JP2019060817A - Wiring board for electronic component inspection device - Google Patents

Wiring board for electronic component inspection device Download PDF

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Publication number
JP2019060817A
JP2019060817A JP2017187789A JP2017187789A JP2019060817A JP 2019060817 A JP2019060817 A JP 2019060817A JP 2017187789 A JP2017187789 A JP 2017187789A JP 2017187789 A JP2017187789 A JP 2017187789A JP 2019060817 A JP2019060817 A JP 2019060817A
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Prior art keywords
laminate
flange portion
wiring board
electronic component
stud
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JP2017187789A
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Japanese (ja)
Inventor
奈須　孝有
Takaari Nasu
孝有 奈須
正臣 服部
Masaomi Hattori
正臣 服部
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2017187789A priority Critical patent/JP2019060817A/en
Priority to KR1020180113481A priority patent/KR102165507B1/en
Priority to US16/143,698 priority patent/US10674614B2/en
Publication of JP2019060817A publication Critical patent/JP2019060817A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

To provide a wiring board for an electronic component inspection device in which cracks are less likely to occur in a ceramic of the back surface of a first laminate adjacent to the periphery of a flange portion of studs even if an external force is applied along the axial direction to a bolt portion or nut cylindrical portion of the plurality of studs joined to the back surface of the ceramic first laminate.SOLUTION: A wiring board for an electronic component inspection device 1 includes: a first laminate 3 formed by laminating a plurality of ceramic layers c1-c3 and having a front surface 5 and a back surface 6; and a plurality of studs 20a joined to the back surface 6 of the first laminate 3. Each of the studs 20a includes a flange portion 21 having a circular bottom view and a bolt portion 26 vertically provided from a central portion of the outer side surface of the flange portion 21. The flange portion 21 has a truncated-cone shape which sequentially approaches the inner side surface 22 side of the flange portion 21 from the base end side of the bolt portion 26 toward the outer peripheral edge of the flange portion 21 on the outer side surface where the bolt portion 26 protrudes.SELECTED DRAWING: Figure 2

Description

本発明は、例えば、シリコンウェハーの表面に沿って形成された多数の半導体素子などの電子部品における電気的特性を検査するための電子部品検査装置に用いられる配線基板に関する。   The present invention relates to a wiring board used in an electronic component inspection apparatus for inspecting electrical characteristics of electronic components such as, for example, a large number of semiconductor elements formed along the surface of a silicon wafer.

前記のような多数の電子部品に対し、複数のプローブピンを均一且つ個別に接触させるべく、前記配線基板の姿勢を前記検査装置において調整するため、該配線基板において、上記プローブピンを配置するためのプローブ用パッドを設けた表面と反対側の裏面には、該裏面に対してボルトが垂直となるように、該ボルトを含むスタッドの平面視が円形で且つ平坦なフランジが接合されている。例えば、前記スタッドが接合された裏面において、該スタッドの周囲にビア導体（隣層間接続導体部）が位置している場合、前記スタッドに大きな外力が加わっても、前記ビア導体の近傍における基板にクラックが発生し難くするため、前記スタッドを前記裏面に形成された表面金属層に接合しているロウ材層の外接円と、前記ビア導体の中心軸との距離などの関係を規定した多層セラミック基板およびその製造方法が提案されている（例えば、特許文献１参照）。   In order to adjust the attitude of the wiring board in the inspection apparatus in order to bring a plurality of probe pins into uniform and individual contact with a large number of electronic components as described above, the probe pins are arranged on the wiring board On the back surface opposite to the surface on which the probe pad is provided, a flat flange having a circular plan view of a stud including the bolt is joined so that the bolt is perpendicular to the back surface. For example, in the case where a via conductor (next interlayer connection conductor portion) is located around the stud on the back surface to which the stud is joined, even if a large external force is applied to the stud, the substrate in the vicinity of the via conductor A multilayer ceramic in which a relationship such as a distance between a circumscribed circle of a brazing material layer joining the stud to a surface metal layer formed on the back surface and a central axis of the via conductor is defined in order to make a crack less likely to occur. A substrate and a method of manufacturing the same have been proposed (see, for example, Patent Document 1).

しかし、前記多層セラミック基板およびその製造方法では、前記スタッドに対し、そのボルトの軸方向に沿って外側に引っ張る大きな外力が加えられた場合、該スタッドにおける平坦なフランジの外周縁と、前記多層セラミック基板における裏面との間に、該多層セラミック基板の厚み方向に沿った剪断力が作用する。その結果、上記スタッドにおけるフランジの外周縁に隣接する上記多層セラミック基板の裏面付近のセラミックに、該基板の厚み方向に沿ったクラックを生じるおそれがあった。該クラックが発生した場合、被検査対象である複数の電子部品に対し、正確な検査を行い難くなると共に、上記多層セラミック基板自体が破損してしまう、という問題があった。   However, in the multilayer ceramic substrate and the method of manufacturing the multilayer ceramic substrate, when a large external force is applied to the stud to pull outward along the axial direction of the bolt, the outer peripheral edge of the flat flange in the stud and the multilayer ceramic A shear force acts along the thickness direction of the multilayer ceramic substrate between the back surface of the substrate and the substrate. As a result, in the ceramic in the vicinity of the back surface of the multilayer ceramic substrate adjacent to the outer peripheral edge of the flange in the stud, there is a possibility that a crack may occur along the thickness direction of the substrate. When the crack is generated, there is a problem that it becomes difficult to carry out an accurate inspection on a plurality of electronic components to be inspected and the multilayer ceramic substrate itself is broken.

特開２０１１−１６５９４５号公報（第１〜２０頁、図１〜７）JP, 2011-165945, A (pages 1-20, FIGS. 1-7)

本発明は、背景技術で説明した問題点を解決し、セラミック製の第１積層体を含む基板本体を備え、前記第１積層体の裏面に接合した複数のスタッドのボルト部またはナット筒体部に対し、これらの軸方向に沿った外力が加えられても、上記スタッドのフランジ部の周縁に隣接する上記第１積層体の裏面におけるセラミックにクラックが生じ難い電子部品検査装置用配線基板を提供する、ことを課題とする。   The present invention solves the problems described in the background art, and comprises a substrate main body including a first laminate made of ceramic, and bolt portions or nut barrels of a plurality of studs joined to the back surface of the first laminate. On the other hand, there is provided a wiring substrate for an electronic component inspection device in which a crack is not easily generated in the ceramic on the back surface of the first laminate adjacent to the peripheral edge of the flange portion of the stud even when external force along these axial directions is applied. To be an issue.

課題を解決するための手段および発明の効果Means for Solving the Problems and Effects of the Invention

本発明は、前記課題を解決するため、前記スタッドのフランジ部の外側面を、該外側面の中央側から外周縁に向かって、該フランジ部の内側面に順次接近する円錐台形状とする、ことに着想して成されたものである。
即ち、本発明の電子部品検査装置用配線基板（請求項１）は、複数のセラミック層を積層してなり、表面および裏面を有する第１積層体と、該第１積層体の裏面に接合された複数のスタッドと、を備えた電子部品検査装置用配線基板であって、上記スタッドは、底面視が円形のフランジ部と、該フランジ部の外側面における中央部から垂設されたボルト部あるいはナット筒体部とからなり、上記フランジ部は、上記ボルト部あるいはナット筒体部が突出する外側面において、上記ボルト部の基端側あるいはナット筒体部の基端側から該フランジ部の外周縁に向かって、該フランジ部の内側面側に順次接近する円錐台形状を呈している、ことを特徴とする。 According to the present invention, in order to solve the above problems, the outer surface of the flange portion of the stud has a frusto-conical shape that sequentially approaches the inner surface of the flange portion from the center side to the outer peripheral edge of the outer surface. It was made with an idea.
That is, the wiring substrate for an electronic component inspection device of the present invention (claim 1) is formed by laminating a plurality of ceramic layers, and is joined to a first laminate having a front surface and a back surface, and the back surface of the first laminate. A wiring board for an electronic component inspection device including a plurality of studs, wherein the studs are a flange portion having a circular bottom view, and a bolt portion hanging from a central portion on the outer surface of the flange portion or The flange portion is formed of a nut cylindrical body portion, and the flange portion is formed on the outer surface from which the bolt portion or the nut cylindrical body portion protrudes from the proximal end side of the bolt portion or the proximal end side of the nut cylindrical body portion. It is characterized by having a frusto-conical shape which approaches the inner surface side of the flange portion sequentially toward the peripheral edge.

前記電子部品検査装置用配線基板によれば、以下の効果（１）が得られる。
（１）前記スタッドは、そのフランジ部の外側面が、該外側面の中央部に垂設されたボルト部あるいはナット筒体部の基端側から、該フランジ部の外周縁に向かって、該フランジ部の内側面側に順次接近する円錐台形状を呈するように傾斜している。そのため、上記ボルト部あるいはナット筒体部の軸方向に沿って、第１積層体の裏面から離間する方向の外力を受けた際に、上記フランジ部において比較的薄肉の外周縁に作用する前記外力の応力（分力）が軽減される。従って、上記フランジ部の外周縁に隣接する前記第１積層体の裏面付近におけるセラミック層にクラックが生じる事態を確実に抑制ないし低減することが可能となる。 According to the wiring board for an electronic component inspection device, the following effect (1) can be obtained.
(1) In the stud, the outer surface of the flange portion faces the outer peripheral edge of the flange portion from the base end side of the bolt portion or nut cylindrical portion vertically provided at the central portion of the outer surface. It inclines so as to exhibit a frusto-conical shape that sequentially approaches the inner surface side of the flange portion. Therefore, when receiving an external force in a direction away from the back surface of the first laminate along the axial direction of the bolt portion or nut cylindrical portion, the external force acting on the relatively thin outer peripheral edge in the flange portion Stress (component force) is reduced. Therefore, it is possible to reliably suppress or reduce the occurrence of a crack in the ceramic layer in the vicinity of the back surface of the first laminate adjacent to the outer peripheral edge of the flange portion.

尚、前記第１積層体を構成する前記セラミック層は、例えば、ガラス−セラミックのような低温焼成セラミック、あるいは、アルミナなどの高温焼成セラミックからなる。
また、前記第１積層体の内部には、互いに導通可能な内層配線やビア導体が適宜形成される。該内層配線やビア導体は、銅や銅合金、または銀や銀合金、あるいは、タングステンまたはモリブデンなどからなる。
更に、前記スタッドは、例えば、コバール（Ｆｅ−２９％Ｎｉ−１７％ｃｏ）、４２アロイ（Ｆｅ−４２％Ｎｉ）、１９４合金（Ｃｕ−２．３％Ｆｅ−０．０３％Ｐ）、あるいは、ステンレス鋼からなる。
加えて、前記スタッドは、例えば、フランジ部の直径が、１０〜１４ｍｍである場合、該フランジ部の中央部の厚みは、３〜７ｍｍである。該スタッドのボルト部やナット筒体部のネジ（ネジの呼び）は、例えば、Ｍ４，Ｍ５である。 The ceramic layer constituting the first laminate is made of, for example, a low temperature fired ceramic such as glass-ceramic or a high temperature fired ceramic such as alumina.
Further, inner layer wirings and via conductors that can be conducted to each other are appropriately formed inside the first stacked body. The inner layer wiring and the via conductor are made of copper, copper alloy, silver, silver alloy, tungsten, molybdenum or the like.
Furthermore, the studs may be, for example, Kovar (Fe-29% Ni-17% co), 42 alloy (Fe-42% Ni), 194 alloy (Cu-2.3% Fe-0.03% P), or , Made of stainless steel.
In addition, when the diameter of the flange portion is 10 to 14 mm, for example, the thickness of the central portion of the flange portion is 3 to 7 mm. Screws (nominal of the screw) of the bolt portion of the stud and the nut cylindrical portion are, for example, M4 and M5.

また、本発明には、前記スタッドの前記フランジ部の前記外側面は、前記ボルト部あるいはナット筒体部の軸方向に沿った垂直断面において、単一の傾斜線であるか、あるいは、複数の傾斜線からなる、電子部品検査装置用配線基板（請求項２）も含まれる。
上記２つの形態のうち、前記フランジ部の前記外側面が、前記ボルト部あるいはナット筒体部の軸方向に沿った垂直断面において、複数の傾斜線からなる形態によれば、上記外側面の外周縁側の傾斜面を、該外側面の中央部側の傾斜面よりも、前記第１積層体の裏面に対する傾斜角度を小さくし且つ薄肉にできる。従って、前記効果（１）を一層確実に得ることができる。
尚、前記フランジ部の外側面を構成する前記傾斜線は、前記第２積層体の裏面に対し、５度以上２０度以下の範囲（例えば、８度や１５度）で傾斜している。 In the present invention, the outer surface of the flange portion of the stud may be a single inclined line or a plurality of inclined lines in a vertical cross section along the axial direction of the bolt portion or the nut cylindrical portion. A wiring board for an electronic component inspection device (claim 2) comprising inclined lines is also included.
Of the two forms described above, according to the aspect in which the outer side surface of the flange portion is formed of a plurality of inclined lines in a vertical cross section along the axial direction of the bolt portion or nut cylindrical body portion, the outer periphery of the outer side surface The inclined surface on the edge side can be thinner and thinner than the inclined surface on the central side of the outer surface with respect to the back surface of the first laminate. Therefore, the effect (1) can be obtained more reliably.
In addition, the said inclination line which comprises the outer surface of the said flange part inclines in 5 degrees or more and 20 degrees or less range (for example, 8 degrees or 15 degrees) with respect to the back surface of the said 2nd laminated body.

更に、本発明には、前記スタッドの前記フランジ部における前記外側面の外周縁と、前記内側面の外周縁との間には、前記ボルト部あるいはナット筒体部の軸方向に沿った長さが２００μｍ以下の円環面が位置している、電子部品検査装置用配線基板（請求項３）も含まれる。
これによれば、前記効果（１）に加えて、更に以下の効果（２）が得られる。
（２）前記フランジ部の内側面と後述する金属層との間に配設されるロウ材層の外周部を、上記円環面の軸方向に沿って濡れ広がるフィレット形状にできる。その結果、上記ロウ材層の外周部が、不用意に上記金属層の外側における前記第１積層体の裏面に濡れ広がる事態を抑制できる。従って、前記第１積層体の裏面において、前記スタッドごとに隣接してファインピッチで形成された接続端子などとの不用意な短絡を防ぐことがてきる。
尚、前記円環面の軸方向に沿った長さの下限は、１００μｍである。 Furthermore, according to the present invention, a length along the axial direction of the bolt portion or the nut cylindrical portion between the outer peripheral edge of the outer side surface of the flange portion of the stud and the outer peripheral edge of the inner side surface A wiring board for an electronic component inspection device (claim 3) in which an annular surface having a diameter of 200 μm or less is located is also included.
According to this, in addition to the effect (1), the following effect (2) can be obtained.
(2) The outer peripheral portion of the brazing material layer disposed between the inner side surface of the flange portion and the metal layer described later can be formed into a fillet shape which spreads in the axial direction of the annular surface. As a result, it is possible to suppress a situation in which the outer peripheral portion of the brazing material layer carelessly spreads on the back surface of the first laminate outside the metal layer. Therefore, on the back surface of the first laminate, an inadvertent short circuit with a connection terminal or the like formed adjacent to each of the studs at a fine pitch can be prevented.
The lower limit of the length of the torus along the axial direction is 100 μm.

また、本発明には、前記スタッドは、該スタッドの前記フランジ部の内側面と、前記第１積層体の裏面に形成された金属層との間に配設されるロウ材層を介して、前記第１積層体の裏面に接合されている、電子部品検査装置用配線基板（請求項４）も含まれる。
これによれば、セラミックからなる前記第１積層体の裏面に対し、予め、該裏面に形成された金属層に対し、前記スタッドにおけるフランジ部の内側面を容易にロウ付けできるので、前記効果（１）をより確実なものとすることができる。
尚、前記金属層は、例えば、スパッタリングによるチタンの薄膜層、同じく銅の薄膜層、および電解メッキによるニッケル層と銅層を順次積層し、更にこれらの外側面全体に亘って電解メッキによる金膜を被覆したものである。
また、前記ロウ材層となるロウ材は、例えば、金ロウや銀ロウであり、該金ロウには、例えば、Ａｕ−Ｓｎ系合金やＡｕ−Ｃｕ系合金が例示され、前記銀ロウには、例えば、Ａｇ−Ｃｕ系合金やＡｇ−Ｃｕ−Ｚｎ系合金が例示される。
更に、上記ロウ材は、例えば、前記金属層の表面またはスタッドのフランジ部の内側面に対し、ディスペンサーによって溶融状態で供給されるか、あるいは、平面視で前記フランジ部の外形と相似形にプリフォームされたものが配設される。 Further, in the present invention, the stud is provided via a brazing material layer disposed between the inner surface of the flange portion of the stud and the metal layer formed on the back surface of the first laminate. A wiring board for an electronic component inspection device (claim 4) joined to the back surface of the first laminate is also included.
According to this, the inner surface of the flange portion of the stud can be easily brazed to the back surface of the first laminated body made of ceramic in advance with respect to the metal layer formed on the back surface. 1) can be made more reliable.
The metal layer is formed, for example, by sequentially laminating a thin film layer of titanium by sputtering, a thin film layer of copper similarly, and a nickel layer and copper layer by electrolytic plating, and further forming a gold film by electrolytic plating over the entire outer surface. Is coated.
The brazing material to be the brazing material layer is, for example, gold or silver, and examples of the gold include Au-Sn based alloys and Au-Cu based alloys, and the silver based solder includes For example, an Ag-Cu alloy and an Ag-Cu-Zn alloy are exemplified.
Furthermore, for example, the brazing material is supplied in a molten state by a dispenser to the surface of the metal layer or the inner surface of the flange portion of the stud, or alternatively, the brazing material has a shape similar to the outer shape of the flange portion in plan view. The reformed one is disposed.

加えて、本発明には、前記第１積層体の表面には、複数の樹脂層を積層してなる第２積層体が配置されており、該第２積層体の表面には複数のプローブ用パッドが形成されている、電子部品検査装置用配線基板（請求項５）も含まれる。
これによれば、前記効果（１），（２）に加えて、更に以下の効果（３）が得られる。
（３）前記複数のスタッドを介して、被検査対象であるシリコンウェハーなどの表面に対し、本配線基板の姿勢を調整することによって、複数の上記プローブ用パッドごとの上面に追って個別に配置されるプローブピンを、ファインピッチ（極狭い間隔）で配置することが容易となり、上記シリコンウェハーなどの表面に形成された複数の電子部品に個別に接触させて、所望の電気的な検査を正確且つ迅速に行うことが可能となる。
尚、前記プローブ用パッドには、追ってプローブピンが個別に配置される。
また、前記第２積層体の樹脂層は、例えば、耐熱性に優れたポリイミドからなり、該第２積層体の内部にも、互いに導通可能な内層配線やビア導体が適宜形成される。該内層配線やビア導体は、銅または銅合金、あるいは銀または銀合金からなる。 In addition, in the present invention, a second laminate formed by laminating a plurality of resin layers is disposed on the surface of the first laminate, and a plurality of probes are disposed on the surface of the second laminate. A wiring board for an electronic component inspection device (claim 5) in which a pad is formed is also included.
According to this, in addition to the effects (1) and (2), the following effect (3) can be obtained.
(3) By adjusting the attitude of the wiring board with respect to the surface of a silicon wafer to be inspected via the plurality of studs, the upper surface of each of the plurality of probe pads is separately disposed. Probe pins can be easily arranged at fine pitches (very narrow intervals), and the individual electronic components formed on the surface such as the silicon wafer can be individually It can be done quickly.
Note that probe pins are individually arranged on the probe pad later.
Further, the resin layer of the second laminate is made of, for example, polyimide excellent in heat resistance, and an inner layer wiring and a via conductor which can be conducted to each other are appropriately formed also inside the second laminate. The inner layer wiring and via conductor are made of copper or copper alloy, or silver or silver alloy.

本発明による一形態の電子部品検査装置用配線基板を示す垂直断面図。FIG. 1 is a vertical sectional view showing a wiring board for an electronic component inspection device according to an aspect of the present invention. 上記配線基板の垂直断面図における１つのスタッド付近を示す拡大図。FIG. 5 is an enlarged view showing the vicinity of one stud in the vertical cross-sectional view of the wiring board. 異なる形態のスタッド付近を示す上記同様の拡大図。The same enlarged view which shows the stud vicinity of a different form. 更に異なる形態のスタッド付近を示す上記同様の拡大図。Furthermore, the same enlarged view showing the vicinity of the stud in a different form.

以下において、本発明を実施するための形態について説明する。
図１は、本発明による一形態の電子部品検査装置用配線基板（以下、単に、配線基板と称する）１を示す垂直断面図、図２は、該配線基板１における１つのスタッド２０ａ付近を示す拡大図である。
上記配線基板１は、図１に示すように、セラミックからなる第１積層体３、および、該第１積層体３の表面５の上に積層され且つ樹脂からなる第２積層体４から構成された基板本体２と、前記第１積層体３の裏面６に接合された複数のスタッド２０ａと、を備えている。
上記第１積層体３は、図１に示すように、３層（複数）のセラミック層ｃ１〜ｃ３を一体に積層し、且つ対向する表面５および裏面６を有してなり、前記表面５には、複数の表面配線９が形成され、上記セラミック層ｃ１〜ｃ３の層間ごとにも複数の内層配線１０が形成されていると共に、上記裏面６には、前記複数のスタッド２０ａに隣接して複数の接続端子１２が互いに離れて形成されている。 Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a vertical sectional view showing a wiring board for an electronic component inspection device (hereinafter simply referred to as a wiring board) 1 according to an embodiment of the present invention, and FIG. 2 shows the vicinity of one stud 20 a in the wiring board 1. It is an enlarged view.
As shown in FIG. 1, the wiring board 1 is composed of a first laminate 3 made of ceramic, and a second laminate 4 made of resin and laminated on the surface 5 of the first laminate 3. And a plurality of studs 20 a joined to the back surface 6 of the first laminate 3.
As shown in FIG. 1, the first laminate 3 is formed by integrally laminating three layers of ceramic layers c1 to c3 and having a surface 5 and a back surface 6 facing each other. A plurality of surface wirings 9 are formed, and a plurality of inner layer wirings 10 are formed also for each of the layers of the ceramic layers c1 to c3, and a plurality of adjacent wirings 20 are formed on the back surface 6 adjacent to the plurality of studs 20a. The connection terminals 12 are formed apart from each other.

前記表面配線９、内層配線１０、および接続端子１２の間は、前記セラミック層ｃ１〜ｃ３を任意に貫通するビア導体１１を介して、電気的に接続されている。
尚、前記セラミック層ｃ１〜ｃ３は、例えば、ガラス−セラミックらなり、上表面配線９、内層配線１０、ビア導体１１、および接続端子１２は、例えば、銅または銅合金からなる。
また、前記第２積層体４は、図１に示すように、３層（複数）の樹脂層ｊ１〜ｊ３を一体に積層し、且つ対向する表面７および裏面８を有してなり、前記表面７には、複数のプローブ用パッド１５が形成され、上記樹脂層ｊ１〜ｊ３間には、複数の内層配線１４が形成されている。上記プローブ用パッド１５ごとの上面には、図１に示すように、追ってプローブピン１８が個別に配置される。
上記プローブ用パッド１５と内層配線１４との間や、層間が相違する内層配線１４同士の間は、樹脂層ｊ１〜ｊ３を個別に貫通するビア導体（フィルドビア）１３を介して電気的に接続されている。 The surface wiring 9, the inner layer wiring 10, and the connection terminal 12 are electrically connected to each other through a via conductor 11 which optionally passes through the ceramic layers c1 to c3.
The ceramic layers c1 to c3 are made of, for example, glass-ceramic, and the upper surface wiring 9, the inner layer wiring 10, the via conductor 11, and the connection terminal 12 are made of, for example, copper or copper alloy.
Further, as shown in FIG. 1, the second laminate 4 is formed by integrally laminating three layers (plural) resin layers j1 to j3 and having an opposing surface 7 and a back surface 8, 7, a plurality of probe pads 15 are formed, and a plurality of inner layer wirings 14 are formed between the resin layers j1 to j3. Probe pins 18 are individually disposed on the upper surface of each of the probe pads 15 later, as shown in FIG.
The probe pads 15 and the inner layer wires 14 or between the inner layer wires 14 having different layers are electrically connected via via conductors (filled vias) 13 individually penetrating the resin layers j1 to j3. ing.

尚、前記樹脂層ｊ１〜ｊ３は、例えば、耐熱性に優れたポリイミドからなり、前記ビア導体１３、内層配線１４、およびプローブ用パッド１５は、例えば、銅または銅合金からなる。
また、前記樹脂層ｊ３を貫通するビア導体１３と、前記第１積層体３の表面配線９とが電気的に接続するように、前記第１積層体３の表面５と、第２積層体４の裏面８との間は、図示しない接着層を介して接合されている。
更に、図１に示すように、前記第１積層体３の裏面６において、前記接続端子１２ごとに隣接して複数の金属層１６が形成されている。該金属層１６は、セラミック層ｃ３が有する裏面６に対し、スパッタリングによるチタンの薄膜層および銅の薄膜層と、電解メッキによる銅層およびニッケル層とを、これらの厚み方向に沿って順次形成すると共に、これら全体の外側面に電解メッキによる金膜（何れも図示せず）を被覆したものである。 The resin layers j1 to j3 are made of, for example, polyimide excellent in heat resistance, and the via conductor 13, the inner layer wiring 14, and the probe pad 15 are made of, for example, copper or a copper alloy.
Further, the surface 5 of the first laminate 3 and the second laminate 4 are provided such that the via conductor 13 penetrating the resin layer j3 is electrically connected to the surface wiring 9 of the first laminate 3. The back surface 8 is bonded to the back surface 8 via an adhesive layer (not shown).
Furthermore, as shown in FIG. 1, on the back surface 6 of the first laminate 3, a plurality of metal layers 16 are formed adjacent to each of the connection terminals 12. The metal layer 16 sequentially forms a thin film layer of titanium and a thin film layer of copper by sputtering, and a copper layer and a nickel layer by electrolytic plating in this order along the thickness direction on the back surface 6 of the ceramic layer c3. In addition, the entire outer surface is coated with a gold film (not shown) by electrolytic plating.

図２に示すように、前記金属層１６の表面上には、ロウ材層３０を介して、スタッド２０ａが接合されている。前記スタッド２０ａは、例えば、コバールの一体物からなり、全体が円錐台形状のフランジ部２１と、平面視で前記フランジ部２１の外側面２３（第１積層体３の裏面６と対向する面と反対側の面）における中央部から垂設されたボルト部２６とを備えている。上記フランジ部２１は、平面視が円形の内側面２２（第１積層体３の裏面６と対向する側の面）と、前記ボルト部２６の基端側から外周縁に向かって前記内側面２２に順次接近するように傾斜した外側面２３と、該外側面２３および前記内側面２２の外周縁同士間に位置するリング状の円環面２４とを有している。該円環部２４の軸方向の長さｙは、２００μｍ以下である。   As shown in FIG. 2, on the surface of the metal layer 16, a stud 20 a is joined via a brazing material layer 30. The stud 20a is, for example, an integral part of Kovar, and has a truncated cone-shaped flange 21 as a whole, and an outer surface 23 of the flange 21 in plan view (a surface facing the back surface 6 of the first laminate 3) And a bolt portion 26 vertically provided from a central portion on the opposite surface). The flange portion 21 has an inner surface 22 (a surface facing the rear surface 6 of the first laminate 3) having a circular plan view, and the inner surface 22 from the base end side of the bolt portion 26 toward the outer peripheral edge. , And a ring-shaped annular surface 24 located between the outer peripheral edges of the outer surface 23 and the inner surface 22. The axial length y of the annular portion 24 is 200 μm or less.

前記外側面２３のフランジ部２１の内側面２２に対する傾斜角度θは、５度以上２０度以下の範囲（例えば、１５度）である。即ち、該外側面２３は、単一の傾斜面からなる。また、前記ボルト部２６の外周面には、雄ネジ２５が螺旋状に刻設されている。
因みに、前記フランジ部２１の直径が、例えば、１０〜１４ｍｍの場合、該フランジ部２１の中央部の厚みは、３〜７ｍｍであり、該フランジ部２１を含む前記スタッド２０ａにおけるボルト部２６の雄ネジ２５は、例えば、Ｍ４である。 The inclination angle θ of the outer side surface 23 with respect to the inner side surface 22 of the flange portion 21 is in the range of 5 degrees or more and 20 degrees or less (for example, 15 degrees). That is, the outer side surface 23 consists of a single inclined surface. Further, a male screw 25 is spirally provided on the outer peripheral surface of the bolt portion 26.
Incidentally, when the diameter of the flange portion 21 is, for example, 10 to 14 mm, the thickness of the central portion of the flange portion 21 is 3 to 7 mm, and the male of the bolt portion 26 in the stud 20 a including the flange portion 21 The screw 25 is, for example, M4.

図２に示すように、前記金属層１６とスタッド２０ａのフランジ部２１との間には、円盤状のロウ材層３０が配設され、該ロウ材層３０と上記金属層１６とを介して、上記スタッド２０ａが前記第１積層体３の裏面６に接合されている。
上記ロウ材層３０は、例えば、Ａｕ−Ｓｕ系合金からなり、スタッド２０ａのフランジ部２１の外周縁よりも外側（径方向）に長さｘが２００μｍ以下ではみ出る外周部３１を有する。該外周部３１は、金属層１６の表面および前記円環部２４にそれぞれ沿った断面ほぼＬ字形状のフィレット形状を呈している。 As shown in FIG. 2, a disk-shaped brazing material layer 30 is disposed between the metal layer 16 and the flange portion 21 of the stud 20 a, with the brazing material layer 30 and the metal layer 16 interposed therebetween. The studs 20 a are joined to the back surface 6 of the first laminate 3.
The brazing material layer 30 is made of, for example, an Au-Su-based alloy, and has an outer peripheral portion 31 that protrudes with a length x of 200 μm or less outside (in the radial direction) the outer peripheral edge of the flange portion 21 of the stud 20a. The outer peripheral portion 31 has a fillet shape having a substantially L-shaped cross section along the surface of the metal layer 16 and the annular portion 24 respectively.

図３は、前記スタッド２０ａの異なる形態を示す前記同様の部分拡大図である。
該スタッド２０ａは、図３に示すように、前記同様のフランジ部２１と、ボルト部２６とを備えており、前記フランジ２１の外側面は、平面視で中央側の傾斜面（外側面）２３ａと外周側の傾斜面（外側面）２３ｂとの２つからなる。このうち、外周側の傾斜面２３ｂは、フランジ部２１の内側面２２に対して、前記中央側の傾斜面２３ａよりも比較的小さい（緩やかな）傾斜角度を有している。 FIG. 3 is a partially enlarged view of the same showing the different form of the stud 20a.
The stud 20a, as shown in FIG. 3, includes the same flange portion 21 and bolt portion 26 as described above, and the outer surface of the flange 21 has an inclined surface (outer surface) 23a on the center side in plan view. And an inclined surface (outer surface) 23b on the outer peripheral side. Among these, the inclined surface 23 b on the outer peripheral side has an inclination angle relatively smaller (loose) to the inner side surface 22 of the flange portion 21 than the inclined surface 23 a on the central side.

図４は、更に異なる形態のスタッド２０ｂを示す前記同様の部分拡大図である。
上記スタッド２０ｂは、前記同様のコバールの一体物からなり、図４に示すように、前記同様のフランジ部２１と、該フランジ部２１の外側面２３の中央部から垂設され、且つ全体が円柱形状を呈するナット筒体部２８とを備えている。該ナット筒体部２８の中心軸に沿った中空部内には、軸方向に沿った雌ネジ２７が螺旋形状に刻設されている。尚、上記フランジ部２１の外側面２３は、前記２つの傾斜面２３ａ，２３ｂからなる形態としても良い。 FIG. 4 is a partially enlarged view of the same showing the stud 20b in still another form.
The stud 20b is an integral part of the same Kovar and, as shown in FIG. 4, is suspended from the center of the same flange 21 and the outer surface 23 of the flange 21 as a whole, and is entirely cylindrical. And a nut cylinder 28 having a shape. In the hollow portion along the central axis of the nut cylindrical portion 28, a female screw 27 along the axial direction is cut in a spiral shape. The outer side surface 23 of the flange portion 21 may be formed of the two inclined surfaces 23a and 23b.

以上において説明した本発明の前記配線基板１によれば、前記スタッド２０ａ，２０ｂは、そのフランジ部２１の外側面２３が、該外側面２３の中央部に垂設されたボルト部２６またはナット筒体部２８の基端側から、該フランジ部２１の外周縁に向かって、該フランジ部２１の内側面２２側に順次接近する円錐台形状を呈するように傾斜している。そのため、ボルト部２６またはナット筒体部２８の軸方向に沿って、前記第１積層体３の裏面６の外側に向かう外力を受けた際に、上記フランジ部２１において比較的薄肉の円環面２４側に作用する前記外力の応力（分力）が軽減される。従って、上記フランジ部２１の外周縁に隣接する第１積層体３の裏面６付近におけるセラミック層ｃ３にクラックが生じる事態を確実に抑制ないし低減することができる。該効果（１）は、前記フランジ部２１の外側面２３が２つの傾斜面２３ａ，２３ｂからなる形態では一層顕著に得られる。   According to the wiring board 1 of the present invention described above, in the studs 20a and 20b, the bolt portion 26 or the nut cylinder in which the outer surface 23 of the flange portion 21 is vertically provided at the central portion of the outer surface 23. From the base end side of the body portion 28, toward the outer peripheral edge of the flange portion 21, it is inclined so as to exhibit a frusto-conical shape that sequentially approaches the inner side surface 22 side of the flange portion 21. Therefore, when an external force directed to the outside of the back surface 6 of the first laminate 3 is received along the axial direction of the bolt portion 26 or the nut cylindrical portion 28, the flange portion 21 has a relatively thin annular surface. The stress (component force) of the external force acting on the side 24 is reduced. Therefore, the occurrence of a crack in the ceramic layer c3 in the vicinity of the back surface 6 of the first laminate 3 adjacent to the outer peripheral edge of the flange portion 21 can be reliably suppressed or reduced. The effect (1) is more remarkably obtained in the embodiment in which the outer side surface 23 of the flange portion 21 is composed of two inclined surfaces 23a and 23b.

また、前記フランジ部２１の内側面２２と金属層１６との間に配設されるロウ材層３０の外周部３１が、前記円環面２４の軸方向に沿って濡れ広がるフィレット形状とされている。その結果、上記ロウ材層３０の外周部３１が、不用意に上記金属層１６の外側における前記第１積層体３の裏面６にはみ出る事態を抑制できるので、前記裏面６において前記スタッド２０ａ，２０ｂごとに隣接してファインピッチで形成された接続端子１２などとの不用意な短絡を防止できる。   Further, the outer peripheral portion 31 of the brazing material layer 30 disposed between the inner side surface 22 of the flange portion 21 and the metal layer 16 has a fillet shape which spreads wet along the axial direction of the annular surface 24. There is. As a result, the peripheral portion 31 of the brazing material layer 30 can be prevented from inadvertently protruding to the back surface 6 of the first laminated body 3 outside the metal layer 16, so that the studs 20a and 20b are formed on the back surface 6. It is possible to prevent an inadvertent short circuit with the connection terminal 12 or the like which is adjacently formed with a fine pitch.

更に、前記複数のスタッド２０ａ，２０ｂを介して、被検査対象のシリコンウェハーなどの表面に対し、前記配線基板１の姿勢を調整することによって、複数の前記プローブ用パッド１５ごとの上面に追って個別に植設されるプローブピン１８を、上記シリコンウェハーなどの表面に形成された複数の電子部品に個別に接触させて、所望の電気的な検査を正確に行うことが可能となる。
従って、前記配線基板１によれば、前記効果（１）〜（３）が確実に得られる。 Furthermore, by adjusting the posture of the wiring board 1 with respect to the surface of the silicon wafer to be inspected or the like via the plurality of studs 20a and 20b, the upper surface of each of the plurality of probe pads 15 is individually separated. It is possible to individually contact the plurality of electronic components formed on the surface of the silicon wafer or the like so that the desired electrical inspection can be accurately performed.
Therefore, according to the wiring board 1, the effects (1) to (3) can be reliably obtained.

ここで、本発明の前記配線基板１の実施例について説明する。
予め、同じガラス−セラミックからなり且つ全体の厚みおよび寸法が同じである第１積層体３と、同じポリイミド樹脂からなり且つ全体の厚みおよび寸法が同じである第２積層体４とを積層した２０個の基板本体２を製作した。これらごとの第１積層体３の裏面６における中心部は、１個ずつの同じ構成材料および構造を有する金属層１６を形成した。
上記２０個の基板本体２のうち、１０個については、同じＡｕ−Ｓｕ系合金からなり、且つ予め同じ寸法の円盤状にプリフォームされたロウ材を介して、上記金属層１６ごとの表面に対し、同じコバールからなり且つ形状および寸法を有するフランジ部２１およびボルト部２６を有するスタッド２０ａを接合した。前記フランジ部２１の外側面２３は、該フランジ部２１の内側面２２に対し、８度傾斜していた。かかる１０個の基板本体２を実施例とした。 Here, an embodiment of the wiring board 1 of the present invention will be described.
First, a first laminate 3 made of the same glass-ceramic and having the same overall thickness and size, and a second laminate 4 made of the same polyimide resin and having the same overall thickness and size 20 Individual substrate bodies 2 were produced. The central portion of the back surface 6 of the first laminate 3 for each of these formed a metal layer 16 having the same constituent material and structure one by one.
About ten of the twenty substrate bodies 2 are made of the same Au-Su based alloy, and on the surface of each of the metal layers 16 via a brazing material preformed into a disk shape of the same dimensions in advance. On the other hand, a stud 20a having a flange portion 21 and a bolt portion 26 which are made of the same Kovar and has the shape and dimensions is joined. The outer side surface 23 of the flange portion 21 is inclined at 8 degrees with respect to the inner side surface 22 of the flange portion 21. The ten substrate bodies 2 are taken as an example.

一方、前記２０個の基板本体２のうち、残りの１０個についても、同じＡｕ−Ｓｕ系合金からなり、且つ予め同じ寸法の円盤状にプリフォームされたロウ材を介して、前記金属層１６ごとの表面に対し、同じコバールからなり且つ形状および寸法を有するフランジ部およびボルト部２６を有するスタッドを接合した。前記フランジ部全体の厚みは、前記スタッド２０ａのフランジ部２１の中央部の厚みと同じで且つ平坦面であった。かかる１０個の基板本体２を比較例とした。   On the other hand, the remaining ten of the twenty substrate bodies 2 are also made of the same Au--Su based alloy, and are made of the metal layer 16 via a brazing material preformed into a disk shape of the same size in advance. To each surface, a stud having a flange portion and a bolt portion 26 which are made of the same Kovar and has the shape and dimensions is joined. The thickness of the entire flange portion was the same as the thickness of the central portion of the flange portion 21 of the stud 20 a and was a flat surface. The ten substrate bodies 2 are used as a comparative example.

以上の１個ずつの実施例および比較例の基板本体２ごとに対し、前記ボルト部２６を軸方向に引っ張って、フランジ部（２１）の外周部に隣接する第１積層体３の裏面６にクラックを生じた荷重（破壊強度）を、各例の基板本体２ごとに測定した。
その結果、実施例の基板本体２では、破壊強度（Ｎ：ニュートン）が全て約１０００〜１３５０Ｎの高い範囲にあった。これに対し、比較例の基板本体２では、破壊強度（Ｎ）が全て約６００〜６５０Ｎの低い範囲にあった。
以上のような実施例によって、本発明の優位性が裏付けられた。 The bolt portion 26 is pulled in the axial direction with respect to each of the substrate bodies 2 of the above-described one example and the comparative example, and the back surface 6 of the first laminated body 3 adjacent to the outer peripheral portion of the flange portion 21 is The load (breaking strength) which produced the crack was measured for every substrate body 2 of each example.
As a result, in the substrate body 2 of the example, all of the breaking strengths (N: newtons) were in the high range of about 1000 to 1350 N. On the other hand, in the substrate body 2 of the comparative example, all the breaking strengths (N) were in the low range of about 600 to 650N.
The superiority of the present invention is supported by the examples as described above.

本発明は、以上において説明した各形態や実施例に限定されるものではない。
例えば、前記第１積層体３を構成するセラミック層は、２層あるいは４層以上でも良く、該セラミック層のセラミックは、アルミナ、窒化アルミニウム、あるいはムライトなどにしても良い。
また、前記第２積層体４を構成する樹脂層も、２層あるいは４層以上としても良いし、該樹脂層をエポキシ系樹脂からなるものとしても良い。
更に、前記スタッド２０ａ，２０ｂは、４２アロイ、１９４合金、あるいは各種のステンレス鋼からなるものとしても良い。 The present invention is not limited to the embodiments and examples described above.
For example, the number of ceramic layers constituting the first laminate 3 may be two or four or more, and the ceramic of the ceramic layer may be alumina, aluminum nitride, mullite or the like.
Also, the resin layer constituting the second laminate 4 may be two or four or more layers, and the resin layer may be made of an epoxy resin.
Furthermore, the studs 20a and 20b may be made of 42 alloy, 194 alloy, or various stainless steels.

更に、前記スタッド２０ａ，２０ｂのフランジ部２１は、それらの外側面２３に３つ以上の傾斜面を平面視で同心円状に併有している形態としても良い。
加えて、前記スタッド２０ａのボルト部２６の中心軸に沿って、内周面に雌ネジ２７が刻設された雌ネジ穴を併設しても良いし、前記スタッド２０ｂのナット筒体部２８の外周面に雄ネジ２５を更に刻設した形態としても良い。 Furthermore, the flanges 21 of the studs 20a and 20b may have three or more inclined surfaces on their outer surface 23 in a concentric manner in plan view.
In addition, a female screw hole in which a female screw 27 is engraved on the inner circumferential surface may be provided along the central axis of the bolt portion 26 of the stud 20a, or the nut cylindrical portion 28 of the stud 20b. The male screw 25 may be further engraved on the outer peripheral surface.

本発明によれば、セラミック製の第１積層体の裏面に接合した複数のスタッドのボルト部またはナット筒体部に対し、これらの軸方向に沿った外力が加えられても、上記スタッドのフランジ部の周縁に隣接する上記第１積層体の裏面におけるセラミックにクラックが生じ難い電子部品検査装置用配線基板を提供できる。   According to the present invention, the flanges of the studs or the nut barrels of the plurality of studs joined to the back surface of the ceramic first laminated body, even if an external force along these axial directions is applied. It is possible to provide a wiring board for an electronic component inspection device in which a crack is not easily generated in ceramic on the back surface of the first laminate adjacent to the peripheral edge of the portion.

１…………………電子部品検査装置用配線基板／配線基板
３…………………第１積層体
４…………………第２積層体
５，７……………表面
６…………………裏面
１５………………プローブ用パッド
１６………………金属層
２０ａ，２０ｂ…スタッド
２１………………フランジ部
２２………………内側面
２３………………外側面／傾斜面
２３ａ，２３ｂ…傾斜面
２４………………円環面
２６………………ボルト部
２８………………ナット筒体部
３０………………ロウ材層
ｃ１〜ｃ３………セラミック層
ｊ１〜ｊ３………樹脂層 1 .............. Wiring board / wiring board for electronic component inspection device 3 ........ First laminate 4 ........ Second laminate 5, 7 ...... Front surface 6... Back surface 15 ........ Probe pad 16 ........ Metal layer 20a, 20b... Inner surface 23 ........ Outer surface / inclined surface 23a, 23b... Inclined surface 24 ........ Annular surface 26 ........ Bolt part 28 ........ Nut cylinder part 30... Wax layer c1 to c3... Ceramic layer j1 to j3 .. Resin layer

Claims (5)

複数のセラミック層を積層してなり、表面および裏面を有する第１積層体と、該１積層体の裏面に接合された複数のスタッドと、を備えた電子部品検査装置用配線基板であって、
上記スタッドは、底面視が円形のフランジ部と、該フランジ部の外側面における中央部から垂設されたボルト部あるいはナット筒体部とからなり、
上記フランジ部は、上記ボルト部あるいはナット筒体部が突出する外側面において、上記ボルト部の基端側あるいはナット筒体部の基端側から該フランジ部の外周縁に向かって、該フランジ部の内側面側に順次接近する円錐台形状を呈している、
ことを特徴とする電子部品検査装置用配線基板。 A wiring board for an electronic component inspection device, comprising: a first laminate having a plurality of ceramic layers laminated and having a front surface and a back surface; and a plurality of studs joined to the back surface of the first laminate,
The stud comprises a flange portion having a circular bottom view, and a bolt portion or a nut cylinder portion suspended from a central portion of the outer surface of the flange portion.
The flange portion is a flange portion toward the outer peripheral edge of the flange portion from the base end side of the bolt portion or the base end side of the nut cylinder portion on the outer surface from which the bolt portion or the nut cylinder portion protrudes. Has a frusto-conical shape that approaches the inner side of the
A wiring board for an electronic component inspection device characterized in that 前記スタッドの前記フランジ部の前記外側面は、前記ボルト部あるいはナット筒体部の軸方向に沿った垂直断面において、単一の傾斜線であるか、あるいは、複数の傾斜線からなる、
ことを特徴とする請求項１に記載の電子部品検査装置用配線基板。 The outer surface of the flange portion of the stud is a single inclined line or is formed of a plurality of inclined lines in a vertical cross section along the axial direction of the bolt portion or the nut cylindrical portion.
A wiring board for an electronic component inspection device according to claim 1, characterized in that. 前記スタッドの前記フランジ部における前記外側面の外周縁と、前記内側面の外周縁との間には、前記ボルト部あるいはナット筒体部の軸方向に沿った長さが２００μｍ以下の円環面が位置している、
ことを特徴とする請求項１または２に記載の電子部品検査装置用配線基板。 An annular surface having a length of 200 μm or less along the axial direction of the bolt portion or the nut cylindrical portion between the outer peripheral edge of the outer surface of the flange portion of the stud and the outer peripheral edge of the inner surface Is located,
The wiring board for electronic component inspection devices according to claim 1 or 2 characterized by things. 前記スタッドは、該スタッドの前記フランジ部の内側面と、前記第１積層体の裏面に形成された金属層との間に配設されるロウ材層を介して、前記第１積層体の裏面に接合されている、
ことを特徴とする請求項１乃至３の何れか一項に記載の電子部品検査装置用配線基板。 The stud is provided on the back surface of the first laminate via a brazing material layer disposed between the inner surface of the flange portion of the stud and the metal layer formed on the back surface of the first laminate. Is joined to the
The wiring board for electronic component inspection devices as described in any one of the Claims 1 thru | or 3 characterized by the above-mentioned. 前記第１積層体の表面には、複数の樹脂層を積層してなる第２積層体が配置されており、該第２積層体の表面には複数のプローブ用パッドが形成されている、
ことを特徴とする請求項１乃至４の何れか一項に記載の電子部品検査装置用配線基板。 A second laminate formed by laminating a plurality of resin layers is disposed on the surface of the first laminate, and a plurality of probe pads are formed on the surface of the second laminate.
The wiring board for electronic component inspection devices as described in any one of the Claims 1 thru | or 4 characterized by the above-mentioned.
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