction mounting member has a second overlapping portion that overlaps the first protrusion in the first direction. 11. . Each of the first protruding portion and the second overlapping portion has a fixing hole into which the first fastening member is inserted,
11. The electronic component unit according to claim 10, wherein each of the second projecting portion and the first overlapping portion has a fixing hole into which a second fastening member is inserted. The heat conduction placement member has a first heat conduction placement member including the first extension part, and a second heat conduction placement member including the second extension part,
The first heat conduction placement member and the second heat conduction placement member are separable,
One of the first heat conductive mounting member and the second heat conductive mounting member protrudes to the other side in a plane facing the other of the first heat conductive mounting member and the second heat conductive mounting member. Having a mating protrusion
The other of said 1st heat conductive mounting member and said 2nd heat conductive mounting member has a fitting recessed part or a fitting hole in which said fitting protrusion part is inserted, The Claim 1 thru | or 11 characterized by the above-mentioned. The electronic component unit according to any one of claims. A heat conduction mounting member for conducting heat generated from the first electronic component to the heat sink,
A contact portion that contacts the heat sink;
A first extending portion that is erected with respect to the heat sink and extends in a first direction from the contact portion;
A second extending portion disposed opposite to the first extending portion and extending in the first direction from the contact portion,
The first electronic component is erected with respect to a heat sink, extends in a first direction, and is sandwiched between the first extension portion and the second extension portion. Element.

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