JP2019067860A - Light-emitting device and manufacturing method of the same - Google Patents

Abstract

To provide a method of manufacturing a light-emitting device with high light fetching efficiency.SOLUTION: A manufacturing method of a light-emitting device includes: a step of facing a plurality of translucent members having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface to an upper surface of a support member 1 and the first surface, and arranging them so as to be separated from each other; a step of forming a metal film onto the second surface of the translucent member and the side surface; a step of removing a metal film formed onto the second surface of the translucent member and forming the translucent member with a metal film comprising the metal film on the side surface; a step of arranging a light-emitting element having a light-emission surface, an electrode formation surface on the side opposite to the light-emission surface, and a side surface between the light-emission surface and the electrode formation surface so as to make the second surface of the translucent member of the translucent member with the metal film face the light-emitting surface of the light-emission element; and a step of forming a coating member that coats the side surface of the light-emitting element and the side surface of the translucent member with the metal film.SELECTED DRAWING: Figure 7

Description

  The present disclosure relates to a light emitting device and a method of manufacturing the same.

  2. Description of the Related Art Conventionally, a light emitting device provided with a light emitting element is widely used as a light source for a backlight for liquid crystal television, a lighting fixture, and the like. As such a light emitting device, a structure having a plate-like transparent member provided with a white ceramic frame has been proposed in order to improve the extraction efficiency of light output from the LED element (for example, Patent Document 1) ).

JP 2012-134355 A

  There is a demand for a compact light emitting device with higher light extraction efficiency.

The manufacturing method of the light emitting device of the embodiment of the present invention includes the following configuration.
A plurality of light transmitting members comprising a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface, the upper surface and the first surface of the support member 1 Facing each other and spaced apart from each other, forming a metal film on the second surface and the side surface of the translucent member, and forming the metal film on the second surface of the translucent member Removing the metal film and forming a metal film-coated light-transmissive member having a metal film on the side surface, a light emitting surface, an electrode forming surface opposite to the light emitting surface, and a side surface between the light emitting surface and the electrode forming surface Arranging a light emitting element comprising the light emitting element, the second surface of the light transmitting member of the light transmitting member with a metal film, and the light emitting surface of the light emitting element, a side surface of the light emitting element, metal Forming a covering member for covering the side surface of the film-coated translucent member, and a method of manufacturing a light emitting device.

The light emitting device of the embodiment of the present invention includes the following configuration.
A translucent member comprising a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface, a light emitting surface, and a light emitting surface opposite to the light emitting surface A light emitting element comprising: an electrode forming surface; and a side surface between the light emitting surface and the electrode forming surface, wherein the light emitting surface is disposed to face the first surface of the translucent member; Covering member for covering a metal film having a side surface portion disposed on the second surface side and an extending portion extending laterally from the side surface portion on the second surface side, a side surface of the light emitting element, and a side surface of the side surface portion of the metal film And a light emitting device.

  According to the method of manufacturing a light emitting device according to the embodiment of the present invention, it is possible to manufacture a compact light emitting device with high light extraction efficiency.

It is a schematic plan view explaining the manufacturing method of the light emitting device of one embodiment. It is a schematic sectional drawing in the IB-IB line of FIG. 1A. It is a schematic plan view explaining the manufacturing method of the light emitting device of one embodiment. It is a schematic sectional drawing in the IIB-IIB line of FIG. 2A. It is a schematic plan view explaining the manufacturing method of the light emitting device of one embodiment. It is a schematic sectional drawing in the IIIB-IIIB line of FIG. 3A. It is a schematic plan view explaining the manufacturing method of the light emitting device of one embodiment. It is a schematic sectional drawing in the IVB-IVB line of FIG. 4A. It is a schematic plan view explaining the manufacturing method of the light emitting device of one embodiment. It is a schematic sectional drawing in the VB-VB line of FIG. 5A. It is a schematic plan view explaining the manufacturing method of the light emitting device of one embodiment. It is a schematic sectional drawing in the VIB-VIB line of FIG. 6A. It is a schematic sectional drawing which shows an example of the light-emitting device obtained by the manufacturing method of the light-emitting device of one Embodiment. It is a schematic sectional drawing which shows an example of the light-emitting device obtained by the manufacturing method of the light-emitting device of one Embodiment. It is a schematic sectional drawing which shows an example of the light-emitting device obtained by the manufacturing method of the light-emitting device of one Embodiment. It is a schematic sectional drawing which shows an example of the metal film provided translucent member of one Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting device and the manufacturing method thereof to be described below are for embodying the technical idea of the embodiment, and are not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, etc. of the component parts do not limit the technical scope of the present invention, and may be exaggerated for the sake of clarity. The embodiments described below can be applied by appropriately combining each configuration and the like.

First Embodiment
FIG. 7 is an example of a light emitting device 100 obtained by the method of manufacturing a light emitting device according to the embodiment. The light emitting device 100 includes the light emitting element 5, the translucent member 2, the covering member 6, and the metal film 3. The translucent member 2 is disposed on the light emitting surface of the light emitting element 5, and the covering member 6 is disposed on the side surface of the light emitting element 5. The metal film 3 includes a side surface portion 31 disposed on the side surface of the light transmitting member 2 and an extending portion 32 extending on the upper surface of the covering member 6. Hereinafter, a method of manufacturing the light emitting device 100 having such a configuration will be described. The light transmitting member 2 and the metal film 3 are collectively referred to as a light transmitting member 10 with a metal film.

  The method of manufacturing the light emitting device according to the first embodiment includes, as shown in FIGS. 1A to 6B, 1) placing the first surface Q of the translucent member 2 on the upper surface of the support member 1; Forming the metal film 3 on the second surface R and the side surface T of the member 2; 3) removing the metal film 3 formed on the second surface R of the light-transmissive member 2; Forming the metal film-coated light-transmissive member 10 having the metal film 3 on the side surface T of 4), 4) the light-emitting element 5, and the light-emitting surface thereof with the second surface R 'of the metal film-attached light-transmissive member 10 And 5) forming a covering member 6 for covering the side surface of the light emitting element 5 and the side surface of the light transmitting member 10 with a metal film.

  Each process concerning a manufacturing method of a light emitting device of this embodiment 1 can be performed as follows, for example.

1. A step of arranging the translucent member 2 on the support member 1 A step of arranging the first surface Q of the translucent member 2 to face the upper surface of the support member 1 is performed. In the first embodiment, the plurality of light transmitting members 2 are separated from each other, and the first surface Q of the light transmitting member 2 is disposed to face the upper surface of the support member 1. This step can be performed, for example, as follows.

  As shown in FIGS. 1A and 1B, a plurality of translucent members 2 are disposed on the support member 1 so as to be separated from each other. The translucent member 2 is formed, for example, by placing a sheet-like translucent member, which is a raw material of the translucent member, on the support member 1 and cutting it by dicing, a luteter, a cutting die, a knife or the like. Can. In addition, the translucent member 2 formed in a predetermined shape in advance may be placed on the support member 1. The light-transmissive member 2 can be formed into a light-emitting device having uniform characteristics with high yield by selecting color characteristics and the like and using materials having desired characteristics.

  The planar shape of the translucent member 2 may be any of a circle, an ellipse, a triangle, a polygon such as a quadrangle and a hexagon, or the like. Moreover, the size and thickness of the translucent member 2 can be selected suitably. In the first embodiment, for example, the translucent member 2 having a square planar shape can be used.

  In the first embodiment, a plurality of such first surfaces Q of the light-transmissive member 2 are in contact with the support member 1 and a plurality of second surfaces R of the light-transmissive member 2 are disposed opposite to the support member 1. The light transmissive member 2 is spaced apart and disposed on the support member 1. Thus, the metal film can be easily formed in a later step, and the first surface Q of the light-transmissive member can be easily exposed.

  It is necessary that the distance at which the plurality of light transmitting members 2 are disposed (the distance to the adjacent light transmitting member 2) be at least greater than the thickness of the metal film 3 to be formed later. In the case where the metal film 3 is formed on both of the two opposing side surfaces of the adjacent light transmitting members 2, the distance between the light transmitting members 2 needs to be at least twice the thickness of the metal film 3 It is. Further, the upper limit of the distance to the adjacent light transmitting member 2 is not particularly limited, and can be set arbitrarily. Depending on the arrangement accuracy of the light emitting element 5, the cutting position accuracy in the subsequent singulation process, and the configuration of the covering member 6, the translucent member 2 arranges the plurality of translucent members 2 in a matrix, for example. In the longitudinal direction and the lateral direction, intervals of about 0.1 μm to 300 μm can be provided. Thereby, on the supporting member 1 exposed between the side surface T between the first surface Q and the second surface R and the side surface T of the adjacent light transmitting member 2 in a later step, It is easy to form the metal film 3. The metal film 3 formed on the side surface T of the light transmitting member 2 is also referred to as the side surface portion 31, and the metal film 3 formed on the support member 1 is also referred to as the extending portion 32. In addition, the support member 1 exposed between the adjacent light transmitting members 2 is also referred to as an outer peripheral portion of the first surface Q of the light transmitting member 2.

  When disposing the translucent member 2 on the support member 1, for example, the translucent member 2 can be fixed by the adhesive layer by the support member 1 being provided with the adhesive layer. For example, those known in the art such as dicing tapes having a UV-curable adhesive layer can be used as the support member 1.

2. Step of Forming Metal Film 3 Next, the metal film 3 is formed on the second surface R and the side surface T of the light-transmissive member 2. By using a member having a high reflectance as the metal film 3, light can be efficiently extracted from the first surface Q which is the light emitting surface of the translucent member 2.

  As described above, the metal film 3 continuous to the second surface R and the side surface T among the plurality of light transmitting members 2 disposed on the support member 1 is formed. Further, the metal film 3 is formed also on the supporting member 1 (the outer peripheral portion of the first surface Q of the light transmitting member 2) exposed between the adjacent light transmitting members 2. Thus, it is preferable to form the metal film 3 continuously on the side surface T of the light transmitting member 2 and the upper surface of the support member 1. Furthermore, it is preferable to form the metal film 3 continuously on the side surfaces T of the plurality of light transmitting members 2 and the upper surface of the support member 1. Thereby, the metal film 3 can be easily formed on the side surface T of the light-transmissive member 2 and the outer peripheral portion of the first surface Q of the light-transmissive member 2.

  The metal film 3 can be formed by any method such as ALD, CVD, sputtering or vapor deposition. Above all, the metal film 3 can be easily formed by sputtering. In particular, in the case where the distance between adjacent light transmitting members 2 is relatively narrow, it is preferable to use sputtering. The metal film 3 may be a single layer or may be a laminated film in which a plurality of layers are laminated. Further, the metal film 3 may be formed collectively for a plurality of light transmitting members 2 or may be formed in plural times.

3. Step of Forming a Light Transmissive Member with a Metal Film Next, as shown in FIGS. 3A and 3B, the metal film 3 formed on the second surface R of the light transmissive member 2 is removed. The metal film 3 can be removed by cutting, polishing, cutting, etching or the like. By removing the metal film 3 on the second surface R of the translucent member 2, the translucent member 2 can be exposed. Thereby, the metallic film provided translucent member 10 provided with the metallic film 3 on the side surface T can be obtained. In addition to the metal film 3, a part of the translucent member 2 may be removed. In that case, the second surface R of the light-transmissive member 2 is removed, but the surface of the light-transmissive member 2 newly exposed is also the surface opposite to the first surface Q. It is called 2-sided R. Further, the surface of the light-transmissive member 10 with a metal film including the second surface R of the light-transmissive member 2 is referred to as a second surface R ′.

  It is preferable that the exposed translucent member 2 and the upper surface of the side surface portion of the metal film 3 be substantially the same surface. As a result, in order to reduce the decrease in adhesion between the covering member 6 and the metal film 3 provided in a later step, in this step, the upper surfaces of the metal film 3 and the light transmitting member 2 are substantially coplanar. It is preferable to make it flat. From such a viewpoint and a viewpoint of improving mass productivity, it is preferable to expose the translucent member 2 and the metal film 3 by grinding.

4. Step of disposing the light emitting element Next, as shown in FIGS. 4A and 4B, the light emitting element 5 is disposed so that the light emitting surface thereof faces the second surface R ′ of the light transmitting member 10 with a metal film. . The light emitting element 5 includes a semiconductor layer including at least a light emitting layer, and has a light emitting surface and a pair of positive and negative electrodes 5 a and 5 b on an electrode forming surface which is a surface opposite to the light emitting surface. Thus, the light emitting elements 5 separated individually from the wafer state are used. For example, after selection of characteristics, by using only one having desired characteristics for manufacturing a light emitting device, a light emitting device with less variation can be formed.

  The planar shape of the light emitting element 5 may be any of a circle, an ellipse, a triangle, and a polygon such as a square and a hexagon. In addition, the size and thickness of the light emitting element 5 can be appropriately selected. In the first embodiment, for example, the light emitting element 5 having a square planar shape can be used.

  In the first embodiment, by arranging the electrodes 5a and 5b of such a light emitting element 5 upward on the second surface R ′ of the light transmitting member 10 with a metal film, the covering member 6 is provided in a later step. Easy to form. Furthermore, the covering member 6 can be easily formed so as to expose the electrodes 5 a and 5 b of the light emitting element 5.

  When disposing the light emitting element 5 on the second surface R ′ of the light transmitting member 10 with a metal film, for example, an adhesive is previously disposed on the second surface R ′, and the light emitting element 5 is disposed on the adhesive It can be arranged and fixed. As the adhesive, those known in the art such as resins can be used. In particular, it is preferable to use a highly translucent resin. For example, it is preferable to use a silicone resin such as dimethyl silicone or phenyl silicone.

5. Step of Forming Cover Member 6 Next, as shown in FIGS. 5A and 5B, a cover member 6 is formed to integrally cover the light emitting element 5 and the light transmitting member 10 with a metal film.

  In detail, the covering member 6 which covers at least the side surface of the light emitting element 5 and the side surface of the light transmitting member 10 with a metal film is formed. Further, it is preferable to form the covering member 6 so as to also cover the metal film 3 (the extending portion 32) formed on the upper surface of the support member 1.

  As shown in FIGS. 5A and 5B, the covering member 6 is formed to cover the electrodes 5a and 5b. Thus, the covering member 6 covering the electrode surface of the light emitting element 5 can be easily formed. The covering member 6 may be formed such that at least a part of the electrodes 5a and 5b is exposed.

  The covering member 6 can be formed by molding by transfer molding, compression molding, screen printing, potting, spraying or the like. In particular, in the case where the adjacent light emitting element 5 or the adjacent light transmitting member 10 with a metal film are disposed at relatively narrow intervals, molding using a mold such as compression molding, compression mold, transfer mold, etc. The method is preferred. In addition, the covering member 6 may be formed collectively, and may be divided and formed in multiple times.

  Next, as shown in FIGS. 6A and 6B, a part of the covering member 6 is removed to expose the upper surface of the electrodes 5a and 5b of the light emitting element 5 from the surface (upper surface) of the covering member 6. Thus, an electrode for supplying electricity to the light emitting element 5 can be formed. It is preferable to make it flat so that the upper surfaces of the covering member 6 and the electrodes 5a and 5b may be substantially the same plane. As a result, when the light emitting device 100 is secondarily mounted on a wiring board or the like, it is possible to suppress a decrease in adhesion between the electrodes 5a and 5b and the wiring of the wiring board. The exposure of the electrodes 5a and 5b can be performed by a method such as grinding, cutting or etching. In order to make the covering member 6 and the electrodes 5a and 5b flush, grinding is preferable.

6. Next, the light emitting device 100 is formed by removing the covering member 6 and a part of the metal film 3. Specifically, as shown in FIGS. 6A and 6B, the covering member 6 and the metal film 3 between the plurality of light emitting elements 5 are cut in a line shape. At the time of cutting, the removing portion 8 having a constant width is removed according to the width of the cutting blade or the like used for cutting. Thereby, the light emitting device 100 separated can be obtained.

  Removal of a part of the covering member 6 and a part of the metal film 3 can be performed by a cutting method known in the art, such as blade dicing using a blade, laser dicing, cutter scribing, drill, blast using a mask, etc. Can be used.

  When the shapes of the plurality of light transmitting members 2 (the light transmitting member 10 with a metal film) disposed on the support member 1 and the light emitting element 5 disposed on the top thereof are the same, the covering member 6 is easily cut. . Furthermore, the cover member 6 and the metal film 3 are efficiently cut by arranging so that the side faces of the rectangular light transmitting member 2 and the light emitting element 5 disposed on the second surface R face each other in top view. And the light emitting device can be singulated.

  The individualization of the light emitting device may be performed simultaneously with the molding of the covering member 6 in addition to the method of removing and cutting a part of the integrally formed covering member 6 and the like as described above . For example, a mold for molding the covering member 6 may be used to cover the light emitting element 5 and to form the covering member 6 in a shape having four side surfaces of the light emitting device. In addition, singulation of a light-emitting device may be performed before the exposure process of the above-mentioned electrode 5a, 5b, and may be performed after. When singulating the light emitting device after the step of exposing the electrodes 5a and 5b of the light emitting element 5, a part of the covering member 6 and the metal film are confirmed while the positions of the electrodes 5a and 5b of the light emitting element 5 are confirmed with a camera. Since a part of 3 can be removed, it can be singulated with high positional accuracy, which is preferable.

  It is preferable that the cutting line (the position of the removal portion 8) be in a linear shape continuous across the plurality of light transmitting members 2 and the light emitting elements 5. Thereby, it can cut | disconnect easily by shaping | molding by cutting or a metal mold | die. Note that when one light emitting element is provided in the light emitting device, the periphery of one light emitting element is cut. Further, in the case where one light emitting device includes a plurality of light emitting elements 5, cutting is performed in a region surrounding the plurality of light emitting elements.

  Through the above steps, the light emitting device 100 as shown in FIG. 7 can be obtained. In the light emitting device having such a configuration, the side surface portion 31 of the metal film 3 formed on the side surface T of the light transmitting member 2 can block the light leaking from the side surface of the light transmitting member 2. Furthermore, by providing the extended portion 32 of the metal film 3 on the outer peripheral portion of the first surface Q of the light-transmissive member 2, light leaking from other than the first surface Q of the light-transmissive member 2 can be blocked. The contrast between the light emitting area and the non-light emitting area can be increased.

  Further, as the light emitting device 200, the lens 9 may be provided on the second surface R 'of the light transmitting member 10 with a metal film as shown in FIG. In that case, it is preferable to form the lens 9 so as to cover the first surface Q of the light-transmissive member 2 and the upper surface of the metal film 3. This can suppress peeling or damage of the upper surface of the metal film 3. The formation of the lens 9 may be before or after singulation of the light emitting device.

Second Embodiment
FIG. 9 is an example of a light emitting device 300 obtained by the method of manufacturing a light emitting device according to the second embodiment. The light emitting device 300 includes the light emitting element 5, the translucent member 2, the covering member 6, and the metal film 3. In the light emitting device 100 according to the first embodiment, as shown in FIG. 7, the metal film 3 is configured by the side surface portion 31 and the extending portion 32 extending sideward from the upper end of the side surface portion 32. The second embodiment differs in that the metal film 3 is only the side surface portion 31. Therefore, on the top surface of the light emitting device 200, the metal film 3 is disposed in a frame shape around the light transmitting member 2, and the top surface of the covering member 6 is disposed on the outer periphery thereof. As a result, the difference in contrast between the light emitting area and the non-light emitting area is increased as an optical characteristic, and the light flux is increased, and light is retained in the lens by arranging the extending portion 32 of the metal film 3 with good reflection efficiency on the lens bottom. Output efficiency of the

  In the light emitting device 300 as described above, in the manufacturing method shown in the first embodiment, as shown in FIG. 3B, the metal film 3 on the second surface R of the light transmitting member 2 separated is removed to transmit light. It is obtained by including the process of removing the part corresponded to the extending part 32 of the metal film 3 after the process of exposing the member 2. In detail, as shown in FIG. 10, it comprises a step of forming a light transmitting member with metal film 10A having only the side surface portion 31 of the metal film 3 on the side surface of the light transmitting member 2, By performing the steps in the same manner as in Embodiment 1, the light emitting device 300 can be obtained.

  In the first embodiment, the step of mounting the light emitting element 5 on the light transmitting member 10 with the metal film including the extending portion 32 is described as an example, but the extending portion as illustrated in the second embodiment is The metal film provided translucent member 10A which is not provided can handle this member alone. By removing the extending portion 32 of the metal film 3 formed continuously, it is possible to obtain the individual light transmitting member 10A with a metal film, so this is placed on the light emitting surface of the light emitting element 5 Can be placed.

  Hereinafter, each component in the light emitting device of the embodiment and the method for manufacturing the same will be described.

(Supporting member 1)
The support member 1 can use sheet-like resin, ceramics, glass or the like. In particular, it is preferable to use a sheet-like polyimide resin from the viewpoint of heat resistance. The planar shape, size, thickness and the like of the support member 1 can be appropriately adjusted depending on the size and the number of the light transmissive members 2 to be disposed. In particular, when the support member 1 is a sheet-like support member 1 having a uniform thickness and a flat surface, the translucent member 2 can be stably disposed, which is preferable.

(Translucent member 2)
The light transmitting member 2 may be any member having light transmitting property (for example, light transmittance of 50% or more, preferably 70% or more, more preferably 85% or more) with respect to light emitted from the light emitting element. As a base material of the translucent member 2, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resin or hybrid resin thereof can be used. Among them, silicone resins or modified resins or hybrid resins thereof are preferable because they are excellent in heat resistance and light resistance. It may be glass. The translucent member 2 can be configured by forming one of these base materials in a single layer or by laminating two or more of these base materials. In addition, as the light-transmissive member 2, a sintered body of a phosphor and an inorganic substance (for example, alumina), a plate crystal of a phosphor, or the like can be used.

(Metal film 3)
As a material of the metal film 3, a metal or an alloy having high reflectance can be used. In particular, the metal film 3 is preferably silver, aluminum or an alloy thereof. The thickness of the metal film 3 is preferably 1 nm to 100 nm. With such a relatively thin metal film, a compact light emitting device can be formed.

(Light-emitting element 5)
As the light emitting element 5, a light emitting diode, a laser diode or the like generally used in the relevant field can be used. For example, the nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, III-V group compound semiconductor such as GaAs, ZnSe, II-VI group Various semiconductors such as compound semiconductors can be used. Note that the light emitting element 5 may have a substrate for growing a semiconductor layer. Examples of the substrate include insulating substrates such as sapphire, and substrates made of oxides such as lithium niobate and neodymium gallium oxide lattice-joined to SiC, ZnO, Si, GaAs, diamond, and nitride semiconductors. The substrate may be removed using a laser lift off method or the like.

(Covering member 6)
The covering member 6 can be made of, for example, a material in which a resin that is a base material contains a light reflective or light absorbing material. Thereby, the covering member 6 can be easily formed into a desired shape. As resin, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, unsaturated polyester resin, polyimide resin, modified polyimide resin, phenol resin, urethane resin, acrylate resin, urea resin, acrylic resin, polyphthalamide (PPA), polyphenylene sulfide (PPS), liquid crystal polymer (LCP) and the like. You may use these individually or in combination of 2 or more types of resin. In particular, in view of heat resistance and light resistance, silicone resins, modified silicone resins, or hybrid silicone resins are preferable. Further, from the viewpoint of adhesiveness, epoxy resins, modified epoxy resins, and hybrid epoxy resins are preferable. The thickness of the covering member 6 (the distance from the side surface of the light emitting element 5 to the side surface of the light emitting device) is, for example, 10 μm to 100 μm to sufficiently block the light of the light emitting element from other than the main light emitting surface Q , A small light emitting device can be formed.

  As the filler contained in the covering member, for example, ceramics, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, silicon nitride, boron nitride, mullite, niobium oxide, zinc oxide, barium sulfate, etc. Rare earth oxides (eg, yttrium oxide, gadolinium oxide) and the like can be mentioned. The light-reflecting or light-absorbing substance is preferably contained in an amount of about 20 wt% to 80 wt%, and more preferably about 30 wt% to 70 wt%, based on the total weight of the covering member. Thereby, the light shielding property and the strength of the covering member can be secured.

(Lens 9)
The lens 9 has translucency (for example, light transmittance of 50% or more, preferably 70% or more, more preferably 85% or more) with respect to light emitted from the light emitting element passing through the light transmitting member 2 If it is As a base material of the lens, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resin or hybrid resin thereof can be used. Among them, silicone resins or modified resins or hybrid resins thereof are preferable because they are excellent in heat resistance and light resistance. It may be glass. The lens 9 can be configured by forming one of these base materials in a single layer or by laminating two or more of these base materials.

  The light emitting device according to the embodiment of the present invention may be used for various light emitting devices such as illumination light sources, light sources for various indicators, light sources for vehicles, light sources for displays, light sources for backlight of liquid crystals, light sources for sensors, and traffic lights. Can.

1 support member 2 translucent member (Q first surface, R second surface, T side surface)
3 Metal film (31 side surface of metal film, 32 stretched part)
5 Light emitting elements (5a, 5b electrodes of light emitting elements)
6 Covering member 8 Removal portion 9 Lens 10 Light transmitting member with metal film (R 'second surface)
100, 200, 300 light emitting devices

Claims (15)

A plurality of light transmitting members provided with a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface, and the upper surface of the support member 1; Making the first surfaces face each other and spaced apart from each other;
Forming a metal film on the second surface and the side surface of the translucent member;
Removing the metal film formed on the second surface of the light-transmissive member, and forming a light-transmissive member with a metal film provided with a metal film on the side surface;
A light emitting element comprising a light emitting surface, an electrode forming surface opposite to the light emitting surface, and a side surface between the light emitting surface and the electrode forming surface is a light transmitting element of the light transmitting member with the metal film. Disposing the second surface of the insulating member opposite to the light emitting surface of the light emitting element;
Forming a covering member for covering the side surface of the light emitting element and the side surface of the light transmitting member with the metal film;
A method of manufacturing a light emitting device including:   The method according to claim 1, wherein the metal film is continuously formed on the side surface of the light-transmissive member and the upper surface of the support member.   The method for manufacturing a light emitting device according to claim 2, wherein the covering member is formed by covering a metal film formed on the upper surface of the support member.   3. The method according to claim 2, further comprising the step of forming a lens on the Q surface of the light transmitting member with a metal film, wherein the lens is formed to cover the metal film formed on the upper surface of the support member. The manufacturing method of the light-emitting device as described in 3. A plurality of the light-transmissive members and the light-emitting elements are prepared, and the plurality of light-transmissive members are arranged to be separated from each other and to face the upper surface of the support member.
The manufacturing method of the light-emitting device as described in any one of Claim 1 to 4 which forms the said metal film continuously on the side surface of these translucent members, and the upper surface of the said supporting member.   The method of manufacturing a light emitting device according to any one of claims 1 to 5, wherein the metal film is formed by sputtering.   The method for manufacturing a light emitting device according to any one of claims 1 to 6, wherein the metal film is silver, aluminum, or an alloy thereof.   The method of manufacturing a light emitting device according to any one of claims 1 to 7, wherein a thickness of the metal film is 1 nm to 100 nm.   The manufacturing method of the light-emitting device as described in any one of Claim 1 to 8 which removes the metal film formed in R surface of the said translucent member by grinding or a lute. A translucent member comprising a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface;
A light emitting surface, an electrode forming surface opposite to the light emitting surface, and a side surface between the light emitting surface and the electrode forming surface, the light emitting surface being opposed to the first surface of the translucent member Light emitting elements disposed
A metal film having a side surface portion disposed on the side surface of the translucent member, and an extending portion extending laterally from the side surface portion on the second surface side;

A covering member for covering the side surface of the light emitting element and the side surface of the side surface portion of the metal film;
A light emitting device comprising:   The light emitting device according to claim 10, further comprising: a lens disposed on the second surface of the light transmitting member, wherein the lens covers the extending portion.   The light emitting device according to claim 10, wherein a base material of the covering member is any one of a silicone resin, a modified silicone resin, a hybrid silicone resin, an epoxy resin, a modified epoxy resin, and a hybrid epoxy resin.   The light emitting device according to any one of claims 10 to 12, wherein a thickness of the metal film is 1 nm to 100 nm.   The light emitting device according to any one of claims 10 to 13, wherein the covering member contains a filler, and the filler contains at least one of alumina, silica and titania.   The light emitting device according to any one of claims 10 to 14, wherein the covering member contains a filler, and a blending amount of the filler is 1 wt% or more and 80 wt% or less.

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