JP2019061976A - 基板処理方法及び基板処理装置 - Google Patents
基板処理方法及び基板処理装置 Download PDFInfo
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Abstract
Description
本発明の実施形態に係る基板処理装置について、基板に熱処理を行う装置を例に挙げて説明する。但し、処理対象、処理内容は特に限定されず、ガスを処理容器内に供給して処理を行う種々の処理装置に適用可能である。図1は、本発明の実施形態に係る基板処理装置の概略図である。
次に、図1の基板処理装置のガス導入機構について説明する。図3は、図1の基板処理装置のガス導入機構の一例を示す図である。図4は、図3のガス導入機構の内部構造を説明するための分解斜視図である。
次に、前述した基板処理装置を用いた基板処理方法について説明する。以下の基板処理方法は、例えば制御部150が基板処理装置内の種々の機器の動作を制御することにより実行される。
第1実施形態では、上下方向を回転軸として回転可能な3本のインジェクタと固定された2本のインジェクタとを有する基板処理装置を用いて、原子層堆積(ALD:Atomic Layer Deposition)法により、シリコン酸化膜を形成する場合について説明する。図5は、第1実施形態に係る基板処理方法を説明するための図である。
第2実施形態では、上下方向を回転軸として回転可能な3本のインジェクタを有する基板処理装置を用いて、ALD法により、シリコン酸化膜を形成する場合の別の例について説明する。図6は、第2実施形態に係る基板処理方法を説明するための図である。
第3実施形態では、上下方向を回転軸として回転可能な3本のインジェクタを有する基板処理装置を用いて、ALD法により、シリコン酸化膜を形成する場合の更に別の例について説明する。図7は、第3実施形態に係る基板処理方法を説明するための図である。
第4実施形態では、上下方向を回転軸として回転可能であり、上下方向の上側部分のみにガス孔が形成されたインジェクタを有する基板処理装置を用いて、ウエハに所定の膜を形成する場合について説明する。図8から図10は、第4実施形態に係る基板処理方法を説明するための図である。図8は第4実施形態に係る基板処理方法を行うための基板処理装置の一例を示し、図9は図8の横断面を示し、図10は第4実施形態に係る基板処理方法による効果を説明するための図である。図10中、横軸はウエハボート80に保持されたウエハの位置を示し、縦軸はウエハWに形成された膜の厚さを示す。図10において、「TOP」、「CTR」、及び「BTM」は、それぞれウエハボート80の上側部分、中央部分、及び下側部分に載置されたウエハWを示す。また、「C−T」及び「C−B」は、それぞれ「CTR」と「TOP」との間、「CTR」と「BTM」との間の位置に載置されたウエハWを示す。
110 インジェクタ
111 ガス孔
150 制御部
200 回転機構
W ウエハ
Claims (6)
- 処理容器の内壁面に沿って上下方向に延び、上下方向を回転軸として回転可能なインジェクタの長手方向に沿って設けられた複数のガス孔から処理ガスを供給し、前記処理容器内に収容される基板に対して所定の処理を行う基板処理方法であって、
前記所定の処理は、複数のステップを含み、
前記ステップに応じて前記インジェクタを回転させて前記処理ガスの供給方向を変更する、
基板処理方法。 - 複数のステップは、
前記基板に原料ガスを供給し、前記基板に前記原料ガスを吸着させる吸着ステップと、
前記基板に前記原料ガスと反応する反応ガスを供給し、前記基板に吸着した前記原料ガスと前記反応ガスとを反応させて反応生成物の層を形成する反応ステップと、
を含む、
請求項1に記載の基板処理方法。 - 複数のステップは、
前記基板に成膜ガスを供給し、前記基板に所定の膜を成膜する成膜ステップと、
前記基板に前記膜をエッチングするエッチングガスを供給し、前記所定の膜をエッチングするエッチングステップと、
を含む、
請求項1に記載の基板処理方法。 - 前記インジェクタは、複数の種類の処理ガスを供給可能であり、
前記ステップに応じて、前記処理ガスの種類を変更する、
請求項1乃至3のいずれか一項に記載の基板処理方法。 - 前記ステップの途中で前記インジェクタを回転させて前記処理ガスの供給方向を変更する、
請求項1乃至4のいずれか一項に記載の基板処理方法。 - 処理容器の内壁面に沿って上下方向に延びるインジェクタの長手方向に沿って設けられた複数のガス孔から前記処理容器に収容される基板に対して処理ガスを供給し、前記基板に所定の処理を行う基板処理装置であって、
上下方向を回転軸として前記インジェクタを回転させる回転機構と、
前記インジェクタの動作を制御する制御部と、
を有し、
前記所定の処理は、複数のステップを含み、
前記制御部は、前記ステップに応じて前記インジェクタを回転させて前記処理ガスの供給方向を変更する、
基板処理装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017182928A JP6925214B2 (ja) | 2017-09-22 | 2017-09-22 | 基板処理方法及び基板処理装置 |
KR1020180111201A KR102355738B1 (ko) | 2017-09-22 | 2018-09-18 | 기판 처리 방법 및 기판 처리 장치 |
CN201811095706.5A CN109536919A (zh) | 2017-09-22 | 2018-09-19 | 基板处理方法和基板处理装置 |
US16/136,689 US11560628B2 (en) | 2017-09-22 | 2018-09-20 | Substrate processing method and substrate processing apparatus |
US18/082,670 US20230119730A1 (en) | 2017-09-22 | 2022-12-16 | Substrate Processing Method and Substrate Processing Apparatus |
US18/082,674 US20230118483A1 (en) | 2017-09-22 | 2022-12-16 | Substrate Processing Method and Substrate Processing Apparatus |
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JP6706901B2 (ja) * | 2015-11-13 | 2020-06-10 | 東京エレクトロン株式会社 | 処理装置 |
JP6925214B2 (ja) * | 2017-09-22 | 2021-08-25 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
CN110998806B (zh) * | 2018-03-23 | 2024-05-31 | 株式会社国际电气 | 基板处理装置、半导体装置的制造方法及存储介质 |
JP7170598B2 (ja) * | 2019-07-17 | 2022-11-14 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
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US11560628B2 (en) | 2023-01-24 |
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