JP2019067968A - Electronic device - Google Patents

Abstract

To effectively remove electromagnetic noise in an electronic device having a plurality of substrates.SOLUTION: An electronic apparatus includes a first substrate and a second substrate on each of which an electronic component is mounted, a first flexible substrate electrically connecting the first substrate and the second substrate, a second flexible substrate having a ground potential pattern electrically connected to the ground potential of the first substrate and the second substrate on substantially the entire surface, and a third flexible substrate having a ground potential pattern substantially on the entire surface, which is electrically connected to the first substrate and partially bent so as to be inserted between the first substrate and the second substrate.SELECTED DRAWING: Figure 1

Description

  One embodiment of the present invention relates to an electronic device including a substrate.

  Substrate configurations having a rigid substrate and a flexible substrate (flexible substrate) are used in various electronic devices. In general, a flexible substrate is used when connecting a rigid substrate or the like to another structure, and is useful for routing signal lines because it has a pliable characteristic. By the way, as shown by patent document 1 etc., it is conventionally known about the structure containing the flexible substrate which has a shield layer in addition to a signal wire | line.

JP, 2011-66065, A

  However, the flexible substrate having the above-mentioned conventional shield layer has a layer having a shield function in addition to signal lines and other structures, and may not effectively shield high level electromagnetic noise. The Also, in recent precision equipment and the like, there is a need to remove electromagnetic noise at an extremely high level in order to completely prevent a malfunction, and the above conventional configuration can not sufficiently cope with such a demand. was there.

  The present invention adopts the following means in order to solve the above-mentioned problems and the like. In the following description, in order to facilitate understanding of the invention, reference numerals and the like in the drawings are appended in parentheses, but each component of the present invention is not limited to the appended ones. It should be interpreted broadly to the extent that the vendor can understand technically.

One means of the present invention is
A rectangular first substrate (11) and a second substrate (12) each having an electronic component mounted thereon;
A flexible first flexible substrate (13) electrically connecting the first substrate and the second substrate;
A second flexible substrate (14 to 16) substantially having a ground potential pattern electrically connected to the ground potential of the first substrate and the second substrate;
A flexible substrate having a ground potential pattern substantially on the entire surface, which is electrically connected to the first substrate and partially bent so as to be inserted between the first substrate and the second substrate. A third flexible substrate (17) having
It is an electronic device.

  According to the electronic device configured as described above, the second flexible substrate having the ground potential pattern can be configured to be able to effectively suppress electromagnetic noise around the first substrate and the second substrate. Furthermore, by arranging the third flexible substrate having the ground potential pattern between the first substrate and the second substrate, the influence of the electromagnetic noise mutually given between the first substrate and the second substrate is suppressed. Possible configurations are possible. Further, since the ground potential pattern is formed in a wide range of the second flexible substrate and the third flexible substrate, the heat dissipation can be enhanced.

In the above electronic device, preferably
The first flexible substrate is disposed at a portion of a first side of the first substrate and a side of the second substrate opposite to the first side.
The second flexible substrate is disposed at a portion of a second side of the first substrate and a side of the second substrate opposite to the second side.
The third flexible substrate is connected to a third side of the first substrate.

  According to the electronic device having the above configuration, it is possible to effectively suppress electromagnetic noise emitted from an element disposed in a portion sandwiched by the first substrate and the second substrate.

In the above electronic device, preferably
Fourth flexible substrate (15) and fifth flexible substrate having substantially all over the ground potential pattern electrically connected to the ground potential of the first substrate (11) and the second substrate (12) With a substrate (16)
The fourth flexible substrate (15) is disposed at a portion of a third side of the first substrate and a side of the second substrate opposite to the third side.
The fifth flexible substrate (16) is disposed at a portion of a fourth side of the first substrate and a side of the second substrate opposite to the fourth side.

  According to the electronic device of the above configuration, since three sides of the portion sandwiched by the first substrate and the second substrate are covered by the flexible substrate having the ground potential pattern, the element disposed in the portion It can be set as the composition which can be controlled more effectively electromagnetic noise emitted from.

In the above electronic device, preferably
It further comprises a pedestal (18) disposed between the first substrate and the second substrate,
The pedestal includes second flexible substrate insertion holes (182a to 182c) through which the second flexible substrate is inserted.

  According to the electronic device having the above configuration, by providing the pedestal, the second flexible substrate can be stably supported. In addition, the configuration can be made easy.

In the above electronic device, preferably
It further comprises a pedestal (18) disposed between the first substrate and the second substrate,
The pedestal is
A second flexible substrate insertion hole (182a) through which the second flexible substrate is inserted;
A fourth flexible substrate insertion hole (182b) through which the fourth flexible substrate is inserted;
And a fifth flexible substrate insertion hole (182c) through which the fifth flexible substrate is inserted.

  According to the electronic device configured as described above, the second flexible substrate, the fourth flexible substrate, and the fifth flexible substrate can be stably supported. In addition, the configuration can be made easy.

In the above electronic device, preferably
The pedestal includes a third flexible substrate insertion hole (182d) into which the third flexible substrate (17) is inserted.

  According to the electronic device having the above configuration, the third flexible substrate can be stably supported, and the assembly can be easily configured.

In the above electronic device, preferably
The second flexible substrate and the third flexible substrate have no signal line other than the ground potential pattern.

  According to the electronic device having the above-described configuration, it is possible to further enhance the suppression of electromagnetic noise and the heat dissipation effect by the second flexible substrate and the third flexible substrate.

In the above electronic device, preferably
The ground potential pattern has a higher thermal conductivity than iron.

  According to the electronic device configured as described above, the second flexible substrate and the third flexible substrate can further enhance the heat dissipation.

FIG. 1 is a plan view of the electronic device 1 in the expanded state according to the first embodiment as viewed from one side. FIG. 2 is a plan view of the electronic device 1 in the expanded state according to the first embodiment as viewed from the other surface side. FIG. 3 is a side view of the electronic device 1 in the assembled state in the first embodiment. FIG. 4 is a plan view of the electronic device 1 in the expanded state according to the second embodiment as viewed from one side. FIG. 5 is a plan view of the electronic device 1 in a developed state as viewed from the other surface side in the second embodiment. FIG. 6 is a plan view of the pedestal 18 in the second embodiment. FIG. 7 is a side view of the electronic device 1 in an assembled state in the second embodiment.

  In the electronic device including a plurality of substrates of the present invention, in addition to a flexible substrate (flexible substrate) for transmitting and receiving signals between the substrates, a flexible substrate having only a ground potential (GND) pattern for suppressing electromagnetic noise One feature is that the substrate is provided. In addition, a feature in which a flexible substrate is inserted between two substrates and a feature in which a pedestal is provided is a further feature.

An embodiment as a specific configuration example of the present invention will be described according to the following configuration. However, the embodiments described below are merely examples of the present invention, and the technical scope of the present invention is not to be interpreted in a limited manner. In the drawings, the same components are denoted by the same reference numerals, and the description thereof may be omitted.
1. Embodiment 1
2. Embodiment 2
3. Supplementary items

  In the present specification, a subject to be photographed is referred to as a “subject” or a “photographed object”. In addition, the central position of light incident on the imaging device is referred to as "optical axis". The direction in which the subject is positioned with respect to the imaging device is referred to as “forward in the optical axis direction”, and the direction in which the imaging device is positioned with respect to the subject is referred to as “rear in the optical axis direction”.

<1. Embodiment 1>
Embodiments of the present invention will be described with reference to FIGS. 1 to 3. 1 and 2 are plan views of the electronic device 1 in a developed state. FIG. 1 is a plan view of the electronic device 1 viewed from one side, and FIG. 2 is a plan view of the electronic device 1 viewed from the side opposite to FIG. FIG. 3 is a side view of the electronic device 1 in an assembled state.

  As illustrated, the electronic device 1 of the present embodiment includes a first substrate 11, a second substrate 12, a first flexible substrate 13, a second flexible substrate 14, a third flexible substrate 15, a fourth flexible substrate 16, and the like. The fifth flexible substrate 17 is included. Furthermore, the electronic device 1 includes the imaging element 111, the connector 121, the electronic components 122a to 122d, and the like.

  The electronic device 1 is included in, for example, a camera module (imaging device). The camera module includes, for example, a front case, a lens barrel, a shield plate, a rear case, the electronic device 1 of the present embodiment, and the like. The front case forms a housing together with the rear case, and accommodates the electronic device 1, the shield plate, and the lens barrel. The lens barrel has a cylindrical configuration including an optical member such as one or more lenses. A lens or the like held by the lens barrel transmits light from the subject toward the imaging device 111 mounted on the first substrate 11 while refracting light from the subject. The imaging element 111 is a photoelectric conversion element such as a CCD or a C-MOS sensor.

<First substrate 11>
The first substrate 11 is a rectangular rigid substrate, on which various electronic components including the imaging device 111 are mounted. The first substrate 11 is disposed in a plane perpendicular to the optical axis such that the imaging device 111 is perpendicular to the optical axis. The imaging element 111 is mounted on the front surface of the first substrate 11 in the optical axis direction, and the other electronic components are mounted on the rear surface of the first substrate 11. As described later, high electronic noise shielding effects can be obtained for electronic components mounted on the rear surface of the first substrate 11 in the direction of the optical axis, so that electronic components such as an image processing IC that easily generate electromagnetic noise can be obtained. The components are preferably disposed on the rear surface of the first substrate 11 in the optical axis direction or the front surface of the second substrate 12 in the optical axis direction.

Second Substrate 12
The second substrate 12 is a rectangular rigid substrate similar to the first substrate, on which electronic components 122a to 122d and the like are mounted. A connector 121 for electrically connecting the second substrate 12 to other members is mounted on the rear surface of the second substrate 12 in the optical axis direction. As will be described later, for electronic components mounted on the front surface of the second substrate 12 in the optical axis direction, a high shielding effect of electromagnetic noise can be obtained, and thus an electron such as an image processing IC that easily generates electromagnetic noise The components are preferably disposed on the rear surface of the second substrate 12 in the optical axis direction or on the rear surface of the first substrate 11 in the optical axis direction.

<First flexible substrate 13>
The first flexible substrate 13 is a flexible substrate, electrically connects the first substrate 11 and the second substrate 12, and transmits and receives a predetermined signal and the like. As shown in the figure, the first flexible substrate 13 is formed of the first substrate 11 and the second substrate 12 at one side of the rectangular first substrate 11 and the side of the second substrate 12 corresponding to this side. The two are electrically connected by soldering or the like (see FIGS. 3 and 4). The first flexible substrate 13 may be connected to the first substrate 11 and the second substrate 12 via a connector or the like.

<Second flexible substrate 14, third flexible substrate 15, fourth flexible substrate 16>
The 2nd flexible substrate 14, the 3rd flexible substrate 15, and the 4th flexible substrate 16 are substrates which have flexibility, respectively. The second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16 each have a ground potential pattern on substantially the entire surface, and are electrically connected to the ground potential of the first substrate 11 and the second substrate 12 It is done. The ground potential patterns of the second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16 are each formed of a planar conductor or a conductor pattern formed in a lattice. This ground potential pattern is formed of a material having high thermal conductivity and low electrical resistance, such as copper, in addition to being used as a pattern for blocking electromagnetic noise and also for heat radiation. For example, the ground potential pattern is formed of a material having higher thermal conductivity than iron.

  The second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16 are electrically connected to the first substrate 11 and the second substrate 12 by solder or the like. More specifically, as shown in FIGS. 1 and 2, the second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16 are electrically connected to the second substrate 12 in advance, At the time of assembly, the connection patterns 142, 152, and 162 are connected to the ground potential of the first substrate 11 by solder or the like.

  The second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16 are respectively the “second flexible substrate”, the “fourth flexible substrate”, and the “fifth flexible substrate” in the present invention. Configuration substrate ".

<Fifth flexible substrate 17>
The fifth flexible substrate 17 is a flexible substrate, and has a ground potential pattern on substantially the entire surface. The ground potential pattern of the fifth flexible substrate 17 is electrically connected to the ground potential of the first substrate 11 and the second substrate 12. The fifth flexible substrate 17 is connected to the side of the first substrate 11 facing the first flexible substrate 13. The fifth flexible substrate 17 may be connected to another side of the first substrate 11.

  The fifth flexible substrate 17 is disposed to be inserted between the first substrate 11 and the second substrate 12. At this time, the fifth flexible substrate 17 is inserted between the first substrate 11 and the second substrate 12 so that the vicinity of the connection portion with the first substrate 11 is bent. As a result, the fifth flexible substrate 17 is disposed between the first substrate 11 and the second substrate 12. Both surfaces of the fifth flexible substrate 17 are covered with an insulator in order to avoid short-circuiting with electronic components or wires mounted on the first substrate 11 and the second substrate 12.

  The electronic device 1 according to the present embodiment includes the second flexible substrate 14, the third flexible substrate 15, the fourth flexible substrate 16, and the fifth flexible substrate 17 as described above. The electromagnetic noise around the two substrates 12 can be effectively removed. Further, since the ground potential pattern is formed in a wide range of the second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16, the heat dissipation can be enhanced.

  In the electronic device 1 according to the present embodiment, the first flexible substrate 13 is configured to have four flexible substrates: the second flexible substrate 14, the third flexible substrate 15, the fourth flexible substrate 16, and the fifth flexible substrate 17. In addition, although the flexible substrates are disposed on the four sides of the rectangular first and second substrates 11 and 12, respectively, the present invention is not limited to such a configuration. For example, even when any one or two of the second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16 and the fifth flexible substrate 17 are provided, removal of electromagnetic noise and heat dissipation can be achieved. A certain effect can be obtained for improvement.

  Further, in the electronic device 1 of the present embodiment, since the first flexible substrate 13 to the fourth flexible substrate 16 are arranged to connect portions of opposing sides of the first substrate 11 and the second substrate 12, respectively. It can be set as the structure which can suppress the electromagnetic noise emitted from the element arrange | positioned in the part pinched | interposed by the 1st board | substrate 11 and the 2nd board | substrate 12. FIG.

  In particular, in the electronic device 1 of the present embodiment, the three flexible substrates of the second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16 are used as the first flexible substrate in the first substrate 11 and the second substrate 12. It arranges in the part of three sides other than the side where 13 is arranged. Therefore, three sides of the portion sandwiched between the first substrate 11 and the second substrate 12 are covered with the flexible substrate having the ground potential pattern, and the electromagnetic noise emitted from the element disposed in the portion Can be further effectively suppressed.

  In the electronic device 1 of the present embodiment, the second flexible substrate 14, the third flexible substrate 15, the fourth flexible substrate 16, and the fifth flexible substrate 17 do not have signal lines other than the ground potential pattern. It is preferable to do. According to such a configuration, it is possible to further enhance the suppression of the electromagnetic noise and the heat radiation effect.

  Further, in the electronic device 1 of the present embodiment, it is preferable that the ground potential pattern be formed of a material such as copper having a thermal conductivity higher than that of iron in order to further enhance the heat dissipation.

<2. Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIGS. 4 to 7. The electronic device 1 a according to the present embodiment is different from the electronic device 1 according to the first embodiment in that a pedestal 18 is provided. The differences will be mainly described below.

  FIG.4 and FIG.5 is a top view of the electronic device 1a of the expand | deployed state. 4 is a plan view of the electronic device 1a as viewed from one side, and FIG. 5 is a plan view of the electronic device 1a as viewed from the side opposite to FIG. And FIG. FIG. 6 is a plan view of the pedestal 18. FIG. 7 is a side view of the electronic device 1a in an assembled state.

  As shown in FIGS. 4 and 5, the electronic device 1 a includes a first substrate 11 a, a second substrate 12, a first flexible substrate 13, a second flexible substrate 14, a third flexible substrate 15, and a fourth flexible substrate 16. And the fifth flexible substrate 17a. That is, the fifth flexible 17 is replaced by the fifth flexible substrate 17a, and the first substrate 11 is replaced by the first substrate 11a. Further, as shown in FIG. 7, the electronic device 1 a includes a pedestal 18.

<Fifth flexible substrate 17a>
The fifth flexible substrate 17a includes through holes 171a and 171b. The through holes 171a and 171b are connected to the through holes 181a and 181b of the pedestal 18 by a connector, and positioning is performed. That is, the fifth flexible substrate 17 a is connected to the pedestal 18 while being positioned. The connection between the fifth flexible substrate 17a and the pedestal 18 may be performed by welding such as heat welding or adhesion using an adhesive instead of the connector.

<First substrate 11a>
The first substrate 11 a has through holes 112 a and 112 b in addition to the first substrate 11 of the first embodiment. The through holes 112 a and 112 b are respectively connected to the through holes 183 a and 183 b of the pedestal 18 to be positioned. That is, the first substrate 11 a is connected to the pedestal 18 while being positioned. The connection between the first substrate 11 a and the pedestal 18 may be performed by welding such as heat welding or adhesion using an adhesive instead of the connector.

<Pedestal 18>
The pedestals 18 are formed of an insulating substrate having a thickness of about 3 mm and made of resin, and as shown in FIG. 6, insertion holes 182 a, 182 b, 182 c, all of which are formed to penetrate the pedestals 18. And 182d and through holes 181a, 181b, 183a, and 183b. The insertion holes 182a, 182b, and 182c are formed to extend along three of the four sides forming the pedestal 18, respectively. The insertion hole 182 d is formed in the vicinity of the insertion hole 182 c along the extending direction of the insertion hole 182 c.

  In the assembled state, the second flexible substrate 14, the third flexible substrate 15, and the fourth flexible substrate 16 are respectively directed from the second substrate 12 side to the first substrate 11 side in the insertion holes 182a, 182b and 182c. It is inserted. The fifth flexible substrate 17a is inserted into the insertion hole 182d. As described above, by inserting the second flexible substrate 14, the third flexible substrate 15, the fourth flexible substrate 16, and the fifth flexible substrate 17a into the insertion holes 182a to 182d, the respective flexible substrates are stabilized. It is in a supported state. The through holes 181a and 181b are connected to the through holes 171a and 171b of the fifth flexible substrate 17a and positioned. The through holes 183a and 183b are connected to the through holes 112a and 112b of the first substrate 11a and positioned.

  In the electronic device 1a of the present embodiment, the pedestals 18 are disposed as described above, and the flexible substrates are inserted into the insertion holes 182a to 182d, whereby the flexible substrates are stably supported, and the assembly becomes easy. ing. The insertion holes of the pedestal 18 may not necessarily be formed for all of the flexible substrates, but may be formed for part of the flexible substrates, and even with such a configuration, certain effects can be obtained.

<3. Additional Notes>
The specific description of the embodiment of the present invention has been described above. In the above description, the description is merely an embodiment, and the scope of the present invention is not limited to the one embodiment, and can be broadly interpreted to a range that can be grasped by those skilled in the art.

  The electronic device 1 according to the above-described embodiment is used, for example, as a part of the configuration of a camera module, but is naturally applicable as a configuration of various other electronic devices.

  The present invention is widely used as an electronic device configured to include a substrate.

Reference Signs List 1 electronic device 11 first substrate 111 imaging element 112a, 112b through hole 121 connector 122a to 122d electronic component 12 second substrate 13 first flexible substrate 14 second flexible substrate 15 third flexible Substrate 16 Fourth flexible substrate 141, 151, 161 Ground potential pattern 142, 152, 162 Connection pattern 17 Fifth flexible substrate 171a, 171b Through hole 18 pedestal 181a, 181b, 183a, 183b Through hole 182a to 182d ... insertion holes

Claims (8)

A first substrate and a second substrate on which electronic components are mounted;
A flexible first flexible substrate electrically connecting the first substrate and the second substrate;
A second flexible substrate having on substantially the entire surface a ground potential pattern electrically connected to the ground potential of the first substrate and the second substrate;
A flexible substrate having a ground potential pattern substantially on the entire surface, which is electrically connected to the first substrate and partially bent so as to be inserted between the first substrate and the second substrate. A third flexible substrate having
Electronics. The first substrate and the second substrate have a rectangular shape,
The first flexible substrate is disposed at a portion of a first side of the first substrate and a side of the second substrate opposite to the first side.
The second flexible substrate is disposed at a portion of a second side of the first substrate and a side of the second substrate opposite to the second side.
The third flexible substrate is connected to a third side of the first substrate,
The electronic device according to claim 1. And a fourth flexible substrate and a fifth flexible substrate, each substantially having a ground potential pattern electrically connected to the ground potential of the first substrate and the second substrate.
The fourth flexible substrate is disposed at a portion of a third side of the first substrate and a side of the second substrate opposite to the third side.
The fifth flexible substrate is disposed at a portion of a fourth side of the first substrate and a side of the second substrate opposite to the fourth side.
The electronic device according to claim 2. And a pedestal disposed between the first substrate and the second substrate,
The pedestal includes a second flexible substrate insertion hole through which the second flexible substrate is inserted.
The electronic device according to any one of claims 1 to 3. And a pedestal disposed between the first substrate and the second substrate,
The pedestal is
A second flexible substrate insertion hole through which the second flexible substrate is inserted;
A fourth flexible substrate insertion hole through which the fourth flexible substrate is inserted;
And a fifth flexible substrate insertion hole through which the fifth flexible substrate is inserted.
The electronic device according to claim 3. The pedestal includes a third flexible substrate insertion hole through which the third flexible substrate is inserted.
The electronic device of Claim 4 or Claim 5. The second flexible substrate and the third flexible substrate have no signal line other than the ground potential pattern.
The electronic device according to any one of claims 1 to 6. The ground potential pattern has a higher thermal conductivity than iron,
The electronic device of any one of Claims 1-7.

Images