JP2019096721A - Transport jig and soldering method - Google Patents

Abstract

To reduce a working time of a paste-in-hole method.SOLUTION: A transport jig 100 is a jig for a substrate with a through holes into which a lead of an insertion component is inserted. The transport jig 100 includes an outer groove 101, a lead groove 102, and a lead holding sheet 110. The substrate is fitted in the outer groove 101. The lead groove 102 is provided at a portion corresponding to the position of the through hole when the substrate is fitted into the outer groove 101. When the substrate is fitted in the outer groove 101, the lead is disposed in the lead groove 102. The lead holding sheet 110 has a notch into which the lead is inserted, and is laid in the lead groove 102. Due to the insertion of the lead into the notch, the position of the insertion component is fixed.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method of collectively soldering a surface mount component and an insert component by a reflow method using a transfer jig.

  When manufacturing a substrate on which a surface mounting component and an insertion component are mixedly mounted, generally, after soldering the surface mounting component by a reflow method, the insertion component is soldered by a flow method or a manual operation.

  Patent Document 1 discloses, as a method of collectively performing reflow soldering and flow soldering, a method of collectively soldering a surface mounted component and an insertion component by a paste-in-hole method.

In the paste-in-hole method, the solder paste is applied to the through holes in which the leads of the insertion component are inserted, in addition to the pads on which the surface mounting components are mounted. Then, after the surface mounted component is mounted on the substrate, the lead of the insertion component is inserted into the through hole, and the substrate is put into the reflow furnace. This makes it possible to solder the insert only on the surface mounting line.
However, since an insertion part such as a connector requires height alignment, a height dimension determined based on the substrate surface is often required. Therefore, it is necessary to position the insert part such as the connector using a jig before the soldering operation.

  In order to manufacture a mixed substrate by the paste-in-hole method, it is often necessary to prepare a jig, attach the jig to the substrate, and position the insert with the jig. Therefore, the paste-in-hole method has not generally spread.

JP 10-224024 A

When replacing the flow soldering or hand soldering of the insert with the paste-in-hole method, the following problems occurred.
Problem 1: In order to attach the jig to the substrate, it is necessary to once take out the substrate from the surface mounting line. Therefore, continuous production can not be performed.
Problem 2: It is necessary to attach a jig to the substrate and to position the insert with the jig.
Problem 3: If the insertion work is manually performed after the surface mounted parts are mounted on the board, errors such as falling of the mounted parts or fading of solder paste may occur during the work, resulting in board failure. There is a risk of

  Due to the problems 1 and 2, the working time of the paste-in-hole method is not much different from the conventional working time when the paste-in-hole method is not used. That is, the effect of reducing the working time by the paste-in-hole method is often small.

  An object of the present invention is to reduce the working time of the paste-in-hole method.

The transfer jig of the present invention is a jig for a substrate having a through hole into which the lead of the insertion part is inserted.
The transport jig is
An outer groove into which the substrate is fitted;
A lead groove provided at a portion corresponding to the position of the through hole when the substrate is fitted in the outer groove, and in which the lead is arranged when the substrate is fitted in the outer groove;
And a lead holding sheet having a notch into which the lead is inserted and placed in the lead groove.

  According to the present invention, the lead of the insertion part is inserted into the notch of the lead holding sheet. Therefore, the position of the insert is fixed by the frictional force between the notch and the lead. This makes it possible to reduce the working time of the paste-in-hole method.

FIG. 2 is a cross-sectional view of the transfer jig 100 and the substrate 200 in Embodiment 1. FIG. 2 is a configuration diagram of a substrate 200 and an insertion part 210 in Embodiment 1. FIG. 2 is a cross-sectional view of the transfer jig 100 in the first embodiment. FIG. 2 is a plan view of a lead holding sheet 110 according to the first embodiment. Explanatory drawing of the 1st process of the soldering method in Embodiment 1. FIG. Explanatory drawing of the 2nd process of the soldering method in Embodiment 1. FIG. Explanatory drawing of the 3rd process of the soldering method in Embodiment 1. FIG. Explanatory drawing of the 4th process of the soldering method in Embodiment 1. FIG.

  In the embodiments and the drawings, the same elements and corresponding elements are denoted by the same reference numerals. Descriptions of elements with the same reference numerals will be omitted or simplified as appropriate. Arrows in the figure mainly indicate the flow of data or the flow of processing.

Embodiment 1
A conveying jig 100 and a soldering method using the conveying jig 100 will be described based on FIGS. 1 to 8.

*** Description of the configuration ***
The configuration of the transfer jig 100 will be described based on FIGS. 1 to 4.
FIG. 1 shows a cross section of the transfer jig 100 on which the substrate 200 is disposed. The insert part 210 is mounted on the substrate 200.
The transport jig 100 is a jig for transporting the substrate 200.
Specifically, the transfer jig 100 is a jig for the paste-in-hole method. Further, the substrate 200 is a mixed substrate on which the insertion component 210 and the surface mounting component 220 described later are mounted.

FIG. 2 shows a cross section of the substrate 200.
The insert 210 has one or more leads 211.
The substrate 200 has one or more through holes 201.
The lead 211 of the insertion part 210 is inserted into each through hole 201.

FIG. 3 shows a cross section of the transfer jig 100.
The transfer jig 100 has an outer groove 101.
The outer groove 101 is a recess that forms a step, and is shallower than the thickness of the substrate 200.
The substrate 200 is fitted in the outer groove 101.

The transfer jig 100 has a lead groove 102 in a part of the outer groove 101.
Specifically, the lead groove 102 is provided at a portion corresponding to the position of the through hole 201 when the substrate 200 is fitted in the outer groove 101.
In other words, the lead groove 102 is provided below the portion including the portion where the through hole 201 is located when the substrate 200 is fitted into the outer groove 101.
The lead groove 102 is a recess that forms a step.
In the lead groove 102, when the substrate 200 is fitted in the outer groove 101 and the lead 211 of the insertion component 210 is inserted into the through hole 201 of the substrate 200, the lead 211 of the insertion component 210 is disposed.

The conveyance jig 100 has a lead holding sheet 110.
The lead holding sheet 110 is laid in the lead groove 102.
The lead holding sheet 110 is a sheet made of a heat-resistant material. Specifically, the lead holding sheet 110 is made of silicon or fluorine-based heat-resistant rubber.

FIG. 4 shows a plane of the lead holding sheet 110. As shown in FIG.
The lead holding sheet 110 has a plurality of cuts 111.
Specifically, each notch 111 is provided at a position facing the through hole 201 when the lead holding sheet 110 is laid in the lead groove 102 and the substrate 200 is fitted in the outer groove 101.
When the substrate 200 is fitted in the outer groove 101 and the lead 211 of the insertion part 210 is inserted into the through hole 201 of the substrate 200, the lead 211 of the insertion part 210 is inserted into each notch 111.
Each notch 111 is a round hole having a diameter equal to or less than the diameter of the lead 211, an elongated hole having a width equal to or less than the diameter of the lead 211, or a slit.

*** Description of operation ***
A soldering method using the transfer jig 100 will be described based on FIGS. 5 to 8.
The soldering method to be described is a method of soldering the insertion part 210 and the surface mounting part 220 to be described later to the substrate 200 collectively by a reflow method.
In the following description, the machine may operate instead of the worker.

The first step (preceding step) will be described based on FIG.
FIG. 5 shows a cross section of the transfer jig 100 and the substrate 200 after the first process.
First, the operator lays the lead holding sheet 110 in the lead groove 102.
Next, the worker fits the substrate 200 in the outer groove 101.
Then, the operator throws the carrier jig 100 into the surface mounting line. This surface mounting line is a facility that performs soldering using a paste-in-hole method.

The second step (printing step) will be described based on FIG.
FIG. 6 shows a cross section of the transfer jig 100 and the substrate 200 after the second process.
The surface mounting line applies solder paste 203 to the substrate 200.
Specifically, the surface mount line printing machine prints solder paste 203 on pad 202. Further, the surface mount line printing machine prints solder paste 203 on the through holes 201. Since the outer groove 101 is shallower than the thickness of the substrate 200, the solder paste 203 can be easily adhered to the substrate 200.

The third step (mounting step) will be described based on FIG.
FIG. 7 shows a cross section of the transfer jig 100 and the substrate 200 after the third process.
The surface mounting line mounts the surface mounting component 220 and the insertion component 210 on the substrate 200.
Specifically, the mounting device of the surface mounting line arranges the surface mounting component 220 such that the electrode of the surface mounting component 220 is positioned on the solder paste 203 applied to the pad 202. Further, the mounting device of the surface mounting line arranges the insertion part 210 such that the lead 211 of the insertion part 210 is inserted into the through hole 201. At this time, the mounting machine adjusts the position of the insertion part 210 so that the height from the surface of the substrate 200 to the insertion part 210 satisfies the dimension requirement value. Then, the tip end of the lead 211 of the insertion part 210 is inserted into the notch 111 of the lead holding sheet 110. Therefore, the position of the insertion part 210 is fixed in a state where the position of the insertion part 210 is adjusted by the elastic force and the frictional force generated between the notch 111 and the lead 211. That is, the insertion part 210 is positioned.

The fourth step (heating step) will be described based on FIG.
FIG. 8 shows a cross section of the transfer jig 100 and the substrate 200 after the fourth process.
The surface mount line bonds the surface mount component 220 and the insert component 210 to the substrate 200.
Specifically, the reflow furnace of the surface mounting line melts the solder paste 203 by heating. Since the lead holding sheet 110 is made of a heat-resistant material, the position of the insertion part 210 is maintained even during heating. The solder paste 203 melts and flows along the electrodes of the surface mount component 220 or the leads 211 of the insert component 210. The solder paste 203 solidifies due to the temperature decrease after heating. The solidified solder 204 is a solidified solder paste 203. Thereby, the surface mounting component 220 and the insertion component 210 are joined to the substrate 200.

*** Effect of Embodiment 1 ***
The following effects can be obtained.
Effect 1: By providing the conveyance jig 100 with the function of positioning and fixing the parts, the jig for positioning the parts, the positioning operation, and the extraction operation once from the surface mounting line become unnecessary.
Effect 2: Since the positioning work of the insertion part 210 can be performed by the automatic mounting machine, the work time for mounting the parts can be shortened compared to the manual work.
Effect 3: Since it is not necessary to temporarily take out the substrate 200 from the surface mounting line, there is no work mistake such as part falling during the positioning work or fading of the solder paste 203, and the quality is improved.
Effect 4: Since the insert part 210 can be mounted only on the surface mounting line, it is possible to reduce the flow soldering equipment for the post mounting operation or the post mounting component.

*** Supplement of the embodiment ***
The embodiments are exemplifications of preferred embodiments, and are not intended to limit the technical scope of the present invention. The embodiment may be partially implemented or may be implemented in combination with other embodiments. Also, the described procedure may be changed as appropriate.

  DESCRIPTION OF SYMBOLS 100 conveyance jig, 101 outline groove, 102 lead groove, 110 lead holding sheet, 111 notch, 200 board | substrate, 201 through hole, 202 pad, 203 solder paste, 204 solidification solder, 210 insertion parts, 211 leads, 220 surface mounting parts .

Claims (6)

A transfer jig for a substrate having a through hole into which a lead of an insertion part is inserted;
An outer groove into which the substrate is fitted;
A lead groove provided at a portion corresponding to the position of the through hole when the substrate is fitted in the outer groove, and in which the lead is arranged when the substrate is fitted in the outer groove;
And a lead holding sheet having a notch into which the lead is inserted and placed in the lead groove. The conveyance jig according to claim 1, wherein the lead holding sheet is a sheet made of a heat-resistant material. The conveyance jig according to claim 2, wherein the lead holding sheet is made of silicon or heat resistant rubber. The transfer jig according to any one of claims 1 to 3, wherein the substrate is a mixed substrate on which a surface mounting component and the insertion component are mounted. The transfer jig is introduced into the surface mounting line in a state in which the substrate is fitted in the outer groove.
The transfer jig according to claim 4, wherein the surface mounting component and the insertion component are mounted on the substrate at the mounting line. This is a soldering method that mounts surface mount components and insert components on a board using a transport jig,
The substrate has a pad and a through hole,
The transport jig is
An outer groove into which the substrate is fitted;
A lead groove provided at a portion corresponding to the position of the through hole when the substrate is fitted in the outer groove, and in which the lead of the insert is disposed when the substrate is fitted in the outer groove ,
And a lead holding sheet having a notch into which the lead is inserted and placed in the lead groove;
The substrate is fitted in the outer groove;
The transfer jig is introduced into the surface mounting line,
The surface mounting line applies a solder paste to the pad and the through hole, the electrode of the surface mounting component is disposed on the solder paste applied to the pad, and the lead of the insertion component is passed through the lead A soldering method in which the lead is inserted into a hole and fixed to the lead holding sheet, and each solder paste is melted by heating and solidified after heating.

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