JP2019038964A - Photosensitive resin composition and electronic apparatus - Google Patents

Abstract

To provide a photosensitive resin composition having excellent elongation characteristics and thermal characteristics.SOLUTION: A photosensitive resin composition according to the present invention is a photosensitive resin composition for film formation that contains a thermosetting resin, a curing agent, and a photosensitizer. The thermosetting resin contains a biphenylaralkyl type epoxy resin having two or more epoxy groups in the molecule.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a photosensitive resin composition and an electronic device.

  Various studies have been made on techniques for improving mechanical properties in photosensitive resin compositions. As this type of technology, for example, the technology described in Patent Document 1 is known. Patent Document 1 describes that an acid-modified vinyl epoxy resin obtained by reacting an epoxy resin with a reactive elastomer component is used as a component of the photosensitive resin composition. Moreover, it is shown by the paragraph 0045 of the literature that a tensile elongation rate is 4.2 to 5.3% (Table 1, Examples 1-4).

JP 2007-102081 A

  As a result of studies by the present inventors, it has been found that there is room for improvement in terms of elongation characteristics and thermal characteristics in the cured product of the photosensitive resin composition described in Patent Document 1.

  The inventor further examined and found that the film characteristics of the cured product of the photosensitive resin composition can be controlled by appropriately selecting the thermosetting resin. As a result of further diligent research based on such knowledge, it has been found that by adopting a biphenyl aralkyl type epoxy resin as a thermosetting resin, it is possible to improve elongation characteristics and thermal characteristics, and the present invention has been completed.

According to the present invention,
A photosensitive resin composition for film formation comprising a thermosetting resin, a curing agent, and a photosensitive agent,
There is provided a photosensitive resin composition in which the thermosetting resin contains a biphenyl aralkyl type epoxy resin having two or more epoxy groups in a molecule.

  Moreover, according to this invention, an electronic device provided with the hardened | cured material of the said photosensitive resin composition is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the photosensitive resin composition excellent in the elongation characteristic and the thermal characteristic and an electronic device using the same are provided.

It is sectional drawing which shows the structure of the electronic device which concerns on this embodiment.

Hereinafter, the outline | summary of the photosensitive resin composition which concerns on embodiment of this invention is demonstrated.
The photosensitive resin composition of this embodiment can contain a thermosetting resin, a curing agent, and a photosensitive agent. The thermosetting resin may include a biphenyl aralkyl type epoxy resin having two or more epoxy groups in the molecule. Moreover, this thermosetting resin can contain the polyfunctional epoxy resin which has a 2 or more epoxy group in a molecule | numerator. The photosensitive resin composition of this embodiment can be used as a photosensitive resin composition for film formation.

  The inventor adopts a combination of a polyfunctional epoxy resin and a biphenyl aralkyl type epoxy resin as a thermosetting resin in the photosensitive resin composition, thereby maintaining a high tensile elongation rate while maintaining a high glass transition temperature. It was found that the elongation characteristics and thermal characteristics of the cured film of the photosensitive resin composition can be improved. Although the detailed mechanism is not clear, it is possible to maintain a high glass transition temperature by using a multifunctional epoxy resin and a biphenyl aralkyl type epoxy resin, so that the glass transition temperature can be kept high. It is considered that the elongation rate increases because the inter-base distance increases and the cross-linking distance increases.

  According to the photosensitive resin composition of the present embodiment, a cured film having excellent elongation characteristics and thermal characteristics can be realized. Such a cured film of the photosensitive resin composition can be suitably used for various electronic devices. Therefore, in an electronic device provided with the cured product of the photosensitive resin composition of the present embodiment, improvement in package crack resistance and reliability is expected.

  Hereinafter, each component of the photosensitive resin composition of this embodiment is explained in full detail.

<Thermosetting resin>
The photosensitive resin composition of this embodiment contains a thermosetting resin.

  The photosensitive resin composition of this embodiment can contain a biphenyl aralkyl type epoxy resin. The biphenyl aralkyl type epoxy resin is not particularly limited as long as it is a biphenyl aralkyl type epoxy resin having two or more epoxy groups in the molecule. For example, it may contain a compound represented by the following general formula (1). Is possible. Thereby, the glass transition temperature and tensile elongation rate in the cured film of the photosensitive resin composition can be increased.

In the general formula (1), R _{1 to} R ₇ and R ₈ each represent one selected from a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, and a phenyl group, They may be the same or different. However, a is an integer of 1 or more. Specific examples of these substituents R _{1 to} R ₈ include, for example, a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, and a phenyl group. Among these, in particular, hydrogen Bis (methoxymethyl) biphenyl-phenol polycondensate type epoxy compounds which are atoms or methyl groups are preferred.

  The said thermosetting resin can contain the polyfunctional epoxy resin which has a 2 or more epoxy group in a molecule | numerator. Thereby, the film | membrane physical property and workability in the resin film of the photosensitive resin composition can be improved.

  Examples of the polyfunctional epoxy resin include phenol novolac type epoxy resin, cresol novolac type epoxy resin, cresol naphthol type epoxy resin, biphenyl type epoxy resin, phenoxy resin, naphthalene skeleton type epoxy resin, bisphenol A type epoxy resin, and bisphenol A. Diglycidyl ether type epoxy resin, bisphenol F type epoxy resin, bisphenol F diglycidyl ether type epoxy resin, bisphenol S diglycidyl ether type epoxy resin, glycidyl ether type epoxy resin, aromatic polyfunctional epoxy resin, aliphatic epoxy resin, fat Group polyfunctional epoxy resins, alicyclic epoxy resins, polyfunctional alicyclic epoxy resins, and the like. These may be used alone or in combination of two or more. Among these, from the viewpoint of easy availability, a phenol novolac type epoxy resin can be used.

  Examples of thermosetting resins other than the above-described thermosetting resins include polyimide resins, bismaleimide resins, epoxy resins, urea (urea) resins, melamine resins, polyurethane resins, cyanate ester resins, silicone resins, and oxetane resins. (Oxetane compound), (meth) acrylate resin, unsaturated polyester resin, diallyl phthalate resin, benzoxazine resin and the like.

  As said oxetane compound, the oxetane compound which has a 2 or more oxetanyl group in a molecule | numerator can be included. As the oxetane compound, any compound having at least two oxetane rings in the molecule can be used. As this oxetane compound, an oxetane compound in which two oxetane rings are connected by a bridging group containing at least one ether bond can be used. Thereby, the glass transition temperature and tensile elongation rate in the cured film of the photosensitive resin composition can be increased.

  The oxetane compound can include a compound represented by the following general formula (2).

In the general formula (2), each R ₃ independently represents a hydrocarbon group, and may be the same or different. Z represents an aromatic ring group, an alicyclic group, a heterocyclic group, or a condensed ring group, and n represents an integer of 1 to 5. As a C3-C12 cyclic group of Z, a bivalent aliphatic ring group or an aromatic ring group is preferable, and a phenylene group is especially preferable.
Examples of the oxetane compound include 1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene (xylylene bisoxetane), 1,4-bis [(3-ethyloxetane- 3-yl) methoxy] benzene, 1,3-bis [(3-ethyloxetane-3-yl) methoxy] benzene, 1,2-bis [(3-ethyloxetane-3-yl) methoxy] benzene, 4, 4′-bis [(3-ethyloxetane-3-yl) methoxy] biphenyl, 2,2′-bis [(3-ethyl-3-oxetanyl) methoxy] biphenyl, 3,3 ′, 5,5′-tetra Methyl [4,4′-bis (3-ethyloxetane-3-yl) methoxy] biphenyl, 2,7-bis [(3-ethyloxetane-3-yl) methoxy] naphthalene, 4, '- bis [(1-ethyl-3-oxetanyl) methyl] thio-di benzene thioether, 2,3-bis [(3-ethyloxetan-3-yl) methoxymethyl] norbornane, and the like. These may be used alone or in combination of two or more.

  The lower limit of the content of the thermosetting resin is, for example, 30% by mass or more, preferably 35% by mass or more, and more preferably 38% by mass with respect to the entire nonvolatile components of the photosensitive resin composition. That's it. Thereby, the heat resistance and mechanical strength of the finally obtained cured film can be improved. On the other hand, the upper limit of the content of the thermosetting resin is, for example, 80% by mass or less, preferably 75% by mass or less, and more preferably 70% by mass with respect to the entire nonvolatile components of the photosensitive resin composition. % Or less. Thereby, patterning property can be improved.

  The lower limit of the content of the biphenyl aralkyl type epoxy resin is, for example, 10% by mass or more, preferably 15% by mass or more, and more preferably 25% by mass or more with respect to the entire thermosetting resin. . Thereby, the tensile elongation rate of the cured film finally obtained can be improved. On the other hand, the upper limit of the content of the biphenyl aralkyl type epoxy resin is, for example, 100% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, with respect to the entire thermosetting resin. is there. Thereby, various film characteristics can be balanced.

  In the present embodiment, the solid content of the photosensitive resin composition refers to a non-volatile content in the photosensitive resin composition, and refers to a remaining portion excluding volatile components such as water and a solvent. Content with respect to the whole solid content of the photosensitive resin composition refers to content with respect to the whole solid content except the solvent of the photosensitive resin composition, when a solvent is included.

<Curing agent>
The photosensitive resin composition of the present embodiment can contain a curing agent. Thereby, the film | membrane physical property and workability in the resin film of the photosensitive resin composition can be improved. The curing agent is not particularly limited as long as it accelerates the polymerization / crosslinking reaction of the thermosetting resin described above.

  The said hardening | curing agent can contain the hardening | curing agent which has a phenolic hydroxyl group, and specifically, it is preferable that the polyfunctional phenol resin which has a 2 or more phenolic hydroxyl group in a molecule | numerator is included. Thereby, it is thought that the thermal expansion of a cured film can be made still smaller and it can contribute to the reliability improvement of an electronic device. The polyfunctional phenol resin can be appropriately selected from known ones. For example, a novolac type phenol resin, a resol type phenol resin, a trisphenylmethane type phenol resin, and an arylalkylene type phenol resin can be used. From the viewpoint of good development characteristics, a novolac type phenol resin can be used. The weight average molecular weight of the phenol resin is preferably 200 to 20,000, more preferably 300 to 15,000, still more preferably 350 to 13,000 (hereinafter, “to” is an upper limit unless otherwise specified). And the lower limit is included).

  Content of the said hardening | curing agent is 10-60 mass% with respect to the whole non-volatile component of the photosensitive resin composition, for example, Preferably it is 15-50 mass%, More preferably, it is 20-45 mass%. By setting it as this range, the heat resistance and strength of the cured product are improved.

<Photosensitive agent>
The photosensitive resin composition of this embodiment can contain a photosensitive agent. Thereby, the workability at the time of patterning, such as sensitivity and resolution, can be improved.
As the photosensitive agent, a photoacid generator can be used. As said photoacid generator, the photoacid generator which generate | occur | produces an acid by irradiation of actinic rays, such as an ultraviolet-ray, is contained. Examples of photoacid generators include onium salt compounds, such as diazonium salts, iodonium salts such as diaryliodonium salts, sulfonium salts such as triarylsulfonium salts, triarylbililium salts, benzylpyridinium thiocyanate, dialkylphenacyl. Examples thereof include cationic photopolymerization initiators such as sulfonium salts and dialkylhydroxyphenylphosphonium salts. Moreover, the photosensitive diazoquinone compound can also be mentioned. The photosensitive diazoquinone compound is preferably used particularly when the photosensitive resin composition is made into a positive type (exposed portion dissolves when developed with a developer). The photosensitive agent is preferably one that does not generate hydrogen fluoride due to decomposition, such as a methide salt type or a borate salt type, because the photosensitive composition contacts the metal.

  The lower limit of the content of the photosensitive agent is, for example, 0.3% by mass or more, preferably 0.5% by mass or more, and more preferably 0% with respect to the entire nonvolatile components of the photosensitive resin composition. 0.7% by mass or more. Thereby, patterning property can be improved in the photosensitive resin composition. On the other hand, the upper limit of the content of the photosensitive agent is, for example, 5% by mass or less, preferably 4.5% by mass or less, more preferably, based on the entire nonvolatile components of the photosensitive resin composition. 4% by mass or less. Thereby, the long-term storage property before hardening of the photosensitive resin composition can be improved.

  In addition to the above components, the photosensitive resin composition of the present embodiment can contain other additives as necessary. Examples of other additives include antioxidants, fillers such as silica, surfactants, sensitizers, filming agents, adhesion aids, and the like.

<Filming agent>
The photosensitive resin composition of this embodiment can contain a film forming agent. Thereby, the brittleness of a cured film can be improved.

  As the filming agent, a liquid epoxy resin different from the thermosetting resin can be used. As this liquid epoxy resin, an epoxy compound having two or more epoxy groups and being liquid at room temperature of 25 ° C. can be used. The viscosity of this liquid epoxy resin at 25 ° C. is, for example, 1 mPa · s to 1500 mPa · s, and preferably 10 mPa · s to 1400 mPa · s.

  Examples of the liquid epoxy resin may include one or more selected from the group consisting of bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, alkyl diglycidyl ether, and alicyclic epoxy. These may be used alone or in combination of two or more. Among these, alkyl diglycidyl ether can be used from the viewpoint of reducing cracks after development.

  The epoxy equivalent of the liquid epoxy resin is, for example, 100 g / eq or more and 200 g / eq or less, preferably 105 g / eq or more and 180 g / eq or less, more preferably 110 g / eq or more and 170 g / eq or less. . Thereby, the brittleness of a cured film can be improved.

  The lower limit of the content of the liquid epoxy resin is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, with respect to the entire nonvolatile components of the photosensitive resin composition. It is. Thereby, the brittleness of the finally obtained cured film can be improved. On the other hand, the upper limit of the content of the liquid epoxy resin is, for example, 40% by mass or less, preferably 35% by mass or less, and more preferably 30% by mass with respect to the entire nonvolatile components of the photosensitive resin composition. It is as follows. Thereby, the balance of the film | membrane characteristic of a cured film can be aimed at.

<Surfactant>
The photosensitive resin composition of the present embodiment can contain a surfactant. By including the surfactant, wettability during coating can be improved, and a uniform resin film and cured film can be obtained. Further, it can be expected to prevent residues and patterns from rising during development. Examples of the surfactant include a fluorine-based surfactant, a silicone-based surfactant, an alkyl-based surfactant, and an acrylic surfactant.

  The surfactant preferably includes a surfactant containing at least one of a fluorine atom and a silicon atom. As a result, a uniform resin film can be obtained (improvement of applicability), and in addition to improvement of developability, it also contributes to improvement of adhesive strength. As such a surfactant, for example, a nonionic surfactant containing at least one of a fluorine atom and a silicon atom is preferable. As a commercial item which can be used as a surfactant, for example, F-251, F-253, F-281, F-430, F-477, F-551 of "Megafac" series manufactured by DIC Corporation, F-552, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F- 565, F-568, F-569, F-570, F-572, F-574, F-575, F-576, R-40, R-40-LM, R-41, R-94, etc. Surfactant having an oligomer structure containing fluorine, fluorine-containing nonionic surfactants such as Footage 250 and Footgent 251 manufactured by Neos Co., Ltd., SILFOAM (registered trademark) series manufactured by Wacker Chemie (for example, SD) 100 TS, SD 670, SD 850, SD 860, SD 882) and the like.

  Content of the said surfactant is 0.01-5 mass% on the basis of the whole quantity of the non-volatile component of the photosensitive resin composition, for example, Preferably it can be 0.05-3 mass%.

<Adhesion aid>
The photosensitive resin composition of this embodiment can contain an adhesion assistant. Thereby, the adhesiveness of a cured film can be improved further.

The adhesion aid is not particularly limited, and for example, a silane coupling agent such as amino silane, epoxy silane, acrylic silane, mercapto silane, vinyl silane, ureido silane, or sulfide silane can be used. A silane coupling agent may be used individually by 1 type, and may use 2 or more types together. Among these, it is more preferable to use epoxysilane (that is, a compound containing both an epoxy moiety and a group that generates a silanol group by hydrolysis) in one molecule.
Examples of the aminosilane include bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldiethoxysilane, and γ-aminopropyl. Methyldimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N -Β (aminoethyl) γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-amino-propyltrimethoxysilane and the like can be mentioned. Examples of the epoxy silane include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and γ-glycidylpropyltrimethoxysilane. Etc. Examples of the acrylic silane include γ- (methacryloxypropyl) trimethoxysilane, γ- (methacryloxypropyl) methyldimethoxysilane, and γ- (methacryloxypropyl) methyldiethoxysilane. Examples of mercaptosilane include 3-mercaptopropyltrimethoxysilane. Examples of vinyl silane include vinyl tris (β-methoxyethoxy) silane, vinyl triethoxy silane, and vinyl trimethoxy silane. Examples of ureidosilane include 3-ureidopropyltriethoxysilane. Examples of the sulfide silane include bis (3- (triethoxysilyl) propyl) disulfide, bis (3- (triethoxysilyl) propyl) tetrasulfide, and the like.

  The content of the adhesion assistant is, for example, preferably 0.1 to 10% by mass, more preferably 0.5 to 8% by mass, based on the total amount of nonvolatile components of the photosensitive resin composition. it can.

  The photosensitive resin composition of the present embodiment may be in the form of a varnish or a film.

  The preparation method of the photosensitive resin composition of this embodiment is not specifically limited, Generally it can manufacture by a well-known method. For example, a varnish-like photosensitive resin composition (resin varnish) can be obtained by mixing and uniformly mixing the above-described components (raw materials) and a solvent.

<Solvent>
The photosensitive resin composition of this embodiment can contain a solvent. An organic solvent can be included as a solvent.
The organic solvent can be used without particular limitation as long as it can dissolve each component of the photosensitive resin composition and does not chemically react with each constituent component. For example, acetone, methyl ethyl ketone, toluene, propylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol 1-monomethyl ether 2-acetate, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, benzyl alcohol, propylene carbonate, ethylene Examples thereof include glycol diacetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, ethyl acetate, and butyl acetate. These can be appropriately selected depending on the desired film thickness. These may be used alone or in combination of two or more.

  It is preferable that the said solvent is used so that the density | concentration of the non-volatile component whole quantity in the photosensitive resin composition may be 30-75 mass%, for example. By setting it as this range, each component can fully be dissolved and good applicability | paintability can be ensured.

  On the other hand, the film-like photosensitive resin composition (photosensitive resin film) is, for example, a coating film (resin film) obtained by applying a varnish-like photosensitive resin composition on a carrier substrate. It can be obtained by performing a solvent removal treatment. The photosensitive resin film may have a solvent content of 10% by weight or less with respect to the entire photosensitive resin composition. For example, the solvent removal treatment can be performed under conditions of 80 to 150 ° C. and 1 to 30 minutes. Thereby, it becomes possible to remove the solvent sufficiently while suppressing the curing of the photosensitive resin composition.

  The step of forming the resin film of the photosensitive resin composition on the carrier substrate is, for example, preparing a resin varnish by dissolving and dispersing the photosensitive resin composition in a solvent or the like, and using various coater devices Examples thereof include a method of drying the varnish after coating the carrier substrate, a method of spraying the resin varnish onto the carrier substrate using a spray device, and then drying the resin varnish. Among these, it is preferable to apply a resin varnish to a carrier substrate using various coaters such as a spin coater, a comma coater, and a die coater, and then dry the resin varnish. Thereby, the photosensitive resin film with a carrier base material which has no void and has a uniform thickness can be produced efficiently.

  The above-mentioned photosensitive resin film with a carrier substrate may be a rollable roll or a rectangular sheet. The surface of the photosensitive resin film with a carrier substrate may be exposed or covered with a protective film (cover film), for example. As the protective film, a film having a known protective function can be used. For example, a PET film may be used.

  In the present embodiment, as the carrier substrate, for example, a polymer film or a metal foil can be used. The polymer film is not particularly limited, but, for example, polyolefin such as polyethylene and polypropylene, polyester such as polyethylene terephthalate and polybutylene terephthalate, release paper such as polycarbonate and silicone sheet, heat resistance such as fluororesin and polyimide resin. A thermoplastic resin sheet having The metal foil is not particularly limited. For example, copper and / or a copper-based alloy, aluminum and / or an aluminum-based alloy, iron and / or an iron-based alloy, silver and / or a silver-based alloy, gold and a gold-based alloy. Zinc and zinc-based alloys, nickel and nickel-based alloys, tin and tin-based alloys, and the like. Among these, a sheet made of polyethylene terephthalate is most preferable because it is inexpensive and easy to adjust the peel strength. Thereby, it becomes easy to peel a carrier base material with moderate intensity | strength from the photosensitive resin film with a carrier base material.

  The film thickness of the photosensitive resin film can be designed according to the final film thickness of the cured film. The lower limit of the film thickness of the photosensitive resin film is, for example, 40 μm or more, preferably 50 μm or more, and more preferably 60 μm or more. Thereby, a thick photosensitive resin film can be realized. The embedding property of an electronic member such as a semiconductor chip of a photosensitive resin film can be improved. Moreover, the mechanical strength of the photosensitive resin film can be improved. On the other hand, the upper limit value of the film thickness of the photosensitive resin film is not particularly limited, but may be, for example, 300 μm or less, 250 μm or less, or 200 μm or less. Thereby, thinning of an electronic device provided with the cured film of the photosensitive resin film is realizable.

  In this embodiment, the glass transition temperature of a cured film is 100-250 degreeC, for example, Preferably it is 120-230 degreeC, More preferably, it can be 130-200 degreeC. An appropriate value of the glass transition temperature means that the cured film can be used even in a high temperature environment, and can contribute to the improvement of the reliability of the electric / electronic device.

  In this embodiment, the elongation percentage of the cured film when measured under conditions of a tensile speed of 5 mm / min is, for example, 15-60%, preferably 17-55%, and more preferably 20-50%. It can be. If the elongation is good, it can contribute to brittleness improvement and reliability improvement.

The photosensitive resin composition of the present embodiment is used as, for example, a permanent film, a protective film, an insulating film, a rewiring material, or the like in an electric / electronic device (electronic device).
Here, “electrical / electronic device” means a semiconductor chip, a semiconductor element, a printed wiring board, an electric circuit, a display device such as a television receiver or a monitor, an information communication terminal, a light emitting diode, a physical battery, a chemical battery, etc. This refers to devices, devices, final products, and other equipment related to electricity that apply engineering technology.

As one specific example of the use of the photosensitive resin composition of the present embodiment, a through electrode substrate can be mentioned. Hereinafter, an electronic device including the through electrode substrate will be described with reference to FIG.
FIG. 1A is a cross-sectional view showing the configuration of the electronic device of this embodiment. FIG. 1B is an enlarged view of a part of the electronic device shown in FIG.

As shown in FIG. 1A, the electronic device 100 according to the present embodiment includes a through electrode substrate 200. The through electrode substrate 200 includes an organic insulating layer (photosensitive resin layer 220), a plurality of through electrodes (vias 242) penetrating from the upper surface to the lower surface of the organic insulating layer, and a semiconductor chip 210 embedded in the organic insulating layer. And a lower wiring layer 252 provided on the lower surface of the organic insulating layer, and an upper wiring layer 250 provided on the upper surface of the organic insulating layer.
The said photosensitive resin layer 220 can be comprised with the cured film (hardened | cured material) of the photosensitive resin composition of this embodiment.

  In the electronic device 100 of this embodiment, a package structure such as a package-on-package is configured by the above-described through electrode substrate 200 without using a thick film package substrate having a core layer or a build-up layer. For this reason, in the electronic device 100, the overall height of the package structure can be reduced.

  In addition, as shown in FIG. 1A, the electronic device 100 according to this embodiment can have a package-on-package structure in which a semiconductor package 300 is mounted on a through electrode substrate 200. For example, the electronic device 100 of this embodiment can further include a semiconductor package 300 having a known package structure mounted on the upper wiring layer 250 of the through electrode substrate 200. Thereby, the multifunctionalization of the electronic device 100 can be realized. In addition, the mounting density of the electronic device 100 can be increased.

  In the present embodiment, for example, as shown in FIG. 1A, the semiconductor package 300 has a semiconductor chip 310 mounted on a substrate 320, and the substrate 320 and the semiconductor chip 310 are bonded to each other via bonding wires 330. You may have the structure to do. In the semiconductor package 300, a plurality of semiconductor chips 310 may be provided, and a plurality of semiconductor chips 310 may be arranged in the planar direction or the stacking direction. Further, the semiconductor chip 310 and the bonding wire 330 may be sealed with a sealing material layer 340. The sealing material layer 340 can be formed, for example, by curing a known sealing resin composition. In addition, solder bumps 360 may be formed on the substrate 320 of the semiconductor package 300 as external terminals. The semiconductor package 300 can be bump-connected to the through electrode substrate 200 via the solder bump 360.

  In addition, the electronic device 100 of the present embodiment can include solder bumps 260 provided on the lower surface of the lower wiring layer 252 of the through electrode substrate 200. As a result, the solder bump 260 functions as an external terminal, thereby enabling external connection with other electronic components.

  Such an electronic device 100 can further include, for example, a mother board that is bump-connected to the lower wiring layer 252 of the through electrode substrate 200 via the solder bumps 260. Thereby, the mechanical strength of the electronic device 100 can be increased, and further multifunctionalization can be realized. At this time, in the through electrode substrate 200, the side surfaces and upper and lower surfaces thereof may be sealed together with the semiconductor package 300 with a sealing material layer formed by curing a known sealing resin composition. Thereby, the connection reliability and mechanical strength of the electronic device 100 can be improved.

  The through electrode substrate 200 included in the electronic device 100 of the present embodiment has an organic layer in addition to the structure in which the upper wiring layer 250 and the lower wiring layer 252 are formed on the upper and lower surfaces of the organic insulating layer (photosensitive resin layer 220), respectively. Since the semiconductor chip 210 and the through electrode (via 242) for electrically connecting the wiring layers are embedded in the insulating layer, the mechanical strength is excellent as compared with a structure without these. be able to.

  Moreover, in embodiment, the organic insulating layer in the said penetration electrode substrate 200 can be comprised with the hardened | cured material of the above-mentioned photosensitive resin composition. Accordingly, since a method of opening by a photoresist method can be adopted, the opening diameter, in other words, the via diameter of the via 242 can be made smaller than in the method of opening by laser irradiation. The integration density of the semiconductor chips 210 and the vias 242 can be increased in the plane of the through electrode substrate 200. Moreover, the mechanical strength of the through electrode substrate 200 can be increased by curing the photosensitive resin composition.

  Moreover, the lower limit of the film thickness of the organic insulating layer (photosensitive resin layer 220) in the through electrode substrate 200 of the present embodiment may be, for example, 40 μm or more, more preferably 50 μm or more, and still more preferably. It is good also as 60 micrometers or more. Thereby, the mechanical strength of the through electrode substrate 200 can be improved. In addition, the embedding property of the semiconductor chip 210 can be improved. On the other hand, the upper limit value of the film thickness of the organic insulating layer may be, for example, 300 μm or less, more preferably 250 μm or less, and even more preferably 200 μm or less. Thereby, the height of the electronic device 100 can be reduced.

  The through electrode (via 242) is, for example, a conductive frustum made of one or more metals selected from the group consisting of copper, gold, silver, nickel, and the like. Specifically, the conductive frustum Or a conductive polygonal frustum, more specifically, a copper frustum (copper pillar).

  In the electronic device 100 of the present embodiment, as shown in FIG. 1A, the wirings constituting the lower wiring layer 252 may be formed to the outside of the semiconductor chip 210 in a cross-sectional view. As a result, the inter-electrode pitch width of the structure in which the plurality of semiconductor chips 210 are mounted at high density can be expanded to the optimum pitch width for connection to the solder bumps 260. That is, the mounting density of the semiconductor chip 210 can be increased.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail with reference to an Example, this invention is not limited to description of these Examples at all.

<Preparation of photosensitive resin composition>
The raw materials of each component blended according to Table 1 were dissolved in butyl acetate to obtain a mixed solution. Thereafter, the mixed solution was filtered through a 0.2 μm polypropylene filter to obtain a photosensitive resin composition having a solid content of 70% by mass.
The detail of the raw material of each component in Table 1 is as follows.

(Thermosetting resin)
Epoxy resin 1: Polyfunctional epoxy resin represented by the following structure (Nippon Kayaku Co., Ltd. EPPN201, phenol novolac type epoxy resin)

  Epoxy resin 2: biphenyl aralkyl type epoxy resin represented by the following structure (Nippon Kayaku Co., Ltd. NC-3000, n = 1 to 10)

(Curing agent)
Phenol resin 1: novolak-type phenol resin represented by the following structure (PR-51470, manufactured by Sumitomo Bakelite Co., Ltd.)

(Filming agent)
Liquid epoxy resin 1: alkyl diglycidyl ether represented by the following structure (manufactured by Mitsubishi Chemical Corporation, YED216D, epoxy equivalent: 110-130 g / eq, viscosity (25 ° C.): 10-16 mPa · s)

  Liquid epoxy resin 2: bisphenol F diglycidyl ether represented by the following structure (manufactured by DIC Corporation, EXA-830CRP, epoxy equivalent of 155 to 163 g / eq, viscosity (25 ° C.): 1100 to 1500 mPa · s)

(Photosensitive agent)
Photosensitizer 1: Triarylsulfonium salt (manufactured by Sun Apro, CPI-310B)
(Adhesion aid)
Adhesion aid 1: Epoxy group-containing silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403E)
(Surfactant)
Surfactant 1: Fluorosurfactant (manufactured by DIC Corporation, MegaFac R41, fluorine-containing / lipophilic group-containing oligomer, propylene glycol monomethyl ether acetate 20% by mass solution)

  The following evaluation was performed about the obtained photosensitive resin composition. The evaluation results are shown in Table 1.

<Production of cured film>
(1) The obtained photosensitive resin composition was applied to a polyethylene terephthalate film (manufactured by Unitika, product number TR1-T, thickness 38 μm) using a comma coater, and then dried at 120 ° C. for 5 minutes to obtain a thickness. A 90 μm photosensitive resin film was formed.
(2) The entire surface of the photosensitive resin film obtained in (1) above was exposed at 1000 mJ / cm ² using an automatic exposure machine.
(3) After the above (2), the photosensitive resin film was heated after exposure at 120 ° C. for 5 minutes on a hot plate.
(4) After the above (3), curing was performed at 200 ° C. for 90 minutes under nitrogen to obtain a cured film for evaluation.

(Coefficient of thermal expansion (CTE))
A sample having a width of 4 mm and a measurement length of 10 mm was obtained from the evaluation cured film obtained above.
This was measured using a thermomechanical analyzer SS6000 (manufactured by Hitachi High-Tech Science Co., Ltd.) under the condition of a tension of 30N. The temperature increase / decrease conditions were as follows.
1st: 30 ℃ → 250 ℃ → 10 ℃ (15 minutes hold) at 10 ℃ / min temperature increase / decrease rate
Second time: 10 ° C. → 250 ° C. (heating rate of 5 ° C./min)
The data obtained in the second region of 50 to 100 ° C. and 100 to 200 ° C. were analyzed to determine the coefficient of thermal expansion. The obtained coefficient of thermal expansion (ppm / ° C.) is shown in Table 1.

(Glass-transition temperature)
The measurement data of the thermal expansion coefficient was analyzed, and the inflection point of the thermal expansion coefficient was set as the glass transition temperature.

(Stress at break)
A sample is cut out from the cured film for evaluation obtained above, and a measurement sample having a film thickness of 90 μm, a width of 6.5 mm, and a distance between chucks of 20 mm for fixing the sample is Tensilon Universal Material Measuring Machine RTA-100 (A & Co., Ltd.)・ Measured under the conditions of a tensile speed of 5 mm / min using a 100N load cell.
In each example, 10 samples were measured and the average stress at break for 6 samples excluding 4 samples with the largest elongation, the second largest elongation, the smallest elongation and the second smallest elongation. Values (MPa) are listed in Table 1.

(Elongation at break)
A sample is cut out from the cured film for evaluation obtained above, and a tensilon universal material measuring machine RTA-100 (A & Co., Ltd.) is used for a measurement sample having a film thickness of 10 μm, a width of 6.5 mm, and a distance between chucks of 20 mm for fixing the sample.・ Measured under the conditions of a tensile speed of 5 mm / min using a 100N load cell.
In each example, 10 samples were measured, and the average value (%) for 6 samples excluding 4 samples of the largest elongation, the second largest elongation, the smallest elongation, and the second smallest elongation. Are listed in Table 1.

(Tensile modulus)
A sample is cut out from the cured film for evaluation obtained above, and a measurement sample having a film thickness of 90 μm, a width of 6.5 mm, and a distance between chucks of 20 mm for fixing the sample is Tensilon Universal Material Measuring Machine RTA-100 (A & Co., Ltd.)・ Measured under the conditions of a tensile speed of 5 mm / min using a 100N load cell.
In each example, 10 samples were measured and the tensile modulus averaged over 6 samples excluding 4 samples with the largest elongation, the second largest elongation, the smallest elongation and the second smallest elongation. Values (GPa) are listed in Table 1.

  It turned out that the photosensitive resin composition of Examples 1-4 can implement | achieve the cured film which the tensile elongation rate improved compared with the comparative example 1, maintaining the glass transition temperature high. Moreover, it turned out that the photosensitive resin composition of Examples 1-4 can implement | achieve the cured film with which the breaking point stress and the tensile elasticity modulus were reduced.

DESCRIPTION OF SYMBOLS 100 Electronic device 200 Penetration electrode substrate 210 Semiconductor chip 220 Photosensitive resin layer 242 Via 250 Upper wiring layer 252 Lower wiring layer 260 Solder bump 300 Semiconductor package 310 Semiconductor chip 320 Substrate 330 Bonding wire 340 Sealing material layer 360 Solder bump

Claims (14)

A photosensitive resin composition for film formation comprising a thermosetting resin, a curing agent, and a photosensitive agent,
The photosensitive resin composition in which the said thermosetting resin contains the biphenyl aralkyl type epoxy resin which has a 2 or more epoxy group in a molecule | numerator. The photosensitive resin composition according to claim 1,
The photosensitive resin composition in which the said thermosetting resin contains the polyfunctional epoxy resin which has a 2 or more epoxy group in a molecule | numerator. The photosensitive resin composition according to claim 1 or 2,
The photosensitive resin composition in which the said biphenyl aralkyl type epoxy resin contains the compound represented by following General formula (1).

(In the general formula (1), R _{1 to} R ₇ and R ₈ each represent one selected from a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, and a phenyl group, They may be the same or different from each other, where a is an integer of 1 or more.) It is the photosensitive resin composition of any one of Claim 1 to 3, Comprising:
A photosensitive resin composition comprising a liquid epoxy resin having two or more epoxy groups in a molecule and being liquid at room temperature of 25 ° C. The photosensitive resin composition according to claim 4,
The photosensitive resin composition whose epoxy equivalent of the said liquid epoxy resin is 100 g / eq or more and 200 g / eq or less. The photosensitive resin composition according to claim 4 or 5,
The photosensitive resin composition in which the said liquid epoxy resin contains 1 or more types selected from the group which consists of bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, alkyl diglycidyl ether, and an alicyclic epoxy. It is the photosensitive resin composition of any one of Claim 1 to 6, Comprising:
The photosensitive resin composition whose glass transition temperature (Tg) of the hardened | cured material which consists of the said photosensitive resin composition is 100 degreeC or more and 250 degrees C or less. It is the photosensitive resin composition of any one of Claim 1 to 7, Comprising:
The photosensitive resin composition whose elongation rate when the hardened | cured material which consists of the said photosensitive resin composition is measured on conditions with a tensile speed of 5 mm / min is 15% or more and 60% or less. It is the photosensitive resin composition of any one of Claim 1 to 8, Comprising:
A photosensitive resin composition for forming a thick film of 40 μm or more and 300 μm or less. It is the photosensitive resin composition of any one of Claim 1 to 9, Comprising:
The photosensitive resin composition in which the said hardening | curing agent contains the polyfunctional phenol resin which has a 2 or more phenolic hydroxyl group in a molecule | numerator. It is the photosensitive resin composition of any one of Claim 1 to 10, Comprising:
A photosensitive resin composition containing a surfactant. It is the photosensitive resin composition of any one of Claim 1 to 11, Comprising:
The photosensitive resin composition in which the said photosensitive agent contains a photo-acid generator. The photosensitive resin composition according to any one of claims 1 to 12,
A photosensitive resin composition in the form of a varnish or a film.   An electronic device provided with the hardened | cured material of the photosensitive resin composition of any one of Claim 1 to 13.

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