JP2019056143A - Base material having thermal spray coating and method for manufacturing the same - Google Patents

Abstract

To provide a method for manufacturing a base material having a thermal spray coating, capable of compatibly improving adhesion to the base material and obtaining a sufficient thickness.SOLUTION: A method for manufacturing a base material having a thermal spray coating comprises: a first thermal spray step of thermally spraying slurry obtained by dispersing spray particles into a solvent on the surface of a base material 20 to form a first thermal spray coating 31 having a thickness of 120 μm or less; and a second thermal spray step of thermally spraying the spray particles in powder on the surface of the first thermal spray coating 31 to form a second thermal spray coating 32.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a base material provided with a sprayed film and a method for manufacturing the same.

When manufacturing semiconductor devices, liquid crystal devices, etc., there are processes such as dry etching in which a predetermined film formed on a Si wafer or a glass substrate is processed in a plasma environment using a halogen-based corrosive gas such as F _2. . Therefore, in recent years, in manufacturing apparatuses such as semiconductor devices and liquid crystal devices, in order to prevent the corrosion resistance of a base material made of a metal material such as Al on a chamber or various members exposed to a corrosive gas in a plasma environment, A sprayed film made of Y ₂ O ₃ or the like having corrosion resistance may be formed on the surface.

  And in order to suppress generation | occurrence | production of a particle, such a thermal spray film | membrane is requested | required that the surface after grinding | polishing process or grinding process is precise | minute, For that purpose, it is necessary to make a porosity small. Compared with dry thermal spraying, where the powder raw material is sprayed as it is, if the thermal spray film is formed by wet spraying using a slurry in which the powder raw material is dispersed, the porosity should be reduced to, for example, 1.5% or less. Is known to be possible.

In Patent Document 1, in order to prevent cracking of a brittle substrate such as glass, when an oxide film such as Y ₂ O ₃ or Al ₂ O ₃ is formed on the surface of the brittle substrate, first, a powder material is used. It is disclosed that dry spraying is performed, and then wet spraying is performed using a slurry in which a powder material is dispersed.

JP 2014-122418 A

  However, since the thermal spray film formed by dry spraying has a high porosity, it has poor adhesion to the base material, and there is a problem that it may be peeled off from the base material when used for a long period of time. On the other hand, in wet spraying, for example, since it is difficult to form a sprayed film having a thickness exceeding 120 μm, it is impossible to form a sprayed film having a sufficient thickness to protect the substrate from plasma corrosion. was there.

  The present invention has been made in view of the above-described conventional problems, and a base material provided with a thermal spray film capable of achieving both improvement in adhesion to the base material and securing sufficient thickness, and production thereof. It aims to provide a method.

  In the method for producing a base material provided with the sprayed film of the present invention, the first sprayed film having a thickness of 120 μm or less is formed on the surface of the base material in the form of a slurry in which spray particles are dispersed in a solvent. And a second step of forming a second sprayed film by spraying sprayed particles in the form of powder on the surface of the first sprayed film.

  In dry spraying in which the spray particles are sprayed in the form of powder, if the spray particles are too small, the spray particles cannot be satisfactorily supplied to the gas flow ejected from the spraying device. There was a limit to reducing the porosity of the sprayed film, and thus to the denseness. On the other hand, in the case of wet spraying in which the thermal spray particles are sprayed in the form of a slurry dispersed in a solvent, the thermal spray particles can be made finer and the porosity of the sprayed film formed can be reduced compared to dry spraying, and thus Excellent denseness.

  According to the manufacturing method of the base material provided with the sprayed film of the present invention, since the first sprayed film is formed on the surface of the base material by wet spraying, a gap is formed between the base material and the first sprayed film. Therefore, it is possible to improve the adhesion and reduce the possibility of peeling between the base material and the first sprayed film.

  Then, a second sprayed film is formed on the surface of the first sprayed film, both of which are sprayed with sprayed particles, and thus have excellent adhesion. Furthermore, since the thickness of the 1st sprayed film formed by wet spraying is 120 micrometers or less, it becomes possible to aim at reduction of a possibility that defects, such as a crack, arise in the formation process.

  Further, when the outermost surface of the sprayed film is the surface of the second sprayed film formed by dry spraying, it is inferior to the denseness compared with the sprayed film formed by wet spraying. It is possible to facilitate the above.

  In the manufacturing method of the base material provided with the sprayed film of the present invention, a third sprayed film having a thickness of 120 μm or less is sprayed on the surface of the second sprayed film in the form of a slurry in which sprayed particles are dispersed in a solvent. It is preferable that the method further includes a third step of forming.

  In this case, the outermost surface of the sprayed film can be the surface of the third sprayed film formed by wet spraying, and when this surface is polished or ground, the surface roughness of the exposed surface is reduced. This makes it possible to suppress the generation of particles.

  In addition, in the manufacturing method of the base material provided with the thermal spray film of the present invention, among the thermal spray films sequentially stacked on the base material, the fourth and subsequent even-numbered thermal spray films shall be formed by dry spraying, If the fifth and subsequent odd-numbered sprayed films are formed by wet spraying, the number of sprayed films is not limited.

  In the method of manufacturing a substrate provided with the sprayed coating of the present invention, when the porosity of the first sprayed coating is PW and the porosity of the second sprayed coating is PD, PW / PD ≦ 0. It is preferable that the relationship 5 is satisfied.

  When PW / PD exceeds 0.5, the case where the porosity PD of the second sprayed film becomes too small and the case where the porosity PW of the first sprayed film becomes too large are included. When PW / PD approaches 1, the structures of the first sprayed film and the second sprayed film are close to each other, so that the adhesion between the first sprayed film and the second sprayed film is improved.

  However, when the porosity PD of the second sprayed film is too small, it is difficult to make the porosity PD smaller than a certain value because the second sprayed film is formed by dry spraying. is there. On the other hand, when the porosity PW of the first sprayed film becomes too large, the adhesion between the base material and the first sprayed film cannot be sufficiently ensured.

  Moreover, in the manufacturing method of the base material provided with the sprayed film of the present invention, when the thickness of the first sprayed film is TW and the thickness of the second sprayed film is TD, TW / TD ≦ 0. It is preferable that the relationship 5 is satisfied.

  This is because, as can be seen from Examples and Comparative Examples described later, when the above relationship is not satisfied, cracks occur in the sprayed film located on the most front side among the sprayed films formed by wet spraying.

  Further, since wet spraying is inferior in thermal spraying efficiency compared to dry spraying, cost reduction is achieved by making the first sprayed film formed by wet spraying thinner than the second sprayed film formed by dry spraying. Can be achieved.

  The base material provided with the thermal spray film of the present invention includes a base material, a first thermal spray film formed on the surface of the base material, and a second thermal spray formed on the surface of the first thermal spray film. A substrate having a thermal spray film provided with a film, where PW / PD ≦ 0.5 when the porosity of the first thermal spray film is PW and the porosity of the second thermal spray film is PD. It is characterized by satisfying the relationship.

  According to the base material provided with the thermal spray film of the present invention, the porosity PW of the first thermal spray film formed on the surface of the base material is smaller than the second porosity PD. There are few gaps between the film and the adhesion, and it is possible to reduce the possibility of peeling between the substrate and the first sprayed film.

The schematic longitudinal cross-sectional view of the thermal spray member which concerns on the 1st Embodiment of this invention. The schematic longitudinal cross-sectional view of the thermal spray member which concerns on the 2nd Embodiment of this invention.

  A thermal spray member 10 and a manufacturing method thereof according to a first embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the thermal spray member 10 includes a base material 20 and a thermal spray film 30 formed on the surface of the base material 20. In addition, the thermal spray member 10 may include an electrode formed between the base material 20 and the thermal spray film 30.

  The thermal spray member 10 may be an electrostatic chuck that attracts the substrate to the surface of the thermal spray film 30 as a mounting surface by a Coulomb force generated when a voltage is applied to an electrode embedded therein. The thermal spray member 10 may be a heater that heats a substrate placed on the surface of the thermal spray film 30 that is a placement surface by a heating resistor embedded therein. Further, the thermal spray member 10 may be an electrostatic chuck with a heater function. In addition, the thermal spray member 10 may be a member used in a process chamber of a semiconductor manufacturing apparatus such as a liner or a shower head.

  In the present embodiment, the base material 20 is a substantially disk-shaped member made of aluminum. However, the base material 20 may be made of aluminum alloy, stainless steel, titanium alloy, tungsten, silicon, metal composite material (MMC), ceramics, or the like. Moreover, the shape of the base material 20 may be various shapes such as a polygonal plate shape, a disk shape, and an elliptical plate shape, or may be a complicated shape.

  In addition, it is preferable to process the surface of the base material 20 into a rough state so that the surface roughness becomes Ra 1.0 μm or more by sandblasting or machining. And the undercoat layer used as the buffer layer of the thermal expansion difference with the thermal spray film 30 may be coat | covered on the surface of the base material 20, or it may not be coat | covered.

A plurality of, in this embodiment, two layers of sprayed films composed of a first sprayed film 31 and a second sprayed film 32 are formed on the surface of the base material 20 by a spraying apparatus (not shown). The thermal spraying apparatus is not particularly limited as long as it is a commercially available thermal spraying apparatus that performs thermal spraying by a method such as arc spraying, plasma spraying, or high-speed flame spraying (HVOF spraying) using a fuel combustion gas. As the plasma gas, Ar, Ar + N ₂ , Ar + H ₂ , Ar + N ₂ + H ₂ , Ar + CO _2, Ar + O _2, or the like is used.

In the present embodiment, the thermal spray particles that are the powder material for thermal spraying are made of yttria (Y ₂ O ₃ ). However, the powder raw material is an insulating ceramic such as alumina (Al ₂ O ₃ ), aluminum nitride (AlN), zirconia (ZrO 2), alumina-zirconia (Al ₂ O ₃ —ZrO ₂ ), spinel (MgAl ₂ O ₄ ), etc. It may be composed of or one of these as a main component.

  The first sprayed film 31 is formed on the surface of the substrate 20. However, as described above, the first sprayed film 31 may be one in which the undercoat layer or a part thereof is formed on the surface of the electrode.

  The first sprayed film 31 is formed by a first spraying process (first process) in which wet spraying is performed in the form of a slurry in which sprayed particles are dispersed in a solvent. As the solvent, a flammable organic solvent such as ethanol or water is used. The ratio of the spray particles in the slurry is, for example, 20 to 40% by weight.

  In dry thermal spraying in which the thermal spray particles are sprayed in the form of powder, if the thermal spray particles are too small, the thermal spraying apparatus cannot supply the thermal spray particles favorably to the gas flow, so there is a limit to making the thermal spray particles minute. On the other hand, in wet spraying, since such a problem does not occur, the particle size of the sprayed particles can be made minute. If the thermal spray particles are made minute, the porosity PW of the first thermal spray film 31 formed by cooling the deposited particles in a melted state becomes small.

  The porosity PW of the first sprayed film 31 is, for example, 0.1 to 1.5%, and more preferably 0.1 to 1.2%. In this case, the average particle diameter of the spray particles may be, for example, 1.0 to 8.0 μm, and more preferably 2.0 to 6.0 μm.

  Thus, since the porosity PW of the first sprayed film 31 formed by wet spraying is small, compared with the case of directly forming the sprayed film formed by dry spraying on the base material 20, It becomes possible to improve the adhesion. Further, fine spray particles dissolved in the roughened surface of the base material 20 enter, and this is cooled, and it is possible to improve the adhesion between the base material 20 and the first thermal spray film 31 by the anchor effect. Become. By these, reduction of a possibility that peeling may arise between substrate 20 and the 1st thermal spray film 31 can be aimed at.

  The thickness TW of the first sprayed film 31 is 120 μm or less, preferably 10 to 60 μm. This is because a sprayed film generally formed by wet spraying is liable to cause defects such as cracks when formed when the thickness exceeds 120 μm. In the present embodiment, since the thickness of the first sprayed film 31 is 120 μm or less, it is possible to suppress the possibility of occurrence of defects.

  The second sprayed film 32 is formed on the surface of the first sprayed film 31 by a second spraying process (second process) in which dry spraying is performed by spraying sprayed particles in the form of powder.

  The thickness TD of the second sprayed film 32 is preferably 10 to 1000 μm. The porosity PD of the second sprayed film 32 is 1.5 to 8.0%, more preferably 1.5 to 5.0%. Furthermore, the porosity PW of the first sprayed film 31 and the porosity PD of the second sprayed film 32 preferably satisfy the relationship of PW / PD ≦ 0.5, more preferably PW / PD ≦ 0.3. .

  When PW / PD exceeds 0.5, the case where the porosity PD of the second sprayed film 32 becomes too small and the case where the porosity PW of the first sprayed film 31 becomes too large are included. When PW / PD approaches 1, the structures of the first sprayed film 31 and the second sprayed film 32 become closer, and thus the adhesion between the first sprayed film 31 and the second sprayed film 32 is improved. To do.

  However, when the porosity PD of the second sprayed film 32 becomes too small, the second sprayed film 32 is formed by dry spraying, so that the porosity PD can be made smaller than a certain value in the first place. Have difficulty. On the other hand, when the porosity PW of the first sprayed film 31 becomes too large, the adhesion between the substrate 20 and the first sprayed film 31 cannot be sufficiently ensured.

  The thickness TD of the second sprayed film 32 is 10 μm or more, preferably 10 to 1000 μm. This is because a thermal sprayed film formed by dry spraying has a very low risk of occurrence of defects such as cracks during formation even when the thickness is increased. The surface of the second sprayed film 32 is the outermost surface of the sprayed film 30.

  Furthermore, the thickness TW of the first sprayed film 31 and the thickness TD of the second sprayed film 32 have a relationship of TW / TD ≦ 0.5, more preferably 0.001 ≦ TW / TD ≦ 0.3. It is preferable to satisfy. This is because, as will be understood from Examples and Comparative Examples described later, when this relationship is not satisfied, there is an increased risk of cracks occurring in the sprayed film located on the most front side among the sprayed films formed by wet spraying.

  That is, when TW / TD> 0.3, the internal stress induced by the difference in physical property values between the first sprayed film 31 formed by wet spraying and the second sprayed film 32 formed by dry spraying becomes large. Therefore, there is an increased risk of cracking.

  When TW / TD <0.001, the distance between the base material 20 and the second thermal spray film 32 formed by dry spraying becomes too close, and the first thermal spray film 31 formed by the base material 20 and wet thermal spraying. The internal stress induced by the difference in the physical property values of the base material 20 and the second sprayed film 32 acts on the interface where the sprayed film 30 is in close contact with each other.

  Further, since wet spraying is inferior in thermal spraying efficiency compared to dry spraying, the thickness TW of the first sprayed film 31 formed by wet spraying is the thickness TD of the second sprayed film 32 formed by dry spraying. It is preferable from the viewpoint of cost reduction.

  Further, the total thickness of the thickness TW of the first sprayed film 31 and the thickness TD of the second sprayed film 32, that is, the thickness of the sprayed film 30 is preferably 150 μm or more, more preferably 200 μm or more. . This is because the thicker the sprayed film 30, the more reliably the substrate 20 can be protected from plasma corrosion.

  In the thermal spray member 10 configured as described above, as described above, there is a low possibility that peeling occurs between the base material 20 and the first thermal spray film 30, and the first and second thermal spray films 31, Since the material of the thermal spray particles 32 is the same, the adhesiveness is good, so that it is possible to reduce the possibility of peeling between the substrate 20 and the thermal spray film 30.

  Hereinafter, a thermal spray member 10A and a manufacturing method thereof according to a second embodiment of the present invention will be described with reference to the drawings.

  The thermal spray member 10A according to this embodiment is different from the thermal spray member 10 described above in that the thermal spray film 30A is formed not from the two thermal spray films 31 and 32 but from the three thermal spray films 31 to 33. Only the difference.

  Here, the first and second sprayed films 31 and 32 are formed in the same manner as the first and second sprayed films 31 and 32 described above.

  And the 3rd thermal spray film 33 is formed in the surface of the 2nd thermal spray film 32, and the 3rd thermal spray process (3rd process) which performs wet thermal spraying similarly to the 1st thermal spray film 31 mentioned above. ).

  The third sprayed film 33 has the same porosity PW and thickness TW as the first sprayed film 31. However, the porosity PW and the thickness TW of the first sprayed film 31 and the third sprayed film 33 may be the same or different.

  The thermal spray member 10A according to the present embodiment has the same effects as the thermal spray member 10 described above. Further, since the third sprayed film 33 excellent in denseness by wet spraying is present on the outermost surface of the sprayed film 30, the surface roughness of the exposed surface is reduced when this surface is polished or ground. This makes it possible to suppress the generation of particles.

  Moreover, this invention is not limited to the thermal spray member 10 and 10A which concern on embodiment mentioned above. For example, the thermal spray member 10 is formed by laminating two thermal spray films 31 and 32, and the thermal spray member 10A is constructed by laminating three thermal spray films 31 to 33, but is not limited thereto. It may be provided with a thermal spray film formed by laminating four or more thermal spray films.

Example 1
As the base material 20, a disc-shaped material made of an aluminum alloy (A6061) and having a diameter of 100 mm and a thickness of 20 mm was prepared. The surface of the substrate 20 was roughened by sandblasting.

  Yttria powder having a median diameter D50 of 25 μm was prepared as a thermal spraying material (spraying material) used for dry spraying. Yttria powder having a median diameter D50 of 3 μm was used as a thermal spraying raw material used in wet spraying.

  Then, referring to FIG. 1, a slurry in which the thermal spray material is dispersed with water at a ratio of 30 wt% by a thermal spraying apparatus is sprayed on the surface of the base material 20, and the thickness TW is formed on the surface of the base material 20. A 40 μm first sprayed film 31 was formed by wet spraying.

  Next, the above-mentioned sprayed material was sprayed on the surface of the first sprayed film 31 by a spraying device, and a second sprayed film 32 having a thickness TD of 120 μm was formed on the surface of the first sprayed film 31 by dry spraying.

  Defects such as cracks could not be visually confirmed in the first and second sprayed films 31 and 32.

  The porosity PW of the first sprayed film 31 was 1.2%, and the porosity PD of the second sprayed film 32 was 3.5%. The porosity PW and PD can be calculated as area porosity. Specifically, the area porosity is binarized by taking a cross-sectional image magnified 1000 times using a scanning electron microscope (SEM) for each of the first sprayed film 31 and the second sprayed film 32. It can be obtained by calculating the area ratio of pores in the cross-sectional image obtained by processing. At this time, by using general-purpose software such as Image J as image analysis software, tissue edge detection, area quantification, and area ratio calculation can be easily performed.

  The strength at which the base material 20 and the first sprayed film 31 were peeled off by pulling, that is, the adhesion strength was measured by a test method according to JIS H8666. The adhesion strength was 22 MPa.

(Example 2)
Compared with the first embodiment described above, referring to FIG. 2, the sprayed film 30 </ b> A is not formed by stacking two sprayed films 31 and 32, but is formed by stacking three sprayed films 31 to 33. The only difference is that

  In the second embodiment, a slurry obtained by dispersing the above-mentioned sprayed material with water at a rate of 30 wt% by a spraying device is applied to the second sprayed member 10 of the first embodiment in which the second sprayed film 32 is formed. A third sprayed film 33 having a thickness TW of 40 μm was formed on the surface of the second sprayed film 32 by wet spraying. Thereby, the thermal spray member 10A was completed.

  Defects such as cracks could not be visually confirmed in the first to third sprayed films 31 to 33.

  The porosity PW of the first and third sprayed films 31 and 33 was 1.2%, and the porosity PD of the second sprayed film 32 was 3.5%. The adhesion strength between the substrate 20 and the first sprayed film 31 was 22 MPa.

(Example 3)
The second embodiment is different from the above-described second embodiment only in that the sprayed film is formed by stacking five sprayed films instead of the three sprayed films 31 to 33.

  In Example 3, the thermal spray material is sprayed onto the surface of the third thermal spray film 33 by the thermal spraying apparatus on the thermal spray member 10A of Example 2 formed up to the third thermal spray film 33, and the third thermal spray film 33 is formed. A fourth sprayed film having a thickness TD of 120 μm was formed on the surface by dry spraying.

  Next, a slurry in which the thermal spray material is dispersed at a rate of 30% by weight with water using a thermal spraying apparatus is sprayed onto the surface of the fourth thermal spray film, and the thermal spray material is sprayed onto the surface of the fourth thermal spray film. A fifth sprayed film having a thickness TW of 40 μm was formed on the surface of the fourth sprayed film by wet spraying. Thereby, the thermal spray member was completed.

  In the first to fifth sprayed films, defects such as cracks could not be visually confirmed.

  The porosity PW of the first, third and fifth sprayed films was 1.2%, and the porosity PD of the second and fourth sprayed films A was 3.5%.

Example 4
The third embodiment is different from the above-described third embodiment only in that the sprayed film is formed by stacking six sprayed films instead of five sprayed films.

  In Example 4, the sprayed material is sprayed onto the surface of the fifth sprayed film by the spraying apparatus on the sprayed member which is the finished product of Example 3 formed up to the fifth sprayed film. A sixth sprayed film having a thickness TD of 120 μm was formed on the surface of the film by dry spraying. Thereby, the thermal spray member was completed.

  Defects such as cracks could not be visually confirmed in the first to sixth sprayed films.

  The porosity PW of the first, third, and fifth sprayed films was 1.2%, and the porosity PD of the second, fourth, and sixth sprayed films was 3.5%.

(Example 5)
The difference from Example 2 described above is that the base material 20 is not made of an aluminum alloy (A6061) but is made of an alumina (Al ₂ O ₃ ) sintered body.

  Defects such as cracks could not be visually confirmed in the first to third sprayed films 31 to 33.

  The porosity PW of the first and third sprayed films 31 and 33 was 1.2%, and the porosity PD of the second sprayed film 32 was 3.5%. The adhesion strength between the substrate 20 and the first sprayed film 31 was 23 MPa.

(Example 6)
Compared with the second embodiment described above, the only difference is that the thickness TD of the second sprayed film 32 is 70 μm instead of 120 μm.

  Cracks were visually confirmed in the third sprayed film 33.

(Example 7)
Compared to the third embodiment described above, the only difference is that the thickness TD of the second and fourth sprayed films is 70 μm, not 120 μm.

  Cracks were visually confirmed in the fifth sprayed film.

(Comparative Example 1)
The same substrate 20 as in Example 1 described above and a thermal spray material used for wet and dry thermal spraying were prepared.

  And the said thermal spray material was sprayed on the surface of the base material 20 with the thermal spraying apparatus, and the 1st thermal spray film with thickness TD of 120 micrometers was formed on the surface of the base material 20 by the dry-type thermal spraying.

  Next, a slurry in which the thermal spray material is dispersed at a rate of 30% by weight with water using a thermal spraying apparatus is sprayed on the surface of the first thermal spray film, and a thickness TW is formed on the surface of the first thermal spray film. A 60 μm second sprayed film was formed by wet spraying. Thereby, the thermal spray member was completed.

  In the first and second sprayed films, defects such as cracks could not be visually confirmed.

  The porosity PD of the first sprayed film was 3.5%, and the porosity PW of the second sprayed film was 1.2%.

  The adhesion strength at which the substrate and the first sprayed film peeled was measured. The adhesion strength was 11 MPa, which was reduced to half compared to Example 1.

(Comparative Example 2)
The same substrate as in Example 1 described above and a thermal spray material used for wet and dry thermal spraying were prepared.

  And the said thermal spray material was thermally sprayed on the surface of the base material with the thermal spraying apparatus, and the 1st thermal spray film with thickness TD of 120 micrometers was formed on the surface of the base material by dry spraying.

  Next, a slurry in which the thermal spray material is dispersed at a rate of 30% by weight with water using a thermal spraying apparatus is sprayed on the surface of the first thermal spray film, and a thickness TW is formed on the surface of the first thermal spray film. A 30 μm second sprayed film was formed by wet spraying.

  Next, the above-mentioned sprayed material was sprayed on the surface of the third sprayed film by a spraying device, and a third sprayed film having a thickness TD of 120 μm was formed on the surface of the third sprayed film by dry spraying.

  Next, a slurry in which the thermal spray material is dispersed with water at a rate of 30% by weight by a thermal spraying apparatus is sprayed on the surface of the third thermal spray film, and a thickness TW is formed on the surface of the third thermal spray film. A fourth sprayed film having a thickness of 30 μm was formed by wet spraying. Thereby, the thermal spray member was completed.

  In the first to fourth sprayed films, defects such as cracks could not be visually confirmed.

  The porosity PD of the first and third sprayed films was 3.5%, and the porosity PW of the second and fourth sprayed films was 1.2%.

  The adhesion strength at which the substrate and the first sprayed film peeled was measured. The adhesion strength was 11 MPa, which was reduced to half compared to Example 1.

(Comparative Example 3)
The difference from Comparative Example 2 described above is that the base material is not made of an aluminum alloy (A6061), but is made of an alumina sintered body.

  In the first to third sprayed films, defects such as cracks could not be visually confirmed.

  The porosity PD of the first and third sprayed films was 3.5%, and the porosity PW of the second sprayed film was 1.2%. The adhesion strength between the substrate and the first sprayed film was 12 MPa, which was about half that of Example 5.

  The above results are summarized in Table 1. In the column of adhesion in Table 1, “-” indicates that the adhesion test was not performed.

  DESCRIPTION OF SYMBOLS 10,10A ... Spraying member, 20 ... Base material, 30, 30A ... Spraying film, 31 ... 1st spraying film, 32 ... 2nd spraying film, 33 ... 3rd spraying film.

Claims (5)

A first step of spraying the surface of the substrate in the form of a slurry in which spray particles are dispersed in a solvent to form a first sprayed film having a thickness of 120 μm or less;
And a second step of spraying sprayed particles in the form of powder on the surface of the first sprayed film to form a second sprayed film. .   The method further comprises a third step of spraying the surface of the second sprayed film in the form of a slurry in which sprayed particles are dispersed in a solvent to form a third sprayed film having a thickness of 120 μm or less. The manufacturing method of the base material provided with the sprayed film of Claim 1. When the porosity of the first sprayed film is PW and the porosity of the second sprayed film is PD,
The method for producing a base material provided with a sprayed film according to claim 1, wherein the relationship of PW / PD ≦ 0.5 is satisfied. When the thickness of the first sprayed film is TW and the thickness of the second sprayed film is TD,
The method for producing a base material provided with a sprayed film according to any one of claims 1 to 3, wherein a relationship of TW / TD≤0.5 is satisfied. A substrate;
A first sprayed film formed on the surface of the substrate;
A base material comprising a thermal spray film comprising a second thermal spray film formed on the surface of the first thermal spray film,
When the porosity of the first sprayed film is PW and the porosity of the second sprayed film is PD,
The base material provided with the sprayed film characterized by satisfy | filling the relationship of PW / PD <= 0.5.