JP2019056101A - Double faced adhesive tape, and stacking body of thin film component and supporting component - Google Patents

Double faced adhesive tape, and stacking body of thin film component and supporting component Download PDF

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JP2019056101A
JP2019056101A JP2018082725A JP2018082725A JP2019056101A JP 2019056101 A JP2019056101 A JP 2019056101A JP 2018082725 A JP2018082725 A JP 2018082725A JP 2018082725 A JP2018082725 A JP 2018082725A JP 2019056101 A JP2019056101 A JP 2019056101A
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thin film
sensitive adhesive
adhesive tape
double
pressure
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JP7139141B2 (en
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健司 楫山
Kenji Iyama
健司 楫山
宮田 照久
Teruhisa Miyata
照久 宮田
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Maxell Ltd
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Maxell Holdings Ltd
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Abstract

To provide a double faced adhesive tape that has appropriate bonding force to prevent a thin film component from shifting from or coming off a supporting component between the thin film component and the supporting component when it is processed into the thin film component, which cannot be deformed substantially, and allows the thin film component to be easily separated from the supporting component after it is processed into the thin film component without damage or adhesive residues.SOLUTION: The double faced adhesive tape is provided with a base material having a first surface and a second surface on a supporting component, an adhesive layer which is disposed above the first surface and the second surface and at the uppermost part, and a release layer which is disposed from at least one surface of the base material to the adhesive layer disposed above the surface.SELECTED DRAWING: Figure 2

Description

本発明は、実質的に変形させることができない薄膜部材を支持部材に仮固定するために使用される両面粘着テープ、及び該両面粘着テープによって、実質的に変形させることができない薄膜部材が支持部材に仮固定された分離可能な積層体に関する。典型的には、薄膜部材は実質的に変形させることができない材料(例えば薄膜ガラス等)から形成されるか、若しくは、表面に実質的に変形させることができない部材(例えば、薄膜電極等)が加工処理された実質的に変形させることができる材料(例えば、プラスチックフィルム等)から形成される。ここで、「実質的に変形させることができない」とは、変形させた場合には破損することを意味する。   The present invention relates to a double-sided pressure-sensitive adhesive tape used for temporarily fixing a thin film member that cannot be substantially deformed to a support member, and the thin film member that cannot be substantially deformed by the double-sided pressure-sensitive adhesive tape. It is related with the separable laminated body temporarily fixed to. Typically, the thin film member is formed of a material that cannot be substantially deformed (for example, thin film glass), or a member that cannot be substantially deformed on the surface (for example, a thin film electrode). Formed from a processed material that can be substantially deformed (eg, plastic film, etc.). Here, “cannot be substantially deformed” means that the material is damaged when deformed.

液晶ディスプレイ又はスマートフォン等の部品として、薄いガラス基板が使用されることがある。かかるガラス基板のように、脆性を有し、強度が低い薄膜基板に何らかの加工、例えば電子デバイス用の素子あるいは素子の一部の形成等を行う場合、薄膜基板の破損を防止するために、薄膜基板の加工面とは反対面に補強用の基盤を貼り合わせ、その状態で、各種加工処理・搬送の繰り返し工程を経て、薄膜基板上に電子デバイス用素子あるいは素子の一部が形成される。そして、上記加工処理の終了後に、薄膜基板は補強用基盤から分離される。   A thin glass substrate may be used as a component such as a liquid crystal display or a smartphone. In order to prevent the thin film substrate from being damaged when performing some processing on the thin film substrate having brittleness and low strength, such as the formation of an element for an electronic device or a part of the element, such as a glass substrate, A substrate for reinforcement is bonded to the surface opposite to the processed surface of the substrate, and in this state, an element for electronic device or a part of the element is formed on the thin film substrate through various processing and conveying repeated steps. Then, after the processing is completed, the thin film substrate is separated from the reinforcing base.

特許文献1には、表面に液晶表示素子の基板を支持して工程搬送される治具であって、ガラス製支持体と、その表面に接着されたブチルゴム製粘着剤層とを有する治具が記載されている。ブチルゴム製粘着剤層は、表面に貼り付けられる基板を保持するための粘着力が、繰返しの使用によってもほぼ一定に維持されるものである。   Patent Document 1 discloses a jig for supporting a substrate of a liquid crystal display element on a surface and transporting the process, the jig having a glass support and a butyl rubber adhesive layer bonded to the surface. Have been described. The pressure-sensitive adhesive layer made of butyl rubber is such that the adhesive force for holding the substrate attached to the surface is maintained substantially constant even after repeated use.

しかしながら、基板及びガラス製支持体は変形させると破損するので、一旦貼着した後は、貼着面から捲り上げることができず、基板に対して脱着力を印加することで基板をガラス製支持体から剥離することは困難である。   However, since the substrate and the glass support are damaged when they are deformed, once they are attached, they cannot be lifted from the attachment surface, and the substrate is made of glass by applying a desorption force to the substrate. It is difficult to peel from the body.

それゆえ、特許文献1の治具のように、基板を粘着剤層に直接貼着させた場合、昨今の薄型化・軽量化を目的とした更に薄いガラス基板に対しては、依然として、粘着層から剥離し難く、剥離する際に基板が破損するおそれがある。また、粘着剤が分離後の基板へ残存するおそれがある。   Therefore, when the substrate is directly attached to the pressure-sensitive adhesive layer as in the jig of Patent Document 1, the pressure-sensitive adhesive layer is still used for a thinner glass substrate for the purpose of reducing the thickness and weight. It is difficult to peel off from the substrate, and the substrate may be damaged when peeling off. In addition, the adhesive may remain on the separated substrate.

特許文献2には、ガラス基板と、裏面保護ガラス基板と、を積層させてなる保護ガラス付ガラス基板であって、前記ガラス基板と、前記裏面保護ガラス基板と、が再剥離性を有する無溶剤付加反応型剥離紙用シリコーン樹脂層を介して積層されている保護ガラス付ガラス基板が記載されている。   Patent Document 2 discloses a glass substrate with protective glass formed by laminating a glass substrate and a back surface protective glass substrate, and the glass substrate and the back surface protective glass substrate have a removability. There is described a glass substrate with protective glass laminated via a silicone resin layer for addition reaction type release paper.

特許文献2の保護ガラス付ガラス基板は、ガラス基板と保護ガラス基板を結合する樹脂層として易剥離性および非粘着性のシリコーン樹脂層等を使用している。そのため、ガラス基板と保護ガラス基板とを剥離し易く、ガラス基板と保護ガラス基板とを剥離する際に、ガラス基板が破損する可能性は低い。   The glass substrate with protective glass of Patent Document 2 uses an easily peelable and non-adhesive silicone resin layer or the like as a resin layer for bonding the glass substrate and the protective glass substrate. Therefore, it is easy to peel a glass substrate and a protective glass substrate, and when peeling a glass substrate and a protective glass substrate, possibility that a glass substrate will be damaged is low.

しかしながら、再剥離性を有する樹脂層は非粘着性であるために貼着し難く、ガラス基板に対する密着力に劣るおそれがある。また、実施例にも記載されているように、再剥離性を有する樹脂層を保護ガラスにスクリーン印刷して加熱硬化させる工程、再剥離性を有する樹脂を介してガラス基板と保護ガラス基板とを、室温下真空プレスにて貼り合わせる工程等、煩雑な工程を経る必要があり、生産性において改善の余地があった。   However, since the resin layer having removability is non-adhesive, it is difficult to stick, and there is a possibility that the adhesion to the glass substrate is poor. In addition, as described in the examples, a step of screen-printing a resin layer having removability on a protective glass and heat-curing, a glass substrate and a protective glass substrate through a resin having removability In addition, it is necessary to go through complicated steps such as a step of bonding with a vacuum press at room temperature, and there is room for improvement in productivity.

特開平8−86993号公報Japanese Patent Laid-Open No. 8-86993 国際公開WO2008/007622号公報International Publication WO2008 / 007622

本発明は上記従来の問題を解決するものであり、その目的とするところは、実質的に変形させることができない薄膜部材への加工処理時には薄膜部材と支持部材との間において、薄膜部材が支持部材からずれたり剥がれ落ちたりすることがない適切な密着力を有し、薄膜部材への加工処理後には薄膜部材を支持部材から破損および糊残りすることなく容易に分離することができる両面粘着テープ、及び薄膜部材と支持部材との積層体、及びその積層体の製造方法を提供することにある。   The present invention solves the above-mentioned conventional problems, and the object of the present invention is to support the thin film member between the thin film member and the support member during the processing of the thin film member that cannot be substantially deformed. Double-sided pressure-sensitive adhesive tape that has an appropriate adhesive force that does not deviate from or peel off from the member, and can easily separate the thin film member from the support member without breakage or adhesive residue after processing to the thin film member Another object of the present invention is to provide a laminate of a thin film member and a support member, and a method for manufacturing the laminate.

本発明者らは、上記課題を解決するために鋭意検討した結果、両面粘着テープの構成を、第1の表面及び第2の表面を有する基材と、第1の表面及び第2の表面の上方かつ最上部に位置する粘着層と、該基材の少なくとも1つの表面から該表面上方に位置する該粘着層までの間に設けられた離型層とを、有するものとし、この両面粘着テープにより、実質的に変形させることができない上記薄膜部材と上記支持部材とを貼り合わせた積層体を適用すれば、加工処理後に、最終的に薄膜部材を破損および糊残りすることなく、支持部材から容易に分離できることを見出し、本発明を成すに至った。   As a result of intensive studies to solve the above-mentioned problems, the present inventors have determined that the structure of the double-sided pressure-sensitive adhesive tape includes a base material having a first surface and a second surface, and a first surface and a second surface. This double-sided pressure-sensitive adhesive tape has an adhesive layer located above and on the top, and a release layer provided between at least one surface of the base material and the adhesive layer located above the surface. By applying a laminated body in which the thin film member that cannot be substantially deformed and the support member are applied, the thin film member is finally damaged and remains without adhesive residue after processing. The inventors have found that they can be easily separated, and have achieved the present invention.

尚、本明細書において、「表面の上方」とは表面を有する材料の内部から表面へ向かう方向を意味する。   In the present specification, “above the surface” means a direction from the inside to the surface of the material having the surface.

具体的に説明すると、(1)上記薄膜部材が上記支持部材上に上記両面粘着テープで貼り合わされた構成からなる積層体を準備し、上記薄膜部材への加工処理終了後に、まず、上記薄膜部材と上記支持部材に対して、垂直方向に脱着力を加えて、両面粘着テープの上記離型層と上記離型層に接する上記粘着層との間で薄膜部材側と支持部材側に分離し、次いで、(2)薄膜部材の加工処理面側と反対面側に、離型層を有する可撓性のある片面粘着テープの形で残った、該片面粘着テープをゆっくりと薄膜基板より剥離すれば、最終的に、破損がなく、且つ糊残りがない、加工処理された薄膜部材を得ることができることを見出した。更に、上記粘着層として放射線や熱等の外部エネルギーの後印加により硬化する性質を有する粘着層を適用すれば、上記薄膜部材側と上記支持部材との分離、及び上記片面粘着テープの上記薄膜部材からの剥離がより容易になり、より歩留まり良く、加工処理された薄膜部材を得ることができることを見出し、本発明を成すに至った。   More specifically, (1) a laminate having a structure in which the thin film member is bonded to the support member with the double-sided adhesive tape is prepared, and after the processing to the thin film member is completed, first, the thin film member And applying a desorption force in the vertical direction to the support member and separating the thin film member side and the support member side between the release layer of the double-sided adhesive tape and the adhesive layer in contact with the release layer, Next, (2) If the single-sided adhesive tape remaining in the form of a flexible single-sided adhesive tape having a release layer on the side opposite to the processing surface side of the thin-film member is slowly peeled off from the thin-film substrate Finally, it was found that a processed thin film member having no breakage and no adhesive residue can be obtained. Furthermore, if an adhesive layer having the property of being cured by subsequent application of external energy such as radiation or heat is applied as the adhesive layer, separation of the thin film member side from the support member, and the thin film member of the single-sided adhesive tape It has been found that it is possible to obtain a processed thin film member that is more easily peeled off from the substrate and that has a better yield, and has led to the present invention.

すなわち、本発明は、第1の表面及び第2の表面を有する基材と、第1の表面及び第2の表面の上方かつ最上部に位置する粘着層と、該基材の少なくとも1つの表面から該表面上方に位置する該粘着層までの間に設けられた離型層とを、有する両面粘着テープを提供する。   That is, the present invention relates to a base material having a first surface and a second surface, an adhesive layer located above and on top of the first surface and the second surface, and at least one surface of the base material A double-sided pressure-sensitive adhesive tape having a release layer provided between the surface and the pressure-sensitive adhesive layer located above the surface.

ある一形態においては、前記離型層は、前記基材のいずれか1つの表面から該表面上方に位置する粘着層までの間に設けられたものである。   In one certain form, the said mold release layer is provided between the any one surface of the said base material and the adhesion layer located above this surface.

ある一形態においては、前記離型層は、シリコーン系剥離剤及びフッ素系剥離剤から成る群から選択される剥離剤を含んで成るものである。   In one certain form, the said release layer comprises the release agent selected from the group which consists of a silicone type release agent and a fluorine-type release agent.

ある一形態においては、前記粘着層は、活性官能基を有するアクリル系粘着性高分子、熱架橋剤及び熱重合開始剤を主成分とする熱硬化性粘着剤、及び活性官能基を有するアクリル系粘着性高分子、熱架橋剤及び光重合開始剤を主成分とする光感応性粘着剤から成る群から選択される粘着剤を含んで成るものである。   In one certain form, the said adhesion layer is the acrylic adhesive polymer which has an active functional group, the acrylic adhesive polymer which has an active functional group, the thermosetting adhesive which has a thermal crosslinking agent and a thermal polymerization initiator as a main component, and an active functional group. It comprises an adhesive selected from the group consisting of an adhesive polymer, a thermal crosslinking agent, and a photosensitive adhesive mainly composed of a photopolymerization initiator.

ある一形態においては、前記いずれかの両面粘着テープは、第1の部材を第2の部材に仮固定するために使用され、該2つの部材は実質的に変形させることができない材料から形成されたものである。   In one certain form, one of the said double-sided adhesive tapes is used in order to temporarily fix the 1st member to the 2nd member, and these 2 members are formed from the material which cannot be changed substantially. It is a thing.

ある一形態においては、前記材料の少なくとも一つはガラスである。   In one certain form, at least one of the said materials is glass.

また、本発明は、上記いずれかの両面粘着テープと、該両面粘着テープの粘着層の表面に設けられた剥離ライナーとを有する両面粘着テープ製品を提供する。   Moreover, this invention provides the double-sided adhesive tape product which has one of the said double-sided adhesive tapes, and the peeling liner provided in the surface of the adhesive layer of this double-sided adhesive tape.

また、本発明は、支持部材と、
該支持部材に積層された第1の表面及び第2の表面を有する基材と、第1の表面及び第2の表面の上方かつ最上部に位置する粘着層と、該基材の少なくとも1つの表面から該表面上方に位置する該粘着層までの間に設けられた離型層とを、有する両面粘着テープと、
該両面粘着テープに積層された実質的に変形させることができない薄膜部材とを、
有する積層体を提供する。
The present invention also includes a support member,
A base material having a first surface and a second surface laminated on the support member; an adhesive layer located above and on top of the first surface and the second surface; and at least one of the base materials A double-sided pressure-sensitive adhesive tape having a release layer provided between the surface and the pressure-sensitive adhesive layer located above the surface;
A thin film member that is substantially undeformable laminated on the double-sided adhesive tape,
A laminate having the same is provided.

ある一形態においては、前記両面粘着テープは上記いずれかの両面粘着テープである。   In one certain form, the said double-sided adhesive tape is one of the said double-sided adhesive tapes.

また、本発明は、上記いずれかの両面粘着テープにより、実質的に変形させることができない薄膜部材と支持部材とを貼り合わせる工程を包含する、薄膜部材と支持部材との積層体の製造方法を提供する。   Moreover, this invention is a manufacturing method of the laminated body of a thin film member and a supporting member including the process of bonding together the thin film member and supporting member which cannot be substantially deformed with either of the above double-sided adhesive tapes. provide.

本発明によれば、実質的に変形させることができない薄膜部材への加工処理時には薄膜部材と支持部材との間において、薄膜部材が支持部材からずれたり剥がれ落ちたりすることがない適切な密着力を有し、薄膜部材への加工処理後には薄膜部材を支持部材から破損及び糊残りすることなく容易に分離することができる両面粘着テープ、及び薄膜部材と支持部材との積層体、及びその積層体の製造方法が提供される。   According to the present invention, an appropriate adhesion force between the thin film member and the support member so that the thin film member is not displaced from the support member or peeled off during the processing to the thin film member that cannot be substantially deformed. A double-sided pressure-sensitive adhesive tape capable of easily separating the thin-film member from the support member without being damaged or having adhesive residue after the processing to the thin-film member, a laminate of the thin-film member and the support member, and a laminate thereof A method of manufacturing a body is provided.

本発明の積層体の一実施形態である両面粘着テープの層構造を示す断面図である。It is sectional drawing which shows the layer structure of the double-sided adhesive tape which is one Embodiment of the laminated body of this invention. 本発明の積層体の一実施形態において、両面粘着テープを用いて支持部材に一旦仮固定された薄膜部材が、支持部材から分離される過程を示した断面図である。In one Embodiment of the laminated body of this invention, it is sectional drawing which showed the process in which the thin film member once temporarily fixed to the support member using the double-sided adhesive tape is isolate | separated from a support member. (a)は実施例の積層体に使用される粘着テープ中間体の層構成を示す断面図であり、(b)は実施例の積層体に使用される両面粘着テープの層構成を示す断面図である。(A) is sectional drawing which shows the laminated constitution of the adhesive tape intermediate body used for the laminated body of an Example, (b) is sectional drawing which shows the laminated constitution of the double-sided adhesive tape used for the laminated body of an Example. It is. (a)は比較例の積層体に使用される粘着テープ中間体の層構成を示す断面図であり、(b)は比較例の積層体に使用される両面粘着テープの層構成を示す断面図である。(A) is sectional drawing which shows the laminated constitution of the adhesive tape intermediate body used for the laminated body of a comparative example, (b) is sectional drawing which shows the laminated constitution of the double-sided adhesive tape used for the laminated body of a comparative example It is. 実施例の積層体の一実施形態において、両面粘着テープを使用して薄膜基板ガラス(薄膜部材)と補強用基盤ガラス(支持部材)とを貼着し、垂直剥離試験を行うために補強用基盤ガラスを、接着剤を用いてステンレス板の上に取り付けた状態を示す断面図である。In one embodiment of the laminate of the example, a double-sided adhesive tape is used to attach a thin film substrate glass (thin film member) and a reinforcing base glass (support member), and to perform a vertical peel test, a reinforcing base It is sectional drawing which shows the state which attached the glass on the stainless steel plate using the adhesive agent.

図1は、本発明の積層体の一実施形態である両面粘着テープの層構造を示す断面図である。図1の両面粘着テープは、第1の表面a及び第2の表面bを有する基材3と、該基材の2つの表面の上方に積層され、最も上部に位置する粘着層2、5と、該基材3の第2の表面bと該粘着層5の間に設けられた離型層4とを有する。   FIG. 1 is a cross-sectional view showing a layer structure of a double-sided pressure-sensitive adhesive tape which is an embodiment of the laminate of the present invention. The double-sided pressure-sensitive adhesive tape of FIG. 1 includes a base material 3 having a first surface a and a second surface b, and adhesive layers 2 and 5 that are laminated above the two surfaces of the base material and located at the top. And a release layer 4 provided between the second surface b of the substrate 3 and the adhesive layer 5.

本発明の両面粘着テープの構成部材及び層構造は、図1に示した実施形態に限定されない。本発明の両面粘着テープは、両面粘着テープを湾曲するのに十分な柔軟性を損なわない限り、基材3、粘着層2、5及び剥離層4以外の層を有していてもよい。   The constituent members and the layer structure of the double-sided pressure-sensitive adhesive tape of the present invention are not limited to the embodiment shown in FIG. The double-sided pressure-sensitive adhesive tape of the present invention may have layers other than the substrate 3, the pressure-sensitive adhesive layers 2, 5 and the release layer 4 as long as the flexibility sufficient to curve the double-sided pressure-sensitive adhesive tape is not impaired.

本発明の両面粘着テープの層構造として、例えば、離型層4は、基材3の第2の表面bと粘着層5の間に代えて、基材3の第1の表面aと粘着層2の間に設けられてもよい。また、例えば、基材3の第2の表面bと粘着層5の間に加えて、基材3の第1の表面aと粘着層2の間に追加の離型層が設けられてもよい。ただし、追加の離型層を設ける場合は、最終的に加工処理して利用したい薄膜部材に近い側の離型層をもう一方の離型層よりも重剥離化しておく必要がある。   As the layer structure of the double-sided pressure-sensitive adhesive tape of the present invention, for example, the release layer 4 is replaced between the second surface b of the base material 3 and the pressure-sensitive adhesive layer 5, and the first surface a of the base material 3 and the pressure-sensitive adhesive layer. 2 may be provided. Further, for example, in addition to the second surface b of the substrate 3 and the adhesive layer 5, an additional release layer may be provided between the first surface a of the substrate 3 and the adhesive layer 2. . However, when an additional release layer is provided, it is necessary that the release layer on the side close to the thin film member that is finally processed and used is more heavily peeled than the other release layer.

本発明の両面粘着テープの層構造として、典型的には、離型層4は、基材3の第2の表面bと支持部材と接着する粘着層5の間に設けられる。   As the layer structure of the double-sided pressure-sensitive adhesive tape of the present invention, the release layer 4 is typically provided between the second surface b of the substrate 3 and the pressure-sensitive adhesive layer 5 that adheres to the support member.

上記両面粘着テープの粘着層5に、新たに基材を貼り付け、その新たな基材の反対側面に支持部材8と接着する新たな粘着層を備えた積層体構成であっても良い。また、両面粘着テープは、使用時までは、各粘着層の粘着面を保護するための剥離ライナーを備えていてもよい。このような剥離ライナーとしては、特に限定されるものではなく、公知の剥離ライナーから適宜選択して用いることができる。   A laminate structure may be employed in which a base material is newly attached to the pressure-sensitive adhesive layer 5 of the double-sided pressure-sensitive adhesive tape, and a new pressure-sensitive adhesive layer that adheres to the support member 8 on the opposite side of the new base material. Moreover, the double-sided pressure-sensitive adhesive tape may include a release liner for protecting the pressure-sensitive adhesive surface of each pressure-sensitive adhesive layer until use. Such a release liner is not particularly limited, and can be appropriately selected from known release liners.

基材3は使用環境に耐える強度を有する材料であればよく、紙、高分子材料、布、金属箔などが含まれる。好ましくは、塩化ビニル、ポリイミド、ポリアミド、ポリ(テトラフルオロエチレン)、及び(ポリエチレンテレフタレート、ポリエチレンナフタレートなどの)ポリエステルなどの高分子材料から成るものである。これらの基材の形態はフィルム状であり、厚さは一般に5〜200μm、好ましくは10〜100μmである。   The base material 3 may be a material having a strength that can withstand the use environment, and includes paper, polymer material, cloth, metal foil, and the like. Preferably, it is made of a polymer material such as vinyl chloride, polyimide, polyamide, poly (tetrafluoroethylene), and polyester (such as polyethylene terephthalate and polyethylene naphthalate). The form of these base materials is a film form, and thickness is generally 5-200 micrometers, Preferably it is 10-100 micrometers.

所望ならば、当技術分野では公知である通り、プライマー組成物を支持体に適用するか、或いは支持体をコロナ処理または火炎処理を施すことによって、樹脂組成物を適用する前に、基材の表面を改質して、樹脂組成物と基材の接着性を高めることができる。プライマーの使用は、ポリエチレンテレフタレートまたはポリエチレンナフタレートの基材を用いる場合に特に好適である。   If desired, before applying the resin composition by applying the primer composition to the support or subjecting the support to corona treatment or flame treatment, as is known in the art, The surface can be modified to enhance the adhesion between the resin composition and the substrate. The use of a primer is particularly suitable when a polyethylene terephthalate or polyethylene naphthalate substrate is used.

離型層4は、その表面に接着する粘着層5の接着力を弱める層である。離型層4は剥離ライナーに通常使用される剥離剤から形成されて良い。剥離剤としては、例えば、シリコーン系剥離剤、フッ素系剥離剤、長鎖アルキル系剥離剤、アルキド系剥離剤、メラミン系剥離剤、アクリル系剥離剤等が挙げられる。中でも、使用される粘着剤との離型性の観点から、シリコーン系剥離剤及びフッ素系剥離剤から成る群から選択される剥離剤を含んで成るものであることが好ましい。   The release layer 4 is a layer that weakens the adhesive force of the pressure-sensitive adhesive layer 5 that adheres to the surface thereof. The release layer 4 may be formed from a release agent commonly used for release liners. Examples of the release agent include silicone release agents, fluorine release agents, long-chain alkyl release agents, alkyd release agents, melamine release agents, acrylic release agents, and the like. Among these, from the viewpoint of releasability with the pressure-sensitive adhesive used, it is preferable to include a release agent selected from the group consisting of silicone release agents and fluorine release agents.

離型層4は、基材3の表面から剥離しないように形成される。即ち、剥離剤を必要に応じて、シクロヘキサン、ヘキサン、ヘプタン、イソオクタンなどの炭化水素系溶剤又はトルエン、キシレンなどの芳香族系溶剤等の有機溶剤、または水で希釈した後、必要に応じて硬化触媒を添加・混合することで、離型層塗工液を得る。次いで、得られた離型層塗工液を、基材3の表面に塗布して乾燥させ、硬化させることにより離型層を形成する。離型層塗工層の乾燥・硬化方法は、熱、紫外線照射、電子線照射などを使用できる。離型層の厚さは約0.1〜0.6μm、好ましくは約0.2〜0.4μmである。   The release layer 4 is formed so as not to peel from the surface of the substrate 3. That is, if necessary, the release agent is diluted with a hydrocarbon solvent such as cyclohexane, hexane, heptane, or isooctane, or an organic solvent such as an aromatic solvent such as toluene or xylene, or water, and then cured as necessary. A release layer coating solution is obtained by adding and mixing the catalyst. Next, the release layer coating liquid obtained is applied to the surface of the substrate 3, dried and cured to form a release layer. As the drying / curing method of the release layer coating layer, heat, ultraviolet irradiation, electron beam irradiation and the like can be used. The thickness of the release layer is about 0.1 to 0.6 μm, preferably about 0.2 to 0.4 μm.

一般に、薄膜部材を支持部材に仮固定するために使用される粘着剤には、脱着(薄膜部材側と支持部材側との分離、片面粘着テープの薄膜部材からの剥離を意味する)時の接着力を低減する目的で、外部エネルギーを印加した際に硬化する性質を有する種類のものが存在する。かかる仮固定用粘着剤は、被着時は未硬化状態にあって柔軟性及び適度な接着力を有するが、脱着時は硬化状態にすることで、硬化収縮し、弾性率が増大するので接着力が大幅に低減される。   In general, the adhesive used to temporarily fix the thin film member to the support member is bonded to the adhesive during desorption (separation between the thin film member side and the support member side, and separation of the single-sided adhesive tape from the thin film member). For the purpose of reducing the force, there is a type having the property of being cured when external energy is applied. Such an adhesive for temporary fixing is in an uncured state at the time of application and has flexibility and appropriate adhesive force, but is cured at the time of desorption and is cured and contracted to increase the elastic modulus. The power is greatly reduced.

薄膜部材を支持部材に固定する状態の粘着層とは、薄膜部材に加工処理を施すため、未だ容易に薄膜部材側を支持部材側から分離させる目的で硬化させていない状態の粘着層を意味する。薄膜部材を支持部材から分離する状態の粘着層、あるいは片面粘着テープを薄膜部材から剥離する状態の粘着層とは、薄膜部材への加工処理後に、容易に薄膜部材側を支持部材側から分離、あるいは片面粘着テープを薄膜部材から剥離させる目的で硬化させた状態の粘着層を意味する。   The adhesive layer in a state in which the thin film member is fixed to the support member means an adhesive layer that has not yet been cured for the purpose of easily separating the thin film member side from the support member side because the thin film member is processed. . The adhesive layer in a state in which the thin film member is separated from the support member or the adhesive layer in a state in which the single-sided adhesive tape is peeled from the thin film member is easily separated from the support member side after the processing to the thin film member, Or the adhesive layer of the state hardened in order to peel a single-sided adhesive tape from a thin film member is meant.

粘着層2は、薄膜部材から剥離した後に、薄膜部材等の被着面に残存しない粘着剤から形成する。粘着層2を形成する粘着剤は、好ましくは、粘着層5と同等の性能を有する種類のものである。粘着層2及び粘着層5を形成する粘着剤は同一種類であっても異なる種類であってもよい。   The adhesive layer 2 is formed from an adhesive that does not remain on the adherend surface of the thin film member or the like after peeling from the thin film member. The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 2 is preferably of a type having performance equivalent to that of the pressure-sensitive adhesive layer 5. The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 2 and the pressure-sensitive adhesive layer 5 may be the same type or different types.

仮固定用粘着剤としては、例えば、再剥離性のある微粘着タイプのシリコーン系粘着剤及びアクリル系粘着剤等が挙げられる。その中でも、特に、脱着時に外部エネルギーの印加により硬化状態にすることで接着力が大幅に低減される硬化型粘着剤が好ましい。   Examples of the temporarily fixing pressure-sensitive adhesive include re-peelable fine-adhesive silicone pressure-sensitive adhesives and acrylic pressure-sensitive adhesives. Among these, in particular, a curable pressure-sensitive adhesive is preferred in which the adhesive strength is greatly reduced by applying external energy at the time of desorption.

硬化型粘着剤の中でも放射線硬化型粘着剤としては、例えば、活性官能基(炭素−炭素二重結合基)を有するアクリル系粘着性高分子、熱架橋剤及び光重合開始剤を主成分とする光感応性粘着剤が好ましい。かかる粘着剤の構成は、その開示をここに参照として含める、特開2002−212521号公報に記載されている。   Among the curable adhesives, as the radiation curable adhesive, for example, an acrylic adhesive polymer having an active functional group (carbon-carbon double bond group), a thermal crosslinking agent, and a photopolymerization initiator are the main components. A photosensitive adhesive is preferred. The configuration of such an adhesive is described in JP-A No. 2002-212521, the disclosure of which is incorporated herein by reference.

上記活性官能基をアクリル系粘着性高分子に導入する方法としては、特に限定されるものではないが、通常、(メタ)アクリル酸エステル、ヒドロキシル基含有不飽和化合物、カルボキシル基含有不飽和化合物等からなる共重合体を重合した後、該共重合体が有する官能基に対して付加反応することが可能な官能基及び炭素−炭素二重結合を有する化合物を付加反応させる方法が挙げられる。例えば、アクリル系粘着性高分子の側鎖にあるヒドロキシル基を(メタ)アクリロイルオキシ基を有するイソシアネート化合物(例えば、2―メタクリロイルオキシエチルイソシアネートなど)と反応させる方法等がある。このようにして、(メタ)アクリロイルオキシ基などの活性官能基を有するアクリル系粘着性高分子を得ることができる。   The method for introducing the active functional group into the acrylic adhesive polymer is not particularly limited, but usually (meth) acrylic acid ester, hydroxyl group-containing unsaturated compound, carboxyl group-containing unsaturated compound, etc. Examples thereof include a method of polymerizing a copolymer comprising, and then subjecting the functional group of the copolymer to an addition reaction with a compound having a functional group capable of undergoing an addition reaction and a carbon-carbon double bond. For example, there is a method in which a hydroxyl group in the side chain of an acrylic adhesive polymer is reacted with an isocyanate compound having a (meth) acryloyloxy group (for example, 2-methacryloyloxyethyl isocyanate). In this manner, an acrylic adhesive polymer having an active functional group such as a (meth) acryloyloxy group can be obtained.

上記活性官能基を有するアクリル系粘着性高分子の重量平均分子量が10万より小さい場合には、塗工性などを考慮して、数千〜数万cPの高粘度の粘着剤組成を得ることが難しく好ましくない。また、重量平均分子量が200万より大きい場合には、粘着テープの特性上、特に問題はないが、アクリル系粘着性高分子を量産的に製造することが難しく、好ましくない。   When the acrylic adhesive polymer having an active functional group has a weight average molecular weight smaller than 100,000, a high viscosity adhesive composition of several thousand to several tens of thousands cP is obtained in consideration of coating properties and the like. Is difficult and undesirable. On the other hand, when the weight average molecular weight is larger than 2 million, there is no particular problem in terms of the characteristics of the adhesive tape, but it is difficult to mass-produce the acrylic adhesive polymer, which is not preferable.

また、上記活性官能基を有するアクリル系高分子の活性官能基含有量が0.01ミリ当量/gより小さい場合には、光ラジカル架橋反応が十分に起こらず、その結果、易剥離性を付与することが難しくなり、また、活性官能基含有量が2.0ミリ当量/gより大きい場合には、粘着テープの特性上、特に問題はないが、アクリル系粘着性高分子を量産的に製造することが難しく、好ましくない。   In addition, when the active functional group content of the acrylic polymer having the active functional group is smaller than 0.01 meq / g, the photoradical crosslinking reaction does not occur sufficiently, and as a result, easy peelability is imparted. When the active functional group content is larger than 2.0 meq / g, there is no particular problem in terms of the characteristics of the adhesive tape, but an acrylic adhesive polymer is mass-produced. Difficult to do and not preferred.

また、上記活性官能基を有するアクリル系粘着性高分子の水酸基価が10mgKOH/gより小さい場合には、熱架橋剤との反応が十分でない為に、初期粘着性が十分でなく、被着体に粘着剤残りが発生するおそれがある。また、水酸基価が100mgKOH/gより大きい場合には、熱架橋剤との反応に関与しない余剰の水酸基が被着体表面と相互作用するため、外部エネルギーを印加しても粘着力が十分に低下しないおそれがある。   Further, when the hydroxyl value of the acrylic adhesive polymer having an active functional group is smaller than 10 mgKOH / g, the initial adhesiveness is not sufficient because the reaction with the thermal crosslinking agent is not sufficient, and the adherend There is a risk that adhesive residue will be generated. In addition, when the hydroxyl value is greater than 100 mgKOH / g, excess hydroxyl group that does not participate in the reaction with the thermal crosslinking agent interacts with the adherend surface, so that the adhesive force is sufficiently reduced even when external energy is applied. There is a risk of not.

上記活性官能基を有するアクリル系粘着性高分子の主成分は、通常、(メタ)アクリル酸アルキルエステル単量体と極性基含有単量体との共重合体から成る。(メタ)アクリル酸アルキルエステル単量体としては、炭素数6 〜 1 2 のヘキシルアクリレート、n − オクチルアクリレート、イソオクチルアクリレート、2 − エチルヘキシルアクリレート、ドデシルアクリレート、デシルアクリレート、または炭素数5 以下の単量体である、ペンチルアクリレート、n − ブチルアクリレート、イソブチルアクリレート、エチルアクリレート、メチルアクリレート、またはこれらと同様のメタクリレート等が挙げられる。また、極性基含有単量体としては、2 − ヒドロキシエチルアクリレート、2 − ヒドロキシエチルメタクリレート、2 − ヒドロキシプロピルアクリレート、2− ヒドロキシプロピルメタクリレート、アクリル酸、メタクリル酸等が挙げられる。これらを共重合した共重合体としては、具体的には、アクリル酸2―エチルヘキシルとアクリル酸との共重合体、アクリル酸2―エチルヘキシルとアクリル酸2―ヒドロキシエチルとの共重合体、アクリル酸2―エチルヘキシルとアクリル酸とアクリル酸2―ヒドロキシエチルとの三元共重合体等が挙げられるが、特にこれらに限定されるものではない。   The main component of the acrylic adhesive polymer having an active functional group is usually composed of a copolymer of a (meth) acrylic acid alkyl ester monomer and a polar group-containing monomer. Examples of the (meth) acrylic acid alkyl ester monomer include hexyl acrylate, n-octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, dodecyl acrylate, decyl acrylate, or a single carbon atom having 5 or less carbon atoms. Examples thereof include pentyl acrylate, n-butyl acrylate, isobutyl acrylate, ethyl acrylate, methyl acrylate, and methacrylates similar to these. Examples of polar group-containing monomers include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, acrylic acid, and methacrylic acid. Specific examples of the copolymer obtained by copolymerizing these include a copolymer of 2-ethylhexyl acrylate and acrylic acid, a copolymer of 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate, and acrylic acid. Examples include terpolymers of 2-ethylhexyl, acrylic acid, and 2-hydroxyethyl acrylate, but are not particularly limited thereto.

放射線硬化型粘着剤に使用される活性官能基を有するアクリル系粘着性高分子は、ラジカル反応により架橋する官能基をポリマー側鎖等に有するものである。放射線硬化型粘着剤は、被着体から剥離する際に、紫外線等に暴露されて架橋反応を起こすことにより、粘着剤の凝集力が上昇し、被着体より剥離する時に、被着体に粘着剤残りが生じ難い。   The acrylic pressure-sensitive adhesive polymer having an active functional group used for the radiation-curable pressure-sensitive adhesive has a functional group that crosslinks by a radical reaction in a polymer side chain or the like. When the radiation curable pressure-sensitive adhesive is peeled off from the adherend, it is exposed to ultraviolet rays or the like to cause a crosslinking reaction, thereby increasing the cohesive force of the pressure-sensitive adhesive. It is difficult to produce adhesive residue.

また、上記活性官能基を有するアクリル系粘着性高分子の代わりとして、通常の上記活性官能基を有さないアクリル系粘着性高分子に、上記活性官能基を有するオリゴマー等を添加した組成物を使用しても構わない。また、上記活性官能基を有するアクリル系粘着性高分子に、更に上記活性官能基を有するオリゴマー等を添加した組成物を使用しても構わない。   Further, instead of the acrylic adhesive polymer having the active functional group, a composition in which an oligomer having the active functional group is added to the usual acrylic adhesive polymer having no active functional group. You can use it. Moreover, you may use the composition which added the oligomer etc. which have the said active functional group further to the acrylic adhesive polymer which has the said active functional group.

放射線硬化型粘着剤に使用される光重合開始剤としては、紫外線等によりラジカル活性種を発生させる化合物が好ましい。具体的には、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインプロピルエーテル、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル等のベンゾインアルキルエーテル系開始剤;ベンゾフェノン、ベンゾイル安息香酸、3,3’−ジメチル−4−メトキシベンゾフェノン、ポリビニルベンゾフェノン等のベンゾフェノン系開始剤;α−ヒドロキシシクロヘキシルフェニルケトン、4−(2−ヒドロキシエトキシ)フェニル(2−ヒドロキシ−2−プロピル)ケトン、α−ヒドロキシ−α,α’−ジメチルアセトフェノン、メトキシアセトフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、2,2−ジエトキシアセトフェノン、2−メチル−1−[4−(メチルチオ)−フェニル]−2−モルホリノプロパン−1等の芳香族ケトン系開始剤;ベンジルジメチルケタール等の芳香族ケタール系開始剤;チオキサントン、2−クロロチオキサントン、2−メチルチオキサントン、2−エチルチオキサントン、2−イソプロピルチオキサントン、2−ドデシルチオキサントン、2,4−ジクロロチオキサントン、2,4−ジメチルチオキサントン、2,4−ジエチルチオキサントン、2,4−ジイソプロピルチオキサントン等のチオキサントン系開始剤;ベンジル等のベンジル系開始剤;ベンゾイン等のベンゾイン系開始剤;2−メチル−2−ヒドロキシプロピオフェノン等のα−ケトール系化合物;2−ナフタレンスルホニルクロリドなどの芳香族スルホニルクロリド系化合物;1−フェノン−1,1−プロパンジオン−2−(o−エトキシカルボニル)オキシム等の光活性オキシム系化合物;カンファーキノン系化合物;ハロゲン化ケトン系化合物:アシルホスフィノキシド系化合物;アシルホスフォナート系化合物が挙げられる。これらは単独で用いても良いし、または2種以上併用してもよい。   As the photopolymerization initiator used in the radiation curable pressure-sensitive adhesive, a compound that generates radical active species by ultraviolet rays or the like is preferable. Specifically, benzoin alkyl ether initiators such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether; benzophenone, benzoylbenzoic acid, 3,3′-dimethyl-4-methoxybenzophenone Benzophenone initiators such as polyvinyl benzophenone; α-hydroxycyclohexyl phenyl ketone, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, methoxy Acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2-morpholine Aromatic ketone initiators such as propane-1; aromatic ketal initiators such as benzyldimethyl ketal; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2-dodecylthioxanthone Thioxanthone initiators such as 2,4-dichlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone; benzyl initiators such as benzyl; benzoin initiators such as benzoin Α-ketol compounds such as 2-methyl-2-hydroxypropiophenone; aromatic sulfonyl chloride compounds such as 2-naphthalenesulfonyl chloride; 1-phenone-1,1-propanedione-2- (o-ethoxyca) Boniru) photoactive oxime-based compounds such as oxime; camphor quinone compounds; halogenated ketone compound: acyl phosphino sulfoxide compounds; acyl phosphonium isocyanate-based compounds. These may be used alone or in combination of two or more.

これらの光重合開始剤の添加量は活性官能基を有するアクリル系粘着性高分子100質量部に対して、0.1〜10質量部であることが好ましい。   It is preferable that the addition amount of these photoinitiators is 0.1-10 mass parts with respect to 100 mass parts of acrylic adhesive polymers which have an active functional group.

光重合開始剤の添加量が0.1質量部より少ない場合には、紫外線等に対する光反応性が充分ではない為に粘着剤の硬化が不十分となり剥離性が十分ではなく、また、その添加量が10質量部より多い場合には、その効果は飽和し、経済性の観点からも好ましくない。   When the addition amount of the photopolymerization initiator is less than 0.1 parts by mass, the photoreactivity with respect to ultraviolet rays or the like is not sufficient, so the curing of the pressure-sensitive adhesive is insufficient, and the releasability is not sufficient. When the amount is more than 10 parts by mass, the effect is saturated, which is not preferable from the viewpoint of economy.

また、このような光重合開始剤の増感剤として、ジメチルアミノエチルメタクリレート、4―ジメチルアミノ安息香酸イソアミル等の化合物を粘着剤に添加してもよい。   Further, as a sensitizer for such a photopolymerization initiator, a compound such as dimethylaminoethyl methacrylate, 4-dimethylaminobenzoic acid isoamyl may be added to the adhesive.

放射線硬化型粘着剤に使用される熱架橋剤としては、一般にアクリル系粘着剤の架橋剤として使用されるイソシアネート化合物系架橋剤、エポキシ化合物系架橋剤、アルミキレート化合物系架橋剤等が使用される。   As the thermal crosslinking agent used in the radiation curable pressure-sensitive adhesive, an isocyanate compound-based crosslinking agent, an epoxy compound-based crosslinking agent, an aluminum chelate compound-based crosslinking agent or the like generally used as a crosslinking agent for acrylic pressure-sensitive adhesives is used. .

例えば、綜研化学社より販売されているポリイソシアネート架橋剤(商品名:L−45など)、エポキシ化合物系架橋剤(商品名:E−AXなど)、アルミキレート化合物系架橋剤(商品名:M−5Aなど)等が使用できるが、ここに挙げたものに限定されるものではない。   For example, polyisocyanate crosslinking agents (trade name: L-45, etc.), epoxy compound-based crosslinking agents (trade name: E-AX, etc.) and aluminum chelate compound-based crosslinking agents (trade name: M) sold by Soken Chemical Co., Ltd. -5A etc.) can be used, but is not limited to those listed here.

これらの熱架橋剤は、上記活性官能基を有するアクリル系粘着性高分子100質量部に対して、0.01〜10質量部の割合で添加されるのが好ましい。熱架橋剤の添加量が0.01質量部より少ない場合には、粘着剤の凝集力が十分ではなく、被着体に糊残りするおそれがあり、またその添加量が10質量部より多い場合には、反応に関与しない余剰の熱架橋剤がブリードアウトし、被着体を汚染するおそれがある。   These thermal crosslinking agents are preferably added at a ratio of 0.01 to 10 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer having the active functional group. When the addition amount of the thermal cross-linking agent is less than 0.01 parts by mass, the cohesive force of the pressure-sensitive adhesive is not sufficient, and there is a possibility that the adhesive remains on the adherend, and the addition amount is more than 10 parts by mass. In some cases, excess thermal crosslinking agent not involved in the reaction may bleed out and contaminate the adherend.

放射線効果型粘着剤には、通常、アクリル樹脂などに使用されるロジン系樹脂、テルペン系樹脂、石油樹脂等の粘着性付与剤を添加しても良い。   A tackifier such as a rosin resin, a terpene resin, or a petroleum resin usually used for an acrylic resin or the like may be added to the radiation effect adhesive.

放射線効果型粘着剤の成分において、光重合開始剤の代わりに熱重合開始剤を使用してもよい。そのことにより、粘着剤に熱硬化性が付与され、熱硬化型粘着剤が提供される。使用される熱重合開始剤としては、加熱によりラジカル活性種を発生させる化合物が好ましい。具体的には、ジクミルパーオキサイド、ジ−t−ブチルパーオキサイド、t−ブチルパーオキシベンゾエート、t−ブチルハイドロパーオキサイド、ベンゾイルパーオキサイド、クメンハイドロパーオキサイド、ジイソプロピルベンゼンハイドロパーオキサイド、パラメンタンハイドロパーオキサイド、ジ−t−ブチルパーオキサイド、2,2’−アゾビス(イソブチロニトリル)、1,1−アゾビス(シクロヘキサン−1−カルボニトリル)、アゾクメン、2,2’−アゾビス(2−メチルブチロニトリル)、2,2’−アゾビスジメチルバレロニトリル、4,4’−アゾビス(4−シアノ吉草酸)、2−(tert−ブチルアゾ)−2−シアノプロパン、2,2’−アゾビス(2,4,4−トリメチルペンタン)、2,2’−アゾビス(2−メチルプロパン)、ジメチル2,2’−アゾビス(2−メチルプロピオネート)等の化合物が挙げられる。   In the component of the radiation effect type pressure-sensitive adhesive, a thermal polymerization initiator may be used instead of the photopolymerization initiator. Thereby, thermosetting property is imparted to the pressure-sensitive adhesive, and a thermosetting pressure-sensitive adhesive is provided. The thermal polymerization initiator used is preferably a compound that generates radical active species by heating. Specifically, dicumyl peroxide, di-t-butyl peroxide, t-butyl peroxybenzoate, t-butyl hydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, paramentane hydro Peroxide, di-t-butyl peroxide, 2,2′-azobis (isobutyronitrile), 1,1-azobis (cyclohexane-1-carbonitrile), azocumene, 2,2′-azobis (2-methyl) Butyronitrile), 2,2′-azobisdimethylvaleronitrile, 4,4′-azobis (4-cyanovaleric acid), 2- (tert-butylazo) -2-cyanopropane, 2,2′-azobis ( 2,4,4-trimethylpentane), 2,2′-azobis ( - methyl propane), compounds such as dimethyl 2,2'-azobis (2-methylpropionate) and the like.

本発明で使用されるこれらの熱重合開始剤の添加量は活性官能基を有するアクリル系粘着性高分子100質量部に対して、0.1〜10質量部であることが好ましい。   It is preferable that the addition amount of these thermal polymerization initiators used by this invention is 0.1-10 mass parts with respect to 100 mass parts of acrylic adhesive polymers which have an active functional group.

熱重合開始剤の添加量が0.1質量部より少ない場合には、加熱に対する反応性が充分ではない為に粘着剤の硬化が不十分となり剥離性が十分ではなく、また、その添加量が10質量部より多い場合には、その効果は飽和し、経済性の観点からも好ましくない。   When the addition amount of the thermal polymerization initiator is less than 0.1 parts by mass, the adhesiveness is not sufficiently cured because the reactivity to heating is insufficient, and the peelability is not sufficient. When the amount is more than 10 parts by mass, the effect is saturated, which is not preferable from the viewpoint of economy.

粘着層2、5は、例えば、塗布法により形成される。即ち、粘着剤をトルエン、酢酸エチルなどの有機溶剤で希釈して粘着層塗工液を得る。次いで、得られた粘着層塗工液を、基材の表面に塗布して乾燥させ、硬化させることにより粘着層を形成する。粘着層の厚さは約5〜100μm、好ましくは約10〜30μmである。   The adhesive layers 2 and 5 are formed by, for example, a coating method. That is, the adhesive is diluted with an organic solvent such as toluene or ethyl acetate to obtain an adhesive layer coating solution. Next, the pressure-sensitive adhesive layer coating liquid is applied to the surface of the substrate, dried and cured to form the pressure-sensitive adhesive layer. The thickness of the adhesive layer is about 5 to 100 μm, preferably about 10 to 30 μm.

図2(a)、(b)及び(c)は、本発明の積層体の一実施形態において、両面粘着テープを用いて支持部材8に一旦仮固定された薄膜部材7が、支持部材8から分離される過程を示した断面図である。図2(a)は薄膜部材7が支持部材8に固定、積層された状態を示す。薄膜部材7の下面に両面粘着テープの粘着層2が基材3と離型層4とを有する片面粘着テープの形で貼着されており、支持部材8の上面に粘着層5が貼着されている。   2 (a), 2 (b), and 2 (c) show that the thin film member 7 temporarily fixed to the support member 8 using a double-sided adhesive tape is removed from the support member 8 in one embodiment of the laminate of the present invention. It is sectional drawing which showed the process separated. FIG. 2A shows a state in which the thin film member 7 is fixed and stacked on the support member 8. The adhesive layer 2 of the double-sided adhesive tape is attached to the lower surface of the thin film member 7 in the form of a single-sided adhesive tape having a base material 3 and a release layer 4, and the adhesive layer 5 is attached to the upper surface of the support member 8. ing.

薄膜部材7は加工される対象物であり、典型的には、脆性を有し、強度が低い材料から成る部材であるが、前述したような、可撓性を有し、強度が高い材料(例えば、プラスチックフィルム等の樹脂)であっても良い。加工の際に、薄膜部材7には、例えば、エッチング、スパッタリング、パターニング等の処理や、加工装置間搬送等の処理が行われる。   The thin film member 7 is an object to be processed. Typically, the thin film member 7 is a member made of a material having brittleness and low strength. However, as described above, a material having flexibility and high strength ( For example, a resin such as a plastic film) may be used. During processing, the thin film member 7 is subjected to processing such as etching, sputtering, and patterning, and processing such as conveyance between processing devices.

薄膜部材7の材料の具体例には、ガラス、金属、樹脂等が挙げられるが、典型的にはガラスが挙げられる。薄膜部材7の厚さは、一般に0.1mm以上、2.0mm以下、好ましくは0.2mm以上、1.0mm以下、より好ましくは0.2mm以上、0.5mm以下である。薄膜部材7の厚さが0.1mm未満では支持部材8から分離される際に破損する可能性が高くなり、厚さが2.0mmを超えるような薄膜部材は単独でも破損させることなく加工することができる。   Specific examples of the material of the thin film member 7 include glass, metal, resin, and the like, and typically includes glass. The thickness of the thin film member 7 is generally 0.1 mm or more and 2.0 mm or less, preferably 0.2 mm or more and 1.0 mm or less, more preferably 0.2 mm or more and 0.5 mm or less. If the thickness of the thin film member 7 is less than 0.1 mm, the possibility of breakage when separated from the support member 8 increases, and a thin film member having a thickness exceeding 2.0 mm is processed without being damaged alone. be able to.

支持部材8は、薄膜部材7の加工に必要な所定の処理が行われる間、薄膜部材7の破損を防止するために補強する部材である。支持部材8は、脆性を有し、強度が低い薄膜部材7を破損させないために剛性、耐熱性、耐薬品性に優れた材料からなることが好ましい。支持部材8の材料の具体例には、ガラス、金属等がある。支持部材8の厚さは、薄膜部材7の厚さより厚いことが好ましいが、一般に、0.1mm以上、5.0mm以下、好ましくは0.4mm以上、2.0mm以下である。   The support member 8 is a member that is reinforced to prevent the thin film member 7 from being damaged while a predetermined process necessary for processing the thin film member 7 is performed. The support member 8 is preferably made of a material excellent in rigidity, heat resistance, and chemical resistance so as not to damage the thin film member 7 having brittleness and low strength. Specific examples of the material of the support member 8 include glass and metal. The thickness of the support member 8 is preferably larger than the thickness of the thin film member 7, but is generally 0.1 mm or more and 5.0 mm or less, preferably 0.4 mm or more and 2.0 mm or less.

図2(b)は薄膜部材7が支持部材8から剥離された状態を示す。薄膜部材7の加工に必要な所定の処理が終了した後に、要すれば、薄膜部材7と支持部材8の積層体に対して易剥離処理を行う。易剥離処理の具体例は、加熱又は放射線照射を行うことで粘着層の接着力を低減する処理である。その後、薄膜部材7に剥離力、例えば薄膜部材7の表面に対して垂直な方向の脱着力を印加する。そうすると、両面粘着テープは離型層4と粘着層5との間で容易に剥離する。これにより、薄膜部材7は支持部材8から分離される。   FIG. 2B shows a state in which the thin film member 7 has been peeled off from the support member 8. After a predetermined process necessary for processing the thin film member 7 is completed, an easy peeling process is performed on the laminate of the thin film member 7 and the support member 8 if necessary. A specific example of the easy peeling treatment is a treatment for reducing the adhesive force of the pressure-sensitive adhesive layer by performing heating or radiation irradiation. Thereafter, a peeling force, for example, a desorption force in a direction perpendicular to the surface of the thin film member 7 is applied to the thin film member 7. Then, the double-sided pressure-sensitive adhesive tape is easily peeled between the release layer 4 and the pressure-sensitive adhesive layer 5. Thereby, the thin film member 7 is separated from the support member 8.

図2(c)は両面粘着テープが薄膜部材7及び支持部材8から分離された状態を示す。薄膜部材7の下面には、粘着層2、基材3、離型層4の構成から成る片面粘着テープが残っているが、該片面粘着テープは柔軟性があり、湾曲させて被着面からめくりあげることができる。それゆえ、粘着層2は基材3、離型層4と共に薄膜部材7の下面から容易に剥離され、粘着剤2は薄膜部材7に残存しない。また、粘着層5は支持部材8の上面に残るが、支持部材8を廃棄せずに再利用する場合は、指で剥がしたり、溶剤を用いて拭き取ることにより支持部材8から除去することができる。   FIG. 2C shows a state where the double-sided adhesive tape is separated from the thin film member 7 and the support member 8. On the lower surface of the thin film member 7, the single-sided adhesive tape having the structure of the adhesive layer 2, the base material 3, and the release layer 4 remains, but the single-sided adhesive tape is flexible and curved from the adherend surface. Can be turned up. Therefore, the adhesive layer 2 is easily peeled off from the lower surface of the thin film member 7 together with the base material 3 and the release layer 4, and the adhesive 2 does not remain on the thin film member 7. In addition, the adhesive layer 5 remains on the upper surface of the support member 8, but when the support member 8 is reused without being discarded, it can be removed from the support member 8 by peeling off with a finger or wiping with a solvent. .

粘着層2、5は、薄膜部材7への加工処理が行われる間、薄膜部材7が支持部材8から、ずれたり剥がれ落ちたりすることがないように、薄膜部材7を支持部材8に固定しておくのに適切な接着力を有する粘着剤から形成する。粘着剤としては、従来から加工部品を仮固定する用途に使用されてきた種類のものが好ましく、再剥離性のある種類のものがより好ましく、外部エネルギーの後印加により硬化する性質を有する種類のものがさらに好ましい。薄膜部材7は加工処理が終了した後に支持部材8から分離される必要があり、この状態においては、粘着剤の接着力は、できるだけ弱いこと、あるいは外部エネルギーの後印加により大幅に弱くなることが好ましい。   The adhesive layers 2 and 5 fix the thin film member 7 to the support member 8 so that the thin film member 7 is not displaced or peeled off from the support member 8 while the thin film member 7 is processed. It is formed from a pressure-sensitive adhesive having an appropriate adhesive strength. As the pressure-sensitive adhesive, a type that has been conventionally used for temporarily fixing a processed part is preferable, a type having removability is more preferable, and a type having a property of being cured by external application after external energy. More preferred. The thin film member 7 needs to be separated from the support member 8 after the processing is completed. In this state, the adhesive force of the pressure-sensitive adhesive may be as weak as possible, or may be significantly weakened by the subsequent application of external energy. preferable.

例えば、図2(a)に示したように、本発明の構成の積層体は、薄膜部材7と支持部材8と固定した直後においては、両面粘着テープの粘着層5は支持部材8と離型層4に接しており、粘着層2は薄膜部材7と基材3に接している。この状態において、粘着層5と支持部材8の界面の接着力、及び、粘着層2と薄膜部材7の界面の接着力は、適度に確保されており、最も接着力が小さい界面は、粘着層5と離型層4の界面となる。これは、典型的に、薄膜部材7及び支持部材8の表面エネルギーが粘着剤2、5の表面エネルギーよりも大きく、離型層4の表面エネルギーが粘着剤2、5の表面エネルギーよりも小さいことに起因する。この場合、粘着層5と離型層4の界面の接着力が極度に小さいと、加工処理中に、この界面において薄膜部材7が支持部材8から分離してしまい、薄膜部材7への加工処理ができなくなる。   For example, as shown in FIG. 2 (a), in the laminate having the configuration of the present invention, immediately after the thin film member 7 and the support member 8 are fixed, the adhesive layer 5 of the double-sided adhesive tape is released from the support member 8. The pressure-sensitive adhesive layer 2 is in contact with the thin film member 7 and the base material 3. In this state, the adhesive force at the interface between the pressure-sensitive adhesive layer 5 and the support member 8 and the adhesive force at the interface between the pressure-sensitive adhesive layer 2 and the thin film member 7 are adequately secured. 5 and the release layer 4 interface. This is because the surface energy of the thin film member 7 and the support member 8 is typically larger than the surface energy of the adhesives 2 and 5, and the surface energy of the release layer 4 is smaller than the surface energy of the adhesives 2 and 5. caused by. In this case, if the adhesive force at the interface between the pressure-sensitive adhesive layer 5 and the release layer 4 is extremely small, the thin film member 7 is separated from the support member 8 at this interface during the processing, and the processing to the thin film member 7 is performed. Can not be.

従って、薄膜部材7を支持部材8に固定した直後においては、粘着層5の離型層4に対する接着力(X)は、0.02N/25mm以上、0.50N/25mm以下の範囲であることが好ましい。絶対値そのものは小さいが、粘着層5の離型層4に対する接着力(X)として、少なくとも0.02N/25mm以上の接着力があれば、薄膜部材7は、加工処理中や搬送工程中に、支持部材8からずれたり、剥がれ落ちることはなく、支持部材8に固定された状態を維持することができる。また、薄膜部材7の加工処理終了後においては、薄膜部材7に対して垂直方向に脱着力を加え、薄膜部材7側を支持部材8側から粘着層5と離型層4の界面において分離する必要があるため、粘着層5に外部エネルギーの後印加により硬化する性質を有する粘着層を適応し、接着力を大幅に弱めてから分離する方法を採用する場合も含めて想定すると、この段階、いわゆる初期の接着力の上限値は0.50N/25mm以下に留めておくことが好ましい。このように、接着力の上限値を必要以上に高くしておかないことにより、加工処理終了後に薄膜部材7側を支持部材8側から粘着層5と離型層4の界面においてより容易に分離しやすくなる。 Therefore, immediately after fixing the thin film member 7 to the supporting member 8, the adhesive force (X) of the adhesive layer 5 to the release layer 4 is in the range of 0.02 N / 25 mm or more and 0.50 N / 25 mm or less. Is preferred. Although the absolute value itself is small, if the adhesive force (X) of the pressure-sensitive adhesive layer 5 to the release layer 4 is at least 0.02 N / 25 mm or more, the thin film member 7 can be removed during processing and transporting processes. The state of being fixed to the support member 8 can be maintained without being displaced from the support member 8 or being peeled off. Further, after the processing of the thin film member 7 is completed, a desorption force is applied to the thin film member 7 in the vertical direction to separate the thin film member 7 side from the support member 8 side at the interface between the adhesive layer 5 and the release layer 4. Since it is necessary to apply the adhesive layer having the property of being cured by the subsequent application of external energy to the adhesive layer 5, and including the case of adopting the method of separating after greatly weakening the adhesive force, this stage, It is preferable to keep the upper limit of the so-called initial adhesive strength at 0.50 N / 25 mm or less. Thus, by not setting the upper limit of the adhesive force higher than necessary, the thin film member 7 side is more easily separated from the support member 8 side at the interface between the adhesive layer 5 and the release layer 4 after the processing is completed. It becomes easy to do.

また、薄膜部材7への加工処理終了後に、薄膜部材7に対して垂直方向に脱着力を加え、薄膜部材7側を支持部材8側から粘着層5と離型層4の界面において分離する状態においては、最も接着力が小さい界面は、やはり、粘着層5と離型層4の界面となる。粘着層5の離型層4に対する接着力(Y)は、0.01N/25mm以上、0.10N/25mm以下の範囲であることが好ましく、0.01N/25mm以上、0.05N/25mm以下の範囲であることがより好ましい。粘着層5の離型層4に対する接着力(Y)を上記範囲とするには、粘着層5に外部エネルギーの後印加により硬化する性質を有する粘着層を適用することが好ましい。すなわち、上述した、薄膜部材7を支持部材8に固定した直後における粘着層5の離型層4に対する上記接着力(X)が、たとえ0.10N/25mmを超えるような場合であっても、加工処理終了後に、粘着層5に外部エネルギーを後印加することにより粘着層5を硬化させることができるため、粘着層5の離型層4に対する上記接着力(Y)を0.10N/25mm以下に低減することができる。上記接着力(Y)を上記範囲とすることにより、薄膜部材7を破損することなく、薄膜部材7側を支持部材8側から、粘着層5と離型層4の界面において、垂直方向に分離することができる。上記接着力(Y)が0.10N/25mmを超えると、加工処理終了後に薄膜部材7側を支持部材8側から垂直方向に分離する際に、薄膜部材7に折れや欠け、割れ等の損傷を与えるおそれがある。 In addition, after the processing to the thin film member 7 is completed, a desorption force is applied to the thin film member 7 in the vertical direction, and the thin film member 7 side is separated from the support member 8 side at the interface between the adhesive layer 5 and the release layer 4. In this case, the interface having the smallest adhesive force is again the interface between the pressure-sensitive adhesive layer 5 and the release layer 4. The adhesive force (Y) of the adhesive layer 5 to the release layer 4 is preferably in the range of 0.01 N / 25 mm or more and 0.10 N / 25 mm or less, 0.01 N / 25 mm or more and 0.05 N / 25 mm or less. More preferably, it is the range. In order to make the adhesive force (Y) of the pressure-sensitive adhesive layer 5 to the release layer 4 fall within the above range, it is preferable to apply a pressure-sensitive adhesive layer having a property of being cured by post-application of external energy to the pressure-sensitive adhesive layer 5. That is, even if the above-mentioned adhesive force (X) to the release layer 4 of the adhesive layer 5 immediately after fixing the thin film member 7 to the support member 8 described above exceeds 0.10 N / 25 mm, Since the adhesive layer 5 can be cured by post-applying external energy to the adhesive layer 5 after the processing is completed, the adhesive force (Y) of the adhesive layer 5 to the release layer 4 is 0.10 N / 25 mm or less. Can be reduced. By setting the adhesive force (Y) within the above range, the thin film member 7 side is separated from the support member 8 side in the vertical direction at the interface between the adhesive layer 5 and the release layer 4 without damaging the thin film member 7. can do. When the adhesive force (Y) exceeds 0.10 N / 25 mm, damage to the thin film member 7 such as breakage, chipping or cracking occurs when the thin film member 7 side is separated from the support member 8 side in the vertical direction after the processing is completed. There is a risk of giving.

薄膜部材7への加工処理が終了し、先ず、離型層4と粘着層5との間で薄膜部材7側と支持部材8側とに分離された後は、例えば、図2(b)に示したように、薄膜部材7の加工処理面側とは反対面側には、粘着層2、基材3、離型層4の構成から成る可撓性のある片面粘着テープ(図2(b)の粘着テープ中間体10に相当)が残る。すなわち、最終的に加工処理された薄膜部材7を得るためには、上記可撓性のある片面粘着テープをゆっくりと例えば90°ピール方向に薄膜部材7から剥離する必要がある。上記片面粘着テープを薄膜部材7を破損させずに、且つ粘着剤残り(糊残り)することなく容易に剥離するためには、剥離する状態においては、上記粘着層2の薄膜部材7に対する接着力(Z)は、0.03N/25mm以上、1.00N/25mm未満の範囲であることが好ましく、0.03N/25mm以上、0.50N/25mm未満の範囲であることがより好ましい。粘着層2の薄膜部材7に対する接着力(Z)を上記範囲とするには、粘着層2に外部エネルギーの後印加により硬化する性質を有する粘着層を適用することが好ましい。上記接着力(Z)を上記範囲とすることにより、薄膜部材7を破損することなく、且つ糊残りすることなく、上記片面粘着テープを薄膜部材7から90°ピール方向に剥離することができる。上記接着力(Z)が1.00N/25mmを超えると、片面粘着テープを薄膜部材7から剥離する際に、薄膜部材7が破損するおそれがある。 After the processing to the thin film member 7 is finished and first separated between the release layer 4 and the adhesive layer 5 into the thin film member 7 side and the support member 8 side, for example, FIG. As shown, on the side opposite to the processing surface side of the thin film member 7, there is a flexible single-sided adhesive tape composed of an adhesive layer 2, a base material 3, and a release layer 4 (FIG. 2B Equivalent to the adhesive tape intermediate 10)). That is, in order to obtain the finally processed thin film member 7, it is necessary to slowly peel the flexible single-sided adhesive tape from the thin film member 7 in a 90 ° peel direction, for example. In order to easily peel the single-sided adhesive tape without damaging the thin film member 7 and without leaving adhesive (residue residue), the adhesive force of the adhesive layer 2 to the thin film member 7 in the peeled state (Z) is preferably in the range of 0.03 N / 25 mm or more and less than 1.00 N / 25 mm, and more preferably in the range of 0.03 N / 25 mm or more and less than 0.50 N / 25 mm. In order to make the adhesive force (Z) of the pressure-sensitive adhesive layer 2 to the thin film member 7 fall within the above range, it is preferable to apply a pressure-sensitive adhesive layer having a property of being cured by post-application of external energy to the pressure-sensitive adhesive layer 2. By setting the adhesive force (Z) within the above range, the single-sided adhesive tape can be peeled from the thin film member 7 in the 90 ° peel direction without damaging the thin film member 7 and without leaving adhesive. If the adhesive force (Z) exceeds 1.00 N / 25 mm, the thin film member 7 may be damaged when the single-sided adhesive tape is peeled from the thin film member 7.

薄膜部材7を支持部材8に固定した直後における、上記の粘着層5の離形層4に対する「接着力(X)」は、上記両面粘着テープの粘着層2をPETフィルムで裏打ちし、23℃において、その反対面の粘着層5を支持部材8に貼り付け、2kgローラーで一往復圧着して作製した試験片を用いて、23℃において、支持部材8を固定した状態で剥離速度300mm/分の剥離速度で90度の角度で、離形層4側を粘着層5から剥離した際の90度ピール接着力を意味する。 Immediately after fixing the thin film member 7 to the support member 8, the “adhesive force (X)” of the adhesive layer 5 to the release layer 4 is that the adhesive layer 2 of the double-sided adhesive tape is lined with a PET film at 23 ° C. In Example 1, the adhesive layer 5 on the opposite surface was attached to the support member 8 and the test piece prepared by reciprocating pressure with a 2 kg roller was used, and the peeling speed was 300 mm / min with the support member 8 fixed at 23 ° C. It means 90 degree peel adhesive force when the release layer 4 side is peeled from the pressure-sensitive adhesive layer 5 at an angle of 90 degrees at a peeling speed of.

また、薄膜部材7側を支持部材8側から分離する状態における、上記の粘着層5の離形層4に対する「接着力(Y)」は、基本的には「接着力(X)」と同様の90度ピール接着力を意味する。ただし、薄膜部材7側を支持部材8側から分離する際に、必要に応じて粘着層に外部エネルギーを印加する場合は、上記試験片に外部エネルギーを印加した後に剥離した際の90度ピール接着力を意味する。 Further, the “adhesive force (Y)” of the adhesive layer 5 to the release layer 4 in a state where the thin film member 7 side is separated from the support member 8 side is basically the same as “adhesive force (X)”. Of 90 degree peel adhesion. However, when the external energy is applied to the adhesive layer as necessary when separating the thin film member 7 side from the support member 8 side, 90 ° peel adhesion when peeling after applying external energy to the test piece Means power.

更に、上記片面粘着テープを薄膜部材7から剥離する状態における、上記の粘着層2の薄膜部材7に対する「粘着力(Z)」は、上記両面粘着テープの粘着層5を剥離した状態の上記片面粘着テープの粘着層2を薄膜部材7に貼り付け、23℃において、2kgローラーで一往復圧着して作製したテープ試験片を、23℃において、薄膜部材7を固定した状態で剥離速度300mm/分の剥離速度で90度の角度で、粘着層2側を薄膜部材7から剥離した際の90度ピール接着力を意味する。ただし、上記片面粘着テープを薄膜部材7から剥離する際に、必要に応じて粘着層に外部エネルギーを印加する場合は、上記試験片に外部エネルギーを印加した後に剥離した際の90度ピール接着力を意味する。 Furthermore, the “adhesive strength (Z)” of the adhesive layer 2 to the thin film member 7 in the state where the single-sided adhesive tape is peeled off from the thin film member 7 is the single-sided state in which the adhesive layer 5 of the double-sided adhesive tape is peeled off. A tape test piece prepared by attaching the adhesive layer 2 of the adhesive tape to the thin film member 7 and press-fitting one reciprocating with a 2 kg roller at 23 ° C. at a peeling speed of 300 mm / min with the thin film member 7 fixed at 23 ° C. It means 90 degree peel adhesive force when the pressure-sensitive adhesive layer 2 side is peeled from the thin film member 7 at an angle of 90 degrees at a peeling speed of. However, when peeling the single-sided pressure-sensitive adhesive tape from the thin film member 7 and applying external energy to the pressure-sensitive adhesive layer as necessary, 90 degree peel adhesive strength when peeling after applying external energy to the test piece Means.

以下の実施例により本発明を更に具体的に説明するが、本発明はこれらに限定されない。   The following examples further illustrate the present invention, but the present invention is not limited thereto.

<樹脂組成物の調製>
1.粘着剤
(1)粘着剤組成物A
シリコーン系粘着剤(信越化学製「KR−3704」(商品名))100質量部、白金触媒(信越化学製「CAT−PL−50T」(商品名))0.5質量部を混合した後、固形分濃度40質量%となるようにトルエンにより希釈し、シリコーン粘着剤組成物Aを得た。
<Preparation of resin composition>
1. Adhesive (1) Adhesive composition A
After mixing 100 parts by mass of silicone-based adhesive (“KR-3704” (trade name) manufactured by Shin-Etsu Chemical) and 0.5 part by mass of platinum catalyst (“CAT-PL-50T” (trade name) manufactured by Shin-Etsu Chemical), It diluted with toluene so that it might become solid content concentration of 40 mass%, and the silicone adhesive composition A was obtained.

(2)粘着剤組成物B
ラジカル重合性アクリル系粘着剤(日本合成化学製「N−4498」(商品名))100質量部、イソシアネート架橋剤(東ソー株式会社製「L−55E」(商品名))1.0質量部、熱重合開始剤(大塚化学製MAIB)0.5質量部を混合した後、固形分濃度が35質量%となるように酢酸エチルにより希釈し、熱硬化型アクリル粘着剤組成物Bを得た。
(2) Adhesive composition B
100 parts by mass of a radical polymerizable acrylic pressure-sensitive adhesive (“N-4498” (trade name) manufactured by Nippon Synthetic Chemical), 1.0 part by mass of an isocyanate crosslinking agent (“L-55E” (trade name) manufactured by Tosoh Corporation), After mixing 0.5 parts by mass of a thermal polymerization initiator (MAIB manufactured by Otsuka Chemical Co., Ltd.), the mixture was diluted with ethyl acetate so that the solid content concentration was 35% by mass to obtain a thermosetting acrylic pressure-sensitive adhesive composition B.

(3)粘着剤組成物C
ラジカル重合性アクリル系粘着剤(日本合成化学製「N−4498」(商品名))100質量部、イソシアネート架橋剤(東ソー株式会社製「L−55E」(商品名))1.0質量部、光重合開始剤(BASF製「Irg819」(商品名))0.5質量部を混合した後、固形分濃度が35質量%となるように酢酸エチルにより希釈し、放射線硬化型アクリル粘着剤組成物Cを得た。
(3) Adhesive composition C
100 parts by mass of a radical polymerizable acrylic pressure-sensitive adhesive (“N-4498” (trade name) manufactured by Nippon Synthetic Chemical), 1.0 part by mass of an isocyanate crosslinking agent (“L-55E” (trade name) manufactured by Tosoh Corporation), After mixing 0.5 parts by mass of a photopolymerization initiator (“Irg819” (trade name) manufactured by BASF), the radiation-curing acrylic pressure-sensitive adhesive composition is diluted with ethyl acetate so that the solid content concentration becomes 35% by mass. C was obtained.

(4)粘着剤組成物D
アクリル粘着剤(綜研化学製「SKダイン1495」(商品名))100質量部、イソシアネート系架橋剤(綜研化学製「L−45」(商品名))1.0質量部を混合した後、固形分30質量%となるように酢酸エチルにより希釈し、アクリル粘着剤組成物Dを得た。
(4) Adhesive composition D
After mixing 100 parts by mass of an acrylic adhesive (“SK Dyne 1495” (trade name) manufactured by Soken Chemical Co., Ltd.) and 1.0 part by mass of an isocyanate-based crosslinking agent (“L-45” (trade name) manufactured by Soken Chemical Co., Ltd.), solid The mixture was diluted with ethyl acetate so as to be 30% by mass, and an acrylic pressure-sensitive adhesive composition D was obtained.

2.剥離剤
(1)剥離剤組成物a
シリコーン系剥離剤(東レ・ダウコーニング製「LTC−752」(商品名))100質量部、白金触媒(東レダウコーニング製NC−25」(商品名))0.5質量部を混合した後、固形分1質量%になるようにトルエンにより希釈し、シリコーン系剥離剤組成物aを得た。
2. Release agent (1) Release agent composition a
After mixing 100 parts by mass of a silicone release agent (“LTC-752” (trade name) manufactured by Toray Dow Corning) and 0.5 part by mass of a platinum catalyst (NC-25 manufactured by Toray Dow Corning (trade name)), It diluted with toluene so that it might become 1 mass% of solid content, and the silicone type release agent composition a was obtained.

(2)剥離剤組成物b
フッ素系剥離剤(東レ・ダウコーニング製「BY24−900」(商品名))100質量部、白金触媒(東レ・ダウコーニング製NC−25」(商品名))0.6質量部を混合した後、固形分1質量%になるようにイソオクタンにより希釈し、フッ素系剥離剤組成物bを得た。
(2) Release agent composition b
After mixing 100 parts by mass of a fluorine-based release agent (Toray Dow Corning “BY24-900” (trade name)) and 0.6 parts by mass of a platinum catalyst (Toray Dow Corning NC-25 (trade name)) Then, it was diluted with isooctane so as to have a solid content of 1% by mass to obtain a fluorine-based release agent composition b.

(3)剥離剤組成物c
非シリコーン系剥離剤(ライオン・スペシャリティ・ケミカル製「ピーロイル1070」(商品名))を固形分1質量%になるようにトルエンにより希釈し、非シリコーン系剥離剤組成物cを得た。
(3) Release agent composition c
A non-silicone release agent (“Pyroyl 1070” (trade name) manufactured by Lion Specialty Chemical) was diluted with toluene to a solid content of 1% by mass to obtain a non-silicone release agent composition c.

[実施例1]
<両面粘着テープの作製>
図3(a)は実施例の粘着テープ中間体の層構成を示す断面図である。PETフィルム(厚さ:38μm)から成る基材層3の一方の表面に、シリコーン系剥離剤組成物a(dry厚さ:0.2μm)を塗工し、溶剤を乾燥させ、離型層4を形成した。基材層3のもう一方の表面に、シリコーン粘着剤組成物A(dry厚さ:10μm)を塗工し、溶剤を乾燥させ、粘着層A2を形成した。この粘着層A2の表面に剥離ライナー1を貼り合せ、粘着テープ中間体10を作製した。
[Example 1]
<Production of double-sided adhesive tape>
Fig.3 (a) is sectional drawing which shows the layer structure of the adhesive tape intermediate body of an Example. The silicone release agent composition a (dry thickness: 0.2 μm) is applied to one surface of the base material layer 3 made of a PET film (thickness: 38 μm), the solvent is dried, and the release layer 4 Formed. A silicone pressure-sensitive adhesive composition A (dry thickness: 10 μm) was applied to the other surface of the base material layer 3, and the solvent was dried to form a pressure-sensitive adhesive layer A2. The release liner 1 was bonded to the surface of the adhesive layer A2 to produce an adhesive tape intermediate 10.

図3(b)は実施例の両面粘着テープの層構成を示す断面図である。剥離ライナー6に、熱硬化型アクリル粘着剤組成物B(厚さ:dry20μm)を塗工し、溶剤を乾燥させ、粘着層B5を形成した。この粘着層B5の表面を粘着テープ中間体10の離型層4の表面に貼り合せて、両面粘着テープ20を得た。   FIG.3 (b) is sectional drawing which shows the layer structure of the double-sided adhesive tape of an Example. A thermosetting acrylic pressure-sensitive adhesive composition B (thickness: dry 20 μm) was applied to the release liner 6 and the solvent was dried to form a pressure-sensitive adhesive layer B5. The surface of this adhesive layer B5 was bonded to the surface of the release layer 4 of the adhesive tape intermediate 10 to obtain a double-sided adhesive tape 20.

<薄膜部材と支持部材との積層体の作製および評価>
図5は、両面粘着テープ20を使用して、薄膜部材としての薄膜基板ガラス30と支持部材としての補強用基盤ガラス31とを貼着した積層体について、垂直剥離試験を行うために補強用基盤ガラス31側を、エポキシ2液ガラス用接着剤40を用いてステンレス板50の上に取り付けた状態を示す断面図である。薄膜基板ガラス30は縦45mm×横45mm、補強用基盤ガラスは縦50mm×横50mm、両面粘着テープ20は縦40mm×横40mm、ステンレス板50は100mm×100mmの大きさとした。薄膜基板ガラス30の厚さは、薄膜基板を想定し、0.4mmとした。また、補強用基盤ガラス31の厚さは、補強用基盤を想定し、2.0mmとした。両面粘着テープ20を用いて、粘着層A2が薄膜基板ガラス30、粘着層B5が補強用基盤ガラス31に接するように、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。次いで、薄膜基板ガラス30と補強用基盤ガラス31の積層体に対して、外部エネルギーの印加処理として、150℃で1時間の加熱処理を行った。
<Production and Evaluation of Laminate of Thin Film Member and Support Member>
FIG. 5 shows a reinforcing base for performing a vertical peel test on a laminate in which a double-sided adhesive tape 20 is used to attach a thin film substrate glass 30 as a thin film member and a reinforcing base glass 31 as a support member. It is sectional drawing which shows the state which attached the glass 31 side on the stainless steel plate 50 using the adhesive agent 40 for epoxy 2 liquid glass. The thin film substrate glass 30 was 45 mm long × 45 mm wide, the reinforcing base glass was 50 mm long × 50 mm wide, the double-sided adhesive tape 20 was 40 mm long × 40 mm wide, and the stainless steel plate 50 was 100 mm × 100 mm in size. The thickness of the thin film substrate glass 30 was 0.4 mm assuming a thin film substrate. The thickness of the reinforcing base glass 31 was 2.0 mm assuming the reinforcing base. Using the double-sided adhesive tape 20, the thin film substrate glass 30 and the reinforcing base glass 31 are adhered so that the adhesive layer A 2 is in contact with the thin film substrate glass 30 and the adhesive layer B 5 is in contact with the reinforcing base glass 31. And a reinforcing substrate glass 31 was prepared. Subsequently, the laminated body of the thin film substrate glass 30 and the reinforcing base glass 31 was subjected to a heat treatment at 150 ° C. for 1 hour as an external energy application treatment.

薄膜基板ガラス30と補強用基盤ガラス31の積層体を室温に冷却した後、補強用基盤ガラス31を、エポキシ2液ガラス用接着剤40を用いてステンレス板50の上に貼り合わせて固定し、垂直剥離試験用の試験片を作製した。   After the laminated body of the thin film substrate glass 30 and the reinforcing base glass 31 is cooled to room temperature, the reinforcing base glass 31 is bonded and fixed onto the stainless steel plate 50 using the epoxy two-component glass adhesive 40, A test piece for a vertical peel test was prepared.

作製した試験片のステンレス板50を固定し、薄膜基板ガラス30の上面中央に吸着パッドを取り付け、吸着パッドを手の指で持って薄膜基板ガラス30に対して上垂直方向にゆっくりと脱着力を加え、薄膜基板ガラス30を補強用基盤ガラス31から引き剥がした。実施例1の両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30は補強用基盤ガラス31から破損せずに分離された。   The prepared stainless steel plate 50 is fixed, and a suction pad is attached to the center of the upper surface of the thin film substrate glass 30. The suction pad is held by the finger of the hand and slowly attaches and detaches vertically to the thin film substrate glass 30. In addition, the thin film substrate glass 30 was peeled off from the reinforcing base glass 31. The double-sided pressure-sensitive adhesive tape of Example 1 was peeled between the release layer 4 and the pressure-sensitive adhesive layer B5, and the thin film substrate glass 30 was separated from the reinforcing base glass 31 without being damaged.

分離された薄膜基板ガラス30の下面には、粘着層A2、基材3、離型層4から構成される粘着テープ中間体10が接着している。次いで、この粘着テープ中間体10を、90°方向に300mm/minの速度で引き離した。実施例1の粘着テープ中間体10は、粘着層A2と薄膜基板ガラス30の間で剥離し、薄膜基板ガラス30の破損及び表面の糊残りの発生は見られなかった。   An adhesive tape intermediate 10 composed of the adhesive layer A2, the base material 3, and the release layer 4 is adhered to the lower surface of the separated thin film substrate glass 30. Subsequently, this adhesive tape intermediate 10 was pulled away at a speed of 300 mm / min in the 90 ° direction. The adhesive tape intermediate 10 of Example 1 was peeled between the adhesive layer A2 and the thin film substrate glass 30, and no damage to the thin film substrate glass 30 and generation of adhesive residue on the surface were observed.

なお、両面粘着テープの離型層4と粘着層B5の間の剥離性は、以下の基準に基づいて評価した。 The peelability between the release layer 4 and the adhesive layer B5 of the double-sided adhesive tape was evaluated based on the following criteria.

<垂直剥離性評価基準>
ガラス板積層体試験体数N=10とし、薄膜基板ガラス30と補強用基盤ガラス31を両面粘着テープ20で貼り合せ、上記の方法により垂直方向に引き離した際に、薄膜基板ガラス30の破損状態を確認し、薄膜基板ガラス30が破損せずに分離できた場合を良品とし、以下の基準で評価した。
<Vertical peelability evaluation criteria>
When the number of glass plate laminate test specimens is N = 10, the thin film substrate glass 30 and the reinforcing base glass 31 are bonded with the double-sided adhesive tape 20, and pulled apart in the vertical direction by the above method, the damaged state of the thin film substrate glass 30 The thin film substrate glass 30 was evaluated as being non-defective and evaluated according to the following criteria.

(◎)良品率:100%(N=10の内、NG数が0)
(○)良品率:70%〜90%(N=10の内、NG数が1〜3)
(△)良品率:10〜60%(N=10の内、NG数が4〜9)
(×)良品率:0%(N=10の内、NG数が10)
(◎) Non-defective rate: 100% (N = 10 out of NG number)
(◯) Non-defective rate: 70% to 90% (N = 10, NG number is 1 to 3)
(△) Non-defective rate: 10 to 60% (N = 10, NG number is 4 to 9)
(×) Non-defective rate: 0% (N = 10, NG number is 10)

薄膜基板ガラス30の良品率が70%以上の(◎)(○)の評価となるものを、実用上、垂直剥離が可能な積層体とした。 A thin film substrate glass 30 having a non-defective rate of 70% or more (◎) (○) was evaluated as a laminate capable of vertical peeling.

[実施例2]
熱硬化型アクリル粘着剤組成物Bの代わりに放射線硬化型アクリル粘着剤組成物Cを使用して粘着層B5を形成すること以外は実施例1と同様にして両面粘着テープ20を作製し、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。加熱処理の代わりに紫外線照射(積算光量300mJ/cm)すること以外は実施例1と同様にして薄膜基板ガラス30と補強用基盤ガラス31の積層体の垂直剥離試験を行った。その結果、両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30は補強用基盤ガラス31から破損せずに分離された。
[Example 2]
A double-sided pressure-sensitive adhesive tape 20 was produced in the same manner as in Example 1 except that the radiation-curable acrylic pressure-sensitive adhesive composition C was used instead of the thermosetting acrylic pressure-sensitive adhesive composition B to form the pressure-sensitive adhesive layer B5. The substrate glass 30 and the reinforcing base glass 31 were attached to produce a laminate of the thin film substrate glass 30 and the reinforcing base glass 31. A vertical peel test of the laminate of the thin film substrate glass 30 and the reinforcing base glass 31 was performed in the same manner as in Example 1 except that ultraviolet irradiation (accumulated light amount 300 mJ / cm 2 ) was performed instead of the heat treatment. As a result, the double-sided adhesive tape was peeled between the release layer 4 and the adhesive layer B5, and the thin film substrate glass 30 was separated from the reinforcing base glass 31 without being damaged.

また、薄膜基板ガラス30の下面に残った実施例2の粘着テープ中間体10は、実施例1と同様に剥離したところ、粘着層A2と薄膜基板ガラス30の間で剥離することができ、薄膜基板ガラス30の破損及び表面の糊残りの発生は見られなかった。   Moreover, when the adhesive tape intermediate body 10 of Example 2 remaining on the lower surface of the thin film substrate glass 30 was peeled in the same manner as in Example 1, it can be peeled between the pressure sensitive adhesive layer A2 and the thin film substrate glass 30, and the thin film Breakage of the substrate glass 30 and generation of adhesive residue on the surface were not observed.

[実施例3]
シリコーン粘着剤組成物Aの代わりに放射線硬化型アクリル粘着剤組成物Cを使用して粘着層A2を形成すること以外は実施例1と同様にして両面粘着テープ20を作製し、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。次いで、薄膜基板ガラス30と補強用基盤ガラス31の積層体の垂直剥離試験を行った。その結果、両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30は補強用基盤ガラス31から破損せずに分離された。
[Example 3]
A double-sided pressure-sensitive adhesive tape 20 was produced in the same manner as in Example 1 except that the radiation-curable acrylic pressure-sensitive adhesive composition C was used in place of the silicone pressure-sensitive adhesive composition A to form the pressure-sensitive adhesive layer A2, and the thin film substrate glass 30 was prepared. And a reinforcing substrate glass 31 were adhered, and a laminate of the thin film substrate glass 30 and the reinforcing substrate glass 31 was produced. Subsequently, the vertical peeling test of the laminated body of the thin film substrate glass 30 and the reinforcement | strengthening base glass 31 was done. As a result, the double-sided adhesive tape was peeled between the release layer 4 and the adhesive layer B5, and the thin film substrate glass 30 was separated from the reinforcing base glass 31 without being damaged.

また、薄膜基板ガラス30の下面に残った実施例3の粘着テープ中間体10に対して、更に紫外線を照射(積算光量300mJ/cm)し、粘着層A2を硬化させた後、実施例1と同様に剥離したところ、実施例3の粘着テープ中間体10は、粘着層A2と薄膜基板ガラス30の間で剥離し、薄膜基板ガラス30の破損及び糊残りの発生は見られなかった。 Further, the adhesive tape intermediate 10 of Example 3 remaining on the lower surface of the thin film substrate glass 30 was further irradiated with ultraviolet rays (integrated light amount 300 mJ / cm 2 ) to cure the adhesive layer A2, and then Example 1 The adhesive tape intermediate 10 of Example 3 was peeled between the adhesive layer A2 and the thin film substrate glass 30, and no damage to the thin film substrate glass 30 and no adhesive residue were observed.

[実施例4]
シリコーン粘着剤組成物Aの代わりに熱硬化型アクリル粘着剤組成物Bを使用して粘着層A2を形成し、熱硬化型アクリル粘着剤組成物Bの代わりに放射線硬化型アクリル粘着剤組成物Cを使用して粘着層B5を形成すること以外は実施例1と同様にして両面粘着テープ20を作製し、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。加熱処理の代わりに紫外線照射(積算光量300mJ/cm)すること以外は実施例1と同様にして薄膜基板ガラス30と補強用基盤ガラス31の積層体の垂直剥離試験を行った。その結果、両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30は補強用基盤ガラス31から破損せずに分離された。
[Example 4]
The adhesive layer A2 is formed using the thermosetting acrylic adhesive composition B instead of the silicone adhesive composition A, and the radiation curable acrylic adhesive composition C is used instead of the thermosetting acrylic adhesive composition B. A double-sided pressure-sensitive adhesive tape 20 is produced in the same manner as in Example 1 except that the adhesive layer B5 is formed using A, and the thin-film substrate glass 30 and the reinforcing base glass 31 are adhered. A laminate with the base glass 31 was produced. A vertical peel test of the laminate of the thin film substrate glass 30 and the reinforcing base glass 31 was performed in the same manner as in Example 1 except that ultraviolet irradiation (accumulated light amount 300 mJ / cm 2 ) was performed instead of the heat treatment. As a result, the double-sided adhesive tape was peeled between the release layer 4 and the adhesive layer B5, and the thin film substrate glass 30 was separated from the reinforcing base glass 31 without being damaged.

また、薄膜基板ガラス30の下面に残った実施例4の粘着テープ中間体10に対して、更に加熱処理(150℃、1時間)を施して、粘着層A2を硬化させた後、実施例1と同様に剥離したところ、実施例3の粘着テープ中間体10は、粘着層A2と薄膜基板ガラス30の間で剥離し、薄膜基板ガラス30の破損及び糊残りの発生は見られなかった。   Further, the adhesive tape intermediate 10 of Example 4 remaining on the lower surface of the thin film substrate glass 30 was further subjected to heat treatment (150 ° C., 1 hour) to cure the adhesive layer A2, and then Example 1 The adhesive tape intermediate 10 of Example 3 was peeled between the adhesive layer A2 and the thin film substrate glass 30, and no damage to the thin film substrate glass 30 and no adhesive residue were observed.

[実施例5]
シリコーン粘着剤組成物Aの代わりに放射線硬化型アクリル粘着剤組成物Cを使用して粘着層A2を形成し、熱硬化型アクリル粘着剤組成物Bの代わりにアクリル粘着剤組成物Dを使用して粘着層B5を形成すること以外は実施例1と同様にして両面粘着テープ20を作製し、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。加熱処理を行わないこと以外は実施例1と同様にして薄膜基板ガラス30と補強用基盤ガラス31の積層体の垂直剥離試験を行った。その結果、一部の薄膜基板ガラス30が破損したが、殆どの両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30は補強用基盤ガラス31から破損せずに分離された。薄膜基板ガラス30の良品率は90%であった。
[Example 5]
The radiation-curable acrylic pressure-sensitive adhesive composition C is used instead of the silicone pressure-sensitive adhesive composition A to form the pressure-sensitive adhesive layer A2, and the thermosetting acrylic pressure-sensitive adhesive composition B is used instead of the acrylic pressure-sensitive adhesive composition D. The double-sided pressure-sensitive adhesive tape 20 is produced in the same manner as in Example 1 except that the adhesive layer B5 is formed, and the thin film substrate glass 30 and the reinforcing base glass 31 are pasted, and the thin film substrate glass 30 and the reinforcing base glass 31 are adhered. A laminate was prepared. A vertical peel test was performed on the laminate of the thin film substrate glass 30 and the reinforcing base glass 31 in the same manner as in Example 1 except that the heat treatment was not performed. As a result, a part of the thin film substrate glass 30 was damaged, but most of the double-sided adhesive tape was peeled off between the release layer 4 and the adhesive layer B5, and the thin film substrate glass 30 was not damaged from the reinforcing base glass 31. Isolated on. The yield rate of the thin film substrate glass 30 was 90%.

また、薄膜基板ガラス30の下面に残った実施例5の粘着テープ中間体10に対して、更に紫外線を照射(積算光量300mJ/cm)し、粘着層A2を硬化させた後、実施例1と同様に剥離したところ、実施例5の粘着テープ中間体10は、粘着層A2と薄膜基板ガラス30の間で剥離し、薄膜基板ガラス30の破損及び糊残りの発生は見られなかった。 Further, the adhesive tape intermediate 10 of Example 5 remaining on the lower surface of the thin film substrate glass 30 was further irradiated with ultraviolet rays (integrated light amount 300 mJ / cm 2 ) to cure the adhesive layer A2, and then Example 1 The adhesive tape intermediate 10 of Example 5 was peeled between the adhesive layer A2 and the thin film substrate glass 30, and no damage to the thin film substrate glass 30 and no adhesive residue were observed.

[実施例6]
シリコーン系剥離剤組成物aの代わりにフッ素剥離剤組成物bを使用して離型層4を形成し、シリコーン粘着剤組成物Aの代わりにアクリル粘着剤組成物Dを使用して粘着層A2を形成し、熱硬化型アクリル粘着剤組成物Bの代わりにシリコーン粘着剤組成物Aを使用して粘着層B5を形成すること以外は実施例1と同様にして両面粘着テープ20を作製し、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。加熱処理を行わないこと以外は実施例1と同様にして薄膜基板ガラス30と補強用基盤ガラス31の積層体の垂直剥離試験を行った。その結果、一部の薄膜基板ガラス30が破損したが、殆どの両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30は補強用基盤ガラス31から破損せずに分離された。薄膜基板ガラス30の良品率は90%以上であった。
[Example 6]
The release layer 4 is formed using the fluorine release agent composition b instead of the silicone release agent composition a, and the adhesive layer A2 using the acrylic adhesive composition D instead of the silicone adhesive composition A. A double-sided pressure-sensitive adhesive tape 20 is produced in the same manner as in Example 1, except that the silicone pressure-sensitive adhesive composition A is used in place of the thermosetting acrylic pressure-sensitive adhesive composition B to form the pressure-sensitive adhesive layer B5. The thin film substrate glass 30 and the reinforcing base glass 31 were attached to produce a laminate of the thin film substrate glass 30 and the reinforcing base glass 31. A vertical peel test was performed on the laminate of the thin film substrate glass 30 and the reinforcing base glass 31 in the same manner as in Example 1 except that the heat treatment was not performed. As a result, a part of the thin film substrate glass 30 was damaged, but most of the double-sided adhesive tape was peeled off between the release layer 4 and the adhesive layer B5, and the thin film substrate glass 30 was not damaged from the reinforcing base glass 31. Isolated on. The yield rate of the thin film substrate glass 30 was 90% or more.

また、薄膜基板ガラス30の下面に残った実施例6の粘着テープ中間体10は、実施例1と同様に剥離したところ、粘着層A2と薄膜基板ガラス30の間で剥離することができ、薄膜基板ガラス30の破損及び表面の糊残りの発生は見られなかった。 Moreover, when the adhesive tape intermediate body 10 of Example 6 remaining on the lower surface of the thin film substrate glass 30 was peeled in the same manner as in Example 1, it can be peeled between the pressure sensitive adhesive layer A2 and the thin film substrate glass 30, and the thin film Breakage of the substrate glass 30 and generation of adhesive residue on the surface were not observed.

[実施例7]
シリコーン系剥離剤組成物aの代わりに非シリコーン系剥離剤組成物cを使用して離型層4を形成すること以外は実施例1と同様にして両面粘着テープ20を作製し、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。次いで、薄膜基板ガラス30と補強用基盤ガラス31の積層体の垂直剥離試験を行った。その結果、一部の薄膜基板ガラス30が破損したが、殆どの両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30は補強用基盤ガラス31から破損せずに分離された。薄膜基板ガラス30の良品率は80%であった。
[Example 7]
A double-sided pressure-sensitive adhesive tape 20 was produced in the same manner as in Example 1 except that the release layer 4 was formed using a non-silicone release agent composition c instead of the silicone release agent composition a. 30 and the reinforcing base glass 31 were pasted to produce a laminate of the thin film substrate glass 30 and the reinforcing base glass 31. Subsequently, the vertical peeling test of the laminated body of the thin film substrate glass 30 and the reinforcement | strengthening base glass 31 was done. As a result, a part of the thin film substrate glass 30 was damaged, but most of the double-sided adhesive tape was peeled off between the release layer 4 and the adhesive layer B5, and the thin film substrate glass 30 was not damaged from the reinforcing base glass 31. Isolated on. The yield rate of the thin film substrate glass 30 was 80%.

また、薄膜基板ガラス30の下面に残った実施例7の粘着テープ中間体10は、実施例1と同様に剥離したところ、粘着層A2と薄膜基板ガラス30の間で剥離することができ、薄膜基板ガラス30の破損及び表面の糊残りの発生は見られなかった。 Moreover, when the adhesive tape intermediate body 10 of Example 7 remaining on the lower surface of the thin film substrate glass 30 was peeled in the same manner as in Example 1, it can be peeled between the pressure sensitive adhesive layer A2 and the thin film substrate glass 30, and the thin film Breakage of the substrate glass 30 and generation of adhesive residue on the surface were not observed.

[実施例8]
シリコーン系剥離剤組成物aの代わりにフッ素系剥離剤組成物bを使用して離型層4を形成すること以外は実施例1と同様にして両面粘着テープ20を作製し、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。次いで、薄膜基板ガラス30と補強用基盤ガラス31の積層体の垂直剥離試験を行った。その結果、両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30の破損は見られなかった。
[Example 8]
A double-sided pressure-sensitive adhesive tape 20 was produced in the same manner as in Example 1 except that the release layer 4 was formed using the fluorine-based release agent composition b instead of the silicone-based release agent composition a, and the thin film substrate glass 30 And a reinforcing substrate glass 31 were adhered, and a laminate of the thin film substrate glass 30 and the reinforcing substrate glass 31 was produced. Subsequently, the vertical peeling test of the laminated body of the thin film substrate glass 30 and the reinforcement | strengthening base glass 31 was done. As a result, the double-sided pressure-sensitive adhesive tape peeled between the release layer 4 and the pressure-sensitive adhesive layer B5, and the thin film substrate glass 30 was not damaged.

また、薄膜基板ガラス30の下面に残った実施例8の粘着テープ中間体10は、実施例1と同様に剥離したところ、粘着層A2と薄膜基板ガラス30の間で剥離することができ、薄膜基板ガラス30の破損及び表面の糊残りの発生は見られなかった。 Moreover, when the adhesive tape intermediate body 10 of Example 8 remaining on the lower surface of the thin film substrate glass 30 was peeled in the same manner as in Example 1, it can be peeled between the pressure sensitive adhesive layer A2 and the thin film substrate glass 30, and the thin film Breakage of the substrate glass 30 and generation of adhesive residue on the surface were not observed.

[実施例9]
シリコーン系剥離剤組成物aの代わりに非シリコーン系剥離剤組成物cを使用して離型層4を形成すること以外は実施例5と同様にして両面粘着テープ20を作製し、薄膜基板ガラス30と補強用基盤ガラス31を貼着し、薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製した。次いで、薄膜基板ガラス30と補強用基盤ガラス31の積層体の垂直剥離試験を行った。その結果、一部の薄膜基板ガラス30が破損したが、殆どの両面粘着テープは離型層4と粘着層B5との間で剥離し、薄膜基板ガラス30は補強用基盤ガラス31から破損せずに分離された。薄膜基板ガラス30の良品率は70%であった。
[Example 9]
A double-sided pressure-sensitive adhesive tape 20 was produced in the same manner as in Example 5 except that the release layer 4 was formed using a non-silicone release agent composition c instead of the silicone release agent composition a, and a thin film substrate glass was prepared. 30 and the reinforcing base glass 31 were pasted to produce a laminate of the thin film substrate glass 30 and the reinforcing base glass 31. Subsequently, the vertical peeling test of the laminated body of the thin film substrate glass 30 and the reinforcement | strengthening base glass 31 was done. As a result, a part of the thin film substrate glass 30 was damaged, but most of the double-sided adhesive tape was peeled off between the release layer 4 and the adhesive layer B5, and the thin film substrate glass 30 was not damaged from the reinforcing base glass 31. Isolated on. The yield rate of the thin film substrate glass 30 was 70%.

また、薄膜基板ガラス30の下面に残った実施例9の粘着テープ中間体10は、実施例1と同様に剥離したところ、粘着層A2と薄膜基板ガラス30の間で剥離することができ、薄膜基板ガラス30の破損及び表面の糊残りの発生は見られなかった。 Moreover, when the adhesive tape intermediate body 10 of Example 9 remaining on the lower surface of the thin film substrate glass 30 was peeled in the same manner as in Example 1, it can be peeled between the pressure sensitive adhesive layer A2 and the thin film substrate glass 30 and the thin film Breakage of the substrate glass 30 and generation of adhesive residue on the surface were not observed.

[比較例1]
図4(a)は比較例の粘着テープ中間体の層構成を示す断面図である。図4(b)は比較例の両面粘着テープの層構成を示す断面図である。基材層3に離型層4を形成しないこと以外は実施例1と同様にして粘着テープ中間体11を作製し、両面粘着テープ21を作製した。得られた両面粘着テープ21を用いて、実施例1と同様にして薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製し、垂直剥離試験を行ったところ、薄膜基板ガラス30と補強用基盤ガラス31を垂直方向に分離しようとした際に、試験体数N=10の全ての薄膜基板ガラス30が破損した。
[Comparative Example 1]
Fig.4 (a) is sectional drawing which shows the layer structure of the adhesive tape intermediate body of a comparative example. FIG.4 (b) is sectional drawing which shows the layer structure of the double-sided adhesive tape of a comparative example. A pressure-sensitive adhesive tape intermediate 11 was produced in the same manner as in Example 1 except that the release layer 4 was not formed on the base material layer 3, and a double-sided pressure-sensitive adhesive tape 21 was produced. A laminate of the thin film substrate glass 30 and the reinforcing base glass 31 was produced in the same manner as in Example 1 using the obtained double-sided adhesive tape 21, and a vertical peel test was performed. When the base glass 31 for use was to be separated in the vertical direction, all the thin film substrate glasses 30 with the number of test bodies N = 10 were broken.

[比較例2]
基材層3に離型層4を形成しないこと以外は実施例2と同様にして粘着テープ中間体11を作製し、両面粘着テープ21を作製した。得られた両面粘着テープ21を用いて、実施例2と同様にして薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製し、垂直剥離試験を行ったところ、薄膜基板ガラス30と補強用基盤ガラス31を垂直方向に分離しようとした際に、試験体数N=10の全ての薄膜基板ガラス30が破損した。
[Comparative Example 2]
A pressure-sensitive adhesive tape intermediate 11 was produced in the same manner as in Example 2 except that the release layer 4 was not formed on the base material layer 3, and a double-sided pressure-sensitive adhesive tape 21 was produced. Using the obtained double-sided adhesive tape 21, a laminate of the thin film substrate glass 30 and the reinforcing base glass 31 was produced in the same manner as in Example 2, and a vertical peel test was performed. When the base glass 31 for use was to be separated in the vertical direction, all the thin film substrate glasses 30 with the number of test bodies N = 10 were broken.

[比較例3]
基材層3に離型層4を形成しないこと以外は実施例3と同様にして粘着テープ中間体11を作製し、両面粘着テープ21を作製した。得られた両面粘着テープ21を用いて、実施例3と同様にして薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製し、垂直剥離試験を行ったところ、薄膜基板ガラス30と補強用基盤ガラス31を垂直方向に分離しようとした際に、試験体数N=10の全ての薄膜基板ガラス30が破損した。
[Comparative Example 3]
A pressure-sensitive adhesive tape intermediate 11 was produced in the same manner as in Example 3 except that the release layer 4 was not formed on the base material layer 3, and a double-sided pressure-sensitive adhesive tape 21 was produced. A laminated body of the thin film substrate glass 30 and the reinforcing base glass 31 was produced in the same manner as in Example 3 using the obtained double-sided adhesive tape 21, and a vertical peel test was performed. When the base glass 31 for use was to be separated in the vertical direction, all the thin film substrate glasses 30 with the number of test bodies N = 10 were broken.

[比較例4]
基材層3に離型層4を形成しないこと以外は実施例4と同様にして粘着テープ中間体11を作製し、両面粘着テープ21を作製した。得られた両面粘着テープ21を用いて、実施例4と同様にして薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製し、垂直剥離試験を行ったところ、薄膜基板ガラス30と補強用基盤ガラス31を垂直方向に分離しようとした際に、試験体数N=10の全ての薄膜基板ガラス30が破損した。
[Comparative Example 4]
A pressure-sensitive adhesive tape intermediate 11 was produced in the same manner as in Example 4 except that the release layer 4 was not formed on the base material layer 3, and a double-sided pressure-sensitive adhesive tape 21 was produced. Using the obtained double-sided adhesive tape 21, a laminate of the thin film substrate glass 30 and the reinforcing base glass 31 was prepared in the same manner as in Example 4, and a vertical peel test was performed. When the base glass 31 for use was to be separated in the vertical direction, all the thin film substrate glasses 30 with the number of test bodies N = 10 were broken.

[比較例5]
基材層3に離型層4を形成しないこと以外は実施例5と同様にして粘着テープ中間体11を作製し、両面粘着テープ21を作製した。得られた両面粘着テープ21を用いて、実施例5と同様にして薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製し、垂直剥離試験を行ったところ、薄膜基板ガラス30と補強用基盤ガラス31を垂直方向に分離しようとした際に、試験体数N=10の全ての薄膜基板ガラス30が破損した。
[Comparative Example 5]
A pressure-sensitive adhesive tape intermediate 11 was produced in the same manner as in Example 5 except that the release layer 4 was not formed on the base material layer 3, and a double-sided pressure-sensitive adhesive tape 21 was produced. Using the obtained double-sided adhesive tape 21, a laminate of the thin film substrate glass 30 and the reinforcing base glass 31 was produced in the same manner as in Example 5, and a vertical peel test was performed. When the base glass 31 for use was to be separated in the vertical direction, all the thin film substrate glasses 30 with the number of test bodies N = 10 were broken.

[比較例6]
基材層3に離型層4を形成しないこと、シリコーン粘着剤組成物Aの代わりにアクリル粘着剤組成物Dを使用して粘着層A2を形成し、熱硬化型アクリル粘着剤組成物Bの代わりにシリコーン粘着剤組成物Aを使用して粘着層B5を形成すること以外は実施例1と同様にして粘着テープ中間体11を作製し、両面粘着テープ21を作製した。得られた両面粘着テープ21を用いて、実施例1と同様にして薄膜基板ガラス30と補強用基盤ガラス31との積層体を作製し、垂直剥離試験を行ったところ、薄膜基板ガラス30と補強用基盤ガラス31を垂直方向に分離しようとした際に、試験体数N=10の全ての薄膜基板ガラス30が破損した。
[Comparative Example 6]
The release layer 4 is not formed on the base material layer 3, the adhesive layer A2 is formed using the acrylic adhesive composition D instead of the silicone adhesive composition A, and the thermosetting acrylic adhesive composition B Instead, the adhesive tape intermediate 11 was produced in the same manner as in Example 1 except that the silicone adhesive composition A was used to form the adhesive layer B5, and the double-sided adhesive tape 21 was produced. A laminate of the thin film substrate glass 30 and the reinforcing base glass 31 was produced in the same manner as in Example 1 using the obtained double-sided adhesive tape 21, and a vertical peel test was performed. When the base glass 31 for use was to be separated in the vertical direction, all the thin film substrate glasses 30 with the number of test bodies N = 10 were broken.

実施例及び比較例の積層体の粘着テープに使用した樹脂組成物の種類及び積層体の垂直剥離試験の評価結果を表1〜4に総括した。   Tables 1 to 4 summarize the types of resin compositions used in the adhesive tapes of the laminates of Examples and Comparative Examples and the evaluation results of the vertical peel test of the laminates.

[表1]

Figure 2019056101
[Table 1]
Figure 2019056101

[表2]

Figure 2019056101
[Table 2]
Figure 2019056101

[表3]

Figure 2019056101
[Table 3]
Figure 2019056101

[表4]

Figure 2019056101
[Table 4]
Figure 2019056101

本発明によれば、実質的に変形させることができない薄膜部材への加工処理時には薄膜部材と支持部材との間において、薄膜部材が支持部材からずれたり剥がれ落ちたりすることがない適切な密着力を有し、薄膜部材への加工処理後には薄膜部材を支持部材から破損および糊残りすることなく容易に分離することができる両面粘着テープ、及び薄膜部材と支持部材との積層体、及びその積層体の製造方法を提供することができる。なお、本実施例では、薄膜部材として、脆性を有し、強度の低い薄膜ガラスを適用した場合を例示したが、本発明は、実質的に変形させることができる材料から形成される部材の上に実質的に変形させることができない加工処理された部材が形成されている場合(例えば、プラスチックフィルム上に薄膜電極等が形成された部材)においても、適用できる。 According to the present invention, an appropriate adhesion force between the thin film member and the support member so that the thin film member is not displaced from the support member or peeled off during the processing to the thin film member that cannot be substantially deformed. A double-sided pressure-sensitive adhesive tape capable of easily separating the thin-film member from the support member without being damaged or having adhesive residue after the processing to the thin-film member, a laminate of the thin-film member and the support member, and a laminate thereof A method of manufacturing a body can be provided. In this embodiment, the thin film member having brittleness and low strength is applied as the thin film member. However, the present invention is not limited to a material formed from a material that can be substantially deformed. The present invention can also be applied to a case where a processed member that cannot be substantially deformed is formed (for example, a member in which a thin film electrode or the like is formed on a plastic film).

1、6…剥離ライナー、
2、A2、5、B5…粘着層、
3…基材、
4…離型層、
7…薄膜部材、
8…支持部材。
1, 6 ... release liner,
2, A2, 5, B5 ... adhesive layer,
3 ... base material,
4 ... release layer,
7: Thin film member,
8: Support member.

Claims (10)

第1の表面及び第2の表面を有する基材と、第1の表面及び第2の表面の上方かつ最上部に位置する粘着層と、該基材の少なくとも1つの表面から該表面上方に位置する該粘着層までの間に設けられた離型層とを、有する両面粘着テープ。   A substrate having a first surface and a second surface; an adhesive layer positioned above and on top of the first surface and the second surface; and located above the surface from at least one surface of the substrate A double-sided pressure-sensitive adhesive tape having a release layer provided between the pressure-sensitive adhesive layers. 前記離型層は、前記基材のいずれか1つの表面から該表面上方に位置する粘着層までの間に設けられたものである請求項1に記載の両面粘着テープ。   The double-sided pressure-sensitive adhesive tape according to claim 1, wherein the release layer is provided between any one surface of the base material and the pressure-sensitive adhesive layer positioned above the surface. 前記離型層は、シリコーン系剥離剤及びフッ素系剥離剤から成る群から選択される剥離剤を含んで成るものである請求項1又は2に記載の両面粘着テープ。   The double-sided pressure-sensitive adhesive tape according to claim 1 or 2, wherein the release layer comprises a release agent selected from the group consisting of a silicone release agent and a fluorine release agent. 前記粘着層は、活性官能基を有するアクリル系粘着性高分子、熱架橋剤及び熱重合開始剤を主成分とする熱硬化性粘着剤、及び活性官能基を有するアクリル系粘着性高分子、熱架橋剤及び光重合開始剤を主成分とする光感応性粘着剤から成る群から選択される粘着剤を含んで成るものである請求項1〜3のいずれか一項に記載の両面粘着テープ。   The adhesive layer comprises an acrylic adhesive polymer having an active functional group, a thermosetting adhesive mainly comprising a thermal crosslinking agent and a thermal polymerization initiator, and an acrylic adhesive polymer having an active functional group, a heat The double-sided pressure-sensitive adhesive tape according to any one of claims 1 to 3, comprising a pressure-sensitive adhesive selected from the group consisting of a light-sensitive pressure-sensitive adhesive mainly composed of a crosslinking agent and a photopolymerization initiator. 第1の部材を第2の部材に仮固定するために使用され、該2つの部材は実質的に変形させることができない材料から形成されたものである請求項1〜4のいずれか一項に記載の両面粘着テープ。   The first member is used to temporarily fix the first member to the second member, and the two members are formed of a material that cannot be substantially deformed. Double-sided adhesive tape as described. 前記材料の少なくとも一つはガラスである請求項5に記載の両面粘着テープ。   The double-sided pressure-sensitive adhesive tape according to claim 5, wherein at least one of the materials is glass. 請求項1〜6のいずれか一項に記載の両面粘着テープと、該両面粘着テープの粘着層の表面に設けられた剥離ライナーとを有する両面粘着テープ製品。   A double-sided pressure-sensitive adhesive tape product comprising the double-sided pressure-sensitive adhesive tape according to any one of claims 1 to 6 and a release liner provided on the surface of the pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive tape. 支持部材と、
該支持部材に積層された第1の表面及び第2の表面を有する基材と、第1の表面及び第2の表面の上方かつ最上部に位置する粘着層と、該基材の少なくとも1つの表面から該表面上方に位置する該粘着層までの間に設けられた離型層とを、有する両面粘着テープと、
該両面粘着テープに積層された実質的に変形させることができない薄膜部材とを、
有する積層体。
A support member;
A base material having a first surface and a second surface laminated on the support member; an adhesive layer located above and on top of the first surface and the second surface; and at least one of the base materials A double-sided pressure-sensitive adhesive tape having a release layer provided between the surface and the pressure-sensitive adhesive layer located above the surface;
A thin film member that is substantially undeformable laminated on the double-sided adhesive tape,
Laminate having.
前記両面粘着テープが請求項2〜6のいずれか一項に記載の両面粘着テープである請求項8に記載の積層体。   The laminate according to claim 8, wherein the double-sided pressure-sensitive adhesive tape is the double-sided pressure-sensitive adhesive tape according to any one of claims 2 to 6. 請求項1〜6のいずれか一項に記載の両面粘着テープにより、実質的に変形させることができない薄膜部材と支持部材とを貼り合わせる工程を包含する、薄膜部材と支持部材との積層体の製造方法。   A laminate of a thin film member and a support member, comprising a step of bonding a thin film member and a support member that cannot be substantially deformed by the double-sided pressure-sensitive adhesive tape according to any one of claims 1 to 6. Production method.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022024655A1 (en) * 2020-07-31 2022-02-03 東レ株式会社 Method for manufacturing laminate
WO2022202659A1 (en) * 2021-03-26 2022-09-29 三井化学東セロ株式会社 Workpiece processing method
WO2023127395A1 (en) * 2021-12-28 2023-07-06 三井化学東セロ株式会社 Double-sided adhesive
WO2024070440A1 (en) * 2022-09-29 2024-04-04 住友化学株式会社 Optical laminate

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08100158A (en) * 1994-09-30 1996-04-16 Toppan Printing Co Ltd Double coated adhesive tape and card using the same tape
JPH10150007A (en) * 1996-11-18 1998-06-02 Toyo Chem Co Ltd Semiconductor wafer fixing sheet
JP2000319600A (en) * 1999-05-07 2000-11-21 Kamaya Kagaku Kogyo Co Ltd Bonding method enabling easy re-separation
JP2001302997A (en) * 2000-04-25 2001-10-31 K D K Kk Pseudo-adhesive sheet and information communicator and member set using the same
JP2002203822A (en) * 2000-12-28 2002-07-19 Lintec Corp Method for processing brittle member and both-side adhesive sheet
JP2004300231A (en) * 2003-03-31 2004-10-28 Nitto Denko Corp Thermally peelable double sided adhesive sheet, method for processing adherend and electronic part
JP2009161620A (en) * 2007-12-28 2009-07-23 Sumiron:Kk Heat peelable adhesive sheet
WO2010137523A1 (en) * 2009-05-26 2010-12-02 三菱樹脂株式会社 Adhesive material having redetachability
JP2011162616A (en) * 2010-02-05 2011-08-25 Somar Corp Removable adhesive composition, removable adhesive sheet using the same, method for producing laminate and electronic part using the adhesive sheet, and electronic part obtained by using the production method
US20130081764A1 (en) * 2011-10-04 2013-04-04 Eiji Yamanaka Heat-expandable removable pressure-sensitive adhesive tape or sheet, and method of removing the same
WO2014192460A1 (en) * 2013-05-27 2014-12-04 Dic株式会社 Double-sided adhesive tape
JP2016117197A (en) * 2014-12-19 2016-06-30 大日本印刷株式会社 Sheet binding body, method for manufacturing sheet binding body, and image formation device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616502B (en) * 2012-11-22 2018-03-01 王子控股股份有限公司 Adhesive composition, adhesive sheet and laminate
CN106170522B (en) * 2014-03-28 2020-10-09 王子控股株式会社 Adhesive sheet, double-sided adhesive sheet, and optical member

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08100158A (en) * 1994-09-30 1996-04-16 Toppan Printing Co Ltd Double coated adhesive tape and card using the same tape
JPH10150007A (en) * 1996-11-18 1998-06-02 Toyo Chem Co Ltd Semiconductor wafer fixing sheet
JP2000319600A (en) * 1999-05-07 2000-11-21 Kamaya Kagaku Kogyo Co Ltd Bonding method enabling easy re-separation
JP2001302997A (en) * 2000-04-25 2001-10-31 K D K Kk Pseudo-adhesive sheet and information communicator and member set using the same
JP2002203822A (en) * 2000-12-28 2002-07-19 Lintec Corp Method for processing brittle member and both-side adhesive sheet
JP2004300231A (en) * 2003-03-31 2004-10-28 Nitto Denko Corp Thermally peelable double sided adhesive sheet, method for processing adherend and electronic part
JP2009161620A (en) * 2007-12-28 2009-07-23 Sumiron:Kk Heat peelable adhesive sheet
WO2010137523A1 (en) * 2009-05-26 2010-12-02 三菱樹脂株式会社 Adhesive material having redetachability
JP2011162616A (en) * 2010-02-05 2011-08-25 Somar Corp Removable adhesive composition, removable adhesive sheet using the same, method for producing laminate and electronic part using the adhesive sheet, and electronic part obtained by using the production method
US20130081764A1 (en) * 2011-10-04 2013-04-04 Eiji Yamanaka Heat-expandable removable pressure-sensitive adhesive tape or sheet, and method of removing the same
CN103031076A (en) * 2011-10-04 2013-04-10 日东电工株式会社 Heat-expandable removable pressure-sensitive adhesive tape or sheet, and method of removing the same
JP2013079322A (en) * 2011-10-04 2013-05-02 Nitto Denko Corp Thermally foaming repeelable adhesive tape or sheet, and peeling method
WO2014192460A1 (en) * 2013-05-27 2014-12-04 Dic株式会社 Double-sided adhesive tape
JP2016117197A (en) * 2014-12-19 2016-06-30 大日本印刷株式会社 Sheet binding body, method for manufacturing sheet binding body, and image formation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022024655A1 (en) * 2020-07-31 2022-02-03 東レ株式会社 Method for manufacturing laminate
WO2022202659A1 (en) * 2021-03-26 2022-09-29 三井化学東セロ株式会社 Workpiece processing method
WO2023127395A1 (en) * 2021-12-28 2023-07-06 三井化学東セロ株式会社 Double-sided adhesive
WO2024070440A1 (en) * 2022-09-29 2024-04-04 住友化学株式会社 Optical laminate

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