JP2019062165A - Processing method of pressure-sensitive adhesive tape and pressure-sensitive adhesive tape sticking device - Google Patents

Abstract

To provide a processing method of pressure-sensitive adhesive tape and a pressure-sensitive adhesive tape sticking device which facilitates removal work of a pressure-sensitive adhesive tape from a winding roller, and reduces man hours required for the disposal work of the pressure-sensitive adhesive tape from the winding roller.SOLUTION: A pressure-sensitive adhesive tape sticking device includes a chuck table 11, a support roller 21 for supporting a sheet roll 14A around which a sheet roll 14A laminating a pressure-sensitive adhesive tape 12 and a separate paper 13 is wound, transportation rollers 22, 23 for feeding the pressure-sensitive adhesive tape 12 from the sheet roll 14A and transporting, a clip unit 30 for clipping a needed area 12A being stuck to a wafer 100 from the fed-out pressure-sensitive adhesive tape 12, and a winding unit 27 for winding the unnecessary region 12B left after clipping. The winding unit 27 includes a winding roller 28 extending in the rotational axis direction, and a spiral tube 29 adhering to the winding roller 28 when applied to the outer peripheral surface 28A of the winding roller 28, and having the bore diameter slidable in the rotational axis direction of winding roller 28.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of treating an adhesive tape and an adhesive tape sticking apparatus.

  Generally, a plate-like workpiece (plate-like object) including various electronic devices such as a semiconductor wafer and a package substrate is divided into individual chips by a grinding apparatus which thins with a grinding stone, a cutting blade or a laser beam Cutting devices or laser processing devices are known. In these various processing apparatuses, although the workpiece is held by the chuck table, it is necessary to prevent the contact surface with the chuck table from being damaged. For this reason, conventionally, an adhesive tape such as a protective tape or a dicing tape is generally attached to a workpiece held by a chuck table. This type of pressure-sensitive adhesive tape is formed in a strip shape, and after it is temporarily bonded to the release sheet, the necessary area matched to the size of the workpiece is cut (cut off), and then peeled off from the release sheet, It adheres to a to-be-processed object (patent document 1). On the other hand, an unnecessary area other than the above-mentioned necessary area in the adhesive tape is wound around and collected by the winding roller, and when collected more than a predetermined amount, the operator removes it from the winding roller and discards it.

JP, 2006-005131, A

  However, in the conventional configuration, the unnecessary area of the adhesive tape is tight and wound in a large amount on the winding roller. For this reason, when disposing of the adhesive tape, it is necessary for the operator to remove the adhesive tape from the winding roller by cutting off the wound adhesive tape with a cutter or the like. was there.

  The present invention has been made in view of the above, and an adhesive tape processing method and adhesive tape affixing can be achieved by removing the adhesive tape from the winding roller and facilitating the work and reducing the number of steps required to dispose the adhesive tape. It aims at providing a dressing device.

  In order to solve the problems described above and to achieve the object, according to the present invention, a band-like adhesive tape wound in a roll is drawn out, and a necessary area is cut off and the unnecessary adhesive tape left is wound. A method of treating an adhesive tape for removing the unnecessary adhesive tape from a winding roller, wherein when attached to the outer periphery of the winding roller, it adheres to the winding roller and has an inner diameter that can slide in the axial direction of the winding roller. A spiral tube mounting step of mounting a spiral tube on an outer periphery of the winding roller; winding the unnecessary adhesive tape with the necessary area cut off on the outer periphery of the winding roller via the spiral tube Winding step, pulling out the wound unnecessary adhesive tape together with the spiral tube from the winding roller, and pulling out the spa from the inner periphery of the drawn unnecessary adhesive tape And removal step of removing while deforming the Lal tube, but with a.

  According to this configuration, by attaching the spiral tube to the winding roller in advance, the adhesive tape can be pulled out from the winding roller together with the spiral tube. Furthermore, the spiral tube can be deformed and removed easily from the inner periphery of the drawn unnecessary adhesive tape. For this reason, by cutting off the wound adhesive tape with a cutter or the like, the operation of removing the adhesive tape from the winding roller becomes unnecessary, and the number of steps required for the adhesive tape discarding operation can be reduced.

  In this configuration, in the spiral tube mounting step, the spiral tube is fixed to the winding roller at a position where the end of the spiral tube is exposed from the widthwise end of the unnecessary adhesive tape wound around the winding roller. It may be wound.

  Further, according to the present invention, there is provided a chuck table for holding a plate-like object, a support roller for supporting a tape roll on which a strip-like adhesive tape is wound in a roll, and the adhesion from the tape roll supported by the support roller. An adhesive tape comprising: a feeding unit for feeding a tape; a cutting unit for cutting a necessary area to be attached to a plate from the fed adhesive tape; and a winding unit for winding the unnecessary adhesive tape left after cutting. The winding device is a sticking device, and the winding unit closely contacts the winding roller when mounted on the winding roller extending in the direction of the rotation axis and mounted on the outer periphery of the winding roller, and the axis of the winding roller And a spiral spiral tube having an inner diameter slidable in a direction.

  According to the present invention, the adhesive tape can be pulled out from the winding roller together with the spiral tube by attaching the spiral tube to the winding roller in advance. Furthermore, the spiral tube can be deformed and removed easily from the inner periphery of the drawn unnecessary adhesive tape in the form of a roll, and the number of steps required to dispose of the adhesive tape can be reduced.

FIG. 1 is a schematic configuration view of a tape bonding apparatus according to the present embodiment. FIG. 2 is a front view of the winding unit. FIG. 3 is a cross-sectional view of the winding unit. FIG. 4 is a flow chart showing the procedure of the processing method for removing the adhesive tape from the winding unit. FIG. 5 is a cross-sectional view showing a state in which an adhesive tape is wound around a winding unit. FIG. 6 is a cross-sectional view showing how the adhesive tape and the spiral tube are pulled out of the winding roller. FIG. 7 is a cross-sectional view showing how the spiral tube is removed from the adhesive tape. FIG. 8 is a front view of a winding unit according to a modification.

  A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the components described below include those which can be easily conceived by those skilled in the art and those which are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or modifications of the configuration can be made without departing from the scope of the present invention.

  FIG. 1 is a schematic configuration view of a tape bonding apparatus according to the present embodiment. The tape bonding apparatus (adhesive tape bonding apparatus) 10 is, as shown in FIG. 1, for a chuck table 11 for holding a wafer (plate-like object) 100 and the wafer 100 held on the chuck table 11. The transport unit 20 transports and sticks the adhesive tape 12, and the cutting unit 30 cuts out the necessary area 12A from the adhesive tape 12 according to the shape of the wafer 100.

  In the present embodiment, the wafer 100 to which the adhesive tape 12 is attached is a disk-shaped semiconductor wafer having silicon as a base material, an optical device wafer having sapphire, SiC (silicon carbide) or the like as a base material, and a package resin substrate , Ceramic substrates, glass substrates and the like. This kind of wafer 100 is divided into a plurality of areas by grid-like planned dividing lines formed on the surface, and devices are formed in each area.

  The chuck table 11 is formed to have a diameter larger than the diameter of the wafer 100, and is configured to suction and hold the wafer 100 on the holding surface 11A by suction means (not shown). Further, the chuck table 11 is configured to be movable in the vertical direction, and is positioned at a tape application position shown in FIG. 1 and a wafer attachment / detachment position (not shown) which is lower than the tape application position.

  The adhesive tape 12 is, for example, a dicing tape or a protective tape, and is formed in a strip shape with an adhesive layer on one side. In the present embodiment, the adhesive tape 12 is conveyed in the state of the laminated sheet 14 in which the release paper 13 is temporarily adhered to the adhesive layer. The transport unit 20 includes a support roller 21 supporting a sheet roll (tape roll) 14A in which a long laminate sheet 14 is wound in a roll shape, and a sheet roll 14A supported by the support roller 21. Conveying rollers (feeding units) 22 and 23 for feeding and conveying the adhesive tape 12) are provided. The transport unit 20 also includes a peeling roller 24 that peels the peeling paper 13 from the laminated sheet 14 and a peeling paper winding roller 25 that winds the peeling paper 13 that has been peeled. The transport unit 20 further includes a pressure roller 26 for pressing and sticking the adhesive tape 12 to the wafer 100 and a winding unit for winding the unnecessary area (unnecessary adhesive tape) 12B of the adhesive tape 12 from which the necessary area 12A is cut off. And 27.

  The conveyance rollers 22 and 23 are disposed across the chuck table 11 in the conveyance direction of the adhesive tape 12. The transport rollers 22 and 23 are rotated by the power of the motor, and transport the adhesive tape 12 in a predetermined transport direction by this rotation. The transport rollers 22 and 23 stop, for example, when transporting a distance slightly longer than the diameter of the wafer 100 (the required area 12A), and start to be transported again when the adhesive tape 12 is attached and cut. The support roller 21 rotates the sheet roll 14A in accordance with the conveyance of the laminated sheet 14 (adhesive tape 12), whereby the laminated sheet 14 is drawn out.

  The peeling roller 24 is disposed between the support roller 21 and the conveyance roller 22 and contacts the peeling sheet 13 of the laminated sheet 14. The peeling roller 24 is rotationally driven in accordance with the conveyance of the laminated sheet 14 and peels the peeling paper 13 from the laminated sheet 14. The release paper winding roller 25 is disposed at a position close to the peeling roller 24. The release paper winding roller 25 is rotationally driven in accordance with the rotation of the transport rollers 22 and 23 and is wound in a roll without slack so that the peeled release paper 13 does not stick to the adhesive layer of the adhesive tape 12.

  The pressing roller 26 is disposed between the conveying rollers 22 and 23 and rotates and moves between the broken line position and the solid line position shown in FIG. 1 when the chuck table 11 is at the tape bonding position, and the adhesive tape 12 Is affixed to the wafer 100. The winding unit 27 is disposed downstream of the transport roller 23 in the transport direction.

  The cutting unit 30 is disposed above the chuck table 11 with the adhesive tape 12 interposed therebetween. The cutting unit 30 has a rotary shaft 31 disposed on the same axis P, a rotary plate 32 connected to the rotary shaft 31, a cutter support member 33 mounted on the lower surface of the rotary plate 32, and the cutter support And a cutter blade 34 attached to the member 33. The cutting unit 30 is configured to be movable in the vertical direction, and is positioned at the tape cutting position shown in FIG. 1 and a retracted position which is higher than the tape cutting position. When the cutting unit 30 ascends to the retracted position, the pressing roller 26 moves on the chuck table 11 to stick the adhesive tape 12 to the wafer 100.

  The rotary plate 32 has, for example, the same size as the chuck table 11, and the cutter support member 33 is configured to be movable in the radial direction of the rotary plate 32. The cutter support member 33 (cutter blade 34) is set at a position matched to the size of the wafer 100, and the adhesive tape 12 is cut along the outer peripheral edge of the wafer 100 by rotating the cutter blade 34 together with the rotary plate 32. The necessary area 12A is cut out. The unnecessary area 12B of the adhesive tape 12 from which the necessary area 12A has been cut is taken up by the winding unit 27.

  Next, the winding unit 27 will be described. FIG. 2 is a front view of the winding unit, and FIG. 3 is a cross-sectional view of the winding unit. As shown in FIGS. 2 and 3, the winding unit 27 includes a winding roller 28 and a spiral tube 29 mounted on an outer peripheral surface 28A of the winding roller 28. The winding roller 28 is a cylindrical body that rotates around the rotation axis Q, and the longitudinal direction extends along the rotation axis Q. The winding roller 28 is formed of a rigid metal material (for example, iron or stainless steel), and in the present embodiment, the diameter is set to, for example, 40 mm. Further, the length in the longitudinal direction of the winding roller 28 is formed longer than the width of the adhesive tape 12. As shown in FIG. 1, the winding roller 28 is rotationally driven in accordance with the rotation of the transport rollers 22 and 23 to wind the unnecessary area 12 B of the adhesive tape 12. In the present embodiment, the adhesive tape 12 is wound around the winding roller 28 via the spiral tube 29 with the adhesive layer facing the winding roller 28.

  The spiral tube 29 is a member formed by spirally winding a flexible strip member in a spiral shape as shown in FIG. 2 and, for example, a flexible resin such as polyethylene, nylon, or fluorine resin. It is formed of a material. The spiral tube 29 has a substantially cylindrical shape with an inner diameter (for example, 20 mm) smaller than the diameter of the winding roller 28 in a normal state in which the spiral tube 29 is disposed alone, and is easily deformed by an external force to form the outer peripheral surface 28A of the winding roller 28 Wrapped around. In the present embodiment, for example, part number SS-20N manufactured by Shinagawa Shoko Co., Ltd. is used as the spiral tube 29. The spiral tube 29 wound around the outer peripheral surface 28A of the winding roller 28 is in close contact with the outer peripheral surface 28A of the winding roller 28 by an elastic force (force to return to the original shape). Thereby, the spiral tube 29 rotates integrally with the winding roller 28 without idling with respect to the winding roller 28. On the other hand, the adhesion of the spiral tube 29 is not so great. Therefore, for example, when the operator moves the spiral tube 29 in the direction in which the rotational axis Q of the winding roller 28 extends, the spiral tube 29 slides along the outer peripheral surface 28A of the winding roller 28. Can be removed.

  Next, a processing method for removing the adhesive tape 12 (the unnecessary area 12B) wound around the winding unit 27 will be described. FIG. 4 is a flow chart showing the procedure of the processing method for removing the adhesive tape from the winding unit. First, the spiral tube 29 is mounted on the outer peripheral surface 28A of the winding roller 28 (step S1; spiral tube mounting step). Specifically, as shown in FIG. 2, the spiral tube 29 is spirally wound around the outer peripheral surface 28A of the winding roller 28 while being deformed. Under the present circumstances, it is preferable to mount so that the both ends 29A and 29A of the spiral tube 29 may be located in the vicinity of the both end surfaces 28B and 28B of the winding roller 28, respectively, or the outer side of both end surfaces 28B and 28B. According to this, when the adhesive tape 12 is wound around the winding unit 27, both ends 29A, 29A of the spiral tube 29 are positioned at least outside the adhesive tape 12, so the adhesive tape 12 is wound around the winding roller The spiral tube 29 can be easily handled while preventing direct winding around 28.

  Next, the unnecessary area 12B of the adhesive tape 12 from which the necessary area 12A has been cut is wound around the winding unit 27 (step S2; winding step). This step is performed in parallel with the operation of attaching the adhesive tape 12 to the wafer 100 and cutting out the necessary area 12A of the adhesive tape 12 along the outer periphery of the wafer 100. Specifically, as shown in FIG. 5, the unnecessary region 12 </ b> B of the adhesive tape 12 is wound around the winding roller 28 via the spiral tube 29. The spiral tube 29 is in close contact with the outer peripheral surface 28A of the winding roller 28 by elastic force, so that the winding roller 28 is prevented from idling, and the unnecessary region 12B of the adhesive tape 12 can be wound up. In this embodiment, although the adhesive layer of the adhesive tape 12 faces the winding roller 28, the adhesive layer contacts the winding roller 28 by mounting the spiral tube 29 on the outer peripheral surface 28 A of the winding roller 28. There is nothing to do. Further, both ends 29A of the spiral tube 29 are located outside the both end surfaces 28B of the winding roller 28, and the winding roller 28 is longer than the width of the adhesive tape 12, so at least one end of the spiral tube 29 The portion 29A is exposed from the side (end in the width direction) 12B1 of the unnecessary area 12B of the adhesive tape 12.

  Next, the unnecessary region 12B of the wound adhesive tape 12 is pulled out of the winding roller 28 together with the spiral tube 29 (step S3; pulling step). Specifically, as shown in FIG. 6, the unnecessary region 12B of the adhesive tape 12 and the spiral tube 29 are pulled out from the winding roller 28 in the axial direction (the direction of the arrow in the drawing). At this time, the unnecessary area 12 B of the adhesive tape 12 is tightly wound and integrated on the spiral tube 29. Therefore, when the operator holds the adhesive tape 12 and moves the adhesive tape 12 in the axial direction, the spiral tube 29 slides on the outer peripheral surface 28A of the winding roller 28, and the unnecessary region 12B of the adhesive tape 12 is thereby obtained. And the spiral tube 29 can be easily pulled out of the winding roller 28.

  Next, the spiral tube 29 is removed from the inner periphery of the unnecessary area 12B of the drawn adhesive tape 12 (step S4; removing step). Specifically, as shown in FIG. 7, the end portion 29A of the spiral tube 29 is pulled from the unnecessary area 12B of the adhesive tape 12 in the axial direction (the direction of the arrow in the drawing). Since the end 29A is exposed from the side portion (end in the width direction) 12B1 of the unnecessary area 12B, the end 29A can be easily grasped and pulled. Furthermore, since the spiral tube 29 is formed by forming a flexible belt-like member in a spiral shape, the spiral tube 29 is easily deformed and peeled from the adhesive layer by pulling the end portion 29A, and an unnecessary area It can be removed from the inner circumference of 12B. The removed spiral tube 29 can be reused for mounting the winding roller 28 on the outer peripheral surface 28A (step S1).

  Finally, the adhesive tape 12 (the unnecessary area 12B) from which the spiral tube 29 has been removed is discarded (step S5; discarding step). As described above, since the spiral tube 29 is removed from the pressure-sensitive adhesive tape 12, it is possible to prevent waste in a state in which an excess adheres to the pressure-sensitive adhesive tape 12, and to realize separation of waste.

  Next, modifications of the winding unit will be described. FIG. 8 is a front view of a winding unit according to a modification. In the winding unit 27 described above, the single spiral tube 29 is attached to the outer peripheral surface 28A of the winding roller 28. In this configuration, since the length of the spiral tube 29 is sufficiently longer than the length of the winding roller 28, some complication is assumed when the spiral tube 29 is removed.

  Therefore, as shown in FIG. 8, the winding unit 127 according to the modification includes the winding roller 28 and a pair of spiral tubes 129 and 129 mounted on the outer peripheral surface 28A of the winding roller 28. It has become. The winding roller 28 is the same as that described above, and thus the description thereof is omitted. The spiral tube 129 has the same configuration except that the length is set to half or less of the length of the spiral tube 29 described above. When the spiral tubes 129, 129 are attached to the outer peripheral surface 28A of the winding roller 28, the end portions 129A, 129A of the spiral tubes 129, 129 are positioned outside the end surfaces 28B, 28B of the winding roller 28, respectively. The spiral tubes 129 are spirally wound around the outer peripheral surface 28A of the rotary roller 28 while being deformed. In this case, it is preferable that the winding is performed so that a region where the spiral tubes 129 and 129 are not attached is not generated at the central portion of the outer peripheral surface 28A of the winding roller 28.

  As described above, in the processing method of the adhesive tape according to the present embodiment, the strip-like adhesive tape 12 wound in a roll is drawn out, and the unnecessary region 12B left after the necessary region 12A is cut is wound. The unnecessary area 12B of the adhesive tape 12 is removed from the wound winding roller 28, and when attached to the outer peripheral surface 28A of the wound roller 28, it adheres closely to the wound roller 28 and slides in the axial center direction of the wound roller 28 Spiral tube mounting step S1 for mounting the spiral tube 29, 129 having movable inner diameter to the outer peripheral surface 28A of the winding roller 28, and the unnecessary region 12B of the adhesive tape 12 with the necessary region 12A cut away A winding step S2 of winding around the outer peripheral surface 28A of the winding roller 28 through the tubes 29, 129, and an unnecessary area 1 of the wound adhesive tape 12 Comprises a B from the winding roller 28 and the pulling step S3 withdrawing spiral tube 29, 129 us and a removal step S4 removing while deforming the spiral tube 29, 129 from the inner periphery of the unnecessary area 12B of the adhesive tape 12 is pulled out, the. According to this configuration, by attaching the spiral tubes 29 and 129 to the winding roller in advance, the unnecessary regions 12B of the adhesive tape 12 can be easily pulled out from the winding roller together with the spiral tubes 29 and 129. Furthermore, the spiral tubes 29 and 129 can be easily deformed and removed from the inner periphery of the rolled unnecessary region 12B that has been pulled out. For this reason, as in the prior art, by cutting off the wound unnecessary area 12B with a cutter or the like, the work of removing the unnecessary area 12B from the winding roller 28 becomes unnecessary, and it is necessary to dispose of the unnecessary area 12B of the adhesive tape 12 Man-hours can be reduced.

  Further, according to the present embodiment, in the spiral tube mounting step S1, the end portions 29A, 129A of the spiral tubes 29, 129 are exposed from the side portion 12B1 of the unnecessary area 12B of the adhesive tape 12 wound around the winding roller 28. In this position, since the spiral tube 29, 129 is wound around the winding roller 28, the end portions 29A, 129A can be easily grasped and pulled, and the spiral tube 29 is easily deformed to be in the unnecessary region 12B. It can be removed from the inner circumference. In particular, in the modification, since the area where the spiral tube 129 adheres to the outer peripheral surface 28A of the winding roller 28 is small, the extraction is easy. Furthermore, since the length of the spiral tube 129A is shorter than the length of the winding roller 28, when the spiral tube 129A is removed from the inner periphery of the unnecessary area 12B, the amount of pulling is short and easy to remove.

  Further, the tape bonding apparatus 10 according to the present embodiment is a sheet roll in which the chuck table 11 for holding the wafer 100 and the laminated sheet 14 in which the strip-shaped adhesive tape 12 and the release paper 13 are laminated are wound in a roll. A supporting roller 21 for supporting 14A, transport rollers 22 and 23 for delivering the adhesive tape 12 by feeding it from the sheet roll 14A supported by the supporting roller 21, and a necessary area for sticking to the wafer 100 from the delivered adhesive tape 12 12A and a winding unit 27, 127 for winding the unnecessary area 12B of the adhesive tape 12 left after being cut off, and the winding units 27, 127 extend in the direction of the rotation axis Q. When mounted on the extending winding roller 28 and the outer peripheral surface 28A of the winding roller 28, the winding roller 28 is in close contact with the winding roller 28 and the winding roller 28 28 in the axial direction and slidable inside diameter of the spiral of the spiral tube 29, 129, and those with a. According to this configuration, by attaching the spiral tubes 29 and 129 to the winding roller in advance, the unnecessary regions 12B of the adhesive tape 12 can be easily pulled out from the winding roller together with the spiral tubes 29 and 129. Furthermore, the spiral tubes 29 and 129 can be easily deformed and removed from the inner periphery of the rolled unnecessary region 12B that has been pulled out. For this reason, as in the prior art, by cutting off the wound unnecessary area 12B with a cutter or the like, the work of removing the unnecessary area 12B from the winding roller 28 becomes unnecessary, and it is necessary to dispose of the unnecessary area 12B of the adhesive tape 12 Man-hours can be reduced.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention. For example, in the present embodiment, the wafer 100 is exemplified as a plate-like object to which the adhesive tape 12 is attached. However, the object is not limited to the wafer 100 as long as it is an object having a plate shape. Further, in this embodiment, as the tape bonding apparatus 10, after the adhesive tape 12 is adhered to the wafer 100, the adhesive tape 12 is cut according to the size of the wafer 100 by the cutter blade 34 of the cutting unit 30. Although the structure which winds up the unnecessary area | region 12B with the winding unit 27 and 127 was demonstrated, it does not restrict to this. For example, before sticking the laminated sheet 14 in which the release paper 13 is laminated on the adhesive tape 12 to the wafer 100, only the adhesive tape 12 is cut into a circle according to the size of the wafer 100 by a batch roller etc. While sticking 12 to wafer 100, it is also possible to use with the tape sticking device of the constitution which takes up the unnecessary territory 12B of adhesive tape 12 which remains with the winding unit.

10 Tape sticking device (adhesive tape sticking device)
11 chuck table 11A holding surface 12 adhesive tape 12A necessary area 12B unnecessary area (unnecessary adhesive tape)
12B1 Side (width direction end)
13 release paper 14 laminated sheet 14A sheet roll (tape roll)
20 transport unit 21 support rollers 22 and 23 transport rollers (feed-out unit)
27, 127 winding unit 28 winding roller 28A outer peripheral surface 28B end surface 29, 129 spiral tube 29A, 129A end 30 cutting unit 100 wafer (plate-like material)

Claims (3)

A method for treating an adhesive tape, comprising removing an unnecessary adhesive tape from a winding roller on which a band-like adhesive tape wound in a roll shape is drawn out and the unnecessary adhesive tape remaining after a necessary area is cut off is wound. ,
When mounted on the outer periphery of the winding roller, the spiral tube is attached to the outer periphery of the winding roller. The spiral tube is in close contact with the winding roller and can slide in the axial direction of the winding roller. Step and
Winding the unnecessary adhesive tape from which the necessary area has been cut, around the outer periphery of the winding roller via the spiral tube;
Extracting the wound unnecessary adhesive tape from the winding roller together with the spiral tube;
And removing the spiral tube from the inner periphery of the unnecessary adhesive tape which has been pulled out.   In the spiral tube mounting step, the spiral tube is wound around the winding roller so that the end of the spiral tube is exposed from the widthwise end of the unnecessary adhesive tape wound around the winding roller. The processing method of the adhesive tape of Claim 1. A chuck table for holding a plate-like object, a support roller for supporting a tape roll on which a strip of adhesive tape is wound in a roll, and a feeding unit for feeding the adhesive tape from the tape roll supported by the support roller An adhesive tape attaching apparatus comprising: a cutting unit for cutting out a necessary area to be attached to a plate-like object from the drawn-out adhesive tape; and a winding unit for winding the unnecessary adhesive tape left after being cut off; ,
The winding unit is
A winding roller extending in the rotational axis direction;
An adhesive tape sticking apparatus comprising: a spiral tube having an inner diameter that is in close contact with the winding roller when mounted on the outer periphery of the winding roller and is slidable in the axial direction of the winding roller;

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