JP2019091769A - Electronic equipment enclosure - Google Patents

Abstract

To provide an electronic equipment enclosure in which temperature deviation of sidewall, where an air outlet is formed, is reduced.SOLUTION: Since a diffuser panel 20 is placed between a first vent hole 11a and an electronic component 12, convection current from the vicinity of the electronic component 12 toward the first vent hole 11a is diffused by existence of this diffuser panel 20, and generates air flow not reaching the first vent hole 11a with shortest distance. The air flow not reaching the first vent hole 11a directly becomes air flow along the transverse plane 10a located above the electronic component 12, and heats the transverse plane 10a when moving along the transverse plane 10a. Consequently, the calory for heating the first vent hole 11a is reduced, and since the calory for heating the transverse plane 10a of other than the first vent hole 11a increases, temperature deviation of the sidewall where the first vent hole 11a is formed is reduced.SELECTED DRAWING: Figure 5

Description

  BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an electronic device housing that accommodates an electronic component that generates heat and has a vent for communicating the inside and the outside of the housing.

What is disclosed by patent documents 1, 2 is known as an electronic device case which accommodates an electronic component which generates heat and has a vent which makes the inside and outside of a case connect.
13 and 14 schematically show the invention disclosed in Patent Document 1. As shown in FIG. As shown in FIG. 13, due to the positional relationship between the heat generating component 1 and the exhaust port 2, high temperature air is exhausted from a part (A part) of the exhaust port 2 and the temperature is not so high from the remaining part (B part) Air was exhausted. For this reason, a part of the exhaust port has been locally heated.

As shown in FIG. 14, in the present invention, by disposing the heat conducting member 3 in which the slit is formed in front of the exhaust port 2, the high temperature air is first transmitted to the heat conducting member 3 and the temperature drops slightly. Exhausted from part A. The exhaust of air that is not very hot absorbs heat by passing through the remaining portion of the heat transfer member 3, and after passing through a slight increase in temperature, it passes through the B partial exhaust port 2. As a result, since the temperature is averaged after exhaustion from the portions A and B of the exhaust port 2, the exhaust temperature can be averaged, and local heating can be prevented. In this example, the heat diffusion is a heat transfer using the heat conducting member 3 as a heat equalizing member, not air diffusion.
In this case, the amount of heat generated in the housing and the amount of heat exhausted from the exhaust port 2 are basically the same, and the heat conducting member 3 passes air and does not block the flow of air.

  In the case of the invention disclosed in Patent Document 2, when the electric fan is provided in the housing, the air is easily exhausted along the shortest path from the intake port to the exhaust port, and the cooling efficiency is not good. For this reason, a plate material for forcing the flow of air is disposed in the path from the intake port to the exhaust port, and the flow of air drawn by the electric fan is diffused in the housing to improve the cooling efficiency in the entire housing. .

JP, 2009-26894, A Japanese Utility Model Application Publication No. 5-25795

FIG. 15 shows the conventional problem from another point of view.
In the invention shown in FIG. 14, the local bias of the heating of the exhaust port is eliminated.
The air heated by the heat generating member 1 passes through the exhaust port 2 by convection and is exhausted, but as shown in FIG. 15, only the portion of the exhaust port 2 is heated in the side wall where the exhaust port 2 is formed, The other parts are not so heated. That is, since the exhaust port 2 is a local heating location and a high temperature location, and the peripheral wall surface is a low temperature location and surface temperature unevenness occurs, the temperature deviation in the side wall becomes large. In this example, the amount of heat generated in the housing and the amount of heat exhausted at the exhaust port 2 are basically the same.

  The present invention provides an electronic device case in which the temperature deviation of the side wall where the exhaust port is formed is reduced.

The present invention is an electronic device housing that accommodates an electronic component and has a vent for communicating the inside and the outside of the housing, and is disposed between the vent and the electronic component, and the vent from the vicinity of the electronic component It is configured to include a diffusion plate for diffusing convection toward the mouth.
In the above-described configuration, heat is generated generally when current flows through the electronic component. For air cooling, a method of forcibly generating an air flow using a fan and a method of utilizing air convection can be adopted. When air convection is used, air is heated by the electronic component to move in the shortest distance toward the upper vent, since convection occurs due to the pressure difference due to the temperature difference. Then, the heated and heated air is exhausted after heating only the slits of the vent and relatively near portions. However, since the diffusion plate is disposed between the vent and the electronic component, the convection from the vicinity of the electronic component toward the vent is diffused by the presence of the diffusion plate, and the air does not reach the exhaust at the shortest distance. Create a flow. The flow of air that does not reach the exhaust port directly causes the flow of air along the top plate above the electronic components, and heats the top plate as it moves along the top plate.

  In other words, the air heated by the electronic component is not directed only to the vent, but a part of it moves along the other top plate. The phenomenon in which the air path is divided in this way also results in the heat being separated, the heat amount for heating the vent decreases, and the heat amount for heating the top plate other than the vent increases. And, the temperature deviation of the side wall where the vent is formed is reduced.

  The electronic device casing according to the present invention disperses the heat of the heated and high temperature air concentrated substantially in the vent, and heats the wall material etc. around the vent, so the electronic device casing The waste heat can be dissipated through the other wall materials, and only the vent can alleviate the locally heated symptom.

It is a schematic perspective view of the electronic device case concerning one embodiment of the present invention. It is a schematic sectional drawing which shows the internal condition of the horizontal installation state of the electronic device housing | casing. It is a schematic sectional drawing which shows the internal condition of the vertical installation state of the same electronic device housing | casing. It is sectional drawing which shows the convection of the horizontal installation state of the electronic device housing | casing which is not provided with a diffusion plate. It is a schematic sectional drawing which shows typically propagation of the heat | fever of the horizontal installation state of an electronic device housing | casing. It is sectional drawing which shows the convection of the horizontal installation state of the electronic device housing | casing concerning a modification. It is sectional drawing which shows typically propagation of the calorie | heat amount of the horizontal installation state of the electronic device housing | casing. It is sectional drawing which shows the convection of the horizontal installation state of the electronic device housing | casing concerning a modification. It is a schematic sectional drawing which shows the cross-sectional shape concerning the modification of a diffusion plate. It is a schematic sectional drawing which shows the cross-sectional shape concerning the modification of a diffusion plate. It is a schematic sectional drawing which shows the cross-sectional shape concerning the modification of a diffusion plate. It is sectional drawing which shows the convection of the horizontal installation state of the electronic device housing | casing concerning a modification. It is a schematic sectional drawing which shows typically the subject of the conventional electronic device housing | casing. It is a schematic sectional drawing which shows typically the state which the conventional electronic device housing solved the subject. It is a schematic sectional drawing which shows typically the subject which the conventional electronic device housing | casing left.

Hereinafter, embodiments of the present invention will be described based on the drawings.
FIG. 1 is a schematic perspective view of an electronic device casing according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view showing an internal state of the electronic device casing in a horizontally placed state, and FIG. It is a schematic sectional drawing which shows the internal condition of the vertical installation state of the same electronic device housing | casing.
In the figure, the housing 10, which is an electronic device housing, is formed in a hollow, substantially rectangular thin box shape, and the side walls (10c to 10f) connect the front 10a and the back 10b. The thickness of) is small. Each side wall is called an upper surface 10c, a bottom surface 10d, a left side surface 10e, and a right side surface 10f. In addition, when setting it sideways so that it may mention later, it may only call the side surfaces 10a-10f. The thin box shape is only an example, and each side or face may be formed by a curve. In the front face 10a, there is formed a first vent 11a which is a through hole disposed in an annular shape. The first vent 11 a communicates the inside and the outside of the housing 10 and functionally functions as a vent.

In the upper surface 10c and the bottom surface 10d, a second vent 11b which is a slit-like through hole is formed. Although not shown in the drawings, a leg portion is formed on the bottom surface 10d so that the second vent 11b of the bottom surface 10d is not blocked even if the bottom surface 10d is disposed on the lower side. The second vent 11b also connects the inside and the outside of the casing 10, and functions functionally as a vent. The first vent 11a and the second vent 11b are collectively referred to simply as the vent 11 (11a, 11b).
The back surface 10b is provided with a hole for wall mounting not shown. It is also possible to use the housing 10 across the wall by using the wall mounting holes.

Here, the housing 10 has installation patterns in at least two directions.
FIG. 2 shows an installation pattern in which the front surface 10a faces upward and the back surface 10b faces downward, which will be referred to as horizontal placement in this embodiment. FIG. 3 shows an installation pattern in which the top surface 10c faces upward and the bottom surface 10d faces downward, and in this embodiment, it is referred to as being placed vertically. That is, the electronic device housing can be installed with the first vent 11a serving as the top, and with one of the second vents 11b serving as the top.
Cooling in the case of vertical installation is performed as follows. When the internal electronic component 12 generates heat, the air entered from the vent 11b on the bottom surface 10d side exits from the vent 11b on the top surface 10c. At this time, ventilation using a so-called chimney effect can be performed. When performing ventilation utilizing this effect, ventilation can be efficiently performed when the height difference between the intake port and the exhaust port is large as compared with the case where the height difference between the intake port and the exhaust port is small. As described later, the diffusion plate 20 is shaped so as to protrude toward the electronic component, but the protruding portion is not disturbed even by the protruding portion. Conversely, the protruding portion of the diffusion plate 20 can move the rising air toward the electronic component 12 (see the arrow in FIG. 3), and the heat dissipation effect of the electronic component 12 can be improved.

  In the housing 10, an electronic component 12 and an electronic substrate 13 on which the electronic component 12 is disposed are accommodated. The electronic component 12 is configured to include various elements, but includes a heat generating member. There are various elements that can be heat generating members, but various high density ICs such as CPUs often require measures against heat generation. The electronic component 12 includes an element that requires such measures against heat generation. The electronic component 12 is disposed on the electronic substrate 13 at a position close to the approximate center of the generally ventilated first vent 11a. Therefore, the heat generating member is a heat generating member that generates an air flow rising to the periphery by the heat generation, and causes an air flow rising in a predetermined range around the heat generating member. In this sense, the position where the rising air flow occurs can be said to be near the electronic component 12.

In the case of the first vent 11a, the electronic substrate 13 is disposed so as to block between the front face 10a and the back face 10b, and the air flow substantially penetrates from the bottom face 10d to the first vent 11a of the top face 10c. There is no such flow. On the other hand, in the case of the second vent 11b, although there is an obstacle such as the electronic component 12 between the top surface 10c and the bottom surface 10d, the plate-like one blocks the air flow like the electronic substrate 13 It is not supposed to be. Therefore, in the case of vertical installation, the flow of air by convection from below to above is relatively easy to flow. In the case of the vertical orientation, when the electronic component 12 generates heat, the surrounding air is warmed and rises because the specific gravity is reduced. As the air around the electronic component 12 rises, the lower air is pulled up and the upper air is naturally pushed up. It becomes easier to rise by absorbing heat. As a result, air is sucked from the second vent 11b on the bottom surface 10d and exhausted from the second vent 11b on the top surface 10c. In the present embodiment, this phenomenon is called convection. Intake and exhaust are not necessarily limited to the flow of one-way air flow, and are generally referred to as a vent.
The shape of the vent holes of the first vent hole 11a and the second vent hole 11b is not particularly limited. Further, in this example, the electronic device housing has a plurality of side surfaces, and the first vent 11a and the second vent 11b are formed on the side surfaces adjacent to each other and not opposite to each other. It is done.

  In the housing 10, the diffusion plate 20 is accommodated adjacent to the first vent 11a disposed in an annular shape. In the diffusion plate 20, a plate member is formed substantially in a ring shape. Details of the diffusion plate 20 will be described later.

FIG. 4 is a cross-sectional view showing convection in a state in which the electronic device case not provided with the diffusion plate 20 is placed horizontally, and the case 10 of FIG. 4 is a cross-sectional view of a specific example without forming an approximate shape. . Also in the following, for the sake of convenience of explanation, those schematically shown and those of specific examples are shown.
As shown in FIG. 4, when the electronic component 12 is energized, the electronic component 12 generates heat, and the surrounding air, particularly the upper air, is warmed. Since the electronic component 12 is disposed approximately at the center of the annular first vent 11a, the heated and warmed air will rise toward the inner wall of the annular first vent 11a. However, since it is blocked by the wall surface, it moves so as to extend to the periphery with reference to the horizontal direction while rising. Then, part of the warmed air passes through the first vent 11a, passes through the wall surface of the front face 10a, and is exhausted to the outside. There are no vents on the wall surface of the front face 10a other than the first vent 11a, so all the warmed air passes through the first vent 11a.

While the air warmed by the electronic component 12 is exhausted through the first vent 11a, external air is sucked from the side surface 10c and the side surface 10d so as to suppress a change in air pressure in the housing 10. In this case, the slit-like second ventilation port 11b of the side surface 10c and the side surface 10d functions only as an intake port, and the sucked air moves toward the first ventilation port 11a. In this case, since an obstacle other than the first vent 11a is not formed on the inner wall of the front face 10a, the air sucked from the second vent 11b is directed to the first vent 11a. Flow. And the first vent 11a of the front face 10a functions only as an exhaust. That is, although the waste heat of the electronic component 12 is discharged from the first vent 11a through the peripheral air, this waste heat heats the first vent 11a, so the first front view 10a Only the wall material portion adjacent to the air vent 11a of is heated locally. The flow of air along the wall surface of the front face 10a is exhausted to the outside from the first vent 11a when the heated air near the center reaches the position of the first vent 11a although it spreads to the periphery. It does not reach to heat the wall surface outside the first vent 11a. On the other hand, on the wall surface outside the first vent 11a, the unheated air drawn from the second vent 11b flows and is exhausted to the outside from the first vent 11a. The wall surface outside the first vent 11a in the front face 10a is not heated even by the flow.
In addition, the flow of the air mentioned above is shown by the arrow in FIG.

FIG. 5 is a schematic cross-sectional view schematically showing the propagation of heat in the horizontal state of the electronic device casing. FIG. 6 is a cross-sectional view showing convection in a specific example of the electronic device casing in this case.
In the housing 10, a ring-shaped diffusion plate 20 made of a plate having an inner diameter slightly larger than the first vent 11a in an annular shape is disposed at a position inside the first vent 11a. There is. Further, the diffusion plate 20 is formed in a ring shape, and a convex wall portion 20 a which protrudes in a cylindrical shape from the edge on the inner peripheral side to the electronic component 12 side is formed.
As described above, the diffusion plate 20 is a plate member, and the heights projecting toward the electronic component 12 are different between the side near the first vent 11 a and the side near the second vent 11 b. .

  When the air warmed by the electronic component 12 moves upward by convection, the convection spreads in the peripheral side on the near side of the first vent 11a due to the resistance of the fluid occurring at the time of passing through the first vent 11a. I will try. In particular, since the diffusion plate 20 is provided with a cylindrical convex wall 20a at the central portion, the path of convection is separated by the convex wall 20a, and the convection spread in front of the convex wall 20a is When it strikes the diffusion plate 20, the pressure from the convection that is going to rise further tends to spread along the diffusion plate 20 in the peripheral direction. In the case where the diffusion plate 20 shown in FIG. 4 is not provided, the inward air flow toward the first vent 11a is generated outside the first vent 11a. In the case where the diffuser plate 20 is provided, a flow of air moving outward from the first vent 11a is generated.

When the air flow reaches the outer peripheral end of the ring-shaped diffusion plate 20, the air flow moves upward because it is warmed, and the outer wall surface of the first vent 11a in the wall surface of the front surface 10a is It will be in contact with you. Heat is transferred to the wall surface of the front surface 10a to warm it by being a flow of air in contact with the wall surface of the front surface 10a. That is, heat radiation from the surface of the wall surface is performed.
As described above, in the case where the diffusion plate 20 is not provided, only the peripheral edge of the first vent 11a is warmed and locally heated, and by installing the diffusion plate 20, it is directed to the first vent 11a. The surface temperature is increased by spreading the convection and guiding the flow of air to the outside of the first vent 11a and consequently transferring the heat to the entire wall surface located outside the first vent 11a. become. By thus increasing the number of sites for transferring waste heat, it is possible to reduce the amount of heat discharged from the first vent 11 a and to reduce local heating.

  In FIG. 5, the heat of the large three arrows is released from the electronic component 12, but the heat of the smaller four arrows is discharged from the first vent 11a, and the heat is discharged outside the first vent 11a. It also shows how the heat of two small arrows is being discharged from the wall of. It can be said that this represents the dispersion of waste heat.

  FIG. 6 is a cross-sectional view showing convection in the horizontal state of the electronic device casing in the specific example. As in the case of FIG. 5 schematically shown as a schematic cross-sectional view, the air heated by the electronic component 12 is diffused outside the diffusion plate 21 on the front side of the diffusion plate 21 with respect to the electronic component 12 and diffused. Then it ascends and flows outward along the wall of the front face 10a. When flowing along the wall surface of the front face 10a, the heat is transmitted to the wall surface, and the heat is dissipated by the heat radiation from the surface of the housing.

FIG. 7 is a cross-sectional view schematically showing propagation of heat in the transversely placed state of the electronic device casing.
In the case of the embodiment shown in FIGS. 6 and 7, when the warmed air is diffused to the outside by the diffusion plate 21, the flow of the air flows out of the rod through a part of the second vent 11b. As shown in FIG. 6, in the case where the diffusion plate 21 itself blocks the path from the outside of the first vent 11a to the first vent 11a, the second vent 11b is more likely to be exhausted. However, even when the diffusion plate 21 itself does not block the same path, there is also a path exhausted from the second vent 11b as shown in FIG.

  Of course, the air is exhausted from the upper opening of the second vent 11b, and the air is drawn from the other lower openings. When the air is exhausted from the second vent 11b, the heat radiation also wastes heat from the casing wall surface of the top face 10c and the bottom face 10d where the second vent 11b is formed. Therefore, in the case shown in FIG. 5, the amount of heat generated by the electronic component 12 and the amount of heat discharged from the front surface 10a are substantially equal, but in the case shown in FIG. The amount of heat released from the heat 10a is small, and it can be said that the difference is caused by the heat from the top surface 10c and the bottom surface 10d.

  Thus, the vent has the first vent 11a and the second vent 11b, and the diffusion plate 21 is disposed at a position closer to the first vent 11a than the second vent 11b. The convection from the vicinity of the electronic component 12 toward the first vent 11a is diffused and guided to the second vent 11b.

  The positions of the diffusion plates 20 and 21 can be changed as appropriate depending on design considerations. In the embodiment described above, it can be said that the diffusion plates 20 and 21 are disposed generally between the first vent 11 a and the electronic component 12. However, the diffusion plates 20 and 21 are not arranged to block the shortest path connecting the first vent 11 a and the electronic component 12 in a straight line. It is possible to lead outside without blocking the shortest path. That is, the diffusion plates 20 and 21 are disposed at positions where the straight path connecting the electronic component 12 and the first vent 11 a is not blocked.

Next, FIG. 8 is a cross-sectional view showing convection in a transversely placed state of the electronic device casing according to the modification.
In this embodiment, the diffusion plate 22 is disposed at a position to block the shortest path connecting the first vent 11 a and the electronic component 12 in a straight line. If disposed in an unobstructed position, theoretically, a flow of air linearly moving from the electronic component 12 to the first vent 11a necessarily occurs, and the flow of the air contains a relatively large amount of heat, The heat quantity is directly transmitted to the first vent 11a. On the other hand, when disposed in the blocking position, the flow of air moving linearly from the electronic component 12 to the first vent 11a is blocked, and the flow of more air moves along the inner wall surface of the front face 10a. By facilitating the flow and releasing the heat via the wall material, the tendency of alleviating the temperature imbalance of the wall material of the front face 10a becomes strong.

  Whether the arrangement is to be interrupted or not may be determined as appropriate by actually forming both and measuring the temperature distribution or the like.

Focusing on the function of diffusing the flow of air, it is preferable to form the convex wall portions 20a and 21a instead of a simple plate like the diffusion plates 20 and 21.
FIGS. 9-11 is a schematic sectional drawing which shows the cross-sectional shape concerning the modification of the diffusion plate in the same viewpoint.
The cross-sectional shape of the diffusion plate 23 shown in FIG. 9 linearly projects from the side of the first vent 11a to the side of the electronic component 12, and then spreads outward, the cross section of the first vent 11a. It gradually recedes toward the side, and recedes toward the first vent 11 a by a linearly short distance at the outer peripheral end.

The cross-sectional shape of the diffusion plate 24 shown in FIG. 10 is a projecting shape having substantially the same shape when viewed from the electronic component 12 side, but the cross-sectional shape is a shape that is not lightened.
The cross-sectional shape of the diffusion plate 25 shown in FIG. 11 has a ring-shaped disc portion 25a having a positional relationship substantially parallel to the electronic component 12, and on the inner peripheral side, the inner diameter further narrows to the electronic component 12 side. A shape provided with an inner peripheral conical wall portion 25b formed obliquely so as to protrude toward the outer peripheral side of the disc portion 25a, and an outer peripheral conical wall portion 25c receding diagonally away from the electronic component 12 while widening the outer shape It has become.
In any of the shapes, it is common to form an inclined surface gradually receding from the electronic component 12 from the inside to the outside, and the air flow warmed by the electronic component 12 is the first vent 11a. It is easy to form an air flow that spreads outward from the

FIG. 12 is a cross-sectional view showing convection in a transversely placed state of the electronic device casing according to the modification.
When the wall surface of the front face 10a in which the first vent 11a is formed is used for heat radiation from the surface, it can be said that it is preferable to efficiently transmit heat along the wall surface as much as possible. In this example, a heat conductive member 30 having a high thermal conductivity such as copper foil or aluminum foil is attached to a portion on the back side of the wall surface of the front face 10a inside the first vent 11a. Of course, the thermal conductivity of the thermal conductive member 30 is higher than that of the wall surface on which the vent holes 11a and 11b are formed. The heat quantity of waste heat propagates quickly on the wall surface to which the heat conduction member 30 is attached, and the efficiency of the heat radiation from the housing 10 is better compared to the case without the heat conduction member 30. The heat conducting member 30 may be attached not only to the wall surface of the front surface 10a but also to the wall surface of the top surface 10c and the bottom surface 10d.

  Thus, the heat conducting member having a thermal conductivity higher than that of the wall surface where the vent is formed is disposed adjacent to the vent.

Needless to say, the present invention is not limited to the above embodiment. It goes without saying for those skilled in the art,
The first vent 11 a and the diffusion plate 20 have an annular shape, but the first vent 11 a and the diffuser plate 20 do not have to be annular, and may be polygonal or linear. It may be a continuous shape or a chain shape, or a net-like filter may be disposed to make it difficult for foreign substances other than air to enter.
Besides this,
・ Replacing mutually replaceable members, structures, etc. disclosed in the above-mentioned embodiment appropriately and changing the combination thereof ・ Although not disclosed in the above-mentioned embodiment, it is a known technique and the above-mentioned embodiment Appropriately replacing the members and configurations etc. which can be replaced with the members and configurations etc. disclosed in the above, and changing the combination thereof and applying it-although not disclosed in the above-mentioned embodiment, known techniques etc. Those skilled in the art can appropriately substitute the members and configurations etc. which can be assumed as substitutes for the members and configurations etc. disclosed in the above-mentioned embodiments on the basis of the above, and change and apply the combination thereof. As disclosed.

DESCRIPTION OF SYMBOLS 1 ... heat-emitting components, 2 ... exhaust port, 3 ... heat conduction member, 10 ... housing, 10 a ... front, 10 b ... back, 10 c ... top, 10 d ... bottom, 10 e ... left side, 10 f ... right side, 11 ... vent 11a: first vent, 11b: second vent, 12: electronic parts, 13: electronic substrate, 20-25: diffusion plate, 20a: convex wall, 21a: convex wall, 25a: Disc portion, 25b: Inner peripheral conical wall surface portion, 25c: Outer peripheral conical wall surface portion, 30: Heat conduction member.

Claims (11)

An electronic device case having an air vent for containing an electronic component and communicating the inside and the outside of the case with each other,
An electronic device case comprising: a diffusion plate disposed between the vent and the electronic component to diffuse convection toward the vent from the vicinity of the electronic component.   The vent has a first vent and a second vent, and the diffusion plate is disposed closer to the first vent than the second vent, from the vicinity of the electronic component The electronic device case according to claim 1, wherein the convection toward the first vent is diffused to guide at least a part to the second vent.   The electronic device casing has a plurality of side surfaces, and the first vent and the second vent are formed on adjacent sides, not opposite sides. The electronic device case according to claim 2, characterized in that:   4. The electronic device according to claim 3, wherein the electronic device casing can be installed with the first vent being a top surface and can be installed with the second vent being a top surface. Equipment housing.   The diffusion plate is a plate material, and the heights projecting to the side of the electronic component are different between a side close to the first vent and a side close to the second vent. An electronic device case according to any one of claims 2 to 4.   The electronic device casing according to any one of claims 2 to 5, wherein the diffusion plate is disposed at a position not blocking the linear path connecting the electronic component and the first vent.   The electronic device casing according to any one of claims 2 to 5, wherein the diffusion plate is disposed at a position where a straight path connecting the electronic component and the first vent is interrupted.   The electronic device housing according to any one of claims 1 to 7, wherein a heat conducting member having a thermal conductivity higher than a wall surface on which the vent is formed is disposed adjacent to the vent. body.   In the electronic device casing, in a state in which the second vent is disposed on the top surface, the second vent is also formed on the bottom to form a flow of air flowing from the bottom to the top. The electronic device case according to claim 4, characterized in that   10. The electronic device according to claim 9, wherein in the electronic device casing, a flow of air passing from the bottom surface to the top surface caused by the second vent formed on the top surface and the bottom surface causes a chimney effect. Equipment housing.   11. The electronic device casing according to claim 9, wherein the diffusion plate produces an effect of causing a flow of air flowing from the bottom surface to the top surface of the electronic device casing toward the side of the electronic component. .

Images