JP2019061697A - Wiring body - Google Patents

Abstract

To suppress increase of the electric resistance value of an extraction wiring layer and prevent disconnections between the netlike electrode layer and the extraction wiring layer.SOLUTION: A wiring body 2 includes: an adhesive layer; a netlike electrode layer 22 on the adhesive layer, the electrode layer having first conductors 221A and 221B arranged in the netlike pattern; and an extraction wiring layer 23 on the adhesive layer, the extraction wiring layer extracting the netlike electrode layer to the outside. The extraction wiring layer has second conductors 231A and 231B arranged in the netlike pattern and a mesh part 241 connected to at least a part of the outer edge of the netlike electrode layer in the planar view of the netlike electrode layer. A first adhesive surface between the first conductors 221A and 221B and the adhesive layer is bent in a convex pattern toward the first conductors 221 A and 221B in the cross-sectional view. A second adhesive surface between the second conductors 231A and 231B and the adhesive layer is bent in a convex pattern toward the second conductors 231 A and 231B in the cross-sectional view.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a wiring body.

  DESCRIPTION OF RELATED ART The electroconductive sheet in which the electrode terminal electrically connected with the edge part of the electrode pattern comprised with the metal fine wire contains the mesh shape which consists of a grid | lattice comprised with the metal fine wire is known (for example, refer patent document 1) ).

JP, 2013-127658, A

  In the above technology, when the width of the metal thin wire forming the electrode terminal is small, the electrical resistance value of the electrode terminal is increased, while when the electrode terminal is planar (so-called solid pattern), the electrode There is a problem that stress is concentrated on the boundary between the electrode terminal and the electrode pattern due to the difference in rigidity between the terminal and the electrode pattern, and the electrode terminal and the electrode pattern may be disconnected.

  The problem to be solved by the present invention is to provide a wiring body capable of suppressing the disconnection between the mesh-like electrode layer and the lead wiring layer while suppressing an increase in the electrical resistance value of the lead wiring layer. It is.

[1] A wiring body according to the present invention includes a resin layer, a mesh-like electrode layer provided on the resin layer and having a plurality of first conductor wires arranged in a mesh shape, and provided on the resin layer A lead-out wiring layer for drawing out the mesh-like electrode layer to the outside, and the lead-out wiring layer has a plurality of second conductor wires arranged in a mesh shape, and the plan view of the mesh-like electrode layer And the first adhesive surface between the first conductor wire and the resin layer is directed toward the first conductor wire side in a cross sectional view. The second adhesive surface between the second conductor wire and the resin layer is convexly curved toward the second conductor wire side in a sectional view. The following equations (1) and (2) are satisfied.
W ₁ <W ₂ (1)
R ₁ <R ₂ (2)
However, in said Formula (1), W ₁ is the width | variety of said 1st conductor wire, W ₂ is the width | variety in the said mesh part of said 2nd conductor wire, In said (2) Formula, R ₁ is the curvature of the first adhesive surface, and R ₂ is the curvature of the second adhesive surface.

[2] A wiring body according to the present invention includes a resin layer, a mesh-like electrode layer provided on the resin layer and having a plurality of first conductor wires arranged in a mesh shape, and provided on the resin layer A lead-out wiring layer for drawing out the mesh-like electrode layer to the outside, and the lead-out wiring layer has a plurality of second conductor wires arranged in a mesh shape, and the plan view of the mesh-like electrode layer And a mesh portion connected to at least a part of the outer edge in the following formula, and the following formulas (1) and (3) are satisfied.
W ₁ <W ₂ (1)
S ₁ <S ₂ (3)
However, in the above (1), W ₁ is the width of the first conductor line, W ₂ is the width of the mesh portion of said second conductor lines, in the above (3), S ₁ is the thickness of the resin layer at the bonded portion between the first conductor line, S ₂ is the thickness of the resin layer at the bonded portion between the second conductor line.

[3] A wiring body according to the present invention is provided on a resin layer, a mesh-like electrode layer provided on the resin layer and having a plurality of first conductor wires arranged in a mesh shape, and on the resin layer A lead-out wiring layer for drawing out the mesh-like electrode layer to the outside, and the lead-out wiring layer has a plurality of second conductor wires arranged in a mesh shape, and the plan view of the mesh-like electrode layer And the second conductor wire is provided from an edge of a unit mesh constituting the mesh electrode layer, and the mesh electrode layer and the mesh portion are provided. And the boundary in plan view between them is non-linear and satisfies the following equation (1).
W ₁ <W ₂ (1)
However, in the above (1), W ₁ is the width of the first conductor line, W ₂ is the width of the mesh portion of the second conductor line.

  [4] In the above invention, the aperture ratio of the mesh-like electrode layer may be 85% or more, and the aperture ratio of the mesh portion may be 50% or less.

[5] In the above invention, the following formula (4) may be satisfied.
2 × W ₁ <W ₂ (4)

  According to the present invention, the mesh portion included in the lead wiring layer is connected to at least a part of the outer edge of the mesh electrode layer in plan view, and the width of the first conductor wire of the mesh electrode layer and the mesh The width | variety of the 2nd conductor wire which a part has satisfy | fills said Formula (1). Thereby, the disconnection between the mesh-like electrode layer and the lead-out wiring layer can be suppressed while suppressing an increase in the electrical resistance value of the lead-out wiring layer.

FIG. 1 is a plan view showing a touch sensor provided with a wiring body in the first embodiment of the present invention. FIG. 2 is an enlarged view of a portion II of FIG. FIG. 3 is a cross-sectional view taken along the line III-III of FIG. FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. FIG. 5 is an explanatory view for explaining the aperture ratio. FIG. 6 is a plan view showing a modified example of the wiring body in the first embodiment of the present invention. FIGS. 7A to 7E are cross-sectional views (simplified views) for describing the method of manufacturing the wiring body in the present embodiment. FIG. 8 is a plan view showing a touch sensor provided with a wiring body in the second embodiment of the present invention. FIG. 9 is an enlarged view of a portion IX of FIG. FIG. 10 is a plan view showing a wiring body in the third embodiment of the present invention. FIG. 11 is a plan view showing a wiring body in the fourth embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described based on the drawings.

<< First Embodiment >>
FIG. 1 is a plan view showing a touch sensor provided with a wiring body in the first embodiment, FIG. 2 is an enlarged view of a portion II of FIG. 1, and FIG. 3 is a cross section along line III-III of FIG. FIG. 4 is a cross-sectional view taken along line IV-IV of FIG.

  The touch sensor 1 including the wiring body 2 in the present embodiment is, for example, a touch input device used for a touch panel or touch pad of an electrostatic capacitance type or the like. The touch sensor 1 includes a wiring board 10 and a second mesh-like electrode layer provided on the mesh-like electrode layer 22 included in the wiring board 10 via a resin layer. In FIG. 1, the resin layer and the second mesh electrode layer are not shown. The wiring substrate 10 in the present embodiment includes a substrate 21 and a wiring body 2.

  The substrate 21 is an insulating transparent substrate composed of a transparent film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI) or the like, glass or the like. In addition, the substrate 21 may be a display device or a cover panel. Therefore, when a backlight such as an LED or a display (not shown) is disposed below the wiring substrate 10, light of the backlight or the display is transmitted through the wiring body 2.

  The wiring body 2 includes an adhesive layer 25, a plurality of (six in this example) mesh-like electrode layers 22 formed on the adhesive layer 25, and a lead-out wiring layer 23.

  The adhesive layer 25 is a layer for bonding and fixing the substrate 21 and the mesh-like electrode layer 22 and the lead-out wiring layer 23 to each other, and as shown in FIG. It is provided throughout. As an adhesive material constituting the adhesive layer 25, UV curable resin such as epoxy resin, acrylic resin, polyester resin, urethane resin, vinyl resin, silicone resin, phenol resin, polyimide resin, thermosetting resin or thermoplastic resin, Ceramics etc. can be illustrated. The adhesive layer 25 includes a support portion 251 supporting the first conductor wires 221A and 221B, a support portion 251B supporting the second conductor wires 231A and 231B, and the main surfaces of the support portions 251 and 251B and the substrate 21. And a flat portion 252 covering the main surface, and the support portions 251 and 251B and the flat portion 252 are integrally formed.

  The cross-sectional shape (the cross-sectional shape of the first conductor wires 221A and 221B in the extending direction) of the support portion 251 in the present embodiment is, as shown in FIG. 3, in the direction away from the substrate 21 (upper direction in FIG. 3). The shape becomes narrower toward the end. The flat portion 252 is provided over the entire one main surface of the substrate 21 at a substantially uniform height (thickness). Since the support portion 251 is provided on the flat portion 252, the adhesive layer 25 protrudes in the support portion 251, and the rigidity of the first conductor wires 221A and 221B in the support portion 251 is improved.

  Note that the flat portion 252 may be omitted from the adhesive layer 25 and the adhesive layer 25 may be configured by only the support portions 251 and 251B. In this case, since the light transmittance of the entire wiring substrate 10 is improved, the visibility of the touch sensor 1 can be improved. The adhesive layer 25 in the present embodiment corresponds to an example of the resin layer of the present invention.

  The mesh-like electrode layer 22 is made of a conductive material containing silver, copper, nickel, tin, bismuth, zinc, indium, palladium, graphite, etc., and an acrylic resin, polyester resin, epoxy resin, vinyl resin, urethane resin, phenol resin And a binder resin containing a polyimide resin or the like. The binder resin may be omitted from the material constituting the mesh-like electrode layer 22. As shown in FIG. 2, in the mesh-like electrode layer 22, a plurality of first conductor lines 221A arranged in parallel and a plurality of first conductor lines 221B arranged in parallel intersect each other at substantially right angles. It has a mesh shape formed. The mesh shape of the mesh electrode layer 22 is not particularly limited. For example, it may be a mesh shape such as a square, a rectangle, or a rhombus, or may be a mesh shape of a hexagon (honeycomb shape).

  In the present embodiment, the first conductor wires 221A and 221B are disposed at an angle of 45 degrees with respect to the extending direction of the mesh electrode layer 22 (the Y-axis direction in FIG. 1). (E.g., 30 degrees) may be inclined. In addition, one of the first conductor wires 221A and 221B may be arranged to be inclined by 90 degrees with respect to the extending direction of the mesh-like electrode layer 22 (the Y-axis direction in FIG. 1). Note that the first conductor lines 221A and 221B may extend in a curved shape, and a linear portion and a curved portion may be mixed.

  As shown in FIG. 3, the side portions 223 of the first conductor wires 221A, 221B and the side portions of the support portion 251 in the adhesive layer 25 form a flat surface by being smoothly connected. The first conductor wires 221A, 221B have a tapered shape that narrows toward the side (upper side in FIG. 3) away from the substrate 21 and, thereby, the outer surfaces of the first conductor wires 221A, 221B. The cross-sectional shape (the cross-sectional shape in the extending direction of the first conductor wires 221A, 221B) is substantially trapezoidal. In addition, the cross-sectional shape in particular of the outer surface of 1st conductor wire 221A, 221B is not limited to this. For example, the cross-sectional shape of the first conductor lines 221A and 221B may be square, rectangular, triangular or the like.

In addition, the lower surface 225 of the first conductor wire 221A, 221B has an uneven shape, and the upper surface of the support portion 251 of the adhesive layer 25 also has an uneven shape corresponding to the uneven shape of the lower surface.
The surface roughness of the lower surface 225 in FIG. 3 in the first conductor wire 221A, 221B in the present embodiment increases the contact area between the first conductor wire 221A, 221B and the adhesive layer 25, and the first conductor wire It is preferable that the surface roughness of the upper surface 226 in FIG. 3 of the first conductor wires 221A and 221B be rougher from the viewpoint of firmly fixing the bonding layers 221A and 221B and the adhesive layer 25.

  Specifically, while the surface roughness Ra of the lower surface 225 of the first conductor wires 221A and 221B is about 0.1 to 3 μm, the surface roughness Ra of the upper surface 226 is 0.001 to 1.0 μm. The surface roughness of the upper surface 226 is more preferably 0.001 to 0.3 μm. Such surface roughness can be measured by the JIS method (JIS B 0601 (revised on March 21, 2013)).

In the present embodiment, as shown in FIG. 2 or FIG. 3, the first conductor wires 221A, 221B constituting the mesh electrode layer 22 have substantially equal widths (with respect to the extending direction of the first conductor wires 221A, 221B. It has an average maximum width) W ₁ in a cross sectional view. The width W ₁ of the first conductor lines 221A and 221B is preferably 100 nm to 100 μm, more preferably 500 nm to 10 μm from the viewpoint of improving the visibility of the touch sensor 1, and 500 nm to 5 μm. More preferable.

  The lead-out wiring layer 23 includes an outer edge portion 241 and a wiring portion 242. The lead-out wiring layer 23 is integrally formed of the same material as the mesh-like electrode layer 22 described above. Further, the outer edge portion 241 and the wiring portion 242 which constitute the lead-out wiring layer 23 are also integrally formed. Here, "integrally" means that the members are not separated, and are formed as an integral structure from the same material (conductive particles of the same particle diameter, binder resin, etc.). Do. The position at which the outer edge portion 241 is provided at the outer edge of the mesh electrode layer 22 is not particularly limited. For example, the outer edge portion 241 may be provided on all the outer edges of the mesh electrode layer 22.

  The lead-out wiring layer 23 and the mesh-like electrode layer 22 may be separately formed. In this case, the lead-out wiring layer 23 and the mesh-like electrode layer 22 may be formed by different methods. Similarly, the outer edge portion 241 and the wiring portion 242 which constitute the lead-out wiring layer 23 may be individually formed. Also in this case, the outer edge portion 241 and the wiring portion 242 may be formed by different methods.

  The outer edge portion 241 is formed to extend along the upper side of the mesh electrode layer 22 in the figure, as shown in FIG. Further, as shown in FIG. 2, the outer edge portion 241 is directly connected to the mesh electrode layer 22, and a plurality of second conductor lines 231 </ b> A disposed in parallel with a plurality of second conductor lines 231 </ b> A disposed in parallel. It has a mesh shape in which the conductor lines 231B intersect with each other at substantially right angles. The mesh shape of the outer edge portion 241 is not particularly limited. For example, it may be a mesh shape such as a square, a rectangle, or a rhombus, or may be a mesh shape of a hexagon (honeycomb shape). The outer edge portion 241 in the present embodiment corresponds to an example of the mesh portion of the present invention.

  In the present embodiment, the second conductor wires 231A and 231B are disposed at an angle of 45 degrees with respect to the Y-axis direction in FIG. 1, but they are inclined at other angles (for example, 30 degrees). It may be arranged. Further, one of the second conductor lines 231A and 231B may be arranged to be inclined by 90 degrees with respect to the Y-axis direction in FIG. Note that the second conductor lines 231A and 231B may extend in a curved shape, or a linear portion and a curved portion may be mixed.

  The cross-sectional shape (the cross-sectional shape in the extending direction of the second conductor wires 231A and 231B) of the support portion 251B supporting the second conductor wires 231A and 231B in the present embodiment is, as shown in FIG. It has a shape that narrows in the direction of separation (upward in FIG. 4). By providing the support portion 251B on the flat portion 252, the adhesive layer 25 protrudes in the support portion 251B, and the rigidity of the second conductor wires 231A and 231B in the support portion 251B is improved.

  As shown in FIG. 4, the side portions 233 of the second conductor wires 231A and 231B and the side portions of the support portion 251B in the adhesive layer 25 form a flat surface by being smoothly continuous. The second conductor lines 231A and 231B have a tapered shape that narrows toward the side (upper side in FIG. 4) away from the substrate 21 and, thereby, the outer surfaces of the second conductor lines 231A and 231B. The cross-sectional shape (the cross-sectional shape in the extending direction of the second conductor wires 231A, 231B) is substantially trapezoidal. In addition, the cross-sectional shape in particular of the outer surface of 2nd conductor wire 231A, 231B is not limited to this. For example, the cross-sectional shape of the second conductor lines 231A and 231B may be square, rectangular, triangular or the like.

  Further, the lower surface 234 of the second conductor wire 231A, 231B has an uneven shape, and the upper surface of the support portion 251B of the adhesive layer 25 also has an uneven shape corresponding to the uneven shape of the lower surface 234. The surface roughness of the lower surface 234 in FIG. 4 in the second conductor wire 231A, 231B in the present embodiment increases the contact area between the second conductor wire 231A, 231B and the adhesive layer 25, and the second conductor wire It is preferable that the surface roughness of the upper surface 235 in FIG. 4 in the second conductor wires 231A and 231B is rougher from the viewpoint of firmly fixing the adhesive layers 25 to the adhesive layers 25A.

  Specifically, while the surface roughness Ra of the lower surface 234 of the second conductor wire 231A, 231B is about 0.1 to 3 μm, the surface roughness Ra of the upper surface 235 is 0.001 to 1.0 μm. The surface roughness of the upper surface 235 is more preferably 0.001 to 0.3 μm. Such surface roughness can be measured by the JIS method (JIS B 0601 (revised on March 21, 2013)).

  The uneven surface of the lower surface 234 of the second conductor lines 231A and 231B according to the present embodiment is the same as the uneven surface of the lower surface 225 of the first conductor 221A (221B), as shown in FIG. Compared to (see FIG. 3), it is gently curved in the direction away from the substrate 21.

Therefore, in the present embodiment, the following equations (5) and (6) are established.
S ₁ <S ₂ (5)
R ₁ <R ₂ (6)
However, in the above (5), _{S 1} is the average maximum thickness of the first conductor lines 221A, the bonded portion the thickness of the resin layer 25 in the (adhesive surface) (plane overall cross section of the lower surface 225 of 221B ), and, _{S 2} is the average maximum thickness) of the second conductor lines 231A, the bonded portion (the thickness of the resin layer 25 in the adhesive surface) (plane overall cross section of the lower surface 234 of 231B. In the above (6), _{R 1} is the curvature in the plane which leveled lower surface 225 at a first conductor lines 221A, 221B (first adhesive surface), _{R 2} is a second conductor lines 231A, It is a curvature in the surface (2nd adhesion surface) which equalized the lower surface 234 in 231B. By the above equations (5) and (6) being established, the contact area between the second conductor wires 231A, 231B and the support portion 251B of the adhesive layer 25 is relatively increased, and the second conductor wire 231A , 231B and the support portion 251B can be improved.

  Note that “the average maximum thickness of the entire in-plane cross-sectional view” refers to a plurality of cross-sections taken along the width direction of each conductor line across the entire extension direction of the conductor line, and for each cross-section Of the maximum thickness required for Incidentally, the conductor lines include the first conductor lines 221A and 221B and the second conductor lines 231A and 231B. The conductor wire is appropriately selected according to the parameter to be obtained.

As shown in FIG. 2 or 4, the second conductor wires 231A, 231B constituting the outer edge portion 241 have substantially equal widths (the average maximum width in a sectional view with respect to the extending direction of the second conductor wires 231A, 231B) ) W ₂ is included. The width W2 of the _second conductor lines 231A and 231B is preferably 1 μm to 500 μm, and from the viewpoint of improving the durability of the wiring body 2 while suppressing an increase in electrical resistance, it is more preferably 3 μm to 100 μm. Preferably, it is 5 to 20 μm. In the present embodiment, the aspect ratio (thickness / width) in a cross sectional view of the second conductor wires 231A, 231B is 1 or less. That is, the second conductor wires 231A and 231B have a horizontally long shape along the main surface of the base 2 in a cross sectional view.

Further, in the present embodiment, the first conductor lines 221A, and the width _{W 1} of 221B second conductor lines 231A, and the width _{W 2} of 231B, meets the following relationship (7).
W ₁ <W ₂ (7)

The first conductor line 221A, the width _{W 1} of 221B second conductor lines 231A, and the width _{W 2} of 231B, it is preferable to satisfy the following expression (8).
2 × W ₁ <W ₂ (8)

  In the present embodiment, the first conductor wire 221A and the second conductor wire 231A are substantially parallel, and the first conductor wire 221B and the second conductor wire 231B are substantially parallel. Further, the pitch between the second conductor lines 231A and the pitch between the second conductor lines 231B are the pitch between the first conductor lines 221A and the pitch between the first conductor lines 221B. It is smaller than each other.

  In the present embodiment, the aperture ratio of the mesh-like electrode layer 22 is 85% or more and less than 100%. On the other hand, the aperture ratio of the outer edge portion 241 is 50% or less. The aperture ratio of the mesh-like electrode layer 22 is preferably 90% or more and less than 100% from the viewpoint of improving the light transmittance of a backlight or the like provided below the wiring body 2. The aperture ratio of the outer edge portion 241 is preferably 10% or more from the viewpoint of reducing the difference in rigidity between the mesh electrode layer 22 and the outer edge portion 241 or from the viewpoint of improving the durability of the outer edge portion 241.

In addition, this "aperture ratio" means the ratio represented by the following (9) Formula (refer FIG. 5).
(Aperture ratio) = b × b / (a × a) (9)
However, in said Formula (9), a is a pitch (distance between center lines CL) between the arbitrary conductor wire 221 and the other conductor wire 221 which adjoins the said conductor wire 221, b is arbitrary. It represents the distance between the conductor wire 221 and the other conductor wire 221 adjacent to the conductor wire 221.

The configuration of the first conductor lines 221A and 221B is not particularly limited to the above, and may be a configuration as shown in FIG. Specifically, in the embodiment of FIG. 6, a wide portion 222 which gradually widens toward the outer edge portion 241 is provided at the end of the first conductor wires 221A, 221B. The inclination angles θ ₁ and θ ₂ of the wide portion 222 are preferably 15 ° or more (θ ₁ ≧ 15 °, θ ₂ 1515 °). Moreover, in the form shown in FIG. 6, although the wide part 222 is provided in the both sides of 1st conductor wire 221A, 221B in the part connected to the outer edge part 241, it is not specifically limited to this. For example, the wide portion 222 may be provided only on one side of the first conductor line 221A, 221B in a portion connected to the outer edge portion 241.

  As shown in FIG. 1, the wiring portion 242 is connected to a terminal 26 for leading the mesh electrode layer 22 to the outside of the wiring substrate 10 via the outer edge portion 241. The terminal 26 is connected to a not-shown partner terminal connected to the drive circuit 3. As described above, neither the outer edge portion 241 nor the wiring portion 242 in the lead wiring layer 23 of the present embodiment has a function as a terminal, and the mesh-like electrode layer 22 is through the lead wiring layer 23 and the terminal 26. It is connected to the drive circuit 3.

  Although the wiring portion 242 in the present embodiment is formed as a solid pattern, the configuration of the wiring portion 242 is not particularly limited thereto. For example, although not shown in particular, in addition to the outer edge portion 241 having a mesh shape, the wiring portion 242 may also have a mesh shape similar to the outer edge portion 241. In the case where the outer edge portion 241 and the wiring portion 242 are integrally formed as in the present embodiment, it is preferable that the wiring portion 242 also have a mesh shape. Incidentally, the terminal 26 may be integrally formed with the outer edge portion 241 and the wiring portion 242. In this case, it is preferable that the terminal 26 have a mesh shape.

  In the touch sensor 1 according to the present embodiment, the second mesh electrode layer (not shown) disposed so that the extending directions of the mesh electrode layers 22 intersect with each other ensures insulation with the mesh electrode layer 22. It is provided on the wiring substrate 10 via a resin layer for the purpose. Then, the mesh-like electrode layer 22 and the second mesh-like electrode layer are connected to the drive circuit 3 respectively. The drive circuit 3 periodically applies a predetermined voltage between the mesh-like electrode layer 22 and the second mesh-like electrode layer, based on the change in capacitance at each intersection of the two mesh-like electrode layers. The contact position of the finger of the operator in the touch sensor 1 is determined. The touch sensor may be configured by overlapping the two wiring substrates 10 so that the extending directions of the mesh-like electrode layer 22 are orthogonal to each other.

  Next, a method of manufacturing the wiring body 2 in the present embodiment will be described. FIG. 7A to FIG. 7E are cross-sectional views (simplified views) for describing the method of manufacturing the wiring body 2 in the present embodiment.

  First, as shown in FIG. 7A, a first recess 41 having a shape corresponding to the shape of the mesh-like electrode layer 22 and a second recess 42 having a shape corresponding to the shape of the lead-out wiring layer 23 are formed. Prepare the intaglio 4.

  Examples of the material constituting the intaglio 4 include nickel, silicon, glasses such as silicon dioxide, organic silicas, glassy carbon, a thermoplastic resin, a photocurable resin, and the like. The width of the first recess 41 is preferably 100 nm to 100 μm, more preferably 500 nm to 10 μm, and still more preferably 500 nm to 5 μm.

  On the other hand, the width of the second recess 42 is preferably 1 μm to 500 μm, more preferably 3 μm to 100 μm, and still more preferably 5 to 20 μm. The depth of the first recess 41 and the second recess 42 is preferably 100 nm to 300 μm, and more preferably 1 μm to 50 μm. In the present embodiment, the cross-sectional shape of the first and second recesses 41 and 42 is formed to have a tapered shape that narrows toward the bottom.

  In order to improve the releasability, the surfaces of the first and second recesses 41 and 42 may be made of a graphite material, a silicone material, a fluorine material, a ceramic material, an aluminum material, or the like. Preferably, a layer (not shown) is provided in advance.

  The conductive material 5 is filled in the first and second recesses 41 and 42 of the intaglio 4 described above. As such a conductive material 5, a conductive paste or a conductive ink which is formed by mixing a conductive powder or metal salt, a binder resin, water or a solvent and various additives can be exemplified. Examples of the conductive powder include metals such as silver, copper, nickel, tin, bismuth, zinc, indium and palladium, and graphite. Examples of the metal salt include salts of the above metals. As the conductive particles contained in the conductive material 5, conductive particles having a diameter φ (0.5 μm ≦ φ ≦ 2 μm) of, for example, 0.5 μm or more and 2 μm or less are used according to the width of the conductor pattern to be formed. be able to. In addition, it is preferable to use the electroconductive particle which has an average diameter (phi) of half or less of the width | variety of the conductor pattern to form.

  Examples of the binder resin contained in the conductive material 5 include acrylic resin, polyester resin, epoxy resin, vinyl resin, urethane resin, phenol resin, polyimide resin, silicone resin, and fluorine resin.

  Examples of the solvent contained in the conductive material 5 include α-terpineol, butyl carbitol acetate, butyl carbitol, 1-decanol, butyl cellosolve, diethylene glycol monoethyl ether acetate, tetradecane and the like.

  As a method for filling the conductive material 5 in the first and second recesses 41 and 42 of the intaglio 4, for example, a dispensing method, an inkjet method, and a screen printing method can be mentioned. Alternatively, the conductive material coated in the areas other than the first and second recesses 41 and 42 after coating by slit coating, bar coating, blade coating, dip coating, spray coating, spin coating Examples of methods include wiping or scraping, sucking, pasting, washing away and blowing away. It can be properly used according to the composition of the conductive material and the shape of the intaglio.

  When the wide portion 222 is provided at the end of the first conductor wires 221A and 221B (see FIG. 6), the filling when the conductive material 5 is filled in the first and second recesses 41 and 42 While being able to suppress generation | occurrence | production of a defect, the connection reliability between the mesh-like electrode layer 22 and the outer edge part 241 in the completed wiring body 2 can be improved.

Next, as shown in FIG. 7B, the mesh-like electrode layer 22 and the lead-out wiring layer 23 are formed by heating the conductive material 5 filled in the first and second recesses 41 and 42 of the intaglio 4. Form. The heating conditions of the conductive material 5 can be appropriately set according to the composition of the conductive material and the like. By this heat treatment, the conductive material 5 shrinks in volume, and the upper surface of the conductive material 5 has the uneven shape 51, and the upper surface of the conductive material 5 filled in the second recess 42 has the second recess It curves toward the bottom of 42 (refer to the drawing of FIG. 7 (B)). Although the upper surface of the conductive material 5 filled in the first recess 41 may be slightly curved toward the bottom of the first recess 41 depending on the width of W ₁ , the degree of the curvature is It becomes relatively smaller than the conductive material 5 filled in the second recess 42. The outer surface except the upper surface of the conductive material 5 is formed in a shape along the first and second recesses 41 and 42.

  In addition, the processing method of the conductive material 5 is not limited to heating. It may be irradiated with energy rays such as infrared rays, ultraviolet rays and laser light, or may be dried only. In addition, two or more of these processing methods may be combined. The contact area between the mesh-like electrode layer 22 and the lead-out wiring layer 23 and the adhesive layer 25 is increased by the presence of the concavo-convex shape 51, and the mesh-like electrode layer 22 and the lead-out wiring layer 23 are more firmly fixed to the adhesive layer 25. Can.

  Subsequently, as shown in FIG. 7C, one is prepared in which the adhesive material 6 for forming the adhesive layer 25 is applied approximately uniformly on the substrate 21. As such an adhesive material 6, UV curable resin such as epoxy resin, acrylic resin, polyester resin, urethane resin, vinyl resin, silicone resin, phenol resin, polyimide resin, thermosetting resin or thermoplastic resin, ceramics, etc. Can be illustrated. As a method of applying the adhesive material 6 on the substrate 21, a screen printing method, a spray coating method, a bar coating method, a dip method, an inkjet method and the like can be exemplified.

  Next, as shown in FIG. 7D, the substrate 21 and the adhesive material 6 are disposed on the intaglio 4 so that the adhesive material 6 enters the first and second recesses 41 and 42 of the intaglio 4, and the substrate 21 is It is pressed against the intaglio 4 to cure the adhesive material 6. As a method of curing the adhesive material 6, energy beam irradiation such as ultraviolet light and infrared laser light, heating, heating and cooling, drying and the like can be exemplified. Thereby, the adhesive layer 25 is formed, and the substrate 21, the mesh electrode layer 22 and the lead-out wiring layer 23 are mutually adhered and fixed via the adhesive layer 25.

  The method of forming the adhesive layer 25 is not particularly limited to the above. For example, the adhesive material 6 is applied on the intaglio 4 (the intaglio 4 in the state shown in FIG. 7B) on which the mesh electrode layer 22 and the lead wiring layer 23 are formed, and the substrate 21 is disposed on the adhesive material 6 Thereafter, the adhesive layer 25 may be formed by curing the adhesive material 6 in a state where the substrate 21 is placed on the intaglio 4 and pressed.

  Subsequently, as shown in FIG. 7E, the wiring body 2 can be obtained by releasing the substrate 21, the adhesive layer 25, the mesh-like electrode layer 22 and the lead-out wiring layer 23 from the intaglio 4.

  Next, the operation of the wiring body in the present embodiment will be described.

  In the wiring body 2 of the present embodiment, the mesh electrode layer 22 is formed of the first conductor wires 221A and 221B, and the outer edge portion 241 included in the lead wiring layer 23 is the second conductor wires 231A and 231B. It is configured. Thereby, since the difference in rigidity between the mesh electrode layer 22 and the outer edge portion 241 can be reduced, concentration of stress on the boundary between the mesh electrode layer 22 and the outer edge portion 241 is suppressed, A break between the mesh-like electrode layer 22 and the lead-out wiring layer 23 can be suppressed. Since the wiring portion 242 has a larger width than the first conductor wires 221A and 221B constituting the mesh-like electrode layer 22, the mesh-like electrode is more concentrated than the concentration of stress at the boundary between the outer edge portion 241 and the wiring portion 242. The concentration of stress at the boundary between the layer 22 and the outer edge portion 241 is more important in suppressing the disconnection between the mesh-like electrode layer 22 and the lead-out wiring layer 23.

  Further, in the wiring body 2 of the present embodiment, the above equation (7) is satisfied, and the line width of the second conductor lines 231A and 231B is larger than the line width of the first conductor lines 221A and 221B. For this reason, it is possible to suppress an increase in the electrical resistance value of the lead-out wiring layer 23 due to the mesh-like shape of the outer edge portion 241. In the present embodiment, this effect can be further improved by satisfying the above equation (8).

  Further, in the wiring body 2 in the present embodiment, the aperture ratio of the mesh electrode layer 22 is 85% or more, and the aperture ratio of the outer edge portion 241 is 50% or less. Therefore, it is possible to suppress the increase in the electrical resistance value of the lead-out wiring layer 23 while improving the light transmittance of the backlight or the like installed below the wiring body 2.

<< Second Embodiment >>
FIG. 8 is a plan view showing a touch sensor provided with a wiring body in the second embodiment, and FIG. 9 is an enlarged view of a portion IX of FIG. The wiring body 2B in the second embodiment is the same as the first embodiment described above except that the configuration of the lead-out wiring layer is different from the first embodiment, so only the parts different from the first embodiment will be described. About the part same as 1st Embodiment, the code | symbol same as 1st Embodiment is attached | subjected, and description is abbreviate | omitted.

  As shown in FIG. 8, the lead-out wiring layer 23B in the present embodiment does not include the outer edge portion 241 described in the first embodiment, and is constituted only by the wiring portion 242B. The mesh-like electrode layer 22 and the lead-out wiring layer 23B are integrally formed.

  The wiring portion 242B of the present embodiment has the same configuration as the outer edge portion 241 of the lead-out wiring layer 23 described in the first embodiment. That is, as shown in FIG. 9, in the wiring portion 242B, a plurality of second conductor lines 231A arranged in parallel and a plurality of second conductor lines 231B arranged in parallel intersect each other at substantially right angles. It has a formed mesh shape. The mesh shape of the wiring portion 242B is not particularly limited. For example, it may be a mesh shape such as a square, a rectangle, or a rhombus, or may be a mesh shape of a hexagon (honeycomb shape). The wiring portion 242B in the present embodiment corresponds to an example of the mesh portion of the present invention.

  In the present embodiment, the wiring portion 242B has a mesh shape in the entire space between the mesh electrode layer 22 and the terminal 26, but at least the connection portion with the mesh electrode layer 22 may be a mesh shape, It is not particularly limited to this.

  The width L of the wiring portion 242B in the present embodiment is defined by the end of the unit mesh constituting the mesh shape of the wiring portion 242B, and the second conductor wires 231A, 231B not constituting the unit mesh head outward. It is not in the state of sticking out. For this reason, the side end of the wiring portion 242B has a wave shape configured by the second conductor lines 231A and 231B.

Further, in the mesh electrode layer 22 in the present embodiment, an edge 224 formed integrally with the mesh electrode layer 22 is provided at an end connected to the wiring portion 242. Width _{W 3} of the edge 224, a first conductor line 221A constituting the reticulate electrode layer 22, but is substantially equal to the width _{W 1} of 221B _{(W 3} ≒ _W 1), the width W of the edge 224 ₃ is larger than the width W _{1 of} the first conductor wires 221A and 221B ((W ₃ > W ₁ )) while suppressing an increase in the electrical resistance value while the mesh electrode layer and the lead wiring layer It is preferable because the disconnection between them can be further suppressed. The width _{W 3} of the edge 224, the second conductor lines 231A, be smaller than the width _{W 2} of _{231B (W 3 <W 2)} , may be greater _{(W 3> W} 2), the edge The width W ₃ of 224 is not particularly limited. Moreover, although the edge part 224 in this embodiment is linear shape, curvilinear shape may be sufficient and the linear part and curvilinear part may be mixed.

  Also in the present embodiment, stress concentration on the boundary between the wiring portion 242B of the lead wiring layer 23B and the mesh electrode layer 22 is suppressed, and the space between the mesh electrode layer 22B and the lead wiring layer 23B is suppressed. The disconnection suppression effect can be exhibited.

  Further, also in the wiring body 2B of the present embodiment, the above equation (7) is satisfied, and the line width of the second conductor lines 231A and 231B becomes larger than the line width of the first conductor lines 221A and 221B. ing. For this reason, it is possible to suppress an increase in the electrical resistance value of the lead-out wiring layer 23B due to the mesh-like shape of the wiring portion 242B.

  Further, in the lead-out wiring layer 23B of the present embodiment, the wiring board 10 can be miniaturized because the outer edge portion 241 is not provided. Furthermore, since the outer edge portion 241 is not provided, blocking of light by the outer edge portion 241 is eliminated at the edge portion of the mesh electrode layer 22 connected to the lead-out wiring layer 23B. It is possible to suppress the decrease in luminance in a part.

<< Third Embodiment >>
FIG. 10 is a plan view showing a wiring body in the third embodiment of the present invention. The wiring body 2C in the third embodiment is the same as the above-described first embodiment except that the configuration of the mesh-like electrode layer is different from that in the first embodiment, so only the parts different from the first embodiment will be described. The parts that are the same as in the first embodiment are given the same reference numerals as in the first embodiment and descriptions thereof will be omitted.

  The wiring body 2C in the present embodiment is a lead-out including an adhesive layer 25, a plurality of mesh electrode layers 22B formed on the adhesive layer 25, and an outer edge portion 241 provided on the outer edge of the mesh electrode layer 22B. And a wiring layer 23. The mesh-like electrode layer 22B can be provided by the same material and manufacturing method as the mesh-like electrode layer 22 described in the first embodiment.

  The mesh-like electrode layer 22B is configured by the first conductor wires 221A and 221B, similarly to the mesh-like electrode layer 22 of the first embodiment. In the present embodiment, as shown in FIG. 10, the first conductor wire 221A is not in parallel with the second conductor wires 231A and 231B of the outer edge portion 241 constituting the lead-out wiring layer 23, and The conductor line 221B is also non-parallel to the second conductor lines 231A and 231B.

  Therefore, in the wiring body 2B in the present embodiment, a direction in which the mesh electrode layer 22B is easily bent (bent) by receiving an external force applied to the wiring body 2B, and a direction in which the outer edge portion 241 is easily bent (bent) Can be in mutually different directions. Accordingly, stress concentration on the boundary between the mesh electrode layer 22B and the outer edge portion 241 is suppressed, and the disconnection suppression effect between the mesh electrode layer 22B and the lead wiring layer 23 is further improved. Can.

  Further, also in the wiring body 2B of the present embodiment, the above equation (7) is satisfied, and the line width of the second conductor lines 231A and 231B becomes larger than the line width of the first conductor lines 221A and 221B. ing. For this reason, it is possible to suppress an increase in the electrical resistance value of the lead-out wiring layer 23 due to the mesh-like shape of the outer edge portion 241.

  Although not particularly shown, the outer edge of the mesh-like electrode layer 22 described in the first embodiment and the first conductor wires 221A and 221B are composed of the second conductor wires 231A and 231B which are not parallel to each other. Also in the wiring body including the lead-out wiring layer including the part, the same effects as described above can be exhibited.

<< 4th Embodiment >>
FIG. 11 is a plan view showing a wiring body in the fourth embodiment of the present invention. The wiring body 2D in the fourth embodiment is the same as the above-described first embodiment except that the shape of the boundary between the mesh electrode layer and the outer edge portion is different from that in the first embodiment, so it is different from the first embodiment. Only the parts will be described, and the parts that are the same as in the first embodiment will be assigned the same reference numerals as in the first embodiment and descriptions thereof will be omitted.

  The wiring body 2D includes an adhesive layer 25, a plurality of mesh-like electrode layers 22 formed on the adhesive layer 25, and a lead-out wiring layer 23.

  In the wiring body 2D in the present embodiment, as shown in FIG. 11, the second conductor wires 231A and 231B constituting the outer edge portion 241 of the lead wiring layer 23 are from the edge of the unit mesh constituting the mesh electrode layer 22. It is provided. That is, the boundary between the mesh electrode layer 22 and the outer edge portion 241 has a corrugated shape formed by being divided by the unit of mesh (unit mesh) constituting the mesh electrode layer 22. In the present embodiment, unit meshes adjacent along the X-axis direction in FIG. 11 form a boundary between the mesh-like electrode layer 22 and the outer edge portion 241, and form the corrugated shape of the boundary. The lengths of the plurality of linear portions are approximately equal to the length of one side of the unit mesh.

  The shape of the boundary between the mesh electrode layer 22 and the outer edge portion 241 is not particularly limited to the above. For example, the length of the straight line portion forming the wave-like shape of the boundary may be substantially equal to a plurality of lengths of one side of the unit mesh constituting the mesh-like electrode layer 22. In addition, the lengths of specific straight portions that constitute the corrugated shape of the boundary may be different from the lengths of other straight portions.

  In the wiring body 2D in the present embodiment, as described above, since the second conductor wires 231A and 231B are provided from the edge of the unit mesh forming the mesh electrode layer 22, the mesh electrode layer 22 and the outer edge are formed. The boundary with the portion 241 is corrugated, and the boundary is non-linear over the whole. As a result, the wiring body 2D is hardly bent (bent) at the boundary between the mesh electrode layer 22 and the outer edge portion 241, and stress is concentrated at the boundary between the mesh electrode layer 22 and the outer edge portion 241. As a result, the effect of suppressing disconnection between the mesh-like electrode layer 22 and the lead-out wiring layer 23 can be further improved.

  Further, also in the wiring body 2D of the present embodiment, the above-mentioned equation (7) is satisfied, and the line width of the second conductor lines 231A and 231B becomes larger than the line width of the first conductor lines 221A and 221B. ing. For this reason, it is possible to suppress an increase in the electrical resistance value of the lead-out wiring layer 23 due to the mesh-like shape of the outer edge portion 241.

  The embodiments described above are described to facilitate the understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents that fall within the technical scope of the present invention.

  For example, although not particularly illustrated, the first conductor lines 221A and 221B in the wiring members 2B to 2D described in the second to fourth embodiments, the wide portion 222 (see FIG. 6) described in the first embodiment described above. It may be provided at the end of the In this case, at the time of manufacturing the wiring bodies 2B to 2D, it is possible to suppress the occurrence of the filling failure in filling the conductive material 5 in the concave portion of the intaglio 4 (see FIG. 7A), and complete the wiring body The connection reliability between the mesh-like electrode layers 22 and 22B and the lead-out wiring layers 23 and 23B in 2B to 2D can be improved.

  In addition, for example, the configurations described in the third embodiment and the fourth embodiment may be applied to the configuration described in the second embodiment. That is, in the third embodiment and the fourth embodiment, the relationship between the shape of the outer edge portion of the lead wiring layer and the shape of the mesh electrode layer is compared with the shape of the wiring portion of the lead wiring layer and the mesh electrode layer in the second embodiment. It may apply to the relationship with the shape of.

  Moreover, in the above-mentioned embodiment, although the wiring body was demonstrated as being used for a touch sensor, the use in particular of a wiring body is not limited to this. For example, the wiring body may be used as a heater by energizing the wiring body to generate heat by resistance heating or the like. Alternatively, the wiring body may be used as an electromagnetic shielding shield by grounding a part of the conductor portion of the wiring body. Also, the wiring body may be used as an antenna.

  The adhesive layer 25 may be omitted from the above-described embodiment, and the mesh electrode layers 22 and 22B and the lead wiring layers 23 and 23B may be provided directly on the substrate 21. In addition, the substrate 21 may be omitted from the above-described embodiment, and the resin layer described as the adhesive layer 25 may be used as a base material.

DESCRIPTION OF SYMBOLS 1 ... Touch sensor 10 ... Wiring board 2, 2B, 2C, 2D ... Wiring body 21 ... Board | substrate 22, 22B ... Reticulated electrode layer 221A, 221B ... 1st conductor wire 223: side portion 225: bottom surface 226: top surface 23, 23B: extraction wiring layer 241: outer edge portion 242, 242B: wiring portion 231A, 231B: second conductor wire 233 ... side 234 ... lower surface 235 ... upper surface 25 ... adhesion layer (resin layer)
251, 251B ··· Support portion 252 · · · Flat portion 26 · · · Terminal 3 · · · Drive circuit 4 · · · Intaglio 41 · · · first recess 42 · · · second recess 5 · · ·・ Conductive material 51 ・ ・ ・ Irregular shape 6 ・ ・ ・ Adhesive material

Claims (5)

With a resin layer,
A mesh-like electrode layer provided on the resin layer and having a plurality of first conductor wires arranged in a mesh-like manner;
And a lead-out wiring layer provided on the resin layer and drawing out the mesh-like electrode layer to the outside,
The lead-out wiring layer has a plurality of second conductor wires arranged in a mesh, and includes a mesh portion connected to at least a part of an outer edge of the mesh-like electrode layer in a plan view;
The first bonding surface between the first conductor wire and the resin layer is curved in a convex shape toward the first conductor wire in a cross sectional view,
The second bonding surface between the second conductor wire and the resin layer is curved in a convex shape toward the second conductor wire in a cross sectional view,
The wiring body which satisfy | fills the following (1) and (2) Formula.
W ₁ <W ₂ (1)
R ₁ <R ₂ (2)
However, in said Formula (1), W ₁ is the width | variety of said 1st conductor wire, W ₂ is the width | variety in the said mesh part of said 2nd conductor wire, In said (2) Formula, R ₁ is the curvature of the first adhesive surface, and R ₂ is the curvature of the second adhesive surface. With a resin layer,
A mesh-like electrode layer provided on the resin layer and having a plurality of first conductor wires arranged in a mesh-like manner;
And a lead-out wiring layer provided on the resin layer and drawing out the mesh-like electrode layer to the outside,
The lead-out wiring layer has a plurality of second conductor wires arranged in a mesh, and includes a mesh portion connected to at least a part of an outer edge of the mesh-like electrode layer in a plan view;
The wiring body which satisfy | fills the following (1) and (3) Formula.
W ₁ <W ₂ (1)
S ₁ <S ₂ (3)
However, in the above (1), W ₁ is the width of the first conductor line, W ₂ is the width of the mesh portion of said second conductor lines, in the above (3), S ₁ is the thickness of the resin layer at the bonded portion between the first conductor line, S ₂ is the thickness of the resin layer at the bonded portion between the second conductor line. With a resin layer,
A mesh-like electrode layer provided on the resin layer and having a plurality of first conductor wires arranged in a mesh-like manner;
And a lead-out wiring layer provided on the resin layer and drawing out the mesh-like electrode layer to the outside,
The lead-out wiring layer has a plurality of second conductor wires arranged in a mesh, and includes a mesh portion connected to at least a part of an outer edge of the mesh-like electrode layer in a plan view;
The second conductor wire is provided from an edge of a unit mesh constituting the mesh electrode layer,
The boundary in plan view between the mesh electrode layer and the mesh portion is non-linear,
Wiring body satisfying the following equation (1).
W ₁ <W ₂ (1)
However, in the above (1), W ₁ is the width of the first conductor line, W ₂ is the width of the mesh portion of the second conductor line. The wiring body according to any one of claims 1 to 3,
The aperture ratio of the mesh-like electrode layer is 85% or more,
The wiring body in which the aperture ratio of the mesh portion is 50% or less. It is a wiring body according to any one of claims 1 to 4,
Wiring body satisfying the following equation (4).
2 × W ₁ <W ₂ (4)

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