JP2019086275A - Equipment temperature controller - Google Patents

Abstract

To more stably control a temperature of target equipment.SOLUTION: An equipment temperature controller comprises a plurality of coolers 14, a condenser 16, an outgoing pipe 21 and a return pipe 22. The plurality of coolers 14 each has an inflow port 141 introducing, into an internal space of a body 143, working fluid flowing in the outgoing pipe 21, and a discharge port 142 discharging, to the return pipe 22, the working fluid evaporated in the body 143. The outgoing pipe 21 is arranged so that at least a part of liquid passage 21a formed by the outgoing pipe 21 is positioned higher than the inflow port 141 of the plurality of coolers 14.SELECTED DRAWING: Figure 4

Description

  BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a device temperature control apparatus that adjusts the temperature of a target device by phase change between a liquid phase and a gas phase of a working fluid.

  In recent years, a technology using thermosiphon as a device temperature control device for adjusting the temperature of an electric device such as a power storage device mounted on an electric vehicle such as an electric vehicle or a hybrid vehicle has been studied.

  In the device temperature control device described in Patent Document 1, when the battery is cooled, the working fluid inside the device heat exchanger absorbs heat from the battery, evaporates, and flows into the condenser through the gas phase passage. The liquid phase working fluid condensed by the condenser flows through the liquid phase passage into the equipment heat exchanger. As described above, the device temperature control device is configured to cool the battery by the phase change of the working fluid circulating in the thermosyphon circuit.

Unexamined-Japanese-Patent No. 2015-041418

  The inventors have found the following problems regarding the thermosiphon-type instrument temperature control apparatus as described in Patent Document 1. That is, the apparatus temperature control apparatus mounted in vehicles, such as a motor vehicle, becomes a structure which connected the several temperature control part by piping, in order to adjust temperature of object apparatuses, such as a secondary battery. In addition, when the device temperature control device is mounted on a vehicle such as a car, the device temperature control device may tilt along with the vehicle. For example, when the vehicle is moving up a hill, the front side in the traveling direction of the vehicle is positioned higher than the rear side in the vehicle traveling direction. And an apparatus temperature control apparatus will also be in the inclined state similarly to a vehicle.

  In this case, the working fluid of the device temperature control apparatus is concentrated in the lower temperature control unit among the plurality of temperature control units under the influence of gravity. That is, a sufficient working fluid may not be supplied to the higher temperature control unit among the plurality of temperature control units.

  On the other hand, when the device temperature control device is mounted on a vehicle such as a car, it is preferable to install an electric device such as a secondary battery and a temperature control unit on a flat surface. However, there may be a case where a flat space sufficient for installing the device temperature control device and the temperature control unit in the vehicle can not be secured.

  Even in such a case, the working fluid of the device temperature control apparatus is concentrated in the lower temperature control section among the plurality of temperature control sections under the influence of gravity. That is, a sufficient working fluid may not be supplied to the higher temperature control unit among the plurality of temperature control units.

  Therefore, there is a problem that supply of the working fluid to each temperature control part becomes unstable, and temperature control of an object apparatus becomes unstable.

  The present invention has been made in view of the above problems, and an object thereof is to enable temperature control of a target device to be realized more stably.

  In order to achieve the above object, the invention according to claim 1 has a circulation circuit (26) for circulating a working fluid, and a target device (12a, 12b) by a phase change between a liquid phase and a gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and, the plurality of coolers are each an outgoing pipe It has an inlet (141) for introducing the working fluid flowing into the internal space of the main body (143), and an outlet (142) for discharging the working fluid evaporated in the main body to the return pipe, and the forward pipe At least a part of the liquid passage formed by the forward piping is arranged higher than the inlets of the plurality of coolers.

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler by the forward piping, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In order to achieve the above object, the invention according to claim 4 has a circulation circuit (26) for circulating a working fluid, and a target device (12a, 12b) by a phase change between a liquid phase and a gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and, the plurality of coolers are each an outgoing pipe It has an inlet (141) for introducing the working fluid flowing into the internal space of the main body (143) and an outlet (142) for discharging the working fluid evaporated in the main body to the return pipe, and the inlets of the plurality of coolers At least one is disposed at a position higher than the lowermost end of the internal space of the main body.

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In order to achieve the above object, the invention according to claim 7 has a circulation circuit (26) for circulating a working fluid, and a target device (12a, 12b) by a phase change between a liquid phase and a gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and, the plurality of coolers are each an outgoing pipe It has an inlet (141) for introducing the working fluid flowing into the internal space of the main body (143) and an outlet (142) for discharging the working fluid evaporated in the main body to the return pipe, and the outgoing pipe has a plurality of coolers A convex portion pipe (214) disposed between an inlet of one of the first coolers and a first cooler of the plurality of coolers and an inlet of a different second cooler, At least a part of the liquid passage formed by the convex portion piping protrudes vertically above the inlet of the first cooler and the inlet of the second cooler.

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In order to achieve the above object, the invention according to claim 13 has a circulation circuit (26) for circulating a working fluid, and a target device (12a, 12b) by a phase change between a liquid phase and a gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and the plurality of coolers The inlet (141) for introducing the working fluid flowing into the inner space of the main body (143) and the outlet (142) for discharging the working fluid evaporated in the main body to the return path piping, It has convex part piping (215) connecting between the condenser outlet and the inlet of the cooler connected to the condenser among the plurality of coolers, and at least a part of the liquid passage formed by the convex part piping Has a convex portion pipe (215) projecting vertically upward above the condenser outlet of the condenser and the inlet of the cooler connected to the condenser.

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In order to achieve the above object, the invention according to claim 15 has a circulation circuit (26) for circulating the working fluid, and the target device (12a, 12b) is obtained by the phase change between the liquid phase and the gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and the plurality of coolers The inlet (141) for introducing the working fluid flowing into the inner space of the main body (143) and the outlet (144) for discharging the working fluid introduced to the main body, and the outgoing pipe includes one of the plurality of coolers A convex portion pipe (216) connecting between an outlet of one first cooler and a first cooler of the plurality of coolers and an inlet of a different second cooler; At least a part of the liquid passage formed by the convex portion pipe protrudes vertically above the outlet of the first cooler and the inlet of the second cooler.

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In order to achieve the above object, the invention according to claim 17 has a circulation circuit (26) for circulating a working fluid, and a target device (12a, 12b) by a phase change between a liquid phase and a gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and the plurality of coolers The inlet (141) for introducing the working fluid flowing into the inner space of the main body (143) and the outlet (144) for discharging the working fluid introduced to the main body, the inlet and outlet of the plurality of coolers At least one of which is disposed at a position higher than the lowermost end of the internal space of the main body.

  According to the above configuration, even when the plurality of coolers are inclined, at least one of the inlet and the outlet of the plurality of coolers is disposed at a position higher than the lowermost end of the internal space of the main body Therefore, a liquid storage portion is formed in the internal space of the main body of each cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In order to achieve the above object, the invention according to claim 20 has a circulation circuit (26) for circulating a working fluid, and a target device (12a, 12b) by a phase change between a liquid phase and a gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and the plurality of coolers And an outlet (142) for discharging the working fluid evaporated in the main body (143) to the return path piping, the plurality of coolers The low-stage cooler includes a low-stage cooler disposed at one height position, and a high-stage cooler disposed at a second height position higher than the first height position, and the forward piping is an inlet of the low-stage cooler High and low connection piping (217) connecting between the high stage cooler and the inlet of the high stage cooler, and at least a part of the liquid passage formed by the high and low connection piping is the inlet and high stage cooler of the low stage cooler It projects upward and downward from the inflow port of.

  According to the above configuration, even when the high-stage cooler is disposed at the second height position higher than the low-stage cooler, the liquid storage portion is formed in the internal space of the main body of the high-stage cooler by the convex piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In order to achieve the above object, the invention according to claim 21 has a circulation circuit (26) for circulating a working fluid, and a target device (12a, 12b) by a phase change between a liquid phase and a gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and the plurality of coolers And an outlet (144) for discharging the working fluid introduced into the main body (143), the plurality of coolers having the first height A low stage cooler disposed at a position and a high stage cooler disposed at a second height position higher than the first height position, wherein the forward piping includes an inlet and a high stage of the low stage cooler It has high and low connection piping (217) connecting with the outlet of the cooler, and at least a part of the liquid passage formed by the high and low connection piping is higher than the lowest end of the internal space of the main body of the high stage cooler Is located at a high position.

  According to the above configuration, even when the high-stage cooler is disposed at the second height position higher than the low-stage cooler, at least a part of the liquid passage formed by the high-low connection piping is high-stage cooling The liquid storage portion is formed in the inner space of the main body of the high stage cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Be liquid. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In order to achieve the above object, the invention according to claim 23 has a circulation circuit (26) for circulating a working fluid, and a target device (12a, 12b) by a phase change between a liquid phase and a gas phase of the working fluid. A plurality of coolers (14) included in the circulation circuit for heat exchange between the heat of the target equipment and the heat of the working fluid to cool the target equipment; And a condenser (16) for dissipating the heat of the working fluid evaporated by the cooler to condense the working fluid, and the working fluid contained in the circulation circuit and condensed in the condenser to a plurality of coolers A return pipe (21) forming a liquid passage (21a) to be supplied, and a return pipe (22a) included in a circulation circuit to form a gas passage (22a) for supplying a working fluid evaporated by a plurality of coolers to a condenser 22) and the plurality of coolers And an outlet (144) for discharging the working fluid introduced into the main body (143), the plurality of coolers having the first height A low stage cooler disposed at a position and a high stage cooler disposed at a second height position higher than the first height position, wherein the forward piping includes an inlet and a high stage of the low stage cooler It has high and low connection piping (217, 218) to connect with the outlet of the cooler, and at least a part of the liquid passage formed by the high and low connection piping is the inlet of the low stage cooler and the high stage cooler It projects above the outlet in the vertical direction.

  According to the above configuration, even when the high-stage cooler is disposed at the second height position higher than the low-stage cooler, the liquid storage portion is formed in the internal space of the main body of the high-stage cooler, The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In addition, the code | symbol in the parenthesis of each means described by this column and the claim shows correspondence with the specific means as described in embodiment mentioned later.

It is a schematic diagram which shows schematic structure of the apparatus temperature control apparatus of 1st Embodiment. It is a block diagram of the apparatus temperature control apparatus of 1st Embodiment. It is an exploded view of a cooler and a rechargeable battery of a 1st embodiment. It is the block diagram which showed the cooler and 1st Embodiment of 1st Embodiment. FIG. 5 is a cross-sectional view taken along the line V-V in FIG. 4; It is a figure showing the state of the apparatus temperature control apparatus in case the vehicle carrying the apparatus temperature control apparatus of 1st Embodiment is driving an upward slope. It is a figure showing the state of the apparatus temperature control apparatus in case the vehicle carrying the apparatus temperature control apparatus of 1st Embodiment is driving downhill. It is the block diagram which showed the cooler and secondary battery of 2nd Embodiment. FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG. It is the block diagram which showed the cooler and secondary battery of 3rd Embodiment. It is the block diagram which showed the cooler and secondary battery of 4th Embodiment. It is the block diagram which showed the cooler and secondary battery of 5th Embodiment. It is a figure showing the comparative example with respect to the cooler and secondary battery of 5th Embodiment. It is the block diagram which showed the cooler and secondary battery of 6th Embodiment. It is the block diagram which showed the cooler and secondary battery of 7th Embodiment. It is the block diagram which showed the cooler and secondary battery of 8th Embodiment. It is a figure showing the comparative example with respect to the cooler and secondary battery of 8th Embodiment. It is the block diagram which showed the cooler and secondary battery of 9th Embodiment. It is the block diagram which showed the cooler and secondary battery of 10th Embodiment. It is the block diagram which showed the cooler and secondary battery of 11th Embodiment. FIG. 16 is a configuration view showing a cooler according to a twelfth embodiment, and is a view showing a modified example of the VV sectional view in FIG. 4; It is a figure for demonstrating a modification. It is a figure for demonstrating a modification. It is the block diagram which showed the cooler and secondary battery of 13th Embodiment. FIG. 25 is a cross-sectional view taken along the line XXV-XXV in FIG. 24. It is the block diagram which showed the cooler and secondary battery of 13th Embodiment. It is a figure showing the flow of the refrigerant at the time of cooling of the object apparatus of the cooler of a 13th embodiment. It is the figure which showed the flow of the refrigerant | coolant at the time of warming-up of the object apparatus of the cooler of 14th Embodiment. FIG. 25 is a cross-sectional view taken along line XXIX-XXIX in FIG. 24. It is a figure showing the flow of the refrigerant at the time of cooling of the object apparatus of the cooler of a 14th embodiment. It is a figure showing the flow of the refrigerant at the time of cooling of the object apparatus of the cooler of a 14th embodiment. It is the figure which showed the flow of the refrigerant | coolant at the time of warming-up of the object apparatus of the cooler of 15th Embodiment. It is the block diagram which showed the cooler and secondary battery of 16th Embodiment. It is the block diagram which showed the cooler and secondary battery of 17th Embodiment. It is the block diagram which showed the cooler and secondary battery of 18th Embodiment. It is the block diagram which showed the cooler and secondary battery of 19th Embodiment. It is the block diagram which showed the cooler and secondary battery of 20th Embodiment. It is the block diagram which showed the cooler and secondary battery of 21st Embodiment. It is the block diagram which showed the cooler and secondary battery of 22nd Embodiment. It is the block diagram which showed the cooler and secondary battery of 23rd Embodiment. It is a top view of a heat source machine of a cooler of a 24th embodiment. It is a top view of a heat source machine of a cooler of a 24th embodiment. It is XXXXIII-XXXXIII sectional drawing in FIG. It is a top view of a heat source machine of a modification. It is XXXXV-XXXXV sectional drawing in FIG. It is the block diagram which showed the cooler and secondary battery of 25th Embodiment. It is the block diagram which showed the cooler and secondary battery of 26th Embodiment.

  Hereinafter, an embodiment of the present invention will be described based on the drawings. In the following embodiments, parts identical or equivalent to each other are denoted by the same reference numerals in the drawings in order to simplify the description.

First Embodiment
The apparatus temperature control apparatus which concerns on this embodiment is demonstrated using FIGS. 1-7. The device temperature control device 10 shown in FIG. 1 is mounted on a vehicle such as an electric vehicle or a hybrid vehicle. Then, in the present embodiment, the device temperature control device 10 cools the secondary batteries 12a and 12b mounted on the electric vehicle. That is, the objects to be cooled which the device temperature control apparatus 10 of the present embodiment is cooled are the secondary batteries 12a and 12b.

  In a vehicle equipped with the device temperature control device 10, the electric power stored in the power storage device including the secondary batteries 12a and 12b as main components is supplied to the electric motor via an inverter circuit or the like, whereby the vehicle travels. The secondary batteries 12a, 12b generate heat when outputting power to the electric motor via the inverter.

  Then, when the temperature of the secondary batteries 12a and 12b becomes excessively high, the deterioration of the battery cells 13 constituting the secondary batteries 12a and 12b is promoted, so that the output of the battery cells 13 and the self-heating are reduced. It is necessary to set restrictions on input.

  Therefore, in order to secure the output and input of the battery cell 13, a cooling device for maintaining the secondary batteries 12a and 12b at a predetermined temperature or lower is required.

  In addition, the battery temperature rises not only while the vehicle is traveling but also when it is parked in summer. In addition, although the power storage device is often arranged under the floor of the vehicle or under the trunk room, the amount of heat per unit time given to the secondary batteries 12a and 12b is small, but the battery temperature gradually rises by leaving for a long time .

  If the secondary batteries 12a and 12b are left in a high temperature state, the life of the secondary batteries 12a and 12b is significantly reduced. Therefore, the battery temperature is maintained at a low temperature by cooling the secondary batteries 12a and 12b even while the vehicle is left. Is desired.

  The secondary batteries 12a and 12b of the present embodiment are configured as a battery pack formed by stacking a plurality of battery cells 13 in the traveling direction of the vehicle, but if the temperature of each battery cell 13 varies, the battery cells 13 Deterioration is uneven and performance of the power storage device is degraded.

  This is because the input / output characteristics of the power storage device are determined in accordance with the characteristics of the most deteriorated battery cell 13. Therefore, in order to cause the power storage device to exhibit desired performance over a long period of time, temperature equalization for reducing temperature variations among the plurality of battery cells 13 is important.

  Also, as other cooling devices for cooling the secondary batteries 12a and 12b, air blowing with a blower, air cooling using a refrigeration cycle, water cooling, or direct refrigerant cooling has been generally used. The blower has only a low cooling capacity because it only blows the air in the room.

  Further, since the secondary batteries 12a and 12b are cooled by the sensible heat of air in the blowing by the blower, the temperature difference between the upstream and the downstream of the air flow becomes large, and the temperature variation among the battery cells 13 can not be sufficiently suppressed. .

  In the refrigeration cycle system, although the cooling capacity is high, since the heat exchange portion with the battery cell 13 is sensible heat cooling in either air cooling or water cooling, temperature variation among the battery cells 13 can not be sufficiently suppressed as well. Furthermore, it is not preferable to drive the compressor and the cooling fan of the refrigeration cycle while leaving the vehicle parked because it causes an increase in power consumption and noise.

  From these backgrounds, in the device temperature control apparatus 10 according to the present embodiment, a thermosyphon system is employed in which the secondary batteries 12a and 12b are cooled by natural convection of the refrigerant without using a compressor.

  Specifically, as shown in FIG. 1, the device temperature control device 10 includes a cooler 14, a condenser 16, a forward pipe 21, and a return pipe 22. The condenser 16, the forward pipe 21, the cooler 14 and the return pipe 22 are annularly connected to form a thermosyphon circuit 26 in which a refrigerant as a working fluid of the device temperature control apparatus 10 circulates.

  That is, the thermosiphon circuit 26 constitutes a thermosiphon that transfers heat by evaporation and condensation of the refrigerant. The thermosyphon circuit 26 is configured to be a loop-type thermosyphon in which a flow path through which the gas phase refrigerant flows and a flow path through which the liquid phase refrigerant flows are separated. The thermosiphon circuit 26 corresponds to a circulation circuit for circulating the working fluid.

  In each of the drawings, the arrow DR1 indicates the vertical direction, and in the arrow DR1, the upper arrow indicates the upper side in the vertical direction of the vehicle, and the lower arrow indicates the lower side in the vertical direction of the vehicle. An arrow DR2 indicates the longitudinal direction of the vehicle. An arrow DR3 indicates the vehicle width direction.

  A refrigerant is sealed and filled in the thermosyphon circuit 26 of the present embodiment. The thermosiphon circuit 26 is filled with the refrigerant. The refrigerant circulates through the thermosyphon circuit 26 by natural convection, and the device temperature adjusting device 10 adjusts the temperature of the secondary batteries 12a and 12b by the phase change between the liquid phase and the gas phase of the refrigerant. In detail, the secondary batteries 12a and 12b are cooled by the phase change of the refrigerant.

  The refrigerant filled in the thermosyphon circuit 26 is, for example, a fluorocarbon-based refrigerant such as HFO-1234yf or HFC-134a. Alternatively, various working fluids other than fluorocarbon-based refrigerants such as water and ammonia may be used as the refrigerant.

  As shown in FIG. 3, the cooler 14 is disposed between the secondary batteries 12 a and 12 b. The cooler 14 exchanges heat between the heat of the secondary batteries 12a and 12b and the heat of the refrigerant to cool the secondary batteries 12a and 12b. The cooler 14 has a main body 143 made of, for example, a metal having high thermal conductivity.

  As shown in FIG. 2, an inlet 141 and an outlet 142 are formed in the main body 143 of the cooler 14. The outlet 142 is disposed above the inlet 141 in the vertical direction.

  The liquid passage 21 a formed inside the forward piping 21 is connected to the main body 143 of the cooler 14. Therefore, when the refrigerant circulates in the thermosyphon circuit 26, the liquid-phase refrigerant in the liquid passage 21 a flows into the internal space of the main body 143 via the inflow port 141.

  The liquid passage 21 a is a flow path of a refrigerant that causes the liquid phase refrigerant to flow from the condenser 16 to the cooler 14. The outlet 142 of the cooler 14 is connected to the main body 143 of the cooler 14.

  Therefore, when the refrigerant circulates in the thermosyphon circuit 26, the gas phase refrigerant in the cooler 14 exits the gas passage 22a through the outlet 142. The gas passage 22 a is a refrigerant flow passage that causes the gas phase refrigerant to flow from the outlet 142 of the cooler 14 to the condenser 16.

  A liquid phase refrigerant with a relatively large specific gravity is accumulated below the main body 143 of the cooler 14, and a gas phase refrigerant with a relatively low specific gravity is accumulated above the main body 143 of the cooler 14. Therefore, the gas phase refrigerant in the main body 143 is exclusively discharged from the outlet 142 among the inlet 141 and the outlet 142.

  The condenser 16 is a heat exchanger that exchanges heat between the gas phase refrigerant and the heat receiving fluid in the condenser 16 to dissipate the heat from the refrigerant to the heat receiving fluid. Specifically, the gas phase refrigerant flows from the return pipe 22 into the condenser inlet 161 of the condenser 16, and the condenser 16 condenses the refrigerant by radiating heat from the refrigerant to the heat receiving fluid. The liquid-phase refrigerant condensed by the condenser 16 flows out of the condenser outlet 162.

  The heat receiving fluid which is heat-exchanged with the refrigerant in the condenser 16 is, for example, air outside the passenger compartment or water.

  The condenser 16 of the present embodiment is installed so as to be positioned above the cooler 14 in the vertical direction even when the vehicle traveling direction of the vehicle or the vehicle width direction is inclined with respect to the horizontal direction. There is.

  The condenser 16 is disposed above the cooler 14 in the vertical direction. In the present embodiment, the condenser 16 is housed in the front storage room or the trunk room. The front storage room is a room which is disposed on the front side in the vehicle traveling direction with respect to a vehicle compartment of the vehicle and stores a traveling engine and a traveling motor. The trunk room is a storage room which is disposed on the rear side in the vehicle traveling direction with respect to the vehicle compartment of the vehicle and stores luggage and the like.

  A return pipe 22 is connected to the upper part of the condenser 16 in the vertical direction. Specifically, the return line pipe 22 is connected to the condenser 16 above the forward line pipe 21 in the vertical direction.

  The device temperature control apparatus 10 according to the present embodiment has a configuration in which a large number of coolers 14 are connected by the forward pipe 21 and the return pipe 22 in order to adjust the temperature of the secondary batteries 12 a and 12 b mounted on the vehicle. There is. FIG. 4 shows a configuration in which four coolers 14A to 14D are connected by the forward pipe 21 and the return pipe 22 as the large number of coolers 14.

  The coolers 14A to 14D are respectively disposed between the secondary battery 12a and the secondary battery 12b. Each of the coolers 14A to 14D has an inlet 141 disposed at the lower portion of the main body 14 and an outlet 142 disposed above the inlet 141.

  The inflow port 141 is for flowing the liquid-phase refrigerant from the condenser 16 into the main body 143. The discharge port 142 is for discharging the gas phase refrigerant evaporated in the main body 143, and is disposed above the inflow port 141.

  Each cooler 14A-14D is connected in parallel with respect to the condenser 16. That is, the forward pipe 21 connects between the condenser outlet 162 of the condenser 16 and the inlet 141 of each of the coolers 14A to 14D. The forward pipe 21 distributes the liquid-phase refrigerant flowing out of the condenser outlet 162 of the condenser 16 to the respective coolers 14A to 14D. In each of the drawings, the liquid-phase refrigerant is indicated by dot hatching.

  The return pipe 22 is connected between the outlet 142 of each of the coolers 14A to 14D and the condenser inlet 161 of the condenser 16. The return pipe 22 collects the gas phase refrigerant discharged from the outlet 142 of each of the coolers 14A to 14D and supplies it to the condenser inlet 161 of the condenser 16.

  The forward pipe 21 includes a liquid phase connecting pipe 211 which forms a liquid passage 211a extending in the front-rear direction, and a connecting pipe 212 which connects between the inlet 141 of each of the coolers 14A to 14D and the liquid phase connecting pipe 211. Have.

  As shown in FIG. 5, the connection pipe 212 extends horizontally from the inlets 141 of the coolers 14A to 14D, and then turns upward and is connected to the liquid phase connection pipe 211.

  The forward pipe 21 is disposed such that at least a part of the liquid passage formed by the forward pipe 21 is at a position higher than the inflow ports 141 of the coolers 14A to 14D. More specifically, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D.

  Here, the charging of the refrigerant into the thermosyphon circuit 26 is performed in a state where the heat exchange between the secondary batteries 12a and 12b and the refrigerant is stopped. The filling amount of the refrigerant into the thermosyphon circuit 26 is set such that the liquid level in the main body 143 of the cooler 14 is an appropriate liquid level. Specifically, the refrigerant is filled in the thermosyphon circuit 26 so that the liquid level in the main body 143 of the cooler 14 becomes a predetermined target liquid level.

  The liquid phase connecting pipe 211 has a height equal to or higher than the target liquid level of the refrigerant in each of the coolers 14A to 14D when the thermosiphon circuit 26 is filled with the working fluid by the liquid path 211a formed by the liquid phase connecting pipe 211. Is located in

  Next, the operation of the device temperature control apparatus 10 will be described. FIG. 4 shows the case where the device temperature control apparatus 10 is in the horizontal state. The liquid phase refrigerant condensed in the condenser 16 flows from the condenser outlet 162 of the condenser 16 to the forward piping 21 by its own weight, and is distributed to the main bodies 143 of the respective coolers 14A to 14D from the inlets 141 of the respective coolers 14A to 14D. And stored in the body 143 of each of the coolers 14A-14D.

  The liquid phase refrigerant stored in the main body 143 of each of the coolers 14A to 14D is evaporated and vaporized by heat exchange with the secondary batteries 12a and 12b. In this process, the secondary batteries 12a and 12b are cooled by the latent heat of vaporization of the liquid phase refrigerant. Thereafter, the refrigerant in the vapor phase is discharged from the outlet 142 of the main body 143 of each of the coolers 14A to 14D. The gas phase refrigerant discharged from the outlet 142 of the main body 143 of each of the coolers 14A to 14D is collected in the return pipe 22, and then returns to the condenser 16 from the condenser inlet port 161 of the condenser 16.

  As described above, the flow of the refrigerant at the time of cooling the secondary batteries 12a and 12b is in the order of the condenser 16 → the outgoing pipe 21 → the main body 143 of each of the coolers 14A to 14D → the return pipe 22 → the condenser 16. That is, a looped flow path including the condenser 16 and the coolers 14A to 14D is formed.

  Next, the case where the vehicle equipped with the device temperature control device 10 is in the inclined state will be described with reference to FIGS. FIG. 6 shows a state where a vehicle in which the condenser 16 is disposed forward of the coolers 14A to 14D is traveling uphill.

  As shown in FIG. 6, even when each cooler 14A-14D is inclined, it is distributed to the main body 143 of each cooler 14A-14D from the condenser 16 through the forward piping 21 and the main body of each cooler 14A-14D It is stored in 143.

  In addition, the forward pipe 21 is disposed such that at least a part of the liquid passage formed by the forward pipe 21 is at a position higher than the inflow ports 141 of the coolers 14A to 14D. More specifically, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D.

  Therefore, even if the vehicle travels uphill or downhill and each cooler 14A-14D is inclined, a liquid storage portion is formed in the internal space of the main body 143 of each cooler 14A-14D, and this liquid storage portion Liquid phase refrigerant is stored. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed. In FIG. 6, the liquid level H of the liquid phase refrigerant stored in the internal space of the main body 143 of each of the coolers 14A to 14D is approximately the same as the height of the connection portion between the connection pipe 212 and the liquid phase connecting pipe 211. It represents a lost state.

  On the other hand, FIG. 7 shows a state where the vehicle having the condenser 16 disposed forward of the coolers 14A to 14D is traveling downhill.

  As shown in FIG. 7, even when each cooler 14A-14D is inclined, it is distributed to the main body 143 of each cooler 14A-14D from the condenser 16 through the forward piping 21 and the main body of each cooler 14A-14D It is stored in 143.

  In addition, the forward pipe 21 is disposed such that at least a part of the liquid passage 21a formed by the forward pipe 21 is at a position higher than the inflow ports 141 of the coolers 14A to 14D. More specifically, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D.

  Therefore, even when each cooler 14A-14D inclines, a liquid storage part is formed in the interior space of main part 143 of each cooler 14A-14D, and liquid phase refrigerant is stored by this liquid storage part. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed. In FIG. 7, the liquid level H of the liquid phase refrigerant stored in the internal space of the main body 143 of each of the coolers 14A to 14D is approximately the same as the height of the connection portion between the connection pipe 212 and the liquid phase connecting pipe 211. It represents a lost state.

  As described above, the device temperature control device 10 of the present embodiment includes the circulation circuit 26 that circulates the working fluid, and the temperature of the target devices 12a and 12b is determined by the phase change between the liquid phase and the gas phase of the working fluid. To adjust the Then, the plurality of coolers 14 included in the circulation circuit and performing heat exchange between the heat of the target device and the heat of the working fluid to cool the target device, and the heat of the working fluid included in the circulation circuit and evaporated by the cooler And a condenser 16 for radiating heat to condense the working fluid.

  Further, the forward pipe 21 is included in the circulation circuit and forms the liquid passage 21a for supplying the working fluid condensed in the condenser to the plurality of coolers, and the operation included in the circulation circuit and evaporated in the plurality of coolers And a return pipe 22 forming a gas passage 22a for supplying the fluid to the condenser. Each of the plurality of coolers has an inlet 141 for introducing the working fluid flowing in the forward piping into the internal space of the main body 143, and an outlet 142 for discharging the working fluid evaporated in the main body to the return piping. ing.

  The forward piping is arranged such that at least a part of the liquid passage formed by the forward piping is at a higher position than the inlets of the plurality of coolers.

  According to the configuration described above, even when the vehicle travels uphill or downhill and each of the coolers 14A to 14D inclines, a liquid storage portion is formed in the internal space of the main body 143 of each of the coolers 14A to 14D, The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In addition, the forward piping has a liquid phase connection pipe 211 which forms a liquid passage extending in the front-rear direction, and a connection pipe 212 which connects between the inlets of the plurality of coolers and the liquid phase connection pipe. . The liquid passage formed by the liquid phase connecting pipe is disposed at a position higher than the inlets of the plurality of coolers.

  As described above, the liquid passage formed by the liquid phase connection piping can be configured to be at a higher position than the inlets of the plurality of coolers.

  The liquid phase connection piping is disposed such that the liquid passage formed by the liquid phase connection piping is at a height higher than the target liquid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Is preferred.

  In the present embodiment, the liquid passage 211a formed by the liquid phase connecting pipe 211 is positioned higher than the inlets 141 of the coolers 14A to 14D for all the four coolers 14A to 14D. As a result, the liquid-phase refrigerant can be stably supplied to the four coolers 14A to 14D.

  However, the liquid passage 211a formed by the liquid phase connection pipe 211 does not necessarily have to be at a position higher than the inlets 141 of the respective coolers 14A to 14D for all the plurality of coolers 14. That is, the liquid passage 211 a formed by the liquid phase connection pipe 211 may be configured to be at a position equivalent to or lower than the inflow ports 141 of the plurality of coolers 14 with respect to a part of the plurality of coolers 14.

Second Embodiment
The apparatus temperature control apparatus which concerns on 2nd Embodiment is demonstrated using FIGS. 8-9. In the device temperature control apparatus 10 according to the first embodiment, the inlets 141 of the plurality of coolers 14 are disposed below the main body 143 of the cooler 14, and the forward piping 21 is more than the inlets 141 of the plurality of coolers 14. It is located high. On the other hand, in the device temperature control apparatus 10 of the present embodiment, the forward piping 21 and the inflow ports 141 of the plurality of coolers 14 are respectively higher than the lowermost end of the internal space of the main body 143 of each cooler 14A to 14D. It is different in that it is placed at the high position of.

  As shown in FIG. 9, the inlet 141 of each cooler 14A-14D is arrange | positioned in the height position higher than the lowest end of the interior space of the main body 143 of each cooler 14A-14D.

  At least a part of the liquid passage 21a formed by the forward pipe 21 is disposed at a position higher in height than the lowermost end of the internal space of the main body 143 of each of the coolers 14A to 14D.

  Specifically, the forward piping 21 is a connection that connects between the liquid phase connecting pipe 211 forming the liquid passage 211a extending in the front-rear direction, the inlet 141 of each of the coolers 14A to 14D, and the liquid phase connecting pipe 211. And a pipe 213.

  The liquid phase connection piping 211 is disposed at substantially the same height as the inlets 141 of the respective coolers 14A to 14D. Further, the connection pipe 213 is connected to the liquid phase connection pipe 211 so as to extend in the horizontal direction from the inlets 141 of the respective coolers 14A to 14D. And liquid passage 211a formed of liquid phase connecting piping 211 is arranged at a position higher in height than the lowest end of the internal space of main part 143 of each cooler 14A-14D.

  Therefore, even if the vehicle travels uphill or downhill and each cooler 14A-14D is inclined, a liquid storage portion is formed in the internal space of the main body 143 of each cooler 14A-14D, and this liquid storage portion Liquid phase refrigerant is stored. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed.

  Furthermore, the liquid phase connecting pipe 211 is a target liquid surface of the refrigerant in each of the coolers 14A to 14D when the liquid passage 211a formed by the liquid phase connecting pipe 211 is filled with the refrigerant in the thermosyphon circuit 26. It is arranged to be at a level above the proper liquid level.

  As described above, in the device temperature control apparatus 10 according to the present embodiment, the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the working fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe. And, at least one of the inlets of the plurality of coolers is disposed at a height higher than the lowermost end of the internal space of the main body.

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  Note that at least one of the inlets of the plurality of coolers is disposed at a height above the appropriate liquid level, which is the target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. Is preferred.

  Specifically, the forward piping has a liquid phase connection piping 211 that forms a liquid passage extending in the front-rear direction. The liquid phase connecting pipe is higher than the appropriate liquid level which is the target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase linking pipe is filled with the working fluid in the circulation circuit. Preferably, they are arranged to

Third Embodiment
An apparatus temperature control apparatus according to a third embodiment will be described with reference to FIG. The forward piping 21 of the device temperature control apparatus of the present embodiment has a convex portion piping 214 that forms the liquid passage 214a, and at least a portion of the liquid passage 214a is the first cooler of the plurality of coolers 14 It projects vertically above the inlet 141 of the second cooler 14 different from the inlet 141 of the first cooler 14 and the first cooler 14.

  The convex portion pipe 214 is disposed between the inlet 141 of the first cooler and the inlet 141 of the second cooler 14. A part of the liquid passage 214 a formed by the convex portion pipe 214 protrudes upward in the vertical direction with respect to the inflow port 141 of the first cooler and the inflow port 141 of the second cooler 14.

  That is, the liquid passage 214 a formed by the convex portion pipe 214 is between the inlet 141 of the first cooler 14 and the inlet 141 of the second cooler 14, and the inlet 141 of the first cooler and the second cooling. It has an inverted U-shape projecting upward in the vertical direction with respect to the inlet 141 of the vessel 14.

  The convex portion pipe 214 is provided between the inlet 141 of the cooler 14A and the inlet 141 of the cooler 14B, between the inlet 141 of the cooler 14B and the inlet 141 of the cooler 14C, and of the cooler 14C. It is disposed between the inlet 141 and the inlet 141 of the cooler 14D.

  Therefore, even if the vehicle travels uphill or downhill and each cooler 14A-14D is inclined, a liquid storage portion is formed in the internal space of the main body 143 of each cooler 14A-14D, and this liquid storage portion Liquid phase refrigerant is stored. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed.

  As described above, in the device temperature control apparatus 10 according to the present embodiment, the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe. Also, the forward piping is disposed between the inlet of the first cooler of one of the plurality of coolers and the inlet of the second cooler different from the first cooler of the plurality of coolers. It has a convex portion pipe 214. Then, at least a part of the liquid passage formed by the convex portion pipe protrudes vertically upward from the inflow port of the first cooler and the inflow port of the second cooler.

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  Preferably, the inlet of the first cooler and the inlet of the second cooler are positioned lower than the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. .

  In addition, in the convex portion pipe, at least a part of the liquid passage formed by the convex portion pipe is at a height higher than the target liquid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Preferably it is arranged.

  In addition, the forward piping forms a liquid passage extending in the front-rear direction, and the flow of the first liquid phase connecting piping connected to the inlet of the first cooler and a flow of the second cooler forming the liquid passage extending in the front-rear direction It has a second liquid phase connecting pipe connected to the inlet. The convex portion pipe is disposed between the first liquid phase connecting pipe and the second liquid phase connecting pipe.

  Thus, the projection piping is provided between the first liquid phase connecting pipe connected to the inlet of the first cooler and the second liquid phase connecting pipe connected to the inlet of the second cooler. be able to.

  Further, the convex portion piping is disposed on the upstream side of the fluid flow of the working fluid flowing inside the liquid phase connection piping 211 from the center of the inlet of the first cooler and the inlet of the second cooler.

  With such a configuration, the convex portion pipe is disposed downstream of the working fluid flow that flows inside the liquid phase connecting pipe rather than at the center of the inlet of the first cooler and the inlet of the second cooler. The flow rate of the working fluid stored in the cooler on the upstream side of the fluid flow of the working fluid from the projection piping can be increased as compared with the case of arranging.

Fourth Embodiment
An apparatus temperature control apparatus according to the fourth embodiment will be described with reference to FIG. In the device temperature control apparatus 10 according to the second embodiment, the target fluid of the refrigerant in each of the coolers 14A to 14D when the thermosiphon circuit 26 is filled with the refrigerant in the liquid passage 211a formed by the liquid phase connection pipe 211 It is arranged to be higher than the appropriate liquid level, which is the surface. On the other hand, in the device temperature control apparatus 10 according to the present embodiment, the liquid passage 211a formed by the liquid phase connection pipe 211 is positioned lower than the appropriate liquid level between the inlets 141 of the coolers 14A to 14D. It is configured.

  Specifically, a liquid passage 211a formed by the liquid phase connection pipe 211 is formed to be recessed downward in the vertical direction between the inlets 141 of the coolers 14A to 14D.

  As described above, the liquid passages 211 a formed by the liquid phase connection piping 211 may be formed to be recessed downward in the vertical direction between the inlets 141 of the coolers 14A to 14D.

Fifth Embodiment
The apparatus temperature control apparatus which concerns on 5th Embodiment is demonstrated using FIGS. 12-13. The forward piping 21 of the device temperature control apparatus 10 of the present embodiment has a convex piping 215 that forms the liquid passage 215a. The convex portion pipe 215 connects between the condenser outlet 162 of the condenser 16 and the inlet 141 of the cooler 14 of the plurality of coolers 14 connected to the condenser 16 and at least a part of the liquid passage 21 a. Form a liquid passage 215 a which protrudes vertically upward above the condenser outlet 162 of the condenser 16 and the inlet 141 of the cooler 14 connected to the condenser 16.

  Therefore, even when the vehicle is inclined such that the height of the condenser 16 is higher than that of the cooler 14A connected to the condenser 16, a liquid storage portion is formed in the internal space of the condenser 16, and this liquid storage portion Since the liquid phase refrigerant is stored, the liquid phase transfer from the condenser to the low stage cooler 14 is suppressed. Even when the vehicle is inclined so that the height of the condenser 16 is lower than that of the cooler 14A connected to the condenser 16, a liquid storage portion is formed in the internal space of the cooler 14A, and this liquid storage portion Liquid phase refrigerant is stored. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed.

  As shown in FIG. 13, when the projection piping 215 is not provided in the forward piping 21 of the device temperature control apparatus 10, the height of the condenser 16 is higher than that of the cooler 14 </ b> A connected to the condenser 16. When the vehicle is inclined as described above, the liquid refrigerant flows from the condenser 16 to the cooler 14A and further to the lower cooler. In addition, when the vehicle is inclined so that the height of the condenser 16 is lower than that of the cooler 14A connected to the condenser 16, the liquid refrigerant may flow from the cooler 14A to the condenser 16. For this reason, supply of the liquid phase refrigerant to cooler 14 becomes unstable, and temperature control of secondary batteries 12a and 12b will become unstable.

  As described above, in the device temperature control apparatus 10 according to the present embodiment, the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the working fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.

  In addition, the forward piping has a convex portion piping 215 that connects between the condenser outlet of the condenser and the inlet of the cooler connected to the condenser among the plurality of coolers. In addition, at least a part of the liquid passage formed by the convex portion piping protrudes vertically above the condenser outlet of the condenser and the inlet of the cooler connected to the condenser.

  According to the above configuration, even if the condenser and the plurality of coolers are inclined such that the condenser becomes lower or the condenser becomes higher, the convex piping connects each cooler or condenser A liquid storage portion is formed in the internal space of the main body, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In addition, in the convex portion pipe, at least a part of the liquid passage formed by the convex portion pipe is at a height equal to or higher than the target liquid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Preferably it is arranged.

Sixth Embodiment
An apparatus temperature control apparatus according to the sixth embodiment will be described with reference to FIG. In the device temperature control apparatus of the present embodiment, three coolers 14A to 14C are connected in series by the forward pipe 21. Each cooler 14 has an inlet 141 for introducing the liquid phase refrigerant into the internal space of the main body 143 and an outlet 144 for discharging the liquid phase refrigerant introduced to the main body 143.

  The inlet 141 of the cooler 14A is connected to the condenser outlet 162 of the condenser 16 via the forward pipe 21. Also, the forward piping 21 has an outlet 144 of one first cooler 14 of the plurality of coolers 14 and an inlet 141 of the second cooler 14 different from the first cooler 14 of the plurality of coolers 14. And a convex portion pipe 216 connecting the two. In the convex portion pipe 216, at least a part of the liquid passage 216a formed by the convex portion pipe 216 protrudes upward in the vertical direction from the outlet port 144 of the first cooler 14 and the inlet port 141 of the second cooler 14. There is.

  Specifically, the projection piping 216 is between the outlet 144 of the cooler 14A and the inlet 141 of the cooler 14B, and between the outlet 144 of the cooler 14B and the inlet 141 of the cooler 14C. It is arranged. The convex portion pipe 216 connects between the outlet 144 of the cooler 14A and the inlet 141 of the cooler 14B, and connects between the outlet 144 of the cooler 14B and the inlet 141 of the cooler 14C. ing.

  The convex portion pipe 216 forms a liquid passage 216a which protrudes upward in the vertical direction with respect to the outlet 144 of each of the coolers 14A to 14B and the inlet 141 of each of the coolers 14B to 14C.

  Therefore, even if each cooler 14A-14C inclines so that the vehicle travels uphill and the position of the cooler 14A becomes higher, the liquid storage portion is in the internal space of the main body 143 of each cooler 14A-14C. The liquid phase refrigerant is stored in the liquid storage portion. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed.

  In addition, when the coolers 14A to 14C are inclined such that the vehicle travels downhill and the position of the cooler 14A becomes lower, the liquid storage portion in the internal space of the main body 143 of each cooler 14B to 14C The liquid phase refrigerant is stored in the liquid storage portion. Thereby, the movement of the liquid phase refrigerant from the high order cooler 14 to the low order cooler 14 is suppressed.

  As described above, in the device temperature control apparatus 10 according to the present embodiment, the plurality of coolers are the inlet 141 for introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the operation introduced into the main body It has an outlet 144 through which the fluid flows out.

  In addition, the forward piping 21 connects between the outlet 144 of one first cooler of the plurality of coolers 14 and the inlet 141 of the second cooler different from the first cooler of the plurality of coolers 14. It has a convex portion pipe 216 to be connected.

  Further, in the convex portion pipe 216, at least a part of the liquid passage 216a formed by the convex portion pipe protrudes vertically above the outlet port 144 of the first cooler and the inlet port 141 of the second cooler. .

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase refrigerant is stored in the liquid storage portion . Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In addition, in the convex portion pipe, at least a part of the liquid passage formed by the convex portion pipe is at a height equal to or higher than the target liquid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Preferably it is arranged.

Seventh Embodiment
An apparatus temperature control apparatus according to a seventh embodiment will be described with reference to FIG. In the device temperature control apparatus of the present embodiment, three coolers 14A to 14C are connected in series by the forward pipe 21. Each cooler 14 has an inlet 141 for introducing the liquid phase refrigerant into the internal space of the main body 143 and an outlet 144 for discharging the liquid phase refrigerant introduced to the main body 143.

  The inlet 141 of the cooler 14A is connected to the condenser outlet 162 of the condenser 16 via the forward pipe 21.

  Further, at least a part of the liquid passage 21a formed by the forward piping 21 is disposed at a position higher in height than the lowermost end of the internal space of the main body 143 of each of the coolers 14A to 14D. There is.

  Specifically, the forward piping 21 has a liquid phase connecting piping 211 that forms a liquid passage 211 a extending in the front-rear direction.

  Further, the liquid phase connection pipe 211 is disposed at substantially the same height as the inlets 141 of the respective coolers 14A to 14D. Specifically, the liquid phase connecting pipe 211 is a target liquid of the refrigerant in each of the coolers 14A to 14D when the thermosiphon circuit 26 is filled with the liquid path 211a formed by the liquid phase connecting pipe 211. It is arranged to be higher than the appropriate liquid level, which is the surface.

  As described above, in the device temperature control device 10 of the present embodiment, the plurality of coolers are introduced into the inlet 141 and the main body 143 that introduce the working fluid flowing through the forward piping 21 into the internal space of the main body 143. It has an outlet 144 through which the working fluid flows out. And, at least one of the inlet 141 and the outlet 144 of the plurality of coolers is disposed at a position higher than the lowermost end of the internal space of the main body 143.

  According to the above configuration, even when the plurality of coolers are inclined, the liquid storage portion is formed in the internal space of the main body of each cooler, and the liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  Note that at least one of the inlets 141 and the outlets 144 of the plurality of coolers is higher than the appropriate liquid level, which is the target fluid level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is preferred that the

  Specifically, the forward piping has a liquid phase connection piping 211 that forms a liquid passage extending in the front-rear direction. The liquid phase connecting pipe is higher than the appropriate liquid level which is the target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase linking pipe is filled with the working fluid in the circulation circuit. Preferably, they are arranged to

Eighth Embodiment
The apparatus temperature control apparatus which concerns on 8th Embodiment is demonstrated using FIGS. 16-17. As shown in FIG. 16, the device temperature control device of the present embodiment is disposed at the second height position higher than the first height position and the low-stage coolers 14B to 14C disposed at the first height position. And a high-stage cooler 14A. In the device temperature control apparatus of the present embodiment, a plurality of coolers 14A to 14C are connected in series by the forward pipe 21 and the return pipe 22.

  Outgoing piping 21 connects high-low connection piping 217 connecting between the inlet 141 of low-stage cooler 14B and the outlet 144 of high-stage cooler 14A, the outlet 144 of low-stage cooler 14B, and the low-stage cooler And a convex portion pipe 216 connected to the inflow port 141 of 14 C.

  The high / low connection piping 217 is between the inlet 141 of the low-stage cooler 14B and the outlet 144 of the high-stage cooler 14A between the inlet 141 of the low-stage cooler 14B and the outlet 144 of the high-stage cooler 14A. Also, a liquid passage 217a that protrudes upward in the vertical direction is formed.

  In addition, the convex portion piping 216 is between the outlet 144 of the low-stage cooler 14B and the inlet of the low-stage cooler 14C between the outlet 144 of the low-stage cooler 14B and the inlet 141 of the low-stage cooler 14C. A liquid passage 216 a is formed to project upward in the vertical direction more than 141.

  As described above, the forward piping 21 has high-low connection piping 217 as high-low connection piping that connects between the inflow port 141 of the low-stage cooler 14B and the outflow port 144 of the high-stage cooler 14A. Then, at least a part of the liquid passage 217a formed by the high and low connection piping protrudes vertically above the inflow port 141 of the low stage cooler 14B and the outflow port 144 of the high stage cooler 14A.

  Therefore, even when the high-stage cooler 14A is disposed at the second height position higher than the low-stage coolers 14B to 14C in this manner, the liquid in the main body 143 of the high-stage cooler 14A by the high and low connection piping 217 A liquid storage portion for storing the phase refrigerant is formed, and the outflow of the liquid phase refrigerant from the high stage cooler 14A to the low stage coolers 14B to 14C is prevented.

  FIG. 17 shows a comparative example in which the high / low connection pipe 217 is not provided between the inlet 141 of the low-stage cooler 14B and the outlet 144 of the high-stage cooler 14A. In such a configuration, the liquid phase refrigerant to be stored in the main body 143 of the high stage cooler 14A flows into the low stage cooler 14B through the forward pipe 21 under the influence of gravity. That is, sufficient liquid phase refrigerant is not supplied to the high-stage cooler 14A disposed at the second height position higher than the first height position.

  However, as shown in FIG. 16, in the device temperature control apparatus of the present embodiment, the high and low connection piping 217 is disposed between the inlet 141 of the low stage cooler 14B and the outlet 144 of the high stage cooler 14A. It is done. The high-low connection piping 217 forms a liquid passage 217a which protrudes upward in the vertical direction with respect to the inflow port 141 of the low-stage cooler 14B and the outflow port 144 of the high-stage cooler 14A.

  Therefore, even when the high-stage cooler 14A is disposed at a second height position higher than the low-stage cooler 14B, the high-low connection piping 217 stores the liquid phase refrigerant inside the main body of the high-stage cooler 14A. A liquid storage portion to be liquid is formed, and the outflow of the liquid phase refrigerant from the high stage cooler 14A to the low stage cooler 14B can be prevented.

  Further, even if the low-stage cooler 14B and the low-stage cooler 14C are inclined due to the vehicle traveling uphill or downhill, the main pipe 143 for the low-stage cooler 14B and the low-stage cooler 14C by the convex portion pipe 216 A liquid storage portion is formed in the inner space of the liquid crystal, and the liquid phase refrigerant is stored in the liquid storage portion. Thereby, the movement of the liquid phase refrigerant between the low-stage cooler 14B and the low-stage cooler 14C is suppressed.

  As described above, in the device temperature control apparatus 10 according to the present embodiment, the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.

  Also, the plurality of coolers may include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position. In addition, the forward piping has high and low connection piping 217 that connects between the inlet of the low stage cooler and the outlet of the high stage cooler. In addition, at least a part of the liquid passage formed by the high and low connection piping 217 protrudes vertically above the inlet of the low stage cooler and the outlet of the high stage cooler.

  According to the configuration described above, even when the high-stage cooler is disposed at the second height position higher than the low-stage cooler, the liquid storage portion in the internal space of the main body of the high-stage cooler by the high / low connection piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

The ninth embodiment
An apparatus temperature control apparatus according to a ninth embodiment will be described with reference to FIG. The apparatus temperature control apparatus of this embodiment includes low-stage coolers 14B to 14C disposed at a first height position, and a high-stage cooler 14A disposed at a second height position higher than the first height position. ,have. In the device temperature control apparatus of the present embodiment, a plurality of coolers 14A to 14C are connected in series by the forward pipe 21 and the return pipe 22.

  Each of the coolers 14A to 14C has an inlet 141 for introducing the liquid phase refrigerant into the internal space of the main body 143 and an outlet 144 for discharging the liquid phase refrigerant introduced to the main body 143.

  The forward piping 21 has high-low connection piping 217 that connects between the inlets 141 of the low-stage coolers 14B to 14C and the outlet 144 of the high-stage cooler 14A. Then, at least a part of the liquid passage 217a formed by the high-low connection piping 217 is disposed at a position higher than the lowermost end of the internal space of the main body 143 of the high-stage cooler 14A.

  Specifically, at least a portion of the fluid passage 217a formed by the high and low connection piping 217 is a target fluid surface or more of the working fluid in the plurality of coolers 14 when the working fluid is filled in the circulation circuit. Is located at the height of the

  As described above, at least a part of the liquid passage 217a formed by the high and low connection piping 217 is disposed at a position higher in height than the lowermost end of the internal space of the main body 143 of the high stage cooler 14A.

  Therefore, even when the high-stage cooler 14A is disposed at the second height position higher than the low-stage coolers 14B to 14C in this manner, the liquid in the main body 143 of the high-stage cooler 14A by the high and low connection piping 217 A liquid storage portion for storing the phase refrigerant is formed, and the outflow of the liquid phase refrigerant from the high stage cooler 14A to the low stage coolers 14B to 14C is prevented.

  As described above, in the device temperature control device 10 according to the present embodiment, the plurality of coolers includes the low-stage cooler disposed at the first height position, and the second height higher than the first height position. And a high stage cooler disposed at a position. In addition, the forward piping 21 has high-low connection piping 217 that connects between the inlet of the low-stage cooler and the outlet of the high-stage cooler. And, at least a part of the liquid passage 217a formed by the high and low connection piping 217 is disposed at a position higher in height than the lowermost end of the internal space of the main body of the high stage cooler.

  According to the configuration described above, even when the high-stage cooler is disposed at the second height position higher than the low-stage cooler, the liquid storage portion in the internal space of the main body of the high-stage cooler by the high / low connection piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

  In addition, at least a part of the liquid passage formed by the high and low connection piping is disposed at a height higher than the appropriate liquid level which is the target liquid level of the working fluid in the plurality of coolers when the working circuit is filled in the circulation circuit. Is preferred.

Tenth Embodiment
An apparatus temperature control apparatus according to a tenth embodiment will be described with reference to FIG. In the device temperature control apparatus of the ninth embodiment, a plurality of coolers 14A to 14C are connected in series by the forward pipe 21 and the return pipe 22. On the other hand, in the device temperature control apparatus of the present embodiment, a plurality of coolers 14A to 14D are connected in parallel by the forward pipe 21 and the return pipe 22.

  The device temperature control device of the present embodiment includes the low-stage coolers 14C to 14D disposed at the first height position, and the high-stage coolers 14A to 14 disposed at the second height position higher than the first height position. And 14B.

  High-low connection piping 217 is disposed between low-stage cooler 14C disposed at the first height position and high-stage cooler 14B disposed at the second height position higher than the first height position. ing.

  The high-low connection piping 217 connects the inlet 141 of the low-stage cooler 14C and the inlet 141 of the high-stage cooler 14B, and also connects the inlet 141 of the low-stage cooler 14C and the high-stage cooler 14B. A liquid passage 217 a that protrudes upward in the vertical direction with respect to the inflow port 141 is formed.

  That is, the forward piping 21 has high-low connection piping 217 as high-low connection piping that connects between the inflow port 141 of the low-stage cooler 14C and the inflow port 141 of the high-stage cooler 14B. Then, at least a part of the liquid passage 217a formed by the high-low connection piping 217 protrudes vertically above the inflow port 141 of the low-stage cooler 14C and the inflow port 141 of the high-stage cooler 14B.

  Therefore, even when the high stage cooler 14B is disposed at the second height position higher than the low stage cooler 14C, the interior of the main body of the high stage cooler 14B and the high stage cooler 14A by the high and low connection piping 217 A liquid storage portion for storing liquid phase refrigerant is formed in the space, and the outflow of liquid phase refrigerant from the high stage coolers 14A to 14B to the low stage coolers 14C to 14D is prevented.

  Further, the high and low connection piping 217 is a target liquid surface of the liquid phase refrigerant in the plurality of coolers 14 when the thermosiphon circuit 26 is filled with the refrigerant at least a part of the liquid passage 217a formed by the high and low connection piping 217 It is arranged to have the above height.

  As described above, in the device temperature control apparatus 10 according to the present embodiment, the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the working fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.

  The plurality of coolers also include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position. In addition, the forward piping has high-low connection piping 217 that connects between the inlet of the low-stage cooler and the inlet of the high-stage cooler. In addition, at least a part of the liquid passage formed by the high and low connection piping 217 protrudes vertically above the inlet of the low-stage cooler and the inlet of the high-stage cooler.

  According to the configuration described above, even when the high-stage cooler is disposed at the second height position higher than the low-stage cooler, the liquid storage portion in the internal space of the main body of the high-stage cooler by the high / low connection piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

Eleventh Embodiment
An apparatus temperature control apparatus according to an eleventh embodiment will be described with reference to FIG. The apparatus temperature control apparatus according to the tenth embodiment includes the low stage cooler 14C disposed at the first height position and the high stage cooler 14B disposed at the second height position higher than the first height position. High-low connection piping 217 was disposed between them.

  On the other hand, the forward piping 21 of the device temperature control apparatus of the present embodiment includes the lower pipe 219 connecting between the respective inlets 141 of the low stage coolers 14C to 14D, and the high stage coolers 14A to 14B. High and low connection pipes 218 connecting between the inflow ports 141;

  The device temperature control apparatus 10 according to the present embodiment includes the low-stage coolers 14C to 14D disposed at the first height position, and the high-stage cooler 14A disposed at the second height position higher than the first height position. And 14B. Each inflow port 141 of high stage coolers 14A-14B is arranged at the lower part of body 143.

  The low point piping 219 forms a liquid passage 219a connecting between the respective inlets 141 of the low stage coolers 14C to 14D. The high / low connection piping 218 connects between the respective inlets 141 of the high stage coolers 14A to 14B, and connects between the respective inlets 141 of the high stage coolers 14A to 14B and the low place piping 219. Form

  In the high-low connection piping 218, a portion of the liquid passage 218a formed by the high-low connection piping 218 is higher in height than the inlet 141 of the high-stage cooler 14 and the inlet 141 of the low-stage cooler 14C. The passage 218a is formed.

  That is, the forward piping 21 has high-low connection piping 218 as high-low connection piping that connects between the inflow port 141 of the low-stage cooler 14C and the inflow port 141 of the high-stage cooler 14B. Further, a part of the liquid passage 218a formed by the high and low connection piping 218 is configured to be higher in height than the inflow port 141 of the low-stage cooler 14C and the inflow port 141 of the high-stage cooler 14B.

  Therefore, even if the high stage coolers 14A to 14B are arranged at the second height position higher than the low stage coolers 14C to 14D in this manner, the high / low connection piping 218 causes the main body 143 of the high stage coolers 14A to 14B. The liquid storage part which stores liquid phase refrigerant is formed in the inside of, and the outflow of the liquid phase refrigerant from high stage coolers 14A-14B to low stage coolers 14C-14D is prevented.

  As described above, in the device temperature control apparatus 10 according to the present embodiment, the plurality of coolers are operated by introducing the working fluid flowing in the forward piping into the internal space of the main body 143 and the evaporation of the working fluid at the main body It has an outlet 142 for discharging the fluid to the return pipe.

  The plurality of coolers also include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position. In addition, the forward piping has high-low connection piping 218 that connects between the inlet of the low-stage cooler and the inlet of the high-stage cooler. In addition, at least a part of the liquid passage formed by the high and low connection piping 218 protrudes vertically above the inlet of the low stage cooler and the inlet of the high stage cooler.

  According to the configuration described above, even when the high-stage cooler is disposed at the second height position higher than the low-stage cooler, the liquid storage portion in the internal space of the main body of the high-stage cooler by the high / low connection piping The liquid phase refrigerant is stored in the liquid storage portion. Therefore, the movement of the liquid-phase refrigerant from the high order cooler to the low order cooler is suppressed, and the temperature adjustment of the target device can be realized more stably.

(Twelfth embodiment)
An apparatus temperature control apparatus according to a twelfth embodiment will be described with reference to FIG. In the second embodiment, the liquid phase connection pipe 211 is disposed at substantially the same height as the inlets 141 of the coolers 14A to 14D, and the connection pipe 213 is the inlet 141 of the coolers 14A to 14D. Is connected to the liquid phase connecting pipe 211 so as to extend in the horizontal direction.

  On the other hand, the connection piping 213 of the present embodiment is bent such that the intermediate portion between the inlets 141 of the coolers 14A to 14D and the liquid phase connection piping 211 is lowered downward.

  As a result, the flow of the liquid refrigerant flowing in the liquid passage 211a formed by the liquid phase connection pipe 211 is directed downward, and it is easy to flow into the main body 143 from the inlets 141 of the respective coolers 14A to 14D. It becomes possible.

(13th Embodiment)
An apparatus temperature control apparatus according to a thirteenth embodiment will be described with reference to FIGS. 24 to 27. The device temperature control device of the present embodiment differs from the device temperature control device of the first embodiment in that it has a function of warming up a target device.

  Each of the coolers 14A to 14D of the present embodiment includes a heating outlet 145 for flowing out to heat the refrigerant introduced into the internal space of the main body 143, and a refrigerant flowing out of the heating outlet 145 for the main body 143. And a heating inlet 146 introduced into the internal space. The heating inlet 146 is disposed above the heating outlet 145 in the vertical direction.

  The heating outlet 145 and the heating inlet 146 are formed on the surface of the main body 143 opposite to the surface on which the inlet 141 and the outlet 142 are formed.

  Further, between the heating outlet 145 and the heating inlet 146, a warming-up pipe 40 for connecting the heating outlet 145 and the heating inlet 146 is provided. The warming-up pipe 40 introduces the refrigerant flowing out of the heating outlet 145 into the heating inlet 146.

  Further, the heating pipe 30 is provided with a heating source 30 for heating the liquid-phase refrigerant introduced into the warming pipe 40. The heating source 30 is constituted by a PTC (Positive Temperature Coefficient) heater.

  The heating source 30 is disposed at a position away from the main body 143. The heating source 30 is disposed below the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14 in the vertical direction. In order to efficiently heat the liquid-phase refrigerant introduced into the warming-up pipe 40, at least a portion of the heating source 30 is from the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14. It is preferable to arrange the heating source 30 so as to be located on the lower side in the vertical direction.

  Moreover, the device temperature control apparatus of this embodiment is equipped with the valve | bulb 50 which opens and closes the liquid path 21a formed of the outgoing path piping 21 as shown in FIG.

  When the target device is cooled, the heating source 30 is controlled to be turned off, and the valve 50 is controlled to open the liquid passage formed by the forward pipe 21. Then, as shown in FIG. 26, the liquid refrigerant supplied from the condenser 16 flows into the internal space of the main body 143 through the forward pipe 21 and the connection pipe 212.

  Here, the liquid refrigerant that has flowed into the internal space of the main body 143 receives heat from the high temperature batteries 12a and 12b, and moves upward in the vertical direction while being evaporated and vaporized. In this process, the batteries 12a, 12b are cooled. The vaporized gas phase refrigerant passes through the return pipe 22 and flows into the condenser 16. At this time, the liquid refrigerant also flows into the warming-up pipe 40, but the evaporation of the liquid refrigerant is not performed inside the warming-up pipe 40 because the heating source 30 is off. There is almost no refrigerant flow.

  On the other hand, when the target device is warmed up, the heating source 30 is controlled to be turned on, and the valve 50 is controlled to close the liquid passage formed by the forward piping 21. As shown in FIG. 27, the liquid refrigerant introduced into the warming-up pipe 40 is heated by the heating source 30, evaporated and vaporized, moves upward in the vertical direction, and is introduced into the internal space of the main body 143 from the heating inlet 146 Be done. In this process, the battery is heated.

  The refrigerant that has dissipated heat in the main body 143 moves downward, turns into liquid refrigerant, and flows into the warming up pipe 40 again. At this time, since the valve 50 is controlled to close the liquid passage formed by the forward pipe 21, the refrigerant flow in the forward pipe 21 and the return pipe 22 hardly occurs.

  As described above, each of the plurality of coolers 14A to 14D has the heating outlet 145 for flowing out to heat the refrigerant introduced into the internal space of the main body 143, and the heating outlet 145 above the heating outlet. And a heating inlet 146 for introducing the refrigerant flowing out from the heating outlet into the internal space of the main body 143.

  Further, between the heating outlet 145 and the heating inlet 146, a warming-up pipe 40 for introducing the refrigerant flowing out from the heating outlet 145 to the heating inlet 146 is provided. Furthermore, the heating pipe 30 is provided with a heating source 30 for heating the liquid-phase refrigerant introduced into the heating pipe 40. Then, the refrigerant heated by the heating source 30 is introduced into the internal space of the main body 143 from the heating inlet 146 through the warming up pipe 40. Thus, the refrigerant can be heated by the heat source 30 to warm up the target device.

  In the present embodiment, the PTC heater constitutes the heating source 30. However, for example, an electric heater other than a PTC heater, a hot water heat exchanger, a radiator of a refrigeration cycle, a thermoelectric element such as a Peltier element, SMR (System Main Relay) The heating source 30 can also be configured by a method such as

Fourteenth Embodiment
An apparatus temperature control apparatus according to a fourteenth embodiment will be described with reference to FIGS. 28 to 31. The present embodiment differs from the device temperature control apparatus shown in FIG. 2 in that it has a function of warming up the target device.

  The device temperature control apparatus according to the present embodiment heats the liquid phase refrigerant introduced into the interior of the warm-up pipe 41 and the warm-up pipe 41 connecting the forward pipe 21 and the return pipe 22. And a source 30. The heating source 30 is disposed such that at least a portion thereof is positioned vertically below the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14.

  Moreover, the device temperature control apparatus of this embodiment is equipped with the valve | bulb 50 which opens and closes the liquid passage formed of the outgoing path piping 21 as shown in FIG.

  When the target device is cooled, the heating source 30 is controlled to be turned off, and the valve 50 shown in FIG. 24 is controlled to open the liquid passage formed by the forward piping 21. As shown in FIG. 30, the liquid refrigerant supplied from the condenser 16 flows into the internal space of the main body 143 through the forward pipe 21 and the connection pipe 212. Here, the liquid refrigerant that has flowed into the internal space of the main body 143 receives heat from the high temperature batteries 12a and 12b, and moves upward in the vertical direction while being evaporated and vaporized. In this process, the batteries 12a, 12b are cooled. The gas phase refrigerant flows into the condenser 16 through the return pipe 22.

  On the other hand, when the target device is warmed up, the heating source 30 is controlled to be turned on, and the valve 50 is controlled to close the liquid passage formed by the forward piping 21. Then, as shown in FIG. 31, the liquid refrigerant introduced into the warming-up pipe 41 is heated by the heating source 30 and moves upward in the vertical direction while being evaporated and vaporized, and is discharged from the discharge port 142 to the internal space of the main body 143 be introduced. In this process, the batteries 12a, 12b are heated. The refrigerant that has dissipated heat in the main body 143 moves downward, becomes liquid refrigerant, and again flows out from the inflow port 141 to the forward pipe 21. At this time, since the valve 50 is controlled to close the liquid passage formed by the forward pipe 21, the refrigerant flow in the forward pipe 21 and the return pipe 22 hardly occurs.

  As described above, the refrigerant can be heated by the heating source 30 to warm up the target device.

(Fifteenth embodiment)
An apparatus temperature control apparatus according to a fifteenth embodiment will be described with reference to FIG. The apparatus temperature control apparatus of this embodiment differs in that the apparatus temperature control apparatus shown in FIG. 14 has a function of warming up the target apparatus.

  In the device temperature control apparatus of the present embodiment, three coolers 14A to 14C are connected in series by the forward pipe 21. Further, among the three coolers 14A to 14C, the cooler 14C disposed at a position farthest from the condenser 16 is a heating outlet for causing the refrigerant introduced into the internal space of the main body 143 to flow out in order to heat it. And a heating inlet 146 for introducing the refrigerant flowing out of the heating outlet 145 into the internal space of the main body 143. The heating inlet 146 is disposed above the heating outlet 145 in the vertical direction.

  In addition, between the heating outlet 145 and the heating inlet 146 in the cooler 14C, a warming-up pipe 40 for introducing the refrigerant flowing out from the heating outlet 145 to the heating inlet 146 is provided. There is. Further, the heating pipe 30 is provided with a heating source 30 for heating the liquid-phase refrigerant introduced into the warming pipe 40.

  Moreover, the device temperature control apparatus of this embodiment is equipped with the valve | bulb 50 which opens and closes the liquid passage formed of the outgoing path piping 21 as shown in FIG.

  When the target device is warmed up, the heating source 30 is controlled to be turned on, and the valve 50 shown in FIG. 24 is controlled to close the liquid passage formed by the forward piping 21. The liquid refrigerant introduced from the internal space of the main body 143 of the cooler 14C through the heating outlet 145 into the warming-up pipe 40 is heated by the heating source 30, and moves upward in the vertical direction while being vaporized and vaporized. It is introduced from the heating inlet 146 into the internal space of the main body 143 of the cooler 14C. In this process, the batteries 12a and 12b disposed on both sides of the cooler 14C are heated.

  Further, the refrigerant introduced into the internal space of the main body 143 of the cooler 14C moves downward and becomes a liquid refrigerant and is introduced from the heating outlet 145 into the warming up pipe 40. Further, part of the refrigerant introduced into the internal space of the main body 143 of the cooler 14C is introduced into the internal space of the main body 143 of the cooler 14B through the return pipe 22. As a result, the batteries 12a and 12b disposed on both sides of the cooler 14B are heated.

  Furthermore, a part of the refrigerant introduced into the internal space of the main body 143 of the cooler 14B is introduced into the internal space of the main body 143 of the cooler 14A through the return pipe 22. As a result, the batteries 12a and 12b disposed on both sides of the cooler 14A are heated.

  At this time, since the valve 50 is controlled to close the liquid passage formed by the forward pipe 21, the refrigerant flow in the forward pipe 21 and the return pipe 22 hardly occurs.

  As described above, the refrigerant can be heated by the heating source 30 to warm up the target device.

Sixteenth Embodiment
An apparatus temperature control apparatus according to a sixteenth embodiment will be described with reference to FIG. In the device temperature control apparatus of the fifteenth embodiment, the coolers 14A to 14C are connected by the convex portion pipe 216. On the other hand, in the device temperature control apparatus of the present embodiment, the coolers 14A to 14C are connected by the liquid phase connecting pipe 211.

  The warming pipe 40 is disposed between the heat outlet 145 of the cooler 14 C and the heating inlet 146, and the liquid introduced into the warming pipe 40 into the warming pipe 40. The heat source 30 for heating the phase refrigerant is provided as in the fifteenth embodiment.

  As described above, even in the configuration in which the liquid phase connection pipe 211 is disposed between the coolers 14A to 14C, the function of warming up the target device can be provided.

(Seventeenth embodiment)
An apparatus temperature control apparatus according to a seventeenth embodiment will be described with reference to FIG. As shown in FIG. 34, the device temperature control device of the present embodiment is disposed at the second height position higher than the first height position and the low-stage coolers 14B to 14C disposed at the first height position. And a high-stage cooler 14A. Further, high and low connection pipes 217 are disposed between the inlet 141 of the low-stage cooler 14B and the outlet 144 of the high-stage cooler 14A.

  The warming pipe 40 is disposed between the heat outlet 145 of the cooler 14 C and the heating inlet 146, and the liquid introduced into the warming pipe 40 into the warming pipe 40. The heat source 30 for heating the phase refrigerant is provided as in the fifteenth embodiment.

  Moreover, the device temperature control apparatus of this embodiment is equipped with the valve | bulb 50 which opens and closes the liquid passage formed of the outgoing path piping 21 as shown in FIG.

  Thus, the low stage coolers 14B to 14C disposed at the first height position and the high stage cooler 14A disposed at the second height position higher than the first height position are provided. The configuration can also have a function of warming up the target device.

Eighteenth Embodiment
An apparatus temperature control apparatus according to an eighteenth embodiment will be described with reference to FIG. As shown in FIG. 35, the device temperature control device of the present embodiment is disposed at the second height position higher than the first height position and the low-stage coolers 14B to 14C disposed at the first height position. And a high-stage cooler 14A. In addition, the forward piping 21 has high-low connection piping 217 that connects between the inflow ports 141 of the low-stage coolers 14B to 14C and the outflow port 144 of the high-stage cooler 14A. Then, at least a part of the liquid passage 217a formed by the high-low connection piping 217 is disposed at a position higher than the lowermost end of the internal space of the main body 143 of the high-stage cooler 14A.

  The warming pipe 40 is disposed between the heating outlet 145 and the heating inlet 146 of the cooler 14C, and the liquid introduced into the warming pipe 40 into the warming pipe 40. The heat source 30 for heating the phase refrigerant is provided as in the fifteenth embodiment.

  Moreover, the device temperature control apparatus of this embodiment is equipped with the valve | bulb 50 which opens and closes the liquid passage formed of the outgoing path piping 21 as shown in FIG.

  Thus, the low stage coolers 14B to 14C disposed at the first height position and the high stage cooler 14A disposed at the second height position higher than the first height position are provided. The configuration can also have a function of warming up the target device.

Nineteenth Embodiment
An apparatus temperature control apparatus according to a nineteenth embodiment will be described with reference to FIG. In the device temperature control apparatus of the present embodiment, the respective coolers 14A to 14D are connected in parallel to the condenser 16 similarly to the device temperature control apparatus shown in FIG. 4. That is, the forward pipe 21 connects between the condenser outlet 162 of the condenser 16 and the inlet 141 of each of the coolers 14A to 14D.

  In addition, the forward pipe 21 is disposed such that at least a part of the liquid passage formed by the forward pipe 21 is at a position higher than the inflow ports 141 of the coolers 14A to 14D. More specifically, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D.

  Further, a heating source 30 for heating the refrigerant introduced into the forward pipe 21 is provided in the forward pipe 21 between the condenser 16 and the cooler 14A. The heating source 30 is disposed below the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14 in the vertical direction. Specifically, the heating source 30 is disposed such that a part of the heating source 30 is positioned below the liquid surface of the liquid refrigerant in the main body 143 of the cooler 14 in the vertical direction.

  Further, the device temperature control apparatus of the present embodiment includes the forward pipe 21 between the valve 50 and the cooler 14A, and the vapor-phase liquid phase communication pipe 42 for connecting the condenser 16 and the cooler 14D. There is.

  Moreover, the device temperature control apparatus of this embodiment is equipped with the valve | bulb 50 which opens and closes the liquid passage formed of the outgoing path piping 21. As shown in FIG.

  When the target device is cooled, the heating source 30 is controlled to be turned off, and the valve 50 is controlled to open the liquid passage formed by the forward pipe 21. The liquid refrigerant supplied from the condenser 16 passes through the forward pipe 21 and flows into the internal space of the coolers 14A to 14D. Since the internal pressure of the return pipe 22 is higher than the internal pressure of the forward pipe 21, the liquid refrigerant supplied from the condenser 16 hardly flows to the return pipe 22 side. Here, the liquid refrigerant that has flowed into the internal space of the main body 143 receives heat from the high temperature batteries 12a and 12b, and moves upward in the vertical direction while being evaporated and vaporized. In this process, the batteries 12a, 12b are cooled. The gas phase refrigerant flows into the condenser 16 through the return pipe 22.

  On the other hand, when the target device is warmed up, the heating source 30 is controlled to be turned on, and the valve 50 is controlled to close the liquid passage formed by the forward piping 21. The liquid refrigerant introduced from the condenser 16 to the forward pipe 21 is heated by the heating source 30, moves upward and downward while being evaporated and vaporized, and passes through the vapor phase liquid phase communication pipe 42 and the return pipe 22 to be a cooler It introduce | transduces into the interior space of each main body 143 from the discharge port 142 of 14A-14D. In this process, the batteries 12a, 12b are heated. The refrigerant that has dissipated heat in the main body 143 moves downward, becomes liquid refrigerant, and again flows out from the inflow port 141 to the forward pipe 21. Then, the liquid refrigerant introduced into the forward piping 21 is again heated by the heating source 30.

(Twentieth embodiment)
An apparatus temperature control system according to the twentieth embodiment will be described with reference to FIG. The apparatus temperature control apparatus of the nineteenth embodiment includes the forward pipe 21 between the valve 50 and the cooler 14A, and the vapor-phase liquid phase communication pipe 42 for connecting the condenser 16 and the cooler 14D. There is. On the other hand, in the device temperature control apparatus of the present embodiment, the forward pipe 21 between the valve 50 and the cooler 14D, and the vapor phase liquid phase communication pipe 42 connecting between the condenser 16 and the cooler 14A. Have.

  Note that the heat source 30 is provided in the forward piping 21 between the condenser 16 and the cooler 14A, the outward piping 21 between the valve 50 and the cooler 14A, the condenser 16 and the cooler 14D, and the like. The third embodiment is the same as the nineteenth embodiment in that a vapor phase liquid phase communication pipe 42 for connecting the two is provided.

  As described above, even in the configuration provided with the forward path piping 21 between the valve 50 and the cooler 14D, and the vapor phase liquid phase communication piping 42 connecting the condenser 16 and the cooler 14A, the target device is warmed up. You can have the ability to play.

(Twenty-first embodiment)
An apparatus temperature control apparatus according to a twenty first embodiment will be described with reference to FIG. In the twentieth embodiment, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connection piping 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D, and the liquid phase connection is performed. The pipe 211 is arranged to extend linearly in the longitudinal direction of the vehicle.

  On the other hand, in the device temperature control apparatus of the present embodiment, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the coolers 14A to 14D. And the forward pipe 21 is partially arranged to be recessed downward in the vertical direction.

  Note that the heat source 30 is provided in the forward piping 21 between the condenser 16 and the cooler 14A, the outward piping 21 between the valve 50 and the cooler 14A, the condenser 16 and the cooler 14D, and the like. Is the same as the twentieth embodiment in that a vapor phase liquid phase communication pipe 42 for connecting the two is provided.

  Thus, the forward piping 21 is disposed such that the liquid passage 211a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the respective coolers 14A to 14D, and part of the forward piping 21 is Even in the configuration arranged to be recessed downward in the vertical direction, it is possible to have the function of warming up the target device.

(Twenty-second embodiment)
An apparatus temperature control apparatus according to a twenty-second embodiment will be described with reference to FIG. The apparatus temperature control apparatus of this embodiment is provided with a vapor phase liquid phase communication pipe 43 connecting the inflow port 141 of the cooler 14D and the return path pipe 22. Further, the vapor phase liquid phase communication pipe 43 is provided with a heating source 30 for heating the refrigerant introduced into the vapor phase liquid phase communication pipe 43.

  As described above, the heating source 30 may be provided in the vapor-phase liquid phase communication pipe 43 connecting between the inflow port 141 of the cooler 14D and the return pipe 22.

(Twenty-third embodiment)
An apparatus temperature control apparatus according to a twenty-third embodiment will be described with reference to FIG. The device temperature control apparatus of the present embodiment includes a vapor-phase liquid phase communication pipe 44 connecting between the inflow port 141 of the cooler 14A and the return path pipe 22. Further, the vapor phase liquid phase communication pipe 44 is provided with a heating source 30 for heating the refrigerant introduced into the vapor phase liquid phase communication pipe 44.

  As described above, the heating source 30 may be provided in the vapor-phase liquid phase communication pipe 44 connecting between the inflow port 141 of the cooler 14A and the return pipe 22.

(Twenty-fourth embodiment)
An apparatus temperature control unit according to a twenty-fourth embodiment will be described with reference to FIGS. The device temperature control apparatus according to the present embodiment heats the refrigerant inside the warming-up pipe 40 provided in the cooler 14A and the warming-up pipe 40 provided in the cooler 14B by one heating source 30. Further, the refrigerant in the warm-up pipe 40 provided in the cooler 14C and the warm-up pipe 40 provided in the cooler 14D are heated by one heating source 30.

  The warming-up pipe 40 includes a first pipe 40a extending in the horizontal direction from the heating outlet 145, a second pipe 40b extending in the vertical direction from an end of the first pipe 40a, and an upper end of the second pipe 40b. And a third pipe 40 c extending horizontally from the heating inlet 146 to the heating inlet 146.

  As shown in FIGS. 42 to 43, the heat source 30 has a block member 31 made of a metal such as aluminum, a plate-like heat transfer member 33, and a heater 32 forming a planar shape. . The block member 31 is formed with two through holes 31a through which the warming-up pipe 40 is inserted, and the warming-up pipes 40 are arranged in the through holes 31a. The heater 32 is disposed so as to be sandwiched between the heat conductive material 33 and the heat insulating material 34. Further, the heat conductive material 33 and the heat insulating material 34 are fixed by the support member 35.

  The two through holes 31 a formed in the block member 31 have an L-shaped cross section. The first pipe 40a and the second pipe 40b of the warming-up pipe 40 are disposed in the L-shaped through holes 31a. Therefore, the refrigerant stored in the first pipe 40 a and the second pipe 40 b of the warming-up pipe 40 can be efficiently heated by the heater 32.

  In the present embodiment, the block member 31 is configured as shown in FIGS. 42 to 43. However, as shown in FIGS. 44 to 45, a heater disposed so as to be sandwiched between two heat transfer members 33 The block member 31 can also be configured to be disposed between the two through holes 31a.

(Twenty-fifth embodiment)
An apparatus temperature control apparatus according to a twenty-fifth embodiment will be described with reference to FIG. In the twenty-fourth embodiment, two through holes 31 a formed in the block member 31 of the heat source 30 have an L-shaped cross section. On the other hand, the cross section of the two through holes 31 a formed in the block member 31 of the heat source 30 of the present embodiment is I-shaped.

  The second pipe 40b of the warming-up pipe 40 is disposed in the I-shaped through hole 31a. Thereby, size reduction and weight reduction of the heating source 30 are possible.

(Twenty-sixth embodiment)
An apparatus temperature control apparatus according to a twenty-sixth embodiment will be described with reference to FIG. The apparatus temperature control apparatus of the present embodiment includes a warming-up pipe 40 connecting between the heating outlet 145 of the cooler 14A and the heating inlet 146, a heating outlet 145 of the cooler 14B, and a heating A warming-up pipe 40 connecting to the inlet 146, a warming-up pipe 40 connecting the heating outlet 145 for the cooler 14C and the heating inlet 146, and a heater for the cooler 14D The heating pipe 40 connecting between the outlet 145 and the heating inlet 146 is configured to be heated by one heating source 30. Thus, four or more warm-up pipes 40 can also be heated by one heating source 30.

(Other embodiments)
(1) In the above embodiments, the secondary battery 12a, 12b has been described as an example of the target device whose temperature is adjusted by the device temperature adjustment device 10. On the other hand, as an object apparatus with which the apparatus temperature control apparatus 10 adjusts temperature, other apparatuses, such as a motor, an inverter, a charger, a semiconductor element, an information apparatus, etc. which require cooling or warming-up may be sufficient.

  (2) In each of the above embodiments, an example in which the device temperature control apparatus 10 is mounted on a car has been described. However, for example, the device temperature control device is used for various moving objects other than cars such as trains, airplanes, electric bikes, and ships. You may mount ten.

  (3) In each of the above embodiments, an example in which a fluorocarbon refrigerant is employed as the working fluid has been described, but the present invention is not limited to this. The working fluid may employ other fluids such as propane, carbon dioxide, water, ammonia and the like.

  (4) In the fifth embodiment, the convex portion piping 215 is provided between the condenser outlet 162 of the condenser 16 and the inlet 141 of the cooler 14 connected to the condenser 16 among the plurality of coolers 14. I did it. On the other hand, the convex part piping 215 provided in the apparatus temperature control apparatus of the said 5th embodiment can also be arrange | positioned at the apparatus temperature control apparatus of 1st-4th, 6th-12th embodiment.

  (5) In the first embodiment, the forward piping 21 is disposed such that the liquid passage 211 a formed by the liquid phase connecting piping 211 is at a higher position than the inflow ports 141 of the plurality of coolers 14. It is not limited to the following configuration. The forward piping 21 may be arranged such that at least a part of the liquid passage 21 a formed by the forward piping 21 is at a higher position than the inflow ports 141 of the plurality of coolers 14.

  (6) In the third to tenth embodiments, the projection piping is disposed such that the liquid flow path formed by the projection piping is higher than the inflow port 141 of the cooler 14. However, the shape of the projection piping is The present invention is not limited to the shapes shown in the third to tenth embodiments. For example, a shielding plate extending upward in the vertical direction is provided in the liquid flow path, or the liquid flow path is formed in an inverted V-shape to form a weir in the middle of the forward flow pipe 21 to form the main body 143 of the cooler 14 It is also possible to form a reservoir within.

  (7) In the tenth embodiment, the movement of the liquid phase refrigerant between the respective coolers between the high stage cooler 14A and the high stage cooler 14B and between the low stage cooler 14C and the low stage cooler 14D There is no configuration to be suppressed. On the other hand, as shown in FIGS. 22-23, the liquid phase between the high-stage cooler 14A and the high-stage cooler 14B and between the low-stage cooler 14C and the low-stage cooler 14D. It can also be provided in combination with various structures in which the movement of the refrigerant is suppressed. Thereby, even when each cooler 14A-14D inclines, a liquid storage part is formed in the internal space of the main body 143 of each cooler 14A-14D, and the liquid phase from the high order cooler 14 to the low order cooler 14 The movement of the refrigerant can be suppressed.

  In addition, this invention is not limited to above-described embodiment, In the range described in the claim, it can change suitably. Moreover, said each embodiment is not mutually irrelevant and can be combined suitably, unless the combination is clearly impossible. Further, in each of the above-described embodiments, it is needless to say that the elements constituting the embodiment are not necessarily essential except when clearly indicated as being essential and when it is considered to be obviously essential in principle. Yes. Further, in the above embodiments, when numerical values such as the number, numerical value, amount, range, etc. of constituent elements of the embodiment are mentioned, it is clearly indicated that they are particularly essential and clearly limited to a specific number in principle. It is not limited to the specific number except when it is done. Further, in the above embodiments, when referring to materials, shapes, positional relationships, etc. of constituent elements etc., unless specifically stated otherwise or in principle when limited to a specific material, shape, positional relationship, etc., etc. It is not limited to the material, the shape, the positional relationship, etc.

(Summary)
According to the first aspect shown in part or all of each of the above embodiments, it has a circulation circuit for circulating the working fluid, and the temperature of the target device is determined by the phase change between the liquid phase and the gas phase of the working fluid. It is an equipment temperature control device to adjust. In addition, a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid. In addition, it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers. In addition, return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser. Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping. The forward piping is arranged such that at least a part of the liquid passage formed by the forward piping is at a higher position than the inlets of the plurality of coolers.

  Further, according to the second aspect, the forward piping has a liquid phase connection piping that forms a liquid passage, and a connection piping that connects between the inflow ports of the plurality of coolers and the liquid phase connection piping. ing. The liquid passage formed by the liquid phase connecting pipe is disposed at a position higher than the inlets of the plurality of coolers.

  As described above, the liquid passage formed by the liquid phase connection piping can be configured to be at a higher position than the inlets of the plurality of coolers.

  Further, according to the third aspect, the liquid phase connecting pipe is a target liquid surface of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. It is arranged to have the above height.

  In this manner, the liquid phase connecting pipe is such that the liquid passage formed by the liquid phase connecting pipe is at a height higher than the target liquid level of the working fluid in the plurality of coolers when the circulating circuit is filled with the working fluid. Preferably it is arranged.

  Further, according to a fourth aspect, the device temperature control device includes a circulation circuit that circulates the working fluid, and adjusts the temperature of the target device by phase change between the liquid phase and the gas phase of the working fluid. In addition, a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid. In addition, it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers. In addition, return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser. Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping. And, at least one of the inlets of the plurality of coolers is disposed at a height higher than the lowermost end of the internal space of the main body.

  Further, according to the fifth aspect, at least one of the inlets of the plurality of coolers is an appropriate liquid surface which is a target fluid level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is arranged at the height above.

  Thus, at least one of the inlets of the plurality of coolers is disposed at a height above the appropriate liquid level, which is the target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. Is preferred.

  Further, according to the sixth aspect, the forward piping has a liquid phase connecting piping that forms a liquid passage, and the liquid phase connecting piping is a circulation of a liquid passage formed by the liquid phase connecting piping. The circuit is disposed at a height higher than the appropriate liquid level which is a target liquid level of the working fluid in the plurality of coolers when the circuit is filled with the working fluid.

  As described above, the liquid phase connecting pipe is a target liquid level or more of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. It is preferable to arrange so that it may become high.

  Further, according to a seventh aspect, there is provided a device temperature control apparatus having a circulation circuit for circulating a working fluid, and adjusting a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. In addition, a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid. In addition, it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers. In addition, return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser. Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping. Also, the forward piping is disposed between the inlet of the first cooler of one of the plurality of coolers and the inlet of the second cooler different from the first cooler of the plurality of coolers. Has a convex piping. Then, at least a part of the liquid passage formed by the convex portion pipe protrudes vertically upward from the inflow port of the first cooler and the inflow port of the second cooler.

  Further, according to the eighth aspect, the inlet of the first cooler and the inlet of the second cooler are not the target level of the working fluid in the plurality of coolers when the circulating circuit is filled with the working fluid. It is also located at a low position.

  Thus, the inlet of the first cooler and the inlet of the second cooler are disposed at a position lower than the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Is preferred.

  Further, according to the ninth aspect, in the convex portion pipe, at least a part of the liquid passage formed by the convex portion pipe is a target of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. It is arranged to be higher than the liquid level.

  Thus, the projection piping has a height above the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid in at least a part of the liquid passage formed by the projection piping. It is preferable to arrange so that

  Further, according to the tenth aspect, the forward piping forms a liquid passage and forms a first liquid phase connecting piping connected to the inflow port of the first cooler and a second liquid passage extending in the front-rear direction. It has a second liquid phase connecting pipe connected to the inlet of the cooler. And convex part piping is arranged between the 1st liquid phase connecting piping and the 2nd liquid phase connecting piping.

  Thus, the convex portion piping is disposed between the first liquid phase connecting piping connected to the inlet of the first cooler and the second liquid phase connecting piping connected to the inlet of the second cooler. can do.

  Further, according to the eleventh aspect, the convex portion pipe is located upstream of the fluid flow of the working fluid flowing inside the liquid phase connecting pipe than the center of the inlet of the first cooler and the inlet of the second cooler. It is arranged.

  With such a configuration, when the convex portion piping is disposed on the downstream side of the fluid flow of the working fluid flowing inside the liquid phase piping than the center of the inlet of the first cooler and the inlet of the second cooler Compared to the above, it is possible to increase the flow rate of the working fluid stored in the cooler upstream of the fluid flow of the working fluid from the projection piping.

  Further, according to the twelfth aspect, the convex portion piping is the first convex portion piping, and the forward piping is the flow of the condenser outlet connected to the condenser outlet and the cooler connected to the condenser among the plurality of coolers It has the 2nd convex part piping connected between inlets. And, in the second convex portion piping, at least a part of the liquid passage formed by the second convex portion piping is vertically above the inlet of the cooler connected to the condenser outlet of the condenser and the condenser It protrudes.

  Therefore, even if the condenser and the plurality of coolers are inclined such that the condenser is at a lower position, a liquid storage portion is formed in the internal space of the main body of each cooler by the convex piping, and the liquid phase is formed in this liquid storage portion The refrigerant is stored. Therefore, the movement of the liquid-phase refrigerant from the high-level cooler to the low-level condenser is suppressed, and the temperature adjustment of the target device can be realized more stably.

  Further, according to a thirteenth aspect of the present invention, there is provided a device temperature control apparatus having a circulation circuit for circulating a working fluid, and adjusting a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. In addition, a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid. In addition, it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers. In addition, return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser. Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping. Also, the forward piping has a convex piping that connects between the condenser outlet of the condenser and the inlet of the cooler connected to the condenser among the plurality of coolers. And, at least a part of the liquid passage formed by the convex portion piping protrudes vertically upward from the condenser outlet of the condenser and the inlet of the cooler connected to the condenser.

  Further, according to a fourteenth aspect, in the convex portion pipe, at least a part of the liquid passage formed by the convex portion pipe is the target of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. It is arranged to be higher than the liquid level.

  Thus, the projection piping has a height above the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid in at least a part of the liquid passage formed by the projection piping. It is preferable to arrange so that

  According to a fifteenth aspect of the present invention, there is provided a device temperature control apparatus having a circulation circuit for circulating a working fluid, and adjusting a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. In addition, a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid. In addition, it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers. In addition, return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser. Further, each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the inner space of the main body and an outlet for discharging the working fluid introduced to the main body. Also, the forward piping is a convex piping that connects between the outlet of one first cooler of the plurality of coolers and the inlet of the second cooler different from the first cooler of the plurality of coolers. And the projection piping projects at least a part of the liquid passage formed by the projection piping in the upper and lower direction above the outlet of the first cooler and the inlet of the second cooler. Has a convex piping.

  Further, according to a sixteenth aspect, in the convex portion pipe, at least a part of the liquid passage formed by the convex portion pipe is a target of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. It is arranged to be higher than the liquid level.

  Thus, the projection piping has a height above the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid in at least a part of the liquid passage formed by the projection piping. It is preferable to arrange so that

  Further, according to a seventeenth aspect, the apparatus temperature control apparatus includes a circulation circuit that circulates the working fluid, and adjusts the temperature of the target device by a phase change between the liquid phase and the gas phase of the working fluid. In addition, a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid. In addition, it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers. And a return pipe, which is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated by the plurality of coolers to the condenser. Further, each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the inner space of the main body and an outlet for discharging the working fluid introduced to the main body. And, at least one of the inlet and the outlet of the plurality of coolers is arranged at a position higher than the lowermost end of the internal space of the main body.

  Further, according to an eighteenth aspect, at least one of the inlet and the outlet of the plurality of coolers is a target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is arranged at the height above the appropriate liquid level.

  Thus, at least one of the inlet and the outlet of the plurality of coolers is higher than the appropriate liquid level which is the target level of the working fluid in the plurality of coolers when the circulation circuit is filled with the working fluid. It is preferred that the

  Further, according to the nineteenth aspect, the forward piping has a liquid phase connection piping (211) forming a liquid passage. The liquid phase connecting pipe is higher than the appropriate liquid level which is the target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase linking pipe is filled with the working fluid in the circulation circuit. It is arranged to be

  As described above, the liquid phase connecting pipe is a target liquid level or more of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. It is preferable to arrange so that it may become high.

  Further, according to a twentieth aspect, there is provided a device temperature control apparatus having a circulation circuit for circulating a working fluid, and adjusting a temperature of a target device by a phase change between a liquid phase and a gas phase of the working fluid. In addition, a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid. In addition, it includes forward piping which is included in the circulation circuit and which forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers. In addition, return circuit piping is included in the circulation circuit and forms a gas passage for supplying the working fluid evaporated in the plurality of coolers to the condenser. Each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the internal space of the main body, and an outlet for discharging the working fluid evaporated in the main body to the return piping. The plurality of coolers also include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position. In addition, the forward piping has high and low connection piping that connects between the inlet of the low stage cooler and the inlet of the high stage cooler. Then, at least a part of the liquid passage formed by the high and low connection piping protrudes vertically above the inlet of the low stage cooler and the inlet of the high stage cooler.

  According to a twenty-first aspect, there is provided a device temperature control apparatus that has a circulation circuit that circulates a working fluid and that adjusts the temperature of a target device by a phase change between the liquid phase and the gas phase of the working fluid. In addition, a plurality of coolers included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the heat of the working fluid contained in the circulation circuit and evaporated by the cooler And a condenser for releasing heat to condense the working fluid. In addition, it is included in the circulation circuit and forms forward flow piping that forms a liquid passage for supplying the working fluid condensed in the condenser to the plurality of coolers, and the working fluid included in the circulation circuit and vaporized in the plurality of coolers And a return pipe forming a gas passage to be supplied to the condenser. Further, each of the plurality of coolers has an inlet for introducing the working fluid flowing in the forward piping into the inner space of the main body and an outlet for discharging the working fluid introduced to the main body. The plurality of coolers also include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position. In addition, the forward piping has high and low connection piping that connects between the inlet of the low stage cooler and the outlet of the high stage cooler. And, at least a part of the liquid passage formed by the high and low connection piping is disposed at a position higher than the lowermost end of the internal space of the main body of the high stage cooler.

  Further, according to the twenty-second aspect, at least a part of the liquid passage formed by the high and low connection piping is a target liquid surface of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. It is arranged at the height more than a field.

  Thus, at least a portion of the fluid passage formed by the high and low connection piping is at a height above the appropriate fluid level, which is the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled with the working fluid. Preferably it is arranged.

  Further, according to the twenty-third aspect, an apparatus having a circulation circuit (26) for circulating the working fluid, and adjusting the temperature of the target device (12a, 12b) by the phase change between the liquid phase and the gas phase of the working fluid. It is a temperature control device. In addition, a plurality of coolers (14) included in the circulation circuit that cools the target device by heat exchange between the heat of the target device and the heat of the working fluid, and the working fluid included in the circulation circuit and evaporated by the cooler And a condenser (16) for dissipating heat from the heat source to condense the working fluid. In addition, it is included in the circulation circuit, forms a liquid passage (21a) for supplying the working fluid condensed in the condenser to the plurality of coolers, and is included in the circulation circuit and includes the plurality of coolers And return line (22) forming a gas passage (22a) for supplying the working fluid thus evaporated to the condenser. Each of the plurality of coolers has an inlet (141) for introducing the working fluid flowing in the forward piping into the inner space of the main body (143) and an outlet (144) for discharging the working fluid introduced to the main body. ing. The plurality of coolers include a low stage cooler disposed at a first height position and a high stage cooler disposed at a second height position higher than the first height position. In addition, the forward piping has high-low connection piping (217, 218) that connects between the inlet of the low-stage cooler and the outlet of the high-stage cooler. Further, at least a part of the liquid passage formed by the high and low connection piping protrudes vertically above the inflow port of the low stage cooler and the outflow port of the high stage cooler.

  According to the twenty-fourth aspect, at least one of the plurality of coolers includes a heating outlet for heating the working fluid introduced into the internal space of the main body, and a vertical direction from the heating outlet. And a heating inlet disposed on the upper side for introducing the working fluid flowing out of the heating outlet into the internal space of the main body. Between the heating outlet and the heating inlet, a warming-up pipe for introducing the working fluid flowing out from the heating outlet to the heating inlet is provided, and the warming pipe is provided with the warming-up pipe. A heating source is provided to heat the working fluid in the liquid phase introduced into the interior of the warm-up pipe. Then, the working fluid heated by the heating source is introduced into the internal space of the main body from the heating inlet through the warming-up pipe. Thus, the working fluid can be heated by the heating source to warm up the target device.

  Further, according to the twenty-fifth aspect, the device temperature control device is disposed in at least one of the warming-up piping connecting the forward piping and the return piping, and at least one of the outward piping and the warming piping. And a heating source for heating a working fluid in a liquid phase introduced into at least one of the warm-up pipes. Then, the working fluid heated by the heating source is introduced into the internal space of the main body from the discharge port through the return pipe. Thus, the working fluid can be heated by the heating source to warm up the target device.

  Further, according to the twenty-sixth aspect, the device temperature control device is disposed above the heating source and a heating source for heating the working fluid in the liquid phase introduced into the inside of the forward piping, and the outward piping and the return path And a vapor phase liquid phase communication pipe connecting between the pipe and the pipe. Then, the working fluid heated by the heating source is introduced into the internal space of the main body through the forward pipe, the gas phase liquid phase communication pipe, and the return pipe. Thus, the working fluid can be heated by the heating source to warm up the target device.

  Further, according to the twenty-seventh aspect, the device temperature control device is disposed in the vapor-liquid-phase communicating pipe connecting the forward pipe and the return pipe, and the vapor-liquid phase communicating pipe, and the vapor phase liquid phase And a heating source for heating the working fluid in the liquid phase introduced into the communication pipe. Then, the working fluid heated by the heating source is introduced into the internal space of the main body through the forward pipe. Thus, the working fluid can be heated by the heating source to warm up the target device.

  Further, according to the twenty-eighth aspect, the device temperature control apparatus includes a plurality of warming-up pipe flow paths, and the heating source includes a heating element that heats the plurality of warming-up pipes. Therefore, the working fluid in the plurality of warming-up pipes can be heated by the heating element.

DESCRIPTION OF SYMBOLS 10 Equipment temperature control apparatus 12a, 12b Secondary battery 14 Cooler 141 Inlet 142 Exhaust port 143 Main body 16 Condenser 21 Forward piping 21a Liquid passage 211 Liquid phase connection piping 212 Connection piping 22 Return piping 26 Thermo siphon circuit

Claims (28)

An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers discharge the working fluid evaporated in the main body to the return pipe, an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143), and And an outlet (142),
The apparatus temperature control device, wherein the forward piping is arranged such that at least a part of the liquid passage formed by the forward piping is higher than the inflow ports of the plurality of coolers.   The forward pipe has a liquid phase connecting pipe (211) forming the liquid channel, and a connecting pipe (212) connecting between the inlets of the plurality of coolers and the liquid phase connecting pipe. The apparatus temperature control device according to claim 1, wherein the liquid passage formed by the liquid phase connection pipe is positioned higher than the inlets of the plurality of coolers.   The liquid phase connecting pipe is a target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. The device temperature control device according to claim 2, wherein the device temperature control device is arranged to have a height higher than a surface. An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers respectively have an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143) and an exhaust for discharging the working fluid evaporated in the main body to the return pipe. With an outlet (142)
An apparatus temperature control apparatus, wherein at least one of the inlets of the plurality of coolers is disposed at a height higher than the lowest end of the internal space of the main body.   At least one of the inlets of the plurality of coolers has a height above the appropriate liquid level, which is the target level of the working fluid in the plurality of coolers when the circulating circuit is filled with the working fluid. The apparatus temperature control apparatus of Claim 4 arrange | positioned at. The forward pipe has a liquid phase connecting pipe (211) forming the liquid passage,
The liquid phase connecting pipe is a target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. The device temperature control device according to claim 4 or 5, wherein the device temperature control device is disposed to have a height greater than a surface. An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers respectively have an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143) and an exhaust for discharging the working fluid evaporated in the main body to the return pipe. With an outlet (142)
The forward piping is between the inlet of a first cooler of one of the plurality of coolers and the inlet of a second cooler different from the first cooler of the plurality of coolers. Have a convex piping (214) arranged in the
The apparatus temperature control apparatus in which at least a part of the liquid passage formed by the convex portion piping protrudes vertically upward from the inflow port of the first cooler and the inflow port of the second cooler.   The inlet of the first cooler and the inlet of the second cooler are lower than a target level of the working fluid in the plurality of coolers when the circulating circuit is filled with the working fluid. The device temperature control device according to claim 7, which is disposed at a position.   The convex portion pipe is a target liquid level or more of the working fluid in the plurality of coolers when the working fluid is filled in the circulation circuit at least a part of the liquid passage formed by the convex portion pipe The apparatus temperature control apparatus of Claim 7 or 8 arrange | positioned so that it may become height. The forward pipe forms the liquid passage and is connected to a first liquid phase connecting pipe connected to the inlet of the first cooler and to the inlet of the second cooler forming the liquid passage. Having a second liquid phase connecting pipe,
The apparatus temperature control device according to any one of claims 7 to 9, wherein the convex portion piping is disposed between the first liquid phase connecting piping and the second liquid phase connecting piping.   The convex portion pipe is disposed upstream of the working fluid flow that flows inside the liquid phase connecting pipe than the center of the inlet of the first cooler and the inlet of the second cooler. The apparatus temperature control apparatus of Claim 10. The convex pipe is a first convex pipe,
The forward pipe is a second convex pipe (215) that connects the condenser outlet (162) of the condenser and the inlet of the cooler connected to the condenser among the plurality of coolers. The second convex portion pipe is a portion of the liquid passage formed by the second convex portion pipe at least a part of the liquid path is connected to the condenser outlet of the condenser and the condenser of the condenser The apparatus temperature control apparatus according to any one of claims 7 to 11, which protrudes upward in the vertical direction with respect to the inflow port. An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers respectively have an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143) and an exhaust for discharging the working fluid evaporated in the main body to the return pipe. With an outlet (142)
The forward pipe has a convex pipe (215) connecting between the condenser outlet of the condenser and the inlet of the cooler connected to the condenser among the plurality of coolers;
An apparatus temperature control in which at least a part of the liquid passage formed by the convex portion piping protrudes vertically above the condenser outlet of the condenser and the inlet of a cooler connected to the condenser. apparatus.   The convex portion pipe is a target liquid level or more of the working fluid in the plurality of coolers when the working fluid is filled in the circulation circuit at least a part of the liquid passage formed by the convex portion pipe The apparatus temperature control device according to claim 13, which is disposed to have a height. An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers respectively have an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143) and an outlet (144) for discharging the working fluid introduced to the main body Have
The forward pipe is connected between the outlet of a first cooler of one of the plurality of coolers and the inlet of a second cooler different from the first cooler of the plurality of coolers. Have a convex piping (216)
In the projection piping, at least a part of the liquid passage formed by the projection piping protrudes upward in the vertical direction from the outlet of the first cooler and the inlet of the second cooler. Equipment temperature control device.   The convex portion pipe is a target liquid level or more of the working fluid in the plurality of coolers when the working fluid is filled in the circulation circuit at least a part of the liquid passage formed by the convex portion pipe The device temperature control device according to claim 15, which is arranged to be at a height. An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers respectively have an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143) and an outlet (144) for discharging the working fluid introduced to the main body Have
The device temperature control device according to claim 1, wherein at least one of the inlet and the outlet of the plurality of coolers is disposed at a height higher than the lowermost end of the internal space of the main body.   At least one of the inlet and the outlet of the plurality of coolers is an appropriate liquid level which is a target level of the working fluid in the plurality of coolers when the circulating circuit is filled with the working fluid. The device temperature control device according to claim 17, which is disposed at the above height. The forward pipe has a liquid phase connecting pipe (211) forming the liquid passage,
The liquid phase connecting pipe is a target liquid level of the working fluid in the plurality of coolers when the liquid passage formed by the liquid phase connecting pipe is filled with the working fluid in the circulation circuit. The device temperature control device according to claim 17 or 18, wherein the device temperature control device is arranged to have a height higher than a surface. An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers respectively have an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143) and an exhaust for discharging the working fluid evaporated in the main body to the return pipe. With an outlet (142)
The plurality of coolers include a low stage cooler disposed at a first height position, and a high stage cooler disposed at a second height position higher than the first height position,
The forward piping has high-low connection piping (217) connecting between the inlet of the low-stage cooler and the inlet of the high-stage cooler;
An apparatus temperature control apparatus, wherein at least a part of the liquid passage formed by the high and low connection piping protrudes vertically upward from the inflow port of the low-stage cooler and the inflow port of the high-stage cooler. An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers respectively have an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143) and an outlet (144) for discharging the working fluid introduced to the main body Have
The plurality of coolers include a low stage cooler disposed at a first height position, and a high stage cooler disposed at a second height position higher than the first height position,
The forward piping has high-low connection piping (217) connecting between the inlet of the low-stage cooler and the outlet of the high-stage cooler,
The apparatus temperature control device in which at least a part of the liquid passage formed by the high and low connection piping is disposed at a position higher in height than the lowermost end of the internal space of the main body of the high stage cooler.   At least a part of the fluid passage formed by the high and low connection piping is higher than the appropriate fluid level which is the target fluid level of the working fluid in the plurality of coolers when the working circuit is filled in the circulation circuit. 22. The device temperature control device according to claim 21, wherein An apparatus temperature control apparatus, comprising: a circulation circuit (26) for circulating a working fluid, wherein the temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase of the working fluid and a gas phase;
A plurality of coolers (14) which are included in the circulation circuit and perform heat exchange between the heat of the target device and the heat of the working fluid to cool the target device;
A condenser (16) which is included in the circulation circuit and dissipates the heat of the working fluid evaporated by the cooler to condense the working fluid;
A forward pipe (21) which is included in the circulation circuit and forms a liquid passage (21a) for supplying the working fluid condensed by the condenser to the plurality of coolers;
Return path piping (22) which is included in the circulation circuit and forms a gas passage (22a) for supplying the working fluid evaporated in the plurality of coolers to the condenser;
The plurality of coolers respectively have an inlet (141) for introducing the working fluid flowing through the forward pipe into the internal space of the main body (143) and an outlet (144) for discharging the working fluid introduced to the main body Have
The plurality of coolers include a low stage cooler disposed at a first height position, and a high stage cooler disposed at a second height position higher than the first height position,
The forward piping has high-low connection piping (217, 218) connecting between the inlet of the low-stage cooler and the outlet of the high-stage cooler,
The apparatus temperature control apparatus in which at least a part of the liquid passage formed by the high and low connection piping protrudes vertically upward from the inflow port of the low-stage cooler and the outflow port of the high-stage cooler. At least one of the plurality of coolers is disposed at a heating outlet (145) for flowing out to heat the working fluid introduced into the internal space of the main body, and vertically above the heating outlet. And a heating inlet (146) for introducing the working fluid that has flowed out of the heating outlet into the internal space of the main body;
Between the heating outlet and the heating inlet, there is provided a warming pipe (40) for introducing the working fluid that has flowed out from the heating outlet to the heating inlet.
The heating pipe (30) is provided with a heating source (30) for heating the working fluid of the liquid phase introduced into the heating pipe.
The apparatus temperature control according to any one of claims 1 to 23, wherein the working fluid heated by the heating source is introduced into the internal space of the main body from the heating inlet through the warming pipe. apparatus. A warming-up pipe (41) for connecting the forward pipe and the return pipe;
A heating source (30) disposed in at least one of the forward piping and the warming piping, for heating the working fluid in a liquid phase introduced into at least one of the outward piping and the warming piping; Equipped with
The apparatus temperature control apparatus according to any one of claims 1 to 23, wherein the working fluid heated by the heating source is introduced into the internal space of the main body from the outlet through the return pipe. A heating source (30) for heating the working fluid of the liquid phase introduced into the inside of the forward piping;
A vapor-phase liquid-phase communicating pipe (42) which is disposed vertically above the heating source and connects the forward pipe and the return pipe;
The method according to any one of claims 1 to 23, wherein the working fluid heated by the heating source is introduced into the internal space of the main body through the forward pipe, the vapor-phase liquid phase communicating pipe, and the return pipe. Equipment temperature control device as described. A gas phase liquid phase communication pipe (43, 44) connecting the forward pipe and the return pipe;
And a heating source (30) disposed in the vapor phase liquid phase communication pipe for heating the working fluid of the liquid phase introduced into the vapor phase liquid phase communication pipe;
The apparatus temperature control apparatus according to any one of claims 1 to 23, wherein the working fluid heated by the heating source is introduced into the internal space of the main body through the forward pipe. Equipped with multiple warm-up pipes,
The device temperature control device according to claim 24 or 25, wherein the heating source has a heating element (32) for heating a plurality of warming pipes.

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